Three dimension mounting apparatus and three dimension mounting method

Abstract

To suppress misalignment of components.SOLUTION: A three dimension mounting apparatus includes a stage for holding a three dimensional substrate, a mounting head for mounting a component onto a surface of the three dimensional substrate, an application head for applying an adhesive onto the surface of the three dimensional substrate, and a controller. The controller includes a mounting order determination section that determines component mounting order on a plurality of mounting areas set on the surface of the three dimensional substrate so that the mounted components have the angle values equal to or less than the allowable angle, a stage control segment that controls the stage so that the plurality of mounting areas become a horizontal state sequentially in accordance with the mounting order, a head control section that controls the mounting head so that the components are sequentially mounted onto the mounting areas in the horizontal state in accordance with the mounting order, and a fixing control section that controls the application head when the first component has had an inclination angle more than the allowable angel at mounting a second component after the first component is mounted onto the first mounting area and before the three dimensional substrate is inclined so that the first component is fixed to the first mounting area with the adhesive after mounting the first component.SELECTED DRAWING: Figure 25

Description

Technical Field

[0001] The technology disclosed in this specification relates to a three-dimensional mounting device and a three-dimensional mounting method.

Background Art

[0002] In the technical field related to three-dimensional mounting devices, a three-dimensional mounting device for mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When mounting a component on a mounting area set on the surface of a three-dimensional substrate, the tilt angle of the three-dimensional substrate is adjusted so that the mounting area is in a horizontal state. When mounting a second component on a second mounting area after mounting a first component on a first mounting area, the first mounting area may be tilted with respect to the horizontal plane. If the first mounting area is tilted with respect to the horizontal plane, the first component may be displaced due to the action of gravity.

[0005] The technology disclosed in this specification aims to suppress displacement of components.

Means for Solving the Problems

[0006] This specification discloses a three-dimensional mounting apparatus including a stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate, an application head for applying an adhesive to the surface of the three-dimensional substrate, and a controller. The controller includes an allowable angle acquisition unit that acquires an allowable angle indicating the maximum value of the tilt angle of a component whose amount of displacement after mounting is suppressed to be equal to or less than a specified amount, a mounting order determination unit that determines the mounting order of components with respect to a plurality of mounting areas set on the surface of the three-dimensional substrate so that the components after mounting are at or below the allowable angle, a stage control unit that controls the stage so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting order, a head control unit that controls the mounting head so that components are sequentially mounted on the mounting areas in the horizontal state according to the mounting order, and a fixing control unit that controls the application head so that the first component and the first mounting area are fixed with an adhesive after the first component is mounted on the first mounting area and before the three-dimensional substrate is tilted when the first component does not become equal to or less than the allowable angle when the second component is mounted.

Advantages of the Invention

[0007] According to the technology disclosed in this specification, displacement of components is suppressed.

Brief Description of the Drawings

[0008]

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MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of the predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotation direction or inclination direction centered on the X-axis direction is defined as the θX direction. The rotation direction or inclination direction centered on the Y-axis direction is defined as the θY direction. The rotation direction or inclination direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Also, in the embodiments, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0010] [First Embodiment] The first embodiment will be described.

[0011] [Substrate] FIG. 1 is a perspective view showing a substrate 1 and components 2 according to the embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a part of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. Protrusions may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In the embodiment, the substrate 1 is formed by an in-mold molding technique. The substrate 1 includes a base material 1A having a curved surface and a film 1B joined to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes electronic components. The component 2 may be a lead-type electronic component having leads protruding from the body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] <Pallet> FIG. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to an embodiment. FIG. 3 is an exploded perspective view showing the substrate 1 and the pallet 3 according to the embodiment. The pallet 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while being held by the pallet 3. The pallet 3 includes a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0015] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on the +Y side and the -Y side of the base portion 4A respectively, and a plurality of pin portions 4C that support the substrate 1 from the +Y side and the -Y side respectively.

[0016] The base portion 4A is plate-shaped and has a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper surface and the lower surface of the base portion 4A.

[0017] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are separated from each other in the Y-axis direction. One guard portion 4B protrudes from the +Y side end of the upper surface of the base portion 4A to the +Z side. The other guard portion 4B protrudes from the -Y side end of the upper surface of the base portion 4A to the +Z side.

[0018] Each of the plurality of pin portions 4C protrudes from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The plurality of pin portions 4C arranged on the +Y side of the center of the base portion 4A support the +Y side end of the substrate 1. The plurality of pin portions 4C arranged on the -Y side of the center of the base portion 4A support the -Y side end of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support portions 5A that support the -X side end portion of the substrate 1 and a movable portion 5B that supports the +X side end portion of the substrate 1. The movable portion 5B is movable in the X-axis direction on the upper surface of the base portion 4A. With the substrate 1 disposed between the support portion 5A and the movable portion 5B, when the movable portion 5B moves in the -X direction, the substrate 1 is clamped between the support portion 5A and the movable portion 5B. The substrate 1 is fixed to the pallet 3 by being clamped between the support portion 5A and the movable portion 5B.

[0020] <Three-dimensional mounting device> FIG. 4 is a side view schematically showing the three-dimensional mounting device 10 according to the embodiment. FIG. 5 is a plan view schematically showing the three-dimensional mounting device 10 according to the embodiment. The three-dimensional mounting device 10 mounts the component 2 on the substrate 1.

[0021] The three-dimensional mounting device 10 includes a base member 18, a transfer device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a dispenser 11, a laser head 12, a chamber 29, and a controller 16.

[0022] The base member 18 supports each of the transfer device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the dispenser 11, the laser head 12, and the head moving device 27.

