Repair instruction apparatus and repair instruction method

Abstract

To give instructions regarding appropriate plating to a repair target article.SOLUTION: A repair instruction apparatus 1 is provided with: a shape measurement part 10 that determines an additional target shape SP by measuring a shape of a site 21 to be repaired in an object 20 to be repaired; a current distribution prediction part 11 that, by assuming a plating gel material 102 and an electrode 103 to be applied to the site 21 to be repaired, calculates a current distribution in the site 21; a repair design part 12 that, based on the additional target shape SP and the current distribution, determines the shape and position of the gel material 102 and the electrode 103; a repair installation position instruction part 13; and an output part 150 that outputs plating execution conditions SA including the shape of the gel material 102 and the electrode 103, the position of the gel material 102 and the electrode 103, a current value PI, and an energizing time PT.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a repair instruction device and a repair instruction method.

Background Art

[0002] As the background art in this technical field, the following Patent Documents 1 and 2 describe techniques related to gel plating. The descriptions of these documents are incorporated as part of the present specification.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the above-described technology, there is a desire to more appropriately instruct plating on a repair target product, such as optimizing the positions of various repair gels and electrodes for plating on the repair target product. This invention has been made in view of the above circumstances, and an object thereof is to provide a repair instruction device and a repair instruction method capable of instructing appropriate plating on a repair target product.

Means for Solving the Problems

[0005] In order to solve the above problems, the repair instruction device of the present invention includes a shape measurement unit that determines an additional target shape, which is the target shape of the plating to be added to the repaired portion, by measuring the shape of the repaired portion in the product to be repaired; a current distribution prediction unit that calculates the current distribution in the repaired portion based on the distance between the assumed electrode and each part of the repaired portion and the volume resistivity of the assumed gel material, assuming the gel material and the electrode to be applied to the repaired portion; a repair design unit that determines the shapes of the gel material and the electrode based on the additional target shape and the current distribution; a repair installation position instruction unit that determines the positions of the gel material and the electrode based on the additional target shape and the current distribution; a repair condition instruction unit that determines the current value and the energization time of the current supplied to the repaired portion through the electrode based on the additional target shape and the calculated current distribution; and an output unit that outputs the plating construction conditions including the shapes of the gel material and the electrode, the positions of the gel material and the electrode, the current value, and the energization time.

Advantages of the Invention

[0006] According to the present invention, appropriate plating for the product to be repaired can be instructed.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

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Figure 9

Mode for Carrying Out the Invention

[0008] [Overview of the Embodiment] Towards environmental issues and resource conservation, it is desired to extend the lifespan of industrial products and regenerate products through repair technology for waste reduction and resource conservation. Particularly for metal products, when local defects occur due to wear, deformation, corrosion, etc., repair is often necessary. For repair, techniques such as build-up welding where metal is melted and the damaged part is filled, and repair by plating are employed. Build-up welding is widely used, but in parts where particularly precise dimensions are required, it is necessary to consider deformation due to heat, and there is a possibility that the correction work will take a lot of man-hours.

[0009] On the other hand, in plating, the repair amount can be adjusted according to the immersion time in the plating solution, the application conditions and application time of the current, and since the construction temperature is also low, it is possible to repair precise parts without worrying about heat deformation. On the other hand, for local repair, a procedure of masking the target part, applying plating, and then removing the mask is required, which is not desirable in terms of man-hours.

[0010] Therefore, a plating technique that can suppress the frequency of mask use is desired, and gel plating can be a solution to this problem. Gel plating is a technique for performing plating using a gel containing plating components, an electrode for passing an electric current through the gel, and a power source for passing an electric current through the electrode. That is, by attaching a gel that follows the shape of the repair location and has a certain hardness that does not deform much during operation to the repair location, the plating range can be restricted without masking. Also, the repair amount can be adjusted by restricting the plating amount according to the amount of plating components contained in the gel and the thickness of the gel. Further, when performing plating by passing an electric current, it is possible to adjust the repair speed and repair amount by increasing the resistance component according to the thickness of the gel and adjusting the plating speed.

[0011] Applying the technology of Patent Document 1 described above, it is considered that the supply of plating components and the plating speed can be increased using a gel and a plating solution. However, Patent Document 1 does not particularly mention the installation position and installation method of the gel. Also, applying the technology of Patent Document 2, it is considered that it is possible to indicate the plating position and use data by AR (Augmented Reality), but Patent Document 2 does not particularly mention a specific method for determining the position. Therefore, a regulation of an instruction method for performing appropriate plating at an appropriate position is desired. In order to determine an appropriate gel installation position and an appropriate gel shape, it is considered necessary to grasp the shape of the repair position. Therefore, the embodiments described below aim to provide a repair instruction system for determining the film thickness and installation position of gel plating and the plating construction conditions for optimizing the repair of industrial products.

[0012] Among industrial products, metal products deteriorate or lose their functions from the performance at the start of use due to damage or deformation caused by wear, corrosion, etc. The performance can be restored by repairing the damage or deformation that causes the above-mentioned performance degradation. To repair the repaired part, it is preferable to perform the optimal construction at the optimal position. However, in order to provide the optimal repair for the shape of the damage with the minimum man-hours, strict control and time are required, and it often depends on the know-how of engineers. Also, when it takes time to repair the repair parts, it also leads to time loss in manufacturing activities and the like for the part users. Furthermore, if the repair method is not optimized, extra power and plating solution will be consumed during repair, which may also impose a burden on the environment. Therefore, the present inventors have come up with the following embodiments by considering the combination of gel plating for realizing local repair and a system for measuring the current shape in order to optimally process and install the gel.

[0013] [First Embodiment] FIG. 1 is a block diagram of a plating repair system PS according to the first embodiment. The repair system PS includes a repair instruction device 1 (computer) and a plating construction device 60. For example, a repair target product 20, which is a metal product, has a repaired part 21 such as a scratch. More specifically, the repair target product 20 is, for example, a finished product having a sliding part such as a compressor or a rotating machine, a sliding part such as a gear or a cylinder, a metal product placed in a corrosive environment, and the like.

[0014] The plating construction device 60 is a device that performs repair by gel plating on the repair target product 20 by passing an electric current through the repair target product 20 via a gel material 102 for plating and an electrode 103 for plating. The plating construction device 60 performs repair by electroplating and needs to pass an electric current through the electrode 103, the gel material 102, and the repair target product 20.

[0015] Therefore, the plating construction device 60 is provided with an energization device 62. The energization device 62 applies current to the electrode 103, the gel material 102, and the repair target product 20 based on a specified current value PI and energization time PT (details will be described later), thereby plating the repair target product 20.

