Substrate processing system and substrate processing method

Abstract

To provide a technique capable of improving throughput.SOLUTION: A substrate processing system includes a loading / unloading section for loading / unloading a cassette in which a plurality of substrates are accommodated, a batch processing section for processing the plurality of substrates in a batch, a single-wafer processing section for processing the substrates one by one, a substrate transfer section for transferring the substrate from the loading / unloading section to the batch processing section and the single-wafer processing section, and a substrate waiting section for transferring the substrate from the batch processing section to the single-wafer processing section. The substrate waiting section includes a waiting table including a first waiting area for placing the substrate carried in from the batch processing section, and a second waiting area that is arranged vertically in line with respect to the first waiting area for placing the substrate carried out to the single-wafer processing section, a first transport device for transporting the plurality of substrates in a batch from the batch processing section to the first waiting area, and a first replacement device for replacing the substrates from the first waiting area to the second waiting area. The second waiting area includes a first processing liquid supply section for supplying a first processing liquid onto an upper surface of the substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a substrate processing system and a substrate processing method.

Background Art

[0002] A substrate processing system including a batch processing unit and a single-wafer processing unit is known (see, for example, Patent Document 1). The batch processing unit performs batch processing for collectively processing a lot including a plurality of substrates. The single-wafer processing unit performs single-wafer processing for processing substrates one by one. In the substrate processing system, composite processing including batch processing and single-wafer processing and single-wafer processing are performed in parallel.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technology capable of improving throughput.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, a substrate processing system includes a loading / unloading unit where a cassette accommodating a plurality of substrates is loaded and unloaded, a batch processing unit that collectively processes the plurality of substrates, a single-wafer processing unit that processes the substrates one by one, a substrate transfer unit that transfers the substrates from the loading / unloading unit to the batch processing unit and the single-wafer processing unit, and a substrate standby unit that transfers the substrates from the batch processing unit to the single-wafer processing unit. The substrate standby unit includes a standby table including a first standby area on which the substrates carried in from the batch processing unit are placed, and a second standby area that is provided side by side with respect to the first standby area in the vertical direction and on which the substrates to be carried out to the single-wafer processing unit are placed, a first transfer device that collectively transfers a plurality of the substrates from the batch processing unit to the first standby area, and a first replacement device that replaces the substrates from the first standby area to the second standby area. The second standby area has a first processing liquid supply unit that supplies a first processing liquid to the upper surface of the substrate.

Advantages of the Invention

[0006] According to the present disclosure, the throughput can be improved.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and duplicate descriptions are omitted.

[0009] 〔Substrate Processing System〕 (Overall Configuration) Referring to FIGS. 1 and 2, the substrate processing system 1 according to the embodiment will be described. FIG. 1 is a plan view showing the substrate processing system 1 according to the embodiment. FIG. 2 is a cross-sectional view showing a configuration including a delivery table 33, a standby table 54, and a single-wafer processing unit 6.

[0010] As shown in FIG. 1, the substrate processing system 1 includes a loading / unloading unit 2, a substrate transfer unit 3, a batch processing unit 4, a substrate standby unit 5, a single-wafer processing unit 6, and a control device 9.

[0011] The loading / unloading unit 2 serves as both a loading unit and an unloading unit. In this case, the substrate processing system 1 can be miniaturized. The loading / unloading unit 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transfer device 24.

[0012] The load port 21 is disposed on the negative side in the X-axis direction of the loading / unloading unit 2. A plurality (for example, four) of load ports 21 are arranged along the Y-axis direction. However, the number of load ports 21 is not particularly limited. A cassette C is placed on the load port 21. The cassette C accommodates a plurality of (for example, 25) substrates W and is loaded / unloaded with respect to the load port 21. Inside the cassette C, the substrates W are held horizontally and are held at a second pitch P2 (P2 = N × P1) which is N times the first pitch P1 in the vertical direction. N is a natural number of 2 or more, and is 2 in the present embodiment, but may be 3 or more.

[0013] The stockers 22 are arranged in a plurality (e.g., four) along the Y-axis direction at the center of the loading / unloading section 2 in the X-axis direction. The stockers 22 are arranged in a plurality (e.g., two) along the Y-axis direction adjacent to the substrate transfer section 3 on the positive X-axis side of the loading / unloading section 2. The stockers 22 may be arranged in multiple stages in the vertical direction. The stockers 22 temporarily store the cassette C in which the substrate W before being subjected to the cleaning process is stored, the cassette C from which the substrate W has been taken out and whose interior has become empty, etc. Note that the number of the stockers 22 is not particularly limited.

[0014] The loader 23 is adjacent to the substrate transfer section 3 and is arranged on the positive X-axis side of the loading / unloading section 2. The cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. A plurality of loaders 23 may be provided. The loaders 23 may be arranged in multiple stages in the vertical direction.

[0015] The cassette transfer device 24 transfers the cassette C between the load port 21, the stockers 22, and the loader 23. The cassette transfer device 24 is, for example, an articulated transfer robot.

[0016] The substrate transfer section 3 is arranged on the positive X-axis side of the loading / unloading section 2. The substrate transfer section 3 transfers the substrate W between the loading / unloading section 2, the batch processing section 4, and the single-wafer processing section 6. The substrate transfer section 3 includes a transfer device 31, a lot formation section 32, a delivery stand 33, and a second replacement device 34.

[0017] The transfer device 31 transports the substrate W between the cassette C placed on the loader 23, the lot forming unit 32, and the delivery stage 33. The transfer device 31 distributes the substrate W accommodated in the cassette C placed on the loader 23 between the third transfer area 33c of the delivery stage 33 for transporting the substrate W to the single wafer processing unit 6 and the lot forming unit 32 for transporting the substrate W to the batch processing unit 4. The transfer device 31 is composed of a multi-axis (e.g., 6-axis) articulated robot and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has a plurality of holding claws (not shown) capable of holding a plurality of (e.g., 25) substrates W. The substrate holding arm 31a can take an arbitrary position and posture in the three-dimensional space while holding the substrate W with the holding claws.

[0018] The lot forming unit 32 is arranged on the positive side in the X-axis direction of the substrate transfer unit 3. The lot forming unit 32 holds a plurality of substrates W at the first pitch P1 to form a lot L. The lot forming unit 32 constitutes a part of the transfer stage. The lot forming unit 32 is an example of the fifth transfer area.

