Adhesive composition for temporary fixing and temporary fixing method

Abstract

To provide an adhesive composition for temporary fixing which can shorten a curing time while securing a time for adjusting a position when members are stuck to each other, can optimize a time required for separating the temporarily fixed members from each other, and has good coatability.SOLUTION: An adhesive composition for temporary fixing contains: a cyanoacrylate compound represented by CH2=C(CN)-COOR1 (where, R1 is a linear or branched alkyl group having 1 to 3 carbon atoms or a branched alkyl group having 4 or more carbon atoms); a thickener; and a cure adjusting agent, wherein the content of the cure adjusting agent is 20 to 900 ppm based on 100 mass parts of the total of the cyanoacrylate compound and the thickener, and the viscosity at 25°C is 1,000-15,000 mPa s.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to an adhesive composition for temporary fixing and a temporary fixing method, and more particularly to a cyanoacrylate-based adhesive composition for temporary fixing and a temporary fixing method using the composition.

Background Art

[0002] In the manufacturing process of semiconductor devices, there may be a step of temporarily fixing a workpiece such as a semiconductor wafer or an optical glass to a support, processing the workpiece in a temporarily fixed state, and then separating the workpiece from the support. In such a process, it is required that the workpiece such as a semiconductor wafer can be easily separated from the support.

[0003] For example, Patent Document 1 discloses a method for processing a semiconductor wafer, including a step of temporarily fixing a semiconductor wafer to a support via a film-shaped temporary fixing material, a step of processing the semiconductor wafer temporarily fixed to the support, and a step of separating the processed semiconductor wafer from the temporary fixing material. In this method, the semiconductor wafer is temporarily fixed to the support by a resin composition containing at least one of an epoxy resin and a phenol resin.

[0004] However, when members are temporarily fixed by a resin composition containing at least one of an epoxy resin and a phenol resin as in Patent Document 1, there is a concern that the time required for the adhesive layer to exhibit sufficient strength (i.e., the curing time) is long, resulting in poor productivity.

[0005] On the other hand, it has been proposed to temporarily fix members in the fields of electronic materials and optical glass materials by an adhesive composition containing a cyanoacrylate compound and separate the members after processing. Cyanoacrylate-based adhesives are one-component solvent-free adhesives that have the property of curing by moisture in the air or on the surface of a substrate (moisture curability) and instantaneously cure even at room temperature, and are widely used as industrial and general-purpose adhesives.

[0006] For example, Patent Document 2 discloses that temporary bonding is performed using a cyanoacrylate adhesive composition obtained by blending a water-soluble polyoxyalkylene glycol-based solvent and a water-soluble surfactant in cyanoacrylate to improve water solubility after curing. This Patent Document 2 also discloses that the bonded object is peeled off by immersing the member bonded with the cyanoacrylate adhesive composition in hot water or pressurized hot water (100 to 130 °C).

[0007] Moreover, Patent Document 3 discloses that a semiconductor wafer or the like is temporarily fixed by using an adhesive composition containing an ester such as 2-[2-(2-methoxyethoxy)ethoxy]ethyl of 2-cyanoacrylate. According to the technique of this Patent Document 3, it is disclosed that the temporarily fixed members can be easily peeled off or removed even by water at a temperature around room temperature.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0009] When temporarily fixing members by bonding them with an adhesive composition, there is a demand for a technique that enables accurate bonding of the members by securing a working time for position adjustment. However, due to its properties, a cyanoacrylate-based adhesive instantaneously cures when members are bonded together, making it difficult to secure a working time for position adjustment during bonding. From the perspective of improving the workability of the temporary fixing process, in the temporary fixing process, it is desirable to suppress the instantaneous increase in adhesive strength at the initial stage of bonding the members, and to rapidly develop a high adhesive strength after positioning, thereby shortening the curing time.

[0010] Also, when separating the temporarily fixed members, if the members immediately separate after starting the separation process (for example, immersion in water), there are concerns about a decrease in workability, such as the need to perform various operations simultaneously or inconvenience caused by the members separating at an unintended timing. Furthermore, in applications that require precise work, such as in the manufacturing process of semiconductor devices, it is required to suppress the adhesion of the adhesive composition to unintended locations and to enable uniform coating on the members.

[0011] The present invention has been made in view of the above circumstances, and its main object is to provide a temporary fixing adhesive composition that can shorten the curing time while securing a time for position adjustment when bonding members, can optimize the time required for separating the temporarily fixed members, and has good coatability.

Means for Solving the Problems

[0012] The present inventors have found that the above problems can be solved by blending a specific component into a cyanoacrylate-based adhesive and setting the viscosity within a specific range. Specifically, the following means are provided according to the present invention.

[0013] 〔1〕 A temporary fixing adhesive composition, which has the following formula (1): CH2=C(CN)-COOR1 (1) (In formula (1), R 1 is a linear or branched alkyl group having 1 to 3 carbon atoms, or a branched alkyl group having 4 or more carbon atoms.) A temporary fixing adhesive composition containing a cyanoacrylate compound represented by , a thickener, and a curing regulator, wherein the content of the curing regulator is 20 to 900 ppm with respect to a total of 100 parts by mass of the cyanoacrylate compound and the thickener, and the viscosity at 25°C is 1,000 to 15,000 mPa·s.) 〔2〕 The temporary fixing adhesive composition according to 〔1〕, wherein the compressive shear adhesive strength after 3 minutes of bonding glass substrates together with the temporary fixing adhesive composition is 0.5 MPa or less, and the compressive shear adhesive strength after 20 minutes of bonding glass substrates together with the temporary fixing adhesive composition is 1.0 MPa or more.) 〔3〕 The temporary fixing adhesive composition according to 〔1〕 or 〔2〕, which is for temporarily fixing a semiconductor wafer.) 〔4〕 The temporary fixing adhesive composition according to any one of 〔1〕 to 〔3〕, further containing a plasticizer.) 〔5〕 The temporary fixing adhesive composition according to 〔4〕, wherein the content of the plasticizer is 20 parts by mass or less with respect to a total of 100 parts by mass of the cyanoacrylate compound and the thickener.) 〔6〕 A temporary fixing method including a step of forming an adhesive layer between a first member and a second member with the temporary fixing adhesive composition according to any one of 〔1〕 to 〔5〕, a step of curing the adhesive layer to temporarily fix the first member and the second member, and a step of separating the first member and the second member by bringing the cured adhesive layer into contact with a liquid.)

