Semiconductor package and semiconductor apparatus

Abstract

To solve such a problem that there was a risk that misalignment of an optical axis occurs when a fixing member is bonded to a through-hole of a substrate using a bond.SOLUTION: A semiconductor package includes a substrate, a fixing member, and a bond joining the substrate and the fixing member. The substrate includes a base including a first upper surface and a frame located on the first upper surface and including an inner side surface, an outer side surface, and an opening portion extending from the outer side surface to the inner side surface in a first direction. The fixing member includes a first portion located in the opening portion, a second portion continuous with the first portion and located on the outer side surface of the first portion, and a through-hole extending through the first portion and the second portion in the first direction. The bond is located between the first portion and the opening portion. The opening portion at least partially includes a first linear portion in the cross-sectional view intersecting the first direction. The first portion includes a second linear portion facing the first linear portion. The bond has a smallest thickness between the first linear portion and the second linear portion in the cross-sectional view intersecting the first direction.SELECTED DRAWING: Figure 12

Description

Technical Field

[0001] The present disclosure relates to a semiconductor package capable of mounting a semiconductor element, and a semiconductor device having the semiconductor element mounted thereon.

Background Art

[0002] Conventional semiconductor packages and semiconductor devices are described in, for example, Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] A semiconductor package according to an embodiment of the present disclosure includes a base body, a fixing member, and a joining member that joins the base body and the fixing member. The base body has a base portion having a first upper surface, and a frame portion that is located on the first upper surface and has an inner surface, an outer surface, and an opening that penetrates in a first direction from the outer surface to the inner surface. The fixing member has a first portion located in the opening, a second portion that is continuous with the first portion and located on the outer surface side of the first portion, and a through hole that penetrates the first portion and the second portion in the first direction. The joining member is located between the first portion and the opening. In a cross-sectional view intersecting the first direction, the opening has a shape including at least a part of a first straight portion, and the first portion has a shape including a second straight portion that faces the first straight portion, and the thickness of the joining member in a cross-sectional view intersecting the first direction is the thinnest between the first straight portion and the second straight portion.

[0005] A semiconductor device according to an embodiment of the present disclosure includes the semiconductor package having the above-described configuration and a semiconductor element mounted on the first upper surface.

Brief Description of the Drawings

[0006] The objectives, features, and advantages of the present disclosure will become more apparent from the following detailed description and the drawings.

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Mode for Carrying Out the Invention

[0007] In recent years, with the miniaturization of devices, small semiconductor packages capable of mounting semiconductor elements such as ICs, light-emitting diodes, piezoelectric elements, or crystal oscillators have been known. In addition, semiconductor packages capable of mounting optical semiconductor elements such as laser diodes or photodiodes have been proposed.

[0008] The semiconductor package disclosed in Patent Document 1 includes a substrate having a mounting region in which an optical semiconductor element is mounted, and a fixing member. The side surface of the substrate has a through-hole. The fixing member is inserted into the through-hole and fixed by a bonding material. Further, an optical component such as an optical fiber member is welded to the fixing member using a laser or the like.

[0009] In the technology disclosed in Patent Document 1, a part of the fixing member to which the optical fiber is fixed is inserted into a through-hole located on the side surface of the substrate. The inserted portion of this fixing member has a circular shape. Further, the through-hole has a circular shape. The inserted portion of the fixing member is joined to the through-hole via a bonding material.

[0010] In such a semiconductor package, when the fixing member is joined to the through-hole of the substrate by a bonding material, since it is a joining of circles, there is no reference plane, making it difficult to position the fixing member and there is a risk of optical axis deviation.

[0011] <Configuration of Semiconductor Package and Semiconductor Device> Hereinafter, some exemplary embodiments of the present disclosure will be described with reference to the drawings. Note that for the semiconductor package and the semiconductor device, any direction may be regarded as upward or downward, but for convenience, a rectangular coordinate system xyz is defined, and the positive side in the z direction is regarded as upward. Hereinafter, the first direction refers to, for example, the y direction in the drawings. The second direction refers to the direction orthogonal to the first direction in plan view, and for example, refers to the x direction in the drawings. Further, the third direction refers to the direction orthogonal to the first direction and the second direction in plan view, and for example, refers to the z direction in the drawings.

[0012] (First Embodiment) With reference to FIGS. 1 to 10, a semiconductor package 1 according to the first embodiment of the present disclosure and a semiconductor device 10 including the same will be described.

[0013] As shown in FIGS. 1 and 2, the semiconductor device 10 includes a semiconductor element 6, a semiconductor package 1, and a lid body 7. The semiconductor device 10 may further include a seal ring 8.

