Liquid crystal device, optical modulator, and projector

Abstract

To provide a liquid crystal device, an optical modulator, and a projector that are excellent in heat dissipation properties.SOLUTION: A liquid crystal device comprises: a liquid crystal panel that includes a pair of substrates holding a liquid crystal layer; a panel holding member that holds the liquid crystal panel; and a first joining layer that joins the liquid crystal panel to the panel holding member. The first joining layer includes an adhesive, and a plurality of first fillers added to the adhesive and having a fibrous shape or a shape having a longitudinal axis. The thermal conductivity of the first filler is higher than the thermal conductivity of the adhesive.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a liquid crystal device, a light modulation device, and a projector.

Background Art

[0002] Conventionally, a liquid crystal projector using a liquid crystal device as a light modulation device has been known. Patent Document 1 below discloses a liquid crystal device in which an adhesive of a silicone-based resin having a high thermal conductivity is filled between a liquid crystal panel and a panel holding frame in order to efficiently dissipate heat generated by the liquid crystal panel.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the above liquid crystal device, since the gap between the panel holding frame and the liquid crystal panel is relatively large, even if an adhesive of a silicone-based resin is used, the thermal resistance due to the thickness of the adhesive increases. For this reason, it has been difficult to efficiently transfer the heat of the liquid crystal panel to the panel holding frame.

Means for Solving the Problems

[0005] In order to solve the above problems, according to one aspect of the present invention, there is provided a liquid crystal device including a liquid crystal panel including a pair of substrates holding a liquid crystal layer, a panel holding member holding the liquid crystal panel, and a first bonding layer bonding the liquid crystal panel to the panel holding member, wherein the first bonding layer includes an adhesive and a first filler in a fibrous shape or a shape having a longitudinal axis added to the adhesive, and the thermal conductivity of the first filler is higher than the thermal conductivity of the adhesive.

[0006] According to another aspect of the present invention, there is provided a projector including a light source device, a liquid crystal device of the above aspect that modulates light emitted from the light source device, and a projection optical device that projects the light modulated by the liquid crystal device.

[0007] According to another aspect of the present invention, there is provided a light modulation device including a light modulation element that modulates incident light as image light, a holding member that holds the light modulation element, and a bonding layer that bonds the light modulation element to the holding member, wherein the bonding layer includes an adhesive and a filler in a fibrous shape or a shape having a longitudinal axis added to the adhesive, and a thermal conductivity of the filler is higher than a thermal conductivity of the adhesive.

[0008] According to another aspect of the present invention, there is provided a projector including a light source device, a light modulation device of the above aspect that modulates light emitted from the light source device, and a projection optical device that projects the light modulated by the light modulation device.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

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Figure 8

Figure 9

Best Mode for Carrying Out the Invention

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Note that the drawings used in the following description may show the characteristic parts enlarged for easy understanding of the characteristics, and the dimensional ratios of the respective components are not necessarily the same as the actual ones.

[0011] (First Embodiment) FIG. 1 is a schematic configuration diagram of the projector of the present embodiment. As shown in FIG. 1, the projector 1 of the present embodiment is a projection type image display device that displays an image on the screen SCR. The projector 1 includes a light source device 2, a color separation optical system 3, an image forming device 4, and a projection optical device 5.

[0012] The light source device 2 emits white illumination light WL toward the color separation optical system 3. As a configuration of the light source device 2, for example, a configuration having a solid light source that emits blue light as excitation light and a wavelength conversion element that converts at least a part of the blue light emitted from the solid light source into fluorescence including green light and red light can be exemplified. Note that as other configurations of the light source device 2, a configuration having a light source lamp such as an ultra-high pressure mercury lamp, or a configuration having light emitting elements that individually emit blue light, green light, and red light can be exemplified.

[0013] The color separation optical system 3 separates the illumination light WL emitted from the light source device 2 into red light LR, green light LG, and blue light LB. The color separation optical system 3 includes a first dichroic mirror 17a, a second dichroic mirror 17b, a first total reflection mirror 18a, a second total reflection mirror 18b, a third total reflection mirror 18c, a first relay lens 19a, and a second relay lens 19b.

[0014] The first dichroic mirror 17a separates the illumination light WL from the light source device 2 into red light LR and light including green light LG and blue light LB. The first dichroic mirror 17a transmits the red light LR and reflects the light including the green light LG and the blue light LB. On the other hand, the second dichroic mirror 17b reflects the green light LG and transmits the blue light LB. Thereby, the second dichroic mirror 17b separates the light including the green light LG and the blue light LB into the green light LG and the blue light LB.

[0015] The first total reflection mirror 18a is disposed in the optical path of the red light LR and reflects the red light LR transmitted through the first dichroic mirror 17a toward the optical modulation device 40R. On the other hand, the second total reflection mirror 18b and the third total reflection mirror 18c are disposed in the optical path of the blue light LB and guide the blue light LB transmitted through the second dichroic mirror 17b to the optical modulation device 40B. The green light LG is reflected from the second dichroic mirror 17b toward the optical modulation device 40G.

[0016] The first relay lens 19a and the second relay lens 19b are disposed on the light emission side of the second total reflection mirror 18b in the optical path of the blue light LB. The first relay lens 19a and the second relay lens 19b compensate for the light loss of the blue light LB caused by the optical path length of the blue light LB being longer than the optical path lengths of the red light LR and the green light LG.

[0017] The image forming apparatus 4 modulates the incident red, green, and blue color lights LR, LG, LB, and synthesizes the modulated color lights LR, LG, LB to form image light. The image forming apparatus 4 includes three optical modulation devices 40R, 40G, 40B, three incident side polarizing plates 41R, 41G, 41B, three emission side polarizing plates 42R, 42G, 42B, one synthesis optical system 43, and three field lenses 44R, 44G, 44B, which are provided according to the incident color light.

[0018] The light modulation device 40R modulates the red light LR according to the image information to form image light corresponding to the red light LR. The light modulation device 40G modulates the green light LG according to the image information to form image light corresponding to the green light LG. The light modulation device 40B modulates the blue light LB according to the image information to form image light corresponding to the blue light LB.

[0019] Specifically, the light modulation devices 40R, 40G, and 40B modulate the color light incident from the incident-side polarizing plates 41R, 41G, and 41B according to the image signal input from a control device (not shown), and emit the modulated image light of each color through the emission-side polarizing plates 42R, 42G, and 42B.

[0020] In the case of this embodiment, each of the light modulation devices 40R, 40G, and 40B is constituted by a transmissive liquid crystal device 6. The configuration of the liquid crystal device 6 will be described later.

[0021] The field lens 44R collimates the red light LR incident on the light modulation device 40R, the field lens 44G collimates the green light LG incident on the light modulation device 40G, and the field lens 44B collimates the blue light LB incident on the light modulation device 40B.

[0022] The color image light emitted from the light modulation devices 40R, 40G, and 40B is incident on the combining optical system 43. The combining optical system 43 combines the image light corresponding to each of the red light LR, the green light LG, and the blue light LB, and emits the combined image light toward the projection optical device 5. For example, a cross dichroic prism is used in the combining optical system 43.

[0023] The projection optical device 5 has a plurality of projection lenses. The projection optical device 5 enlarges and projects the image light combined by the combining optical system 43 toward the screen SCR. As a result, an enlarged video is displayed on the screen SCR.

[0024] The configuration of the liquid crystal device 6 will be described below. In the following description, three mutually orthogonal directions are defined as the +X direction, the +Y direction, and the +Z direction. In this embodiment, the +Z direction is the traveling direction of light incident on the liquid crystal device 6. When the liquid crystal device 6 is viewed along the +Z direction such that the +Y direction coincides with the upward direction, the left direction is defined as the +X direction. Although not shown in the figures, the opposite direction of the +X direction is the -X direction, the opposite direction of the +Y direction is the -Y direction, and the opposite direction of the +Z direction is the -Z direction. That is, the +Z direction with respect to the liquid crystal device 6 is the light emission side with respect to the liquid crystal device 6, and the -Z direction with respect to the liquid crystal device 6 is the light incident side with respect to the liquid crystal device 6. Also, the axis along the +X direction or the -X direction is defined as the X axis, the axis along the +Y direction or the -Y direction is defined as the Y axis, and the axis along the +Z direction or the -Z direction is defined as the Z axis.