[0016] In addition, the repair instruction device 1 is a device that gives various instructions to the plating construction device 60 and is equipped with general computer hardware. That is, the repair instruction device 1 includes an arithmetic unit 160, a storage unit 130, a reception unit 140, and an output unit 150.

[0017] The reception unit 140 includes an input device (not shown) such as a keyboard, a mouse, and a touch panel that receives input from the user, and a display or a speaker (not shown) that displays various information to the user. Thus, the reception unit 140 inputs various data to the arithmetic unit 160 based on the user's operations on the input device. The input data includes the mechanical properties, chemical properties, required lifespan, etc. required for the repaired repair target product 20. The output unit 150 outputs the plating construction conditions SA to the plating construction device 60.

[0018] The storage unit 130 stores the data input from the reception unit 140 and also stores an electrochemical database SD, an electrochemical property database SF, and a plating condition database ED. The electrochemical database SD stores the current distribution, etc. when various gel materials 102 and electrodes 103 of various shapes are applied to various repair target products 20 and repaired portions 21 of various shapes. The stored current distribution is obtained from prior simulations or experimental data. The electrochemical property database SF and the plating condition database ED will be described later. The storage unit 130 is a non-temporary or temporary storage medium, such as a ROM (Read Only Memory), a RAM (Random Access Memory), an HDD (Hard Disk Drive), and a flash memory, etc.

[0019] The calculation unit 160 includes a shape measurement unit 10, a current distribution prediction unit 11, a repair design unit 12, a repair installation position indication unit 13, and a repair condition indication unit 14. These components of the calculation unit 160 are functions realized by a program or the like.

[0020] The shape measurement unit 10 measures the repair target location 21 and outputs repair target location information AR representing its shape and position. Further, the shape measurement unit 10 outputs an additional target shape SP, which is the target shape of the plating added to repair the repair target location information AR. In addition, the shape measurement unit 10 measures the shape of the repair target product 20 after the repair target location 21 has been repaired, and also has a function of inspecting whether the processing tolerance of the repair target product 20 is within a predetermined allowable range. For example, when the plating construction device 60 repairs the repair target product 20 so as to be within the range of the processing tolerance at the initial manufacturing of the repair target product 20, the shape measurement unit 10 can determine that the inspection has passed.

[0021] Based on the electrochemical database SD, the current distribution prediction unit 11 assumes the situations such as the shapes and positions of the gel material 102 and the electrode 103, and predicts the current distribution in the assumed situation. That is, the current distribution prediction unit 11 calculates the current distribution in each part of the gel material 102 and the repair target location 21 based on the distance between the assumed electrode 103 and each part of the repair target location 21, and the volume resistivity of the assumed gel material 102.

[0022] When the current distribution predicted by the current distribution prediction unit 11 is appropriate, the repair design unit 12 determines whether the gel material 102 has the physical requirements to support the plating process. Here, the case where the current distribution is "appropriate" means that the variation of the current in each part of the gel material 102 is uniform within a predetermined range. The physical requirements are: · Based on the strength and shear strength of the gel material 102, the gel material 102 can maintain its shape, · The adhesion of the gel material 102 to the repair target location 21 can be ensured, and · The adhesion of the gel material 102 to the electrode 103 can be ensured. is included.

[0023] When the current distribution is appropriate and the gel material 102 satisfies the physical requirements, the repair design unit 12 adopts the assumed shapes of the gel material 102 and the electrode 103 as the shapes of the actually applied gel material 102 and electrode 103. Then, the repair design unit 12 outputs gel shape information GS indicating the shape of the actually applied gel material 102 and electrode shape information ES indicating the shape of the actually applied electrode 103.

[0024] When the current distribution predicted by the current distribution prediction unit 11 is appropriate and the gel material 102 satisfies the above physical requirements, the repair installation position instruction unit 13 adopts the assumed positions of the gel material 102 and the electrode 103 as the positions of the actually applied gel material 102 and electrode 103. Then, the repair installation position instruction unit 13 outputs gel position information GP indicating the installation position of the actually applied gel material 102 and electrode position information EP indicating the installation position of the actually applied electrode 103.

[0025] The repair condition instruction unit 14 outputs a current value PI, an energization time PT, and an additional operation instruction SB (details will be described later) for realizing an appropriate current distribution in the gel material 102. Instead of the current value PI, a voltage value PV (not shown) applied to the electrode 103 may be output.

[0026] Also, in the example of FIG. 2, one gel material 102 and one electrode 103 are provided, but a plurality of them may be provided. When these plurality of gel materials 102 and electrodes 103 are simultaneously applied to the plating process, the repair installation position instruction unit 13 determines the gel position information GP and the electrode position information EP so that mutual interference does not occur among the plurality of gel materials 102 and electrodes 103.

[0027] When a plurality of electrodes 103 are formed, the repair condition instruction unit 14 may output different current values PI (or voltage values PV) and energization times PT for each electrode 103. The plating construction condition SA output by the output unit 150 to the plating construction apparatus 60 includes the above-described respective pieces of information AR, SP, GS, ES, GP, EP, the current value PI (or voltage value PV), the energization time PT, and the additional work instruction SB.

[0028] FIG. 2 is a schematic side view of a repair target article 20 and the like in the first embodiment. As described above, on the repair target article 20, a repaired portion 21 that is a damaged portion recessed in its upper surface has occurred. The above-described shape measurement unit 10 (see FIG. 1) determines an additional target shape SP representing the shape of the portion where plating is to be applied to the repair target article 20. The additional target shape SP is, for example, the portion indicated by the dashed line. In the illustrated example, the additional target shape SP has an upper surface that coincides with the upper surface of the repair target article 20 and fills the repaired portion 21 completely.

[0029] In other words, the additional target shape SP is a shape that fills the repaired portion 21 and smoothes the surface of the repair target article 20. However, the additional target shape SP is not necessarily limited to completely filling the repaired portion 21. For example, as long as there is no problem in terms of the performance of the repair target article 20, an additional target shape SP including some voids CV may be used.

[0030] In this way, the repair instruction device 1 determines the plating construction condition SA including the shape of the gel material 102, the shape of the electrode 103, the energization time, etc., for realizing the additional target shape SP. The plating construction apparatus 60 manufactures the gel material 102 and the electrode 103 based on the plating construction condition SA determined by the repair instruction device 1, and forms an aggregate 120 in which both are integrated. Then, the plating construction apparatus 60 attaches the aggregate 120 to the repair target article 20 and repairs the repair target article 20 by passing an electric current between the two.

