Information processing device

Abstract

To provide an information processing device excellent in overview; an information processing device excellent in portability; an information processing device low in power consumption; and information processing device high in display quality.SOLUTION: An information processing device includes: a display part having flexibility; a plurality of drive circuit parts arranged in the periphery of the display part; a detection part for identifying the state of the outer shape of the display part; an operation part for supplying image information to the drive circuits; and a storage part for storing a program performed in the operation part. The detection part detects a first form of unfolding the display part or a second form of folding the display part: and the program controls brightness according to the first or second form.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an article, a method, or a manufacturing method. The present invention relates to a method, manufacture, or composition of matter. The present invention relates to, for example, a human interface, a semiconductor device, a display device, and a light-emitting device. The present invention relates to a lighting device, a power storage device, a driving method thereof, or a manufacturing method thereof. The present invention relates to, for example, a method for processing and displaying image information, a program, and a program recorded thereon. In particular, the present invention relates to an information processing device having a display unit, Image information processing and display method and display unit for displaying an image including information processed by a processing device A program for displaying an image including processed information on an information processing device equipped with the program, and the program The present invention relates to an information processing device having a recording medium on which a gram is recorded. [Background technology]

[0002] The social infrastructure related to the means of information transmission is well developed. This allows diverse and abundant information to be available in the workplace. It is now possible to obtain, process, and transmit information using information processing devices not only at home but also on the go. It is.

[0003] In this context, portable information processing devices have been actively developed.

[0004] For example, a portable information processing device may include a switching element on a film substrate. A flexible active matrix light-emitting device with transistors and organic electroluminescence (EL) elements. An optical device is disclosed (see Patent Document 1). [Prior art documents] [Patent documents]

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] A display device having a large screen and capable of displaying a lot of information is excellent in listability. Therefore, it is suitable for an information processing device.

[0007] On the other hand, a display device having a large screen is inferior in portability compared to one having a small screen. In addition, a display device having a large screen has higher power consumption than one having a small screen. is high.

[0008] In addition, in a display device, the display quality may deteriorate. For example, when a light-emitting element is used as the display device, depending on the light emission intensity and light emission time, the light emission characteristics of the light-emitting element deteriorate. Therefore, when the light emission intensity and light emission time differ for each pixel, the deterioration state of the light-emitting element is different. Therefore, it is observed as display unevenness and the display quality deteriorates.

[0009] In view of the above problems, one aspect of the present invention is to provide an information processing device excellent in listability, etc. as one of the problems. Or, to provide an information processing device excellent in portability, etc. as one of the problems. Or, to provide an information processing device with low power consumption as one of the problems. Or, to provide an information processing device with high display quality as one of the problems. Also or, to provide an information processing device with less display unevenness as one of the problems. Or, to provide a novel information processing device, etc. as one of the problems.

[0010] Note that the description of these problems does not prevent the existence of other problems. Note that one aspect of the present invention does not need to solve all of these problems. Note that other problems will be apparent from the description in the specification, drawings, claims, etc., and it is possible to extract these other problems from the description in the specification, drawings, claims, etc.

Means for Solving the Problems

[0011] One aspect of the present invention includes a flexible display unit, a plurality of drive circuits arranged on the outer periphery of the display unit, a detection unit for identifying the state of the outer shape of the display unit, an arithmetic unit for supplying image information to the drive circuit unit, and a storage unit for storing a program to be executed by the arithmetic unit. The detection unit detects a first form in which the display unit is unfolded or a second form in which the display unit is folded, and the program performs brightness adjustment processing according to the first

[0012] form or the second form. An information processing apparatus characterized by this is provided. In addition, the program stored in the information processing apparatus according to one aspect of the present invention includes a first step of specifying the outer shape form, a second step in which, in the case of the first form, it proceeds to the fifth step and, in the case of other than the first form, it proceeds to the third step, a third step in which, in the case of the second form, it proceeds to the fourth step and, in the case of other than the second form, it proceeds to the first step, a fourth step of performing brightness adjustment processing, and a fifth step of If it is the case, proceed to the 10th step, and if the brightness adjustment process is not canceled, proceed to the 8th step It has a 9th step of proceeding to the 8th step when not proceeding to the 10th step and when not canceling the brightness adjustment process, and a 10th step of returning from the brightness adjustment process

[0013] Thus, in the information processing apparatus according to one aspect of the present invention, by performing the brightness adjustment process according to whether the program is in the first form or the second form, it is possible to suppress display unevenness of the display unit and suppress power consumption

Effect of the Invention

[0014] According to one aspect of the present invention, it is possible to provide an information processing apparatus with excellent listability. Or, it is possible to provide an information processing apparatus with excellent portability Or, it is possible to provide an information processing apparatus with low power consumption Or, it is possible to provide an information processing apparatus with high display quality

Brief Description of the Drawings

[0015]

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Embodiments for Carrying Out the Invention

[0016] An information processing device according to an aspect of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and without departing from the spirit and scope of the present invention, its form and It is easily understood by those skilled in the art that various details can be changed. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having similar functions among different drawings, and the repeated description thereof will be omitted. In addition, the arrangement of each block in the block diagram in the drawings is for specifying the positional relationship for the purpose of explanation. Even if different blocks are shown to realize different functions, there are cases where they are provided so that the same circuit or the same area can realize different functions in the actual circuit or area. Also, the function of each block in the block diagram in the drawings is for specifying the function for the purpose of explanation. Even if it is shown as one block, there are cases where the processing performed by one block in the actual circuit or area is provided to be performed by a plurality of blocks. (Embodiment 1) In this embodiment, the configuration of an information processing apparatus according to an aspect of the present invention will be described below with reference to FIGS. 1 to 18.

[0017] FIG. 1(A) is a block diagram for explaining the configuration of an information processing apparatus 100 according to an aspect of the present invention. The information processing apparatus 100 shown in FIG. 1(A) includes a flexible display unit 102, a plurality of drive circuit units 104 arranged on the outer periphery of the display unit 102, a detection unit 106 for identifying the state of the outer shape of the display unit 102, an arithmetic unit 108 for supplying image information to the drive circuit units 104, and a storage unit 110 for storing a program to be executed by the arithmetic unit 108.

[0018]

[0019]

[0020]

[0021] ​​​​​​​​​​​​​In FIG. 1(A), the display unit 102 and the drive circuit unit 104 constitute the display panel 105. Note that the display panel 105 may have a configuration having only the display unit 102, or a configuration in which the display unit 102 is combined with the detection unit 106, the arithmetic unit 108, the storage unit 110, etc. is also acceptable.

[0022] As shown in FIG. 1(A), by configuring the display panel 105 with the flexible display unit 102 and the drive circuit unit 104, the drive circuit unit 104 also has flexibility. However, the drive circuit unit 104 may be fabricated on a substrate different from the display panel 105 and may not have flexibility. is also acceptable.

[0023] The information processing apparatus 100 according to one aspect of the present invention shown in FIG. 1(A) can deform the outer shape of the flexible display unit 10 2, so that it is possible to achieve both an excellent list function and an excellent portability function. For example, when the display unit 102 is unfolded, it can be used as an information processing apparatus 100 with excellent listability. When the display unit 102 is in a folded form, it can be used as an information processing apparatus 100 with excellent portability. Here, each configuration shown in FIG. 1(A) will be described in detail below.

[0024]

[0025] <Display unit> The display unit 102 is formed on a substrate whose outer shape can be deformed, for example, a flexible substrate or a flexible film.

[0026] <Drive circuit unit> The drive circuit unit 104 is disposed on the outer periphery of the display unit 102. Also, a signal is supplied from the drive circuit unit 104 to the display unit 102. As the drive circuit unit 104, a unit for driving the display unit 102 ​If possible, for example, when pixels are arranged in a matrix on the display unit 102, a circuit (gate driver) that outputs a signal (scanning signal) for selecting pixels and a circuit (source driver) for supplying a signal (data signal) for driving the display elements of the pixels can be used. A circuit (gate driver) that outputs a signal (scanning signal) for selecting pixels and a circuit (source driver) for supplying a signal (data signal) for driving the display elements of the pixels are used. A circuit (source driver) for supplying a signal (data signal) for driving the display elements of the pixels is used. This is possible.

[0027] Moreover, it is preferable that part or all of the drive circuit unit 104 is formed on the same substrate as the display unit 102 in the same process. In particular, it is preferable to provide a gate driver that is easy to form on the same substrate in the same process near the folding area. Since the gate driver has a low operating frequency, it is easy to form on the same substrate as the display unit 102 in the same process. As a result, the number of components and terminals can be reduced. Also, since elements formed in the same process as the display unit 102 are used, part or all of the drive circuit unit 104 can also have flexibility. Therefore, the display unit 102 can be folded at any location. For this reason, the information processing apparatus 100 can be made a tough and durable apparatus that is not easily broken. However, the configuration of the drive circuit unit 104 is not limited to this, and for example, it may be configured not to be formed on the same substrate as the display unit 102. In this case, part or all of the drive circuit unit 104 can be mounted by COG or TAB. When mounting by COG or TAB, when the substrate provided with the display unit 102 is folded, it is preferable not to provide an IC or LSI provided by COG or TAB in the area that becomes the fold line. As a result, the substrate provided with the display unit 102 can be folded. Moreover, it is preferable that part or all of the drive circuit unit 104 is formed on the same substrate as the display unit 102 in the same process. In particular, it is preferable to provide a gate driver that is easy to form on the same substrate in the same process near the folding area. Since the gate driver has a low operating frequency, it is easy to form on the same substrate as the display unit 102 in the same process. As a result, the number of components and terminals can be reduced. Also, since elements formed in the same process as the display unit 102 are used, part or all of the drive circuit unit 104 can also have flexibility. Therefore, the display unit 102 can be folded at any location. For this reason, the information processing apparatus 100 can be made a tough and durable apparatus that is not easily broken. However, the configuration of the drive circuit unit 104 is not limited to this, and for example, it may be configured not to be formed on the same substrate as the display unit 102. In this case, part or all of the drive circuit unit 104 can be mounted by COG or TAB. When mounting by COG or TAB, when the substrate provided with the display unit 102 is folded, it is preferable not to provide an IC or LSI provided by COG or TAB in the area that becomes the fold line. As a result, the substrate provided with the display unit 102 can be folded. However, the configuration of the drive circuit unit 104 is not limited to this, and for example, it may be configured not to be formed on the same substrate as the display unit 102. In this case, part or all of the drive circuit unit 104 can be mounted by COG or TAB. When mounting by COG or TAB, when the substrate provided with the display unit 102 is folded, it is preferable not to provide an IC or LSI provided by COG or TAB in the area that becomes the fold line. As a result, the substrate provided with the display unit 102 can be folded. For this reason, the information processing apparatus 100 can be made a tough and durable apparatus that is not easily broken. However, the configuration of the drive circuit unit 104 is not limited to this, and for example, it may be configured not to be formed on the same substrate as the display unit 102. In this case, part or all of the drive circuit unit 104 can be mounted by COG or TAB. When mounting by COG or TAB, when the substrate provided with the display unit 102 is folded, it is preferable not to provide an IC or LSI provided by COG or TAB in the area that becomes the fold line. As a result, the substrate provided with the display unit 102 can be folded.

