Method for manufacturing heat conductive member, heat conductive member, and electronic device

Abstract

To provide a heat conductive member which can be selectively provided to a site with generates much heat and propagates heat more efficiently.SOLUTION: The present invention relates to a method for manufacturing a heat conductive member including a pattern-like resin film 2 containing an aerotropic filler 5, the method including the step of applying a magnetic field to a laminate body A on a magnet 3 and aligning the anisotropic filler 5 in a magnetic field.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a heat conductive member, a heat conductive member, and an electronic device.

Background Art

[0002] With the improvement of the processing capacity of electronic devices, the amount of heat generated from electronic devices tends to increase. Therefore, measures for effectively transferring heat to the outside of the device have become important. As such measures, heat conductive members made of materials such as metals, ceramics, and resin compositions are applied. Among these heat conductive members, heat conductive members formed of a resin composition are widely used because they have good electrical insulation, mechanical properties, heat resistance, chemical resistance, adhesiveness, etc.

[0003]

[0004] Patent Document 1 discloses an insulating heat conductive sheet containing insulating high heat conductive fibers penetrating in the thickness direction and a binder resin, having a surface roughness of 15 μm or less on at least one surface of the sheet, and having a penetration density of the insulating high heat conductive fibers penetrating in the thickness direction of 6% or more. Patent Document 1 also describes that the object is to provide a heat conductive sheet excellent in insulation and heat conductivity.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention provides a thermally conductive member that can be selectively applied to a site with a large calorific value and has improved thermal conductivity.

Means for Solving the Problems

[0007] According to the present invention, there are provided a method for manufacturing a thermally conductive member, a thermally conductive member, and an electronic device as described below.

[0008] 1. A method for manufacturing a thermally conductive member including a patterned resin film containing an anisotropic filler, The method for manufacturing a thermally conductive member including a step (X) of magnetically orienting the anisotropic filler. 2. A step (A1) of preparing a sheet having a resin film made of a resin composition on a substrate, A step (X1) of magnetically orienting the anisotropic filler inside the resin film, A step (B1) of patterning the resin film, The method for manufacturing a thermally conductive member according to 1., including the above steps. 3. The method for manufacturing a thermally conductive member according to 2., where the step (B1) is performed after the step (X1). 4. After the step (X1), the method for manufacturing a thermally conductive member according to 2. or 3., further including a step (C1) of laminating a resin film different from the resin film on the resin film. 5. The method for manufacturing a thermally conductive member according to any one of 2. to 4., where the step (X1) is performed after the step (B1). 6. The method for manufacturing a thermally conductive member according to 5., further including a step (D1) of softening the patterned resin film between the step (B1) and the step (X1). 7. The method for manufacturing a thermally conductive member according to any one of 2. to 6., where the resin film contains the anisotropic filler before performing the step (X1). 8. A step (X2) of magnetically orienting the anisotropic filler on a sheet having an adhesive resin layer, A step (A2) of preparing a sheet having a resin film made of a resin composition on a substrate, A step (E2) of laminating the sheet in which the anisotropic filler is magnetically oriented on the resin film; A step (B2) of patterning the resin film; A step (F2) of peeling the sheet having the adhesive resin layer; The method for manufacturing a thermally conductive member according to 1., comprising: 9. The method for manufacturing a thermally conductive member according to any one of 2. to 8., wherein the resin composition contains a photosensitive resin composition. 10. A step (A3) of preparing a sheet having a patterned resin film made of a resin composition on a substrate; A step (X3) of magnetically orienting the anisotropic filler inside the patterned resin film; The method for manufacturing a thermally conductive member according to 1., comprising: 11. The method for manufacturing a thermally conductive member according to 10., wherein the resin composition contains a photosensitive resin composition. 12. The method for manufacturing a thermally conductive member according to 10., wherein the resin composition contains a thermosetting resin composition. 13. The method for manufacturing a thermally conductive member according to any one of 2. to 12., wherein ultrasonic waves are irradiated to the anisotropic filler in the step (X1), (X2) or (X3). 14. The method for manufacturing a thermally conductive member according to any one of 1. to 13., wherein the shape of the anisotropic filler is scaly. 15. The method for manufacturing a thermally conductive member according to any one of 1. to 14., wherein the anisotropic filler contains one or more selected from the group consisting of boron nitride, aluminum nitride, alumina and graphite. 16. The median diameter D of the anisotropic filler on a volume basis 50 is 20 μm or more and 100 μm or less. The method for manufacturing a thermally conductive member according to any one of 1. to 15. 17. The method for manufacturing a thermally conductive member according to any one of 1. to 16., wherein the content of the anisotropic filler with respect to 100 parts by mass of the thermally conductive member is 10 parts by mass or more and 90 parts by mass or less. 18. The ratio (D of the median diameter D of the anisotropic filler to the thickness T of the resin film c with respect to the anisotropic filler 50 of50 / T c is 0.5 or more and 1.1 or less, The manufacturing method of the heat conductive member according to any one of 1. to 17. 19. The manufacturing method of the heat conductive member according to any one of 1. to 18., including the step of treating the surface of the anisotropic filler with a coupling agent. 20. The manufacturing method of the heat conductive member according to any one of 2. to 19., wherein the resin composition contains a (meth)acrylic resin. 21. The manufacturing method of the heat conductive member according to any one of 2. to 20., wherein the resin composition contains an epoxy resin. 22. The manufacturing method of the heat conductive member according to any one of 2. to 21., wherein the resin composition contains a solvent. 23. The manufacturing method of the heat conductive member according to any one of 2. to 22., wherein the resin composition contains a heat curing initiator. 24. The manufacturing method of the heat conductive member according to any one of 2. to 23., wherein the resin composition contains a photo-curing initiator. 25. The manufacturing method of the heat conductive member according to any one of 2. to 24., wherein the base material contains a metal foil. 26. The manufacturing method of the heat conductive member according to 25., wherein the metal foil contains a copper foil. 27. The anisotropic filler contains one or more selected from the group consisting of boron nitride and graphite, The manufacturing method of the heat conductive member according to any one of 1. to 26., wherein the heat conductive member satisfies the following formula (1). C F ×I 100 / I 002 ≧2.4 (1) (In the formula (1), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (2), C F =V F / (V F +VR ) (2) In the formula (2), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film.) [X-ray Diffraction Method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scan speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°. 28. The method for manufacturing a heat conductive member according to any one of 1. to 27., wherein the anisotropic filler contains aluminum nitride, and the heat conductive member satisfies the following formula (4). C F ×I 100 / I 002 ≧1.0 (4) (In the formula (4), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray Diffraction Method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray Diffraction Method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (5), C F =V F / (V F +V R ) (5) In the formula (5), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film.) [X-ray Diffraction Method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scan speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°. 29. The method for manufacturing a heat conductive member according to any one of 1. to 28., wherein the anisotropic filler contains alumina, and the heat conductive member satisfies the following formula (7). C F ×I 113 / I 006 ≧5.0 (7) (In the above formula (7), I 006 is the diffraction peak intensity of the 006 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 113 is the diffraction peak intensity of the 113 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (8), C F =V F / (V F +V R ) (8) In the above formula (8), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, perform X-ray diffraction by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scan speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° 30. The method for manufacturing a heat conductive member according to any one of 1. to 29., wherein the heat conductive member is in a B-stage state. 31. The method for manufacturing a heat conductive member according to any one of 1. to 29., wherein the heat conductive member is in a C-stage state. 32. A heat conductive member obtained by the method for manufacturing a heat conductive member according to any one of 1. to 31. 33. An electronic device comprising the heat conductive member according to 32., and an electronic component on the heat conductive member.

