capacitor
The capacitor design with internal electrodes, dielectric layers, and external electrodes connected via vias and separation layers effectively reduces ESR, addressing the need for high capacitance and miniaturization in electronic devices.
Patent Information
- Application Number
- JP2024118604
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-21
- Filing Date
- 2024-07-24
- Publication Date
- 2025-07-03
AI Technical Summary
There is a demand for capacitors with higher capacitance and smaller equivalent series resistance (ESR) to meet the requirements of miniaturized electronic devices without compromising capacitance.
The capacitor design includes a body with internal electrodes laminated by a dielectric layer, connected via connection vias and external electrodes, with separation layers to reduce ESR, and multiple external electrodes positioned to minimize current path length.
This design achieves a capacitor with reduced ESR without capacitance loss, suitable for miniaturized electronic devices.
Smart Images
Figure 2025100312000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a capacitor.
Background Art
[0002] As electronic components used in electronic devices, there are capacitors, inductors, piezoelectric elements, varistors, or thermistors. Among such ceramic electronic components, multilayer capacitors can be used in various electronic devices due to their advantages of being small in size while ensuring high capacitance and being easy to mount.
[0003] For example, multilayer capacitors can be used as chip-shaped capacitors mounted on the substrates of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light-emitting diodes (OLEDs) and other video devices, computers, personal mobile terminals, and smartphones to charge or discharge electricity.
[0004] Recently, with the trend of miniaturization and thinning of electronic products, the demand for capacitors with higher capacitance and smaller equivalent series resistance (ESR) than existing multilayer capacitors has been increasing.
Summary of the Invention
Problems to be Solved by the Invention
[0005] At least one embodiment among the embodiments is for providing a capacitor with a small equivalent series resistance (ESR) without capacitance loss.
Means for Solving the Problems
[0006] A capacitor by one side can include: a body including a first internal electrode and a second internal electrode laminated with a dielectric layer therebetween; a first external electrode positioned to cover the upper surface and the outer surface of the body and connected to the first internal electrode through the upper surface and the outer surface of the body; and a second external electrode positioned to cover the upper surface and the outer surface of the body and connected to the second internal electrode through the upper surface and the outer surface of the body.
[0007] It can further include a first connection via positioned inside the body and connecting the first internal electrode and the first external electrode; and a second connection via positioned inside the body and connecting the second internal electrode and the second external electrode.
[0008] It can further include a first via separation layer positioned between the first connection via and the second internal electrode.
[0009] It can further include a second via separation layer positioned between the second connection via and the first internal electrode.
[0010] The first external electrode can contact the first connection via, and the second external electrode can contact the second connection via.
[0011] It can further include a first connection layer connecting the first external electrode and the first connection via; and a second connection layer connecting the second external electrode and the second connection via.
[0012] The first connection layer and the second connection layer can be arranged on the dielectric layer located at the uppermost side among the dielectric layers.
[0013] The number of the first connection vias can be more than the number of the first external electrodes.
[0014] The number of the second connection vias can be more than the number of the second external electrodes.
[0015] Each of the first external electrode and the second external electrode can be disposed adjacent to a corner where the longitudinal end portion and the widthwise end portion of the body are in contact with each other.
[0016] Two of each of the first external electrode and the second external electrode are provided.
[0017] The first external electrode is connected to a part of the first internal electrode exposed on the outer surface of the body, and the second external electrode is connected to a part of the second internal electrode exposed on the outer surface of the body.
[0018] It may further include a first electrode separation layer located between the first external electrode and the second internal electrode; and a second electrode separation layer located between the second external electrode and the first internal electrode.
[0019] A capacitor on the other side includes a substrate; a first internal electrode and a second internal electrode laminated with a dielectric layer interposed therebetween, a body located on the substrate; a first external electrode located so as to cover the upper surface and the outer surface of the body and connected to the first internal electrode; and a second external electrode located so as to cover the upper surface and the outer surface of the body and connected to the second internal electrode.
[0020] The first external electrode is connected to a part of the first internal electrode exposed on the outer surface of the body, and the second external electrode is connected to a part of the second internal electrode exposed on the outer surface of the body.
[0021] Each of the first external electrode and the second external electrode can be disposed adjacent to a corner where the longitudinal end portion and the widthwise end portion of the body are in contact with each other.
[0022] Two of each of the first external electrode and the second external electrode are provided.
[0023] A capacitor according to another aspect includes a substrate; a first internal electrode and a second internal electrode laminated with a dielectric layer interposed therebetween; a body located on the upper surface of the substrate; two first external electrodes located apart from each other on the upper surface of the body and connected to the first internal electrode; and two second external electrodes located apart from each other on the upper surface of the body and connected to the second internal electrode.
[0024] It may further include a first connection via located inside the body and connected to the first internal electrode; and a second connection via located inside the body and connected to the second internal electrode.
[0025] A part of the first external electrode covers the outer surface of the body and is connected to a part of the first internal electrode exposed on the outer surface of the body, and a part of the second external electrode is positioned to cover the outer surface of the body and is connected to a part of the second internal electrode exposed on the outer surface of the body.
Advantages of the Invention
[0026] According to at least one of the embodiments, a capacitor with a small ESR (Equivalent Serial Resistance) without capacitance loss can be provided.
Brief Description of the Drawings
[0027]
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Embodiments for Carrying Out the Invention
[0028] Hereinafter, with reference to the accompanying drawings, various embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement them. The present invention can be realized in various different forms and is not limited to the embodiments described herein.
[0029] In order to clearly explain the present invention, parts that are unnecessary for the explanation are omitted, and the same reference numerals are given to the same or similar components throughout the specification.
[0030] Also, the sizes and thicknesses of the respective configurations shown in the drawings are arbitrarily shown for the convenience of explanation, and thus the present invention is not necessarily limited to what is shown in the drawings. In the drawings, the thicknesses are enlarged to clearly represent various layers and regions. And in the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated.
[0031] Also, when a part such as a layer, film, region, or plate is "on" or "above" another part, this includes not only the case where it is "directly above" the other part but also the case where there are other parts in between. Conversely, when a part is "directly above" another part, it means that there are no other parts in between. Also, being "on" or "above" a reference part means being located above or below the reference part, and it does not necessarily mean being located "on" or "above" in the direction opposite to the direction in which gravity acts.
