Program, laser processing system, and laser processing method

The described system enhances laser beam positioning accuracy by using a galvano scanning device and control device to correct drawing data based on positional deviations, improving precision and applicability across different scanner types.

JP2025097787APending Publication Date: 2025-07-01SUMITOMO HEAVY IND LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2023214198
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-19
Publication Date
2025-07-01

AI Technical Summary

Technical Problem

Existing laser processing systems struggle to correct the irradiation position of a laser beam with high accuracy when the object to be processed is misaligned.

Method used

A program and laser processing system that includes a galvano scanning device and a control device to input, correct, and output drawing data based on position deviation information, using coordinate transformation to achieve precise laser beam positioning.

Benefits of technology

The system significantly improves the accuracy of laser beam correction, simplifies the process for various galvanometer scanners, and avoids correction delays by addressing positional deviations before processing.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025097787000001_ABST
    Figure 2025097787000001_ABST
Patent Text Reader

Abstract

To provide a program for a laser processing system, the laser processing system, and a laser processing method, capable of correcting the irradiation position of a laser beam with higher accuracy.SOLUTION: A program for a laser processing system that includes a galvano-scanner which drives a mirror so that an irradiation position of a laser beam moves on the basis of drawing data for scan control, causes a computer to execute the steps of: inputting drawing data representing the irradiation position of the laser beam; inputting positional deviation information on a workpiece; correcting the drawing data on the basis of the positional deviation information to create corrected drawing data corresponding to the positional deviation of the workpiece; and outputting the corrected drawing data as drawing data for scan control.SELECTED DRAWING: Figure 6
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present disclosure relates to a program, a laser processing system, a laser processing method, and the like.

Background Art

[0002] Conventionally, there has been a laser processing system having a galvanometer scanning device that moves the irradiation point of a laser beam. The galvanometer scanning device includes a mirror that reflects the laser beam and a motor that rotationally drives the mirror. Patent Document 1 discloses a laser welding system that corrects the deviation of the laser beam irradiation position by correcting the control command output to the motor of the galvanometer scanning device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the object to be processed is misaligned, it is preferable that the irradiation position of the laser beam can be corrected with higher accuracy corresponding to the misalignment.

[0005] An object of the present disclosure is to provide a program, a laser processing system, a laser processing method, and the like that can correct the irradiation position of a laser beam with higher accuracy.

Means for Solving the Problems

[0006] The program according to the present disclosure is a program for a laser processing system including a galvano scanning device that drives a mirror so that the irradiation position of a laser beam moves based on drawing data for scanning control. The program causes a computer to perform a procedure of inputting drawing data representing the irradiation position of the laser beam, a procedure of inputting position deviation information of a processing object, a procedure of correcting the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the processing object, and a procedure of outputting the corrected drawing data as the drawing data for scanning control.

[0007] The laser processing system according to the present disclosure is a laser processing system including a galvano scanning device that drives a mirror so that the irradiation position of a laser beam moves based on drawing data for scanning control, and a control device that controls processing. The control device inputs drawing data representing the irradiation position of the laser beam, inputs position deviation information of a processing object, corrects the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the processing object, and outputs the corrected drawing data as the drawing data for scanning control. The position deviation information is information including the deviation for each irradiation position of the laser beam due to distortion of the mirror, and creating the corrected drawing data includes coordinate-transforming the input drawing data according to the deviation for each irradiation position.

[0008] The laser processing method according to the present disclosure is a laser processing method that performs laser processing using a galvano scanning device that drives a mirror so that the irradiation position of a laser beam moves based on drawing data for scanning control. The method includes inputting drawing data representing the irradiation position of the laser beam, inputting position deviation information of a processing object, correcting the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the processing object, and outputting the corrected drawing data as the drawing data for scanning control. The position deviation information is information including the deviation for each irradiation position of the laser beam due to distortion of the mirror, and creating the corrected drawing data includes coordinate-transforming the input drawing data according to the deviation for each irradiation position.

[0009] In addition, any combination of the above components, or those obtained by converting these expressions into methods, apparatuses, systems, recording media, computer programs, etc., are also included in the present disclosure.

