Inspection system, semiconductor manufacturing apparatus, and inspection method

Abstract

To provide an inspection system, a semiconductor manufacturing apparatus, and an inspection method, capable of relatively precisely performing an inspection of an electronic component whose size exceeds that of a field of view of a camera.SOLUTION: An inspection system comprises a table, a camera, a first movement mechanism, a second movement mechanism, and a control unit. The control unit controls each of the camera, the first movement mechanism, and the second movement mechanism so that a plurality of items of first partial image data indicating parts of an electronic component differing from each other are generated. The control unit executes: first processing of performing corrections on the plurality of items of first partial image data, respectively, the corrections including a correction taking into account an inclination of the camera with respect to a first axis, and a correction taking into account a difference between an angle formed by the first axis and a second axis and a reference angle; second processing of combining the plurality of corrected items of first partial image data to generate composite image data; and third processing of inspecting the electronic component on the basis of the composite image data.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an inspection system, a semiconductor manufacturing apparatus, and an inspection method.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2023-076250 (Patent Document 1) discloses an inspection system that inspects an object to be inspected based on a captured image of the object to be inspected. In this inspection system, for example, four objects to be inspected are included in one captured image (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the electronic component as the object to be inspected is large, a situation may occur where the electronic component does not fit within the field of view of the camera. Patent Document 1 does not disclose a method for inspecting an electronic component that does not fit within the field of view of the camera.

[0005] The present invention has been made to solve such problems, and an object thereof is to provide an inspection system, a semiconductor manufacturing apparatus, and an inspection method capable of relatively highly accurately inspecting an electronic component having a size that does not fit within the field of view of a camera.

Means for Solving the Problems

[0006] An inspection system according to an aspect of the present invention includes a table, a camera, a first moving mechanism, a second moving mechanism, and a control unit. The table holds an electronic component. The camera images a part of the electronic component and generates first partial image data. The first moving mechanism moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in a first axis is changed. The second moving mechanism moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in a second axis is changed. The control unit controls each of the camera, the first moving mechanism, and the second moving mechanism so that a plurality of first partial image data each indicating a different part of the electronic component are generated. The control unit performs a first process of performing correction considering the inclination of the camera with respect to the first axis and correction considering the difference between the angle formed by the first axis and the second axis and a reference angle on each of the plurality of first partial image data, a second process of generating composite image data by synthesizing the plurality of first partial image data after correction, and a third process of inspecting the electronic component based on the composite image data.

[0007] A semiconductor manufacturing apparatus according to another aspect of the present invention includes the above inspection system and a manufacturing system. The manufacturing system manufactures an electronic component. The electronic component is a semiconductor device. The inspection system inspects the electronic component manufactured by the manufacturing system.

[0008] An inspection method according to another aspect of the present invention is an inspection method using an inspection system. The inspection system includes a table, a camera, a first moving mechanism, and a second moving mechanism. The table holds an electronic component. The camera images a part of the electronic component and generates first partial image data. The first moving mechanism moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in a first axis is changed. The second moving mechanism moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in a second axis is changed. The inspection method includes steps of generating a plurality of partial image data each showing a different part of the electronic component, applying correction considering the inclination of the camera with respect to the first axis and the difference between the angle formed by the first axis and the second axis and a reference angle to each of the plurality of partial image data, generating composite image data by synthesizing the plurality of corrected partial image data, and inspecting the electronic component based on the composite image data.

Advantages of the Invention

[0009] According to the present invention, it is possible to provide an inspection system, a semiconductor manufacturing apparatus, and an inspection method capable of performing inspection of an electronic component having a size that does not fit within the field of view of a camera with relatively high accuracy.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments according to one aspect of the present invention (hereinafter also referred to as "the present embodiments") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their descriptions will not be repeated. Also, for ease of understanding, each drawing is schematically drawn with appropriate omissions or exaggerations of the subject. In the drawings, the X-axis and the Y-axis are orthogonal to each other, the X-axis and the Z-axis are orthogonal to each other, and the Y-axis and the Z-axis are orthogonal to each other.

[0012] [1. Configuration] <1-1. Overall Configuration of the Cutting Device> FIG. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to cut a package substrate (object to be cut) to individualize the package substrate into a plurality of electronic components (package components). In the package substrate, a substrate or a lead frame on which a semiconductor chip is mounted is resin-sealed. Note that the object to be cut does not necessarily have to be a package substrate, and for example, a substrate that is not resin-sealed (including a wafer) may be used. A substrate individualized by cutting a substrate that is not resin-sealed is also included in the "electronic components".

[0013] Examples of the package substrate include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package) package substrate, an LED (Light Emitting Diode) package substrate, and a QFN (Quad Flat No-leaded) package substrate.

[0014] In addition, the cutting device 1 is configured to inspect each of the plurality of individualized electronic components. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as a "good product" or a "defective product". In the cutting device 1, in particular, inspection of electronic components having a size that does not fit within a single captured image is performed. Specific inspection procedures will be described later.

[0015] In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is individualized into a plurality of electronic components S1 by the cutting device 1. Hereinafter, of the two surfaces of the package substrate P1, the resin-sealed surface is referred to as the mold surface, and the surface opposite to the mold surface is referred to as the ball / lead surface. Note that when the object to be cut is a substrate that is not resin-sealed, the surface facing upward (cutting surface) during cutting corresponds to the ball / lead surface in the present embodiment, and the surface opposite to the cutting surface corresponds to the mold surface in the present embodiment.

[0016] As shown in FIG. 1, the cutting device 1 includes, as components, a cutting module A1 and an inspection / storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection / storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to other components.

[0017] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a transfer unit 7.

[0018] The substrate supply unit 3 supplies the package substrate P1 to the positioning unit 4 one by one by pushing out the package substrate P1 one by one from a magazine M1 that houses a plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball / lead surface facing upward.

[0019] The positioning unit 4 positions the package substrate P1 by placing the package substrate P1 pushed out from the substrate supply unit 3 on the rail unit 4a. Then, the positioning unit 4 transfers the positioned package substrate P1 to the cutting table 5.

[0020] The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 having a twin-cut table configuration with two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the package substrate P1 by adsorbing the package substrate P1 conveyed by the positioning unit 4 from below. The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in the figure (that is, rotate in the horizontal plane of XY in FIG. 1). The movement mechanism 5c can move the holding member 5a along the Y axis in the figure.

[0021] The spindle unit 6 cuts the package substrate P1 to separate the package substrate P1 into a plurality of electronic components S1. In this example, a cutting device 1 with a twin spindle configuration having two spindle units 6 is illustrated. The spindle unit 6 is movable along the X-axis and Z-axis in the figure. Note that the cutting device 1 may have a single spindle configuration having one spindle unit 6.

[0022] The spindle unit 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, and separates the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being sandwiched by first and second flanges (both not shown). The first and second flanges are fixed to the rotating shaft 6c by a fastening member (not shown) such as a nut. The first flange is also referred to as the inner flange, and the second flange is also referred to as the outer flange.