[0032] Also, throughout the specification, when a part "includes" a certain component, this means that other components can be further included, rather than excluding other components unless otherwise stated to the contrary.
[0033] Also, throughout the specification, when it is said "on a plane", it means when the target part is viewed from above, and when it is said "in a cross-section", it means when the cross-section obtained by vertically cutting the target part is viewed from the side.
[0034] FIG. 1 is a diagram showing a capacitor 1 according to an embodiment, and FIG. 2 is a longitudinal sectional view taken along line A - A' of FIG. 1.
[0035] Referring to FIGS. 1 and 2, a capacitor 1 according to an embodiment can include a substrate 10, a body 20, and an external electrode 30.
[0036] The substrate 10 has a predetermined area. The substrate 10 is provided with an insulating material. As an example, the substrate 10 may be a silicon substrate or the like. The substrate 10 has an upper surface and a lower surface facing each other. The substrate 10 has a predetermined thickness in the vertical direction (T) in which the upper surface and the lower surface are separated.
[0037] The substrate 10 can have a predetermined width in the width direction (W) intersecting the vertical direction (T). The width direction (W) can be orthogonal to the vertical direction (T). The substrate 10 can have a predetermined length in the length direction (L) intersecting the vertical direction (T) and the width direction (W). The length direction (L) can be orthogonal to the vertical direction (T) and the width direction (W). The length of the substrate 10 may be greater than the width of the substrate 10.
[0038] The body 20 is located on the upper surface of the substrate 10. The body 20 includes an internal electrode 200 and a dielectric layer 210. The body 20 can have a predetermined length along the length direction (L) of the substrate 10. The body 20 can have a predetermined width along the width direction (W) of the substrate 10. The body 20 can have a predetermined thickness along the vertical direction (T).
[0039] The internal electrode 200 is laminated and located on the upper surface of the substrate 10. The internal electrode 200 is provided with a conductive material. The internal electrode 200 may be a metallic material. The internal electrode 200 can be laminated in the vertical direction (T).
[0040] The dielectric layer 210 is positioned between the internal electrodes 200 adjacent to each other in the vertical direction (T). Also, the dielectric layer 210 can be disposed on the internal electrode 200 located on the uppermost side. The dielectric layer 210 can be formed from any one of metal oxides such as Al2O3ZrO2, HfO2, AlN, etc. Also, the dielectric layer 210 can be formed from a combination of metal oxides such as Al2O3ZrO2, HfO2, AlN, etc. Also, the dielectric layer 210 can be formed from ZAZ which is a ZrO2 - Al2O3 - ZrO2 composite layer.
[0041] The internal electrode 200 can include a first internal electrode 201 and a second internal electrode 202.
[0042] The first internal electrode 201 and the second internal electrode 202 are laminated and positioned on the upper surface of the substrate 10. The first internal electrode 201 and the second internal electrode 202 can be laminated alternately. A dielectric layer 210 can be disposed between the first internal electrode 201 and the second internal electrode 202. The first internal electrode 201 and the second internal electrode 202 are provided with a conductive material. The first internal electrode 201 and the second internal electrode 202 can be provided with a non - magnetic material. The first internal electrode 201 may be a metallic material. The second internal electrode 202 may be a metallic material. The first internal electrode 201 and the second internal electrode 202 may be made of different materials from each other. Thereby, the first internal electrode 201 and the second internal electrode 202 can be selectively etched. As an example, the first internal electrode 201 can contain molybdenum and the second internal electrode 202 can contain titanium.
[0043] The external electrode 30 is connected to the internal electrode 200 of the body 20. The external electrode 30 can be disposed so as to cover a part of the outer surface of the body 20. The external electrode 30 can be disposed on the upper surface of the body 20. The external electrode 30 is connected to the internal electrode 200 through connection vias 221, 222.
[0044] The connection vias 221 and 222 are located inside the body 20. The connection vias 221 and 222 are electrically connected to the internal electrodes 200. The connection vias 221 and 222 extend in a direction in which the internal electrodes 200 are separated from each other. As an example, the connection vias 221 and 222 can extend in the vertical direction (T). The connection vias 221 and 222 are provided to penetrate the region of the body 20 where the internal electrodes 200 are located. The lower ends of the connection vias 221 and 222 can be arranged adjacent to the bottom surface of the body 20. As an example, the lower ends of the connection vias 221 and 222 can contact the upper surface of the substrate 10. The upper ends of the connection vias 221 and 222 can be arranged adjacent to the upper surface of the body 20. As an example, the upper ends of the connection vias 221 and 222 are exposed on the upper surface of the body 20. At this time, the upper ends of the connection vias 221 and 222 can be coplanar with the upper surface of the body 20. Also, the upper ends of the connection vias 221 and 222 may protrude above the upper surface of the body 20. The upper ends of the connection vias 221 and 222 may be directly connected to the external electrodes 30.
[0045] The connection vias 221 and 222 include a first connection via 221 and a second connection via 222.
[0046] The first connection via 221 is electrically connected to the first internal electrode 201. The first connection via 221 is provided to penetrate the region of the body 20 where the internal electrode 200 is located, and the first connection via 221 is connected to the first internal electrode 201 in a form of contacting the first internal electrode 201. The first connection via 221 is electrically separated from the second internal electrode 202. That is, a first via separation layer 231 is located between the first connection via 221 and the second internal electrode 202. The first via separation layer 231 can have a ring structure so as to surround the first connection via 221. That is, the second internal electrode 202 may be separated from the first connection via 221 in a region adjacent to the first connection via 221. And the first via separation layer 231 can be arranged in a form of being filled between the first connection via 221 and the second internal electrode 202. The first via separation layer 231 is provided with an insulating material. As an example, the first via separation layer 231 can be provided with alumina (Al2O3), silicon oxide, or the like. Dielectric layers 210 are located on both sides in the vertical direction (T) of the first via separation layer 231.