[0031] Returning to FIG. 1, the shape measurement unit 10 acquires repair location information AR representing the detailed three-dimensional shape of the repair target location 21 through physical measurements such as optical measurement or stylus measurement, analysis of image data, etc. However, instead of the detailed three-dimensional shape, the depth of the repair target location 21, the width of the opening, the length of the opening, etc. may be used as the repair location information AR. Also, the shape measurement unit 10 may acquire the shape of the repair target product 20 by machine learning or the like based on the image data obtained by photographing the repair target product 20, and use the result as the repair location information AR. That is, the repair location information AR does not necessarily have to be highly accurate, and it is sufficient to be able to output repair location information AR within the range that satisfies the functional requirements of the final product, such as measurement with a feeler gauge and clearance during fitting.

[0032] As described above, the electrochemical database SD stores the current distribution and the like when various gel materials 102 and electrodes 103 of various shapes are applied to various repair target products 20 and repair target locations 21 of various shapes. In other words, the electrochemical database SD stores a plurality of records, and one record includes the combination of the above-described information AR, SP, GS, ES, GP, EP and the corresponding current distribution.

[0033] Although not shown, the information included in one record of the electrochemical database SD is referred to as repair location accumulation information ARB, additional target shape accumulation information SPB, gel shape accumulation information GSB, electrode shape accumulation information ESB, gel position accumulation information GPB, electrode position accumulation information EPB, and current distribution accumulation information CDB.

[0034] The current distribution prediction unit 11 refers to the electrochemical database SD based on the two-dimensional aspect ratio or three-dimensional shape of the repair location information AR and the additional target shape SP. That is, the current distribution prediction unit 11 acquires the various accumulation information described above from the electrochemical database SD based on the repair location information AR and the additional target shape SP. However, generally, there are no repair location accumulation information ARB and additional target shape accumulation information SPB stored in the electrochemical database SD that completely match the repair location information AR and additional target shape SP obtained by measurement.

[0035] Therefore, the accumulated information GSB, ESB, GPB, and EPB in any record generally cannot be directly applied as the gel shape information GS, electrode shape information ES, gel position information GP, and electrode shape information ES. Thus, the repair design unit 12 and the repair installation position instruction unit 13 (see FIG. 1) may determine these pieces of information GS, ES, GP, and EP according to the correlation ratio between the additional target shape SP and the additional target shape accumulated information SPB.

[0036] The electrochemical property database SF (see FIG. 1) stored in the storage unit 130 is a data group representing the plating components of the gel material 102 and the electrochemical properties of the repair target product 20, and includes the following data. · Measurement results of the anodic polarization characteristics, cathodic polarization characteristics, and other electrokinetic polarization characteristics of the gel material 102 · Plating formation results during constant potential and constant current polarization of the gel material 102 · Resistivity of the gel material 102.

[0037] The current distribution prediction unit 11 predicts the current distribution in the gel material 102 based on the electrochemical property database SF and the additional target shape SP. Further, the repair design unit 12 calculates the plating repair amount SPTV, which is the volume of the plating to be added, based on the above-described additional target shape SP. Next, the repair design unit 12 calculates the amount of plating components required to realize the additional target shape SP based on the plating repair amount SPTV. Next, the repair design unit 12 determines the gel shape information GS, such as the thickness of the gel material 102, based on the calculated amount of plating components.

[0038] As an example, in the case of nickel plating, the shape that fills all the repaired part information AR may be set as the additional target shape SP, the amount of nickel required to realize this is calculated, and the thickness of the gel material 102 is determined corresponding to the plating bath components input by the operator. Further, the determined thickness is desirably 3 mm or more in consideration of the possibility that the gel may be deformed by the heat of reaction.

[0039] In addition, the electrochemical property database SF stores data corresponding to various plating components, various bath types, and various thickeners applicable to the gel material 102. For example, when nickel plating is adopted, as the bath type, Watts bath, Wood bath, sulfamic acid bath, etc. can be applied. Also, as the thickener, gelatin, agar, xanthan gum, locust bean gum, etc. can be applied.

[0040] The gel material 102 contains a plating component that satisfies the required parameters such as hardness, corrosion resistance, abrasion resistance, and thermal conductivity of the film after plating. Specifically, the gel material 102 contains plating components such as Cr, Ni, Cu, Ag, Zn, Al, etc. for applying wet plating.

[0041] Furthermore, the gel material 102 contains a gelling agent such as gelatin, agar, locust bean gum, etc., a gel hardness adjuster such as KCl, and an electrolyte component such as Na2SO4 for adjusting conductivity. It is advisable to select a gelling agent that does not have fluidity and maintains its shape at the plating application temperature. However, the gel material 102 does not necessarily need to maintain its shape alone and may be able to maintain its shape in a form that follows the shape and gaps of the electrode 103.

[0042] Also, for the purpose of suppressing hydrogen generation, improving the gel hardener, and improving the embedding property of scratches, it is also possible to add commercially available leveling agents, brightening agents, thiourea, saccharin, etc. to the gel material 102.

[0043] For the electrode 103, an insoluble electrode or a soluble electrode can be applied. In the case of an insoluble electrode, electrochemically stable electrodes such as platinum, platinum-plated titanium, gold, and iridium oxide can be used. In the case of a soluble electrode, for supplying the plating component into the gel material 102, pure metals such as nickel for nickel plating, copper for copper plating, and silver for silver plating can be applied. An alloy may be used, but in that case, it is necessary to consider the physical properties of the repair plating including the elution of alloy elements. Also, the shape of the electrode can be freely selected such as a plate, a foil, a mesh, etc. However, in the case of a mesh, since the current distribution changes according to the mesh shape, it is preferable to collate with the data in the electrochemical database SD.

[0044] The electrode 103, particularly in the case of a soluble electrode, requires a volume equal to or greater than the plating current from the shape and thickness of the electrode. Therefore, the repair design unit 12 may determine the thickness of the electrode 103 according to the energization time based on the calculated plating repair amount SPTV and the electrochemical database SD.

[0045] The repair condition instruction unit 14 calculates the charge amount for reducing and depositing the amount of the plating component for realizing the additional target shape SP based on the gel shape information GS and the electrode shape information ES. Next, the repair condition instruction unit 14 determines and outputs the current value PI and the energization time PT in consideration of the plating inhibition factors stored in the electrochemical database SD and the electrochemical property database SF, and the heat generation due to the electrical resistance, etc. for the calculated charge amount. Note that the plating inhibition factors include the plating current efficiency and the amount of hydrogen gas generated by electrolysis.