[0014] The semiconductor element 6 processes an optical signal, such as converting an optical signal into an electrical signal or converting an electrical signal into an optical signal. As shown in FIG. 2, the semiconductor element 6 is housed in the semiconductor package 1.

[0015] Examples of the semiconductor element 6 include optical semiconductor elements such as a semiconductor laser (Laser Diode; LD) or a photodiode (Photodiode; PD), semiconductor integrated circuit elements, and sensor elements such as optical sensors. The semiconductor element 6 can be formed of a semiconductor material such as gallium arsenide or gallium nitride.

[0016] The semiconductor package 1 can protect the semiconductor element 6 from the outside. The semiconductor package 1 includes at least a base 2 for housing the semiconductor element 6, a fixing member 3 joined to the base 2, a joining member 4 for joining the base 2 and the fixing member 3, and input / output terminals 5.

[0017] As shown in FIG. 5, the base 2 has a base portion 21 and a frame portion 22. The base portion 21 of the base 2 has a first upper surface 21a. The frame portion 22 of the base 2 has an opening 22a, an outer surface 22b, an inner surface 22c, and a second upper surface 22d, and is located on the first upper surface 21a.

[0018] The semiconductor element 6 is mounted on the base portion 21 of the base 2. The base portion 21 is, for example, quadrangular in plan view and has a first upper surface 21a on which the semiconductor element 6 is mounted.

[0019] The base 21 can dissipate the heat generated from the semiconductor element 6 within the semiconductor package 1 to the outside of the semiconductor package 1. In this embodiment, although the shape of the base 21 in plan view is a quadrangular shape, as long as it is possible to mount the semiconductor element 6, it is not limited to the quadrangular shape, and may be a polygonal shape other than the quadrangular shape or an elliptical shape, etc. In plan view, the length of one side of the base 21 may be, for example, 5 mm or more and 50 mm or less.

[0020] Examples of the material of the base 21 include metal materials such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or alloys containing these metal materials. In this case, the base 21 may be a single metal plate or a laminate obtained by laminating a plurality of metal plates. Further, when the material of the base 21 is the above metal material, in order to reduce oxidation corrosion, a plating layer such as nickel or gold may be formed on the surface of the base 21 using an electroplating method or an electroless plating method.

[0021] In addition, when the material of the base 21 is the above metal material, it can be processed into a predetermined shape by performing metal processing such as a rolling process, a punching process, or a cutting process on the ingot of the above metal material.

[0022] Further, the main component of the base 21 may be a ceramic material such as an aluminum oxide-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, an aluminum nitride-based sintered body, a silicon nitride-based sintered body, or glass ceramics. When the main component of the base 21 is a ceramic material, on the first upper surface 21a of the base 21, there may be located wirings formed by sintering a metal paste containing a metal such as molybdenum or manganese through which a high-frequency signal is transmitted, or wirings formed using a thin film forming technique such as a vapor deposition method or a sputtering method. Here, the "main component" in the present disclosure only needs to be, at least, the component having the highest content rate, for example, a component having a content rate of 90% or more.

[0023] The first upper surface 21a of the base 21 has a stepped portion (for example, a submount) for mounting the semiconductor element 6, and the semiconductor element 6 may be mounted via the stepped portion.

[0024] When the material of the base 21 is a ceramic material, the stepped portion may be integrally formed. When the stepped portion is integrally formed with the base 21, the base 21 can have a convex portion 21b on the first upper surface 21a as shown in FIG. 7, and the semiconductor element 6 is mounted on the convex portion 21b.

[0025] The frame portion 22 of the base body 2 is located on the first upper surface 21a of the base 21 as shown in FIGS. 2, 3, and 5, and protects the semiconductor element 6 located inside in a plan view. That is, in a plan view, the frame portion 22 is positioned so as to surround the semiconductor element 6. Further, the frame portion 22 may be located along the outer edge of the first upper surface 21a, or may be located inside the outer edge of the first upper surface 21a. Also, it does not have to surround all of the outer edge of the first upper surface 21a of the base 21. That is, there may be a partially open portion.

[0026] The material of the frame portion 22 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. Also, the material of the frame portion 22 may be an insulating material, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or glass ceramics.

[0027] The frame portion 22 can be joined to the base 21 via a brazing material or the like. Note that the material of the brazing material is, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus. Also, when the material of the frame portion 22 is the same as the material of the base 21, the base 21 and the frame portion 22 can be integrally formed. In this case, the process of joining the base 21 and the frame portion 22 using a joining material can be reduced.

