Resin composition

Abstract

To provide a resin composition that reduces a decrease in glass viscosity and makes the glass less likely to be over-sintered, when the resin composition is subjected to sintering together with a conductive layer (in particular, a conductive layer containing Ag).SOLUTION: A resin composition includes a glass frit, an inorganic filler, an alkali-soluble resin, a photosensitive monomer, and a photopolymerization initiator, where the rate of decrease in the complex viscosity of the glass frit with 7 wt.% or less of Ag added to the glass frit is less than 40% at 900°C, and less than 60% at 926°C, as compared with a case without Ag added.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a resin composition.

Background Art

[0002] In order to form an insulating layer of an electronic component, an insulating paste containing glass powder may be used as in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When manufacturing an electronic component, an insulating layer formed from a resin composition containing glass powder may be laminated and sintered together with a conductive layer. The present inventor has found that the glass in the insulating layer adjacent to the conductive layer is likely to be over-sintered during sintering, which may cause defects such as voids in the insulating layer near the interface between the insulating layer and the conductive layer.

[0005] The present disclosure has been made in view of the above problems. That is, the present disclosure provides a resin composition capable of producing an insulating layer in which the glass in the insulating layer is hardly over-sintered when sintered together with a conductive layer (particularly, a conductive layer containing Ag).

Means for Solving the Problems

[0006] In the present disclosure including glass frit, an inorganic filler, an alkali-soluble resin, a photosensitive monomer, and a photopolymerization initiator, When 7% by weight of Ag is added to the glass frit, the rate of decrease in the complex viscosity of the glass frit is less than 40% at 900 °C and less than 60% at 926 °C as compared with the case where no Ag is added, and a resin composition is provided.

Advantages of the Invention

[0007] When sintering an insulating layer together with a conductive layer (particularly, a conductive layer containing Ag), an insulating layer in which the glass in the insulating layer is hardly over-sintered can be produced from the resin composition of the present disclosure.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0009] Hereinafter, the resin composition of the present disclosure will be described in more detail. Although the description will be made with reference to the drawings as necessary, the various elements in the drawings are merely shown schematically and exemplarily for the understanding of the resin composition of the present disclosure, and the appearance and / or dimensional ratios may be different from the actual ones.

[0010] The various numerical ranges referred to in this specification are intended to include the numerical values of the lower and upper limits themselves. That is, for example, in the case of a numerical range of 1 or more and 10 or less, it can be interpreted as including the lower limit value "1" and also including the upper limit value "10".

[0011] <Resin composition> The resin composition of the present disclosure includes glass frit, an inorganic filler, an alkali-soluble resin, a photosensitive monomer, and a photopolymerization initiator, and the rate of decrease in the complex viscosity of the glass frit when 7% by weight of Ag is added to the glass frit is less than 40% at 900 °C and less than 60% at 926 °C as compared with the case where no Ag is added.

[0012] The glass frit when 7% by weight of Ag is added to the glass frit means a glass frit obtained by adding 7% by weight of Ag alone, that is, metallic silver, based on the weight of the glass frit.

[0013] When an insulating layer is sintered together with a conductive layer (particularly, a conductive layer containing Ag) from the resin composition of the present disclosure, it is possible to produce an insulating layer in which the glass in the insulating layer is hardly over-sintered.

[0014] Previously, metal ions (for example, Ag ions) contained in the conductive layer diffuse into the glass of the insulating layer adjacent to the conductive layer by sintering, making it easier for the viscosity of the glass to decrease. The glass with a decreased viscosity is more likely to be sintered, and as a result, the glass in the insulating layer may be over-sintered. Such over-sintering may cause defects such as cracks and voids in the insulating layer. In particular, at the interface between the insulating layer and the conductive layer, since the glass of the insulating layer and the metal of the conductive layer come into contact, the glass of the insulating layer at the interface is more likely to have its viscosity decreased during sintering and is more likely to be over-sintered than the glass of the insulating layer other than the interface.

[0015] The glass frit contained in the resin composition of the present disclosure is characterized by its high-temperature rheology when sintered together with the conductive layer. Specifically, the glass frit of the present disclosure is difficult to reduce its complex viscosity even when sintered together with the conductive layer. In particular, the glass frit contained in the resin composition of the present disclosure is difficult to reduce its complex viscosity even when sintered together with a conductive layer containing Ag. This is because it is difficult for metal ions, particularly Ag ions, from the conductive layer to diffuse into the glass frit softened by sintering.

[0016] In addition, as described above, since it is difficult for metal ions, particularly Ag ions, to diffuse in the insulating layer produced from the resin composition of the present disclosure, it is easy to maintain the insulation reliability of the insulating layer after sintering. Therefore, it becomes easy to maintain the performance and characteristics of electronic components using the resin composition of the present disclosure, such as inductors.