[0019] The delivery stage 33 is adjacent to the single wafer processing unit 6 and is arranged on the positive side in the Y-axis direction of the substrate transfer unit 3. The delivery stage 33 constitutes a part of the transfer stage. As shown in FIG. 2, the delivery stage 33 includes a first transfer area 33a, a second transfer area 33b, a third transfer area 33c, and a fourth transfer area 33d. The first transfer area 33a, the second transfer area 33b, the third transfer area 33c, and the fourth transfer area 33d are arranged side by side in the vertical direction.

[0020] The first transfer area 33a places the substrate W carried in from the single-wafer processing unit 6. The first transfer area 33a is provided for each processing unit block 60 of the single-wafer processing unit 6. The first transfer area 33a is provided, for example, at two positions where the transfer arm 61b of the upper processing unit block 60 can access and the second replacement device 34 can access. The first transfer area 33a is provided, for example, at two positions where the transfer arm 61b of the middle processing unit block 60 can access and the second replacement device 34 can access. The first transfer area 33a is provided, for example, at two positions where the transfer arm 61b of the lower processing unit block 60 can access and the second replacement device 34 can access.

[0021] Each first transfer area 33a is configured to be able to place the first number of substrates W. The first number is, for example, the same as the number of substrates W that the transfer arm 61b can hold. The first number is, for example, 1. The first transfer area 33a temporarily stores the substrate W received from the transfer arm 61b until it is passed to the second transfer area 33b.

[0022] The second transfer area 33b places the substrate W carried out to the carry-in / carry-out unit 2. The second transfer area 33b is provided at a position where the transfer device 31 and the second replacement device 34 can access. The second transfer area 33b is provided, for example, at three different positions in the vertical direction.

[0023] Each second transfer area 33b is configured to be able to place the second number of substrates W. The second number is, for example, the same as the number of substrates W accommodated in the cassette C. The second number is, for example, 25. The second transfer area 33b temporarily stores the substrate W received from the second replacement device 34 until it is passed to the carry-in / carry-out unit 2.

[0024] The third transfer area 33c places the substrate W carried in from the carry-in / carry-out unit 2 and also places the substrate W carried out to the carry-in / carry-out unit 2. The third transfer area 33c is provided at a position where the transfer device 31 and the second replacement device 34 can access. The third transfer area 33c is provided, for example, at one position.

[0025] The third transfer area 33c is configured to be able to place the substrates W of the third number. The third number is, for example, the same number as the number of substrates W accommodated in the cassette C. The third number is, for example, 25. The third transfer area 33c temporarily stores the substrates W received from the transfer device 31 until they are passed to the fourth transfer area 33d. The third transfer area 33c temporarily stores the substrates W received from the second replacement device 34 until they are passed to the loading / unloading section 2.

[0026] The fourth transfer area 33d places the substrates W unloaded to the single-wafer processing section 6 and also places the substrates W loaded into the single-wafer processing section 6. The fourth transfer area 33d is provided for each processing unit block 60 of the single-wafer processing section 6. For example, two fourth transfer areas 33d are provided at positions where the transfer arm 61b of the upper processing unit block 60 can access and where the second replacement device 34 can access. For example, two fourth transfer areas 33d are provided at positions where the transfer arm 61b of the middle processing unit block 60 can access and where the second replacement device 34 can access. For example, two fourth transfer areas 33d are provided at positions where the transfer arm 61b of the lower processing unit block 60 can access and where the second replacement device 34 can access.

[0027] Each fourth transfer area 33d is configured to be able to place the substrates W of the fourth number. The fourth number is, for example, the same number as the number of substrates W that the transfer arm 61b can hold. The fourth number is, for example, 1. The fourth transfer area 33d temporarily stores the substrates W received from the second replacement device 34 until they are passed to the single-wafer processing section 6. The fourth transfer area 33d temporarily stores the substrates W received from the transfer arm 61b until they are passed to the third transfer area 33c.

[0028] The second replacement device 34 is accessible to the first transfer area 33a, the second transfer area 33b, the third transfer area 33c, and the fourth transfer area 33d. The second replacement device 34 may be configured to be movable along the vertical direction. The second replacement device 34 replaces the substrate W from the first transfer area 33a to the second transfer area 33b. The second replacement device 34 replaces the substrate W from the third transfer area 33c to the fourth transfer area 33d. The second replacement device 34 replaces the substrate W from the fourth transfer area 33d to the third transfer area 33c. The second replacement device 34 may replace the substrates W one by one, or may replace a plurality of substrates W at once. In the latter case, the second replacement device 34 conveys a plurality of (for example, two) substrates W collectively.

[0029] The batch processing unit 4 is arranged on the positive side in the X-axis direction of the substrate transfer unit 3. That is, the loading / unloading unit 2, the substrate transfer unit 3, and the batch processing unit 4 are arranged in this order from the negative side to the positive side in the X-axis direction. The batch processing unit processes a lot L including a plurality of (for example, 50 or 100) substrates W at a first pitch P1 collectively. One lot L is composed of, for example, substrates W in M cassettes C. M is a natural number of 2 or more. M may be the same natural number as N, or may be a natural number different from N. The batch processing unit 4 includes a chemical solution tank 41, a rinse solution tank 42, a first lot transfer device 43, a processing tool 44, and a drive device 45.

[0030] The chemical solution tank 41 and the rinse solution tank 42 are arranged along the X-axis direction. For example, the chemical solution tank 41 and the rinse solution tank 42 are arranged in this order from the positive side to the negative side in the X-axis direction. The chemical solution tank 41 and the rinse solution tank 42 are also collectively referred to as a processing tank. The number of the chemical solution tank 41 and the rinse solution tank 42 is not limited to that in FIG. 1. For example, although the chemical solution tank 41 and the rinse solution tank 42 are one set in FIG. 1, they may be a plurality of sets.

[0031] The chemical solution tank 41 stores the chemical solution in which the lot L is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film among the silicon oxide film and the silicon nitride film. The chemical solution is not limited to the aqueous phosphoric acid solution. For example, it may be DHF (dilute hydrofluoric acid), BHF (a mixed solution of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixed solution of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixed solution of ammonia, hydrogen peroxide, and water), SC2 (a mixed solution of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixed solution of tetramethylammonium hydroxide and water), a plating solution, or the like. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited, and a plurality of them may be used.