[0023] The spindle unit 6 is provided with a cutting water nozzle, a cooling water nozzle, a cleaning water nozzle (all not shown), etc. The cutting water nozzle injects cutting water toward the blade 6a rotating at high speed. The cooling water nozzle injects cooling water. The cleaning water nozzle injects cleaning water for cleaning cutting chips and the like.

[0024] After the cutting table 5 adsorbs the package substrate P1, the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. The confirmation using the first position confirmation camera 5d is, for example, the confirmation of the position of a mark provided on the package substrate P1. The mark is, for example, a mark for determining the cutting position of the package substrate P1.

[0025] After that, the cutting table 5 moves along the Y-axis of the figure toward the spindle unit 6. After the cutting table 5 moves below the spindle unit 6, alignment is performed, and then the package substrate P1 is cut by relatively moving the cutting table 5 and the spindle unit 6. Each time the package substrate P1 is cut by the blade 6a of the spindle unit 6, the package substrate P1 is imaged and confirmed by the second position confirmation camera 6b provided in the spindle unit 6. The confirmation using the second position confirmation camera 6b is, for example, the confirmation of the cut position and the cut width of the package substrate P1.

[0026] After the cutting of the package substrate P1 is completed, the cutting table 5 moves in a direction away from the spindle unit 6 along the Y-axis of the figure while adsorbing a plurality of singulated electronic components S1. In this moving process, the upper surface (ball / lead surface) of the electronic component S1 is cleaned and dried by the first cleaner 5e.

[0027] The transfer unit 7 adsorbs the electronic component S1 held on the cutting table 5 from above and transfers the electronic component S1 to the inspection table 11 of the inspection and storage module B1. In this transfer process, the lower surface (molded surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a.

[0028] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, lighting units 16 and 17, an arrangement unit 14, and an extraction unit 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1.

[0029] The inspection table 11 holds the electronic component S1 for the optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis of the figure. Also, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by adsorbing the electronic component S1. Further, in the inspection table 11, the surface that holds the electronic component S1 is made of, for example, black rubber. Note that the color of the rubber does not have to be black and may be, for example, white or the like.

[0030] The first optical inspection camera 12 and the second optical inspection camera 13 image the mold surface and the ball / lead surface of the electronic component S1, respectively. Various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged to image upward in the vicinity of the inspection table 11. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is movable along the Y-axis of the figure. Although details will be described later, the directions in which each of the first optical inspection camera 12 and the second optical inspection camera 13 moves may not be completely parallel to the Y-axis. The captured images generated by each of the first optical inspection camera 12 and the second optical inspection camera 13 are, for example, grayscale (256 gradation) images.

[0031] The first optical inspection camera 12 images the mold surface of the electronic component S1 that is transported to the inspection table 11 by the transport unit 7. Thereafter, the transport unit 7 places the electronic component S1 on the holding member of the inspection table 11. After adsorbing the electronic component S1, the inspection table 11 turns upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the electronic component S1 is imaged by the second optical inspection camera 13.

[0032] Above the first optical inspection camera 12, an illumination unit 16 is provided, and above the second optical inspection camera 13, an illumination unit 17 is provided. Each of the illumination units 16 and 17 is composed of, for example, so-called coaxial illumination and / or dome-shaped illumination. The illumination unit 16 is configured to irradiate light onto the electronic component S1 on the inspection table 11 during the inspection by the first optical inspection camera 12. The illumination unit 17 is configured to irradiate light onto the electronic component S1 on the inspection table 11 during the inspection by the second optical inspection camera 13. Since the illumination units 16 and 17 have, for example, the same configuration, the configuration of the illumination unit 17 will be typically described below.

[0033] FIG. 2 is a diagram including a cross-section of the schematically shown illumination unit 17. As shown in FIG. 2, in the inspection by the second optical inspection camera 13, the light emitted by the illumination unit 17 irradiates the electronic component S1. With the electronic component S1 irradiated with light, an imaging image of the electronic component S1 is generated by the second optical inspection camera 13. Based on this imaging image, the inspection of the electronic component S1 is performed.

[0034] The illumination unit 17 is composed of dome-shaped illumination and includes a dome 17a and a plurality of LEDs 17b. Note that the dome-shaped illumination may be composed of so-called dome illumination, but it is not necessarily composed of dome illumination. It suffices to include a dome-shaped (umbrella-shaped) member and a plurality of light-emitting members (e.g., LEDs) arranged within the member. The dome 17a has a dome shape, and the shape of the dome 17a in plan view is circular. Also, a plurality of LEDs 17b are arranged on the inner surface of the dome 17a. In the illumination unit 17, a plurality of segments (Ch01 to Ch08) are formed from the inner side to the outer side in the radial direction of the dome 17a. The illumination unit 17 is so-called multi-channel illumination that can individually perform dimming of each segment. In each of the plurality of segments, a plurality of LEDs 17b are arranged at predetermined intervals in the circumferential direction of the dome 17a.

[0035] Referring again to FIG. 1, inspected electronic components S1 are placed in the placement unit 14. The placement unit 14 is movable along the Y-axis in the figure. The inspection table 11 places the inspected electronic components S1 in the placement unit 14.

[0036] The extraction unit 15 transfers the electronic components S1 placed in the placement unit 14 to a tray. The electronic components S1 are classified as "good products" or "defective products" based on the results of inspections using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to a good-product tray 15a or a defective-product tray 15b based on the classification results. That is, good products are stored in the good-product tray 15a, and defective products are stored in the defective-product tray 15b. Each of the good-product tray 15a and the defective-product tray 15b is replaced with a new tray when filled with the electronic components S1.

[0037] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display images. The monitor 20 is composed of a display device such as, for example, a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

[0038] The computer 50 controls the operations of each part of, for example, the cutting module A1 and the inspection / storage module B1. By the computer 50, for example, the operations of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transfer unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the lighting units 16, 17, the placement unit 14, the extraction unit 15, and the monitor 20 are controlled.

[0039] Also, the computer 50 performs various inspections of the electronic components S1 based on, for example, the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.

[0040] <1-2. Hardware Configuration of Computer> FIG. 3 is a diagram schematically showing the hardware configuration of the computer 50. As shown in FIG. 3, the computer 50 includes a control unit 70, an input / output I / F (interface) 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0041] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.

[0042] The input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input / output I / F 90 is used for transmitting data from the computer 50 to each component in the cutting device 1 and receiving data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive an instruction from the user. The reception unit 95 is composed of, for example, part or all of a touch panel, a keyboard, a mouse, and a microphone.

[0043] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store, for example, a control program 81. By executing the control program 81 by the control unit 70, various operations in the cutting device 1 are realized. When the control unit 70 executes the control program 81, the control program 81 is expanded in the RAM 74. Then, the control unit 70 controls each component by interpreting and executing the control program 81 expanded in the RAM 74 by the CPU 72.

[0044] [2. Inspection of Electronic Components with Sizes Outside the Field of View of the Camera] As described above, in the cutting device 1, inspections of electronic components are performed. Specifically, various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. Hereinafter, typically, the inspection using the second optical inspection camera 13 will be described. Note that the same processing is also performed in the inspection using the first optical inspection camera 12.

