Manufacturing apparatus

Abstract

To provide a manufacturing apparatus for an electronic component that can shorten the distance in which an operator is to travel to operate the manufacturing apparatus.SOLUTION: A manufacturing apparatus is a manufacturing apparatus for an electronic component. The electronic component is manufactured through a plurality of processes. The manufacturing apparatus includes a plurality of mechanisms, a housing, a first observation window, and a reception unit. Each of the plurality of mechanisms performs one of the processes included in the plurality of processes. The housing covers each of the plurality of mechanisms. The first observation window is provided in the housing and is switchable between a transparent state and an opaque state. The reception unit receives operation instructions for the manufacturing apparatus. The plurality of mechanisms are aligned in a predetermined direction. The first observation window and the reception unit are spaced apart from each other in the predetermined direction. When the first observation window is in an opaque state, the first observation window receives operation instructions.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a manufacturing apparatus, and more particularly to a manufacturing apparatus for electronic components.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2022-13023 (Patent Document 1) discloses a resin molding apparatus. This resin molding apparatus includes a resin supply module, a plurality of compression molding modules, and a transfer module. In this resin molding apparatus, the resin supply module, the plurality of compression molding modules, and the transfer module are arranged in this order in one direction, and a display unit is provided in the transfer module. The operation of this resin molding apparatus is performed via the display unit provided in the transfer module (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the resin molding apparatus disclosed in the above Patent Document 1, for example, when an operator needs to operate the resin molding apparatus when located near the resin supply module, the operator needs to move from near the resin supply module to near the transfer module. That is, a long-distance movement may be required for the operation of the resin molding apparatus. However, the above Patent Document 1 does not disclose a solution to such a problem.

[0005] The present invention has been made to solve such a problem, and an object thereof is to provide a manufacturing apparatus capable of shortening the movement distance of an operator caused for the operation of a manufacturing apparatus for electronic components.

Means for Solving the Problems

[0006] The manufacturing apparatus according to the present invention is a manufacturing apparatus for electronic components. The electronic components are manufactured through a plurality of processes. The manufacturing apparatus includes a plurality of mechanisms, a housing, a first observation window, and a reception unit. Each of the plurality of mechanisms performs one of the processes included in the plurality of processes. The housing covers each of the plurality of mechanisms. The first observation window is provided in the housing and can be switched between a transmissive state and a non-transmissive state. The reception unit receives an operation instruction for the manufacturing apparatus. The plurality of mechanisms are arranged side by side in a predetermined direction. The first observation window and the reception unit are separated from each other in the predetermined direction. When the first observation window is in the non-transmissive state, the first observation window receives the operation instruction.

Effect of the Invention

[0007] According to the present invention, it is possible to provide a manufacturing apparatus capable of shortening the moving distance of an operator generated for the operation of a manufacturing apparatus for electronic components.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments according to one aspect of the present invention (hereinafter also referred to as "the present embodiments") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated. Also, each drawing is schematically drawn with appropriate omissions or exaggerations of the subject for ease of understanding.

[0010] [1. Configuration of Manufacturing Apparatus] FIG. 1 is a diagram schematically showing the front of a resin molding apparatus 100 according to the present embodiments. The resin molding apparatus 100 is configured to perform resin encapsulation on a substrate W (see FIG. 2) on which electronic components such as semiconductor chips are mounted, and manufacture a resin molded product (for example, a semiconductor device). In the resin molding apparatus 100, the component mounting surface of the substrate W on which the electronic components are mounted is resin encapsulated.

[0011] Examples of the substrate W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate W may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). In the substrate W, wiring may or may not already be provided.

[0012] As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply / storage module A (hereinafter also simply referred to as "module A"), two resin molding modules B (hereinafter also simply referred to as "module B"), and a resin material supply module C (hereinafter also simply referred to as "module C"). Module A, the two modules B, and module C are arranged in this order along the X-axis direction. Each of modules A - C is detachable and replaceable with respect to other modules. Also, in the resin molding apparatus 100, each of modules A - C is scalable.

[0013] In the resin molding apparatus 100, a resin molded product is manufactured through a plurality of steps. Although details will be described later, each of Modules A - C includes a mechanism for performing at least one of the plurality of steps. In the resin molding apparatus 100, the whole is covered by a housing 15, and in each of Modules A - C, the housing 15A - 15C, which is a part of the housing 15, covers the mechanism respectively.

[0014] On the front surface of Module A, a reception unit 10 is provided. The reception unit 10 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, and has a touch panel function. An operator of the resin molding apparatus 100 can operate each of Modules A - C through the reception unit 10, for example.

