Photoelectric mixed substrate, active optical cable, and manufacturing method for photoelectric mixed substrate

Abstract

To provide a photoelectric mixed substrate having excellent connection reliability, an active optical cable provided with the photoelectric mixed substrate, and a method for manufacturing the photoelectric mixed substrate.SOLUTION: A photoelectric mixed substrate 4 comprises a metal support layer 12, a flexible wiring board 11, and an optical waveguide film 13. The flexible wiring board 11 is provided with a base insulating layer 14, a conductive layer 15, and a metal plating layer 31. The conductive layer 15 is provided with an electrical wiring 18 and a connector-side terminal 17. The photoelectric mixed substrate 4 is provided with an electrical connecting section 7. The electrical connecting section 7 includes the metal support layer 12, the base insulating layer 14, the connector-side terminal 17, and the metal plating layer 31. In the electrical connecting section 7, the edge of the metal support layer 12 on one longitudinal end side protrudes toward one side in the longitudinal direction from the edges of the connector-side terminal 17 and the metal plating layer 31 on one longitudinal end side. The edge of the base insulating layer 14 on one longitudinal end side protrudes toward one side in the longitudinal direction from the edge of the metal support layer 12 on one longitudinal end side.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an optoelectronic hybrid substrate, an active optical cable, and a method for manufacturing an optoelectronic hybrid substrate.

Background Art

[0002] Conventionally, optoelectronic hybrid substrates are known. An optoelectronic hybrid substrate includes, for example, a flexible wiring board, a metal support layer, and an optical waveguide film. The optoelectronic hybrid substrate is connected to a printed wiring board via, for example, an electrical connector. More specifically, the optoelectronic hybrid substrate is inserted into the insertion port of the electrical connector, and the connector-side terminal of the optoelectronic hybrid substrate and the connector terminal of the electrical connector are brought into contact (see, for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Further improvement in the connection reliability between the optoelectronic hybrid substrate and the electrical connector is required.

[0005] The present invention is an optoelectronic hybrid substrate having excellent connection reliability, an active optical cable including the optoelectronic hybrid substrate, and a method for manufacturing the optoelectronic hybrid substrate.

Means for Solving the Problems

[0006] The present invention [1] is an optoelectronic hybrid substrate including a metal support layer, a flexible wiring board, and an optical waveguide film. The flexible wiring board is disposed on one side in the thickness direction of the metal support layer, and includes a base insulating layer, a conductor layer disposed on one side in the thickness direction of the base insulating layer, the conductor layer including a wiring portion and a terminal portion continuous with the wiring portion, and a metal plating layer disposed on one side in the thickness direction of the terminal portion. The optical waveguide film is disposed on the other side in the thickness direction of the metal support layer. The optoelectronic hybrid substrate includes a connection portion disposed at one end in the longitudinal direction of the optoelectronic hybrid substrate. The connection portion includes the metal support layer, the base insulating layer, the terminal portion, and the metal plating layer. In the connection portion, one end edge in the longitudinal direction of the metal support layer protrudes toward one side in the longitudinal direction more than one end edge in the longitudinal direction of the terminal portion and the metal plating layer, and one end edge in the longitudinal direction of the base insulating layer protrudes toward one side in the longitudinal direction more than one end edge in the longitudinal direction of the metal support layer.

[0007] The present invention [2] is the optoelectronic hybrid substrate according to [1] above, wherein the connection portion includes the optical waveguide film, and in the connection portion, one end edge in the longitudinal direction of the optical waveguide film protrudes toward one side in the longitudinal direction more than one end edge in the longitudinal direction of the terminal portion and the metal plating layer, and one end edge in the longitudinal direction of the metal support layer protrudes toward one side in the longitudinal direction more than one end edge in the longitudinal direction of the optical waveguide film.

[0008] The present invention [3] is the optoelectronic hybrid substrate according to [1] or [2] above, wherein in the connection portion, the distance between one end edge in the longitudinal direction of the base insulating layer and one end edge in the longitudinal direction of the terminal portion and the metal plating layer is longer than 0.10 mm.

[0009] The present invention [4] is the optoelectronic hybrid substrate according to [3] above, wherein in the connection portion, the distance between one end edge in the longitudinal direction of the base insulating layer and one end edge in the longitudinal direction of the terminal portion and the metal plating layer is 0.12 mm or more.

[0010] In the present invention [5], in the connection portion, the distance between one longitudinal end edge of the base insulating layer and one longitudinal end edge of the terminal portion and the metal plating layer is 0.12 mm or more and 0.30 mm or less, and the optoelectronic hybrid substrate according to [4] above is included.

[0011] In the present invention [6], the connection portion includes the optical waveguide film, and in the connection portion, the sum of the thickness of the metal support layer, the thickness of the flexible wiring board, and the thickness of the optical waveguide film is 100 μm or more and 500 μm or less, and the optoelectronic hybrid substrate according to any one of [1] to [5] above is included.

[0012] In the present invention [7], the optical waveguide film is made of a photosensitive resin, and the optoelectronic hybrid substrate according to any one of [1] to [6] above is included.

[0013] The present invention [8] includes an active optical cable including the optoelectronic hybrid substrate according to any one of [1] to [7] above and an optical cable connected to the optoelectronic hybrid substrate.

[0014] The present invention [9] is a method for manufacturing an optoelectronic hybrid substrate according to any one of [1] to [7] above, comprising the steps of preparing a metal support layer, disposing the base insulating layer having an opening on one side in the thickness direction of the metal support layer, disposing the wiring portion of the conductor layer on one side in the thickness direction of the base insulating layer, and disposing the terminal portion of the conductor layer on one side in the thickness direction of the metal support layer exposed from the opening, forming a metal plating layer on one side in the thickness direction of the terminal portion by supplying power from the metal support layer to the terminal portion in the opening, processing one side edge in the longitudinal direction of the metal support layer to project one side in the longitudinal direction beyond one side edge in the longitudinal direction of the terminal portion and the metal plating layer, and projecting one side edge in the longitudinal direction of the base insulating layer beyond one side edge in the longitudinal direction of the metal support layer toward one side in the longitudinal direction, and disposing a optical waveguide film on the other side with respect to one side in the thickness direction of the metal support layer. The method for manufacturing an optoelectronic hybrid substrate is included.

Advantages of the Invention

[0015] The optoelectronic hybrid substrate and the active optical cable of the present invention have excellent connection reliability.

[0016] The method for manufacturing an optoelectronic hybrid substrate of the present invention can efficiently manufacture an optoelectronic hybrid substrate having excellent connection reliability.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0018] 1. Photoelectric hybrid mounting substrate 1) Overall configuration Hereinafter, an embodiment of the optoelectronic hybrid substrate of the present invention will be described with reference to FIGS. 1 to 2. In FIGS. 1 to 2, the optoelectronic hybrid substrate 4 has a long and flat plate shape.