[0025] Figure 2 is an exploded perspective view showing the liquid crystal device 6 as viewed from the light incident side. Figure 3 is a view showing a cross section along the YZ plane of the liquid crystal device 6. As shown in FIGS. 2 and 3, the liquid crystal device 6 includes a liquid crystal panel 61, a panel holding member 62, an FPC (Flexible printed circuits) 63, a first bonding layer 70 for bonding the liquid crystal panel 61 to the panel holding member 62, an incident side dustproof substrate 64 and an emission side dustproof substrate 65 for sandwiching the liquid crystal panel 61 in the direction along the Z axis, and a back side plate 60.

[0026] The liquid crystal panel 61 includes a liquid crystal layer 610, and a pair of substrates, a counter substrate 611 and a pixel substrate 612, that sandwich the liquid crystal layer 610 in the Z axis. The liquid crystal panel 61 has a pixel region including a plurality of pixels.

[0027] The liquid crystal layer 610 is formed by liquid crystal molecules encapsulated between the counter substrate 611 and the pixel substrate 612. The counter substrate 611 is disposed on the light incident side with respect to the liquid crystal layer 610 and is made of, for example, quartz glass. A counter electrode is provided on the surface of the counter substrate 611 that faces the liquid crystal layer 610. The pixel substrate 612 is disposed on the light-emitting side with respect to the liquid crystal layer 610 and is made of, for example, quartz glass. A plurality of pixel electrodes are provided on the surface of the pixel substrate 612 facing the liquid crystal layer 610. The counter substrate 611 and the pixel substrate 612 are connected to the FPC 63, and change the alignment state of the liquid crystal molecules forming the liquid crystal layer 610 according to the image signal supplied from the FPC 63. Thereby, the liquid crystal panel 61 modulates the incident light. That is, the liquid crystal device 6 modulates the light incident in the +Z direction by the liquid crystal layer 610 of the liquid crystal panel 61 and emits the modulated light in the +Z direction.

[0028] The incident-side dust-proof substrate 64 is a translucent substrate provided on the light-incident surface of the counter substrate 611. The incident-side dust-proof substrate 64 is provided on the light-incident surface of the counter substrate 611 so as to be heat-transferable. The incident-side dust-proof substrate 64 suppresses dust or the like from adhering to the light-incident surface of the counter substrate 611 and the shadow of dust or the like from entering the image light.

[0029] The emission-side dust-proof substrate 65 is a translucent substrate provided on the light-emitting surface of the pixel substrate 612. The emission-side dust-proof substrate 65 is provided on the light-emitting surface of the pixel substrate 612 so as to be heat-transferable. The emission-side dust-proof substrate 65 suppresses dust or the like from directly adhering to the light-emitting surface of the pixel substrate 612 and the shadow of dust or the like from entering the image light.

[0030] As shown in FIG. 3, the FPC 63 extends from the counter substrate 611 and the pixel substrate 612 in the +Y direction and is connected to a control device that controls the operation of the projector 1. The FPC 63 has a driving chip 63a including a driver circuit or the like for driving the liquid crystal panel 61, and supplies a driving signal corresponding to the image signal input from the control device to the pixel substrate 612.

[0031] The panel holding member 62 is a metal case that holds the liquid crystal panel 61 via the first bonding layer 70. The panel holding member 62 is arranged so as to surround the outer peripheral edge 61a of the liquid crystal panel 61 in a frame shape. The panel holding member 62 has a chip heat radiating portion 620. The chip heat radiating portion 620 is provided at a position corresponding to the driving chip 63a mounted on the FPC 63 and releases the heat of the driving chip 63a.

[0032] The backside plate 60 is a sheet metal member that is disposed on the light-emitting side (backside) of the liquid crystal panel 61 and holds the liquid crystal panel 61 together with the panel holding member 62. The backside plate 60 has an opening 60a that transmits the light emitted from the liquid crystal panel 61.

[0033] The liquid crystal panel 61 generates heat when driven. The heat of the liquid crystal panel 61 is transmitted to the first bonding layer 70 and then transmitted to the panel holding member 62 via the first bonding layer 70. The inventors of the present invention focused on the fact that by forming a good heat path from the liquid crystal panel 61 to the panel holding member 62 in the first bonding layer 70, the heat of the liquid crystal panel 61 can be efficiently transmitted to the panel holding member 62. Then, the configuration of the first bonding layer 70 of the liquid crystal device 6 of the present embodiment was found.

[0034] FIG. 4 is an enlarged cross-sectional view showing the main part configuration of the first bonding layer 70. FIG. 4 is an enlarged view of the region IV in FIG. 3. As shown in FIG. 4, the first bonding layer 70 joins between the outer peripheral edge 61a of the liquid crystal panel 61 and the inner surface 62a of the panel holding member 62. Specifically, the first bonding layer 70 joins the side surface 611a of the counter substrate 611 and the surface 612a of the pixel substrate 612 protruding from the counter substrate 611 to the inner surface 62a of the panel holding member 62.

[0035] The first bonding layer 70 includes an adhesive 71 and a plurality of first fillers 72 added to the adhesive 71. The plurality of first fillers 72 each have an elongated shape. Here, the elongated shape is a shape that extends in one direction, and may be an oblong shape with an elliptical cross-section or a needle-like shape with pointed ends. Therefore, the elongated first filler 72 has a longitudinal axis Lx along its length.

[0036] The plurality of first fillers 72 are positioned in a direction where the direction along the longitudinal axis Lx intersects the thickness direction of the first bonding layer 70. That is, the plurality of first fillers 72 are added into the adhesive 71 so as to be in a state inclined rather than parallel to the side surface 611a of the counter substrate 611, the surface 612a or the side surface 612b of the pixel substrate 612, and the inner surface 62a of the panel holding member 62. Thus, each first filler 72 is disposed in the adhesive 71 with its longitudinal axis Lx along the thickness direction of the first bonding layer 70.

[0037] As shown in FIG. 4, each of the plurality of first fillers 72 has an elongated shape, but the plurality of first fillers 72 are stacked one on top of another in the adhesive 71, forming a fibrous shape as a whole. That is, it can also be said that the first bonding layer 70 of the present embodiment includes the adhesive 71 and the fibrous or elongated first fillers 72 having a longitudinal axis.

[0038] In the present embodiment, the plurality of first fillers 72 include a filler 72a in contact with the liquid crystal panel 61 and a filler 72b in contact with the panel holding member 62. Specifically, the filler 72a is in contact with the side surface 611a of the counter substrate 611, the surface 612a or the side surface 612b of the pixel substrate 612, and the filler 72b is in contact with the inner surface 62a of the panel holding member 62.

[0039] In the present embodiment, the plurality of first fillers 72 include an elongated filler 72c. One end of such an elongated filler 72c is in contact with the liquid crystal panel 61, and the other end is in contact with the panel holding member 62.

[0040] As the material of the first filler 72 having an elongated shape or a fibrous shape, it is preferable to use a material with excellent thermal conductivity. For example, titanium oxide, alumina (Al2O3), carbon, carbon nanotubes, boron nitride (BN), BN nanotubes, etc. can be used.