[0047] The second connection via 222 is electrically connected to the second internal electrode 202. The second connection via 222 is provided to penetrate the region of the body 20 where the internal electrode 200 is located, and the second connection via 222 is connected to the second internal electrode 202 in a form of contacting the second internal electrode 202. The second connection via 222 is electrically separated from the first internal electrode 201. That is, a second via separation layer 232 is located between the second connection via 222 and the first internal electrode 201. The second via separation layer 232 can have a ring structure so as to surround the second connection via 222. That is, the first internal electrode 201 may be separated from the second connection via 222 in a region adjacent to the second connection via 222. And the second via separation layer 232 can be arranged in a form of being filled between the second connection via 222 and the first internal electrode 201. The second via separation layer 232 is provided with an insulating material. As an example, the second via separation layer 232 can be provided with alumina (Al2O3), silicon oxide, or the like. Dielectric layers 210 are located on both sides in the vertical direction (T) of the second via separation layer 232.
[0048] An insulating layer 240 can be disposed on the outer surface of the body 20. That is, in the length direction (L) and width direction (W) of the body 20, the insulating layer 240 is located outside the ends of the first internal electrode 201 and outside the ends of the second internal electrode 202, so that the first internal electrode 201 and the second internal electrode 202 are insulated from the outside. Further, the insulating layer 240 may be disposed on the upper surface of the body 20. In this case, the connection vias 221, 222 can penetrate through the insulating layer 240 connected to the external electrodes 30. The insulating layer 240 can be provided with alumina (Al2O3), silicon oxide, or the like.
[0049] The external electrodes 30 include a first external electrode 31 and a second external electrode 32.
[0050] The first external electrode 31 is located on the upper surface of the body 20. The first external electrode 31 can be disposed on the upper surface at the end in the length direction (L) of the body 20. The first external electrode 31 is connected to the first internal electrode 201. The first external electrode 31 is connected to the first internal electrode 201 through the first connection via 221. The first connection via 221 is located in the lower region of the first external electrode 31 in the vertical direction (T), and the upper end portion of the first connection via 221 is connected in a manner that contacts the first external electrode 31. A plurality of first external electrodes 31 can be provided. As an example, two first external electrodes 31 can be provided. Then, two first connection vias 221 are provided, and each first connection via 221 can be disposed in the lower region of the first external electrode 31 in the vertical direction (T). The two first external electrodes 31 can be respectively disposed on the upper surfaces at both ends in the length direction (L) of the body 20. Thereby, the two first external electrodes 31 can be arranged to be spaced apart from each other along the length direction (L) of the body 20. Further, the two first external electrodes 31 can be arranged to be spaced apart from each other along the width direction (W) of the body 20. Thereby, the two first external electrodes 31 can be arranged to be spaced apart from each other in a diagonal direction intersecting the length direction (L) and width direction (W) of the body 20. The first external electrode 31 can be disposed adjacent to the corner where the end in the length direction (L) and the end in the width direction (W) of the body 20 contact.
[0051] The second external electrode 32 is located on the upper surface of the body 20. The second external electrode 32 can be arranged on the upper surface at the end in the length direction (L) of the body 20. The second external electrode 32 is connected to the second internal electrode 202. The second external electrode 32 is connected to the second internal electrode 202 through the second connection via 222. The second connection via 222 is located in the lower region of the second external electrode 32 in the vertical direction (T), and the upper end portion of the second connection via 222 is connected in a manner that contacts the second external electrode 32. A plurality of second external electrodes 32 can be provided. As an example, two second external electrodes 32 may be provided. Then, two second connection vias 222 are provided, and each second connection via 222 can be arranged in the lower region of the second external electrode 32 in the vertical direction (T). The two second external electrodes 32 can be respectively arranged on the upper surfaces at both ends in the length direction (L) of the body 20. Thereby, the two second external electrodes 32 can be arranged spaced apart from each other along the length direction (L) of the body 20. Also, the two second external electrodes 32 can be arranged spaced apart from each other along the width direction (W) of the body 20. Thereby, the two second external electrodes 32 can be arranged spaced apart from each other in a diagonal direction intersecting the length direction (L) and the width direction (W) of the body 20. The two second external electrodes 32 can be respectively arranged spaced apart from the two first external electrodes 31 in the width direction (W) of the body 20. The second external electrode 32 can be arranged adjacent to the corner where the end in the length direction (L) and the end in the width direction (W) of the body 20 contact.
[0052] FIG. 3 is a diagram showing a state in which the capacitor 1 according to an embodiment is mounted on the mounting substrate MS.
[0053] Referring to FIG. 3, when the capacitor 1 according to an embodiment is used in a state mounted on the mounting substrate MS, a current path is generated between the mounting substrate MS and the capacitor 1. At this time, the current path is generated in a form connecting the first external electrode 31 and the second external electrode 32. The insulating layer 240 located in the upper surface region of the body 20 may be provided in a thin film form. As an example, the thickness of the insulating layer 240 located in the upper surface region of the body 20 may be 2 μm or less. Thereby, the current path becomes shorter in the vertical direction (T), and the ESR (Equivalent Serial Resistance) can be reduced. Also, inside the body 20, the current path is formed between the first connection via 221 and the second connection via 222. Thereby, the current path becomes shorter compared to the overall length of the body 20, and the ESR (Equivalent Serial Resistance) can be reduced. Further, by providing a plurality of the first external electrodes 31 and the second external electrodes 32, the region where the current path is formed inside the body 20 can be adjusted, and the ESR (Equivalent Serial Resistance) can be reduced.
[0054] FIGS. 4 to 11 are diagrams showing a manufacturing method according to an embodiment of the capacitor.
[0055] Hereinafter, with reference to FIGS. 4 to 11, a manufacturing method of the capacitor 1 according to an embodiment will be described.
[0056] Referring to FIG. 4, an internal electrode layer IE1, IE2, and a dielectric layer DL for forming the body 20 are formed on the substrate S. The substrate S may be a silicon substrate or the like. The substrate S is provided with an area larger than the area of the two bodies 20. And the area of the region where the internal electrode layer IE1, IE2, and the dielectric layer DL are formed may be larger than the area occupied by one body 20. For convenience of illustration in FIG. 4, the region where one body 20 is formed on the substrate S is shown.
[0057] The internal electrode layers IE1 and IE2 and the dielectric layer DL can be formed alternately. In the internal electrode layers IE1 and IE2 and the dielectric layer DL for forming the body 20, the dielectric layer DL is finally formed. As a result, the dielectric layer DL is disposed on the internal electrode layers IE1 and IE2 located on the uppermost side.