[0028] As shown in FIG. 5, the opening 22a of the frame portion 22 is located from the outer surface 22b to the inner surface 22c and penetrates in the first direction. Further, as shown in FIG. 6, in a cross-sectional view intersecting the first direction, the opening 22a has a shape including at least a part of a first straight portion 22aa. Here, "intersecting" means not being parallel. Also, the first direction refers to, for example, the y direction in the drawing.

[0029] Further, the opening 22a may be polygonal in a cross-sectional view intersecting the first direction. Furthermore, as shown in FIG. 6, when the opening 22a is rectangular in a cross-sectional view intersecting the first direction, one of the four sides can be the first straight portion 22aa.

[0030] As shown in FIGS. 8A to 8C, the fixing member 3 has a first portion 31 located in the opening 22a of the frame portion 22, a second portion 32 located on the outer surface 22b side of the frame portion 22 continuously with the first portion 31, and a through hole 33 penetrating the first portion 31 and the second portion 32 in the first direction. Optical components such as lenses and optical fibers are fixed to the fixing member 3, for example.

[0031] Examples of the material of the fixing member 3 include metal materials such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or alloys containing these metal materials. The fixing member 3 can be manufactured into a predetermined shape, for example, by using metal processing methods such as rolling or punching on an ingot obtained by casting a molten metal material into a mold and solidifying it. Here, the predetermined shape is, for example, as shown in FIGS. 16A to 16C, in a side view from the first direction, the second portion 32 has a shape combining a circle and a rectangle, and the first portion 31 has a rectangular shape.

[0032] The first part 31 of the fixing member 3 is joined to the opening 22a of the frame part 22 via a joining member 4. As shown in FIG. 6, the first part 31 has a shape including a second straight part 31a that faces the first straight part 22aa of the opening 22a in a cross-sectional view intersecting the first direction. The joining member 4 (D41) positioned between the first straight part 22aa and the second straight part 31a can be made thinnest. In this case, a part of the joining member 4 positioned between the first straight part 22aa and the second straight part 31a may be the thinnest, or all of the joining member 4 positioned between the first straight part 22aa and the second straight part 31a may be the thinnest. This enables the first straight part 22aa and the second straight part 31a to be used as a reference plane for optical axis alignment.

[0033] Further, as shown in FIG. 6, the first part 31 of the fixing member 3 may have a shape along the opening 22a in a cross-sectional view intersecting the first direction. In this case, compared with the case where the first part 31 of the fixing member 3 does not have a shape along the shape of the opening 22a, the joining area between the first part 31 of the fixing member 3 and the opening 22a increases, so that the joining strength between the fixing member 3 and the base body 2 can be improved. Here, the shape in which the first part 31 follows the opening 22a is not limited to a shape in which the first part 31 and the opening 22a are completely similar. For example, either one may include a manufacturing error, or the opening 22a may be rectangular and the shape of the first part 31 may be rectangular with at least a part of one corner missing. Also, there may be a location where the distance between the sides of the opening 22a facing the first part 31 is not constant. Note that the size of the first part 31 in a side view from the first direction may be, for example, 2 mm × 2 mm to 10 mm × 10 mm.

[0034] As shown in FIG. 4, the fixing member 3 can have the length L312 of the first part 31 in the second direction shorter than the length L322 of the second part 32 in the second direction in a plan view. In this case, since the area where the second part 32 contacts the frame part 22 or contacts via the joining member 4 increases, the joining strength between the fixing member 3 and the frame part 22 can be improved. Note that the length L312 of the first part 31 in the second direction may be, for example, 2 mm or more and 10 mm or less. Also, the length L322 of the second part 32 in the second direction may be, for example, 2 mm or more and 15 mm or less.

[0035] Also, as shown in FIGS. 8A to 8C, the fixing member 3 can have the length L313 of the first part 31 in the third direction shorter than the length L323 of the second part 32 in the third direction. In this case, since the area where the second part 32 contacts the frame part 22 or contacts via the joining member 4 increases, the joining strength between the fixing member 3 and the frame part 22 can be improved. Note that the length L313 of the first part 31 in the third direction may be, for example, 2 mm or more and 10 mm or less. Also, the length L323 of the second part 32 in the third direction may be, for example, 2 mm or more and 15 mm or less.

[0036] Note that the fixing member 3 may have a portion where the first part 31 and the second part 32 are flush in a cross-sectional view intersecting the first direction and / or a cross-sectional view intersecting the second direction. For example, as in the embodiment described later, in a cross-sectional view intersecting the first direction, the first part 31 and the second part 32 may have a portion that is flush, or in both a cross-sectional view intersecting the first direction and a cross-sectional view intersecting the second direction, the first part 31 and the second part 32 may have a portion that is flush.