[0028] Note that the drive circuit unit 104 includes a protection circuit, a control circuit, a power supply circuit, a signal generation circuit, etc. It may be configured to have a function including...

[0029] Also, as the drive circuit unit 104, it may be configured to have a plurality of power supply circuits, and further, the power supply circuits are independently controlled so that the display unit 102 can be driven in a divided manner. Alternatively, it may be configured such that the supply of the power supply voltage can be controlled for each part of the divided display unit 102. Also, a circuit having a function of monitoring the current amount flowing through a light emitting element provided in a part of the above-described power supply circuit or in the display unit 102 separately from the power supply circuit may be provided. By monitoring the current amount flowing through the light emitting element, it becomes possible to measure the power consumption of the display unit 102. For example, as the current amount monitor, the current amount between the anode and cathode of the light emitting element used in the display unit 102 may be monitored.

[0030] <Arithmetic unit> The arithmetic unit 108 has a function of supplying image information to the drive circuit unit 104.

[0031] <Detection unit> The detection unit 106 has a function of being able to identify the state of the outer shape of the display unit 102. For example, it detects the first form in which the display unit 102 is unfolded or the second form in which the display unit 102 is folded. As the detection unit 106, it is sufficient that it can identify the state of the outer shape of the display unit 102. For example, it can be configured using a switch, a MEMS pressure sensor, an acceleration sensor, an infrared sensor, a magnetic sensor, or a pressure-sensitive sensor, etc.

[0032] <Storage unit> The storage unit 110 stores a program to be executed by the arithmetic unit 108. The program causes the arithmetic unit 108 to execute different processes according to the information from the detection unit 106.​​​

[0033] Next, an example of the specific configuration of the display panel 105 shown in FIG. 1(A) will be described below. This will be done.

[0034] FIG. 1(B) is a top schematic view for explaining the configuration of the display panel 105.

[0035] The display panel 105 shown in FIG. 1(B) can be folded between the broken lines α1-α2 and the broken lines β1-β2. In the case of the configuration shown in FIG. 1(B), the display panel 105 can be three-folded. However, the configuration of the display panel 105 is not limited to this, and it may be configured to be folded at one or three or more locations. The broken lines α1-α2 and β1-β2, which are the folding lines, are arranged in parallel, but one aspect of the present invention is not limited to this. The folding lines may be arranged non-parallelly or may be provided in an intersecting state. This will be done. This will be done. However, the configuration of the display panel 105 is not limited to this, and it may be configured to be folded at one or three or more locations. The broken lines α1-α2 and β1-β2, which are the folding lines, are arranged in parallel, but one aspect of the present invention is not limited to this. The folding lines may be arranged non-parallelly or may be provided in an intersecting state. This will be done. However, the configuration of the display panel 105 is not limited to this, and it may be configured to be folded at one or three or more locations. The broken lines α1-α2 and β1-β2, which are the folding lines, are arranged in parallel, but one aspect of the present invention is not limited to this. The folding lines may be arranged non-parallelly or may be provided in an intersecting state. This will be done. However, the configuration of the display panel 105 is not limited to this, and it may be configured to be folded at one or three or more locations. The broken lines α1-α2 and β1-β2, which are the folding lines, are arranged in parallel, but one aspect of the present invention is not limited to this. The folding lines may be arranged non-parallelly or may be provided in an intersecting state. This will be done. However, the configuration of the display panel 105 is not limited to this, and it may be configured to be folded at one or three or more locations. The broken lines α1-α2 and β1-β2, which are the folding lines, are arranged in parallel, but one aspect of the present invention is not limited to this. The folding lines may be arranged non-parallelly or may be provided in an intersecting state. This will be done.

[0036] Also, the display panel 105 shown in FIG. 1(B) includes a display unit 102 and, as a drive circuit unit 104 on the outer periphery of the display unit 102, a first gate driver 104g_1, a second gate driver 104g_2, a first source driver 104s_1, and a second source driver 104s_2. The first gate driver 104g_1, the first source driver 104s_1, and the second source driver 104s_2 are each independently formed in a non-folded region. This will be done. This will be done. This will be done. This will be done. This will be done.

[0037] At this time, the second gate driver 104g_2 is arranged in the folded region, but by configuring it to be formed on the same substrate as the display unit 102 in the same process, it can operate without problems. This will be done. It can be made to operate. However, one aspect of the present invention is not limited to this. For example, as shown in FIG. 7(A ), gate drivers (gate driver 104g_1A and gate driver 104g_1B, gate driver 104g_2A and gate driver 10 4g_2B, gate driver 104g_2C and gate driver 104g_2D, etc.) may be provided on both sides of the display unit 102, or only one source driver may be arranged. Alternatively, a source driver may be arranged at the position of the gate driver in FIG. 1 (B), and a gate driver may be arranged at the position of the source driver in FIG. 1(B). Alternatively, no second gate driver 104g_2 may be arranged in the folding region, and no circuit may be arranged at the fold as in gate driver 104g _2A and gate driver 104g_2C in FIG. 7(A), or gate driver 104g_2B and gate driver 104g_2D. This can improve the reliability of the display panel. Alternatively, it can be mounted by COG or TAB .. .. .. ..

[0038] Alternatively, as shown in FIG. 7(B), the gate driver and the source driver may be arranged on the same side . In FIG. 7(B), the first gate driver 104g_3, the second gate driver 104g_4, the first source driver 104s_3, and the second source driver 104s_4 are arranged on one side. And the first gate driver 104g_ 3 and the second gate driver 104g_4 are connected via wiring arranged to surround the periphery of the display unit 102 . By arranging it in this way, the folding position of the display unit 102 can be freely changed. Also, since the drive circuit cannot be folded .. , since no pressure is applied to the transistor, the reliability can be improved. Note that FIG. 7 (B), the gate driver is arranged on the source driver side, and the wiring to the gate line is arranged with a large detour. However, one aspect of the present invention is not limited to this. The source driver may be arranged on the gate driver side, and the wiring to the source line may be arranged with a large detour.

[0039] Next, the display state of the display unit 102 of the display panel 105 shown in FIG. 1(B) in the unfolded state (the first form) will be described with reference to FIGS. 2(A) and (B).

[0040] FIG. 2(A) is a top schematic view of the display unit 102 of the display panel 105 in the unfolded state (the first form), and FIG. 2(B) is a cross-sectional view corresponding to the cross-section along the dashed line A-B shown in FIG. 2(A).

[0041] In the case of the display unit 102 shown in FIGS. 2(A) and (B), by using the first gate driver 104g_1 and , the second gate driver 104g_2, the first source driver 104s_1, and the second source driver 104s_2, an image can be displayed on the entire surface of the display unit 102.

[0042] Next, the display state of the display unit 102 of the display panel 105 shown in FIG. 1(B) in the folded state (the second form) will be described with reference to FIGS. 3(A), (B), and (C).

[0043] FIG. 3(A) is a top schematic view of the display unit 102 in the folded state (the second form), and FIG. 3(B) corresponds to the cross-sectional view along the dashed line A-B shown in FIG. 3(A). Note that , FIG. 3(C) is a cross-sectional view when the display state is in a different mode from FIG. 3(B).

[0044] In the case of the display unit 102 shown in FIG. 3(A), as shown in FIG. 3(B), when using the first gate driver 104g_1, the second gate driver 104g_2, the first source driver 104s_1, and the second source driver 104s_2, an image is displayed over the entire surface of the display unit 102. However, for the region 120 located at the folded portion, it cannot be directly observed by the viewer. Therefore, as shown in FIG. 3(C), the display unit 102 is divided into a display unit 102a and a display unit 102b, and only the image of the display unit 102a that can be observed by the viewer is displayed, and the image of the display unit 102b that cannot be observed by the viewer is not displayed, thereby reducing the power consumption of the display unit 102. However, for the region 120 located at the folded portion, it cannot be directly observed by the viewer. Therefore, as shown in FIG. 3(C), the display unit 102 is divided into a display unit 102a and a display unit 102b, and only the image of the display unit 102a that can be observed by the viewer is displayed, and the image of the display unit 102b that cannot be observed by the viewer is not displayed, thereby reducing the power consumption of the display unit 102. However, for the region 120 located at the folded portion, it cannot be directly observed by the viewer. Therefore, as shown in FIG. 3(C), the display unit 102 is divided into a display unit 102a and a display unit 102b, and only the image of the display unit 102a that can be observed by the viewer is displayed, and the image of the display unit 102b that cannot be observed by the viewer is not displayed, thereby reducing the power consumption of the display unit 102. 02 is divided into a display unit 102a and a display unit 102b, and only the image of the display unit 102a that can be observed by the viewer is displayed, and the image of the display unit 102b that cannot be observed by the viewer is not displayed, thereby reducing the power consumption of the display unit 102. 02 is divided into a display unit 102a and a display unit 102b, and only the image of the display unit 102a that can be observed by the viewer is displayed, and the image of the display unit 102b that cannot be observed by the viewer is not displayed, thereby reducing the power consumption of the display unit 102. 02 is divided into a display unit 102a and a display unit 102b, and only the image of the display unit 102a that can be observed by the viewer is displayed, and the image of the display unit 102b that cannot be observed by the viewer is not displayed, thereby reducing the power consumption of the display unit 102. can be achieved.

[0045] Thus, in order not to display an image on the display unit 102b, various methods can be used. For example, a black (minimum brightness and number of gradations) image is displayed on the pixels of the display unit 102b. That is, by controlling the video signal supplied to the display unit 102b, a black image is displayed. As a result, in the display unit 102b, since light is not emitted, it can be made equivalent to substantially not displaying an image. image is displayed on the pixels of the display unit 102b. That is, by controlling the video signal supplied to the display unit 102b, a black image is displayed. As a result, in the display unit 102b, since light is not emitted, it can be made equivalent to substantially not displaying an image. image is displayed on the pixels of the display unit 102b. That is, by controlling the video signal supplied to the display unit 102b, a black image is displayed. As a result, in the display unit 102b, since light is not emitted, it can be made equivalent to substantially not displaying an image.

[0046] Furthermore, another method can also be used. In that case, there are different situations depending on the circuit configuration of the pixel. Or, there are different situations depending on the arrangement locations of the source driver and the gate driver. Furthermore, another method can also be used. In that case, there are different situations depending on the circuit configuration of the pixel. Or, there are different situations depending on the arrangement locations of the source driver and the gate driver. Furthermore, another method can also be used. In that case, there are different situations depending on the circuit configuration of the pixel. Or, there are different situations depending on the arrangement locations of the source driver and the gate driver.