Advantages of the Invention

[0014] According to the temporary fixing adhesive composition of the present invention, in the temporary fixing step, at the initial stage of bonding members together, while ensuring the time for position adjustment, high adhesive strength is rapidly developed after alignment, and the curing time can be shortened. In addition, it is possible to optimize the time required for separating the temporarily fixed members, and an adhesive composition having good coating properties can be obtained.

Mode for Carrying Out the Invention

[0015] Hereinafter, matters related to the present disclosure will be described in detail. In this specification, the numerical range indicated by "~" includes the numerical values described before and after it as the upper limit value and the lower limit value.

[0016] ≪Adhesive Composition for Temporary Fixing≫ The adhesive composition for temporary fixing of the present disclosure (hereinafter, also simply referred to as "adhesive composition") contains a 2-cyanoacrylate compound, a thickener, and a curing regulator.

[0017] Here, the adhesive composition of the present disclosure containing a 2-cyanoacrylate compound has moisture curability. For this reason, in the adhesive composition of the present disclosure, the 2-cyanoacrylate compound in the composition reacts with the slight moisture present in the air or on the surface of the adherend and cures rapidly. In addition, the cured product obtained by curing the adhesive composition of the present disclosure exhibits good adhesiveness and easy peelability upon contact with a liquid (for example, immersion). Thus, the adhesive composition of the present disclosure having both good adhesiveness and easy peelability is useful as an adhesive composition for temporarily fixing members together. Hereinafter, the components blended in the adhesive composition of the present disclosure and the components optionally blended will be described in detail.

[0018] <2-Cyanoacrylate Compound> The 2-cyanoacrylate compound contained in the adhesive composition of the present disclosure is represented by the following formula (1). CH2=C(CN)-COOR 1 (1) (In formula (1), R 1is a linear or branched alkyl group having 1 to 3 carbon atoms, or a branched alkyl group having 4 or more carbon atoms.)

[0019] In the above formula (1), R 1 When is a linear or branched alkyl group having 1 to 3 carbon atoms, examples of the linear or branched alkyl group having 1 to 3 carbon atoms include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. Further, R 1 When is a branched alkyl group having 4 or more carbon atoms, specific examples of the branched alkyl group having 4 or more carbon atoms include an isobutyl group, a sec-butyl group, a tert-butyl group, an isopentyl group, a sec-pentyl group, a 3-pentyl group, a tert-pentyl group, a neopentyl group, a 2-ethylhexyl group, a 2-octyl group, an isononyl group, an isodecyl group, an isotridecyl group, a hexyl decyl group, an octyl dodecyl group, and the like. When R 1 is a branched alkyl group having 4 or more carbon atoms, from the viewpoint of moderately increasing the flexibility of the cured product formed by the adhesive composition and improving the easy peelability of the cured product when the cured product is brought into contact with a liquid, the number of carbon atoms of R 1 is preferably 4 to 20, more preferably 4 to 10, and still more preferably 4 to 6.

[0020] In addition, when R 1 in the above formula (1) is a linear alkyl group having a relatively large number of carbon atoms (specifically, 4 or more carbon atoms), the flexibility of the cured product (i.e., the adhesive layer) formed by the adhesive composition becomes too high, and it takes time to separate the temporarily fixed members from each other, or residues are likely to remain on the surface of the member after peeling due to cohesive failure.

[0021] Among the above, the 2-cyanoacrylate compound is preferably an ester compound in which a hydrogen atom in the carboxyl group of 2-cyanoacrylic acid is replaced by a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an isobutyl group, a sec-butyl group, a 2-ethylhexyl group or a 2-octyl group. From the viewpoint of making the peelability of the cured product better when the cured product formed by the adhesive composition is brought into contact with a liquid, among these, an ester compound in which a hydrogen atom in the carboxyl group of 2-cyanoacrylic acid is replaced by a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an isobutyl group or a sec-butyl group is more preferable. Note that the adhesive composition may contain one kind of 2-cyanoacrylate compound alone or may contain two or more kinds thereof.

[0022] <Thickener> The thickener is mainly blended into the adhesive composition of the present disclosure in order to adjust the viscosity of the adhesive composition. As the thickener, known compounds as additives for imparting viscosity can be appropriately used.

[0023] Specific examples of the thickener include methyl polymethacrylate, a copolymer of methyl methacrylate and an acrylic ester, a copolymer of methyl methacrylate and a methacrylic ester other than methyl methacrylate, an acrylic rubber, polyvinyl chloride, polystyrene, a cellulose ester, a polyalkyl-2-cyanoacrylate ester, an ethylene-vinyl acetate copolymer, a vinyl chloride-vinyl acetate copolymer, a (meth)acrylic ester-butadiene-styrene copolymer, a vinyl chloride-acrylonitrile copolymer, an ethylene-vinyl acetate copolymer, a lactic acid-caprolactone copolymer, cellulose acetate, cellulose acetate propionate, polyvinyl acetate, polyvinyl pyrrolidone and the like. The thickener may be used alone or in combination of two or more.

[0024] From the perspective of moderately increasing the viscosity of the adhesive composition, the content of the thickener is preferably 2 parts by mass or more, more preferably 5 parts by mass or more, and still more preferably 7 parts by mass or more with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener in the adhesive composition. Also, from the perspective of suppressing the decrease in the curability of the adhesive composition caused by an excessive amount of the thickener, the content of the thickener is preferably 30 parts by mass or less, and more preferably 25 parts by mass or less with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener in the adhesive composition.

[0025] The preferable range of the content of the thickener can be determined by appropriately combining the above-described preferable upper and lower limit values. The content of the thickener is preferably in the range of 2 to 30 parts by mass, more preferably in the range of 5 to 25 parts by mass, and still more preferably in the range of 7 to 25 parts by mass with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener in the adhesive composition.