Effects of the Invention

[0010] According to the present disclosure, it is possible to provide a program and a laser processing system capable of correcting the irradiation position of a laser beam with higher accuracy.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0012] Hereinafter, embodiments for implementing the present disclosure (hereinafter also referred to as embodiments) will be described in detail with reference to the drawings. In the description and / or the drawings, the same reference numerals are assigned to the same or equivalent components, members, processes, etc., and redundant descriptions are omitted. The scales and shapes of the respective parts shown are set for the sake of simplicity of description and are not to be construed restrictively unless otherwise specified. The embodiments are examples and do not limit the scope of the present disclosure in any way. All features presented in the embodiments and combinations thereof are not necessarily essential to the present disclosure. The embodiments are presented by being decomposed into components for each function and / or function group for the sake of convenience. However, one component in the embodiments may actually be realized by a combination of a plurality of components as separate entities, or a plurality of components in the embodiments may actually be realized by one component as an integral entity. Also, a plurality of embodiments and modification examples may be disclosed in parallel, but any components of each embodiment and / or each modification example may be combined in any manner as long as they do not inhibit each other's functions.

[0013] FIG. 1 is a block diagram showing a laser processing system according to an embodiment of the present disclosure. FIG. 2 is a configuration diagram showing the optical system of the laser processing system of FIG. 1.

[0014] The laser processing system 1 of the present embodiment is a system that irradiates a workpiece H with laser light to perform processing. The type of processing is not particularly limited, such as cutting, drilling, welding, annealing, etc. The workpiece H is fixed to the work area Q via a jig I. The laser processing system 1 includes a laser oscillator 10 that emits laser light, a galvano scanning device 20 that moves the irradiation position of the laser light, a condenser lens 31 that condenses the laser light onto the workpiece H, a position deviation monitoring device 40 that detects the position deviation of the workpiece H, and a control device 50 that performs control processing.

[0015] The galvanometer scanning device 20 includes a scanner head 20A and a control driver 26 that drives the scanner head 20A. As shown in FIG. 2, the scanner head 20A includes a first mirror 21 and a first motor (corresponding to a driving device) 22 that displace the irradiation position of the laser beam in the X direction, and a second mirror 23 and a second motor 24 (corresponding to a driving device) that displace the irradiation position in the Y direction. The first motor 22 rotationally drives the first mirror 21. The second motor 24 rotationally drives the second mirror 23.

[0016] The galvanometer scanning device 20 reflects the laser beam emitted from the laser oscillator 10 by the first mirror 21 and the second mirror 23, and irradiates the workpiece H through the condenser lens 31. By driving the first motor 22 and the second motor 24, the angles of the first mirror 21 and the second mirror 23 change, and the optical axis incident on the condenser lens 31 is displaced, so that the irradiation position of the laser beam irradiated on the workpiece H changes in the X-Y direction.

[0017] The control driver 26 inputs drawing data for scanning control representing the irradiation position of the laser beam. The drawing data for scanning control shows a plurality of coordinates sequentially representing a series of irradiation positions of the laser beam. A coordinate means a combination of numerical values representing the position of an arbitrary point. The plurality of coordinates included in the drawing data for scanning control are a series of coordinates arranged in succession corresponding to the order of change of the irradiation position of the laser beam. The series of coordinates may include a portion where the coordinate values change continuously and a portion where the coordinate values are intermittent. The portion where the coordinate values change continuously is a drawing portion where the irradiation position of the laser beam changes linearly in succession. The portion where the coordinate values are intermittent is a drawing portion where the irradiation position of the laser beam is once interrupted and moves to another location.

[0018] The control driver 26 drives the first motor 22 and the second motor 24 so that the irradiation position of the laser beam sequentially changes to a series of coordinates shown in the drawing data for scanning control. The control driver 26 outputs a drive signal to the first motor 22 and the second motor 24, and controls the amount of rotation of the first motor 22 and the second motor 24 by the drive signal. The above drive signal may be an analog signal (for example, an analog drive current). More specifically, the control driver 26 may be configured to control the amount of rotation of the first motor 22 by changing the magnitude of the analog signal output to the first motor 22, and to control the amount of rotation of the second motor 24 by changing the magnitude of the analog signal output to the second motor 24.

