Capacitor and manufacturing method of the capacitor

Abstract

To provide a capacitor capable of easily inspecting whether or not a foreign matter adheres to a joint part of a joint terminal portion.SOLUTION: A film capacitor 1 includes: a capacitor element 100; a first bus bar 200 and a second bus bar 300; and an exterior body (a filling resin 30). The first bus bar 200 and the second bus bar 300 include a first bonding terminal part 230 and a second bonding terminal part 330 that are exposed from the exterior body and have a flat plate shape to which external terminals T1 and T2 are bonded. Some regions of the surfaces of the first bonding terminal part 230 and the second bonding terminal part 330 are set as a first bonding part 231 and a second bonding part 331 to be welded when the external terminals T1 and T2 are bonded. The surfaces of the first bonding terminal part 230 and the second bonding terminal part 330 are provided with clarifying parts (a first groove part 232 and a second groove part 332) for clarifying the regions of the first bonding part 231 and the second bonding part 331.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a capacitor and a method for manufacturing the capacitor.

Background Art

[0002] Conventionally, a capacitor has been known in which a capacitor element and a bus bar connected to an electrode of the capacitor element are covered with a resin exterior body to enhance moisture resistance, shock resistance, and humidity resistance. In such a capacitor, there are a type in which the exterior body is constituted by a resin filled in a case and the case is provided outside the exterior body, and a type in which the exterior body is constituted by resin molding using a casting mold and the case is not provided outside the exterior body. In such a capacitor, a bonding terminal portion is provided at a portion of the bus bar exposed from the exterior body, and an external terminal provided in an external device is bonded to the bonding terminal portion.

[0003] As one of the bonding methods between the bonding terminal portion and the external terminal, for example, a method by welding can be used. In this case, one or a plurality of bonding portions are provided in the bonding terminal portion. The external terminal is overlapped with the bonding terminal portion, and welding is performed at the position of the bonding portion. Thereby, the bonding terminal portion and the external terminal are bonded. A capacitor module as an example of such a capacitor is described in Patent Document 1.

[0004] In the capacitor module of Patent Document 1, a plate-like welding terminal (bus bar) has a standing portion (bonding terminal portion) at a portion protruding from a potting resin (exterior body). A welding portion (bonding portion) is provided at an end of the standing portion so as to protrude from the end. When a terminal (external terminal) of another component (external device) is bonded to the standing portion of the welding terminal, a portion of the standing portion including the welding portion and the terminal (external terminal) of the other component are overlapped in their thickness directions, and welding is performed at the position of the welding portion.

Prior Art Documents

Patent Documents

[0005] Patent Document 1 Japanese Patent Application Laid-Open No. 2015-220789 Summary of the Invention Problems to be Solved by the Invention

[0006] When the bonding terminal portion and the external terminal are joined by welding as described above, if foreign matter adheres to the joint portion of the bonding terminal portion, there is a risk that the foreign matter may interfere with the welding. In particular, in the manufacturing process of a capacitor, when the exterior body is formed by resin in a case or a casting mold, air bubbles contained in the resin in a liquid phase state may splash near the liquid surface and the resin may scatter from the liquid surface, and the scattered resin may adhere to the joint portion, which may interfere with the welding.

[0007] Therefore, in the completed capacitor, it is conceivable to inspect whether foreign matter adheres to the joint portion of the bonding terminal portion.

[0008] In the capacitor module of Patent Document 1 described above, the welded portion has a protrusion shape protruding from the end portion of the standing portion. For this reason, it is easy to clearly distinguish the welded portion from other portions of the standing portion, and an inspector can easily grasp the welded portion during the inspection for foreign matter adhesion.

[0009] However, depending on the capacitor, there may be a configuration in which a part of the surface of the bonding terminal portion having a flat plate shape is set as the joint portion. When configured in this way, it is difficult to distinguish the region of the joint portion from other regions on the surface of the bonding terminal portion, so it is difficult for an inspector to grasp the joint portion, and there is a risk that the inspection becomes difficult.

[0010] Furthermore, it is more desirable to be able to prevent foreign matter from adhering to the joint portion in the process until the external terminal is joined to the joint portion of the bonding terminal portion, such as in the manufacturing process of the capacitor, because the inspection for the presence or absence of foreign matter adhesion becomes unnecessary.

[0011] The above problems can similarly occur in a capacitor in which the bonding terminal portion and the external terminal are joined by brazing or welding.

[0012] Therefore, an object of the present invention is to provide a capacitor capable of easily inspecting whether foreign matter adheres to the joint portion of the joint terminal portion. Further, an object of the present invention is to provide a capacitor capable of preventing foreign matter from adhering to the joint portion of the joint terminal portion and a method for manufacturing the capacitor.

Means for Solving the Problems

[0013] A first aspect of the present invention relates to a capacitor. The capacitor according to this aspect includes a capacitor element having electrodes, a bus bar connected to the electrodes, and an exterior body formed of a resin material and covering the capacitor element and a part of the bus bar. Here, the bus bar includes a flat joint terminal portion that is exposed from the exterior body and to which an external terminal is joined. A part of the region on the surface of the joint terminal portion is set as a joint portion where welding, brazing or soldering is performed when the external terminal is joined. An explicit portion for explicitly indicating the region of the joint portion is provided on the surface of the joint terminal portion.

[0014] A second aspect of the present invention relates to a capacitor. The capacitor according to this aspect includes a capacitor element having electrodes, a bus bar connected to the electrodes, and an exterior body formed of a resin material and covering the capacitor element and a part of the bus bar. Here, the bus bar includes a flat joint terminal portion that is exposed from the exterior body and to which an external terminal is joined. A part of the region on the surface of the joint terminal portion is set as a joint portion where welding, brazing or soldering is performed when the external terminal is joined. The region of the joint portion on the surface of the joint terminal portion is covered by a removable protective member.

[0015] The third aspect of the present invention relates to a method for manufacturing a capacitor. The method for manufacturing a capacitor according to this aspect includes an accommodating step of accommodating a capacitor element module including a capacitor element having an electrode and a bus bar connected to the electrode into a case having an opening through the opening, a resin injection step of injecting a resin in a liquid phase state into the case in which the capacitor element module is accommodated through the opening, and a resin curing step of curing the resin in the liquid phase state in the case to form an exterior body covering the capacitor element module. Here, the bus bar includes a flat bonding terminal portion to which an external terminal is bonded. A part of a region on the surface of the bonding terminal portion is set as a bonding portion where welding, brazing or soldering is performed when the external terminal is bonded. In the resin injection step, the capacitor element and the bus bar are buried in the resin in the liquid phase state so that the bonding terminal portion is exposed from the liquid surface of the resin in the liquid phase state that becomes the casting surface of the exterior body. The resin injection step and the resin curing step are performed in a state where the region of the bonding portion is covered with a removable protective member.