[0046] Figure 3 is a schematic diagram showing the operation of the repair condition instruction unit 14. As described above, the shape measurement unit 10 outputs the additional target shape SP, and the repair design unit 12 outputs the plating repair amount SPTV representing the volume of the plating to be added. Further, the user determines the plating bath type EB in consideration of the physical properties and usage environment of the repair target product 20 and inputs it from the reception unit 140. The repair condition instruction unit 14 calculates the amount of charge required when using the plating bath type EB. Then, according to the amount of charge, it determines and outputs the current value PI and the energization time PT. Here, depending on the plating bath type EB, when gelling, gas may stay at the interface between the gel material 102 and the repair target product 20, and plating defects may occur.

[0047] Also, depending on the type of thickener used in the gel material 102, when the current value is large, deformation and dissolution may occur due to resistance heating with the increase in the gel temperature. As a countermeasure, it is conceivable to reduce the current value PI. However, it is not desirable for the energization time PT to become excessively long. Thus, the repair condition instruction unit 14 determines the current value PI and the energization time PT so as to suppress hydrogen generation and gel deformation.

[0048] In addition, data such as the amount of hydrogen generation and the amount of heat generation during plating are stored in the plating condition database ED stored in the storage unit 130 (see FIG. 1). The plating condition database ED may be constructed based on the construction records during actual plating implementation, the data of sample tests for realizing the additional target shape SP by plating, the physical property measurement results of the gel material 102, and the like.

[0049] The repair condition instruction unit 14 determines the current value PI and the energization time PT that minimize hydrogen generation and thermal deformation of the gel material 102 and shorten the plating time by referring to the plating condition database ED. Here, it is desirable that the plating process can be completed in a single plating operation. However, depending on the additional target shape SP, the plating may not be sufficient in a single gel plating operation. For example, gas may accumulate between the gel material 102 and the repair target location 21, or the gel material 102 may be deformed depending on its temperature. In such cases, it is preferable to perform additional operations such as replacing the gel material 102, moving the gel material 102 to vent the gas at the interface, or cooling the gel material 102. The necessity of these additional operations depends on the additional target shape SP and the plating repair amount SPTV. Therefore, the repair condition instruction unit 14 outputs an additional operation instruction SB when such additional operations are required. In this way, in the present embodiment, in order to enable optimization of the plating conditions, it is also possible to optimize the processing time of the plating. Also, for the user of the repaired part, the time loss due to part defects can be reduced by shortening the repair time. Furthermore, optimization of the plating conditions enables reduction of the environmental load without consuming extra power.

[0050] 〈Operation of the First Embodiment〉 Next, the operation of the present embodiment will be described. FIG. 4 is a flowchart of a repair instruction routine executed by the repair instruction device 1 of the first embodiment. When the process starts in FIG. 4, the processes of steps S2 and S4 are executed in parallel. First, in step S2, the shape measurement unit 10 measures the shapes of the repair target product 20 and the repair target location 21, and the shape measurement unit 10 outputs the repair target location information AR, which is the result, and the additional target shape SP. At the same time, in step S4, the user inputs a gel component having physical properties suitable for the repair target product 20, a plating bath type EB, etc. via the reception unit 140. The physical properties at this time indicate physical properties such as hardness and wear resistance, and chemical properties such as corrosion resistance. The physical properties are related to the product life and product performance.

[0051] Next, when the process proceeds to step S6, the repair design unit 12 performs a gel shape determination process. That is, the repair design unit 12 queries the electrochemical database SD based on the output shape data. Based on the query result, the repair design unit 12 determines the shape of the gel material 102 that is optimal for realizing the added target shape SP, i.e., the gel shape information GS.

[0052] Next, when the process proceeds to step S8, the repair installation position instruction unit 13 performs a gel installation position determination process. That is, the repair design unit 12 determines gel position information GP, which is the installation position of the gel material 102, so that the additional target shape SP can be realized based on the current distribution of each part.

[0053] 2, the additional target shape SP does not necessarily have to be a shape that fills the entire area to be repaired 21, and may have voids CV formed therein. In other words, as long as the functional requirements and durability, such as the strength, of the item to be repaired 20 are satisfied, the additional target shape SP may be determined to include voids CV therein.

[0054] When the additional target shape SP includes a void CV, it is advisable to determine the gel shape information GS and the gel position information GP so as to use a smaller amount of gel material 102 than would be required to completely fill the repaired portion 21. In other words, at this time, conditions such as "functional requirements required of the item to be repaired 20 are satisfied" and "adhesion between the item to be repaired 20 and the plating is high, and damage such as peeling does not occur" are satisfied.

[0055] The functional requirements required when repairing the part to be repaired 21 refer to physical or chemical properties that can withstand use during the expected lifespan of the item to be repaired 20 or the period of use of the item to be repaired 20 before repair. For example, when repairing the sliding part of the item to be repaired 20, even if a void CV (see FIG. 2) exists in the additional target shape SP, it is sufficient that the upper part does not deform and can operate until the next inspection or until the designed product lifespan.

[0056] Therefore, the repair instruction device 1 determines the plating film thickness considering the hardness that does not damage the mating material (not shown) of the repair target product 20 and the wear amount of the repair target product 20 corresponding to the product life (when the own machine wears), and reflects it in the current value PI and the energization time PT. Thereby, the output unit 150 commands the plating construction device 60 with the plating construction conditions SA including such a current value PI and an energization time PT.

[0057] For the actual processing and installation of the gel material 102, direct application to the repair target product 20 by a dispenser (not shown) can be adopted. At this time, the gel material 102 processed into the shape determined by the gel shape information GS may be attached to the position specified by the gel position information GP. At this time, if there are necessary peripheral devices such as cooling and position fixing, they may be installed around the gel material 102.

[0058] Next, when the process proceeds to step S10, the above-described repair design unit 12 determines the shape of the electrode 103 and outputs the result as electrode shape information ES. The electrode shape information ES is restricted by the gel shape information GS. The repair design unit 12 determines the shape of the electrode 103 so as to realize a desired current distribution. The gel shape information GS includes the distance between the electrode 103 and the repair target product 20, the shape of the electrode 103, and the like. Also, at this time, the electrode 103 is arranged outside the gel material 102 as the energization point.

[0059] When priority is given to realizing the current distribution with respect to the electrode position information EP, the amount of plating components in the gel material 102 between the electrode 103 and the item to be repaired 20 may be insufficient to realize the additional target shape SP. In such a case, it is possible to use the electrode 103 as a soluble electrode to supply the necessary ions. Also, instead of being between the item to be repaired 20 and the electrode 103, the gel material 102 may be placed on the opposite side of the electrode 103 for replenishing the plating components. The size of the gel material 102 required for plating in this case is limited by the gel shape information GS determined in step S6. Also, the shape of the electrode 103 when the gel material 102 for replenishing the plating components is desirably a mesh-like or sponge-like shape so that the gel material 102 is continuous and does not hinder ion diffusion.

