Chip holding device, chip holding method, semiconductor device manufacturing equipment

Abstract

To provide a chip holding device capable of reversing the orientation of chips while suppressing misalignment of chips with respect to the holding surface.SOLUTION: A chip holding device 10 comprises a chip holder 12 having a holding surface 18 for noncontact holding of a chip 100 and a vibration source 30 that applies ultrasonic vibration to the holding surface 18 to form a squeeze film between the holding surface 18 and the chip 100, and a rotary mechanism 40 that rotates the chip holder 12 around a defined rotary axis 46, and the rotary axis 46 is the axis that rotates the chip 100 in the direction of inverting the chip, and is the axis set in an area other than the area where the holding surface 18 is pushed out in the opposite direction of the chip 100.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] This specification discloses a chip holding device that holds a chip in a non-contact manner, a chip holding method, and a semiconductor device manufacturing apparatus.

Background Art

[0002] In recent years, in order to achieve further miniaturization and higher density of semiconductor devices, there has been a demand for a chip holding device that holds a chip in a non-contact manner. In response to such demands, in some cases, a chip holding device that holds a semiconductor chip in a non-contact manner has been proposed. According to such a technique, chipping and contamination of the chip can be prevented.

[0003] For example, Patent Document 1 discloses a chip holding device having a chip holder that holds a chip in a non-contact manner by utilizing the ultrasonic squeeze effect. In Patent Document 1, ultrasonic vibration is applied to the holding surface of the chip holder to form a squeeze film between the holding surface and the chip. Due to the squeeze film, an ultrasonic holding force that tries to stay on the surface of the squeeze film acts on the chip.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in order to reverse the orientation of such a chip, the chip holder may be rotated while the chip is being held in some chip holding devices. In conventional chip holding devices, the rotation axis was set on the opposite side of the chip across the holding surface. In this case, during the rotation process, due to gravity and centrifugal force, the chip may be displaced with respect to the holding surface or may be detached from the holding surface.

[0006] Therefore, the present specification discloses a chip holding device, a chip holding method, and a semiconductor device manufacturing apparatus that can suppress misalignment of a chip with respect to a holding surface while reversing the orientation of the chip.

Means for Solving the Problems

[0007] The chip holding device disclosed in the present specification includes a holding surface that holds a chip in a non-contact manner, and a vibration source that applies ultrasonic vibration to the holding surface to form a squeeze film between the holding surface and the chip, and a chip holder having the vibration source, and a rotation mechanism that rotates the chip holder around a specified rotation axis, wherein the rotation axis is an axis that rotates the chip in a direction of inverting the chip upside down, and is an axis set in an area other than an area where the holding surface is pushed out in a direction opposite to the chip, which is characterized.

[0008] In this case, the rotation axis may be set in an area where the holding surface is pushed out in a direction approaching the chip from the holding surface.

[0009] For example, the rotation axis may be an axis passing through the chip. Also, the rotation axis may be set outside the holding surface when viewed in the axial direction of the chip holder.

[0010] Furthermore, a controller is provided, and the controller may control the rotation speed of the chip holder by the rotation mechanism according to the rotation angle so that at least temporarily, the vertical component of the centrifugal force acting on the chip substantially balances the gravity acting on the chip.

[0011] Also, the controller may rotate the chip holder while accelerating it by the rotation mechanism so that at least temporarily, an inertial force in a direction approaching the holding surface acts on the chip.

[0012] Furthermore, it further includes a controller and a suction source that applies a negative pressure for sucking the chip onto the holding surface to the holding surface. When an inertial force in a direction away from the holding surface acts on the chip, the controller may increase at least one of the suction force by the suction source and the ultrasonic holding force by the vibration source compared to the case where an inertial force in a direction approaching the holding surface acts.

[0013] Furthermore, it further includes a swing mechanism that swings the chip holder around a swing axis different from the rotation axis. The controller may swing the chip holder by the swing mechanism at least temporarily according to the rotation angle.

[0014] The rotation mechanism is configured to be able to change the rotation radius, which is the distance from the rotation axis to the chip holder. The controller may rotate the chip holder non-circularly by the rotation mechanism so that the rotation radius changes according to the rotation angle.

