Card equipped with contactless interface and method for manufacturing card equipped with contactless interface

Abstract

To provide a card equipped with a contactless interface, and a method for manufacturing a card equipped with a contactless interface.SOLUTION: The present invention relates to a card equipped with a contactless interface. The card has an activation device, a microprocessor, and an antenna. The activation device has first and second conductive components and a spacer. The microprocessor and the antenna are each connected to the first conductive component or the second conductive component. A cavity of the card has a normal state and a deformed state, and at least part of the cavity is configured to separate the first component from the second component in the normal state. When a force external to the activation device is applied to the activation device to move the first component towards the second component, the cavity transitions from the normal state to the deformed state, and part of the first conductive component is configured to enter the cavity, thus forming an electrical contact with the second conductive component.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention generally relates to the field of cards having non-contact functions, and more particularly to cards with non-contact interfaces and methods for manufacturing such cards.

Background Art

[0002] Chip cards function as data storage devices for various applications, particularly for access control, payment, and identification. Each chip card incorporates an integrated circuit (hereinafter "IC") that enables the card to store and process data. This IC has a microcontroller or a similar processor and memory.

[0003] There are various types of chip cards, particularly cards with only a non-contact interface, cards with only a contact interface, and dual-interface cards having both contact and non-contact functions.

[0004] A widely recognized concern regarding non-contact communication is the risk that an unauthorized person may use a scanner-type device to illegally obtain personal information about the cardholder from the card.

[0005] There are various patents and products aimed at addressing this problem. As an example, (Patent Document 1) describes a non-contact card having a switch. Once activated, this switch forms an open circuit within the card's antenna, deactivating the non-contact function of the card. FIG. 1 shows this antenna.

[0006] However, this approach has several drawbacks. This approach requires the use of a switch that is normally in a closed state, which is robust and can effectively form a short circuit within the antenna once closed, and may require a local energy source to open and close the switch. This can lead to a complex and bulky design.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

Summary of the Invention

[0008] The present invention aims to overcome the aforementioned drawbacks of the existing technology. Unless otherwise indicated, in this document, the term "or" is understood to mean "and / or".

[0009] According to a first aspect, the present invention relates to a card having a non-contact interface. The card has a microprocessor, an antenna, and an activation device.

[0010] The card can be either a non-contact card or a dual interface card. Examples of cards that can be mentioned are, in particular, payment cards (such as credit cards and debit cards), mobile passes (used in public transport systems), access passes (such as library cards and electronic toll cards used in highway and bridge toll systems), and EMV cards (an abbreviation for "Europay, Mastercard, and Visa").

[0011] The non-contact interface of the card can be integrated with one or more communication technologies, particularly, but not limited to, radiofrequency identification (hereinafter "RFID"), Wireless Fidelity (hereinafter "Wi-Fi"), Bluetooth low energy technology (hereinafter "BLE"), Zigbee, and Z-Wave.

[0012] The expression "RFID compatible card" is understood in this document to mean any card that communicates by radio frequency technology. It can be an RFID card or a near-field communication (hereinafter "NFC") card.

[0013] The contactless interface can be adapted to any version of the communication protocol associated with the aforementioned technologies. As an example, in the case of an NFC card, it can be compatible with any version of the ISO / IEC 14443, 15693, or 18092 standards. In the case of a Wi-Fi compatible card, it can function with any version of the IEEE 802.11 standard.

[0014] As an example, the expression "activation device" is understood in this document to be a device configured to act as a switch between a microprocessor and an antenna. More specifically, this device is configured to activate the contactless function of the card when an external force as described below is applied, and to deactivate the contactless function when the external force is removed. This device has a spacer, a first conductive component, and a second conductive component.

[0015] The expression "conductive component" is understood in this document to mean an electronic component composed of one or more conductive materials and capable of conducting electricity in a closed circuit. The conductive component can have (some) contact pads, and / or (some) conductive tracks, and / or (some) connection wires, and / or (some) electrodes.

[0016] In addition, the expression "connected" or the term "connection" is understood in this document to be a connection such as wired, wireless, direct, indirect (e.g., via one or more intermediate connections) that enables an electric current to flow between two electrical components.

[0017] The spacer is in contact with the periphery of the second conductive component. The spacer is configured to form the sidewalls of a deformable cavity within the activation device. The second conductive component is configured to form at least a portion of either the upper or lower surface of the cavity.

[0018] The "periphery" of the conductive component is, in this case, defined by the contour of the conductive component.

[0019] The expression "sidewalls of the cavity" is understood in this document to mean the sidewalls of the cavity whose vertical dimension defines the height of the cavity in the thickness direction of the card (i.e., the direction from the top to the bottom of the card). The second conductive component can be substantially parallel to the upper or lower surface of the card.

