Electronic circuit device and manufacturing method of the electronic circuit device

Abstract

To provide an electronic circuit device capable of suppressing an increase in weight and an increase in an external shape, and capable of suppressing deflection of a second substrate during use.SOLUTION: An electronic circuit device 1 includes: a case 10 having one open direction; a first substrate 20 disposed inside the case 10; a first substrate structure 22 mounted on the first substrate 20; a second substrate 30 disposed closer to an opening side of the case 10 than the first substrate 20; a second substrate structure 32 mounted on the second substrate 30; a first sealing body 40; and a second sealing body 42. The electronic circuit device 1 further includes: a sealing body surface adjustment member 50 that forms a concave part 52 that is not filled with the first sealing body 40; and a fixing member 60 that fixes the second substrate 30 on the opening side of the case 10 with respect to the first substrate 20. At least one of the second substrate structures 32 has a tip end that faces a bottom surface of the concave portion 52.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic circuit device and a method for manufacturing an electronic circuit device.

Background Art

[0002] Conventionally, an electronic circuit device in which a substrate stored in a case and a substrate structure (typically an electronic component) mounted on the substrate are sealed with a sealing body (for example, a resin such as an epoxy resin) is widely known. The electronic circuit device is used, for example, as a component of an in-vehicle electrical device such as a regulator.

[0003] In the above-described electronic circuit device, two or more substrates may be used. When manufacturing such an electronic circuit device, it is conceivable to adopt a manufacturing method in which sealing with a sealing body is performed for each substrate. That is, when manufacturing an electronic circuit device including a first substrate and a second substrate as substrates, the arrangement of the first substrate, the sealing of the first substrate with a first sealing body, the arrangement of the second substrate, and the sealing of the second substrate with a second sealing body are performed in this order. In this manufacturing method, connection of other components (such as a harness or a cable) to connectors or terminals provided on the first substrate is performed after the first substrate is sealed and before the second substrate is arranged.

[0004] According to the electronic circuit device manufactured by the above manufacturing method, it is possible to suppress the influence (such as short circuit between terminals) on the first substrate and the substrate structure due to phenomena occurring during connection of other components. Examples of phenomena occurring during connection of other components include scattering of solder balls if the connection is by soldering, and scattering of sparks if the connection is by welding.

[0005] By the way, the sizes and shapes of substrate structures mounted on a substrate are various, and some of them tend to have a high height. As such a substrate structure, a chip electrolytic capacitor can be exemplified.

[0006] As an electronic circuit device in which a structure on the second substrate protruding from the second substrate faces the opening side of the case, the conventional electronic circuit device 901 can be exemplified. As shown in FIG. 9, the electronic circuit device 901 includes a case 910, a first substrate 920, a structure on the first substrate 922, a second substrate 930, a structure on the second substrate 932, a first sealing body 940, and a second sealing body 942. Note that reference numeral 100 denotes other components connected to the electronic circuit device 901.

[0007] When the structure 932 on the second substrate protruding from the second substrate 930 faces the opening side of the case 910 as in the electronic circuit device 901, the amount of the second sealing body 942 required to seal the second substrate 930 and the structure 932 on the second substrate increases, and a large case 910 is also required. Therefore, it is difficult to solve the problems of weight increase and large external shape.

[0008] Further, as an electronic circuit device in which the structure on the second substrate faces the first substrate side, the conventional electronic circuit device 902 can be exemplified. As shown in FIG. 10, the electronic circuit device 902 has basically the same configuration as the electronic circuit device 901, but the structure 932 on the second substrate faces the first substrate 920 side.

[0009] When the structure 932 on the second substrate faces the first substrate 920 side, the first sealing body 940 and the structure 932 on the second substrate interfere with each other. Therefore, even when the structure 932 on the second substrate faces the first substrate 920 side, it is still difficult to solve the problems of weight increase and large external shape.

[0010] For this reason, it is conceivable to apply a method using a mold member or a cover member (see, for example, Patent Documents 1 and 2) or a method using a net covering electronic components (see, for example, Patent Document 3) to form a concave portion on the surface of the first sealing body.

[0011] As shown in FIG. 11, the conventional electronic circuit device 903 has basically the same configuration as the electronic circuit device 902, but a recess 941 is formed on the surface of the first encapsulation body 940. By opposing the tip of the second substrate structure 932 to the recess 941, it becomes possible to avoid interference between the first encapsulation body 940 and the second substrate structure 932.

Prior Art Documents

Patent Documents

[0012]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0013] However, in the conventional electronic circuit device 903, the second substrate 930 is liable to be affected by the linear expansion (thermal expansion) of the second encapsulation body 942, and the second substrate 930 may bend during use.

[0014] Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide an electronic circuit device capable of suppressing an increase in weight and a large - scale increase in the outer shape, and capable of suppressing bending of the second substrate during use. Another object of the present invention is to provide a method for manufacturing such an electronic circuit device.

Means for Solving the Problems

[0015] The electronic circuit device of the present invention has a case having a bottom plate and side plates and open in one direction, and A first substrate disposed inside the case, a first substrate structure mounted on the first substrate, a second substrate disposed closer to the opening side of the case than the first substrate, a second substrate structure mounted on the second substrate, a first sealing body filled inside the case to seal at least a part of the first substrate and the first substrate structure, and a second sealing body filled inside the case to seal the second substrate and the second substrate structure. The electronic circuit device further includes a sealing body surface adjusting member disposed on the opening side of the case of the first substrate, forming a recess in which the first sealing body is not filled by recessing the surface of the first sealing body toward the first substrate side, and a fixing member disposed on the opening side of the case of the first substrate for fixing the second substrate closer to the opening side of the case than the first substrate. The second sealing body is filled inside the recess, and at least one of the second substrate structures is mounted on the first substrate side of the second substrate and has a tip facing the bottom surface of the recess.