[0017] Hereinafter, the glass frit, inorganic filler, alkali-soluble resin, photosensitive monomer, and photoinitiator contained in the resin composition of the present disclosure will be described.

[0018] [Glass Frit] Glass frit is powdery glass, also referred to as glass powder. Glass frit can soften and become a liquid phase when the resin composition is sintered.

[0019] (Components) Glass frit is an inorganic powder mainly composed of oxides. Specifically, glass frit contains oxides of at least one element selected from the group consisting of Si, B, Ni, Cu, Pd, Al, Ti, Zr, Zn, Ga, Bi, Pb, Nb, Fe, Co, V, alkali metals, alkaline earth metals, and lanthanoids.

[0020] In one embodiment, the glass frit includes at least one selected from the group consisting of SiO2, Al2O3, B2O3, K2O, Li2O, Na2O, CaO, MgO, La2O3, ZnO, TiO2, and ZrO2.

[0021] In one embodiment, the glass frit of the present disclosure contains SiO2, X2O3 (where X is Al or B), and R2O (where R is an alkali metal element). In a preferred embodiment, the glass frit of the present disclosure contains SiO2, Al2O3 or B2O3, and K2O or Li2O.

[0022] When the glass frit contains less X (i.e., Al or B) and more Si, the reduction rate of the complex viscosity of the glass when Ag is added tends to be smaller. Since X can adopt a four - coordinate structure with Ag, a glass frit containing more X allows Ag to diffuse more easily in the glass (i.e., the solubility of Ag in the glass tends to be larger). Since Si hardly adopts or does not adopt a four - coordinate structure with Ag, a glass frit containing more Si makes it more difficult for Ag to diffuse in the glass.

[0023] In one embodiment, the ratio of the amount of X2O3 to the total amount of SiO2 and X2O3 contained in the glass frit may be less than 0.200. From the perspective of making over - sintering less likely, X2O3 / (SiO2 + X2O3) < 0.200 may be satisfied, and X2O3 / (SiO2 + X2O3) < 0.180, X2O3 / (SiO2 + X2O3) < 0.160, X2O3 / (SiO2 + X2O3) < 0.150, or X2O3 / (SiO2 + X2O3) < 0.145 may be satisfied.

[0024] When the glass frit adjusts the amount of R (i.e., alkali metal) and contains it within a certain range, the reduction rate of the complex viscosity of the glass when Ag is added tends to be smaller. Increasing the amount of R decreases the basicity of the glass and makes it easier for Ag to diffuse in the glass. Decreasing the amount of R makes it easier for the complex viscosity of the glass at high temperatures to decrease and makes it easier for Ag to diffuse in the glass.

[0025] In one embodiment, the ratio of the amount of R2O to the total amount of SiO2 and X2O3 contained in the glass frit may be more than 0.008 and less than 0.042. From the viewpoint of making over-sintering difficult, 0.008 < R2O / (SiO2 + X2O3) < 0.042 may be satisfied, 0.009 < R2O / (SiO2 + X2O3) < 0.042, 0.010 < R2O / (SiO2 + X2O3) < 0.037, 0.010 < R2O / (SiO2 + X2O3) < 0.031, 0.014 < R2O / (SiO2 + X2O3) < 0.031, or 0.020 < R2O / (SiO2 + X2O3) < 0.031 may be satisfied.

[0026] In one embodiment, the weight ratios of SiO2, X2O3, and R2O are selected to be within the region surrounded by points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15), and D(85, 15, 0) in the ternary composition diagram shown in FIG. 1.

[0027] By selecting the composition of the glass in this way, the softening point of the glass can be set in the range of 700°C or higher and 1050°C or lower. Therefore, the reactivity with other materials such as electrode materials is small, and for example, a sintered body can be obtained at a sintering temperature of 900°C or higher and 1050°C or lower. The insulating property of the electrically insulating layer formed thereby can be made excellent, and good processability can also be realized. In addition, the relative dielectric constant of the glass can be made lower than 7.0, making it suitable for applications to substrates and electronic components having high-frequency circuits.

[0028] In one embodiment, the weight ratios of SiO2, X2O3, and R2O are selected to be within the region surrounded by points E(75, 24.5, 0.5), F(75, 22, 3), G(85, 12, 3), and H(85, 14.5, 0.5) in the ternary composition diagram shown in FIG. 2. By selecting the composition of the glass in this way, the softening point of the glass can be brought within the range of 750°C or higher and 940°C or lower. Therefore, for forming an electrical insulation layer, it can be fired and sintered at a temperature of 950°C or lower. As a result, the processability is further improved, and the reactivity with other materials such as electrode materials can be further reduced.