[0026] <Curing regulator> The curing regulator mainly functions as a curing retarder that delays the start of the curing reaction of the 2-cyanoacrylate compound. A relatively large amount of the curing regulator is blended in the adhesive composition of the present disclosure. Thereby, in the step of temporarily fixing the members, in the initial stage of applying and bonding the adhesive composition to the surface of the members, it is possible to suppress the adhesive composition from instantaneously curing and exhibiting high adhesiveness. Therefore, at the stage of bonding the members with the adhesive composition, re-bonding becomes possible, and the work of adjusting the positions of the members can be performed.

[0027] As the curing regulator, known compounds as stabilizers or anion polymerization inhibitors can be appropriately used. Specific examples of the curing regulator include aliphatic sulfonic acids such as sulfur dioxide and methanesulfonic acid; aromatic sulfonic acids such as p-toluenesulfonic acid; boron trifluoride complexes such as boron trifluoride methanol, boron trifluoride diethyl ether, and boron trifluoride acetate complex; HBF4, trialkyl borate, phosphorus pentoxide, and the like. As the curing regulator, one kind may be used alone, or two or more kinds may be used in combination.

[0028] The content of the curing regulator is 20 to 900 ppm with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener. When the content of the curing regulator is less than 20 ppm with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener, when bonding members with the adhesive composition, the adhesive composition cures in a short time and exhibits a high adhesive strength, and it is not possible to sufficiently secure the time for position adjustment when bonding the members via the adhesive composition. Further, when the content of the curing regulator exceeds 900 ppm with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener, the time (i.e., the curing time) until the adhesive composition cures and exhibits sufficient adhesive strength becomes too long.

[0029] From the viewpoint of shortening the curing time while sufficiently securing the time for position adjustment when bonding members with the adhesive composition, thereby improving workability, the content of the curing regulator is preferably 30 ppm or more, more preferably 50 ppm or more, still more preferably 70 ppm or more, even more preferably 90 ppm or more, and still more preferably 100 ppm or more with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener. Further, the content of the curing regulator is preferably 800 ppm or less, more preferably 750 ppm or less, and still more preferably 700 ppm or less with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener.

[0030] The preferable range of the content of the curing regulator can be determined by appropriately combining the above-described preferable upper limit value and lower limit value. The content of the curing regulator is preferably in the range of 30 to 800 ppm, more preferably in the range of 50 to 750 ppm, and still more preferably in the range of 50 to 700 ppm.

[0031] <Other components> The adhesive composition of the present disclosure may further contain a component different from any of the 2-cyanoacrylate compound, the thickener, and the curing regulator (hereinafter, also referred to as "other components").

[0032] Plasticizer The adhesive composition of the present disclosure may further contain a plasticizer as other components. By further blending a plasticizer into the adhesive composition of the present disclosure, it is possible to effectively suppress the glue residue in which the adhesive composition remains attached to the members after separating the members temporarily fixed by the adhesive composition.

[0033] Specific examples of the plasticizer include phthalic acid esters, fatty acid esters, esters of polyalkylene glycols, phosphate esters, polyethylene glycol, polypropylene glycol, polyethers obtained by converting the hydroxyl groups of polyethylene glycol or polypropylene glycol, chlorinated paraffins, hydrocarbon oils such as alkyldiphenyl and partially hydrogenated terphenyl, ethylene carbonate, polyester type polyfunctional (meth)acrylates having an ester structure of polyhydric alcohol and (meth)acrylic acid, polyfunctional epoxy (meth)acrylates, polyfunctional urethane (meth)acrylates, polyfunctional polyester (meth)acrylates, polyfunctional polyester urethane (meth)acrylates, polyfunctional polyether urethane (meth)acrylates, and other polyfunctional (meth)acrylates.

[0034] Specific examples of the phthalic acid esters include dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diisodecyl phthalate, dihexyl phthalate, diheptyl phthalate, dioctyl phthalate, bis(2-ethylhexyl) phthalate, diisononyl phthalate, diisotridecyl phthalate, dipentadecyl phthalate, and the like. Specific examples of fatty acid esters include triethyl acetyl citrate, tributyl acetyl citrate, dimethyl adipate, diethyl adipate, dipropyl adipate, diisopropyl adipate, dibutyl adipate, diisobutyl adipate, dimethyl succinate, diethyl succinate, dibutyl succinate, dimethyl sebacate, diethyl sebacate, dioctyl terephthalate, glyceryl triacetate, diisopropyl fumarate, dibutyl fumarate, diisononyl isophthalate, decyl toluate, bis(2-ethylhexyl) camphorate, 2-ethylhexyl cyclohexyl carboxylate, and triglyceride caproate, etc.

[0035] Specific examples of esters of polyalkylene glycols include diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, diethylene glycol dibenzoate, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dibenzoate, etc. Specific examples of phosphate esters include tricresyl phosphate, tributyl phosphate, etc.

[0036] Specific examples of polyester-type polyfunctional (meth)acrylates include ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like. Further specific examples of polyester-type polyfunctional (meth)acrylates include alkylene oxide-modified polyester-type polyfunctional (meth)acrylates having an oxyalkylene chain between a polyhydric alcohol and (meth)acrylic acid, and polyfunctional (meth)acrylates containing a caprolactone adduct. Specific examples of alkylene oxide-modified polyester-type polyfunctional (meth)acrylates include trimethylolpropane propylene oxide-modified tri(meth)acrylate, ethylene oxide-modified bisphenol A di(meth)acrylate, 3-(meth)acryloyloxy glycerin mono(meth)acrylate, bisphenol A-diepoxy-(meth)acrylic acid adduct, dipentaerythritol propylene oxide-modified hexa(meth)acrylate, and the like. As the plasticizer, one kind may be used alone, or two or more kinds may be used in combination.

[0037] The plasticizer blended in the adhesive composition of the present disclosure is preferably a hydrophilic plasticizer. Here, in the present specification, the "hydrophilic plasticizer" refers to a plasticizer having a logP (octanol / water partition coefficient) of 1.5 or less. The logP of the hydrophilic plasticizer is preferably -1.0 or more and 1.2 or less.

[0038] Preferred specific examples of the hydrophilic plasticizer include fatty acid esters, esters of polyalkylene glycols, and polyester-type polyfunctional (meth)acrylates. Further preferred specific examples of the hydrophilic plasticizer include dimethyl adipate, dimethyl succinate, diethyl succinate, glyceryl triacetate, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, ethylene carbonate, ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and the like.

