Connector

Abstract

To provide a connector that can improve mountability to a circuit board.SOLUTION: Connectors 10, 10A have outer conductors 12, 13, an inner conductor 11 located inside the outer conductors 12, 13, and a dielectric body 14 interposed between the inner conductor 11 and the outer conductors 12, 13. The outer conductors 12, 13 have a bottom surface 46 opposite the board surface of a circuit board 100, a drawer 42 opening in the bottom surface 46 to draw out the inner conductor 11 toward the circuit board 100, mounting parts 47, 48 protruding from the bottom surface 46, and board installation parts 51, 52 protruding at least one on each side across a mounting area 49 where the mounting parts 47, 48 and the drawer 42 are formed on the bottom surface 46, the leading edge of which is positioned ahead of the leading edge of the mounting parts 47, 48.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a connector.

Background Art

[0002] The connector disclosed in Patent Document 1 includes a plug body (hereinafter referred to as an outer conductor) and an internal conductor portion (hereinafter referred to as an inner conductor) disposed inside the plug body. The outer conductor has a bottom surface facing the plate surface of the circuit board. On the bottom surface of the outer conductor, a mounting portion electrically connected to the ground conductive path of the circuit board is provided. The inner conductor penetrates the bottom surface of the plug body, and the lower end portion is electrically connected to the signal conductive path of the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The mounting portion of the outer conductor is soldered and connected to the copper foil (conductive layer) of the circuit board. For example, during reflow, if the tip surface of the mounting portion is displaced with respect to the circuit board, there is a concern that the mounting portion may contact the resist (insulating layer, resin layer) of the circuit board, and an appropriate solder connection state cannot be obtained.

[0005] Therefore, an object of the present disclosure is to provide a connector capable of improving the mountability to a circuit board.

Means for Solving the Problems

[0006] The connector of the present disclosure includes a conductive outer conductor, a conductive inner conductor disposed inside the outer conductor, and an insulating dielectric interposed between the inner conductor and the outer conductor. The outer conductor has a bottom surface facing the board surface of the circuit board, an outlet opening on the bottom surface for drawing out the inner conductor to the circuit board side, a mounting portion protruding from the bottom surface, and at least one substrate installation portion protruding from both sides of the bottom surface sandwiching the mounting area where the mounting portion and the outlet are formed, and having a tip surface positioned ahead of the tip surface of the mounting portion. It is a connector.

Advantages of the Invention

[0007] According to the present disclosure, a connector capable of improving the mountability to a circuit board can be provided.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0009] [Description of Embodiments of the Present Disclosure] First, the embodiments of the present disclosure will be listed and described. The connector of the present disclosure is (1) A conductive outer conductor, a conductive inner conductor disposed inside the outer conductor, and an insulating dielectric interposed between the inner conductor and the outer conductor, wherein the outer conductor includes a bottom surface facing the board surface of a circuit board, an outlet opening in the bottom surface for drawing out the inner conductor to the circuit board side, a mounting portion projecting from the bottom surface, and at least one substrate mounting portion projecting from each of both sides of the bottom surface sandwiching a mounting area where the mounting portion and the outlet are formed, and a tip surface of the substrate mounting portion is located ahead of a tip surface of the mounting portion.

[0010] According to the above configuration, a gap can be formed between the tip surface of the mounting portion and the board surface of the circuit board in a state where the tip surface of the substrate mounting portion is supported by the board surface of the circuit board. Therefore, even if the mounting portion is displaced with respect to the circuit board during reflow, the solder can follow the mounting portion, and a solder fillet can be formed between the board surface of the circuit board and the mounting portion. In particular, since at least one substrate mounting portion projects from each of both sides of the outer conductor's bottom surface sandwiching the mounting area, the gap formed between the tip surface of the mounting portion and the board surface of the circuit board can be maintained at an appropriate size.