[0047] Therefore, first, an example of a pixel circuit is shown in FIGS. 8(A) and (B). Note that FIGS. 8(A) and (B) Here, a pixel in the case of an active matrix type using a transistor is shown, but one aspect of the present invention is not limited to this. A passive matrix type pixel that does not use a transistor or the like may be used. Alternatively, it may be an illumination device in which pixels are not arranged and light is emitted over the entire surface. .

[0048] Pixel 909 has transistor 901, transistor 903, capacitor element 902, and light emitting element 904. Each pixel is electrically connected via wiring 906, wiring 905, wiring 907, and wiring 908. .

[0049] Wiring 906 has a function of supplying a video signal, an initialization signal, a precharge signal, etc. Therefore, wiring 906 has functions such as a source signal line and a video signal line. Wiring 905 has a function of supplying a selection signal etc. Therefore, wiring 905 has functions such as a gate signal line. Wiring 907 has a function of supplying current to light emitting element 904 or transistor 903, or a function of supplying a signal for correcting the current of transistor 903. Therefore, wiring 907 has functions such as an anode line, a current supply line, a power supply line, and a voltage supply line. Wiring 908 has functions such as a cathode line and a common electrode. . .

[0050] Transistor 901 has a function of controlling whether to supply a video signal, an initialization signal, etc., or whether to select a pixel. Therefore, transistor 901 has a function as a selection transistor. Capacitor element 902 has a function of holding a video signal and the threshold voltage of a transistor. Transistor 903 has a function of controlling the current supply to the light emitting element 904 or the transistor 903. The transistor 903 has a function capable of controlling the magnitude of the current flowing through the light-emitting element 904. The transistor 903 can control the magnitude of the current according to the voltage held in the capacitive element 902. That is, the transistor 903 has a function as a driving transistor. Therefore, in FIG. 8(A), a P-channel type is desirable for the transistor 903, and in FIG. 8(B), an N-channel type is desirable. However, one aspect of the present invention is not limited to this.

[0051] Note that the pixel circuit can adopt various configurations. Therefore, one aspect of the present invention is not limited to the configurations of FIGS. 8(A) and 8(B).

[0052] FIGS. 9(A) and 9(B) show diagrams in which the pixel circuits of FIG. 8(A) are arranged in a matrix. In FIG. 9(A), a case where a fold is provided in parallel with the wiring 907 is shown, and in FIG. 9(B), a case where a fold is provided in parallel with the wiring 905 is shown.

[0053] FIG. 10 shows a block diagram in the case where a circuit 911 for controlling the conduction state of the wiring 907 is provided in the case of FIG. 9(A). The wiring 906 is electrically connected to the source driver circuit 912. The wiring 907 is electrically connected to the circuit 911. The circuit 911 can control which of the plurality of wirings 907 to supply voltage to and which not to supply voltage to. As a result, when folded, a non-light-emitting region can be formed, and power consumption can be reduced.

[0054] FIGS. 11(A) and 11(B) show an example of the internal circuit configuration of the circuit 911. ​​​​​​​In the region to the left of the dashed line α1-α2 which is the first fold line, wiring 918A is used, and in the region to the right of the dashed line α1-α2 which is the first fold line, wiring 918B is used. The region to the left of the dashed line α1-α2 which is the first fold line is the region that can be displayed even when folded, and the region to the right of the dashed line α1-α2 which is the first fold line is the region that is not displayed when folded. Here, wiring 907A, wiring 907B, etc. are connected to wiring 918A, and wiring 907C, wiring 907D, wiring 907E, wiring 907F, etc. are connected to wiring 918B. By adopting such a configuration, when folded, by supplying a voltage to wiring 918A, current is supplied to the transistor 903 and the light-emitting element 904 of each pixel via wiring 907A, wiring 907B, etc., and light emission can be achieved. On the other hand, by making wiring 918B in a floating state without supplying a voltage, or by supplying a voltage such that the light-emitting element 904 does not emit light, current is not supplied to the transistor 903 and the light-emitting element 904 of each pixel, and light emission can be prevented. In the region to the right of the dashed line α1-α2 which is the first fold line, wiring 918B is used. The region to the left of the dashed line α1-α2 which is the first fold line is the region that can be displayed even when folded, and the region to the right of the dashed line α1-α2 which is the first fold line is the region that is not displayed when folded. Here, wiring 907A, wiring 907B, etc. are connected to wiring 918A, and wiring 907C, wiring 907D, wiring 907E, wiring 9 07F, etc. are connected to wiring 918B. By adopting such a configuration, when folded, by supplying a voltage to wiring 918A, current is supplied to the transistor 903 and the light-emitting element 904 of each pixel via wiring 907A, wiring 90 7B, etc., and light emission can be achieved. On the other hand, by making wiring 918B in a floating state without supplying a voltage, or by supplying a voltage such that the light-emitting element 904 does not emit light, current is not supplied to the transistor 903 and the light-emitting element 904 of each pixel, and light emission can be prevented.

[0055] In FIG. 11(A), the transistors 903 and the light-emitting elements 904 of each pixel are connected separately to wiring 9 18A and wiring 918B with the dashed line α1-α2 which is the first fold line as the boundary, but one aspect of the present invention is not limited to this. In order to enable light emission even in the region to the right of the dashed line α1-α2 which is the first fold line when folded, as shown in FIG. 11( B), wiring 907C and wiring 918A may be connected.

[0056] ​​​Note that the source driver circuit 912 and the circuit 911 may be divided into a plurality of IC chips, and IC chips may not be arranged in the region overlapping the fold line, so that they can be mounted by COG or TAB. Further, in FIGS. 11(A) and 11(B), the wiring 918A and the wiring 918B are used to control the light-emitting region and the non-light-emitting region when folded. However, one aspect of the present invention is not limited to this. The wiring 918A and the wiring 918B may be combined into one, and instead, a switch may be arranged to control light emission. FIG. 12(A)

[0057] shows that in the left region between the broken lines α1-α2 which is the first fold line, the wirings 907A, 907 B, etc. are connected to the wiring 918 without passing through a switch. Therefore, light can be emitted regardless of whether it is folded or not. On the other hand, in the right region between the broken lines α1-α 2 which is the first fold line, the wirings 907C, 907D, 907E, 907F, etc. are connected to the wiring 918 through switches 917C, 917D, 917E, 917F, etc. Therefore, when folded, these switches can be turned off to make the pixels non-light-emitting. Note that when the resistance value changes depending on the region due to the presence or absence of the switch, as shown in FIG. 12 (B), even in the left region between the broken lines α1-α2 which is the first fold line, the wirings 9 07A, 907B, etc. may be connected to the wiring 91 8 through switches 917A, 917B, etc. Next, regarding the configuration in which light emission can be controlled depending on the region in the case of FIG. 9(B),

[0058] (B), even in the left region between the broken lines α1-α2 which is the first fold line, the wirings 9 07A, 907B, etc. may be connected to the wiring 91 8 through switches 917A, 917B, etc.

[0059] Next, regarding the configuration in which light emission can be controlled depending on the region in the case of FIG. 9(B), as shown in FIG. 13(A). As shown in FIG. 13(A), in the lower region between the first fold line, the broken line α1-α2 the gate driver 9 13B is connected to the transistors 903 and the light-emitting elements 904 of each pixel. In the upper region between the first fold line, the broken line α1-α2 the gate driver 913A is connected to the transistors 903 and the light-emitting elements 904 of each pixel. In the lower region between the first fold line, the broken line α1-α2, even when folded the gate driver 913B is operated so that light can be emitted. In the upper region between the first fold line, the broken line α1-α2, when folded the gate driver 913A operates so that the pixels are not selected and light is not emitted. For example, the gate driver 913A outputs an L signal . As a result, since the gate driver 913A does not substantially perform a scan operation, the power consumption can be reduced. Note that FIG. 3(C) corresponds to the case of FIG. 13(A).

[0060] In the case of the display unit 102 shown in FIG. 3(C), for example, the first gate driver 104g_1 and the first source driver 104s_1 and the second source driver 104s_2 are used and the second gate driver 104g_2 does not output a selection signal (for example, only outputs an L signal ) so as not to substantially perform a scan operation, thereby enabling only the display unit 102a to be displayed.

[0061] Note that, as shown in FIG. 13(B), a circuit 915 may be provided in the output section of the gate driver 914 so that it is possible to control whether or not a selection signal is output. FIG. 14 shows an example of the circuit 915. By setting the potential of the wiring 920 to an H signal, the gate driver The output of 914 is controlled by the AND circuit 919 and output to the wiring 905. On the other hand By setting the potential of the wiring 920 to the L signal, the wiring 905 is always supplied with the L signal This enables the supply of the selection signal to the pixel to be stopped, thus reducing power consumption .

[0062] Note that the gate driver 914, the circuit 915, the gate driver 913A, etc. can be divided into a plurality of IC chips so that no IC chip is arranged in the region overlapping the fold, and it may be possible to implement them by COG or TAB .

[0063] Next, a diagram in which the pixel circuits of FIG. 8(B) are arranged in a matrix is shown in FIGS. 15(A) and (B) . In FIG. 15(A), the case where a fold is provided in parallel with the wiring 906 is shown, and in FIG. 15 (B), the case where a fold is provided in parallel with the wiring 905 is shown

[0064] In FIGS. 16(A) and (B), as in FIG. 13(A), the case where separate drive circuits are arranged according to the region is shown. Note that there may be a case where a circuit for driving the wiring 905 and a circuit for driving the wiring 907 are provided. In FIG. 16(A), the circuits 916A and 916B are respectively provided as circuits for driving the wiring 907. On the other hand, in FIG 16(B), the circuit 913 for driving the wiring 905 is provided without being divided according to the region . That is, the circuit for driving the wiring 905 and the circuit for driving the wiring 907 can be configured to be divided or not divided for each region .

[0065] Also, similar to the circuit 915 in FIG. 13(B), the circuit 921 is provided at the output part of the circuit 916 ​​​​An example in this case is shown in Fig. 17(A). A specific example of circuit 921 is shown in Fig. 17(B). By controlling the potential of wiring 9 23, the potential of wiring 907 is controlled by AND circuit 922 .

[0066] In this way, the light emission state can be controlled according to the region by various methods.

[0067] However, as in the display unit 102 shown in Fig. 3(C), after driving the drive circuit unit 104 in a configuration where only the display unit 102a displays an image, in the state where the display unit 102 of the display panel 105 shown in Figs. 2(A) and (B) is unfolded (the first form), when an image is displayed on the entire surface of the display unit 102 , a phenomenon may occur in which the brightness of the display unit 102a and the display unit 102b shown in Fig. 3(C) is different. For example, when a light-emitting element is used as the display unit 102, by adopting a configuration in which only the display unit 102a displays an image, the light-emitting elements in the region of the display unit 102a may deteriorate. Therefore, in the first form in which the display unit 102 is unfolded, the brightness and the like vary within the plane of the display unit 102, and it is recognized as display unevenness . In particular, since the brightness change is large at the boundary between the display unit 102a and the display unit 102b, the boundary between the display unit 102a and the display unit 102b is recognized by the viewer. .

