Bonding material attachment mounting method

Abstract

To provide a bonding material attachment mounting method that can quickly and accurately mount even small and light conductive balls in all mounting grooves of a mask.SOLUTION: A bonding material attachment mounting method according to the present invention includes the steps of (a) horizontally positioning a mask, (b) positioning a mounting head including a head body, a first main nozzle, and a second main nozzle such that the mounting head is adjacent to the upper surface of the mask, (c) supplying a bonding material deposit into the interior of a central chamber of the mounting head, (d) spraying compressed gas through the first main nozzle and the second main nozzle of the mounting head, respectively, and (e) moving the mounting head horizontally relative to the mask while performing step (d) such that the bonding material deposit in the central chamber of the mounting head is loaded into the attachment groove of the mask.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a method for mounting binding material deposits, and more particularly, to a method for mounting binding material deposits in mounting grooves formed in a mask so that binding material deposits can be mounted on electrodes of a substrate.

Background Art

[0002] When mounting semiconductor devices such as LSI (Large Scale Integration) and LCD (Liquid Crystal Display), conductive balls such as solder balls are often used for electrical connection.

[0003] Fine particulate conductive balls with a diameter of 1 mm or less are mounted on a substrate and used for electrical mounting of the substrate. For this purpose, a mask having mounting grooves is usually mainly used. In a state where the mask is disposed on the substrate, a conductive ball is mounted in the mounting groove formed in the mask, or the conductive ball is mounted in the mounting groove of the mask separately from the substrate and then transferred to the substrate. This method is mainly used.

[0004] In recent years, the size of conductive balls has become smaller to about several tens to several hundreds of micrometers, and as the substrate becomes more integrated, the number of conductive balls to be mounted per unit area has also increased.

[0005] However, the smaller and lighter the conductive balls become, the more difficult it is to attach the conductive balls to the mask by the conventional method.

[0006] Japanese Patent Application Laid-Open No. 2010-177230 discloses a ball supply device as shown in FIG. 1. Such a ball supply device is generally called a "cyclone head". Such a conventional cyclone head has a structure in which a swirling air flow is formed inside a cylindrical chamber with conductive balls accommodated therein by a pin 28a. However, in the case of such a conventional cyclone head, similar to a tornado, when a very fast swirling air flow is formed inside the chamber, it generates the movement of the conductive balls in a direction parallel to the upper surface of the mask. By the way, the mounting groove of the mask is formed in the vertical direction, and since the conductive balls mainly move in the horizontal direction, there is a problem that the mounting efficiency of the conductive balls is not high. In particular, the smaller and lighter the conductive balls are, the more likely it is that a phenomenon occurs in which the conductive balls float upward inside the chamber, similar to a tornado or a spout. That is, the conductive balls do not move in the direction of the mounting groove of the mask located on the lower side, but move upward in the opposite direction. In such a conventional cylindrical cyclone head, it is difficult to effectively perform the process of mounting the conductive balls.

[0007] Also, in the case of a conventional cyclone head formed in a cylindrical shape as shown in FIG. 1, rather than the conductive balls being uniformly distributed inside the head, they concentrate in the central part of the head, so there is a problem that the productivity of the process of mounting the conductive balls on the mask decreases. That is, since the area of the effective region where the conductive balls are concentrated is relatively narrow, when performing the operation of mounting the conductive balls on a mask with a relatively large area, there is a problem that it takes a lot of time to pass through all parts of the mask in the narrow effective area.

[0008] Therefore, there is a need for a method that can effectively mount the bonding material deposits containing such conductive balls in the mounting grooves of the mask. Also, even when the bonding material deposits are small and light, a method is required that can quickly and accurately mount the bonding material deposits in all the mounting grooves of the mask.

Prior Art Documents

Patent Document

[0009]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0010] The present invention has been devised to solve such problems, and its object is to provide a method for mounting a bonding material deposit that can mount all mounting grooves of a mask quickly and accurately even with a small and light conductive ball.

Means for Solving the Problems

[0011] In order to solve the above object, the present invention provides a method for mounting an attachment of bonding material on the attachment groove of a mask in which the attachment groove is formed, the method comprising: (a) horizontally arranging the mask; (b) a first wall member and a second wall member which are arranged to face each other and extend parallel to each other in the horizontal direction, a first connecting member and a second connecting member for connecting both ends of the first wall member and the second wall member respectively, a central chamber formed by being surrounded by the first wall member, the second wall member, the first connecting member and the second connecting member so that the attachment of bonding material waits therein, and a cover member covering the upper side of the central chamber, a mounting head; a first main nozzle formed to extend along the longitudinal direction of the first wall member at the lower part of the first wall member so as to be able to inject compressed gas inside and below the central chamber, and a second main nozzle formed to extend along the longitudinal direction of the second wall member at the lower part of the second wall member so as to be able to inject compressed gas inside and below the second wall member, arranging the mounting head close to the upper surface of the mask; (c) supplying the attachment of bonding material into the central chamber of the mounting head; (d) injecting compressed gas through the first main nozzle and the second main nozzle of the mounting head respectively; (e) while performing the step (d), horizontally transferring the mounting head with respect to the mask so that the attachment of bonding material in the central chamber of the mounting head is mounted on the attachment groove of the mask.