[0023] The transfer device 19 transfers the pallet 3 holding the substrate 1 in the X-axis direction. The transfer device 19 transfers the pallet 3 to the processing position of the three-dimensional mounting device 10. The processing position is defined on the transfer path of the transfer device 19.

[0024] The transfer device 19 has a transfer belt 19A that transfers the pallet 3 in the X-axis direction and a guide member 19B that guides the pallet 3.

[0025] The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One of the guide members 19B is arranged on the +Y side of the pallet 3. The other guide member 19B is arranged on the -Y side of the pallet 3.

[0026] The conveyor belt 19A is annular. A pair of conveyor belts 19A are provided. The conveyor belt 19A is supported by the guide member 19B via a driving pulley and a driven pulley. The conveyor belt 19A is wound around the driving pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0027] Of the pair of conveyor belts 19A, the conveyor belt 19A arranged on the +Y side supports the +Y side end of the lower surface of the pallet 3. The conveyor belt 19A arranged on the -Y side supports the -Y side end of the lower surface of the pallet 3. When the driving pulley rotates by a drive motor (not shown), the pallet 3 is conveyed in the X-axis direction.

[0028] By an actuator (not shown), one of the guide members 19B is movable in the Y-axis direction with respect to the other guide member 19B. When one of the guide members 19B and the other guide member 19B are separated from each other in the Y-axis direction, the support of the pallet 3 by the conveyor belt 19A is released.

[0029] FIG. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. FIG. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0030] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 conveyed to the processing position from the -Z side. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning member 20A is inserted into the hole 4D of the pallet 3. When the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the stage 20 and the pallet 3 are positioned. A hook is provided at the upper end of the positioning member 20A. The hook is hung on the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hung on the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, Z-axis direction, θX direction, and θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is conveyed to the processing position by the conveying device 19, the guide member 19B on the +Y side moves in the +Y direction so as to separate from the other guide member 19B, and the stage 20 moves in the +Z direction by the stage moving device 21. When the guide member 19B on the +Y side moves in the Y-axis direction so as to separate from the other guide member 19B, the support of the pallet 3 by the conveyor belt 19A is released. The support of the pallet 3 by the conveyor belt 19A is released, and the stage 20 moves in the +Z direction, so that the pallet 3 is transferred from the conveying device 19 to the stage 20. The stage moving device 21 can move the stage 20 in each of the Z-axis direction, θX direction, and θY direction by moving the stage 20 in the +Y direction so as to come to the center of the two guide members 19B with the pallet 3 supported by the stage 20.

[0033] When passing the pallet 3 from the stage 20 to the transfer device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 comes onto the transfer belt 19A, and the guide member 19B on the +Y side moves in the -Y direction until the opposite side of the pallet 3 comes onto the transfer belt 19A. After the fixing of the hook provided at the upper end of the positioning member 20A is released, the stage 20 moves in the -Z direction by the stage moving device 21. Thereby, the support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transfer belt 19A.

[0034] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeder holds a plurality of components 2. The component supply device 22 supplies at least one of the plurality of components 2 to the supply position. The component supply device 22 is arranged on the -Y side of the transfer device 19. Note that the component supply device 22 may be arranged on each of the +Y side and the -Y side of the transfer device 19.

[0035] The mounting head 24 mounts the components 2 on the substrate 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 by the nozzles 23 and mounts them on the substrate 1. The mounting head 24 is movable between the supply position where the components 2 are supplied from the component supply device 22 and the processing position where the substrate 1 is arranged. After holding the components 2 supplied to the supply position by the nozzles 23 and moving to the processing position, the mounting head 24 mounts them on the surface of the substrate 1 arranged at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In the embodiment, the head moving device 27 moves the mounting head 24 in each of the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. By the operation of the X-axis moving device 27X, the mounting head 24 moves in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. By the operation of the Y-axis moving device 27Y causing the X-axis moving device 27X to move in the Y-axis direction, the mounting head 24 moves in the Y-axis direction.

[0037] FIG. 8 is a diagram schematically showing the mounting head 24 according to the embodiment. As shown in FIG. 8, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. In a state where the lower end of the nozzle 23 is in contact with the component 2, by performing a suction operation from the opening provided at the lower end of the nozzle 23, the component 2 is suction-held at the lower end of the nozzle 23. By releasing the suction operation from the opening, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that holds the component 2 while sandwiching it.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in each of the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of the shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to respective ones of the plurality of shafts 23A. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to respective ones of the plurality of shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the nozzle 23 by moving the shaft 23A in the Z-axis direction and the θZ direction.

[0039] The nozzle 23 is movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction by the head moving device 27 and the nozzle moving device 28. When the nozzle 23 moves, the component 2 held by the nozzle 23 is also movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0040] The camera 25 images the substrate 1. In the embodiment, the camera 25 images the surface of the substrate 1 from the +Z side of the substrate 1. The camera 25 is provided on the mounting head 24. The camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The camera 25 can image the alignment marks provided on the surface of the substrate 1. The camera 25 can image the component 2 after being mounted on the substrate 1.

[0041] The dispenser 11 applies cream solder to the substrate 1. The dispenser 11 moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transfer device 19. The dispenser 11 and the mounting head 24 can move separately. After cream solder is applied to the surface of the substrate 1 by the dispenser 11, the component 2 is mounted on the substrate 1 by the mounting head 24. The mounting head 24 mounts the component 2 on the substrate 1 to which cream solder has been applied.