[0015] On the front surface of the housing 15 of each of Modules A - C, a rectangular door 20 is provided. On the front surface of each door 20, a handle 40 is provided. Each door 20 is a hinged door or a double - hinged door (butterfly door). The rotation axis of each door 20 extends in the Z - axis direction. The operator can open the door 20 by pulling the handle 40.

[0016] An observation window 30 is provided on each door 20. Although details will be described later, the observation window 30 can be switched between a transmissive state and a non - transmissive state. When the observation window 30 is in the transmissive state, the operator can observe the inside of the housing 15 through the observation window 30. On the other hand, when the observation window 30 is in the non - transmissive state, an operation screen of the resin molding apparatus 100 is displayed on the observation window 30. When the observation window 30 is in the non - transmissive state, the operator can give an operation instruction to the resin molding apparatus 100 through the observation window 30. Each door 20 is separated from the reception unit 10 in the X - axis direction.

[0017] FIG. 2 is a diagram schematically showing the internal plane of the resin molding apparatus 100 according to the present embodiment. As shown in FIG. 2, the resin molding apparatus 100 includes Module A, two Modules B, Module C, and a controller 200.

[0018] Module A includes a substrate supply unit 1, a substrate storage unit 2, a substrate placement unit 3, and a substrate transfer mechanism 4. The substrate supply unit 1 is configured to supply a substrate (hereinafter also referred to as "pre-sealing substrate") W before resin sealing onto the substrate placement unit 3. The substrate storage unit 2 is configured to store a substrate (hereinafter also referred to as "sealed substrate") W (resin molded product) that has been resin-sealed. The substrate placement unit 3 is configured to move in the Y-axis direction between a position corresponding to the substrate supply unit 1 and a position corresponding to the substrate storage unit 2. The substrate transfer mechanism 4 is configured to move in the X-axis direction and the Y-axis direction in Module A and each Module B. The substrate transfer mechanism 4, for example, holds the pre-sealing substrate W on the substrate placement unit 3 and transfers it to Module B, and places the sealed substrate W on the substrate placement unit 3.

[0019] Each Module B includes a compression molding unit 5. The compression molding unit 5 is configured to manufacture a sealed substrate W (resin molded product) by compression molding. In this compression molding, a granular resin material P having thermosetting properties is used. Note that the resin material P may be a resin material having thermoplastic properties. Also, the resin material P may be a liquid resin. The compression molding unit 5 includes a molding die 50 and a die clamping mechanism 53. The molding die 50 includes an upper die 52 and a lower die 51. The upper die 52 and the lower die 51 are arranged to face each other in the Z-axis direction. An observation window 30B (FIG. 1) is arranged in front (the near side) of the molding die 50. The die clamping of the molding die 50 is performed by the die clamping mechanism 53 raising the lower die 51.

[0020] A cavity 51C is formed on the upper surface of the lower die 51. A film (release film) on which the resin material P is placed is arranged in the cavity 51C. The substrate W is arranged on the lower surface of the upper die 52. The die clamping of the molding die 50 is performed in a state where a film on which the resin material P is placed is arranged in the cavity 51C of the lower die 51 and the substrate W is arranged on the lower surface of the upper die 52. Thereby, the component mounting surface of the substrate W is resin-sealed.

[0021] Module C includes a moving table 6, a resin material storage section 7, a resin material supply mechanism 8, a release film supply section (not shown), and a resin material transfer mechanism 9. The moving table 6 is configured to move in the X-axis direction and the Y-axis direction in Module C.

[0022] The resin material storage section 7 includes a film and a frame-shaped member (not shown) disposed on the upper surface of the film. In the resin material storage section 7, a space (recess 71) corresponding to the size of the cavity 51C of the lower mold 51 is formed. The resin material storage section 7 is placed on the moving table 6. The resin material supply mechanism 8 is configured to supply the resin material P to the resin material storage section 7 from above the resin material storage section 7. The resin material P falling from the discharge port of the resin material supply mechanism 8 is evenly spread in the recess 71 of the resin material storage section 7 by the relative movement of the moving table 6 with respect to the discharge port of the resin material supply mechanism 8.

[0023] The resin material transfer mechanism 9 is configured to move in the X-axis direction and the Y-axis direction in Module C and Module B. The resin material transfer mechanism 9 is configured to transfer the resin material storage section 7 containing the resin material P to the lower mold 51 and supply the resin material P to the cavity 51C of the lower mold 51. In the resin molding apparatus 100, one or a plurality of mechanisms included in each module are arranged in the X-axis direction.

[0024] The controller 200 is configured to control the entire resin molding apparatus 100. The controller 200 controls, for example, each of Module A, the two Modules B, and Module C. The controller 200 includes, for example, a CPU (Central Processing Unit) which is a hardware processor, a RAM (Random Access Memory), a ROM (Read Only Memory), etc., and is configured to execute information processing based on programs and various data. Note that the controller 200 may be disposed at any location within the resin molding apparatus 100, or may be configured by a plurality of controllers.