[0037] The first part 31 of the fixing member 3 may have a recess 31c in the second direction and / or the third direction, for example, as shown in FIGS. 8J to 8L. In this case, the joining member 4 located between the opening 22a and the first part 31 can be stored in the recess 31c. Therefore, it becomes possible to further improve the joining strength between the fixing member 3 and the base body 2.

[0038] As shown in FIG. 4, the thickness D311 of the first portion 31 in the first direction may be thicker than the thickness D221 of the frame portion 22 in the first direction. In this case, compared with the case where the thickness D311 of the first portion 31 in the first direction is thinner than the thickness D221 of the frame portion 22 in the first direction, the joint area between the opening 22a and the first portion 31 increases, so that the joint strength between the fixing member 3 and the frame portion 22 can be improved. In the present embodiment, the thickness D311 of the first portion 31 and the thickness D221 of the frame portion 22 are each constant along the second direction, but these thicknesses may have portions that become thinner. For example, the thickness of the frame portion 22 may be partially increased around the opening 22a to which the first portion 31 is fixed. In addition, when the thickness D311 of the first portion 31 in the first direction and the thickness D221 of the frame portion 22 in the first direction are not constant, the minimum thickness of the first portion 31 in the first direction may be, for example, 10 μm or more and 100 μm or less thicker than the maximum thickness of the frame portion 22 in the first direction.

[0039] The shape of the second portion 32 of the fixing member 3 when viewed from the side in the first direction is not particularly limited. For example, as shown in FIGS. 8A to 8B, it may be circular.

[0040] The through hole 33 of the fixing member 3 may be circular as shown in FIGS. 8A to 8C. Further, in a cross-sectional view intersecting the second direction, as shown in FIGS. 8D to 8L, the through hole 33 may have a concave or convex holding portion 33a. In this case, a lens is held in the through hole 33, and the concave or convex holding portion 33a joins the fixing member 3 and the lens. The lens is made of, for example, a light-transmitting material such as glass, a light-transmitting resin, or sapphire. Further, an optical fiber may be inserted and fixed in the through hole 33 of the fixing member 3, for example. Note that the size of the through hole 33 is set such that, for example, the diameter is 1.5 mm or more and 5 mm or less.

[0041] The joining member 4 is positioned between the opening 22a of the frame portion 22 and the first portion 31 of the fixing member 3, and joins the opening 22a and the first portion 31. Also, as shown in FIG. 6, the thickness of the joining member 4 is the thinnest between the first straight portion 22aa and the second straight portion 31a. That is, the thickness D41 of the joining member 4 positioned between the first straight portion 22aa of the opening 22a and the second straight portion 31a of the first portion 31 is thinner than the thickness of the joining member 4 positioned at a position different from the position between the first straight portion 22aa of the opening 22a and the second straight portion 31a of the first portion 31. Stated more specifically, the joining member 4 has a portion with the thinnest thickness at the position between the first straight portion 22aa of the opening 22a and the second straight portion 31a of the first portion 31. Here, the thickness of the joining member 4 refers to the thickness in a cross-sectional view intersecting the first direction.

[0042] In the present embodiment, as shown in FIG. 6, the thickness D41 of the joining member 4 positioned between the first straight portion 22aa and the second straight portion 31a is constant along the first straight portion 22aa. In such a case, the surface having the first straight portion 22aa and the surface having the second straight portion 31a can be used as reference surfaces. By this, alignment between the fixing member 3 and the opening 22a of the base body 2 can be facilitated, and the occurrence of optical axis misalignment can be reduced. As described above, the thickness D41 of the joining member 4 does not necessarily have to be constant along the first straight portion 22aa. In this case, it is sufficient that a part of the joining member 4 positioned between the first straight portion 22aa and the second straight portion 31a is the thinnest.

[0043] For this joining member 4, solder, brazing material, glass, resin adhesive, or the like can be used. As the brazing material, silver brazing or the like can be used, and it is excellent in heat resistance and joining strength among joining materials.

[0044] Further, as shown in FIG. 9, the joining member 4 may have a first portion 41 located between the first portion 31 of the fixing member 3 and the opening 22a, and a second portion 42 that is continuous with the first portion 41 and is located between the second portion 32 of the fixing member 3 and the outer surface 22b. That is, the opening 22a and the first portion 31 are joined by the first portion 41 of the joining member 4, and the second portion 32 and the outer surface 22b are joined by the second portion 42 that is continuous with the first portion 41 of the joining member 4. As a result, the joining area between the fixing member 3 and the base body 2 further increases, so that the joining strength between the fixing member 3 and the base body 2 can be improved. In this case, for example, the area of the second portion 32 in a side view from the first direction may be made larger than the area of the opening 22a.