[0060] It is desirable that the electrode 103 has a shape that follows the shape of the repair object 20. For example, in order for the electrode 103 to sufficiently follow the curved surface, it is desirable that the electrode 103 be as thin as possible while maintaining the strength to support the weight of the gel material 102.

[0061] Next, when the process proceeds to step S12, the repair installation position indication unit 13 determines and outputs the electrode position information EP. The electrode position information EP is also constrained by the gel position information GP, similar to the electrode shape information ES. The repair installation position indication unit 13 determines the electrode position information EP for the additional target shape SP so that the current is basically uniform.

[0062] On the other hand, there may be cases where localized repair is required for the additional target shape SP, such as when the bottom of the additional target shape SP has an acute angle. In such cases, the electrode 103 is placed at a position where the outermost surface of the final repair shape is smooth and the inside is repaired to the extent that the performance or life required of the repair target 20 is satisfied.

[0063] Next, when the process proceeds to step S14, the repair condition instruction unit 14 determines the current conditions, that is, the current value PI and the energization time PT. At this time, the repair condition instruction unit 14 determines the current value PI and the energization time PT that can sufficiently realize the additional target shape SP corresponding to the gel shape information GS, the gel position information GP, the electrode shape information ES, and the electrode position information EP.

[0064] When making the determination, the current value PI and the energization time PT that can sufficiently perform plating repair up to the plating repair amount SPTV are selected using the physical properties of the gel material 102 and the hydrogen generation amount recorded in the plating condition database ED. If it is considered that this condition cannot be achieved at normal temperature, measures other than electrical measures may be taken, such as heating the gel material 102 and the object to be repaired 20 to raise the temperature.

[0065] Next, when the process proceeds to step S16, the repair condition instruction unit 14 performs an additional work determination process. First, the repair condition instruction unit 14 determines the necessity of additional work. Here, when it is determined that additional work is unnecessary, step S16 immediately ends. On the other hand, when it is determined that additional work is necessary, the repair condition instruction unit 14 outputs an additional work instruction SB. For example, the repair condition instruction unit 14 outputs an additional work instruction SB when the target plating repair amount SPTV cannot be achieved in a single plating operation.

[0066] The repair work using the gel material 102 is different from normal wet plating in that hydrogen gas may stay at the interface between the gel material 102 and the object to be repaired 20. Due to the retention of hydrogen gas, when the electrical contact between the gel material 102 and the object to be repaired 20 is interrupted, the plating reaction stops. This is because the diffusion amount of hydrogen gas into the gel material 102 is small. However, hydrogen gas can be physically released.

[0067] Also, when the heat generation from the gel material 102 is large, it may interfere with the plating process due to the heat generation. Therefore, the additional operation instruction SB instructs additional operations to release heat and gas, such as replacing the gel material 102 when it is predicted that a predetermined amount of hydrogen gas will remain, or when it is predicted that the temperature of the gel material 102 will reach a predetermined temperature, or sliding the gel material 102 and the repair target product 20.

[0068] Next, when the process proceeds to step S18, a repair permission input screen 50 (see FIG. 5) is displayed on the display of the reception unit 140, and it is determined on this screen whether or not the user has permitted the repair. Here, if it is determined as "No", the process returns to step S4. As a result, when the user changes the gel component, the plating bath type EB, etc., the processes of steps S4 to S18 are repeated based on the new gel component, plating bath type EB, etc.

[0069] On the other hand, in step S18, if it is determined as "Yes", the process proceeds to step S20 and the plating application process is executed. That is, the repair instruction device 1 outputs plating application conditions SA to the plating application device 60 via the output unit 150 and commands the execution of plating. As a result, plating is applied to the repair target product 20 in the plating application device 60. Thus, the processing of this routine ends.

[0070] FIG. 5 is a diagram showing an example of the repair permission input screen 50 displayed on the reception unit 140. The repair permission input screen 50 includes a repair assumed diagram display unit 52, a plating application condition display unit 53, a Yes button 56, and a No button 57. The repair assumed diagram display unit 52 displays a schematic diagram of the gel material 102, the electrode 103, and the repair target product 20 shown in FIG. 2.

[0071] The plating construction condition display unit 53 displays the content of the plating construction condition SA. When the user approves the content shown in the repair assumed drawing display unit 52 and the plating construction condition display unit 53, the user clicks the Yes button 56. Thereby, as described in step S20 of FIG. 4, the plating construction process is executed by the plating construction apparatus 60.

[0072] On the other hand, when the user does not approve the content shown in the repair assumed drawing display unit 52 and the plating construction condition display unit 53, the user clicks the No button 57. Thereby, as described with respect to FIG. 4, the processes after step S4 are re-executed.

[0073] [Second Embodiment] Next, the second embodiment will be described. The configuration of the second embodiment is the same as that of the first embodiment (see FIGS. 1 and 3). FIG. 6 is a schematic side view of the repair target product 20 and the like in the second embodiment. In FIG. 6, a stepped repaired portion 21 is formed at the corner of the repair target product 20. The additional target shape SP2 has a complex shape that fills the stepped repaired portion 21 and regenerates the corner. For such an additional target shape SP2, a single plating process may not be sufficient for repair, and multiple plating processes may be required to achieve the repair.

[0074] Also, as shown in FIG. 6, when the additional target shape SP2 is located at the end of the repair target product 20, it may be difficult to fix the installation positions of the gel material 102 and the electrode 103. That is, when the gel material 102 attempts to realize an additional target shape SP2 with a complex shape in a single plating, the assumed gel shape and installation position may not be maintained during the operation, and appropriate repair may not be achievable. For this reason, multiple repairs are required regardless of the generation of hydrogen gas. Therefore, in some cases, it may be preferable to divide the shape related to the additional target shape SP2 into a plurality of shapes that can be sufficiently repaired at once, and determine the shape and installation position of the gel material and the electrode for each of the divided additional target shapes SP2.

[0075] FIG. 7 is another schematic side view of the repair target 20 etc. in the second embodiment. In this embodiment, when it is determined that it is difficult to realize the additional target shape SP2 obtained by measuring the repaired portion 21 with one plating run, the shape related to the additional target shape SP2 is divided into a plurality of shapes. For example, as shown in the figure, the additional target shape SP2 is divided into a plurality of partial target shapes SP2-1, SP2-2. Then, gel materials 102-1, 102-2 and electrodes 103-1, 103-2 are formed corresponding to the partial target shapes SP2-1, SP2-2, respectively.