[0058] The internal electrode layers IE1 and IE2 and the dielectric layer DL can be formed through a deposition process. For the formation of the internal electrode layers IE1 and IE2, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. can be used. For the formation of the dielectric layer DL, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. can be used.
[0059] The internal electrode layers IE1 and IE2 can include a first internal electrode layer IE1 and a second internal electrode layer IE2. The first internal electrode layer IE1 and the second internal electrode layer IE2 can be formed alternately. Different materials can be used for the formation of the first internal electrode layer IE1 and the formation of the second internal electrode layer IE2. As an example, the first internal electrode layer IE1 can be formed using molybdenum, and the second internal electrode layer 202 can be formed using titanium.
[0060] Also, an insulating layer IL can be formed on the uppermost part. The insulating layer IL can be formed through a deposition process. For the formation of the insulating layer IL, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. can be used.
[0061] Referring to FIG. 5, via holes VH1 and VH2 are formed through the internal electrode layers IE1 and IE2, the dielectric layer DL, and the insulating layer IL. As an example, the via holes VH1 and VH2 can be formed through an etching process. The etching process can be performed by dry etching using plasma. Also, the via holes VH1 and VH2 can be formed through hole processing using a laser. The via holes VH1 and VH2 can include a first via hole VH1 and a second via hole VH2. A plurality of the first via holes VH1 can be formed spaced apart from each other. As an example, two of the first via holes VH1 can be formed. A plurality of the second via holes VH2 can be formed spaced apart from each other. As an example, two of the second via holes VH2 can be formed.
[0062] Referring to FIG. 6, a first groove G1 is formed in the inner region of the first via hole VH1. The first groove G1 can be formed by etching the second electrode layer IE2 exposed toward the first via hole VH1. The first groove G1 can be formed through wet etching using a chemical or dry etching using plasma.
[0063] While etching is performed in the inner region of the first via hole VH1, the second via hole VH2 is blocked through a mask. The mask can be formed through a photolithography process so as to have a form in which the region where the first via hole VH1 is located is open and the region where the second via hole VH2 is located is blocked.
[0064] Referring to FIG. 7, a first via separation layer 231 is formed in the first groove G1. As an example, the first via separation layer 231 can be formed such that an insulating material fills the inside of the first via hole VH1 and the insulating material is etched again in a direction other than the first groove G1.
[0065] Referring to FIG. 8, a second groove G2 is formed in the inner region of the second via hole VH2. The second groove G2 can be formed by etching the first electrode layer IE1 exposed toward the second via hole VH2.
[0066] The second groove G2 can be formed through wet etching using chemicals or dry etching using plasma.
[0067] While etching is performed on the inner region of the second via hole VH2, the first via hole VH1 is blocked through a mask. The mask can be formed through a photolithography process so that the region where the second via hole VH2 is located is open and the region where the first via hole VH1 is located is blocked.
[0068] Referring to FIG. 9, a second via isolation layer 232 is formed in the second groove G2. As an example, the second via isolation layer 232 can be formed such that an insulating material fills the inside of the second via hole VH2 and the insulating material is etched again in a direction other than the second groove G2.
[0069] FIGS. 6 to 9 illustrate the case where the second via isolation layer 232 is formed after the first via isolation layer 231 is formed. However, the first via isolation layer 231 may be formed after the second via isolation layer 232 is formed.
[0070] Referring to FIG. 10, a first connection via 221 is formed in the first connection via hole VH1, and a second connection via 222 is formed in the second connection via hole VH2. The first connection via 221 and the second connection via 222 can be formed through a deposition process. Chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, etc. can be used for the formation of the first connection via 221 and the second connection via 222. Also, the first connection via 221 and the second connection via 222 can be formed by a plating process.
[0071] Thereafter, a first external electrode 31 is formed on the first connection via 221, and a second external electrode 32 is formed on the second connection via 222. The first external electrode 31 and the second external electrode 32 can be formed through a vapor deposition process. For the formation of the external electrode 30, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, or the like can be used. Also, the external electrode 30 can be formed by a plating process.
[0072] Referring to FIG. 11, the internal electrode layers IE1, IE2, the dielectric layer DL, the insulating layer IL, and the substrate S can be cut into a size corresponding to one capacitor 1. The cutting process can be performed through a dicing process. The dicing process can be performed through a blade, a laser, or the like. Also, an insulating layer 240 can be formed on the outer ends of the first internal electrode 201 and the second internal electrode 202. The insulating layer 240 can be formed through a vapor deposition process. Thereby, the insulating layer 240 is disposed on the outer surface of the body 20.
[0073] FIG. 12 is a plan view of a capacitor 1a according to the second embodiment.
[0074] Referring to FIG. 12, in the capacitor 1a according to the second embodiment, a plurality of first connection vias 221a and second connection vias 222a are arranged in the body 20a.
[0075] A plurality of first connection vias 221a are provided. Three or more first connection vias 221a are provided. The case where four first connection vias 221a are provided is illustrated in FIG. 12. Each of the first connection vias 221a can be arranged spaced apart from each other. Two first connection vias 221a can be arranged spaced apart in the length direction (L) of the body 20a. Two first connection vias 221a can be arranged spaced apart in the width direction (W) of the body 20a.
[0076] A plurality of second connection vias 222a are provided. Three or more second connection vias 222a are provided. The number of the second connection vias 222a may be the same as or different from the number of the first connection vias 221a. In FIG. 12, a case where four second connection vias 222a are provided is illustrated. Each of the second connection vias 222a can be arranged separately from each other. Two second connection vias 222a can be arranged separately in the length direction (L) of the body 20a. Two second connection vias 222a can be arranged separately in the width direction (W) of the body 20a.
[0077] The external electrodes 31a, 32a include a first external electrode 31a and a second external electrode 32a.
[0078] The first external electrode 31a is located on the upper surface of the body 20a. The first external electrode 31a is provided in the same number as the first connection vias 221a. Each of the first external electrodes 31a is located on the first connection vias 221a and is connected to the first connection vias 221a.
[0079] The second external electrode 32a is located on the upper surface of the body 20a. The second external electrode 32a is provided in the same number as the second connection vias 222a. Each of the second external electrodes 32a is located on the second connection vias 222a and is connected to the second connection vias 222a.
[0080] Since the remaining configuration of the capacitor 1a is the same as or similar to the capacitor 1 described above with reference to FIGS. 1 and 2, repeated description is omitted.