[0045] Also, when the thickness D311 of the first portion 31 in the first direction is thicker than the thickness D221 of the frame portion 22 in the first direction, as shown in FIG. 10, the end portion 43 on the inner surface 22c side of the joining member 4 can have a shape including a curved portion. That is, at the joint between the fixing member 3 and the base body 2, a fillet is formed by the joining member 4. Therefore, the joining strength of the fixing member 3 to the base body 2 is improved. Here, the fillet refers to a C-plane shape.

[0046] The input / output terminal 5 has a first wiring layer 51 and a second wiring layer 52, and may have a structure in which a plurality of layers are laminated. Further, the input / output terminal 5 is located on the outer surface 22b of the frame portion 22, away from the opening 22a of the frame portion 22. For example, in a plan view, when the base portion 21 is rectangular, the input / output terminal 5 may be located on a surface of the outer surface 22b of the frame portion 22 that is different from the surface where the opening 22a is located. The first wiring layer 51 and the second wiring layer 52 transmit electrical signals between the semiconductor element 6 and the external circuit board. As shown in FIG. 4, in a plan view, the first wiring layer 51 may be exposed on the upper surface of the input / output terminal 5.

[0047] As materials for each of the multiple layers constituting the input / output terminal 5, insulating materials are used, such as ceramics like aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, silicon nitride sintered body, or glass ceramics.

[0048] Here, a method for manufacturing the input / output terminal 5 will be described. First, green sheets corresponding to the multiple layers constituting the input / output terminal 5 are prepared. Then, using tools such as a laser, punch, or cutter, the multiple layers before firing are obtained so that each green sheet has a predetermined shape. Next, for the multiple uncured layers before firing, for example, wirings formed by sintering a metal paste containing a metal such as molybdenum or manganese through which a high-frequency signal is transmitted, or wirings are formed using thin-film formation techniques such as vapor deposition or sputtering to obtain a first wiring layer 51 and a second wiring layer 52. Thereafter, the multiple layers including the first wiring layer 51 and the second wiring layer 52 are pressure-bonded and simultaneously fired in a laminated state.

[0049] As shown in FIG. 4, in a plan view, the second wiring layer 52 of the input / output terminal 5 can be made larger than the frame portion 22. Here, that the second wiring layer 52 is larger than the frame portion 22 means that in a plan view, the second wiring layer 52 has a portion protruding 0.05 mm or more and 2 mm or less in the second direction, for example, from the frame portion 22. When a high-frequency signal line or the like is wired on the second wiring layer 52, the protruding portion of the second wiring layer 52 can be used as a reference surface during lamination, and the occurrence of lamination misalignment during the manufacture of the input / output terminal 5 can be reduced, and the positional misalignment between the wiring layer and the fixing member 3 can be reduced.

[0050] Note that the input / output terminal 5 may be joined to the frame portion 22 via a brazing material, or may be integrally formed with the frame portion 22.

[0051] Also, a lead terminal may be connected to the first wiring layer 51 of the input / output terminal 5. The lead terminal is a member for electrically connecting to an external electric circuit board or the like. The lead terminal may be connected to the first wiring layer 51 via a brazing material.

[0052] The seal ring 8 has a function of joining the frame portion 22 and the lid body 7. As shown in FIG. 2, the seal ring 8 is disposed on the second upper surface 22d of the frame portion 22 and surrounds the semiconductor element 6 in plan view or planar perspective. Examples of the material of the seal ring 8 include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, or tungsten, or alloys obtained by combining a plurality of these metal materials.

[0053] The lid body 7 is located on the second upper surface 22d of the frame portion 22 and protects the semiconductor element 6 together with the frame portion 22. As shown in FIGS. 1 and 2, this lid body 7 is joined to the frame portion 22 via the seal ring 8 located on the second upper surface 22d of the frame portion 22, and seals the semiconductor package 1. The lid body 7 can be formed of, for example, a metal material. In this case, examples of the material of the lid body 7 include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, or tungsten, or alloys obtained by combining a plurality of these metal materials. Further, when the seal ring 8 is not provided on the second upper surface 22d of the frame portion 22, the lid body 7 may be joined via a bonding material such as solder, brazing material, glass, or resin adhesive.

[0054] <Semiconductor Package and Manufacturing Method of Semiconductor Device 10> Here, a semiconductor package 1 according to the first embodiment and a manufacturing method of the semiconductor device 10 will be described. Note that the present disclosure is not limited to the following embodiments.