[0041] For example, the filler made of titanium oxide has an average particle size of several to several tens of μm, a light reflectance of 90 to 98%, and a thermal conductivity of 7.5 to 10.5 W / m·K. Also, the filler made of alumina (Al2O3) has an average particle size of several to several tens of μm, a light reflectance of 90%, and a thermal conductivity of 20 W / m·K. Also, the filler made of boron nitride (BN) has an average particle size of 1 μm or less, a light reflectance of 95%, and a thermal conductivity of 200 W / m·K. Also, the filler made of BN nanotubes has an average particle size of several μm, a light reflectance of 95%, and a thermal conductivity of about 3000 W / m·K. Also, the filler made of carbon has an average particle size of 50 μm, a light reflectance of 5% or less, and a thermal conductivity of 2000 W / m·K or less. Also, the filler made of carbon nanotubes has an average particle size of 1 μm or less, a light reflectance of 5% or less, and a thermal conductivity of 3000 to 6000 W / m·K or less.

[0042] In the present embodiment, the adhesive 71 is made of a resin material having light transmissivity, for example, a silicone resin. The thermal conductivity of the adhesive 71 made of a silicone resin is about 0.15 W / m·K. In the first bonding layer 70 of the present embodiment, the thermal conductivity of the first filler 72 is higher than that of the adhesive 71.

[0043] Subsequently, the operation of the liquid crystal device 6 of the present embodiment will be described. In FIG. 4, for easy understanding of the explanation, the heat path HC, which is the path of heat transmitted from the liquid crystal panel 61 side to the panel holding member 62 side, is shown by a broken line.

[0044] In the liquid crystal device 6 of the present embodiment, first, the heat of the liquid crystal panel 61 is transmitted to the filler closest to the liquid crystal panel 61 among the plurality of first fillers 72. In the case of the present embodiment, the heat of the liquid crystal panel 61 is transmitted to the filler 72a in contact with the liquid crystal panel 61.

[0045] In the first bonding layer 70 of the present embodiment, since the longitudinal axis Lx of each first filler 72 is along the thickness direction of the first bonding layer 70, any of the plurality of first fillers 72 are arranged side by side in the thickness direction of the first bonding layer 70 in a state of being in contact with each other. Therefore, the heat of the filler 72a is transmitted to the first filler 72 in contact with the filler 72a, and eventually reaches the first filler 72 closest to the panel holding member 62. In the case of the present embodiment, the heat of the liquid crystal panel 61 is transmitted from the filler 72 in contact with the inner surface 62a of the panel holding member 62 to the panel holding member 62. That is, the first bonding layer 70 forms a heat path HC for transmitting the heat of the liquid crystal panel 61 to the panel holding member 62 by the plurality of first fillers 72 arranged in the thickness direction, so that the heat of the liquid crystal panel 61 can be efficiently released from the panel holding member 62.

[0046] Also, in the embodiment, since both ends of the long filler 72c are in contact with the liquid crystal panel 61 and the panel holding member 62 respectively, the long filler 72c can form a heat path HC in the first bonding layer 70 alone. For the heat path HC from the liquid crystal panel 61 side to the panel holding member 62 side, it is preferable that the plurality of first fillers 72 are in contact with each other from the panel holding member 62 to the panel holding member 62. However, since the thermal conductivity is higher compared to the conventional spherical fillers, it is possible to enhance the heat dissipation effect even when some of the fillers are not in contact.

[0047] In the first bonding layer 70 of the present embodiment, the plurality of first fillers 72 are stacked multiple times in the adhesive 71 as described above to form a fibrous shape as a whole. Therefore, as shown in FIG. 3, a plurality of similar heat paths HC are formed inside the first bonding layer 70. Thereby, the heat of the liquid crystal panel 61 is transmitted to the panel holding member 62 through the first bonding layer 70 and is released through the panel holding member 62. Note that as the fibrous form, the plurality of first fillers are not limited to the long axis shape, and a form in which a plurality of filamentous first fillers are entangled with each other may be used. A plurality of first fillers in which curved fillers are entangled in a filamentous form may form a heat path and obtain a similar effect.

[0048] Here, the heat of the liquid crystal panel 61 is transmitted to the surrounding members, causing the surrounding members to thermally expand. In the case of this embodiment, the opposing substrate 611 and the pixel substrate 612 constituting the liquid crystal panel 61 are made of quartz glass having a relatively low linear expansion coefficient. The linear expansion coefficient of quartz glass is 0.5×E -6 / °C.

[0049] On the other hand, the panel holding member 62 has a higher linear expansion coefficient compared to quartz glass. In the case of this embodiment, as the material of the panel holding member 62, for example, ADC12 of an aluminum alloy or AZ91 of a magnesium alloy is used. Note that the linear expansion coefficient of ADC12 is 21×E -6 / °C, and the linear expansion coefficient of AZ91 is 27×E -6 / °C. The linear expansion coefficient of the silicone resin constituting the adhesive 71 of this embodiment is 300×E -6 / °C.

[0050] As described above, the linear expansion coefficient of the silicone resin constituting the adhesive 71 is sufficiently higher than the linear expansion coefficients of the quartz glass constituting the liquid crystal panel 61 and the metal member constituting the panel holding member 62. For this reason, a single adhesive 71 that does not contain a filler may thermally expand and apply stress to the liquid crystal panel 61, which may affect the gap of the liquid crystal layer 610 sandwiched between the pair of substrates. If the gap of the liquid crystal layer 610 varies in this way, it may affect the quality of the image formed by the liquid crystal panel 61.

[0051] On the other hand, when the linear expansion coefficient of the first bonding layer 70 is lower than the linear expansion coefficient of the panel holding member 62, the adhesive 71 may not be able to follow the elongation due to the expansion of the panel holding member 62, and there is a risk that the adhesive 71 may break.

[0052] The inventors have intensively studied and found that by adjusting the addition amount of fibrous or long-axis fillers with a longitudinal axis in the adhesive, it is possible to realize a bonding layer that suppresses the stress caused by thermal expansion applied to the liquid crystal panel 61 and suppresses breakage due to thermal expansion. Then, the first bonding layer 70 of the present embodiment was completed.

[0053] Here, let the linear expansion coefficient of the first bonding layer 70 of the present embodiment be αa and the linear expansion coefficient of the panel holding member 62 be αc. The linear expansion coefficient αa of the first bonding layer 70 of the present embodiment satisfies αa ≧ αc. That is, the linear expansion coefficient αa of the first bonding layer 70 is larger than the linear expansion coefficient αc of the panel holding member 62. According to this configuration, since the first bonding layer 70 expands more than the panel holding member 62, the first bonding layer 70 follows the expansion of the panel holding member 62, so that breakage of the first bonding layer 70 and peeling from the interface can be suppressed.

[0054] In addition, the inventors have found that if the thermal expansion amount of the first bonding layer 70 is suppressed to 3 pixels or less of the liquid crystal panel 61 even if the first bonding layer 70 expands, the occurrence of display defects due to gap fluctuations can be suppressed.

[0055] FIG. 5 is a graph showing the relationship between the filler addition amount and the linear expansion coefficient of the first bonding layer 70. In FIG. 5, the horizontal axis represents the filler addition amount (unit: vol%), and the vertical axis represents the linear expansion coefficient (unit: ×E -6 / °C). In addition, in FIG. 5, a graph showing the relationship between the filler addition amount and the linear expansion coefficient in a bonding layer in which spherical fillers of crystalline silica are added to a silicone adhesive is shown as a comparative example. Note that for the first bonding layer 70 shown in FIG. 5, carbon is used as the first filler 72, and ADC12, an aluminum alloy, is used as the material of the panel holding member 62.

[0056] In FIG. 5, the optimal range of the linear expansion coefficient αa of the first bonding layer 70 is indicated by hatching. As shown in FIG. 5, the filler addition amount in the first bonding layer 70 is set to 5% vol% to 45% vol%. This is because when the filler addition amount is less than 5% vol%, the thermal conductivity of the first bonding layer 70 decreases, and when the filler addition amount is greater than 45% vol%, the adhesive content of the bonding layer decreases, which may result in insufficient bonding strength. It is preferable to set the more optimal filler addition amount in the first bonding layer 70 to 7% vol% to 40% vol%. Further preferably, the filler addition amount in the first bonding layer 70 is set to 10% vol% to 30% vol%.