[0019] The optoelectronic hybrid substrate 4 includes an electrical connection portion 7 as a connection portion, an electrical transmission portion 8, an optoelectronic conversion portion 9, and an optical transmission portion 10 in this order in the longitudinal direction. The optoelectronic hybrid substrate 4 also includes a metal support layer 12, a flexible wiring board 11, and an optical waveguide film 13.

[0020] Note that one side in the longitudinal direction of the optoelectronic hybrid substrate 4 is the left side of the paper surface in FIG. 1 and the upper side of the paper surface in FIG. 2. One side in the longitudinal direction of the optoelectronic hybrid substrate 4 is the side that is electrically connected to the printed wiring board 2 described later (that is, the side that is inserted into the electrical connector 3).

[0021] The other side of the optoelectronic hybrid substrate 4 with respect to one side in the longitudinal direction (hereinafter referred to as the other side in the longitudinal direction) is the right side of the paper surface in FIG. 1 and the lower side of the paper surface in FIG. 2. The other side in the longitudinal direction of the optoelectronic hybrid substrate 4 is the side that is optically connected to the optical cable 101 described later (that is, the side that is inserted into the optical connector 102).

[0022] The electrical connection portion 7 is disposed at one end in the longitudinal direction of the optoelectronic hybrid substrate 4. The electrical transmission portion 8 is disposed adjacent to the other side in the longitudinal direction of the electrical connection portion 7. The optoelectronic conversion portion 9 is disposed adjacent to the other side in the longitudinal direction of the electrical transmission portion 8. The optical transmission portion 10 is disposed adjacent to the other side in the longitudinal direction of the optoelectronic conversion portion 9.

[0023] The electrical connection portion 7, the electrical transmission portion 8, and the optoelectronic conversion portion 9 include the flexible wiring board 11, the metal support layer 12, and the optical waveguide film 13 in this order in the thickness direction. The optical transmission portion 10 does not include the metal support layer 12 and includes the flexible wiring board 11 and the optical waveguide film 13 in this order in the thickness direction.

[0024] Hereinafter, the metal support layer 12, the flexible wiring board 11, and the optical waveguide film 13 will be described in detail.

[0025] [Metal support layer] The metal support layer 12 is disposed in the middle portion in the thickness direction of the optoelectronic hybrid substrate 4. That is, the metal support layer 12 is disposed between the flexible wiring board 11 and the optical waveguide film 13. Further, the metal support layer 12 is not disposed in the optical transmission portion 10, but is disposed in the electrical connection portion 7, the electrical transmission portion 8, and the optoelectronic conversion portion 9.

[0026] The metal support layer 12 is disposed on the other side (the other surface) in the thickness direction of the flexible wiring board 11. Specifically, the metal support layer 12 is in contact with the other side (the other surface) in the thickness direction of the base insulating layer 14 (described later) without an adhesive layer therebetween. Further, the metal support layer 12 has a through hole 28 penetrating in the thickness direction. The through hole 28 is formed, for example, so as to face the light entrance and exit of the optoelectronic conversion element 23 described later.

[0027] Examples of the material of the metal support layer 12 include metals. More specifically, examples of the metal include 42 alloy, aluminum, copper-beryllium, phosphor bronze, copper, silver, and aluminum. From the viewpoint of ensuring excellent rigidity and toughness, stainless steel is preferably used. The thickness of the metal support layer 12 is, for example, 3 μm or more and 100 μm or less, preferably 10 μm or more and 50 μm or less.

[0028] [Flexible wiring board] The flexible wiring board 11 is disposed on one side (one surface) in the thickness direction of the metal support layer 12. The flexible wiring board 11 is disposed over the entire optoelectronic hybrid substrate 4 from one end to the other end of the optoelectronic hybrid substrate 4 in the longitudinal direction. Specifically, the flexible wiring board 11 is disposed in the electrical connection portion 7, the electrical transmission portion 8, the optoelectronic conversion portion 9, and the optical transmission portion 10.

[0029] The flexible printed circuit board 11 includes a base insulating layer 14, a conductor layer 15, a metal plating layer 31, and a cover insulating layer 24.

[0030] The planar shape of the base insulating layer 14 is the same as the planar shape of the flexible printed circuit board 11. The base insulating layer 14 is disposed at the electrical connection portion 7, the electrical transmission portion 8, the optoelectronic conversion portion 9, and the optical transmission portion 10. Examples of the material of the base insulating layer 14 include insulating materials. Examples of the insulating material include polyimide. The thickness of the base insulating layer 14 is set as appropriate.

[0031] The base insulating layer 14 includes an opening 32 at the electrical connection portion 7. The opening 32 is a through hole that penetrates the base insulating layer 14 in the thickness direction. In the opening 32, the metal support layer 12 is exposed from the base insulating layer 14.

[0032] The conductor layer 15 is disposed on one side (one surface) in the thickness direction of the base insulating layer 14. Further, the conductor layer 15 is also disposed on one side in the thickness direction of the metal support layer 12 exposed from the base insulating layer 14 (more specifically, inside the opening 32 (the same applies hereinafter)). The conductor layer 15 is not disposed at the optical transmission portion 10, and is disposed at the electrical connection portion 7, the electrical transmission portion 8, and the optoelectronic conversion portion 9.

[0033] Specifically, the conductor layer 15 includes an electrical wiring 18 as a wiring portion, a connector-side terminal 17 as a terminal portion continuous with one longitudinal side of the electrical wiring 18, and a conversion-side terminal 16 as a terminal portion continuous with the other longitudinal side of the electrical wiring 18.

[0034] The electrical wiring 18 is a portion of the conductor layer 15 that transmits an electrical signal. As shown in FIG. 2, a plurality of electrical wirings 18 are arranged at intervals in the width direction orthogonal to the longitudinal direction and the thickness direction.

[0035] As shown in FIG. 1, each electrical wiring 18 is arranged along the longitudinal direction in the electrical transmission portion 8. Further, each electrical wiring 18 connects the conversion side terminal 16 and the connector side terminal 17, respectively.

[0036] The connector side terminal 17 is a portion of the conductor layer 15 that is electrically connected to the connector terminal 6 (described later). As shown in FIG. 2, a plurality of connector side terminals 17 are arranged at intervals in the width direction orthogonal to the longitudinal direction and the thickness direction.

[0037] As shown in FIG. 1, each connector side terminal 17 is arranged along the longitudinal direction in the electrical connection portion 7. Further, each connector side terminal 17 is arranged on one side (inside the opening 32) in the thickness direction of the metal support layer 12 exposed from the base insulating layer 14.