[0055] (a) First, a plurality of green sheets are formed. Specifically, for example, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with ceramic powder such as boron nitride, aluminum nitride, silicon nitride, silicon carbide, or beryllium oxide to obtain a mixture, and the mixture is formed into layers to produce a plurality of green sheets. Next, the plurality of green sheets described above are processed by a mold or the like, and as shown in FIG. 4, in a plan view, a plurality of first green sheets formed on the outer shape of the base portion 21 and a plurality of second green sheets formed on the outer shape of the frame portion 22 are prepared. For the portion where the opening 22a of the frame portion 22 is located, in a plan view, a part of the second green sheets are formed by providing a notch in a part of the outer shape of the frame portion 22.

[0056] Also, when the input / output terminal 5 is integrally formed with the frame portion 22, a part of the second green sheets are formed in the outer shape of the combined shape of the frame portion 22 and the input / output terminal 5. In this step, vias or the like may be formed in the plurality of first green sheets and the plurality of second green sheets using a mold or a laser or the like.

[0057] Here, the case where the material of the base portion 21 is the same ceramic material as the material of the frame portion 22 is described. However, when either the base portion 21 or the frame portion 22 is made using a metal material, it is created by molding an ingot obtained by casting a molten metal material into a mold and solidifying it into a predetermined shape using a metal processing method or the like.

[0058] (b) High melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with this powder to prepare a metal paste. Next, the metal paste is printed on each of the plurality of first green sheets and the plurality of second green sheets in a predetermined pattern to form wiring. Note that the metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2.

[0059] (c) Stack the outer edges of the plurality of first green sheets and the outer edges of the plurality of second green sheets to coincide with each other to form a green sheet laminate. Note that after forming the green sheet laminate, a metal paste may be printed in a predetermined pattern to form wiring.

[0060] (d) By firing the green sheet laminate, sinter the plurality of first green sheets and the second green sheets to obtain a substrate 2 in which the base portion 21 and the frame portion 22 are joined. When the input / output terminal 5 is integrally formed with the frame portion 22, obtain a substrate 2 sintered in a state where the input / output terminal 5 is further joined to the frame portion 22. Note that when either the material of the base portion 21 or the material of the frame portion 22 is a metal material, the base portion 21 and the frame portion 22 can be joined using a brazing material or the like to form the substrate 2.

[0061] (e) The semiconductor package 1 can be formed by joining a fixing member 3 formed in a predetermined shape using a metal material to the frame portion 22 via a joining member 4. Thereafter, the semiconductor element 6 is mounted on the first upper surface 21a of the base portion 21, and the lid body 7 is joined to the second upper surface 22d of the frame portion 22 to form the semiconductor device 10. Note that, as shown in FIG. 2, a seal ring 8 is located on the second upper surface 22d of the frame portion 22, and the lid body 7 may be joined via the seal ring 8.

[0062] (Second Embodiment) Next, the semiconductor package 1 according to the second embodiment of the present disclosure will be described with reference to FIGS. 11 to 19.

[0063] In this embodiment, differences from the first embodiment will be described. As shown in FIGS. 16A to 16C, the first part 31 of the fixing member 3 has a third upper surface 31b. Further, as shown in FIG. 15, the opening 22a of the frame part 22 reaches the second upper surface 22d of the frame part 22. Furthermore, as shown in FIGS. 13 and 17, the third upper surface 31b of the first part 31 is flush with the second upper surface 22d of the frame part 22. For this reason, when the lid body 7 or the seal ring 8 is located on the second upper surface 22d of the frame part 22, the lid body 7 or the seal ring 8 is sealed to the third upper surface 31b of the fixing member 3 via a bonding material. By this, the bonding area between the first part 31 and the opening 22a increases, and the bonding strength between the fixing member 3 and the base body 2 can be further improved. Also, in this case, when the base body 2 is made of a ceramic material, it is not necessary to provide a ceramic layer above the opening 22a, so the possibility that the ceramic above the opening 22a sags and the base body 2 deforms can be reduced.

[0064] Here, the fact that the third upper surface 31b and the second upper surface 22d are flush means not only the case where both are completely flush, but also, as shown in FIG. 18, in a cross-sectional view intersecting the first direction, due to manufacturing errors, the third upper surface 31b of the first part 31 is, for example, about 0.1 mm above the second upper surface 22d of the frame part 22. Also, as shown in FIG. 19, in a cross-sectional view intersecting the first direction, due to manufacturing errors, the third upper surface 31b of the first part 31 may be, for example, about 0.1 mm below the second upper surface 22d of the frame part 22. In this case, as shown in FIG. 11, when the seal ring 8 or the lid body 7 is joined, the joining member 4 can accumulate on the third upper surface 31b of the first part 31, and airtightness can be improved.