[0045] The size of each electronic component S1 held on the inspection table 11 may be large, and it is conceivable that each electronic component S1 may not fit within the field of view (angle of view) of the second optical inspection camera 13. In such a case, in the cutting device 1, a plurality of partial image data each showing a different part of the electronic component S1 are generated by the second optical inspection camera 13, and the partial image data are synthesized. By synthesizing the partial image data, synthesized image data is generated. The synthesized image data shows an image of the entire electronic component S1. In the cutting device 1, the electronic component S1 is inspected based on the synthesized image data.

[0046] If the unprocessed partial image data are synthesized, the image deviation at the boundary part (joint part) between the partial images can be large. As an example of the factor causing the deviation, for example, the distortion aberration of the lens included in the second optical inspection camera 13, the inclination around the Z-axis of the second optical inspection camera 13 with respect to the inspection table 11 (with respect to the X-axis), the phenomenon that the rectangular electronic component S1 is imaged as a trapezoid even if the deviation caused by the distortion aberration of the lens and the inclination of the second optical inspection camera 13 is corrected, and the deviation between the moving direction of the second optical inspection camera 13 and the Y-axis, etc. can be mentioned.

[0047] FIG. 4 is a diagram for explaining a problem that occurs when the unprocessed partial image data is synthesized when the second optical inspection camera 13 is tilted around the Z axis with respect to the inspection table 11. Referring to FIG. 4, when the second optical inspection camera 13 is tilted around the Z axis with respect to the inspection table 11, a partial image tilted with respect to the X axis is captured. Each of the partial images PI1, PI2, and PI3 shows, for example, different parts of the imaging target. When the partial images PI1, PI2, and PI3 are synthesized, a synthesized image IM1 is generated. In the synthesized image IM1, for example, a line that originally extends in a straight line parallel to the X axis becomes discontinuous at the boundary of the partial images.

[0048] FIG. 5 is a diagram for explaining a problem that occurs when the unprocessed partial image data is synthesized when a rectangular imaging target is imaged as a trapezoid. Referring to FIG. 5, for example, even if distortion such as distortion due to the distortion aberration of the lens of the second optical inspection camera 13 is corrected, there are cases where a rectangular imaging target is imaged as a trapezoid. In the partial image PI4, for example, a range of 100 mm is imaged on the left side, and a range of 105 mm is imaged on the right side. As a result, the rectangular imaging target is imaged as a trapezoid. In such a case, for example, when a partial image showing the left half of the imaging target and a partial image showing the right half of the imaging target are synthesized, a synthesized image IM2 is generated. In the synthesized image IM2, for example, a line that originally extends in a straight line becomes discontinuous at the boundary of the partial images.

[0049] FIG. 6 is a diagram for explaining a problem that occurs when unprocessed partial image data is synthesized when the moving direction of the second optical inspection camera 13 is deviated from the Y axis. Referring to FIG. 6, as described above, the direction in which the second optical inspection camera 13 moves may not be completely parallel to the Y axis. In such a case, for example, assume that partial images PI5, PI6, PI7, PI8, and PI9 are continuously captured. The partial images PI5, PI6, PI7, PI8, and PI9 show, for example, different parts of the imaging target. When the partial images PI5, PI6, PI7, PI8, and PI9 are synthesized, a synthesized image IM3 is generated. In the synthesized image IM3, for example, a line that originally extends linearly diagonally upward becomes discontinuous at the boundary of the partial images.

[0050] As described above, when unprocessed partial image data is synthesized, the image deviation at the boundary between partial images can increase. In the cutting device 1, before the synthesis of partial image data, each partial image data is corrected. Specifically, correction considering the inclination of the second optical inspection camera 13 with respect to the X axis, and correction considering the difference between the angle formed by the axis corresponding to the direction in which the second optical inspection camera 13 moves and the X axis and a reference angle (for example, 90°) are applied to each of the plurality of partial image data, and then the plurality of partial image data are synthesized. Since the synthesis of the plurality of partial image data is performed after various corrections are applied, the deviation that may occur at the boundary between partial image data in the synthesized image data is suppressed. Therefore, according to the cutting device 1, the inspection of the electronic component S1 based on the synthesized image data can be performed with relatively high accuracy.

[0051] In the cutting device 1, the correction of the partial image is performed by using various correction data. The various correction data are generated in advance through the calibration of the cutting device 1. In the cutting device 1, the inspection of the electronic component S1 is performed by using the various correction data generated in advance. Hereinafter, the calibration operation and the inspection operation will be described in order.

[0052] [3. Operation] <3-1. Calibration Operation> FIG. 7 is a flowchart showing the calibration procedure in the cutting device 1. Referring to FIG. 7, the operator adjusts the inclination of the second optical inspection camera 13 (step S100). For example, the inclination of the second optical inspection camera 13 with respect to the inspection table 11 around the X-axis (hereinafter also referred to as "X-axis inclination"), and the inclination of the second optical inspection camera 13 with respect to the inspection table 11 around the Y-axis (hereinafter also referred to as "Y-axis inclination") are adjusted so that each approaches 0°.

[0053] FIG. 8 is a diagram for explaining the inclination around the X-axis. Referring to FIG. 8, in this example, the second optical inspection camera 13 is inclined at an angle θ1 with respect to the inspection table 11 around the X-axis. When adjusting the inclination of the second optical inspection camera 13, a calibration plate is set on the inspection table 11.

[0054] FIG. 9 is a diagram schematically showing the plane of the calibration plate PL1. As shown in FIG. 9, a plurality of dots of the same size are arranged at equal intervals vertically and horizontally on the calibration plate PL1. In the cutting device 1, calibration is performed based on the shape of the dots in the captured image.

[0055] Referring to FIG. 8 again, in this example, the inspection table 11 is not a perfect plane but is slightly warped. In such a case, the inclination around the X-axis changes as the second optical inspection camera 13 moves in the XY direction.

[0056] FIG. 10 is a diagram for explaining an overview of adjustment of the tilt around the X axis. Referring to FIG. 10, the left diagram shows the tilt information AN1 for each imaging position before adjustment of the tilt around the X axis, and the right diagram shows the tilt information AN1 for each imaging position after adjustment of the tilt around the X axis. Each tilt information AN1 indicates the tilt around the X axis at each imaging position. Each tilt information AN1 is calculated by using various known methods based on, for example, the captured image. The adjustment of the tilt around the X axis is performed by manually adjusting the tilt of the second optical inspection camera 13 around the X axis. For example, the tilt information AN1 for each imaging position is displayed on the monitor 20, and the operator adjusts the tilt of the second optical inspection camera 13 while checking the monitor 20. When it is determined that the tilt around the X axis for each imaging position is within a desired range, the operator ends the adjustment of the tilt around the X axis. The operator may perform the adjustment of the tilt around the Y axis in the same procedure as the adjustment of the tilt around the X axis after the adjustment of the tilt around the X axis, or may perform the adjustment of the tilt around the Y axis in the same procedure as the adjustment of the tilt around the X axis in parallel with the adjustment of the tilt around the X axis.