[0057] The lower limit of the linear expansion coefficient αa of the first bonding layer 70 shown in FIG. 5 is set based on the linear expansion coefficient αc of the panel holding member 62 (ADC12). That is, the lower limit of the linear expansion coefficient αa of the first bonding layer 70 is 21×E, which is the linear expansion coefficient αc of the material (ADC12) of the panel holding member 62. -6 / °C or more.

[0058] Note that as the material of the panel holding member 62, AZ91 of a magnesium alloy can also be used as described above. When AZ91 is used as the material of the panel holding member 62, the lower limit of the linear expansion coefficient αa of the first bonding layer 70 is 27×E, which is the linear expansion coefficient of AZ91. -6 / °C or more.

[0059] On the other hand, the upper limit of the linear expansion coefficient αa of the first bonding layer 70 shown in FIG. 5 is set based on the thermal expansion amount of the first bonding layer 70 such that the thermal expansion length of the first bonding layer 70 is 3 pixels or less. The thermal expansion amount of the first bonding layer 70 is calculated from the linear expansion coefficient, the maximum thickness, and the change amount of the environmental temperature. Let the maximum thickness of the first bonding layer 70 shown in FIG. 3 be d, the change amount of the environmental temperature of the first bonding layer 70 be ΔT, and the thermal expansion amount of the first bonding layer 70 be Δd. At this time, the thermal expansion amount Δd of the first bonding layer 70 is calculated by Δd = αa × d × ΔT.

[0060] Therefore, assuming that the pixel pitch of the liquid crystal panel 61 is P, the linear expansion coefficient αa of the first bonding layer 70 that limits the thermal expansion amount of the first bonding layer 70 to 3 pixels or less satisfies αa ≦ 3P / (d·ΔT). That is, the upper limit of the linear expansion coefficient αa of the first bonding layer 70 is defined by αa ≦ 3P / (d·ΔT).

[0061] The pixel pitch P of the liquid crystal panel 61 varies according to the size of the liquid crystal panel 61. For example, the graph shown in FIG. 5 is a graph when the pixel pitch P of the liquid crystal panel 61 is 7.5 μm (a 0.67-inch WUXGA panel) and the maximum thickness d of the first bonding layer 70 is 0.4 mm. The reason for setting the maximum thickness d to 0.4 mm is to reduce the influence of the optical axis blur of the liquid crystal panel 61 fixed to the panel holding member 62.

[0062] The amount of change ΔT in the ambient temperature varies depending on the cooling conditions of the liquid crystal panel, such as the air cooling method or the liquid cooling method, but generally falls within the range of 30°C to 40°C. For example, when the amount of change ΔT in the ambient temperature is 40°C, the linear expansion coefficient αa of the first bonding layer 70 is 140.6×E -6 / °C or less. Also, when the amount of change ΔT in the ambient temperature is 30°C, the linear expansion coefficient αa of the first bonding layer 70 is 187.5×E -6 / °C or less.

[0063] That is, when bonding the liquid crystal panel 61 with a pixel pitch P of 7.5 μm, the linear expansion coefficient αa of the first bonding layer 70 is preferably 187.5×E -6 / °C or less. According to this configuration, since the thermal expansion amount of the first bonding layer 70 can be suppressed to 3 pixels or less of the liquid crystal panel 61 with a pixel pitch of 7.5 μm, it is possible to suppress the occurrence of display defects due to gap fluctuations of the liquid crystal panel 61 caused by the thermal expansion of the first bonding layer 70.

[0064] Note that the pixel pitch P of the liquid crystal panel 61 is not limited to 7.5 μm or less. For example, consider the case where the pixel pitch P is 11.6 μm (a 1.0-inch WUXGA panel) and the maximum thickness d of the first bonding layer 70 is 0.4 mm.

[0065] When the change amount ΔT of the ambient temperature is 40°C and the pixel pitch P of the liquid crystal panel 61 is 11.6 μm, the linear expansion coefficient αa of the first bonding layer 70 is 217.5×E -6 / °C or less. Also, when the change amount ΔT of the ambient temperature is 30°C and the pixel pitch P of the liquid crystal panel 61 is 11.6 μm, the linear expansion coefficient αa of the first bonding layer 70 is 290.0×E -6 / °C or less.

[0066] That is, when bonding the liquid crystal panel 61 with a pixel pitch P of 11.6 μm, the linear expansion coefficient αa of the first bonding layer 70 is preferably 290.0×E -6 / °C or less. According to this configuration, since the thermal expansion amount of the first bonding layer 70 can be suppressed to 3 pixels or less of the liquid crystal panel 61 with a pixel pitch of 11.6 μm, it is possible to suppress the occurrence of display defects due to gap fluctuations of the liquid crystal panel 61 caused by thermal expansion of the first bonding layer 70.

[0067] In the bonding layer of the comparative example using spherical fillers, in order to form a good heat path, that is, to improve the thermal conductivity, it is desirable to increase the filler addition amount as much as possible. Also, as shown in FIG. 5, the bonding layer of the comparative example has a smaller slope of the graph compared to the first bonding layer 70 of the present embodiment. For this reason, in the bonding layer of the comparative example, it is necessary to increase the filler addition amount in order to suppress the linear expansion coefficient while improving the thermal conductivity. For example, in the bonding layer of the comparative example, when the linear expansion coefficient is 120×E -6 / °C, it is necessary to set the filler addition amount to 60 vol%. However, in the case of a filler addition amount of 60 vol%, as described above, the bonding strength of the bonding layer becomes insufficient. Thus, in the bonding layer of the comparative example, it was difficult to realize a configuration excellent in bonding reliability and thermal conductivity.

[0068] In contrast, according to the first bonding layer 70 of the present embodiment, compared with the case of using spherical fillers, the linear expansion coefficient can be adjusted to be lower with a smaller filler addition amount, so that a decrease in bonding reliability due to an increase in the filler addition amount can be suppressed. The first bonding layer 70 of the present embodiment has an excellent balance between thermal conductivity and bonding strength by setting the filler addition amount to 5% vol% to 45% vol%. Further, according to the first bonding layer 70 of the present embodiment, the thermal conductivity can be improved by forming a heat path HC in the first bonding layer 70 with fibrous or long-axis-shaped first fillers 72 having a long axis. That is, according to the first bonding layer 70 of the present embodiment, a configuration excellent in bonding reliability and thermal conductivity can be realized.

[0069] (Effect of the First Embodiment) The liquid crystal device 6 of the present embodiment includes a liquid crystal panel 61 including a pair of substrates 611 and 612 holding a liquid crystal layer 610, a panel holding member 62 holding the liquid crystal panel 61, and a first bonding layer 70 bonding the liquid crystal panel 61 to the panel holding member 62. The first bonding layer 70 includes an adhesive 71 and a plurality of fibrous or long-axis-shaped first fillers 72 added to the adhesive 71. The thermal conductivity of the first filler 72 is higher than that of the adhesive 71.

[0070] In the liquid crystal device 6 of the present embodiment, the first bonding layer 70 is composed of an adhesive 71 and a plurality of first fillers 72 having a long-axis shape or a fibrous shape added to the adhesive 71. The thermal conductivity of the first filler 72 is higher than that of the adhesive 71, and the plurality of first fillers 72 constitute a heat path HC for transferring the heat of the liquid crystal panel 61 to the panel holding member 62.

[0071] According to the liquid crystal device 6 of the present embodiment, a heat path HC from the liquid crystal panel 61 toward the panel holding member 62 can be formed in the first bonding layer 70 by the plurality of first fillers 72. Here, when a heat path is formed in the bonding layer by increasing the filling rate of spherical fillers as in the prior art, the amount of the adhesive decreases and the bonding strength of the bonding layer decreases, which may cause peeling or breakage of the liquid crystal panel 61. In contrast, the first bonding layer 70 of the present embodiment can obtain sufficient bonding strength without reducing the amount of the adhesive 71 by aligning the longitudinal axis Lx of the first filler 72 along the thickness direction to efficiently form the heat path HC. Therefore, according to the liquid crystal device 6 of the present embodiment, the liquid crystal panel 61 can be stably held and efficiently cooled, so that deterioration of the liquid crystal panel 61 due to heat can be suppressed over a long period.

