Laminated type electronic component

Abstract

To provide a laminated type electronic component which can prevent short circuit failures even when cracks occur, and is excellent in electric characteristics such as electrostatic capacitance.SOLUTION: A laminated electronic component includes: a body including a dielectric layer, and first and second internal electrodes which are alternately arranged across the dielectric layer in a first direction; a first external electrode which is connected to the first internal electrode, is arranged on a third surface and extends to the upper part of the first surface and the second surface; and a second external electrode which is connected to the second internal electrode, is arranged on a fourth surface, and extends to the upper part of the first surface and the second surface, wherein the body includes a superposed region that is superposed on the second internal electrode to which the first internal electrode is adjacent across the dielectric layer in the first direction, the central part in the first direction of the superposed region has a length in a second direction longer than both ends in the first direction of the superposed region, a crack extending to the inside of the body exists on at least one tip side of the first and second external electrodes in the body, and the crack is separated from the superposed region.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as video equipment like liquid crystal display (LCD) devices and plasma display panel (PDP) devices, computers, smartphones, and mobile phones, and serves to charge or discharge electricity. Such an MLCC can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount.

[0003] Recently, MLCCs are used not only in conventional IT devices such as smartphones and notebook computers but also in electrical equipment and industrialized products such as electric vehicles and autonomous driving, and the demand for high-voltage, high-reliability MLCCs is increasing. In order to ensure the reliability of MLCCs, it is necessary to improve the bending strength of MLCCs.

[0004] An MLCC is mainly composed of a main body and external electrodes arranged on the main body. When bending stress acts on an MLCC, the stress tends to concentrate on the tip side of the external electrode, and as a result, cracks may occur from the tip side of the external electrode toward the inside of the main body.

[0005] When such cracks propagate to the overlapping region of the main body where internal electrodes of different polarities are alternately arranged, there is a possibility of a short circuit in the MLCC. To solve the above problems, a solution of reducing the number of stacked internal electrodes or reducing the size of the overlapping region can be considered. However, if the number of stacked internal electrodes or the size of the overlapping region is reduced, the capacitance and DC-bias characteristics of the MLCC may decrease.

[0006] Therefore, while preventing cracks from propagating into the overlapping region of the main body and causing a short circuit in the MLCC, there is a need for research on MLCCs with excellent electrical characteristics such as capacitance and DC-bias.

Summary of the Invention

Problems to be Solved by the Invention

[0007] One of the various objects of the present invention is to provide a multilayer electronic component capable of preventing a short-circuit defect even when cracks occur.

[0008] One of the various objects of the present invention is to provide a multilayer electronic component having excellent electrical characteristics such as capacitance.

[0009] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0010] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body including a dielectric layer and first and second internal electrodes alternately arranged in the first direction with the dielectric layer therebetween, a first external electrode connected to the first internal electrode, disposed on the third surface, and extending over a part of the first surface and the second surface, and a second external electrode connected to the second internal electrode, disposed on the fourth surface, and extending over a part of the first surface and the second surface. The main body includes an overlapping region where the second internal electrode adjacent to the first internal electrode overlaps the first internal electrode in the first direction with the dielectric layer therebetween. The central portion of the overlapping region in the first direction is longer in the second direction than both end portions of the overlapping region in the first direction. There is a crack extending inside the main body on the tip side of at least one of the first and second external electrodes. The crack provides a multilayer electronic component spaced apart from the overlapping region.

Advantages of the Invention

[0011] As one of various advantages of the present invention, it is possible to provide a multilayer electronic component capable of preventing a short circuit failure even when a crack occurs.

[0012] As one of various advantages of the present invention, it is possible to provide a multilayer electronic component excellent in electrical characteristics such as capacitance.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited by the illustrations. Also, components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0016] In the drawings, the first direction can be defined as the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0017] Multilayer electronic component FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut section along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut section along the line II-II' of FIG. 1, FIG. 4 is an enlarged view of the A region of FIG. 1, and FIG. 5 is a cross-sectional view schematically showing a ceramic laminate for manufacturing the multilayer electronic component shown in FIG. 2.

[0018] Hereinafter, with reference to FIGS. 1 to 5, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Also, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto and can also be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention can include a main body 110 including a dielectric layer 111 and internal electrodes 121, 122, and external electrodes 131, 132.