[0029] In the ternary composition diagram shown in FIG. 1, from the viewpoint of further improving processability and further reducing the reactivity with other materials such as electrode materials, X2O3 and R2O may be B2O3 and K2O.

[0030] In one embodiment, the glass frit of the present disclosure may be borosilicate glass. The borosilicate glass in the present disclosure is a glass that essentially contains Si and B, and may optionally contain the elements listed above. Examples of the components of borosilicate glass include, but are not limited to, the following combinations. SiO2 + B2O3 + K2O SiO2 + B2O3 + Li2O SiO2 + B2O3 + Na2O + K2O + CaO + Al2O3 SiO2 + B2O3 + Na2O + K2O + Al2O3 SiO2 + B2O3 + Al2O3 + CaO SiO2 + B2O3 + BaO + ZnO + Al2O3 + MgO + La2O3 SiO2 + B2O3 + CaO + Al2O3 + Na2O + K2O

[0031] In one embodiment, the glass frit contains SiO2, B2O3, and K2O. In such an embodiment, when 7% by weight of Ag is added to the glass frit, the reduction rate of the complex viscosity of the glass frit can be further reduced.

[0032] In addition to the components listed above, the glass frit of the present disclosure may contain components that can form glass in order to adjust various properties such as acid resistance, water resistance, durability, and heat resistance. For example, the glass frit of the present disclosure may contain one or more selected from the group consisting of Li2O, CaO, ZnO, MgO, TiO2, La2O3, and ZrO2.

[0033] (Particle size) The average particle size of the glass frit may be 0.1 μm or more, and may be 0.4 μm or more, 0.7 μm or more, 1.0 μm or more, or 1.3 μm or more. The average particle size of the glass frit may be 5.0 μm or less, and may be 4.5 μm or less, 4.0 μm or less, 3.5 μm or less, or 3.0 μm or less. When the particle size of the glass frit is within the above range, the glass frit in the resin composition is likely to be uniformly dispersed, and the smoothness of the surface of the insulating layer formed from the resin composition is likely to be improved.

[0034] The average particle size of the glass frit is the particle size D50 when the cumulative particle volume from the small particle size side reaches 50% of the total particle volume in the particle size distribution determined by the laser diffraction / scattering method.

[0035] (Complex viscosity at 900 °C) - Glass frit alone The complex viscosity of the glass frit alone of the present disclosure at 900 °C may be 1.0×10 9 mPa·S or more, and from the viewpoint of making it difficult to over-sinter, 1.3×10 9 mPa·S or more, 1.6×10 9 mPa·S or more, 2.0×10 9 mPa·S or more, 2.3×10 9 mPa·S or more, or 3.0×10 9 mPa·S or more.

[0036] The complex viscosity of the glass frit alone of the present disclosure at 900 °C may be 15.0×10 9 mPa·S or less, and from the viewpoint of making it difficult to over-sinter, 13.0×109 less than mPa·S, 11.0×10 9 less than mPa·S, 9.0×10 9 less than mPa·S, or 7.0×10 9 may be less than mPa·S.

[0037] - Added 7 wt% Ag When 7 wt% of Ag is added to the glass frit of the present disclosure, the complex viscosity of the glass frit at 900 °C is 1.0×10 9 may be mPa·S or more, and from the viewpoint of making it difficult to over-sinter, 1.2×10 9 mPa·S or more, 1.6×10 9 mPa·S or more, or 2.5×10 9 may be mPa·S or more.

[0038] When 7 wt% of Ag is added to the glass frit of the present disclosure, the complex viscosity of the glass frit at 900 °C is 15.0×10 9 may be less than mPa·S, and from the viewpoint of making it difficult to over-sinter, 13.0×10 9 less than mPa·S, 11.0×10 9 less than mPa·S, 9.0×10 9 less than mPa·S or 7.0×10 9 may be less than mPa·S.

[0039] (Complex viscosity at 926 °C) - Glass frit alone The complex viscosity of the glass frit alone of the present disclosure at 926 °C is 0.76×10 9 may be mPa·S or more, and from the viewpoint of making it difficult to over-sinter, 1.0×10 9 mPa·S or more, 1.3×10 9 mPa·S or more, 1.6×10 9 mPa·S or more, 2.0×10 9 mPa·S or more, or 3.0×10 9 may be mPa·S or more.

[0040] The complex viscosity of the glass frit of the present disclosure at 926 °C may be 15.0×10 9 mPa·S or less, and from the viewpoint of making over-sintering difficult, it may be 13.0×10 9 mPa·S or less, 11.0×10 9 mPa·S or less, 9.0×10 9 mPa·S or less, or 7.0×10 9 mPa·S or less.