[0057] FIG. 11 is a flowchart showing the process executed in step S100 of FIG. 7. In the cutting device 1, a plurality of imaging positions (imaging positions) at the time of calibration are predetermined. Note that the imaging position (imaging position) refers to the position of the second optical inspection camera 13 on the XY plane. Also, in this example, first, the tilt around the X axis is adjusted, and then the tilt around the Y axis is adjusted. Since the adjustment procedure for the tilt around the X axis and the adjustment procedure for the tilt around the Y axis are substantially the same, only the adjustment procedure for the tilt around the X axis will be described here.

[0058] Referring to FIG. 11, the control unit 70 controls the second optical inspection camera 13 to start imaging the calibration plate PL1 held on the inspection table 11 (step S200). The control unit 70 controls at least one of the inspection table 11 and the second optical inspection camera 13 to move to an imaging position among a plurality of predetermined imaging positions where imaging has not been performed yet (step S210). The control unit 70 controls the second optical inspection camera 13 to perform autofocus (AF) (step S220). The autofocus is performed by adjusting the position of the second optical inspection camera 13 on the Z axis. In a state where the focus of the second optical inspection camera 13 is adjusted, the control unit 70 acquires the coordinate information of the second optical inspection camera 13 on the Z axis (step S230).

[0059] The control unit 70 determines whether imaging has been completed at all the predetermined imaging positions (step S240). If it is determined that imaging has not been completed at all the predetermined imaging positions (NO in step S240), the control unit 70 executes the process of step S210 again.

[0060] On the other hand, if it is determined that imaging has been completed at all the predetermined imaging positions (YES in step S240), the control unit 70 determines whether imaging has been performed a predetermined number of times at all the imaging positions (step S250). If it is determined that imaging has not been performed a predetermined number of times at all the imaging positions (NO in step S250), the control unit 70 executes the process of step S200 again.

[0061] On the other hand, if it is determined that imaging has been performed a predetermined number of times at all the imaging positions (YES in step S250), the control unit 70 extracts the average imaging image at each imaging position and calculates the inclination around the X axis at each imaging position based on the average imaging image (step S260). The calculation result is displayed on the monitor 20, for example.

[0062] Even if the calibration plate PL1 is imaged at the same imaging position, due to the mechanical accuracy of each of the inspection table 11 and the second optical inspection camera 13, and the image processing accuracy, the positions of the dots in the captured image are slightly shifted. Considering such circumstances, imaging is performed a predetermined number of times at all imaging positions, and the inclination around the X-axis is calculated based on the average captured image. Note that which captured image corresponds to the average captured image is determined based on the distance between dots in the captured image.

[0063] FIG. 12 is a diagram for explaining the distance between dots in the captured image of the calibration plate PL1. Referring to FIG. 12, the distance between dots includes the distance AD1 between the dots DO1 in the X-axis direction and the distance BD1 between the dots DO1 in the Y-axis direction. For example, the captured image in which each of the distances AD1 and BD1 is closest to the average value is extracted as the average captured image.

[0064] FIG. 13 is a diagram including a table showing an example of the distance between each dot in five captured images. Referring to FIG. 13, in this example, in the captured image with n = 3, each of the distances AD1 and BD1 is closest to the average value. Therefore, the captured image with n = 3 is extracted as the average captured image.

[0065] Referring back to FIG. 11, when the process of step S260 is executed, the operator checks the inclination around the X-axis at each imaging position displayed on the monitor 20, and determines whether the inclination around the X-axis at each imaging position satisfies a predetermined standard (step S270). When it is determined that the inclination around the X-axis at each imaging position satisfies the predetermined standard (YES in step S270), the inclination adjustment of the second optical inspection camera 13 is completed.

[0066] On the other hand, when it is determined that the inclination around the X-axis at each imaging position does not satisfy a predetermined standard (NO in step S270), the operator issues an instruction to readjust the inclination of the second optical inspection camera 13, for example, via the reception unit 95 of the computer 50. When the readjustment instruction is issued, the control unit 70 controls the second optical inspection camera 13 to move to an average inclination position among the plurality of imaging positions (step S280). Thereafter, the operator manually adjusts the inclination of the second optical inspection camera 13 around the X-axis (step S290). When the manual adjustment is completed, the process of step S200 is executed again.

[0067] Referring again to FIG. 7, when the inclination adjustment of the second optical inspection camera 13 is completed, the control unit 70 of the computer 50 generates a virtual plane based on the plurality of partial image data generated by the second optical inspection camera 13 (step S110). The virtual plane refers to a plane for estimating the focus position (z) for each imaging position (x, y). The focus position refers to the position on the Z-axis of the second optical inspection camera 13 in the in-focus state.

[0068] FIG. 14 is a diagram for explaining the outline of the virtual plane. Referring to FIG. 14, for example, when the inspection table 11 is slightly inclined, the focus position of the second optical inspection camera 13 varies depending on the imaging position. For example, the focus positions at the positions of the second optical inspection camera 13 shown at both ends are actually detected, and the focus position at the position of the second optical inspection camera 13 shown in the center is estimated based on the virtual plane VP1.

[0069] FIG. 15 is a diagram for explaining a procedure for generating a virtual plane. Referring to FIG. 15, the upper left diagram shows points D1, D2, D3, D4 in the XY plane. Each of the points D1, D2, D3, D4 corresponds to an imaging position by the second optical inspection camera 13. At the time of generating the virtual plane, a calibration plate PL1 is set on the inspection table 11. For example, when the inspection table 11 is warped even slightly, it is assumed that the focus positions (positions on the Z axis) at points D1, D2, D3, D4 are different from each other. First, the focus position at each of the points D1, D2, D3, D4 is detected.

[0070] The upper right diagram shows points D1, D2, D3, D4 in the XYZ space obliquely from above. Each of (x, y) of the points D1, D2, D3, D4 indicates the coordinate position in the XY plane, and each of (z) of the points D1, D2, D3, D4 indicates the focus position. A tetrahedron is formed by connecting the points D1, D2, D3, D4 to each other. In this case, consider a virtual plane for estimating the focus position of the point DX1(x, y). When viewed from directly above, the point DX1 intersects the two faces of the tetrahedron.

[0071] That is, the point DX1 intersects the plane FA1 as shown in the lower left diagram and intersects the plane FA3 as shown in the lower center diagram. Then, the focus position at the point DX1 is likely to exist in the intermediate plane between the plane FA1 and the plane FA3.

[0072] The figure on the lower right is a diagram for explaining a method of deriving an intermediate plane between plane FA1 and plane FA3. The intermediate plane between plane FA1 and plane FA3 is a plane connecting points D1, D2, and D5. The coordinates of point D5 are the average values of the coordinates of points D1, D2, D3, and D4. The expression indicating the intermediate plane between plane FA1 and plane FA3 is derived, for example, by using various known methods based on the coordinates of each of points D1, D2, and D5. By substituting the (x, y) of point DX1 into the expression indicating the intermediate plane, the focus position at point DX1 is estimated. That is, this intermediate plane is used as a virtual plane. Note that the method of deriving the virtual plane is not limited to this. For example, a virtual plane may be derived based on the (x, y, z) of four or more points surrounding the imaging position.