[0016] A method for manufacturing an electronic circuit device according to the present invention includes: a first substrate arranging step of arranging a first substrate on which a first substrate upper structure is mounted inside a case having a bottom plate and side plates and having an opening in one direction; a first sealing step of filling the inside of the case with a first sealing body to seal at least a part of the first substrate and the first substrate upper structure; a second substrate arranging step of arranging a second substrate on which a second substrate upper structure is mounted on the opening side of the case with respect to the first substrate; and a second sealing step of filling the inside of the case with a second sealing body to seal the second substrate and the second substrate upper structure. Before the start of the second substrate arranging step, a sealing body surface adjusting member for forming a recess in which the surface of the first sealing body is recessed toward the first substrate side and the first sealing body is not filled, and a fixing member for fixing the second substrate are arranged on the opening side of the case of the first substrate. In the second substrate arranging step, the second substrate is arranged such that at least one of the second substrate upper structures exists on the first substrate side and the tip thereof faces the bottom surface of the recess. A fixing step of fixing the second substrate to the fixing member on the opening side of the case with respect to the first substrate is further included between the second substrate arranging step and the second sealing step.

Advantages of the Invention

[0017] The electronic circuit device according to the present invention includes a sealing body surface adjusting member that is arranged on the opening side of the case of the first substrate and forms a recess in which the surface of the first sealing body is recessed toward the first substrate side and the first sealing body is not filled, and the tip of at least one of the second substrate upper structures faces the bottom surface of the recess. Therefore, by arranging the second substrate upper structure while avoiding interference with the first sealing body, it is possible to reduce the amount of the second sealing body required to seal the second substrate and the second substrate upper structure, and it is also possible to suppress an increase in the size of the case. As a result, according to the electronic circuit device of the present invention, it is possible to suppress an increase in weight and an increase in the outer shape size.

[0018] Further, the electronic circuit device of the present invention includes a fixing member that is disposed on the opening side of the case of the first substrate and fixes the second substrate on the opening side of the case rather than the first substrate. Therefore, according to the electronic circuit device of the present invention, the deformation of the second substrate due to the influence of the linear expansion of the second sealing body can be suppressed by the fixing member, and the bending of the second substrate during use can be suppressed.

[0019] Therefore, the electronic circuit device of the present invention can suppress an increase in weight and an increase in the outer shape size, and becomes an electronic circuit device capable of suppressing the bending of the second substrate during use.

[0020] In the manufacturing method of the electronic circuit device of the present invention, the above-described sealing body surface adjusting member and fixing member are used. Therefore, according to the manufacturing method of the electronic circuit device of the present invention, it is possible to suppress an increase in weight and an increase in the outer shape size, and it is possible to manufacture the electronic circuit device of the present invention capable of suppressing the bending of the second substrate during use.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

[0022] Hereinafter, the electronic circuit device and the method for manufacturing the electronic circuit device of the present invention will be described based on the embodiments shown in the drawings. In each of the embodiments described below, for components having exactly the same function or substantially the same function, even if their shapes or the like are somewhat different, the same reference numerals are used in each embodiment, and the description already made may be omitted. Each of the embodiments described below does not limit the invention according to the claims. Also, not all of the elements and their combinations described in each embodiment are essential for the solution means of the present invention.

[0023] [Embodiment 1] 1. Electronic Circuit Device 1 As shown in FIG. 1, the electronic circuit device 1 according to Embodiment 1 includes a case 10, a first substrate 20, a structure on the first substrate 22, a second substrate 30, a structure on the second substrate 32, a first encapsulant 40, a second encapsulant 42, a surface adjusting member 50 for the encapsulant, and a fixing member 60. The electronic circuit device 1 further includes other component connection terminals 24 and substrate connection terminals 26. The electronic circuit device 1 may include components other than those described above.

[0024] The case 10 has a bottom plate 12 and side plates 14 and is open in one direction. The material constituting the case 10 can be appropriately selected from the viewpoints of strength, heat dissipation, heat resistance, weight, etc. For example, aluminum or an aluminum alloy can be preferably used.

[0025] The first substrate 20 is disposed inside the case 10. As the first substrate 20, various substrates such as a metal substrate, a ceramic substrate, and a resin substrate can be used.

[0026] The structure 22 on the first substrate is mounted on the first substrate 20. The structure 22 on the first substrate is connected to the first substrate 20 by the electrode 23. Note that the number of the structures on the first substrate may be plural or one. Also, although illustration and detailed description are omitted, other structures on the first substrate than the structure 22 on the first substrate may be mounted on the first substrate 20. The other-component connection terminal 24 and the substrate connection terminal 26 can also be included in the structure on the first substrate.

[0027] The "structure on the substrate" in this specification refers to components and members mounted on the substrate. The structures on the substrate are typically electronic components and structural components, and include, for example, capacitors, semiconductor chips, coils, heat sinks, lead wires, jumper terminals, bus bars, etc.