[0065] Note that here, the fact that the base body 2 is made of a ceramic material may include the case where the base body 2 contains substances unavoidable in manufacturing other than the ceramic material as its material.

[0066] As a method of manufacturing the semiconductor package 1 of the present embodiment, for example, in the above-described manufacturing method, the number of layers of the second green sheet having a notch in a part of the outer shape of the frame portion 22 is changed in a plan view.

[0067] Note that the present disclosure is not limited to the above-described first embodiment, second embodiment, and examples, and various modifications are possible without departing from the gist of the present disclosure.

[0068] For example, the shape of the opening 22a may be a shape combining the first straight portion 22aa and an arc.

[0069] Further, in the second embodiment, the fixing member 3 may have a concave or convex holding portion 33a in a cross-sectional view intersecting the second direction.

[0070] Further, the input / output terminal 5 may have a stepped shape in a side view from the second direction. That is, the input / output terminal 5 may have a two-step stepped shape in a side view from the second direction. In this case, the first wiring layer 51 is located on the upper surface of the upper step, the second wiring layer 52 is located on the upper surface of the lower step, and the second wiring layer 52 may extend in the first direction and / or the second direction from the outer periphery of the frame portion 22 in a plan view. Further, the second wiring layer 52 may be a wiring layer different from the above-described first wiring layer 51 and may be exposed in a plan view.

[0071] The semiconductor package according to the present disclosure can implement the following configurations (1) to (18).

[0072] (1) A base having a first upper surface, and a base body having a frame portion located on the first upper surface and having an inner surface, an outer surface, and an opening penetrating in the first direction from the outer surface to the inner surface. A fixing member having a first portion located in the opening, a second portion located on the outer surface side of the frame portion continuously with the first portion, and a through hole penetrating the first portion and the second portion in the first direction. And a joining member located between the first portion and the opening. In a cross-sectional view intersecting the first direction, the opening has a shape including at least a part of a first straight portion, and the first portion has a shape including a second straight portion positioned to face the first straight portion. The thickness of the joining member in a cross-sectional view intersecting the first direction is the thinnest between the first straight portion and the second straight portion, semiconductor package.

[0073] (2) The semiconductor package according to the above configuration (1), wherein in a cross-sectional view intersecting the first direction, the shape of the opening is a polygon.

[0074] (3) The semiconductor package according to the above configuration (1) or (2), wherein in a cross-sectional view intersecting the first direction, the shape of the first portion has a shape along the opening.

[0075] (4) The frame portion has a second upper surface, The first portion has a third upper surface, The opening reaches the second upper surface of the frame portion, The semiconductor package according to any one of the above configurations (1) to (3), wherein the third upper surface of the first portion is flush with the second upper surface of the frame portion.

[0076] (5) The semiconductor package according to any one of the above configurations (1) to (4), wherein in a plan view, the length of the first portion in a second direction orthogonal to the first direction is shorter than the length of the second portion in the second direction.

[0077] (6) The joining member has a first portion positioned between the first portion and the opening, and a second portion that is continuously positioned and is positioned between the second portion and the outer surface, the semiconductor package according to the above configuration (5).

[0078] (7) In a cross-sectional view intersecting the second direction, the length of the first portion in the third direction orthogonal to the first direction and the second direction is shorter than the length of the second portion in the third direction, the semiconductor package according to the above configuration (5) or (6).

[0079] (8) In a cross-sectional view intersecting the first direction and / or in a cross-sectional view intersecting the second direction, the semiconductor package according to any one of the above configurations (5) to (7), having a portion where the first portion and the second portion are flush.

[0080] (9) The semiconductor package according to any one of the above configurations (5) to (8), wherein the first portion has a recess in the second direction and / or the third direction.

[0081] (10) The semiconductor package according to any one of the above configurations (1) to (9), wherein the thickness of the first portion in the first direction is thicker than the thickness of the frame portion in the first direction.

[0082] (11) In a plan view, the semiconductor package according to the above configuration (10), wherein the end portion on the inner surface side of the joining member has a shape including a curved portion.

[0083] (12) The semiconductor package according to any one of the above configurations (1) to (11), wherein the base body has a convex portion on the first upper surface.

[0084] (13) The base body is located away from the opening on the outer surface and includes an input / output terminal having at least a first wiring layer and a second wiring layer. In a plan view, the semiconductor package according to any one of the above configurations (1) to (12), wherein the second wiring layer has a portion protruding from the frame portion.

[0085] (14) In a cross-sectional view intersecting the first direction, the semiconductor package according to any one of the above configurations (1) to (13), wherein the opening is rectangular and the first portion is rectangular.