Advantages of the Invention

[0012] The method for mounting an attachment of bonding material of the present invention can increase the area of the region where the attachments of bonding material are concentrated inside the chamber, and effectively mount even small and light attachments of bonding material on the attachment groove of the mask.

[0013] In addition, the method for mounting an attachment of a bonding material according to the present invention can quickly mount the attachment of the bonding material to all of a large number of mounting grooves formed in the mask by increasing the contact opportunity between the attachment of the bonding material and the mounting grooves of the mask.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0015] Hereinafter, with reference to the accompanying drawings, the method for mounting an attachment of a bonding material according to the present invention will be described in detail. First, with reference to the drawings, the structure of the mounting head used in the implementation of the method for mounting an attachment of a bonding material of the present invention will be described.

[0016] The present invention is for mounting bonding material deposits (such as conductive balls) in the mounting groove of a mask. Hereinafter, as an example of such bonding material deposits, the case of mounting a conductive ball on a mask will be taken as an example for explanation. However, the bonding material deposits are not limited to conductive balls and can be various other connecting elements used for connecting the electrodes of a chip and a substrate, such as copper pillars and copper pins.

[0017] FIG. 2 is a perspective view of a mounting head according to an embodiment for implementing the bonding material deposit mounting method of the present invention. FIG. 3 is an exploded perspective view of the mounting head shown in FIG. 2, FIG. 4 is a cross-sectional view taken along line IV-IV of the mounting head shown in FIG. 2, and FIG. 5 is a cross-sectional view taken along line V-V of the mounting head shown in FIG. 2.

[0018] Referring to FIGS. 2 to 5, the mounting head 100 used for implementing the bonding material deposit mounting method according to this embodiment includes a head body 101, a first main nozzle 111, and a second main nozzle 121.

[0019] The head body 101 includes a first wall member 110, a second wall member 120, a first connecting member 130, a second connecting member 140, a central chamber 102, and a cover member 150.

[0020] The first wall member 110, the second wall member 120, the first connecting member 130, and the second connecting member 140 are connected to each other to form an outer periphery surrounding the central chamber 102, and the cover member 150 is formed to cover the upper part of the central chamber 102. The conductive ball B for mounting in the mounting groove H of the mask M is accommodated and waits in the central chamber 102.

[0021] The first wall member 110 and the second wall member 120 are arranged to face each other and are formed to extend parallel to each other in the horizontal direction. The first connecting member 130 and the second connecting member 140 connect both ends of the first wall member 110 and the second wall member 120, respectively.

[0022] The first main nozzle 111 is formed to extend along the longitudinal direction of the first wall member 110 at the lower part of the first wall member 110 so that compressed gas can be injected inside and below the central chamber 102. In the case of this embodiment, the first main nozzle 111 is formed to communicate with the lower surface of the first wall member 110.

[0023] The second main nozzle 121 is formed to extend along the longitudinal direction of the second wall member 120 at the lower part of the second wall member 120 so that compressed gas can be injected inside and below the second wall member 120. In the case of this embodiment, the second main nozzle 121 is formed to communicate with the lower surface of the second wall member 120 so that compressed gas can be injected at the boundary between the lower surface and the inner wall surface of the second wall member 120.

[0024] Referring to FIG. 4, the first main nozzle 111 is formed to incline in a direction approaching the central chamber 102 as it goes downward on the lower side of the first wall member 110. Due to such an inclined structure of the first main nozzle 111, the conductive ball B at a position close to the inner wall of the first wall member 110 is guided to move in a direction away from the first wall member 110 (that is, toward the central chamber 102).

[0025] Similar to the first main nozzle 111, the second main nozzle 121 is also formed to incline in a direction approaching the central chamber 102 as it goes downward on the lower side of the second wall member 120.

[0026] In the case of this embodiment, the first main nozzle 111 and the second main nozzle 121 are formed to incline in opposite directions, and the inclination angles of the first main nozzle 111 and the second main nozzle 121 with respect to the first wall member 110 and the second wall member 120 are formed to be equal to each other.

[0027] A plurality of first guide grooves 1712 and second guide grooves 1722 are respectively formed in the first main nozzle 111 and the second main nozzle 121. Such first guide grooves 1712 and second guide grooves 1722 respectively guide the injection directions of the compressed gas injected from the first main nozzle 111 and the second main nozzle 121. In the case of this embodiment, the first guide grooves 1712 and the second guide grooves 1722 are formed so as to be arranged at regular intervals along the extending directions of the first wall member 110 and the second wall member 120, respectively.

[0028] Also, in the case of this embodiment, the plurality of first guide grooves 1712 and the second guide grooves 1722 are respectively formed by first guide members 171 and second guide members 172 disposed in the first main nozzle 111 and the second main nozzle 121. The first guide member 171 and the second guide member 172 each include a plurality of first guide pins 1711 and a plurality of second guide pins 1721. The first guide groove 1712 is formed between the plurality of first guide pins 1711, and the second guide groove 1722 is formed between the plurality of second guide pins 1721.

[0029] The plurality of first guide pins 1711 are formed to be inclined so as to advance in the extending direction (longitudinal direction) of the first wall member 110 as they go downward of the first wall member 110, and the plurality of second guide pins 1721 are formed to be inclined so as to advance in the extending direction (longitudinal direction) of the second wall member 120 as they go downward of the second wall member 120. The compressed gas injected from the first main nozzle 111 and the second main nozzle 121 by such first guide pins 1711 and second guide pins 1721 is not injected in a direction perpendicular to the longitudinal direction of the first wall member 110 and the second wall member 120, but is injected in an inclined direction.