[0072] The projector 1 of the present embodiment includes a light source device 2, a light modulation device 40R, 40G, 40B including a liquid crystal device 6 that modulates light emitted from the light source device 2, and a projection optical device 5 that projects the light modulated by the light modulation devices 40R, 40G, 40B.

[0073] According to the projector 1 of the present embodiment, a projector with excellent display quality and high efficiency can be provided.

[0074] (Second Embodiment) Hereinafter, the liquid crystal device of the second embodiment will be described. The basic configuration of the liquid crystal device of the second embodiment is the same as that of the first embodiment, and the configuration of the first bonding layer is different from that of the first embodiment. Therefore, the configuration of the first bonding layer will be mainly described below.

[0075] FIG. 6 is an enlarged cross-sectional view showing a main configuration of the first bonding layer 270 of the present embodiment. In FIG. 6, the same reference numerals are given to the components common to the drawings used in the above embodiment, and the description thereof is omitted. As shown in FIG. 6, the first bonding layer 270 of the present embodiment includes an adhesive 71, a plurality of first fillers 72, and a plurality of second fillers 73. The plurality of second fillers 73 each have a spherical shape. Each second filler 73 is made of crystalline silica. According to the first bonding layer 270 of the present embodiment, the contact between the first filler 72 and the second filler 73 can make it easier to form a heat path in the thickness direction.

[0076] As shown in FIG. 6, a narrow gap portion S1 with a smaller gap than others is formed between the outer peripheral edge 61a of the liquid crystal panel 61 and the inner surface 62a of the panel holding member 62, and it is difficult for the first filler 72 to uniformly enter the narrow gap portion S1.

[0077] According to the first bonding layer 270 of the present embodiment, the spherical second filler 73 can be well made to enter the narrow gap portion S1. In the case of the narrow gap portion S1 with a small gap, the spherical second fillers 73 can contact each other to form a heat path HC1 in the thickness direction. Therefore, according to the first bonding layer 270 of the present embodiment, even when the narrow gap portion S1 is formed between the outer peripheral edge 61a of the liquid crystal panel 61 and the inner surface 62a of the panel holding member 62, a good heat path can be formed between the liquid crystal panel 61 and the panel holding member 62. Therefore, according to the liquid crystal device of the present embodiment, by holding the liquid crystal panel 61 by the panel holding member 62 via the first bonding layer 270, the liquid crystal panel 61 is stably held and efficiently cooled, so that deterioration of the liquid crystal panel 61 due to heat can be suppressed over a long period.

[0078] (Third Embodiment) Hereinafter, the liquid crystal device of the third embodiment will be described. The basic configuration of the liquid crystal device of the third embodiment is the same as that of the first embodiment, and the configuration of the first bonding layer is different from that of the first embodiment. Therefore, hereinafter, the configuration of the first bonding layer will be mainly described.

[0079] FIG. 7 is an enlarged cross-sectional view showing a main part configuration of the first bonding layer 370 of the present embodiment. In FIG. 7, the same reference numerals are given to the components common to the drawings used in the above embodiments, and the description thereof is omitted.

[0080] Here, a part of the light incident on the liquid crystal panel may become stray light and enter the bonding layer. Generally, since the adhesive contained in the bonding layer is white, there is a possibility that the stray light is reflected between the substrate of the liquid crystal panel 61 and the panel holding member 62 through the adhesive and enters the liquid crystal panel 61 again, causing defects in the display image such as color unevenness.

[0081] In contrast, as shown in FIG. 7, the first bonding layer 370 of the present embodiment includes an adhesive 71, a plurality of first fillers 72, and a plurality of third fillers 74. Each third filler 74 is made of a material with a reflectance of 30% or less. In the case of the present embodiment, as the material of the third filler 74, for example, carbon or carbon nanotubes can be used. Carbon and carbon nanotubes have a very high thermal conductivity and are blackish in color and absorb light, so the reflectance is as low as 5% or less. Note that the shape of the third filler 74 is not particularly limited, and it may have the same long-axis shape as the first filler 72 or the same spherical shape as the second filler 73.

[0082] According to the first bonding layer 370 of the present embodiment, by containing the third filler 74 with a reflectance of 30% or less in the adhesive 71, a part of the stray light ML incident from the liquid crystal panel 61 into the adhesive 71 can be absorbed by the third filler 74. As a result, the amount of stray light reflected between the substrate of the liquid crystal panel 61 and the panel holding member 62 through the adhesive 71 and incident on the liquid crystal panel 61 again can be reduced. Therefore, the occurrence of display defects in the liquid crystal panel 61 due to stray light can be suppressed.

[0083] (Fourth Embodiment) Hereinafter, the liquid crystal device of the fourth embodiment will be described. The basic configuration of the liquid crystal device of the fourth embodiment is the same as that of the first embodiment, and is different from the first embodiment in that it further includes a vapor chamber and a Peltier element for enhancing the cooling performance of the liquid crystal panel.

[0084] FIG. 8 is an exploded perspective view showing a schematic configuration of the liquid crystal device of the present embodiment as viewed from the light incident side, and FIG. 9 is an exploded perspective view showing a schematic configuration of the liquid crystal device of the present embodiment as viewed from the light emission side. In FIG. 9, the same reference numerals are given to the components common to the drawings used in the first embodiment, and the description thereof is omitted. As shown in FIGS. 8 and 9, the liquid crystal device 100 of the present embodiment includes a liquid crystal panel 61, a panel holding member 162, an FPC 63, an incident-side dust-proof substrate 164 and an emission-side dust-proof substrate 65 that sandwich the liquid crystal panel 61 in the direction along the Z axis, a heat diffusion member 50, a thermoelectric conversion device 55, a heat dissipation member 59, a first bonding layer 70, a second bonding layer 80, a third bonding layer 90, and a backside plate 60.

[0085] The heat diffusion member 50 has a heat receiving portion 51 that receives the heat of the liquid crystal panel 61, a heat radiating portion 52 that radiates the heat received by the heat receiving portion 51, and an opening portion 53. The heat diffusion member 50 is attached to the panel holding member 162. The heat diffusion member 50 is a vapor chamber VC having a sealed housing VC1 in which a working fluid that can change between a gas phase and a liquid phase is enclosed.

[0086] The heat receiving portion 51 is provided on the light emission side surface of the heat diffusion member 50, and the heat radiating portion 52 is provided on the light incident side surface of the heat diffusion member 50. The opening portion 53 allows the light incident on the liquid crystal panel 61 to pass in the +Z direction when the heat diffusion member 50 is attached to the panel holding member 162. That is, the opening portion 53 is a through hole that penetrates the heat diffusion member 50 along the +Z direction. The opening portion 53 is formed in a substantially rectangular shape corresponding to the pixel region of the liquid crystal panel 61 when viewed from the light incident side. The heat receiving portion 51 contacts the incident-side dust-proof substrate 164 and receives the heat of the liquid crystal panel 61 through the incident-side dust-proof substrate 164. The incident-side dust-proof substrate 164 of the present embodiment uses a sapphire substrate with excellent thermal conductivity. Therefore, the heat of the liquid crystal panel 61 is transmitted to the heat receiving portion 51 of the heat diffusion member 50 through the incident-side dust-proof substrate 164.