Advantages of the Invention

[0009] According to the present invention, it is possible to provide a heat conductive member that can be selectively applied to a site with a large amount of heat generation and has improved heat conductivity.

Brief Description of the Drawings

[0010] ​

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0011] Hereinafter, the present invention will be described based on embodiments.

[0012] [Method for Manufacturing a Thermally Conductive Member] Hereinafter, the method for manufacturing the thermally conductive member of the present embodiment will be described.

[0013] The method for manufacturing a thermally conductive member of the present embodiment is a method for manufacturing a thermally conductive member including a patterned resin film containing an anisotropic filler, and includes a step (X) of magnetically orienting the anisotropic filler.

[0014] When the present inventors analyzed the heat generated from the electronic device, they obtained the finding that there are portions with a large amount of heat generation and portions with a small amount of heat generation in the electronic device. On the one hand, conventional heat conductive members cover the entire surface of an electronic device and cool the entire surface of the electronic device without distinguishing between a portion with a large amount of heat generation and a portion with a small amount of heat generation. That is, a portion with a small amount of heat generation and a low need for cooling is also covered with a heat conductive member, resulting in waste. Based on the above findings, the inventors of the present invention have found a means of selectively applying a heat conductive member in a pattern to a portion with a large amount of heat generation and a high need for cooling. As a result, efficient cooling can be achieved with a small amount of heat conductive member.

[0015] Furthermore, the heat conductive member of the present embodiment has improved heat conductivity by including oriented anisotropic fillers.

[0016] From the above, the heat conductive member of the present embodiment can be selectively applied to a portion with a large amount of heat generation and has improved heat conductivity.

[0017] <First Embodiment> Hereinafter, a method for manufacturing a heat conductive member according to the first embodiment will be described with reference to FIGS. 1 to 3.

[0018] The method for manufacturing the heat conductive member 20 according to the first embodiment includes a step (A1) of preparing a sheet having a resin film 2 made of a resin composition on a substrate 1, a step (X1) of magnetically orienting anisotropic fillers 5 inside the resin film 2, and a step (B1) of patterning the resin film 2.

[0019] In the method for manufacturing the heat conductive member according to the first embodiment, the order of each step is not limited. For example, step (B1) may be performed after step (X1), or step (X1) may be performed after step (B1).

[0020] An embodiment in which step (B1) is performed after step (X1) will be described with reference to FIGS. 1 and 2.

[0021] An example of an embodiment in which step (B1) is performed after step (X1) will be described with reference to FIG. 1. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin and an anisotropic filler 5 is prepared on a substrate 1 to obtain a laminate A. In the embodiment shown in FIG. 1, the resin film 2 contains the anisotropic filler 5 before magnetic field alignment. (FIG. 1(1)) Next, the laminate A is placed on the magnet 3 and a magnetic field is applied. Thereby, the anisotropic filler 5 is magnetically aligned. (FIG. 1(2)) Next, a mask 8 is placed on the laminate A and irradiated with light 9. (FIG. 1(3)) Next, the uncured portion is removed (developed) to pattern the resin film 2. In this way, the heat conductive member 20 is obtained. (FIG. 1(4))

[0022] Another example of an embodiment in which step (B1) is performed after step (X1) will be described with reference to FIG. 2. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin is prepared on a substrate 1 to obtain a laminate A. In the embodiment shown in FIG. 2, the resin film 2 does not contain the anisotropic filler 5 before magnetic field alignment. (FIG. 2(1)) Next, the anisotropic filler 5 is sprinkled on the resin film 2 of the laminate A, the laminate A is placed on the magnet 3, and a magnetic field is applied. Thereby, the anisotropic filler 5 is magnetically aligned so as to be embedded in the resin film 2. (FIG. 2(2)) Next, a mask 8 is placed on the laminate A and irradiated with light 9. (FIG. 2(3)) Next, the uncured portion is removed (developed) to pattern the resin film 2. In this way, the heat conductive member 20 is obtained. (FIG. 2(4))

[0023] In the method for manufacturing a heat conductive member according to the first embodiment, it is preferable to further include a step (C1) of laminating a resin film 6 different from the resin film 2 on the resin film 2 after the step (X1). By laminating the resin film 6, the anisotropic filler 5 exposed from the surface of the resin film 2 can be covered with the resin film 6, whereby a heat conductive member in which the anisotropic filler 5 is not exposed from the surface can be obtained.

[0024] An embodiment in which step (X1) is performed after step (B1) will be described with reference to FIG. 3. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin and an anisotropic filler 5 is prepared on a substrate 1 to obtain a laminate A. In the embodiment shown in FIG. 3, the resin film 2 contains the anisotropic filler 5 before magnetic field alignment. (FIG. 3(1)) Next, a mask 8 is placed on the resin film 2 and irradiated with light 9. (FIG. 3(2)) Next, the uncured portion is removed (developed) to pattern the resin film 2. (FIG. 3(3)) Next, the laminate A is placed on a magnet 3 and a magnetic field is applied. As a result, the anisotropic filler 5 is magnetically aligned to obtain a heat conductive member 20. (FIG. 3(4), (5))

[0025] When step (X1) is performed after step (B1), it is preferable to further include a step (D1) of softening the patterned resin film between step (B1) and step (X1). This makes it easier for the anisotropic filler 5 to be aligned. The means for softening the resin film is not particularly limited. For example, the resin film can be softened by heating the resin film.

[0026] When step (X1) is performed after step (B1), the hardness of the resin film may be adjusted in advance to an appropriate range for the alignment of the anisotropic filler 5 at the time of forming the resin film. The means for adjusting the hardness of the resin film is not particularly limited. For example, the hardness of the resin film can be adjusted by adjusting the components of the resin film or the crosslink density of the resin film.

