Work execution device, height measurement method, height measurement program, and recording medium

Abstract

To perform height measurement only at measurement points that are to be measured for a predetermined operation to be performed on a workpiece supported at a workpiece support position, thereby efficiently measuring the height of the measurement points.SOLUTION: From among 12 (M) measurement points P provided on a board B supported at a board support position A (work support position), target point information 924 is acquired that indicates three (N) measurement points P (target points) that satisfy a predetermined relationship with the mounting point L (work location) (step S202). Then, the heights of the three measurement points P indicated by the target point information 924 are measured (step S205). This makes it possible to efficiently measure the heights of the measurement points P by limiting the height measurement to the measurement points P that are to be measured for component mounting (predetermined work) to be performed on the board B (work) supported at the board support position A.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] This invention relates to a technique for measuring the height of a measurement point provided on a workpiece.

Background Art

[0002] When performing a predetermined operation at a work location of a workpiece, it is generally done to measure the height of the workpiece in advance in order to appropriately perform the predetermined operation according to the height of the workpiece. For example, Patent Document 1 discloses a technique for measuring the height of a substrate when mounting components at a planned mounting position provided on the substrate. Specifically, a plurality of provisional measurement points are provided on the substrate, and the height of the planned mounting position closest to the provisional measurement point is measured. Also, Patent Document 2 proposes a technique for shortening the time required for measuring the height of a workpiece before work execution. By measuring the heights of three or more measurement points arranged in a straight line on the substrate, approximating the cross-sectional shape with a curve from the heights of each measurement point, and correcting the height of the work location from this cross-sectional shape, the number of measurement points for measuring the height is limited.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In addition, from the perspective of shortening the measurement time of measurement points, the inventor of the present application has found the following problems. That is, a plurality of work heads are provided corresponding to each of a plurality of work support positions provided in series, and while transporting workpieces to the plurality of work support positions in order, each of the plurality of work heads performs work on the workpiece supported at the corresponding work support position. In this case, a plurality of work heads share the work on one workpiece. Therefore, among the plurality of measurement points provided on the workpiece supported at one work support position, there may be measurement points different from the measurement points to be measured for the work to be performed by the work head corresponding to the one work support position. Nevertheless, since the heights of all the plurality of measurement points provided on the workpiece were measured, it sometimes took a long time to complete the height measurement of the measurement points.

[0005] This invention has been made in view of the above problems, and an object thereof is to limit the measurement of height to the measurement points to be measured for a predetermined work to be performed on the workpiece supported at the work support position, and to enable the efficient measurement of the height of the measurement points.

Means for Solving the Problems

[0006] The work execution device according to the present invention includes a work support unit that supports a workpiece provided with a work location where a predetermined work is to be performed at a work support position, a work head that performs a predetermined work at the work location of the workpiece supported at the work support position, a height measurement unit that measures the height of the workpiece supported by the work support unit, an information acquisition unit that acquires target point information indicating N (N is an integer of 1 or more and less than M) target points among M (M is an integer of 2 or more) measurement points provided on the workpiece, which satisfy a predetermined relationship with the work location, and a height measurement control unit that causes the height measurement unit to measure the heights of the N target points indicated by the target point information.

[0007] The height measurement method according to the present invention includes a step of supporting a workpiece having a work location where a predetermined operation is performed at a workpiece support position, and among M measurement points (where M is an integer of 2 or more) provided on the workpiece supported at the workpiece support position, a step of obtaining target point information indicating N target points (where N is an integer of 1 or more and less than M) that satisfy a predetermined relationship with the work location, and a step of measuring the heights of the N target points indicated by the target point information.

[0008] The height measurement program according to the present invention causes a computer to execute the above height measurement method.

[0009] The recording medium according to the present invention records the above height measurement program in a computer-readable manner.

[0010] In the present invention (work execution device, height measurement method, height measurement program, and recording medium) configured as described above, among M measurement points (where M is an integer of 2 or more) provided on the workpiece supported at the workpiece support position, target point information indicating N target points (where N is an integer of 1 or more and less than M) that satisfy a predetermined relationship with the work location is obtained. Then, the heights of the N target points indicated by the target point information are measured. As a result, it is possible to efficiently measure the heights of the measurement points by limiting the measurement to the measurement points to be measured for the predetermined operation to be performed on the workpiece supported at the workpiece support position.

[0011] Further, the work execution device may be configured such that the target point information indicates the top N measurement points among the M measurement points in the order of being closer to the work location as the N target points. With such a configuration, it is possible to appropriately execute the predetermined operation on the work location based on the measurement results of the heights of the N target points.