[0032] The rinse solution tank 42 stores the first rinse solution in which the lot L is immersed. The first rinse solution is pure water for removing the chemical solution from the substrate W, and is, for example, DIW (deionized water).

[0033] The first lot transfer device 43 includes a guide rail 43a and a transfer arm 43b. The guide rail 43a is disposed on the negative side in the Y-axis direction with respect to the processing tank. The guide rail 43a extends along the horizontal direction (X-axis direction) from the substrate transfer unit 3 to the batch processing unit 4. The transfer arm 43b moves along the guide rail 43a in the horizontal direction (X-axis direction). The transfer arm 43b may move in the vertical direction or rotate around the vertical axis. The transfer arm 43b transfers the lot L in a batch between the substrate transfer unit 3 and the batch processing unit 4.

[0034] The processing tool 44 receives and holds the lot L from the transfer arm 43b. The processing tool 44 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W vertically.

[0035] The drive device 45 moves the processing tool 44 in the X-axis direction and the Z-axis direction. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then passes the lot L to the first lot transfer device 43.

[0036] In this embodiment, the number of units of the processing tool 44 and the drive device 45 is one, but it may also be plural. In the latter case, one unit immerses the lot L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the lot L in the first rinse solution stored in the rinse solution tank 42. In this case, the drive device 45 only needs to move the processing tool 44 in the Z-axis direction, and does not need to move the processing tool 44 in the X-axis direction.

[0037] The substrate standby unit 5 is arranged on the positive side in the Y-axis direction of the batch processing unit 4. The substrate standby unit 5 conveys the substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The substrate standby unit 5 includes an immersion tank 51, a second lot transfer device 52, a first transfer device 53, a standby table 54, and a first replacement device 55.

[0038] The immersion tank 51 is arranged outside the movement range of the transfer arm 43b. For example, the immersion tank 51 is arranged at a position shifted in the positive Y-axis direction with respect to the processing tank. The immersion tank 51 stores the second rinse solution in which the lot L is immersed. The second rinse solution is, for example, DIW (deionized water). The substrate W is held in the second rinse solution until it is lifted from the second rinse solution by the first transfer device 53. Since the substrate W exists below the liquid level of the second rinse solution, the surface tension of the second rinse solution does not act on the substrate W, and the collapse of the uneven pattern on the substrate W can be prevented.

[0039] The second lot transfer device 52 includes a Y-axis drive device 52a, a Z-axis drive device 52b, and a transfer arm 52c.

[0040] The Y-axis drive device 52a is arranged on the positive side in the X-axis direction of the substrate standby unit 5. The Y-axis drive device 52a extends along the horizontal direction (Y-axis direction) from the substrate standby unit 5 to the batch processing unit 4. The Y-axis drive device 52a moves the Z-axis drive device 52b and the transfer arm 52c in the Y-axis direction. The Y-axis drive device 52a may include a ball screw.

[0041] The Z-axis drive device 52b is movably attached to the Y-axis drive device 52a. The Z-axis drive device 52b moves the transfer arm 52c in the Z-axis direction. The Z-axis drive device 52b may include a ball screw.

[0042] The transfer arm 52c is movably attached to the Z-axis drive device 52b. The transfer arm 52c receives and holds the lot L from the transfer arm 43b. The transfer arm 52c holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W in the vertical direction. The transfer arm 52c moves in the Y-axis direction and the Z-axis direction by the Y-axis drive device 52a and the Z-axis drive device 52b. The transfer arm 52c is configured to be movable to a plurality of positions including a delivery position, an immersion position, and a standby position.

[0043] The delivery position is a position where the lot L is delivered between the transfer arm 43b and the transfer arm 52c. The delivery position is a position on the negative side in the Y-axis direction and the positive side in the Z-axis direction.

[0044] The immersion position is a position where the lot L is immersed in the immersion tank 51. The immersion position is a position on the positive side in the Y-axis direction and the negative side in the Z-axis direction with respect to the delivery position.

[0045] The standby position is a position where the transfer arm 52c waits when the delivery of the lot L and the immersion of the lot L in the immersion tank 51 are not performed. The standby position is directly below the delivery position (negative side in the Z-axis direction) and is a position that does not interfere with the movement of the transfer arm 43b. In this case, since the transfer arm 52c can move to the delivery position only by moving upward (positive side in the Z-axis direction), the throughput is improved. The standby position may be the same position as the immersion position. In this case, it is possible to prevent particles that may occur when the first lot transfer device 43 operates from adhering to the transfer arm 52c. The standby position may be a position directly above the immersion position (positive side in the Z-axis direction). Thus, by setting the standby position to a position different from the delivery position, contact between the transfer arm 43b and the transfer arm 52c can be prevented.

[0046] While the first lot transfer device 43 is operating, the second lot transfer device 52 moves the transfer arm 52c to the immersion position or the standby position. Thereby, contact between the transfer arm 43b and the transfer arm 52c can be prevented.

[0047] The first transfer device 53 collectively transfers a plurality of (for example, two) substrates W between the transfer arm 52c at the immersion position and the first standby area 54a of the standby table 54. In this case, the time required for transferring the substrate W is shortened. As a result, the throughput is improved. The first transfer device 53 is composed of a multi-axis (for example, six-axis) arm robot and has a transfer arm 53a at its tip. The transfer arm 53a has holding claws (not shown) that can hold a plurality of (for example, two) substrates W. The transfer arm 53a can take an arbitrary position and posture in the three-dimensional space while holding the substrate W by the holding claws. Also, the immersion tank 51 is arranged outside the movement range of the transfer arm 43b. For this reason, the transfer arm 43b and the transfer arm 53a do not interfere with each other. Thereby, either the first lot transfer device 43 or the first transfer device 53 can be operated independently regardless of the operating state of the other. For this reason, the first lot transfer device 43 and the first transfer device 53 can be operated at an arbitrary timing, so the time required for transferring the substrate W is shortened. As a result, the throughput is improved.

[0048] The standby table 54 is adjacent to the single-wafer processing unit 6 and is arranged on the negative X-axis side of the substrate standby unit 5. The standby table 54 temporarily stores the substrate W received from the first transfer device 53 until it is delivered to the single-wafer processing unit 6. That is, the substrate W taken out from the immersion tank 51 is placed on the standby table 54. The substrate W placed on the standby table 54 is preferably in a state where, for example, the surface is wet with the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate W, and the collapse of the uneven pattern of the substrate W can be suppressed.