[0073] FIG. 16 is a flowchart showing the process executed in step S110 of FIG. 7. Referring to FIG. 16, the processes from step S300 to step S340 are the same as the processes from step S200 to step S240 of FIG. 11, respectively, and thus the description will not be repeated.

[0074] In step S340, when it is determined that imaging at all predetermined imaging positions has been completed (YES in step S340), the control unit 70 generates a virtual plane based on each imaging position and the focus position (step S350). Note that the virtual plane does not necessarily need to be generated in advance, and it may be sufficient that only the (x, y, z) at each imaging position is stored in the storage unit 80. At the time of inspecting the electronic component S1, a virtual plane may be generated each time based on the (x, y, z) at each of at least three points surrounding the imaging position of the second optical inspection camera 13.

[0075] Referring to FIG. 7 again, when the virtual plane is generated, the control unit 70 acquires various correction data by using the generated virtual plane (step S120). Examples of the correction data to be acquired include distortion correction data, rotation correction data, trapezoid correction data, and axis angle correction data.

[0076] FIG. 17 is a flowchart showing the process executed in step S120 of FIG. 7. Referring to FIG. 17, the control unit 70 executes a process for acquiring distortion correction data (step S400).

[0077] FIG. 18 is a diagram for explaining the outline of the correction of the distortion aberration. Referring to FIG. 18, in this example, the thread-winding type of distortion aberration is corrected. Note that the distortion aberration to be corrected may be the barrel type of distortion aberration. The distortion correction data is data for correcting the distortion aberration. The distortion correction data is acquired, for example, by using various known methods based on the captured image by the second optical inspection camera 13.

[0078] FIG. 19 is a flowchart showing the process executed in step S400 of FIG. 17. Referring to FIG. 19, the processes of steps S500, S510, S540, and S550 are the same as the processes of steps S200, S210, S240, and S250 of FIG. 11, respectively, and thus the description will not be repeated.

[0079] In step S510, when the movement to the imaging positions among the plurality of predetermined imaging positions where imaging has not yet been performed is completed, the control unit 70 controls the second optical inspection camera 13 to adjust the Z-axis coordinate position based on the virtual plane (step S520). When the adjustment of the Z-axis coordinate position is completed, the control unit 70 controls the second optical inspection camera 13 to capture a partial image of the calibration plate PL1 (step S530).

[0080] When it is determined that imaging has been performed a predetermined number of times at all imaging positions (YES in step S550), the control unit 70 extracts the average captured image at each imaging position (step S560). The control unit 70 generates distortion correction data based on the extracted average captured image (step S570).

[0081] Referring again to FIG. 17, when the distortion correction data is acquired, the control unit 70 executes a process for acquiring the rotation correction data (step S410).

[0082] FIG. 20 is a diagram for explaining an outline of rotation correction when a partial image is inclined with respect to the X-axis. Referring to FIG. 20, in this example, each of the partial images PI10 and PI11 is inclined at an angle θ2 with respect to the X-axis. In the cutting device 1, rotation correction of each partial image is performed by cutting out a region parallel to the X-axis from each partial image. Due to such rotation correction being performed, the adjacent partial images PI10 and PI11 partially overlap. By synthesizing the rotation-corrected partial images PI10 and PI11, a synthesized image IM4 is generated. In order to perform such rotation correction, it is necessary to calculate the inclination (angle θ2: rotation correction data) around the Z-axis of the second optical inspection camera 13 with respect to the X-axis.

[0083] FIG. 21 is a diagram for explaining a procedure for calculating the inclination around the Z-axis of the second optical inspection camera 13 with respect to the X-axis. Referring to FIG. 21, the axis AX1 is, for example, a row of dots DO1 shown on the calibration plate PL1. Regarding the imaging positions of the partial images PI12 and PI13, the X coordinates are different from each other while the Y coordinates are the same as each other. The factors for the dot DO1 being imaged obliquely in each of the partial images PI12 and PI13 include (1) the inclination around the Z-axis of the second optical inspection camera 13 with respect to the X-axis, and (2) the inclination of the calibration plate PL1 on the inspection table 11. That is, the angle of the axis AX1 in each of the partial images PI12 and PI13 is the sum of the above (1) and (2).

[0084] On the one hand, in this example, when focusing on a specific dot DO1, as the imaging position moves by X1 on the X-axis, the position of the specific dot DO1 moves by Y1 on the Y-axis. The resulting inclination (angle θ3) is due to the above (2). Therefore, the above (1) can be calculated by subtracting the angle θ3 from the angle of the axis AX1 in each of the partial images PI12 and PI13.

[0085] Figure 22 is a flowchart showing the processing executed in step S410 of FIG. 17. Referring to FIG. 22, the processing of steps S600, S610, S620, S630, S650, S660, and S670 is the same as the processing of steps S500, S510, S520, S530, S540, S550, and S560 of FIG. 19, respectively, and thus the description will not be repeated.

[0086] When a partial image is captured in step S630, the control unit 70 performs distortion correction on the partial image data by using the distortion correction data (step S640). When the average captured image at each imaging position is extracted in step S670, the control unit 70 generates rotation correction data based on the extracted average captured image (step S680).

[0087] Referring again to FIG. 17, when the rotation correction data is acquired, the control unit 70 executes a process for acquiring the trapezoid correction data (step S420).

[0088] FIG. 23 is a diagram for explaining the outline of trapezoidal correction when a rectangular imaging target is imaged as a trapezoid. Referring to FIG. 23, as described above, for example, even if distortion such as distortion due to the aberration of the lens of the second optical inspection camera 13 is corrected, there may be a case where a rectangular imaging target is imaged as a trapezoid. In the partial image PI14, for example, a range of 100 mm is imaged on the left side, and a range of 105 mm is imaged on the right side. As a result, a rectangular imaging target is imaged as a trapezoid. In trapezoidal correction, for example, correction is performed on the partial image PI14 such that the imaging range on the left side and the imaging range on the right side are the same, and the imaging range on the upper side and the imaging range on the lower side are the same. As a result, in the corrected partial image PI15, the rectangular imaging target has an accurate shape. The trapezoidal correction data required for such correction is obtained, for example, by using various known methods such as affine transformation.

[0089] FIG. 24 is a flowchart showing the process executed in step S420 of FIG. 17. Referring to FIG. 24, the control unit 70 performs rotational correction on the average imaging image at each imaging position extracted in step S670 of FIG. 22 (step S700). The control unit 70 generates trapezoidal correction data such that the imaging range on the left side and the imaging range on the right side are the same, and the imaging range on the upper side and the imaging range on the lower side are the same in the imaging image after rotational correction (step S710).

[0090] Referring again to FIG. 17, when the trapezoidal correction data is obtained, the control unit 70 executes a process for obtaining the axis angle correction data (step S430).

[0091] FIG. 25 is a diagram for explaining the outline of axis angle correction when there is a deviation between the moving direction of the second optical inspection camera 13 and the Y axis. Referring to FIG. 25, when there is a deviation between the moving direction of the second optical inspection camera 13 and the Y axis, correction of the partial image is performed by adjusting (offsetting) the image cutting position in each of the partial images PI16 and PI17. A composite image IM5 is generated by combining the corrected partial images.