[0011] (2) In the connector according to (1) above, the outer conductor has a base portion and a cylindrical portion projecting forward from the base portion, the bottom surface is disposed between the base portion and the board surface, and it is preferable that at least one substrate mounting portion projects from each of the front and rear sides of the outer conductor sandwiching the mounting area.

[0012] The outer conductor has its center of gravity positioned forward by the cylindrical portion projecting forward from the base portion. Then, there is a concern that the mounting portion may tilt with respect to the board surface of the circuit board. However, according to the above configuration, since the substrate mounting portion located in front of the mounting area is supported by the board surface of the circuit board, tilting of the mounting portion with respect to the circuit board can be suppressed.

[0013] (3) In the connector according to (2) above, further comprising an insulating housing that holds the outer conductor and is disposed on the front side of the outer conductor, the cylindrical portion protrudes into the interior of the housing, and it is preferable that the circuit board installation portion located on the front side of the mounting area is disposed within the range in the front-rear direction of the housing.

[0014] According to the above configuration, since the circuit board installation portion located on the front side of the mounting area is supported on the board surface of the circuit board within the range in the front-rear direction of the housing, it is possible to effectively suppress the inclination of the outer conductor to the front side.

[0015] (4) In the connector according to any one of (1) to (3) above, it is preferable that the circuit board installation portions protrude in pairs at intervals in the left-right direction on both the front and rear sides sandwiching the mounting area.

[0016] According to the above configuration, the outer conductor is stably supported on the circuit board by each circuit board installation portion, and the gap formed between the front end surface of the mounting portion and the board surface of the circuit board can be adjusted to be constant. Thereby, a better solder fillet can be formed between the board surface of the circuit board and the mounting portion.

[0017] [Details of Embodiments of the Present Disclosure] Specific examples of the present disclosure will be described below with reference to the drawings. It should be noted that the present invention is not limited to these examples, and is indicated by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0018] <Embodiment 1> As shown in FIG. 1, the connector 10 according to Embodiment 1 exemplifies a shield connector mounted on a circuit board 100. The connector 10 includes a conductive inner conductor 11, conductive outer conductors 12 and 13 surrounding the outer periphery of the inner conductor 11, an insulating dielectric 14 interposed between the inner conductor 11 and the outer conductors 12 and 13, and an insulating housing 15 holding the outer conductors 12 and 13. The housing 15 is configured to be fitted to a mating connector (not shown). In the following description, regarding the front-rear direction, the side where the housing 15 is fitted to the mating connector is defined as the front side. The arrow X in FIG. 1 indicates the front side. The left-right direction is based on the thickness direction of the paper surface of FIG. 1. The left-right direction is synonymous with the width direction. The reference sign Y in FIG. 1 indicates the right side. The up-down direction is based on the up-down direction in FIG. 1. The up-down direction is synonymous with the height direction. The arrow Z in FIG. 1 indicates the upper side. These direction references are for convenience. For example, the lower side does not necessarily coincide with the lower side in the gravitational direction when the connector 10 is mounted on a vehicle or the like (not shown).

[0019] (Housing 15) The housing 15 is made of synthetic resin and has, as shown in FIG. 1, an end wall portion 16 and a hood portion 17 protruding forward from the end wall portion 16. A mating connector (not shown) is fitted inside the hood portion 17. The hood portion 17 has a lock portion 18 for locking the mating connector in a fitted state. The lock portion 18 is claw-shaped and protrudes inward from the upper wall of the hood portion 17. The end wall portion 16 has an insertion hole 19 penetrating in the front-rear direction. A cylindrical portion 32, which will be described later, is inserted into the insertion hole 19.

[0020] The housing 15 has an assembly recess 21 inside the wall thickness of the end wall portion 16. As shown in FIG. 5, the assembly recess 21 opens to the rear surface and the lower surface of the end wall portion 16. On the lower end side of the end wall portion 16, there are a pair of locking portions 22 that partially block the left and right ends of the rear surface of the assembly recess 21. A connecting portion 39 of the outer conductors 12 and 13, which will be described later, is inserted into the assembly recess 21 from below. Each locking portion 22 contacts the left and right ends of the connecting portion 39 in a pressing state from the rear and holds the connecting portion 39 in the assembly recess 21.