[0039] Although the content of the plasticizer in the adhesive composition of the present disclosure is not particularly limited, from the viewpoint of improving the workability of the temporary fixing step and suppressing the decrease in adhesive strength, it is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and still more preferably 10 parts by mass or less with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener. The lower limit of the content of the plasticizer is preferably 1 part by mass or more with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener from the viewpoint of sufficiently suppressing the glue residue of the adhesive composition when separating the members after bonding the members together.

[0040] (Thixotropic agent) The adhesive composition of the present disclosure may further contain a thixotropic agent as another component. The thixotropic agent is arbitrarily blended into the adhesive composition for the purpose of adjusting the flow behavior of the adhesive composition. Examples of the thixotropic agent to be blended into the adhesive composition of the present disclosure include organic thixotropic agents and inorganic thixotropic agents.

[0041] Examples of the organic thixotropic agent include hydrogenated castor oil, amine-modified hydrogenated castor oil, polyamide, etc. In the amine-modified hydrogenated castor oil, the amine compound used for modifying the hydrogenated castor oil is preferably an aliphatic diamine. Specific examples of the aliphatic diamine include 1,2-ethylenediamine, 1,3-propanediamine, 1,6-hexanediamine, etc. Examples of the inorganic thixotropic agent include hydrophobic fumed silica, precipitated silica, or a combination thereof.

[0042] When a thixotropic agent is blended into the adhesive composition of the present disclosure, the content of the thixotropic agent is, for example, 2 to 20 parts by mass, and may be 2 to 15 parts by mass with respect to a total of 100 parts by mass of the 2-cyanoacrylate compound and the thickener.

[0043] Examples of other components include, in addition to the above, for example, particles, colorants, fragrances, solvents, strength improvers, etc. The content of these components can be appropriately set according to the use of the adhesive composition and the like within a range that does not impair the effects of the present invention.

[0044] The adhesive composition of the present disclosure can be produced by mixing the above-described 2-cyanoacrylate compound, thickener, and curing regulator, and other components optionally blended. The method of mixing each component is not particularly limited and can be carried out according to a known method. For example, it can be obtained by mixing the 2-cyanoacrylate compound, thickener, and curing regulator, preferably with stirring, at a temperature of 0 to 60°C.

[0045] <Viscosity> The adhesive composition of the present disclosure is preferably a liquid composition obtained by mixing a 2-cyanoacrylate compound, a thickener, a curing regulator, and optionally other components. The adhesive composition of the present disclosure has a viscosity at 25°C of 1,000 to 15,000 mPa·s. When the viscosity of the adhesive composition is less than 1,000 mPa·s, dripping is likely to occur when the adhesive composition is applied to the adherend. On the other hand, when the viscosity of the adhesive composition exceeds 15,000 mPa·s, the viscosity may be too high to uniformly apply the adhesive composition to the adherend.

[0046] From the viewpoint of improving the coatability of the adhesive composition and enhancing the working efficiency, the viscosity of the adhesive composition is more preferably 1,200 mPa·s or more, still more preferably 1,300 mPa·s or more, and even more preferably 1,500 mPa·s or more. Also, the viscosity of the adhesive composition is more preferably 14,000 mPa·s or less, still more preferably 13,000 mPa·s or less, and even more preferably 10,000 mPa·s or less. Further, the preferable range of the viscosity of the adhesive composition can be determined by appropriately combining the above-described preferable upper and lower limit values. The viscosity of the adhesive composition preferably ranges from 1,200 to 14,000 mPa·s, more preferably from 1,300 to 13,000 mPa·s. In this specification, the viscosity of the adhesive composition is a value measured at 25°C using an E-type viscometer (cone-plate viscometer). Details of the measurement method follow the method described in the examples below.

[0047] <Adhesive strength> In the initial stage of temporarily fixing the members using the adhesive composition of the present disclosure, that is, at the stage of bonding the members together with the adhesive composition, the adhesive strength developed by the curing of the adhesive composition is relatively small, whereby sufficient time for alignment can be ensured when bonding the members together through the adhesive composition. On the other hand, the time required until sufficient adhesive strength is developed after bonding the members together with the adhesive composition is short, enabling shortening of the curing time. Such an adhesive composition of the present disclosure is excellent in workability.

[0048] Specifically, the compression shear adhesion strength after 3 minutes of bonding glass substrates together with the adhesive composition of the present disclosure is preferably 0.50 MPa or less. The compression shear adhesion strength after 3 minutes is more preferably 0.45 MPa or less, still more preferably 0.40 MPa or less, even more preferably 0.30 MPa or less, yet more preferably 0.25 MPa or less, and still yet more preferably 0.20 MPa or less. The lower limit of the compression shear adhesion strength after 3 minutes of bonding glass substrates together with the adhesive composition is not particularly limited, and may be, for example, 0.01 MPa or more.

[0049] Also, the compression shear adhesion strength after 20 minutes of bonding glass substrates together with the adhesive composition of the present disclosure is preferably 0.8 MPa or more. The compression shear adhesion strength after 20 minutes is more preferably 0.9 MPa or more, still more preferably 1.0 MPa or more, and even more preferably 1.1 MPa or more. The upper limit of the compression shear adhesion strength after 20 minutes of bonding glass substrates together with the adhesive composition of the present disclosure is not particularly limited, and may be, for example, 8.0 MPa or less. In addition, in this specification, the compression shear adhesion strength after bonding glass substrates together with the adhesive composition of the present disclosure is a value measured in an environment of 23°C and 50% RH in accordance with JIS K 6852-1994. Details of the measurement method follow the measurement method of the examples described later.

[0050] The ratio of the compression shear adhesion strength P1 after 3 minutes to the compression shear adhesion strength P2 after 20 minutes of bonding glass substrates together with the adhesive composition of the present disclosure, when expressed as the ratio (P2 / P1) of the adhesion strength P2 to the adhesion strength P1, is preferably 5.0 or more, more preferably 6.0 or more, and still more preferably 7.0 or more.

[0051] In the stage of processing using the members to be bonded by the adhesive composition of the present disclosure, that is, in the stage where sufficient adhesive strength is exhibited after bonding the members with the adhesive composition, a higher adhesive strength between the members can suppress unintended peeling during processing. On the other hand, after bonding the members with the adhesive composition of the present disclosure, when the bonded members are immersed in a liquid such as warm water and a certain period of time has elapsed, the adhesive strength between the members in the liquid decreases to a certain range. Such an adhesive composition of the present disclosure is excellent as an adhesive for temporarily fixing members and then peeling the members from each other.