[0025] Figure 3 schematically shows a part of the cross-section taken along line III-III in Figure 1. Referring to Figure 3, the structure around the door 20 is substantially the same in each of the modules A - C. Here, the structure around the door 20B typically included in module B will be described.

[0026] As described above, the door 20B is openable and closable. In the housing 15B, a locking mechanism 65 is provided at a position facing the front end surface of the door 20B when the door 20B is in the closed state. The locking mechanism 65 is configured to switch between the locked state and the unlocked state of the door 20B according to a control signal transmitted from, for example, the controller 200 (see Figure 2). When the door 20B is in the locked state, it is impossible to open the door 20B, and when the door 20B is in the unlocked state, it is possible to open the door 20B. When the door 20B is in the unlocked state, the operator pulls the handle 40 to open the door 20B.

[0027] Inside the housing 15B, lighting devices 60A and 60B are provided to illuminate the observation window 30 from the inside of the housing 15B. The lighting devices 60A and 60B are provided near the sides opposite to and near the side SD1 among the four sides of the door 20, respectively. The side SD1 is, for example, the side where a hinge connecting the door 20B and the housing 15B is provided, and is the side regarded as the rotation axis of the door 20B among the four sides of the door 20B. Each lighting device 60 is composed of, for example, LED (Light Emitting Diode) lighting. For example, when the observation window 30 is in an opaque state, each lighting device 60 emits light to illuminate the observation window 30. Thereby, it is possible to suppress the difficulty in viewing the display screen due to the reflection of ambient light on the outer surface of the observation window 30. The control of each lighting device 60 will be described in detail later.

[0028] FIG. 4 is a diagram schematically showing a part of the cross section taken along the line IV-IV in FIG. 3. As shown in FIG. 4, the observation window 30 includes a touch panel 31, a display 32, and a heat insulating plate 33. The touch panel 31 is configured to receive an operation instruction of the resin molding apparatus 100 from an operator. The display 32 is constituted by a display device capable of switching between a transmissive state and a non-transmissive state. The display 32 is realized by various known display devices. The heat insulating plate 33 is transparent and is constituted by a plate such as an acrylic plate that can insulate the heat generated in each mechanism of the resin molding apparatus 100 in the housing 15.

[0029] In the observation window 30, the touch panel 31, the display 32, and the heat insulating plate 33 are arranged in this order from the outside to the inside of the resin molding apparatus 100. Thus, in the observation window 30, the heat insulating plate 33 is arranged inside the display 32. According to the resin molding apparatus 100, since the heat insulating plate 33 is arranged between the mechanism arranged in the housing 15 and the display 32, even if the temperature of the mechanism rises and the temperature in the housing 15 becomes high, deterioration of the display 32 can be suppressed.

[0030] The touch panel 31 and the display 32 are fixed to each other, for example, at their peripheral portions by an adhesive 35. The bezel BZ1 is a frame member that covers the observation window 30 from the side, and includes a first portion BZ10 that constitutes the front surface of the bezel BZ1 and a second portion BZ11 that extends rearward from the first portion BZ10. At the center of the bezel BZ1, an opening H1 penetrating in the front-rear direction (Y-axis direction (see FIG. 1)) is formed. Through the touch panel 31 exposed through the opening H1, the operator operates the resin molding apparatus 100. A boss BS1 is welded to the rear surface of the first portion BZ10. By inserting a bolt (not shown) into the boss BS1, the bezel BZ1 and the clamp CL1 are connected to each other. The observation window 30 is fixed to the housing 15 by sandwiching the peripheral portion of the observation window 30 between the bezel BZ1 and the clamp CL1 via the cushions CS1 and CS2. In the example shown in FIG. 4, the touch panel 31 and the display 32 are fixed by the adhesive 35 so that a space is formed therebetween, but they may be fixed so that no space is formed.

[0031] As described above, the heat insulating plate 33 is located more inside the resin molding apparatus 100 than the display 32. The heat insulating plate 33 is fixed to the second portion BZ11 of the bezel BZ1 without contacting the surface of the display 32. By providing a space between the heat insulating plate 33 and the display 32 (and the touch panel 31) in this way, the heat insulating effect can be further enhanced.

[0032] Referring again to FIG. 3, the control board SS1 is disposed inside the housing 15B and near the side SD1 of the door 20B. A control device CP1 is mounted on the control board SS1. The control device CP1 includes a CPU, a RAM, a ROM, etc., and is configured to control each of the touch panel 31 and the display 32. The control device CP1 is configured to communicate with, for example, the controller 200. Each of the touch panel 31 and the display 32 and the control board SS1 are electrically connected by a wiring group L1. The wiring group L1 is concentrated near the side SD1 among the four sides of the door 20B. Therefore, according to the resin molding apparatus 100, even when the door 20B is opened, since the change in the distance between the observation window 30B and the control board SS1 is relatively small, for example, compared with the case where each wiring is concentrated near the sides other than the side SD1 among the four sides of the door 20B, the length of each wiring can be shortened.

