Method for correcting image formation state in spatial frequency domain
By dividing the transmission flat plate into regions for transmittance and phase difference adjustment, the semiconductor manufacturing process achieves faster turnaround times and higher yield through improved imaging state control.
Patent Information
- Application Number
- JP2024000014
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-01-04
- Publication Date
- 2025-07-16
AI Technical Summary
Existing semiconductor manufacturing processes face challenges in efficiently adjusting the transfer and imaging state of mask patterns, leading to prolonged turnaround time (TAT) and reduced yield, especially in vertically and horizontally arranged devices and circuits.
The transmission flat plate near the aperture stop of the imaging lens is divided into regions for adjusting transmittance and phase difference, allowing for fine tuning of the imaging state without replacing the member, using pupil apodization and local doping to address spatial frequency characteristics.
This approach enables faster semiconductor device production with improved yield and stability by enhancing the adjustment capabilities of the imaging state.
Smart Images

Figure 2025106645000001_ABST
Abstract
Description
Technical Field
[0001] Techniques for transferring and lithographing device and circuit patterns in semiconductor device manufacturing.
Prior Art Documents
Patent Documents
[0002] Japanese Patent Application Laid-Open No. 2016-42192 (P2016-42192A) Japanese Patent Application Laid-Open No. 2014-75610 (P2014-75610A) Japanese Patent Application Laid-Open No. 2010-535423 (P2010-535423A) Japanese Patent Application Laid-Open No. 2008-181125 (P2008-181125A)
Summary of the Invention
Problems to be Solved by the Invention
[0003] In the techniques and processes of transferring and lithographing device and circuit patterns in semiconductor device manufacturing, it is an object to improve the ease of manufacturing. Specifically, even after installing an exposure apparatus in a semiconductor device process, a new means for adjusting the transfer and imaging state of a mask pattern is provided, aiming to contribute to shortening the rapid TAT and increasing the Yield of semiconductor devices, and further to continuous stable production.
Means for Solving the Problems
[0004] In lithographic projection exposure for semiconductor device patterning, many of the actual mask patterns of current devices and wirings are arranged "vertically and horizontally". Therefore, when considering the spatial frequency region on the imaging lens (exit) pupil, almost all signals are arranged "along the ξ-axis and η-axis". Even in the prior art, techniques such as performing phase difference correction on a transmission flat plate arranged near the aperture stop and then replacing it to adjust the aberration of the entire imaging lens have been carried out. However, in the present invention, considering the above spatial frequency characteristics, the transmission flat plate is "divided into several parts in the rotation direction", and a. regions that have no effect, b. regions for adjusting the transmittance by dividing into low-frequency and high-frequency parts (a kind of so-called pupil apodization), c. regions for adjusting the phase difference by dividing into low-frequency and high-frequency parts (controlling the refractive index by local doping), and d. regions of combinations thereof are provided, so that it is possible to "perform only rotation" to adjust the imaging state (mainly to relieve the critical points through trade-offs with other mask locations) without replacing the member. Also, by preparing in advance a plurality of combinations of the strength of transmittance adjustment and the strength of phase difference adjustment, and replacing the member, further fine tuning of the imaging state becomes possible.
Advantages of the Invention
[0005] By increasing the means for adjusting the imaging state, it becomes possible to shorten the rapid TAT of semiconductor devices, increase the yield, and further lead to continuous stable production.
Brief Description of the Drawings
[0006]
Figure 1
Figure 2
Figure 3
Figure 4
Industrial Applicability
[0007] When considering this method in the design of a novel imaging lens, it becomes possible to increase the final adjustment means (adjustment knob) for the imaging state even after installing the exposure apparatus at the semiconductor device manufacturing site.
Claims
1. By making use of the spatial frequency characteristics of the current mask pattern, dividing the transmissive parallel flat plate arranged near the aperture stop in the rotational direction, and providing differences and corrections in transmittance and phase difference in the low spatial frequency region and the high spatial frequency region, a method that enables adjustment of the imaging state without replacing the member.
2. The method according to claim 1, wherein by preliminarily providing a plurality of combinations of the strengths of transmittance correction and phase difference correction, it is possible to further fine-tune the imaging state.