[0030] In the case of this embodiment, the plurality of first guide grooves 1712 and the plurality of second guide grooves 1722 formed by such first guide pins 1711 and second guide pins 1721 are formed to be inclined in opposite directions as shown in FIG. 3, and the inclination angles thereof are equal to each other.

[0031] On one hand, the first wall member 110 and the second wall member 120 are respectively formed with a first flow path 1111 and a second flow path 1211 that are connected to the first main nozzle 111 and the second main nozzle 121. The pressure of the compressed gas supplied to the first flow path 1111 and the second flow path 1211 is controlled by the control unit 180. In the case of this embodiment, the control unit 180 controls the pressures of the compressed gas supplied to the first flow path 1111 and the second flow path 1211 to be different from each other. That is, the control unit 180 constantly maintains a state in which the pressure of the compressed gas supplied to the first flow path 1111 is greater than the pressure of the compressed gas supplied to the second flow path 1211.

[0032] The first connecting member 130 and the second connecting member 140 that connect the first wall member 110 and the second wall member 120 to each other are also respectively formed with a first connecting main nozzle 131 and a second connecting main nozzle 141. Similar to the aforementioned first main nozzle 111 and second main nozzle 121, the first connecting main nozzle 131 and the second connecting main nozzle 141 are respectively formed to extend along the extending direction of the first connecting member 130 and the second connecting member 140 at the lower parts of the first connecting member 130 and the second connecting member 140 so as to be able to inject compressed gas inside the first connecting member 130 and the second connecting member 140 downward. Further, the first connecting main nozzle 131 and the second connecting main nozzle 141 are formed to be inclined in a direction approaching the central chamber 102 as they go to the lower parts of the first connecting member 130 and the second connecting member 140 respectively.

[0033] The first connecting main nozzle 131 and the second connecting main nozzle 141 may be formed to be connected to the first main nozzle 111 and the second main nozzle 121 respectively, or may be formed not to be connected to the first main nozzle 111 and the second main nozzle 121.

[0034] Referring to FIG. 3, a first connecting guide member 161 and a second connecting guide member 162, which are formed in the same form as the aforementioned first guide member 171 and second guide member 172, are also arranged on the first connecting main nozzle 131 and the second connecting main nozzle 141.

[0035] As shown in FIG. 3, the inner wall surfaces of the first connecting member 130 and the second connecting member 140 that are in contact with the central chamber 102 are each formed as concave curved surfaces.

[0036] The control unit 180 keeps the pressure of the compressed gas supplied to the first connecting main nozzle 131 and the second connecting main nozzle 141 constant.

[0037] An ionizer 105 can be installed on the inner wall surfaces of the configurations such as the central chamber 102, the first wall member 110, and the second wall member 120, or on the flow path of the compressed gas. When performing the conductive ball mounting process using very small and light conductive balls B, there is a possibility that the conductive balls B may adhere to the configurations such as the inner wall surface of the central chamber and the mask M due to static electricity. At this time, when the control unit 180 as described above operates the ionizer 105 to remove static electricity, the quality and productivity of the conductive ball mounting process can be improved.

[0038] Hereinafter, the process of implementing the bonding material deposit mounting method according to the present invention using the mounting head 100 configured as described above will be described.

[0039] First, a mask M having a mounting groove H for mounting the conductive balls B is horizontally arranged ((a) step). At this time, a substrate may be arranged below the mask M, or a conductive ball holder such as a suction plate may be arranged. When a substrate is arranged below the mask M, the conductive balls B directly seat on the substrate through the mounting groove H of the mask M. When a conductive ball holder is arranged below the mask M, after the conductive balls B seated in the mounting groove H are transferred to the conductive ball holder, they are transferred to the substrate again and bonded.

[0040] Next, the mounting head 100 configured as described above is arranged so as to be close to the upper surface of the mask M ((b) step).

[0041] In such a state, a conductive ball B is supplied and stored inside the central chamber of the mounting head 100 ((c) step).

[0042] Next, the control unit 180 uses a mechanical configuration such as an air pressure regulator to supply compressed gas to each of the first main nozzle 111, the second main nozzle 121, the first connecting main nozzle 131, and the second connecting main nozzle 141 at a set pressure constantly ((d) step). The compressed gas may be air or nitrogen gas. Other gases may be supplied through the nozzles in addition to air and nitrogen.

[0043] At this time, as described above, the control unit 180 can also maintain the pressure of the compressed gas supplied to the first flow path 1111 and the pressure of the compressed gas supplied to the second flow path 1211 to be the same as each other, or can maintain the pressures of the first flow path 1111 and the second flow path 1211 to be different from each other. Usually, the control unit 180 maintains the pressures of the first flow path 1111 and the second flow path 1211 to be different from each other. Also, the control unit 180 can maintain the pressures of the first flow path 1111 and the second flow path 1211 to be constant according to the flow of time, or can adjust the pressures of the first flow path 1111 and the second flow path 1211 to change in a certain pattern according to the flow of time like a sine wave or a pulse wave.