[0016] The fourth aspect of the present invention relates to a method for manufacturing a capacitor. The method for manufacturing a capacitor according to this aspect includes an accommodating step of accommodating a capacitor element module including a capacitor element having electrodes and a bus bar connected to the electrodes into a casting mold having an opening through the opening, a resin injection step of injecting a resin in a liquid phase state into the casting mold in which the capacitor element module is accommodated through the opening, and a resin curing step of curing the resin in the liquid phase state in the casting mold to form an exterior body covering the capacitor element module. Here, the bus bar includes a flat bonding terminal portion to which an external terminal is bonded. A part of the region on the surface of the bonding terminal portion is set as a bonding portion where welding, brazing or soldering is performed when the external terminal is bonded. In the resin injection step, the capacitor element and the bus bar are buried in the resin in the liquid phase state so that the bonding terminal portion is exposed from the liquid surface of the resin in the liquid phase state that becomes the casting surface of the exterior body. The resin injection step and the resin curing step are performed in a state where the region of the bonding portion is covered with a removable protective member.

Advantages of the Invention

[0017] According to the present invention, it is possible to provide a capacitor that can easily inspect whether foreign matter adheres to the bonding portion of the bonding terminal portion. Furthermore, according to the present invention, it is possible to provide a capacitor and a method for manufacturing a capacitor that can prevent foreign matter from adhering to the bonding portion of the bonding terminal portion.

[0018] The effects or significance of the present invention will become clearer from the following description of the embodiments. However, the embodiments shown below are merely examples when implementing the present invention, and the present invention is not limited to those described in the following embodiments at all.

Brief Description of the Drawings

[0019]

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DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, a film capacitor, which is an embodiment of the capacitor of the present invention, will be described with reference to the drawings. For convenience, X-axis, Y-axis, and Z-axis orthogonal to each other are added to each drawing.

[0021] <Embodiment 1> The film capacitor 1 according to Embodiment 1 will be described. The film capacitor 1 is a so-called case-molded type capacitor.

[0022] FIG. 1 is a perspective view of the film capacitor 1. FIG. 2 is a cross-sectional view of the film capacitor 1 cut parallel to the XZ plane at the center in the Y-axis direction. In FIG. 2, for convenience, the filling resin 30 is shown in a transparent state.

[0023] The film capacitor 1 includes a capacitor element module 10, a case 20, and a filling resin 30. The capacitor element module 10 is housed in the case 20, and the case 20 is filled with the filling resin 30.

[0024] The filling resin 30 is a thermosetting resin such as an epoxy resin. The filling resin 30 is an exterior body that covers the capacitor element module 10 in the case 20. The portion of the capacitor element module 10 buried in the filling resin 30 is protected from moisture and impact by the case 20 and the filling resin 30.

[0025] Figures 3 and 4 are perspective views of the capacitor element module 10. Figure 5 is a cross-sectional view of the capacitor element module 10 cut parallel to the XY plane at a position on the negative Z-axis side of the insulating member 400. Figure 6 is a perspective view of the first bus bar 200. Figure 7 is a perspective view of the second bus bar 300. Figure 8(a) is a main part cross-sectional view of the first bus bar 200 cut at the position of the first joint portion 231 showing the vicinity of the first joint terminal portion 230. Figure 8(b) is a main part cross-sectional view of the second bus bar 300 cut at the position of the second joint portion 331 showing the vicinity of the second joint terminal portion 330. Figures 9(a) and (b) are perspective views of the insulating member 400.

[0026] The capacitor element module 10 includes four capacitor elements 100, a first bus bar 200, a second bus bar 300, and an insulating member 400.

[0027] The capacitor element 100 is formed in a shape close to a flat oblong cylinder by stacking two metallized films with aluminum vapor-deposited on a dielectric film, winding or laminating the stacked metallized films, and pressing them. On one end face of the capacitor element 100, a first electrode 110 is formed by spraying a metal such as zinc, and on the other end face, a second electrode 120 is formed by spraying the same metal such as zinc.

[0028] The capacitor element 100 has a circumferential surface 130 connecting the first electrode 110 and the second electrode 120. The circumferential surface 130 includes two first planes 131 arranged in the X-axis direction, which is the short side direction of the capacitor element 100, two second planes 132 arranged in the Y-axis direction, which is the long side direction of the capacitor element 100, and four arc surfaces 133 existing between the first plane 131 and the second plane 132. The dimension of the first plane 131 in the Y-axis direction is larger than the dimension of the second plane 132 in the X-axis direction.

[0029] Note that the capacitor element 100 of the present embodiment is formed of a metallized film obtained by vapor-depositing aluminum on a dielectric film. However, it may also be formed of a metallized film obtained by vapor-depositing other metals such as zinc and magnesium. Alternatively, the capacitor element 100 may be formed of a metallized film obtained by vapor-depositing a plurality of these metals, or may be formed of a metallized film obtained by vapor-depositing an alloy of these metals.

[0030] The four capacitor elements 100 are arranged in two rows each in the X-axis direction and the Y-axis direction such that the peripheral surfaces 130 face each other. In each capacitor element 100, the first electrode 110 faces the negative Z-axis direction, and the second electrode 120 faces the positive Z-axis direction.

[0031] The first bus bar 200 is formed by appropriately cutting and bending a conductive material, for example, a copper plate, and has a configuration in which the first electrode terminal portion 210, the first relay portion 220, and the first bonding terminal portion 230 are integrated.

[0032] The first electrode terminal portion 210 has a substantially rectangular flat plate shape that is long in the Y-axis direction. Two corner portions of the first electrode terminal portion 210 in the positive X-axis direction are formed into large arcs. A substantially U-shaped notch portion 211 is formed at the end of the first electrode terminal portion 210 in the positive X-axis direction at the center.

[0033] The first relay portion 220 relays between the first electrode terminal portion 210 and the first bonding terminal portion 230. The first relay portion 220 has a substantially rectangular flat plate shape that is long in the Y-axis direction, and extends in the positive Z-axis direction perpendicular to the first electrode terminal portion 210 from the end of the first electrode terminal portion 210 in the negative X-axis direction. The dimension of the first relay portion 220 in the Z-axis direction is larger than the dimension of the capacitor element 100 in the Z-axis direction, that is, the dimension in the direction in which the first electrode 110 and the second electrode 120 are arranged.

[0034] At the first relay portion 220, two protrusions 221 are provided at two positions on the surface in the positive X-axis direction, on the positive Y-axis side and the negative Y-axis side, and at positions closer to the first electrode terminal portion 210 than the center in the Z-axis direction, such that the two protrusions 221 are arranged in the Y-axis direction. The four protrusions 221 have a flat, substantially columnar shape and protrude in the positive X-axis direction from the surface of the first relay portion 220 on the positive X-axis side. The tip surface 221a of each protrusion 221 has a flat shape, and the outer peripheral edge of the tip surface 221a is chamfered in an arc shape. Further, at the positive Y-axis end and the negative Y-axis end of the first relay portion 220, in the vicinity of the first bonding terminal portion 230, first protruding pieces 222 protruding in the positive Y-axis direction and the negative Y-axis direction are respectively formed.

[0035] The first bonding terminal portion 230 has a substantially rectangular flat plate shape that is elongated in the Y-axis direction, and extends in the negative X-axis direction perpendicular to the first relay portion 220 from the positive Z-axis end of the first relay portion 220. On the inner portion of the surface of the first bonding terminal portion 230, first bonding portions 231 where welding is performed when external terminals are bonded are set at two positions side by side in the Y-axis direction. And on the surface of the first bonding terminal portion 230, as an explicit portion for explicitly indicating the region of each first bonding portion 231, a substantially rectangular annular first groove portion 232 for explicitly indicating the boundary between the region of the first bonding portion 231 and the other region is provided.