[0068] Therefore, in the information processing apparatus 100 according to one aspect of the present invention, according to the first form in which the display unit 102 is unfolded or the second form in which the display unit 102 is folded, the program performs brightness adjustment processing and controls the driving method, thereby making it possible to reduce the display unevenness of the display unit 102, particularly the difference in brightness at the boundary between the display unit 102a and the display unit 102b. Thus . . . .

[0069] . , or according to the second form in which the display unit 102 is folded, the program performs brightness adjustment processing and controls the driving method, thereby making it possible to reduce the display unevenness of the display unit 102, particularly the difference in brightness at the boundary between the display unit 102a and the display unit 102b. Thus , by controlling the driving method, it is possible to reduce the display unevenness of the display unit 102, particularly the difference in brightness at the boundary between the display unit 102a and the display unit 102b. Therefore . Thus, an information processing apparatus with high display quality can be provided.

[0070] Here, with reference to FIGS. 4 and 5, the above-described program and driving method will be described. will be described.

[0071] <Program> FIG. 4 is a flowchart of the program included in the storage unit 110 of the information processing apparatus 100 shown in FIG. 1(A). is a flowchart.

[0072] In the first step, the state of the outer shape of the display unit 102 is specified based on the information from the detection unit 106 (step S1). (step S1).

[0073] In the second step, it is determined whether the display unit 102 is in a deployed form (first form) ( step S2). If it is in the first form, proceed to the fifth step; if it is not in the first form, proceed to the third step.

[0074] In the third step, it is determined whether the display unit 102 is in a folded form (second form) (step S3). If it is in the second form, proceed to the fourth step; if it is not in the second form, proceed to the first step (step S1).

[0075] In the fourth step, brightness adjustment processing is performed (step S4).

[0076] In the fifth step, the process ends (step S5).

[0077] Here, the brightness adjustment processing in the fourth step (step S4) will be described using the flowchart shown in FIG. 5. will be described.

[0078] <Brightness Adjustment Processing> In the sixth step, the display area and the non-display area are determined (step V6). In particular, It is preferable that the non-display area is set from the boundary of the display area recognizable by the viewer.

[0079] In the seventh step, for example, at least one drive circuit unit is put into a standby state (step V7). In addition, as described above, various methods for controlling various non-emitting areas can be adopted.

[0080] By putting at least one drive circuit unit into a standby state or the like, it becomes possible to make the image of the area not observable by the viewer in the form in which the display unit 102 is folded (second form) non-displayable, so that the information processing apparatus 100 with low power consumption can be achieved.

[0081] In the eighth step, a part of the non-display area is caused to emit light (step V8).

[0082] In the ninth step, it is determined whether to cancel the brightness adjustment process (step V9). When the brightness adjustment process is canceled, the process proceeds to the tenth step, and when the brightness adjustment process is not canceled, the process proceeds to the eighth step.

[0083] In the tenth step, the process returns from the brightness adjustment process (step V10).

[0084] Here, the specific method of the above-described brightness adjustment process will be described with reference to FIG. 6.

[0085] FIGS. 6(A) and (C) are top schematic views for explaining the configuration of the display panel 105. Also, FIG. 6(B) corresponds to a cross-sectional view of a cut surface between the dashed-dotted line A-B shown in FIG. 6(A). Also, FIG. 6(D) corresponds to a cross-sectional view of a cut surface between the dashed-dotted line A-B shown in FIG. 6(B).

[0086] Note that FIGS. 6(A) and 6(B) are a top view schematic diagram and a cross-sectional view of the form (first form) in which the display unit 102 is unfolded, and FIGS. 6(C) and 6(D) are a top view schematic diagram and a cross-sectional view of the form (second form) in which the display panel 105 of the display unit 102 shown in FIGS. 6(A) and 6(B) is folded. The display panel 105 shown in FIG. 6(A) can be folded between the broken lines α1-α2 and the broken lines β1-β2 in the same manner as the display panel 105 shown in FIG. 1(B).

[0087] The display panel 105 shown in FIGS. 6(A), (B), (C), and (D) includes the display unit 102 and, as a drive circuit unit 104 on the outer periphery of the display unit 102, a first gate driver 104g_1, a second gate driver 104g_2, a first source driver 104s_1, and a second source driver 104s_2. The first gate driver 104g_1, the first source driver 104s_1, and the second source driver 104s_2 are independently formed in non-folded regions, respectively.

[0088]

[0089] In FIG. 6(D), similar to the display unit 102 shown in FIG. 3(C), the display unit 102 is divided into a display unit 102a and a display unit 102b, and only the display unit 102a that can be observed by the viewer is displayed, and an image of the display unit 102b that cannot be observed by the viewer is not displayed.

[0090] In the display unit 102b of FIG. 6(D), a light-emitting region 130 including a first light-emitting region 131, a second light-emitting region 132, and a third light-emitting region 133 is formed from the boundary with the display unit 102a.

[0091] ​​​​​​​​​​​​​​ The light-emitting region 130 emits light according to the eighth step (step V8) executed by the above-described program.

[0092] The light-emitting region 130 satisfies the relationship: luminance of the first light-emitting region 131 > luminance of the second light-emitting region 132 > luminance of the third light-emitting region. This can be achieved by controlling the video signals of the pixels in each region.

[0093] In this way, by providing a light-emitting region in which the luminance changes stepwise from the display unit 102a, the luminance at the boundary between the display unit 102a and the display unit 102b changes smoothly. For example, when a light-emitting element is used as the display unit 102, only the light-emitting elements in the region of the display unit 102a deteriorate when only the display unit 102a emits light. However, by providing a light-emitting region in which the luminance changes stepwise from the display unit 102a, the deterioration of the light-emitting elements is alleviated from the display unit 102a to the display unit 102b. Therefore, since the viewer cannot recognize the boundary between the display unit 102a and the display unit 102b, an information processing apparatus with high display quality can be provided.

[0094] Note that FIGS. 6(A) and (B) are illustrated for easy understanding, and the light-emitting region 130 may emit light when the display unit 102 shown in FIGS. 6(C) and (D) is in the folded form (second form).

[0095] Therefore, for example, it may be considered that the light-emitting region 130 is included in the region of the display unit 102a instead of the display unit 102b. For example, as corresponding to FIG. 6(D), as shown in FIG. 18(A), the display unit 102a is also provided on the side surface, and the first light-emitting region 131, the second ​​​​​​​​​​​​​​The light-emitting region 132 and the third light-emitting region 133 may be made to be completely hidden. Thus, in the visible region, since it appears with normal brightness, appropriate display can be performed. Also, or, as shown in FIG. 18(B), the display unit 102a may be limited only to a flat region, and the first light-emitting region 131, the second light-emitting region 132, and the third light-emitting region 133 may be provided in the bent portion. Since the bent portion appears distorted, it is not suitable for accurate display. Therefore, by performing gradation display in that region, it becomes difficult to visually recognize the influence of degradation.

[0096] Or, the states such as those in FIG. 18(B), FIG. 6(D), and FIG. 18(A) may be switched at predetermined intervals. Or, from FIG. 18(B), the boundary gradually changes to become FIG. 6(D), and further the boundary gradually changes to become FIG. 18(A), and then, similarly, it may return to FIG. 18(B) via FIG. 6(D). In this way, by changing the light-emitting region, it becomes even more difficult to visually recognize the influence of degradation.

[0097] Also, the starting point of the light-emitting region within the display unit 102b may be changed, or the position or brightness of the light-emitting region within the display unit 102b may be changed. For example, when the display unit 102 is folded multiple times, at the first folding, only the first light-emitting region 131 emits light. At the second folding, the first light-emitting region 131 and the second light-emitting region 132 emit light. At the third folding, the starting point of the first light-emitting region 131 is changed and it emits light. Such a light-emitting pattern is also one of the effective driving methods for reducing

[0098] Also, in FIGS. 6(A), (B), and (D), the light-emitting region 130 is composed of three light-emitting regions: a first light-emitting region 13 1, a second light-emitting region 132, and a third light-emitting region 133, but is not limited thereto. For example, the light-emitting region 130 may not have regions such as the first light-emitting region 131, the second light-emitting region 132, and the third

[0099] light-emitting region 133. In that case, states such as those in FIGS. 18(C), 3(C ), and 18(D) may be switched at predetermined intervals. Alternatively, from FIG. 18 (C), the boundary gradually changes to FIG. 3(C), and further, the boundary gradually changes to FIG. 18(D), and then, similarly, via FIG. 3(C), it may return to FIG. 18(C). In this way, by changing the light-emitting region, the influence of further degradation can be made less visible. It is also possible to separately execute a program such that the light-emitting region 130 emits light only when the information processing apparatus 150 is charged.

[0100] Also, the light-emitting region 130 may be independently controlled by a circuit different from the drive circuit unit 104. For example, since there is no need to display an image in the light-emitting region 130, the anode and cathode of the light-emitting element are short-circuited. In this case, the light-emitting element provided in the display unit 102 may be driven by the drive

[0101] circuit unit 104. Moreover, the luminance of each of the first light-emitting region 131, the second light-emitting region 132, and the third light-emitting region 133 of the light-emitting region 130 is measured by a current monitor circuit for the current flowing through the display unit 102a.

[0102] It is set by measuring and reading the current value of the current monitor circuit.

[0103] In addition, this embodiment can be appropriately combined with other embodiments shown in this specification. It can be.

[0104] (Embodiment 2) In this embodiment, an example of an information processing apparatus according to one aspect of the present invention will be described with reference to FIG. 19. It will be described.

[0105] FIG. 19(A) shows an information processing apparatus 150 in a form (first form) in which a display unit is deployed. FIG. 19(B) shows an information processing apparatus 150 in a form (first form) in which the display unit is deployed or in an intermediate form changing from one form (second form) in which the display unit is folded to the other. FIG. 1 (Second form) to the other. FIG. 1 FIG. 19(C) shows an information processing apparatus 150 in a form (second form) in which the display unit is folded.

[0106] The information processing apparatuses 150 shown in FIGS. 19(A), (B), and (C) have a display panel 152 including a flexible display unit. The information processing apparatus 150 further includes a plurality of support panels 153 a, a plurality of support panels 155a, and a plurality of support panels 155b. It has.

[0107] The support panel 153a is formed of a material having lower flexibility than the display panel 152, for example. Further, the support panels 155a and 155b are formed of a material having lower flexibility than the support panel 153a, for example. As shown in FIGS. 19(A), (B), and (C), It is preferable to have a support panel on the outer periphery of the display panel 152 and on the surface of the display panel 152 facing the display unit, so that the mechanical strength of the display panel 152 is increased and the structure is less likely to be damaged. It is preferable.

