Wafer container cleaning device

Abstract

To effectively reduce particle residue inside the body.SOLUTION: A wafer container cleaning device according to an embodiment includes a cleaning tank body that houses the body of a wafer storage container, the body having a storage space for storing semiconductor wafers and an opening to the storage space, a mounting portion that is arranged within the cleaning tank body and has a mounting surface on which the body is placed with the opening facing downward and that supports the body via the mounting surface, a cleaning liquid supply portion that cleans the inside and outside of the body by supplying cleaning liquid to the inside of the body, which serves as a wall surface surrounding the storage space, and the outside, which serves as an outer wall surface, a first waste liquid receiving portion that receives waste liquid, which is the cleaning liquid after cleaning the inside of the body, and discharges it to the outside, a second waste liquid receiving portion that receives waste liquid, which is the cleaning liquid after cleaning the outside of the body, and discharges it to the outside, and an exhaust portion that exhausts air from the storage space formed by at least the inside of the body.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Embodiments of the present invention relate to a wafer storage container cleaning device.

Background Art

[0002] Conventionally, there is a wafer storage container cleaning device for cleaning and drying wafer storage containers such as FOUP (Front Opening Unified Pod) and FOSB (Front Opening Shipping Box) that store (accommodate) semiconductor wafers.

[0003] In a wafer storage container, impurities (particles) may adhere to the wall surface (inside of the wafer storage container) surrounding the storage space where the semiconductor wafer is stored when the door (lid) is opened and closed or when the semiconductor wafer is taken in and out. Therefore, at least the inside of the wafer storage container is cleaned by the cleaning tank of the wafer storage container cleaning device. In such a wafer storage container cleaning device, there is a desire to effectively reduce the remaining particles inside the wafer storage container.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present invention has been made to solve the above problems, and an object thereof is to provide a wafer storage container cleaning device capable of effectively reducing the remaining particles inside the wafer storage container.

Means for Solving the Problems

[0006] In order to solve the above-described problems and achieve the object, a wafer storage container cleaning apparatus according to an aspect of the present invention includes a cleaning tank body that houses the main body of a wafer storage container having a storage space for storing semiconductor wafers and an opening of the storage space, a placement portion that is disposed in the cleaning tank body and has a placement surface on which the main body is placed with the opening facing downward, and supports the main body by the placement surface, a cleaning liquid supply portion that supplies cleaning liquid to the inner side as a wall surface surrounding the storage space and the outer side as an outer wall surface of the main body to clean the inner and outer sides of the main body, a first drain receiving portion that receives drain liquid which is the cleaning liquid after cleaning the inner side of the main body and discharges the received drain liquid to the outside, a second drain receiving portion that receives drain liquid which is the cleaning liquid after cleaning the outer side of the main body and discharges the received drain liquid to the outside, and an exhaust portion that exhausts the storage space constituted at least by the inner side of the main body.

Advantages of the Invention

[0007] According to an aspect of the present invention, it is possible to effectively reduce the residue of particles inside the wafer storage container by the drain liquid of the cleaning liquid.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiment for Carrying Out the Invention

[0009] Hereinafter, with reference to the accompanying drawings, embodiments of the wafer storage container cleaning apparatus disclosed in the present application will be described in detail. Note that the wafer storage container cleaning apparatus disclosed in the present application is not limited to the following embodiments. Also, each embodiment and each modification can be appropriately combined within a range where no contradiction occurs. In the following embodiments, the case where the wafer storage container to be cleaned is a FOUP will be described as an example, but the wafer storage container to be cleaned is not limited to this. For example, the wafer storage container to be cleaned may be a FOSB.

[0010] (Embodiment) FIG. 1 is a plan view showing an example of the schematic configuration of a wafer storage container cleaning apparatus 1 according to the embodiment. In the present embodiment, the FOUP 20, which is a wafer storage container to be cleaned, includes a main body (FOUP main body) 20a and a door 20b. The main body 20a has a storage space for storing semiconductor wafers. The door 20b is provided in a state where it can be opened and closed with respect to the opening of the storage space. Further, a flange 20c is provided on the upper part of the main body 20a. The flange 20c is a portion that is gripped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport) or a robot 3 or the like. In the present embodiment, in the main body 20a, the portion of the inner wall surface surrounding the storage space is referred to as the "inside", and the portion of the outer wall surface is referred to as the "outside". That is, the inside of the main body 20a constitutes the storage space. Similarly, in the door 20b, in a state of being connected to the main body 20a, the portion facing the storage space is referred to as the "inside", and the portion facing the outside is referred to as the "outside".

[0011] The wafer storage container cleaning device 1 is provided, for example, inside a factory that manufactures semiconductor wafers, and cleans the wafer storage containers. As shown in FIG. 1, the wafer storage container cleaning device 1 includes a load port 2, a robot 3, a disassembling / connecting stage 4, a cleaning tank 5, an unload port 6, and a control unit 7.

[0012] The robot 3, the disassembling / connecting stage 4, the cleaning tank 5, and the control unit 7 are provided inside the casing 1a of the wafer storage container cleaning device 1. On the other hand, the load port 2 and the unload port 6 are provided straddling the inside and outside of the casing 1a of the wafer storage container cleaning device 1.

[0013] The load port 2 moves the FOUP 20 carried and placed by the OHT in the direction indicated by the arrow 2b at the external portion of the casing 1a at the load port 2 and carries it into the inside of the casing 1a. The shutter 2a provided at the opening 1b of the casing 1a is open when the FOUP 20 is carried in, but is closed otherwise.

[0014] The robot 3 conveys the FOUP 20 to each part while gripping the flange 20c of the FOUP 20. The robot 3 is, for example, a vertical articulated robot and includes a robot arm 3a and a robot hand 3b. The robot 3 conveys the FOUP 20 to each part by expanding and contracting or rotating the robot arm 3a while the robot hand 3b grips the flange 20c.

[0015] The disassembling / connecting stage 4 disassembles the FOUP 20 into the main body 20a and the door 20b, or connects (attaches) the main body 20a and the door 20b. A latch key 4a is provided on the disassembling / connecting stage 4. The disassembling / connecting stage 4 can disassemble (separate) the door 20b from the main body 20a of the FOUP 20 or connect the door 20b to the main body 20a by rotating the latch key 4a while inserted into the latch hole provided in the door 20b of the FOUP 20.

[0016] The cleaning tank 5 is a tank for cleaning the FOUP 20. Details of the cleaning tank 5 will be described later.

[0017] The unload port 6 moves the FOUP 20 placed by the robot 3 inside the casing 1a at the unload port 6 in the direction indicated by the arrow 6b and unloads it outside the casing 1a. Note that the FOUP 20 with the door 20b connected to the main body 20a at the disassembling / connecting stage 4 is conveyed from the disassembling / connecting stage 4 by the robot 3 to the unload port 6. The shutter 6a provided at the opening 1c of the casing 1a is open when unloading the FOUP 20, but is closed otherwise.

[0018] The control unit 7 controls the operation of the entire wafer storage container cleaning device 1. For example, the control unit 7 operates the load port 2, the robot 3, the disassembling / connecting stage 4, the cleaning tank 5, and the unload port 6 by controlling the load port 2, the robot 3, the disassembling / connecting stage 4, the cleaning tank 5, and the unload port 6 as described above.

[0019] For example, the control unit 7 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an HDD (Hard Disk Drive), and a communication interface. These are connected via an internal bus.

[0020] The CPU executes various processes while using the storage area of the RAM as a temporary storage area for data used in various processes. The ROM and the HDD store programs for executing various processes, various databases used when executing various processes, various tables, etc.