[0092] FIG. 26 is a diagram for explaining a procedure for calculating the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis. Based on the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis, the offset amount of the cut position is determined.

[0093] Referring to FIG. 26, the axis AX2 is, for example, a column of dots DO1 shown on the calibration plate PL1. Regarding the imaging positions of the partial images PI18 and PI19, the X coordinates are the same as each other, while the Y coordinates are different from each other. The factors for the dots DO1 to be imaged obliquely in each of the partial images PI18 and PI19 include (A) the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis (axis angle correction data), and (B) the inclination of the calibration plate PL1 on the inspection table 11. That is, the angle of the axis AX2 in each of the partial images PI18 and PI19 is the sum of the above (A) and (B).

[0094] On the other hand, in this example, when paying attention to a specific dot DO1, as the imaging position moves by Y2 on the Y-axis, the position of the specific dot DO1 moves by X2 on the X-axis. The inclination (angle θ4) caused thereby is due to the above (B). Therefore, the above (A) can be calculated by subtracting the angle θ4 from the angle of the axis AX2 in each of the partial images PI18 and PI19.

[0095] FIG. 27 is a flowchart showing the process executed in step S430 of FIG. 17. Referring to FIG. 27, the processes of steps S800, S810, S820, S830, S850, S860, and S870 are the same as the processes of steps S600, S610, S620, S630, S650, S660, and S670 of FIG. 22, respectively, and thus the description will not be repeated.

[0096] When a partial image is captured in step S830, the control unit 70 performs distortion correction on the partial image data by using distortion correction data, rotation correction on the partial image data by using rotation correction data, and trapezoid correction on the partial image data by using trapezoid correction data in this order (step S840). When an average captured image at each imaging position is extracted in step S870, the control unit 70 generates axis angle correction data based on the extracted average captured image (step S880). In this way, through calibration, a virtual plane and various correction data are generated.

[0097] <3-2. Inspection operation> FIG. 28 is a flowchart showing an inspection procedure for an electronic component S1 that does not fit within the field of view of the second optical inspection camera 13. The processes shown in this flowchart are executed by the control unit 70 of the computer 50 at a predetermined cycle.

[0098] Referring to FIG. 28, the control unit 70 determines a plurality of imaging positions (imaging positions) based on the arrangement information of the electronic component S1 to be inspected (step S900). The control unit 70 controls the second optical inspection camera 13 to start imaging the electronic component S1 held on the inspection table 11 (step S910). The control unit 70 controls at least one of the inspection table 11 and the second optical inspection camera 13 to move to an imaging position among the plurality of predetermined imaging positions where imaging has not been performed yet (step S920).

[0099] The control unit 70 calculates the Z-axis coordinate position based on the virtual plane, and controls the second optical inspection camera 13 to move to the calculated Z-axis coordinate position (step S930). When the adjustment of the Z-axis coordinate position is completed, the control unit 70 controls the second optical inspection camera 13 to capture a partial image of the electronic component S1 (step S940). Thus, in the cutting device 1, when generating the partial image data, the focus position of the second optical inspection camera 13 along the Z-axis is individually adjusted. The control unit 70 performs distortion correction using the distortion correction data, rotation correction using the rotation correction data, and trapezoidal correction using the trapezoidal correction data on the partial image data in this order (step S950).

[0100] The control unit 70 determines whether imaging has been completed at all the predetermined imaging positions (step S960). If it is determined that imaging has not been completed at all the predetermined imaging positions (NO in step S960), the control unit 70 executes the process of step S920 again.

[0101] On the other hand, if it is determined that imaging has been completed at all the predetermined imaging positions (YES in step S960), the control unit 70 performs offset (axis correction) of the partial image data using the axis correction data (step S970). The control unit 70 generates composite image data by synthesizing the partially image data subjected to various corrections (step S980). The control unit 70 inspects and measures the electronic component S1 based on the composite image data (step S990). Examples of the inspection of the electronic component S1 include an appearance inspection of the electronic component S1, and examples of the measurement of the electronic component S1 include measurement of the lengths of the respective parts of the electronic component S1.

[0102] [4. Features] As described above, in the cutting device 1, after correction considering the inclination of the camera with respect to the X-axis and correction considering the difference between the angle formed by the axis along the moving direction of the second optical inspection camera 13 and the X-axis and the reference angle (90°) are applied to each of the plurality of partial image data, the plurality of partial image data are synthesized. Since the plurality of partial image data are synthesized after various corrections are applied, displacement that may occur at the boundary portion between the partial image data is suppressed in the synthesized image data. Therefore, according to the cutting device 1, the inspection of the electronic component S1 based on the synthesized image data can be performed with relatively high accuracy.

[0103] Also, in the cutting device 1, the focus position is individually adjusted at the time of generating each of the plurality of partial image data. Therefore, according to the cutting device 1, each of the plurality of partial image data can be generated by using the second optical inspection camera 13 set at an appropriate focus position. As a result, according to the cutting device 1, the inspection of the electronic component S1 can be performed with relatively high accuracy.

[0104] In the cutting device 1, correction considering the inclination of the second optical inspection camera 13 with respect to the X-axis, and correction considering the difference between the angle formed by the moving direction of the second optical inspection camera 13 and the X-axis and the reference angle (90°) (the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis) are applied to each of a plurality of partial image data in this order. The reason for applying the correction in this order is as follows. As described above, the inclination of the second optical inspection camera 13 with respect to the X-axis can be calculated based on the captured image of the second optical inspection camera 13 even if correction considering the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis is not performed. On the other hand, the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis cannot be calculated based on the captured image of the second optical inspection camera 13 in a state where correction considering the inclination of the second optical inspection camera 13 with respect to the X-axis is not performed. This is because the captured image in a state where correction considering the inclination of the second optical inspection camera 13 with respect to the X-axis is not performed is affected by both the inclination of the second optical inspection camera 13 with respect to the X-axis and the inclination of the moving direction of the second optical inspection camera 13 with respect to the Y-axis. Therefore, in the cutting device 1, correction considering the inclination of the camera with respect to the X-axis is performed first. Since synthesis of a plurality of partial image data is performed after correction is applied in an appropriate order, displacement that may occur at the boundary portion between the partial image data is suppressed in the synthesized image data. Therefore, according to the cutting device 1, inspection of the electronic component S1 based on the synthesized image data can be performed with relatively high accuracy.

[0105] According to the cutting device 1, since the calibration plate PL1 is imaged a plurality of times at the same imaging position and correction data is acquired based on the average captured image, image synthesis can be performed based on more accurate correction data. Note that depending on the imaging object, instead of the average of a plurality of captured images, an image closest to the median of the variations of the plurality of captured images may be used as a basis.

[0106] According to the cutting device 1, a plurality of captured images can be corrected and then combined into one composite image. Therefore, in order to inspect electronic components that do not fit within the field of view of a camera, even if a conventional device would require a camera with a wider field of view, it can be handled with the camera of the conventional device.