[0021] As shown in FIG. 1, a conductive connection member 23 is attached to the housing 15. The connection member 23 brings a portion protruding upward in a state of being attached to the housing 15 into contact with a wall surface of a conductive housing 90 disposed outside. Further, the connection member 23 brings a portion located inside the housing 15 in a state of being attached to the housing 15 into contact with the cylindrical portion 32.

[0022] (Inner conductor 11, dielectric 14) The inner conductor 11 is disposed inside the outer conductors 12 and 13. The inner conductor 11 is made of metal and has a tab shape or a pin shape, and as shown in FIG. 1, has a mating connection portion 24 that extends long in the front-rear direction and a substrate connection portion 25 that extends downward from the rear end of the mating connection portion 24. When the housing 15 and the mating connector are mated, the front end portion of the mating connection portion 24 is electrically connected to a mating inner conductor (not shown). When mounted on the circuit board 100, the lower end portion of the substrate connection portion 25 is inserted into the through hole 102 of the circuit board 100 and electrically connected to the signal conductive path of the circuit board 100.

[0023] The dielectric 14 is made of synthetic resin and, as shown in FIG. 1, has a terminal accommodating portion 26 that extends long in the front-rear direction and a terminal leading-out portion 27 that extends downward from the rear end of the terminal accommodating portion 26. The dielectric 14 has an accommodating chamber 28 that extends the terminal accommodating portion 26 in the front-rear direction and a leading-out groove 29 that extends the terminal leading-out portion 27 in the vertical direction. The accommodating chamber 28 penetrates the dielectric 14 in the front-rear direction. The upper end of the leading-out groove 29 communicates with the rear end of the accommodating chamber 28. The lower end of the leading-out groove 29 opens to the lower surface of the terminal leading-out portion 27. The leading-out groove 29 is open to the rear of the terminal leading-out portion 27. The mating connection portion 24 of the inner conductor 11 is inserted into the accommodating chamber 28 of the terminal accommodating portion 26 from the rear. When the mating connection portion 24 is accommodated in the accommodating chamber 28 and the substrate connection portion 25 of the inner conductor 11 comes into contact with the inner surface of the leading-out groove 29, further insertion operation of the inner conductor 11 is restricted. At this time, the front end portion of the mating connection portion 24 protrudes forward from the terminal accommodating portion 26. The lower end portion of the substrate connection portion 25 protrudes downward from the terminal leading-out portion 27. The space behind the substrate connection portion 25 is closed by a back wall 43 described later.

[0024] (Outer conductors 12, 13) The outer conductors 12, 13 electrically shield the inner conductor 11 and are configured as, for example, die-cast conductive rigid bodies. In the case of Embodiment 1, the outer conductor is composed of a first outer conductor 12 and a second outer conductor 13 that are separate from each other. As shown in FIG. 1, the first outer conductor 12 is disposed below the second outer conductor 13.

[0025] As shown in FIG. 2, the second outer conductor 13 has a base portion 31 and a cylindrical portion 32 that projects forward from the base portion 31. The base portion 31 has a square frame shape and has a mounting recess 33 inside. The mounting recess 33 opens to the rear surface and the lower surface of the base portion 31. The first outer conductor 12 is inserted and mounted into the mounting recess 33 from below. The base portion 31 has a pair of side wall portions 34 that close the left and right ends of the mounting recess 33. As shown in FIG. 5, the lower end portion of each side wall portion 34 has a support end portion 35 that is wider than the intermediate portion in the front-rear direction at the front-rear direction end portions. Each support end portion 35 constitutes the four corners of the lower surface of the base portion 31. The base portion 31 has four leg portions 36 that project from the flat lower surface of each support end portion 35. Each leg portion 36 has a cylindrical shape and is inserted into each fixing hole 101 formed in the circuit board 100 and soldered and fixed to the circuit board 100 as shown in FIG. 1.