[0028] The other-component connection terminal 24 is provided on the first substrate 20 and is connected to the linear other component 100. The other-component connection terminal 24 is made of a metal plate, and a space for passing the end of the other component 100 is formed at the tip. The base end portion (the portion connected to the first substrate 20) of the other-component connection terminal 24 is sealed by the first sealing body 40. The tip portion (the portion connected to the other component 100) of the other-component connection terminal 24 is sealed by the second sealing body 42. Note that the other component 100 is a component for performing electrical communication between the electronic circuit device 1 and other devices.

[0029] The substrate connection terminal 26 is a terminal (conductive terminal) for electrically connecting the first substrate 20 and the second substrate 30. Although illustration is omitted, the substrate connection terminal 26 and the second substrate 30 may be fixed by a conductive bonding material (for example, solder).

[0030] The second substrate 30 is disposed closer to the opening side of the case 10 than the first substrate 20. As the second substrate 30, various substrates such as a metal substrate, a ceramic substrate, and a resin substrate can be used.

[0031] The structure 32 on the second substrate is mounted on the second substrate 30. Note that the number of structures on the second substrate may be plural or one. At least one of the structures 32 on the second substrate is mounted on the side of the first substrate 20 of the second substrate 30, and the tip thereof faces the bottom surface of the recess 52 (described later). At least one of the structures 32 on the second substrate has at least a part of the tip side disposed inside the recess 52. In the electronic circuit device 1, both of the two structures 32 on the second substrate satisfy the above description. Note that the tip of the structure 32 on the second substrate may or may not be in contact with the bottom surface of the recess 52. The structure 32 on the second substrate is a structure on the substrate having a large height protruding from the second substrate 30, such as a chip electrolytic capacitor, for example.

[0032] Note that although illustration and detailed description are omitted, structures other than the structure 32 on the second substrate may be mounted on the second substrate 30. It is assumed that the structures other than the structure 32 on the second substrate are structures on the second substrate having a height protruding from the second substrate 30 smaller than that of the structure 32 on the second substrate. Examples of such structures on the second substrate include various chip components.

[0033] The first encapsulant 40 is filled inside the case 10 and encapsulates at least a part of the first substrate 20 and the structure 22 on the first substrate. As the first encapsulant 40, various resins, gels, etc. can be used, which have fluidity at least during filling and are excellent in insulation and stability.

[0034] The second encapsulant 42 is filled inside the case 10 and encapsulates the second substrate 30 and the structure 32 on the second substrate. It can also be said that the second encapsulant 42 is filled on the opening side of the case 10 of the first encapsulant 40. As the second encapsulant 42, various resins, gels, etc. can be used, which have fluidity at least during filling and are excellent in insulation and stability. The first encapsulant 40 and the second encapsulant 42 may be made of the same material or different materials.

[0035] As shown in FIGS. 1 and 2, the sealing body surface adjusting member 50 is disposed on the opening side of the case 10 of the first substrate 20, and forms a recess 52 that concaves the surface of the first sealing body 40 toward the first substrate 20 side and in which the first sealing body 40 is not filled. In this specification, the "surface of the first sealing body" refers to the surface on the opening side of the case of the first sealing body. In the electronic circuit device as a product, the surface of the first sealing body described above is not exposed, but the surface of the first sealing body can also be said to be the surface that is exposed when there is no second sealing body. In the electronic circuit device 1, the recess 52 is formed in the sealing body surface adjusting member 50. The second sealing body 42 is filled inside the recess 52. Positioning holes 54 for passing the fixing member 60 are formed at both ends of the sealing body surface adjusting member 50.

[0036] The fixing member 60 is disposed on the opening side of the case 10 of the first substrate 20 and fixes the second substrate 30 on the opening side of the case 10 rather than the first substrate 20. The fixing member 60 is a pin-shaped member protruding from the first substrate 20. In the electronic circuit device 1, there are two fixing members 60. The fixing member 60 is passed through holes provided at corresponding positions of the second substrate 30, and in this state, the second substrate 30 is fixed to the fixing member 60 by a bonding material 62.

[0037] Also, the fixing member 60 positions the sealing body surface adjusting member 50. In the electronic circuit device 1, the fixing member 60 passes through the positioning hole 54 of the sealing body surface adjusting member 50, thereby positioning the sealing body surface adjusting member 50. The shape of the fixing member 60 and the shape of the positioning hole 54 can be appropriately determined from viewpoints such as the degree of positioning accuracy and the degree to which the sealing body surface adjusting member 50 should be firmly fixed.

[0038] Note that the fixing member 60 may or may not have a function as a terminal for electrically connecting the first substrate 20 and the second substrate 30. When the fixing member 60 is disposed at a portion where the bending of the second substrate 30 during use becomes large, from the viewpoint of the reliability of the entire apparatus, it is preferable that the fixing member 60 does not have a function as a terminal for electrically connecting the first substrate 20 and the second substrate 30.

[0039] 2. Method for manufacturing an electronic circuit device The method for manufacturing an electronic circuit device according to Embodiment 1 is a manufacturing method for manufacturing the electronic circuit device 1 according to Embodiment 1. As shown in FIG. 3, the method for manufacturing an electronic circuit device according to Embodiment 1 includes a first substrate arranging step S10, a first sealing step S20, an other component connecting step S30, a second substrate arranging step S40, a fixing step S50, and a second sealing step S60. Note that the method for manufacturing an electronic circuit device according to Embodiment 1 may include steps other than those described above. Hereinafter, each step will be described.

[0040] As shown in FIG. 4(a), the first substrate arranging step S10 is a step of arranging the first substrate 20 on which the first substrate upper structure 22 is mounted inside the case 10 having a bottom plate 12 and side plates 14 and having an opening in one direction.