[0049] As shown in FIG. 2, the standby table 54 has a first standby area 54a and a second standby area 54b. The first standby area 54a and the second standby area 54b are arranged side by side in the vertical direction.

[0050] The first standby area 54a places the substrate W carried in from the batch processing unit 4. The first standby area 54a is provided at a position accessible by the first transfer device 53 and the first replacement device 55. The first standby area 54a is provided, for example, at two different positions in the vertical direction.

[0051] Each first standby area 54a is configured to be able to place the fifth number of substrates W. The fifth number is, for example, one. The first standby area 54a temporarily stores the substrate W received from the first transfer device 53 until it is passed to the second standby area 54b.

[0052] The second standby area 54b places the substrate W to be carried out to the single-wafer processing unit 6. The second standby area 54b is provided for each processing unit block 60 of the single-wafer processing unit 6. The second standby area 54b is provided, for example, at two positions where the transfer arm 61b of the upper processing unit block 60 can access and the first replacement device 55 can access. The second standby area 54b is provided, for example, at two positions where the transfer arm 61b of the middle processing unit block 60 can access and the first replacement device 55 can access. The second standby area 54b is provided, for example, at two positions where the transfer arm 61b of the lower processing unit block 60 can access and the first replacement device 55 can access.

[0053] Each second standby area 54b is configured to be able to place the sixth number of substrates W. The sixth number is, for example, one. The second standby area 54b temporarily stores the substrate W received from the first replacement device 55 until it is passed to the single-wafer processing unit 6.

[0054] The first replacement device 55 can access the first standby area 54a and the second standby area 54b. The first replacement device 55 may be configured to be movable along the vertical direction. The first replacement device 55 replaces the substrate W from the first standby area 54a with the substrate W in the second standby area 54b. The first replacement device 55 may replace the substrates W one by one, or may replace a plurality of substrates W at once. In the latter case, the first replacement device 55 conveys a plurality of substrates W (for example, two) at once.

[0055] The single-wafer processing unit 6 is arranged on the negative side in the X-axis direction of the substrate standby unit 5 and on the positive side in the Y-axis direction of the loading / unloading unit 2, the substrate transfer unit 3, and the batch processing unit 4. The single-wafer processing unit 6 processes the substrates W one by one. The single-wafer processing unit 6 has processing unit blocks 60 arranged in three stages vertically. In this case, since single-wafer processing can be performed simultaneously on a plurality of substrates W, the throughput is improved. Each processing unit block 60 includes a second transfer device 61, a liquid processing device 62, and a retraction table 64.

[0056] The second transfer device 61 transfers the substrate W between the standby table 54, the liquid processing device 62, the retraction table 64, and the delivery table 33. The second transfer device 61 may be configured to transfer the substrate W from the second standby area 54b of the standby table 54 to the liquid processing device 62. When the processing on the substrate W is a composite process, the second transfer device 61 may be configured to transfer the substrate W from the liquid processing device 62 to the first transfer area 33a of the delivery table 33. When the processing on the substrate W is a single-wafer process, the second transfer device 61 may be configured to transfer the substrate W from the liquid processing device 62 to the fourth transfer area 33d of the delivery table 33. When the liquid processing device 62 becomes unavailable during the transfer of the substrate W from the substrate standby unit 5 to the liquid processing device 62, the second transfer device 61 may be configured to transfer the substrate W being transferred to the retraction table 64. After transferring the substrate W to the retraction table 64, when at least one of the three liquid processing devices 62 becomes available, the second transfer device 61 may be configured to transfer the substrate W from the retraction table 64 to the available liquid processing device 62.

[0057] The second transfer device 61 has a guide rail 61a and a transfer arm 61b. The guide rail 61a is arranged on the negative side in the Y-axis direction of the single-wafer processing unit 6. The guide rail 61a extends along the horizontal direction (X-axis direction) in the single-wafer processing unit 6. The transfer arm 61b moves in the horizontal direction (X-axis direction) and the vertical direction along the guide rail 61a and rotates around the vertical axis. The number of transfer arms 61b may be one or a plurality. In the latter case, the second transfer device 61 transfers a plurality of (for example, five) substrates W at once.

[0058] Three liquid processing apparatuses 62 are arranged along the X-axis direction. Each liquid processing apparatus 62 is of a single-wafer type and processes the substrate W one by one with a processing liquid. There may be a plurality of processing liquids. For example, they may be pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA (isopropyl alcohol).

[0059] The retraction table 64 mounts the substrate W carried out from the substrate standby unit 5. The retraction table 64 is provided at a position accessible by the second transfer device 61. The retraction table 64 is provided, for example, on the side opposite to the liquid processing apparatus 62 (negative side in the Y-axis direction) with the second transfer device 61 interposed therebetween. The retraction table 64 may be configured to mount one substrate W or may be configured to mount a plurality of substrates W. The retraction table 64 temporarily stores the substrate W when the liquid processing apparatus 62 becomes unavailable during the transfer of the substrate W from the substrate standby unit 5 to the liquid processing apparatus 62.

[0060] In the present embodiment, the single-wafer processing unit 6 has a plurality of processing unit blocks 60 having the same configuration, but the single-wafer processing unit 6 may have processing unit blocks 60 having different configurations. For example, the single-wafer processing unit 6 may have a processing unit block 60 including a drying device in addition to the liquid processing apparatus 62. The drying device is of a single-wafer type and dries the substrate W one by one with a supercritical fluid. In the present embodiment, three stages of processing unit blocks 60 are provided vertically, but the number of processing unit blocks 60 is not limited.

[0061] The control device 9 is, for example, a computer and includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as a memory. A program for controlling various processes executed in the substrate processing system 1 is stored in the recording medium 92. The control device 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the program stored in the recording medium 92. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives a signal from the outside through the input interface 93 and transmits a signal to the outside through the output interface 94.

[0062] The above program is stored, for example, in a computer-readable recording medium and installed from the recording medium into the recording medium 92 of the control device 9. Examples of the computer-readable recording medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, and the like. Note that the program may be downloaded from a server via the Internet and installed into the recording medium 92 of the control device 9.