[0012] Further, N is 3, and the work execution device may be configured such that the target point information indicates N measurement points that satisfy a relationship such that a triangle having the N measurement points as vertices includes at least a part of the work location as the N target points. With such a configuration, it is possible to appropriately execute the predetermined operation on the work location based on the measurement results of the heights of the N target points.

[0013] Furthermore, it further includes a component supply unit that supplies components, a horizontal drive unit that drives the work head in the horizontal direction, a lifting drive unit that raises and lowers a nozzle attached to a shaft of the work head, a mounting control unit that controls the mounting of components on the work piece, and a lowering distance calculation unit that calculates a lowering distance for lowering the nozzle by the lifting drive unit. The mounting control unit moves the work head that has adsorbed the component supplied by the component supply unit by the horizontal drive unit to face the component from above the work piece, and then lowers the nozzle by the lowering distance by the lifting drive unit to bring the component into contact with the work piece, thereby mounting the component on the work piece. The lowering distance calculation unit may be configured to calculate the lowering distance during the period after the nozzle adsorbs the component and before the nozzle starts to lower. In such a configuration, the lowering distance of the nozzle is calculated after the nozzle adsorbs the component, not before. Therefore, the component adsorption of the nozzle can be started without waiting for the completion of the calculation of the lowering distance, and the execution of the component on the substrate can be efficiently performed.

[0014] In addition, various specific acquisition modes of the target point information are conceivable. For example, the information acquisition unit may acquire the target point information by calculating the target point information based on the position of the measurement point and the position of the work location. Alternatively, the information acquisition unit may acquire the target point information by receiving the target point information from an external device.

Advantages of the Invention

[0015] As described above, according to the present invention, it is possible to efficiently measure the height of the measurement point by performing height measurement limited to the measurement point to be measured for a predetermined operation to be performed on the work piece supported at the work support position.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 7C

Figure 8

Embodiments for Carrying Out the Invention

[0017] FIG. 1 is a diagram schematically showing an example of a substrate production system that produces a component-mounted substrate by mounting components on a substrate, and FIG. 2 is a diagram schematically showing an example of a substrate. In FIG. 2 and the following figures, the X direction, which is the horizontal direction, the Y direction, which is the horizontal direction orthogonal to the X direction, and the Z direction, which is the vertical direction, are appropriately shown.

[0018] The board production system S in FIG. 1 includes a plurality of (three) component mounters 1 arranged in series in the X direction, and a server computer C that controls each component mounter 1. A board B is transported to the plurality of component mounters 1 in order, and each component mounter 1 mounts a component E on the transported board B. In each component mounter 1, the board B is supported parallel to the X direction and the Y direction (i.e., supported horizontally). As shown in FIG. 2, the board B is provided with a plurality of mounting points L1 to L6 at different positions. Here, the mounting points L1 to L6 are, for example, a pair of land electrodes. In the following, when the mounting points L1 to L6 are not particularly distinguished from each other, they are collectively referred to as mounting points L.

[0019] The multiple mounters 1 share and execute the mounting of components E on multiple mounting points L1 to L6 according to instructions from the server computer C. For example, the first mounter 1 (left end of FIG. 1) in the transfer order of the board B is responsible for mounting components E on the mounting points L3 and L4, the second mounter 1 (middle of FIG. 1) in the transfer order of the board B is responsible for mounting components E on the mounting points L1, L2, and L6, and the third mounter 1 (right end of FIG. 1) in the transfer order of the board B is responsible for mounting components E on the mounting point L5. In addition, multiple measurement points P1 to P12 are provided on the board B at different positions. The measurement points P1 to P16 are points that are measured to obtain the height of the board B. When the measurement points P1 to P16 are not particularly distinguished, they are collectively referred to as measurement points P.

[0020] Fig. 3 is a partial plan view showing an example of a component mounter that implements a height measurement method according to the present invention, Fig. 4 is a block diagram showing an example of an electrical configuration of the component mounter of Fig. 3, and Fig. 5 is a diagram showing an example of an operation from component pickup to mounting performed by the component mounter. Note that Fig. 3 shows the Ya side and the Yb side in the Y direction. Here, the Ya side and the Yb side face in opposite directions.