[0038] The conversion side terminal 16 is a portion of the conductor layer 15 that is electrically connected to the photoelectric conversion element 23. Although not shown, a plurality of conversion side terminals 16 are arranged at intervals in the width direction orthogonal to the longitudinal direction and the thickness direction. Each conversion side terminal 16 is arranged along the longitudinal direction in the photoelectric conversion portion 9, although not shown.

[0039] Examples of the material of the conductor layer 15 include known conductor materials. For example, copper can be mentioned as the conductor material. The thickness of the conductor layer 15 is set as appropriate.

[0040] The metal plating layer 31 is arranged on one side (one surface) in the thickness direction of each connector side terminal 17. The shape of the metal plating layer 31 in plan view is substantially the same as the shape of each connector side terminal 17 in plan view. That is, one end face in the longitudinal direction of the metal plating layer 31 and one end face in the longitudinal direction of the connector side terminal 17 are flush with each other. The metal plating layer 31 is formed, for example, by using the metal support layer 12 as a plating lead and supplying power to the metal support layer 12 as described later.

[0041] Examples of the material of the metal plating layer 31 include gold and nickel. The thickness of the metal plating layer 31 is set as appropriate.

[0042] The cover insulating layer 24 is disposed on one side in the thickness direction of the conductor layer 15. The cover insulating layer 24 is not disposed on the electrical connection portion 7, the photoelectric conversion portion 9, and the optical transmission portion 10, but is disposed on the electrical transmission portion 8.

[0043] Specifically, the cover insulating layer 24 is in contact with one surface in the thickness direction of the base insulating layer 14 around the electrical wiring 18 so as to cover the electrical wiring 18. The material of the cover insulating layer 24 is the same as that of the base insulating layer 14. The thickness of the cover insulating layer 24 is set as appropriate.

[0044] The thickness of the flexible printed circuit board 11 is not particularly limited and is set as appropriate. In particular, from the viewpoint of connection reliability, the thickness of the flexible printed circuit board 11 at the electrical connection portion 7 is set. For example, the thickness of the flexible printed circuit board 11 at the electrical connection portion 7 is, for example, 20 μm or more and 250 μm or less, preferably 50 μm or more and 100 μm or less. Note that the thickness of the flexible printed circuit board 11 at the electrical connection portion 7 is the sum of the thickness of the connector-side terminal 17 and the thickness of the metal plating layer 31.

[0045] [Optical waveguide film] The optical waveguide film 13 is disposed on the other side (the other surface) in the thickness direction of the metal support layer 12. The optical waveguide film 13 is disposed over the entire optoelectronic hybrid substrate 4 from one end to the other end in the longitudinal direction. Specifically, the optical waveguide film 13 is disposed over the electrical connection portion 7, the electrical transmission portion 8, the optoelectronic conversion portion 9, and the optical transmission portion 10. The optical waveguide film 13 includes an underclad layer 20, a core layer 21, and an overclad layer 22.

[0046] The underclad layer 20 is disposed on the electrical connection portion 7, the electrical transmission portion 8, the photoelectric conversion portion 9, and the optical transmission portion 10. The underclad layer 20 is disposed so as to contact the other surface in the thickness direction of the base insulating layer 14 of the flexible wiring board 11. Further, the underclad layer 20 is disposed so as to contact the other surface in the thickness direction of the metal support layer 12. The thickness of the underclad layer 20 is, for example, 2 μm or more and 600 μm or less, preferably 3 μm or more and 100 μm or less, more preferably 4 μm or more and 60 μm or less, and still more preferably 5 μm or more and 45 μm or less.

[0047] The core layer 21 is not disposed on the electrical connection portion 7, but is disposed on the electrical transmission portion 8, the photoelectric conversion portion 9, and the optical transmission portion 10. The core layer 21 is disposed on the other surface in the thickness direction of the underclad layer 20. The core layer 21 is formed in a pattern narrower in width than the underclad layer 20. The thickness of the core layer 21 is, for example, 5 μm or more and 100 μm or less, preferably 10 μm or more and 90 μm or less, more preferably 15 μm or more and 80 μm or less, and still more preferably 20 μm or more and 60 μm or less.

[0048] In the photoelectric conversion portion 9, a mirror 29 is formed on the core layer 21. The mirror 29 faces the through hole 28 in the thickness direction. That is, the mirror 29 faces the light inlet / outlet (not shown) of the photoelectric conversion element 23 in the thickness direction.

[0049] The overclad layer 22 is disposed at the same position as the underclad layer 20 in a plan view. Specifically, the overclad layer 22 is disposed on the electrical connection portion 7, the electrical transmission portion 8, the photoelectric conversion portion 9, and the optical transmission portion 10. The overclad layer 22 is disposed so as to cover the other surface in the thickness direction of the underclad layer 20, the other surface and the side surface in the thickness direction of the core layer 21. The thickness of the overclad layer 22 is, for example, 2 μm or more and 600 μm or less, preferably 3 μm or more and 100 μm or less, more preferably 4 μm or more and 60 μm or less, and still more preferably 5 μm or more and 45 μm or less.

[0050] The thickness of the overclad layer 22 is the distance between the other side in the thickness direction of the underclad layer 20 and the other side in the thickness direction of the overclad layer 22. The ratio of the thickness of the overclad layer 22 to the thickness of the underclad layer 20 is, for example, 0.5 or more and 10 or less, preferably 1 or more and 5 or less.

[0051] Examples of the material of the optical waveguide film 13 include resins, and preferably photosensitive resins. That is, the optical waveguide film 13 is made of, for example, a resin, and preferably a photosensitive resin. Examples of the photosensitive resin include epoxy resins, acrylic resins, and silicone resins, and preferably epoxy resins. The photosensitive resin is appropriately selected so that the refractive index of the core layer 21 is higher than the refractive indices of the underclad layer 20 and the overclad layer 22.

[0052] The thickness of the optical waveguide film 13 is not particularly limited and is set as appropriate. In particular, from the viewpoint of connection reliability, the thickness of the optical waveguide film 13 at the electrical connection portion 7 is set. For example, the thickness of the optical waveguide film 13 at the electrical connection portion 7 is, for example, 20 μm or more and 250 μm or less, preferably 50 μm or more and 100 μm or less. Note that the thickness of the optical waveguide film 13 at the electrical connection portion 7 is the sum of the thickness of the underclad layer 20 and the thickness of the overclad layer 22.

[0053] [Photoelectric conversion element] The optoelectronic hybrid substrate 4 can include a photoelectric conversion element 23. The photoelectric conversion element 23 is an element capable of converting an optical signal into an electrical signal and / or converting an electrical signal into an optical signal. The photoelectric conversion element 23 is electrically connected to the conversion-side terminal 16 of the flexible wiring board 11 via a known bonding member 19.