[0033] [2. Operation through the observation window] As described above, the resin molding apparatus 100 according to the present embodiment includes the module A, two modules B, and the module C. The module A, the two modules B, and the module C are arranged side by side in the X-axis direction, and the length of the resin molding apparatus 100 in the X-axis direction is long. Suppose that in the resin molding apparatus 100, each observation window 30 is constituted by a mere acrylic plate and no operation instruction of the resin molding apparatus 100 can be given through the observation window 30. In this case, when it becomes necessary for the operator to operate the resin molding apparatus 100 while being located near the module C, the operator has to move from near the module C to near the module A. That is, a long-distance movement is required for the operation of the resin molding apparatus 100.

[0034] In the resin molding apparatus 100 according to the present embodiment, when the observation window 30 is in an opaque state, the observation window 30 receives an operation instruction of the resin molding apparatus 100. Therefore, according to the resin molding apparatus 100, for example, when an operator of the resin molding apparatus 100 is observing the manufacturing state of an electronic component such as a resin molded product through the transparent observation window 30, the operator can give an operation instruction to the resin molding apparatus 100 by switching the observation window 30 from the transparent state to the opaque state. That is, according to the resin molding apparatus 100 according to the present embodiment, the operator can give an operation instruction to the resin molding apparatus 100 without moving to the position of the reception unit 10.

[0035] FIG. 5 is a diagram for explaining the state transition of the observation window 30. Referring to FIG. 5, when the observation window 30 is in a transparent state, the operator can observe the inside of the housing 15 through the observation window 30. When the observation window 30 is in a transparent state, if the operator touches the observation window 30 (touch panel 31) with a finger, for example, and slides the finger upward (swipe up), the observation window 30 switches from the transparent state to the opaque state (opaque state A).

[0036] On the observation window 30 in the opaque state A, for example, one or a plurality of windows WD1 are displayed. Each window WD1 displays information regarding the current state of the resin molding apparatus 100, for example. Examples of the information displayed in each window WD1 include the flow rate and flow volume during resin material P spraying, the temperature, pressure, and vacuum pressure of the mold 50, and the temperature of the heater that heats the mold 50. An operation panel described later may be displayed on the observation window 30 in the opaque state A.

[0037] When the observation window 30 is in the opaque state A, if the operator touches the observation window 30 (touch panel 31) with a finger, for example, and slides the finger to the left direction (left swipe), the observation window 30 switches from the opaque state A to the opaque state B. On the observation window 30 in the opaque state B, for example, one or more windows WD1 are displayed. Each window WD1 displays, for example, the operation panel of the resin molding apparatus 100. The operator can operate the resin molding apparatus 100 by touching the operation panel. Information regarding the current state of the resin molding apparatus 100 described above may be displayed on the observation window 30 in the opaque state B. Also, it is not necessarily required to provide two screens (opaque states A and B) for the opaque state. Only one screen may be provided for the opaque state, or three or more screens may be provided for the opaque state.

[0038] In addition, an image for advertising the resin molding apparatus 100 (such as an image showing at least a part of the apparatus name, model number, and manufacturer name of the resin molding apparatus 100) may be displayed on the window WD1 displayed on the observation window 30 in the opaque states A and B. According to the resin molding apparatus 100 according to the present embodiment, since an image for advertising the resin molding apparatus 100 is displayed on the observation window 30, for example, the resin molding apparatus 100 can be advertised to potential users who are observing the resin molding apparatus 100.

[0039] In addition, information regarding the name and photograph of the operator of the resin molding apparatus 100, the variety of the resin molded product being produced or the type of the substrate W, the frame size and resin type, memo, calendar, shift work, production schedule, production results, and cleaning time may be displayed on the window WD1 displayed on the observation window 30 in the opaque states A and B. Conventionally, this information has been shared by, for example, attaching a handwritten memo to the apparatus. By displaying this information on the window WD1 displayed on the observation window 30 in the opaque states A and B, the labor of attaching a handwritten memo to the apparatus or the like can be reduced.

[0040] When the observation window 30 is in the non-transmissive state B, if the operator touches the observation window 30 (touch panel 31) with a finger and slides the finger to the right (right swipe), the observation window 30 switches from the non-transmissive state B to the non-transmissive state A. When the observation window 30 is in the non-transmissive state A or the non-transmissive state B, if the operator touches the observation window 30 (touch panel 31) with a finger and slides the finger downward (swipe down), the observation window 30 switches from the non-transmissive state to the transmissive state. Note that the screens displayed on the observation window 30 in the non-transmissive states A and B are examples of the "operation screen". Also, the operation method for changing the state of the observation window 30 is merely an example.