[0019] The position deviation monitoring device 40 detects the position and orientation of the workpiece H from, for example, an image or picture of the workpiece H taken by a digital camera, and calculates the deviation from a preset reference state. Alignment marks M1 and M2 are attached to the jig I that fixes the workpiece H, and the position deviation monitoring device 40 may calculate the above deviation by identifying the alignment marks M1 and M2.

[0020] The control device 50 is a computer that controls the laser oscillator 10 and the galvano scanning device 20 by executing a control program. The control device 50 includes a storage unit 51 that stores the control program, an input device 53 that inputs operations from an operator, a data reader 54 that reads data given by the operator, and an I / O port 55 that exchanges commands and data with an external device. The laser oscillator 10, the control driver 26 of the galvano scanning device 20, and the position deviation monitoring device 40 are connected to the I / O port 55. The control driver 26 may be mounted inside the housing of the computer that constitutes the control device 50.

[0021] The storage unit 51 stores a laser processing control processing program 51a as a program according to an embodiment of the present disclosure.

[0022] The control device 50 can cause the laser oscillator 10 to emit or stop emitting laser light by sending a command to the laser oscillator 10. The control device 50 can cause the galvanometric scanning device 20 to start a series of operations based on the drawing data by sending the drawing data to the control driver 26 of the galvanometric scanning device 20 and sending a scanning start command.

[0023] <Laser processing control process> FIG. 3 is a flowchart showing a first embodiment of the laser processing control process executed by the control device. The program 51a of the laser processing control process is stored in a non-transitory storage medium such as the storage unit 51. The control device 50 may be configured to read a program stored in a portable non-transitory storage medium and execute the program. The above-mentioned portable non-transitory storage medium may store the program 51a of the laser processing control process.

[0024] When the laser processing control process is started, the control device 50 inputs drawing data (drawing data before correction) representing the irradiation position of the laser light (step S1).

[0025] FIG. 4(A) is a diagram for explaining an example of the drawing data. In the figure, the line L0 represents a series of irradiation positions of the laser light. The drawing data input in step S1 is data including a series of coordinates representing the line L0. The coordinates are represented as values in a reference coordinate system (coordinate axes X0, Y0) preset in the work area Q where the laser light is irradiated. In the reference coordinate system, when the work piece H and the jig I are placed without deviation, the coordinates where the work piece H and the jig I, or their alignment marks M1, M2 are located are defined. The defined positions are indicated by a two-dot chain line. The positions of the alignment marks M1, M2 when there is no positional deviation are denoted as the reference positions O1, O2 of the alignment marks M1, M2.

[0026] The drawing data input in step S1 indicates the irradiation position of the laser beam required for the workpiece H when the workpiece H is installed without positional deviation. The drawing data may be input by the operator via the data reader 54, or may be created in advance in the control device 50.

[0027] Next, when the workpiece H is set in the work area, the control device 50 inputs the positional deviation information of the workpiece H from the positional deviation monitoring device 40 (step S2).

[0028] FIG. 4(B) is a diagram for explaining an example of the positional deviation information. In the figure, the workpiece H, the jig I, and the alignment marks M1 and M2 shown by solid lines represent the actual situation of the work area Q. The positional deviation information detected by the positional deviation monitoring device 40 is the information of the deviations (displacement vectors) A1 and A2 in FIG. 4(B). The deviations A1 and A2 indicate the direction and amount of deviation from the reference positions O1 and O2 of the alignment marks M1 and M2. From the information of the deviations A1 and A2, the amount of deviation in the rotational direction and the amount of deviation in the translational direction of the workpiece H and the jig I can be calculated. The standard coordinate system (coordinate axes X0, Y0) is shown superposed with the actual coordinate system (coordinate axes X1, Y1) shifted in the rotational direction and the translational direction based on the positional deviation information.

[0029] Subsequently, the control device 50 creates the drawing data corresponding to the positional deviation, that is, the drawing data representing the irradiation position of the laser beam corresponding to the positionally deviated workpiece H, as the corrected drawing data (step S3).