[0021] The communication interface is an interface for communicating with each of the above-described parts of the wafer storage container cleaning apparatus 1 and for communicating with an external apparatus connected to the wafer storage container cleaning apparatus 1 via a network. For example, the communication interface is a network interface card.

[0022] Next, the cleaning tank 5 according to the embodiment will be described. FIGS. 2 and 3 are diagrams schematically showing an example of the configuration of the cleaning tank 5 according to the embodiment. Note that FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2, and is a diagram in which the transparent main body 20a in a state of being placed on the placement portion 5c is represented by a two-dot chain line. As shown in FIG. 2, for example, the cleaning tank 5 includes a cleaning tank main body 5a, a lid portion 5b, a placement portion 5c, a first drain receiving portion 5d, a second drain receiving portion 5e, a first exhaust pipe 5f, a second exhaust pipe 5g, a plurality of cleaning liquid nozzles 5h1, 5h2, 5h3, and a plurality of hot blow nozzles 5i1, 5i2, 5i3.

[0023] The lid portion 5b is attached to the upper end of the cleaning tank main body 5a via a hinge portion, and opens and closes with respect to the main body opening of the cleaning tank main body 5a by driving an air cylinder. A holding portion (holding mechanism) 5b1 capable of holding the door 20b of the FOUP 20 is provided on the back surface (the surface on the cleaning tank main body 5a side) of the lid portion 5b.

[0024] The cleaning tank main body 5a is a box-shaped member having an open upper surface, has an opening (main body opening) upward, and has a cleaning space communicating with the main body opening. The cleaning space is a space existing inside the main body opening. The main body 20a is carried into the cleaning space via the main body opening by the robot 3. In this way, the main body 20a is carried into the cleaning tank main body 5a. Then, the cleaning tank main body 5a houses the main body 20a.

[0025] Here, in the present embodiment, when the FOUP 20 is cleaned in the cleaning tank 5, the robot 3 separately conveys the main body 20a and the door 20b on the disassembly / connection stage 4 to the cleaning tank 5. For example, the robot 3 conveys the main body 20a from the opening of the cleaning tank main body 5a into the interior of the cleaning tank main body 5a with the opening of the main body 20a facing downward. Thereby, the main body 20a is placed on the placement portion 5c with the opening of the main body 20a facing downward. Further, the robot 3 conveys the door 20b to the holding portion 5b1 such that the outer surface of the door 20b is held by the holding portion 5b1 of the lid portion 5b. Thereby, when the lid portion 5b is closed, the inner surface (inner face) of the door 20b faces downward.

[0026] Note that when the cleaning of the FOUP 20 in the cleaning tank 5 is completed, the robot 3 separately conveys the main body 20a and the door 20b in the cleaning tank 5 onto the disassembly / connection stage 4. Then, the disassembly / connection stage 4 connects the main body 20a and the door 20b.

[0027] A placement portion 5c is provided at the center of the cleaning space of the cleaning tank main body 5a. The carried-in main body 20a is placed on the placement portion 5c. For example, as shown in FIG. 2, the placement portion 5c is a placement table having a placement surface 5c1 for placing the main body 20a with the opening of the main body 20a facing downward. In this way, the placement surface 5c1 supports the main body 20a. The placement portion 5c is provided rotatably as a disk-shaped member. Further, the placement portion 5c is disposed at the upper end of a cylindrical rotating member (rotating shaft) 5a5 provided via a bearing 5a4 such as a bearing with respect to a support shaft 5a3 erected at the center of a circular base portion 5a2 in plan view disposed at the bottom 5a1 of the cleaning tank main body 5a.

[0028] Further, the rotating member 5a5 is rotatable by a hollow motor 5a6. The hollow motor 5a6 includes a rotor 5a61 fixed to the lower end side of the rotating member 5a5 and a stator 5a62 installed on the base portion 5a2 corresponding to the rotor 5a61. With such a configuration, the mounting portion 5c is rotatable by the drive of the hollow motor 5a6. As described above, the mounting portion 5c is circular in plan view and is rotatably supported around the rotating member 5a5 provided at the center portion.

[0029] The mounting portion 5c is provided with a plurality (eight in the illustrated example) of hole portions (opening portions) 5c2 in a concentric arrangement near the middle between the outer periphery of a support base 5a7 described later and the outer periphery of the region 20a1 within the region 20a1 (the region surrounded by the two-dot chain line indicated by reference numeral 20a in FIG. 3) where the main body 20a of the FOUP 20 is placed. The hole portions 5c2 are provided to allow the drainage liquid, which is the cleaning liquid after cleaning the inside of the main body 20a of the FOUP 20, and the gas inside the main body 20a (the gas in the storage space of the main body 20a) to flow to the lower side of the mounting portion 5c. Also, the sizes of the eight hole portions 5c2 are set so as to provide an opening area sufficient for exhausting air. The sizes of the hole portions 5c2 are determined, for example, by experiments or simulations. However, as long as the required opening area is obtained, it is not essential to arrange the plurality of hole portions 51c in a concentric arrangement or to provide a plurality of hole portions 5c2. The plurality of hole portions 5c2 may be randomly arranged, or a single hole portion 5c2 may be provided.

[0030] Further, the mounting portion 5c includes support members 5c5 (see FIG. 4) that support the main body 20a, two for each corner portion, so as to sandwich each of the four corner portions of the main body 20a in accordance with the mounting position of the main body 20a indicated by the two-dot chain line in FIG. 3. As shown in FIG. 4, each support member 5c5 includes a pedestal 5c51, a support portion 5c52 on which the outer peripheral edge of the opening of the main body 20a is placed, and a position regulating portion (pin-shaped member) 5c53 that rises from the support portion 5c52 and contacts the side wall of the outer periphery of the opening of the main body 20a to regulate the position of the main body 20a. With such a configuration, the support member 5c5 can position the main body 20a placed on the mounting portion 5c.

[0031] Here, as shown in FIG. 4, on the placement portion 5c, a rectangular annular ridge 5c6 is provided at a position slightly inside the outer peripheral edge of the main body 20a along the outer peripheral edge of the placed main body 20a. The cross-sectional shape of this ridge 5c6 perpendicular to the circumferential direction is formed such that the side surface on the outer peripheral side is vertical and the upper base is shorter than the lower base, being trapezoidal. Also, the ridge 5c6 is formed to have the same height as the pedestal 5c51 of the support member 5c5, and the lower surface of the support portion 5c52 is in contact with the upper surface of the ridge 5c6. Therefore, except for the portion where the main body 20a is supported by the support portion 5c52, a gap G indicated by two arrows is formed between the main body 20a and the ridge 5c6 of the placement portion 5c. This is because when drying the main body 20a in the cleaning tank 5, the main body 20a can be dried better when a gap is formed between the main body 20a and the ridge 5c6 of the placement portion 5c compared to the case where no gap is formed. More specifically, when the main body 20a is in contact with the ridge 5c6 of the placement portion 5c and no gap is formed, the cleaning liquid that has entered between the main body 20a and the upper surface of the ridge 5c6, that is, between the contact surfaces of the two, will be covered by the main body 20a and the ridge 5c6, making drying difficult. Also, the cleaning liquid remaining inside the ridge 5c6 has no choice but to rely only on the hole portion 5c2 for its discharge, which may hinder the drying efficiency. On the other hand, when there is the above-described gap G between the main body 20a and the ridge 5c6, the removability of the cleaning liquid adhering to the main body 20a becomes good in the portion of the gap G. Also, it can be expected that the cleaning liquid remaining inside the ridge 5c6 will be discharged through the gap between the main body 20a and the ridge 5c6 by the centrifugal force caused by the rotation of the placement portion 5c, and this also improves the removability of the cleaning liquid. Note that FIG. 4 is a diagram showing an example of the configuration of the support member 5c5 according to the embodiment.