[0020] The cavity has a normal state and a deformed state. At least a portion of the cavity is configured to separate the first conductive component from the second conductive component when the cavity occupies the normal state. The two components can face each other.

[0021] When an external force is applied to the activation device (typically, a user's finger applies pressure on the card) to move the first conductive component towards the second conductive component, the cavity is configured to transition from the normal state to the deformed state, and at least one portion of the first conductive component is configured to enter the cavity. When the cavity occupies the deformed state, the first conductive component and the second conductive component are in electrical contact with each other to establish an electrical connection between the microprocessor and the antenna.

[0022] Furthermore, when the external force is removed (typically, when the user's finger stops applying pressure on the card), the cavity is configured to return to the normal state, thereby moving the first conductive component away from the second conductive component to interrupt the electrical connection. As an example, the spacer is elastic and thereby acts like a spring.

[0023] More specifically, the microprocessor and the antenna are each connected to the first conductive component or to the second conductive component. As an example, the microprocessor is connected to one of the two conductive components and the antenna is connected to the other. In a variant, the first conductive component has two conductive sub-components that are electrically insulated when the cavity occupies its normal state, one sub-component being connected to the microprocessor and the other to the antenna. When the cavity occupies its deformed state and the first and second conductive components are in contact, the second conductive component is configured to form an electrical bridge between the two sub-components.

[0024] The expression "when the external force is no longer applied" is understood to mean the exact instant when the force is no longer applied, or any instant or duration after the instant when the force is no longer applied to the activation device of the card.

[0025] As an example, before a force is applied to the activation device, the cavity occupies its normal state and has a first form. When an external force is applied, the cavity undergoes a deformation and ends by assuming a second form. Subsequently, after the external force is removed, the cavity ends by returning to the same form as the first form or a form slightly different therefrom.

[0026] In this regard, the activation device is normally in an open state, ensuring that the microprocessor remains in an inactive state as long as the user does not apply a force to the card.

[0027] The fact that a spacer configured to form the side walls of the cavity is in contact with the periphery of the second conductive component makes the activation device compact.

[0028] Compared to previous designs, the configuration described above results in a simplified structure, is easy to manufacture, reduces manufacturing costs, does not take up much space, and provides higher stability and reliability.

[0029] By providing a card with the spacer in contact with the periphery of the second conductive component, it becomes possible to increase, for example, the surface area of the second conductive component that is in contact with the first conductive component when the cavity deforms.

[0030] This enables better deformation of the cavity.

[0031] In a practical application of this invention, a user applies pressure on an activation device, thereby bringing the first and second conductive components into contact with each other. This establishes an electrical connection between the microprocessor and the antenna, thereby enabling energy to be transmitted from the antenna to the microprocessor and activating the contactless function of the card. When the user releases the activation device (e.g., by removing a finger), the first conductive component moves away from the second conductive component, thereby breaking the connection and deactivating the contactless function.

[0032] In certain examples compatible with other examples in this document, the activation device further has a non-conductive layer configured to carry the first conductive component. This can ensure better protection of the first conductive component against damage.

[0033] In addition, the non-conductive layer and the second conductive component can be respectively disposed on opposite surfaces of the cavity, thereby incorporating the first conductive component into the cavity. The distance between the first conductive component and the second conductive component improves the reliability of the activation device.

[0034] The spacer does not necessarily need to extend across the entire area of the cavity. The spacer covers the outer surface of the second conductive component, more specifically the surface that is not in contact with the first conductive component when the cavity occupies its deformed state, thereby protecting the second conductive component against environmental factors and making the cavity more airtight. Preferably, the spacer can be provided in an annular shape. The spacer can be sandwiched between the second conductive component and the non-conductive layer, or while the main part of the spacer connects the second conductive component and the non-conductive layer, its ends can extend to cover the outer edges of the second conductive component and the non-conductive layer.

[0035] In another specific embodiment compatible with any other examples in this document, the card includes an adhesive. This adhesive can prevent the establishment of electrical contact between the first conductive component and the second conductive component when adhered to the inner surface of the first conductive component or the second conductive component (i.e., the surface that is in contact with the first conductive component when the cavity occupies its deformed state). To overcome this problem, the cavity is made airtight, the first conductive component is encapsulated within the cavity, and the spacer or the non-conductive layer is composed of one or more materials that are impermeable to the adhesive in its liquid or solid state.

[0036] With this configuration of the activation device, corrosion or deterioration of the first and second conductive components due to contaminants, chemical products, salts, moisture, adhesives, etc. can be prevented.