[0081] FIG. 13 is a cross-sectional view of a capacitor 1b according to the third embodiment.
[0082] Referring to FIG. 13, in the capacitor 1b according to the third embodiment, connection vias 221b, 222b and external electrodes 31b, 32b are connected to each other by a connection layer 225. The connection layer 225 can be arranged on the dielectric layer 210b located on the uppermost side. The connection layer 225 can be arranged between the insulating layer 240b and the dielectric layer 210b located on the uppermost side. The connection layer 225 is provided with a conductive material. The connection layer 225 may be a metallic material.
[0083] The connection layer 225 includes a first connection layer 226 and a second connection layer 227.
[0084] The first connection layer 226 is located between the first connection via 221b and the first external electrode 31b, so that the first connection via 221b and the first external electrode 31b are electrically connected to each other. One end of the first connection layer 226 is connected to the upper end of the first connection via 221b. The other end of the first connection layer 226 is connected to the first external electrode 31b. The region where the first external electrode 31b and the first connection layer 226 are connected to each other can penetrate through the insulating layer 240b.
[0085] The second connection layer 227 is located between the second connection via 222b and the second external electrode 32b, so that the second connection via 222b and the second external electrode 32b are electrically connected to each other. One end of the second connection layer 227 is connected to the upper end of the second connection via 222b. The other end of the second connection layer 227 is connected to the second external electrode 32b. The region where the second external electrode 32b and the second connection layer 227 are connected to each other can penetrate through the insulating layer 240b.
[0086] The remaining substrate 10b, the internal electrode 200b including the first internal electrode 201b and the second internal electrode 202b, the first via separation layer 231b, and the second via separation layer 232b may be the same as or similar to the capacitor 1 described above with reference to FIGS. 1 and 2, and thus repeated description is omitted.
[0087] In addition, the first connection via 221b and the second connection via 222b may be the same as or similar to the capacitor 1 described above with reference to FIGS. 1 and 2, or the capacitor 1a described above with reference to FIG. 12, except that they are connected to the external electrodes 31b and 32b through the connection layer 225, and thus repeated description is omitted.
[0088] In the capacitor 1b according to the third embodiment, the positions of the external electrodes 31b and 32b are adjusted to be separated from the positions of the upper ends of the connection vias 221b and 222b. Thereby, the positions of the connection vias 221b and 222b and the external electrodes 31b and 32b can be freely adjusted to more effectively reduce the ESR (Equivalent Serial Resistance).
[0089] FIG. 14 is a diagram showing a capacitor 1c according to the fourth embodiment, and FIG. 15 is a cross-sectional view taken along line B-B' of FIG. 14.
[0090] Referring to FIGS. 14 and 15, the capacitor 1c according to the fourth embodiment can include a substrate 10c, a body 20c, and an external electrode 30c.
[0091] The substrate 10c has a predetermined area. The substrate 10c is provided with an insulating material.
[0092] The body 20c is located on the upper surface of the substrate 10c. The body 20c includes an internal electrode 200c and a dielectric layer 210c. The body 20c can have a predetermined length along the length direction (L) of the substrate 10c. The body 20c can have a predetermined width along the width direction (W) of the substrate 10c. The body 20c can have a predetermined thickness along the vertical direction (T).
[0093] The internal electrode 200c can include a first internal electrode 201c and a second internal electrode 202c.
[0094] The first internal electrode 201c and the second internal electrode 202c are laminated and located on the upper surface of the substrate 10c. The first internal electrode 201c and the second internal electrode 202c can be laminated alternately. A dielectric layer 210c is disposed between the first internal electrode 201c and the second internal electrode 202c. The dielectric layer 210c can be disposed on the internal electrode 200c located on the uppermost side. Also, an insulating layer 240c is disposed on the dielectric layer 210c located on the uppermost side.
[0095] The external electrode 30c is connected to the internal electrode 200c in a partial region at an end in the length direction (L) of the body 20c or in a partial region at an end in the width direction (W) of the body 20c. That is, the external electrode 30c is positioned to cover the outer surface of the body 20c in a partial region at an end in the length direction (L) of the body 20c or in a partial region at an end in the width direction (W) of the body 20c. Thereby, the internal electrode 200c exposed on the outer surface of the body 20c is connected to the external electrode 30c. The external electrode 30c can cover a partial region of the upper surface of the body 20c.
[0096] The external electrode 30c includes a first external electrode 31c and a second external electrode 32c.
[0097] The first external electrode 31c is positioned to cover the outer surface of the body 20c and is connected to the first internal electrode 201c exposed on the outer surface of the body 20c. The first external electrode 31c is connected in a manner of directly contacting the first internal electrode 201c exposed on the outer surface of the body 20c.
[0098] A first electrode separation layer 231c is disposed between the first external electrode 31c and the second internal electrode 202c. That is, in a region facing the first external electrode 31c, the second internal electrode 202c can have a structure that enters in a direction opposite to that of the first external electrode 31c. And a first electrode separation layer 231c is disposed between the ends of the first external electrode 31c and the second internal electrode 202c. The first electrode separation layer 231c may be made of an insulating material.
[0099] The first external electrode 31c is connected to the first internal electrode 201c exposed on the outer surface in a partial region at an end in the length direction (L) of the body 20c or in a partial region at an end in the width direction (W) of the body 20c. The first external electrode 31c can cover a partial region of the upper surface of the body 20c.
[0100] The first external electrode 31c is located in a corner region where the length direction (L) end and the width direction (W) end of the body 20c are in contact, and is connected to the first internal electrode 201c exposed on the outer surface in a partial region of the length direction (L) end of the body 20c and a partial region of the width direction (W) end of the body 20c. The first external electrode 31c can cover a partial region of the upper surface of the body 20c in a corner region where the length direction (L) end and the width direction (W) end of the body 20c are in contact.
[0101] A plurality of the first external electrodes 31c are provided. Two of the first external electrodes 31c are provided. The two first external electrodes 31c can be arranged at intervals along the length direction (L) of the body 20c. Also, the two first external electrodes 31c can be arranged at intervals along the width direction (W) of the body 20c. Further, the two first external electrodes 31c can be arranged at intervals in a diagonal direction intersecting the length direction (L) and the width direction (W) of the body 20c.
