Attachment support device

The mounting support device addresses picking errors in component mounters by recording operation results to analyze and mitigate causes, ensuring high productivity in the mounting process.

JP2025108869APending Publication Date: 2025-07-24FUJI CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2024002353
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-11
Publication Date
2025-07-24

AI Technical Summary

Technical Problem

The occurrence of picking errors during the mounting process by a component mounter using a bulk feeder leads to reduced productivity, primarily due to errors in image processing and positioning of the holding members, which are not effectively addressed by existing technologies.

Method used

A mounting support device that records conformity information on the operation results of picking operations, associating them with the combination of holding members and cavities, allowing for statistical analysis to identify and mitigate the causes of picking errors.

Benefits of technology

Enables the suppression of picking errors by identifying the contributing factors through statistical information, thereby maintaining high productivity and efficiency in the mounting process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025108869000001_ABST
    Figure 2025108869000001_ABST
Patent Text Reader

Abstract

To provide an attachment support device for supporting attachment processing by suppressing generation of collection errors when collecting components supplied by a bulk feeder.SOLUTION: The attachment support device has a management unit for recording an operation result showing whether a collection operation to collect components in a predetermined cavity was correctly performed with a predetermined holding member, as matching information, in relation to the combination of the holding member used for the collection operation and the cavity.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to a mounting support device.

Background Art

[0002] The mounting support device supports the mounting process by a component mounter using a bulk feeder. The bulk feeder is equipped in a component mounter that mounts components on a substrate and supplies components in a bulk state (see Patent Document 1). In the mounting process, the component mounter executes a picking operation of moving a mounting head to sequentially pick up components accommodated in a plurality of cavities, and a mounting operation of sequentially mounting the plurality of components on a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the picking operation of the mounting process by the component mounter is repeatedly executed, for example, a picking error may occur where the picking operation is not normally executed, such as not holding a component. As causes of the picking error, an error between the result of image processing for recognizing the supply state of components by the bulk feeder and the actual position of the components, a positioning error of a holding member for picking up and holding the components, etc. are assumed. Since the occurrence of a picking error causes a factor of productivity reduction, it is desired that the component mounter suppresses the occurrence of a picking error.

[0005] This specification aims to provide a mounting support device that supports the mounting process by suppressing the occurrence of a picking error in a picking operation for components supplied by a bulk feeder.

Means for Solving the Problems

[0006] This specification is applied to a component mounting machine that picks up components from a bulk feeder formed with a plurality of cavities capable of accommodating the components using a plurality of holding members capable of holding the components, and mounts the components on a substrate, and records, as conformity information, an operation result indicating whether or not a picking operation of picking up the components accommodated in a predetermined cavity using a predetermined holding member has been normally executed, in association with a combination of the holding member and the cavity applied to the picking operation, and discloses a mounting support device including a management unit.

[0007] In this specification, the technical idea of changing "the mounting support device according to claim 5" to "the mounting support device according to any one of claims 5 to 7" in claim 8 at the time of initial filing, and the technical idea of changing "the mounting support device according to any one of claims 1 to 4" to "the mounting support device according to any one of claims 1 to 9" in claim 10 at the time of initial filing are also disclosed. Further, the technical idea of changing "the mounting support device according to any one of claims 1 to 4" to "the mounting support device according to any one of claims 1 to 10" in claim 11 at the time of initial filing, and the technical idea of changing "the mounting support device according to any one of claims 1 to 4" to "the mounting support device according to any one of claims 1 to 11" in claim 12 at the time of initial filing are also disclosed. Further, the technical idea of changing "the mounting support device according to any one of claims 1 to 4" to "the mounting support device according to any one of claims 1 to 12" in claim 13 at the time of initial filing, and the technical idea of changing "the mounting support device according to any one of claims 1 to 4" to "the mounting support device according to any one of claims 1 to 14" in claim 15 at the time of initial filing are also disclosed.

Advantages of the Invention

[0008] According to the configuration of the invention according to claim 1, it is possible to obtain statistical information indicating whether the combination of the holding member and the cavity affects the operation result of the sampling operation by recording the conformity information. Thereby, for example, when a predetermined sampling error occurs, it becomes possible to determine whether the combination of the holding member and the cavity involved in the sampling operation is a cause of the sampling error based on the conformity information. By thus supporting the investigation of the cause of the sampling error, the occurrence of the sampling error can be suppressed.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Embodiments for Carrying Out the Invention

[0010] 1. Overview of the Mounting Support Device 50 The mounting support device 50 supports the mounting process by the component mounter 10 using the bulk feeder 30. In this embodiment, the mounting support device 50 is incorporated into the control device 20 of the component mounter 10. The mounting support device 50 supports the mounting process by suppressing the occurrence of a sampling error in which the sampling operation for the components supplied by the bulk feeder 30 is not executed normally.

[0011] The above-mentioned component mounter 10 executes the mounting process of mounting components on the substrate 91 as a predetermined substrate-related operation. The component mounter 10 is installed in the conveyance direction of the substrate 91 together with other substrate-related operation machines to form a production line. Each of the plurality of substrate-related operation machines is communicably connected to a host computer 60 (see FIG. 4) that controls the production line as a whole. The production line includes, for example, a printer, a component mounter 10, a reflow oven, and an inspection machine as a plurality of substrate-related operation machines.

[0012] 2. Configuration of the Component Mounter 10 2-1. Substrate Conveyance Device 11 As shown in FIG. 1, the component mounter 10 includes a substrate conveyance device 11. The substrate conveyance device 11 sequentially conveys the substrate 91 in the conveyance direction and positions the substrate 91 at a predetermined position inside the machine.

[0013] 2-2. Component Supply Device 12 The component mounter 10 includes a component supply device 12. The component supply device 12 supplies the components to be mounted on the substrate 91. The component supply device 12 has feeders 122 respectively set in a plurality of slots 121. For the feeder 122, for example, a tape feeder that feeds and moves a carrier tape in which a large number of components are stored and supplies the components so that they can be sampled is applied. Also, for the feeder 122, a bulk feeder 30 that supplies the components stored in a bulk state so that they can be sampled is applied. Details of the bulk feeder 30 will be described later.

[0014] 2-3. Component Transfer Device 13 The component mounting machine 10 includes a component transfer device 13. The component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the substrate 91. The component transfer device 13 includes a head drive device 131, a moving stage 132, a mounting head 133, and a suction nozzle 134. The head drive device 131 moves the moving stage 132 in the horizontal directions (X direction and Y direction) by a linear motion mechanism. The mounting head 133 is detachably fixed to the moving stage 132 by a clamping member (not shown) and is provided so as to be movable horizontally inside the machine.