[0037] As an example, the card includes an adhesive, a resin, or a plastic film in contact with the activation device. The adhesive, resin, or plastic film can include or be composed of at least one element of alkyd, acrylic, epoxy, polyester, phenol, polycarbonate, polyamide, polyimide, polyurethane, silicon, polyethylene, polystyrene, polypropylene, vinyl ester, methacrylate, cyanoacrylate, or polyvinyl acetate.

[0038] Thus, in order to prevent adhesives, resins, or plastic films from entering the cavity, the spacer or non-conductive layer is composed of (some) materials that are impermeable to adhesives, resins, or plastic films in their liquid or solid states. The cavity can be made airtight by the non-conductive layer, the spacer, and the second conductive component.

[0039] In yet another specific example that is compatible with any other example in this document, each of one or more elements of the activation device is deformable and has a normal state and a deformed state. The element includes a spacer or a non-conductive layer. The cavity is configured to occupy its normal state when the element occupies its (their) normal state and to occupy its deformed state when the element occupies its (their) deformed state.

[0040] In yet another specific example that is compatible with any other example in this document, the spacer is deformable and is configured to be compressed (e.g., the thickness measured in the operating direction of the external force is reduced) when transitioning from its normal state to its deformed state. This enables the user to more easily manage the activation and deactivation of the non-contact or wireless communication function of the card, while at the same time also simplifying the structure of the card.

[0041] In yet another specific example that is compatible with any other example in this document, the non-conductive layer is deformable and is configured to deform in the operating direction of the external force when a force is applied to the activation device. The non-conductive layer can be substantially parallel to the upper or lower surface of the card in its normal state. This configuration ensures that the card remains flat in the absence of an external force, thereby making it more convenient to carry and providing better protection against damage.

[0042] In yet another specific example that is compatible with any other example in this document, at least one portion of one or more deformable elements of the activating device is elastic. At least one portion of (some) deformable elements is configured to deform when an external force is applied to the activating device and, when the external force ceases, to contribute to moving the first conductive component away from the second conductive component.

[0043] As an example, when an external force is applied to the activating device, at least one portion of (some) deformable elements of the activating device is deformed, thereby bringing the first and second conductive components into contact with each other and forming an electrical bridge. When the application of the force ceases, the deformable element returns to its (their) initial shape, at least in part due to the elasticity of at least one portion. During this process, the potential energy stored in at least one portion is released, thereby moving the first conductive component away from the second conductive component and breaking the electrical bridge.

[0044] As an example, a portion of a spacer or a portion of a non-conductive layer may incorporate a spring-like structure or may be composed of an elastic material such as natural rubber, silicone rubber, silicon, polyvinyl chloride (hereinafter "PVC"), polystyrene, polyethylene, neoprene, a dielectric gel, or a dielectric rubber.

[0045] In yet another specific example that is compatible with any other example in this document, the cavity is made airtight and filled with a gas. The gas is configured to contribute to moving the first conductive component away from the second conductive component when the external force ceases, thereby generating a spring effect.

[0046] The gas is non-corrosive, non-sticky, and may exhibit dielectric or electrical insulating properties. As an example, the gas may be pure air or an inert gas such as nitrogen, helium, and sulfur hexafluoride.

[0047] In yet another specific example that is compatible with any other example in this document, when the cavity occupies its normal state, the thickness of the activation device is greater than or substantially equal to the thickness of the antenna. This can ensure a sufficient distance between the first conductive component and the second conductive component without increasing the size of the card in other ways.

[0048] More specifically, when the antenna has a variable thickness across different segments, the thickness of the activation device can be equal to the maximum thickness of the antenna.

[0049] Furthermore, the antenna can be an inductive antenna. When the deformable cavity occupies its normal state, the thickness of the activation device can be substantially equal to the thickness of the coil of the antenna.

[0050] In yet another specific example that is compatible with any other example in this document, the non-conductive layer is composed of polyvinyl chloride (hereinafter "PVC") and / or G10 and / or FR4 and / or polyamide and / or polyimide.

[0051] In yet another specific example that is compatible with any other example in this document, the spacer is composed of one or more materials such as, in particular, elastomers, dielectric rubbers, or dielectric gels. More specifically, the dielectric gel or dielectric rubber can be used as a gel component in the spacer and can be encapsulated in a protective shell composed of an elastomeric material or plastic material such as polyimide plastic or urethane plastic.

[0052] As an example, the spacer can be composed of silicone rubber or urethane rubber in the form of a gel or a solid. The elastomer can be soft and thin. The elastomer can have a Shore 00 hardness of 00 to 35.