[0076] Then, the plating application device 60 performs plating processes on the repair target 20 multiple times so as to sequentially realize the partial target shapes SP2-1, SP2-2. At this time, the multiple gel materials and electrodes do not need to be placed at the same time. In the example of Fig. 7, the gel material 102-1 and the electrode 103-1 may be placed first and plating processes may be performed, and then the gel material 102-2 and the electrode 103-2 may be placed and plating processes may be performed.

[0077] In other words, the repair installation position instruction unit 13 in this embodiment determines a multi-stage process so that different gel materials 102-1, 102-2 and electrodes 103-1, 103-2 are arranged for each stage. In particular, when a large repair is required at a predetermined location of the repair target area 21, the shapes and positions of the gel materials 102-1, 102-2 and electrodes 103-1, 103-2 may be determined so as to concentrate the current at the predetermined location.

[0078] FIG. 8 is a schematic side view of the repair target 20 in the second embodiment during repair. Assume that plating treatment is performed on the product 20 to be repaired by the gel material 102-1 and the electrode 103-1 shown in FIG. 7, and as a result, the repaired portion TP shown in FIG. 8 is formed. Thereafter, the gel material 102-2 and the electrode 103-2 may be arranged to perform plating treatment corresponding to the partial target shape SP2-2. In the example of FIG. 8, the posture of the product 20 to be repaired is not changed when only the gel material 102-2 is installed after forming the repaired portion TP, but the posture and installation method of the product 20 to be repaired may be changed so that the installation of the gel material 102-2 is stabilized. Further, the state of the repaired portion TP may be re-measured, and the shape and installation method of the gel material 102-2 may be determined based on the re-measurement result.

[0079] FIG. 9 is a flowchart of a repair instruction routine executed by the repair instruction device 1 of the second embodiment. When the process starts in FIG. 9, the processes of steps S2 and S4 are executed in parallel. The contents of these processes are the same as those of the first embodiment (see FIG. 4). That is, in step S2, the shape measurement unit 10 outputs the information AR of the portion to be repaired and the additional target shape SP2, and in step S4, the user inputs the gel component, the plating bath type EB, etc.

[0080] Next, in steps S6 to S12, for example, for the gel material 102 and the electrode 103 shown in FIG. 6, the same processes as those in the first embodiment are executed. That is, for the gel material 102, in step S6, the repair design unit 12 determines the gel shape information GS, and in step S8, the repair installation position instruction unit 13 determines the gel position information GP. Also, for the electrode 103, in step S10, the repair design unit 12 determines the electrode shape information ES, and in step S12, the repair installation position instruction unit 13 determines the electrode position information EP.

[0081] Next, when the process proceeds to step S13, the calculation unit 160 determines whether the product 20 to be repaired can be sufficiently repaired by one plating treatment, that is, whether the content of the additional target shape SP2 can be sufficiently realized.

[0082] More specifically, in step S13, the arithmetic unit 160 refers to the jelly strength and shear strength to check whether the gel material 102 can sufficiently follow the additional target shape SP2 and whether the gel material 102 is damaged. Also, even when the gel material 102 can follow the additional target shape SP2, the adhesion between the gel material 102 and the electrode 103 may not be ensured and separation may occur. In step S13, it is also checked whether such separation occurs.

[0083] For example, in the state of FIG. 6, when the arithmetic unit 160 determines that damage to the gel material 102, separation between the gel material 102 and the electrode 103, etc. are within the allowable range, it is determined as "Yes" in step S13, and the process proceeds to step S14. In this case, the processes of steps S14 to S20 are executed in the same manner as in the first embodiment. Therefore, when it is determined as "Yes" in step S18 (when execution is permitted), the plating application device 60 applies plating to the repair target product 20 using the gel material 102 and the electrode 103 (see FIG. 6) in the same manner as in the first embodiment.

[0084] On the other hand, when it is determined as "No" in step S13, the process proceeds to step S36, and the repair design unit 12 performs gel shape determination processing. Here, first, the repair design unit 12 divides the additional target shape SP2 into a plurality of partial target shapes. For example, the additional target shape SP2 is divided into the partial target shapes SP2-1 and SP2-2 shown in FIG. 7.

[0085] At this time, the repair design unit 12 makes the same determination as in step S13 described above regarding whether each partial target shape is achievable, and determines the achievable ones as the partial target shapes to be adopted. Next, the repair design unit 12 determines the gel shape information GS corresponding to the plurality of partial target shapes. For example, when adopting the partial target shapes SP2-1 and SP2-2 shown in FIG. 7, the gel shape information GS may include partial gel shape information GS-1 and GS-2 (not shown) that specify the shapes of the gel materials 102-1 and 102-2.

[0086] Next, when the process proceeds to step S38, the repair installation position indicator 13 determines the gel position information GP corresponding to the plurality of partial target shapes. In the example shown in FIG. 7, the gel position information GP may include the partial gel position information GP-1, GP-2 (not shown) of the gel materials 102-1, 102-2. Also, as described above, when applying the gel material 102-2 after applying the gel material 102-1, the posture of the repair target product 20 may be changed.

[0087] Next, when the process proceeds to step S40, the repair design unit 12 determines and outputs the electrode shape information ES regarding the plurality of electrodes corresponding to the plurality of gel materials. In the example shown in FIG. 7, the electrode shape information ES may include the partial electrode shape information ES-1, ES-2 (not shown) which are the shapes of the corresponding electrodes 103-1, 103-2 for the gel materials 102-1, 102-2 individually.

[0088] The shapes of the electrodes 103-1, 103-2 are restricted by the shapes of the gel materials 102-1, 102-2, but when the following partial current values PI-1, PI-2 (not shown) and partial energization times PT-1, PT-2 (not shown) match, the electrodes 103-1, 103-2 may be integrated.

[0089] Next, when the process proceeds to step S42, the repair installation position indicator 13 determines the electrode position information EP that designates the shapes of the plurality of electrodes. In the example shown in FIG. 7, the electrode position information EP may include the partial electrode position information EP-1, EP-2 (not shown) that designates the shapes of the electrodes 103-1, 103-2.

[0090] If there is a possibility of interference with the electrodes 103-1, 103-2 in the electrode position information EP-1, EP-2, the plating process may be divided. That is, as described above, first, the gel material 102-1 and the electrode 103-1 are arranged and the plating process is performed, and then the gel material 102-2 and the electrode 103-2 are arranged and the plating process is performed.