[0015] The mounting head 133 supports a plurality of suction nozzles 134 so as to be rotatable and vertically movable. The suction nozzle 134 is a holding member capable of picking up and holding the components supplied by the feeder 122. The suction nozzle 134 sucks the components supplied by the feeder 122 by the supplied negative pressure air. As the holding member attached to the mounting head 133, a chuck or the like that holds the component by gripping it may be employed.

[0016] In the present embodiment, the mounting head 133 includes eight holders (not shown) arranged at equal intervals on an annular ring centered on the R axis extending in the vertical direction. It is assumed that the suction nozzles 134 used for the mounting process are attached to each of the eight holders. The eight suction nozzles 134 are provided so as to be rotatable around the R axis and are provided so as to be rotatable around the Q axis extending in the vertical direction passing through the center of each axis.

[0017] 2-4. Component Camera 14, Substrate Camera 15 The component mounting machine 10 includes a component camera 14 and a substrate camera 15. The component camera 14 and the substrate camera 15 are digital imaging devices having imaging elements such as CMOS. The component camera 14 and the substrate camera 15 perform imaging based on a control signal and send out the image data obtained by the imaging. The component camera 14 is configured to be able to image the component held by the suction nozzle 134 from below. The substrate camera 15 is provided on the moving stage 132 so as to be movable horizontally integrally with the mounting head 133. The substrate camera 15 is configured to be able to image the substrate 91 from above.

[0018] In addition to imaging the surface of the substrate 91, the substrate camera 15 can image various devices and the like as long as they are within the movable range of the moving stage 132. For example, in this embodiment, as shown in FIG. 3, the substrate camera 15 can image the supply area As where the bulk feeder 30 supplies components and the reference mark 49 provided on the upper part of the bulk feeder 30 by including them in the camera field of view. In this way, the substrate camera 15 can be used for imaging different imaging targets in order to acquire the image data used for various image processes.

[0019] 2-5. Control Device 20 The component mounting machine 10 includes a control device 20. The control device 20 is mainly composed of a CPU, various memories, and control circuits. The control device 20 includes a storage unit 21 as shown in FIG. 4. The storage unit 21 is composed of a storage device such as a hard disk device or a flash memory. Various data such as a control program M1 used for controlling the mounting process, component data M2, cavity information M3, and conformity information M4 are stored in the storage unit 21 of the control device 20.

[0020] The control program M1 indicates the mounting position, mounting angle, and component type of the components to be mounted on the substrate 91 in the planned mounting order. Here, the mounting process includes a process of repeating a PP cycle (pick-and-place cycle) including a picking cycle and a mounting cycle a plurality of times. The above-mentioned "picking cycle" is a process of repeatedly performing a picking operation of picking up the components supplied by the component supply device 12 with the suction nozzle 134 a plurality of times.

[0021] Here, in the picking cycle, the components to be picked may be supplied by the bulk feeder 30. And when the cavities 45 (see FIG. 3) for individually accommodating the components are formed in the supply area As of the bulk feeder 30, the picking cycle becomes an operation of moving the mounting head 133 and sequentially picking up the components accommodated in the plurality of cavities 45.

[0022] Also, the above-mentioned "mounting cycle" is a process of sequentially mounting the picked components on the substrate 91. Specifically, it is a process of repeatedly performing a mounting operation of mounting at a predetermined mounting angle at a predetermined mounting position on the substrate 91 a plurality of times. Thus, in the control program M1, there may be a case where the execution order of the PP cycle composed of a plurality of picking operations and mounting operations grouped in consideration of the number of suction nozzles 134 supported by the mounting head 133 (8 in this embodiment), the moving distance of the mounting head 133, etc. is set in advance.

[0023] The component data M2 includes shape data for each type of component. The above-mentioned "shape data" includes at least one of the outer edge shape of the component, the shape of the characteristic part of the component, and the dimensions of the component. The "outer edge shape" of the component corresponds to the shape of the outer edge when the inside of the component and the background are distinguished with the outer edge of the component as the boundary.

[0024] The "shape of the characteristic part" of a component corresponds to the boundary shape of the characteristic part on the appearance caused by the shape, pattern, color, etc. of the component. As the characteristic part of the component, the corners, bumps, terminals, lead parts, etc. of the component can be applied. In addition to the shape data, the component data M2 may include, for example, the maximum allowable moving speed (acceleration) for each component, the picking position (for example, the position in contact with the suction nozzle 134), etc.

[0025] The cavity information M3 is information regarding the cavity 45 formed in the supply area As of the bulk feeder 30, associated with the identification information (ID) of the bulk feeder 30. The cavity information M3 may include the shape (including the side lengths and depth) of the cavity 45 in the supply area As, the position, the orientation, the type of the corresponding component, etc. Note that addresses (in this embodiment, Cad001 - Cad115) are pre - assigned to the plurality of cavities 45 so that they can be individually distinguished in the mounting process, etc.

[0026] The conformity information M4 is statistical information including the operation result indicating whether the picking operation has been executed normally, and is used when the mounting support device 50 supports the mounting process by the component mounter 10. The details of the conformity information M4 will be described later.

[0027] The control device 20 executes the recognition process of the holding state of the components held by each of the plurality of holding members (suction nozzles 134). Specifically, the control device 20 performs image processing on the image data acquired by the imaging of the component camera 14, and recognizes the position and angle of each component with respect to the reference position of the mounting head 133. Note that in addition to the component camera 14, the control device 20 may perform image processing on the image data acquired by imaging the component from the side, below, or above, for example, by a head camera unit integrally provided on the mounting head 133.

[0028] In the mounting process, the control device 20 controls the mounting operation by the mounting head 133 so that components are mounted on the substrate 91 in a predetermined posture. At this time, the control device 20 controls the mounting operation based on the recognized holding state of the components. That is, the control device 20 corrects the position and angle deviation of the component held by the suction nozzle 134 with respect to the Q-axis (the rotation axis of the suction nozzle 134) by correcting the position of the mounting head 133 and the angle of the suction nozzle 134 around the Q-axis. As a result, the component held by the suction nozzle 134 is mounted at a predetermined mounting position and a predetermined mounting angle as instructed by the control program M1.