[0053] In yet another specific example that is compatible with any other example in this document, the card further has a metal layer including the activation device. This can make the manufacturing process of the metal card easier.

[0054] More specifically, the card may have a metallic card body that defines a cavity. The cavity has a continuous surface defined by the inner surface of the metallic card body. The antenna is housed inside the cavity. The activation device is configured to be disposed within a zone at least partially surrounded by the coil of the antenna.

[0055] In yet another specific example that is compatible with any other example in this document, the activation device may be continuous within the antenna. More specifically, for easier manufacturing processes of the card, one and the other may be pre-assembled to form a single module.

[0056] In yet another specific example that is compatible with any other example in this document, to improve the stability and reliability of the activation device, the spacer is a dielectric or an electrical insulator.

[0057] In yet another specific example that is compatible with any other example in this document, the spacer covers at least a part of one or more surfaces of the first conductive component. Thereby, the first conductive component can be protected from the environment.

[0058] Furthermore, the spacer may be in close contact with one or more surfaces of the first conductive component.

[0059] In yet another specific example that is compatible with any other example in this document, the spacer can, of course, function as an adhesive due to its surface tension.

[0060] In yet another specific example that is compatible with any other example in this document, at least one part of the spacer is sandwiched between a non-conductive layer and a second conductive component. The thickness of this at least one part of the spacer thus creates a cavity that can become a gas pocket.

[0061] In yet another specific example that is compatible with any other example in this document, the activation device has the following structure.

[0062] The spacer has an internal through-hole, the side walls of which form the side walls of the cavity. The second conductive component and the non-conductive layer carrying the first conductive component are at / near the opposite ends of the through-hole. The second conductive component at least partially forms at least one of the lower and upper surfaces of the cavity, and the non-conductive layer at least partially forms at least the other of the lower and upper surfaces of the cavity. Further, the spacer adheres to the second conductive component and the non-conductive layer, or to the (some) side surfaces of the first conductive component, thereby making the cavity airtight, and preventing the inner surfaces of the first conductive component and the second conductive component from being exposed to the adhesive that is present within the card and used when the card is manufactured.

[0063] In yet another specific example that is compatible with any other example in this document, the first conductive component has two conductive tracks, one electrically connected to the microprocessor and the other to the antenna. When the cavity occupies its normal state, the two conductive tracks are electrically insulated from each other. When the cavity occupies its deformed state and the first conductive component is in contact with the second conductive component, the second conductive component is configured to form an electrical bridge for connecting the two conductive tracks of the first conductive component.

[0064] As an example, each of the two tracks has a main base and a protrusion extending from the main base. The protrusion of one of the two tracks is inserted between the protrusions of the other of the two tracks. This particular structure can disperse the mechanical stress applied on the first conductive component, thereby minimizing the risk of breakage. The protrusion can be of an elongated shape and can be fixed to the non-conductive layer. In addition, by printed circuit board (hereinafter "PCB") technology, the tracks can be printed on the non-conductive layer, thereby making the electrical connection more reliable and making the activation device more compact. Further, the PCB and the antenna can be formed as a pre-assembled module, thereby rationalizing the manufacturing process. As an example, to ensure a reliable electrical connection, the distance separating adjacent protrusions can be fixed at twice the thickness of the track. The thickness of the track is determined based on the required power specifications.

[0065] In yet another specific example compatible with any other example in this document, the card includes a casing. The activation device is configured to be received within a cavity in the casing or formed within the cavity. As is well known to those skilled in the art, the casing has individual layers including an embedded electronic device that can include an antenna and further include a microprocessor. These layers are fused together under pressure and heat during a lamination process, thereby forming a sheet or a durable single support. A metal layer can be present within the casing.

[0066] According to a second aspect, the present invention presents a method of manufacturing a card according to the first aspect. The method includes a manufacturing process of an activation device. This process includes a step of forming a cavity, which includes a step of applying one or more materials configured as spacers around a second conductive component.

[0067] In a specific example compatible with any other example in this document, the step of forming a cavity further includes a step of applying one or more materials to one or more sides of a first conductive component or around a non-conductive layer.

[0068] The spacer can have various layers composed of various materials, stacked in the direction from the first conductive component to the second conductive component, so as to increase the distance between the two conductive components when the cavity occupies its normal state. By way of example, the spacer can be composed of a dielectric gel layer and a polyimide layer, and these layers are stacked vertically.

[0069] In another specific example that is compatible with any other example in this document, the method further includes the step of applying a layer of adhesive, resin, or plastic film to the upper and lower surfaces of the activated device.