[0063] The control device 9 is configured to control the transfer device 31 to transfer the plurality of substrates W accommodated in the cassette C to either the lot forming unit 32 or the delivery stand 33 based on the information associated with the cassette C carried into the loading / unloading unit 2. The information may include the substrate type. For example, when the substrate type is a product substrate, the control device 9 controls the transfer device 31 to transfer the substrate W accommodated in the cassette C to the lot forming unit 32. For example, when the substrate type is a dummy substrate, the control device 9 controls the transfer device 31 to transfer the substrate W accommodated in the cassette C to the delivery stand 33.

[0064] (Details of the Configuration of the Second Waiting Area) Referring to FIG. 3, the details of the configuration of the second waiting area 54b will be described. FIG. 3 is a diagram showing the second waiting area 54b. FIG. 3(a) is a top view, and FIG. 3(b) is a cross-sectional view. FIG. 3(b) corresponds to a cross-sectional view taken along line B-B in FIG. 3(a).

[0065] As shown in FIGS. 3(a) and 3(b), the second waiting area 54b has a pure water supply unit 80, a liquid receiving unit 73, and three or more pins 74. In FIG. 3(a), the pure water supply unit 80 is omitted.

[0066] The liquid receiving part 73 has a bottom plate 71 and a wall part 72. The bottom plate 71 has a disk-like shape. The wall part 72 is provided annularly on the bottom plate 71. The pins 74 are provided on the bottom plate 71. In the present embodiment, the number of pins 74 is three, but it may be four or more. The three pins 74 are arranged so as to form an equilateral triangle in a plan view. The plane including the upper ends of the respective pins 74 is horizontal. The upper ends of the respective pins 74 are located above the upper end of the wall part 72. In a plan view, the center of the equilateral triangle formed by the three pins 74 substantially coincides with the center of the disk-like bottom plate 71. The pins 74 support the substrate W from below above the bottom plate 71.

[0067] The pure water supply part 80 has a nozzle 81, a pure water supply line 82, and a return line 83. The pure water supply line 82 is connected to the nozzle 81. The nozzle 81 discharges the pure water supplied through the pure water supply line 82. A branch point 85 is provided in the pure water supply line 82, and the return line 83 is connected to the branch point 85. Even during a period when the discharge of pure water from the nozzle 81 is not performed, pure water flows through the portion upstream of the branch point 85 in the pure water supply line 82 and the return line 83. The pure water supply part 80 configured in this way supplies pure water to the upper surface of the substrate W. The pure water supply part 80 is an example of a first processing liquid supply part, and the pure water is an example of a first processing liquid.

[0068] The second standby area 54b has such a configuration and horizontally holds the substrate W in a state of being in contact with pure water.

[0069] The retraction table 64 may also have a pure water supply part, a liquid receiving part, and three or more pins, similar to the second standby area 54b. The pure water supply part is an example of a second processing liquid supply part, and the pure water is an example of a second processing liquid.

[0070] As described above, the substrate processing system 1 according to the embodiment includes a loading / unloading unit 2, a substrate transfer unit 3, a batch processing unit 4, a substrate standby unit 5, and a single-wafer processing unit 6. The substrate standby unit 5 includes a standby table 54, a first transfer device 53, and a first replacement device 55. The standby table 54 includes a first standby area 54a and a second standby area 54b. The first standby area 54a is for placing the substrate W carried in from the batch processing unit 4. The second standby area 54b is provided side by side with the first standby area 54a in the vertical direction and is for placing the substrate W to be carried out to the single-wafer processing unit 6. The second standby area 54b has a pure water supply unit 80 for supplying the first processing liquid to the upper surface of the substrate W. The first transfer device 53 collectively transfers a plurality of substrates W from the batch processing unit 4 to the first standby area 54a. The first replacement device 55 replaces the substrate W from the first standby area 54a with the substrate W in the second standby area 54b. In this case, the time required for transferring the substrate W from the batch processing unit 4 to the single-wafer processing unit 6 is shortened. As a result, the throughput is improved.

[0071] 〔Operation of Substrate Processing System〕 (Overall Operation) Referring to FIGS. 4 to 8, the operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described. FIG. 4 is a flowchart showing the substrate processing method according to the embodiment. FIG. 5 is a plan view showing the operation of the composite processing. FIG. 6 is a diagram showing the transfer flow of the substrate W in the composite processing. FIG. 7 is a plan view showing the operation of the single-wafer processing. FIG. 8 is a diagram showing the transfer flow of the substrate W in the single-wafer processing. The processing shown in FIG. 4 is carried out under the control of the control device 9.

[0072] First, the cassette C is carried into the loading / unloading unit 2 in a state of accommodating a plurality of substrates W and placed on the load port 21. Inside the cassette C, the substrates W are held horizontally and held in the vertical direction at a second pitch P2 (P2 = N × P1). N is a natural number of 2 or more, and in this embodiment, it is 2, but it may be 3 or more.

[0073] Next, the cassette transfer device 24 transfers the cassette C from the load port 21 to the loader 23 (arrow F1 in FIG. 5, arrow G1 in FIG. 7). When the cassette C is transferred to the loader 23, the lid of the cassette C is opened by the lid opening / closing mechanism.

[0074] Next, the control device 9 controls each part of the substrate processing system 1 so as to perform the processing shown in FIG. 4. The control device 9 controls each part of the substrate processing system 1 so as to perform the processing shown in FIG. 4 every time the cassette C is placed on the loader 23.

[0075] First, when the cassette C is transferred to the loader 23, the control device 9 determines whether to perform composite processing or single-sheet processing on the plurality of substrates W accommodated in the cassette C based on the information associated with the cassette C (S101 in FIG. 4).

[0076] In S101 of FIG. 4, when it is determined to perform composite processing, the control device 9 controls each part of the substrate processing system 1 so as to transfer the substrate W accommodated in the cassette C to the batch processing unit 4 (S102 in FIG. 4). Specifically, the transfer device 31 receives the substrate W accommodated in the cassette C and transfers it to the lot forming unit 32 (arrow F2 in FIG. 5). Next, the lot forming unit 32 holds the plurality of substrates W at the first pitch P1 (P1 = P2 / N) to form a lot L. One lot L is composed of, for example, the substrates W of M cassettes C. Since the pitch of the substrates W is narrowed from the second pitch P2 to the first pitch P1, the number of substrates W to be processed in a batch can be increased. Next, the first lot transfer device 43 receives the lot L from the lot forming unit 32 and transfers it to the processing tool 44 (arrow F3 in FIG. 5).