[0029] 3. Configuration of the bulk feeder 30 The bulk feeder 30 is set in the component mounting machine 10 and functions as a part of the component supply device 12. The bulk feeder 30 supplies components stored in a component case in a bulk state (a scattered state where each posture is irregular) without being packaged like a carrier tape. Therefore, unlike the tape feeder, the bulk feeder 30 does not use a carrier tape, which has the advantage of omitting the loading of the carrier tape and the collection of the used tape.

[0030] There is a type of bulk feeder 30 that supplies components in an irregular posture to, for example, a planar supply area As. However, if the components are too close to each other or deposited (in a state of overlapping in the vertical direction) in the supply area As, or if they are in a standing posture where the width direction of the component is in the vertical direction, the component mounting machine 10 cannot target these components for picking. Therefore, in order to increase the proportion of pickable components, there is a type of bulk feeder 30 that supplies components in an aligned state in the supply area As. In this embodiment, a type of bulk feeder 30 that aligns components will be exemplified and described.

[0031] The bulk feeder 30 is provided with an orbit unit 40 that can vibrate and is detachable with respect to a feeder main body 31 formed in a flat box shape. At the front part (the right end part in FIG. 2) of the feeder main body 31, a connector 311 and two positioning pins 312 are provided. When the feeder main body 31 is set in the slot 121 of the component supply device 12, it is powered through the connector 311 and becomes communicable with the control device 20 of the component mounting machine 10.

[0032] The orbit unit 40 is vibrated by a vibration device 35. The orbit unit 40 forms a conveyance path R through which a plurality of components are conveyed, and a supply area As that communicates with the conveyance path R and opens upward so as to be able to collect a plurality of components. The orbit unit 40 is formed so as to extend in the front-rear direction (the left-right direction in FIG. 3) of the feeder main body 31. On both edges in the width direction (the up-down direction in FIG. 3) of the orbit unit 40, a pair of side walls 46 that protrude upward are formed. The pair of side walls 46, together with the tip part 47 of the orbit unit 40, surround the periphery of the conveyance path R and are wall members that prevent the components conveyed in the conveyance path R from leaking.

[0033] As shown in FIG. 3, an alignment member 42 is detachably attached to the supply area As of the orbit unit 40. The alignment member 42 is, for example, one or a plurality of plate-shaped members. The orbit unit 40 is unitized by attaching one alignment member 42 selected from a plurality of types of alignment members 42 corresponding to the shapes of a plurality of types of components to the main body of the common orbit unit 40.

[0034] The alignment member 42 is formed with a plurality of cavities 45. Each of the plurality of cavities 45 opens upward and is configured to accommodate parts in a posture where the thickness direction of the parts is the vertical direction. In the present embodiment, the plurality of cavities 45 are arranged in a staggered pattern. Here, the "supply area As" of the track unit 40 is an area where parts are supplied in a bulk state and is an area where parts can be picked up by the suction nozzle 134 supported by the mounting head 133. Also, the "transport path R" of the track unit 40 is a passage for parts through which parts flowing from the parts case side to the track unit 40 are transported to the supply area As.

[0035] Further, the above-described vibration device 35 applies vibration to the track unit 40 so that a plurality of parts are transported along the transport path R. When the track unit 40 vibrates, a forward and upward external force or a rearward and upward external force is applied to the parts. As a result, the plurality of parts will be transported to the front side or the rear side of the track unit 40. The bulk feeder 30 controls the operation of the vibration device 35 by the feeder control device 36 to transport the parts and executes the supply operation of the parts to the supply area As. By accommodating the parts in the plurality of cavities 45 by the supply operation, the suction nozzle 134 can be in a state where it can pick up the parts.

[0036] On the upper part of the track unit 40, a shutter 48 capable of closing the opening of the supply area As is provided. The shutter 48 is in a state where its opening and closing operation is controlled by a shutter drive device (not shown) when the track unit 40 is attached to the feeder main body 31. The bulk feeder 30 can prevent parts from jumping out and foreign objects from entering the supply area As by opening and closing the shutter 48.

[0037] 4. Mounting Process by the Component Mounter 10 The mounting process by the component mounting machine 10 will be described with reference to FIG. 5. Here, it is assumed that a bulk feeder 30 is set in the component supply device 12. In the mounting process, first, the substrate transfer device 11 of the component mounting machine 10 executes the transfer process of the substrate 91 as shown in FIG. 5 (S11). As a result, the substrate 91 is transferred into the machine and positioned at a predetermined position within the machine.

[0038] Note that, in parallel with the mounting process, the component supply operation by the bulk feeder 30 is executed at a predetermined timing. After the execution of this component supply operation, a process of recognizing the component supply state in the supply area As is executed. Details of the supply state recognition process will be described later.

[0039] Next, the control device 20 executes a PP cycle. In the PP cycle, the control device 20 executes a sampling cycle in which it repeatedly performs a sampling operation of sampling components using a plurality of suction nozzles 134 (S12). At this time, the control device 20 controls the operation of the mounting head 133 in the sampling operation so as to sequentially position the mounting head 133 according to the positions of the components that can be sampled.

[0040] Further, when the bulk feeder 30 is supplying the components to be sampled, the control device 20 appropriately switches the coordinate values of the center of the cavity 45 or the coordinate values of the reference position of the component as the positions of the components that can be sampled, and positions the suction nozzles 134. Note that the movement path of the mounting head 133 in the sampling cycle (S12) is set by the mounting support device 50. Details of the movement path setting process will be described later.

[0041] Subsequently, the control device 20 executes a process of recognizing the holding state of the components held by the plurality of suction nozzles 134 respectively (S13). Specifically, the control device 20 moves the mounting head 133 above the component camera 14 and sends an imaging command to the component camera 14. The control device 20 performs image processing on the image data acquired by the imaging of the component camera 14 to recognize the postures (positions and angles) of the components held by each of the plurality of suction nozzles 134.

[0042] Thereafter, the control device 20 executes a mounting cycle in which a mounting operation of mounting components using a plurality of suction nozzles 134 is repeated (S14). In the mounting operation of this mounting cycle (S14), the control device 20 controls the operation of the mounting head 133 so as to mount the components at the mounting positions specified in the control program. Further, the control device 20 controls the operation of the mounting head 133 so that the suction nozzles 134 are positioned and angled based on the result of the recognition process (S13) with respect to the mounting positions.