[0041] - 7 wt% Ag addition When 7 wt% of Ag is added to the glass frit of the present disclosure, the complex viscosity of the glass frit at 926 °C is 0.76×10 9 mPa·S or more, and from the viewpoint of making over-sintering difficult, it may be 1.0×10 9 mPa·S or more, 1.3×10 9 mPa·S or more, 1.6×10 9 mPa·S or more, 2.0×10 9 mPa·S or more, or 3.0×10 9 mPa·S or more.

[0042] When 7 wt% of Ag is added to the glass frit of the present disclosure, the complex viscosity of the glass frit at 926 °C may be 15.0×10 9 mPa·S or less, and from the viewpoint of making over-sintering difficult, it may be 13.0×10 9 mPa·S or less, 11.0×10 9 mPa·S or less, or 9.0×10 9 mPa·S or less.

[0043] (Reduction rate of complex viscosity upon addition of Ag) The complex viscosity of the glass frit with Ag added (in other words, the complex viscosity with Ag added) decreases when compared with the complex viscosity of the glass frit without Ag added at high temperatures. However, for the glass frit of the present disclosure, the degree of the decrease is small. Specifically, the reduction rate of the complex viscosity of the glass frit when 7 wt% of Ag is added to the glass frit of the present disclosure is small compared with the case where no Ag is added.

[0044] Note that the glass frit without Ag addition includes not only the case where the glass frit does not contain Ag at all, i.e., 0% by weight, but also the case where it substantially does not contain Ag. The glass frit substantially not containing Ag may contain Ag at 0.01% by weight or less, 0.001% by weight, or 0.0001% by weight or less with respect to the glass frit.

[0045] Reduction rate at 900 °C When 7% by weight of Ag is added to the glass frit of the present disclosure, the reduction rate of the complex viscosity of the glass frit may be less than 40% at 900 °C as compared with the case where no Ag is added, and from the viewpoint of making it more difficult to over-sinter, it may be less than 35%, less than 30%, or less than 25%.

[0046] Reduction rate at 926 °C When 7% by weight of Ag is added to the glass frit of the present disclosure, the reduction rate of the complex viscosity of the glass frit may be less than 60% at 926 °C as compared with the case where no Ag is added, and from the viewpoint of making it more difficult to over-sinter, it may be less than 50%, less than 40%, less than 30%, or less than 25%.

[0047] The reduction rates of the complex viscosity of the glass frit upon Ag addition at 900 °C and 926 °C can be determined by the following formula. "Reduction rate of the complex viscosity of the glass frit upon Ag addition = 100 - complex viscosity of the glass frit upon Ag addition / complex viscosity of the glass frit alone × 100"

[0048] Note that the complex viscosities at 900 °C and 926 °C described above are not necessarily limited to the complex viscosities at exactly 900 °C and 926 °C, and also include the complex viscosities at temperatures that can be judged to be substantially the complex viscosities at 900 °C and 926 °C. For example, such temperatures may be in the range of 900 °C ± 1 °C and 926 °C ± 1 °C, or may be in the range of 900 °C ± 2 °C and 926 °C ± 2 °C.

[0049] (Method for Measuring Complex Viscosity) The complex viscosity of the glass frit of the present disclosure can be measured with a high-temperature rheometer. By pressing the glass frit with a press or the like, a compacted powder is produced, and the complex viscosity of the glass frit can be obtained by measuring such a compacted powder with a high-temperature rheometer. Specifically, as follows The complex viscosity can be measured under the conditions described in Tables 1 and 2.

[0050]

Table 1

[0051]

Table 2

[0052] The glass frit with 7 wt% Ag added can be produced as follows. As starting materials, SiO2, B2O3, and K2CO3 were each prepared, mixed so as to have a glass composition with a desired weight composition ratio, and then each obtained mixture was melted at a temperature of 1700 °C to produce a molten glass. Then, each molten glass was rapidly cooled with a cooling roll and then pulverized to produce glass powder. After weighing Ag powder at a predetermined ratio into the glass frit powder, the mixture stirred with a spatula for about 1 minute is obtained by compacting it by the compacted powder formation method of the content disclosed in the present application. The Ag powder may have a particle size of, for example, D50 of 2.0 μm or more and 5.0 μm or less. The Ag powder can be obtained by a known method and may be, for example, atomized Ag powder. Ag powder with a particle size other than the above particle size may be used, for example, Ag powder by a wet reduction method may be used.

[0053] (Softening Point) The softening point of the glass frit of the present disclosure may be equal to or lower than the melting point of Ag. Such Ag means elemental Ag, and the melting point of Ag means 961°C. The softening point of the glass frit of the present disclosure may be 950°C or lower, may be 930°C or lower, 900°C or lower, 860°C or lower, or 820°C or lower. The softening point of the glass frit of the present disclosure may be 650°C or higher, may be 700°C or higher, 730°C or higher, 760°C or higher, or 780°C or higher.