[0021] As shown in FIG. 4, the component mounter 1 includes a control unit 9 that comprehensively controls the component mounter 1. The control unit 9 has an arithmetic processing unit 91, a storage unit 92, a drive control unit 93, an imaging control unit 94, and a sensor control unit 95. The arithmetic processing unit 91 is a processor such as a CPU (Central Processing Unit) that performs the arithmetic functions of the component mounter 1, and the storage unit 92 is a storage device such as an SSD (Solid State Drive) or an HDD (Hard Disk Drive). In this storage unit 92, there are stored a component mounting program 921 that defines the procedure for mounting the component E on the mounting point L of the substrate B, mounting point information 922 indicating the positions of the respective mounting points L provided on the substrate B, and measurement point information 923 indicating the positions of the respective measurement points P provided on the substrate B. The drive control unit 93 controls the drive system provided in the component mounter 1 in response to commands from the arithmetic processing unit 91, the imaging control unit 94 controls the imaging system provided in the component mounter 1 in response to commands from the arithmetic processing unit 91, and the sensor control unit 95 acquires the output of the sensor provided in the component mounter 1 in response to commands from the arithmetic processing unit 91 and transmits it to the arithmetic processing unit 91.

[0022] The component mounter 1 includes a base 11 having a substantially rectangular shape in plan view and a substrate conveyance unit 2 attached to the base 11. The substrate conveyance unit 2 has a pair of conveyors 21 arranged parallel to the X direction, and conveys the substrate B in the X direction (substrate conveyance direction) by the pair of conveyors 21. Specifically, the substrate conveyance unit 2 receives the substrate B from the upstream side in the X direction in response to a loading command from the drive control unit 93 and supports the substrate B at a predetermined substrate support position A (the position of the substrate B in FIG. 3). Further, the substrate conveyance unit 2 unloads the substrate B on which the component E has been mounted at the substrate support position A from the substrate support position A to the downstream side in the X direction in response to an unloading command from the drive control unit 93.

[0023] The component mounter 1 is equipped with two mounting heads 3a and 3b. The mounting head 3a is provided on the Ya side of the mounting head 3b, and the mounting head 3b is provided on the Yb side of the mounting head 3a. Each of the mounting heads 3a and 3b is an in-line type mounting head having a plurality of shafts 31 arranged in a row in the X direction. Each shaft 31 extends in the Z direction, and a suction nozzle 32 is detachably attached to the lower end of each shaft 31. Further, the component mounter 1 includes Z motors 47 attached to each of the mounting heads 3a and 3b. The Z motor 47 is provided for each of the plurality of shafts 31 that the mounting heads 3a and 3b have, and drives the corresponding shaft 31 in the Z direction. That is, the mounting heads 3a and 3b can individually raise and lower each of the shafts 31 by the Z motor 47. These mounting heads 3a and 3b mount the component E on the substrate B by placing the component E adsorbed by the suction nozzle 32 on the substrate B. Note that the specific type of the mounting heads 3a and 3b is not limited to the in-line type, and a rotary type in which a plurality of shafts 31 are arranged in a circular shape may also be acceptable.

[0024] In addition, the component mounting machine 1 is provided with an XY drive mechanism 4 that individually drives each of the two mounting heads 3a and 3b in the X and Y directions. This XY drive mechanism 4 has X beams 41a and 41b that extend parallel to the X direction and support the mounting heads 3a and 3b so as to be movable in the X direction. Each of the X beams 41a and 41b is attached with a ball screw 42 that extends parallel to the X direction and an X motor 43 that rotationally drives the ball screw 42. The X motor 43 is a servo motor in this example. And the mounting heads 3a and 3b are respectively attached to the nuts of the ball screws 42 of the X beams 41a and 41b. Furthermore, the XY drive mechanism 4 has a pair of Y beams 44 and 44 that extend parallel to the Y direction. One end of each of the X beams 41a and 41b is supported by one of the Y beams 44 so as to be movable in the Y direction, and the other end of each of the X beams 41a and 41b is supported by the other Y beam 44 so as to be movable in the Y direction. A Y motor 45 that drives the X beams 41a and 41b in the Y direction is attached to each of the Y beams 44. Each of the Y motors 45 is a linear motor in this example and has movers 451 and 451 attached to both ends of the X beams 41a and 41b and stators 452 and 452 that extend parallel to the Y direction. And the X beams 41a and 41b are driven in the Y direction together with the movers 451 by the magnetic force acting between the movers 451 and the stators 452. According to such an XY drive mechanism 4, the mounting heads 3a and 3b can be moved in the X and Y directions by the X motor 43 and the Y motor 45. That is, the XY drive mechanism 4 moves the mounting head 3a in the X and Y directions on the Ya side of the mounting head 3b and moves the mounting head 3b in the X and Y directions on the Yb side of the mounting head 3a.