[0043] The control device 20 determines whether or not all the PP cycles have been completed based on the control program (S15). If not all the PP cycles have been completed (S15: No), the PP cycles (S12 - S14) are executed. If all the PP cycles have been completed (S15: Yes), the control device 20 executes a carry-out process for the substrate 91 (S16). In the carry-out process for the substrate 91, the substrate transfer device 11 unclamps the positioned substrate 91 and carries out the substrate 91 outside the component mounter 10.

[0044] 5. Configuration of the mounting support device 50 The configuration of the mounting support device 50 will be described with reference to FIGS. 4, 6 - 12. The mounting support device 50 supports the collection cycle that the control device 20 of the component mounter 10 executes in the mounting process. In the collection cycle including components supplied by the bulk feeder 30 as collection targets, image processing for recognizing the supply state of the components by the bulk feeder 30 is first executed, and based on the result of the image processing, the collection operation of the components using the suction nozzles 134 is controlled.

[0045] Here, when the supply process of the components to the supply area As of the bulk feeder 30 is performed, it is not always the case that the components are accommodated in all the cavities 45 in a collectable manner. Therefore, in the above-described recognition process of the supply state, the cavities 45 that accommodate the components in a collectable manner are recognized, and the movement path of the mounting head 133 is set so that the suction nozzles 134 are sequentially positioned with respect to those cavities 45.

[0046] The plurality of cavities 45 in this embodiment are formed by arranging cavity rows composed of a plurality of cavities 45 arranged along a first direction (in this embodiment, the X direction) side by side in a second direction (in this embodiment, the Y direction) intersecting the X direction. Therefore, as the above movement path, it is set such that components are preferentially collected from the cavities 45 belonging to the cavity row close to the substrate 91 among the plurality of cavities 45.

[0047] By the way, when the picking operation of the mounting process by the component mounter 10 is repeatedly executed, for example, a picking error may occur where the picking operation is not executed normally, such as when it is recognized in the holding state recognition process (S13) that the suction nozzle 134 is not holding a component. As causes of the picking error, an error between the result of the image processing for recognizing the supply state of the components by the bulk feeder 30 and the actual position of the components, a positioning error of the suction nozzle 134 for picking and holding the components, etc. are assumed.

[0048] When a picking error occurs, a recovery process for retrying the picking operation and the mounting operation related to the picking error is required, which becomes a factor in productivity reduction. Therefore, it is desired that the component mounter suppresses the occurrence of picking errors. Thus, the mounting support device 50 adopts a configuration that supports the mounting process by suppressing the occurrence of picking errors in the picking operation targeting the components supplied by the bulk feeder 30.

[0049] As shown in FIG. 4, the mounting support device 50 includes a management unit 52. The management unit 52 executes an update process (S20) and an analysis process (S30) in the management process shown in FIG. 6. Further, the management unit 52 may execute an initialization process (S70) of the conformity information M4 shown in FIG. 12. The mounting support device 50 may further include a change unit 53 and a determination unit 54. The change unit 53 executes a change process (S60) in the movement path setting process shown in FIG. 10. The control device 20 controls the operation of the mounting head 133 in the collection cycle according to the movement path set by the setting process in FIG. 10. The determination unit 54 executes a determination process (S40) in the management process shown in FIG. 6.

[0050] 5-1. State recognition unit 51 The mounting support device 50 further includes a state recognition unit 51. The state recognition unit 51 performs image processing on the image data D1 (see FIG. 7A) obtained by imaging the supply area As of the component 92 in the bulk feeder in which a plurality of cavities 45 are formed, and recognizes the supply state of the component 92 in the supply area As. The supply state of the component 92 includes the determination result as to whether or not the component 92 supplied to the supply area As of the bulk feeder 30 is suitable for the collection operation by the component mounter 10.

[0051] More specifically, the state recognition unit 51 performs image processing on the image data D1 obtained by imaging with the board camera 15, and executes a recognition process (for example, blob analysis) of the component 92 in the image data D1. Specifically, the state recognition unit 51 binarizes the image data D1 with a predetermined threshold value to generate blobs, and recognizes the component 92 based on the size and shape of the generated blobs and the component data M2.

[0052] Subsequently, the state recognition unit 51 executes a determination process as to whether or not the recognized component 92 can be collected. In other words, this determination process is a determination as to whether or not the recognized component 92 is suitable for the collection operation by the component mounter 10. That is, even if the component 92 exists in the supply area As, if it is not housed in the cavity 45 or is in contact with other components 92, it is determined that collection is not possible (not suitable for the collection operation).

[0053] The state recognition unit 51 determines the state of each of the plurality of cavities 45. As a result, the plurality of cavities 45 are classified into an accommodation cavity (indicated by hatching in FIG. 7B, "OK") that can accommodate the component 92, an NG cavity (indicated by an X mark connecting diagonal lines in FIG. 7B, "NG") that cannot be collected because another component 92 exists around the cavity that accommodates the component 92, and an empty cavity (indicated by a broken line in FIG. 7B, "EMP") that does not accommodate the component 92 in a collectable manner. The state recognition unit 51 calculates the number (V1, V2, V3) of each state (OK, NG, EMP) of the plurality of cavities 45.

[0054] The state recognition unit 51 associates each state (OK, NG, EMP) with a plurality of cavity addresses (Cad001-Cad115) and records it as a result of the recognition process of the supply state. Further, in the recognition process of the supply state, when there is a component 92 suitable for the picking operation, the state recognition unit 51 recognizes the position and angle of the component 92. Thus, the result of the recognition process of the supply state includes, in addition to the state (OK, NG, EMP) of each cavity 45, the position (for example, the center coordinates of the component 92) and the angle (for example, the inclination angle with respect to the reference angle of the cavity 45) of the cavity 45 of the pickable component 92.

[0055] Note that the above-described recognition process of the supply state is executed after the supply operation of the component 92 by the bulk feeder 30 is executed. The state recognition unit 51 can execute the recognition process of the supply state, for example, in parallel with the substrate loading process (S11) or the PP cycle. The result of the recognition process is discarded when the supply operation of the component 92 by the bulk feeder 30 is executed again.

[0056] 5-2. Management unit 52 5-2-1. Update process of the conformity information M4 After the collection operation is executed based on the result of the supply state recognition process, the management unit 52 executes an update process for the conformity information M4 (S20). More specifically, the management unit 52 acquires the result of the holding state recognition process (S13 in FIG. 5) as the result information of the collection operation (S21). That is, the management unit 52 acquires, as the result of the holding state recognition process, the presence or absence of parts and whether or not, if there are parts, they are held in a posture suitable for the subsequent mounting operation.