[0041] In the first substrate arranging step S10, it is preferable to fix the first substrate 20 inside the case 10. As a method for fixing the first substrate 20 to the case 10, various resins or the like having fluidity during filling (for example, those made of the same material as the first sealing body 40) or an adhesive may be filled or disposed on the bottom surface of the case 10 prior to the first substrate 20, and then cured after the first substrate 20 is disposed. Also, it is conceivable to fix the first substrate 20 to the case 10 with screws or the like. The method for fixing the first substrate 20 to the case 10 is not limited to the above, and can be appropriately selected from the viewpoints of the material of the first substrate 20, the mounting condition of the first substrate upper structure 22, the necessity of insulation, and the like.

[0042] In the method for manufacturing an electronic circuit device according to Embodiment 1, before the start of the second substrate placement step S40, on the opening side of the case 10 of the first substrate 20, a sealing body surface adjusting member 50 for forming a recess 52 in which the surface of the first sealing body 40 is recessed toward the first substrate 20 and the first sealing body 40 is not filled, and a fixing member 60 for fixing the second substrate 3) are arranged. In Embodiment 1, the description and illustration will be made assuming that the sealing body surface adjusting member 50 and the fixing member 60 are arranged on the first substrate 20 by the completion of the first substrate placement step S10. That is, in Embodiment 1, the sealing body surface adjusting member 50 and the fixing member 60 are arranged on the first substrate 20 at a timing before or during the first substrate placement step S10. Note that the timing of arranging the sealing body surface adjusting member 50 and the fixing member 60 on the first substrate 20 is not limited to the above. The timing of this arrangement may be any time before the start of the second substrate placement step S40, for example, the timing after the first substrate placement step S10 or during the first sealing step S20. From the viewpoint of simplifying the manufacturing process and the like, it is preferable to arrange the fixing member 60 on the first substrate 20 relatively early (for example, before the first substrate placement step S10).

[0043] When arranging the sealing body surface adjusting member 50, the position of the sealing body surface adjusting member 50 is determined by the fixing member 60. Therefore, in the method for manufacturing an electronic circuit device according to Embodiment 1, the fixing member 60 is arranged on the first substrate 20 before the sealing body surface adjusting member 50. The positioning of the sealing body surface adjusting member 50 can be performed by passing the fixing member 60 through the positioning hole 54 of the sealing body surface adjusting member 50.

[0044] As shown in FIG. 4(b), the first sealing step S20 is a step of filling the inside of the case 10 with the first sealing member 40 to seal at least a part of the first substrate 20 and the structure 22 on the first substrate. The first sealing member 40 is preferably filled up to a height at which the main current-carrying portions (such as the electrodes 23) of the first substrate 20 and the structure 22 on the first substrate are buried. Also, in the first sealing step S20, the first sealing member 40 is filled up to a height at which the edge of the recess 52 is not buried. In the first sealing step S20, a process (such as heating) for curing the first sealing member 40 may be performed after the filling of the first sealing member 40.

[0045] As shown in FIG. 4(c), the other component connection step S30 is a step of connecting the other component connection terminal 24 and the other component 100. The connection may be by a conductive connection material (for example, solder), by welding, or by any other appropriate method. Although not shown in the drawings, when connecting the other component connection terminal 24 and the other component 100, the tip of the other component connection terminal 24 may be deformed to fix the other component 100.

[0046] As shown in FIG. 4(d), the second substrate arrangement step S40 is a step of arranging the second substrate 30 on which the second substrate structure 32 is mounted on the opening side of the case 10 with respect to the first substrate 20. In the second substrate arrangement step S40, the second substrate 30 is arranged such that at least one (both of the two second substrate structures 32 in Embodiment 1) of the second substrate structures 32 exists on the side of the first substrate 20 and the tip thereof faces the bottom surface of the recess 52. In the second substrate arrangement step S40, the second substrate 30 is arranged such that at least a part of the tip side of at least one (both of the two second substrate structures 32 in Embodiment 1) of the second substrate structures 32 is arranged inside the recess 52.

[0047] The fixing step S50 is a step included between the second substrate placement step S40 and the second encapsulation step S60. As shown in FIG. 4(e), the fixing step S50 is a step of fixing the second substrate 30 to the fixing member 60 on the opening side of the case 10 rather than the first substrate 20. In the fixing step S50, the fixing member 60 and the second substrate 30 are fixed by the bonding material 62. As the bonding material 62, those made of a metal such as solder or those made of various adhesives can be used. Note that by using solder as the bonding material 62, the second substrate 30 can be fixed to the fixing member 60 by performing a process (for example, flow) for establishing an electrical connection between the first substrate 20 and the second substrate 30.

[0048] As shown in FIG. 4(f), the second encapsulation step S60 is a step of filling the second encapsulant 42 into the case 10 to encapsulate the second substrate 30 and the structure 32 on the second substrate. In the second encapsulation step S60, the second encapsulant 42 is also filled inside the recess 52. Further, in the second encapsulation step S60, the portion of the structure 22 on the first substrate that has not been encapsulated by the first encapsulant 40 is also encapsulated by the second encapsulant 42. Note that in the second encapsulation step S60, a process (such as heating) for curing the second encapsulant 42 may be performed after the filling of the second encapsulant 42.

[0049] In the method for manufacturing the electronic circuit device according to the first embodiment, the electronic circuit device 1 according to the first embodiment can be manufactured by completing the second encapsulation step S60.