[0027] Whether step (B1) is performed after step (X1) or step (X1) is performed after step (B1), it is preferable that the resin film contains an anisotropic filler before step (X1) is performed. This makes it easier to adjust the content of the anisotropic filler (filler content, hereinafter referred to as FC) in the resin film. Regarding this point, before performing step (X1), by comparing with the case where the resin film does not contain the anisotropic filler, in this case, as described above, the anisotropic filler 5 is sprinkled on the resin film 2 of the laminate A, the laminate A is placed on the magnet 3, and a magnetic field is applied to embed the anisotropic filler 5 into the resin film 2. When orienting the anisotropic filler in this way, it is difficult to control how much of the anisotropic filler 5 sprinkled on the resin film 2 is embedded in the resin film 2. On the other hand, before performing step (X1), when the resin film contains the anisotropic filler, since the resin film is formed from the resin composition containing the anisotropic filler 5, the content of the anisotropic filler in the resin film can be easily controlled by controlling the amount of the anisotropic filler 5 blended in the resin composition.

[0028] If the FC can be adjusted, the ease of orientation of the anisotropic filler can thereby be adjusted. Specifically, if the FC in the resin film is too much, the resin film becomes hard, and the viscosity of the resin composition (varnish) serving as the raw material of the resin film increases, etc., making it difficult for the anisotropic filler to be oriented. However, by reducing the FC, such a situation can be prevented. On the other hand, if the FC is too little, the thermal conductivity becomes small. Therefore, the FC should be set to a certain amount or more according to the required thermal conductivity. Thus, the amount of FC should preferably be adjusted according to the case. Therefore, the ease of preparing the FC is advantageous for the manufacture of the thermal conductive member.

[0029] <Second Embodiment> Hereinafter, the manufacturing method of the thermal conductive member according to the second embodiment will be described with reference to FIG. 4.

[0030] The manufacturing method of the heat conductive member according to the second embodiment includes a step (X2) of magnetically orienting the anisotropic filler 5 on the sheet 12 having the adhesive resin layer (preferably an alkali-soluble adhesive resin layer) 10, a step (A2) of preparing a sheet having a resin film 2 made of a resin composition on the base material 1, a step (E2) of laminating the sheet 12 on which the anisotropic filler 5 is magnetically oriented on the resin film 2, a step (B2) of patterning the resin film 2, and a step (F2) of peeling off the sheet 12 having the adhesive resin layer 10.

[0031] An example of the manufacturing method of the heat conductive member according to the second embodiment will be described with reference to FIG. 4. First, a sheet 12 having an adhesive resin layer 10 is prepared on a light transmissive base material 11 formed of a light transmissive material such as PET. (FIG. 4(1)) Next, the anisotropic filler 5 is sprinkled on the adhesive resin layer 10 of the sheet 12, and the sheet 12 is placed on the magnet 3 with the adhesive resin layer 10 facing up, and a magnetic field is applied. As a result, the anisotropic filler 5 is magnetically oriented so as to be embedded in the adhesive resin layer 10. (FIG. 4(2)) Next, the sheet 12 on which the anisotropic filler 5 is magnetically oriented is laminated on the laminate A including the resin film 2 made of a resin composition containing a photosensitive resin, such that the resin film 2 and the adhesive resin layer 10 face each other. (FIG. 4(3)) Next, a mask 8 is placed on the light transmissive base material 11 of the sheet 12, and light 9 is irradiated. (FIG. 4(4)) Next, the sheet 12 is peeled off, and the uncured portion and the adhesive resin layer 10 are removed (preferably removed by an alkali solution), the resin film 2 is patterned, and the heat conductive member 20 is obtained. (FIG. 4(5))

[0032] In the manufacturing methods of the heat conductive members according to the first and second embodiments, it is preferable that the resin composition for forming the resin film includes a photosensitive resin composition. Thereby, curing by light irradiation becomes possible.

[0033] <Third Embodiment> Hereinafter, the manufacturing method of the heat conductive member according to the third embodiment will be described with reference to FIGS. 5 and 6.

[0034] The manufacturing method of the heat conductive member according to the third embodiment includes a step (A3) of preparing a sheet having a patterned resin film 13 made of a resin composition on a base material, and a step (X3) of magnetically orienting the anisotropic filler 5 inside the patterned resin film 13.

[0035] An example of the manufacturing method of the heat conductive member according to the third embodiment will be described with reference to FIG. 5. First, a sheet having a resin film 2 made of a resin composition containing a photosensitive resin is prepared on a base material 1 to obtain a laminate A. (FIG. 5(1)) Next, a mask 8 is placed on the resin film 2, and light 9 is irradiated. (FIG. 5(2)) Next, the uncured portion is removed (developed) to form the resin film 2 into a pattern, thereby obtaining a patterned resin film 13. (FIG. 5(3)) Next, the anisotropic filler 5 is sprinkled on the patterned resin film 13 of the laminate A, and the laminate A is placed on the magnet 3 and a magnetic field is applied. Thereby, the anisotropic filler 5 is magnetically oriented to obtain a heat conductive member 20. (FIG. 5(4), (5))

[0036] Another example of the manufacturing method of the heat conductive member according to the third embodiment will be described with reference to FIG. 6. First, a sheet having a patterned resin film 13 is prepared on a base material 1 by an arbitrary method such as inkjet printing to obtain a laminate A. (FIG. 6(1)) Next, the anisotropic filler 5 is sprinkled on the patterned resin film 13 of the laminate A, and the laminate A is placed on the magnet 3 and a magnetic field is applied. Thereby, the anisotropic filler 5 is magnetically oriented. Then, the patterned resin film 13 is cured by an arbitrary method such as heating or light irradiation to obtain a heat conductive member 20. (FIG. 6(2), (3))

[0037] In the manufacturing method of the heat conductive member according to the third embodiment, it is preferable that the resin composition for forming the resin film contains a photosensitive resin composition. Thereby, curing by light irradiation becomes possible.

[0038] In the method for manufacturing a thermally conductive member according to the third embodiment, it is preferable that the resin composition for forming the resin film includes a thermosetting resin composition. This enables curing by heating.

[0039] <Ultrasonic irradiation> In the method for manufacturing a thermally conductive member according to the present embodiment, in step (X1), (X2) or (X3), it is preferable to irradiate the anisotropic filler 5 with ultrasonic waves. This makes it easier for the anisotropic filler 5 to be oriented. For example, even when the viscosity of the resin composition (varnish) is high due to a large amount of FC and it is difficult for the anisotropic filler 5 to be oriented, irradiating the anisotropic filler 5 with ultrasonic waves makes it easier for the filler 5 to be oriented.

[0040] <Each component> Hereinafter, each component included in the thermally conductive member according to the present embodiment will be described.

[0041] The thermally conductive member according to the present embodiment includes an anisotropic filler. In the present embodiment, the anisotropic filler refers to a filler that imparts anisotropy to the thermally conductive member when blended therewith. Anisotropy generally refers to the fact that physical properties are different depending on the direction, but in the present embodiment, it refers to the fact that thermal conductivity is different depending on the direction. That is, when the anisotropic filler in the present embodiment is blended, a thermally conductive member having different thermal conductivities depending on the direction can be obtained.