[0026] The cylindrical portion 32 has a cylindrical shape and projects from the front surface of the base portion 31. The dimension in the front-rear direction (projection dimension) of the cylindrical portion 32 is made larger than the length in the front-rear direction of the base portion 31. As shown in FIG. 1, the inside of the cylindrical portion 32 is an insertion hole 37 into which the dielectric 14 can be inserted. The insertion hole 37 is formed from the cylindrical portion 32 to the base portion 31 and is open to the rear of the second outer conductor 13 via the mounting recess 33. Specifically, the insertion hole 37 penetrates the inside of the second outer conductor 13 in the front-rear direction.

[0027] The first outer conductor 12 is composed of a main body portion 38 and a connecting portion 39 that continues in front of the main body portion 38. As shown in FIG. 4, the main body portion 38 has an outer shape corresponding to the opening shape of the mounting recess 33 of the first outer conductor 12 in a bottom view. The connecting portion 39 has an outer shape corresponding to the opening shape of the assembly recess 21 of the housing 15 in a bottom view.

[0028] As shown in FIG. 3, the first outer conductor 12 has a plate-shaped bottom wall 41 that constitutes the bottom portions of the main body portion 38 and the connecting portion 39. The main body portion 38 has a rectangular lead-out opening 42 in a bottom view that penetrates a portion on the rear end side of the bottom wall 41 in the thickness direction (vertical direction). As shown in FIGS. 5 and 6, the lower end portion of the terminal lead-out portion 27 of the dielectric 14 is fitted into the lead-out opening 42 of the bottom wall 41. The lower end portion of the board connection portion 25 of the inner conductor 11 is drawn out from the lead-out opening 42 of the bottom wall 41 and inserted into the through hole 102 of the circuit board 100.

[0029] The main body portion 38 has a back wall 43 that stands upward on the rear end side of the bottom wall 41. As shown in FIG. 1, in a state where the first outer conductor 12 is mounted in the mounting recess 33 of the second outer conductor 13, the back wall 43 closes the rear surface opening of the mounting recess 33 of the second outer conductor 13.

[0030] As shown in FIG. 3, a plurality of holding ribs 44 extending in the vertical direction are formed on the left and right surfaces of each of the back wall 43 and the bottom wall 41. As shown in FIG. 5, when each holding rib 44 contacts the inner surface of the mounting recess 33 in a pressed state, the first outer conductor 12 is held by the second outer conductor 13.

[0031] As shown in FIG. 3, the connecting portion 39 has a pair of projecting walls 45 that stand upward at the left and right end portions on the front end side of the bottom wall 41. As shown in FIG. 5, each projecting wall 45 is fitted into the assembly recess 21 of the housing 15.

[0032] The second outer conductor 13 is assembled to the housing 15 from the rear. Thereafter, the first outer conductor 12 is assembled so as to straddle the second outer conductor 13 and the housing 15 from below. By press-fitting the main body portion 38 into the mounting recess 33 and press-fitting the connecting portion 39 into the assembly recess 21, the first outer conductor 12, the second outer conductor 13, and the housing 15 are held in an assembled state.

[0033] As shown in FIGS. 3 to 5, the lower surface of the bottom wall 41 is a flat bottom surface 46 in the front-rear direction and the left-right direction. A plurality of mounting portions 47, 48 are projectingly provided at intervals around the lead-out port 42 on the bottom surface 46 of the bottom wall 41. Each of the mounting portions 47, 48 is soldered to a ground conductive path (copper foil) on the board surface of the circuit board 100 and electrically connected. The internal area of the bottom surface 46 of the main body portion 38 excluding the outer edge portion is a mounting area 49 where the lead-out port 42 from which the lower end portion of the board connection portion 25 of the inner conductor 11 is drawn out and each of the mounting portions 47, 48 are arranged and soldered to the circuit board 100. As shown in FIG. 1, for example, the tip of the cylindrical portion 32 is located in front of the mounting area 49 in the front-rear direction. Further, in a state where the connector 10 is arranged with respect to the circuit board 100, the bottom surface 46 is arranged between the base portion 31 and the board surface of the circuit board 100.