[0087] In the case of this embodiment, since the incident-side dustproof substrate 164 is made of a sapphire substrate with excellent thermal conductivity, the heat receiving part 51 of the heat diffusion member 50 is thermally connected to the liquid crystal panel 61 via the incident-side dustproof substrate 164. According to this configuration, the heat of the liquid crystal panel 61 is efficiently transmitted to the heat receiving part 51 of the heat diffusion member 50 via the incident-side dustproof substrate 164, so that the heat dissipation performance of the liquid crystal panel 61 can be efficiently enhanced. When the incident-side dustproof substrate 164 is made of a sapphire substrate, it is desirable that the heat receiving part 51 of the heat diffusion member 50 does not contact the panel holding member 62. This is because when the heat receiving part 51 of the heat diffusion member 50 contacts the panel holding member 62, it becomes difficult for the heat of the liquid crystal panel 61 to be efficiently transmitted to the incident-side dustproof substrate 164 side, and as a result, the heat dissipation efficiency of the liquid crystal panel 61 decreases.

[0088] On the other hand, since the sapphire substrate is very expensive, for example, it is also conceivable to use quartz glass as the material of the incident-side dustproof substrate 164 due to cost constraints. In such a case, it is preferable that the heat receiving part 51 of the heat diffusion member 50 contacts the panel holding member 62. According to this configuration, although the thermal conductivity of the incident-side dustproof substrate 164 decreases compared to the case of using a sapphire substrate, the heat of the liquid crystal panel 61 can be transmitted from both the incident-side dustproof substrate 164 and the panel holding member 62 to the heat receiving part 51 of the heat diffusion member 50, so that the heat dissipation performance of the liquid crystal panel 61 can be enhanced as a result.

[0089] Among the liquid-phase working fluid enclosed in the sealed housing VC1, a part of the working fluid is vaporized by the heat of the liquid crystal panel 61 heated at the heat receiving part 51 and changes into a gas-phase working fluid, and diffuses in the sealed housing VC1. A part of the gas-phase working fluid transfers heat to the heat radiating part 52 which is a part with a low temperature in the sealed housing VC1. Thereby, the gas-phase working fluid is condensed by radiating heat at the heat radiating part 52 and changes into a liquid-phase working fluid. The working fluid that has changed into a liquid phase moves along the inner surface of the sealed housing VC1 and returns to the heat receiving part 51 again.

[0090] The heat dissipation member 50 is provided with a thermoelectric conversion device 55 at a portion corresponding to the heat dissipation portion 52. The thermoelectric conversion device 55 has a first surface 55a, a second surface 55b, and a lead wire 56. The first surface 55a is a surface of the thermoelectric conversion device 55 that faces the heat dissipation portion 52 of the heat dissipation member 50. The second surface 55b is a surface of the thermoelectric conversion device 55 that faces the -Z direction opposite to the first surface 55a, and the heat dissipation member 59 contacts it. The heat dissipation member 59 is composed of a heat sink including a plurality of fins 59a.

[0091] The lead wire 56 extends in the +Y direction from the end portion of the thermoelectric conversion device 55 in the +Y direction. The thermoelectric conversion device 55 actively absorbs heat transferred from the heat dissipation portion 52 at the first surface 55a by the electric power supplied from the lead wire 56, and dissipates the absorbed heat from the second surface 55b to the heat dissipation member 59.

[0092] The thermoelectric conversion device 55 of the present embodiment is a Peltier element. Therefore, by reversing the polarity of the thermoelectric conversion device 55, it is possible to supply heat from the first surface 55a to the heat dissipation portion 52. That is, the thermoelectric conversion device 55 can warm the liquid crystal panel 61 through the heat dissipation member 50. At this time, in the heat dissipation member 50, the working fluid in the liquid phase near the heat dissipation portion 52 changes to the working fluid in the gas phase due to the heat supplied from the thermoelectric conversion device 55, and the working fluid in the gas phase diffuses in the sealed housing VC1. Then, among the working fluid in the gas phase, a part of the working fluid transfers heat to the heat receiving portion 51, and heat is supplied from the heat receiving portion 51 to the liquid crystal panel 61. When supplying heat from the first surface 55a to the heat dissipation member 50, the second surface 55b serves as a heat absorption surface and absorbs heat from the heat dissipation member 59.

[0093] As shown in FIG. 9, the first bonding layer 70 bonds the outer peripheral edge 61a of the liquid crystal panel 61 and the inner surface 163a of the frame body 163 of the panel holding member 162. As shown in FIG. 8, the second bonding layer 80 bonds the liquid crystal panel 61 and the heat receiving portion 51 provided around the opening 53 of the heat diffusion member 50. Similar to the first bonding layer 70, the second bonding layer 80 contains a plurality of first fillers 72. According to this configuration, the second bonding layer 80 forms a heat path from the liquid crystal panel 61 to the heat receiving portion 51 of the heat diffusion member 50 by the plurality of first fillers 72, and can efficiently transfer the heat of the liquid crystal panel 61 to the heat receiving portion 51. When the polarity of the thermoelectric conversion device 55 is reversed, the second bonding layer 80 can form a heat path from the heat receiving portion 51 of the heat diffusion member 50 to the liquid crystal panel 61.

[0094] The third bonding layer 90 bonds the heat diffusion member 50 and the heat radiating member 59. In the case of the present embodiment, the third bonding layer 90 bonds the heat diffusion member 50 and the heat radiating member 59 with the thermoelectric conversion device 55 sandwiched between the heat diffusion member 50 and the heat radiating member 59. Specifically, the third bonding layer 90 bonds the heat radiating portion 52 of the heat diffusion member 50 and the first surface 55a of the thermoelectric conversion device 55, and bonds the second surface 55b of the thermoelectric conversion device 55 and the heat radiating member 59. Similar to the first bonding layer 70, the third bonding layer 90 contains a plurality of first fillers 72. According to this configuration, the third bonding layer 90 forms a heat path from the heat radiating portion 52 of the heat diffusion member 50 to the thermoelectric conversion device 55 by the plurality of first fillers 72, and can efficiently transfer the heat of the heat diffusion member 50 to the thermoelectric conversion device 55. When the polarity of the thermoelectric conversion device 55 is reversed, the third bonding layer 90 can form a heat path from the thermoelectric conversion device 55 to the heat radiating portion 52 of the heat diffusion member 50. Further, the third bonding layer 90 forms a heat path from the thermoelectric conversion device 55 to the heat radiating member 59 by the plurality of first fillers 72, and can efficiently transfer the heat of the thermoelectric conversion device 55 to the heat radiating member 59. When the polarity of the thermoelectric conversion device 55 is reversed, the third bonding layer 90 can form a heat path from the heat radiating member 59 to the thermoelectric conversion device 55.

[0095] According to the liquid crystal device 100 of this embodiment in this way, by adopting the vapor chamber VC as the heat diffusion member 50, the heat of the liquid crystal panel 61 can be quickly dissipated. Therefore, the cooling efficiency of the liquid crystal panel 61 can be improved. Also, since the thermoelectric conversion device 55 is a Peltier element, heat can be actively absorbed from the heat radiating portion 52 of the heat diffusion member 50, and the heat of the liquid crystal panel 61 can be efficiently radiated to the heat radiating member 59. Therefore, the cooling efficiency of the liquid crystal panel 61 can be improved.

[0096] Here, when the temperature of the liquid crystal panel 61 is low, the responsiveness of the liquid crystal decreases, and the formed image may deteriorate. In particular, when forming an image with a high frame rate, the image formation may not follow the frame rate, and there is a possibility that an image corresponding to the image signal input to the liquid crystal panel 61 cannot be formed.

[0097] Even in such a case, according to the liquid crystal device 100 of this embodiment, the thermoelectric conversion device 55, which is a Peltier element, can raise the temperature of the liquid crystal layer by heating the liquid crystal panel 61 through the heat diffusion member 50. Therefore, it is possible to suppress a decrease in the responsiveness of the liquid crystal in the liquid crystal panel 61. On the other hand, when the temperature of the liquid crystal panel 61 is high, the liquid crystal is likely to deteriorate, and the life of the liquid crystal panel 61 is likely to be shortened. In contrast, by the thermoelectric conversion device 55 actively absorbing the heat of the liquid crystal panel 61 through the heat diffusion member 50, it is possible to facilitate radiating the heat of the liquid crystal panel 61 to the heat radiating member 59.