[0108] Also, when the support panels 153a, 155a, and 155b are formed of a light-shielding material, it is possible to suppress external light from irradiating the drive circuit portion of the display panel 152. Thus, it is suitable because light degradation of transistors and the like used in the drive circuit portion can be suppressed.

[0109] Although not shown in FIGS. 19(A), (B), and (C), the arithmetic unit, storage unit, detection unit, etc. included in the information processing apparatus 150 can be disposed between the display panel 152 and the support panel 155b.

[0110] As materials that can be used for the support panels 153a, 155a, and 155b, plastics, metals, alloys, rubber, etc. can be used to form them. By using plastics or rubber, etc., it is possible to obtain lightweight and damage-resistant support panels, which is preferable. For example, as the support panels 1 53a, 155a, and 155b, silicone rubber, stainless steel, or aluminum can be used.

[0111] Also, in the information processing apparatus 150, the display panel 152 including a flexible display portion can be folded either inward or outward. When the information processing apparatus 150 is not in use, by bending the display panel 152 so that the display portion is on the inside, it is possible to suppress the display portion from being scratched or soiled.

[0112] Note that this embodiment can be appropriately combined with other embodiments shown in this specification.

[0113] (Embodiment 3) In this embodiment, a light-emitting panel that can be used in an information processing apparatus according to an aspect of the present invention will be described with reference to FIGS. 20 to 25. ​​​

[0114] <Specific Example 1> Fig. 20(A) shows a top view of the light-emitting panel, and Fig. 20(B) shows an example of a cross-sectional view of the cross-section between the dashed-dotted line A1 - A2 in Fig. 20(A). An example of the cross-sectional view of the cross-section between the dashed-dotted line A1 - A2 in Fig. 20(A) is shown in Fig. 20(B).

[0115] The light-emitting panel shown in Fig. 20(B) has an element layer 180, an adhesive layer 185, and a substrate 181. . The element layer 180 has a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 254, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, a sealing layer 21 3, an insulating layer 261, a coloring layer 259, a light-shielding layer 257, and an insulating layer 255.

[0116] The conductive layer 254 is electrically connected to the FPC 186 via the connector 215.

[0117] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The lower electrode 231 is electrically connected to the source electrode or the drain electrode of the transistor 240 . The end of the lower electrode 231 is covered with the insulating layer 211. The light-emitting element 230 has a top emission structure. The upper electrode 235 has light-transmitting properties and transmits the light emitted by the EL layer 233 .

[0118] The coloring layer 259 is provided at a position overlapping with the light-emitting element 230, and the light-shielding layer 257 is provided at a position overlapping with the insulating layer 211 . The coloring layer 259 and the light-shielding layer 257 are covered with the insulating layer 261 . The space between the light-emitting element 230 and the insulating layer 261 is filled with the sealing layer 213.

[0119] The light-emitting panel has a plurality of transistors in the light extraction portion 182 and the drive circuit portion 184 . The transistor 240 is provided on the insulating layer 205. The insulating layer 205 and the substrate 2 01 is bonded by an adhesive layer 203. Further, the insulating layer 255 and the substrate 181 are bonded by an adhesive layer 185. When a film with low water permeability is used for the insulating layer 205 or the insulating layer 255, it is possible to suppress the intrusion of impurities such as water into the light-emitting element 230 and the transistor 240, which is preferable because the reliability of the light-emitting panel is improved. The adhesive layer 203 can use the same materials as the adhesive layer 185.

[0120] In Specific Example 1, an insulating layer 205, a transistor 240, and a light-emitting element 230 are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and the insulating layer 2 05, the transistor 240, and the light-emitting element 230 are transferred onto the substrate 201 using the adhesive layer 203, showing a light-emitting panel that can be fabricated. Further, in Specific Example 1, an insulating layer 255, a coloring layer 259 and a light-shielding layer 257 are fabricated on a fabrication substrate with high heat resistance, the fabrication substrate is peeled off, and the insulating layer 255, the coloring layer 259, and the light-shielding layer 257 are transferred onto the substrate 181 using the adhesive layer 185, showing a light-emitting panel that can be fabricated.

[0121] When a material (such as resin) with high water permeability and low heat resistance is used for the substrate, the substrate cannot be subjected to high temperature during the fabrication process, so there are limitations on the conditions for fabricating transistors and insulating films on the substrate. In the fabrication method of the present embodiment, since transistors and the like can be fabricated on a fabrication substrate with high heat resistance, it is possible to form highly reliable transistors and insulating films with sufficiently low water permeability. Then, by transferring them onto the substrate 181 or the substrate 201, a highly reliable light-emitting panel can be fabricated. As a result, in one aspect of the present invention, a lightweight or thin and highly reliable information processing apparatus can be realized.

[0122] It is preferable to use a highly tough material for each of the substrate 181 and the substrate 201. Thereby, a display device excellent in impact resistance and difficult to be damaged can be realized. For example, the substrate 181 is an organic resin substrate, and the substrate 201 is a substrate using a thin metal material or alloy material. In this way, a lighter and less breakable light-emitting panel can be realized compared with the case where a glass substrate is used for the substrate. It can be realized.

[0123] Since the metal material or alloy material has high thermal conductivity and can easily conduct heat throughout the substrate, local temperature rise of the light-emitting panel can be suppressed, which is preferable. When using a metal material or alloy material for the substrate, the thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

[0124] In addition, when a material with a high emissivity is used for the substrate 201, it is possible to suppress the surface temperature of the light-emitting panel from increasing, and it is possible to suppress the destruction and reliability degradation of the light-emitting panel. For example, the substrate 201 may have a laminated structure of a metal substrate and a layer with a high emissivity (for example, a metal oxide or a ceramic material can be used).

[0125] <Specific Example 2> FIG. 21(A) shows another example of the light extraction portion 182 in the light-emitting panel. FIG. 21(A) shows a light-emitting panel capable of touch operation. In each of the following specific examples, the description of the same configuration as that of the specific example 1 is omitted.

[0126] The light-emitting panel shown in FIG. 21(A) includes an element layer 180, an adhesive layer 185, and a substrate 181. The element layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, and an insulating An edge layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, and a sealing layer 21 3, an insulating layer 261, a colored layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 281, a conductive The insulating layer 283 , the insulating layer 291 , the insulating layer 293 , the insulating layer 295 , and the insulating layer 255 .

[0127] In the specific example 2, an insulating layer 217 is provided on the insulating layer 211. , the distance between the substrate 181 and the substrate 201 can be adjusted.

[0128] FIG. 21A shows an example in which a light-receiving element is provided between an insulating layer 255 and a sealing layer 213. The non-light-emitting region on the substrate 201 side (for example, the region where the transistor 240 and wiring are provided) is overlapped. Since the light receiving element can be arranged in a wide area, the aperture ratio of the pixel (light emitting element) is not reduced. A touch sensor can be provided on the light-emitting panel.

[0129] The light receiving element of the light emitting panel is, for example, a pn-type or pin-type photodiode. In this embodiment, a p-type semiconductor layer 271, an i-type semiconductor layer A pin type photodiode having a conductor layer 273 and an n-type semiconductor layer 275 is used.

[0130] The i-type semiconductor layer 273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1×10 20 cm -3 The concentration is less than 10 and the photoconductivity is 10 The i-type semiconductor layer 273 contains an impurity element of Group 13 or 15 of the periodic table. In other words, i-type semiconductors are those that have valence electron control. When no impurity elements are intentionally added, it exhibits weak n-type electrical conductivity, so it is called an i-type semiconductor layer. 273 includes those in which an impurity element imparting a p-type is intentionally or unintentionally added during or after film formation. It falls within this category.

[0131] The light-shielding layer 257 is above the light-emitting element 230 and overlaps with the light-receiving element. The light emitted from the light-emitting element 230 can be suppressed from irradiating the light-receiving element by the light-shielding layer 257 located between the light-receiving element and the encapsulation layer 213.

[0132] The conductive layer 281 and the conductive layer 283 are each electrically connected to the light-receiving element. It is preferable to use a conductive layer that transmits the light incident on the light-receiving element for the conductive layer 281. It is preferable to use a conductive layer that shields the light incident on the light-receiving element for the conductive layer 283.

[0133] Having an optical touch sensor between the substrate 181 and the encapsulation layer 213 is preferable because it is less affected by the light emission of the light-emitting element 230 and the signal-to-noise ratio can be improved.

[0134] <Specific Example 3> Another example of the light extraction part 182 in the light-emitting panel is shown in FIG. 21(B). The light-emitting panel in FIG. 21(B) is a light-emitting panel capable of touch operation.

[0135] The light-emitting panel shown in FIG. 21(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The element layer 180 has a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 207, an insulating layer 209a, an insulating layer 209b, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, an encapsulation layer 213, a coloring layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 280, a conductive layer 281, and an insulating layer 255.

[0136] ​​​​​​​​​​FIG. 21(B) shows an example in which a light-receiving element is provided between the insulating layer 205 and the sealing layer 213. By providing the light-receiving element between the insulating layer 205 and the sealing layer 213, the transistor 240 is formed using the same material and the same process as the conductive layer and the semiconductor layer constituting the transistor 240, and a conductive layer electrically connected to the light-receiving element and a photoelectric conversion layer constituting the light-receiving element can be formed. Therefore, a light-emitting panel capable of touch operation can be manufactured without significantly increasing the manufacturing process.

[0137] <Specific Example 4> Another example of the light-emitting panel is shown in FIG. 22(A). The light-emitting panel in FIG. 22(A) is a light-emitting panel capable of touch operation.

[0138] The light-emitting panel shown in FIG. 22(A) includes an element layer 180, an adhesive layer 185, and a substrate 181. The element layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 253, a conductive layer 254, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, a coloring layer 259, a light-shielding layer 257, an insulating layer 255, a conductive layer 272, a conductive layer 274, an insulating layer 276, an insulating layer 278, a conductive layer 294, and a conductive layer 296.

[0139] FIG. 22(A) shows an example in which a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. The capacitive touch sensor includes a conductive layer 272 and a conductive layer 274.

[0140] The conductive layer 253 and the conductive layer 254 are electrically connected to the FPC 186 via the connector 215. The conductive layer 294 and the conductive layer 296 are electrically connected to the conductive layer 274 via the conductive particles 292. Therefore, the capacitive touch sensor is driven via the FPC 186. ​ It is possible.

[0141] <Specific Example 5> Another example of the light-emitting panel is shown in FIG. 22(B). The light-emitting panel in FIG. 22(B) is a light-emitting panel capable of touch operation. It is a light-emitting panel capable of touch operation.