[0036] As shown in FIG. 8(a), the first groove portion 232 has, for example, a V-shaped cross section. The first groove portion 232 may have a cross-sectional shape other than V-shaped, such as a semi-circle, a U-shape, or a rectangle. In the first bonding terminal portion 230, the thickness D1 at the portion of each first groove portion 232 is smaller than the thickness D2 at the portion of each first bonding portion 231.

[0037] The second bus bar 300 is formed by appropriately cutting and bending a conductive material, for example, a copper plate, and has a configuration in which a second electrode terminal portion 310, a second relay portion 320, and a second bonding terminal portion 330 are integrated.

[0038] The second electrode terminal 310 has a generally rectangular flat plate shape that is long in the Y-axis direction, and the end 310a on the negative X-axis side (the second relay portion 320 side) is one step higher in the Z-axis direction. The two corners of the second electrode terminal 310 in the positive X-axis direction are formed into large arcs. A generally semicircular notch 311 is formed in the center of the end of the second electrode terminal 310 in the positive X-axis direction.

[0039] The second link portion 320 provides a relay between the second electrode terminal 310 and the second connecting terminal 330. The second link portion 320 has a generally rectangular flat plate shape that is elongated in the Y-axis direction, and extends in the Z-axis positive direction perpendicular to the second electrode terminal 310 from the end of the second electrode terminal 310 in the X-axis negative direction. Second protruding pieces 321 that protrude in the Y-axis positive direction and the Y-axis negative direction are formed on the end of the second link portion 320 on the Y-axis positive side and the Y-axis negative side, respectively.

[0040] Second connecting terminal portion 330 has a generally rectangular flat plate shape that is elongated in the Y-axis direction, and extends in the X-axis positive direction from the end of second relay portion 320 in the Z-axis positive direction perpendicular to second relay portion 320. Second connecting portions 331, to which welding is performed when joining external terminals, are set in two positions aligned in the Y-axis direction on the inner part of the surface of second connecting terminal portion 330. Second connecting portions 331 are welded when joining external terminals. Second connecting terminal portion 330 has generally rectangular annular second groove portions 332 on its surface as identifying portions that identify the areas of each second connecting portion 331, and that identify the boundaries between the areas of second connecting portions 331 and other areas.

[0041] 8(b), the second groove 332 has, for example, a V-shaped cross section. The second groove 332 may have a cross-sectional shape other than a V-shape, such as a semicircular, U-shaped, or rectangular shape. The second connecting terminal 330 has a thickness D3 at each second groove 332 which is smaller than a thickness D4 at each second connecting portion 331.

[0042] The insulating member 400 is formed of a material having electrical insulation properties such as polyphenylene sulfide (PPS), and has a substantially rectangular flat plate shape that is long in the Y-axis direction. On the first surface 400a on the negative X-axis side and the second surface 400b on the positive X-axis side of the insulating member 400, a substantially rectangular first recess 410 and a second recess 420 that are recessed in the Y-axis direction with respect to these surfaces are respectively formed. In the first recess 410, a passage 411 that extends to the end on the negative Z-axis side of the insulating member 400 is provided at the end on the positive Y-axis side.

[0043] The insulating member 400 is provided with holding portions 430 at both ends in the Y-axis direction. Each holding portion 430 is provided with a first fitting groove 431 that opens in the negative Z-axis direction and the Y-axis direction on the first surface 400a side, and a second fitting groove 432 that opens in the positive Z-axis direction and the Y-axis direction on the second surface 400b side. Further, the insulating member 400 is provided with a shielding portion 440 that extends in the negative X-axis direction at the end in the positive Z-axis direction.

[0044] In the capacitor element module 10, the first electrode terminal portion 210 of the first bus bar 200 contacts the first electrodes 110 of the four capacitor elements 100 from the negative Z-axis side. The first electrode terminal portion 210 and the four first electrodes 110 are joined by a joining method such as welding or soldering. Thereby, the first bus bar 200 is electrically connected to the four first electrodes 110.

[0045] The second electrode terminal portion 310 of the second bus bar 300 contacts the second electrodes 120 of the four capacitor elements 100 from the positive Z-axis side. A gap exists between the end portion 310a of the second electrode terminal portion 310 and the second electrode 120. The second electrode terminal portion 310 and the four second electrodes 120 are joined by a joining method such as welding or soldering. Thereby, the second bus bar 300 is electrically connected to the four second electrodes 120.

[0046] The first relay portion 220 of the first bus bar 200 faces the first plane 131 of the circumferential surfaces 130 of the two capacitor elements 100 on the negative X-axis side, across the entire region between the first electrode 110 and the second electrode 120, from the negative X-axis side. The tip surfaces 221a of the two protrusions 221 on the positive Y-axis side of the first relay portion 220 contact the first plane 131 of the capacitor element 100 on the positive Y-axis side at a position closer to the first electrode 110 than the second electrode 120. Similarly, the tip surfaces 221a of the two protrusions 221 on the negative Y-axis side of the first relay portion 220 contact the first plane 131 of the capacitor element 100 on the negative Y-axis side at a position closer to the first electrode 110 than the second electrode 120.

[0047] The portion of the insulating member 400 on the positive Z-axis side is interposed between the first relay portion 220 of the first bus bar 200 and the second relay portion 320 of the second bus bar 300 in a state of being in contact with them. Also, the portion of the insulating member 400 on the negative Z-axis side is interposed between the first relay portion 220 of the first bus bar 200 and the first plane 131 of the two capacitor elements 100 on the negative X-axis side in a state of being in contact with them. Thereby, insulation between the first relay portion 220, the second relay portion 320, and the second electrode 120 is ensured.

[0048] The thickness D5 of the insulating member 400 is made equal to the protruding length D6 of the four protrusions 221 of the first relay portion 220 (see FIG. 2). Thereby, the first plane 131 of the two capacitor elements 100 and the first relay portion 220 become parallel. A uniform gap S with a constant width (the width corresponding to the thickness D5 and the protruding length D6) is ensured between the first plane 131 of the two capacitor elements 100 and the first relay portion 220. Since the distance between the two capacitor elements 100 and the first relay portion 220 is maintained constant, that is, the variation in the distance is suppressed, the electrical characteristics of the film capacitor 1 are less likely to vary.

[0049] The first protruding piece 222 of the first relay part 220 is fitted into the first fitting groove 431 of the holding part 430 of the insulating member 400 from the negative Z-axis direction side, and the first joint terminal part 230 abuts against the eaves part 440 of the insulating member 400 from the negative Z-axis direction side. The second protruding piece 321 of the second relay part 320 is fitted into the second fitting groove 432 of the holding part 430 of the insulating member 400 from the negative Z-axis direction side, and the second joint terminal part 330 abuts against the holding part 430 from the positive Z-axis direction side. Thereby, the three members of the first bus bar 200, the second bus bar 300, and the insulating member 400 are less likely to separate in the Z-axis direction, the Y-axis direction, and the Z-axis direction.

[0050] FIG. 10 is a perspective view of the case 20.

[0051] The case 20 is formed of a resin material, for example, a thermoplastic resin such as polyphenylene sulfide (PPS). The case 20 may be formed of a thermosetting resin such as an epoxy resin.