[0098] Note that the technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. In addition, regarding the specific descriptions of the shapes, numbers, arrangements, materials, etc. of the respective components of the liquid crystal device and the projector, they are not limited to the above embodiment, and can be appropriately changed. In the above embodiment, as an example of the projector of the present invention, the case of applying it to a projector that performs optical modulation using a liquid crystal device is shown, but it is not limited to this.

[0099] The projector of the present invention may be applied to a projector that performs optical modulation using an optical modulation device having a digital micromirror device as an optical modulation element. In this case, the optical modulation device of the present invention can adopt a configuration in which the digital micromirror device and the holding member for holding the digital micromirror device are joined using the first bonding layer 70. That is, the optical modulation device of the present invention includes an optical modulation element that modulates incident light as image light, a holding member that holds the optical modulation element, and a bonding layer that bonds the optical modulation element to the holding member. The bonding layer includes an adhesive and fibrous or longitudinally shaped fillers added to the adhesive, and the thermal conductivity of the fillers is higher than the thermal conductivity of the adhesive. According to the optical modulation device having this configuration, by stably holding the digital micromirror device and efficiently cooling it, deterioration of the digital micromirror device due to heat can be suppressed over a long period. Further, even in a projector provided with the optical modulation device, a projector with excellent display quality and high efficiency can be provided.

[0100] Further, the projector of the present invention may not have a plurality of optical modulation devices (liquid crystal devices), and may have only one optical modulation device (liquid crystal device).

[0101] Hereinafter, a summary of the present disclosure is appended. (Appendix 1) A liquid crystal panel including a pair of substrates holding a liquid crystal layer, A panel holding member that holds the liquid crystal panel, A first bonding layer that bonds the liquid crystal panel to the panel holding member, and The first bonding layer includes an adhesive and a plurality of first fillers in a fibrous or long-axis shape having a longitudinal axis added to the adhesive, The thermal conductivity of the first filler is higher than the thermal conductivity of the adhesive, A liquid crystal device characterized by this.

[0102] According to the liquid crystal device of Supplementary Note 1, a plurality of first fillers can form a heat path from the liquid crystal panel toward the panel holding member within the first bonding layer. When forming a heat path within the bonding layer by increasing the filling rate of spherical fillers as in the prior art, the amount of adhesive decreases, the adhesive strength of the bonding layer decreases, and there is a risk of phosphor peeling or damage. In contrast, with the configuration of Supplementary Note 1, since the first fillers efficiently form a heat path, sufficient bonding strength can be obtained without reducing the amount of adhesive. Therefore, according to this configuration, it is possible to provide a liquid crystal device that stably holds the liquid crystal panel and efficiently cools it, thereby suppressing deterioration of the liquid crystal panel due to heat over a long period.

[0103] (Supplementary Note 2) The first bonding layer further includes granular second fillers. The liquid crystal device according to Supplementary Note 1, characterized in that.

[0104] According to the configuration of Supplementary Note 2, the formation of a heat path in the thickness direction can be made easier by the contact of the first fillers and the second fillers. Also, since the spherical second fillers can enter well into the narrow gap portions with smaller gaps than others in the region where the first bonding layer is disposed, the second fillers can form a heat path well in the thickness direction of the narrow gap portions by contacting each other.

[0105] (Supplementary Note 3) When the linear expansion coefficient of the first bonding layer is αa and the linear expansion coefficient of the panel holding member is αc, satisfies αa≧αc. The liquid crystal device according to Supplementary Note 1 or Supplementary Note 2, characterized in that.

[0106] According to the configuration of Supplementary Note 3, the linear expansion coefficient of the first bonding layer can be made larger than the linear expansion coefficient of the panel holding member. As a result, since the first bonding layer expands more than the panel holding member, the first bonding layer follows the expansion of the panel holding member, so that breakage of the first bonding layer and peeling from the interface can be suppressed.

[0107] (Appendix 4) The panel holding member is made of ADC12 aluminum alloy, The linear expansion coefficient αa of the first bonding layer is 21×E -6 / °C or more, The liquid crystal device according to Appendix 3, characterized in that.

[0108] According to the configuration of Appendix 4, the linear expansion coefficient of the first bonding layer can be made larger than the linear expansion coefficient of the panel holding member made of ADC12 aluminum alloy. As a result, since the first bonding layer expands more than the panel holding member, the first bonding layer follows the expansion of the panel holding member, so that breakage of the first bonding layer and peeling from the interface can be suppressed.

[0109] (Appendix 5) The panel holding member is made of AZ91 magnesium alloy, The linear expansion coefficient αa of the first bonding layer is 27×E -6 / °C or more, The liquid crystal device according to Appendix 3, characterized in that.

[0110] According to the configuration of Appendix 5, the linear expansion coefficient of the first bonding layer can be made larger than the linear expansion coefficient of the panel holding member made of AZ91 magnesium alloy. As a result, since the first bonding layer expands more than the panel holding member, the first bonding layer follows the expansion of the panel holding member, so that breakage of the first bonding layer and peeling from the interface can be suppressed.

[0111] (Appendix 6) When the pixel pitch of the liquid crystal panel is P, the maximum thickness of the first bonding layer is d, and the change amount of the ambient temperature of the liquid crystal panel is ΔT, αa satisfies αa≦3P / (d·ΔT), The liquid crystal device according to any one of Appendices 1 to 5, characterized in that.

[0112] According to the configuration of Supplementary Note 6, by suppressing the thermal expansion amount of the first bonding layer to 3 pixels or less of the liquid crystal panel, it is possible to suppress the occurrence of display defects due to gap fluctuations of the liquid crystal panel.

[0113] (Supplementary Note 7) The maximum thickness d of the first bonding layer is 0.4 mm, The change amount ΔT of the environmental temperature is 30 to 40 °C, The liquid crystal device according to Supplementary Note 6, characterized in that.

[0114] According to the configuration of Supplementary Note 7, it is possible.

[0115] (Supplementary Note 8) The pixel pitch P of the liquid crystal panel is 11.6 μm or less, The linear expansion coefficient αa of the first bonding layer is 290.0×E -6 / °C or less, The liquid crystal device according to Supplementary Note 7, characterized in that.

[0116] According to the configuration of Supplementary Note 8, in a liquid crystal panel with a pixel pitch of 11.6 μm, it is possible to suppress the occurrence of display defects due to gap fluctuations caused by thermal expansion of the first bonding layer.

[0117] (Supplementary Note 9) The pixel pitch P of the liquid crystal panel is 7.5 μm or less, The linear expansion coefficient αa of the first bonding layer is 187.5×E -6 / °C or less, The liquid crystal device according to Supplementary Note 8, characterized in that.

[0118] According to the configuration of Supplementary Note 9, in a liquid crystal panel with a pixel pitch of 7.5 μm, it is possible to suppress the occurrence of display defects due to gap fluctuations caused by thermal expansion of the first bonding layer.

[0119] (Supplementary Note 10) The content rate of the plurality of first fillers in the first bonding layer is 5 vol% to 45 vol%, The liquid crystal device according to any one of Appendices 1 to 9, characterized in that...

[0120] According to the configuration of Appendix 10, a bonding layer excellent in the balance between thermal conductivity and bonding strength can be provided.

[0121] (Appendix 11) The first bonding layer further includes a third filler having a reflectance of 30% or less. The liquid crystal device according to any one of Appendices 1 to 10, characterized in that...

[0122] According to the configuration of Appendix 11, by containing a third filler having a reflectance of 30% or less in the adhesive, part of the stray light incident on the adhesive from the liquid crystal panel can be absorbed by the third filler. As a result, the amount of stray light reflected between the liquid crystal panel and the panel holding member through the adhesive and incident on the liquid crystal panel again can be reduced. Therefore, the occurrence of display defects in the liquid crystal panel due to stray light can be suppressed.