[0030] Figure 5(A) is a diagram for explaining the input drawing data and the corrected drawing data. In this figure, line L0 indicates a series of coordinates included in the drawing data input in step S1, and line L1 indicates a series of coordinates included in the corrected drawing data. The corrected drawing data (line L1) is obtained by performing coordinate transformation corresponding to the positional deviation information (the amount of deviation in the rotation direction and the amount of deviation in the translation direction) input in step S2 on each coordinate of the drawing data (line L0) input in step S1. In the example of Figure 5(A), by performing coordinate transformation between the reference coordinate system (X0, Y0) and the actual coordinate system (X1, Y1), the drawing data is rewritten as the corrected drawing data. In step S3, such calculations are performed by the control device 50, and the corrected drawing data is created. The corrected drawing data includes a series of coordinates in which line L1 of the actual coordinate system is represented as values in the reference coordinate system.

[0031] Subsequently, the control device 50 sends the corrected drawing data to the control driver 26 of the galvanometer scanning device 20 (step S4), and then, the control driver 26 of the galvanometer scanning device 20 sends a command to start operation to the laser oscillator 10 to start the processing (step S5).

[0032] Figure 5(B) is a diagram for explaining the relationship between the object to be processed having a positional deviation and the corrected drawing data. Since the corrected drawing data is sent to the control driver 26, the irradiation position of the laser beam is controlled based on the corrected drawing data. Therefore, as shown in Figure 5(B), the laser beam is irradiated along line L1 corresponding to the positionally deviated object to be processed H, and the same processing as when there is no positional deviation is performed on the positionally deviated object to be processed H. Then, when a series of operations of the galvanometer scanning device 20 based on the drawing data are completed, the processing is completed.

[0033] <Comparison with Comparative Example> Here, another correction method will be described as a comparative example. When it is desired to shift the irradiation position of the laser beam by a predetermined amount in the rotational direction and the translational direction from a series of coordinates shown in the drawing data, a correction method can be adopted in which corrections are added to the analog signals respectively output from the control driver 26 to the first motor 22 and the second motor 24. Also by this correction method, since the analog signals are corrected, the rotation amounts of the first motor 22 and the second motor 24 are corrected, and the laser beam can be irradiated at a position shifted from the coordinates shown in the drawing data. However, in such a correction method, the characteristics of the mirror rotation mechanism and the driving characteristics of the motor affect the correction amount of the irradiation position of the laser beam. Therefore, it is difficult to improve the accuracy of correction. Furthermore, when the mechanism or specifications of the galvanometer scanning device are different, the method of correcting the analog signal differs, so there is the complication that an appropriate method of correcting the analog signal must be searched for for each type of galvanometer scanning device. Also, in the correction method of the comparative example, since the irradiation position of the laser beam is corrected in real time during processing by feedback control, there is a problem that correction delay is likely to occur.

[0034] On the other hand, in the correction method of the present embodiment, the control driver 26 only needs to perform a standard operation. That is, in the present embodiment, although the coordinate values of the drawing data change due to the correction, the control driver 26 performs a standard operation of controlling the driving of the first motor 22 and the second motor 24 so that the irradiation position of the laser beam sequentially changes to a series of coordinates shown in the drawing data (step S5 in FIG. 3). Therefore, according to the processing control process of the present embodiment, it is possible to reduce the difficulty of improving the correction accuracy in the correction method of the above comparative example, and the correction accuracy can be significantly improved. Furthermore, according to the processing control process of the present embodiment, there is no need for the complication of searching for a correction method for each type of galvanometer scanning device, and there is an advantage that the same correction process can be applied to various types of galvanometer scanning devices. Furthermore, in the correction method of the present embodiment, since a process of dealing with the positional deviation of the workpiece H before processing (the control device 50 inputs positional deviation information and corrects the drawing data) is performed, there is an advantage that correction delay does not occur as in the above comparative example.

[0035] As described above, according to the laser processing system 1, the laser processing method, and the program 51a of the present embodiment, the control device 50 inputs drawing data representing the irradiation position of the laser beam (step S1), and inputs the position deviation information of the workpiece H (step S2). Then, the control device 50 corrects the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the workpiece H (step S3). Then, the control device 50 outputs the corrected drawing data as drawing data for scanning control. By such processing, as shown by comparison with the comparative example, an effect that the correction accuracy can be significantly improved is obtained. Furthermore, for various galvanometer scanners with different mechanisms and specifications, an effect that the same correction process can be applied with less complexity and the position deviation of the workpiece H can be dealt with is obtained.