[0052] Specifically, the compression shear adhesive strength 24 hours after bonding aluminum substrates with the adhesive composition of the present disclosure (hereinafter, also referred to as "compression shear adhesive strength 24 hours after") is preferably 3.0 MPa or more from the viewpoint of ensuring good workability in the temporary fixing process. The compression shear adhesive strength 24 hours after is more preferably 5.0 MPa or more, and even more preferably 8.0 MPa or more. The upper limit of the compression shear adhesive strength 24 hours after is not particularly limited, and may be, for example, 15.0 MPa or less. In this specification, the compression shear adhesive strength after bonding aluminum substrates with the adhesive composition is a value measured under the environment of 23°C and 50% RH in accordance with JIS K 6852-1994. Details of the measurement method follow the measurement method of the examples described later.

[0053] In addition, the compression shear adhesion strength in warm water after immersing aluminum substrates bonded together with the adhesive composition of the present disclosure in warm water at 80°C for 1 hour 24 hours after bonding (hereinafter also referred to as "compression shear adhesion strength in warm water at 80°C") is preferably 7.0 MPa or less, more preferably 4.0 MPa or less, from the viewpoint of making the time until the members peel off appropriately long. The lower limit of the compression shear adhesion strength in warm water at 80°C is not particularly limited, but is preferably more than 1.0 MPa from the viewpoint of suppressing peeling of the members at an unintended timing. In the present specification, the compression shear adhesion strength in warm water after immersing in warm water at 80°C for 1 hour after bonding aluminum substrates together with the adhesive composition is a value measured under the condition of immersion in warm water at 80°C in accordance with JIS K 6852-1994. Details of the measurement method follow the measurement method of the examples described later.

[0054] ≪Temporary fixing method≫ Next, a method for temporarily fixing members using the adhesive composition of the present disclosure described above will be explained. The temporary fixing method of the present disclosure includes the following layer forming step, temporary fixing step, and separation step. Layer forming step: A step of forming an adhesive layer between a first member and a second member with the adhesive composition of the present disclosure Temporary fixing step: A step of curing the adhesive layer formed in the layer forming step to temporarily fix the first member and the second member Separation step: A step of separating the first member and the second member by bringing the cured adhesive layer into contact with a liquid Hereinafter, each step included in the temporary fixing method of the present disclosure will be explained.

[0055] <Layer forming step> The adherends (i.e., the first member and the second member) to be temporarily fixed by the adhesive composition are not particularly limited. Examples of the adherends include members formed of metals, minerals (such as quartz), resins, ceramics, rubber, glass, wood, plants, cloth, ceramics, leather, concrete, or combinations of two or more of these. The members to be temporarily fixed by the adhesive composition may be made of the same material or different materials. In addition, the shapes and sizes of the first member and the second member are not particularly limited.

[0056] Specific examples of members to be temporarily fixed with the adhesive composition of the present disclosure include various members such as electronic materials such as semiconductor wafers and chips, optical materials such as ingots, lenses, prisms, polarizers, optical fibers, and optical waveguides, quartz crystal oscillators, piezoelectric elements, building materials, wall materials, lumber, wooden boards, plywood, woodwork products, glass windows, decorative items, sensors, jigs such as polishing plates, mounting tables, supports, teaching materials, pottery, porcelain, woven fabrics, nonwoven fabrics, paper, threads, fibers, leather products, etc. In the temporary fixing method of the present disclosure, the same types of these members may be temporarily fixed to the adhesive composition, or different types of these members may be temporarily fixed to each other.

[0057] The method of applying the adhesive composition to the adherend and forming an adhesive layer made of the adhesive composition is not particularly limited. For example, the adhesive composition can be dropped onto the adherend, or the adhesive composition can be attached to the adherend in a planar, linear, strip or dot shape, or other various methods. When applying the adhesive composition to the adherend, a dispenser, coater, roll, brush, spatula, spray, application tool, or the like may be used according to the shape of the adherend. Alternatively, a method may be adopted in which the adherend that has been laminated in advance is immersed in the adhesive composition and the adhesive composition is allowed to penetrate into the gaps in the adherend. In addition, when applying the adhesive composition, the adhesive composition may be applied to the entire surface of the adherend, or the adhesive composition may be applied locally. The amount of the adhesive composition to be applied is not particularly limited, but it is preferable to apply a moderately small amount in order to rapidly cure the 2-cyanoacrylate compound in the adhesive composition by a slight amount of moisture in the air or on the surface of the adherend in the next temporary fixing step to express adhesive performance.

[0058] <Temporary Fixing Process> In the temporary fixing process, a sufficiently high adhesive strength is developed by curing the adhesive layer formed between the members into a cured product, thereby temporarily fixing the members to each other. Since the adhesive composition of the present disclosure starts curing with moisture, a cured product can be formed without providing special devices or conditions for curing, and the members can be adhered to each other by the cured product. In order to accelerate the curing reaction, within a range that does not affect the members to be temporarily fixed, for example, heating to about 40 to 60 °C may be performed to carry out the curing reaction.

[0059] <Separation Process> In the separation process, the first member and the second member are separated to release the temporarily fixed state by bringing the adhesive layer (i.e., the cured product) after curing in the temporary fixing process into contact with a liquid. The liquid brought into contact with the cured adhesive layer is preferably an aqueous solvent, and examples thereof include water, alcohol, or a mixture thereof. The method of bringing the cured adhesive layer into contact with the liquid is not particularly limited, and examples thereof include a method of immersing the temporarily fixed member in the liquid; a method of applying running water; a method of spraying the liquid onto the temporarily fixed member; and the like.

[0060] The temperature of the liquid brought into contact with the cured adhesive layer depends on the melting point and boiling point of the liquid, but is, for example, 5 to 97 °C, and preferably 10 to 95 °C. The time for bringing the cured adhesive layer into contact with the liquid can be appropriately set according to the contact method and temperature of the liquid. The contact time with the liquid can be, for example, in the range of 10 seconds to 12 hours, and may be about 10 seconds to 1 hour.