[0050] 3. Effects of the electronic circuit device 1 and the method for manufacturing the electronic circuit device according to the first embodiment Hereinafter, the effects of the electronic circuit device 1 and the method for manufacturing the electronic circuit device according to the first embodiment will be described.

[0051] The electronic circuit device 1 according to Embodiment 1 is disposed on the opening side of the case 10 of the first substrate 20, and includes a sealing body surface adjusting member 50 that forms a recess 52 by denting the surface of the first sealing body 40 toward the first substrate 20 side and the recess 52 is not filled with the first sealing body 40. At least one tip of the structures 32 on the second substrate faces the bottom surface of the recess 52. Therefore, by arranging the structures 32 on the second substrate while avoiding interference with the first sealing body 40, it is possible to reduce the amount of the second sealing body 42 required to seal the second substrate 30 and the structures 32 on the second substrate, and it is also possible to suppress an increase in the size of the case 10. As a result, according to the electronic circuit device 1 according to Embodiment 1, it is possible to suppress an increase in weight and an increase in the outer shape size.

[0052] Further, the electronic circuit device 1 according to Embodiment 1 is disposed on the opening side of the case 10 of the first substrate 20, and includes a fixing member 60 that fixes the second substrate 30 on the opening side of the case 10 rather than the first substrate 20. Therefore, according to the electronic circuit device 1 according to Embodiment 1, the fixing member 60 can suppress the deformation of the second substrate 30 due to the influence of the linear expansion of the second sealing body 42, and can suppress the deflection of the second substrate 30 during use.

[0053] Therefore, the electronic circuit device 1 according to Embodiment 1 is an electronic circuit device that can suppress an increase in weight and an increase in the outer shape size, and can suppress the deflection of the second substrate 30 during use.

[0054] Further, when the electronic circuit device 1 according to Embodiment 1 is disposed at a portion where the deflection of the second substrate 30 becomes large during use and the fixing member 60 does not function as a terminal for electrically connecting the first substrate 20 and the second substrate 30, it has the following effects. That is, with such a configuration, when the second substrate 30 is deflected, the largest load is applied to the fixing member 60, and it is possible to suppress the breakage of the electrical connection at the conduction terminal near the fixing member 60.

[0055] In addition, since the electronic circuit device 1 according to Embodiment 1 includes the sealing body surface adjusting member 50, it is possible to form the recess 52 on the surface of the first sealing body 40 without using a special molding member or the like.

[0056] Moreover, according to the electronic circuit device 1 according to Embodiment 1, the fixing member 60 is a pin-shaped member protruding from the first substrate 20 and is fixed to the second substrate 30 by the bonding material 62. Therefore, it is possible to reliably fix the second substrate 30 by the fixing member 60.

[0057] Furthermore, according to the electronic circuit device 1 according to Embodiment 1, since the fixing member 60 also positions the sealing body surface adjusting member 50, there is no need to separately prepare a member or jig for positioning the sealing body surface adjusting member 50 when manufacturing the electronic circuit device 1, and it is possible to suppress an increase in the number of members and complication of the manufacturing process.

[0058] Moreover, according to the electronic circuit device 1 according to Embodiment 1, at least one of the structures 32 on the second substrate has at least a part of the tip side disposed inside the recess 52. Therefore, it is possible to arrange the first substrate 20 and the second substrate 30 closer to each other. For this reason, according to the electronic circuit device 1 according to Embodiment 1, it is possible to further reduce the amount of the second sealing body 42 required to seal the second substrate 30 and the structures 32 on the second substrate, and further suppress an increase in weight and enlargement of the outer shape.

[0059] In addition, according to the electronic circuit device 1 according to Embodiment 1, since the recess 52 is formed in the sealing body surface adjusting member 50, it is possible to form the recess 52 only by arranging the sealing body surface adjusting member 50 on the first substrate 20.

[0060] In the method for manufacturing an electronic circuit device according to Embodiment 1, the above-described sealing body surface adjusting member 50 and fixing member 60 are used. Therefore, according to the method for manufacturing an electronic circuit device according to Embodiment 1, it is possible to suppress an increase in weight and an increase in the outer shape size, and it is possible to manufacture the electronic circuit device 1 according to Embodiment 1 that can suppress the bending of the second substrate 30 during use.

[0061] Further, according to the method for manufacturing an electronic circuit device according to Embodiment 1, since the sealing body surface adjusting member 50 is used, it is possible to form the concave portion 52 on the surface of the first sealing body 40 without using a special mold member or the like.

[0062] Also, in the method for manufacturing an electronic circuit device according to Embodiment 1, the fixing member 60 is a pin-shaped member protruding from the first substrate 20, and in the fixing step S50, the fixing member 60 and the second substrate 30 are fixed by the bonding material 62. Therefore, according to the method for manufacturing an electronic circuit device according to Embodiment 1, it is possible to reliably fix the second substrate 30 by the fixing member 60.

[0063] Further, in the method for manufacturing an electronic circuit device according to Embodiment 1, when arranging the sealing body surface adjusting member 50, the position of the sealing body surface adjusting member 50 is determined by the fixing member 60. Therefore, according to the method for manufacturing an electronic circuit device according to Embodiment 1, it is not necessary to separately prepare a member or a jig for positioning the sealing body surface adjusting member 50, and it is possible to suppress an increase in the number of members and a complication of the manufacturing process.