[0020] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process and the polishing of the edge portions, the main body 110 is not in the shape of a hexahedron with perfect straight lines, but can have a substantially hexahedron shape.

[0021] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first surface and the second surface 1, 2, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction and connected to the first surface to the fourth surface 1, 2, 3, 4.

[0022] The main body 110 can include a dielectric layer 111 and internal electrodes 121, 122 alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0023] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-soluted in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0024] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0025] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0026] The first internal electrode 121 is spaced apart from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 is spaced apart from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4 side.

[0027] The conductive metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably can contain Ni, but the present invention is not limited thereto.

[0028] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0029] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively mean the average thicknesses of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, after measuring the thicknesses at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, the average thickness td of the dielectric layer 111 can be measured by taking the average value. Also, after measuring the thicknesses at a number of points of one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, the average thickness te of the internal electrodes 121 and 122 can be measured by taking the average value. The 30 points at equal intervals can be specified in the overlapping region 110a. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0030] The main body 110 can include an overlapping region 110a that overlaps in the first direction with the second internal electrode 122 adjacent to the first internal electrode 121 with the dielectric layer 111 in between, a first margin region 110b disposed between the overlapping region 110a and the third surface 3 where the second internal electrode 122 is not disposed, and a second margin region 110c disposed between the overlapping region 110a and the fourth surface 4 where the first internal electrode 121 is not disposed.

[0031] The main body 110 can include a first cover portion 112 and a second cover portion 113 that are respectively disposed on both surfaces facing each other in the first direction of the overlapping region 110a. The first cover portion 112 can be continuously disposed on one surface in the first direction of the overlapping region 110a, one surface in the first direction of the first margin region 110b, and one surface in the first direction of the second margin region 110c. The second cover portion 113 can be continuously disposed on the other surface in the first direction of the overlapping region 110a, one surface in the first direction of the first margin region 110b, and the other surface in the first direction of the second margin region 110c. The cover portions 112, 113 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress. The cover portions 112, 113 can have a configuration similar to that of the dielectric layer 111 except that they do not include internal electrodes.

[0032] The average thickness of the cover portions 112, 113 is not particularly limited. The average thickness of the cover portions 112, 113 can be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112, 113 can be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness of the cover portions 112, 113 means the average thickness of each of the first cover portion 112 and the second cover portion 113. The average thickness of the cover portions 112, 113 can mean the average thickness in the first direction of the cover portions 112, 113, and can be a value obtained by averaging the thicknesses in the first direction measured at five points at equal intervals in the second direction in the cross-sections in the first and second directions of the main body 110.

[0033] The main body 110 can include a first margin portion 114 and a second margin portion 115 that are respectively disposed on both surfaces facing each other in the third direction of the overlapping region 110a. The first margin portion 114 can be continuously disposed on one surface in the third direction of the overlapping region 110a, one surface in the third direction of the first margin region 110b, and one surface in the third direction of the second margin region 110c. The second margin portion 115 can be continuously disposed on the other surface in the third direction of the overlapping region 110a, the other surface in the third direction of the first margin region 110b, and the other surface in the third direction of the second margin region 110c. The margin portions 114, 115 can mean the regions between the interfaces of both ends of the internal electrodes 121, 122 and the main body 110 in the cross section obtained by cutting the main body 110 in the first direction and the third direction. The margin portions 114, 115 can have a configuration similar to that of the dielectric layer 111, except that they do not include the internal electrodes 121, 122.

[0034] The average thickness of the margin portions 114, 115 is not particularly limited. The average thickness of the margin portions 114, 115 can be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness of the margin portions 114, 115 can be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tm of the margin portions 114, 115 means the average thickness of each of the first margin portion 114 and the second margin portion 115. The average thickness of the margin portions 114, 115 can mean the average thickness in the third direction of the margin portions 114, 115, and can be a value obtained by averaging the thicknesses in the third direction measured at five equally spaced points in the first direction in the cross section of the main body 110 in the first direction and the third direction.