[0036] Specifically, the drawing data is data indicating the irradiation position of the laser beam when there is no position deviation of the workpiece H, and the corrected drawing data is data indicating the irradiation position of the laser beam corresponding to the position-deviated workpiece H. With this configuration, the laser beam can be irradiated at a position required for the position-deviated workpiece H using the drawing data created without considering the position deviation.

[0037] Furthermore, the galvanometer scanner 20 includes a first motor 22 and a second motor 24 that drive the first mirror 21 and the second mirror 23, respectively, and a control driver 26 that outputs drive signals to the first motor 22 and the second motor 24. Then, the corrected drawing data output by the control device 50 is sent to the control driver 26 as drawing data for scanning control. With this configuration, a process for dealing with the position deviation of the workpiece H can be performed in the front stage of the galvanometer scanner 20.

[0038] Furthermore, the positional deviation information is information including the amount of deviation in the rotational direction and the amount of deviation in the translational direction of the alignment marks M1 and M2 attached to the jig I of the object H to be processed. Further, the process of creating the corrected drawing data (step S3) includes a process of coordinate-transforming the coordinates of the drawing data according to the amount of deviation in the rotational direction and the amount of deviation in the translational direction described above. By such a process, it becomes possible to create corrected drawing data with high correction accuracy by calculation with a small load.

[0039] As described above, the embodiments of the present disclosure have been explained. However, the present disclosure is not limited to the above-described embodiments. For example, in the above embodiment, the configuration in which the control device 50 directly outputs the corrected drawing data to the control driver 26 is shown, but the present disclosure is not limited to this configuration. For example, the corrected drawing data output by the control device 50 may be sent to the control driver 26 after passing through a data processing unit that performs various other data processes. Further, in the above embodiment, as marks for detecting the positional deviation of the object H to be processed, two alignment marks M1 and M2 attached to the jig I are shown, but the alignment mark may be one mark capable of identifying the direction, or may be three or more marks. Further, if the alignment mark is provided in association with the object H to be processed, it may be attached to a configuration other than the jig I, or may be attached to the object H itself. Further, the mark for detecting the positional deviation of the object H to be processed does not have to be a mark dedicated to alignment. For example, any identifiable mark associated with the object H to be processed may be applied. "Associated" means that it has a relationship of moving together with the object H to be processed so that the relative position with respect to the object H does not change. Further, the object H to be processed may be installed in the work area Q without going through the jig I.

[0040] In addition, in the above embodiment, an example in which there is no change in the positional deviation during processing was shown. However, the present disclosure can also be applied when the amount of positional deviation of the object H to be processed changes during processing. In this case, each time the positional deviation changes, the control device updates the corrected drawing data and sends the updated drawing data to the galvanometer scanning device 20. Then, when the drawing data is updated, the galvanometer scanning device 20 may be configured to drive based on the updated drawing data. In addition, the details shown in the embodiments can be appropriately changed without departing from the gist of the invention.

[0041] FIG. 6 is a flowchart showing a second embodiment of the laser processing control process executed by the control device. For the content common to the first embodiment shown in FIG. 3, the same reference numerals are given and duplicate descriptions are omitted.

[0042] The laser processing control process program 51a may be stored in the storage unit 51 in the control device 50 as in the first embodiment, may be stored in a storage unit (not shown) in the control driver 26 of the galvanometer scanning device 20, may be stored distributedly in the storage unit 51 in the control device 50 and the storage unit (not shown) in the control driver 26, or may be stored in a storage unit in a host computer (not shown) that controls the entire laser processing system 1. Also, in the first embodiment, the laser processing control process program 51a may be stored in a storage unit (not shown) in the control driver 26 of the galvanometer scanning device 20, may be stored distributedly in the storage unit 51 in the control device 50 and the storage unit (not shown) in the control driver 26, or may be stored in a storage unit in a host computer (not shown) that controls the entire laser processing system 1.

[0043] In this embodiment, the correction of the positional deviation from the reference state (desired state) of the object H to be processed and / or each irradiation position is performed in two steps. The first correction procedure is an initial correction procedure performed using the object H to be processed for initial correction (one object to be processed), and the second correction procedure is an in-process correction procedure performed using the object H to be processed for this processing (another object to be processed). Note that the first correction procedure or the initial correction procedure may be omitted, and only the second correction procedure or the in-process correction procedure may be executed. "S" in the flowchart means step or process.