[0044] As described above, the first main nozzle 111, the second main nozzle 121, the first connecting main nozzle 131, and the second connecting main nozzle 141 are each formed to be inclined in a direction approaching the central chamber 102 toward the lower side. Therefore, the compressed gas ejected from each nozzle forms a gas flow toward the central chamber 102. That is, when the mounting head 100 according to the present embodiment is arranged in a state of being close to the mask M, a gas flow is formed between the mask M and the lower surface of the mounting head 100, and a gas flow is formed toward the inside of the central chamber 102 between the lower surfaces of the first wall member 110, the second wall member 120, the first connecting member 130, and the second connecting member 140 and the mask M. Due to such a gas flow, the conductive balls B in the central chamber 102 remain inside the central chamber 102 without leaking outside the central chamber 102.

[0045] The first wall member 110 and the second wall member 120 are arranged parallel to each other and are formed to extend in the longitudinal direction. In the first main nozzle 111 and the second main nozzle 121, the compressed gas is ejected at a uniform pressure along the longitudinal direction, so that the conductive balls B are distributed relatively uniformly in the central chamber 102 along the longitudinal direction of the central chamber 102. That is, inside the central chamber 102, the conductive balls B are distributed in the form of a long-extending line.

[0046] In such a state, the mounting head 100 is horizontally transferred in a direction perpendicular to the first wall member 110 and the second wall member 120 ((e) step). Such a process is performed by a separate transfer unit that horizontally transfers the mounting head 100. The conductive balls B are arranged in a long state along the extending direction of the central chamber 102 inside the central chamber 102. When the mounting head 100 is horizontally transferred in such a state, the mounting process of the conductive balls B is performed while covering the upper surface of the mask M with a relatively large area. Thus, since the mounting head 100 has a structure that extends long in a rectangular shape, it can effectively mount the conductive balls B on all the mounting grooves H without leakage quickly with respect to the upper surface of the mask M having a relatively large area. Thus, the bonding material deposit mounting method of the present invention has a dramatically high productivity compared to the method using the conventional cyclone head shown in FIG. 1.

[0047] Also, as described above, when the pressure of the first main nozzle 111 and the pressure of the second main nozzle 121 are set to be different from each other, and the control unit 180 maintains the pressure of either one of the first main nozzle 111 and the second main nozzle 121 to be greater than the other, a gas flow is formed inside the central chamber 102 that further improves the mounting efficiency of the conductive ball B. For example, when the pressure of the first main nozzle 111 is made even greater than the pressure of the second main nozzle 121, an overall gas flow that moves from the first wall member 110 toward the second wall member 120 is formed at the lower inner side of the central chamber 102. In this way, the gas flow that has moved toward the second wall member 120 at the lower part of the central chamber 102 hits the inner wall of the second wall member 120 and rises upward, and then moves along the cover member 150 at the upper part of the central chamber 102 toward the inner wall of the first wall member 110. The gas flow that has moved toward the first wall member 110 while hitting the first wall member 110 at the upper part of the central chamber 102 in this way hits the inner wall of the first wall member 110 and moves in the downward direction. When such a process occurs continuously, a gas flow that rotates at high speed around a virtual rotation axis extending in a direction parallel to the extending directions of the first wall member 110 and the second wall member 120 (that is, the horizontal direction) is formed inside the central chamber 102. As a result, in the vicinity of the first wall member 110, a gas flow (that is, a downward air current) that strongly descends along the inner wall surface of the first wall member 110 is formed, so that the probability that the conductive ball B lands in the mounting groove H of the mask M while descending along such a gas flow increases dramatically. Also, since the conductive ball B that has descended from the vicinity of the first wall member 110 adheres to the surface of the mask M and flows in the direction of the second wall member 120, the probability of landing in the mounting groove H of the mask M also becomes high in such a process.

[0048] In the case of the conventional cyclone head described above with reference to FIG. 1, since a gas flow is formed that rotates about a rotation axis extending vertically along the inner wall surface of the chamber formed in a cylindrical shape, the efficiency of mounting the conductive ball B in the actual mounting groove H of the mask M is lower than that of the present invention. That is, in the case of the conventional cyclone head described with reference to FIG. 1, there is a problem that it is difficult to form a flow of the conductive ball B that moves at an angle close to perpendicular toward the surface of the mask M.

[0049] However, the present invention has the advantage of dramatically improving the productivity of the conductive ball mounting process because the conductive ball B effectively generates a gas flow that moves straight toward the mask M or the mounting groove H. In particular, by configuring the structure of the mounting head 100 itself to be in a shape extending in the longitudinal direction, the present invention can cover a large area of the mask M while there is not much difference in the volume of the mounting head 100 itself compared to the prior art. Thereby, the bonding material deposit mounting method of the present invention can easily shorten the working time of the conductive ball mounting process.

[0050] On the other hand, as described above, when the mounting head 100 is configured such that the compressed gas jetted from the first main nozzle 111 and the second main nozzle 121 is jetted in a direction inclined with respect to the inner wall surfaces of the first wall member 110 and the second wall member 120 by the first guide member 171 and the second guide member 172, respectively, it is also possible to improve the mounting performance of the conductive ball B by other methods.