[0061] Note that the temporary fixing method of the present disclosure may further include steps other than the above. For example, the temporary fixing method of the present disclosure may further include a step of processing the temporarily fixed member into a desired shape (hereinafter, also referred to as the "processing step") between the temporary fixing step and the peeling step. In the processing step, various treatments such as cutting, grinding, polishing, and etching may be performed on the temporarily fixed member to obtain a desired shape.

[0062] ≪Applications≫ When the adhesive composition of the present disclosure described above is used to bond members with the composition interposed therebetween, it can be easily and rapidly cured by slight moisture in the air or on the surface of the members, and one member can be fixed to the other member. Further, by bringing the adhesive layer of the members fixed by the adhesive composition of the present disclosure into contact with a liquid, the temporarily fixed members can be easily separated from each other. Therefore, each process of temporary fixing and separation can be performed while suppressing contamination of the members. Such an adhesive composition of the present disclosure is suitable for use in temporarily fixing a semiconductor wafer, an optical member, or a crystal oscillator to other members (for example, a support such as a support substrate or a fixing jig, a mounting table, etc.), and is particularly suitable for temporarily fixing a semiconductor wafer.

[0063] In addition, the adhesive composition of the present disclosure can easily peel off the temporarily fixed members from each other by a simple process such as bringing the adhesive layer of the members fixed by the adhesive composition of the present disclosure into contact with a liquid. Therefore, even when it is desired to change the fixing position after temporarily fixing the members to each other, the fixing position can be easily readjusted by performing the process of bringing the adhesive layer into contact with a liquid. Therefore, the adhesive composition of the present disclosure can also be applied to temporarily fixing building materials or wood, which are mainly used at construction sites or in households where DIY is carried out. Furthermore, the adhesive composition of the present disclosure can be used as a one-component solvent-free adhesive that cures rapidly even at room temperature, and is more useful in terms of workability.

Examples

[0064] Hereinafter, the present invention will be specifically described based on examples. Note that the present invention is not limited to the following examples. In the following, "parts" and "%" mean "parts by mass" and "mass%" respectively unless otherwise specified.

[0065] <Manufacture of the adhesive composition for temporary fixing (1)> [Example 1] As the 2-cyanoacrylate compound, 87 parts by mass of methyl 2-cyanoacrylate was blended with 600 ppm of boron trifluoride diethyl ether as a curing regulator, and the mixture was stirred at 23°C for 1 hour. Next, 13 parts by mass of a thickener (methyl polymethacrylate, molecular weight 400,000) was added, and the mixture was stirred at 60°C for 6 hours to produce an adhesive composition.

[0066] [Examples 2, 3, and 8, and Comparative Examples 1, 3 to 7] An adhesive composition was produced in the same manner as in Example 1, except that the composition of the adhesive composition was changed as shown in Table 1.

[0067] [Example 4] As the 2-cyanoacrylate compound, 90 parts by mass of ethyl 2-cyanoacrylate was blended with 50 ppm of boron trifluoride diethyl ether as a curing regulator, and the mixture was stirred at 23°C for 1 hour. Next, 10 parts by mass of a thickener (methyl polymethacrylate, molecular weight 100,000) was added, and the mixture was stirred at 60°C for 6 hours. To this, 9 parts by mass of Aerosil (registered trademark, trade name "RX-200", manufactured by Nippon Aerosil Co., Ltd.) as a thixotropic agent was added and dispersed with a disper to produce an adhesive composition.

[0068] [Examples 5 to 7 and Comparative Example 2] An adhesive composition was produced in the same manner as in Example 4, except that the composition of the adhesive composition was changed as shown in Table 1.

[0069]

Table 1

[0070] The symbols of each component described in Table 1 mean the following compounds. (2-Cyanoacrylate compound) A-1: Methyl 2-cyanoacrylate A-2: Ethyl 2-cyanoacrylate A-3: Isopropyl 2-cyanoacrylate A-4: n-Butyl 2-cyanoacrylate A-5: Ethoxyethyl 2-cyanoacrylate A-6: 2-[2-(2-Methoxyethoxy)ethoxy]ethyl 2-cyanoacrylate (Thickening agent) B-1: Poly(methyl methacrylate), molecular weight 400,000 B-2: Poly(methyl methacrylate), molecular weight 100,000 (Thixotropic agent) RX-200: Aerosil, manufactured by Nippon Aerosil Co., Ltd. (Hardening regulator) BF3·Et2O: Boron trifluoride diethyl ether

[0071] (Measurement and evaluation) Using the adhesive compositions of Examples 1 to 8 and Comparative Examples 1 to 7, the following measurements (1) and (2) were carried out, and the following items (3) to (6) were evaluated.

[0072] (1) Measurement of viscosity Using a viscometer (RE215SR / U type, manufactured by Toki Sangyo Co., Ltd.), the viscosity at a shear rate of 5 rpm was measured under the conditions of a cone rotor: 1°34×R24 and 25°C. The measurement results are shown in Table 2.

[0073] (2) Measurement of adhesive strength 3 minutes and 20 minutes after bonding According to the method specified in JIS K 6852-1994, using a glass plate test piece (30 mm×25 mm×8 mm) as a test piece assuming the material to be processed, two glass plate test pieces were bonded together (adhesive area 20 mm×25 mm) under the environment of 23°C and 50%RH with each adhesive composition, and the compressive shear adhesive strength was measured 3 minutes and 20 minutes after bonding. The measurement results are shown in Table 2.

[0074] (3) Evaluation of coatability Based on the measurement results of viscosity, the coatability was evaluated according to the following criteria. The evaluation results are shown in Table 2. ○: 1,000~15,000 mPa·s (Viscosity range where dripping does not occur and uniform coating is possible) ×: Other than the above (Dripping occurs when less than 1,000 mPa·s, and uniform coating is difficult when exceeding 15,000 mPa·s)

[0075] (4) Evaluation of Workability (Adhesion Time) Based on the measurement results of the adhesive strength, the workability was evaluated according to the following criteria. · After 3 minutes from bonding ○: Adhesive strength less than 0.5 MPa (Position adjustment is possible after bonding) ×: Adhesive strength 0.5 MPa or more (Insufficient time for position adjustment can be ensured after bonding) · After 20 minutes from bonding ○: Adhesive strength 1.0 MPa or more (Good adhesive strength after a certain time from bonding, shortening of the curing time is possible) ×: Adhesive strength less than 1.0 MPa (Insufficient adhesive strength after a certain time from bonding, prolongation of the curing time) For Comparative Example 3, since the glass plate test piece was broken in the measurement of the adhesive strength, it was indicated as "-" in Table 2.