[0041] [3. Operation of the manufacturing apparatus] FIG. 6 is a flowchart showing the operation procedure of the observation window 30 and the lighting device 60. The processes shown in this flowchart are executed by the controller 200 at a predetermined cycle when the observation window 30 is in the transmissive state.

[0042] Referring to FIG. 6, the controller 200 determines whether an instruction to switch the observation window 30 from the transmissive state to the non-transmissive state has been received (step S100). Specifically, the controller 200 determines whether a signal indicating that the touch panel 31 has received the operator's swipe-up operation has been received from the control device CP1. If it is determined that an instruction to switch the observation window 30 from the transmissive state to the non-transmissive state has not been received (NO in step S100), the controller 200 repeats the process of step S100 until an instruction to switch the observation window 30 from the transmissive state to the non-transmissive state is received.

[0043] On the other hand, if it is determined that an instruction to switch the observation window 30 from the transmissive state to the non-transmissive state has been received (YES in step S100), the controller 200 transmits a signal instructing the control device CP1 to the control device CP1 so that the display 32 switches from the transmissive state to the non-transmissive state and an operation screen is displayed on the display 32 (step S110). Also, the controller 200 controls each lighting device 60 to turn on.

[0044] After that, the controller 200 determines whether it has received an instruction to switch the observation window 30 from the non-transmissive state to the transmissive state (step S120). Specifically, the controller 200 determines whether a signal indicating that the touch panel 31 has received a swiping-down operation by the operator has been received from the control device CP1. If it is determined that an instruction to switch the observation window 30 from the non-transmissive state to the transmissive state has not been received (NO in step S120), the controller 200 repeats a predetermined process until it receives an instruction to switch the observation window 30 from the non-transmissive state to the transmissive state. Here, the predetermined process refers to a process of switching the state of the observation window 30 between the non-transmissive states A and B according to an operation received from the operator.

[0045] On the other hand, if it is determined that an instruction to switch the observation window 30 from the non-transmissive state to the transmissive state has been received (YES in step S120), the controller 200 transmits a signal to the control device CP1 instructing the control device CP1 to control the display 32 to switch from the non-transmissive state to the transmissive state (step S110). Further, the controller 200 controls each lighting device 60 to turn off.

[0046] In the resin molding apparatus 100 according to the present embodiment, the lighting device 60 turns off as the observation window 30 is switched from the non-transmissive state to the transmissive state. Therefore, according to the resin molding apparatus 100, when the observation window 30 is in the transmissive state, the lighting device 60 does not emit light toward the operator, so that a decrease in visibility inside the housing 15 can be suppressed as compared with the case where the lighting device 60 emits light toward the operator when the observation window 30 is in the transmissive state.

[0047] FIG. 7 is a flowchart showing the operation procedure of the lock mechanism 65 and the lighting device 60. The process shown in this flowchart is executed by the controller 200 at a predetermined cycle when the door 20 is in the locked state and the observation window 30 is in the non-transmissive state.

[0048] Referring to FIG. 7, the controller 200 determines whether an instruction to switch the door 20 from the locked state to the unlocked state has been received (step S200). Specifically, the controller 200 determines whether an unlock instruction from the operator has been received via the reception unit 10 or the observation window 30. If it is determined that an instruction to switch the door 20 from the locked state to the unlocked state has not been received (NO in step S200), the controller 200 repeats the process of step S200 until an instruction to switch the door 20 from the locked state to the unlocked state is received.

[0049] On the other hand, if it is determined that an instruction to switch the door 20 from the locked state to the unlocked state has been received (YES in step S200), the controller 200 controls the lock mechanism 65 to switch from the locked state to the unlocked state and controls each lighting device 60 to turn off (step S210).

[0050] Thereafter, the controller 200 determines whether an instruction to switch the door 20 from the unlocked state to the locked state has been received (step S220). Specifically, the controller 200 determines whether a lock instruction from the operator has been received via the reception unit 10 or the observation window 30. If it is determined that an instruction to switch the door 20 from the unlocked state to the locked state has not been received (NO in step S220), the controller 200 repeats the process of step S220 until an instruction to switch the door 20 from the unlocked state to the locked state is received.

[0051] On the other hand, if it is determined that an instruction to switch the door 20 from the unlocked state to the locked state has been received (YES in step S220), the controller 200 controls the lock mechanism 65 to switch from the unlocked state to the locked state and controls each lighting device 60 to turn on (step S230).