[0057] The management unit 52 assumes that no collection error has occurred and the operation result of the collection operation is good ("OK" in FIG. 9) when the parts are held in a posture suitable for the mounting operation. On the other hand, the management unit 52 assumes that a collection error has occurred and the operation result of the collection operation is bad ("NG" in FIG. 9) in other cases (that is, when the parts are not held or are held in a posture not suitable for the mounting operation).

[0058] Also, as shown in FIG. 9, the management unit 52 acquires, as the operation result of the collection operation, information (in this embodiment, nozzle ID and cavity address) specifying the suction nozzle 134 applied to the collection operation and the cavity 45. In this embodiment, the management unit 52 also acquires information (holder ID) specifying the holder of the mounting head 133 to which the suction nozzle 134 applied to the collection operation is attached.

[0059] As shown in FIG. 9, the operation results of the collection operation, including the eight suction nozzles 134 that are repeatedly used, the address of the cavity 45 that housed the parts to be collected, and the results of the collection operation, are recorded for each PP cycle. Note that, in addition to diverting the result of the holding state recognition process (S13 in FIG. 5) as described above, the operation result of the collection operation may be determined by using a camera or sensor other than the component camera 14 to determine whether a collection error has occurred, and the result may be used.

[0060] Next, the management unit 52 updates the conformity information M4 (S22). This conformity information M4 records, in association with the combination of the suction nozzle 134 and the cavity 45 to which the suction operation is applied, an operation result indicating whether or not the suction operation of collecting the component 92 accommodated in the predetermined cavity 45 using the predetermined suction nozzle 134 has been executed normally.

[0061] 5-2-2. Analysis Processing by Management Unit 52 Here, the suction error may occur due to, for example, the accuracy of the image processing or the error of the mechanical operation as described above. Therefore, it is considered that the plurality of suction nozzles 134 and the plurality of cavities 45 are approximately equally likely to be related to the accidentally occurring suction error. However, when the suction operation is executed a large number of times, a tendency for the occurrence probability of the suction error to be biased with respect to the combination of the suction nozzle 134 and the cavity 45 has been statistically found.

[0062] That is, in the suction operation using the same suction nozzle 134, the suction error does not occur with a certain probability, but the occurrence rate of the suction error may be high when the component accommodated in the predetermined cavity 45 is the target of the suction operation. Similarly, as shown by the broken line L2 in FIG. 8, in the suction operation targeting the component accommodated in the same cavity 45, the suction error does not occur with a certain probability, but the occurrence rate of the suction error may be high in the suction operation using the predetermined suction nozzle 134 (the suction nozzle 134 of NID5 in the broken line L2 of FIG. 8).

[0063] The reasons for such events are assumed to be various, such as errors for each stop position due to the mechanical characteristics of the head driving device 131, the amount of deformation of the suction nozzle 134, and the amount of deformation of the holder acting in combination, resulting in a relatively large positioning error when positioning the suction nozzle 134 in any of the plurality of cavities 45. Therefore, when such an event occurs, instead of performing some mechanical maintenance, it is useful for maintaining high productivity to perform control to avoid the occurrence of collection errors. Thus, the management unit 52 executes the analysis process (S30) regarding the combination of the suction nozzle 134 and the cavity 45 as described above, and updates the conformity information M4, which is statistical information.

[0064] In the present embodiment, as shown in FIG. 9, the conformity information M4 includes combinations of nozzle IDs (NID1, NID2, ···) of the suction nozzle 134 and addresses (Cad001, Cad002, ···) of the cavities 45. The number of these combinations corresponds to the product of the number of suction nozzles 134 supported by the mounting head 133 and the number of cavities 45 formed in the supply area As. Note that the conformity information M4 may include holder IDs (HID1, HID2, ···) of the holders to which the suction nozzles 134 are attached.

[0065] Based on the operation results of the collection operations executed multiple times, the management unit 52 calculates, for each combination, a collection success rate (SA001M%, SA002M%, ···) indicating the ratio of the collection operations that were executed normally, and records it in the conformity information M4 (S31). The collection success rate is the ratio of the number of successful collection operations (SA001, SA002, ···) to the number of executions of the collection operations (XA001, XA002, ···) for each combination.

[0066] Further, the management unit 52 calculates the collection success rates (S001C%, S002C%, ···) for each of the plurality of cavities 45 based on the operation results of the collection operations executed multiple times, and records them in the conformity information M4 (S32). The collection success rate for each cavity 45 is the ratio of the sum of the number of successful collection operations (SA001, SB001, ···) to the sum of the number of executions (XA001, XB001, ···) of the collection operations associated with the same cavity address (for example, Cad001).

[0067] Furthermore, the management unit 52 may calculate the collection success rates (SA%, SB%, ···) for each of the plurality of suction nozzles 134 based on the operation results of the collection operations executed multiple times, and record them in the conformity information M4. The collection success rate for each suction nozzle 134 is the ratio of the sum of the number of successful collection operations (SA001, SA002, ···) to the sum of the number of executions (XA001, XA002, ···) of the collection operations associated with the same nozzle ID (for example, NID1).

[0068] Here, the combination of the suction nozzle 134 and the cavity 45 can be a factor that increases the occurrence rate of collection errors, but there are also many cases where it does not contribute to the occurrence rate of collection errors. Therefore, the management unit 52 records the degree of influence on the operation result by the combination of the suction nozzle 134 and the cavity 45 in the conformity information M4 (S33). The above "degree of influence" is, in other words, the degree to which the combination affects the success or failure of the collection operation regardless of whether the collection success rate is high or low.

[0069] In the present embodiment, the management unit 52 calculates the above degree of influence based on the collection success rates (SA001M%, SA002M%, ···) for each combination and the collection success rates (S001C%, S002C%, ···) for each cavity 45. The management unit 52 assumes that the degree of influence is lower as the collection success rates for each combination and for each cavity 45 are closer, and higher as the two are farther apart.

[0070] In calculating the degree of influence, the management unit 52 may further consider the collection success rates (SA%, SB%, ···) for each adsorption nozzle 134. As a result, for example, when the collection success rate of a predetermined combination is relatively low compared to that of other combinations, it is possible to more accurately calculate whether it is due to a defect in the cavity 45 or the adsorption nozzle 134, or due to the combination, as the degree of influence. The management unit 52 may calculate the degree of influence as a specific numerical value, or as a value shown step by step (shown as values in 5 levels from 1 to 5 in FIG. 9) as shown in FIG. 9.