[0051] In such a case, the gas flow moving from the first wall member 110 towards the second wall member 120 at the lower part of the central chamber 102 is formed in a diagonal direction inclined with respect to the extending direction of the first wall member 110. The gas flow formed by such a path serves to increase the possibility of contact between the conductive ball B and the upper surface of the mask M. When crossing between the first wall surface and the second wall surface in the inclined direction rather than in the vertical direction, the distance that the conductive ball B travels via the upper surface of the mask M increases. Thereby, while the possibility of contact between the conductive ball B and the upper surface of the mask M increases, the mounting probability in the mounting groove H of the conductive ball B increases. Also, even when the pressures of the first main nozzle 111 and the second main nozzle 121 are not uniform for some reason along the longitudinal direction of the first wall member 110 and the second wall member 120, as shown in FIG. 3, due to the diagonal gas flow formed by the first guide groove 1712 and the second guide groove 1722, the distribution of the conductive balls B inside the central chamber 102 can be induced to be relatively uniform along its longitudinal direction. By such a method, it is possible to reduce the possibility that the conductive balls B are not mounted in the mounting groove H in a specific region of the mask M passed by the mounting head 100. Also, in this way, even when a diagonal flow of the conductive balls B is formed inside the central chamber 102 by the first guide groove 1712 and the second guide groove 1722, the gas flow descending along the inner wall surface of the first wall member 110 is still maintained, so that such a gas flow causes the conductive balls B to move forward towards the mounting groove H while improving the mounting efficiency.

[0052] On the other hand, the bonding material deposit mounting method of the present invention can also be implemented by a method of setting the pressures of the first main nozzle 111 and the second main nozzle 121 to be different depending on the direction of horizontally transferring the mounting head 100. For example, when the mounting head 100 is horizontally transferred to the right with reference to FIG. 4, the bonding material deposit mounting method can be performed by making the pressure of the second main nozzle 121 larger than the pressure of the first main nozzle 111. In this case, while the conductive balls B gather on the rear side with respect to the transfer direction of the mounting head 100, the density of the conductive balls B becomes higher on the side closer to the first main nozzle 111. By making the density of the conductive balls B higher in a specific region in this way, the mounting efficiency of the conductive balls B can be improved. Conversely, when the mounting head 100 is horizontally transferred to the left with reference to FIG. 4, the bonding material deposit mounting method is implemented by operating the pressure of the first main nozzle 111 to be larger than the pressure of the second main nozzle 121.

[0053] Also, when the size of the conductive ball B is very small, a step (d) of injecting the pressure of the compressed gas supplied to the first main nozzle 111 and the second main nozzle 121 in a pulse wave shape can be performed. When the size of the conductive ball B is extremely small, the conductive ball B can float and suspend even in a very weak air flow due to its very light weight. In this case, when the compressed gas is supplied to the first main nozzle 111 and the second main nozzle 121 in a pulse wave shape, the conductive ball B also falls downward while contacting the surface of the mask M when the pressure instantaneously drops, and the probability of being mounted in the mounting groove H becomes higher.

[0054] Also, the step (c) of supplying the conductive ball B to the central chamber and the step (b) of arranging the mounting head close to the upper surface of the mask M may be interchanged with each other, and it is also possible to perform the step (c) while performing the step (d) or the step (e).

[0055] As described above, an example of the method for mounting an attachment of a bonding material according to the present invention and the mounting head 100 for carrying out the method has been described. However, the mounting head used in the present invention is not limited to the forms described above and shown in the drawings.

[0056] For example, although it has been described above that the first guide pin 1711 and the second guide pin 1721 are each formed so as to be inclined with respect to the extending direction of the first wall member 110 and the second wall member 120, differently from this, it is also possible to configure the first guide pin and the second guide pin to be formed in a direction perpendicular to the extending direction of the first wall member and the second wall member, respectively. In this case, the directions of the first guide groove and the second guide groove formed by the first guide pin and the second guide pin also become a direction perpendicular to the extending direction of the first wall member and the second wall member.

[0057] Also, although it has been described above that the first guide groove 1712 and the second guide groove 1722 are formed by the first guide member 171 and the second guide member 172, respectively, it is also possible to form the first guide groove and the second guide groove without using the first guide member 171 and the second guide member 172 in this way. That is, it is also possible to provide the first guide groove and the second guide groove by forming irregularities on the inner wall surfaces of the first main nozzle and the second main nozzle, respectively.

[0058] In some cases, it is also possible to carry out the method for mounting an attachment of a bonding material using a mounting head having a structure without the first guide groove 1712 and the second guide groove 1722.

[0059] Also, the structures and shapes of the first guide groove and the second guide groove or the first guide member and the second guide member can be deformed into various other forms in addition to the forms described above.

[0060] Also, as described above, the first main nozzle 111 and the second main nozzle 121 are each formed to be inclined in a direction approaching the central chamber 102 toward the lower side. However, the structures of the first main nozzle and the second main nozzle are not limited in this way. It is also possible to use a mounting head configured to adjust the direction of the compressed gas jetted from the first main nozzle and the second main nozzle by using another separate configuration without using the inclined structures of the first main nozzle and the second main nozzle.