[0042] The laser head 12 irradiates the cream solder with laser light so as to melt the cream solder. The laser head 12 irradiates the cream solder with laser light after the component 2 is mounted on the substrate 1 via the cream solder. The laser head 12 irradiates the cream solder with laser light to melt the cream solder. The laser head 12 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transfer device 19. The laser head 12, the dispenser 11, and the mounting head 24 can move separately.

[0043] The chamber 29 has an internal space in which the base member 18, the transfer device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, the nozzle moving device 28, the dispenser 11, and the laser head 12 are respectively accommodated.

[0044] <Controller> FIG. 9 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 has a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 16C, and an interface 16D including an input / output circuit. The functions of the controller 16 are stored in the storage 16C as a computer program. The processor 16A reads the computer program from the storage 16C, expands it in the main memory 16B, and executes a predetermined process according to the computer program. Note that the computer program may be distributed to the controller 16 via a network.

[0045] FIG. 10 is a functional block diagram showing a three-dimensional mounting device 10 according to an embodiment. As shown in FIG. 10, the controller 16 includes a tolerance angle storage unit 30, a mounting order storage unit 40, a dispenser control unit 31, a stage control unit 32, a head control unit 33, a laser control unit 34, a misalignment amount calculation unit 35, a tolerance angle acquisition unit 36, and a mounting order determination unit 37.

[0046] The dispenser control unit 31 controls the dispenser 11. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to the surface of the substrate 1.

[0047] FIG. 11 is a plan view schematically showing a substrate 1 according to an embodiment. As shown in FIG. 11, a plurality of mounting areas 50 are set on the surface of the substrate 1. The mounting area 50 is an area where the component 2 is mounted. The component 2 is mounted in each of the plurality of mounting areas 50. The dispenser control unit 31 applies the cream solder 60 to each of the plurality of mounting areas 50.

[0048] The stage control unit 32 controls the stage 20. The head control unit 33 controls the mounting head 24 so that the component 2 is mounted on the substrate 1 supported by the stage 20.

[0049] Each of FIGS. 12 and 13 is a diagram for explaining the operations of the stage 20 and the mounting head 24 according to an embodiment. A plurality of mounting areas 50 are set on the surface of the substrate 1. In the examples shown in FIGS. 12 and 13, the mounting areas 50 set on the surface of the substrate 1 include a mounting area 50A, a mounting area 50B, and a mounting area 50C. The cream solder 60 is applied to each of the plurality of mounting areas 50. The component 2 includes a component 2A mounted in the mounting area 50A, a component 2B mounted in the mounting area 50B, and a component 2C mounted in the mounting area 50C.

[0050] When mounting the component 2 on the mounting area 50 set on the surface of the substrate 1, the inclination angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2 is sequentially mounted on the mounting area 50 in the horizontal state.

[0051] As shown in FIG. 12, when mounting the component 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2A is mounted on the mounting area 50A in the horizontal state. The component 2A is mounted on the mounting area 50A via the cream solder 60 applied to the mounting area 50A.

[0052] As shown in FIG. 13, after the component 2A is mounted on the mounting area 50A, the component 2B is mounted on the mounting area 50B. When mounting the component 2B on the mounting area 50B, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2B is mounted on the mounting area 50B in the horizontal state. The component 2B is mounted on the mounting area 50B via the cream solder 60 applied to the mounting area 50B.

[0053] After the component 2B is mounted on the mounting area 50B, the component 2C is mounted on the mounting area 50C. When mounting the component 2C on the mounting area 50C, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2C is mounted on the mounting area 50C in the horizontal state. The component 2C is mounted on the mounting area 50C via the cream solder 60 applied to the mounting area 50C.

[0054] The laser control unit 34 controls the laser head 12. After the component 2 is mounted on the mounting area 50 via the cream solder 60, the laser control unit 34 controls the laser head 12 so that the cream solder 60 is irradiated with laser light. When the cream solder 60 is irradiated with laser light, the cream solder 60 melts. When the melted cream solder 60 cools, the component 2 is soldered to the substrate 1.

[0055] FIG. 14 is a diagram for explaining the operation of the laser head 12 according to the embodiment. As shown in FIG. 14, the laser head 12 irradiates the cream solder 60 with laser light after the component 2 is mounted on the mounting area 50. When irradiating the cream solder 60 in the mounting area 50 where the component 2 is mounted with laser light, the tilt angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50 is sequentially irradiated with laser light.

[0056] As shown in FIG. 14, when irradiating the cream solder 60 in the mounting area 50A where the component 2A is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50A is irradiated with laser light. The cream solder 60 in the mounting area 50A melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50A is cooled, the component 2A is soldered to the mounting area 50A.

[0057] When irradiating the cream solder 60 in the mounting area 50B where the component 2B is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50B is irradiated with laser light. The cream solder 60 in the mounting area 50B melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50B is cooled, the component 2B is soldered to the mounting area 50B.

[0058] When irradiating the cream solder 60 in the mounting area 50C where the component 2C is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50C is irradiated with laser light. The cream solder 60 in the mounting area 50C melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50C is cooled, the component 2C is soldered to the mounting area 50C.

[0059] <Allowable Angle> The position deviation amount calculation unit 35 calculates the position deviation amount ΔD of the component 2 after mounting with respect to the mounting area 50. The component 2 after being mounted on the substrate 1 is imaged by the camera 25. The position deviation amount calculation unit 35 calculates the position deviation amount ΔD of the component 2 after mounting based on the image data of the component 2 after being imaged by the camera 25.

[0060] FIG. 15 is a diagram for explaining the position deviation of the component 2 according to the embodiment. After the component 2 is mounted on the mounting area 50 via the cream solder 60 and before the cream solder 60 is irradiated with laser light, the component 2 is not soldered to the mounting area 50. Therefore, as shown in FIG. 15, when the mounting area 50 is inclined with respect to the horizontal plane, the component 2 may be displaced with respect to the mounting area 50 due to the action of gravity.