[0035] The external electrodes 131 and 132 are connected to the first internal electrode 121, are disposed on the third surface 3, and are connected to the first external electrode 131 and the second internal electrode 122 that extend on a part of the first surface and the second surface 1 and 2, and can include the second external electrode 132 that is disposed on the fourth surface 4 and extends on a part of the first surface and the second surface 1 and 2. The first external electrode 131 can be disposed on the third surface 3 and extend on a part of each of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6, and the second external electrode 132 can be disposed on the fourth surface 4 and extend on a part of each of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6.

[0036] The type and form of the external electrode are not particularly limited, and it can also have a multilayer structure. For example, the external electrode can include an underlying electrode layer that contacts the internal electrodes 121 and 122 and a plating layer disposed on the underlying electrode layer.

[0037] The underlying electrode layer can be a sintered electrode containing metal and glass. The metal contained in the underlying electrode layer can include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy containing the same, but the present invention is not limited thereto. The glass contained in the underlying electrode layer can include one or more oxides of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0038] On the other hand, the underlying electrode layer can be composed of only the first layer containing metal and glass, but the present invention is not limited thereto, and the underlying electrode layer can have a multilayer structure. For example, the underlying electrode layer can include the first layer containing metal and glass and the second layer disposed on the first layer and containing metal and resin.

[0039] The metal contained in the second layer can include one or more of spherical particles and flaky particles. Here, the spherical particles can include forms that are not perfectly spherical, for example, forms with a length ratio of the major axis to the minor axis (major axis / minor axis) of 1.45 or less. The flaky particles mean powders having a flat and elongated form, and are not particularly limited, but for example, the length ratio of the major axis to the minor axis (major axis / minor axis) can be 1.95 or more. The metal contained in the second layer can include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or an alloy containing the same. The resin contained in the second layer can include, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose.

[0040] The plating layer can improve mounting characteristics. The plating layer can include, for example, Ni, Sn, Pd, and / or an alloy containing the same, and can also be formed from multiple layers. The plating layer can be, for example, a Ni plating layer or a Sn plating layer, or can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed. Further, the plating layer can also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0041] In the drawings, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but it is not limited thereto, and the number and shape of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0042] When a bending stress acts on the multilayer electronic component 100, the stress can be concentrated on the tip sides 131a and 132a of the external electrodes. As a result, there may be a crack CR extending from at least one of the tip sides of the first and second external electrodes 131 and 132 into the interior of the main body 110. The crack CR can extend from the tip side 131a of the first external electrode through the first margin region 110b to the third surface 3 side, or can extend from the tip side 132a of the second external electrode through the second margin region 110c to the fourth surface 4 side. The presence of such a crack CR in the main body 110 is presumably due to a stress acting to pull outward the region of the main body 110 with which the tip sides 131a and 132a of the external electrodes are in contact. On the other hand, the propagation path of the crack CR can vary depending on the density of the medium. For example, the inclination of at least a part of the section CL2 of the crack CR that penetrates the dielectric layer with respect to the second direction can be steeper than the inclination of the section CL1 of the crack CR that penetrates the first or second internal electrode with respect to the second direction.

[0043] According to an embodiment of the present invention, the central portion of the overlapping region 110a in the first direction can be longer in the second direction than both end portions of the overlapping region 110a in the first direction. For example, the central portions of the margin regions 110b and 110c in the first direction can be shorter in the second direction than both end portions of the margin regions 110b and 110c in the first direction. Since the central portion of the overlapping region 110a in the first direction is longer in the second direction than both end portions of the overlapping region 110a in the first direction, even if a crack CR exists in the main body 110, the crack CR can be separated from the overlapping region 110a.

[0044] FIG. 10 is a cross-sectional view schematically showing a state in which a crack has occurred in a conventional multilayer electronic component, and is a drawing corresponding to FIG. 2. Referring to FIG. 10, the main body 10 of the conventional multilayer electronic component includes an overlapping region 10a in which the first internal electrode 21 overlaps with the second internal electrode 22 adjacent thereto with the dielectric layer 11 interposed therebetween. Generally, the length of the overlapping region 10a in the second direction is constant at the central portion and both end portions of the overlapping region 10a in the first direction.