[0032] The placement portion 5c has an annular convex rib portion 5c3 that extends downward along its outer peripheral end. Also, below the placement portion 5c, a first drainage receiving portion 5d is provided to receive the drained liquid (the cleaning liquid after cleaning the inside of the main body 20a) discharged from the hole portion 5c2 of the placement portion 5c.

[0033] The first drainage receiving part 5d forms an annular concave groove surrounding the periphery of the rotating member 5a5 that supports the placement part 5c, and is arranged on the bottom part 5a1 of the cleaning tank body 5a via a support column (not shown). Thus, the first drainage receiving part 5d has an annular concave groove shape in plan view. The outer shape of the first drainage receiving part 5d is formed to be slightly smaller than the outer shape of the placement part 5c (the inner diameter of the annular rib part 5c3). Further, the first drainage receiving part 5d is provided such that a height difference sufficient to allow the exhaust air from the hole part 5c2 of the placement part 5c to flow smoothly is formed between the upper end of its outer periphery and the lower end of the rib part 5c3 at the outer peripheral end of the placement part 5c. The bottom part (groove bottom part) 5d1 of the groove part of the first drainage receiving part 5d is an inclined surface that gradually descends from the center side toward the outer peripheral side. And a drainage pipe 5d2 for discharging the received drainage to the outside is connected to the outer peripheral end corresponding to the lowermost part of the groove bottom part 5d1. In the example of FIG. 2, the case where one drainage pipe 5d2 is provided is shown, but two or more drainage pipes 5d2 may be provided. Also, the first drainage receiving part 5d and the drainage pipe 5d2 together may be referred to as the first drainage receiving part. That is, the drainage pipe 5d2 may be included in the elements constituting the first drainage receiving part 5d. In FIG. 2, the drainage discharged to the outside by the first drainage receiving part 5d is illustrated as drainage (2).

[0034] Also, the inner peripheral end of the first drainage receiving part 5d is positioned between the hole part 5c2 formed in the placement part 5c and the rotating member 5a5, and the outer peripheral end of the first drainage receiving part 5d is positioned between the outermost peripheral part of the main body 20a placed on the placement surface 5c1 with the opening of the main body 20a facing downward and the outer peripheral end of the placement part 5c. Further, the first drainage receiving part 5d is arranged such that a gap is formed between the outer peripheral part of the first drainage receiving part 5d and the placement part 5c through which the gas flowing from the storage space of the main body 20a toward the second exhaust pipe 5g via the hole part 5c2 can flow.

[0035] On the outer peripheral side of the placement portion 5c, there is a circular opening 5j1 (an opening with an inner diameter slightly larger than the outer shape of the placement portion) that surrounds the placement portion 5c, and a partition plate 5j is provided with its outer periphery in contact with the inner wall surface of the cleaning tank main body 5a. This partition plate 5j is provided such that its upper surface is at the same height as the upper surface of the placement portion 5c. Such a partition plate 5j divides the inside of the cleaning tank main body 5a into an upper space and a lower space with respect to the placement portion 5c. Specifically, the partition plate 5j divides the cleaning space in the cleaning tank main body 5a into an upper cleaning space and a lower cleaning space with respect to the placement portion 5c. Here, the above-described hole portion 5c2 communicates the upper cleaning space and the lower cleaning space.

[0036] The partition plate 5j has a gap 5k between the opening 5j1 and the outer periphery of the placement portion 5c. This gap 5k functions as a drainage path for draining the drainage liquid, which is the cleaning liquid after cleaning the outside of the main body 20a of the FOUP 20, to the lower space (the bottom 5a1 of the cleaning tank main body 5a) of the partition plate 5j. Here, as will be described later, in this embodiment, the upper space and the lower space are each individually exhausted. For this reason, it is preferable that the gap 5k be small. Therefore, in this embodiment, the shape of the placement portion 5c is a disk shape, and the partition plate 5j is formed with a circular opening 5j1 along the shape of the placement portion 5c. Thereby, the size of the gap 5k can be made smaller compared to the case where the shape of the placement portion 5c and the shape of the opening formed in the partition plate 5j are polygons such as quadrilaterals.

[0037] A second drainage receiving portion 5e is provided in the lower space of the partition plate 5j. The second drainage receiving portion 5e is composed of the bottom 5a1 of the cleaning tank main body 5a and a drainage pipe 5e1. That is, the second drainage receiving portion 5e includes the bottom 5a1 and the drainage pipe 5e1. The bottom 5a1 mainly receives the drainage liquid, which is the cleaning liquid after cleaning the outside of the main body 20a of the FOUP 20. The drainage pipe 5e1 is provided in the bottom 5a1. The drainage pipe 5e1 discharges the drainage received at the bottom 5a1 to the outside. In FIG. 2, the drainage discharged to the outside by the second drainage receiving portion 5e is illustrated as drainage (1). In the example of FIG. 2, the case where one drainage pipe 5e1 is provided is shown, but two or more drainage pipes 5e1 may be provided.

[0038] On the side wall of the cleaning tank body 5a, two exhaust pipes (the first exhaust pipe 5f and the second exhaust pipe 5g) for exhausting the inside of the cleaning tank body 5a are connected. The first exhaust pipe 5f is connected to the side wall above the partition plate 5j, and mainly exhausts the space above the partition plate 5j and the placement portion 5c. By this exhaust, the water vapor generated by cleaning the outside of the main body 20a of the FOUP 20 is exhausted. In FIG. 2, the exhaust by the first exhaust pipe 5f is illustrated as exhaust (1). Note that the first exhaust pipe 5f is connected to an adjustment device for adjusting the exhaust volume, such as a pump (not shown), and the exhaust volume is adjusted by this device. Here, the "water vapor" is not limited to the vaporized steam of water or the cleaning liquid, but generally refers to fine particles generated by cleaning, such as mist of water or the cleaning liquid, mist containing particles, etc., which float in the space and are preferably not attached to the FOUP 20, and are collectively referred to as water vapor.

[0039] The second exhaust pipe 5g is connected to the side wall below the partition plate 5j, and mainly exhausts the space below the partition plate 5j and the placement portion 5c. By this exhaust, the water vapor generated by cleaning the inside of the main body 20a of the FOUP 20 is exhausted. In the present embodiment, the second exhaust pipe 5g is configured to exhaust at least the storage space formed by the inside of the main body 20a by exhausting the space below the partition plate 5j and the placement portion 5c. In FIG. 2, the exhaust by the second exhaust pipe 5g is illustrated as exhaust (2). Note that the second exhaust pipe 5g is connected to an adjustment device for adjusting the exhaust volume, such as a pump (not shown), and the exhaust volume is adjusted by this device.

[0040] When the exhaust gas is exhausted by the first exhaust pipe 5f and the second exhaust pipe 5g, it is preferable that the exhaust gas volume when the exhaust gas is exhausted by the first exhaust pipe 5f and the exhaust gas volume when the exhaust gas is exhausted by the second exhaust pipe 5g are adjusted so that the lower space (drainage side space) is at a negative pressure with respect to the upper space (washing side space). This is because if the upper space becomes a negative pressure, the water vapor in the lower space may enter the upper space and adhere to the outside of the main body 20a of the FOUP20. However, if the pressure difference is too large, there is a risk that the water vapor outside the main body 20a will be drawn into the inside of the main body 20a through the gap between the main body 20a of the FOUP20 and the mounting portion 5c. Therefore, it is preferable to keep the pressure difference to such an extent that the water vapor on the drainage side does not leak from the gap 5k between the mounting portion 5c and the partition plate 5j into the washing side space.