[0042] The shape of the anisotropic filler is preferably scaly from the viewpoint of further improving the thermal conductivity of the thermally conductive member. The scaly anisotropic filler may be monodisperse particles or aggregated particles, but is preferably aggregated particles from the viewpoint of further improving the thermal conductivity of the thermally conductive member. The aggregated particles of the scaly anisotropic filler may be sintered particles or non-sintered particles.

[0043] The anisotropic filler preferably contains one or more selected from the group consisting of boron nitride, aluminum nitride, alumina, and graphite, more preferably contains one or more selected from the group consisting of boron nitride, aluminum nitride, and alumina, and still more preferably contains boron nitride, from the viewpoint of further improving the thermal conductivity of the thermally conductive member.

[0044] The median diameter D of the anisotropic filler based on volume 50 is preferably 20 μm or more, more preferably 30 μm or more, still more preferably 50 μm or more, from the viewpoint of further improving the thermal conductivity of the thermally conductive member, and is preferably 100 μm or less, still more preferably 80 μm or less, from the viewpoint of further improving the performance balance such as moldability, appearance, and flexibility of the thermally conductive member. Here, the median diameter D of the anisotropic filler based on volume 50 is the median diameter (D 50 ) when the particle size distribution is measured based on volume by a laser diffraction particle size distribution measuring device.

[0045] The content of the anisotropic filler with respect to 100 parts by mass of the thermally conductive member is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, still more preferably 30 parts by mass or more, still more preferably 40 parts by mass or more, still more preferably 50 parts by mass or more, from the viewpoint of further improving the thermal conductivity of the thermally conductive member, and is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably 70 parts by mass or less, still more preferably 60 parts by mass or less, from the viewpoints of improving the moldability of the thermally conductive member and facilitating the orientation of the anisotropic filler.

[0046] The thickness T of the resin film c to the median diameter D of the anisotropic filler 50 ratio (D 50 / T c ) is preferably 1.1 or more from the viewpoint of further improving the thermal conductivity of the thermally conductive member, and is preferably 5.0 or less from the viewpoints of further improving the moldability, appearance, flexibility, etc. of the thermally conductive member.

[0047] In the method for manufacturing a thermally conductive member according to the present embodiment, it is preferable to include a step of treating the surface of the anisotropic filler with a coupling agent. Thereby, the compatibility between the anisotropic filler and the organic component is improved, and the dispersibility of the anisotropic filler is enhanced. The type of the coupling agent is not particularly limited, and known ones can be used. For example, a silane coupling agent can be mentioned. Examples of the silane coupling agent include vinyl group-containing silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy group-containing silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; (meth)acrylic group-containing silane coupling agents such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane.

[0048] The resin composition according to the present embodiment preferably contains a (meth)acrylic resin. In addition, the notation "(meth)acrylic" in this specification represents a concept including both acrylic and methacrylic. The same applies to similar notations such as "(meth)acrylate" and "(meth)acryloyl".

[0049] The type of the (meth)acrylic resin is not particularly limited. For example, a resin obtained by polymerizing a monomer containing a (meth)acrylate ester as a main component (50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more) can be used. (Meth)acrylic esters include, for example, one or more selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-propyl (meth)acrylate, chloro-2-hydroxyethyl (meth)acrylate, diethylene glycol mono(meth)acrylate, methoxyethyl (meth)acrylate, glycidyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and isobornyl (meth)acrylate.

[0050] When the resin composition according to this embodiment contains a (meth)acrylic resin, the content of the (meth)acrylic resin with respect to 100 parts by mass of the resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, still more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more, still more preferably 20 parts by mass or more, from the viewpoint of further improving the moldability, appearance, flexibility, etc. of the heat conductive member, and preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably 70 parts by mass or less, still more preferably 60 parts by mass or less, still more preferably 5 parts by mass or less from the viewpoint of further improving the heat conductivity of the heat conductive member.

[0051] The resin composition according to this embodiment preferably contains an epoxy resin.

[0052] The type of the epoxy resin is not particularly limited. For example, bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylenediisoprene) bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylenediisoprene) bisphenol type epoxy resin), bisphenol Z type epoxy resin (4,4'-cyclohexadiene bisphenol type epoxy resin); novolak type epoxy resins such as phenol novolak type epoxy resin, cresol novolak type epoxy resin, tetraphenol group ethane type novolak type epoxy resin, novolak type epoxy resin having a condensed ring aromatic hydrocarbon structure; epoxy resins having a biphenyl skeleton; arylalkylene type epoxy resins such as xylylene type epoxy resin, epoxy resin having a biphenylaralkyl skeleton; naphthylene ether type epoxy resin; naphthol type epoxy resin; naphthalenediol type epoxy resin; bifunctional to tetrafunctional epoxy type naphthalene resins such as 1,6-dihydroxynaphthalene type epoxy resin, 2,7-dihydroxynaphthalene type epoxy resin, 1,5-dihydroxynaphthalene type epoxy resin, 1,4-dihydroxynaphthalene type epoxy resin, 2,6-dihydroxynaphthalene type epoxy resin; binaphthyl type epoxy resin; naphthalene type epoxy resins such as epoxy resin having a naphthalene aralkyl skeleton; anthracene type epoxy resin; epoxy resin having a dicyclopentadiene skeleton; norbornene type epoxy resin; epoxy resin having an adamantane skeleton; fluorene type epoxy resin;It contains one or more selected from the group consisting of epoxy resins having a phenol aralkyl skeleton, preferably one or more selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, epoxy resin having a dicyclopentadiene skeleton, epoxy resin having a biphenyl skeleton, epoxy resin having an adamantane skeleton, naphthalenediol type epoxy resin, epoxy resin having a phenol aralkyl skeleton, epoxy resin having a biphenyl aralkyl skeleton, and epoxy resin having a naphthalene aralkyl skeleton.;

[0053] When the resin composition according to this embodiment contains an epoxy resin, the content of the epoxy resin with respect to 100 parts by mass of the resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, still more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more, still more preferably 20 parts by mass or more from the viewpoint of further improving the performance balance such as the moldability, appearance and flexibility of the heat conductive member, and preferably 90 parts by mass or less, more preferably 80 parts by mass or less, still more preferably 70 parts by mass or less, still more preferably 60 parts by mass or less, still more preferably 50 parts by mass or less from the viewpoint of further improving the thermal conductivity of the heat conductive member.

[0054] The resin composition according to this embodiment preferably contains a solvent. By blending a solvent into the resin composition, the viscosity of the resin composition can be lowered, whereby the anisotropic filler 5 becomes more likely to be oriented.