[0052] The case 20 has a substantially rectangular parallelepiped box shape, and includes a substantially rectangular opening 21, a substantially rectangular bottom surface portion 22 facing the opening 21, first side surface portions 23 and 24 that extend from both end portions on the X-axis direction side of the bottom surface portion 22 toward the opening 21 (positive Z-axis direction) and face each other, and third side surface portions 25 and 4 that extend from both end portions on the Y-axis direction side of the bottom surface portion 22 toward the opening 21 (positive Z-axis direction) and face each other.

[0053] Mounting tabs 27 are provided on the first side surface portion 23, the third side surface portion 25, and the fourth side surface portion 26. Insertion holes 27a are formed in each mounting tab 27. A metal collar 27b is fitted into the insertion hole 27a to increase the strength of the hole. Further, positioning tabs 28 are provided on the third side surface portion 25 and the fourth side surface portion 26. Each positioning tab 28 has a positioning pin 28a that protrudes toward the bottom surface portion 22 side. When the film capacitor 1 is installed on the installation portion of an external device, the mounting tab 27 is fixed to the installation portion with a screw or the like. At this time, in order to position the film capacitor 1 with respect to the installation portion, the positioning pin 28a is inserted into a positioning hole provided in the installation portion.

[0054] In the case 20, the capacitor element module 10 is arranged such that the first electrodes 110 of the four capacitor elements 100 face the bottom surface portion 22 of the case 20. The first relay portion 220 of the first bus bar 200 extends from the bottom surface portion 22 side toward the opening portion 21 side along the second side surface portion 24 of the case 20, is led out from the casting surface 31 of the filling resin 30 to the outside of the filling resin 30, and the first bonding terminal portion 230 of the first bus bar 200 is exposed from the filling resin 30. Further, the second relay portion 320 of the second bus bar 300 is led out from the casting surface 31 to the outside of the filling resin 30, and the second bonding terminal portion 330 of the second bus bar 300 is exposed from the filling resin 30.

[0055] When the film capacitor 1 is assembled, first, an accommodation process is performed, and the capacitor element module 10 is accommodated in the case 20 through the opening portion 21. The capacitor element module 10 is positioned at a predetermined position in the case 20 by a positioning jig.

[0056] Next, a resin injection process is performed, and the liquid-phase filling resin 30 is injected into the case 20 through the opening portion 21 and filled up to a position close to the opening portion 21. The first bonding terminal portion 230 of the first bus bar 200 and the second bonding terminal portion 330 of the second bus bar 300 are exposed from the liquid surface of the liquid-phase filling resin 30 that becomes the casting surface 31 after curing.

[0057] A gap S with a certain width is secured between the first plane 131 of the two capacitor elements 100 on the negative X-axis side and the first relay portion 220 of the first bus bar 200 by the insulating members 400 and the four protrusions 221. For this reason, the injected filling resin 30 can easily enter the gap S, and the gap S is sufficiently filled with the filling resin 30 so that air hardly remains in the gap S. In particular, not only does the filling resin 30 enter the gap S from both sides in the Y-axis direction of the first relay portion 220, but as shown by the broken-line arrow in FIG. 2, the filling resin 30 enters through the gap between the end portion 310a of the second electrode terminal portion 310 of the second bus bar 300 and the second electrode 120 of the two capacitor elements 100 on the negative X-axis side and the gap between the two second electrodes 120, so that the filling resin 30 can easily spread in the gap S.

[0058] Also, the injected filling resin 30 enters the first concave portion 410 and the second concave portion 420 of the insulating member 400, and the first concave portion 410 and the second concave portion 420 are filled with the filling resin 30.

[0059] Furthermore, in the capacitor element module 10, the notch portion 211 of the first electrode terminal portion 210 of the first bus bar 200 and the notch portion 311 of the second electrode terminal portion 310 of the second bus bar 300 are provided so as to coincide with the space generated in the central portion of the four capacitor elements 100 (see FIGS. 3 and 4). For this reason, the injected filling resin 30 can easily spread between the capacitor element module 10 and the bottom surface portion 22 of the case 20 through the two notch portions 211, 311 and the space in the central portion.

[0060] When the case 20 is filled with the filling resin 30, a resin curing process is performed, the inside of the case 20 is heated, and the filling resin 30 is heated. As a result, the filling resin 30 cures inside the case 20. The filling resin 30 becomes an exterior body that covers the capacitor element module 10.

[0061] In this way, the film capacitor 1 as shown in FIG. 1 is completed.

[0062] The circumferential surfaces 130 of the two capacitor elements 100 on the negative X-axis side and the first relay portion 220 are adhered by the filling resin 30 present in the gap S therebetween. At this time, since the filling resin 30 present in the gap S has a certain thickness ensured, peeling hardly occurs between the circumferential surface 130 of each capacitor element 100 and the filling resin 30 or between the first relay portion 220 and the filling resin 30. Also, since the gap S is difficult to narrow, voids are less likely to occur in the filling resin 30 present in the gap S. Therefore, since a decrease in moisture resistance due to moisture intrusion into the peeled portion or voids hardly occurs, the moisture resistance of the film capacitor 1 can be improved. Further, the first relay portion 220 and the insulating member 400 are adhered by the filling resin 30 in the first recess 410, and the second relay portion 320 and the insulating member 400 are adhered by the filling resin 30 in the second recess 420. Thereby, it becomes difficult for moisture to penetrate between the first relay portion 220 and the insulating member 400 and between the second relay portion 320 and the insulating member 400, and the moisture resistance of the film capacitor 1 is further improved.

[0063] When the filling resin 30 in a liquid phase state is injected into the case 20 by the resin injection process, a large number of air bubbles may be generated in the filling resin 30 in the liquid phase state in the case 20 due to air being entrained. These air bubbles may burst near the liquid surface and the resin may splash from the liquid surface, and there is a risk that the splashed resin may adhere to the first joint portion 231 of the first joint terminal portion 230 or the second joint portion 331 of the second joint terminal portion 330 that are present near the liquid surface. Further, in various processes until the film capacitor 1 is completed, there is also a risk that foreign matters such as dust may adhere to the first joint portion 231 and the second joint portion 331.

[0064] When external terminals are joined to the first joint terminal portion 230 and the second joint terminal portion 330, welding is performed within the regions of the first joint portion 231 and the second joint portion 331. For this reason, in the completed film capacitor 1, if foreign matters such as resin and dust adhere to the first joint portion 231 and the second joint portion 331, there is a risk of hindering the welding.

[0065] Therefore, in the completed film capacitor 1, an inspection is performed to check whether foreign matter adheres to the first joint portion 231 and the second joint portion 331. In the film capacitor 1 of the present embodiment, on the surface of the first joint terminal portion 230, the boundary between the region of the first joint portion 231 and the other regions is indicated by a first groove portion 232 which is an indicating portion. Similarly, on the surface of the second joint terminal portion 330, the boundary between the region of the second joint portion 331 and the other regions is indicated by a second groove portion 332 which is an indicating portion. For this reason, the inspector can easily grasp the first joint portion 231 and the second joint portion 331, and can easily perform an inspection for the presence or absence of foreign matter adhesion. Then, the inspector can easily detect foreign matter, particularly resin adhesion, to the first joint portion 231 and the second joint portion 331.