[0034] As shown in FIGS. 3 to 5, for example, a pair of first mounting portions 47 are disposed on both the front and rear sides with the lead-out port 42 interposed therebetween. Also, for example, a pair of second mounting portions 48 are disposed on both the left and right sides with the lead-out port 42 interposed therebetween. Each first mounting portion 47 has a rib shape extending in the left-right direction along each of the front and rear edges of the lead-out port 42, and the front end surface (lower surface) in the protruding direction is formed flat in the left-right direction. Each second mounting portion 48 has a rib shape extending in the front-rear direction along each of the left and right edges of the lead-out port 42, and the front end surface (lower surface) in the protruding direction is formed flat along the front-rear direction. The dimension in the front-rear direction (front-rear length) of each second mounting portion 48 is made smaller than the dimension in the left-right direction (left-right length) of each first mounting portion 47. The front end surfaces of each first mounting portion 47 and the front end surfaces of each second mounting portion 48 are respectively disposed at the same height position. Each support end portion 35 (including each leg portion 36) of the second outer conductor 13 is disposed at positions on both the left and right sides sandwiching each first mounting portion 47 and at positions on both the front and rear sides sandwiching each second mounting portion 48.

[0035] On the bottom surface 46 of the bottom wall 41, a plurality of substrate mounting portions 51, 52 project on both the front and rear sides with the mounting area 49 interposed therebetween. Each of the substrate mounting portions 51, 52 is placed on the resist on the board surface of the circuit board 100. Each of the substrate mounting portions 51, 52 has a prismatic shape, and the front end surface (lower surface) in the protruding direction is formed flat. The protruding dimension of each of the substrate mounting portions 51, 52 from the bottom surface 46 is made larger than the protruding dimension of each of the mounting portions 47, 48 from the bottom surface 46. The front end surfaces of each of the substrate mounting portions 51, 52 are disposed below the front end surfaces of each of the mounting portions 47, 48. For this reason, the front end surfaces of each of the substrate mounting portions 51, 52 are positioned ahead of the front end surfaces of each of the mounting portions 47, 48 in the protruding direction of the substrate mounting portions 51, 52. The area of the front end surfaces of each of the substrate mounting portions 51, 52 is made smaller than the area of the front end surfaces of each of the mounting portions 47, 48.

[0036] Each substrate mounting portion is composed of a pair of first substrate mounting portions 51 spaced apart in the left-right direction at a position farther forward than the front first mounting portion 47, and a pair of second substrate mounting portions 52 spaced apart in the left-right direction at a position farther rearward than the rear first mounting portion 47. Each first substrate mounting portion 51 is provided on the front end side of the bottom surface 46 of the connecting portion 39. Each first substrate mounting portion 51 is arranged within the range in the front-rear direction of the housing 15 when the connecting portion 39 is press-fitted into the assembling recess 21. In the connector 10 of the first embodiment, since the cylindrical portion 32 protrudes forward of the base portion 31 and the housing 15 is continuous with the front of the outer conductors 12 and 13, the center of gravity is located on the housing 15 side. Each first substrate mounting portion 51 is arranged near the center of gravity of the connector 10 and is stably supported by the circuit board 100.

[0037] Each second substrate mounting portion 52 is provided on the rear end side of the bottom surface 46 of the main body portion 38. The rear surface of each second substrate mounting portion 52 is continuously connected to the rear surface of the bottom wall 41 without a step. The distance in the front-rear direction between the front first mounting portion 47 and each first substrate mounting portion 51 is made larger than the distance in the front-rear direction between the rear first mounting portion 47 and each second substrate mounting portion 52.