[0044] In S0, the object H to be processed for initial correction and the jig I are installed or fixed in the work area Q. Subsequently, the laser processing control processes S1 to S5 according to the first embodiment shown in FIG. 3 are executed as an initial correction procedure targeting the object H to be processed for initial correction installed in S0. As a result of this initial correction procedure S1 to S5, as described above with respect to FIGS. 4 and 5, the positional deviations in the overall rotational direction and translational direction of the jig I and the object H to be processed are effectively corrected. Note that the object H to be processed used in the initial correction procedure S1 to S5 (the one installed in S0) may be used only for this initial correction, or may be adopted as a product (or the processed product for this processing) when the corrected positional deviation is within the allowable range.

[0045] In a state where the overall positional deviation of the jig I and the object H to be processed is corrected through the initial correction procedure S1 to S5 as described above, in S6, the object H to be processed for this processing is installed or fixed to the jig I and the work area Q. The subsequent series of processes is an in-process correction procedure targeting the object H to be processed installed in S6. S1 to S5 in this in-process correction procedure are the same as the above-described initial correction procedure S1 to S5, but the positional deviation information to be corrected is different. Specifically, while the initial correction procedure targets the overall positional deviation of the object H (and the jig I) to be processed, the in-process correction procedure targets the fine deviation of each position in the object H or each irradiation position of the laser beam.

[0046] In S1 of the correction procedure during machining, the control device 50 inputs drawing data (drawing data before correction) representing the irradiation position of the laser beam. In S3, the control device 50 creates the drawing data after correction. As will be described later, this S3 is repeated for a plurality of workpieces H for main machining. In the first S3, the correction amounts for the overall rotation and translation of the workpiece H and the jig I obtained through the initial correction procedures S1 to S5 are used.

[0047] FIG. 7 is a diagram for explaining an example of the drawing data after correction created in S3. Points P1 to P5 in the figure represent the dot-like irradiation positions of the laser beam irradiated onto the workpiece H for main machining. Note that the irradiation positions of the laser beam for main machining may be linearly continuous like the line L0 shown in FIG. 4. The drawing data created or corrected in S3 is data including the coordinates representing each of the points P1 to P5. The coordinates are represented as values in the actual coordinate system (coordinate axes X1, Y1) in which the overall positional deviation in the rotational direction and the translational direction has been corrected through the initial correction procedures S1 to S5.

[0048] In S4, the control device 50 sends the drawing data after correction created in S3 to the control driver 26 of the galvano scanning device 20. In S5, the control driver 26 of the galvano scanning device 20 sends a command to start operation to the laser oscillator 10, thereby starting the machining process for the workpiece H for main machining installed in S6.

[0049] In S2 after the irradiation of the laser beam to each of the irradiation positions P1 to P5 based on the drawing data as shown in FIG. 7 created in S3 (i.e., the main machining), the position deviation monitoring device 40 inputs the position deviation information of each of the irradiation positions P1 to P5 to the control device 50 based on an image obtained by photographing a photographing region R including the workpiece H after main machining irradiated with the laser beam (the one installed in S6) by a camera or the like.

[0050] Here, the positional deviation information of each irradiation position P1 to P5 may be obtained based on the reference position N included in the image (i.e., the imaging region R) and the displacement or distance between each of the irradiation positions P1 to P5. The reference position N is the position of an arbitrary reference object that is imaged by a camera or the like together with the object H to be processed or each of the irradiation positions P1 to P5. The reference object is an object whose absolute position, orientation, size, etc. are recognized by the control device 50, and is, for example, the aforementioned alignment mark, jig I, or a characteristic structure or shape in the work area Q, etc.

[0051] FIG. 8 schematically shows the irradiation positions P1 to P5 with positional deviation, as compared to FIG. 7 showing the ideal irradiation positions P1 to P5 without positional deviation. In the figure, the circles indicated by the dotted lines are the ideal irradiation positions shown in FIG. 7, and the black circles are the irradiation positions P1 to P5 on the object H to be processed where the laser light is actually irradiated. Each arrow or each vector indicating the displacement from each ideal irradiation position to each actual irradiation position P1 to P5 is the deviation of each of the irradiation positions P1 to P5 detected by the positional deviation monitoring device 40 (S2).