[0071] Subsequently, the management unit 52 calculates the fitness (DA001F, DA002F, ···) of the combination of the adsorption nozzle 134 and the cavity 45 with respect to the collection operation, and records it in the fitness information M4 (S34). The above-mentioned "fitness" is an index indicating whether a predetermined combination can be applied to the collection operation. In the present embodiment, the management unit 52 calculates so that the lower the collection success rate and the higher the degree of influence for each combination calculated previously, the lower the fitness. The management unit 52 may execute the analysis process (S30) each time the PP cycle is executed, or execute the analysis process (S30) when the PP cycle is executed a predetermined number of times, and update the fitness information M4.

[0072] 5-2-3. Initialization Process of Fitness Information M4 Here, as a factor that the combination of the adsorption nozzle 134 and the cavity 45 can affect the collection success rate, it can be mentioned that the mechanical characteristics related to the collection operation act complexly. Therefore, when the mechanical configuration or positional relationship of the equipment related to the collection operation is changed, it is considered that the validity of the fitness information M4 also fluctuates. Therefore, in the present embodiment, in the fitness information M4, information specifying at least one of the holder that supports the adsorption nozzle 134, the slot 121 in which the bulk feeder 30 is set, and the member constituting the cavity 45 in the bulk feeder 30 is associated and recorded with the combination of the adsorption nozzle 134 and the cavity 45.

[0073] Specifically, as shown in FIG. 9, for each combination of the suction nozzle 134 and the cavity 45, the management unit 52 records by associating a holder ID (HID1, HID2, ···) as information for identifying the holder that supports the suction nozzle 134. Similarly, the management unit 52 records by associating a feeder ID (FID001) as information for identifying the bulk feeder 30, a slot ID (LID001) as information for identifying the slot 121 in which the bulk feeder 30 is set, and a unit ID (TID001) as information for identifying the alignment member 42 that constitutes the cavity 45 in the bulk feeder 30.

[0074] The management unit 52 executes an initialization process of the conformity information M4 under a predetermined timing or predetermined conditions, that is, when the mechanical configuration or positional relationship of the devices related to the collection operation is changed. Specifically, as shown in FIG. 12, in the PP cycle repeatedly executed a plurality of times, the management unit 52 determines whether at least a part of the plurality of suction nozzles 134 has been replaced, for example, due to the need for maintenance (S71). When one or more suction nozzles 134 have been replaced (S71: Yes), the management unit 52 returns the conformity information M4 related to the suction nozzle 134 to be replaced to the initial value (S72).

[0075] In addition, the management unit 52 determines whether the positional relationship of the devices has been changed due to component replenishment or change of production conditions (S73). For example, when the slot 121 in which the bulk feeder 30 is set in the component mounting machine 10 is changed, or at least a part of the members that constitute the cavity 45 in the bulk feeder 30 is changed (S73: Yes), the management unit 52 returns the conformity information M4 related to the plurality of cavities 45 of the bulk feeder 30 to the initial value (S74).

[0076] The initial value of the suitability information M4 is, for example, a value where the degree of influence on the collection operation by combination is 0 and the degree of suitability for the collection operation is evaluated as "good". When there is no replacement of the suction nozzle 134 (S71: No), the management unit 52 skips some of the initialization processes (S72), and when the positional relationship of the devices has not been changed (S73: No), it skips the initialization process (S74) of all the suitability information M4 regarding the bulk feeder 30. The timing, conditions, and items to be initialized for the initialization process of the suitability information M4 can be set as appropriate.

[0077] 5-3. Modification Unit 53 Based on the suitability information M4, the modification unit 53 changes the combination of the suction nozzle 134 and the cavity 45 set in the planned PP cycle as necessary. After the component supply operation by the bulk feeder 30 is executed and the recognition process of the supply state is completed, as shown in FIG. 10, the control device 20 executes the movement path setting process. In the movement path setting process, the control device 20 first acquires various information (S51). The various information may include, in addition to the accommodation information indicating the positions of a plurality of cavities 45 that can accommodate components among the plurality of cavities 45, the control program M1, the component data M2, the cavity information M3, and further conditions and parameters used for setting the movement path.

[0078] Then, based on predetermined conditions and parameters, the control device 20 sets the movement path of the mounting head 133 in the collection cycle of the current PP cycle (S52). Specifically, the control device 20 first sets the cavity 45 from which the component is first collected by the mounting head 133 among the plurality of cavities 45 that can accommodate components. The position of this cavity 45 is the starting position of the movement path.

[0079] The control device 20 sets the movement path in consideration of production efficiency so as to connect to the cavity 45 close to the substrate 91 or to shorten the movement distance of the mounting head 133. When the setting process of the movement path of the mounting head 133 is executed as described above, as shown in the left column of FIG. 11, the combination of which component accommodated in which cavity 45 is to be picked up by the plurality of suction nozzles 134 is determined. Below the left column of FIG. 11, the movement path Ni of the mounting head 133 is schematically shown.

[0080] Subsequently, the change unit 53 determines whether the currently set operation mode is the error avoidance priority mode in the picking cycle of the current PP cycle (S53). Here, when the change process (S60) of the combination of the suction nozzle 134 and the cavity 45 is executed, the effect of suppressing the occurrence of picking errors can be expected. On the other hand, if the mounting head 133 moves along a path different from the optimized movement path in S52, the required time of the picking cycle may be extended.

[0081] Taking such circumstances into consideration, the change unit 53 determines whether to execute the change process (S60) of the movement path based on the operation mode set in the component mounter 10 when executing the picking cycle. When the operation mode of the component mounter 10 when executing the picking cycle is the error avoidance priority mode (S53: Yes), the change unit 53 executes the change process (S60) of the combination. On the other hand, when the operation mode is the production priority mode (S53: No), the change unit 53 skips the change process (S60) of the combination.

[0082] Note that the operation mode of the component mounting machine 10 may be set based on at least one of the type of component supplied by the bulk feeder 30, the number of times the picking operation has not been executed normally, and the picking success rate indicating the ratio of the number of times the picking operation has been executed normally. For example, depending on the type of component supplied by the bulk feeder 30, the operation mode may be set to the error avoidance priority mode so that the combination change process (S60) is uniformly executed. Also, the cumulative operation results of the picking operation may be monitored, and the operation mode may be dynamically switched when the number of picking errors reaches a predetermined value or when the picking success rate falls below a predetermined value.