[0038] (Operation of the connector 10) The connector 10 is mounted on the circuit board 100 by reflow. Prior to reflow, the connector 10 is installed on the circuit board 100. At this time, each leg portion 36 is inserted into each fixing hole 101, and each substrate mounting portion 51, 52 is placed on the board surface of the circuit board 100. When each substrate mounting portion 51, 52 is supported by the circuit board 100, a constant interval is maintained between the bottom surface 46 of the bottom wall 41 and the circuit board 100. Also at this time, by bringing the front end surface of each of the substrate mounting portions 51, 52 into contact with the board surface of the circuit board 100 and arranging the connector 10 with respect to the circuit board 100, the front end surfaces of each mounting portion 47, 48 are arranged to face the board surface with a gap therebetween.

[0039] Next, the connector 10 is heated in a reflow furnace (not shown), and the solder on the board surface of the circuit board 100 is melted. As a result, as shown in FIG. 6, a solder fillet 70 is formed across the front end surfaces of the respective mounting portions 47, 48 and the board surface of the circuit board 100. Also, a solder fillet 80 is formed between the lower end portion of the board connection portion 25 of the inner conductor 11 and the board surface of the circuit board 100. Thereafter, as the solder cools and solidifies, the respective mounting portions 47, 48 of the outer conductors 12, 13 are soldered to the ground conductive path of the circuit board 100, and the board connection portion 25 of the inner conductor 11 is soldered to the signal conductive path of the circuit board 100. The lower end portion of the board connection portion 25 of the inner conductor 11 has a portion exposed between the bottom surface 46 of the bottom wall 41 and the board surface of the circuit board 100, and is surrounded by the respective mounting portions 47, 48 from all four sides (front-back direction and left-right direction). Thereby, the shielding performance for the inner conductor 11 is enhanced. Also, each leg portion 36 is soldered and fixed to each fixing hole 101 of the circuit board 100.

[0040] No solder is applied to the respective board mounting portions 51, 52, and during the reflow process, the respective board mounting portions 51, 52 function to maintain a constant interval between the bottom surface 46 of the bottom wall 41 and the board surface of the circuit board 100. Thus, even if the connector 10 is displaced with respect to the circuit board 100, it is possible to avoid the respective mounting portions 47, 48 coming into contact with the resist.

[0041] Since the respective board mounting portions 51, 52 function to maintain the above-described interval, a gap is formed between the front end surfaces of the respective mounting portions 47, 48 and the board surface of the circuit board 100. For this reason, the molten solder can follow in the displacement direction of the respective mounting portions 47, 48 to properly form the solder fillet 70.

[0042] As described above, according to the first embodiment, a gap can be formed between the front end surfaces of the mounting portions 47 and 48 and the board surface of the circuit board 100 in a state where the front end surfaces of the board mounting portions 51 and 52 are supported by the board surface of the circuit board 100. Therefore, even if the mounting portions 47 and 48 are displaced with respect to the circuit board 100 during reflow, the solder can follow the mounting portions 47 and 48, and a solder fillet 70 can be properly formed between the board surface of the circuit board 100 and the mounting portions 47 and 48. In particular, since the board mounting portions 51 and 52 are provided in pairs on both sides sandwiching the mounting area 49 on the bottom surface 46 of the first outer conductor 12, the gap formed between the front end surfaces of the mounting portions 47 and 48 and the board surface of the circuit board 100 can be adjusted to a proper size and kept constant. As a result, the connector 10 can improve mountability.

[0043] Also, in the case of the first embodiment, since each of the first board mounting portions 51 located on the front side of the mounting area 49 is supported by the board surface of the circuit board 100 near the center of gravity position of the connector 10, it is possible to suppress the inclination of the mounting portions 47 and 48 with respect to the circuit board 100 during reflow.