[0142] The light-emitting panel shown in FIG. 22(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The element layer 180 has a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 253, a conductive layer 254, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, a coloring layer 259, a light-shielding layer 257, an insulating layer 255, a conductive layer 270, a conductive layer 272, a conductive layer 274, an insulating layer 276, and an insulating layer 278. In FIG. 22(B), an example having a capacitive touch sensor between the insulating layer 255 and the sealing layer 213 is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. The conductive layer 253 and the conductive layer 254 are electrically connected to the FPC 186a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 186b via the connector 215b. Therefore, the light-emitting elements 230 and the transistors 240 can be driven via the FPC 186a, and the capacitive touch sensor can be driven via the FPC 186b. It is possible.

[0143] In FIG. 22(B), an example having a capacitive touch sensor between the insulating layer 255 and the sealing layer 213 is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0144] The conductive layer 253 and the conductive layer 254 are electrically connected to the FPC 186a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 186b via the connector 215b. Therefore, the light-emitting elements 230 and the transistors 240 can be driven via the FPC 186a, and the capacitive touch sensor can be driven via the FPC 186b. It is possible.

[0145] <Specific Example 6> Another example of the light extraction portion 182 in the light-emitting panel is shown in FIG. 23(A).

[0146] The light extraction portion 182 shown in FIG. 23(A) has a substrate 181, an adhesive layer 185, a substrate 202. ​Insulating layer 205, a plurality of transistors, insulating layer 207, conductive layer 208, insulating layer 209a, ins ulating layer 209b, a plurality of light-emitting elements, insulating layer 211, encapsulation layer 213, and a coloring layer 259.

[0147] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The lower electrode 231 is electrically connected to the source electrode or drain electrode of the transistor 240 via the conductive layer 208. An end portion of the lower electrode 231 is covered with the insulating layer 211. The light-emitting element 230 has a bottom emission structure. The lower electrode 231 has translucency and transmits light emitted by the EL layer 23 3.

[0148] A coloring layer 259 is provided at a position overlapping the light-emitting element 230, and light emitted by the light-emitting element 230 is extracted to the substrate 181 side through the coloring layer 259. The space between the light-emitting element 230 and the substrate 202 is filled with the encapsulation layer 213. The substrate 202 can be manufactured using the same material as the aforementioned substrate 201.

[0149] <Specific Example 7> Another example of the light-emitting panel is shown in FIG. 23(B).

[0150] The light-emitting panel shown in FIG. 23(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The element layer 180 has a substrate 202, an insulating layer 205, a conductive layer 310a, a conductive layer 310b, a plurality of light-emitting elements, an insulating layer 211, a conductive layer 212, and an encapsulation layer 213.

[0151] The conductive layer 310a and the conductive layer 310b are external connection electrodes of the light-emitting panel and can be electrically connected to an FPC or the like.

[0152] ​​​​​​The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The end portion of the lower electrode 231 is covered with an insulating layer 211. The light-emitting element 230 has a bottom emission structure. The lower electrode 231 has translucency and transmits the light emitted by the EL layer 233. The conductive layer 212 is electrically connected to the lower electrode 231.

[0153] The substrate 181 may have, as a light extraction structure, a hemispherical lens, a microlens array, a film with a concavo-convex structure, a light diffusion film, or the like. For example, the above-described lens or film can be adhered onto a resin substrate using an adhesive or the like having a refractive index similar to that of the substrate or the lens or film to form a light extraction structure.

[0154] The conductive layer 212 does not necessarily have to be provided, but it is preferably provided because it can suppress the voltage drop due to the resistance of the lower electrode 231. Also, for the same purpose, a conductive layer electrically connected to the upper electrode 235 may be provided on the insulating layer 211.

[0155] The conductive layer 212 can be formed as a single layer or by lamination using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material having these as a main component. The film thickness of the conductive layer 212 can be set to 0.1 μm or more and 3 μm or less, and preferably, it is 0.1 μm or more and 0.5 μm or less.

[0156] When a paste (such as a silver paste) is used as the material of the conductive layer electrically connected to the upper electrode 235, the metal constituting the conductive layer becomes granular and aggregates. Therefore, the surface of the conductive layer ​It becomes a structure with many gaps, and it is difficult for the EL layer 233 to completely cover the conductive layer, and it is preferable that the upper electrode can easily make an electrical connection with the conductive layer.

[0157] <An example of a material> Next, materials and the like that can be used for the light-emitting panel will be described. Note that the description of the configuration described above will be omitted.

[0158] The element layer 180 has at least a light-emitting element. As the light-emitting element, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in that category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, etc. can be used. Among the above, an organic EL element is particularly preferable from the viewpoints of luminous efficiency and manufacturing method. .

[0159] The element layer 180 may further have a transistor for driving the light-emitting element, a touch sensor, etc. .

[0160] The structure of the transistor included in the light-emitting panel is not particularly limited. For example, it may be a staggered transistor or an inverse staggered transistor. Also, it may have either a top gate type or a bottom gate type transistor structure. The semiconductor material used for the transistor is not particularly limited, and examples include silicon, germanium, etc. Or , an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn-based metal oxide, may be used.

[0161] The crystallinity of the semiconductor material used for the transistor is not particularly limited either, and amorphous semiconductors, Any semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or semiconductor having a partially crystalline region) may be used. Using a semiconductor having crystallinity is preferable because deterioration of transistor characteristics can be suppressed. The light-emitting element included in the light-emitting panel includes a pair of electrodes (lower electrode 231 and upper electrode 235) and an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes functions as an anode,

[0162] and the other functions as a cathode. The light-emitting element may have any of a top emission structure, a bottom emission structure, and a dual emission structure. For the electrode on the side where light is extracted, a conductive film that transmits visible light is used. Also, for the electrode on the side where light is not extracted, it is preferable to use a conductive film that reflects visible light. The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide doped with gallium, or the like. Also, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) can be used by forming them thinly enough to have light transmittance. Further, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Also, graphene or the like may be used.

[0163] The light-emitting element may have any of a top emission structure, a bottom emission structure, and a dual emission structure. For the electrode on the side where light is extracted, a conductive film that transmits visible light is used. Also, for the electrode on the side where light is not extracted, it is preferable to use a conductive film that reflects visible light.

[0164] The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide doped with gallium, or the like. Also, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) can be used by forming them thinly enough to have light transmittance. Also, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) can be used by forming them thinly enough to have light transmittance. For example, titanium nitride) can be used by forming them thinly enough to have light transmittance. Also, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Also, graphene or the like may be used.

[0165] ​ A conductive film that reflects visible light can be made of, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy containing these metal materials. Further, lanthanum, neodymium, or germanium may be added to the above metal materials or alloys. Also, it can be formed using an alloy containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium (aluminum alloy), or an alloy containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, or an alloy of silver and magnesium. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, oxidation of the aluminum alloy film can be suppressed by laminating a metal film or a metal oxide film in contact with the aluminum alloy film. Examples of materials for the metal film and the metal oxide film include titanium and titanium oxide. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used.

[0166] The electrodes can be formed using, for example, vapor deposition or sputtering. In addition, they can be formed using a dispensing method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

[0167] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected into the EL layer 233 from the anode side and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light. ​​​​​​​​​​​​​​​​

[0168] The EL layer 233 has at least a light-emitting layer. As layers other than the light-emitting layer, the EL layer 233 may further have a layer containing a substance with high hole injection property, a substance with high hole transport property, a hole blocking material, a substance with high electron transport property, a substance with high electron injection property, or a bipolar substance (a substance with high electron transport property and high hole transport property), etc.

[0169] Either a low molecular weight compound or a high molecular weight compound can be used for the EL layer 233, and it may contain an inorganic compound. The layers constituting the EL layer 233 can each be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, etc.

[0170] In the element layer 180, it is preferable that the light-emitting element is provided between a pair of insulating films with low water permeability. Thereby, it is possible to suppress the intrusion of impurities such as water into the light-emitting element and suppress the decrease in the reliability of the light-emitting device.

[0171] Examples of the insulating film with low water permeability include films containing nitrogen and silicon such as a silicon nitride film and a silicon oxynitride film, and films containing nitrogen and aluminum such as an aluminum nitride film. Further, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. may be used.

[0172] For example, the water vapor transmission rate of the insulating film with low water permeability is 1×10 -5 [g / m 2 ·day] or less, preferably 1×10 [g / m -6 ·day] or less, more preferably 1×10 2 [g / m -7 g / m 2 ·day] or less, and even more preferably 1×10 -8 [g / m​​​​​​​​​​2 ·day]Shall be as follows as follows.

[0173] The substrate 181 has translucency and transmits at least the light emitted by the light-emitting elements included in the element layer 180. The substrate 181 may have flexibility. Also, the refractive index of the substrate 181 is higher than that of the atmosphere. than that of the atmosphere.

[0174] Since an organic resin is lighter in weight than glass, using an organic resin as the substrate 181 can reduce the weight of the light-emitting device compared to using glass, which is preferable. compared to using glass, which is preferable.

[0175] Examples of materials having flexibility and transmissivity for visible light include glass having a thickness with a certain degree of flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, and the like. In particular, it is preferable to use a material having a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used can be preferably used . Also, a substrate in which glass fibers are impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used . Also, a substrate in which glass fibers are impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used . Also, a substrate in which glass fibers are impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used . Also, a substrate in which glass fibers are impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used

[0176] As the substrate 181, a layer using the above materials may be laminated with a hard coat layer (for example, a silicon nitride layer, etc.) that protects the surface of the light-emitting device from scratches or a layer made of a material capable of dispersing pressure (for example, an aramid resin layer, etc.). Also, the light-emitting elements due to moisture, etc. an aramid resin layer, etc.). Also, the light-emitting elements due to moisture, etc. In order to suppress a decrease in the life of the element or the like, it may have the above-described insulating film with low water permeability.

[0177] The adhesive layer 185 has translucency and transmits at least the light emitted by the light-emitting element included in the element layer 180. Also, the refractive index of the adhesive layer 185 is higher than the refractive index of the atmosphere.

[0178] As the adhesive layer 185, a curable resin that cures at room temperature, such as a two-component mixed resin, a photocurable resin, a thermosetting resin, or the like can be used. For example, epoxy resin, acrylic resin, silicone resin, phenolic resin, and the like can be mentioned. In particular, a material with low moisture permeability such as epoxy resin is preferable.

[0179] Further, the above resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an oxide of an alkaline earth metal (calcium oxide, barium oxide, etc.), can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. When a desiccant is included, it is possible to suppress the intrusion of impurities such as moisture into the light-emitting element, which is preferable because the reliability of the light-emitting device is improved.

[0180] Further, by mixing a filler with a high refractive index (such as titanium oxide) into the above resin, the light extraction efficiency from the light-emitting element can be improved, which is preferable.

[0181] Also, the adhesive layer 185 may have a scattering member that scatters light. For example, a mixture of the above resin and particles having a refractive index different from that of the above resin can also be used for the adhesive layer 185. The particles function as a light scattering member.