[0054] [Positional relationship at the electrical connection portion] In the above-mentioned optoelectronic hybrid substrate 4, the electrical connection portion 7 includes a metal support layer 12, a base insulating layer 14, a connector-side terminal 17 and a metal plating layer 31, and an optical waveguide film 13.

[0055] The metal support layer 12, the base insulating layer 14, the connector-side terminal 17 and the metal plating layer 31, and the optical waveguide film 13 are arranged so as to have a predetermined positional relationship. More specifically, as will be described in detail below, in the electrical connection portion 7, one longitudinal end edge of the metal support layer 12, one longitudinal end edge of the base insulating layer 14, one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31, and one longitudinal end edge of the optical waveguide film 13 have a predetermined positional relationship as follows.

[0056] That is, in the electrical connection portion 7, as shown in FIGS. 1 and 2, among one longitudinal end edge of the metal support layer 12, one longitudinal end edge of the base insulating layer 14, one longitudinal end edge of the optical waveguide film 13, and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31, one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is arranged on the farthest side in the longitudinal direction.

[0057] In other words, in the electrical connection portion 7, one longitudinal end edge of the base insulating layer 14, one longitudinal end edge of the metal support layer 12, and one longitudinal end edge of the optical waveguide film 13 all protrude toward the one longitudinal side from one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31.

[0058] Also, in the electrical connection portion 7, among one longitudinal end edge of the metal support layer 12, one longitudinal end edge of the base insulating layer 14, one longitudinal end edge of the optical waveguide film 13, and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31, one longitudinal end edge of the optical waveguide film 13 is arranged second farthest in the longitudinal direction.

[0059] That is, in the electrical connection portion 7, one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the metal support layer 12 both protrude toward one longitudinal side beyond one longitudinal end edge of the optical waveguide film 13.

[0060] Furthermore, in the electrical connection portion 7, as shown in FIGS. 1 and 2, among one longitudinal end edge of the metal support layer 12, one longitudinal end edge of the base insulating layer 14, one longitudinal end edge of the optical waveguide film 13, and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31, one longitudinal end edge of the metal support layer 12 is arranged thirdly toward the other longitudinal side.

[0061] In other words, in the electrical connection portion 7, one longitudinal end edge of the base insulating layer 14 protrudes toward one longitudinal side beyond one longitudinal end edge of the metal support layer 12.

[0062] As described above, in the electrical connection portion 7, one longitudinal end edge of the base insulating layer 14 is arranged most toward one longitudinal side. Also, in the electrical connection portion 7, one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is arranged most toward the other longitudinal side.

[0063] The lower limit of the distance (in other words, the shortest distance in the longitudinal direction (the same applies hereinafter)) between one longitudinal end edge of the base insulating layer 14 (more specifically, the edge arranged most toward one longitudinal side of the base insulating layer 14 (the same applies hereinafter)) and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 (more specifically, the edge arranged most toward the other longitudinal side of the connector-side terminal 17 and the metal plating layer 31 (the same applies hereinafter)) is, from the viewpoint of connection reliability, for example, 0.05 mm or more, preferably longer than 0.10 mm (in other words, exceeding 0.10 mm), and more preferably 0.12 mm or more.

[0064] Also, in the electrical connection portion 7, the upper limit of the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is set according to, for example, the terminal size of the electrical connector 3. For example, in the electrical connection portion 7, the upper limit of the distance between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is, from the viewpoint of the terminal size, for example, 0.50 mm or less, preferably 0.40 mm or less, more preferably 0.30 mm or less.

[0065] That is, in the electrical connection portion 7, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is, from the viewpoints of connection reliability and terminal size, for example, 0.05 mm or more and 0.50 mm or less, preferably longer than 0.10 mm (in other words, exceeding 0.10 mm) and 0.40 mm or less, more preferably 0.12 mm or more and 0.30 mm or less.

[0066] Hereinafter, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is referred to as the "margin distance".

[0067] And in the longitudinal direction, one longitudinal end edge of the metal support layer 12 and one longitudinal end edge of the optical waveguide film 13 are arranged between one longitudinal end edge of the base insulating layer 14 (the edge arranged most on the one longitudinal side) and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 (the edge arranged most on the other longitudinal side).

[0068] For example, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the metal support layer 12 is, for example, 0.01 mm or more and 0.2 mm or less, preferably 0.02 mm or more and 0.1 mm or less.

[0069] Hereinafter, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the metal support layer 12 is referred to as the "first distance".

[0070] The ratio of the first distance is, for example, 7% or more and 80% or less, preferably 13% or more and 67% or less, with respect to the margin distance.

[0071] Also, for example, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the metal support layer 12 and one longitudinal end edge of the optical waveguide film 13 is, for example, 0.01 mm or more and 0.7 mm or less, preferably 0.05 mm or more and 0.5 mm or less.

[0072] Hereinafter, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the metal support layer 12 and one longitudinal end edge of the optical waveguide film 13 is referred to as the "second distance".

[0073] The ratio of the second distance is, for example, 7% or more and 60% or less, preferably 33% or more and 50% or less, with respect to the margin distance.

[0074] Also, for example, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the optical waveguide film 13 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is, for example, 0.01 mm or more and 0.5 mm or less, preferably 0.05 mm or more and 0.2 mm or less.

[0075] Hereinafter, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the optical waveguide film 13 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is referred to as the "third distance".

[0076] The ratio of the third distance is, for example, 7% or more and 60% or less, preferably 33% or more and 50% or less, with respect to the margin distance.

[0077] Note that the total ratio of the first distance, the second distance, and the third distance is 100% with respect to the above margin distance.

[0078] Also, for example, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the metal support layer 12 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is, for example, 0.01 mm or more and 0.5 mm or less, preferably 0.05 mm or more and 0.3 mm or less.

[0079] Hereinafter, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the metal support layer 12 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 is referred to as the "fourth distance".

[0080] The ratio of the fourth distance is, for example, 7% or more and 90% or less, preferably 33% or more and 80% or less with respect to the above margin distance.

[0081] Also, for example, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the optical waveguide film 13 is, for example, 0.01 mm or more and 0.5 mm or less, preferably 0.05 mm or more and 0.4 mm or less.

[0082] Hereinafter, the distance (the shortest distance in the longitudinal direction) between one longitudinal end edge of the base insulating layer 14 and one longitudinal end edge of the optical waveguide film 13 is referred to as the "fifth distance".

[0083] The ratio of the fifth distance is, for example, 7% or more and 90% or less, preferably 33% or more and 80% or less with respect to the above margin distance.

[0084] In the electrical connection portion 7, the thickness of the optoelectronic hybrid substrate 4 is set from the viewpoint of connection reliability. For example, in the electrical connection portion 7, the thickness of the optoelectronic hybrid substrate 4 is adjusted to be the same as the distance between the first surface 26 (described later) of the electrical connector 3 and the connector terminal 6 (described later). The thickness of the optoelectronic hybrid substrate 4 is the sum of the thickness of the metal support layer 12, the thickness of the flexible wiring board 11, and the thickness of the optical waveguide film 13.