[0044] <Second Embodiment> The connector 10A according to the second embodiment is different from the first embodiment in that it includes two inner conductors 11 and two dielectrics 14, two lead-out ports 42 are opened on the bottom surface 46 of the bottom wall 41, and a plurality of mounting portions 47A and 48A are provided corresponding to each lead-out port 42. Others are the same as those in the first embodiment. In the second embodiment, the same reference numerals are given to the same or similar structures as those in the first embodiment, and redundant descriptions are omitted.

[0045] As shown in FIG. 7, the two lead-out ports 42 are provided side by side in the front-rear direction on the bottom wall 41 of the first outer conductor 12. Each lead-out port 42 opens in a rectangular shape in a bottom view on the bottom surface 46 of the bottom wall 41. The rear edge of the front lead-out port 42 and the front edge of the rear lead-out port 42 are arranged parallel to each other. The two dielectrics 14 respectively fit the lower ends of the terminal lead-out portions 27 into the corresponding lead-out ports 42. The two inner conductors 11 respectively project the lower ends of the substrate connection portions 25 downward from the corresponding lead-out ports 42.

[0046] The plurality of mounting portions include a main mounting portion 47A arranged at a site excluding the front-rear direction ends in the mounting area 49, and a pair of sub-mounting portions 48A arranged at the front-rear direction ends of the mounting area 49. The main mounting portion 47A is composed of a rib-shaped intermediate mounting portion 47B extending in the left-right direction between the lead-out ports 42, and a pair of rib-shaped side mounting portions 47C extending long along each of the left and right edges of each lead-out port 42 across each lead-out port 42. The left and right direction ends of the intermediate mounting portion 47B are respectively connected to the front-rear direction intermediate portions of the side mounting portions 47C. The front-rear direction dimension (front-rear width) of the intermediate mounting portion 47B is made larger than the left-right direction dimension (left-right width) of the side mounting portion 47C. The main mounting portion 47A presents an H shape in a bottom view by the intermediate mounting portion 47B and the side mounting portions 47C. The front end surface of the main mounting portion 47A is formed flat along the H shape of the main mounting portion 47A.

[0047] Each sub-mounting portion 48A is composed of a rib-shaped portion extending in the left-right direction along the front edge of the front lead-out port 42, and a rib-shaped portion extending in the left-right direction along the rear edge of the rear lead-out port 42. The front end surface of each sub-mounting portion 48A is formed flat at the same height position as the front end surface of the main mounting portion 47A. The front-rear direction dimension of each sub-mounting portion 48A is made smaller than the front-rear direction dimension of the intermediate mounting portion 47B.

[0048] On the bottom surface 46 of the bottom wall 41, a pair of substrate mounting portions 51 and 52 are protruding at intervals in the left - right direction on both the front and rear sides with the mounting area 49 in between. The front end surfaces of each of the substrate mounting portions 51 and 52 are arranged below the front end surfaces of each of the mounting portions 47A and 48A. Each of the substrate mounting portions 51 and 52 is placed on the board surface of the circuit board 100. Each of the mounting portions 47A and 48A forms a gap with the board surface of the circuit board 100 by each of the substrate mounting portions 51 and 52. The structure and arrangement regarding the substrate mounting portions 51 and 52 are the same as those in the first embodiment.

[0049] According to the second embodiment, since the main mounting portion 47A and each sub - mounting portion 48A surround the four sides of each lead - out port 42, the shielding performance for each inner conductor 11 drawn out from each lead - out port 42 can be enhanced. In particular, since the intermediate mounting portion 47B of the main mounting portion 47A is provided between the board connection portions 25 of each inner conductor 11, crosstalk between each inner conductor 11 can be prevented.