[0015] The manufacturing apparatus for a semiconductor device disclosed in this specification has the above-described chip holding device.

[0016] The chip holding method disclosed in this specification is characterized in that, in a state where the chip is held non-contactingly by the holding surface of the chip holder, the chip holder is rotated around a specified rotation axis, and the rotation axis is an axis that rotates in a direction to turn the chip upside down, and is an axis set in an area other than the area where the holding surface is pushed out in a direction opposite to the chip.

Advantages of the Invention

[0017] According to the technology disclosed in this specification, even when the chip holder is rotated at high speed, a centrifugal force in a direction away from the chip in the thickness direction does not act on the chip, so that the detachment of the chip can be effectively suppressed.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0019] Hereinafter, the configuration of the chip holding device 10 will be described with reference to the drawings. FIG. 1 is a diagram showing the configuration of the chip holding device 10. This chip holding device 10 is a device that holds and transports a semiconductor chip 100 in a non-contact manner, and is incorporated into, for example, a manufacturing device or an inspection device of a semiconductor device.

[0020] As shown in Fig. 1, the chip holding device 10 includes a chip holder 12, a rotation mechanism 40, a vibration source 30, a suction source 36, and a controller 50. The chip holder 12 holds the semiconductor chip 100 in a non-contact manner. The chip holder 12 has a substantially plate-shaped holding plate 16 and a main body 14. The end face of the holding plate 16 functions as a holding surface 18 for holding the semiconductor chip 100. A suction hole 22 communicating with the suction source 36 described later is formed at the center of the holding surface 18. The main body 14 extends axially from the holding plate 16. A suction path 24 communicating the suction hole 22 and the suction source 36 is formed in the main body 14. Further, the vibration source 30 is incorporated in the main body 14. The main body 14 may function as a horn that amplifies the ultrasonic vibration generated by the vibration source 30 and transmits it to the holding surface 18.

[0021] The rotation mechanism 40 is an actuator that rotates the chip holder 12 around the rotation axis 46. The rotation axis 46 is an axis that rotates in a direction to turn the chip 100 upside down. The rotation axis 46 is, for example, parallel to the holding surface 18. By rotating the chip holder 12 180 degrees around the rotation axis 46, the top and bottom of the semiconductor chip 100 are inverted. The rotation mechanism 40 has a power source 42 that is driven and controlled by the controller 50 described later. The power source 42 may be any electrically controllable device, for example, a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or a combination thereof.

[0022] The vibration source 30 generates ultrasonic vibration and, for example, includes an ultrasonic vibration element 32 and an AC power source 34. The ultrasonic vibration element 32 generates longitudinal vibration when receiving a drive signal that is a voltage signal. The ultrasonic vibration element 32, for example, has lead zirconate titanate (commonly known as PZT) that vibrates when receiving an AC voltage, and is a bolt-clamped Langevin type vibrator (commonly known as BLT or BL vibrator) in which the PZT is sandwiched between metal blocks and clamping pressure is applied with bolts. The AC power source 34 applies an alternating voltage having a frequency corresponding to a predetermined resonance frequency to the ultrasonic vibration element 32.

[0023] By driving the vibration source 30, the holding surface 18 vibrates ultrasonically in the axial direction. Then, due to the ultrasonic vibration of the holding surface 18, an ultrasonic squeeze effect occurs between the holding surface 18 and a plane (for example, the end face of the semiconductor chip 100) that is closely opposed to the holding surface 18. And due to this ultrasonic squeeze effect, the semiconductor chip 100 is held on the holding surface 18 while being separated from the holding surface 18, which will be described later.

[0024] The suction source 36 generates a negative pressure and has, for example, an air pump or the like. The suction source 36 communicates with the suction path 24. By driving the suction source 36, a negative pressure acts on the suction holes 22, generating a suction force that attracts the semiconductor chip 100 to the holding surface 18.

[0025] The controller 50 controls the driving of the electrical elements of the chip holding device 10. Physically, this controller 50 is a computer having a processor 52 and a memory 54. In FIG. 1, the controller 50 is illustrated as a single computer, but the controller 50 may be physically configured by combining a plurality of separated computers.