[0052] In the resin molding apparatus 100 according to the present embodiment, when the observation window 30 is in an opaque state, the lighting device 60 turns off as the door 20 is switched from the locked state to the unlocked state. Therefore, according to the resin molding apparatus 100, since the lighting device 60 does not emit light toward the operator when the door 20 is open, it is possible to suppress a decrease in visibility inside the housing 15 as compared with the case where the lighting device 60 emits light toward the operator when the door 20 is open.

[0053] [4. Features] As described above, in the resin molding apparatus 100 according to the present embodiment, when the observation window 30 is in an opaque state, the observation window 30 receives an operation instruction of the resin molding apparatus 100. Therefore, according to the resin molding apparatus 100, for example, when an operator of the resin molding apparatus 100 is observing the manufacturing state of an electronic component such as a resin molded product through the transparent observation window 30, the operator can give an operation instruction to the resin molding apparatus 100 by switching the observation window 30 from the transparent state to the opaque state. That is, according to the resin molding apparatus 100, the operator can give an operation instruction to the resin molding apparatus 100 without moving to the position of the reception unit 10.

[0054] [5. Other Embodiments] The idea of the above embodiment is not limited to the embodiments described above. Hereinafter, examples of other embodiments to which the idea of the above embodiment can be applied will be described.

[0055] <5-1> In the above-described embodiment, the technology enabling operation instructions for the apparatus at the observation window is applied to the resin molding apparatus for compression molding. However, the application scope of this technology is not limited thereto. For example, this technology may be applied to a resin molding apparatus for transfer molding or injection molding or a cutting apparatus. The cutting apparatus, for example, cuts a package substrate (object to be cut) to individualize the package substrate into a plurality of electronic components (package components). In the package substrate, a substrate on which a semiconductor chip is mounted or a lead frame is resin-sealed. Note that the object to be cut does not necessarily have to be a package substrate, and for example, a substrate that is not resin-sealed (including a wafer) may be used. Substrates individualized by cutting a substrate that is not resin-sealed are also included in the "electronic components". Further, this technology may be applied to a wafer cleaning apparatus, a coater-developer, an annealing apparatus, a film thickness measuring apparatus, a wafer appearance inspection apparatus, an exposure apparatus, a film forming apparatus, a bonding apparatus, and the like.

[0056] <5-2> In the above-described embodiment, the reception unit 10 is configured by a display device such as a liquid crystal monitor or an organic EL monitor. However, the configuration of the reception unit 10 is not limited thereto. The reception unit 10 may be configured by, for example, the observation window 30. In this case, the operator can observe the manufacturing state of electronic components such as resin molded products through the reception unit 10 in the transmissive state, and can give an operation instruction for the resin molding apparatus 100 through the reception unit 10 in the non-transmissive state.

[0057] <5-3> In the above-described embodiment, the resin molding apparatus 100 is composed of a plurality of modules. However, the resin molding apparatus 100 does not necessarily have to be composed of a plurality of modules. Each mechanism included in Modules A-C may be included in one housing.

[0058] <5-4> In the above embodiment, the observation window 30 provided in each module included a touch panel 31 and a display 32. However, the configuration of the observation window 30 provided in each module is not necessarily limited to this. For example, the observation window 30 provided in some modules may be constituted only by an acrylic plate. It is sufficient that at least one of the plurality of observation windows 30 provided in the resin molding apparatus 100 includes a touch panel 31 and a display 32.

[0059] <5-5> In the above embodiment, the reception unit 10 or the observation window 30 was provided on the front side of the resin molding apparatus 100. However, the reception unit 10 or the observation window 30 may be provided on the side surface side and / or the back surface side of the resin molding apparatus 100.

[0060] <5-6> In the above embodiment, the door 20 was a hinged door or a double-opening door (butterfly opening). However, the door 20 may be a door in any form, for example, a flip-up door.

[0061] The embodiments of the present invention have been exemplarily described above. That is, for exemplary purposes, a detailed description and the accompanying drawings have been disclosed. Therefore, among the components described in the detailed description and the accompanying drawings, there may be components that are not essential for solving the problems. Therefore, just because those non-essential components are described in the detailed description and the accompanying drawings, they should not be immediately recognized as essential.

[0062] Also, the above embodiments are merely examples of the present invention in every respect. Various improvements and modifications are possible within the scope of the present invention. For example, at least a part of the configuration of one of the embodiments may be combined with at least a part of the configuration of any other embodiment. That is, in practicing the present invention, a specific configuration can be appropriately adopted according to the embodiment.