[0083] The change unit 53 determines whether the fitness of the combination of the suction nozzle 134 and the cavity 45 in the picking operation in the picking cycle to be executed is less than the reference value in the combination change process (S60) (S61). When the fitness is less than the reference value in a predetermined picking operation (S61: Yes), the change unit 53 changes the combination of the suction nozzle 134 and the cavity 45 in the picking cycle (S62).

[0084] Specifically, as shown in the left column of FIG. 11, for example, it is assumed that the fitness (DD010F) of the combination (NID4, Cad010) scheduled to be applied to the fourth picking operation out of the eight picking operations included in the picking cycle is less than the reference value (NG). In such a case, the change unit 53 changes the combination by assigning one of the cavities 45 having a fitness equal to or higher than the reference value to the suction nozzle 134 of the combination to be changed based on the fitness information M4.

[0085] The change unit 53 excludes, for example, the component housed in the cavity 45 with the cavity address (Cad010) from the picking target, and sets the component that was the picking target in the subsequent picking operations as the picking target by the suction nozzle 134 to be changed. The change unit 53 repeats the above processes (S61, S62) for all combinations included in the picking cycle until the processes are completed (S63).

[0086] As a result, as shown in the right column of FIG. 11, the combination of the suction nozzle 134 and the cavity 45 applied to the collection operations after the fourth collection operation out of the eight collection operations is changed. At this time, the fitness (DA002F, DB003, ···) is equal to or higher than the reference value in any of the eight collection operations. Below the right column of FIG. 11, the movement path Nr of the mounting head 133 that has changed with the change in the combination of the suction nozzle 134 and the cavity 45 is schematically shown.

[0087] In addition, in the combination change process (S61), although the parts housed in the cavity 45 of the combination with a fitness less than the reference value are excluded from the collection targets, various other change modes can be applied. For example, the changing unit 53 may exchange the target cavity 45 between the collection operations that are continuous with the collection operation of the combination with a fitness less than the reference value. Thereby, it is possible to target the collection operation without skipping the collectible parts.

[0088] However, in the above change mode, there is a concern that the movement path Ni of the mounting head 133 that varies after the combination change becomes relatively long. Therefore, the changing unit 53 may select the combination to be changed based on the number of parts that can be collected based on the recognized supply state of the parts and the moving distance of the changing mounting head 133 (i.e., the time required for the collection cycle).

[0089] Also, the cavity 45 to be changed needs to accommodate the parts so that they can be collected. Therefore, it is assumed that there is no cavity 45 with a fitness equal to or higher than the reference value for the suction nozzle 134 of the combination to be changed. In such a case, the changing unit 53 may change the combination by preferentially allocating the cavity 45 with a high fitness to the suction nozzle 134 among the plurality of cavities 45.

[0090] 5-4. Determination Unit 54 After the sampling operation has been performed to such an extent that the collection success rate for a predetermined combination is statistically significant, the determination unit 54 executes a determination process (S40) to identify the cause of the error related to the collection error. In the present embodiment, the determination unit 54 executes the determination process (S40) after the execution of the update process (S20) and the analysis process (S30) of the conformity information M4 in the management process of the conformity information M4 shown in FIG. 6.

[0091] Specifically, first, when the collection success rate (SA001M%, SA002M%, ···) for each combination of the suction nozzle 134 and the cavity 45 is less than a predetermined value set in advance and the number of executions of the collection operation for that combination is equal to or greater than a sufficient number of samplings (S41: Yes), the determination unit 54 executes a correlation determination between the collection error and the combination (S42). When the collection success rate for each combination is equal to or greater than the predetermined value (S41: No), the determination unit 54 skips the correlation determination on the grounds that it cannot be determined that the collection error has occurred due to the combination.

[0092] Also, when the number of executions of the collection operation has not reached a sufficient number of samplings (S41: No), the determination unit 54 skips the correlation determination on the grounds that there is a high possibility that the result of the correlation determination contains an error. In the correlation determination (S42), the determination unit 54 determines the presence or absence of a correlation between the cause of the error when the collection operation has not been executed normally and the combination based on the degree of conformity (DA001F, DA002F, ···) of the collection operation for each of the plurality of combinations indicated by the conformity information M4. The above-mentioned "correlation between the cause of the error and the combination" indicates the degree to which the combination of the suction nozzle 134 and the cavity 45 is the cause of the occurrence of the collection error.

[0093] Here, the determination unit 54 reuses the fitness for each combination that has already been calculated (S34) in the analysis process (S30) by the management unit 52. When the analysis process (S30) by the management unit 52 is omitted, the determination unit 54 calculates the fitness by a method similar to the method shown in S34. In the correlation determination (S42), when the deviation of the fitness for each combination of a predetermined adsorption nozzle 134 and a plurality of cavities 45 exceeds a preset threshold value, the determination unit 54 determines that there is a correlation with the cause of the error in at least a part of the plurality of combinations.

[0094] The result of the determination process (S40) by the determination unit 54 is recorded in the control device 20 or the host computer 60. More specifically, for example, when the sampling operation is normally repeated, as shown by the broken line L1 in FIG. 8, the occurrence rate of sampling errors is low for any of the eight adsorption nozzles 134. Therefore, the fitness of any of the eight adsorption nozzles 134 is set to a value corresponding to "good" for the sampling operation.

[0095] On the other hand, as shown by the broken line L2 in FIG. 8, in the sampling operation using a predetermined adsorption nozzle 134 (the adsorption nozzle 134 of NID5 in FIG. 8) among the eight adsorption nozzles 134, the occurrence rate of sampling errors is high, and the deviation of the fitness may exceed the threshold value in relation to other combinations. In such a case, the determination unit 54 determines that there is a correlation with the cause of the error in the combination of this adsorption nozzle 134 (NID5) and this cavity 45 (CadN). Naturally, the fitness of the combination (NID5, CadN) is set to a value corresponding to "bad".

[0096] In addition, as shown by the broken line L3 in FIG. 8, when the error rate is relatively high for any of the eight adsorption nozzles 134, the fitness of any combination is set to a value corresponding to "bad". At this time, the deviation of the fitness does not exceed the threshold value even for the combination with the highest occurrence rate of sampling errors, and the determination unit 54 determines that there is no correlation with the cause of the error in any combination of the adsorption nozzle 134 and the cavity 45 (CadN).