[0041] The first exhaust pipe 5f, the adjustment device connected to the first exhaust pipe 5f, the second exhaust pipe 5g, and the adjustment device connected to the second exhaust pipe 5g are an example of the exhaust portion.

[0042] The support shaft 5a3 provided on the base portion 5a2 is provided such that its upper end protrudes above the mounting portion 5c, and a support base 5a7 having a circular shape in plan view is provided at its upper end. The outer peripheral portion of the support base 5a7 overlaps with the inner peripheral portion of the mounting portion 5c with a vertical interval. Further, the support base 5a7 is provided with an annular ridge portion 5a71 extending downward at its outer peripheral end. A minute gap is formed between the lower end of this ridge portion 5a71 and the upper surface (mounting surface 5c1) of the mounting portion 5c. Further, an annular ridge portion 5c4 extending upward is provided at the inner peripheral end of the mounting portion 5c so as to form a minute gap between the ridge portion 5c4 and the inside of the ridge portion 5a71 of the support base 5a7. A minute gap is also formed between the ridge portion 5c4 of the mounting portion 5c and the lower surface of the support base 5a7. Thereby, a labyrinth seal is formed between the mounting portion 5c and the support base 5a7. For this reason, it is possible to suppress the water vapor generated by cleaning the inside of the main body 20a of the FOUP20 from entering the inside of the rotating member 5a5 and the hollow motor 5a6 through the gap between the mounting portion 5c and the support base 5a7.

[0043] On the upper surface of the support table 5a7, there are provided a cleaning liquid nozzle 5h1 for cleaning the inside of the main body 20a of the FOUP 20, and a hot blow nozzle 5i1 standing upright for blowing off and evaporating the droplets of the cleaning liquid remaining adhered to the inside of the main body 20a after cleaning. The supply pipe for supplying the cleaning liquid to the cleaning liquid nozzle 5h1 and the supply pipe for supplying the hot blow to the hot blow nozzle 5i1 pass through the support shaft 5a3 and are connected inside the support shaft 5a3.

[0044] The cleaning liquid nozzle 5h1 is provided at a position where it can supply the cleaning liquid to the inside (accommodation space) of the main body 20a placed on the placement portion 5c. For example, the cleaning liquid nozzle 5h1 includes at least one rod-shaped pipe extending upward from the support table 5a7, at least one rod-shaped pipe extending horizontally from the upper end of this pipe, and a plurality of nozzles provided on each pipe. The nozzle is, for example, a two-fluid nozzle. When the nozzle is a two-fluid nozzle, the nozzle mixes air (an example of a gas) and the cleaning liquid, atomizes the cleaning liquid by the flow of air, and supplies the atomized cleaning liquid to the inside of the main body 20a to clean the inside of the main body 20a. Note that such a nozzle can supply the cleaning liquid to the inside of the main body 20a without mixing air and the cleaning liquid. That is, the nozzle can supply the non-atomized cleaning liquid to the inside of the main body 20a without atomizing the cleaning liquid.

[0045] The hot blow nozzle 5i1 is provided at a position where it can supply hot blow (hot air (heated gas)) to the inside of the main body 20a placed on the placement portion 5c. For example, the hot blow nozzle 5i1 includes at least one rod-shaped pipe extending upward from the support table 5a7, at least one rod-shaped pipe extending horizontally from the upper end of this pipe, and a plurality of nozzles provided on each pipe. The nozzle dries the inside of the main body 20a by supplying hot blow to the inside of the main body 20a placed on the placement portion 5c.

[0046] Outside the placement section 5c, there are cleaning liquid nozzles 5h2 and 5h3 for cleaning the outside of the main body 20a of the FOUP 20, and hot blow nozzles 5i2 and 5i3 for blowing off and evaporating and removing the droplets of the cleaning liquid remaining attached to the outside of the main body 20a after cleaning are provided.

[0047] The cleaning liquid nozzle 5h2 supplies the cleaning liquid to the main body 20a of the FOUP 20 from the side (outside). As shown in FIG. 3, the cleaning liquid nozzle 5h2 is provided vertically penetrating through the partition plate 5j from the bottom 5a1 of the cleaning tank main body 5a near one corner (the upper left corner in FIG. 3) of the cleaning tank main body 5a. For example, the cleaning liquid nozzle 5h2 includes at least one rod-shaped pipe extending upward from the bottom 5a1 and a plurality of nozzles provided on the pipe. The nozzles are, for example, two-fluid nozzles. For example, the nozzles clean the side of the main body 20a by supplying the atomized cleaning liquid to the side of the main body 20a. Note that such nozzles can supply the non-atomized cleaning liquid to the side of the main body 20a without atomizing the cleaning liquid.

[0048] The cleaning liquid nozzle 5h3 supplies the cleaning liquid to the main body 20a of the FOUP20 from above (outside). The cleaning liquid nozzle 5h3 is provided so that its nozzle part swings between a standby position shown by a two-dot chain line and a cleaning position shown by a solid line in FIG. 3. In FIG. 2, the cleaning liquid nozzle 5h3 shown by a solid line is located at the cleaning position. More specifically, the cleaning liquid nozzle 5h3 is provided vertically penetrating through the partition plate 5j from the bottom 5a1 of the cleaning tank main body 5a at a position closer to the corner of the cleaning tank main body 5a than the cleaning liquid nozzle 5h2, and includes a rotating support column (a support column taller than the cleaning liquid nozzle 5h2), a swing arm extending horizontally and fixed to the upper end of this support column, and a nozzle part extending horizontally provided at the tip of the swing arm. One or a plurality of nozzles are provided in the nozzle part. The nozzle is, for example, a two-fluid nozzle. For example, the nozzle supplies the atomized cleaning liquid to the upper side of the main body 20a in a swinging state to clean the upper side of the main body 20a. Note that such a nozzle can supply the non-atomized cleaning liquid to the upper side of the main body 20a without atomizing the cleaning liquid.

[0049] The hot blow nozzle 5i2 supplies hot blow to the main body 20a of the FOUP20 from the side (outside). As shown in FIG. 3, the hot blow nozzle 5i2 is provided vertically penetrating through the partition plate 5j from the bottom 5a1 of the cleaning tank main body 5a near one corner of the cleaning tank main body 5a (the upper right corner in FIG. 3). For example, the hot blow nozzle 5i2 includes at least one rod-shaped pipe extending upward from the bottom 5a1 and a plurality of nozzles provided on the pipe. The nozzles dry the side (outside) of the main body 20a by supplying hot blow to the side (outside) of the main body 20a placed on the placement part 5c.

[0050] The hot blow nozzle 5i3 supplies hot air from above to the main body 20a of the FOUP 20. The hot blow nozzle 5i3 is provided such that its nozzle portion swings between a drying position indicated by a two-dot chain line and a standby position indicated by a solid line in FIG. 3. In FIG. 2, the hot blow nozzle 5i3 indicated by the two-dot chain line is located at the drying position. More specifically, the hot blow nozzle 5i3 penetrates through the partition plate 5j from the bottom 5a1 of the cleaning tank main body 5a at a position closer to the corner of the cleaning tank main body 5a than the hot blow nozzle 5i2 and is vertically provided, and includes a rotating support column (a support column taller than the hot blow nozzle 5i2), a horizontally extending swing arm fixed to the upper end of this support column, and a horizontally extending nozzle portion provided at the tip of the swing arm. One or more nozzles are provided in the nozzle portion. The nozzles supply hot air to the upper side (outer side) of the main body 20a placed on the placement portion 5c at the drying position, thereby drying the upper side (outer side) of the main body 20a. In FIG. 2, the hot blow nozzle 5i3 located at the standby position indicated by a solid line in FIG. 3 is not shown.