[0055] The type of the solvent is not particularly limited. For example, alcohols such as ethyl alcohol, propyl alcohol, butyl alcohol, pentyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, nonyl alcohol, decyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, methyl methoxybutanol, α-terpineol, β-terpineol, hexylene glycol, benzyl alcohol, 2-phenylethyl alcohol, isopalmitic alcohol, isostearyl alcohol, lauryl alcohol, ethylene glycol, propylene glycol or glycerin; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, diacetone alcohol (4-hydroxy-4-methyl-2-pentanone), 2-octanone, isophorone (3,5,5-trimethyl-2-cyclohexen-1-one) or diisobutyl ketone (2,6-dimethyl-4-heptanone); esters such as ethyl acetate, butyl acetate, diethyl phthalate, dibutyl phthalate, acetoxyethane, methyl butyrate, methyl hexanoate, methyl octanoate, methyl decanoate, methyl cellosolve acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, 1,2-diacetoxyethane, tributyl phosphate, tricresyl phosphate or tripentyl phosphate; ethers such as tetrahydrofuran, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, propylene glycol dimethyl ether, ethoxyethyl ether, 1,2-bis(2-diethoxy)ethane or 1,2-bis(2-methoxyethoxy)ethane, ethylene glycol mono-2-ethylhexyl ether, tripropylene glycol mono n-butyl ether; ester ethers such as 2-(2-butoxyethoxy)ethyl acetate;One or more selected from the group consisting of ether alcohols such as 2-(2-methoxyethoxy)ethanol; hydrocarbons such as toluene, xylene, n-paraffin, isoparaffin, dodecylbenzene, turpentine oil, kerosene or light oil; nitriles such as acetonitrile or propionitrile; amides such as acetamide or N,N-dimethylformamide; silicone oils such as low molecular weight volatile silicone oil and volatile organically modified silicone oil, more preferably one or more selected from the group consisting of ethers such as tetrahydrofuran, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, propylene glycol dimethyl ether, ethoxyethyl ether, 1,2-bis(2-diethoxy)ethane or 1,2-bis(2-methoxyethoxy)ethane, ethylene glycol-mono-2-ethylhexyl ether, tripropylene glycol mono n-butyl ether, and even more preferably one or two selected from the group consisting of ethylene glycol-mono-2-ethylhexyl ether and tripropylene glycol mono n-butyl ether.;

[0056] When the resin composition according to this embodiment contains a solvent, the content of the solvent with respect to 100 parts by mass of the resin composition is preferably 1 part by mass or more, more preferably 5 parts by mass or more, even more preferably 10 parts by mass or more, from the viewpoints of improving the moldability of the heat conductive member and facilitating the orientation of the anisotropic filler, and is preferably 80 parts by mass or less, more preferably 60 parts by mass or less, even more preferably 40 parts by mass or less, from the viewpoint of reducing the labor of volatilizing the solvent etc..

[0057] The resin composition according to this embodiment preferably contains a thermosetting initiator.

[0058] Examples of the thermosetting initiator include a thermal radical generator that generates radicals by heating and a thermal cation generator that generates cations by heating etc.. Examples of the thermal radical initiator include azo compounds such as 2,2'-azobisbutyronitrile (AIBN) and peroxides such as benzoyl peroxide (BPO). Examples of the thermal cation initiator include iodonium salts and sulfonium salts. Commercially available products include the Sun-Aid series manufactured by Sanshin Chemical Industry Co., Ltd. and the Adeka Optomer series manufactured by ADEKA Corporation.

[0059] When the resin composition according to this embodiment contains a thermal curing initiator, the content of the thermal curing initiator is not particularly limited and can be arbitrarily set as needed.

[0060] The resin composition according to this embodiment preferably contains a photoinitiator.

[0061] Examples of the photoinitiator include a photo radical initiator that generates radicals by light irradiation and a photo cation initiator that generates cations by light irradiation. Examples of the photo radical initiator include benzoin derivatives, benzyl ketals, acetophenones, acylphosphine oxides, benzophenones, Michler's ketones, or thioxanthones. Commercially available products include the Irgacure series of IGM resins. Examples of the photo cation initiator include iodonium salts and sulfonium salts. Commercially available products include the CPI series and the IK series of SunApro Co., Ltd.

[0062] When the resin composition according to this embodiment contains a photoinitiator, the content of the photoinitiator is not particularly limited and can be arbitrarily set as needed.

[0063] The resin composition according to this embodiment may contain components other than those described above. For example, it may contain known components such as polymerization inhibitors, defoamers, surfactants, and colorants. The content of these other components can be arbitrarily set as needed.

[0064] The base material constituting the heat conductive member according to the present embodiment preferably includes a metal foil.

[0065] The type of the metal foil is not particularly limited, but from the viewpoint of good workability, it preferably includes one or more selected from the group consisting of copper foil, silver foil, gold foil, and aluminum foil, more preferably includes one or more selected from the group consisting of copper foil and aluminum foil, and still more preferably includes copper foil. <Physical properties of the heat conductive member, etc.> Hereinafter, the physical properties of the heat conductive member according to the present embodiment will be described.

[0066] The heat conductive member according to the first embodiment includes one or more selected from the group consisting of anisotropic fillers made of boron nitride and graphite, and it is preferable that the heat conductive member satisfies the following formula (1). C F ×I 100 / I 002 ≧2.4 (1) (In formula (1), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (2), C F =V F / (V F +V R ) (2) In formula (2), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, X-ray diffraction is performed by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°.

[0067] The volume V of the anisotropic filler in the resin filmF can be calculated from the content of the anisotropic filler and the specific gravity of the anisotropic filler. When the resin film does not contain fillers other than the anisotropic filler, the volume V of the anisotropic filler in the resin film is subtracted from the volume of the resin film, and the resulting volume can be defined as the volume V F of the resin component in the resin film. When the resin film contains fillers other than the anisotropic filler, the volume obtained by subtracting the volume V of the anisotropic filler and the volume of the fillers other than the anisotropic filler from the volume of the resin film can be defined as the volume V R of the resin component in the resin film. F In Equation (1), I R is the diffraction peak intensity of the 002 plane (2θ is approximately 27°) perpendicular to the plane direction of the anisotropic filler, and I

[0068] is the diffraction peak intensity of the 100 plane (2θ is approximately 42°) parallel to the plane direction of the anisotropic filler. Therefore, the fact that the value of I 002 / I 100 is equal to or greater than a certain value means that the plane direction of the anisotropic filler is parallel to the thickness direction of the heat conductive member, that is, the orientation degree of the anisotropic filler is equal to or greater than a certain value. 100 / I 002 Also, C is the filling rate of the anisotropic filler. F Therefore, Equation (1) is an equation indicating that the filling rate of the anisotropic filler is equal to or greater than a certain value and the orientation degree of the anisotropic filler is equal to or greater than a certain value. In the heat conductive member of the first embodiment, the value of C

[0069] ×I F / I 100 / I 002 is preferably 3.0 or more, more preferably 5.0 or more, still more preferably 7.0 or more, still more preferably 7.5 or more, still more preferably 8.0 or more, still more preferably 9.0 or more, still more preferably 10.0 or more, still more preferably 11.0 or more from the viewpoint of further improving the thermal conductivity.