[0064] Also, in the method for manufacturing an electronic circuit device according to Embodiment 1, in the second substrate arranging step S40, the second substrate 30 is arranged such that at least a part of the tip side of at least one of the structures 32 on the second substrate is disposed inside the concave portion 52. Therefore, according to the method for manufacturing an electronic circuit device according to Embodiment 1, it is possible to further reduce the amount of the second sealing body 42 required to seal the second substrate 30 and the structures 32 on the second substrate, and it is possible to further suppress an increase in weight and an increase in the outer shape size of the manufactured electronic circuit device 1.

[0065] [Embodiment 2] 1. Electronic circuit device 2 The electronic circuit device 2 according to Embodiment 2 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, but the configuration of the sealing body surface adjusting member is different from that of the electronic circuit device 1 according to Embodiment 1. That is, in the electronic circuit device 2 according to Embodiment 2, a through hole 56 penetrating from the opening side of the case 10 to the first substrate 20 side is formed in the sealing body surface adjusting member 50a (see FIGS. 5 and 6). It can also be said that the through hole 56 of the sealing body surface adjusting member 50a has no bottom surface of the recess 52 of the sealing body surface adjusting member 50 in Embodiment 1.

[0066] Also, in the electronic circuit device 2, one end of the through hole 56 is blocked by the first substrate 20. For this reason, the recess 52a in the electronic circuit device 2 is formed by the combination of the through hole 56 and the first substrate 20 that blocks one end of the through hole 56. Therefore, in the electronic circuit device 2, the "bottom surface of the recess 52a" facing the tip of the second substrate upper structure 32 is the first substrate 20.

[0067] 2. Manufacturing method of electronic circuit device The manufacturing method of the electronic circuit device according to Embodiment 2 is a manufacturing method for manufacturing the electronic circuit device 2 according to Embodiment 2. The manufacturing method of the electronic circuit device according to Embodiment 2 is basically the same method as the manufacturing method of the electronic circuit device according to Embodiment 1, but the configuration of the sealing body surface adjusting member is different from that of the manufacturing method of the electronic circuit device according to Embodiment 1. That is, in the manufacturing method of the electronic circuit device according to Embodiment 2, with the state of being disposed on the first substrate 20 as a reference, the sealing body surface adjusting member 50a in which the through hole 56 penetrating from the opening side of the case 10 to the first substrate 20 side is formed is used.

[0068] The manufacturing method of the electronic circuit device according to Embodiment 2 includes, as shown in FIG. 7, a first substrate placement step S10a, a first encapsulation step S20a, an other component connection step S30a, a second substrate placement step S40a, a fixing step S50a, and a second encapsulation step S60a. Note that the manufacturing method of the electronic circuit device according to Embodiment 2 may include steps other than those described above. Hereinafter, each step will be described.

[0069] The first substrate placement step S10a is basically the same as the first substrate placement step S10 in Embodiment 1, except that a sealing body surface adjustment member 50a is placed on the first substrate 20 (see FIG. 8(a)). When placing the sealing body surface adjustment member 50a, the sealing body surface adjustment member 50a is placed so as to block one end of the through hole 56 with the first substrate 20, so that the concave portion 52a is formed by the combination of the through hole 56 and the first substrate 20 that blocks one end of the through hole 56.

[0070] When placing the sealing body surface adjustment member 50a, in order to prevent the first sealing body 40 from entering the concave portion 52a in the first encapsulation step S20a, it is preferable that there is no gap between the first substrate 20 and the sealing body surface adjustment member 50a. The gap between the first substrate 20 and the sealing body surface adjustment member 50a can be filled with, for example, an adhesive or a filler.

[0071] Note that the placement of the sealing body surface adjustment member 50a in Embodiment 2 may be performed before the start of the first encapsulation step S20a, and does not necessarily have to be performed during the first substrate placement step S10a.

[0072] The steps from the first encapsulation step S20a to the second encapsulation step S60a are substantially the same as the steps from the first encapsulation step S20 to the second encapsulation step S60 in Embodiment 1, so detailed description thereof will be omitted (see FIGS. 8(b) to 8(f)).

[0073] 3. Effects of the electronic circuit device 2 and the manufacturing method of the electronic circuit device according to Embodiment 2 The electronic circuit device 2 according to Embodiment 2 is arranged on the opening side of the case 10 of the first substrate 20. Although the configuration of the sealing body surface adjusting member is different from that of the electronic circuit device 1 according to Embodiment 1, a sealing body surface adjusting member 50a is provided which forms a recess 52a that concaves the surface of the first sealing body 40 toward the first substrate 20 side and is not filled with the first sealing body 40. The tip of the structure 32 on the second substrate faces the bottom surface of the recess 52. Further, the electronic circuit device 2 according to Embodiment 2 is arranged on the opening side of the case 10 of the first substrate 20 and includes a fixing member 60 for fixing the second substrate 30 on the opening side of the case 10 rather than the first substrate 20. Therefore, similar to the case of the electronic circuit device 1 according to Embodiment 1, the electronic circuit device 2 according to Embodiment 2 can suppress an increase in weight and an increase in the outer shape size, and can suppress the bending of the second substrate 30 during use.