[0061] For example, as shown in FIG. 13, when component 2A is mounted on mounting area 50A and then component 2B is mounted on mounting area 50B, mounting area 50A is inclined with respect to the horizontal plane. When mounting area 50A is inclined with respect to the horizontal plane, due to the action of gravity, component 2A may be displaced.

[0062] When calculating the displacement amount ΔD of component 2, after component 2 is mounted on mounting area 50 via solder paste 60 and before the solder paste 60 is irradiated with laser light, component 2 is imaged by camera 25. Displacement amount calculation unit 35 can calculate the displacement amount ΔD of component 2 based on the image data of component 2 imaged by camera 25.

[0063] Allowable angle acquisition unit 36 acquires an allowable angle θ indicating the maximum value of the inclination angle of component 2 at which the displacement amount ΔD of component 2 after mounting is suppressed to be equal to or less than a predetermined specified amount. The inclination angle of component 2 is equal to the inclination angle of mounting area 50 on which component 2 is mounted. The inclination angle of component 2 and the inclination angle of mounting area 50 are inclination angles with respect to the horizontal plane. The specified amount is a value close to zero. In the embodiment, allowable angle θ is the maximum value of the inclination angle at which component 2 is substantially not displaced.

[0064] As shown in FIG. 15, when displacement amount calculation unit 35 calculates displacement amount ΔD, stage control unit 32 inclines mounting area 50 at an arbitrary inclination angle. Stage control unit 32 gradually increases the inclination angle of mounting area 50 with respect to the horizontal plane from 0 degrees. Camera 25 images component 2 mounted on mounting area 50 whose inclination angle is gradually increasing. Displacement amount calculation unit 35 can calculate the maximum value of the inclination angle of component 2 at which displacement amount ΔD becomes equal to or less than the specified value based on the image data of component 2 mounted on mounting area 50 whose inclination angle is gradually increasing. In the embodiment, displacement amount calculation unit 35 can calculate the maximum value of the inclination angle of component 2 at which component 2 is substantially not displaced based on the image data of component 2.

[0065] The allowable angle acquisition unit 36 acquires, as the allowable angle θ, the maximum value of the inclination angle of the component 2 at which the amount of positional deviation ΔD of the component 2 calculated by the positional deviation amount calculation unit 35 is equal to or less than a specified amount. The positional deviation amount calculation unit 35 calculates the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle acquisition unit 36 acquires the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle θ acquired by the allowable angle acquisition unit 36 is stored in the allowable angle storage unit 30.

[0066] <Mounting order> The mounting order determination unit 37 determines the mounting order of the component 2 with respect to the plurality of mounting areas 50 set on the surface of the substrate 1 such that the component 2 after being mounted on the substrate 1 has an allowable angle θ or less. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state according to the mounting order determined by the mounting order determination unit 37. The head control unit 33 controls the mounting head 24 so that the component 2 is sequentially mounted on the horizontal mounting area 50 according to the mounting order determined by the mounting order determination unit 37.

[0067] Each of FIGS. 16 and 17 is a diagram for explaining the mounting order of the component 2 according to the embodiment. In the examples shown in FIGS. 16 and 17, the allowable angle θa of the component 2A is smaller than the allowable angle θb of the component 2B. FIG. 16 shows an example in which the component 2B is mounted on the mounting area 50B after the component 2A is mounted on the mounting area 50A. FIG. 17 shows an example in which the component 2A is mounted on the mounting area 50A after the component 2B is mounted on the mounting area 50B.

[0068] As shown in FIG. 16(A), when mounting 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. As shown in FIG. 16(B), after the component 2A is mounted on the mounting area 50A and then the component 2B is mounted on the mounting area 50B, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. Since the allowable angle θa of the component 2A is small, if the mounting area 50A is inclined with respect to the horizontal plane, the component 2A is likely to be displaced due to the action of gravity.

[0069] As shown in FIG. 17(A), when mounting the component 2B on the mounting area 50B, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. As shown in FIG. 17(B), after the component 2B is mounted on the mounting area 50B, when mounting the component 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. Since the allowable angle θb of the component 2B is large, even if the mounting area 50B is inclined with respect to the horizontal plane, the possibility of the component 2B being displaced is low.

[0070] As shown in FIG. 17, after mounting the component 2B with a large allowable angle θb and then mounting the component 2A with a small allowable angle θa, displacement of each of the component 2A and the component 2B is suppressed. The mounting order determination unit 37 determines the mounting order of the component 2 for each of the plurality of mounting areas 50 so that the component 2 with a small allowable angle θ is mounted after the component 2 with a large allowable angle θ. The mounting order determined by the mounting order determination unit 37 is stored in the mounting order storage unit 40.

[0071] The mounting order of the component 2 determined by the mounting order determination unit 37 is stored in the mounting order storage unit 40, and displacement is suppressed by mounting the components according to that order.

[0072] <Corresponding to components with displacement not eliminated> Due to the weight of the component 2, the size of the component 2, the shape of the substrate 1, etc., even if the mounting order is adjusted, there may be a component 2 that does not become less than the allowable angle θ in the mounting of the component 2. That is, even if the mounting order is adjusted, there may be a component 2 whose displacement is not eliminated.

[0073] In the following description, the component 2 whose displacement is eliminated by adjusting the mounting order is appropriately referred to as an allowable component, and the component 2 whose displacement is not eliminated even if the mounting order is adjusted is appropriately referred to as a non-allowable component.