[0063] [6. Supplementary Note] <Technology 1> (Configuration) A manufacturing apparatus for electronic components, wherein the electronic components are manufactured through a plurality of processes, a plurality of mechanisms each performing one of the plurality of processes included in the plurality of processes, a housing covering each of the plurality of mechanisms, a first observation window provided in the housing and capable of switching between a transmissive state and a non-transmissive state, and a reception unit that receives an operation instruction for the manufacturing apparatus, wherein the plurality of mechanisms are arranged in a predetermined direction, the first observation window and the reception unit are separated from each other in the predetermined direction, and the first observation window receives the operation instruction when the first observation window is in the non-transmissive state. A manufacturing apparatus. (Effects, etc.) In this manufacturing apparatus, when the first observation window is in the non-transmissive state, the first observation window receives an operation instruction for the manufacturing apparatus. Therefore, according to this manufacturing apparatus, for example, when an operator of the manufacturing apparatus is observing the manufacturing state of electronic components through the transmissive first observation window, the operator can issue an operation instruction for the manufacturing apparatus by switching the first observation window from the transmissive state to the non-transmissive state. That is, according to this manufacturing apparatus, the operator can issue an operation instruction for the manufacturing apparatus without moving to the position of the reception unit.

[0064] <Technology 2> (Configuration) The manufacturing apparatus according to Technology 1, wherein when the first observation window is in the non-transmissive state, the first observation window displays an operation screen of the manufacturing apparatus. (Effects, etc.) According to this manufacturing apparatus, since an operation screen of the manufacturing apparatus is displayed on the first observation window, the operator can issue an operation instruction for the manufacturing apparatus through the operation screen.

[0065] <Technology 3> (Configuration) The operation screen includes an image for promoting the manufacturing apparatus, and the manufacturing apparatus described in Technology 2. (Effects, etc.) According to this manufacturing apparatus, since an image for promoting the manufacturing apparatus is displayed on the first observation window, for example, it is possible to promote the manufacturing apparatus to potential users who are observing the manufacturing apparatus.

[0066] <Technology 4> (Configuration) The first observation window includes a display capable of switching between the transparent state and the non-transparent state, and a touch panel disposed outside the display, and the manufacturing apparatus described in any one of Technologies 1 to 3. (Effects, etc.) According to this manufacturing apparatus, it is possible to achieve both switching between the transparent state and the non-transparent state in the first observation window and operation instructions for the manufacturing apparatus through the first observation window.

[0067] <Technology 5> (Configuration) The first observation window further includes a heat insulating plate disposed inside the display, and the manufacturing apparatus described in Technology 4. (Effects, etc.) According to this manufacturing apparatus, since a heat insulating plate is disposed inside the display in the first observation window, it is possible to suppress deterioration of the display even if the temperature inside the housing becomes high.

[0068] <Technology 6> (Configuration) The manufacturing apparatus further includes a control board on which a first control device for controlling the display is mounted. The housing includes a rectangular door. The first observation window is provided on the door. Wiring connecting the display and the control board is concentrated in the vicinity of a side regarded as a rotation axis among the four sides of the door, and the manufacturing apparatus described in Technology 4 or Technology 5. (Effects, etc.) In this manufacturing apparatus, the wiring connecting the display and the control board is concentrated near the side of the four sides of the door that is regarded as the rotation axis. Therefore, according to this manufacturing apparatus, even if the door is opened, the change in the distance between the display and the control board is relatively small. For example, compared with the case where the wiring is concentrated near the sides other than the side regarded as the rotation axis, the length of the wiring can be shortened.

[0069] <Technology 7> (Configuration) An illumination device for illuminating the first observation window from the inside of the housing, And a second control device for controlling the illumination device, The second control device controls the illumination device to turn off in response to the first observation window being switched from the non-transmissive state to the transmissive state. The manufacturing apparatus according to any one of Technologies 1 to 6. (Effect, etc.) In this manufacturing apparatus, the illumination device turns off in response to the first observation window being switched from the non-transmissive state to the transmissive state. Therefore, according to this manufacturing apparatus, when the first observation window is in the non-transmissive state, the illumination device does not emit light toward the operator. Therefore, compared with the case where the illumination device emits light toward the operator when the first observation window is in the non-transmissive state, a decrease in visibility inside the housing can be suppressed.

[0070] <Technology 8> (Configuration) An illumination device for illuminating the first observation window from the inside of the housing, And a second control device for controlling the illumination device, The door can be switched between a locked state and an unlocked state, The second control device controls the illumination device to turn off in response to the door being switched from the locked state to the unlocked state when the first observation window is in the non-transmissive state. The manufacturing apparatus according to Technology 6. (Effect, etc.) In this manufacturing apparatus, when the first observation window is in an opaque state, the lighting device turns off in response to the door being switched from the locked state to the unlocked state. Therefore, according to this manufacturing apparatus, since the lighting device does not emit light toward the operator when the door is open, it is possible to suppress a decrease in visibility inside the housing as compared with the case where the lighting device emits light toward the operator when the door is open.