[0107] Note that the inspection table 11 is an example of the "table" in the present invention, and each of the first optical inspection camera 12 and the second optical inspection camera 13 is an example of the "camera" in the present invention. The mechanism for moving the inspection table 11 along the X-axis is an example of the "first moving mechanism" in the present invention, and the mechanism for moving each of the first optical inspection camera 12 and the second optical inspection camera 13 along the Y-axis is an example of the "second moving mechanism" in the present invention. The control unit 70 is an example of the "control unit" in the present invention, and the mechanism for moving each of the first optical inspection camera 12 and the second optical inspection camera 13 along the Z-axis is an example of the "third moving mechanism" in the present invention.

[0108] [5. Other Embodiments] The idea of the above-described embodiments is not limited to the embodiments described above. Hereinafter, an example of other embodiments to which the idea of the above-described embodiments can be applied will be described.

[0109] In the above-described embodiment, the technique of inspecting an inspection object that does not fit within the field of view of a camera is applied to the cutting device. However, the application range of this technology is not limited to this. For example, this technology may be applied to a resin molding device for manufacturing resin molded products. For example, this technology may be applied for inspecting resin molded products that do not fit within the field of view of a camera. This technology is applicable to, for example, semiconductor manufacturing devices such as cutting devices and resin molding devices.

[0110] In the above-described embodiment, the inspection table 11 moves along the X-axis, and each of the first optical inspection camera 12 and the second optical inspection camera 13 moves along the Y-axis, thereby adjusting the imaging positions by the respective cameras. However, the method for adjusting the imaging positions by the respective cameras is not limited to this. For example, the imaging positions by the respective cameras may be adjusted by moving each camera along both the X-axis and the Y-axis, or the imaging positions by the respective cameras may be adjusted by moving the inspection table 11 along both the X-axis and the Y-axis.

[0111] As described above, the embodiments of the present invention have been illustratively described. That is, for illustrative purposes, a detailed description and the accompanying drawings have been disclosed. Therefore, among the components described in the detailed description and the accompanying drawings, there may be components that are not essential for solving the problems. Therefore, just because those non-essential components are described in the detailed description and the accompanying drawings, they should not be immediately recognized as essential.

[0112] Also, the above-described embodiment is merely an exemplification of the present invention in every aspect. Various improvements and modifications are possible within the scope of the present invention. For example, at least a part of the configuration of one of the embodiments and at least a part of the configuration of another one of the embodiments may be combined. That is, in practicing the present invention, a specific configuration can be appropriately adopted according to the embodiment.

[0113] [6. Supplementary Note] <Technology 1> (Configuration) A table for holding an electronic component, A camera that images a part of the electronic component and generates first partial image data, A first moving mechanism that moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in a first axis is changed, A second moving mechanism that moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in the second axis is changed; A control unit that controls each of the camera, the first moving mechanism, and the second moving mechanism so that a plurality of first partial image data each showing a different part of the electronic component are generated; The control unit performs a first process of correcting each of the plurality of first partial image data in consideration of the inclination of the camera with respect to the first axis and correcting in consideration of the difference between the angle formed by the first axis and the second axis and a reference angle, a second process of generating composite image data by synthesizing the plurality of corrected first partial image data, and a third process of inspecting the electronic component based on the composite image data. An inspection system.

[0114] (Effects, etc.) In this inspection system, after correction in consideration of the inclination of the camera with respect to the first axis and correction in consideration of the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of the plurality of first partial image data, the plurality of first partial image data are synthesized. Since the plurality of first partial image data are synthesized after various corrections are applied, displacement that may occur at the boundary portion between the first partial image data is suppressed in the composite image data. Therefore, according to this inspection system, the inspection of the electronic component based on the composite image data can be performed with relatively high accuracy.

[0115] <Technology 2> (Configuration) The inspection system according to Technology 1, wherein the reference angle is 90°.

[0116] (Effects, etc.) In this inspection system, when the angle formed by the first axis and the second axis deviates from a right angle, correction is applied to each of the plurality of first partial image data. Since the plurality of first partial image data are combined after the correction is applied, misalignment that may occur at the boundary portions between the first partial image data is suppressed in the combined image data. Therefore, according to this inspection system, inspection of electronic components based on the combined image data can be performed with relatively high accuracy.

[0117] <Technology 3> (Configuration) The camera includes a lens, In the first process, correction taking into account the distortion of the lens is further applied to each of the plurality of first partial image data, in the inspection system according to Technology 1 or Technology 2.

[0118] (Effects, etc.) In this inspection system, after correction taking into account the distortion of the lens is further applied to each of the plurality of first partial image data, the plurality of first partial image data are combined. Since the plurality of first partial image data are combined after various corrections are applied, misalignment that may occur at the boundary portions between the first partial image data is suppressed in the combined image data. Therefore, according to this inspection system, inspection of electronic components based on the combined image data can be performed with relatively high accuracy.

[0119] <Technology 4> (Configuration) The inspection system further includes a third moving mechanism that moves the camera along a third axis orthogonal to each of the first axis and the second axis, The control unit controls the third moving mechanism such that the focus position of the camera along the third axis is individually adjusted when each of the plurality of first partial image data is generated, in the inspection system according to any one of Technologies 1 to 3.

[0120] (Effects, etc.) For example, when the table is not a perfect plane, a situation may occur where the focus position varies depending on the imaging position of the electronic component. In this inspection system, the focus position is individually adjusted during the generation of each of the plurality of first partial image data. Therefore, according to this inspection system, each of the plurality of first partial image data can be generated by using a camera set at an appropriate focus position. As a result, according to this inspection system, the inspection of the electronic component can be performed with relatively high precision.

[0121] <Technology 5> (Configuration) The control unit controls the third moving mechanism so that the focus position is adjusted by referring to the virtual plane. The virtual plane is generated based on the focus position at each of at least three points surrounding the imaging position by the camera, and the inspection system described in Technology 4.

[0122] (Effects, etc.) In this inspection system, by referring to the virtual plane, the focus position of the camera is adjusted with relatively high precision. Therefore, according to this inspection system, each of the plurality of first partial image data can be generated by using a camera set at an appropriate focus position. As a result, according to this inspection system, the inspection of the electronic component can be performed with relatively high precision.

[0123] <Technology 6> (Configuration) In the first process, the control unit performs correction considering the inclination of the camera with respect to the first axis and correction considering the difference between the angle formed by the first axis and the second axis and the reference angle on each of the plurality of first partial image data in this order, and the inspection system according to any one of Technologies 1 to 5.

[0124] (Effects, etc.) In this inspection system, corrections considering the inclination of the camera with respect to the first axis and corrections considering the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of a plurality of first partial image data in this order. That is, in this inspection system, the correction considering the inclination of the camera with respect to the first axis that is not affected by the difference between the angle formed by the first axis and the second axis and the reference angle is performed first. Since the plurality of first partial image data are synthesized after the corrections are applied in an appropriate order, displacement that may occur at the boundary portion between the first partial image data is suppressed in the synthesized image data. Therefore, according to this inspection system, the inspection of electronic components based on the synthesized image data can be performed with relatively high accuracy.