[0085] More specifically, in the electrical connection portion 7, the sum of the thickness of the metal support layer 12, the thickness of the flexible wiring board 11, and the thickness of the optical waveguide film 13 is, for example, 50 μm or more, preferably 100 μm or more, more preferably 150 μm or more. Also, the sum of the thickness of the metal support layer 12, the thickness of the flexible wiring board 11, and the thickness of the optical waveguide film 13 is, for example, 1000 μm or less, preferably 500 μm or less, more preferably 400 μm or less.

[0086] That is, the sum of the thickness of the metal support layer 12, the thickness of the flexible wiring board 11, and the thickness of the optical waveguide film 13 is, from the viewpoint of connection reliability, for example, 50 μm or more and 1000 μm or less, preferably 100 μm or more and 500 μm or less, more preferably 150 μm or more and 400 μm or less.

[0087] 2) Manufacturing method of optoelectronic hybrid substrate Hereinafter, the manufacturing method of the optoelectronic hybrid substrate 4 will be described in detail with reference to FIGS. 3 to 4.

[0088] In this method, first, as shown in FIG. 3A, the metal support layer 12 is prepared.

[0089] Next, in this method, as shown in FIG. 3B, a base insulating layer 14 having an opening 32 is formed on one surface in the thickness direction of the metal support layer 12.

[0090] The method of forming the base insulating layer 14 is not particularly limited. For example, the resin varnish for forming the base insulating layer 14 is applied to one surface in the thickness direction of the metal support layer 12, exposed and developed into a predetermined pattern where the opening 32 is formed, and then the resin varnish is cured. Thereby, the base insulating layer 14 having a predetermined pattern is formed.

[0091] Next, in this method, as shown in FIG. 3C, a conductor layer 15 including the electrical wiring 18, the connector-side terminal 17, and the conversion-side terminal 16 is formed.

[0092] More specifically, the electrical wiring 18 and the conversion-side terminal 16 of the conductor layer 15 are arranged on one surface in the thickness direction of the base insulating layer 14. Also, in this method, the connector-side terminal 17 of the conductor layer 15 is arranged on one surface in the thickness direction of the metal support layer 12 exposed from the opening 32. The method of forming the conductor layer 15 is not particularly limited, and a known method is adopted. For example, an additive method, a semi-additive method, and a subtractive method can be mentioned. Preferably, the additive method can be mentioned. In the additive method, for example, a seed film is formed by a known method, the seed film is immersed in a plating solution, and power is supplied to the seed film from the metal support layer 12 using an external device. Thereby, the conductor layer 15 having a predetermined pattern is formed on the seed film.

[0093] Next, in this method, as shown in FIG. 3D, a cover insulating layer 24 is arranged on one side in the thickness direction of the electrical wiring 18.

[0094] The method of forming the cover insulating layer 24 is not particularly limited. For example, the resin varnish for forming the cover insulating layer 24 is applied to one surface in the thickness direction of the base insulating layer 14 and the conductor layer 15, exposed and developed into a predetermined pattern where the electrical wiring 18 is covered, and then the resin varnish is cured. Thereby, the cover insulating layer 24 having a predetermined pattern is formed.

[0095] Next, in this method, as shown in FIG. 4E, a metal plating layer 31 is formed on one surface in the thickness direction of the connector-side terminal 17.

[0096] More specifically, the connector-side terminal 17 in the opening 32 is immersed in the plating solution, and power is supplied to the connector-side terminal 17 in the opening 32 using an external device via the metal support layer 12. That is, the metal support layer 12 is used as a plating lead to supply power to the connector-side terminal 17. Thereby, the metal plating layer 31 is formed on one surface in the thickness direction of the connector-side terminal 17.

[0097] Next, in this method, as shown in FIG. 4F, at the electrical connection portion 7, one longitudinal end edge of the metal support layer 12 is processed so that the metal support layer 12 satisfies the above-described predetermined positional relationship.

[0098] More specifically, in this step, by processing one longitudinal end edge of the metal support layer 12, the longitudinal length of the metal support layer 12 is shortened, and one longitudinal end edge of the base insulating layer 14 is made to protrude toward one longitudinal side more than one longitudinal end edge of the metal support layer 12.

[0099] Also, in this step, the longitudinal length of the metal support layer 12 is not excessively shortened, and one longitudinal end edge of the metal support layer 12 is made to protrude toward one longitudinal side more than one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31.

[0100] Furthermore, in this step, for example, a part of the metal support layer 12 of the photoelectric conversion portion 9 is removed to form a through hole 28. In addition, in this step, the metal support layer 12 of the optical transmission portion 10 is removed. The method of processing the metal support layer 12 is not particularly limited, and a known method is adopted.

[0101] Next, in this method, as shown in FIG. 4G, the optical waveguide film 13 is disposed on the other surface of the metal support layer 12 with respect to one surface in the thickness direction.

[0102] More specifically, for example, on the other side in the thickness direction of the metal support layer 12, an underclad layer 20, a core layer 21, and an overclad layer 22 are formed in this order. Thereby, the optical waveguide film 13 can be disposed on the other side in the thickness direction of the metal support layer 12. Further, in this step, the optical waveguide film 13 is processed (here, more specifically, it means cutting (the same applies hereinafter)), and a mirror 29 is formed on the core layer 21.

[0103] Also, in this step, the optical waveguide film 13 is disposed so as to satisfy the above-described predetermined positional relationship.

[0104] That is, the size and position of the optical waveguide film 13 are adjusted, and one end edge in the longitudinal direction of the optical waveguide film 13 is made to protrude toward one side in the longitudinal direction from one end edge in the longitudinal direction of the connector-side terminal 17 and the metal plating layer 31.

[0105] Also, the size and position of the optical waveguide film 13 are adjusted, and one end edge in the longitudinal direction of the metal support layer 12 is made to protrude toward one side in the longitudinal direction from one end edge in the longitudinal direction of the optical waveguide film 13.

[0106] Thus, the optoelectronic hybrid substrate 4 is manufactured.

[0107] As will be described in detail later, the above-described optoelectronic hybrid substrate 4 has excellent connection reliability. Therefore, the optoelectronic hybrid substrate 4 is suitably used as a component of the optoelectronic composite transmission module 1.

[0108] 3) Optoelectronic Composite Transmission Module Hereinafter, the optoelectronic composite transmission module 1 will be described with reference to FIGS. 5 to 6. As shown in FIGS. 5 to 6, the optoelectronic composite transmission module 1 has a long shape.