[0026] This controller 50 controls the driving of the vibration source 30 and the suction source 36 so that the holding surface 18 can hold the semiconductor chip 100 in a non-contact manner. This will be described with reference to FIG. 2. FIG. 2 is a schematic diagram showing the principle of holding the semiconductor chip 100 in a non-contact manner.

[0027] As described above, when an alternating voltage is applied to the ultrasonic vibration element 32, the holding surface 18 vibrates ultrasonically. In a state where this ultrasonic vibration occurs, when the semiconductor chip 100 is brought close to the holding surface 18, an ultrasonic squeeze effect occurs between the holding surface 18 and the semiconductor chip 100. The ultrasonic squeeze effect is an effect in which when one of two flat plates facing each other through a minute gap vibrates, a pressure higher than the outside is generated in the gap due to the influence of the viscosity in the gap. When this ultrasonic squeeze effect occurs, a squeeze film Sf is formed.

[0028] Due to the pressure difference, a force that attempts to stay on the surface of the squeeze film Sf acts on the semiconductor chip 100. The force generated by this squeeze film Sf becomes the holding force for holding the semiconductor chip 100. Hereinafter, the holding force caused by the squeeze film Sf is referred to as the "ultrasonic holding force". The ultrasonic holding force occurs in both the direction perpendicular to and parallel to the holding surface 18 (i.e., the plane direction). That is, when the squeeze film Sf is formed, a force that separates the semiconductor chip 100 from the holding surface 18 in the thickness direction, that is, a force in the direction of floating from the holding surface 18, acts on the semiconductor chip 100. Also, when the squeeze film Sf is formed, the semiconductor chip 100 attempts to stay within the vibration plane. Therefore, as shown in the lower figure of FIG. 2, even if the semiconductor chip 100 is temporarily displaced in the plane direction under an external force, the semiconductor chip 100 moves in the plane direction so that its entire body is positioned within the vibration plane and attempts to return to a state facing the holding surface 18.

[0029] In this example, in order to assist such an ultrasonic holding force, a suction force due to negative pressure is further generated on the holding surface 18. The controller 50 controls the driving of the suction source 36 and the vibration source 30 so that the suction force, the ultrasonic holding force, and the gravitational force acting on the semiconductor chip 100 are balanced in a state where the semiconductor chip 100 floats from the holding surface 18.

[0030] Also, the controller 50 drives the rotation mechanism 40 to rotate the chip holder 12 in order to invert the semiconductor chip 100 upside down as needed. During this rotation, due to gravity and centrifugal force, the semiconductor chip 100 may be displaced with respect to the holding surface 18 or the semiconductor chip 100 may fall off the holding surface 18. This will be described with reference to FIGS. 3 and 4.

[0031] Figures 3 and 4 are diagrams showing the rotation state of the chip holder 12 by the chip holding device 10* of the comparative example. As shown in FIGS. 3 and 4, in the chip holding device 10* of the comparative example, the rotation axis 46* is set on the opposite side of the semiconductor chip 100 across the holding surface 18. In other words, in the chip holding device 10*, the rotation axis 46* is set in the area Aa where the holding surface 18 is pushed out to the opposite side of the semiconductor chip 100.

[0032] In such a chip holding device 10*, as shown in FIG. 3, consider the case where the chip holder 12 is rotated so that the semiconductor chip 100 changes from the downward-facing rotation angle θ1 to the upward-facing rotation angle θ3. In this case, as shown by the rotation angle θ2 in FIG. 3, during the rotation process, the direction of the gravitational force Fg acting on the semiconductor chip 100 becomes substantially parallel to the plane direction, and the semiconductor chip 100 may be displaced in the plane direction with respect to the holding surface 18. Such displacement is automatically corrected by the ultrasonic holding force when the rotation reaches the completed rotation angle θ3. However, it takes some time to correct this positional displacement, and during that time, the semiconductor chip 100 vibrates in the plane direction. This leads to an increase in the processing time for the semiconductor chip 100.