[0061] Also, as described above, the first main nozzle 111 and the second main nozzle 121 are each formed to communicate with the lower surfaces of the first wall member 110 and the second wall member 120. However, in some cases, it is also possible to perform the bonding material attachment method using a mounting head having a structure in which the first main nozzle and the second main nozzle are each formed to communicate with the wall surfaces on the central chamber side of the first wall member and the second wall member. Even with such a configuration, as described above, it is possible to form a flow of the conductive ball B that strongly descends toward the mask M between the first wall member and the second wall member. It is also possible to use a mounting head having a structure in which the first main nozzle and the second main nozzle are each formed to communicate with the boundary between the lower surface and the inner wall surface of the first wall member and the second wall member.

[0062] Also, it is possible to form the inclination angle of the first main nozzle with respect to the first wall member and the inclination angle of the second main nozzle with respect to the second wall member to be different from each other. Even with the method of configuring the inclination angles of the first main nozzle and the second main nozzle to be different in this way, it is possible to induce the downward movement of the conductive ball B due to the rotation of the compressed gas inside the central chamber. In particular, if the inclination angles of the first main nozzle and the second main nozzle are configured to be different from each other in this way, even when the control unit controls the pressures of the compressed gas supplied to the first main nozzle and the second main nozzle to be equal to each other, it is possible to form various forms of air flow inside the central chamber.

[0063] Also, as described above, the first connecting main nozzle 131 and the second connecting main nozzle 141 are also provided with a first connecting guide member 161 and a second connecting guide member 162 formed in the same form as the first guide member 171 and the second guide member 172. However, it is also possible to use a mounting head having a structure that does not include the first connecting guide member 161 and the second connecting guide member 162. Further, it is also possible to use a mounting head including a first connecting guide member and a second connecting guide member having a structure different from that shown in the figure.

[0064] Next, with reference to FIGS. 6 to 9, a mounting head 200 according to another embodiment for implementing the bonding material deposit mounting method according to the present invention will be described.

[0065] FIG. 6 is a perspective view of a mounting head according to another embodiment for implementing the bonding material deposit mounting method of the present invention, FIG. 7 is an exploded perspective view of the mounting head shown in FIG. 6, FIG. 8 is a cross-sectional view of the mounting head shown in FIG. 6 taken along line VIII-VIII, and FIG. 9 is a cross-sectional view of the mounting head shown in FIG. 6 taken along line IX-IX.

[0066] Referring to FIGS. 6 to 9, the mounting head 200 according to another embodiment includes, in the same manner as the mounting head 100 of the embodiment described above with reference to FIGS. 2 to 5, a head body 201 including a first wall member 210, a second wall member 220, a first connecting member 230, a second connecting member 240, a central chamber 202, and a cover member 250, a first main nozzle 211, and a second main nozzle 221. Further, the mounting head 200 of the present embodiment further includes a first connecting member 230 and a second connecting member 240. Hereinafter, for the components having the same names as those of the mounting head 100 described with reference to FIGS. 2 to 5, specific descriptions will be omitted, and only the component numbers will be different for the description.

[0067] The mounting head 200 according to this embodiment includes a first outer nozzle 291 and a second outer nozzle 292 outside the first main nozzle 211 and the second main nozzle 221, respectively.

[0068] The first outer nozzle 291 is formed at the lower part of the first wall member 210 so as to extend along the longitudinal direction of the first wall member 210. The first outer nozzle 291 is disposed outside the first main nozzle 211. The first outer nozzle 291 is formed to communicate with the lower surface of the first wall member 210. With such a structure, the first outer nozzle 291 is formed so as to be able to inject compressed gas in the downward direction of the first wall member 210.

[0069] The second outer nozzle 292 is formed at the lower part of the second wall member 220 so as to extend along the longitudinal direction of the second wall member 220. The second outer nozzle 292 is disposed outside the second main nozzle 221. The second outer nozzle 292 is formed to communicate with the lower surface of the second wall member 220. With such a structure, the second outer nozzle 292 is formed so as to be able to inject compressed gas in the downward direction of the second wall member 220.

[0070] Also, the first outer nozzle 291 is formed to incline in a direction approaching the central chamber 202 as it goes downward on the lower side of the first wall member 210, similar to the first main nozzle 211. The second outer nozzle 292 is also formed to incline in a direction approaching the central chamber 202 as it goes downward on the lower side of the second wall member 220, similar to the second main nozzle 221.

[0071] Such a first outer nozzle 291 and a second outer nozzle 292 each serve to assist the first main nozzle 211 and the second main nozzle 221. A gas flow is formed from the outside to the inside of the central chamber 202 through the gap between the head body 201 and the mask M. The conductive ball B in the central chamber 202 is prevented from escaping to the outside of the central chamber 202 by the compressed gas ejected from such a first outer nozzle 291 and a second outer nozzle 292. Also, in some cases, the compressed gas ejected from the first outer nozzle 291 and the second outer nozzle 292 serves to assist the pressure of the compressed gas ejected from the first main nozzle 211 and the second main nozzle 221 and to induce a flow of the conductive ball B at a sufficient speed inside the central chamber 202.

[0072] Also, in some cases, the first outer nozzle 291 and the second outer nozzle 292 are formed to be inclined as described above, and the first main nozzle and the second main nozzle can also perform a mounting head in a form formed in the vertical direction. In this case, the compressed gas ejected vertically downward from the first main nozzle and the second main nozzle naturally flows into the central chamber 202 by the compressed gas in the inclined direction ejected from the first outer nozzle and the second outer nozzle.