[0066] The film capacitor 1 is mounted on an external device. The external device is provided with an external terminal T1 corresponding to the first joint terminal portion 230 of the first bus bar 200 and an external terminal T2 corresponding to the second joint terminal portion 330 of the second bus bar 300. The external terminal T1 is joined to the first joint terminal portion 230 by welding, and the external terminal T2 is joined to the second joint terminal portion 330 by welding.

[0067] FIG. 11 is a plan view of the film capacitor 1 in a state where the external terminals T1 and T2 are joined to the first joint terminal portion 230 and the second joint terminal portion 330.

[0068] The external terminal T1 is overlapped on the surface of the first joint terminal portion 230 so as to cover the two first joint portions 231. The joint surface of the external terminal T1 that contacts the first joint terminal portion 230 is flat. Similarly, the external terminal T2 is overlapped on the surface of the second joint terminal portion 330 so as to cover the two second joint portions 331. The joint surface of the external terminal T2 that contacts the second joint terminal portion 330 is flat.

[0069] Welding (such as laser welding, resistance welding, etc.) using welding equipment is performed within the regions of the respective first joint portions 231 and the respective second joint portions 331. Thereby, the external terminal T1 is joined to the first joint terminal portion 230, and the external terminal T2 is joined to the second joint terminal portion 330.

[0070] The actual welding portion P has a shape that is long in the longitudinal direction (Y-axis direction) of the first joining terminal portion 230 and the second joining terminal portion 330. Therefore, in order to correspond to the shape of the welding portion P, each of the first joining portions 231 and each of the second joining portions 331 has a substantially rectangular shape. Also, due to assembly tolerances, member tolerances, etc. in the film capacitor 1, there is a possibility that the position of the welding portion P may shift slightly. Therefore, considering the positional deviation of the welding portion P, the sizes of each of the first joining portions 231 and each of the second joining portions 331 are made larger than the size of the welding portion P. Note that if the shape of the welding portion P is changed, the shapes of each of the first joining portions 231 and each of the second joining portions 331 can be changed accordingly.

[0071] The indicating portion that indicates each of the first joining portions 231 is the first groove portion 232, and it does not protrude from the surface of the first joining terminal portion 230. Therefore, the contact of the joining surface of the external terminal T1 with the surface of the first joining terminal portion 230 is not obstructed by the indicating portion. Also, in the first joining terminal portion 230, the thickness D1 at the portion of each of the first groove portions 232 is smaller than the thickness D2 at the portion of each of the first joining portions 231 (see Fig. 8(a)). For this reason, heat is less likely to propagate in the portion of each of the first groove portions 232, so the heat generated at each of the first joining portions 231 during welding is less likely to escape from each of the first joining portions 231. Therefore, welding can be efficiently performed at each of the first joining portions 231.

[0072] Similarly, the indicating portion that indicates each of the second joining portions 331 is the second groove portion 332, and it does not protrude from the surface of the second joining terminal portion 330. Therefore, the contact of the joining surface of the external terminal T2 with the surface of the second joining terminal portion 330 is not obstructed by the indicating portion. Also, in the second joining terminal portion 330, the thickness D3 at the portion of each of the second groove portions 332 is smaller than the thickness D4 at the portion of each of the second joining portions 331 (see Fig. 8(b)). For this reason, heat is less likely to propagate in the portion of each of the second groove portions 332, so the heat generated at each of the second joining portions 331 during welding is less likely to escape from each of the second joining portions 331. Therefore, welding can be efficiently performed at each of the second joining portions 331.

[0073] Since the first joint portion 231 and the second joint portion 331 are defined by the first groove portion 232 and the second groove portion 332, it is also possible for the welding equipment to identify the areas of the first joint portion 231 and the second joint portion 331 by image recognition and perform welding.

[0074] <Effect of Embodiment 1> As described above, according to Embodiment 1, the following effects are achieved.

[0075] The film capacitor 1 includes a capacitor element 100 having a first electrode 110 and a second electrode 120, first and second bus bars 200 and 300 connected to the first electrode 110 and the second electrode 120, and an exterior body (filled resin 30) formed of a resin material and covering the capacitor element 100 and a part of the first and second bus bars 200 and 300. The first and second bus bars 200 and 300 include flat first and second joint terminal portions 230 and 330 that are exposed from the exterior body and to which external terminals T1 and T2 are joined. A partial area on the surfaces of the first and second joint terminal portions 230 and 330 is set as first and second joint portions 231 and 331 where welding is performed when the external terminals T1 and T2 are joined. On the surfaces of the first and second joint terminal portions 230 and 330, there are provided indicating portions (first groove portion 232 and second groove portion 332) for indicating the areas of the first and second joint portions 231 and 331.

[0076] According to this configuration, when inspecting whether foreign matter that may interfere with welding adheres to the first joint portion 231 and the second joint portion 331, it is easier for the inspector to recognize the areas of the first joint portion 231 and the second joint portion 331 on the surfaces of the first and second joint terminal portions 230 and 330. Therefore, the inspector can perform the inspection easily.

[0077] Furthermore, the marking portion is an annular first groove portion 232 formed on the surface of the first bonding terminal portion 230 to indicate the boundary between the region of the first bonding portion 231 and the other regions, and is also an annular second groove portion 332 formed on the surface of the second bonding terminal portion 330 to indicate the boundary between the region of the second bonding portion 331 and the other regions. The first bonding terminal portion 230 has a thickness D1 at the portion of the first groove portion 232 that is smaller than the thickness D2 at the portion of the first bonding portion 231, and the second bonding terminal portion 330 has a thickness D3 at the portion of the second groove portion 332 that is smaller than the thickness D4 at the portion of the second bonding portion 331.

[0078] According to this configuration, the contact of the bonding surface of the external terminal T1 with the surface of the first bonding terminal portion 230 is not hindered by the first groove portion 232. Also, the heat generated at the first bonding portion 231 during welding is less likely to escape from the first bonding portion 231, enabling efficient welding. Similarly, the contact of the bonding surface of the external terminal T2 with the surface of the second bonding terminal portion 330 is not hindered by the second groove portion 332. Also, the heat generated at the second bonding portion 331 during welding is less likely to escape from the second bonding portion 331, enabling efficient welding.

[0079] Furthermore, the exterior body (encapsulating resin 30) includes a casting surface 31, and the first bonding terminal portion 230 and the second bonding terminal portion 330 are exposed from the casting surface 31.

[0080] When the exterior body is formed, resin that has splashed near the liquid surface of the encapsulating resin 30 in the liquid phase state that becomes the casting surface 31 may adhere to the first bonding portion 231 and the second bonding portion 331. According to this configuration, it becomes possible to easily detect the adhesion of resin to the first bonding portion 231 and the second bonding portion 331.

[0081] <Embodiment 2> The film capacitor 2 according to Embodiment 2 will be described. The film capacitor 2 is a so-called case - less type capacitor.

[0082] FIG. 12 is a perspective view of the film capacitor 2. In the present embodiment, the same components as those in the above - described Embodiment 1 are denoted by the same reference numerals.

[0083] In the film capacitor 2, unlike the film capacitor 1 of the above-described Embodiment 1, it does not have a case, and the capacitor element module 10 is covered only by the exterior body 40.