[0054] The softening point of the glass frit can be obtained from thermogravimetric differential thermal analysis (TG-DTA). In thermogravimetric differential thermal analysis, 30 mg of glass frit having a median diameter (D50) of 0.1 μm or more and 5.0 μm or less was used, and a platinum pan was used as the container for the glass frit. α-alumina was used as the reference, and the inflection point (the fourth inflection point) of the trailing edge of the second endothermic peak as viewed from the low-temperature side of the DTA chart obtained by heating from room temperature to 950°C at 10°C / min in an air atmosphere was taken as the glass softening point.

[0055] (Content) The content of the glass frit may be 10% by weight or more, 15% by weight or more, 20% by weight or more, 25% by weight or more, 30% by weight or more, or 35% by weight or more with respect to the resin composition. The content of the glass frit may be 70% by weight or less, 60% by weight or less, 55% by weight or less, 50% by weight or less, 45% by weight or less, 40% by weight or less, or 35% by weight or less with respect to the resin composition. In one aspect, from the viewpoint of making over-sintering difficult, the content of the glass frit may be contained in the resin composition at 20% by weight or more and 50% by weight or less, preferably 30% by weight or more and 50% by weight or less.

[0056] [Inorganic filler] The inorganic filler refers to one that does not melt when the resin composition is sintered. The inorganic filler is an inorganic filler other than the glass frit. The type of the inorganic filler is not particularly limited, and known ones may be used. For example, as the inorganic filler, metal oxides, silicate compounds, nitrides, carbides, minerals, etc. can be used.

[0057] In one embodiment, the inorganic filler may be included in the resin composition with at least one or more selected from Mg2SiO4 (forsterite), CaSiO3 (wollastonite), ZrO2 (zirconia), Al2O3 (alumina), CeO (ceria), TiO2 (titania), Fe2O3 (ferrite), SiO2 (quartz), CoAl2O4 (cobalt aluminate), and perovskite-type oxides having the general formula ABO3. From the viewpoint of crack suppression, the inorganic filler may be Al2O3 (alumina) and / or SiO2 (quartz). The names in parentheses mean compounds or minerals composed of or containing the inorganic filler as a main component.

[0058] As the perovskite-type oxide having the general formula ABO3, at least one selected from the group consisting of Ag, K, La, Sr, Ca, and Ba is included as a constituent element of the A site in the formula, and at least one selected from the group consisting of Nb, Ca, Co, Ti, Zr, and Fe is included as a constituent element of the B site.

[0059] The combination of inorganic fillers may be appropriately selected according to the use of the resin composition of the present disclosure. For example, in view of the type, structure, and performance of electronic components, inorganic fillers may be appropriately combined and included in the resin composition. Examples of the combination of inorganic fillers include Mg2SiO4 + Al2O3 + SiO2 + ZrO2 CaSiO3 + Al2O3 + SiO2 + ZrO2 Mg2SiO4 + Al2O3 + + SiO2 ABO3 + Fe2O3 Al2O3 + SiO2 Al2O3 + SiO2 + CeO Al2O3 + SiO2 + CoAl2O4 + TiO2 may be mentioned.

[0060] (Content) The content of the inorganic filler may be 1% by weight or more, 3% by weight or more, 5% by weight or more, 10% by weight or more, 15% by weight or more, or 20% by weight or more with respect to the resin composition. The content of the inorganic filler may be 40% by weight or less, 35% by weight or less, 30% by weight or less, 25% by weight or less, or 20% by weight or less with respect to the resin composition. In one aspect, from the viewpoint of making over-sintering difficult, the content of the inorganic filler may be included at 1% by weight or more and 35% by weight or less, preferably 15% by weight or more and 25% by weight or less with respect to the resin composition.

[0061] [Alkali-soluble resin] As the alkali-soluble resin, for example, resins such as acrylic copolymers having functional groups such as carboxy groups in the side chain can be used. Specifically, copolymers of unsaturated carboxylic acids and ethylenically unsaturated compounds other than unsaturated carboxylic acids can be mentioned. The resin composition of the present disclosure may contain one or more kinds of alkali-soluble resins.

[0062] Examples of the ethylenically unsaturated compounds of unsaturated carboxylic acids include acrylic acid, methacrylic acid, maleic acid, fumaric acid, vinylacetic acid, and acid anhydrides thereof. Examples of the ethylenically unsaturated compounds other than unsaturated carboxylic acids include, for example, unsaturated carboxylic acid esters. Specifically, acrylic acid esters such as methyl acrylate and ethyl acrylate, methacrylic acid esters such as methyl methacrylate and ethyl methacrylate, and fumaric acid esters such as monoethyl fumarate can be mentioned.