[0045] In the conventional case, when a crack CR propagates from the tips of the external electrodes 31 and 32 into the interior of the main body 10, there was a problem that a short - circuit failure occurred as the crack CR penetrated the overlapping region 10a. To solve such a problem, a plan can be considered to reduce the length of the overlapping region 10a in the second direction as a whole so that the crack CR does not extend into the overlapping region 10a. However, the more the length of the overlapping region 10a in the second direction is reduced, the more likely it is that the capacitance and DC - bias characteristics of the multilayer electronic component will deteriorate as a side effect.

[0046] On the other hand, the multilayer electronic component 100 according to an embodiment of the present invention has a structure in which the length of the central portion of the overlapping region 110a far from the crack CR in the first direction is longer in the second direction than the lengths of both ends of the overlapping region 110a close to the crack CR in the first direction. By doing so, it is possible to prevent the crack CR from propagating into the overlapping region 110a, and while preventing the occurrence of a short - circuit failure, the capacitance and DC - bias characteristics of the multilayer electronic component 100 can be improved compared to the case where the length of the overlapping region 110a in the second direction is reduced as a whole.

[0047] On the other hand, for the overlapping region 110a, it is only necessary that the length of the central portion in the first direction is longer in the second direction than both ends in the first direction, and the specific shape of the overlapping region 110a is not particularly limited. For example, the length of the overlapping region 110a in the second direction can gradually decrease toward both ends of the overlapping region 110a in the first direction at the central portion of the overlapping region 110a in the first direction. For example, the length in the second direction in which the first external electrode 131 and the second internal electrode 122 are separated can gradually increase toward both ends of the overlapping region 110a in the first direction at the central portion of the overlapping region 110a in the first direction, and the length in the second direction in which the second external electrode 132 and the first internal electrode 121 are separated can gradually increase toward both ends of the overlapping region 110a in the first direction at the central portion of the overlapping region 110a in the first direction. Thereby, while preventing the occurrence of a short - circuit failure, the improvement effect of the capacitance and DC - bias characteristics of the present invention can be made more remarkable.

[0048] On the other hand, the distance in the second direction between the overlapping region 110a and the crack CR can gradually increase from both ends of the overlapping region 110a in the first direction toward the center of the overlapping region 110a in the first direction, but the present invention is not limited thereto.

[0049] Referring to FIGS. 2 and 4, in one embodiment, in the cross section of the main body 110 in the first direction and the second direction, the distance LE in the second direction between the third surface and the tip of the first external electrode can be longer than the distance LM in the second direction between the third surface and the second internal electrode disposed on the outermost side in the first direction. That is, LE>LM can be satisfied.

[0050] Cracks CR propagating from the tip sides 131a and 132a of the external electrodes into the main body 110 are more likely to occur as a high voltage is applied to the multilayer electronic component 100. In order to prevent the crack CR from extending into the overlapping region 110a and causing a short-circuit failure, if the above LE is made shorter than LM, there may be a problem that the bending strength of the high-voltage electronic component cannot be ensured.

[0051] That is, when the crack CR extending from the tip sides 131a and 132a of the external electrodes into the main body 110 satisfies LE>LM while being separated from the overlapping region 110a, it is possible to prevent a short circuit from occurring in the high-voltage electronic component and ensure a bending strength equal to or higher than a certain level.

[0052] In one embodiment, among the first surface and the second surface 1 and 2, when the distance in the first direction between the cracked surface where a crack exists on the tip 131a side of the first external electrode and the second internal electrode 122 arranged on the outermost side in the first direction is TM, the straight line CL connecting one end and the other end of the crack CR, and the angle formed by the cracked surface is θ, LM > LE - TM × tan(90° - θ) can be satisfied. In FIGS. 3 and 4, the cracked surface can be the second surface. One end of the crack CR existing on the tip 131a side of the first external electrode can be located on the second surface, and the other end can be located on the third surface 3. When LM > LE - TM × tan(90° - θ) is satisfied, the occurrence of short-circuit defects in the high-voltage laminated electronic component can be prevented, and a bending strength of a certain level or higher can be ensured. The above θ can be, for example, 60° or more and 70° or less.

[0053] When LM > LE - TM × tan(90° - θ) is satisfied, the above LM is not particularly limited. However, when the length of the main body in the second direction is LB, the ratio (LM / LB) of LM to LB can be 0.05 or more and 0.4 or less.