[0084] The exterior body 40 is formed of a thermosetting resin such as an epoxy resin and has a substantially rectangular parallelepiped shape. The exterior body 40 includes a casting surface 41, and from the casting surface 41, the first joining terminal portion 230 of the first bus bar 200 and the second joining terminal portion 330 of the second bus bar 300 are exposed. The first joining terminal portion 230 has two first joining portions 231 indicated by a first groove portion 232 which is an indication portion, and the second joining terminal portion 330 has two second joining portions 331 indicated by a second groove portion 332 which is an indication portion.

[0085] To form the exterior body 40, a rectangular box-shaped casting mold having an opening is used.

[0086] First, an accommodation step is performed, and the capacitor element module 10 is accommodated into the casting mold through the opening. The capacitor element module 10 is positioned at a predetermined position within the casting mold by a positioning jig.

[0087] Next, a resin injection step is performed, and the resin in a liquid phase state is injected into the casting mold through the opening. The first joining terminal portion 230 of the first bus bar 200 and the second joining terminal portion 330 of the second bus bar 300 are exposed from the liquid surface of the resin in a liquid phase state that will become the casting surface 41 after curing.

[0088] Next, a resin curing step is performed, the inside of the casting mold is heated, and the resin is heated. As a result, the resin cures within the casting mold, and the exterior body 40 is formed. Then, the casting mold is removed. Thus, the film capacitor 2 as shown in FIG. 12 is completed.

[0089] The film capacitor 2 is mounted on an external device. Similar to the first embodiment, the external terminal T1 is joined to the first joining terminal portion 230 by welding at two first joining portions 231, and the external terminal T2 is joined to the second joining terminal portion 330 by welding at two second joining portions 331.

[0090] <Effects of Embodiment 2> According to the second embodiment, the same effects as those of the first embodiment can be achieved.

[0091] <Embodiment 3> The film capacitor 3 according to Embodiment 3 will be described. The film capacitor 3 is a so-called case-molded type capacitor.

[0092] FIG. 13 is a perspective view of the film capacitor 3. FIG. 14 is a perspective view of the first protective member 51, the second protective member 52, and the capacitor element module 10A. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals.

[0093] The film capacitor 3 includes a capacitor element module 10A, a case 20, a filling resin 30, two first protective members 51, and two second protective members 52. The capacitor element module 10A includes four capacitor elements 100, a first bus bar 200A, a second bus bar 300A, and an insulating member 400.

[0094] Similar to the first bus bar 200 in the first embodiment, the first bus bar 200A includes a first electrode terminal portion 210, a first relay portion 220, and a first joining terminal portion 230. On the surface of the first joining terminal portion 230, as shown by the virtual line L1 of the dashed-dotted line in FIG. 14, two first joining portions 231 having a substantially rectangular shape that is long in the Y-axis direction are set. However, unlike the first bus bar 200 in the first embodiment, the first bus bar 200A does not have an explicit portion on the surface of the first joining terminal portion 230 that demarcates the boundary between the regions of the two first joining portions 231 and the other regions.

[0095] The second bus bar 300A includes a second electrode terminal portion 310, a second relay portion 320, and a second bonding terminal portion 330, similar to the second bus bar 300 of the first embodiment. On the surface of the second bonding terminal portion 330, two second bonding portions 331 having a substantially rectangular shape that is long in the Y-axis direction are set as indicated by the virtual line L2 of the dashed line in FIG. 14. However, unlike the second bus bar 300 of the first embodiment, the second bus bar 300A does not have an explicit portion on the surface of the second bonding terminal portion 330 that demarcates the boundary between the regions of the two second bonding portions 331 and the other regions.

[0096] The capacitor element module 10A is buried in the potting resin 30 within the case 20. The first bonding terminal portion 230 and the second bonding terminal portion 330 are exposed from the casting surface 31 of the potting resin 30.

[0097] On the surface of the first bonding terminal portion 230, two first protective members 51 are attached so as to cover the entire two first bonding portions 231. Similarly, on the surface of the second bonding terminal portion 330, two second protective members 52 are attached so as to cover the entire two second bonding portions 331.

[0098] The first protective member 51 and the second protective member 52 are formed in a film shape from a resin such as polyethylene terephthalate (PET), have a substantially rectangular shape that is long in the Y-axis direction, and have substantially the same size as the first bonding portion 231 and the second bonding portion 331. The first protective member 51 and the second protective member 52 are attached to the surfaces of the first bonding terminal portion 230 and the second bonding terminal portion 330, respectively, by an adhesive applied to their back surfaces and can be removed from these surfaces.

[0099] The first protective member 51 and the second protective member 520 are attached to the positions of the regions set for the first bonding portion 231 in the first bonding terminal portion 230 and the positions of the regions set for the second bonding portion 331 in the second bonding terminal portion 330, respectively, using a dedicated attaching device, for example, after the capacitor element module 10A is completed and before it is housed in the case 20.

[0100] Figs. 15(a) and (b) are diagrams for explaining the manufacturing method of the film capacitor 3.

[0101] When the film capacitor 3 is assembled, first, an accommodation process is performed. As shown in Fig. 15(a), the capacitor element module 10A is accommodated into the case 20 through the opening 21. At this time, the two first joint portions 231 of the first joint terminal portion 230 are covered by the first protection member 51, and the two second joint portions 331 of the second joint terminal portion 330 are covered by the second protection member 52. The capacitor element module 10A is positioned at a predetermined position within the case 20 by a positioning jig.

[0102] Next, a resin injection process is performed. As shown in Fig. 15(b), the liquid-phase filling resin 30 is injected into the case 20 through the opening 21 and filled up to a position close to the opening 21. The first joint terminal portion 230 and the second joint terminal portion 330 are exposed from the liquid surface of the liquid-phase filling resin 30 that becomes the casting surface 31 after curing.

[0103] When the case 20 is filled with the filling resin 30, a resin curing process is performed, the inside of the case 20 is heated, and the filling resin 30 is heated. As a result, the filling resin 30 cures inside the case 20. The filling resin 30 becomes an exterior body that covers the capacitor element module 10A.

[0104] In this way, the film capacitor 3 as shown in Fig. 13 is completed.

[0105] In the resin injection process, when the liquid-phase filling resin 30 is injected into the case 20, air may be entrained, generating a large number of bubbles in the liquid-phase filling resin 30 within the case 20. These bubbles may burst near the liquid surface, causing the resin to splash from the liquid surface, and the splashed resin may adhere to the first joint terminal portion 230 or the second joint terminal portion 330 present near the liquid surface. However, in the present embodiment, the two first joint portions 231 of the first joint terminal portion 230 are covered by the two first protective members 51, and the two second joint portions 331 of the second joint terminal portion 330 are covered by the two second protective members 52. Therefore, it is possible to prevent the resin adhering to the first joint terminal portion 230 or the second joint terminal portion 330 from adhering to each of the first joint portions 231 and each of the second joint portions 331. Further, even after the film capacitor 3 is completed, it is possible to prevent foreign matter such as dust from adhering to each of the first joint portions 231 and each of the second joint portions 331.