[0070] In yet another specific example that is compatible with any other example in this document, the method further includes the step of inserting the activated device into a cavity defined by a metal layer. The cavity extends through the upper and lower surfaces of the metal layer, thereby forming a through-hole. The step of applying a layer of adhesive, resin, or plastic film to the upper and lower surfaces of the activated device includes the step of applying these layers to the respective upper and lower surfaces of the layers.

[0071] In yet another specific example that is compatible with any other example in this document, the method further includes a pre-assembly step of installing an antenna coil around the activated device. The first conductive component is connected to the antenna coil.

[0072] In that sense, the pre-assembly of the various elements of the activated device and the antenna before insertion into the card does not change the established card manufacturing process.

[0073] Hereinafter, embodiments of the present invention and their advantages will be described in detail by way of example with reference to the accompanying schematic drawings.

Brief Description of the Drawings

[0074]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5a

Figure 5b

Figure 5c

Figure 6

Modes for Carrying Out the Invention

[0075] Hereinafter, various aspects of the present invention will be described by explaining specific embodiments.

[0076] FIG. 2 shows an example of a card with a non-contact interface according to a first embodiment of the present invention. The card can be a dual-interface credit card.

[0077] The card has a covering including a metallic card body 4 defining a cavity and an inductive antenna 7 housed within the cavity. The card further includes a chip module (not shown). The cavity has a continuous surface defined by the inner surface of the metallic card body 4 and extends through the upper and lower surfaces of the metallic card body 4.

[0078] The metal card body 4 can be made of stainless steel or any other type of metal. The cavity can be chemically etched within the metal card body 4. The card further comprises an upper cover layer 1, an upper decorative layer 2, an upper polymer layer (not shown), and an upper adhesive layer 3 that form a series of layers stacked on the coating. Additionally, the card comprises a lower adhesive layer 10, a lower polymer layer (not shown), a lower decorative layer 11, and a lower cover layer 12 that form a series of layers stacked under the coating.

[0079] The upper decorative layer 2 and the lower decorative layer 11 may have patterns such as logos or identification information regarding the card issuer or cardholder. The upper cover layer 1 and the lower cover layer 12 are protective layers, and the lower cover layer 12 may include a magnetic strip for sliding the card through a reading device such as a payment terminal. Further, the cover layer 1 and the cover layer 12, as well as the decorative layer 2 and the decorative layer 11, may be layers made of a plastic material, particularly a layer made of PVC or polyvinyl chloride acetate ("PVCA"), but are not limited thereto. The upper and lower polymer layers may be made of PVC or an epoxy-based compound. The upper adhesive layer 3 and the lower adhesive layer 10 may be made of a resin or other adhesive. The resin may be a curable resin, and may be a resin containing an ester group, an acetal resin, a casting resin, an impregnating resin, an unsaturated resin, a saturated resin, a urethane acrylate, a silicone acrylate, an epoxy acrylate, a methacrylate, an acrylate, or a urethane, but is not limited thereto. The polymer layer and the adhesive layer may be completely transparent or partially transparent.

[0080] The card further comprises an activation device housed inside the cavity and surrounded by the coil of the antenna 7. The activation device includes, from top to bottom, a deformable non-conductive disk 5, a matrix 6 of conductive tracks adhered to the non-conductive disk 5 (i.e., the first conductive component), a deformable spacer 8 adhered to the non-conductive disk 5 and to a conductive disk 9 facing the non-conductive disk 5 and sandwiched therebetween, and the conductive disk 9 (i.e., the second conductive component). The deformable spacer 8 having an annular shape, together with the non-conductive disk 5 and the conductive disk 9, forms an airtight cavity containing a fluid (preferably air).

[0081] The spacer 8 and the non-conductive disk 5 occupy their normal states when no external force is applied to exert pressure on the non-conductive disk 5, and begin to deform when an external force starts to exert pressure on the non-conductive disk 5. When the spacer 8 and the non-conductive disk 5 occupy their normal states, the matrix 6 of conductive tracks and the conductive disk 9 are separated. The conductive disk 9 can be in contact with and attached to the antenna 7. The thickness of the activation device is equal to the thickness of the antenna 7 in the normal states of the spacer 8 and the non-conductive disk 5. The non-conductive disk 5 is made of polyimide, the conductive disk 9 and the antenna 7 are made of the same material, and the matrix 6 of conductive tracks is made of copper.

[0082] Specific regions in each of the upper cover layer 1, the upper decorative layer 2, and the upper polymer layer corresponding to the arrangement of the activation device within the casing are made of one or more deformable materials. This region can be indicated by text, graphic elements, or a unique three-dimensional shape in the upper cover layer 1 and / or the upper decorative layer 2. For example, the upper cover layer 1 can have a protruding region corresponding to the position of the activation device. This protruding region can be pressed by the user to compress the spacer 8 in the activation device and press the non-conductive disk 5.