[0054] Also, the above TM is not particularly limited. However, as the above TM increases, the effect that the thickness of the cover portion increases occurs, and the probability that a crack CR occurs in the laminated electronic component 100 becomes low. Even if a crack CR occurs, it can be prevented from extending into the overlapping region 110a. However, as the above TM increases, the volume of the overlapping region 110a decreases in the total volume of the main body 1100, and the capacitance of the laminated electronic component 100 may decrease. On the other hand, in the present invention, since the central portion of the overlapping region 110a in the first direction is longer in the second direction than both end portions of the overlapping region 110a in the first direction, even if the ratio (TM / TB) of the above TM to the thickness TB of the main body 110 in the first direction is 0.3 or less, the occurrence of short-circuit defects in the laminated electronic component can be prevented, and at the same time, a bending strength and a capacitance of a certain level or higher can be ensured. The lower limit of the ratio (TM / TB) of TM to TB is not particularly limited, but it can be 0.05 or more.

[0055] In one embodiment, the main body 110 may include a first dummy electrode 123 that is disposed at a distance from the second internal electrode 122 in a second direction and is connected to the first external electrode 131, and a second dummy electrode 124 that is disposed at a distance from the first internal electrode 121 in the second direction and is connected to the second external electrode 132. The first dummy electrode 123 can be disposed substantially on the same plane as the second internal electrode 122, and the second dummy electrode 124 can be disposed substantially on the same plane as the first internal electrode 121.

[0056] By appropriately forming the dummy electrodes 123 and 124 on the main body 110, a laminated electronic component according to an embodiment of the present invention can be manufactured without increasing the types of internal electrode patterns printed on a ceramic green sheet described later.

[0057] In one embodiment, the length of the first dummy electrode 123 in the second direction measured at the central portion of the overlapping region 110a in the first direction can be shorter than the length of the first dummy electrode 123 in the second direction measured at both ends of the overlapping region 110a in the first direction. Also, the length of the second dummy electrode 124 in the second direction measured at the central portion of the overlapping region 110a in the first direction can be shorter than the length of the second dummy electrode 124 in the second direction measured at both ends of the overlapping region 110a in the first direction.

[0058] For example, the length of the first dummy electrode 123 in the second direction can increase from the center of the main body 110 in the first direction toward the outside of the main body 110 in the first direction, and the length of the second dummy electrode 124 in the second direction can increase from the center of the main body 110 in the first direction toward the outside of the main body 110 in the first direction.

[0059] In one embodiment, when the distance in the second direction between the second internal electrode 122 disposed on the outermost side in the first direction and the first dummy electrode 123 disposed on the outermost side in the first direction is defined as LD, the ratio of LD to LM (LD / LM) can be 0.3 or more. If LD / LM is less than 0.3, there is a risk that the second internal electrode 122 and the first dummy electrode 123 will come into contact and a short circuit failure will occur. The upper limit of LD / LM is not particularly limited, but can be 0.8 or less.

[0060] Hereinafter, with reference to FIG. 5, an example of a method for forming a multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0061] First, ceramic powder for forming ceramic green sheets 211a and 211b is prepared. The ceramic powder can be, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1). BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide and a barium raw material such as barium carbonate. Examples of the synthesis method of the ceramic powder include a solid phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and then the ceramic slurry is applied and dried on a carrier film to provide ceramic green sheets 211a and 211b.

[0062] Next, conductive pastes for internal electrodes containing metal powder, binder, organic solvent, etc. with a predetermined thickness are printed on the ceramic green sheets 211a and 211b using a screen printing method or a gravure printing method to form internal electrode patterns 221 and 222. More specifically, a plurality of first internal electrode patterns 221 are formed on the first ceramic green sheet 211a, and a plurality of second internal electrode patterns 222 are formed on the second ceramic green sheet 211b.