[0025] Furthermore, the component mounting machine 1 includes a component supply unit 5a disposed on the Ya side in the Y direction of the substrate conveyance unit 2 and a component supply unit 5b disposed on the Yb side in the Y direction of the substrate conveyance unit 2. In each of the component supply units 5a and 5b, a plurality of tape feeders 51 arranged in the X direction are detachably mounted. Each tape feeder 51 intermittently feeds in the Y direction a tape storing chip-like components E (chip components) such as integrated circuits, transistors, capacitors, etc. at predetermined intervals, thereby supplying the components E in the tape to the component supply position.

[0026] The component E thus supplied by the tape feeder 51 of the component supply unit 5a is mounted on the substrate B at the substrate support position A by the mounting head 3a, and the component E supplied by the tape feeder 51 of the component supply unit 5b is mounted on the substrate B at the substrate support position A by the mounting head 3b. The details will be described below by taking the component mounting by the mounting head 3a as an example.

[0027] The drive control unit 93 drives the mounting head 3a by the XY drive mechanism 4 to oppose the suction nozzle 32 mounted on the lower end of the shaft 31 of the mounting head 3a to the component E supplied by the tape feeder 51 of the component supply unit 5a from above (step S101 in FIG. 5). Then, the drive control unit 93 lowers the shaft 31 by the Z motor 47 to bring the suction nozzle 32 into contact with the upper surface of the component E (step S102), and the mounting head 3a applies a negative pressure to the suction nozzle 32 to suck the component E onto the suction nozzle 32. Further, the drive control unit 93 raises the shaft 31 on which the suction nozzle 32 sucking the component E is mounted by the Z motor 47 to take out the component E from the tape feeder 51 (step S103). Subsequently, the drive control unit 93 drives the mounting head 3a by the XY drive mechanism 4 to oppose the component E sucked by the suction nozzle 32 on the shaft 31 of the mounting head 3a to the mounting point L of the substrate B from above (step S104). Then, the drive control unit 93 lowers the shaft 31 and the suction nozzle 32 by a predetermined descending distance D by the Z motor 47 to bring the component E sucked by the suction nozzle 32 into contact with the surface of the substrate B (step S105), and the mounting head 3a applies atmospheric pressure or positive pressure to the suction nozzle 32 to detach the component E from the suction nozzle 32 to the substrate B. Thus, the component E is mounted on the substrate B. The component mounting by the mounting head 3b is the same.

[0028] The component mounting machine 1 is provided with two side view cameras 6a and 6b corresponding to two mounting heads 3a and 3b. The side view cameras 6a and 6b are respectively attached to the corresponding mounting heads 3a. The detailed operation will be described by taking the side view camera 6a as an example. The side view camera 6a captures an image of the component E sucked by the corresponding mounting head 3a with the suction nozzle 32 from the horizontal direction to obtain a side view image. The acquisition of this side view image is executed after the suction of the component E and before the mounting of the component E on the substrate B. For example, it can be executed during the period from when the mounting head 3a takes out the component E from the component supply unit 5 with the suction nozzle 32 until the component E is opposed to the mounting point L (the period of steps S103 to S104). The side view camera 6a captures the component E in response to a command from the imaging control unit 94 to obtain a side view image, and transmits the side view image to the imaging control unit 94. The arithmetic processing unit 91 recognizes the height of the component E based on the side view image acquired by the imaging control unit 94. Then, the arithmetic processing unit 91 adjusts the lowering distance D based on the recognized height. The side view camera 6b corresponding to the mounting head 3b also has the same configuration and function.

[0029] Furthermore, the component mounter 1 includes two height sensors 8a and 8b provided corresponding to the two mounting heads 3a and 3b. Each of the height sensors 8a and 8b is a laser distance sensor and measures the distance to the measurement point P provided on the substrate B. As the laser distance sensor, a triangulation distance sensor or a time-of-flight sensor can be used. However, the sensors that can be used as the height sensors 8a and 8b are not limited to laser distance sensors, and ultrasonic distance sensors may also be used. The height sensors 8a and 8b are respectively fixed to the corresponding mounting heads 3a and 3b and move along with the mounting heads 3a and 3b. Therefore, the drive control unit 93 can move the height sensor 8a in the X and Y directions on the Ya side of the height sensor 8b by driving the mounting head 3a by the XY drive mechanism 4, and can move the height sensor 8b in the X and Y directions on the Yb side of the height sensor 8a by driving the mounting head 3b by the XY drive mechanism 4. When measuring the height of the measurement point P, the drive control unit 93 drives the height sensor 8a in the X and Y directions to oppose the height sensor 8a to the measurement point P from above. Then, the height sensor 8a measures the height of the opposing measurement point P and acquires height data indicating the height of the measurement point P. This height data is transmitted from the height sensor 8a to the sensor control unit 95, and the arithmetic processing unit 91 acquires the height of the measurement point P based on the height data received by the sensor control unit 95. Acquisition of height data by the height sensor 8b is also executed in the same manner.