[0182] The resin and the particles having a refractive index different from that of the resin preferably have a refractive index difference of 0.1 or more , more preferably 0.3 or more. Specifically, examples of the resin include epoxy resin, acrylic resin, imide resin, silicone, and the like. Examples of the particles include titanium oxide , barium oxide, zeolite, and the like.

[0183] Particles of titanium oxide and barium oxide preferably have a strong property of scattering light. Further, when zeolite is used, it can adsorb water possessed by the resin or the like, and can improve the reliability of the light-emitting element .

[0184] An inorganic insulating material can be used for the insulating layer 205 and the insulating layer 255. In particular, it is preferable to use the insulating film having low water permeability described above because a highly reliable light-emitting panel can be realized.

[0185] The insulating layer 207 has an effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor . As the insulating layer 207, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used.

[0186] As the insulating layer 209, the insulating layer 209a, and the insulating layer 209b, it is preferable to select an insulating film having a planarizing function in order to reduce surface irregularities caused by transistors or the like . For example, organic materials such as polyimide-based resins, acrylic-based resins, and benzocyclobutene-based resins can be used. In addition to the above organic materials, low dielectric constant materials (low-k materials) and the like can be used. Note that a plurality of insulating films and inorganic insulating films formed of these materials may be laminated .

[0187] The insulating layer 211 is provided to cover the end portion of the lower electrode 231. The upper layer of the insulating layer 211 To achieve good coverage of the EL layer 233 and the upper electrode 235 formed thereon, it is preferable that the side wall of the insulating layer 2 11 be an inclined surface formed with a continuous curvature.

[0188] As the material of the insulating layer 211, a resin or an inorganic insulating material can be used. As the resin For example, polyimide-based resins, polyamide-based resins, acrylic-based resins, siloxane-based resins epoxy-based resins, or phenolic resins can be used. In particular, since the production of the insulating layer 211 is facilitated, it is preferable to use a negative-type photosensitive resin or a positive-type photosensitive resin.

[0189] The method for forming the insulating layer 211 is not particularly limited, and a photolithography method, a sputtering method , a vapor deposition method, a droplet discharge method (such as an inkjet method), a printing method (screen printing, offset printing etc.) can be used.

[0190] The insulating layer 217 can be formed using an inorganic insulating material, an organic insulating material, or a metal material, etc. For example, as the organic insulating material, negative-type or positive-type photosensitive resins, non-photosensitive resins etc. can be used. Also, as the metal material, titanium, aluminum, etc. can be used. By using a conductive material for the insulating layer 217 and configuring the insulating layer 217 and the upper electrode 235 to be electrically connected, potential drop caused by the resistance of the upper electrode 235 can be suppressed. Also, the insulating layer 217 may have a forward taper shape or a reverse taper shape.

[0191] The insulating layers 276, 278, 291, 293, and 295 are each ​, it can be formed using an inorganic insulating material or an organic insulating material. In particular, the insulating layer 278 and the insulating layer 295 It is preferable to use an insulating layer having a planarizing function in order to reduce surface irregularities caused by the sensor element. is preferred.

[0192] For the encapsulation layer 213, a curable resin that cures at room temperature, such as a two-component mixed resin, a photo-curable resin , a resin such as a thermosetting resin can be used. For example, PVC (polyvinyl chloride ide) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB ( polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The encapsulation layer 213 may contain a desiccant. Also, when the light of the light-emitting element 230 passes through the encapsulation layer 213 and is taken out of the light-emitting panel, the encapsulation layer 213 preferably contains a filler or a scattering member having a high refractive index. Regarding the desiccant, the filler having a high refractive index, and the scattering member, the same materials as those that can be used for the adhesive layer 185 can be mentioned.

[0193] The conductive layer 253, the conductive layer 254, the conductive layer 294, and the conductive layer 296 can be formed of the same material and in the same process as the conductive layer constituting the transistor or the light-emitting element, respectively. Also, the conductive layer 280 can be formed of the same material and in the same process as the conductive layer constituting the transistor.

[0194] For example, each of the above conductive layers can be formed as a single layer or by lamination using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, or an alloy material containing these elements. Also, each of the above conductive layers may be formed using a conductive metal oxide. Examples of the conductive metal oxide include ​​​​​​​Indium (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, indium zinc oxide (such as In2O3-ZnO) or a material obtained by adding silicon oxide to these metal oxide materials can be used.

[0195] Also, the conductive layer 208, the conductive layer 212, the conductive layer 310a, and the conductive layer 310b can each be formed using the above metal material, alloy material, or conductive metal oxide, etc.

[0196] The conductive layer 272 and the conductive layer 274, and the conductive layer 281 and the conductive layer 283 are conductive layers having transparency. For example, indium oxide, ITO, indium zinc oxide, zinc oxide added with gallium, etc. can be used. Also, the conductive layer 270 can be formed of the same material and in the same process as the conductive layer 272.

[0197] The conductive particles 292 are those obtained by coating the surface of particles such as organic resin or silica with a metal material. Using nickel or gold as the metal material is preferable because the contact resistance can be reduced. Also, it is preferable to use particles coated with two or more kinds of metal materials in layers, such as nickel further coated with gold.

[0198] As the connector 215, a paste-like or sheet-like material obtained by mixing metal particles into a thermosetting resin can be used, and a material showing anisotropic conductivity by thermocompression bonding can be used. As the metal particles, it is preferable to use particles in which two or more kinds of metals are layered, such as those obtained by coating nickel particles with gold.

[0199] The coloring layer 259 is a colored layer that transmits light in a specific wavelength band. For example, in the red wavelength band ​​​​​​A red (R) color filter that transmits light of , a green (G) color filter that transmits light in the green wavelength band A blue (B) color filter that transmits light in the blue wavelength band, etc. can be used. Each colored layer is formed at a desired position using various materials by printing, inkjet, Etching methods using photolithography, etc. Here, a light-shielding layer 257 is provided between adjacent colored layers 259. The light-shielding layer 257

[0200] Shields light that wraps around from adjacent light-emitting elements and suppresses color mixing between adjacent pixels. Here, By providing the end portion of the colored layer 259 so as to overlap with the light-shielding layer 257, light leakage can be suppressed. The light-shielding layer 257 can use a material that shields the light emission of the light-emitting element, And can be formed using a metal material, a resin material containing a pigment or a dye, etc. As shown in FIG. 2 0(A), it is preferable to provide the light-shielding layer 257 in a region other than the light extraction portion 182 such as the drive circuit portion 184 because unintentional light leakage due to guided light or the like can be suppressed. 0(A), it is preferable to provide the light-shielding layer 257 in a region other than the light extraction portion 182 such as the drive circuit portion 184 because unintentional light leakage due to guided light or the like can be suppressed. In addition, providing an insulating layer 261 that covers the colored layer 259 and the light-shielding layer 257 is preferable because it can suppress the diffusion of impurities such as pigments contained in the colored layer 259 and the light-shielding layer 257 into the light-emitting element or the like.

[0201] The insulating layer 261 uses a light-transmissive material and can use an inorganic insulating material or an organic insulating material. The insulating layer 261 may use the above-mentioned insulating film with low water permeability.

[0202]

[0202] <Example of manufacturing method> Next, a method for manufacturing a light-emitting panel will be exemplified using FIGS. 24 and 25. Here, a specific example A light-emitting panel having the configuration of 1 (FIG. 20(B)) will be described as an example.

[0203] First, a release layer 303 is formed on a production substrate 301, and an insulating layer 205 is formed on the release layer 303. Next, a plurality of transistors, a conductive layer 254, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, and an insulating layer 211 are formed on the insulating layer 205. Note that the insulating layer 211, the insulating layer 209, and the insulating layer 207 are open so that the conductive layer 254 is exposed (FIG. 24(A)). )

[0204] Also, a release layer 307 is formed on a production substrate 305, and an insulating layer 255 is formed on the release layer 307. Next, a light-shielding layer 257, a coloring layer 259, and an insulating layer 261 are formed on the insulating layer 255 (FIG. 24(B)).

[0205] As the production substrate 301 and the production substrate 305, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, etc. can be used respectively.

[0206] Also, for the glass substrate, for example, glass materials such as aluminosilicate glass, aluminoborosilicate glass, barium borosilicate glass, etc. can be used. When the temperature of the subsequent heat treatment is high, it is preferable to use one with a strain point of 730°C or higher. Note that by including a large amount of barium oxide (BaO), a more practical heat-resistant glass can be obtained. In addition, crystallized glass, etc. can also be used. When using a glass substrate for the production substrate, forming an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, a silicon nitride oxide film, etc. between the production substrate and the release layer can prevent contamination from the glass substrate, which is preferable.

[0207]

[0208] As the release layer 303 and the release layer 307, tungsten, molybdenum, titanium, etc. can be used respectively. N, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium An element selected from palladium, osmium, iridium, silicon, an alloy material containing the element, or a compound material containing the element, and is a single-layer or laminated layer. The crystal structure of the layer containing silicon May be any of amorphous, microcrystalline, and polycrystalline.

[0209] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, etc. Note that the coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

[0210] When the release layer has a single-layer structure, it is preferable to form a layer containing a tungsten layer, a molybdenum layer, or a mixture of tungsten and molybdenum. Also, a layer containing an oxide or oxynitride of tungsten, a layer containing an oxide or oxynitride of molybdenum, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

[0211] Also, when forming a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten as the release layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed on the upper layer thereof, so that a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film. It may be utilized. Also, the surface of the layer containing tungsten may be subjected to heat oxidation treatment, oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, treatment with a solution having a strong oxidizing power such as ozone water, etc. to form a layer containing an oxide of tungsten. Also plasma The treatment or heat treatment may be performed in an atmosphere of oxygen, nitrogen, nitrous oxide alone, or a mixed gas of these gases and other gases. By changing the surface state of the release layer by the plasma treatment or heat treatment, it is possible to control the adhesion between the release layer and the insulating film formed later. Moreover, an insulating layer may be provided between the insulating layer 205 or the insulating layer 255 and the release layer, and peeling may be performed at the interface between the insulating layer and the insulating layer 205 or the insulating layer 255 in a later step. As the insulating layer, it is preferable to form a silicon nitride film, a silicon oxynitride film, a silicon nitride oxide film, etc. in a single layer or multiple layers. Each insulating layer can be formed using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, by forming the film by the plasma CVD method with the film formation temperature set to 250°C or higher and 400°C or lower, a dense and very low water-permeable film can be obtained.

[0212]

[0213]

[0214] Thereafter, a material that will become the sealing layer 213 is applied to the surface of the production substrate 305 where the coloring layer 259 etc. is provided or the surface of the production substrate 301 where the light-emitting element 230 etc. is provided, and the surfaces are bonded together via the sealing layer 213 (Fig. 24(C)).

[0215] Then, the production substrate 301 is peeled off, and the exposed insulating layer 205 and the substrate 201 are bonded together using the adhesive layer 203. Also, the production substrate 305 is peeled off, and the exposed insulating layer 255 and the substrate 181 are bonded together using the adhesive layer 185. In Fig. 25(A), the substrate 181 is configured not to overlap with the conductive layer 254, but the conductive layer 254 and the substrate 181 may overlap.