[0086] (15) The semiconductor package according to any one of the above configurations (1) to (14), wherein the frame portion and the base portion are made of the same material and integrally formed.

[0087] (16) The semiconductor package according to any one of the above configurations (1) to (15), wherein the substrate is made of ceramic.

[0088] (17) The semiconductor package according to any one of the above configurations (1) to (16), wherein the bonding member is a resin adhesive.

[0089] (18) In a cross-sectional view intersecting a second direction orthogonal to the first direction in a plan view, the through hole has a concave or convex holding portion, and the semiconductor package according to any one of the above configurations (1) to (17).

[0090] The semiconductor device according to the present disclosure can implement the following configuration (19).

[0091] (19) A semiconductor package according to any one of the above configurations (1) to (18), and a semiconductor element mounted on the first upper surface of the semiconductor package. A semiconductor device comprising.

[0092] As described above, in the semiconductor package according to an embodiment of the present disclosure, by making the thickness of the bonding member between the first straight portion and the second straight portion thinner than the thickness of the bonding member located between the other first portion and the opening portion, the surface having the first straight portion and the surface having the second straight portion can be used as a reference surface, so that it is possible to easily align the fixing member and the opening of the substrate. As a result, it is possible to provide a semiconductor package and a semiconductor device capable of reducing the occurrence of optical axis deviation.

[0093] The present disclosure can be implemented in various other forms without departing from its spirit or main features. Therefore, the foregoing embodiments are merely illustrative in all respects, and the scope of the present disclosure is shown by the claims and is not restricted by the text of the specification. Furthermore, all modifications and changes belonging to the scope of the claims are within the scope of the present disclosure.

Explanation of Reference Numerals

[0094] 1 Semiconductor package 2 Substrate 21 Base portion 21a First upper surface 21b Protrusion 22 Frame portion 22a Opening 22aa First straight portion 22b Outer surface 22c Inner surface 22d Second upper surface D221 Thickness of the frame portion in the first direction 3 Fixing member 31 First portion 31a Second straight portion 31b Third upper surface 31c Recess D311 Thickness of the first portion in the first direction L312 Length of the first portion in the second direction L313 Length of the first portion in the third direction 32 Second portion L322 Length of the second portion in the second direction L323 Length of the second portion in the third direction 33 Through hole 33a Holding portion 4 Bonding member 41 First part 42 Second part 43 End portion D41 Thickness of the bonding member located between the first straight portion and the second straight portion 5 Input / output terminal 51 First wiring layer 52 Second wiring layer 6 Semiconductor element 7 Cover 8 Seal ring 10 Semiconductor device

Claims

1. A substrate having a first upper surface, and a frame portion located on the first upper surface and having an inner surface, an outer surface, and an opening penetrating in a first direction from the outer surface to the inner surface. A fixing member having a first portion located in the opening, a second portion located on the outer surface side of the frame portion continuously with the first portion, and a through hole penetrating the first portion and the second portion in the first direction. An optical component fixed to the fixing member. In a cross-sectional view intersecting the first direction, the opening has a shape including a plurality of straight portions, the plurality of straight portions have a first straight portion, and the first portion has a shape including a second straight portion facing the first straight portion. A semiconductor package.

2. In a cross-sectional view intersecting the first direction, the shape of the opening includes four straight portions, and the four straight portions include two pairs of straight portions facing each other. The semiconductor package according to claim 1.

3. In a cross-sectional view intersecting the first direction, the shape of the opening is polygonal. The semiconductor package according to claim 1.

4. In a cross-sectional view intersecting the first direction, the shape of the first portion has a shape along the opening. The semiconductor package according to claim 1.

5. In a plan view, the length of the first portion in a second direction orthogonal to the first direction is shorter than the length of the second portion in the second direction. The semiconductor package according to claim 1.

6. The substrate has a convex portion on the first upper surface. The semiconductor package according to claim 1.

7. The substrate is located away from the opening on the outer surface and includes an input / output terminal having at least a first wiring layer and a second wiring layer. In a plan view, the second wiring layer has a portion protruding from the frame portion. The semiconductor package according to claim 1.

8. In a cross-sectional view intersecting the first direction, the opening is rectangular and the first portion is rectangular. The semiconductor package according to claim 1.

9. The frame portion and the substrate are made of the same material and are integrally formed. The semiconductor package according to claim 1.

10. The fixing member is made of a metal material. The semiconductor package according to claim 1.

11. The frame portion is made of a metal material. The semiconductor package according to claim 1.

12. A semiconductor device comprising the semiconductor package according to any one of claims 1 to 11, and a semiconductor element mounted on the first upper surface of the semiconductor package.

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