[0109] The optoelectronic composite transmission module 1 includes the above-described optoelectronic hybrid substrate 4, a printed wiring board 2, and an electrical connector 3 for connecting these.

[0110] The printed wiring board 2 is disposed at one longitudinal end of the optical and electrical hybrid transmission module 1. The printed wiring board 2 includes a substrate 25 and terminals (not shown).

[0111] The substrate 25 has a flat plate shape. Examples of the material of the substrate 25 include hard materials. Examples of the hard materials include glass fiber reinforced epoxy resin. The terminals (not shown) are provided on one side in the thickness direction of the substrate 25. The substrate 25 and the electrical connector 3 are connected via the terminals (not shown).

[0112] The electrical connector 3 is a connector that electrically connects the printed wiring board 2 and the optical and electrical hybrid substrate 4. Examples of the electrical connector 3 include an FPC connector, a ZIF connector, and a substrate connector, and preferably, a ZIF connector.

[0113] The electrical connector 3 is disposed on one side in the thickness direction of the printed wiring board 2. The electrical connector 3 has, for example, a substantially U-shaped (or U-shaped) cross-sectional view. The electrical connector 3 has an insertion port 5 and connector terminals 6 provided in the insertion port 5.

[0114] The insertion port 5 is configured such that the electrical connection portion 7 of the above-described optical and electrical hybrid substrate 4 can be inserted. The insertion port 5 includes a first surface 26, a second surface 27, and a third surface 30. The first surface 26, the second surface 27, and the third surface 30 are all inner walls of the insertion port 5.

[0115] The first surface 26 and the second surface 27 are arranged along the longitudinal direction so as to face each other in the thickness direction. The third surface 30 is the innermost wall surface in the insertion direction of the insertion port 5 (here, the longitudinal direction is shown (the same applies hereinafter)). More specifically, the third surface 30 is arranged along the thickness direction between one longitudinal end edge of the first surface 26 and one longitudinal end edge of the second surface 27. One end edge of the third surface 30 in the thickness direction is connected to one longitudinal end edge of the first surface 26. Also, the other end edge of the third surface 30 in the thickness direction is connected to one longitudinal end edge of the second surface 27.

[0116] The connector terminal 6 is provided on the second surface 27. The connector terminal 6 is provided corresponding to the connector-side terminal 17 of the electrical connection portion 7.

[0117] The distance between the first surface 26 and the connector terminal 6 is appropriately set according to the standard of the electrical connector 3 (in other words, the type (the same applies hereinafter)). Specifically, the distance between the first surface 26 and the connector terminal 6 is, for example, 10 μm or more and 2,000 μm or less, preferably 100 μm or more and 500 μm or less.

[0118] And the optoelectronic composite transmission module 1 is manufactured, for example, by electrically connecting the optoelectronic hybrid substrate 4 and the printed wiring board 2.

[0119] More specifically, as shown in FIG. 5, the printed wiring board 2 and the electrical connector 3 that are electrically connected to each other are prepared. Also, the optoelectronic hybrid substrate 4 is manufactured by the above method.

[0120] Next, as shown in FIG. 6, the electrical connection portion 7 of the optoelectronic hybrid substrate 4 is inserted into the electrical connector 3, and the connector-side terminal 17 of the optoelectronic hybrid substrate 4 and the connector terminal 6 of the electrical connector 3 are brought into contact with each other.

[0121] As described above, the optoelectronic hybrid substrate 4 and the printed wiring board 2 are electrically connected via the electrical connector 3. As a result, the optoelectronic composite transmission module 1 is manufactured.

[0122] 4) Operating effects The above optoelectronic hybrid substrate 4 and optoelectronic composite transmission module 1 have excellent connection reliability.

[0123] More specifically, as described above, the electrical connection portion 7 includes the metal support layer 12, the base insulating layer 14, the connector-side terminal 17 and the metal plating layer 31 as the terminal portion, and the optical waveguide film 13.

[0124] In the conventional electrical connection portion 7, one longitudinal edge of the connector-side terminal 17 and the metal plating layer 31 may be arranged at one longitudinal edge of the optoelectronic hybrid substrate 4.

[0125] More specifically, in the above description, the metal support layer 12 is used as a plating lead to supply power to the connector-side terminal 17. However, in the conventional electrical connection portion 7, a convex plating lead (see the virtual line B in FIG. 2) is formed without using the metal support layer 12 as a plating lead. That is, in the conventional electrical connection portion 7, the connector-side terminal 17 is arranged on one side in the thickness direction of the base insulation layer 14, and further, a convex plating lead (see the virtual line B in FIG. 2) for forming the metal plating layer 31 is connected to the connector-side terminal 17. Then, the convex plating lead is arranged such that one longitudinal edge of the convex plating lead and one longitudinal edge of the optoelectronic hybrid substrate 4 are flush. Then, by supplying power to the convex plating lead, the metal plating layer 31 is formed on one side in the thickness direction of the connector-side terminal 17.

[0126] In such a case, one longitudinal edge of the convex plating lead (see the virtual line B in FIG. 2) and the metal plating layer 31 is arranged at one longitudinal edge of the optoelectronic hybrid substrate 4. Further, in the conventional electrical connection portion 7, the metal support layer 12, the base insulation layer 14, the convex plating lead (see the virtual line B in FIG. 2) and the metal plating layer 31, and the optical waveguide film 13 may be arranged to be flush on one side in the thickness direction, for example.

[0127] In such a case, one longitudinal edge of the metal support layer 12, one longitudinal edge of the base insulation layer 14, one longitudinal edge of the metal plating layer 31, and one longitudinal edge of the optical waveguide film 13 are all arranged at one longitudinal edge of the optoelectronic hybrid substrate 4.

[0128] In such a case, when inserting the electrical connection portion 7 of the optoelectronic hybrid substrate 4 into the insertion port 5 of the electrical connector 3, the third surface 30 of the insertion port 5 and the metal plating layer 31 may come into contact. As a result, the metal plating layer 31 may be damaged, which may cause a decrease in the connection reliability between the optoelectronic hybrid substrate 4 and the electrical connector 3.

[0129] In contrast, in the above-mentioned optoelectronic hybrid substrate 4 and the optoelectronic composite transmission module 1, in the electrical connection portion 7, the metal support layer 12, the base insulating layer 14, the connector-side terminal 17 and the metal plating layer 31, and the optical waveguide film 13 have the above-mentioned positional relationship.

[0130] More specifically, the above-mentioned connector-side terminal 17 is disposed on one surface of the metal support layer 12 within the opening 32, and the metal plating layer 31 is formed by supplying power to the connector-side terminal 17. That is, a convex plating lead (see the virtual line B in FIG. 2) is unnecessary.