[0071] <Technology 9> (Configuration) The reception unit is constituted by a second observation window, The second observation window is provided in the housing and can be switched between a transparent state and an opaque state, When the second observation window is in the opaque state, the second observation window receives the operation instruction, the manufacturing apparatus according to any one of Technologies 1 to 8. (Effect, etc.) In this manufacturing apparatus, the reception unit is constituted by a second observation window. Therefore, according to this manufacturing apparatus, the operator can observe the manufacturing state of the electronic component through the transparent second observation window, and can give an operation instruction for the manufacturing apparatus through the opaque second observation window.

[0072] <Technology 10> (Configuration) The electronic component is a semiconductor device, the manufacturing apparatus according to any one of Technologies 1 to 9. (Effect, etc.) According to this manufacturing apparatus, for example, when the operator of the manufacturing apparatus is observing the manufacturing state of the semiconductor device through the transparent first observation window, the operator can give an operation instruction for the manufacturing apparatus by switching the first observation window from the transparent state to the opaque state.

Explanation of Signs

[0073] 1 Substrate supply unit, 2 Substrate storage unit, 3 Substrate placement unit, 4 Substrate transfer mechanism, 5 Compression molding unit, 6 Moving table, 7 Resin material storage unit, 8 Resin material supply mechanism, 9 Resin material transfer mechanism, 10 Reception unit, 15 Housing, 20 Door, 30 Observation window, 31 Touch panel, 32 Display, 33 Heat insulation plate, 35 Adhesive, 40 Handle, 50 Mold, 51 Lower mold, 51C Cavity, 52 Upper mold, 53 Mold clamping mechanism, 60 Lighting device, 65 Locking mechanism, 100 Resin molding device, 200 Controller, A Substrate supply and storage module, B Resin molding module, BS1 Boss, BZ1 Bezel, BZ10 First part, BZ11 Second part, C Resin material supply module, CL1 Clamp, CP1 Control device, CS1, CS2 Cushion, H1 Opening, L1 Wiring group, P Resin material, SD1 Side, SS1 Control board, W Substrate, WD1 Window.

Claims

1. A manufacturing apparatus for electronic components, wherein the electronic components are manufactured through a plurality of processes, a plurality of mechanisms each performing any one of the plurality of processes, a housing covering each of the plurality of mechanisms, a first observation window provided in the housing and capable of switching between a transmissive state and a non-transmissive state, and a reception unit for receiving operation instructions for the manufacturing apparatus, wherein the plurality of mechanisms are arranged side by side in a predetermined direction, the first observation window and the reception unit are separated from each other in the predetermined direction, and when the first observation window is in the non-transmissive state, the first observation window receives the operation instructions, the manufacturing apparatus.

2. The manufacturing apparatus according to claim 1, wherein when the first observation window is in the non-transmissive state, the first observation window displays an operation screen of the manufacturing apparatus.

3. The manufacturing apparatus according to claim 2, wherein the operation screen includes an image for advertising the manufacturing apparatus.

4. The manufacturing apparatus according to any one of claims 1 to 3, wherein the first observation window includes a display capable of switching between the transmissive state and the non-transmissive state and a touch panel disposed outside the display.

5. The manufacturing apparatus according to claim 4, wherein the first observation window further includes a heat insulating plate disposed inside the display.

6. The manufacturing apparatus further includes a control board on which a first control device for controlling the display is mounted, the housing includes a rectangular door, the first observation window is provided on the door, and wiring connecting the display and the control board is concentrated in the vicinity of a side regarded as a rotation axis among the four sides of the door. The manufacturing apparatus according to claim 4 or claim 5.

7. The manufacturing apparatus further includes an illumination device for illuminating the first observation window from the inside of the housing, and a second control device for controlling the illumination device, wherein the second control device controls the illumination device to turn off in response to the first observation window being switched from the non-transmissive state to the transmissive state. The manufacturing apparatus according to any one of claims 1 to 6.

8. The manufacturing apparatus further includes an illumination device for illuminating the first observation window from the inside of the housing, and a second control device for controlling the illumination device, wherein the door is capable of switching between a locked state and an unlocked state. The manufacturing apparatus according to claim 6, wherein the second control device controls the lighting device to turn off in response to the door being switched from the locked state to the unlocked state when the first observation window is in the non-transmissive state.

9. The reception unit is constituted by a second observation window, The second observation window is provided in the housing and can be switched between the transmissive state and the non-transmissive state, The manufacturing apparatus according to any one of claims 1 to 8, wherein when the second observation window is in the non-transmissive state, the second observation window receives the operation instruction.

10. The manufacturing apparatus according to any one of claims 1 to 9, wherein the electronic component is a semiconductor device.

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