[0074] Also, in the electronic circuit device 2 according to Embodiment 2, a through hole 56 penetrating from the opening side of the case 10 to the first substrate 20 side is formed in the sealing body surface adjusting member 50a. One end of the through hole 56 is blocked by the first substrate 20, and the recess 52a is formed by the through hole 56 and the first substrate 20 blocking one end of the through hole 56. Therefore, according to the electronic circuit device 2 according to Embodiment 2, compared with the case where a recess is formed in the sealing body surface adjusting member, it is possible to deepen the recess 52a without increasing the height of the sealing body surface adjusting member 50a, or to lower the height of the sealing body surface adjusting member 50a without reducing the depth of the recess 52a. That is, according to the electronic circuit device 2 according to Embodiment 2, it is possible to mount a tall structure 32 on the second substrate without increasing the product thickness (increasing the design freedom), or to reduce the height of the case 10 and reduce the product thickness (further miniaturizing and lightening the product).

[0075] Since the electronic circuit device 2 according to Embodiment 2 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, it also has the corresponding effects among the effects that the electronic circuit device 1 according to Embodiment 1 has.

[0076] The manufacturing method of the electronic circuit device according to Embodiment 2 uses the above-described sealing body surface adjusting member 50a and fixing member 60, although the configuration of the sealing body surface adjusting member is different from that of the manufacturing method of the electronic circuit device according to Embodiment 1. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 2, it is possible to suppress an increase in weight and a large-sized outer shape, similar to the case of the manufacturing method of the electronic circuit device according to Embodiment 1, and it is possible to manufacture the electronic circuit device 2 according to Embodiment 2 that can suppress the bending of the second substrate 30 during use.

[0077] Further, in the manufacturing method of the electronic circuit device according to Embodiment 2, the sealing body surface adjusting member 50a is formed with a through hole 56 that penetrates from the opening side of the case 10 toward the first substrate 20 with respect to the state of being disposed on the first substrate 20. When disposing the sealing body surface adjusting member 50a, the sealing body surface adjusting member 50a is disposed so that one end of the through hole 56 is blocked by the first substrate 20, whereby the concave portion 52a is formed by the through hole 56 and the first substrate 20 that blocks one end of the through hole 56. The arrangement of the sealing body surface adjusting member 50a is performed before the start of the first sealing step S20a. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 2, compared with the case of using the sealing body surface adjusting member in which the concave portion is formed, it is possible to deepen the concave portion 52a without increasing the height of the sealing body surface adjusting member 50a, or to lower the height of the sealing body surface adjusting member 50a without reducing the depth of the concave portion 52a. That is, according to the manufacturing method of the electronic circuit device according to Embodiment 2, it is possible to mount the high second substrate superstructure 32 without increasing the product thickness (increasing the design freedom), or to reduce the height of the case 10 to reduce the product thickness (further miniaturizing and lightening the product).

[0078] Since the manufacturing method of the electronic circuit device according to Embodiment 2 basically includes the same steps as the manufacturing method of the electronic circuit device according to Embodiment 1, it also has the corresponding effects among the effects that the manufacturing method of the electronic circuit device according to Embodiment 1 has.

[0079] As described above, the present invention has been explained based on each of the above embodiments, but the present invention is not limited to each of the above embodiments. It can be implemented in various modes without departing from the gist thereof. For example, the following modifications are also possible.

[0080] (1) The positions, sizes, etc. of the respective components described in each of the above embodiments are examples, and can be changed within a range that does not impair the effects of the present invention.

[0081] (2) The fixing member 60 in each of the above embodiments is a pin-shaped member protruding from the first substrate 20, but the present invention is not limited thereto. The shape of the fixing member in the present invention is not limited to a pin shape.

[0082] (3) The fixing member 60 in each of the above embodiments is fixed to the second substrate 30 by the bonding material 62, but the present invention is not limited thereto. The fixing member may be fixed by a member other than the second substrate and the bonding material, or may be fixed by mechanical bonding to the second substrate.

[0083] (4) The fixing member 60 in each of the above embodiments also positions the sealing body surface adjusting member 50, but the present invention is not limited thereto. The fixing member does not have to position the sealing body surface adjusting member.

[0084] (5) In each of the above embodiments, at least a part of the tip side of the second substrate upper structure 32 is disposed inside the recesses 52, 52a, but the present invention is not limited thereto. For example, due to relationships such as the characteristics of the second substrate upper structure and the fluidity of the second sealing body, when a clearance is required between the second substrate upper structure and the bottom surface of the recess, the second substrate upper structure may be disposed outside the recess.

[0085] (6) Further, in the present invention, all of the structures on the second substrate may be disposed inside the recess, and the second substrate may be in contact with the surface adjusting member of the sealing body. In this case, by forming a hole in an appropriate part of the second substrate or providing a groove at the edge of the recess, it becomes possible to fill the inside of the recess with the second sealing body.

[0086] (7) In each of the above embodiments, the other component connection terminal 24 made of a metal plate and the linear other component 100 are connected, but the present invention is not limited thereto. The shape of the other component connection terminal can be any shape according to the shape of the other component and the like. Further, the electronic circuit device of the present invention may be provided with a connector instead of the other component connection terminal.

[0087] (8) In the electronic circuit device 2 according to the above Embodiment 2, one end of the through hole 56 is blocked by the first substrate 20, and the recess 52a in the electronic circuit device 2 is formed by the through hole 56 and the first substrate 20 that blocks one end of the through hole 56, but the present invention is not limited thereto. When a through hole penetrating from the opening side of the case to the first substrate side is formed in the surface adjusting member of the sealing body, one end of the through hole only needs to be blocked by at least one of the first substrate and the structures on the first substrate. That is, the through hole in the surface adjusting member of the sealing body may be blocked by the structures on the first substrate, or may be blocked by both the first substrate and the structures on the first substrate.