[0063] In addition, as the acrylic copolymer having a carboxy group in the side chain, those introducing unsaturated bonds in the following forms may be used. (1) Add an acrylic monomer having a functional group such as an epoxy group, which can react with the carboxy group in the side chain of the acrylic copolymer. (2) React an unsaturated monocarboxylic acid with the acrylic copolymer in which an epoxy group is introduced instead of the carboxy group in the side chain, and then introduce a saturated or unsaturated polycarboxylic acid anhydride.

[0064] Furthermore, as the acrylic copolymer having a carboxy group in the side chain, it is preferable that the weight average molecular weight (Mw) is 50,000 or less and the acid value is 30 mgKOH / g or more and 150 mgKOH / g or less.

[0065] (Content) The content of the alkali-soluble resin may be 5% by weight or more, 10% by weight or more, 15% by weight or more, 20% by weight or more, or 25% by weight or more with respect to the resin composition. The content of the alkali-soluble resin may be 50% by weight or less, 45% by weight or less, 40% by weight or less, 35% by weight or less, 30% by weight or less, or 25% by weight or less with respect to the resin composition. In one aspect, from the viewpoint of making over-sintering difficult, the content of the alkali-soluble resin may be contained in the resin composition at 15% by weight or more and 45% by weight or less, preferably 25% by weight or more and 35% by weight or less.

[0066] [Photosensitive monomer] As the photosensitive monomer, a compound having an ethylenically unsaturated double bond can be used. As the photosensitive monomer, monofunctional and polyfunctional compounds having a vinyl group, an allyl group, an acrylate group, a methacrylate group, or an acrylamide group may be used. The resin composition of the present disclosure may contain one or more photosensitive monomers.

[0067] In addition to dipentaerythritol monohydroxypentaacrylate, the photosensitive monomer can be hexanediol triacrylate, tripropylene glycol triacrylate, trimethylolpropane triacrylate, EO-modified trimethylolpropane triacrylate, stearyl acrylate, tetrahydrofurfuryl acrylate, lauryl acrylate, 2-phenoxyethyl acrylate, isodecyl acrylate, isooctyl acrylate, tridecyl acrylate, caprolactone acrylate, ethoxylated nonylphenol acrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate, diethylene glycol diacrylate, tetraethylene glycol diacrylate, triethylene glycol diacrylate, ethoxylated bisphenol A diacrylate, propoxylated neopentyl glycol diacrylate, tris(2-hydroxyethyl)isocyanurate triacrylate, pentaerythritol triacrylate, propoxylated trimethylolpropane triacrylate, propoxylated glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, etc. Also, those in which part or all of the acrylate in the molecule of the above compound is changed to methacrylate can be used.

[0068] (Content) The content of the photosensitive monomer may be 1% by weight or more, 3% by weight or more, 5% by weight or more, or 10% by weight or more with respect to the resin composition. The content of the photosensitive monomer may be 30% by weight or less, 25% by weight or less, 20% by weight or less, 15% by weight or less, 10% by weight or less, or 5% by weight or less with respect to the resin composition. In one aspect, from the viewpoint of making over-sintering difficult, the content of the photosensitive monomer may be contained in the resin composition at 1% by weight or more and 25% by weight or less, preferably 10% by weight or more and 15% by weight or less.

[0069] [Photoinitiator] A photoinitiator is a component that decomposes upon irradiation with light energy such as ultraviolet light, generates active species such as radicals and / or cations, and initiates the polymerization reaction of monomers. The photoinitiator is not particularly limited, and one kind can be used alone or two or more kinds can be appropriately combined according to the type of monomer, etc. from among those conventionally known.

[0070] As the photoinitiator, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane is used. In addition, benzyl, benzoin ethyl ether, benzoin isobutyl ether, benzoin isopropyl ether, benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-benzoyl-4'-methyldiphenyl sulfide, benzyldimethyl ketal, 2-n-butoxy-4-dimethylaminobenzoate, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, isopropylthioxanthone, 2-dimethylaminoethyl benzoate, ethyl p-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate, 3,3'-dimethyl-4-methoxybenzophenone, 2,4-dimethylthioxanthone, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, methyl benzoyl formate, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, etc. can also be used.

[0071] (Content) The content of the photoinitiator may be 0.1% by weight or more, 0.5% by weight or more, 1% by weight or more, 3% by weight or more, 5% by weight or more, or 10% by weight or more with respect to the resin composition. The content of the photoinitiator may be 20% by weight or less, 15% by weight or less, 10% by weight or less, 5% by weight or less, or 3% by weight or less with respect to the resin composition. In one aspect, from the viewpoint of making over-sintering difficult, the content of the photoinitiator may be included at 0.1% by weight or more and 10% by weight or less, preferably 1% by weight or more and 3% by weight or less with respect to the resin composition.