[0074] Each of FIGS. 18 and 19 is a diagram for explaining component 2 in which misalignment is not eliminated according to the embodiment. In the examples shown in FIGS. 18 and 19, mounting area 50 set on the surface of substrate 1 includes mounting area 50D, mounting area 50E, and mounting area 50F. Solder paste 60 is applied to each of the plurality of mounting areas 50. Component 2 includes component 2D mounted in mounting area 50D, component 2E mounted in mounting area 50E, and component 2F mounted in mounting area 50F. The allowable angle θf of component 2F is large. The allowable angles θd of component 2D and θe of component 2E are small. Component 2F is an allowable component. Each of component 2D and component 2E is a non-allowable component. FIG. 18 shows an example in which after component 2D is mounted in mounting area 50D, component 2E is mounted in mounting area 50E. FIG. 19 shows an example in which after component 2E is mounted in mounting area 50E, component 2D is mounted in mounting area 50D. Component 2F is already mounted in mounting area 50F.

[0075] As shown in FIG. 18(A), when mounting component 2D in mounting area 50D, stage control unit 32 controls stage 20 so that mounting area 50D is in a horizontal state. As shown in FIG. 18(B), after component 2D is mounted in mounting area 50D, when mounting component 2E in mounting area 50E, stage control unit 32 controls stage 20 so that mounting area 50E is in a horizontal state. Since the allowable angle θd of component 2D is small, when mounting area 50D is inclined with respect to the horizontal plane, component 2D is likely to be misaligned due to the action of gravity.

[0076] As shown in FIG. 19(A), when mounting component 2E in mounting area 50E, stage control unit 32 controls stage 20 so that mounting area 50E is in a horizontal state. As shown in FIG. 19(B), after component 2E is mounted in mounting area 50E, when mounting component 2D in mounting area 50D, stage control unit 32 controls stage 20 so that mounting area 50D is in a horizontal state. Since the allowable angle θe of component 2E is small, when mounting area 50E is inclined with respect to the horizontal plane, component 2E is likely to be misaligned due to the action of gravity.

[0077] That is, when component 2E is mounted on mounting area 50E after component 2D is mounted on mounting area 50D, component 2D does not become less than the allowable angle θd during the mounting of component 2E, and component 2D is displaced. Even when the mounting order is reversed and component 2D is mounted on mounting area 50D after component 2E is mounted on mounting area 50E, there may be a situation where component 2E does not become less than the allowable angle θe during the mounting of component 2D.

[0078] When the situation shown in FIGS. 18 and 19 occurs, that is, after component 2D is mounted on mounting area 50D, component 2D does not become less than the allowable angle θd during the mounting of component 2E, and even when the mounting order is reversed, there is a case where component 2E does not become less than the allowable angle θe during the mounting of component 2D after component 2E is mounted on mounting area 50E. In that case, the laser control unit 34 irradiates the cream solder 60 in mounting area 50D with laser light after the mounting of component 2D and before the inclination of the substrate 1, and fixes component 2D by soldering before the inclination accompanying the mounting of component 2E. When the mounting order is opposite, the laser head 12 is controlled so that the cream solder 60 in mounting area 50E is irradiated with laser light after the mounting of component 2E and before the inclination of the substrate 1.

[0079] Each of FIGS. 20 and 21 is a diagram for explaining the operation of the three-dimensional mounting apparatus 10 when there is a component 2 for which displacement is not eliminated according to the embodiment.

[0080] As shown in FIG. 20(A), when component 2D is mounted on mounting area 50D, the stage control unit 32 controls the stage 20 so that mounting area 50D is in a horizontal state. As shown in FIG. 20(B), after component 2D is mounted on mounting area 50D, the cream solder 60 in mounting area 50D is irradiated with laser light while the horizontal state of mounting area 50D is maintained. As the melted cream solder 60 by the laser light cools, component 2D is soldered to mounting area 50D.

[0081] As shown in FIG. 21(A), after the component 2D is soldered to the mounting area 50D, the component 2E is mounted on the mounting area 50E. When mounting the component 2E on the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E becomes horizontal. When the mounting area 50E becomes horizontal, the mounting area 50D is inclined with respect to the horizontal plane. Since the component 2D is soldered to the mounting area 50D, even if the inclination angle of the mounting area 50D exceeds the allowable angle θd, the displacement of the component 2D is suppressed. As shown in FIG. 21(B), after the component 2E is mounted on the mounting area 50E, the mounting area 50E is maintained in a horizontal state, and the cream solder 60 in the mounting area 50E is irradiated with laser light. When the melted cream solder 60 by the laser light cools, the component 2E is soldered to the mounting area 50E. Thereafter, laser soldering of the allowable components is sequentially performed.

[0082] <Method for determining mounting order> FIG. 22 is a flowchart showing a method for determining the mounting order of the component 2 according to the embodiment. When determining the mounting order, the test substrate 1 and the test component 2 are used.

[0083] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 become horizontal in sequence. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SA1).

[0084] The head control unit 33 controls the mounting head 24 so that the component 2 is mounted on the horizontal mounting area 50 (step SA2).

[0085] The displacement amount calculation unit 35 causes the camera 25 to image the component 2 in the mounting area 50 (step SA3).

[0086] The displacement amount calculation unit 35 calculates the respective displacement amounts ΔD of the component 2 based on the image data of the component 2 captured in step SA3 (step SA4). It is determined whether the displacement amount ΔD calculated by the displacement amount calculation unit 35 is equal to or less than a specified amount (step SA5).