[0033] For example, consider the case of changing the orientation of the semiconductor chip 100 held by the chip holder 12 in order to inspect the semiconductor chip 100. In this case, after changing the orientation of the semiconductor chip 100, if the semiconductor chip 100 vibrates for a while, the inspection process cannot be started during the vibration period, and the time required for the inspection becomes longer. Also, as another form, consider the case of delivering the semiconductor chip 100 picked up by the chip holder 12 to a bonding tool. In this case, after picking up the semiconductor chip 100, the chip holder 12 rotates 180 degrees to change the orientation of the semiconductor chip 100. After this rotation is completed, the semiconductor chip 100 cannot be delivered to the bonding tool until the vibration in the plane direction of the semiconductor chip 100 stops. As a result, the manufacturing lead time of the semiconductor device increases.

[0034] Therefore, in order to prevent the positional deviation of the semiconductor chip 100 caused by gravity, it is conceivable to rotate the chip holder 12 at high speed. However, in this case, as shown in FIG. 4, a centrifugal force Fc in a direction away from the holding surface 18 in the thickness direction acts on the semiconductor chip 100. And due to this centrifugal force Fc, the semiconductor chip 100 may be detached from the holding surface 18. Further, when the absolute value of the acceleration (including negative acceleration) when rotating the chip holder 12 is large, an inertial force Fi acts on the semiconductor chip 100. Due to this inertial force Fi, the semiconductor chip 100 may be displaced in the plane direction with respect to the holding surface 18.

[0035] In this example, in order to prevent such positional deviation and detachment of the semiconductor chip 100, the rotation axis 46 of the chip holder 12 is set in an area other than the area Aa where the holding surface 18 is pushed out to the opposite side of the semiconductor chip 100. Hereinafter, this will be described in detail.

[0036] For example, as shown in FIG. 5, the rotation axis 46 may be set in an area Ab where the holding surface 18 is pushed out in a direction approaching the semiconductor chip 100 from the holding surface 18. In other words, the rotation axis 46 is set in the area Ab such that a centrifugal force Fc in a direction toward the holding surface 18 acts on the semiconductor chip 100 as the chip holder 12 rotates. A line segment La connecting the rotation axis 46 and the bottom surface of the semiconductor chip 100 is perpendicular to the holding surface 18 and does not pass through the holding surface 18.

[0037] In this case, by rotating the chip holder 12, a centrifugal force Fc toward the holding surface 18 acts on the semiconductor chip 100. Due to this centrifugal force Fc, the positional deviation and detachment of the semiconductor chip 100 are effectively suppressed. Further, since the chip holder 12 can be rotated at high speed, the processing time can be shortened.

[0038] In addition, when the above chip holder 12 is used as a pickup collet or the like, a lifting mechanism 60 for lifting the chip holder 12 together with the rotation axis 46 may be provided in conjunction with the rotation of the chip holder 12. That is, as shown in FIG. 13, the pickup collet 78 picks up the semiconductor chip 100 from the chip supply source 72 located below the chip holder 12 and delivers the semiconductor chip 100 to the bonding tool 86 located above the chip holder 12. Therefore, the chip height position of the pickup collet 78 in the upward state must be higher than the chip height position in the downward state. On the other hand, as is clear from FIG. 5, the above chip holder 12 has a lower chip height position in the upward state (θ3) than in the downward state (θ1). Therefore, when the above chip holder 12 is used as a pickup collet, a lifting mechanism 60 for lifting the chip holder 12 together with the rotation axis 46 may be provided so that the chip height position in the upward state (θ3) is higher than the chip height position in the downward state (θ1). The lifting mechanism 60 may have a power source 62 that can be electrically controlled, such as a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or the like.

[0039] Also, as another form, as shown in FIG. 6, the rotation axis 46 may be set at a position passing through the semiconductor chip 100 held by the holding surface 18. In this case, with the rotation of the chip holder 12, the centrifugal force Fc acting on the semiconductor chip 100 can be made substantially zero. As a result, the detachment of the semiconductor chip 100 due to the centrifugal force Fc can be effectively prevented.

[0040] Also, as another form, as shown in FIG. 7, the rotation axis 46 may be set outside the holding surface 18 when viewed in the axial direction of the chip holder 12. In this case, no centrifugal force Fc in the thickness direction (i.e., the axial direction of the chip holder 12) acts on the semiconductor chip 100. As a result, the detachment of the semiconductor chip 100 due to the centrifugal force Fc can be effectively prevented.