[0131] Therefore, in the above-mentioned optoelectronic hybrid substrate 4 and the optoelectronic composite transmission module 1, the positional relationship between one longitudinal end edge of the metal support layer 12 and one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31 can be adjusted as described above.

[0132] That is, one longitudinal end edge of the metal support layer 12 can be made to protrude toward one longitudinal side from one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31. Also, one longitudinal end edge of the base insulating layer 14 can be made to protrude toward one longitudinal side from one longitudinal end edge of the metal support layer 12.

[0133] As a result, in the above-mentioned optoelectronic hybrid substrate 4 and optoelectronic composite transmission module 1, when inserting the electrical connection portion 7 of the optoelectronic hybrid substrate 4 into the insertion port 5 of the electrical connector 3, before the third surface 30 of the insertion port 5 contacts the connector-side terminal 17 and the metal plating layer 31, first, the third surface 30 of the insertion port 5 contacts the base insulating layer 14, and the insertion is stopped. Further, when the third surface 30 of the insertion port 5 contacts the base insulating layer 14 and the insertion does not stop, then, the third surface 30 of the insertion port 5 contacts the metal support layer 12, and the insertion is stopped.

[0134] That is, according to the above-mentioned optoelectronic hybrid substrate 4 and optoelectronic composite transmission module 1, contact between the third surface 30 of the insertion port 5 and the connector-side terminal 17 and the metal plating layer 31 can be suppressed. As a result, damage to the connector-side terminal 17 and the metal plating layer 31 is suppressed, and the connection reliability between the optoelectronic hybrid substrate 4 and the electrical connector 3 is improved.

[0135] Furthermore, in the above-mentioned optoelectronic hybrid substrate 4 and optoelectronic composite transmission module 1, one longitudinal end edge of the optical waveguide film 13 protrudes toward one longitudinal side more than one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31, and one longitudinal end edge of the metal support layer 12 protrudes toward one longitudinal side more than one longitudinal end edge of the optical waveguide film 13.

[0136] Therefore, when the third surface 30 of the insertion port 5 contacts the metal support layer 12 and the insertion does not stop, then, the third surface 30 of the insertion port 5 contacts the optical waveguide film 13, and the insertion is stopped.

[0137] That is, according to the above-mentioned optoelectronic hybrid substrate 4 and optoelectronic composite transmission module 1, contact between the third surface 30 of the insertion port 5 and the connector-side terminal 17 and the metal plating layer 31 can be suppressed particularly well. As a result, damage to the connector-side terminal 17 and the metal plating layer 31 is suppressed, and the connection reliability between the optoelectronic hybrid substrate 4 and the electrical connector 3 is improved.

[0138] As described above, the above-mentioned optoelectronic hybrid substrate 4 and the optoelectronic composite transmission module 1 have excellent connection reliability with respect to the electrical connector 3. Further, according to the manufacturing method of the above-mentioned optoelectronic hybrid substrate 4, an optoelectronic hybrid substrate 4 having excellent connection reliability can be efficiently manufactured.

[0139] Therefore, the above-mentioned optoelectronic hybrid substrate 4 and the above-mentioned optoelectronic composite transmission module 1 are suitably used, for example, as components of the active optical cable 100.

[0140] 2. Active Optical Cable Hereinafter, the active optical cable 100 will be described with reference to FIG. 7. As shown in FIG. 7, the active optical cable 100 has a long string shape.

[0141] The active optical cable 100 includes the above-mentioned optoelectronic composite transmission module 1, an optical cable 101, and an optical connector 102 that connects them.

[0142] The optoelectronic composite transmission module 1 includes the above-mentioned printed wiring board 2, the electrical connector 3, and the optoelectronic hybrid substrate 4 as described above. In other words, the active optical cable 100 includes the above-mentioned optoelectronic hybrid substrate 4, an optical cable 101 connected to the optoelectronic hybrid substrate 4, and an optical connector 102.

[0143] And in the optoelectronic hybrid substrate 4, the optical waveguide film 13 (see FIG. 1) of the optical transmission portion 10 is optically connected to the optical cable 101.

[0144] More specifically, the optoelectronic composite transmission module 1 is provided with two (more specifically, a pair (the same applies hereinafter)) for one active optical cable 100. And one optoelectronic composite transmission module 1 is optically connected to one side in the longitudinal direction of the optical cable 101. The other optoelectronic composite transmission module 1 is optically connected to the other side in the longitudinal direction of the optical cable 101.

[0145] The optical cable 101 is a cable capable of transmitting and receiving optical signals. The optical cable 101 has, for example, a plastic optical fiber that allows optical signals to pass through and an outer skin that covers the plastic optical fiber.

[0146] The optical cable 101 is provided, for example, one for one active optical cable 100. More specifically, as described above, one end portion in the longitudinal direction of the optical cable 101 is optically connected to one of the optical and electrical composite transmission modules 1. Also, the other end portion in the longitudinal direction of the optical cable 101 is optically connected to the other optical and electrical composite transmission module 1.

[0147] The optical connector 102 is a connector that connects the optical and electrical composite transmission module 1 and the optical cable 101. The optical connector 102 is interposed in a known manner at the connection portion between the optical and electrical composite transmission module 1 and the optical cable 101.

[0148] More specifically, the optical connector 102 is provided, for example, two (a pair) for one active optical cable 100. And one of the optical connectors 102 is interposed between one end portion in the longitudinal direction of the optical cable 101 and one of the optical and electrical composite transmission modules 1. Also, the other optical connector 102 is interposed between the other end portion in the longitudinal direction of the optical cable 101 and the other optical and electrical composite transmission module 1.

[0149] The method for manufacturing the active optical cable 100 is not particularly limited. For example, in a known method, one optical cable 101 and two (a pair) of optical and electrical composite transmission modules 1 are connected via the optical connector 102. Thus, the active optical cable 100 is manufactured. According to the above active optical cable 100, an optical signal can be transmitted between a pair of optical and electrical composite transmission modules 1.

[0150] And the above active optical cable 100 includes the above optoelectronic hybrid transmission module 1. Therefore, the above active optical cable 100 has excellent connection reliability between the optoelectronic hybrid substrate 4 and the electrical connector 3.

[0151] 3. Variation In the following respective variations, for members and processes similar to those in the above-described embodiment, the same reference numerals are given, and detailed descriptions thereof are omitted. Also, each variation can achieve the same operational effects as the embodiment, unless otherwise specified. Furthermore, the embodiment and its variations can be combined as appropriate.

[0152] As shown in FIG. 8, the electrical connection portion 7 may not include the optical waveguide film 13. Also, the electrical transmission portion 8 may not include the optical waveguide film 13.

[0153] More specifically, in FIG. 8, the optoelectronic hybrid substrate 4 has, in the longitudinal direction, in this order, an electrical connection portion 7 as a connection portion, an electrical transmission portion 8, an optoelectronic conversion portion 9, and an optical transmission portion 10.