[0087] In step SA5, when it is determined that the displacement amount ΔD is equal to or less than the specified amount (step SA5: Yes), the stage control unit 32 increases the tilt angle of the mounting area 50, and the imaging by the displacement amount calculation unit 35 and the calculation of the displacement amount ΔD are repeated (step SA6).

[0088] In step SA5, when it is determined that the displacement amount ΔD exceeds the specified amount (step SA5: No), the tilt angle before the displacement amount ΔD exceeds the specified amount is stored in the allowable angle storage unit 30 as the allowable angle θ of the tilt angle of the component 2 (step SA7).

[0089] This operation is performed for each component 2 to be mounted on the substrate 1. The allowable angle θ stored in the allowable angle storage unit 30 can also be applied to other substrates 1 for the same component 2.

[0090] The mounting order determination unit 37 determines the mounting order of the components 2 for the plurality of mounting areas 50 based on the respective allowable angles θ of the plurality of components 2.

[0091] The mounting order determination unit 37 tentatively determines the mounting order based on the optimal mounting order in the case of a conventional flat substrate (step SA8).

[0092] Check whether each component 2 becomes an allowable component or a non-allowable component when mounted in accordance with the mounting order (step SA9).

[0093] The non-allowable components are moved to the back of the mounting order, and it is checked whether each component 2 becomes an allowable component or a non-allowable component (step SA10).

[0094] Repeat the rearrangement and check of the mounting order until the identification of acceptable parts and unacceptable parts does not change (step SA11).

[0095] Store the mounting order and the identification of acceptable parts and unacceptable parts in that order in the mounting order storage unit 40 (step SA12).

[0096] By doing so, the parts 2 with a small allowable angle θ, that is, the parts 2 that are likely to be displaced, are mounted later in the mounting order, and are less likely to receive the inclination of the substrate 1 when other parts 2 are mounted. Therefore, by increasing the acceptable parts and decreasing the unacceptable parts, continuous mounting operation becomes possible and the mounting tact can be shortened.

[0097] <Mounting method> FIG. 23 is a flowchart showing a method for mounting the parts 2 according to the embodiment.

[0098] The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SB1).

[0099] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state according to the mounting order stored in the mounting order storage unit 40. The head control unit 33 controls the mounting head 24 so that the parts 2 are sequentially mounted on the horizontal mounting area 50 according to the mounting order stored in the mounting order storage unit 40, and mounts the acceptable parts (step SB2).

[0100] The head control unit 33 determines whether or not there are unacceptable parts (step SB3).

[0101] In step SB3, when it is determined that there are unacceptable parts (step SB3: Yes), the head control unit 33 mounts the unacceptable parts on the mounting area 50 (step SB4).

[0102] As described with reference to FIGS. 20 and 21, after the non-conforming component is mounted on the mounting area 50, the laser control unit 34 controls the laser head 12 so that the laser beam irradiates the cream solder 60 of the non-conforming component in a state where the horizontal state of the mounting area 50 is maintained (step SB5).

[0103] The head control unit 33 determines whether or not the mounting of all non-conforming components has been completed (step SB6).

[0104] In step SB6, if it is determined that the mounting of the non-conforming component has not been completed (step SB6: No), the process returns to step SB4.

[0105] In step SB6, if it is determined that the mounting of the non-conforming component has been completed (step SB6: Yes), the laser control unit 34 controls the laser head 12 so that the laser beam irradiates the cream solder 60 of the conforming component (step SB7).

[0106] The laser control unit 34 controls the laser head 12 so that the laser beam is sequentially irradiated onto the cream solder 60 of each of the plurality of conforming components. Similarly, in step SB3, if it is determined that there is no non-conforming component (step SB3: No), the laser control unit 34 controls the laser head 12 so that the laser beam irradiates the cream solder 60 of each of the plurality of conforming components (step SB7).

[0107] The soldering order by the laser beam at this time is set to be the opposite order to the component mounting, so that it is possible to prevent the conforming component before soldering from being tilted more than the angle at the time of mounting.

[0108] <Effect> As described above, according to the embodiment, based on the allowable angle θ of the component 2, the mounting order of the component 2 is determined. Since the mounting order of the component 2 is determined so that the component 2 after mounting is equal to or less than the allowable angle θ, the displacement of the component 2 is suppressed.

[0109] The three-dimensional mounting device 10 is designed to achieve an optimal tact time when continuously adsorbing and mounting components 2, thereby improving productivity. According to the present invention, by distinguishing between acceptable components and unacceptable components, acceptable components can be continuously adsorbed and mounted in the conventional manner, and even in three-dimensional mounting where the substrate 1 is mounted while being tilted, a decrease in tact time can be minimized.

[0110] [Second Embodiment] The second embodiment will be described. In the following description, components that are the same as or equivalent to those in the above-described embodiment are denoted by the same reference numerals, and the description of those components will be simplified or omitted.

[0111] FIG. 24 is a side view schematically showing a three-dimensional mounting device 110 according to an embodiment. In the embodiment, the three-dimensional mounting device 110 includes an application head 13 for applying an adhesive 70 to the surface of the substrate 1, and an ultraviolet light head 14 for emitting ultraviolet light. In FIG. 24, the illustration of the dispenser 11 is omitted. Note that the cream solder 60 may be applied to the substrate 1 by an application device different from the three-dimensional mounting device 110.

[0112] FIG. 25 is a functional block diagram showing the three-dimensional mounting device 110 according to an embodiment. In the embodiment, the controller 16 has a fixed control unit 38 for controlling each of the application head 13 and the ultraviolet light head 14.