[0123] (Appendix 12) A heat dissipation member that is bonded to the liquid crystal panel via a second bonding layer and has a heat receiving portion that receives the heat of the liquid crystal panel and a heat radiating portion that radiates the heat received by the heat receiving portion. A heat radiating member that is bonded to the heat radiating portion of the heat dissipation member via a third bonding layer and radiates the heat of the heat dissipation member. The liquid crystal device according to any one of Appendices 1 to 11, characterized in that...

[0124] According to the configuration of Appendix 12, the heat transmitted from the liquid crystal panel to the heat dissipation member can be efficiently released through the heat radiating member. Therefore, the liquid crystal panel can be efficiently cooled.

[0125] (Appendix 13) The heat dissipation member is also in contact with the panel holding member. The liquid crystal device according to Appendix 12, characterized in that...

[0126] According to the configuration of Supplementary Note 13, the heat of the panel holding member can be efficiently released by the heat diffusion member.

[0127] (Supplementary Note 14) The liquid crystal device further includes a thermoelectric conversion device disposed between the heat radiating portion of the heat diffusion member and the heat radiating member, The thermoelectric conversion device is joined to the heat diffusion member and the heat radiating member via the third bonding layer, The liquid crystal device according to Supplementary Note 12 or Supplementary Note 13, characterized in that.

[0128] According to the configuration of Supplementary Note 14, the heat of the heat diffusion member can be efficiently released to the heat radiating member by the thermoelectric conversion device.

[0129] (Supplementary Note 15) The second bonding layer and the third bonding layer each contain the plurality of first fillers, The liquid crystal device according to Supplementary Note 14, characterized in that.

[0130] According to the configuration of Supplementary Note 15, a heat path can be efficiently formed in the second bonding layer and the third bonding layer by the first filler.

[0131] (Supplementary Note 16) A light source device, The liquid crystal device according to any one of Supplementary Notes 1 to 15, which modulates the light emitted from the light source device, A projection optical device that projects the light modulated by the liquid crystal device, comprising: A projector, characterized in that.

[0132] According to the projector having the configuration of Supplementary Note 16, a projector with excellent display quality and high efficiency can be provided.

[0133] (Supplementary Note 17) A light modulation element that modulates incident light as image light, A holding member that holds the light modulation element, A bonding layer for bonding the light modulation element to the holding member, and the bonding layer includes an adhesive and a filler in a fibrous shape or a shape having a longitudinal axis added to the adhesive, the thermal conductivity of the filler is higher than the thermal conductivity of the adhesive, A light modulation device characterized by this.

[0134] According to the configuration of Supplementary Note 17, since the first filler efficiently forms a heat path, sufficient bonding strength can be obtained without reducing the amount of the adhesive. Therefore, according to this configuration, it is possible to provide a light modulation device that stably holds the light modulation element and efficiently cools it, thereby suppressing deterioration of the light modulation element due to heat over a long period.

[0135] (Supplementary Note 18) A light source device, The light modulation device according to Supplementary Note 17 that modulates the light emitted from the light source device, A projection optical device that projects the light modulated by the light modulation device, A projector characterized by this.

[0136] According to the projector having the configuration of Supplementary Note 18, it is possible to provide a projector with excellent display quality and high efficiency.

Explanation of Reference Numerals

[0137] 1... Projector, 2... Light source device, 5... Projection optical device, 6,100... Liquid crystal device, 40B, 40G, 40R... Light modulation device, 50... Heat diffusion member, 51... Heat receiving part, 52... Heat radiating part, 55... Thermoelectric conversion device, 59... Heat radiating member, 61... Liquid crystal panel, 62, 162... Panel holding member, 70, 270, 370... First bonding layer, 71... Adhesive, 72... First filler, 73... Second filler, 74... Third filler, 80... Second bonding layer, 90... Third bonding layer, 610... Liquid crystal layer, 611... Opposing substrate, 612... Pixel substrate, Lx... Longitudinal axis, P... Pixel pitch.

Claims

1. A liquid crystal panel including a pair of substrates holding a liquid crystal layer, a panel holding member holding the liquid crystal panel, and a first bonding layer bonding the liquid crystal panel to the panel holding member, wherein the first bonding layer includes an adhesive and a plurality of first fillers in a fibrous or long-axis shape having a major axis added to the adhesive, and a thermal conductivity of the first filler is higher than a thermal conductivity of the adhesive. A liquid crystal device characterized by the above.

2. The first bonding layer further includes a granular second filler. The liquid crystal device according to claim 1, characterized by the above.

3. When a linear expansion coefficient of the first bonding layer is αa and a linear expansion coefficient of the panel holding member is αc, αa ≥ αc is satisfied. The liquid crystal device according to claim 1, characterized by the above.

4. The panel holding member is made of ADC12 of an aluminum alloy. The linear expansion coefficient αa of the first bonding layer is 21×E －６ / °C or more, The liquid crystal device according to claim 3, characterized by the above.

5. The panel holding member is made of AZ91 of a magnesium alloy. The linear expansion coefficient αa of the first bonding layer is 27×E －６ / °C or more, The liquid crystal device according to claim 3, characterized by the above.

6. When a pixel pitch of the liquid crystal panel is P, a maximum thickness of the first bonding layer is d, and a change amount of an ambient temperature of the liquid crystal panel is ΔT, αa ≤ 3P / (d·ΔT) is satisfied. The liquid crystal device according to claim 1, characterized by the above.

7. The maximum thickness d of the first bonding layer is 0.4 mm, and the change amount ΔT of the ambient temperature is 30 to 40°C. The liquid crystal device according to claim 6, characterized by the above.

8. The pixel pitch P of the liquid crystal panel is 11.6 μm or less. The linear expansion coefficient αa of the first bonding layer is 290.0×E －６ / °C or less, The liquid crystal device according to claim 7, characterized by the above.

9. The pixel pitch P of the liquid crystal panel is 7.5 μm or less. The linear expansion coefficient αa of the first bonding layer is 187.5×E －６ / °C or less, The liquid crystal device according to claim 8, characterized by the above.

10. A content rate of the plurality of first fillers in the first bonding layer is 5 vol% to 45 vol%. The liquid crystal device according to any one of claims 1 to 9, characterized by the above.

11. The first bonding layer further includes a third filler having a reflectance of 30% or less. The liquid crystal device according to any one of claims 1 to 9, characterized by the above.

12. A heat dissipation member bonded to the liquid crystal panel via a second bonding layer, having a heat receiving portion that receives heat of the liquid crystal panel and a heat radiating portion that radiates heat received by the heat receiving portion. A heat radiating member that is joined to the heat radiating portion of the heat diffusion member via a third joining layer and radiates the heat of the heat diffusion member. The liquid crystal device according to any one of claims 1 to 9, characterized in that.

13. The heat diffusion member is also in contact with the panel holding member. The liquid crystal device according to claim 12, characterized in that.

14. The liquid crystal device further includes a thermoelectric conversion device disposed between the heat radiating portion of the heat diffusion member and the heat radiating member. The thermoelectric conversion device is joined to the heat diffusion member and the heat radiating member via the third joining layer. The liquid crystal device according to claim 12, characterized in that.

15. The second joining layer and the third joining layer each contain the plurality of first fillers. The liquid crystal device according to claim 14, characterized in that.

16. A light source device, The liquid crystal device according to any one of claims 1 to 9 that modulates the light emitted from the light source device, A projection optical device that projects the light modulated by the liquid crystal device. A projector, characterized in that.

17. A light modulation element that modulates incident light as image light, A holding member that holds the light modulation element, A joining layer that joins the light modulation element to the holding member. The joining layer includes an adhesive and a filler in a fibrous shape or a shape having a longitudinal axis added to the adhesive. The thermal conductivity of the filler is higher than the thermal conductivity of the adhesive. A light modulation device, characterized in that.

18. A light source device, The light modulation device according to claim 17 that modulates the light emitted from the light source device, A projection optical device that projects the light modulated by the light modulation device. A projector, characterized in that.

Images