[0076] (5) Evaluation of Peel Time and Peel State (Glass) A slide glass (26 mm × 76 mm × 1.0 - 1.2 mm, manufactured by Matsunami Glass Industry Co., Ltd.) cut in half was used. Using each adhesive composition, the slide glasses were bonded and temporarily fixed (adhesive area 5 mm × 30 mm) in an environment of 23°C and 50% RH. After curing for 24 hours, the bonded slide glasses were immersed in warm water heated to 95°C. The time until the slide glasses separated from each other after immersion in the warm water was measured, and the glass surface at the time of peeling was observed to evaluate the peel state. The evaluation criteria are as follows. · Peel Time ○: Peel time 30 minutes to 1 hour (The time until peeling is moderately long and good) ×: Other than the above (The time until peeling is too short or too long) · Peel State (Glass) ○: No glue residue ×: With glue residue

[0077] (6) Evaluation of Peel State (Iron) Cold-rolled steel sheet SPCC-SB (50 mm × 25 mm × 1.6 mm, manufactured by TP Giken Co., Ltd.) was used, and each adhesive composition was used to apply the adhesive to the cold-rolled steel sheet at 23°C and 50% RH environment (coating area 25 mm × 25 mm). After curing for 24 hours, the cold-rolled steel sheet coated with the adhesive was immersed in warm water heated to 80°C. One hour after immersion in the warm water, the peeling state of the adhesive layer from the steel sheet was evaluated. The evaluation criteria are as follows. · Peeling state (iron) A: The adhesive layer peels off in a film form B: Part of the adhesive layer peels off in a film form C: Adhesive residue occurs due to the adhesive layer -: The adhesive layer was dissolved by immersion in warm water, so evaluation was impossible

[0078]

Table 2

[0079] As shown in Table 2, the adhesive compositions of Examples 1 to 8 were evaluated as "○" in terms of all items of coating properties, workability (ensuring alignment time, shortening curing time), peeling time (optimizing the time required for peeling), and peeling state (reducing adhesive residue), and the balance of various performances was achieved.

[0080] In contrast, in Comparative Example 1 where the viscosity of the adhesive composition was as low as 2 mPa·s, dripping occurred when applied to the adherend, and in Comparative Example 2 where the viscosity was as high as 21,000 mPa·s, the adhesive composition could not be uniformly applied to the adherend. Further, in Comparative Example 3 where the amount of the curing regulator was small, the adhesive strength at 3 minutes after bonding the members together was too high, and in Comparative Example 4 where the amount of the curing regulator was large, the adhesive strength was insufficient after 20 minutes had elapsed since bonding the members together. In Comparative Example 5 using n-butyl 2-cyanoacrylate and Comparative Example 6 using ethoxyethyl 2-cyanoacrylate as the 2-cyanoacrylate compound, the time required for peeling became too short and glue residue also occurred. In Comparative Example 7 using 2-[2-(2-methoxyethoxy)ethoxy]ethyl 2-cyanoacrylate as the 2-cyanoacrylate compound and not containing a thickener, immediately after immersing the temporarily fixed members in warm water, it gradually melted from the edge of the adhesive layer and the members peeled off from each other in a short time.

[0081] <Manufacture of Temporarily Fixing Adhesive Composition (2)> [Example 9] 92 parts by mass of ethyl 2-cyanoacrylate as the 2-cyanoacrylate compound, 600 ppm of boron trifluoride diethyl ether as the curing regulator, and 10 parts by mass of diethylene glycol dimethyl ether as the plasticizer were blended and stirred at 23°C for 1 hour. Next, 8 parts by mass of a thickener (methyl polymethacrylate, molecular weight 400,000) was added and stirred at 60°C for 6 hours. To this, 8 parts by mass of Aerosil (registered trademark, product name "RX-200", manufactured by Nippon Aerosil Co., Ltd.) as a thixotropic agent was added and dispersed with a disper to produce an adhesive composition.

[0082] [Examples 10 to 21] An adhesive composition was produced in the same manner as in Example 9 except that the composition of the adhesive composition was changed as shown in Table 3. Table 3 also shows Example 7 having the same composition except for not containing a plasticizer.

[0083]

Table 3

[0084] The symbols of each component described in Table 3 mean the following compounds. (2-cyanoacrylate compound) A-2: Ethyl 2-cyanoacrylate (Thickener) B-1: Methyl polymethacrylate, molecular weight 4,000,000 (Thixotropic agent) RX-200: Aerosil, manufactured by Nippon Aerosil Co., Ltd. (Curing regulator) BF3·Et2O: Boron trifluoride diethyl ether (Plasticizer) C-1: Diethylene glycol dimethyl ether, logP: -0.45 C-2: Ethylene carbonate, logP: -0.45 C-3: Glycerol triacetate, logP: 0.22 C-4: Diethylene glycol diethyl ether, logP: 0.57 C-5: Polyethylene glycol diacrylate, logP: 1.00 C-6: Diethylene glycol dibutyl ether, logP: 2.61 C-7: Tributyl acetylcitrate, logP: 4.71 C-8: Ethylene oxide-modified trimethylolpropane triacrylate, logP: 1.63

[0085] <Measurement and evaluation> Using the adhesive compositions of Examples 9 to 21, the following measurements (1) and (2) were carried out, and the following items (3) to (5) were evaluated. Also, for comparison, the adhesive composition of Example 7, which has the same composition as Examples 9 to 21 except that it does not contain a plasticizer, was also measured and evaluated in the same manner as Examples 9 to 21.

[0086] (1) Measurement of viscosity Using a viscometer (RE215SR / U type, manufactured by Toki Sangyo Co., Ltd.), the viscosity at a shear rate of 5 rpm was measured under the conditions of a cone rotor: 1°34×R24 and 25°C. The measurement results are shown in Table 4.