[0102] The second external electrode 32c is positioned to cover the outer surface of the body 20c and is connected to the second internal electrode 202c exposed on the outer surface of the body 20c. The second external electrode 32c is connected in a manner of directly contacting the second internal electrode 202c exposed on the outer surface of the body 20c.
[0103] A second electrode separation layer 232c is arranged between the second external electrode 32c and the first internal electrode 201c. That is, in a region facing the second external electrode 32c, the first internal electrode 201c can have a structure that enters in a direction opposite to the second external electrode 32c. And a second electrode separation layer 232c is arranged between the ends of the second external electrode 32c and the first internal electrode 201c. The second electrode separation layer 232c may be made of an insulating material.
[0104] The second external electrode 32c is connected to the second internal electrode 202c exposed on the outer surface in a partial region of the length direction (L) end of the body 20c or a partial region of the width direction (W) end of the body 20c. The second external electrode 32c can cover a partial region of the upper surface of the body 20c.
[0105] The second external electrode 32c is located in a corner region where the end portion in the length direction (L) and the end portion in the width direction (W) of the body 20c are in contact, and is connected to the second internal electrode 202c exposed on the outer surface in a partial region of the end portion in the length direction (L) of the body 20c and a partial region of the end portion in the width direction (W) of the body 20c. The second external electrode 32c can cover a partial region of the upper surface of the body 20c in a corner region where the end portion in the length direction (L) and the end portion in the width direction (W) of the body 20c are in contact.
[0106] A plurality of second external electrodes 32c are provided. Two second external electrodes 32c are provided. The two second external electrodes 32c can be arranged at intervals along the length direction (L) of the body 20c. Also, the two second external electrodes 32c can be arranged at intervals along the width direction (W) of the body 20c. Further, the two second external electrodes 32c can be arranged at intervals in a diagonal direction intersecting the length direction (L) and the width direction (W) of the body 20c.
[0107] Also, an insulating layer 240c is arranged outside the region covered by the external electrode 30c on the outer surface of the body 20c.
[0108] FIGS. 16 to 20 are diagrams showing a manufacturing method according to an embodiment of the capacitor 1c according to the fourth embodiment.
[0109] Hereinafter, with reference to FIGS. 16 to 20, the manufacturing method of the capacitor 1c will be described.
[0110] Referring to FIG. 16, an internal electrode layer IE1c, IE2c, and a dielectric layer DLc for forming the body 20c are formed on the substrate Sc. Also, an insulating layer ILc can be formed on the uppermost part. Since the forming methods of the internal electrode layer IE1c, IE2c, the dielectric layer DLc, and the insulating layer ILc are the same as or similar to the methods described above with reference to FIG. 4, repeated description will be omitted.
[0111] Referring to FIG. 17, the internal electrode layers IE1c and IE2c and the dielectric layer DLc are cut to a size corresponding to one body 20c. An etching process can be used for the cutting. As the etching process, a dry etching process using plasma or the like can be used. Also, the cutting may be performed using a laser.
[0112] Referring to FIGS. 18 and 19, the first internal electrode 201c exposed to the outside is selectively etched to form a first separation groove G1c. The etching of the first internal electrode 201c can be formed by wet etching through chemicals or dry etching through plasma. Then, the first separation groove G1c is filled with an insulating material to form a first electrode separation layer 231c.
[0113] Also, the second internal electrode 202c exposed to the outside is selectively etched to form a second separation groove G2c. The etching of the second internal electrode 202c can be formed by wet etching through chemicals or dry etching through plasma. Then, the second separation groove G2c is filled with an insulating material to form a second electrode separation layer 232c.
[0114] Although the case where the first electrode separation layer 231c is formed first and the second electrode separation layer 232c is formed has been described, the second electrode separation layer 232c may be formed first and the first electrode separation layer 231c may be formed.
[0115] Referring to FIG. 20, an external electrode 30c is formed so as to cover the outer surface of the body 20c. For the formation of the external electrode 30c, chemical vapor deposition (CVD), atomic layer deposition (ALD), sputtering, or the like can be used. Also, the external electrode 30c can be formed by a plating process. Then, the substrate Sc is cut to a size corresponding to one capacitor 1c. The cutting process can be performed through a dicing process. The dicing process can be performed through a blade, a laser, or the like.
[0116] FIG. 21 is a view showing the capacitor 1d according to the fifth embodiment, FIG. 22 is a cross-sectional view taken along line C-C' of FIG. 21, and FIG. 23 is a cross-sectional view taken along line D-D' of FIG. 22.
[0117] Referring to FIGS. 21 to 23, the external electrode 30d is connected to the internal electrode 200d in a partial region at an end in the length direction (L) of the body 20d or in a partial region at an end in the width direction (W) of the body 20d. That is, the external electrode 30d is positioned so as to cover the outer surface of the body 20d in a partial region at an end in the length direction (L) of the body 20d or in a partial region at an end in the width direction (W) of the body 20d. Thereby, the internal electrode 200d exposed on the outer surface of the body 20d is connected to the external electrode 30d. Further, the external electrode 30d can cover a partial region of the upper surface of the body 20d.
[0118] The external electrode 30d includes a first external electrode 31d and a second external electrode 32d.
[0119] The first external electrode 31d is positioned so as to cover the outer surface of the body 20d and is connected to the first internal electrode 201d exposed on the outer surface of the body 20d. The first external electrode 31d is connected in a manner of directly contacting the first internal electrode 201d exposed on the outer surface of the body 20d. A first electrode separation layer 231d is disposed between the first external electrode 31d and the second internal electrode 202d.
[0120] Also, a region of the first external electrode 31d positioned to cover the upper surface of the body 20d is connected to the first connection via 221d. Thereby, the first external electrode 31d is connected to the first internal electrode 201d through the first connection via 221d. A first via separation layer 233d is disposed between the first connection via 221d and the second internal electrode 202d.
[0121] The second external electrode 32d is positioned to cover the outer surface of the body 20d and is connected to the second internal electrode 202d exposed on the outer surface of the body 20d. The second external electrode 32d is connected in such a way that it directly contacts the second internal electrode 202d exposed on the outer surface of the body 20d. A second electrode separation layer 232d is disposed between the second external electrode 32d and the first internal electrode 201d.