[0077] Next, the processing tool 44 descends from above the chemical liquid tank 41, immerses the lot L in the chemical liquid, and performs chemical liquid processing (S103 in FIG. 4). Then, the processing tool 44 rises to lift the lot L from the chemical liquid, and then moves horizontally (negative X-axis direction) toward above the rinse liquid tank 42 (arrow F4 in FIG. 5).

[0078] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs rinse liquid treatment (S103 in FIG. 4). After that, the processing tool 44 ascends to lift the lot L from the first rinse liquid. Next, the first lot transfer device 43 receives the lot L from the processing tool 44 and transfers it to the second lot transfer device 52.

[0079] Next, the transfer arm 52c of the second lot transfer device 52 moves in the horizontal direction (positive side of the Y-axis direction), descends from above the immersion tank 51, and immerses the lot L in the second rinse liquid (S104 in FIG. 4, arrow F5 in FIG. 5). The plurality of substrates W of the lot L are held in the second rinse liquid until they are lifted from the second rinse liquid by the first transfer device 53. Since the substrates W are present below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrates W, and the collapse of the uneven patterns on the substrates W can be prevented.

[0080] Next, the first transfer device 53 transfers the substrates W of the lot L held by the transfer arm 52c in the second rinse liquid to the standby table 54 (arrow F6 in FIG. 5). The first transfer device 53 transfers a plurality of (for example, two) substrates W collectively to the first standby area 54a of the standby table 54 (FIG. 6).

[0081] Next, the first replacement device 55 transfers the substrates W placed in the first standby area 54a to the second standby area 54b provided corresponding to each of the upper, middle, and lower stages (FIG. 6). The first replacement device 55 may replace the substrates W one by one, or may replace the substrates W in a plurality at a time. In the latter case, the first replacement device 55 transfers a plurality of (for example, two) substrates W collectively.

[0082] Next, in each processing unit block 60, the second transfer device 61 receives the substrates W from the second standby area 54b of the standby table 54 and transfers them to the liquid treatment device 62 (arrow F7 in FIG. 5, FIG. 6).

[0083] Next, in each processing unit block 60, the liquid processing apparatus 62 processes the substrate W one by one with a liquid (S105 in FIG. 4). There may be a plurality of liquids. For example, the liquids may be pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA. The liquid processing apparatus 62 supplies pure water and the drying liquid to the upper surface of the substrate W in this order to form a liquid film of the drying liquid. The liquid processing apparatus 62 rotates the substrate W and removes the drying liquid from the upper surface of the substrate W by spin drying that shakes off the drying liquid from the substrate W by centrifugal force.

[0084] In the present embodiment, the liquid processing apparatus 62 dries the substrate W by spin drying, but the drying method is not particularly limited. The drying method may be any method that can suppress the collapse of the uneven pattern of the substrate W. For example, supercritical drying, scan drying, or water-repellent drying may be used. In supercritical drying, the drying liquid can be replaced with a supercritical fluid, and the collapse of the uneven pattern of the substrate W due to the surface tension of the drying liquid can be suppressed. In scan drying, while moving the supply position of the drying liquid from the center of the substrate W toward the outer periphery of the substrate W, the substrate W is rotated, and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, further, the supply position of a drying gas such as N2 gas may be moved from the center of the substrate W toward the outer periphery of the substrate W so as to follow the supply position of the drying liquid.

[0085] Next, in each processing unit block 60, the second transfer device 61 receives the substrate W from the liquid processing apparatus 62 and transfers it to the first transfer area 33a of the transfer stage 33 (arrow F8 in FIG. 5, FIG. 6).

[0086] When the liquid processing apparatus 62 becomes unavailable during the transfer of the substrate W from the second standby area 54b to the liquid processing apparatus 62, the second transfer device 61 may transfer the substrate W being transferred to the evacuation stage 64 (arrow F11 in FIG. 5). After transferring the substrate W to the evacuation stage 64, the second transfer device 61 may transfer the substrate W from the evacuation stage 64 to the available liquid processing apparatus 62 when at least one of the three liquid processing apparatuses 62 becomes available (arrow F12 in FIG. 5). The second transfer device 61 receives the substrate W from the liquid processing apparatus 62 and transfers it to the first transfer area 33a of the delivery stage 33 (arrow F13 in FIG. 5).

[0087] Next, the second replacement device 34 transfers the substrate W placed in the first transfer area 33a provided corresponding to each of the upper, middle, and lower processing unit blocks 60 to the second transfer area 33b (FIG. 6). The second replacement device 34 may replace the substrates W one by one, or may replace a plurality of substrates W at once. In the latter case, the second replacement device 34 transfers a plurality of (for example, two) substrates W collectively.

[0088] Next, the transfer device 31 receives the substrate W from the second transfer area 33b of the delivery stage 33 and stores it in the cassette C placed on the loader 23 (S106 in FIG. 4, arrow F9 in FIG. 5, FIG. 6).

[0089] Next, the cassette transfer device 24 transfers the cassette C from the loader 23 to the load port 21 (arrow F10 in FIG. 5). The cassette C transferred to the load port 21 is unloaded from the loading / unloading unit 2 in a state of accommodating a plurality of substrates W. The cassette transfer device 24 may transfer the cassette C from the loader 23 to the stocker 22 and temporarily store it in the stocker 22.

[0090] In S101 of FIG. 4, when it is determined to perform single-wafer processing, the control device 9 controls each part of the substrate processing system 1 to transfer the substrate W accommodated in the cassette C to the single-wafer processing unit 6 (S107 in FIG. 4). Specifically, the transfer device 31 receives the substrate W accommodated in the cassette C and transfers it to the third transfer area 33c of the delivery stage 33 (arrow G2 in FIG. 7, FIG. 8).

[0091] Next, the second replacement device 34 conveys the substrate W placed on the third transfer area 33c to the fourth transfer areas 33d provided corresponding to each of the upper, middle, and lower stages (FIG. 8). The second replacement device 34 may replace the substrates W one by one, or may replace a plurality of substrates W at once. In the latter case, the second replacement device 34 conveys a plurality of (for example, two) substrates W at once.