[0073] As described above, the control unit 280 can perform steps (d) and (e) while adjusting the pressure of the first main nozzle 211 and the pressure of the second main nozzle 221 in various ways. At this time, the control unit 280 may maintain the pressures of the first outer nozzle 291 and the second outer nozzle 292 equal to each other, or may maintain the pressure of the first outer nozzle 291 and the pressure of the second outer nozzle 292 different from each other.

[0074] Also, the control unit 280 can also induce the gas flow in the central chamber 202 by making the pressure of the first outer nozzle 291 larger than the pressure of the second outer nozzle 292 and making the pressures of the first main nozzle 211 and the second main nozzle 221 equal to each other.

[0075] Also, in the case of this embodiment, as shown in FIG. 8, the inclination angle of the first outer nozzle 291 with respect to the first wall member 210 and the inclination angle of the second outer nozzle 292 with respect to the second wall member 220 may be configured to be equal to each other, or may be configured to be different from each other to induce a change in the gas flow in the central chamber 202.

[0076] Also, in the case of this embodiment as well, as shown in FIG. 7, the first guide member 271 and the second guide member 272 each include a plurality of first guide pins 2711 and a plurality of second guide pins 2721. The plurality of first guide grooves 2712 and the plurality of second guide grooves 2722 are formed by the first guide member 271 and the second guide member 272 disposed on the first main nozzle 211 and the second main nozzle 221, respectively. In the case of this embodiment, different from the mounting head described with reference to FIGS. 2 to 5, the plurality of first guide pins 2711 and the plurality of second guide pins 2721 extend in a vertical direction without inclining with respect to the extending direction of the first wall member 210 and the second wall member 220 as they go downward. Thus, the extending directions of the plurality of first guide pins 2711 and the plurality of second guide pins 2721 can be variously deformed as needed.

[0077] The mounting head 200 according to this embodiment can also be designed and modified in various forms, similar to the mounting head 100 described with reference to FIGS. 2 to 5.

Explanation of Reference Numerals

[0078] 101, 201 Head body 110, 210 First wall member 120, 220 Second wall member 130, 230 First connecting member 140, 240 Second connecting member 150, 250 Cover member 102, 202 Central chamber 111, 211 First main nozzle 121, 221 Second main nozzle 131 First connecting main nozzle 141 Second Connecting Main Nozzle 171, 271 First Guide Member 172, 272 Second Guide Member 1711, 2711 First Guide Pin 1721, 2721 Second Guide Pin 1712, 2712 First Guide Groove 1722, 2722 Second Guide Groove 180, 280 Control Unit 291 First Outer Nozzle 292 Second Outer Nozzle 105 Ionizer 100, 200 Mounting Head M Mask H Mounting Groove B Conductive Ball

Claims

1. A method for mounting an attachment of bonding material on the attachment groove of a mask having the attachment groove, comprising: (a) horizontally arranging the mask; (b) a first wall member and a second wall member arranged to face each other and extending parallel to each other in the horizontal direction, a first connecting member and a second connecting member connecting both ends of the first wall member and the second wall member respectively, a central chamber formed by being surrounded by the first wall member, the second wall member, the first connecting member, and the second connecting member so that the attachment of bonding material waits, and a head body including a cover member covering the upper side of the central chamber; a first main nozzle formed to extend along the longitudinal direction of the first wall member at the lower part of the first wall member so that compressed gas can be injected below the inside of the central chamber; a second main nozzle formed to extend along the longitudinal direction of the second wall member at the lower part of the second wall member so that compressed gas can be injected below the inside of the second wall member; arranging a mounting head including the above so as to be close to the upper surface of the mask; (c) supplying the attachment of bonding material into the central chamber of the mounting head; (d) injecting compressed gas through the first main nozzle and the second main nozzle of the mounting head respectively; (e) while performing the step (d), horizontally transferring the mounting head with respect to the mask so that the attachment of bonding material in the central chamber of the mounting head is mounted on the attachment groove of the mask. A method for mounting an attachment of bonding material, including the above steps.

2. The method for mounting an attachment of bonding material according to claim 1, performed using the mounting head, wherein the first main nozzle is formed to be inclined in a direction approaching the central chamber as it goes downward on the lower side of the first wall member, and the second main nozzle is formed to be inclined in a direction approaching the central chamber as it goes downward on the lower side of the second wall member.

3. The method for mounting an attachment of bonding material according to claim 2, performed using the mounting head, wherein the first main nozzle is formed to communicate with the lower surface of the first wall member, and the second main nozzle is formed to communicate with the lower surface of the second wall member.

4. The mounting head is used, wherein the first main nozzle is formed to communicate with the wall surface of the first wall member on the central chamber side, and the second main nozzle is formed to communicate with the wall surface of the second wall member on the central chamber side. The method for mounting an attachment with a bonding material according to claim 2.

5. The mounting head is used, wherein the inclination angle of the first main nozzle with respect to the first wall member and the inclination angle of the second main nozzle with respect to the second wall member are formed to be different from each other. The method for mounting an attachment with a bonding material according to any one of claims 2 to 4.

6. The mounting head is used, wherein the first main nozzle includes a plurality of first guide grooves arranged along the extending direction of the first wall member so as to guide the injection direction of the compressed gas, and the second main nozzle includes a plurality of second guide grooves arranged along the extending direction of the second wall member so as to guide the injection direction of the compressed gas. The method for mounting an attachment with a bonding material according to any one of claims 1 to 4.