[0041] Note that, in this case, at a rotation angle of θ3 = 90 degrees, the direction of the gravitational force Fg acting on the semiconductor chip 100 becomes parallel to the plane direction. In this case, due to the gravitational force Fg, the semiconductor chip 100 is likely to be displaced in the plane direction. Therefore, when passing near θ3 = 90 degrees, the controller 50 may control the rotation speed of the chip holder 12 by the rotation mechanism 40 so that the vertical component of the centrifugal force Fc acting on the semiconductor chip 100 balances the gravitational force Fg. With such a configuration, the displacement of the semiconductor chip 100 in the plane direction due to the gravitational force Fg can be effectively suppressed.

[0042] Also, as another form, the controller 50 may temporarily accelerate the chip holder 12 in order to suppress the displacement caused by the centrifugal force Fc or the gravitational force Fg. FIG. 8 is a diagram showing how the semiconductor chip 100 changes from an upward state (θ5) to a downward state (θ1). In this case, as shown in FIG. 8, by rotating the chip holder 12 while accelerating it, an inertial force Fi in the direction toward the holding surface 18 acts on the semiconductor chip 100. By the action of such an inertial force Fi, the displacement of the semiconductor chip 100 caused by the centrifugal force Fc and the gravitational force Fg is effectively suppressed.

[0043] Note that the chip holding device 10 may further include a swing mechanism 64 that swings the chip holder 12 about a swing axis 68 different from the rotation axis 46. By changing the inclination of the holding surface 18 by such a swing mechanism 66, the direction of the resultant force Fgc of the gravitational force Fg and the centrifugal force Fc can be finely adjusted. For example, like the rotation angle θ4 in FIG. 8, by tilting the chip holder 12 by the swing mechanism 64, the direction of the resultant force Fgc of the gravitational force Fg and the centrifugal force Fc can be adjusted in the direction from the semiconductor chip 100 toward the holding surface 18. As a result, even when a sufficient inertial force Fi cannot be obtained, the semiconductor chip 100 can be pressed against the holding surface 18 side, and the displacement of the semiconductor chip 100 can be effectively suppressed.

[0044] Furthermore, the controller 50 may change the suction force Fs by the suction source 36 and the ultrasonic holding force Fv by the vibration source 30 according to the rotation angle, rotation speed, and acceleration of the chip holder 12. For example, at the rotation angle θ2 in FIG. 8, the chip holder 12 decelerates to stop. Due to this deceleration, an inertial force Fi in a direction away from the holding surface 18 in the thickness direction acts on the semiconductor chip 100. Also, at this time, the gravitational force Fg acting on the semiconductor chip 100 is also in a direction away from the holding surface 18. Therefore, at the rotation angle θ2, the semiconductor chip 100 is likely to be detached or displaced. Thus, at the rotation angle θ2, the suction force Fs by the suction source 36 and the ultrasonic holding force Fv by the vibration source 30 may be increased. Thereby, the detachment and displacement of the semiconductor chip 100 can be more effectively suppressed.

[0045] Also, in the previous description, the chip holder 12 rotates in a circular shape, but the chip holder 12 may rotate in a non-circular shape. For example, as shown in FIG. 9, the rotation mechanism 40 may change the distance from the rotation axis 46 to the chip holder 12 (hereinafter referred to as the "rotation radius") according to the rotation angle. In the example of FIG. 9, the rotation radius at an angle where the semiconductor chip 100 is likely to be displaced in the plane direction due to the gravitational force Fg, that is, around the rotation angle θ5 = 90 degrees, is made larger than the rotation radius at other rotation angles. With such a configuration, at around the rotation angle of 90 degrees, the centrifugal force Fc becomes large, and the displacement in the plane direction due to the gravitational force Fg can be effectively suppressed.