[0216] ​​​​​​​​​​​​​Note that various methods can be appropriately used in the peeling process. For example, when a layer containing a metal oxide film is formed on the side in contact with the release layer, the metal oxide film can be made fragile by crystallization, and the layer to be peeled can be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the release layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by laser light irradiation or etching, and the layer to be peeled can be peeled from the production substrate. Further, when a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the release layer, the metal oxide film is made fragile by crystallization, and then a part of the release layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the fragile metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the release layer, and laser light can be irradiated on the release layer to release nitrogen, oxygen, or hydrogen contained in the release layer as a gas to promote the peeling between the layer to be peeled and the substrate. Also, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching it with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, a release layer may not be provided. When a layer containing a metal oxide film is formed on the side in contact with the release layer, the metal oxide film can be made fragile by crystallization, and the layer to be peeled can be peeled from the production substrate. Moreover, when an amorphous silicon film containing hydrogen is formed as the release layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by laser light irradiation or etching, and the layer to be peeled can be peeled from the production substrate. Also, when a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the release layer, the metal oxide film is made fragile by crystallization, and then a part of the release layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the fragile metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the release layer, and laser light can be irradiated on the release layer to release nitrogen, oxygen, or hydrogen contained in the release layer as a gas to promote the peeling between the layer to be peeled and the substrate. Also, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching it with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, a release layer may not be provided. Moreover, the peeling process can be performed more easily by combining a plurality of the above peeling methods. That is, laser light irradiation, etching of the release layer with a gas or a solution, mechanical removal with a sharp knife or a scalpel, etc. are performed to make the release layer and the layer to be peeled in a state where they are easy to peel, and then peeling can be performed by a physical force (by a machine, etc.). Note that various methods can be appropriately used in the peeling process. For example, when a layer containing a metal oxide film is formed on the side in contact with the release layer, the metal oxide film can be made fragile by crystallization, and the layer to be peeled can be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the release layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by laser light irradiation or etching, and the layer to be peeled can be peeled from the production substrate. Also, when a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as the release layer, the metal oxide film is made fragile by crystallization, and then a part of the release layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3.

[0217] After that, peeling can be performed on the fragile metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the release layer, and laser light can be irradiated on the release layer to release nitrogen, oxygen, or hydrogen contained in the release layer as a gas to promote the peeling between the layer to be peeled and the substrate. Also, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching it with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, a release layer may not be provided.

[0218] Alternatively, a liquid may be infiltrated into the interface between the release layer and the layer to be released, and the layer to be released may be peeled off from the production substrate. Also, peeling may be performed while applying a liquid such as water during peeling.

[0219] As another peeling method, when the release layer is formed of tungsten, peeling may be performed while etching the release layer with a mixed solution of aqueous ammonia and hydrogen peroxide solution.

[0220] Note that when peeling is possible at the interface between the production substrate and the layer to be released, the release layer may not be provided. For example, glass is used as the production substrate, an organic resin such as polyimide is formed in contact with the glass, and an insulating film, a transistor, or the like is formed on the organic resin. In this case, by heating the organic resin, peeling can be achieved at the interface between the production substrate and the organic resin. Alternatively, a metal layer may be provided between the production substrate and the organic resin, and the metal layer may be heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin. and an insulating film, a transistor, or the like is formed on the organic resin. In this case, by heating the organic resin, peeling can be achieved at the interface between the production substrate and the organic resin. Alternatively, a metal layer may be provided between the production substrate and the organic resin, and the metal layer may be heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin.

[0221] Finally, by opening the insulating layer 255 and the sealing layer 213, the conductive layer 254 is exposed (FIG. 25(B)). Note that when the substrate 181 overlaps with the conductive layer 254, the substrate 181 and the adhesive layer 185 are also opened (FIG. 25(C)). The means for opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Alternatively, a sharp blade or the like may be used to cut into the film on the conductive layer 254, and a part of the film may be peeled off by physical force. Alternatively, a sharp blade or the like may be used to cut into the film on the conductive layer 254, and a part of the film may be peeled off by physical force.

[0222] As described above, a light-emitting panel can be manufactured.

[0223] As described above, the light-emitting panel of the present embodiment includes the substrate 181 and the substrate 201 or the base It is composed of two substrates, namely the board 202. Even if it further includes a touch sensor, it can be composed of two substrates. By minimizing the number of substrates, it becomes easier to improve the light extraction efficiency and the clarity of the display.

[0224] This embodiment can be appropriately combined with other embodiments.

[0225] (Embodiment 4) In this embodiment, a light-emitting panel that can be used in an information processing apparatus will be described with reference to FIG. 26.

[0226] The light-emitting panel shown in FIG. 26 includes a substrate 401, a transistor 240, a light-emitting element 230, an insulating layer 207, an insulating layer 209, an insulating layer 211, an insulating layer 217, a space 405, an insulating layer 261, a light-blocking layer 257, a coloring layer 259, a light-receiving element (having a p-type semiconductor layer 271, an i-type semiconductor layer 273, and an n-type semiconductor layer 275), a conductive layer 281, a conductive layer 283, an insulating layer 291, an insulating layer 293, an insulating layer 295, and a substrate 403.

[0227] The light-emitting panel has an adhesive layer (not shown) arranged in a frame shape so as to surround the light-emitting element 230 and the light-receiving element between the substrate 401 and the substrate 403. The light-emitting element 230 is sealed by the adhesive layer, the substrate 401, and the substrate 403.

[0228] In the light-emitting panel of this embodiment, the substrate 403 has light transmissibility. The light emitted by the light-emitting element 230 is taken out into the atmosphere through the coloring layer 259, the substrate 403, and the like.

[0229] The light-emitting panel of this embodiment is a light-emitting panel capable of touch operation. Specifically, the received Using an optical element, it is possible to detect the proximity or contact of a detection target to the surface of the substrate 403.

[0230] Even if the surface where the detection target contacts has scratches or the like, the detection accuracy of the optical touch sensor is not affected, so it is highly durable and preferable. In addition, the optical touch sensor can perform non-contact sensing, and when applied to a display device, the sharpness of the image does not deteriorate. There are also advantages such as being applicable to large light-emitting panels and display devices.

[0231] When the optical touch sensor is provided between the substrate 403 and the space 405, it is less affected by the light emission of the light-emitting element 230 and the signal-to-noise ratio can be improved, so it is preferable.

[0232] The light-shielding layer 257 is above the light-emitting element 230 and overlaps with the light-receiving element. By the light-shielding layer 257, it is possible to suppress the light emitted from the light-emitting element 230 from irradiating the light-receiving element.

[0233] There is no particular limitation on the materials used for the substrates 401 and 403. For the substrate on the side where the light from the light-emitting element is extracted, a material that transmits the light is used. For example, materials such as glass, quartz, ceramic, sapphire, and organic resin can be used. Since the substrate on the side where light emission is not extracted does not necessarily need to have light transmissivity, in addition to the substrates listed above, a metal substrate or the like using a metal material or an alloy material can also be used. Also, for the substrates 401 and 403, the substrate materials exemplified in the previous embodiments can also be used.

[0234] The sealing method of the light-emitting panel is not limited, and for example, it may be solid sealing or hollow sealing. For example, glass materials such as glass frit, and resins that cure at room temperature such as two-component mixed resins Resin materials such as curable resins, photocurable resins, and thermosetting resins can be used. The space 405 may be filled with an inert gas such as nitrogen or argon, or filled with a resin or the like similar to the sealing layer 21. 3. Further, the resin may contain the aforementioned desiccant, a filler with a high refractive index, or a scattering member.

[0235] This embodiment can be appropriately combined with other embodiments.

Description of Reference Numerals

[0236] 100 Information processing apparatus 102 Display unit 102a Display unit 102b Display unit 104 Driving circuit unit 104g_1 Gate driver 104g_1A Gate driver 104g_1B Gate driver 104g_2 Gate driver 104g_2A Gate driver 104g_2B Gate driver 104g_2C Gate driver 104g_2D Gate driver 104g_3 Gate driver 104g_4 Gate driver 104s_1 Source driver 104s_2 Source driver 104s_3 Source driver 104s_4 Source driver 105 Display panel 106 Detection unit 108 Arithmetic unit 110 Storage unit 120 Region 130 Light-emitting region 131 Light-emitting region 132 Light-emitting region 133 Light-emitting region 150 Information processing device 152 Display panel 153a Support panel 155a Support panel 155b Support panel 180 Element layer 181 Substrate 182 Light extraction part 184 Drive circuit part 185 Adhesive layer 186 FPC 186a FPC 186b FPC 201 Substrate 202 Substrate 203 Adhesive layer 205 Insulating layer 207 Insulating layer 208 Conductive layer 209 Insulating layer 209a Insulating layer 209b Insulating layer 211 Insulating layer 212 Conductive layer 213 Encapsulation layer 215 Connector 215a Connector 215b Connector 217 Insulating layer 230 Light-emitting element 231 Lower electrode 233 EL layer 235 Upper electrode 240 Transistor 253 Conductive layer 254 Conductive layer 255 Insulating layer 257 Light-shielding layer 259 Coloring layer 261 Insulating layer 270 Conductive layer 271 p-type semiconductor layer 272 Conductive layer 273 i-type semiconductor layer 274 Conductive layer 275 n-type semiconductor layer 276 Insulating layer 278 Insulating layer 280 Conductive layer 281 Conductive layer 283 Conductive layer 291 Insulating layer 292 Conductive particles 293 Insulating layer 294 Conductive layer 295 Insulating layer 296 Conductive layer 301 Fabrication substrate 303 Release layer 305 Fabrication substrate 307 Release layer 310a Conductive layer 310b Conductive layer 401 Substrate 403 Substrate 405 Space 901 Transistor 902 Capacitor element 903 Transistor 904 Light-emitting element 905 Wiring 906 Wiring 907 Wiring 907A Wiring 907B Wiring 907C Wiring 907D Wiring 907E Wiring 907F Wiring 908 Wiring 909 Pixel 911 Circuit 912 Source driver circuit 913 Circuit 913A Gate driver 913B Gate driver 914 Gate driver 915 Circuit 916 Circuit 916A Circuit 916B Circuit 917A Switch 917B Switch 917C Switch 917D Switch 917E Switch 917F Switch 918 Wiring 918A Wiring 918B Wiring 919 AND Circuit 920 Wiring 921 Circuit 922 AND Circuit 923 Wiring

Claims

Claim 1 a display unit having flexibility; a detection unit that identifies the state of the outer shape of the display unit, and the detection unit detects a first form in which the display unit is unfolded or a second form in which the display unit is folded, an information processing apparatus that performs brightness adjustment processing of the display unit according to the first form or the second form.

Images