[0083] The chip module can be of any type. The chip module typically comprises a chip, a substrate, and external contact pads stacked in order from bottom to top. The chip comprises a microprocessor and a memory storage unit and is configured for storing and retrieving data, encryption, and authentication, and also for other functions necessary for data transfer and authentication. The external contact pads are exposed to the external environment and enable an interface with a card reader.

[0084] As can be surmised, when no pressure is applied on the activation device, the circuit connection between the microprocessor and antenna 7 is interrupted, but one end of the microprocessor and one end of antenna 7 remain permanently physically connected, whereby, as soon as pressure is applied on the activation device, rapid re - establishment of the connection becomes possible. The connection between one end of the microprocessor and one end of antenna 7 can follow any established practice. By way of example, one end of the microprocessor present in the chip is connected to one end of the antenna 7 of the card via a connection point (also called a pad) on the substrate.

[0085] In addition, the microprocessor within the chip, and the matrix of conductive tracks 6a, are electrically connected to another connection point on the substrate, for example by a wire or by a track passing through a via formed through the non - conductive disk 5. The antenna 7 and the matrix of conductive tracks 6b can also be electrically connected in a similar manner. To rationalize the manufacturing process, the substrate can form a non - conductive hub for the antenna.

[0086] Figure 3 is a schematic diagram of the circuit of the above - mentioned card according to the first embodiment, where the connection points on the substrate are shown in the form of contact pads 100 and 200.

[0087] The card can function in both a contact mode and a non-contact mode. In the contact mode, the card communicates with the reader via the exposed contact pads of the chip module. Once the card is inserted into the card reader, these contact pads physically contact the corresponding contacts within the reader. The reader supplies a voltage to one of these contact pads, thereby powering the chip.

[0088] In contrast, in the non-contact mode, the card communicates with the non-contact reader via RF waves. When the card is placed in the vicinity of the reader, the RF electric field radiated from the reader induces a voltage within the antenna 7. As shown in Figure 3, by turning on the activation device 300, a current is generated from the antenna 7 to the microprocessor PR, thereby activating the non-contact function. Otherwise, the non-contact function will be deactivated.

[0089] An example of the matrix 6 of conductive tracks is shown in Figure 4. In this example, the matrix 6 of conductive tracks includes two separate and distinct conductive tracks 6a and 6b. Each of the two tracks 6a and 6b has a main base and an elongated protrusion extending from the main base. The protrusion of one of the two tracks is inserted between the protrusions of the other of the two tracks. As shown in Figure 4, the protrusions of the two tracks 6a and 6b are aligned in a straight line without physically contacting each other. The main base of track 6a is configured to be connected to the microprocessor, and the main base of track 6b is configured to be connected to the antenna 7 (not shown).

[0090] Figures 5a and 5b are schematic cross-sectional views of the activation device 300 when the spacer 8 occupies the normal state and the deformed state, respectively. Figure 5c is an example of a bottom view of the activation device.

[0091] In the first embodiment, the spacer 8 separates the non-conductive disk 5 from the conductive disk 9. More specifically, as shown in FIGS. 2 and 5a-5c, the spacer 8 has a through-hole, the side wall of which forms the side wall of the cavity, and the non-conductive disk 5 and the conductive disk 9 are disposed at opposite ends of the through-hole so as to form the upper and lower surfaces of the cavity, respectively. The cavity is made airtight by the non-conductive disk 5, the spacer 8, and the conductive disk 9. As shown in FIGS. 5a and 5b, air is trapped within the cavity (air pocket 400).

[0092] The matrix 6 of conductive tracks is incorporated within the cavity, the upper surface of which is fixed by and covered by the lower surface of the non-conductive disk 5. More specifically, the matrix 6 of conductive tracks is printed on the non-conductive disk 5 by PCB technology.

[0093] The spacer 8 and the non-conductive disk 5 are composed of one or more non-adhesive deformable materials that are dielectric or electrically insulating. The one or more materials are impermeable to the adhesive layer. The one or more materials can be elastic (e.g., dielectric silicone rubber for the spacer) or have low elasticity (e.g., dielectric gel for the spacer). FIG. 5c shows a bottom view of an activated device according to an example. The spacer 8 has a layer of dielectric gel. The annulus of the spacer 8 is clearly visible in FIG. 5c. In FIG. 5c, pressure is applied on the activated device, and a part of the button is visible from below on the side opposite to the side where the pressure is applied.

[0094] Examples of the material of the non-conductive layer 5 include those composed of FR4, G10, polyimide, and polyamide.