[0046] Also, in the example of FIG. 9, the swing angle of the chip holder 12 by the swing mechanism is also changed according to the rotation angle. For example, in the example of FIG. 9, at the angle θ8 immediately before the rotation stops, the chip holder 12 is swung so that the centrifugal force Fc acting on the semiconductor chip 100 is directed toward the holding surface 18. Thereby, it can be effectively suppressed that the semiconductor chip 100 is detached from the holding surface 18 due to the inertial force Fi generated by deceleration. The controller 50 controls the driving of the rotation mechanism 40 and the swing mechanism 64 so that the chip holder 12 rotates as shown in FIG. 9.

[0047] Incidentally, heretofore, the holding surface 18 has been described as having a substantially flat shape. However, as long as the semiconductor chip 100 can be held in a non-contact manner, the form of the holding surface 18 may be appropriately changed. For example, as shown in FIG. 10, a positioning recess 28 and an air flow forming groove 26 may be provided in the holding surface 18. FIG. 10 is an axial view of the holding surface 18. In FIG. 10, the diagonally hatched portion indicates a recess that does not penetrate the holding plate 16, and the cross-hatched portion indicates a hole that penetrates the holding plate 16.

[0048] The positioning recess 28 has substantially the same shape as the outer shape of the semiconductor chip 100. In the example of FIG. 10, since the semiconductor chip 100 is a square with a side length of approximately L1, the shape of the inner peripheral edge of the positioning recess 28 is also a square with a side length of approximately L1.

[0049] The operation of such a positioning recess 28 will be described with reference to FIG. 11. FIG. 11 is an image diagram showing the operation of the positioning recess 28. Note that in FIG. 11, the illustration of the air flow forming groove 26 is omitted. When the positioning recess 28 is formed, the positioning accuracy of the semiconductor chip 100 in the plane direction is improved as compared with the case where it is not formed. The principle by which such an effect is obtained is presumed to be that the amplitude of the ultrasonic vibration changes abruptly with the positioning recess 28 as a boundary.

[0050] That is, when the positioning recess 28 exists, it is presumed that the amplitude of the ultrasonic vibration generated on the holding surface 18 changes abruptly at the boundary of the positioning recess 28. As a result, the ultrasonic holding force generated due to the ultrasonic vibration also changes abruptly at the boundary of the positioning recess 28. In such a case, as shown in FIG. 7, when the semiconductor chip 100 is displaced in the plane direction with respect to the holding surface 18, the ultrasonic holding force acting on the semiconductor chip 100 becomes unbalanced on the left and right. The semiconductor chip 100 moves in the plane direction in order to eliminate this force imbalance, so that the positional deviation of the semiconductor chip 100 in the plane direction is automatically corrected, that is, self-aligned. As a result, by providing the positioning recess 28, the positioning accuracy of the semiconductor chip 100 can be improved.

[0051] Next, the airflow forming groove 26 will be described. The airflow forming groove 26 is a groove connected to the suction source 36. The shape of the airflow forming groove 26 is not particularly limited as long as it is connected to the suction hole 22. In this example, the airflow forming groove 26 includes four lines extending radially or in a cross shape from the suction hole 22 and a substantially rectangular line surrounding the four lines.

[0052] The operation of such an airflow forming groove 26 will be described with reference to FIG. 12. FIG. 12 is an image diagram showing the operation of the airflow forming groove 26. Note that in FIG. 12, the illustration of the positioning recess 28 is omitted. When the airflow forming groove 26 is formed, the airflow in the plane direction flowing between the semiconductor chip 100 and the holding surface 18 accelerates and stabilizes.

[0053] That is, when the suction force by the suction source 36 is generated while the semiconductor chip 100 is lifted by the ultrasonic squeeze effect, an airflow in the plane direction and toward the center is generated in the lift gap. Here, when there is no airflow forming groove 26, the airflow in the plane direction toward the center is affected by fluid viscosity, has a low speed, and is likely to be unstable. Further, the suction force acts locally only in the vicinity of the suction hole 22. In this case, even if the semiconductor chip 100 is displaced in the plane direction, it is difficult to move in the plane direction and it is difficult to self-correct the displacement.