[0052] As schematically shown in FIG. 8, the positional deviation that occurs during the actual processing of the object H to be processed may vary depending on each position on the object H to be processed or each irradiation position P1 to P5 of the laser light. This is typically considered to be because when laser processing is continuously performed on a large number of objects H to be processed, the temperature of the first mirror 21 and / or the second mirror 23 in the galvano scanning device 20 rises and distorts. In particular, as a result of the amount or time of the laser light hitting each of the mirrors 21, 23 varying from position to position, different deviations may appear for each of the irradiation positions P1 to P5 as shown in FIG. 8. The deviation of each of the irradiation positions P1 to P5 of the laser light due to such local distortion of the mirrors 21, 23 is not appropriately corrected by an overall process such as the initial correction procedures S1 to S5.

[0053] Therefore, in S7, the position deviation monitoring device 40 and / or the control device 50 calculates a correction amount for correcting the deviation for each of the irradiation positions P1 to P5 detected in S2 for each of the irradiation positions P1 to P5. FIG. 9 schematically shows the correction amount for each of the irradiation positions P1 to P5 (or the irradiation order) calculated or generated in S7. As shown in the figure, for each of the irradiation positions P1 to P5, an X correction amount in the X1 direction and a Y correction amount in the Y1 direction in the actual coordinate system are calculated and recorded in the form of a table or a table or the like. Such a set of X correction amount and Y correction amount is the inverse vector of the vector representing the position deviation in FIG. 8.

[0054] If there is an unprocessed workpiece H in S8 (Yes), it returns to S6 and a new workpiece H for main processing is installed. In S1, the control device 50 inputs drawing data (drawing data before correction) representing the irradiation position of the laser beam. In S3, the control device 50 creates corrected drawing data. In such second and subsequent S3 to S5, the correction amount for each of the irradiation positions P1 to P5 calculated in the previous S7 is used. As a result, in the previous S3 to S5, each of the irradiation positions P1 to P5 that deviated from the expected irradiation position (dotted circle) as shown in FIG. 8 is corrected to the expected irradiation positions P1 to P5 as shown in FIG. 7 by the X correction amount and the Y correction amount corresponding to each inverse vector.

[0055] Note that in a plurality of workpieces H on which main processing is continuously performed, the irradiation positions of the laser beam do not always exactly match. In such a case, the procedure S3 for creating corrected drawing data may include a procedure for calculating an interpolation deviation of the acquired deviations for a plurality of irradiation positions around an irradiation position that does not include a deviation in the position deviation information acquired in S2 before the previous time, and may include a procedure for coordinate-transforming the input drawing data according to the calculated deviation.

[0056] For example, in the example of FIG. 7, the procedure S3 for creating the corrected drawing data includes a procedure for calculating an offset obtained by interpolating the offsets already obtained for a plurality of irradiation positions P3, P5, etc. around the irradiation position P6 where the offset information obtained in S2 before the previous time does not include an offset, and may include a procedure for coordinate-transforming the drawing data for the irradiation position P6 according to the calculated offset. As a simple example, when the irradiation position P6 for which the positional deviation information has not been obtained is the midpoint of the irradiation positions P3 and P5 for which the positional deviation information has been obtained, the correction amount or inverse vector for the irradiation position P6 may be the average of the correction amounts or inverse vectors already calculated for the irradiation positions P3 and P5.

[0057] If there is no unprocessed object H to be processed in S8 (No), the laser processing control process ends.

[0058] As described above, the present disclosure has been described based on the embodiments. It is obvious to those skilled in the art that various modifications are possible for each component and combination of processes in the embodiments as examples, and such modifications are included in the scope of the present disclosure.

[0059] Note that the configurations, operations, and functions of each device and each method described in the embodiments can be realized by hardware resources or software resources, or by the cooperation of hardware resources and software resources. As hardware resources, for example, a processor, ROM, RAM, and various integrated circuits can be used. As software resources, for example, programs such as an operating system and an application can be used.