[0154] And the optoelectronic conversion portion 9 includes, in the thickness direction, in this order, a flexible wiring board 11, a metal support layer 12, and an optical waveguide film 13. The electrical connection portion 7 and the electrical transmission portion 8 do not include the optical waveguide film 13 and include, in the thickness direction, in this order, a flexible wiring board 11 and a metal support layer 12. The optical transmission portion 10 does not include the metal support layer 12 and includes, in the thickness direction, in this order, a flexible wiring board 11 and an optical waveguide film 13.

[0155] Even in such a case, at the electrical connection portion 7, one longitudinal end edge of the metal support layer 12 protrudes toward one longitudinal side more than one longitudinal end edge of the connector-side terminal 17 and the metal plating layer 31. Also, one longitudinal end edge of the base insulating layer 14 protrudes toward one longitudinal side more than one longitudinal end edge of the metal support layer 12. Therefore, the above-described optoelectronic hybrid substrate 4 has excellent connection reliability.

[0156] From the viewpoints of the rigidity and connection reliability of the electrical connection portion 7, preferably, the electrical connection portion 7 includes an optical waveguide film 13. That is, if the electrical connection portion 7 includes the optical waveguide film 13, the rigidity of the electrical connection portion 7 is improved, and the connection reliability is further improved.

[0157] Also, in the above description, after the resin varnish is exposed and developed in the formation of the base insulating layer 14 and the cover insulating layer 24, it is cured. On the other hand, for example, the resin varnish may be cured without being exposed and developed, and then the cured product of the resin varnish may be cut into a predetermined pattern.

[0158] Also, in the above description, on the other side in the thickness direction of the metal support layer 12, the underclad layer 20, the core layer 21, and the overclad layer 22 are formed in this order. On the other hand, for example, an optical waveguide film 13 may be formed in advance, and the optical waveguide film 13 may be adhered to the other side in the thickness direction of the metal support layer 12 via an adhesive.

Description of Reference Numerals

[0159] 1 Optoelectronic Composite Transmission Module 2 Printed Wiring Board 3 Electrical Connector 4 Optoelectronic Hybrid Substrate 6 Connector Terminal 7 Electrical Connection Portion 8 Electrical Transmission Portion 9 Optoelectronic Conversion Portion 10 Optical Transmission Portion 11 Flexible Wiring Board 12 Metal Support Layer 13 Optical waveguide film 14 Base insulating layer 15 Conductor layer 16 Conversion side terminal 17 Connector side terminal 18 Electrical wiring 19 Joining member 20 Underclad layer 21 Core layer 22 Overclad layer 23 Photoelectric conversion element 24 Cover insulating layer 25 Substrate 26 First surface 27 Second surface 28 Through-hole 29 Mirror 30 Third surface 31 Metal plating layer 32 Opening

Claims

1. An optoelectronic hybrid substrate comprising a metal support layer, a flexible wiring board, and an optical waveguide film, wherein the flexible wiring board is disposed on one side in the thickness direction of the metal support layer, a base insulating layer, a conductor layer disposed on one side in the thickness direction of the base insulating layer, the conductor layer comprising a wiring portion and a terminal portion continuous with the wiring portion, and a metal plating layer disposed on one side in the thickness direction of the terminal portion, wherein the optical waveguide film is disposed on the other side in the thickness direction of the metal support layer, the optoelectronic hybrid substrate comprising a connection portion disposed at one end in the longitudinal direction of the optoelectronic hybrid substrate, the connection portion including the metal support layer, the base insulating layer, the terminal portion, and the metal plating layer, in the connection portion, one end edge of the metal support layer in the longitudinal direction protrudes toward one side in the longitudinal direction more than one end edge of the terminal portion and the metal plating layer in the longitudinal direction, An optoelectronic hybrid substrate in which one end edge of the base insulating layer in the longitudinal direction protrudes toward one side in the longitudinal direction more than one end edge of the metal support layer in the longitudinal direction.

2. the connection portion includes the optical waveguide film, in the connection portion, one end edge of the optical waveguide film in the longitudinal direction protrudes toward one side in the longitudinal direction more than one end edge of the terminal portion and the metal plating layer in the longitudinal direction, The optoelectronic hybrid substrate according to claim 1, wherein one end edge of the metal support layer in the longitudinal direction protrudes toward one side in the longitudinal direction more than one end edge of the optical waveguide film in the longitudinal direction.

3. in the connection portion, The optoelectronic hybrid substrate according to claim 1, wherein a distance between one end edge of the base insulating layer in the longitudinal direction and one end edge of the terminal portion and the metal plating layer in the longitudinal direction is longer than 0.10 mm.

4. in the connection portion, The optoelectronic hybrid substrate according to claim 3, wherein a distance between one end edge of the base insulating layer in the longitudinal direction and one end edge of the terminal portion and the metal plating layer in the longitudinal direction is 0.12 mm or more.

5. in the connection portion, The optoelectronic hybrid substrate according to claim 4, wherein a distance between one end edge of the base insulating layer in the longitudinal direction and one end edge of the terminal portion and the metal plating layer in the longitudinal direction is 0.12 mm or more and 0.30 mm or less.

6. the connection portion includes the optical waveguide film, in the connection portion, the thickness of the metal support layer, The thickness of the flexible printed circuit board and, the thickness of the optical waveguide film have a total of 100 μm or more and 500 μm or less. The optoelectronic hybrid substrate according to claim 1.

7. The optoelectronic hybrid substrate according to claim 1, wherein the optical waveguide film is made of a photosensitive resin.

8. An optoelectronic hybrid substrate according to any one of claims 1 to 7, and an optical cable connected to the optoelectronic hybrid substrate comprising an active optical cable.

9. A method for manufacturing an optoelectronic hybrid substrate according to any one of claims 1 to 7, a step of preparing a metal support layer, a step of disposing the base insulating layer having an opening on one surface in the thickness direction of the metal support layer, a step of disposing the wiring portion of the conductor layer on one surface in the thickness direction of the base insulating layer, and disposing the terminal portion of the conductor layer on one surface in the thickness direction of the metal support layer exposed from the opening, a step of forming a metal plating layer on one surface in the thickness direction of the terminal portion by supplying power to the terminal portion in the opening from the metal support layer, processing one longitudinal end edge of the metal support layer, one longitudinal end edge of the metal support layer is made to protrude toward one longitudinal side from one longitudinal end edge of the terminal portion and the metal plating layer, and a step of making one longitudinal end edge of the base insulating layer protrude toward one longitudinal side from one longitudinal end edge of the metal support layer, a step of disposing an optical waveguide film on the other surface of the metal support layer with respect to one surface in the thickness direction comprising a method for manufacturing an optoelectronic hybrid substrate.

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