[0054] On the one hand, as shown in FIG. 11, when the airflow forming groove 26 is formed, in the vicinity of the airflow forming groove 26, the thickness of the gap between the semiconductor chip 100 and the holding surface 18 increases, and the influence of the fluid viscosity acting on the entire airflow decreases. As a result, the velocity of the airflow in the plane direction increases, and the airflow in the plane direction becomes stable. Such a stable airflow in the plane direction applies a force to the semiconductor chip 100 such that the center of the semiconductor chip 100 approaches the suction hole 22 (and thus the center of the holding surface 18). And thereby, the semiconductor chip 100 is automatically positioned with respect to the holding surface 18. Further, by forming the airflow forming groove 26, the peak of the suction force generated in the vicinity of the suction hole 22 can be reduced, and the suction force can be dispersed in the plane direction. Thereby, the semiconductor chip 100 becomes easier to move in the plane direction and easier to self-correct the displacement in the plane direction. Note that the forms of the positioning recess 28 and the airflow forming groove 26 described here are examples and may be changed as appropriate.

[0055] Next, a manufacturing apparatus 70 for a semiconductor device having such a chip holding apparatus 10 will be described. FIG. 13 is a diagram showing an example of a manufacturing apparatus 70 having a chip holding apparatus 10. The manufacturing apparatus 70 in FIG. 13 is an apparatus for manufacturing a semiconductor device by bonding one or more semiconductor chips 100 to a substrate 110.

[0056] This manufacturing apparatus 70 includes a chip supply source 72, a pickup unit 76, and a bonding unit 80. The chip supply source 72 is provided with semiconductor chips 100 attached to a dicing tape 74. The pickup unit 76 includes a push-up pin 77 that pushes up the semiconductor chip 100 attached to the dicing tape 74 from below, and a pickup collet 78 that picks up the pushed-up semiconductor chip 100. In this example, the above-described chip holding apparatus 10 is used as this pickup collet 78. In FIG. 13, the pickup collet 78 (chip holding apparatus 10) has a rotation axis 46 that extends in a direction parallel to the holding surface 18 on the outer side in the plane direction of the holding surface 18.

[0057] The semiconductor chip 100 is attached to the dicing tape 74 in a posture where the surface joined to the substrate 110, that is, the joining surface (the thick line portion in FIG. 13), faces upward. The chip holding device 10, which is the pickup collet 78, non - contactingly holds this joining surface with the holding surface 18.

[0058] When the pickup collet 78 receives the semiconductor chip 100 from the dicing tape 74, it rotates 180 degrees about the rotation axis 46. As a result, the holding surface 18 changes from a downward state to an upward state. After rotating 180 degrees, the pickup collet 78 delivers the semiconductor chip 100 to the bonding tool 86.

[0059] Here, when the pickup collet 78 rotates, a centrifugal force Fc in a direction away from the holding surface 18 does not act on the semiconductor chip 100. Therefore, the pickup collet 78 can be rotated at high speed while preventing the semiconductor chip 100 from detaching from the holding surface 18. As a result, the lead time for manufacturing the semiconductor device can be shortened. Note that the controller 50 may change the acceleration, the rotation radius, the inclination angle of the holding surface 18, the suction force, etc., according to the rotation angle of the pickup collet 78 in order to more effectively prevent the positional deviation and detachment of the semiconductor chip 100.

[0060] The bonding unit 80 has a stage 82 on which the substrate 110 is placed and a bonding head 84 that holds and transports the semiconductor chip 100. The bonding head 84 has a bonding tool 86. The bonding tool 86 sucks and holds the semiconductor chip 100 at its end face and transports the semiconductor chip 100.

[0061] As shown in FIG. 13, the bonding tool 86 receives the semiconductor chip 100 from the pickup collet 78 in the upward posture and sucks and holds the surface of the semiconductor chip 100 opposite to the bonding surface. Further, after receiving the semiconductor chip 100 from the pickup collet 78, the bonding tool 86 moves to directly above a predetermined bonding position and bonds the semiconductor chip 100 to the substrate 110. By bonding the required number of semiconductor chips 100 to one substrate 110, a semiconductor device is manufactured.