[0063] After that, the ceramic green sheets 211a and 211b on which the internal electrode patterns 221 and 222 are printed are peeled off from the carrier film. Next, the first ceramic green sheet 211a and the second ceramic green sheet 211b are alternately laminated by a predetermined number of layers and then pressure-bonded to form the ceramic laminate 200 shown in FIG. 5. On the upper and lower portions of the ceramic laminate 200, ceramic green sheets on which no internal electrode patterns are formed can be laminated by a predetermined number of layers in order to form cover portions 112 and 113 after firing. After that, the ceramic laminate 200 is cut along the cutting line C1 so as to have a predetermined chip size, and the cut chips can be fired at a temperature of 1000°C or higher and 1400°C or lower to form the main body 110. At this time, the length D1 by which the tip of the first internal electrode pattern is offset with reference to the cutting line C1 is made longer toward both ends in the first direction of the ceramic laminate 200 at the central portion in the first direction of the ceramic laminate 200. Also, the length D2 by which the tip of the second internal electrode pattern is offset with reference to the cutting line C1 is made longer toward both ends in the first direction of the ceramic laminate 200 at the central portion in the first direction of the ceramic laminate 200. Thereby, the length in the second direction of the central portion in the first direction of the overlapping region 110a after firing can be made longer than that of both ends in the first direction of the overlapping region 110a.

[0064] On the one hand, the margin portions 114 and 115 can be formed by applying and firing a conductive paste for an internal electrode except where the margin portion is formed on the ceramic green sheet. Alternatively, in order to suppress the step due to the internal electrodes 121 and 122, after cutting the ceramic laminate so that the internal electrode patterns are exposed on both surfaces in the third direction of the cut chip, the margin portion forming sheet is adhered onto both surfaces in the third direction of the cut chip and then fired to form the margin portions 114 and 115.

[0065] Thereafter, the main body 110 is dipped in a conductive paste containing metal powder, glass frit, binder, organic solvent, etc., and then the conductive paste is fired to form a base electrode layer. When the base electrode layer includes a first layer containing metal and glass and a second layer containing metal and resin, the second layer can be formed by dipping it in a conductive resin composition containing metal powder, resin, binder, organic solvent, etc. on the first layer and then performing a curing heat treatment at a temperature of 250°C to 550°C. Next, the laminated electronic component 100 can be manufactured by forming a plating layer using an electrolytic plating method and / or an electroless plating method.

[0066] On the other hand, a crack CR extending from the tip side of the external electrode into the main body 110 can be formed due to the bending stress applied to the laminated electronic component 100. However, since the central portion in the first direction of the overlapping region 110a is longer in the second direction than both end portions in the first direction of the overlapping region 110a, the crack CR can be separated from the overlapping region 110a.

[0067] However, the above-described manufacturing method is an example, and the manufacturing method of the laminated electronic component 100 is not limited to the above-described manufacturing method.

[0068] FIG. 6 is a cross-sectional view schematically showing a multilayer electronic component 100' according to another embodiment of the present invention, and is a drawing corresponding to FIG. 2. FIG. 7 is a cross-sectional view schematically showing a ceramic laminate 200' for manufacturing the multilayer electronic component 100' shown in FIG. 6, and is a drawing corresponding to FIG. 5.

[0069] Hereinafter, with reference to FIGS. 6 and 7, a multilayer electronic component 100' according to another embodiment of the present invention and a ceramic laminate 200' for manufacturing the multilayer electronic component 100' will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100 and the ceramic laminate 200 described in FIGS. 1 to 5, and redundant descriptions are omitted.

[0070] Referring to FIG. 6, the length of the overlapping region 110a' in the second direction can be decreased stepwise toward both ends in the first direction of the overlapping region 110a' at the central portion in the first direction of the overlapping region 110a'.

[0071] The multilayer electronic component 100' according to an embodiment of the present invention has a structure in which the length of the overlapping region 110a' in the second direction decreases stepwise toward both ends in the first direction of the overlapping region 110a' at the central portion in the first direction of the overlapping region 110a'. Thus, the crack CR does not propagate inside the overlapping region 110a', and while preventing the occurrence of a short-circuit defect, the capacitance and DC-bias characteristics of the multilayer electronic component 100' can be improved as compared with the case where the length of the overlapping region 110a' in the second direction is decreased as a whole.

