Printed wiring substrate

Abstract

To solve the problem that a conventional slit is provided to reduce the amount of heat conduction to a portion close to an electronic component serving as a heat generation source, positively conducts, on the contrary, heat to a portion far from the electronic component serving as the heat generation source, and does not reduce the amount of heat conduction to other electronic components.SOLUTION: In a printed wiring substrate where an electronic component serving as a heat generating source and other electronic components are mounted on one substrate body, the substrate body is divided into a heat generating area where the component serving as the heat generating source is mounted and a normal area where the other electronic components are mounted, and a slit penetrating the substrate body is formed between the heat generating area and the normal area.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a printed wiring board on which an electronic component serving as a heat source and other electronic components are mounted on a single substrate body.

Background Art

[0002] For example, in the case of a printed wiring board used in a power supply device, a large amount of heat may be generated from an electronic component for power control. Such an electronic component with a large amount of heat generation may have a heat sink or the like attached to cool the electronic component itself. However, the heat generated from such an electronic component serving as a heat source may conduct through the substrate body and affect other electronic components.

[0003] There is known a structure in which slits are provided so that the influence of heat conducted from such a heat source through the substrate body does not cause a difference even if the distance from the electronic component serving as the heat source is different (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0009] ,

[0033] , FIGS. 5, 6)

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above conventional structure is provided to reduce the amount of heat conduction to the portion close to the electronic component serving as the heat source, but instead actively conducts heat to the portion far from the electronic component serving as the heat source, and does not reduce the amount of heat conduction to other electronic components.

[0006] Therefore, in view of the above problems, an object of the present invention is to provide a printed wiring board capable of preventing heat generated from an electronic component serving as a heat source from affecting other electronic components as much as possible.

Means for Solving the Problem

[0007] In order to solve the above problems, the printed wiring board according to the present invention is a printed wiring board in which an electronic component serving as a heat source and other electronic components are mounted on a single substrate body. The substrate body is divided into a heat generating area where the component serving as the heat source is mounted and a normal area where the other electronic components are mounted, and a slit penetrating the substrate body is formed between the heat generating area and the normal area.

[0008] Although the heat conducted through the substrate body is blocked by this slit, copper foil may be deposited on the inner peripheral surface of the slit to enhance the heat dissipation property at the slit.

[0009] Further, if the substrate body is a single-sided mounting substrate, the electronic component serving as the heat source and other electronic components are mounted on one surface, and the other surface is covered with copper foil, the amount of heat dissipated from the copper foil deposited on the other surface can be increased.

[0010] Furthermore, if the copper foil deposited on the other surface is connected to the copper foil deposited on the inner peripheral surface of the slit, heat can be dissipated from the copper foil deposited on the inner peripheral surface of the slit to the copper foil deposited on the other surface.

[0011] By the way, if copper foil is deposited on the portion of the heat generating area of the substrate body where the electronic component serving as the heat source is not mounted, the heat dissipation property in the heat generating area can be improved.

Effects of the Invention

[0012] As is clear from the above description, since the present invention provides a slit between the heat generating area and the normal area, it is possible to reduce the transfer of heat from the heat generating area to the normal area through the substrate body, and to reduce as much as possible the influence of the heat generated by the electronic component serving as the heat source on other electronic components.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0014] Referring to FIGS. 1 and 2, reference numeral 1 denotes a substrate body of a printed wiring board according to the present invention. Two types of areas, a heat generating area and a normal area, are set on this substrate body 1. An electronic component 3 serving as a heat source is mounted in the heat generating area, and other normal electronic components (not numbered) are mounted in the normal area.

[0015] Then, a slit 2a is provided between these heat generating area and normal area. By providing the slit 2a at this position, it is possible to prevent the heat generated from the electronic component 3 from conducting through the substrate body 1 and acting on the normal area side. In addition, in order to enhance the heat dissipation property at this slit 2a, a copper foil 21a is adhered to the inner peripheral surface of the slit 2a.

[0016] Three slits (2b, 2c, 2d) similar to this slit 2a are formed in the normal area, and copper foils 21b, 21c, 21d are also adhered to the inner peripheral surfaces of the respective slits 2b, 2c, 2d. Although these slits are provided in the normal area, the purpose is to block the heat conducting in the normal area, and it is not necessarily required. In particular, the necessity of the slit 2d at the right end in the figure is not so high.

[0017] In the heat-generating area, the electronic component 3 serving as a heat source is mounted as described above, but the copper foil 11 is adhered to the area where the electronic component is not mounted. By adhering the copper foil 11 in this way, the heat dissipation property in the heat-generating area is improved. In addition, in the present embodiment, the electronic components are configured to be mounted only on one surface (the upper surface in the figure) of the substrate body 1. Therefore, although no electronic component is mounted on the other surface, the copper foil 12 is adhered to the other surface to improve the heat dissipation property of the entire substrate body 1. Note that the copper foil 21a, 21b, 21c, 21d adhered to the inner peripheral surfaces of the respective slits 2a, 2b, 2c, 2d is connected to the copper foil 12 adhered to the other surface.

[0018] By configuring in this way, the conduction of heat from the heat-generating area to the normal area is blocked, and the heat dissipation property of the substrate body 1 itself is improved.

[0019] Incidentally, in the one shown in FIG. 1, slits are formed over substantially the entire vertical width of the substrate body 1 in the figure. However, if the mechanical strength of the substrate body 1 seems to decrease, as shown in FIG. 3, the slit 2a may be divided into two slits 4a-1 and 4a-2.

[0020] Similarly, for the other slits 2b, 2c, 2d, they may be divided into slits 4b-1, 4b-2, 4c-1, 4c-2, 4d-1, 4d-2, 4d-3, respectively.

[0021] Further, when the substrate body 1 is forcibly cooled by blowing air with a cooling fan (not shown) against the other surface of the substrate body 1, a wind guide plate 5 may be provided for each slit so that the cooling air W from the blower fan passes through each slit.

[0022] Note that the present invention is not limited to the above-described form, and various modifications may be made without departing from the gist of the present invention.

Explanation of reference numerals

[0023] 1 Substrate body 2a Slit 3 Electronic components that are heat sources 5 Air guide plates 11 Copper foils 12 Copper foils 21a Copper foils W Cooling air

Claims

1. In a printed wiring board on which an electronic component serving as a heat source and other electronic components are mounted on a single substrate body, the substrate body is divided into a heat generating area where the component serving as the heat source is mounted and a normal area where the other electronic components are mounted, and a slit penetrating the substrate body is formed between the heat generating area and the normal area. A printed wiring board characterized by this.

2. The printed wiring board according to claim 1, characterized in that a copper foil is adhered to the inner peripheral surface of the slit to enhance heat dissipation through the slit.

3. The substrate body is a single-sided mounting substrate, and the electronic component serving as the heat source and other electronic components are mounted on one surface, and the other surface is covered with a copper foil. The printed wiring board according to claim 1 or claim 2, characterized by this.

4. The printed wiring board according to claim 3, characterized in that the copper foil adhered to the other surface is connected to the copper foil adhered to the inner peripheral surface of the slit.

5. The printed wiring board according to claim 4, characterized in that a copper foil is adhered to a portion of the heat generating area of the substrate body where the electronic component serving as the heat source is not mounted.

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