[0072] <Resin composition paste> The resin composition paste of the present disclosure includes the resin composition of the present disclosure, a solvent, and a dispersant and / or a plasticizer. The resin composition paste of the present disclosure may include both a dispersant and a plasticizer. The resin composition paste of the present disclosure may include either a dispersant or a plasticizer.

[0073] The resin composition included in the resin composition paste of the present disclosure is as described above.

[0074] [Solvent] The resin composition paste of the present disclosure may include a solvent. The solvent is not particularly limited, and a known solvent may be used. The solvent may be an organic solvent, for example, butyl carbitol acetate, butyl carbitol, ethyl carbitol acetate, ethyl carbitol, hexane, toluene, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl cellosolve acetate, diethylene glycol diethyl ether, diacetone alcohol, terpineol, methyl ethyl ketone, benzyl alcohol, methyl ethyl ketone, methyl isobutyl ketone, tetradecane, tetralin, propyl alcohol, isopropyl alcohol, dihydroterpineol, dihydroterpineol acetate, ethyl carbitol, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate (texanol), 1-(2-methoxy-2-methylethoxy)-2-propanol, dipropylene glycol monomethyl ether, or a combination thereof.

[0075] Content (content) The content of the solvent may be appropriately selected in view of the degree of dispersion of the resin composition in the resin composition paste and the viscosity of the resin composition paste. For example, the content of the solvent may be 50% by weight or more, 60% by weight or more, 70% by weight or more, or 80% by weight or more based on the resin composition paste. The content of the solvent may be 90% by weight or less, 80% by weight or less, 70% by weight or less, or 60% by weight or less based on the resin composition.

[0076] [Dispersant] The resin composition paste of the present disclosure may contain a dispersant. The dispersant is included to disperse at least the glass frit in the resin composition paste. The dispersant is not particularly limited as long as it can disperse at least the glass frit in the resin composition paste, and one kind or a mixture of two or more kinds may be used.

[0077] As the dispersant, a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. can be used.

[0078] As the nonionic dispersant, ethyl cellulose, nitrocellulose, polyvinyl acetate, polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene polyoxybutylene alkyl ether, polyoxyethylene polyoxypropylene glycol, polyethyleneimine ethoxylate, etc. may be used.

[0079] As the anionic dispersant, alkyl ether sulfate, alkyl sulfate, alkenyl ether sulfate, alkenyl sulfate, olefin sulfonate, alkane sulfonate, saturated or unsaturated fatty acid salt, alkyl or alkenyl ether carboxylate, α-sulfonated fatty acid salt, N-acyl amino acid type dispersant, phosphoric acid mono- or diester type dispersant, and sulfosuccinate ester, etc. may be used.

[0080] As cationic dispersants, amine salt type dispersants such as alkylamine salts, amino alcohol fatty acid derivatives, polyamine fatty acid derivatives, imidazolines; alkyltrimethylammonium salts, dialkyldimethylammonium salts, alkyldimethylbenzylammonium salts, pyridinium salts, alkylisoquinolinium salts, etc. may be used.

[0081] (Content) The content of the dispersant may be 0.01% by weight or more, 0.05% by weight or more, 0.1% by weight or more, or 0.3% by weight or more with respect to the resin composition paste. The content of the dispersant may be 15% by weight or less, 10% by weight or less, 5% by weight or less, 1% by weight or less, 0.5% by weight or less with respect to the resin composition paste. In one aspect, from the viewpoint of making over-sintering difficult, the content of the dispersant may be 0.1% by weight or more and 10% by weight or less, preferably 0.1% by weight or more and 0.5% by weight or less, contained in the resin composition.

[0082] When the dispersant is an anionic dispersant, the content of the anionic dispersant may be in a range such that the total acid amount thereof is 10% or more and 150% or less of the total base amount of the glass frit. When the content of the anionic dispersant is such that the total acid amount is less than 10% of the total base amount of the glass powder, a sufficient dispersing effect cannot be exhibited, and even if added in excess of 150%, no significant improvement in the dispersing effect is observed. The total acid amount of the anionic dispersant and the total base amount of the glass frit can be quantified by methods such as titration.

[0083] [Plasticizer] The resin composition paste of the present disclosure may contain a plasticizer. The plasticizer is included to adjust the rheological properties of the resin composition paste. The type of the plasticizer is not particularly limited, and known ones can be used. The plasticizer may be used alone or in combination of two or more.