[0072] Referring to FIG. 7, in the ceramic laminate 200' for manufacturing the multilayer electronic component 100', the length D1' by which the tip of the first internal electrode pattern is offset with reference to the cutting line C1 increases stepwise toward both ends of the ceramic laminate 200' in the first direction at the central portion of the ceramic laminate 200' in the first direction. Also, the length D2' by which the tip of the second internal electrode pattern is offset with reference to the cutting line C1 increases stepwise toward both ends of the ceramic laminate 200' in the first direction at the central portion of the ceramic laminate 200' in the first direction. Thereby, the length of the overlapping region 110a' in the second direction after firing can be formed to decrease stepwise toward both ends of the overlapping region 110a' in the first direction at the central portion of the overlapping region 110a' in the first direction. However, the above-described manufacturing method is an example, and the manufacturing method of the multilayer electronic component 100' is not limited to the above-described manufacturing method.

[0073] FIG. 8 is a cross-sectional view schematically showing a multilayer electronic component 100'' according to another embodiment of the present invention, and is a drawing corresponding to FIG. 2. FIG. 9 is a cross-sectional view schematically showing a ceramic laminate 200'' for manufacturing the multilayer electronic component 100'' shown in FIG. 8, and is a drawing corresponding to FIG. 5.

[0074] Hereinafter, with reference to FIGS. 8 and 9, a multilayer electronic component 100'' according to another embodiment of the present invention and a ceramic laminate 200'' for manufacturing the multilayer electronic component 100'' will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100 and the ceramic laminate 200 described with reference to FIGS. 1 to 5, and the overlapping description will be omitted.

[0075] Referring to FIG. 8, the overlapping region 110a'' can include a first region R1 disposed at the central portion of the overlapping region 110a'' in the first direction and having a substantially constant length in the second direction, and second regions R2, R3 in which the length in the second direction gradually decreases toward both ends of the overlapping region 110a'' in the first direction. Here, the fact that the length of the first region R1 in the second direction is substantially constant can mean that it is constant enough for a person with ordinary knowledge to be convinced that it is constant, and can mean that it is the same including process errors, position deviations, and measurement errors occurring in the manufacturing process.

[0076] The stacked electronic component 100'' according to an embodiment of the present invention includes second regions R2, R3 in which the length of the overlapping region 110a'' in the second direction gradually decreases toward both ends of the overlapping region 110a'' in the first direction, so that a crack CR does not propagate inside the overlapping region 110a'', and while preventing a short circuit failure from occurring, compared with the case where the length of the overlapping region 110a'' in the second direction is reduced as a whole, the capacitance and DC-bias characteristics of the stacked electronic component 100'' can be improved.

[0077] Referring to FIG. 9, in the ceramic laminate 200'' for manufacturing the stacked electronic component 100'', the length D1'' by which the tip of the first internal electrode pattern is offset with reference to the cutting line C1 gradually increases toward both ends of the ceramic laminate 200'' in the first direction at the central portion of the ceramic laminate 200'' in the first direction, but the length D1'' by which the tip of the first internal electrode pattern is offset has a region where it is substantially constant at the central portion of the ceramic laminate 200'' in the first direction. Also, the length D2'' by which the tip of the second internal electrode pattern is offset with reference to the cutting line C1 gradually increases toward both ends of the ceramic laminate 200'' in the first direction at the central portion of the ceramic laminate 200'' in the first direction, but the length D2'' by which the tip of the second internal electrode pattern is offset has a region where it is substantially constant at the central portion of the ceramic laminate 200'' in the first direction.

[0078] As a result, the overlapping region 110a'' can include a first region R1 that is disposed at the center of the overlapping region 110a'' in the first direction and has a substantially constant length in the second direction, and second regions R2 and R3 whose length in the second direction gradually decreases toward both ends of the overlapping region 110a'' in the first direction in the first region R1. However, the above-described manufacturing method is an example, and the manufacturing method of the stacked electronic component 100'' is not limited to the above-described manufacturing method.

[0079] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and this can also be said to belong to the scope of the present invention.

[0080] Also, the expression "one embodiment" does not mean the same embodiment as each other, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being realized in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0081] Furthermore, expressions such as first and second are used to distinguish one component from another component, and do not limit the order and / or importance of the corresponding components. In some cases, without departing from the scope of the rights, the first component can also be named the second component, and similarly, the second component can be named the first component.