[0106] The film capacitor 3 is mounted on an external device. In the film capacitor 3, after installation on the external device, the two first protective members 51 are removed from the surface of the first joint terminal portion 230, and the two second protective members 52 are removed from the surface of the second joint terminal portion 330. Similar to the above-described Embodiment 1, the external terminal T1 is joined to the first joint terminal portion 230 by welding at the two first joint portions 231, and the external terminal T2 is joined to the second joint terminal portion 330 by welding at the two second joint portions 331. At this time, since almost no foreign matter adheres to each of the first joint portions 231 and each of the second joint portions 331, welding can be performed satisfactorily.

[0107] Note that in the film capacitor 3 of the present embodiment, after completion, an inspection for whether foreign matter adheres to the first joint portion 231 and the second joint portion 331 becomes unnecessary.

[0108] <Effects of Embodiment 3> As described above, according to Embodiment 3, the following effects are achieved.

[0109] The film capacitor 3 includes a capacitor element 100 having a first electrode 110 and a second electrode 120, first bus bars 200A and second bus bars 300A connected to the first electrode 110 and the second electrode 120, and an exterior body (encapsulating resin 30) formed of a resin material that covers the capacitor element 100 and a part of the first bus bars 200A and the second bus bars 300A. The first bus bars 200A and the second bus bars 300A include flat first joint terminal portions 230 and second joint terminal portions 330 that are exposed from the exterior body and to which external terminals T1 and T2 are joined. A part of the region inside the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330 is set as first joint portions 231 and second joint portions 331 where welding is performed when the external terminals T1 and T2 are joined. On the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330, the regions of the first joint portions 231 and the second joint portions 331 are covered by removable first protection members 51 and second protection members 52.

[0110] According to this configuration, it is possible to prevent foreign matter that hinders welding from adhering to the first joint portions 231 and the second joint portions 331.

[0111] Furthermore, the exterior body (encapsulating resin 30) includes a casting surface 31, and the first joint terminal portions 230 and the second joint terminal portions 330 are exposed from the casting surface 31.

[0112] According to this configuration, when the exterior body is formed, it is possible to prevent resin that has splashed near the liquid surface of the liquid-phase encapsulating resin 30 that becomes the casting surface 31 from adhering to the first joint portions 231 and the second joint portions 331.

[0113] Furthermore, the method for manufacturing the film capacitor 3 includes: a housing step of housing a capacitor element module 10A including a capacitor element 100 having a first electrode 110 and a second electrode 120, and first bus bars 200A and second bus bars 300A connected to the first electrode 110 and the second electrode 120, through an opening 21 into a case 20 having the opening 21; a resin injection step of injecting a resin in a liquid phase state through the opening 21 into the case 20 in which the capacitor element module 10A is housed; and a resin curing step of curing the resin in the liquid phase state in the case 20 to form an exterior body (filled resin 30) that coats the capacitor element module 10A. The first bus bars 200A and the second bus bars 300A include flat first joining terminal portions 230 and second joining terminal portions 330 to which external terminals T1 and T2 are joined. A partial region inside the surfaces of the first joining terminal portion 230 and the second joining terminal portion 330 is set as first joining portions 231 and second joining portions 331 where welding is performed when the external terminals T1 and T2 are joined. In the resin injection step, the capacitor element 100, the first bus bars 200A, and the second bus bars 300A are buried in the resin in the liquid phase state such that the first joining terminal portion 230 and the second joining terminal portion 330 are exposed from the liquid surface of the resin in the liquid phase state that becomes the casting surface 31 of the exterior body. The resin injection step and the resin curing step are performed in a state where the regions of the first joining portions 231 and the second joining portions 331 are covered by a first protective member 51 and a second protective member 52 that can be removed.

[0114] According to this manufacturing method, when the exterior body is formed, it is possible to prevent the resin scattered near the liquid surface of the filled resin 30 in the liquid phase state that becomes the casting surface 31 from adhering to the first joining portion 231 and the second joining portion 331.

[0115] <Embodiment 4> The film capacitor 4 according to Embodiment 4 will be described. The film capacitor 4 is a so-called case-less type capacitor.

[0116] FIG. 16 is a perspective view of the film capacitor 4. In the present embodiment, the same components as those in the above Embodiment 3 are denoted by the same reference numerals.

[0117] In the film capacitor 4, unlike the film capacitor 3 of the above-described Embodiment 3, it does not have a case, and the capacitor element module 10A is covered only by the exterior body 40.

[0118] The exterior body 40 is formed of a thermosetting resin such as an epoxy resin and has a substantially rectangular parallelepiped shape. The exterior body 40 includes a casting surface 41, and from the casting surface 41, the first joining terminal portion 230 of the first bus bar 200 and the second joining terminal portion 330 of the second bus bar 300 are exposed.

[0119] FIGS. 17(a) and (b) are diagrams for explaining the manufacturing method of the film capacitor 4.

[0120] To form the exterior body 40, a rectangular box-shaped casting mold 5 having an opening 5a is used.

[0121] First, an accommodation step is performed. As shown in FIG. 17(a), the capacitor element module 10A is accommodated into the casting mold 5 through the opening 5a. At this time, the two first joining portions 231 of the first joining terminal portion 230 are in a state covered by the first protection member 51, and the two second joining portions 331 of the second joining terminal portion 330 are in a state covered by the second protection member 52. The capacitor element module 10A is positioned at a predetermined position within the casting mold 5 by a positioning jig.

[0122] Next, a resin injection step is performed. As shown in FIG. 17(b), the resin in a liquid phase state is injected into the casting mold 5 through the opening 5a. The first joining terminal portion 230 and the second joining terminal portion 330 are exposed from the liquid surface of the resin in a liquid phase state that will become the casting surface 41 after hardening.

[0123] Next, a resin hardening step is performed, and the inside of the casting mold 5 is heated to heat the resin. As a result, the resin hardens within the casting mold 5, and the exterior body 40 is formed. Thereafter, the casting mold 5 is removed.

[0124] In this way, the film capacitor 4 as shown in FIG. 16 is completed.

[0125] The film capacitor 4 is mounted on an external device. Similar to the third embodiment, in the film capacitor 4, after installation on the external device, the two first protective members 51 are removed from the surface of the first connection terminal portion 230, and the two second protective members 52 are removed from the surface of the second connection terminal portion 330. Then, the external terminal T1 is joined to the first connection terminal portion 230 by welding at the two first joints 231, and the external terminal T2 is joined to the second connection terminal portion 330 by welding at the two second joints 331. At this time, since almost no foreign matter adheres to each of the first joints 231 and the second joints 331, welding can be performed well.

[0126] <Effects of Embodiment 4> According to the fourth embodiment, the same effects as those of the third embodiment can be achieved.

[0127] <Modification Example> As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and various modifications are possible for the application examples of the present invention in addition to the above-described embodiments.

[0128] For example, in the first to fourth embodiments, the first connection terminal portion 230 and the second connection terminal portion 330 each have two first joints 231 and two second joints 331. However, the number of the first joints 231 and the second joints 331 may be any number. Furthermore, the shapes of the first joints 231 and the second joints 331 do not have to be rectangular, and may be any shape.

[0129] Furthermore, in the first to fourth embodiments, when the external terminals T1 and T2 are joined to the first connection terminal portion 230 and the second connection terminal portion 330, welding is performed at the first joints 231 and the second joints 331. However, welding such as ultrasonic welding or brazing such as soldering may be performed.