[0070] In the heat conductive member of the first embodiment, C FThe value is preferably 10% by volume or more, more preferably 30% by volume or more, still more preferably 50% by volume or more, still more preferably 55% by volume or more, still more preferably 60% by volume or more, still more preferably 65% by volume or more from the viewpoint of further improving thermal conductivity, and is preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less, still more preferably 75% by volume or less from the viewpoint of the balance between thermal conductivity and production efficiency.

[0071] The heat conductive member of the first embodiment preferably satisfies the following formula (3) from the viewpoint of improving the performance balance between thermal conductivity and production efficiency. C F ×I 100 / I 002 ≦20.0 (3) In formula (3), C F 、I 100 and I 002 are defined in the same way as in formula (1).

[0072] In the heat conductive member of the first embodiment, C F ×I 100 / I 002 The value is preferably 18.0 or less, more preferably 16.0 or less, still more preferably 15.0 or less, still more preferably 14.5 or less, still more preferably 14.0 or less, still more preferably 13.5 or less, still more preferably 13.0 or less from the viewpoint of improving the performance balance between thermal conductivity and production efficiency.

[0073] In the heat conductive member of the first embodiment, D 50 / T c The value is preferably 1.1 or more, more preferably 1.2 or more, still more preferably 1.3 or more, still more preferably 1.4 or more, still more preferably 1.5 or more, and is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.0 or less, still more preferably 2.8 or less, still more preferably 2.6 or less, still more preferably 2.4 or less, still more preferably 2.3 or less. D 50 / T cSince the value is within the above range, the thermal conductivity of the thermally conductive member can be further improved.

[0074] In the thermally conductive member according to the second embodiment, the anisotropic filler contains aluminum nitride, and it is preferable that the thermally conductive member satisfies the following formula (4). C F ×I 100 / I 002 ≧1.0 (4) (In formula (4), I 002 is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I 100 is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C F is the filling rate of the anisotropic filler, which is represented by the following formula (5), C F =V F / (V F +V R ) (5) In formula (5), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, with the scanning axis 2θ / θ, sampling width 0.02°, scan speed 2° / min, incident angle 5°, and reflection angle 5°, irradiate the thermally conductive member with X-rays in the thickness direction to perform X-ray diffraction.

[0075] The calculation method of the volume V F of the anisotropic filler in the resin film and the volume V R of the resin component in the resin film is as described above.

[0076] In formula (4), I 002 is the diffraction peak intensity of the 002 plane (2θ is about 36.5°) perpendicular to the plane direction of the anisotropic filler, and I 100 is the diffraction peak intensity of the 100 plane (2θ is about 33.2°) parallel to the plane direction of the anisotropic filler. Therefore, I 100 / I 002The fact that the value of is equal to or greater than a certain value means that the planar direction of the anisotropic filler is parallel to the thickness direction of the heat conductive member, that is, the degree of orientation of the anisotropic filler is equal to or greater than a certain value. F Also, C is the filling rate of the anisotropic filler.

[0077] In the heat conductive member of the second embodiment, C F × I 100 / I 002 From the viewpoint of further improving the thermal conductivity, the value is preferably 1.5 or more, more preferably 2.0 or more, still more preferably 2.5 or more, still more preferably 3.0 or more, and still more preferably 3.4 or more.

[0078] In the heat conductive member of the second embodiment, C F From the viewpoint of further improving the thermal conductivity, the value is preferably 10% by volume or more, more preferably 30% by volume or more, still more preferably 50% by volume or more, still more preferably 55% by volume or more, still more preferably 60% by volume or more, and still more preferably 65% by volume or more. And from the viewpoint of improving the performance balance between thermal conductivity and production efficiency, it is preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less, and still more preferably 75% by volume or less.

[0079] The heat conductive member of the second embodiment preferably satisfies the following formula (6) from the viewpoint of improving the performance balance between thermal conductivity and production efficiency. C F × I 100 / I 002 ≦ 10.0 (6) In formula (6), C F , I 100 and I 002 are defined in the same way as in formula (4).

[0080] In the heat conductive member of the second embodiment, CF ×I 100 / I 002 The value of is preferably 9.0 or less, more preferably 8.0 or less, still more preferably 7.0 or less, still more preferably 6.5 or less, and still more preferably 6.0 or less from the viewpoint of improving the performance balance between thermal conductivity and production efficiency.

[0081] In the heat conductive member of the second embodiment, D 50 / T c The value of is preferably 1.1 or more, more preferably 1.2 or more, still more preferably 1.3 or more, still more preferably 1.4 or more, and still more preferably 1.5 or more, and is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.0 or less, still more preferably 2.8 or less, still more preferably 2.6 or less, still more preferably 2.4 or less, and still more preferably 2.3 or less. When the value of D 50 / T c is within the above range, the thermal conductivity of the heat conductive member can be further improved.

[0082] The heat conductive member according to the third embodiment preferably contains alumina as the anisotropic filler and the heat conductive member satisfies the following formula (7). C F ×I 113 / I 006 ≧5.0 (7) (In formula (7), I 006 is the diffraction peak intensity of the 006 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], I 113 is the diffraction peak intensity of the 113 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], C F is the filling rate of the anisotropic filler, which is represented by the following formula (8), C F =V F / (V F +V R ) (8) In formula (8), V F is the volume of the anisotropic filler in the resin film, and V R is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, X-ray diffraction is performed by irradiating X-rays in the thickness direction of the heat conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scan speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°.

[0083] The volume V of the anisotropic filler in the resin film F and the volume V of the resin component in the resin film R are calculated as described above.

[0084] In Equation (7), I 006 is the diffraction peak intensity of the 006 plane (2θ is approximately 41.6°) perpendicular to the plane direction of the anisotropic filler, and I 113 is the diffraction peak intensity of the 113 plane (2θ is approximately 43.3°) parallel to the plane direction of the anisotropic filler. Therefore, the fact that the value of I 113 / I 006 is equal to or greater than a certain value means that the plane direction of the anisotropic filler is parallel to the thickness direction of the heat conductive member, that is, the orientation degree of the anisotropic filler is equal to or greater than a certain value. Also, C F is the filling rate of the anisotropic filler. Therefore, Equation (7) is an equation indicating that the filling rate of the anisotropic filler is equal to or greater than a certain value and the orientation degree of the anisotropic filler is equal to or greater than a certain value.

[0085] In the heat conductive member of the third embodiment, the value of C F ×I 113 / I 006 is preferably 6.0 or more, more preferably 7.0 or more, and still more preferably 10.0 or more from the viewpoint of further improving the thermal conductivity.

[0086] In the heat conductive member of the third embodiment, C FThe value is preferably 10% by volume or more, more preferably 30% by volume or more, still more preferably 50% by volume or more, still more preferably 55% by volume or more, still more preferably 60% by volume or more, still more preferably 65% by volume or more from the viewpoint of further improving the thermal conductivity, and is preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less, still more preferably 75% by volume or less from the viewpoint of the balance between the thermal conductivity and the production efficiency.