[0051] Here, the cleaning liquid nozzle 5h3 waits at a standby position, indicated by a two-dot chain line in FIG. 3, that does not interfere with the main body 20a when the main body 20a is being carried out, carried in, and dried. After the main body 20a is carried into the cleaning space of the cleaning tank main body 5a and the lid portion 5b is closed with the door 20b held by the holding portion 5b1, the cleaning liquid nozzle 5h3 rotates and moves to a cleaning position (the position indicated by the solid line) above the main body 20a placed on the placement portion 5c and below the door 20b held by the holding portion 5b1. When the cleaning is completed, the cleaning liquid nozzle 5h3 rotates and moves to the standby position.

[0052] Also, for example, the hot blow nozzle 5i3 waits at a standby position that does not interfere with the main body 20a, as shown by the solid line in FIG. 3, when the main body 20a is being carried out, carried in, and cleaned. Then, when the cleaning is completed, the hot blow nozzle 5i3 rotates and moves to a drying position (the position shown by the two-dot chain line) above the main body 20a placed on the placement portion 5c and below the door 20b held by the holding portion 5b1. When the drying is completed, the hot blow nozzle 5i3 rotates and moves to the standby position.

[0053] The cleaning liquid nozzles 5h1, 5h2, 5h3 are an example of a cleaning liquid supply unit. Also, the hot blow nozzles 5i1, 5i2, 5i3 are an example of a heated gas supply unit.

[0054] Next, an example of the configuration of each part provided in the flow path through which the drain liquid (drain liquid (2)) flowing downstream of the first drain receiving portion 5d of the wafer storage container cleaning apparatus 1 flows will be described. FIG. 5 is a diagram for explaining an example of the configuration of each part provided in the flow path through which the drain liquid flowing downstream of the first drain receiving portion 5d according to the embodiment flows. Here, it is assumed that the drain pipe 5d2 is included in the elements constituting the first drain receiving portion 5d.

[0055] As shown in FIG. 5, in the flow path through which the drain liquid flowing downstream of the first drain receiving portion 5d flows, a three-way valve 31, a drain measurement tank 32, AO valves (air-operated valves) 33 to 36, a pump 37, a particle counter 38, liquid level sensors 39, 40, a degassing unit 50, and a degassing pump 51 are provided. In the following description, the AO valve 33 may be referred to as the first AO valve 33, the AO valve 34 as the second AO valve 34, the AO valve 35 as the third AO valve 35, and the AO valve 36 as the fourth AO valve 36.

[0056] The three connection ports of the three-way valve 31 are connected to the first drain receiving portion 5d, the waste liquid side (left side in FIG. 5), and the drain measurement tank 32. For example, the drain liquid discharged by the first drain receiving portion 5d flows into the three-way valve 31. Then, under the control of the control unit 7, the three-way valve 31 causes the drain liquid flowing into the three-way valve 31 to flow out to either the waste liquid side or the drain measurement tank 32.

[0057] The drainage measurement tank 32 stores the drained liquid containing the particles measured by the particle counter 38.

[0058] The first AO valve 33 is provided in the flow path through which pure water flows toward the drainage measurement tank 32. When the first AO valve 33 is opened, pure water is supplied to the drainage measurement tank 32. When the first AO valve 33 is closed, the supply of pure water to the drainage measurement tank 32 stops.

[0059] The second AO valve 34 is provided in the flow path through which the drained liquid flows out as waste liquid from the drainage measurement tank 32. When the second AO valve 34 is opened, the waste liquid flows out from the drainage measurement tank 32. When the second AO valve 34 is closed, the outflow of the waste liquid from the drainage measurement tank 32 stops.

[0060] The third AO valve 35 is provided in the flow path through which the drained liquid flows from the drainage measurement tank 32 toward the particle counter 38 via the deaeration unit 50. When the third AO valve 35 is opened, the drained liquid from the drainage measurement tank 32 is supplied to the particle counter 38. When the third AO valve 35 is closed, the supply of the drained liquid to the particle counter 38 stops.

[0061] The fourth AO valve 36 is provided in the flow path through which pure water flows from the deaeration unit 50 toward the particle counter 38. When the fourth AO valve 36 is opened, pure water is supplied to the particle counter 38 and its flow path (measurement line). When the fourth AO valve 36 is closed, the supply of pure water to the particle counter 38 and its flow path (measurement line) stops.

[0062] The pump 37 draws in the drained liquid and pure water when it operates. Note that the drained liquid drawn in by the pump 37 is discharged as waste liquid.

[0063] The particle counter 38 measures the particles contained in the supplied drained liquid and outputs information regarding the particles. For example, the particle counter 38 measures the number of particles contained in a drained liquid of a predetermined unit volume (e.g., 10 ml). Then, the particle counter 38 outputs, as information regarding the particles, the number of particles contained in the drained liquid of the predetermined unit volume to the control unit 7. The particle counter 38 is an example of a particle measurement unit.

[0064] The liquid level sensor 39 is provided at a position defining the upper limit of the drained liquid stored in the drained liquid measurement tank 32, and detects whether or not the height of the liquid level of the drained liquid stored in the drained liquid measurement tank 32 has reached the same height 39a as the height of the liquid level sensor 39. The liquid level sensor 39 performs such detection every predetermined time. Then, the liquid level sensor 39 outputs the detection result to the control unit 7 every predetermined time.

[0065] The liquid level sensor 40 is provided at a position defining the lower limit of the drained liquid stored in the drained liquid measurement tank 32, and detects whether or not the height of the liquid level of the drained liquid stored in the drained liquid measurement tank 32 has reached the same height 40a as the height of the liquid level sensor 40. The liquid level sensor 40 performs such detection every predetermined time. Then, the liquid level sensor 40 outputs the detection result to the control unit 7 every predetermined time.

[0066] The degassing unit 50 and the degassing pump 51 are provided upstream of the particle counter 38 and degas the drained liquid supplied to the particle counter 38. Note that the degassing unit 50 and the degassing pump 51 do not degas the pure water supplied to the particle counter 38.

[0067] Next, an example of the process executed by the wafer storage container cleaning apparatus 1 will be described. FIG. 6 is a flowchart showing an example of the flow of the process (operation of the wafer storage container cleaning apparatus 1) executed by the wafer storage container cleaning apparatus 1 according to the embodiment. The process shown in FIG. 6 is executed when the FOUP 20 is cleaned in the cleaning tank 5. Note that the process shown in FIG. 6 is, for example, a process executed by each part under the control of the control unit 7 for each part other than the control unit 7.

[0068] When the loading of the main body 20a and the door 20b into the cleaning space of the cleaning tank 5 is completed, the cleaning starts. At this time, first, the cleaning liquid nozzle 5h3 moves from the standby position to the cleaning position. Also, the placement unit 5c starts rotating. When the cleaning liquid nozzle 5h3 is positioned at the cleaning position and the placement unit 5c reaches the preset rotation speed, the cleaning liquid nozzles 5h1, 5h2, 5h3 start supplying, for example, atomized cleaning liquid (two-fluid) to the inside and outside of the main body 20a (step S101). At this time, the three-way valve 31 causes the drainage from the first drainage receiving part 5d to flow out to the waste liquid side.