[0087] (2) Measurement of the compression shear adhesion strength in warm water after 24 hours from lamination and after immersion in 80°C warm water for 1 hour Using the method in accordance with JIS K 6852-1994, two aluminum substrates (25 mm × 50 mm × 2.0 mm) were used as test pieces assuming the work piece materials, and the two aluminum substrates were laminated in an environment of 23°C and 50% RH with each adhesive composition (adhesive area: 25 mm × 12.5 mm). The compression shear adhesion strength after 24 hours of curing from lamination was measured in an environment of 23°C. Similarly, using the method in accordance with JIS K 6852-1994, test pieces with two aluminum substrates laminated with each adhesive composition were immersed in 80°C warm water using a water bath, and the compression shear adhesion strength after 1 hour from immersion was measured in a warm water environment of 80°C. The measurement results are shown in Table 4.

[0088] (3) Evaluation of coatability Based on the measurement results of viscosity, the coatability was evaluated according to the following criteria. The evaluation results are shown in Table 4. ○: 1,000~15,000 mPa·s (Viscosity range where dripping does not occur and uniform coating is possible) ×: Others than the above (Dripping occurs when less than 1,000 mPa·s, and uniform coating is difficult when exceeding 15,000 mPa·s)

[0089] (4) Evaluation of compression shear adhesion strength Based on the measurement results of the adhesion strength, the adhesion strength was evaluated according to the following criteria. · Adhesion strength after 24 hours from laminating two aluminum substrates A: Adhesion strength of 8.0 MPa or more (The adhesion strength is sufficiently high and the workability in the temporary fixing process is very good) B: Adhesion strength of 5.0 MPa or more and less than 8.0 MPa (The adhesion strength is high and the workability in the temporary fixing process is good) C: Adhesion strength of 3.0 MPa or more and less than 5.0 MPa (The adhesion strength is slightly high and the workability in the temporary fixing process is good) · Adhesion strength in warm water 1 hour after immersion in 80°C warm water 24 hours after laminating two aluminum substrates A: Adhesion strength is 1.0 MPa or more and less than 4.0 MPa (the load required for peeling is moderately strong and good) B: Adhesion strength is 4.0 MPa or more and less than 7.0 MPa (the load required for peeling is slightly strong) C: Adhesion strength is less than 1.0 MPa (the load required for peeling is slightly weak)

[0090] (5) Evaluation of peeling state (iron) Using cold-rolled steel sheet SPCC-SB (50 mm × 25 mm × 1.6 mm, manufactured by TP Giken Co., Ltd.), the adhesive composition was applied to the cold-rolled steel sheet in an environment of 23°C and 50% RH using each adhesive composition (coating area: 25 mm × 25 mm). After curing for 24 hours, the cold-rolled steel sheet coated with the adhesive composition was immersed in warm water heated to 80°C. One hour after immersion in warm water, the way the adhesive layer peeled off from the steel sheet was evaluated. The evaluation criteria are as follows. · Peeling state (iron) A: The adhesive layer peels off in a film shape B: Part of the adhesive layer peels off in a film shape C: Adhesive residue remains due to the adhesive layer

[0091]

Table 4

[0092] Furthermore, for the adhesive compositions of Examples 9 to 21 to which a plasticizer was further compounded, the coating properties were good, and they also had good adhesiveness and easy peelability, just like the adhesive composition of Example 7 having the same composition except for not containing a plasticizer. When examined in more detail, the adhesive compositions of Examples 9 to 14 to which a hydrophilic plasticizer was compounded had good evaluations in terms of coating properties, evaluation of adhesion strength (processability between bonded members, peelability in warm water), and peeling state (iron) (reduction of adhesive residue), and the balance of various performances was achieved. Also, the adhesive compositions of Examples 9 to 14 had less adhesive residue on the steel sheet compared to the adhesive composition of Example 7.

[0093] For the adhesive compositions of Examples 17 to 19 using plasticizers with logP exceeding 1.5, the compressive shear adhesion strength in warm water after immersion in warm water at 80°C for 1 hour was slightly higher compared to the adhesive composition of Example 7. Also, for the adhesive compositions of Examples 17 to 19, slight glue residue occurred on the steel plate compared to the adhesive compositions of Examples 9 to 14. Among Examples 15, 16, 20, and 21 with a high content of plasticizer, in the adhesive compositions of Examples 15, 16, and 21, the compressive shear adhesion strength 24 hours after bonding aluminum substrates together was slightly decreased compared to the adhesive composition of Example 7, and in the adhesive composition of Example 20, the compressive shear adhesion strength in warm water after immersion in warm water at 80°C for 1 hour was slightly decreased.

Claims

1. An adhesive composition for temporary fixation, comprising: a cyanoacrylate compound represented by the following formula (1): CH ２ =C(CN)-COOR １ (1) (In formula (1), R １ is a linear or branched alkyl group having 1 to 3 carbon atoms, or a branched alkyl group having 4 or more carbon atoms.) a thickener; a curing regulator; wherein the content of the curing regulator is 20 to 900 ppm with respect to a total of 100 parts by mass of the cyanoacrylate compound and the thickener, and the viscosity at 25°C is 1,000 to 15,000 mPa·s. An adhesive composition for temporary fixation.

2. The adhesive composition for temporary fixation according to Claim 1, wherein the compression shear adhesive strength after 3 minutes of bonding glass substrates with each other using the adhesive composition for temporary fixation is 0.5 MPa or less, and the compression shear adhesive strength after 20 minutes of bonding glass substrates with each other using the adhesive composition for temporary fixation is 1.0 MPa or more.

3. The adhesive composition for temporary fixation according to Claim 1, which is for temporary fixation of a semiconductor wafer.

4. The adhesive composition for temporary fixation according to Claim 1, further comprising a plasticizer.

5. The adhesive composition for temporary fixation according to Claim 4, wherein the content of the plasticizer is 20 parts by mass or less with respect to a total of 100 parts by mass of the cyanoacrylate compound and the thickener.

6. A temporary fixation method, comprising: forming an adhesive layer between a first member and a second member with the adhesive composition for temporary fixation according to any one of Claims 1 to 5; curing the adhesive layer to temporarily fix the first member and the second member; and separating the first member and the second member by bringing the cured adhesive layer into contact with a liquid. A temporary fixation method.

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