[0122] Also, a region of the second external electrode 32d positioned to cover the upper surface of the body 20d is connected to the second connection via 222e. Thereby, the second external electrode 32d is connected to the second internal electrode 202d through the second connection via 222e. A second via separation layer 224d is disposed between the second connection via 222e and the first internal electrode 201d.
[0123] Since the structure in which the external electrode 30d is connected to the internal electrode 200d on the outer surface of the body 20d can be the same as or similar to the capacitor 1c described above with reference to FIGS. 14 and 15, repeated description is omitted.
[0124] Also, since the structure in which the external electrode 30d is connected to the internal electrode 200d through the connection vias 221d, 222d can be the same as or similar to the capacitor 1 described above with reference to FIGS. 1 and 2, or the capacitor 1a described above with reference to FIG. 12, or the capacitor 1b described above with reference to FIG. 13, repeated description is omitted.
[0125] According to the capacitor 1d according to the fifth embodiment, current paths can be formed between the external electrode 30d and the internal electrode 225d in various paths. Thereby, the equivalent series resistance (ESR) can be effectively reduced by adjusting the path of the current path.
[0126] FIG. 24 is a plan view of a capacitor 1e according to a sixth embodiment.
[0127] Referring to FIG. 24, in the capacitor 1e according to the sixth embodiment, a plurality of first connection vias 221e and second connection vias 222e are disposed in the body 20e.
[0128] The first connection via 221e and the second connection via 222e can be arranged in the central region in the longitudinal direction (L) or the width direction (W) of the body 20e. Then, the first connection via 221e and the second connection via 222e can be alternately arranged at intervals along the width direction (W) or the longitudinal direction (L) of the body 20e. Two first connection vias 221e are provided. Two second connection vias 222e are provided.
[0129] The external electrodes 31e, 32e include a first external electrode 31e and a second external electrode 32e.
[0130] The first external electrode 31e is located on the upper surface of the body 20e. Two first external electrodes 31e are provided in the same manner as the first connection via 221e. The two first external electrodes 31e can be arranged at intervals along the longitudinal direction (L) of the body 20e. Also, the two first external electrodes 31e can be arranged at intervals along the width direction (W) of the body 20e. Thereby, the two first external electrodes 31e can be arranged at intervals in the diagonal direction intersecting the longitudinal direction (L) and the width direction (W) of the body 20e. The first external electrode 31e can be arranged adjacent to the corner where the longitudinal direction (L) end portion and the width direction (W) end portion of the body 20e are in contact.
[0131] The second external electrode 32e is located on the upper surface of the body 20e. Two second external electrodes 32e are provided in the same manner as the second connection via 222e. The two second external electrodes 32e can be arranged at intervals along the longitudinal direction (L) of the body 20e. Also, the two second external electrodes 32e can be arranged at intervals along the width direction (W) of the body 20e. Thereby, the two second external electrodes 32e can be arranged at intervals in the diagonal direction intersecting the longitudinal direction (L) and the width direction (W) of the body 20e. The second external electrode 32e can be arranged adjacent to the corner where the longitudinal direction (L) end portion and the width direction (W) end portion of the body 20e are in contact.
[0132] The connection vias 221e and 222e and the external electrodes 31e and 32e are connected to each other by connection layers 226e and 227e. The connection layers 226e and 227e are provided with a conductive material. The connection layers 226e and 227e may be a metallic material. The connection layers 226e and 227e include a first connection layer 226e and a second connection layer 227e.
[0133] The first connection layer 226e is located between the first connection via 221e and the first external electrode 31e so that the first connection via 221e and the first external electrode 31e are electrically connected to each other.
[0134] The second connection layer 227e is located between the second connection via 222e and the second external electrode 32e so that the second connection via 222e and the second external electrode 32e are electrically connected to each other.
[0135] Also, the first external electrode 31e is positioned to cover the outer surface of the body 20e and is connected to the first internal electrode on the outer surface of the body 20e.
[0136] Also, the second external electrode 32e is positioned to cover the outer surface of the body 20e and is connected to the second internal electrode on the outer surface of the body 20e.
[0137] Since the structure in which the external electrodes 31e and 32e and the connection vias 221e and 222e are connected by the connection layers 226e and 227e is the same as or similar to the capacitor 1b described above with reference to FIG. 13, a repeated description thereof will be omitted.
[0138] Since the structure in which the external electrodes 31e and 32e and the internal electrodes are connected on the side surface of the body 20e is the same as or similar to the capacitor 1c described above with reference to FIGS. 14 and 15, a repeated description thereof will be omitted.
[0139] FIG. 25 is a plan view of a capacitor 1f according to the seventh embodiment.
[0140] Referring to FIG. 26, the external electrodes 31f and 32f of the capacitor 1f according to the seventh embodiment include a first external electrode 31f and a second external electrode 32f.
[0141] The first external electrode 31f is located on the upper surface of the body 20f. Two first external electrodes 31f are provided. The two first external electrodes 31f can be arranged to be spaced apart from each other along the length direction (L) of the body 20f. Also, the two first external electrodes 31f can be arranged to be spaced apart from each other along the width direction (W) of the body 20f. Thereby, the two first external electrodes 31f can be arranged to be spaced apart from each other in a diagonal direction intersecting the length direction (L) and the width direction (W) of the body 20f. The first external electrode 31f can be arranged adjacent to the corner where the end portion in the length direction (L) and the end portion in the width direction (W) of the body 20f are in contact.
[0142] The second external electrode 32f is located on the upper surface of the body 20f. Two second external electrodes 32f are provided. The two second external electrodes 32f can be arranged to be spaced apart from each other along the length direction (L) of the body 20f. Also, the two second external electrodes 32f can be arranged to be spaced apart from each other along the width direction (W) of the body 20f. Thereby, the two second external electrodes 32f can be arranged to be spaced apart from each other in a diagonal direction intersecting the length direction (L) and the width direction (W) of the body 20f. The second external electrode 32f can be arranged adjacent to the corner where the end portion in the length direction (L) and the end portion in the width direction (W) of the body 20f are in contact.
[0143] A plurality of first connection vias 221f and second connection vias 222f are arranged in the body 20f for the capacitor 1f. The number of the first connection vias 221f may be larger than the number of the first external electrodes 31f. The number of the second connection vias 222f may be larger than the number of the second external electrodes 32f.