[0069] Next, the control unit 7 determines whether or not a first predetermined time has elapsed since the start of cleaning of the FOUP 20 (start of supply of the two-fluid cleaning liquid (two-fluid)) (step S102).

[0070] If the first predetermined time has not elapsed since the start of cleaning of the FOUP 20 (step S102: No), the supply of the cleaning liquid is continued, and the control unit 7 makes the determination of step S102 again. On the other hand, if the first predetermined time has elapsed since the start of cleaning of the FOUP 20 (step S102: Yes), the cleaning liquid nozzles 5h1, 5h2, 5h3 start supplying non-atomized cleaning liquid (pure water) to the inside and outside of the main body 20a without mixing air and the cleaning liquid (step S103). That is, in step S103, the cleaning liquid nozzles 5h1, 5h2, 5h3 switch the fluid discharged from the cleaning liquid nozzles 5h1, 5h2, 5h3 from the two-fluid of air and cleaning liquid to pure water (one-fluid).

[0071] Next, after switching to pure water in step S103, the control unit 7 determines whether or not a second predetermined time has elapsed (step S104). This second predetermined time is, for example, a time period sufficient for all of the two-fluid within the storage space of the main body 20a to be discharged from the storage space by the supply of pure water.

[0072] If the second predetermined time has not elapsed after switching to pure water (step S104: No), the supply of the single-fluid cleaning liquid (single-fluid cleaning liquid) is continued, and the control unit 7 makes the determination of step S104 again. On the other hand, if the second predetermined time has elapsed after switching to pure water (step S104: Yes), the control unit 7 switches the three-way valve 31 so that the drained liquid (pure water which is the single-fluid cleaning liquid) flowing into the three-way valve 31 flows out into the drain measurement tank 32 (step S105). That is, the control unit 7 controls the three-way valve 31 so that the drained liquid flows out into the drain measurement tank 32. At this time, the first AO valve 33, the second AO valve 34, and the third AO valve 35 are closed, and the fourth AO valve 36 is in an open state. Also, the pump 37 starts operating at the timing when the two-fluid cleaning liquid is supplied to the inside (storage space) of the main body 20a in step S101, and pure water is being supplied to the particle counter 38. This is a process for cleaning the particle measurement area before the start of measurement by the particle counter 38.

[0073] Then, based on the detection results output from the liquid level sensor 39 at predetermined time intervals, the control unit 7 determines whether or not the drained liquid has accumulated in the drain measurement tank 32 up to the same height 39a as the height of the liquid level sensor 39 (step S106).

[0074] When the drain liquid has not accumulated up to the same height 39a as the height of the liquid level sensor 39 (step S106: No), the control unit 7 continues the outflow of the drain liquid into the drain measurement tank 32 and again makes the determination in step S106. On the other hand, when the drain liquid has accumulated up to the same height 39a as the height of the liquid level sensor 39 (step S106: Yes), the control unit 7 switches the three-way valve 31 so that the drain liquid flowing into the three-way valve 31 flows out to the waste liquid side (step S107). That is, the control unit 7 controls the three-way valve 31 so that the drain liquid flows out to the waste liquid side.

[0075] Next, the control unit 7 stops the pump 37, closes the fourth AO valve 36, and opens the third AO valve 35 (step S108).

[0076] Next, the control unit 7 operates the pump 37 to send the drain liquid in the drain measurement tank 32 to the particle counter 38 (step S109).

[0077] Next, the particle counter 38 measures the number of particles contained in a predetermined unit volume of the drain liquid and outputs, as information regarding the particles, the number of particles contained in a predetermined unit volume of the drain liquid to the control unit 7 (step S110).

[0078] Next, the control unit 7 generates information associating the measurement result with the ID (individual identification number) of the FOUP 20, stores the generated information in the HDD of the control unit 7, and controls the communication interface of the control unit 7 to output the generated information to an external device that centrally manages all the FOUPs in the factory (step S111). For example, the control unit 7 includes an ID reading unit, and the ID reading unit reads the ID (Identification), which is the identification information of the FOUP 20 provided on the FOUP 20. For example, the ID of the FOUP 20 can be obtained by a barcode scanner (barcode reader) which is the ID reading unit. For example, the barcode scanner reads a barcode indicating the individual identification number of the FOUP 20 as the ID of the FOUP 20, and transmits the individual identification number indicated by the read barcode to the control unit 7. Also, for example, the ID reading unit may be a reader that reads the individual identification number of the FOUP 20 output as the ID of the FOUP 20 from an RF tag provided on the FOUP 20. In this case, the reader transmits the read individual identification number to the control unit 7. Also, instead of outputting the particle measurement result to an external device that centrally manages all the FOUPs in the factory, the control unit 7 may write the measurement result information to an RF tag provided on the FOUP 20.

[0079] By the process in step S111, information regarding the particles measured by the particle counter 38 is output to an external device. Also, in the HDD, a history of information regarding the particles associated with the FOUP 20 (more specifically, the ID of the FOUP 20) will be stored.

[0080] Next, the control unit 7 stops the pump 37, closes the third AO valve 35, and opens the fourth AO valve 36 (step S112).

[0081] Next, the control unit 7 operates the pump 37 to send pure water to the particle counter 38 and its flow path to purge the flow path (step S113).

[0082] Next, the control unit 7 opens the second AO valve 34 to discharge the drain remaining in the drain measurement tank 32 as waste liquid (step S114).

[0083] Next, the control unit 7 determines whether or not all the drain remaining in the drain measurement tank 32 has been discharged from the drain measurement tank 32 (step S115). For example, based on the detection results output from the liquid level sensor 40 at predetermined time intervals, the control unit 7 determines that all the drain remaining in the drain measurement tank 32 has been discharged from the drain measurement tank 32 when a predetermined time has elapsed after the liquid level of the drain has reached the same height 40a as the height of the liquid level sensor 40. On the other hand, if not, the control unit 7 determines that not all the drain remaining in the drain measurement tank 32 has been discharged from the drain measurement tank 32.

[0084] When not all the drain remaining in the drain measurement tank 32 has been discharged from the drain measurement tank 32 (step S115: No), the control unit 7 continues to discharge the drain and makes the determination in step S115 again. On the other hand, when all the drain remaining in the drain measurement tank 32 has been discharged from the drain measurement tank 32 (step S115: Yes), the control unit 7 opens the first AO valve 33 and closes the second AO valve 34 (step S116). Thereby, pure water is supplied to the drain measurement tank 32 and stored in the drain measurement tank 32. In step S116, the drain measurement tank 32 stores pure water until it overflows. Note that the time required until overflow is obtained in advance, and pure water may be continuously supplied to the drain measurement tank 32 for this time.

[0085] Next, the control unit 7 closes the first AO valve 33 and opens the second AO valve 34 (step S117). Thereby, the pure water in the drain measurement tank 32 is discharged from the drain measurement tank 32.

[0086] Next, the control unit 7 determines whether the processes in steps S116 and S117 have been repeated a predetermined number of times (step S118). By repeating the processes in steps S116 and S117 a predetermined number of times, the inside of the drain measurement tank 32 is purged.

[0087] If the processes in steps S116 and S117 have not been repeated a predetermined number of times (step S118: No), the control unit 7 returns to step S116 and performs each process after step S116 again. On the other hand, if the processes in steps S116 and S117 have been repeated a predetermined number of times (step S118: Yes), the control unit 7 ends the process shown in FIG. 6.

