Electronic appliance

Abstract

To provide an electronic appliance in which the decrease in insulating performance of a multilayer substrate is suppressed.SOLUTION: In an electronic appliance according to the present invention, a power semiconductor module and an electronic substrate are stacked on a housing in this order, and the power semiconductor module and the electronic substrate are connected to each other by a floating connector. A columnar support is installed at an edge part of the power semiconductor module. The power semiconductor module is fixed to the housing by a fixing member that penetrates the edge part and the columnar support. A spring member provided at the columnar support is in contact with an edge part of the electronic substrate and presses in a direction to the housing. A terminal of the floating connector includes a spring structure and the electronic substrate is pressed in a direction opposite to the housing. Thus, the excess stress is not applied to the multilayer substrate and the decrease in insulating performance can be suppressed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device such as a power conversion device used in a vehicle.

Background Art

[0002] Electronic devices such as power conversion devices used in electric vehicles are required to have vibration resistance against vibrations received from the road surface during driving and vibrations from engines and motors, and to be miniaturized in order to secure space in the vehicle interior.

[0003] Patent Document 1 describes that by embedding the bus bar of the power conversion device in a resin sealing material, it is possible to suppress a decrease in vibration resistance while reducing the number of parts.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in a high-voltage circuit board such as a drive circuit board of an inverter, in order to achieve both ensuring a creepage distance that can withstand a high voltage and a pattern width that can withstand a large current, and miniaturization, a multilayer substrate in which a conductive foil and an insulating layer are alternately laminated is used. If excessive stress is applied to this multilayer substrate, the layer structure may be damaged and the insulation performance may deteriorate, such as a short circuit between layers.

[0006] The present invention has been made in view of such problems of the prior art, and an object thereof is to provide an electronic device that suppresses a decrease in the insulation performance of a multilayer substrate.

Means for Solving the Problems

[0007] As a result of intensive studies to achieve the above object, the present inventor has found that the above object can be achieved by holding the multilayer substrate with a spring, and has completed the present invention.

[0008] That is, in the electronic device of the present invention, a power semiconductor module and an electronic substrate are stacked and arranged on a housing in this order, and the power semiconductor module and the electronic substrate are connected by a floating connector. And a support column is provided at an edge of the power semiconductor module, the power semiconductor module is fixed to the housing by a fixing member penetrating through the edge and the support column, and a spring member provided on the support column abuts against an edge of the electronic substrate and presses in the housing direction, and terminals of the floating connector have a spring structure and press the electronic substrate in a direction opposite to the housing.

Advantages of the Invention

[0009] According to the present invention, since the multilayer substrate is held by the elastic force of the spring, it is possible to provide an electronic device that suppresses a decrease in the insulation performance of the multilayer substrate.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0011] The electronic device of the present invention will be described in detail. The electronic device 1 of the present invention includes a power semiconductor module 3 and an electronic substrate 4. As shown in FIG. 1, these are arranged in a state where the power semiconductor module and the electronic substrate overlap in parallel, and are electrically connected by a floating connector 8 provided therebetween.

[0012] A support column 5 is arranged on the opposing edge portion 31 of the power semiconductor module. The power semiconductor module 3 and the support column 5 are fixed to the housing 4 by a fixing member 7 such as a screw that penetrates the support column 5 and the edge portion 31 of the power semiconductor module.

[0013] The electronic substrate 2 is arranged between the opposing support columns 5. On the upper part of the support column, a spring member 6 fixed to the support column 5 by the fixing member 7 extends in the direction of the electronic substrate. The tip of the spring member 6 abuts on the upper surface of the edge portion 21 of the electronic substrate.

[0014] Also, a floating connector 8 is arranged on the lower surface of the electronic substrate 2. The terminal 83 of the floating connector has a spring structure as shown in FIG. 2, and can absorb the displacement and maintain the electrical connection even if the power semiconductor module 3 and the electronic substrate 2 are displaced in the vertical and horizontal directions.

[0015] The electronic substrate is pressed downward, that is, in the direction of the housing, by a spring member provided on the support column, and is also pressed upward by a floating connector having a spring structure. It is held by the balance between the downward pressing force and the upward pressing force.