[0092] Next, in each processing unit block 60, the second transfer device 61 receives the substrate W from the fourth transfer area 33d of the delivery stage 33 and conveys it to the liquid processing device 62 (arrow G3 in FIG. 7, FIG. 8).

[0093] Next, similarly to S105 in FIG. 4, in each processing unit block 60, the liquid processing device 62 processes the substrates W one by one with liquid (S108 in FIG. 4).

[0094] Next, in each processing unit block 60, the second transfer device 61 receives the substrate W from the liquid processing device 62 and conveys it to the fourth transfer area 33d of the delivery stage 33 (arrow G4 in FIG. 7, FIG. 8).

[0095] Next, the second replacement device 34 conveys the substrate W placed on the fourth transfer areas 33d provided corresponding to each of the upper, middle, and lower processing unit blocks 60 to the third transfer area 33c (FIG. 8). The second replacement device 34 may replace the substrates W one by one, or may replace a plurality of substrates W at once. In the latter case, the second replacement device 34 conveys a plurality of (for example, two) substrates W at once.

[0096] Next, the transfer device 31 receives the substrate W from the third transfer area 33c of the delivery stage 33 and stores it in the cassette C placed on the loader 23 (S109 in FIG. 4, arrow G5 in FIG. 7, FIG. 8).

[0097] Next, the cassette transport device 24 transports the cassette C from the loader 23 to the load port 21 (arrow G6 in FIG. 7). The cassette C transported to the load port 21 is unloaded from the loading / unloading section 2 while accommodating a plurality of substrates W. The cassette transport device 24 may transport the cassette C from the loader 23 to the stocker 22 and temporarily store it in the stocker 22.

[0098] (Operation of the First Replacement Device) Referring to FIGS. 9 to 15, as an example of the operation of the first replacement device 55, the operation in which the first replacement device 55 replaces the substrate W from the first standby area 54a to the second standby area 54b of the standby table 54 will be described. FIGS. 9 to 15 are diagrams showing the operation of replacing the substrate W on the standby table 54. In FIGS. 9 to 15, the case where the first replacement device 55 has an upper arm 55a and a lower arm 55b and replaces the substrate W with the upper arm 55a and the lower arm 55b will be described.

[0099] First, as shown in FIG. 9, one substrate W is loaded into each of the two first standby areas 54a by the first transport device 53. Each substrate W is, for example, a substrate processed by the batch processing unit 4.

[0100] Next, as shown in FIG. 10, the first replacement device 55 inserts the upper arm 55a into one of the first standby areas 54a and receives the substrate W placed on one of the first standby areas 54a. Further, the first replacement device 55 inserts the lower arm 55b into the other of the first standby areas 54a and receives the substrate W placed on the other of the first standby areas 54a.

[0101] Next, as shown in FIG. 11, the first replacement device 55 pulls out the upper arm 55a holding the substrate W from one of the first standby areas 54a, and pulls out the lower arm 55b holding the substrate W from the other of the first standby areas 54a. As a result, the substrates W are simultaneously taken out from one side and the other side of the first standby area 54a.

[0102] Next, as shown in FIG. 12, the first replacement device 55 descends to the same height as one of the second standby areas 54b provided corresponding to the lower processing unit block 60, inserts the lower arm 55b into one of the second standby areas 54b, and delivers the substrate W to one of the second standby areas 54b. As a result, one substrate W is carried into one of the second standby areas 54b provided corresponding to the lower processing unit block 60.

[0103] Next, as shown in FIG. 13, the first replacement device 55 withdraws the lower arm 55b from one of the second standby areas 54b.

[0104] Next, as shown in FIG. 14, the first replacement device 55 ascends to the same height as the other of the second standby areas 54b provided corresponding to the lower processing unit block 60, inserts the upper arm 55a into the other of the second standby areas 54b, and delivers the substrate W to the other of the second standby areas 54b. As a result, one substrate W is carried into the other of the second standby areas 54b provided corresponding to the lower processing unit block 60.

[0105] Next, as shown in FIG. 15, the first replacement device 55 withdraws the upper arm 55a from the other of the second standby areas 54b.

[0106] As described above, two substrates W are collectively replaced from the first standby area 54a to the second standby area 54b. In this case, the time required for transporting the substrate W is shortened. As a result, the throughput is improved.

[0107] Note that the same may apply when replacing the substrate W from the first standby area 54a to the second standby areas 54b provided corresponding to the upper and middle processing unit blocks 60. Further, the first replacement device 55 may deliver the substrate W held by the upper arm 55a and the substrate W held by the lower arm 55b to the second standby area 54b provided corresponding to another processing unit block 60.

[0108] (Operation of the second replacement device) Referring to FIGS. 16 to 24, as an example of the operation of the second replacement device 34, the operation of the second replacement device 34 for replacing the substrate W from the first transfer area 33a to the second transfer area 33b of the delivery stage 33 will be described. FIGS. 16 to 24 are diagrams showing the operation of replacing the substrate W on the delivery stage 33. In FIGS. 16 to 24, the case where the second replacement device 34 has an arm 34a and the substrate W is replaced by the arm 34a will be described.

[0109] First, as shown in FIG. 16, by the second transfer device 61, one substrate W is carried into each of the first transfer area 33a provided corresponding to the middle processing unit block 60 and the first transfer area 33a provided corresponding to the lower processing unit block 60. Each substrate W is, for example, a substrate processed by the single-wafer processing unit 6.

[0110] Next, as shown in FIG. 17, the second replacement device 34 inserts the arm 34a into the first transfer area 33a provided corresponding to the lower processing unit block 60 and receives the substrate W placed on the first transfer area 33a.

[0111] Next, as shown in FIG. 18, the second replacement device 34 pulls out the arm 34a holding the substrate W from the first transfer area 33a. Thereby, the substrate W is taken out from the first transfer area 33a.

[0112] Next, as shown in FIG. 19, the second replacement device 34 rises to the same height as one of the three second transfer areas 33b, inserts the arm 34a into the second transfer area 33b, and delivers the substrate W to the second transfer area 33b. Thereby, the first substrate W is carried into the second transfer area 33b.

[0113] Next, as shown in FIG. 20, the second replacement device 34 pulls out the arm 34a from the second transfer area 33b.

[0114] Next, as shown in FIG. 21, the second replacement device 34 rises to the same height as the first transfer area 33a provided corresponding to the middle processing unit block 60, inserts the arm 34a into the first transfer area 33a, and receives the substrate W placed on the first transfer area 33a.