[0095] When the user presses on the deformable area on the upper cover layer 1 corresponding to the position of the activation device, the force is transmitted to the activation device, thereby causing the matrix 6 of conductive tracks to penetrate into the cavity. In the example shown in Figure 5b, this force ends by bringing one of the elongated protrusions of track 6a and one of the elongated protrusions of track 6b into electrical contact with the conductive disk 9, thereby forming an electrical bridge between the two tracks 6a and 6b. Accordingly, the microprocessor and the antenna 7 are electrically connected. As shown in Figure 5b, this force also causes deformation of the spacer 8 and the non-conductive disk 5, as well as redistribution or compression of the air within the cavity.

[0096] As soon as the user stops applying pressure, the air returns to its initial position within the cavity, thereby causing the spacer 8 and the non-conductive disk 5 to reverse and the matrix 6 of conductive tracks to move away from the conductive disk 9.

[0097] If the spacer and / or the non-conductive disk 5 are elastic, this elasticity will also cause them / it to return to their initial form and move the matrix 6 of conductive tracks away from the conductive disk 9.

[0098] The matrix 6 of conductive tracks can be composed of copper, gold, or tin and can have a thickness of at least 10 μm in order to avoid weakening of the radio frequency communication function of the card.

[0099] Examples of the thicknesses of the other layers of the card are as follows.

[0100] The upper cover layer 1 is about 45 - 60 μm, the upper decorative layer 2 is about 127 - 145 μm, the combined thickness of the upper adhesive layer 3 and the upper polymer layer is about 30 - 40 μm, the metal layer 4 is about 330 μm, the non - conductive disk 5 is about 75 μm, the antenna 7 is about 300 μm, the conductive disk 9 is about 100 - 120 μm, the combined thickness of the lower adhesive layer 10 and the lower polymer layer is about 40 - 50 μm, the lower decorative layer 11 is about 127 - 145 μm, and the lower cover layer 12 is about 45 - 60 μm.

[0101] In FIG. 2, the first and second conductive components are shown in the form of round disks 5 and 9, but the first and second conductive components can take other forms. For reliability and simplicity, they can be provided in the same form and the same size. In this particular example, the activation device operates like a button. When the user presses the button, the contactless function of the card is activated. When the user releases the button, the contactless function is deactivated.

[0102] FIG. 6 shows the flow of an example of a method for manufacturing a card according to a second embodiment of the present invention.

[0103] In step S601, a dielectric gel is applied around the non - conductive disk 5 and around the conductive disk 9 to form an airtight cavity between the two disks 5 and 9. The non - conductive disk 5 is pre - manufactured, and at the end of its pre - manufacturing process, a matrix 6 of conductive tracks is already fixed. One of the tracks 6a and 6b is already connected to the antenna 7, and the other track is already connected to the microprocessor. Similarly, the conductive disk 9 is also pre - manufactured.

[0104] More specifically, the dielectric gel adheres to the sides of the tracks 6a, 6b, and a spacer 8 is sandwiched between the non - conductive disk 5 and the conductive disk 9 to form a sandwich structure. Due to the thickness of the dielectric gel, an air pocket is formed that separates the tracks 6a, 6b from the conductive disk 9 when no pressure is applied on the activation device.

[0105] In step S602, an adhesive is applied to the lower polymer layer disposed on the table of the adhesive applicator.

[0106] In step S603, the metal card body 4 is disposed on the lower adhesive layer 10 formed at the end of step S602, the activation device and the antenna 7 are inserted into the metal card body, and the activation device is surrounded by the coil of the antenna 7.

[0107] In step S604, an adhesive is applied to the upper surface of the metal card body 4 and the components inserted therein.

[0108] In step S605, the upper polymer layer is disposed on the upper adhesive layer 3 formed at the end of step S604.

[0109] In steps S602 to S605, a part of the pre-lamination stage is formed. A secondary pre-lamination stage may follow. In step S606, the upper decorative layer 2 and the upper cover layer 1 are disposed on the upper polymer layer, and the lower cover layer 12 and the lower decorative layer 11 are disposed under the lower polymer layer.

[0110] In step S607, varnish is added to the upper and lower surfaces of the layer.

[0111] In step S608, a chip module is incorporated into the card.

[0112] In step S609, the card undergoes a quality control test to ensure that it is customized, operates correctly, and is secure.

[0113] For further details of the manufacturing process, reference may be made to (Patent Document 2) incorporated herein by reference.