[0113] FIG. 26 is a diagram for explaining the operation of the application head 13 according to an embodiment. In the embodiment, the adhesive 70 is applied to the mounting area 50 where unacceptable components are mounted. The unacceptable components and the mounting area 50 are fixed with the adhesive 70.

[0114] In the embodiment, the adhesive 70 is an ultraviolet light-curable type. The fixed control unit 38 controls the ultraviolet light head 14 so that the adhesive 70 applied to the mounting area 50 is irradiated with ultraviolet light after the unacceptable components are mounted on the mounting area 50 via the adhesive 70 and the cream solder 60.

[0115] Each of FIGS. 27 and 28 is a diagram for explaining the operation of the three-dimensional mounting apparatus 110 when there is a component 2 in which misalignment is not eliminated according to the embodiment.

[0116] After mounting the component 2D on the mounting area 50D and when mounting the component 2E, if the component 2D does not become equal to or less than the allowable angle θd, and after mounting the component 2E on the mounting area 50E and when mounting the component 2D, if the component 2E does not become equal to or less than the allowable angle θe, the fixing control unit 38 fixes the component 2D and the mounting area 50D with the adhesive 70 after mounting the component 2D and before tilting the substrate 1, and fixes the component 2E and the mounting area 50E with the adhesive 70 after mounting the component 2E and before tilting the substrate 1, and controls the coating head 13.

[0117] Before the non - allowable component 2D is mounted on the mounting area 50D, the cream solder 60 and the adhesive 70 are applied to the mounting area 50D. Before the non - allowable component 2E is mounted on the mounting area 50E, the cream solder 60 and the adhesive 70 are applied to the mounting area 50E.

[0118] As shown in FIG. 27(A), when mounting the component 2D on the mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D becomes horizontal. The component 2D is mounted on the mounting area 50D via the adhesive 70 and the cream solder 60. As shown in FIG. 27(B), after the component 2D is mounted on the mounting area 50D via the adhesive 70 and the cream solder 60, with the horizontal state of the mounting area 50D maintained, ultraviolet light is irradiated onto the adhesive 70 of the mounting area 50D. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 cures, and the component 2D and the mounting area 50D are fixed with the adhesive 70.

[0119] As shown in FIG. 28(A), after the component 2D and the mounting area 50D are fixed with the adhesive 70, the component 2E is mounted on the mounting area 50E. When mounting the component 2E on the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E is in a horizontal state. When the mounting area 50E becomes horizontal, the mounting area 50D is inclined with respect to the horizontal plane. Since the component 2D is fixed to the mounting area 50D with the adhesive 70, even if the inclination angle of the mounting area 50D exceeds the allowable angle θd, the displacement of the component 2D is suppressed. As shown in FIG. 28(B), after the component 2E is mounted on the mounting area 50E via the adhesive 70 and the cream solder 60, ultraviolet light is irradiated onto the adhesive 70 of the mounting area 50E while the horizontal state of the mounting area 50E is maintained. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 is cured, and the component 2E and the mounting area 50E are fixed with the adhesive 70.

[0120] The curing of the adhesive by ultraviolet light does not have to be immediately after the component 2 is mounted, and there is no problem as long as the component 2 is not tilted by more than the allowable angle θ. Therefore, as long as this condition is satisfied for adjacent non-permissible components, they can be cured simultaneously, and the tact time can be shortened accordingly.

[0121] FIG. 29 is a flowchart showing a method for mounting the component 2 according to the embodiment.

[0122] The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SC1).

[0123] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially brought into a horizontal state according to the mounting order stored in the mounting order storage unit 40. The head control unit 33 controls the mounting head 24 so that the component 2 is sequentially mounted on the horizontal mounting area 50 according to the mounting order stored in the mounting order storage unit 40 (step SC2).

[0124] The head control unit 33 determines whether there is a non-permissible component (step SC3).

[0125] In step SC3, if it is determined that there is a non-permissible component (step SC3: Yes), the fixing control unit 38 applies the adhesive 70 to the mounting area 50 where the non-permissible component is to be mounted (step SC4).

[0126] The head control unit 33 mounts the non-permissible component on the mounting area 50 (step SC5).

[0127] As described with reference to FIGS. 27 and 28, after the non-permissible component is mounted on the mounting area 50, the fixing control unit 38 controls the ultraviolet light head 14 so that the ultraviolet light is irradiated onto the adhesive 70 of the non-permissible component within a range where the inclination angle of the mounting area 50 does not exceed the allowable angle θ.

[0128] The head control unit 33 determines whether the mounting of all non-permissible components has been completed (step SC6).

[0129] In step SC6, if it is determined that the mounting of the non-permissible component has not been completed (step SC6: No), the process returns to step SC4.

[0130] In step SC6, if it is determined that the mounting of the non-permissible component has been completed (step SC6: Yes), the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of all the components 2 including the permissible components and the non-permissible components (step SC7). Similarly, in step SC3, if it is determined that there is no non-permissible component (step SC3: No), the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of all the permissible components (step SC7).

[0131] By setting the irradiation order of the laser light to be the opposite of the mounting order, it is possible to prevent the permissible components before soldering from being tilted beyond the reference angle.

[0132] Note that in step SC7, the substrate 1 on which a plurality of components 2 are mounted may be carried into the reflow furnace without tilting it using the laser head 12. In this case, soldering by laser light becomes unnecessary, and productivity is greatly improved by batch soldering.

[0133] As described above, also in the embodiment, displacement of the component 2 is suppressed while minimizing a decrease in productivity due to three-dimensional mounting. In the embodiment, even if there are non-conforming components, displacement of the non-conforming components is suppressed by the adhesive 70.