[0125] <Technology 7> (Configuration) First correction data is used for the correction considering the inclination of the camera with respect to the first axis, and second correction data is used for the correction considering the difference between the angle formed by the first axis and the second axis and the reference angle. Each of the first correction data and the second correction data is generated in advance. The camera images a calibration plate and generates second partial image data. The inspection system according to any one of Technologies 1 to 6, wherein the second correction data is generated based on the second partial image data after the correction using the first correction data has been performed.

[0126] (Effects, etc.) In this inspection system, second correction data is generated based on second partial image data after the inclination of the camera with respect to the first axis is corrected. Therefore, in this inspection system, relatively high-precision second correction data is generated in advance. As a result, in this inspection system, after correction using the relatively high-precision second correction data is performed, a plurality of first partial image data is synthesized. Therefore, in the synthesized image data, misalignment that may occur at the boundary portion between the first partial image data is suppressed. Thus, according to this inspection system, inspection of the electronic component based on the synthesized image data can be performed with relatively high precision.

[0127] <Technology 8> (Configuration) An inspection system according to any one of Technologies 1 to 7, and a manufacturing system for manufacturing the electronic component, wherein the electronic component is a semiconductor device, and the inspection system is a semiconductor manufacturing apparatus that inspects the electronic component manufactured by the manufacturing system.

[0128] (Effects, etc.) In this semiconductor manufacturing apparatus, after correction considering the inclination of the camera with respect to the first axis and correction considering the difference between the angle formed by the first axis and the second axis and the reference angle are applied to each of a plurality of first partial image data, the plurality of first partial image data is synthesized. Since the plurality of first partial image data is synthesized after various corrections are applied, misalignment that may occur at the boundary portion between the first partial image data is suppressed in the synthesized image data. Therefore, according to this semiconductor manufacturing apparatus, inspection of the electronic component based on the synthesized image data can be performed with relatively high precision.

[0129] <Technology 9> (Configuration) An inspection method using an inspection system, wherein the inspection system includes a table for holding an electronic component, and a camera that images a part of the electronic component and generates partial image data, A first moving mechanism that moves at least one of the table and the camera so that a relative positional relationship between the electronic component and the camera in a first axis is changed; A second moving mechanism that moves at least one of the table and the camera so that a relative positional relationship between the electronic component and the camera in a second axis is changed; and The inspection method includes: Generating a plurality of partial image data, each of which shows a different part of the electronic component; Performing correction in consideration of the inclination of the camera with respect to the first axis, and correction in consideration of a difference between an angle formed by the first axis and the second axis and a reference angle on each of the plurality of partial image data; Generating composite image data by synthesizing the plurality of corrected partial image data; and Inspecting the electronic component based on the composite image data.

[0130] (Effects, etc.) In this inspection method, after correction in consideration of the inclination of the camera with respect to the first axis and correction in consideration of a difference between an angle formed by the first axis and the second axis and a reference angle are performed on each of the plurality of first partial image data, the plurality of first partial image data are synthesized. Since the plurality of first partial image data are synthesized after various corrections are performed, displacement that may occur at a boundary portion between the first partial image data is suppressed in the composite image data. Therefore, according to this inspection method, inspection of the electronic component based on the composite image data can be performed with relatively high accuracy.

Explanation of Signs

[0131] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Spindle unit, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 7 Conveying unit, 7a Second cleaner, 11 Inspection table, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Arrangement unit, 15 Extraction unit, 15a Tray for good products, 15b Tray for defective products, 16, 17 Lighting unit, 17a Dome, 17b LED, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Storage unit, 81 Control program, 90 Input / output I / F, 95 Reception unit, A1 Cutting module, AN1 Tilt information, AX1 Axis, B1 Inspection / storage module, D1 - D5, DX1 Points, DO1 Dot, FA1 - FA4 Surfaces, M1 Magazine, P1 Package substrate, PI1 - PI19 Partial images, IM1 - IM5 Composite images, PL1 Calibration plate, S1 Electronic component, VP1 Virtual plane.

Claims

1. A table for holding an electronic component, a camera that images a part of the electronic component and generates first partial image data, a first moving mechanism that moves at least one of the table and the camera so that a relative positional relationship between the electronic component and the camera in a first axis is changed, a second moving mechanism that moves at least one of the table and the camera so that a relative positional relationship between the electronic component and the camera in a second axis is changed, and a control unit that controls each of the camera, the first moving mechanism, and the second moving mechanism so that a plurality of first partial image data each showing a different part of the electronic component are generated, wherein the control unit performs a first process of performing correction in consideration of the inclination of the camera with respect to the first axis and correction in consideration of a difference between an angle formed by the first axis and the second axis and a reference angle on each of the plurality of first partial image data, a second process of generating composite image data by synthesizing the plurality of first partial image data after correction, and a third process of inspecting the electronic component based on the composite image data. The inspection system.

2. The inspection system according to claim 1, wherein the reference angle is 90°.

3. The camera includes a lens, In the first process, correction in consideration of distortion of the lens is further performed on each of the plurality of first partial image data. The inspection system according to claim 1 or claim 2.

4. further comprising a third moving mechanism that moves the camera along a third axis orthogonal to each of the first axis and the second axis, The control unit controls the third moving mechanism so that the focus position of the camera along the third axis is individually adjusted when each of the plurality of first partial image data is generated. The inspection system according to any one of claims 1 to 3.

5. The control unit controls the third moving mechanism so that the focus position is adjusted by referring to a virtual plane, The inspection system according to claim 4, wherein the virtual plane is generated based on the focus position at each of at least three points surrounding the imaging position by the camera.

6. In the first process, the control unit performs correction considering the inclination of the camera with respect to the first axis and correction considering the difference between the angle formed by the first axis and the second axis and the reference angle on each of the plurality of first partial image data in this order. The inspection system according to any one of claims 1 to 5.

7. First correction data is used for the correction considering the inclination of the camera with respect to the first axis, and second correction data is used for the correction considering the difference between the angle formed by the first axis and the second axis and the reference angle. Each of the first correction data and the second correction data is generated in advance. The camera images a calibration plate and generates second partial image data. The second correction data is generated based on the second partial image data after the correction using the first correction data. The inspection system according to any one of claims 1 to 6.

8. An inspection system according to any one of claims 1 to 7, And a manufacturing system for manufacturing the electronic component, The electronic component is a semiconductor device, The inspection system is a semiconductor manufacturing apparatus that inspects the electronic component manufactured by the manufacturing system.

9. An inspection method using an inspection system, The inspection system is, A table for holding an electronic component, A camera that images a part of the electronic component and generates partial image data, A first moving mechanism that moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in the first axis is changed, And a second moving mechanism that moves at least one of the table and the camera so that the relative positional relationship between the electronic component and the camera in the second axis is changed. The inspection method is, Generating a plurality of partial image data each showing a different part of the electronic component, Performing correction considering the inclination of the camera with respect to the first axis and correction considering the difference between the angle formed by the first axis and the second axis and the reference angle on each of the plurality of partial image data, Generating composite image data by synthesizing the plurality of corrected partial image data, And inspecting the electronic component based on the composite image data. An inspection method.

Images