[0030] FIG. 6 is a flowchart showing an example of component mounting operation performed by one component mounter on a substrate, FIG. 7A is a diagram showing an example of mounting point information used in the flowchart of FIG. 6 in a table format, FIG. 7B is a diagram showing an example of measurement point information used in the flowchart of FIG. 6 in a table format, FIG. 7C is a diagram showing an example of target point information created in the flowchart of FIG. 6 in a table format, and FIG. 8 is a diagram schematically showing the operation performed on the substrate in the component mounting operation of FIG. 6. The flowchart of FIG. 6 is executed under the control of the arithmetic processing unit 91 based on the component mounting program 921. Here, among the three component mounters 1 in FIG. 1, the component mounter 1 that performs the second mounting on the substrate B is taken as an example for explanation. However, the first and third component mounters 1 also perform the component mounting operation in the same manner.

[0031] In step S201, the arithmetic processing unit 91 extracts a mounting point L for mounting component E on the component mounter 1 to which the arithmetic processing unit 91 belongs from among a plurality of mounting points L on the substrate B. Specifically, the arithmetic processing unit 91 receives mounting point information 922 (FIG. 7A) indicating the positions (XY coordinates) of the responsible mounting points L1, L2, L6, which are the mounting points L responsible for component E, from the server computer C, and extracts the mounting point L by checking the mounting point information 922. In the example of FIG. 8, at mounting points L3 and L4, component E is first mounted by the component mounter 1 (left end in FIG. 1) to which the substrate B is first conveyed, and at mounting point L6, component E is later mounted by the component mounter 1 (right end in FIG. 1) to which the substrate B is third conveyed.

[0032] In step S202, the arithmetic processing unit 91 extracts a measurement point P (target point) to be measured from among a plurality of measurement points P provided on the substrate B. Specifically, measurement point information 923 (FIG. 7B) indicating the positions (XY coordinates) of the plurality of measurement points P provided on the substrate B is received from the server computer C. Then, among the plurality of measurement points P1 to P12 indicated by the measurement point information 923, measurement points P that satisfy a predetermined positional relationship with the responsible mounting points L1, L2, and L6 are extracted. In this example, the top 3 measurement points P in the order of proximity to the mounting point L are extracted. The extraction of these 3 measurement points P is performed for each of the responsible mounting points L1, L2, and L6. That is, for the responsible mounting point L1, the top 3 measurement points P1, P5, and P6 are extracted from the measurement point information 923 (FIG. 7B) as target points 1, 2, and 3 in the order of proximity to the XY coordinates (8, 18) of the responsible mounting point L1. For the responsible mounting point L2, the top 3 measurement points P5, P9, and P10 are extracted from the measurement point information 923 (FIG. 7B) as target points 1, 2, and 3 in the order of proximity to the XY coordinates (12, 7) of the responsible mounting point L2. For the responsible mounting point L16, the top 3 measurement points P7, P8, and P12 are extracted from the measurement point information 923 (FIG. 7B) as target points 1, 2, and 3 in the order of proximity to the XY coordinates (32, 13) of the responsible mounting point L6. In this way, target point information 924 (FIG. 7C) indicating the relationship between the responsible mounting points L1, L2, and L6 and the measurement point P (target point) to be measured is generated and stored in the storage unit 92. This target point information 924 associates the mounting point L (mounting point number), the XY coordinates of the mounting point L, and target points 1 to 3, and shows it for each mounting point L. In this way, 8 measurement points P1, P5, P6, P7, P8, P9, P10, and P12 are extracted as measurement targets, that is, target points.