[0097] Thus, in the picking operation for picking up components housed in the same cavity 45 (CadN), when the occurrence rate of picking errors becomes high for any of the suction nozzles 134, the following states are assumed. That is, it is assumed that maintenance of the suction nozzle 134, the holder, and the cavity 45 is required, or that adjustment of parameters and imaging conditions in the supply state recognition process is required.

[0098] 6. Effects of the Configuration of the Embodiment According to the configuration of the mounting support device 50 of the embodiment, by recording the compatibility information M4, it is possible to obtain statistical information indicating whether the combination of the suction nozzle 134 and the cavity 45 affects the operation result of the picking operation. Thereby, for example, when a predetermined picking error occurs, it is possible to determine by the compatibility information M4 whether the combination of the suction nozzle 134 and the cavity 45 involved in the picking operation is a cause of the picking error. By thus supporting the investigation of the cause of the picking error, the occurrence of the picking error can be suppressed.

[0099] Thus, for example, in the mounting process that is repeatedly executed, when the occurrence rate of picking errors increases, it is possible to distinguish whether the cause of the error lies in the combination of the suction nozzle 134 and the cavity 45 or elsewhere. Further, when it is determined that the cause of the error is correlated with the combination, for example, the occurrence of the picking error can be suppressed by the combination change process (S60).

[0100] Also, if the cause of the error is other than the combination, for example, based on the picking success rates for each cavity 45 (S001C%, S002C%, ···) and the picking success rates for each suction nozzle 134 (SA%, SB%, ···), it is possible to identify the equipment that requires maintenance or the parameters and imaging conditions that require adjustment. As a result, it is possible to support the mounting process so as to maintain high productivity.

[0101] 7. Modifications of the Embodiment In the embodiment, the mounting support device 50 is configured to be incorporated into the control device 20 of the component mounter 10. On the other hand, part or all of the mounting support device 50 may be incorporated into a host computer 60 and other external devices. For example, the mounting support device 50 may be incorporated into the host computer 60 and may also be a dedicated device installed on the production line Ln.

Description of Reference Numerals

[0102] 10: Component mounter, 11: Substrate transfer device, 12: Component supply device, 121: Slot, 122: Feeder, 13: Component transfer device, 131: Head drive device, 132: Moving table, 133: Mounting head, 134: Suction nozzle, 20: Control device, 30: Bulk feeder, 40: Track unit, 42: Alignment member, 45: Cavity, 50: Mounting support device, 51: State recognition unit, 52: Management unit, 53: Change unit, 54: Judgment unit, 60: Host computer, 91: Substrate, 92: Component, As: Supply area, R: Transfer path, M4: Conformity information

Claims

1. Using a plurality of holding members capable of holding components, the components are collected from a bulk feeder having a plurality of cavities capable of accommodating the components, and applied to a component mounting machine for mounting the components on a substrate. A management unit that records, as conformity information, an operation result indicating whether or not a collection operation for collecting the components accommodated in a predetermined cavity using a predetermined holding member has been normally executed, in association with a combination of the holding member and the cavity to which the collection operation is applied. A mounting support device comprising:

2. The management unit calculates, for each combination, a collection success rate indicating a ratio at which the collection operation has been normally executed based on the operation results of the collection operations executed a plurality of times, and records the same in the conformity information. The mounting support device according to claim 1.

3. The management unit calculates the collection success rate for each of the plurality of cavities based on the operation results of the collection operations executed a plurality of times, and records the same in the conformity information. The mounting support device according to claim 2.

4. The management unit calculates the degree of influence on the operation result by the combination of the holding member and the cavity based on the collection success rate for each combination and the collection success rate for each cavity, and records the degree of influence in the conformity information. The mounting support device according to claim 3.

5. The component mounting machine executes a collection cycle in which the collection operation is repeatedly executed using a plurality of the holding members. When the conformity of the combination of the holding member and the cavity in the collection cycle to be executed with respect to the collection operation is less than a reference value, the mounting support device according to any one of claims 1 to 4 further includes a changing unit that changes the combination of the holding member and the cavity in the collection cycle.

6. The changing unit changes the combination by assigning, based on the conformity information, one of the cavities for which the conformity with respect to the holding member of the combination to be changed is equal to or greater than the reference value. The mounting support device according to claim 5.

7. The changing unit changes the combination by preferentially allocating the cavity having a high degree of fitness to the holding member among the plurality of cavities when there is no cavity having a degree of fitness equal to or higher than the reference value with respect to the holding member of the combination to be changed. The mounting support device according to claim 6.

8. The changing unit executes the change process of the combination when the operation mode of the component mounting machine when executing the collection cycle is the error avoidance priority mode, and skips the change process of the combination when the operation mode is the production priority mode. The mounting support device according to claim 5.

9. The operation mode is set based on at least one of the type of the component supplied by the bulk feeder, the number of times the collection operation was not executed normally, and the collection success rate indicating the ratio of the collection operation being executed normally. The mounting support device according to claim 8.

10. When at least some of the holding members are replaced in the mounting head that supports the plurality of holding members, the management unit returns the fitness information regarding the holding member to be replaced to the initial value. The mounting support device according to any one of claims 1-4.

11. When the slot in which the bulk feeder is set in the component mounting machine is changed, or when at least a part of the members constituting the cavity in the bulk feeder is changed, the management unit returns the fitness information regarding the plurality of cavities of the bulk feeder to the initial value. The mounting support device according to any one of claims 1-4.

12. After the component mounting machine executes a collection cycle in which the collection operation is repeatedly executed using a plurality of the holding members, the component mounting machine executes a recognition process for recognizing the holding state of the components by the plurality of the holding members. The management unit acquires the operation result of the collection operation based on the result of the recognition process and updates the fitness information. The mounting support device according to any one of claims 1-4.

13. The mounting support device according to any one of claims 1-4 further includes a determination unit that determines the presence or absence of a correlation between the error cause and the combination when the collection operation is not executed normally based on the degree of fitness for the collection operation for each of the plurality of combinations indicated by the fitness information.

14. The determination unit according to claim 13 determines that there is a correlation with the error cause in at least a part of the plurality of combinations when the deviation of the degree of fitness for each combination of the predetermined holding member and the plurality of cavities exceeds a preset threshold value. The wearing support device described.

15. The fitting information is recorded with information for specifying at least one of a holder that supports the holding member, a slot in which the bulk feeder is set, and a member that constitutes the cavity in the bulk feeder, in association with the combination of the holding member and the cavity. The wearing support device according to any one of claims 1 to 4.

Citation Information

Patent Citations

  • Electronic component supplying apparatus

    JP2011114084A