[0062] Note that the configurations described so far are examples, and other configurations may be appropriately changed as long as they include the configuration described in claim 1. For example, in the above description, the chip holding device 10 holds the semiconductor chip 100 using both ultrasonic holding force and suction force. However, the chip holding device 10 may be configured to hold the semiconductor chip 100 only by ultrasonic holding force without having a suction source 36.

Description of Reference Numerals

[0063] 10, 10* Chip holding device, 12 Chip holder, 14 Main body, 16 Holding plate, 18 Holding surface, 22 Suction hole, 24 Suction path, 26 Airflow forming groove, 28 Positioning recess, 30 Vibration source, 32 Ultrasonic vibration element, 34 AC power supply, 36 Suction source, 40 Rotation mechanism, 42 Power source, 46, 46* Rotation shaft, 50 Controller, 52 Processor, 54 Memory, 60 Lifting mechanism, 62 Power source, 64 Oscillation mechanism, 66 Oscillation mechanism, 68 Oscillation shaft, 70 Manufacturing device, 72 Chip supply source, 74 Dicing tape, 76 Pickup unit, 78 Pickup collet, 80 Bonding unit, 82 Stage, 84 Bonding head, 86 Bonding tool, 100 Semiconductor chip, 110 Substrate, Fc Centrifugal force, Fg Gravity, Fgc Resultant force, Fi Inertial force, Fs Suction force, Fv Ultrasonic holding force, Sf Squeeze film.

Claims

1. A chip holder having a holding surface for holding a chip in a non-contact manner and a vibration source for applying ultrasonic vibration to the holding surface to generate a holding force for holding the chip on the holding surface; A rotation mechanism for rotating the chip holder around a specified rotation axis; The rotation axis is an axis for rotating the chip in a direction of turning it upside down, and is an axis set in an area other than an area where the holding surface is pushed out in a direction opposite to the chip; A chip holding device characterized by the above.

2. The chip holding device according to Claim 1, wherein the rotation axis is set in an area where the holding surface is pushed out in a direction approaching the chip from the holding surface. A chip holding device characterized by this.

3. The chip holding device according to Claim 1, wherein the rotation axis is an axis passing through the chip. A chip holding device characterized by this.

4. The chip holding device according to Claim 1, wherein the rotation axis is set outside the holding surface in a view in the axial direction of the chip holder. A chip holding device characterized by this.

5. The chip holding device according to Claim 4, further comprising a controller, wherein the controller controls the rotation speed of the chip holder by the rotation mechanism according to the rotation angle so that at least temporarily, the vertical component of the centrifugal force acting on the chip substantially balances the gravity acting on the chip; A chip holding device characterized by the above.

6. The chip holding device according to Claim 4, further comprising a controller, wherein the controller rotates the chip holder while accelerating it by the rotation mechanism so that at least temporarily, an inertial force in a direction approaching the holding surface acts on the chip; A chip holding device characterized by the above.

7. The chip holding device according to Claim 4, further, a controller, a suction source for applying a negative pressure for sucking the chip to the holding surface to the holding surface, The chip holding device is provided with, wherein when an inertial force in a direction away from the holding surface acts on the chip, the controller increases at least one of the suction force by the suction source and the ultrasonic holding force by the vibration source more than when an inertial force in a direction approaching the holding surface acts; A chip holding device characterized by the above.

8. The chip holding device according to Claim 4, further, a controller, a swing mechanism that swings the chip holder around a swing axis different from the rotation axis; comprising; the controller at least temporarily swings the chip holder by the swing mechanism according to the rotation angle; A chip holding device characterized by this.

9. The chip holding device according to claim 4, further comprising a controller; the rotation mechanism is configured to be able to change the rotation radius, which is the distance from the rotation axis to the chip holder; the controller rotates the chip holder in a non-circular shape by the rotation mechanism so that the rotation radius changes according to the rotation angle; A chip holding device characterized by this.

10. A manufacturing device for a semiconductor device having the chip holding device according to any one of claims 1 to 9.

11. While the chip is held in a non-contact state on the holding surface of the chip holder, the chip holder is rotated around a specified rotation axis, the rotation axis is an axis that rotates in a direction that turns the chip upside down, and is an axis set in an area other than the area where the holding surface is pushed out in the direction opposite to the chip; A chip holding method characterized by this.

Images