[0087] In the heat conductive member of the third embodiment, from the viewpoint of improving the performance balance between the thermal conductivity and the production efficiency, preferably, the heat conductive member satisfies the following formula (9). C F ×I 113 / I 006 ≦50.0 (9) In formula (9), C F 、I 006 およびI 113 are defined in the same way as in formula (7).

[0088] In the heat conductive member of the third embodiment, C F ×I 113 / I 006 The value of is preferably 48.0 or less, more preferably 45.0 or less, still more preferably 43.0 or less, still more preferably 41.0 or less, still more preferably 40.0 or less from the viewpoint of improving the performance balance between the thermal conductivity and the production efficiency.

[0089] In the heat conductive member of the third embodiment, D 50 / T c The value of is preferably 1.1 or more, more preferably 1.2 or more, still more preferably 1.3 or more, still more preferably 1.4 or more, still more preferably 1.5 or more, and is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, still more preferably 3.0 or less, still more preferably 2.8 or less, still more preferably 2.6 or less, still more preferably 2.4 or less, still more preferably 2.3 or less. D 50 / T cWhen the value is within the above range, the thermal conductivity of the thermally conductive member can be further improved.

[0090] The thermally conductive member according to this embodiment may be in a B-stage state or a C-stage state.

[0091] [Thermally Conductive Member] The thermally conductive member of this embodiment is obtained by the above method for manufacturing a thermally conductive member.

[0092] The above thermally conductive member includes a patterned resin film. Further, the above thermally conductive member includes oriented anisotropic fillers. Thereby, the above thermally conductive member can be selectively applied to a site with a large amount of heat generation, and the thermal conductivity is improved.

[0093] The thermally conductive member of this embodiment can be used in various applications where thermal conductivity is required, for example, it can be used in electronic devices such as semiconductor devices.

[0094] [Electronic Device] The electronic device of this embodiment will be described with reference to FIG. 7. The electronic device 40 of this embodiment includes the above thermally conductive member 20 and an electronic component 30 on the above thermally conductive member.

[0095] The above thermally conductive member 20 includes a patterned resin film 13. Further, the above thermally conductive member 20 includes oriented anisotropic fillers 5. Thereby, the above thermally conductive member 20 can be selectively applied to a site with a large amount of heat generation, and the thermal conductivity is improved. Therefore, the electronic device 40 of this embodiment including the above thermally conductive member 20 has improved thermal conductivity.

[0096] The type of the electronic component is not particularly limited. For example, a power semiconductor element may be used as the electronic component, and the electronic device may be a power module. The power semiconductor device uses a wide bandgap material such as SiC, GaN, Ga2O3, or diamond, and is designed to be used at high voltage and high current. Therefore, it generates more heat than a normal silicon chip (semiconductor device), and thus operates in a high-temperature environment. For example, the power semiconductor device is required to be used for a long time in a high-temperature operating environment of 200 °C or higher, 250 °C or higher, etc. Since the heat conductive member of the present embodiment has improved heat conductivity, it can be suitably used for the power semiconductor device. Examples of the power semiconductor device include a rectifier diode, a power transistor, a power MOSFET, an insulated gate bipolar transistor (IGBT), a thyristor, a gate turn-off thyristor (GTO), a triac, and the like.

[0097] As described above, the embodiments of the present invention have been described, but these are examples of the present invention, and various configurations other than the above can also be adopted. Further, the present invention is not limited to the foregoing embodiments, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are included in the present invention.

Examples

[0098] Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples as long as the gist thereof is not exceeded.

[0099] (Examples 1 to 3 and Comparative Example 1) First, a resin composition was applied onto a base material (copper foil) to form a resin film. Note that the thickness T of the resin film after curing c varies for each example and comparative example. The T of each example and comparative example c is shown in Table 1. Note that the median diameter D of the flaky boron nitride 50 was obtained by measuring the particle size distribution of the particles on a volume basis using a laser diffraction particle size distribution measuring device (manufactured by Horiba, Ltd., model name: HORIBA LA-950V2). The median diameter D of the flaky boron nitride of each example and comparative example50 It is shown in Table 1. The resin composition is obtained by blending a flaky boron nitride (manufactured by Sanwa Materials Co., Ltd.) surface-treated with 3-(methacryloyloxy)propyltrimethoxysilane into a (meth)acrylic photosensitive resin varnish so that the filler filling rate C after curing F becomes the value described in Table 1. The (meth)acrylic photosensitive resin varnish contains methacrylate, bisphenol F type epoxy resin, and acetophenone. The volume V of the anisotropic filler in the resin film F is calculated from the content of the anisotropic filler and the specific gravity of the anisotropic filler. Also, the volume V of the resin component in the resin film R is calculated by subtracting the volume V of the anisotropic filler in the resin film from the volume of the resin film. F

[0100] Next, the substrate on which the resin film is formed is placed on the S pole of a neodymium magnet with a magnetic force of 0.4 T so that the substrate side faces the magnet side, and dried at 100 °C for 30 minutes while applying ultrasonic waves (frequency 40 kHz, intensity 120 W) to orient the flaky boron nitride in a magnetic field.

[0101] Next, vacuum lamination is performed at 120 °C and 0.5 MPa for 30 seconds to defoam the resin film. Next, a mask is placed on the resin film, and ultraviolet light with a wavelength of 256 nm is irradiated at an irradiation intensity of 6 mJ / cm 2 for 200 seconds. Next, the uncured portion is removed to obtain a patterned resin film. Next, the patterned resin film is heated at 180 °C for 60 minutes to cure it, and a heat conductive member is obtained.

[0102] (Comparative Example 2) A heat conductive member was obtained in the same manner as in Example 1 except that the flaky boron nitride was not oriented in a magnetic field.

[0103] X-ray diffraction of the heat conductive members of each Example and Comparative Example was performed by the following [X-ray diffraction method]. [X-ray diffraction method] Using the Rigaku X-ray diffractometer "Rigaku UltimaIV", with CuKα rays as the radiation source, under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scan speed of 2° / min, an incident angle of 5°, and a reflection angle of 5°, X-rays were irradiated in the thickness direction of the thermal conductivity member to perform X-ray diffraction. The I 100 / I 002 and C F ×I 100 / I 002 values of the thermal conductivity members of each example and comparative example are shown in Table 1.

[0104] The thermal conductivity of the thermal conductivity members of each example and comparative example was measured by the following [Thermal Conductivity Measurement Method]. The results are shown in Table 1. [Thermal Conductivity Measurement Method] In accordance with JIS R 1611, using a laser flash method, the thermal conductivity of the thermal conductivity member in the thickness direction at 25°C was measured using thermal conductivity measurement equipment (manufactured by Netzsch, equipment name: LFA447 NanoFlash). The results are shown in Table 1.