[0033] Note that the timing for extracting the mounting points L in step S201 and the measurement points P in step S202 is not limited to the example in FIG. 6. For example, the extraction in steps S201 and S202 may be performed after the loading of the substrate B in step S203. In particular, when the substrate B is marked with a bad mark, since the mounting points L may change depending on the substrate B, it is preferable to perform the extraction in steps S201 and S202 for each loaded substrate B. Alternatively, when the substrate B is not marked with a bad mark, the extraction in steps S201 and S202 may be performed at the timing of creating a program for causing the three component mounters 1 shown in FIG. 1 to execute component mounting.

[0034] Incidentally, as shown in FIG. 8, the triangle (broken-line triangle) having the three measurement points P extracted as the target points as its vertices includes at least a part (in other words, overlaps) of the mounting points L corresponding to the three measurement points P. For example, the triangle having the measurement points P1, P5, and P6 as its vertices includes at least a part of the mounting point L1 corresponding to the measurement points P1, P5, and P6.

[0035] In step S203, the substrate transfer unit 2 loads and supports the substrate B at the substrate support position A, and in step S204, by imaging the fiducial mark of the substrate B with a camera (not shown), the position of the substrate B in the X direction and the Y direction is recognized by the arithmetic processing unit 91.

[0036] In step S205, height measurement for measuring the height of the measurement points P is performed for each of the measurement points P1, P5, P6, P7, P8, P9, P10, and P12 which are the target points, by opposing the height sensors 8a or 8b to the measurement points P from above and measuring the distance to the measurement points P by the height sensors 8a or 8b. Thus, the height of each of the measurement points P1, P5, P6, P7, P8, P9, P10, and P12 is obtained. Note that in step S205, the height measurement is performed only for the measurement points P1, P5, P6, P7, P8, P9, P10, and P12 extracted as the target points, and the height measurement is not performed for the other measurement points P not extracted as the target points.

[0037] In step S206, the mounting head 3a or 3b adsorbs the component E and mounts it at the mounting point L. For example, when mounting the component E at the mounting point L1, the mounting head 3b closer to the mounting point L1 among the mounting heads 3a and 3b adsorbs the component E from the component supply unit 5b (steps S101 to S103 in FIG. 5).

[0038] In step S207, the drop distance D of the component E required to mount the adsorbed component E at the mounting point L1 is calculated by the arithmetic processing unit 91. Specifically, the height of the component E is calculated from the side view image of the component E captured by the side view camera 6b mounted on the mounting head 3b. Subsequently, the height of the mounting point L1 is calculated based on the heights of the three measurement points P1, P5, and P6 extracted for the mounting point L1. That is, a virtual plane passing through the three measurement points P1, P5, and P6 is calculated based on the positions (XY coordinates) of the measurement points P1, P5, and P6 and the heights (Z coordinates) of the measurement points P1, P5, and P6, and the height of the virtual plane at the position (XY coordinates) of the mounting point L1 is calculated as the height of the mounting point L1. Then, the difference between the height of the component E and the height of the mounting point L1 is calculated as the drop distance D.

[0039] In step S208, the component E adsorbed on the mounting head 3b is opposed to the mounting point L1 from above (step S104), and the component E is lowered by the drop distance D calculated in step S207 (step S105). Thereby, the component E is mounted at the mounting point L1.

[0040] Steps S206 to S208 are executed for each of the assigned mounting points L1, L2, and L6. When the component E is mounted on all of the assigned mounting points L1, L2, and L6 (when "YES" in step S209), the substrate B is carried out from the substrate support position A and returns to step S203.

[0041] In the embodiment configured as described above, among the 12 (M) measurement points P provided on the substrate B supported at the substrate support position A (work support position), target point information 924 indicating 3 (N) measurement points P (target points) that satisfy a predetermined relationship with the mounting point L (work location) is acquired (step S202). Then, the heights of the 3 measurement points P indicated by the target point information 924 are measured (step S205). As a result, it is possible to efficiently measure the heights of the measurement points P by limiting the measurement to the measurement points P to be measured for component mounting (predetermined work) performed on the substrate B (work) supported at the substrate support position A.

[0042] Further, the target point information 924 indicates, as target points, each of the top 3 measurement points P among the 12 measurement points P in the order closest to the mounting point L. With such a configuration, it is possible to accurately determine the height of the mounting point L based on the measurement results of the heights of the 3 measurement points P and appropriately perform component mounting on the mounting point L.

[0043] Further, the target point information 924 indicates, as target points, each of the 3 measurement points P that satisfy a relationship such that a triangle having the 3 measurement points P as vertices includes at least a part of the mounting point L. With such a configuration, it is possible to accurately determine the height of the mounting point L based on the measurement results of the heights of the 3 measurement points P and appropriately perform component mounting on the mounting point L.