Explanation of Reference Numerals

[0114] 1 Upper cover layer 2 Upper decorative layer 3 Upper adhesive layer 4 Metal card body 5 Non-conductive disk 6 Matrix of conductive tracks 6a, 6b Conductive tracks 7 Antenna 8 Spacer 9 Conductive disk 10 Lower adhesive layer 11 Lower decorative layer 12 Lower cover layer 100 Contact pad 300 Activation device 400 Air pocket PR Microprocessor

Claims

1. A card having a non-contact interface, comprising an activation device, a microprocessor, and an antenna (7), wherein the activation device includes a first conductive component (6), a second conductive component (9), a spacer (8) in contact with the periphery of the second conductive component (9), and includes the microprocessor and the antenna (7) are respectively connected to the first conductive component (6) or the second conductive component (9), the spacer (8) is configured to form a side wall of a deformable cavity in the activation device, and the second conductive component (9) is configured to form at least a part of either the upper surface or the lower surface of the cavity, the cavity has a normal state and a deformed state, and at least a part of the cavity is configured to separate the first conductive component (6) from the second conductive component (9) when the cavity is in the normal state, when an external force is applied to the activation device to move the first component (6) towards the second component (9), the cavity is configured to transition from the normal state to the deformed state, and at least one part of the first conductive component (6) is configured to enter the cavity, whereby when the cavity is in the deformed state, an electrical contact with the second conductive component (9) is formed to establish an electrical connection between the microprocessor and the antenna (7), when the external force is no longer applied, the cavity is configured to return to its normal state, thereby moving the first conductive component (6) away from the second conductive component (9) to interrupt the electrical connection. A card.

2. The card according to claim 1, wherein the activation device further includes a non-conductive layer (5) for holding the first conductive component (6).

3. The non-conductive layer (5) and the second conductive component (9) are respectively disposed on opposite surfaces of the cavity, or The non-conductive layer (5) is composed of FR4 and / or G10 and / or polyimide and / or polyamide. The card according to claim 2.

4. Further comprising an adhesive, wherein the first conductive component (6) is encapsulated within the cavity, the cavity is made airtight, and the spacer (8) is made of one or more materials that are impermeable to the adhesive. The card according to claim 1.

5. At least one element of the activation device is deformable and has a normal state and a deformed state. The at least one element includes the spacer (8) or a non-conductive layer (5) configured to carry the first conductive component (6). The cavity is configured to occupy its normal state when the at least one element occupies its normal state, and is configured to occupy its deformed state when the at least one element occupies its deformed state. The card according to claim 1.

6. At least one part of the at least one element is elastic, deforms when an external force is applied to the activation device, and contributes to moving the first conductive component (6) away from the second conductive component (9) when the external force ceases. The card according to claim 5, or The cavity is made airtight and filled with a gas, and the gas is configured to contribute to moving the first conductive component (6) away from the second conductive component (9) when the external force ceases. The card according to claim 1.

7. - When the cavity occupies its normal state, the thickness of the activation device is greater than or equal to the thickness of the antenna (7). - The spacer (8) is made of one or more materials including an elastomer or a dielectric gel. The card according to claim 1.

8. The card comprises a metal layer (4) including the activation device, or the activation device is present within the antenna (7). The card according to claim 1.

9. - The spacer (8) is a dielectric or an electrical insulator, or - At least one part of the spacer (8) is sandwiched between the second conductive component (9) and the non-conductive layer (5) carrying the first conductive component (6), or - The spacer (8) covers at least a part of one or more surfaces of the first conductive component (6). The card according to claim 1.

10. The first conductive component (6) has two conductive tracks (6a, 6b), one being electrically connected to the microprocessor and the other being electrically connected to the antenna (7), and when the cavity occupies its normal state, the two conductive tracks (6a, 6b) are electrically insulated from each other. The card according to claim 1.

11. The card according to claim 1, wherein the card is compatible with radio frequency identification "RFID".

12. Including the manufacturing process of the activation device, the process The method for manufacturing a card according to claim 1, including the step of forming the cavity by applying one or more materials of which the spacer (8) is composed around the second conductive component (9).

13. The step of forming the cavity The method according to claim 12, further including the step of applying the one or more materials on one or more sides of the first conductive component (6) or around the non-conductive layer (5) carrying the first conductive component (6).

14. The method according to claim 12 or 13, further including the step of applying a layer (3, 10) of adhesive resin or plastic film on the upper and lower surfaces of the activation device.

15. The step of inserting the activation device into a cavity defined by a metal layer, the cavity extending through the upper and lower surfaces of the metal layer, and the step of applying a layer of adhesive resin or plastic film on the upper and lower surfaces of the activation device The method according to claim 14, including the step of applying a layer of adhesive resin or plastic film on each of the upper and lower surfaces of the metal layer.

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