[0115] Next, as shown in FIG. 22, the second replacement device 34 pulls out the arm 34a holding the substrate W from the first transfer area 33a. Thereby, the substrate W is taken out from the first transfer area 33a.

[0116] Next, as shown in FIG. 23, the second replacement device 34 descends to the same height as the second transfer area 33b into which the first substrate W is carried, inserts the arm 34a into the second transfer area 33b, and transfers the substrate W to the second transfer area 33b. Thereby, the second substrate W is carried into the second transfer area 33b.

[0117] Next, as shown in FIG. 24, the second replacement device 34 pulls out the arm 34a from the second transfer area 33b.

[0118] As described above, the substrate W is replaced from the first transfer area 33a to the second transfer area 33b. When a predetermined number (for example, 25) of substrates W are carried into the second transfer area 33b, the transfer device 31 collectively transfers a predetermined number of substrates W from the second transfer area 33b to the cassette C placed on the loader 23.

[0119] Note that the same may apply when replacing the substrate W from the first transfer area 33a provided corresponding to the upper processing unit block 60 to the second transfer area 33b.

[0120] In the substrate processing method according to the embodiment described above, the first transfer device 53 transfers a plurality of substrates W from the batch processing unit 4 to the first standby area 54a in a batch. Next, the first replacement device 55 replaces the substrate W from the first standby area 54a to the second standby area 54b. Next, the pure water supply unit 80 supplies pure water to the upper surface of the substrate W placed in the second standby area 54b to form a liquid film on the upper surface of the substrate W. Next, the second transfer device 61 transfers the substrate W on which the liquid film is formed from the second standby area 54b to the single-wafer processing unit 6. In this case, the time required to transfer the substrate W from the batch processing unit 4 to the single-wafer processing unit 6 is shortened. As a result, the throughput is improved.

[0121] The embodiments disclosed this time should be considered as illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

Explanation of Reference Numerals

[0122] 1 Substrate processing system 2 Loading / unloading unit 3 Substrate transfer unit 4 Batch processing unit 5 Substrate standby unit 53 First transfer device 54 Standby table 54a First standby area 54b Second standby area 55 First replacement device 80 Pure water supply unit 6 Single-wafer processing unit C Cassette W Substrate

Claims

1. A loading / unloading section where a cassette for accommodating a plurality of substrates is loaded and unloaded; A batch processing section for collectively processing the plurality of substrates; A single-wafer processing section for processing the substrates one by one; A substrate transfer section for transferring the substrates from the loading / unloading section to the batch processing section and the single-wafer processing section; A substrate standby section for transferring the substrates from the batch processing section to the single-wafer processing section; comprising: The substrate standby section: A standby table including a first standby area for placing the substrates carried in from the batch processing section, and a second standby area provided side by side in the vertical direction with respect to the first standby area for placing the substrates to be carried out to the single-wafer processing section; A first transfer device for collectively transferring a plurality of the substrates from the batch processing section to the first standby area; A first replacement device for replacing the substrates from the first standby area to the second standby area; having: The second standby area has a first processing liquid supply section for supplying a first processing liquid to the upper surface of the substrate. A substrate processing system.

2. The substrate transfer section: A transfer table including a first transfer area for placing the substrates carried in from the single-wafer processing section, and a second transfer area provided side by side in the vertical direction with respect to the first transfer area for placing the substrates to be carried out to the loading / unloading section; A second replacement device for replacing the substrates from the first transfer area to the second transfer area; A transfer device for transferring the substrates from the second transfer area to the loading / unloading section; having The substrate processing system according to Claim 1.

3. The single-wafer processing section: A liquid processing device for processing the substrates one by one; A second transfer device for transferring the substrates from the liquid processing device to the first transfer area; having: The substrate processing system according to Claim 2.

4. The single-wafer processing section is provided at a position accessible by the second transfer device, and has a retraction table for placing the substrates carried out from the substrate standby section. The second transfer device is configured to transfer the substrates being transferred to the retraction table when the liquid processing device becomes unavailable during the transfer of the substrates from the substrate standby section to the liquid processing device. The substrate processing system according to Claim 3.

5. The retraction table has a second processing liquid supply section for supplying a second processing liquid to the upper surface of the substrate. The substrate processing system according to Claim 4.

6. A plurality of the liquid processing devices are provided side by side in the vertical direction. The substrate processing system according to any one of Claims 3 to 5.

7. The transfer table: ​ A third transfer region for placing the substrate carried in from the loading / unloading unit; A fourth transfer region for placing the substrate unloaded to the single-wafer processing unit; comprising; the transfer device is configured to transfer the substrate from the loading / unloading unit to the third transfer region; the second replacement device is configured to replace the substrate from the third transfer region to the fourth transfer region; The substrate processing system according to claim 2.

8. the transfer stage includes a fifth transfer region for placing the substrate unloaded to the batch processing unit; the transfer device is configured to transfer the substrate from the loading / unloading unit to the fifth transfer region; The substrate processing system according to claim 7.

9. the transfer device is configured to transfer a plurality of the substrates accommodated in the cassette associated with the information of the cassette loaded into the loading / unloading unit to the third transfer region or the fifth transfer region based on the information; The substrate processing system according to claim 8.

10. the transfer device is configured to transfer a plurality of the substrates collectively; The substrate processing system according to claim 2.

11. the first replacement device is configured to transfer a plurality of the substrates collectively; The substrate processing system according to claim 1.

12. A substrate processing method in a substrate processing system including a loading / unloading unit for loading and unloading a cassette accommodating a plurality of substrates, a batch processing unit for collectively processing a plurality of the substrates, a single-wafer processing unit for processing the substrates one by one, a substrate transfer unit for delivering the substrates from the loading / unloading unit to the batch processing unit and the single-wafer processing unit, and a substrate standby unit for delivering the substrates from the batch processing unit to the single-wafer processing unit, comprising: the substrate standby unit has a first standby region and a second standby region provided side by side in the vertical direction; collectively transferring a plurality of the substrates from the batch processing unit to the first standby region; replacing the substrate from the first standby region to the second standby region; supplying a first processing liquid to the upper surface of the substrate placed in the second standby region to form a liquid film on the upper surface; transferring the substrate with the liquid film formed from the second standby region to the single-wafer processing unit; having; Substrate processing method.

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