Description of Reference Numerals

[0082] 100, 100', 100'' Stacked electronic components 110 body 110a, 110a', 110a'' overlapping regions 110b, 110c margin regions 111 dielectric layer 112, 113 cover parts 114, 115 margin parts 121, 122 internal electrodes 123, 124 dummy electrodes 131, 132 external electrodes 200, 200', 200'' ceramic laminate 211a, 211b ceramic green sheet 221, 222 internal electrode patterns CR crack R1 first region R2, R3 second region

Claims

1. A main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other in a third direction, and including a dielectric layer and first and second internal electrodes alternately arranged in the first direction with the dielectric layer therebetween; a first external electrode connected to the first internal electrode and disposed on the third surface and extending over a part of the first surface and the second surface; a second external electrode connected to the second internal electrode and disposed on the fourth surface and extending over a part of the first surface and the second surface; the main body includes an overlapping region where the first internal electrode overlaps with the second internal electrode adjacent thereto with the dielectric layer therebetween in the first direction; a central portion of the overlapping region in the first direction is longer in the second direction than both end portions of the overlapping region in the first direction; a crack extending from a tip side of at least one of the first and second external electrodes into the main body is present in the main body, and the crack is separated from the overlapping region, a multilayer electronic component.

2. the main body includes a first margin region disposed between the overlapping region and the third surface and where the second internal electrode is not disposed, and a second margin region disposed between the overlapping region and the fourth surface and where the first internal electrode is not disposed; the crack extends from the tip side of the first external electrode through the first margin region to the third surface side or extends from the tip side of the second external electrode through the second margin region to the fourth surface side, the multilayer electronic component according to claim 1.

3. in a cross section of the main body in the first direction and the second direction, when a distance in the second direction between the third surface and the second internal electrode disposed on the outermost side in the first direction is LM, and a distance in the second direction between the third surface and the tip of the first external electrode is LE, LE > LM is satisfied, the multilayer electronic component according to claim 1.

4. when a distance in the first direction between a cracked surface where a crack exists on the tip side of the first external electrode and the second internal electrode disposed on the outermost side in the first direction among the first surface and the second surface is TM, and an angle formed by a straight line connecting one end and the other end of the crack and the cracked surface is θ, LM > LE - TM × tan(90° - θ) is satisfied, the multilayer electronic component according to claim 3.

5. the θ is 60° or more and 70° or less, the multilayer electronic component according to claim 4.

6. When the thickness of the main body in the first direction is TB, the ratio of TM to TB (TM / TB) is 0.05 or more and 0.3 or less. The multilayer electronic component according to claim 4.

7. Among the cracks, the inclination of at least a part of the section penetrating the dielectric layer with respect to the second direction is steeper than the inclination of the section penetrating the first or second internal electrode among the cracks with respect to the second direction. The multilayer electronic component according to claim 2.

8. The main body further includes a first dummy electrode that is disposed apart from the second internal electrode in the second direction and is connected to the first external electrode, and a second dummy electrode that is disposed apart from the first internal electrode in the second direction and is connected to the second external electrode. The multilayer electronic component according to claim 1.

9. The length of the first dummy electrode in the second direction measured at the central portion of the overlapping region in the first direction is shorter than the length of the first dummy electrode in the second direction measured at both ends of the overlapping region in the first direction. The multilayer electronic component according to claim 8.

10. The length of the overlapping region in the second direction gradually decreases toward both ends of the overlapping region in the first direction at the central portion of the overlapping region in the first direction. The multilayer electronic component according to claim 1.

11. The length of the first external electrode and the second internal electrode separated in the second direction gradually increases toward both ends of the overlapping region in the first direction at the central portion of the overlapping region in the first direction. The length of the second external electrode and the first internal electrode separated in the second direction gradually increases toward both ends of the overlapping region in the first direction at the central portion of the overlapping region in the first direction. The multilayer electronic component according to claim 10.

12. The length of the overlapping region in the second direction decreases stepwise toward both ends of the overlapping region in the first direction at the central portion of the overlapping region in the first direction. The multilayer electronic component according to claim 1.

13. The overlapping region includes a first region that is disposed at the central portion of the overlapping region in the first direction and has a substantially constant length in the second direction, and a second region in which the length in the second direction gradually decreases toward both ends of the overlapping region in the first direction. The multilayer electronic component according to claim 1.

Images