[0088] Next, an example of the exhaust gas discharged by the wafer storage container cleaning apparatus 1 will be described. FIG. 7 is a diagram for explaining an example of the exhaust gas discharged by the wafer storage container cleaning apparatus 1 according to the embodiment. In FIG. 7, processes other than the exhaust gas discharged by the wafer storage container cleaning apparatus 1 are also illustrated together with the exhaust gas.

[0089] In the present embodiment, the processes of loading or unloading the main body 20a and the door 20b of the FOUP 20 into or from the cleaning tank 5 ( "Loading" and "Unloading" in FIG. 7), the process of cleaning the main body 20a and the door 20b loaded into the cleaning tank 5 ( "Cleaning" in FIG. 7), the process of drying the main body 20a and the door 20b after the cleaning is completed ( "Drying" in FIG. 7), and the processes from when the main body 20a and the door 20b are loaded into the cleaning tank 5 until the cleaning starts, and until the main body 20a and the door 20b after the drying is completed are unloaded ( "First standby" and "Second standby" in FIG. 7), adjustment devices (not shown) respectively connected to the first exhaust pipe 5f and the second exhaust pipe 5g are respectively controlled so that the exhaust gas amounts are different.

[0090] First, in the loading process, no exhaust gas is discharged in either the first exhaust pipe 5f or the second exhaust pipe 5g. That is, the loading process is the period from when the lid portion 5b of the cleaning tank 5 is opened until the main body 20a and the door 20b of the FOUP 20 are loaded into the cleaning tank 5 and the lid portion 5b of the cleaning tank 5 is closed. During this period, the wafer storage container cleaning apparatus 1 does not discharge exhaust gas.

[0091] The first standby process is the period from when the lid 5b of the cleaning tank 5 is closed until the cleaning of the main body 20a and the door 20b of the FOUP 20 is started. During this first standby process, the wafer storage container cleaning apparatus 1 performs exhaust with the first standby exhaust volume. Specifically, an adjustment device (not shown) of the first exhaust pipe 5f controls to exhaust the space above the partition plate 5j and the placement portion 5c with the first exhaust volume for the first standby. Also, an adjustment device (not shown) of the second exhaust pipe 5g controls to exhaust the space below the partition plate 5j and the placement portion 5c with the second exhaust volume for the first standby (step S201). Note that if the cleaning is started immediately after the loading process, the first standby process is omitted and the process proceeds to the cleaning process.

[0092] The cleaning process is the period from when the cleaning of the main body 20a and the door 20b of the FOUP 20 is started until the cleaning is completed. In the cleaning process, the processes of steps S101 to S118 shown in FIG. 6 are executed. During this cleaning process, the wafer storage container cleaning apparatus 1 performs exhaust with the cleaning exhaust volume. Specifically, an adjustment device (not shown) of the first exhaust pipe 5f controls to exhaust the space above the partition plate 5j and the placement portion 5c with the first exhaust volume for cleaning. Also, an adjustment device (not shown) of the second exhaust pipe 5g controls to exhaust the space below the partition plate 5j and the placement portion 5c with the second exhaust volume for cleaning (step S202). The exhaust during cleaning executed by the first exhaust pipe 5f and the second exhaust pipe 5g like this is an example of the first exhaust. For example, the second exhaust pipe 5g executes the first exhaust to exhaust the storage space while the inside of the main body 20a is being cleaned by the cleaning liquid nozzle 5h1.

[0093] Note that during cleaning, the amount of water vapor generated in the cleaning tank 5 becomes relatively large. For this reason, the first exhaust volume for cleaning is set to be larger than the first exhaust volume for the first standby. Similarly, the second exhaust volume for cleaning is set to be larger than the second exhaust volume for the first standby.

[0094] The drying process is the period from when the drying of the main body 20a and the door 20b of the FOUP 20 starts until the drying is completed. In the drying process, for example, hot air is supplied from the hot blow nozzles 5i1, 5i2, 5i3 to the inside and outside of the main body 20a for a predetermined time. Also, during drying, the main body 20a and the door 20b are rotated. The rotation speed of the main body 20a and the door 20b during drying may be higher than the rotation speed of the main body 20a and the door 20b during cleaning. During such a drying process, the wafer storage container cleaning device 1 exhausts air at an exhaust volume for drying. Specifically, an adjustment device (not shown) of the first exhaust pipe 5f controls to exhaust the space above the partition plate 5j and the placement portion 5c at the first exhaust volume for drying. Also, an adjustment device (not shown) of the second exhaust pipe 5g controls to exhaust the space below the partition plate 5j and the placement portion 5c at the second exhaust volume for drying (step S203). The exhaust during drying performed by such first exhaust pipe 5f and second exhaust pipe 5g is an example of the second exhaust. For example, the second exhaust pipe 5g performs the second exhaust to exhaust the storage space while hot air is being supplied to the inside of the main body 20a by the hot blow nozzle 5i1. When the drying with the second exhaust is completed, the rotation of the placement portion 5c stops.

[0095] Note that during drying, it is considered that the amount of water vapor generated in the cleaning tank 5 is larger than during cleaning. Therefore, the first exhaust volume for drying is set to be larger than the first exhaust volume for cleaning. Similarly, the second exhaust volume for drying is set to be larger than the second exhaust volume for cleaning. The first exhaust volume for cleaning and the second exhaust volume for cleaning are an example of the first exhaust volume. The first exhaust volume for drying and the second exhaust volume for drying are an example of the second exhaust volume.

[0096] The second standby process is the period from when the drying is completed until the lid 5b of the cleaning tank 5 is opened. That is, when the robot 3 is performing other transfer operations, the cleaning tank 5 waits until the robot 3 can carry out the main body 20a and the door 20b from the cleaning tank 5. During this second standby process, the wafer storage container cleaning device 1 exhausts air at the exhaust volume for the second standby. Specifically, an adjustment device (not shown) of the first exhaust pipe 5f is controlled to exhaust the space above the partition plate 5j and the placement portion 5c at the first exhaust volume for the second standby. Also, an adjustment device (not shown) of the second exhaust pipe 5g is controlled to exhaust the space below the partition plate 5j and the placement portion 5c at the second exhaust volume for the second standby (step S204). Note that the first exhaust volume for the second standby and the second exhaust volume for the second standby are the same as the first exhaust volume for the first standby and the second exhaust volume for the first standby in the first standby process.

[0097] In the carrying-out process, no exhaust is performed in either the first exhaust pipe 5f or the second exhaust pipe 5g. The carrying-out process is the period from when the lid 5b of the cleaning tank 5 is opened until the main body 20a and the door 20b are carried out from the cleaning tank 5 and until the next main body 20a and door 20b are carried in.

[0098] During the first standby process, the cleaning process, the drying process, and the second standby process, the exhaust volume when exhausting through the first exhaust pipe 5f and the exhaust volume when exhausting through the second exhaust pipe 5g are preferably adjusted so that the lower space is under negative pressure with respect to the upper space. That is, the above-described adjustment device preferably adjusts the exhaust volume when the first exhaust pipe 5f exhausts the upper space and the exhaust volume when the second exhaust pipe 5g exhausts the lower space so that the pressure of the lower space is lower than the pressure of the upper space. However, the exhaust volume when exhausting through the first exhaust pipe 5f and the exhaust volume when exhausting through the second exhaust pipe 5g may be adjusted so that the lower space is under positive pressure with respect to the upper space. Also, the exhaust volume when exhausting through the first exhaust pipe 5f and the exhaust volume when exhausting through the second exhaust pipe 5g may be adjusted so that the pressure of the upper space and the pressure of the lower space are the same or substantially the same.