[0134] [Other Embodiments] FIG. 30 is a diagram schematically showing the allowable angle storage unit 30 according to the embodiment. In the above-described embodiment, the allowable angle θ is calculated based on the image data of the component 2 captured by the camera 25. The allowable angle θ of the component 2 may be measured by a measuring device different from the three-dimensional mounting device 10. In that case, correlation data (allowable angle table) between the component 2 and the allowable angle θ as shown in FIG. 30 may be directly stored in the allowable angle storage unit 30 from external measurement data without passing through the allowable angle acquisition unit 36.

[0135] FIG. 31 is a diagram schematically showing the controller 16 according to the embodiment. As shown in FIG. 31, the controller 16 may have an allowable angle calculation unit 39 that calculates the allowable angle θ of the component 2 based on the weight of the component 2. The allowable angle acquisition unit 36 may acquire the allowable angle θ from the allowable angle calculation unit 39. The weight of the component 2 and the allowable angle θ are correlated. The larger the weight of the component 2, the smaller the allowable angle θ. Note that the allowable angle calculation unit 39 may calculate the allowable angle θ in consideration of not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60. By considering not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60, the calculation accuracy of the allowable angle θ is improved.

Explanation of Reference Numerals

[0136] 1…Substrate, 1A…Base material, 1B…Film, 2…Component, 2A…Component, 2B…Component, 2C…Component, 2D…Component, 2E…Component, 2F…Component, 3…Pallet, 4…Support member, 4A…Base part, 4B…Guard part, 4C…Pin part, 4D…Hole, 5…Clamping mechanism, 5A…Support part, 5B…Movable part, 10…3D mounting device, 11…Dispenser, 12…Laser head, 13…Coating head, 14…Ultraviolet light head, 16…Controller, 16A…Processor, 16B…Main memory, 16C…Storage, 16D…Interface, 18…Base member, 19…Conveyor, 19A…Conveyor belt, 19B…Guide member, 20…Stage, 20A…Positioning member, 21…Stage moving device, 22…Component supply device, 23…Nozzle, 23A…Shaft, 24…Mounting head, 25…Camera, 27…Head moving device, 27X…X-axis moving device, 27Y…Y-axis moving device, 28…Nozzle moving device, 29…Chamber, 30…Allowable angle memory unit, 31…Dispenser control unit, 32…Stage control unit, 33…Head control unit, 34…Laser control unit, 35…Position deviation amount calculation unit, 36…Allowable angle acquisition unit, 37…Mounting order determination unit, 38…Fixing control unit, 39…Allowable angle calculation unit, 40…Mounting order memory unit, 50…Mounting area, 50A…Mounting area, 50B…Mounting area, 50C…Mounting area, 50D…Mounting area, 50E…Mounting area, 50F…Mounting area, 60…Solder paste, 70…Adhesive, 110…3D mounting device.

Claims

1. a stage for supporting a three-dimensional substrate; a mounting head for mounting components on the surface of the three-dimensional substrate; an application head for applying an adhesive to the surface of the three-dimensional substrate; a controller, comprising: the controller includes: a tolerance angle acquisition unit that acquires a tolerance angle indicating a maximum value of the inclination angle of a component whose displacement amount after mounting is suppressed to be equal to or less than a specified amount; a mounting order determination unit that determines the mounting order of components with respect to a plurality of mounting areas set on the surface of the three-dimensional substrate so that the components after mounting are at or below the tolerance angle; a stage control unit that controls the stage so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting order; a head control unit that controls the mounting head so that components are sequentially mounted on the mounting areas in the horizontal state according to the mounting order; a fixing control unit that controls the application head so that the first component and the first mounting area are fixed with an adhesive after the first component is mounted and before the three-dimensional substrate is tilted when the first component does not become equal to or less than the tolerance angle when the second component is mounted after the first component is mounted on the first mounting area; and a three-dimensional mounting apparatus.

2. the adhesive is an ultraviolet curable type; comprising an ultraviolet head for emitting ultraviolet light; the fixing control unit controls the ultraviolet head so that the adhesive applied to the mounting area is irradiated with ultraviolet light; the three-dimensional mounting apparatus according to claim 1.

3. the controller has a displacement amount calculation unit that calculates a displacement amount of a component after mounting based on image data of the component after mounting; the tolerance angle acquisition unit acquires the maximum value of the inclination angle of the component whose displacement amount calculated by the displacement amount calculation unit is equal to or less than the specified amount as the tolerance angle; the three-dimensional mounting apparatus according to claim 1.

4. the controller has a tolerance angle storage unit that stores correlation data between the component and the tolerance angle; the tolerance angle storage unit acquires and stores the tolerance angle from the tolerance angle acquisition unit; the three-dimensional mounting apparatus according to claim 1.

5. the controller has a tolerance angle calculation unit that calculates the tolerance angle based on the weight of the component; the tolerance angle acquisition unit acquires the tolerance angle from the tolerance angle calculation unit; the three-dimensional mounting apparatus according to claim 1.

6. acquiring a tolerance angle indicating a maximum value of the inclination angle of a component whose displacement amount after mounting on the surface of a three-dimensional substrate is suppressed to be equal to or less than a specified amount; Determining the mounting order of components for a plurality of mounting areas set on the surface of the three-dimensional substrate so that the components after mounting are within the allowable angle; Rotating the three-dimensional substrate so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting order; Sequentially mounting components on the mounting areas in the horizontal state according to the mounting order; When, after mounting the first component on the first mounting area and before mounting the second component, the first component does not become within the allowable angle, fixing the first component and the three-dimensional substrate with an adhesive after mounting the first component and before tilting the three-dimensional substrate; and A three-dimensional mounting method.

Images