Description of Reference Numerals

[0060] 1 Laser processing system 10 Laser oscillator 20 Galvano scanning device 21 First mirror 22 First motor (drive device) 23 Second mirror 24 Second motor (drive device) 26 Control driver 31 Condensing lens 40 Monitoring device 50 Control device 51 Memory unit 51a Program 55 I / O port Q Working area H Object to be processed I Fixture M1, M2 Alignment marks O1, O2 Reference positions A1, A2 Deviations L0 Line (drawing data) L1 Line (corrected drawing data) P1, P2, P3, P4, P5 Irradiation positions

Claims

1. A program for a laser processing system including a galvano scanning device that drives a mirror so that the irradiation position of a laser beam moves based on drawing data for scanning control, the program causing a computer to perform the steps of: inputting drawing data representing the irradiation position of the laser beam; inputting position deviation information of the object to be processed; correcting the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the object to be processed; outputting the corrected drawing data as the drawing data for scanning control; and a program for realizing the above.

2. The input drawing data is data indicating the irradiation position of the laser beam when there is no position deviation of the object to be processed, and the corrected drawing data is data indicating the irradiation position of the laser beam corresponding to the position-deviated object to be processed. The program according to claim 1.

3. The galvano scanning device includes a driving device that drives the mirror and a control driver that outputs a driving signal to the driving device based on drawing data, and the corrected drawing data is sent to the control driver by the step of outputting the corrected drawing data. The program according to claim 1.

4. The position deviation information is information including the amount of deviation in the rotational direction and the amount of deviation in the translational direction of a mark attached to the object to be processed, and the step of creating the corrected drawing data includes a step of coordinate-transforming the input drawing data according to the amount of deviation in the rotational direction and the amount of deviation in the translational direction. The program according to claim 1.

5. The position deviation information is information including the deviation for each irradiation position of the laser beam due to distortion of the mirror, and the step of creating the corrected drawing data includes a step of coordinate-transforming the input drawing data according to the deviation for each irradiation position. The program according to claim 1.

6. The position deviation information is obtained based on an image of the object to be processed irradiated with the laser beam. The program according to claim 5.

7. The position deviation information is obtained based on the displacement between a reference position included in the image and each irradiation position. The program according to claim 6.

8. The procedure for creating the corrected drawing data includes a procedure for calculating a deviation obtained by interpolating deviations for a plurality of irradiation positions around an irradiation position where no deviation is included in the position deviation information, and a procedure for coordinate-transforming the input drawing data according to the calculated deviation. The program according to claim 5.

9. The position deviation information includes information including a deviation amount in the rotational direction and a deviation amount in the translational direction of a mark attached to the object to be processed. The procedure for creating the corrected drawing data includes a first correction procedure for coordinate-transforming the input drawing data according to the deviation amount in the rotational direction and the deviation amount in the translational direction using one of the objects to be processed, and a second correction procedure for coordinate-transforming the input drawing data according to the deviation for each irradiation position for another object to be processed that is processed after the first correction procedure. The program according to any one of claims 5 to 8.

10. A laser processing system including a galvano scanning device that drives a mirror so that the irradiation position of a laser beam moves based on drawing data for scanning control, and a control device that performs processing control. The control device Inputs drawing data representing the irradiation position of the laser beam. Inputs position deviation information of the object to be processed. Corrects the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the object to be processed. Outputs the corrected drawing data as the drawing data for scanning control. The position deviation information is information including the deviation for each irradiation position of the laser beam due to the distortion of the mirror. Creating the corrected drawing data includes coordinate-transforming the input drawing data according to the deviation for each irradiation position. Laser processing system.

11. A laser processing method for performing laser processing using a galvano scanning device that drives a mirror so that the irradiation position of a laser beam moves based on drawing data for scanning control, Inputs drawing data representing the irradiation position of the laser beam. Inputs position deviation information of the object to be processed. Corrects the drawing data based on the position deviation information to create corrected drawing data corresponding to the position deviation of the object to be processed. Outputs the corrected drawing data as the drawing data for scanning control. The position deviation information is information including the deviation for each irradiation position of the laser beam due to the distortion of the mirror. Creating the corrected drawing data includes coordinate-transforming the input drawing data according to the deviation for each irradiation position. Laser processing method.

Citation Information

Patent Citations

  • Laser welding system

    JP2018039039A