[0016] In this way, since the electronic device of the present invention holds the electronic substrate by the elastic forces of the spring member 6 and the spring structure 83 of the floating connector, in addition to not applying fastening stress to the electronic substrate 2, vibrations received during the running of the vehicle can also be absorbed by the elastic deformation of the spring member and the spring structure that hold the electronic substrate in the vertical direction.

[0017] Therefore, excessive stress is prevented from being applied to the electronic substrate 2, and even if the electronic substrate is a multilayer substrate, a decrease in its insulation performance can be prevented.

[0018] The spring member 6 provided on the support column is preferably arranged at a position that is point-symmetrical with respect to the electronic substrate 2, and by holding it at four or more points so that the holding force of the electronic substrate is uniform between the fulcrums, parallelism with the power semiconductor module is maintained, and since the electronic substrate does not tilt, stress can be prevented from being applied to the electronic substrate. Note that the support columns 5 are not limited to two as shown in FIG. 3, and may be a plurality of support columns 5 in which the support columns on the opposite side are divided together with the fixing member 7.

[0019] Examples of the spring member 6 include a leaf spring such as a washer extending in the direction of the electronic substrate, and a cantilever spring provided with a flange extending in the direction of the electronic substrate and provided below the flange.

[0020] Also, it is preferable to disperse and arrange a plurality of floating connectors near the spring member of the support column so that the electronic substrate is not deflected by the pressing force received from the spring member of the support column.

[0021] Also, when there is one floating connector, by arranging it at the center in the in-plane direction of the electronic substrate, parallelism between the electronic substrate and the power semiconductor module is maintained, and excessive stress can be prevented from being applied to the electronic substrate.

[0022] Examples of the electronic substrate include a high-power circuit substrate such as a drive circuit board of an inverter that controls and drives a motor. As shown in FIG. 3, such a high-power circuit substrate can suppress noise radiation by surrounding the outer periphery, that is, the edge of the substrate, with a ground ring 21.

[0023] In the drive circuit board of the inverter, setting of a ground line as the ground ring 21 is essential, and the ground line is an area where electronic components cannot be mounted and becomes a dead space.

[0024] In the electronic device of the present invention, since the spring member 6 of the support column is in contact with the ground line 21 of the electronic substrate, the dead space where electronic components cannot be mounted can be effectively utilized, and the miniaturization of the electronic device is possible.

[0025] Further, the spring member 6 of the support column and the fixing member 7 are in contact with each other, and since these are formed of a conductive material such as metal, the ground line of the electronic substrate 2 and the housing 4 connected to the ground are electrically connected via the spring member 6 of the support column and the fixing member 7. Therefore, there is no need to provide a harness or a bus bar for grounding the electronic substrate 2.

[0026] Therefore, the number of components can be reduced, space can be saved, and miniaturization is possible.

[0027] Such a structure of the electronic device of the present invention can be suitably used for a power conversion device of an electric vehicle.

[0028] As described above, the structure of the electronic device of the present invention has been described by taking as an example the case where, according to FIG. 1, the arrangement order is such that the housing is at the bottom, the power semiconductor module is in the middle, and the electronic substrate is at the top. However, the whole may be inverted while maintaining this arrangement order. Further, the number of electronic substrates is not limited to one, and a plurality of electronic substrates can be stacked.

Explanation of Signs

[0029] 1 Electronic device 2 Electronic substrate 21 Ground ring (component mounting prohibited area) 3 Power semiconductor module 31 Edge 4 Housing 41 Refrigerant flow path 5 Support column 6 Spring member (washer) 7 Fixing member (screw) 8 Floating connector 81 Jack 82 Plug 83 Terminals (Spring Structure)

Claims

1. An electronic device in which a power semiconductor module and an electronic substrate are stacked and arranged on a housing in this order, and the power semiconductor module and the electronic substrate are connected by a floating connector, a support is provided at an edge of the power semiconductor module, the power semiconductor module is fixed to the housing by a fixing member that penetrates the edge and the support, a spring member provided on the support abuts against an edge of the electronic substrate and presses in the housing direction, the terminals of the floating connector have a spring structure and press the electronic substrate in a direction opposite to the housing. An electronic device characterized by this.

2. the electronic substrate is a high-power circuit board, the contact portion of the electronic substrate with the spring member is a ground line, The electronic device according to claim 1, wherein the ground line is electrically connected to the housing that is grounded through the spring and the fixing member.

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