[0044] Also provided are a component supply unit 5 that supplies component E, an XY drive mechanism 4 (horizontal drive unit) that drives the mounting heads 3a and 3b (working heads) in the horizontal direction, and a Z motor 47 (lifting drive unit) that raises and lowers the suction nozzles 32 attached to the shafts 31 of the mounting heads 3a and 3b. Then, an arithmetic processing unit 91 (mounting control unit, descent distance calculation unit) calculates a descent distance D for lowering the suction nozzles 32 by the Z motor 47 and controls the mounting of component E onto the substrate B. That is, the arithmetic processing unit 91 moves the mounting heads 3a and 3b that have adsorbed component E supplied by the component supply unit 5 by the XY drive mechanism 4 so that component E faces the mounting point L of the substrate B from above, and then lowers the suction nozzles 32 by the descent distance D by the Z motor 47 to bring component E into contact with the mounting point L of the substrate B, thereby mounting component E onto the substrate B. In particular, the arithmetic processing unit 91 calculates the descent distance D during the period after the suction nozzles 32 have adsorbed component E and before the suction nozzles 32 start to descend toward the mounting point L (step S207). With such a configuration, the descent distance D of the suction nozzles 32 is calculated after the suction nozzles 32 have adsorbed component E, rather than before. Therefore, the suction of component E by the suction nozzles 32 can be started without waiting for the completion of the calculation of the descent distance D, and the mounting of component E onto the substrate B can be performed efficiently.

[0045] In the embodiments described above, the mounting points L1, L2, and L6 correspond to an example of the "working location" of the present invention, the substrate B corresponds to an example of the "workpiece" of the present invention, the substrate support position A corresponds to an example of the "workpiece support position" of the present invention, the substrate transfer unit 2 corresponds to an example of the "workpiece support unit" of the present invention, the mounting heads 3a and 3b correspond to an example of the "working head" of the present invention, the height sensors 8a and 8b correspond to an example of the "height measurement unit" of the present invention, the twelve measurement points P1 to P12 correspond to an example of the "M (M is an integer of 2 or more) measurement points" of the present invention, each of the three measurement points P1, P5, P6, the three measurement points P5, P9, P10, and the three measurement points P7, P8, P12 corresponds to an example of the "N (N is an integer of 1 or more and less than M) target points" of the present invention, the target point information 924 corresponds to an example of the "target point information" of the present invention, the arithmetic processing unit 91 corresponds to an example of the "information acquisition unit" of the present invention, the arithmetic processing unit 91 corresponds to an example of the "height measurement control unit" of the present invention, the component mounter 1 corresponds to an example of the "work execution device" of the present invention, the component supply unit 5 corresponds to an example of the "component supply unit" of the present invention, the XY drive mechanism 4 corresponds to an example of the "horizontal drive unit" of the present invention, the shaft 31 corresponds to an example of the "shaft" of the present invention, the suction nozzle 32 corresponds to an example of the "nozzle" of the present invention, the Z motor 47 corresponds to an example of the "lifting drive unit" of the present invention, the arithmetic processing unit 91 corresponds to an example of the "mounting control unit" of the present invention, the lowering distance D corresponds to an example of the "lowering distance" of the present invention, the arithmetic processing unit 91 corresponds to an example of the "lowering distance calculation unit" of the present invention, the component mounting program 921 corresponds to an example of the "height measurement program" of the present invention, and the storage unit 92 corresponds to an example of the "recording medium" of the present invention.

[0046] Note that the present invention is not limited to the above-described embodiments, and various modifications can be made to the above-described embodiments without departing from the spirit thereof. For example, the acquisition of the target point information 924 does not necessarily have to be performed by generation by the arithmetic processing unit 91 of the component mounter 1. That is, the target point information 924 generated by the substrate production system S (a device external to the component mounter 1) may be transmitted from the substrate production system S to the component mounter 1, and the arithmetic processing unit 91 may acquire the target point information 924 received by the component mounter 1.

[0047] In addition, the specific criteria for extracting the measurement points P based on the mounting points L can be changed as appropriate. For example, among any three measurement points P each having a triangle with its own vertex and including the entire mounting points L, the top three measurement points P in the order from the closest to the mounting points L may be extracted. Alternatively, for example, among any three measurement points P each having a triangle with its own vertex and including the entire mounting points L, the three measurement points P with the smallest area of the said triangle may be extracted.

[0048] In addition, the number of measurement points P extracted for one mounting point L in step S202 is not limited to three, and may be one, two, or four or more.