[0091] Next, when the process proceeds to step S44, the repair condition instruction unit 14 determines current conditions, that is, a current value PI and a conduction time PT, so as to perform plating processes a plurality of times corresponding to the plurality of electrodes. In the example shown in FIG. 7, the current value PI may include partial current values PI-1 and PI-2 that specify the currents supplied to the respective electrodes 103-1 and 103-2. Also, the conduction time PT may include partial conduction times PT-1 and PT-2 that specify the conduction times of the respective electrodes 103-1 and 103-2.

[0092] Next, when the process proceeds to step S46, the repair condition instruction unit 14 performs an additional work determination process. First, the repair condition instruction unit 14 determines whether additional work is necessary. Here, when it is determined that additional work is unnecessary, step S46 immediately ends. On the other hand, when it is determined that additional work is necessary, the repair condition instruction unit 14 outputs an additional work instruction SB. For example, the repair condition instruction unit 14 outputs an additional work instruction SB when the target plating repair amount SPTV cannot be achieved in a single plating operation.

[0093] Similar to the case of the first embodiment, the additional work instruction SB instructs an additional process such as releasing hydrogen when it is difficult to achieve plating up to the target film thickness. However, the execution timing of the additional process corresponding to the partial target shapes SP2-1 and SP2-2 does not necessarily belong to the plating process period of the partial target shapes SP2-1 and SP2-2. For example, when installing the gel material 102-2 corresponding to the partial target shape SP2-2 after performing the plating process corresponding to the partial target shape SP2-1, the additional process corresponding to the partial target shape SP2-2 may be executed.

[0094] [Modification Example] The present invention is not limited to the above-described embodiments, and various modifications are possible. The above-described embodiments are exemplified for easy understanding and explanation of the present invention, and are not necessarily limited to those having all the configurations described. Also, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Further, a part of the configuration of each embodiment can be deleted, or other configurations can be added or replaced. Also, the control lines and information lines shown in the figures indicate those considered necessary for explanation, and do not necessarily show all the control lines and information lines required on the product. In fact, it may be considered that almost all the configurations are interconnected. Possible modifications to the above embodiments are, for example, as follows.

[0095] (1) Since the hardware of the repair instruction device 1 in the above embodiment can be realized by a general computer, the flowchart shown in FIG. 4 or FIG. 9, and other programs for executing various processes described above can be stored in a storage medium (a computer-readable recording medium recording the program), or distributed via a transmission path.

[0096] (2) The processes shown in FIG. 4 or FIG. 9, and other processes described above were described as software processes using a program in the above embodiment, but a part or all of them may be replaced with hardware processes using an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array), etc.

[0097] (3) The data in the storage unit 130, such as the electrochemistry database SD, may be placed in a cloud on the network (not shown), etc., and may not be included in the repair instruction device 1.

[0098] (4) The repair instruction device 30 may be used not only for repair after use of the product to be repaired 20, but also for correcting products that deviate from the processing tolerance during initial manufacturing and become manufacturing defects. At this time, the determination of the repair amount may be made by referring to the functional requirements required for the product to be repaired 20 and the manufacturing drawing information.

[0099] [Effects of the Embodiment] As described above, according to the above-described embodiment, the repair instruction device 1 assumes the plating gel material 102 and the electrode 103 to be applied to the repair location 21, and based on the distance between the assumed electrode 103 and each part of the repair location 21, and the volume resistivity of the assumed gel material 102, a current distribution prediction unit 11 that calculates the current distribution at the repair location 21, an additional target shape SP, a repair design unit 12 that determines the shapes of the gel material 102 and the electrode 103 based on the current distribution, an additional target shape SP, a repair installation position instruction unit 13 that determines the positions of the gel material 102 and the electrode 103 based on the current distribution, and an additional target shape SP, and based on the calculated current distribution, a repair condition instruction unit 14 that determines the current value PI and the energization time PT of the current supplied to the repair location 21 via the electrode 103.

[0100] Thereby, since the shapes and positions of the gel material 102 and the electrode 103 can be determined based on the predicted current distribution, appropriate plating for the product to be repaired can be instructed. Also, since the shape and installation position of the gel material 102 and / or the current value flowing through the gel material 102 via the electrode 103 can be calculated based on the measured shape, appropriate plating corresponding to the additional target shape SP can be instructed.

[0101] Further, it is more preferable that the current distribution prediction unit 11 calculates the current distribution at the repair location 21 based on an electrochemical database SD that stores a plurality of records corresponding to the combination of the repair location 21, the gel material 102, the electrode 103, and the current distribution. Thereby, more appropriate plating for the product to be repaired can be instructed based on the results stored in the electrochemical database SD.

[0102] Furthermore, it is more preferable that the repair design unit 12 determines the shape of the gel material 102 based on the strength of the gel material 102 and the shear strength of the gel material 102. Thereby, the shape of the gel material 102 corresponding to the strength and the shear strength of the gel material 102 can be determined.

[0103] Furthermore, it is more preferable that the repair design unit 12 determines the shape of the gel material 102 based on the adhesion of the gel material 102 to the repair target portion 21 and the adhesion of the gel material 102 to the electrode 103. Thereby, the shape of the gel material 102 corresponding to the adhesion of the gel material 102 to the repair target portion 21 and the adhesion of the gel material 102 to the electrode 103 can be determined.

[0104] Furthermore, a plurality of gel materials 102 and a plurality of electrodes 103 are provided respectively, and it is more preferable that the repair installation position indication unit 13 determines the positions of the plurality of gel materials 102 and the plurality of electrodes 103 so that no interference occurs between them. Thereby, the plating process can be executed simultaneously using the plurality of gel materials 102 and electrodes 103.

[0105] Furthermore, it is more preferable that the shape measurement unit 10 determines the additional target shape SP including the internal void CV according to the functional requirements or durability required for the repair target product 20. Thereby, the plating process time can be shortened and the required amounts of the gel material 102 and the electrode 103 can be reduced.

[0106] Furthermore, it is more preferable that the repair condition indication unit 14 outputs an additional operation instruction SB for moving the gel material 102 to release the gas released from the gel material 102 during the plating process, or to cool the gel material 102, or to release heat. Thereby, it is possible to suppress poor electrical conduction due to the generated gas and deformation of the gel material 102 due to heat.

[0107] Furthermore, the repair target portion 21 is a recess formed on the surface of the repair target product 20, and it is more preferable that the shape measurement unit 10 determines the additional target shape SP so as to smooth the surface of the repair target product 20 by filling the repair target portion 21 with plating. Thereby, the surface of the repair target product 20 can be smoothed.