[0099] In the wafer storage container cleaning device 1 according to the present embodiment, the second exhaust pipe 5g exhausts the storage space of the main body 20a while the inside of the main body 20a is being cleaned by the cleaning liquid nozzle 5h1. Thereby, according to the wafer storage container cleaning device 1, the remaining particles in the inside (storage space) of the main body 20a of the FOUP 20 can be effectively reduced.

[0100] Further, a partition plate 5j that partitions the inside of the cleaning tank main body 5a into an upper cleaning space and a lower cleaning space above the placement portion 5c is provided, and a hole portion 5c2 that communicates the storage space of the main body 20a and the lower cleaning space is formed in the placement portion 5c, and the lower cleaning space is exhausted by the second exhaust pipe 5g to exhaust the storage space of the main body 20a. Thereby, since the lower cleaning space can be exhausted separately from the upper cleaning space, the inside (inside the storage space) of the main body 20a can be exhausted more efficiently, and the remaining particles inside the main body 20a can be effectively reduced.

[0101] In addition, hot blow nozzles 5i1, 5i2, and 5i3 are provided as a heated gas supply unit for supplying heated gas to the inside (storage space) and the outside of the main body 20a. The second exhaust pipe 5g performs a first exhaust for exhausting the inside of the main body 20a during the cleaning of the inside of the main body 20a by the cleaning liquid nozzle 5h1 as a cleaning liquid supply unit, and during the supply of the heated gas to the inside of the main body 20a by the hot blow nozzle 5i1 (during drying), a second exhaust is performed to exhaust the inside of the main body 20a at an exhaust volume (second exhaust volume) larger than the exhaust volume of the first exhaust (first exhaust volume). Thereby, during drying when it is considered that the amount of water vapor generated inside the main body 20a is larger than during cleaning, the exhaust volume can be increased. Therefore, it is possible to perform appropriate exhaust of the inside of the main body 20a during cleaning and drying, and effectively reduce the residue of particles in the storage space.

[0102] Also, the exhaust volume by the first exhaust pipe 5f and the exhaust volume by the second exhaust pipe 5g are adjusted so that the pressure for exhausting the lower cleaning space is lower than the pressure for exhausting the upper cleaning space. Further, during the cleaning of the inside of the main body 20a by the cleaning liquid nozzle 5h1 and during the supply of the heated gas to the inside of the main body 20a by the hot blow nozzle 5i1, the exhaust volume by the first exhaust pipe 5f and the exhaust volume by the second exhaust pipe 5g are adjusted so that the pressure of the lower cleaning space is lower than the pressure of the upper cleaning space. Thereby, it is possible to prevent the water vapor inside the main body 20a, which has been exhausted to the lower cleaning space by the exhaust of the second exhaust pipe 5g, from entering the upper cleaning space where the main body 20a is placed. Therefore, it is possible to prevent the water vapor exhausted from the inside of the main body 20a from adhering to and contaminating the outside of the main body 20a or the door 20b of the FOUP 20.

[0103] Further, the placement portion 5c is circular in plan view and is supported so as to be rotatable around the support shaft 5a3 provided at the center portion. And the first drainage receiving portion 5d has an annular concave groove shape in plan view, and the inner peripheral end of the first drainage receiving portion 5d is located between the hole portion 5c2 formed in the placement portion 5c and the rotating member 5a5. The outer peripheral end of the first drainage receiving portion 5d is arranged to be located between the outermost peripheral portion of the main body 20a placed on the placement surface 5c1 with the opening of the main body 20a facing downward and the outer peripheral end of the placement portion 5c. Further, a gap is formed between the outer peripheral portion of the first drainage receiving portion 5d and the placement portion 5c so that gas flowing from the storage space of the main body 20a toward the second exhaust pipe 5g via the hole portion 5c2 can flow through. Thereby, while effectively discharging the drainage of the cleaning liquid separately on the outside and the inside of the main body 20a, the storage space and the outside of the main body 20a can be effectively exhausted, and the remaining particles inside the main body 20a can be further reduced.

[0104] As described above, the embodiments of the present invention have been described. However, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, and combinations can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and its equivalent scope.

Explanation of Reference Numerals

[0105] 1 Wafer storage container cleaning device 5 Cleaning tank 5a Cleaning tank main body 5c Placement portion 5d First drainage receiving portion 5e Second drainage receiving portion 5f First exhaust pipe 5g Second exhaust pipe 5h1, 5h2, 5h3 Cleaning liquid nozzles 5i1, 5i2, 5i3 Hot blow nozzles

Claims

1. A cleaning tank body for housing the main body of a wafer storage container including a storage space for storing a semiconductor wafer and the main body having an opening of the storage space, a placement portion disposed in the cleaning tank body, having a placement surface on which the main body is placed with the opening facing downward, and supporting the main body by the placement surface, a cleaning liquid supply portion for cleaning the inside and outside of the main body by supplying a cleaning liquid to the inside as a wall surface surrounding the storage space and the outside as an outer wall surface of the main body, a first drainage receiving portion for receiving drainage which is the cleaning liquid after cleaning the inside of the main body, and discharging the received drainage to the outside, a second drainage receiving portion for receiving drainage which is the cleaning liquid after cleaning the outside of the main body, and discharging the received drainage to the outside, an exhaust portion for exhausting at least the storage space constituted by the inside of the main body, A wafer storage container cleaning device comprising the above.

2. The exhaust portion exhausts the storage space during cleaning of the inside of the main body by the cleaning liquid supply portion. The wafer storage container cleaning device according to Claim 1.

3. The cleaning tank body further includes a partition plate for partitioning the inside of the cleaning tank body into an upper space and a lower space above the placement portion, an opening portion communicating the storage space and the lower space is formed in the placement portion, The exhaust portion exhausts the storage space by exhausting the lower space. The wafer storage container cleaning device according to Claim 1.

4. The device further includes a heated gas supply portion for supplying heated gas to the inside and outside of the main body, The exhaust portion performs a first exhaust for exhausting the storage space during cleaning of the inside of the main body by the cleaning liquid supply portion at a first exhaust volume, and performs a second exhaust for exhausting the storage space during supplying the heated gas to the inside of the main body by the heated gas supply portion at a second exhaust volume larger than the first exhaust volume. The wafer storage container cleaning device according to Claim 1.

5. The exhaust portion further exhausts the upper space, and adjusts the exhaust volume when exhausting the upper space and the exhaust volume when exhausting the lower space so that the pressure of the lower space is lower than the pressure of the upper space. The wafer storage container cleaning device according to Claim 3.

6. The device further includes a heated gas supply portion for supplying heated gas to the inside and outside of the main body. The exhaust section adjusts the exhaust amount when exhausting the lower space so that the pressure of the lower space becomes lower than the pressure of the upper space during the cleaning inside the main body by the cleaning liquid supply section and during the supply of the heated gas into the main body by the heated gas supply section, and the exhaust amount when exhausting the lower space. The wafer storage container cleaning device according to claim 5.

7. The placement section has a circular shape in plan view and is rotatably supported around a rotation axis provided at the center. The first liquid drainage receiving section has an annular concave groove shape in plan view. The inner peripheral end of the first liquid drainage receiving section is located between the opening formed in the placement section and the rotation axis, and the outer peripheral end of the first liquid drainage receiving section is located between the outermost peripheral part of the main body placed on the placement surface with the opening of the main body facing downward and the outer peripheral end of the placement section. At the same time, a gap is formed between the outer peripheral part of the first liquid drainage receiving section and the placement section so that a gas flowing from the storage space through the opening toward the exhaust section can flow through. The wafer storage container cleaning device according to claim 3.

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