[0130] Furthermore, in the above-described Embodiments 1 and 2, an annular first groove portion 232 and a second groove portion 332 that indicate the boundaries of the first joint portion 231 and the second joint portion 331 are provided in the first joint terminal portion 230 and the second joint terminal portion 330, respectively, as indicating portions. However, as the indicating portion, an annular line indicating the boundary may be printed with ink or the like. Also in this configuration, the indicating portion does not protrude from the first joint terminal portion 230 and the second joint terminal portion 330 so as to interfere with the joining of the external terminals T1 and T2.

[0131] Furthermore, in the above-described Embodiments 3 and 4, the first protective member 51 and the second protective member 52 have substantially the same sizes as the first joint portion 231 and the second joint portion 331, respectively. However, the first protective member 51 and the second protective member 52 may each have a size larger than that of the first joint portion 231 and the second joint portion 331. In this case, an adhesive may be applied to a region outside the first joint portion 231 and the second joint portion 331 on the back surfaces of the first protective member 51 and the second protective member 52. By doing so, there is no need to worry about the adhesive remaining on the sides of the first joint portion 231 and the second joint portion 331 after the first protective member 51 and the second protective member 52 are removed.

[0132] Furthermore, in the above-described Embodiments 3 and 4, an indicating portion that indicates the boundary between the region of the first joint portion 231 and the other region is not provided on the surface of the first joint terminal portion 230, and an indicating portion that indicates the boundary between the region of the second joint portion 331 and the other region is not provided on the surface of the second joint terminal portion 330. However, on the surfaces of the first joint terminal portion 230 and the second joint terminal portion 330, the first groove portion 232 and the second groove portion 332 may be provided as indicating portions, similar to those in the above-described Embodiments 1 and 2. By doing so, it becomes possible to visually confirm whether the first protective member 51 and the second protective member 52 are mounted in a state of being displaced from the first joint portion 231 and the second joint portion 331.

[0133] Furthermore, the configurations of the first bus bars 200, 200A and the second bus bars 300, 300A are not limited to the configurations shown in the above-described Embodiments 1 to 4, and may be any configuration.

[0134] Furthermore, in the above-described Embodiments 1 to 4, the film capacitors 1 to 4 are provided with four capacitor elements 100. However, the number of capacitor elements 100 can be appropriately changed, including the case where the number is one.

[0135] Furthermore, in the above-described Embodiments 1 to 4, the capacitor element 100 is formed by stacking two metallized films obtained by vapor-depositing aluminum on a dielectric film and winding or laminating the stacked metallized films. However, alternatively, the capacitor element 100 may be formed by stacking a metallized film obtained by vapor-depositing aluminum on both surfaces of a dielectric film and an insulating film and winding or laminating them.

[0136] Furthermore, in the above-described Embodiments 1 to 4, as an example of the capacitor of the present invention, the film capacitors 1 to 4 are mentioned. However, the present invention can also be applied to capacitors other than the film capacitors 1 to 4.

[0137] In addition, the embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the claims.

Industrial Applicability

[0138] The present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, vehicle electrical equipment, etc.

Explanation of Reference Numerals

[0139] 1 to 4 Film capacitors (capacitors) 5 Molding mold 5a Opening 10, 10A Capacitor element module 20 Case 21 Opening 30 Filling resin (outer package) 31 Molding surface 40 Outer package 41 Molding surface 51 First protective member (protective member) 52 Second protective member (protective member) 100 Capacitor element 110 First electrode (electrode) 120 Second electrode (electrode) 200, 200A First bus bar (bus bar) 230 First joint terminal portion (joint terminal portion) 231 First joint portion (joint portion) 232 First groove portion (groove portion, indication portion) 300, 300A Second bus bar (bus bar) 330 Second joint terminal portion (joint terminal portion) 331 Second joint portion (joint portion) 332 Second groove portion (groove portion, indication portion) T1, T2 External terminals

Claims

1. A capacitor element having electrodes, a bus bar connected to the electrodes, and an exterior body formed of a resin material and covering the capacitor element and a part of the bus bar. The bus bar includes a flat joining terminal portion that is exposed from the exterior body and to which an external terminal is joined. A part of a region on the surface of the joining terminal portion is set as a joining portion where welding, brazing, or soldering is performed when the external terminal is joined. An indicating portion for indicating the region of the joining portion is provided on the surface of the joining terminal portion. A capacitor characterized by the above.

2. In the capacitor according to Claim 1, the indicating portion is an annular groove portion formed on the surface of the joining terminal portion and indicating the boundary between the region of the joining portion and the other regions. The thickness of the joining terminal portion at the portion of the groove is smaller than the thickness at the portion of the joining portion. A capacitor characterized by the above.

3. A capacitor element having electrodes, a bus bar connected to the electrodes, and an exterior body formed of a resin material and covering the capacitor element and a part of the bus bar. The bus bar includes a flat joining terminal portion that is exposed from the exterior body and to which an external terminal is joined. A part of a region on the surface of the joining terminal portion is set as a joining portion where welding, brazing, or soldering is performed when the external terminal is joined. On the surface of the joining terminal portion, the region of the joining portion is covered by a removable protective member. A capacitor characterized by the above.

4. In the capacitor according to any one of Claims 1 to 3, the exterior body includes a casting surface, and the joining terminal portion is exposed from the casting surface. A capacitor characterized by the above.

5. A housing step of housing a capacitor element module including a capacitor element having electrodes and a bus bar connected to the electrodes in a case having an opening through the opening; a resin injection step of injecting a resin in a liquid phase state through the opening into the case in which the capacitor element module is housed; and a resin curing step of curing the resin in the liquid phase state in the case to form an exterior body covering the capacitor element module. The bus bar includes a flat joining terminal portion to which an external terminal is joined. A part of the surface of the bonding terminal portion is set as a bonding portion where welding, brazing or soldering is performed when the external terminal is bonded. In the resin injection step, the capacitor element and the bus bar are buried in the resin in the liquid phase state so that the bonding terminal portion is exposed from the liquid surface of the resin in the liquid phase state that becomes the casting surface of the exterior body. The resin injection step and the resin curing step are performed in a state where the region of the bonding portion is covered with a removable protective member. A method for manufacturing a capacitor, characterized by the above.

6. A housing step of housing a capacitor element module including a capacitor element having an electrode and a bus bar connected to the electrode in a casting mold having an opening through the opening; A resin injection step of injecting a resin in a liquid phase state through the opening into the casting mold in which the capacitor element module is housed; A resin curing step of curing the resin in the liquid phase state in the casting mold to form an exterior body covering the capacitor element module, including: The bus bar includes a flat bonding terminal portion to which an external terminal is bonded. A part of the surface of the bonding terminal portion is set as a bonding portion where welding, brazing or soldering is performed when the external terminal is bonded. In the resin injection step, the capacitor element and the bus bar are buried in the resin in the liquid phase state so that the bonding terminal portion is exposed from the liquid surface of the resin in the liquid phase state that becomes the casting surface of the exterior body. The resin injection step and the resin curing step are performed in a state where the region of the bonding portion is covered with a removable protective member. A method for manufacturing a capacitor, characterized by the above.

Images