[0108] Further, it is more preferable that the repair design unit 12 and the repair installation position indicating unit 13 determine the shapes and positions of the gel material 102 and the electrodes 103 so that the current distribution in the gel material 102 is made uniform. Thereby, the current distribution in the gel material 102 can be made uniform, and more appropriate plating can be indicated.

[0109] Also, a plurality of gel materials 102-1, 102-2 and electrodes 103-1, 103-2 are provided respectively, and it is more preferable that the repair installation position indicating unit 13 determines a multi-stage process so as to arrange different gel materials 102-1, 102-2 and electrodes 103-1, 103-2 at each stage in order to concentrate current at a predetermined location of the repair target location 21. Thereby, even when the repair target location 21 is formed at a corner or the like of the repair target product 20, appropriate plating can be indicated.

[0110] Also, it is more preferable that the repair installation position indicating unit 13 varies the posture of the repair target product 20 at each stage. Thereby, an appropriate posture can be imparted to the repair target product 20 at each stage.

[0111] Further, it is more preferable that the shape measurement unit 10 further has a function of inspecting whether or not the machining error of the repair target product 20 is within a predetermined allowable range. Thereby, the inspection of the repair target product 20 can be appropriately performed.

[0112] Also, according to another aspect, the repair instruction device 1 outputs the shape position and installation position of the gel material 102 that realizes the target plating to be applied to the repair target product 20, the shape position and installation position of the electrodes 103, and the plating construction conditions SA that realize the repair of the repair target product 20 based on the measured shape that is the result of measuring the shape of the repair target product 20 having the additional target shape SP. Thereby, appropriate plating with respect to the additional target shape SP can be indicated.

[0113] Furthermore, it is more preferable that the gel material 102 and the electrode 103 are integrated and are energized in contact with the article 20 to be repaired. Thereby, the gel material 102 and the electrode 103 can be handled as an integral aggregate.

[0114] Moreover, it is more preferable that the electrode 103 includes a thin metal plate, a metal mesh, etc. that can follow the additional target shape SP. Thereby, the shape of the electrode 103 can be easily processed into a shape corresponding to the additional target shape SP.

Explanation of Reference Numerals

[0115] 1 Repair instruction device (computer) 10 Shape measurement unit 11 Current distribution prediction unit 12 Repair design unit 13 Repair installation position indication unit 14 Repair condition indication unit 20 Article to be repaired 21 Portion to be repaired 102, 102-1, 102-2 Gel material 103, 103-1, 103-2 Electrode 150 Output unit CV Void PI Current value PT Energization time SA Plating construction conditions SB Additional work instruction SD Electrochemical database SP Additional target shape

Claims

1. a shape measuring unit that measures a shape of a portion to be repaired in a repair target product to determine an additional target shape that is a target shape of plating to be added to the portion to be repaired; a current distribution prediction unit that assumes a gel material and an electrode for plating to be applied to the repaired portion, and calculates a current distribution in the repaired portion based on the assumed distance between the electrode and each portion of the repaired portion and the assumed volume resistivity of the gel material; A repair design unit that determines shapes of the gel material and the electrodes based on the additional target shape and the current distribution; a repair installation position indication unit that determines positions of the gel material and the electrodes based on the additional target shape and the current distribution; a repair condition specifying unit that determines a current value and a current application time of a current to be supplied to the portion to be repaired via the electrodes based on the additional target shape and the calculated current distribution; and an output unit that outputs plating conditions including the shapes of the gel material and the electrodes, the positions of the gel material and the electrodes, the current value, and the current application time. A repair instruction device comprising:

2. The current distribution prediction unit calculates the current distribution in the repaired portion based on an electrochemical database that stores a plurality of records corresponding to combinations of the repaired portion, the gel material, the electrodes, and the current distribution.

2. The repair instruction device according to claim 1.

3. The repair design department The shape of the gel material is determined based on the strength of the gel material and the shear strength of the gel material.

2. The repair instruction device according to claim 1.

4. The repair design department A shape of the gel material is determined based on adhesion of the gel material to the repaired portion and adhesion of the gel material to the electrode.

2. The repair instruction device according to claim 1.

5. The gel material and the electrode are each provided in a plurality of pieces, The repair installation position instruction unit determines positions of the gel materials and the electrodes so as not to cause mutual interference.

2. The repair instruction device according to claim 1.

6. The shape measurement unit determines the additional target shape including a void therein according to a functional requirement or durability required for the repair object.

2. The repair instruction device according to claim 1.

7. The repair condition instruction unit outputs an additional operation instruction to move the gel material to release the gas released from the gel material during the plating process, or to cool the gel material, or to release heat. The repair instruction device according to claim 1, characterized in that.

8. The repair target portion is a recess formed on the surface of the repair target product, The shape measurement unit determines the additional target shape so as to smooth the surface of the repair target product by filling the repair target portion with plating. The repair instruction device according to claim 1, characterized in that.

9. The repair design unit and the repair installation position instruction unit determine the shapes and positions of the gel material and the electrodes so that the current distribution in the gel material is uniformized. The repair instruction device according to claim 1, characterized in that.

10. A plurality of the gel materials and the electrodes are provided respectively, The repair installation position instruction unit determines a multi-step process so as to arrange the different gel materials and electrodes at each step in order to concentrate the current at a predetermined location of the repair target portion. The repair instruction device according to claim 1, characterized in that.

11. The repair installation position instruction unit varies the posture of the repair target product at each step. The repair instruction device according to claim 10, characterized in that.

12. The shape measurement unit further has a function of inspecting whether the machining error of the repair target product is within a predetermined allowable range. The repair instruction device according to claim 1, characterized in that.

13. A shape measurement process for determining an additional target shape, which is the target shape of the plating to be added to the repair target portion, by measuring the shape of the repair target portion in the repair target product; An electric current distribution prediction process for calculating the electric current distribution at the repair target portion based on the distance between the assumed electrode and each part of the repair target portion and the volume resistivity of the assumed gel material, assuming the gel material and electrode for plating to be applied to the repair target portion; A repair design process for determining the shapes of the gel material and the electrodes based on the additional target shape and the electric current distribution; A repair installation position instruction process for determining the positions of the gel material and the electrodes based on the additional target shape and the electric current distribution; A repair condition instruction process for determining the current value and the energization time of the current supplied to the repair target portion through the electrode based on the additional target shape and the calculated electric current distribution. Causing a computer to execute an output process of outputting plating construction conditions including the shapes of the gel material and the electrode, the positions of the gel material and the electrode, the current value, and the energization time A repair instruction method characterized by the above.

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