[0144] As an example, a part of the first connection via 221f and the second connection via 222f is arranged in the central region in the length direction (L) of the body 20f or the width direction (W) of the body 20f. Then, the first connection via 221f and the second connection via 222f are alternately arranged at intervals along the width direction (W) of the body 20f or the length direction (L) of the body 20f. Also, the rest of the first connection via 221f is arranged in the region between the first external electrode 31f and the second external electrode 32f. Further, the rest of the second connection via 222f is arranged in the region between the first external electrode 31f and the second external electrode 32f.
[0145] The connection vias 221f, 222f and the external electrodes 31f, 32f are connected to each other by the connection layers 226f, 227f. The connection layers 226f, 227f are provided with a conductive material. The connection layers 226f, 227f may be a metallic material. The connection layers 226f, 227f include a first connection layer 226f and a second connection layer 227f.
[0146] The first connection layer 226f is located between the first connection via 221f and the first external electrode 31f so that the first connection via 221f and the first external electrode 31f are electrically connected to each other. Thereby, the first external electrode 31f is connected to two or more first connection vias 221f.
[0147] The second connection layer 227f is located between the second connection via 222f and the second external electrode 32f so that the second connection via 222f and the second external electrode 32f are electrically connected to each other. Thereby, the second external electrode 32f is connected to two or more second connection vias 222.
[0148] Also, the first external electrode 31f is positioned to cover the outer surface of the body 20f and is connected to the first internal electrode on the outer surface of the body 20f.
[0149] Also, the second external electrode 32f is positioned to cover the outer surface of the body 20f and is connected to the second internal electrode on the outer surface of the body 20f.
[0150] The structure in which the external electrodes 31f and 32f and the connection vias 221f and 222f are connected by the connection layers 226f and 227f is the same as or similar to the capacitor 1b described above with reference to FIG. 13, and thus a repetitive description thereof will be omitted.
[0151] The structure in which the external electrodes 31f and 32f and the internal electrode are connected on the side surface of the body 20f is the same as or similar to the capacitor 1c described above with reference to FIGS. 14 and 15, and thus a repetitive description thereof will be omitted.
[0152] Although the embodiments of the present invention have been described in detail above, the scope of rights of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention defined in the following claims also belong to the scope of rights of the present invention.
Explanation of Reference Numerals
[0153] 10: Substrate 20: Body 30: External electrode 31: First external electrode 32: Second external electrode 200: Internal electrode 201: First internal electrode 202: Second internal electrode 210: Dielectric layer 221: First connection via 222: Second connection via 231: First via separation layer 232: Second via separation layer
Claims
1. A body including a first internal electrode and a second internal electrode laminated with a dielectric layer interposed therebetween; A first external electrode positioned to cover the upper surface and the outer surface of the body and connected to the first internal electrode through the upper surface and the outer surface of the body; A second external electrode positioned to cover the upper surface and the outer surface of the body and connected to the second internal electrode through the upper surface and the outer surface of the body; A capacitor including the above.
2. A first connection via positioned inside the body and connecting the first internal electrode and the first external electrode; A second connection via positioned inside the body and connecting the second internal electrode and the second external electrode, the capacitor according to Claim 1, further including the above.
3. The capacitor according to Claim 2, further including a first via isolation layer positioned between the first connection via and the second internal electrode.
4. The capacitor according to Claim 2, further including a second via isolation layer positioned between the second connection via and the first internal electrode.
5. The first external electrode contacts the first connection via; The second external electrode contacts the second connection via, the capacitor according to Claim 2.
6. A first connection layer connecting the first external electrode and the first connection via; A second connection layer connecting the second external electrode and the second connection via, the capacitor according to Claim 2, further including the above.
7. The capacitor according to Claim 6, wherein the first connection layer and the second connection layer are positioned on the dielectric layer located at the uppermost side among the dielectric layers.
8. The capacitor according to Claim 6, wherein the number of the first connection vias is larger than the number of the first external electrodes.
9. The capacitor according to Claim 6, wherein the number of the second connection vias is larger than the number of the second external electrodes.
10. The capacitor according to Claim 1, wherein each of the first external electrode and the second external electrode is positioned adjacent to a corner where the longitudinal end and the widthwise end of the body are in contact.
11. The capacitor according to Claim 1, wherein two of each of the first external electrode and the second external electrode are provided.
12. The first external electrode is connected to a part of the first internal electrode exposed on the outer surface of the body; The capacitor according to claim 1, wherein the second external electrode is connected to a part of the second internal electrode exposed on the outer surface of the body.
13. A first electrode separation layer positioned between the first external electrode and the second internal electrode; The capacitor according to claim 12, further comprising a second electrode separation layer positioned between the second external electrode and the first internal electrode.
14. A substrate; A body positioned on the substrate, including a first internal electrode and a second internal electrode laminated with a dielectric layer interposed therebetween; A first external electrode positioned to cover the upper surface and the outer surface of the body and connected to the first internal electrode; A capacitor, comprising a second external electrode positioned to cover the upper surface and the outer surface of the body and connected to the second internal electrode.
15. The first external electrode is connected to a part of the first internal electrode exposed on the outer surface of the body; The capacitor according to claim 14, wherein the second external electrode is connected to a part of the second internal electrode exposed on the outer surface of the body.
16. The capacitor according to claim 14, wherein each of the first external electrode and the second external electrode is positioned adjacent to a corner where the longitudinal end and the widthwise end of the body are in contact.
17. The capacitor according to claim 16, wherein two of each of the first external electrode and the second external electrode are provided.
18. A substrate; A body positioned on the upper surface of the substrate, including a first internal electrode and a second internal electrode laminated with a dielectric layer interposed therebetween; Two first external electrodes positioned spaced apart from each other on the upper surface of the body and connected to the first internal electrode; A capacitor, comprising two second external electrodes positioned spaced apart from each other on the upper surface of the body and connected to the second internal electrode.
19. A first connection via positioned inside the body and connected to the first internal electrode; The capacitor according to claim 18, further comprising a second connection via positioned inside the body and connected to the second internal electrode.
20. A part of the first external electrode covers the outer surface of the body and is connected to a part of the first internal electrode exposed on the outer surface of the body; The capacitor according to claim 18, wherein a part of the second external electrode covers the outer surface of the body and is connected to a part of the second internal electrode exposed on the outer surface of the body.