[0105]

Table 1

[0106] The thermal conductivity of the thermal conductivity member of the example was higher than that of the thermal conductivity member of the comparative example. From this, it can be seen that the thermal conductivity member of this example has improved thermal conductivity. Also, from Example 2, it can be seen that even when the filling rate of the filler is low, if the filler is oriented, the thermal conductivity tends to increase.

Explanation of Signs

[0107] 1 Substrate 2 Resin film 3 Magnet 5 Anisotropic filler 8 Mask 9 Light 10 Adhesive resin layer 11 Light-transmissive substrate 12 Sheet 13 Pattern-shaped resin film 20 Heat conductive member 30 Electronic component 40 Electronic device A Laminate A B Laminate B

Claims

1. A method for manufacturing a thermally conductive member including a patterned resin film containing an anisotropic filler, the method for manufacturing a thermally conductive member including a step (X) of magnetically orienting the anisotropic filler.

2. A step (A1) of preparing a sheet having a resin film made of a resin composition on a substrate, a step (X1) of magnetically orienting the anisotropic filler inside the resin film, and a step (B1) of patterning the resin film, The method for manufacturing a thermally conductive member according to claim 1, comprising:

3. The method for manufacturing a thermally conductive member according to claim 2, wherein the step (B1) is performed after the step (X1).

4. The method for manufacturing a thermally conductive member according to claim 2 or 3, further comprising a step (C1) of laminating a resin film different from the resin film on the resin film after the step (X1).

5. The method for manufacturing a thermally conductive member according to claim 2, wherein the step (X1) is performed after the step (B1).

6. The method for manufacturing a thermally conductive member according to claim 5, further comprising a step (D1) of softening the patterned resin film between the step (B1) and the step (X1).

7. The method for manufacturing a thermally conductive member according to claim 2, wherein the resin film contains the anisotropic filler at a point in time before performing the step (X1).

8. A step (X2) of magnetically orienting the anisotropic filler on a sheet having an adhesive resin layer, a step (A2) of preparing a sheet having a resin film made of a resin composition on a substrate, a step (E2) of laminating the sheet on which the anisotropic filler is magnetically oriented on the resin film, a step (B2) of patterning the resin film, and a step (F2) of peeling off the sheet having the adhesive resin layer, The method for manufacturing a thermally conductive member according to claim 1, comprising:

9. The method for manufacturing a thermally conductive member according to claim 2 or 8, wherein the resin composition contains a photosensitive resin composition.

10. A step (A3) of preparing a sheet having a patterned resin film made of a resin composition on a substrate, and a step (X3) of magnetically orienting the anisotropic filler inside the patterned resin film, The method for manufacturing a thermally conductive member according to claim 1, comprising:

11. The method for manufacturing a thermally conductive member according to claim 10, wherein the resin composition contains a photosensitive resin composition.

12. The method for manufacturing a thermally conductive member according to claim 10, wherein the resin composition contains a thermosetting resin composition.

13. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein in the step (X1), (X2) or (X3), ultrasonic waves are irradiated onto the anisotropic filler.

14. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the shape of the anisotropic filler is flaky.

15. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the anisotropic filler contains one or more selected from the group consisting of boron nitride, aluminum nitride, alumina and graphite.

16. The median diameter D on a volume basis of the anisotropic filler ５０ is 20 μm or more and 100 μm or less, and the method for producing a thermally conductive member according to claim 2, 8, or 10.

17. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the content of the anisotropic filler with respect to 100 parts by mass of the thermally conductive member is 10 parts by mass or more and 90 parts by mass or less.

18. The thickness T of the resin film ｃ The median diameter D of the anisotropic filler relative to ５０ The ratio (D ５０ / T ｃ ) is 1.1 or more and 5.0, The method for manufacturing a thermally conductive member according to claim 2, 8 or 10.

19. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, including a step of treating the surface of the anisotropic filler with a coupling agent.

20. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the resin composition contains a (meth)acrylic resin.

21. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the resin composition contains an epoxy resin.

22. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the resin composition contains a solvent.

23. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the resin composition contains a thermal curing initiator.

24. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the resin composition contains a photo-curing initiator.

25. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the substrate contains a metal foil.

26. The method for manufacturing a thermally conductive member according to claim 25, wherein the metal foil contains a copper foil.

27. The anisotropic filler contains one or more selected from the group consisting of boron nitride and graphite, The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the thermally conductive member satisfies the following formula (1). C Ｆ × I １００ / I ００２ ≥ 2.4 (1) (In the above formula (1), I ００２ is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I １００ is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Ｆ is the filling rate of the anisotropic filler, which is represented by the following formula (2), C Ｆ = V Ｆ / (V Ｆ + V Ｒ ) (2) In the formula (2), V Ｆ is the volume of the anisotropic filler in the resin film, and V Ｒ is the volume of the resin component in the resin film). [X-ray diffraction method] Using CuKα rays as the radiation source, X-rays are irradiated in the thickness direction of the thermally conductive member under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° to perform X-ray diffraction.

28. The anisotropic filler contains aluminum nitride, The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the thermally conductive member satisfies the following formula (4). C Ｆ × I １００ / I ００２ ≥ 1.0 (4) (In the above formula (4), I ００２ is the diffraction peak intensity of the 002 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I １００ is the diffraction peak intensity of the 100 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Ｆ is the filling rate of the anisotropic filler, which is represented by the following formula (5), C Ｆ = V Ｆ / (V Ｆ + V Ｒ ) (5) In the formula (5), V Ｆ is the volume of the anisotropic filler in the resin film, and V Ｒ is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, irradiate the thermally conductive member with X-rays in the thickness direction under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° to perform X-ray diffraction

29. wherein the anisotropic filler contains alumina, The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the thermally conductive member satisfies the following formula (7). C Ｆ × I １１３ / I ００６ ≥ 5.0 (7) (In the above formula (7), I ００６ is the diffraction peak intensity of the 006 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and I １１３ is the diffraction peak intensity of the 113 plane of the X-ray diffraction chart obtained by the following [X-ray diffraction method], and C Ｆ is the filling rate of the anisotropic filler, which is represented by the following formula (8), C Ｆ = V Ｆ / (V Ｆ + V Ｒ ) (8) In the formula (8), V Ｆ is the volume of the anisotropic filler in the resin film, and V Ｒ is the volume of the resin component in the resin film) [X-ray diffraction method] Using CuKα rays as the radiation source, irradiate the thermally conductive member with X-rays in the thickness direction under the conditions of a scanning axis of 2θ / θ, a sampling width of 0.02°, a scanning speed of 2° / min, an incident angle of 5°, and a reflection angle of 5° to perform X-ray diffraction

30. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the thermally conductive member is in a B-stage state.

31. The method for manufacturing a thermally conductive member according to claim 2, 8 or 10, wherein the thermally conductive member is in a C-stage state.

32. A thermally conductive member obtained by the method for manufacturing a thermally conductive member according to claim 2, 8 or 10.

33. A thermally conductive member according to claim 32, an electronic component on the thermally conductive member, and an electronic device comprising the same.

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