7. The mounting head is used, wherein the plurality of first guide grooves of the first main nozzle are inclined so as to advance in the extending direction of the first wall member as they go downward, and the plurality of second guide grooves of the second main nozzle are inclined so as to advance in the extending direction of the second wall member as they go downward. The method for mounting an attachment with a bonding material according to claim 6.

8. The mounting head is used, wherein the plurality of first guide grooves of the first main nozzle are formed by a plurality of first guide pins arranged on the first main nozzle, and the plurality of second guide grooves of the second main nozzle are formed by a plurality of second guide pins arranged on the second main nozzle. The method for mounting an attachment with a bonding material according to claim 7.

9. The mounting head is used, wherein the plurality of first guide grooves of the first main nozzle and the plurality of second guide grooves of the second main nozzle are formed to be inclined in opposite directions to each other. The method for mounting an attachment with a bonding material according to claim 7.

10. The step (d) is independently adjusting the pressures of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head and injecting the compressed gas. The method for mounting a bonded material deposit according to any one of claims 1 to 4.

11. The step (d) is injecting the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head so that the pressures thereof are different from each other. The method for mounting a bonded material deposit according to claim 10.

12. The step (e) is to transfer the mounting head in a direction perpendicular to the first wall member and the second wall member. The step (d) is to inject the compressed gas while maintaining the pressure of the nozzle located in front of the transfer direction of the mounting head among the first main nozzle and the second main nozzle to be higher than the pressure of the nozzle located behind the transfer direction of the mounting head. The method for mounting a bonded material deposit according to claim 11.

13. The step (d) is injecting the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head in a pulse wave shape. The method for mounting a bonded material deposit according to claim 10.

14. The method for mounting a bonded material deposit according to claim 10, which is performed using the mounting head, the mounting head comprising a plurality of first guide grooves arranged along the extending direction of the first wall member so that the first main nozzle guides the injection direction of the compressed gas, and a plurality of second guide grooves arranged along the extending direction of the second wall member so that the second main nozzle guides the injection direction of the compressed gas.

15. The method for mounting a bonded material deposit according to claim 14, which is performed using the mounting head, wherein the plurality of first guide grooves of the first main nozzle are formed to be inclined so as to advance in the extending direction of the first wall member as they go downward, and the plurality of second guide grooves of the second main nozzle are formed to be inclined so as to advance in the extending direction of the second wall member as they go downward.

16. The method for mounting a bonded material deposit according to claim 15, which is performed using the mounting head, wherein the plurality of first guide grooves of the first main nozzle are formed by a plurality of first guide pins arranged on the first main nozzle, and the plurality of second guide grooves of the second main nozzle are formed by a plurality of second guide pins arranged on the second main nozzle.

17. The method for mounting a bonding material deposit according to claim 16, which is performed using the mounting head, wherein a plurality of first guide grooves of the first main nozzle and a plurality of second guide grooves of the second main nozzle are formed to be inclined in opposite directions to each other.

18. A first outer nozzle formed to extend along the longitudinal direction of the first wall member at a lower portion of the first wall member outside the first main nozzle so that compressed gas can be injected in a downward direction of the first wall member; A second outer nozzle formed to extend along the longitudinal direction of the second wall member at a lower portion of the second wall member outside the second main nozzle so that compressed gas can be injected in a downward direction of the second wall member, further including the same, and performed using the mounting head. The method for mounting a bonding material deposit according to any one of claims 1 to 4.

19. The first outer nozzle is formed to be inclined in a direction approaching the central chamber as it goes downward of the first wall member. The second outer nozzle is formed to be inclined in a direction approaching the central chamber as it goes downward of the second wall member, and is performed using the mounting head. The method for mounting a bonding material deposit according to claim 18.

20. The first outer nozzle is formed to communicate with the lower surface of the first wall member. The second outer nozzle is formed to communicate with the lower surface of the second wall member, and the method for mounting a bonding material deposit according to claim 19 is performed using the mounting head.

21. The method for mounting a bonding material deposit according to claim 20, which is performed using the mounting head, wherein an inclination angle of the first outer nozzle with respect to the first wall member and an inclination angle of the second outer nozzle with respect to the second wall member are formed to be different from each other.

22. The step (d) is injecting compressed gas by independently adjusting the pressures of the compressed gas supplied to the first main nozzle, the second main nozzle, the first outer nozzle, and the second outer nozzle of the mounting head. The method for mounting a bonding material deposit according to claim 19.

23. The step (d) is injecting the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head at different pressures from each other. The method for mounting a bonding material deposit according to claim 22.

24. In the step (e), the mounting head is transferred in a direction perpendicular to the first wall member and the second wall member, In the step (d), while maintaining the pressure of the nozzle located in front of the transfer direction of the mounting head among the first main nozzle and the second main nozzle to be higher than the pressure of the nozzle located behind the transfer direction of the mounting head, compressed gas is jetted. The method for mounting an attachment with a bonding material according to claim 23.

25. In the step (d), the pressure of the compressed gas supplied to the first main nozzle and the second main nozzle of the mounting head is jetted in a pulse wave shape, The method for mounting an attachment with a bonding material according to claim 22.

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