[0088] In the method for manufacturing the electronic circuit device according to the second embodiment, when arranging the sealing body surface adjusting member 50a, the sealing body surface adjusting member 50a is arranged so as to block one end of the through hole 56 with the first substrate 20, so that the concave portion 52a is formed by the through hole 56 and the first substrate 20 that blocks one end of the through hole 56. However, the present invention is not limited to this. When a through hole penetrating from the opening side of the case to the first substrate side is formed in the sealing body surface adjusting member, the sealing body surface adjusting member may be arranged so as to block one end of the through hole with at least one of the first substrate and the structure on the first substrate. That is, the through hole of the sealing body surface adjusting member may be blocked by the structure on the first substrate, or may be blocked by both the first substrate and the structure on the first substrate.

Description of reference numerals

[0089] 1, 2... Electronic circuit device, 10... Case, 20... First substrate, 22... Structure on the first substrate, 30... Second substrate, 32... Structure on the second substrate, 40... First sealing body, 42... Second sealing body, 50, 50a... Sealing body surface adjusting member, 52, 52a... Concave portion, 56... Through hole, 60... Fixing member, 62... Bonding material

Claims

1. A case having a bottom plate and side plates and open in one direction, a first substrate disposed inside the case, a first substrate structure mounted on the first substrate, a second substrate disposed on the opening side of the case with respect to the first substrate, a second substrate structure mounted on the second substrate, a first sealing body filled inside the case and sealing at least a part of the first substrate and the first substrate structure, an electronic circuit device including a second sealing body filled inside the case and sealing the second substrate and the second substrate structure, wherein the electronic circuit device, a sealing body surface adjusting member disposed on the opening side of the case of the first substrate, and forming a recess in which the surface of the first sealing body is recessed toward the first substrate side and the first sealing body is not filled, further includes a fixing member disposed on the opening side of the case of the first substrate and fixing the second substrate on the opening side of the case with respect to the first substrate, the second sealing body is filled inside the recess, and at least one of the second substrate structures is mounted on the first substrate side of the second substrate, and the tip thereof faces the bottom surface of the recess. An electronic circuit device characterized by this.

2. The electronic circuit device according to claim 1, wherein the fixing member is a pin-shaped member protruding from the first substrate, and is fixed to the second substrate by a bonding material.

3. The electronic circuit device according to claim 1, wherein the fixing member also positions the sealing body surface adjusting member.

4. The electronic circuit device according to claim 1, wherein at least a part of the tip side of at least one of the second substrate structures is disposed inside the recess.

5. The electronic circuit device according to claim 1, wherein the recess is formed in the sealing body surface adjusting member.

6. A through hole penetrating from the opening side of the case to the first substrate side is formed in the sealing body surface adjusting member, one end of the through hole is blocked by at least one of the first substrate and the first substrate structure, and the recess is formed by a combination of the through hole and at least one of the first substrate and the first substrate structure that blocks one end of the through hole. The electronic circuit device according to claim 1, characterized by this.

7. A first substrate arranging step of arranging a first substrate on which a first substrate upper structure is mounted inside a case having a bottom plate and side plates and having an opening in one direction; A first sealing step of filling a first sealing body inside the case and sealing at least a part of the first substrate and the first substrate upper structure; A second substrate arranging step of arranging a second substrate on which a second substrate upper structure is mounted on the opening side of the case with respect to the first substrate; A method for manufacturing an electronic circuit device, comprising: a second sealing step of filling a second sealing body inside the case and sealing the second substrate and the second substrate upper structure, Before the start of the second substrate arranging step, on the opening side of the case of the first substrate, a sealing body surface adjusting member for forming a recess in which the surface of the first sealing body is recessed toward the first substrate side and the first sealing body is not filled, And a fixing member for fixing the second substrate are arranged, In the second substrate arranging step, the second substrate is arranged such that at least one of the second substrate upper structures exists on the first substrate side and the tip thereof faces the bottom surface of the recess, The method for manufacturing an electronic circuit device according to claim 7, further comprising a fixing step of fixing the second substrate to the fixing member on the opening side of the case with respect to the first substrate between the second substrate arranging step and the second sealing step.

8. The fixing member is a pin-shaped member protruding from the first substrate, The method for manufacturing an electronic circuit device according to claim 7, wherein in the fixing step, the fixing member and the second substrate are fixed by a bonding material.

9. The method for manufacturing an electronic circuit device according to claim 7, wherein when the sealing body surface adjusting member is arranged, the position of the sealing body surface adjusting member is determined by the fixing member.

10. The method for manufacturing an electronic circuit device according to claim 7, wherein in the second substrate arranging step, the second substrate is arranged such that at least a part of the tip side of at least one of the second substrate upper structures is arranged inside the recess.

11. The method for manufacturing an electronic circuit device according to claim 7, wherein the recess is formed in the sealing body surface adjusting member.

12. In the sealing body surface adjusting member, a through hole penetrating from the opening side of the case toward the first substrate side is formed with reference to the state of being arranged on the first substrate, When arranging the sealing body surface adjusting member, the sealing body surface adjusting member is arranged so as to block one end of the through hole with at least one of the first substrate and the structure on the first substrate, so that the concave portion is formed by a combination of the through hole and at least one of the first substrate and the structure on the first substrate that block one end of the through hole. The method for manufacturing an electronic circuit device according to claim 7, wherein the arrangement of the sealing body surface adjusting member is performed before the start of the first sealing step.

Images