[0050] [Other Embodiments of the Present Disclosure] It should be considered that the above - disclosed first and second embodiments are illustrative in all respects and not restrictive. In the case of the above - mentioned first and second embodiments, the board connection portions were arranged in pairs on both sides sandwiching the mounting area. In contrast, according to other embodiments, the board connection portions may be arranged one by one on both sides sandwiching the mounting area, or three or more may be arranged on both sides sandwiching the mounting area. In the case of the first and second embodiments, the board connection portions were arranged on both the front and rear sides sandwiching the mounting area. In contrast, according to other embodiments, the board connection portions may be arranged on both the left and right sides sandwiching the mounting area. Also, the board connection portions may be arranged on both the front and rear sides and both the left and right sides sandwiching the mounting area respectively. In the case of the first and second embodiments, the mounting portions were arranged in a plurality around the lead - out ports on the bottom surface of the bottom wall. In contrast, according to other embodiments, the mounting portions may be arranged one for each lead - out port so as to surround the entire circumference around the lead - out ports on the bottom surface of the bottom wall. In the case of Embodiments 1 and 2, the mounting portion had a shape that linearly extended along the edge of the lead-out port on the bottom surface of the bottom wall. In contrast, for example, when the lead-out port has a circular opening shape, the mounting portion may have a shape that curves and extends along the edge of the lead-out port. In the case of Embodiments 1 and 2, the outer conductor was separable into a first outer conductor and a second outer conductor. In contrast, according to other embodiments, the outer conductor may be an integral non-separable outer conductor. In the case of the above Embodiments 1 and 2, the outer conductor was made of die-cast. In contrast, according to other embodiments, the outer conductor may be formed by machining a metal block member.

Explanation of Reference Numerals

[0051] 10, 10A... Connectors 11... Inner Conductor 12... First Outer Conductor (Outer Conductor) 13... Second Outer Conductor (Outer Conductor) 14... Dielectric 15... Housing 16... End Wall Portion 17... Hood Portion 18... Lock Portion 19... Insertion Hole 21... Assembly Recess 22... Locking Portion 23... Connection Member 24... Mate Connection Port 25... Board Connection Port 26... Terminal Accommodation Port 27... Terminal Lead-Out Port 28... Accommodation Chamber 29... Lead-Out Groove 31... Base Portion 32... Cylindrical Portion 33... Mounting Recess 34... Side Wall Portion 35... Support End Portion 36... Leg Portion 37... Insertion Hole 38... Body Portion 39... Connection Portion 41... Bottom Wall 42... Lead-Out Port 43... Rear Wall 44... Holding Rib 45... Projection wall 46…Bottom 47…First mounting section (mounting section) 47A…Main mounting section (mounting section) 47B…Middle mounting section (mounting section) 47C…Side mounting part (mounting part) 48…Second mounting section (mounting section) 48A…Sub-mounting section (mounting section) 49…Mounting area 51...First board installation section (board installation section) 52...Second board installation section (board installation section) 70...Solder fillet (mounting side) 80...Solder fillet (inner conductor side) 90…Housing 100...Circuit board 101…Fixing hole 102...Through hole

Claims

1. A conductive outer conductor, a conductive inner conductor disposed inside the outer conductor, and an insulating dielectric interposed between the inner conductor and the outer conductor, and the outer conductor has a bottom surface facing the board surface of the circuit board, an outlet that opens on the bottom surface and draws out the inner conductor to the circuit board side, a mounting portion protruding from the bottom surface, and at least one substrate mounting portion protruding from both sides of the bottom surface sandwiching the mounting area where the mounting portion and the outlet are formed, and having a tip surface positioned ahead of the tip surface of the mounting portion. A connector.

2. The outer conductor has a base portion and a cylindrical portion protruding forward from the base portion, the bottom surface is disposed between the base portion and the board surface, and the substrate mounting portion protrudes at least one on each of the front and rear sides sandwiching the mounting area. The connector according to claim 1.

3. further comprising an insulating housing that holds the outer conductor and is disposed on the front side of the outer conductor, the cylindrical portion protrudes into the interior of the housing, and the substrate mounting portion located on the front side of the mounting area is disposed within the range of the housing in the front-rear direction. The connector according to claim 2.

4. The substrate mounting portion protrudes in pairs at intervals in the left-right direction on both the front and rear sides sandwiching the mounting area. The connector according to any one of claims 1 to 3.

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