[0049] In addition, the number of mounting heads does not have to be two, and may be one.

[0050] In addition, the timing for calculating the descent distance D is not limited to the above example, and may be before the adsorption of the component E in step S206.

[0051] In addition, when producing a substrate with a single component mounter (for example, described in JP-A-2011-054900 or JP-A-2016-018884) that supports a plurality of substrates at each of a plurality of mounting positions and transports the substrates to the plurality of mounting positions in order while mounting components at each mounting position, the above height measurement may be applied in the same manner. That is, when measuring the height of a substrate transported and supported at one mounting position, the measurement is limited to the measurement points extracted based on the mounting points where components are mounted at one mounting position, and when measuring the height of a substrate transported and supported at another mounting position, control may be performed so that the measurement is limited to the measurement points extracted based on the mounting points where components are mounted at the other mounting position.

[0052] In addition, a specific example of the device that functions as the work execution device is not limited to a component mounter, and may be a dispenser that applies an adhesive to a substrate.

[0053] In addition, the specific object of the height measurement is not limited to the substrate B.

[0054] Also, although the provision mode of the component mounting program 921 has not been particularly described, for example, the component mounting program 921 may be downloaded from a server to the storage unit 92. In this case, the server corresponds to the "recording medium" of the present invention.

[0055] Also, the configuration of the illustrated substrate B is merely an example, and of course, the number and arrangement of the measurement points P and the number and arrangement of the mounting points L have various variations.

Explanation of Reference Numerals

[0056] 1... Component mounter 2... Substrate conveyance unit 31... Shaft 32... Suction nozzle 3a... Mounting head 4... Driving mechanism 47... Z motor 5... Component supply unit 8a... Height sensor 91... Arithmetic processing unit 92... Storage unit 921... Component mounting program 924... Target point information A... Substrate support position B... Substrate D... Lowering distance L1... Mounting point L2... Mounting point L6... Mounting point P1~P12... Measurement points

Claims

1. A work support unit that supports a work provided with a work location where a predetermined operation is to be performed at a work support position; A work head that performs the predetermined operation on the work location of the work supported at the work support position; A height measurement unit that measures the height of the work supported by the work support unit; An information acquisition unit that acquires target point information indicating N (where N is an integer greater than or equal to 1 and less than M) target points out of M (where M is an integer of 2 or more) measurement points provided on the work, which satisfy a predetermined relationship with the work location; A height measurement control unit that causes the height measurement unit to measure the heights of the N target points indicated by the target point information A work execution device comprising the same.

2. The work execution device according to claim 1, wherein the target point information indicates the top N measurement points among the M measurement points in the order of proximity to the work location as the N target points.

3. N is 3, The work execution device according to claim 1 or 2, wherein the target point information indicates the N measurement points that satisfy a relationship such that a triangle having the N measurement points as vertices includes at least a part of the work location as the N target points.

4. A component supply unit that supplies components; A horizontal drive unit that drives the work head in the horizontal direction; A lifting drive unit that raises and lowers a nozzle attached to a shaft of the work head; A mounting control unit that controls the mounting of the components on the work; A descent distance calculation unit that calculates a descent distance for lowering the nozzle by the lifting drive unit; Further comprising: The mounting control unit moves the work head that has adsorbed the component supplied by the component supply unit by the nozzle by the horizontal drive unit to face the component from above the work, and then lowers the nozzle by the descent distance by the lifting drive unit to bring the component into contact with the work, thereby mounting the component on the work. The work execution device according to claim 1, wherein the descent distance calculation unit calculates the descent distance during a period after the nozzle has adsorbed the component and before the nozzle starts to descend.

5. The work execution device according to claim 1, wherein the information acquisition unit acquires the target point information by calculating the target point information based on the positions of the measurement points and the work location.

6. The work execution device according to claim 1, wherein the information acquisition unit acquires the target point information by receiving the target point information from an external device.

7. A step of supporting a workpiece having a work location where a predetermined operation is to be performed at a workpiece support position; Among M (M is an integer of 2 or more) measurement points provided on the workpiece supported at the workpiece support position, a step of acquiring target point information indicating N (N is an integer of 1 or more and less than M) target points that satisfy a predetermined relationship with the work location; A step of measuring the heights of the N target points indicated by the target point information; A height measurement method comprising:

8. A height measurement program for causing a computer to execute the height measurement method according to Claim 7.

9. A recording medium on which the height measurement program according to Claim 8 is recorded so as to be readable by a computer.

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