[0084] Plasticizers may include glycol derivatives, phthalic acid derivatives, isophthalic acid derivatives, tetrahydrophthalic acid derivatives, adipic acid derivatives, maleic acid derivatives, fumaric acid derivatives, trimellitic acid derivatives, pyromellitic acid derivatives, stearic acid derivatives, oleic acid derivatives, itaconic acid derivatives, ricinoleic acid derivatives, and the like.

[0085] (Aspect including an organic vehicle) In one embodiment, the resin composition paste of the present disclosure includes the resin composition of the present disclosure, an organic vehicle, and a dispersant and / or a plasticizer.

[0086] [Organic vehicle] The organic vehicle includes a solvent and an organic binder.

[0087] As the solvent contained in the organic vehicle, the solvents exemplified above can be used.

[0088] Examples of the organic binder contained in the organic vehicle include cellulose acetate and cellulose acetate butyrate as cellulose ester compounds, and ethyl cellulose, methyl cellulose, hydroxypropyl cellulose, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, and hydroxyethyl methyl cellulose as cellulose ether compounds. Examples of acrylic compounds include polyacrylamide, polymethacrylate, polymethyl methacrylate, and polyethyl methacrylate. Examples of vinyl compounds include polyvinyl butyral, polyvinyl acetate, and polyvinyl alcohol. At least one of the organic binders can be selected and used.

[0089] The content of the organic binder in the organic vehicle may be 5% by weight or more, 10% by weight or more, or 15% by weight or more based on the total of the content of the organic binder and the content of the solvent.

[0090] The content of the organic binder in the organic vehicle may be 30% by weight or less, 25% by weight or less, or 20% by weight or less based on the total of the content of the organic binder and the content of the solvent.

[0091] The content of the organic vehicle may be 1% by weight or more, 3% by weight or more, 5% by weight or more, or 10% by weight or more based on the resin composition paste. The content of the organic vehicle may be 20% by weight or less, 15% by weight or less, 10% by weight or less, or 5% by weight or less based on the resin composition paste.

[0092] [Other components] The resin composition of the present disclosure may further contain other components as necessary in addition to the above-described components, as long as the effects of the resin composition of the present disclosure are not impaired. Examples of other components may include defoamers, sensitizers, surfactants, antioxidants, polymerization inhibitors (polymerization preventives), leveling agents, thickeners, anti-gelling agents, stabilizers, preservatives, pigments, rheology modifiers, and the like. The other components may be contained in an amount of 5% by weight or less, 3% by weight or less, or 1% by weight or less based on the resin composition.

[0093] <Green sheet> A green sheet can be obtained by forming the resin composition of the present disclosure or the resin composition paste of the present disclosure into a sheet shape.

[0094] Since the green sheet of the present disclosure contains the resin composition of the present disclosure, a decrease in the viscosity of the glass during sintering with a conductive layer (particularly, a conductive layer containing Ag) is reduced, and over-sintering is difficult to occur.

[0095] The green sheet of the present disclosure can be manufactured as follows.

[0096] First, a resin composition, a dispersant, a plasticizer, and a solvent are blended at the ratios shown below. (a) Resin composition: 50 parts by weight or more and 200 parts by weight or less (b) Dispersant: 1 part by weight or more and 4 parts by weight or less (d) Plasticizer: 0.5 to 3.0 parts by weight (e) Solvent: 100 to 300 parts by weight

[0097] Next, 300 to 700 parts by weight of zirconia balls with a diameter of 1 mm or more and 5 mm or less are added to this blended raw material, and it is mixed and crushed by a ball mill for 3 hours or more and 7 hours or less to obtain a final dispersion slurry for manufacturing a green sheet. Note that the resin composition paste of the present disclosure prepared in the above-described formulation may be used as the final dispersion slurry as it is.

[0098] Next, this final dispersion slurry is supplied onto a base material such as a carrier sheet and formed into a sheet shape by the doctor blade method to produce a green sheet.

[0099] The green sheet of the present disclosure may be appropriately adjusted according to the application, and may be, for example, 0.1 μm or more and 10 μm or less.

[0100] The green sheet of the present disclosure can be used for various electronic components. For example, the green sheet of the present disclosure can be used for inductor components, capacitor components, etc. For example, by laminating, pressure-bonding, and heat-treating a sintered green sheet provided with internal electrodes, inductors, capacitors, etc. can be manufactured.

[0101] Specifically, an electrode-arranged sheet is formed by arranging an internal electrode for capacitance formation on the green sheet manufactured as described above. Next, a predetermined number of electrode-arranged sheets are laminated, and further, green sheets (outer layer sheets) without electrodes arranged on both the upper and lower surfaces thereof are laminated and pressure-bonded to form a laminate (laminated pressure-bonded body) in which one end side of each internal electrode is alternately drawn out to the end surfaces on different sides.

[0102] Then, after sintering this laminated and pressure-bonded body under predetermined conditions, conductive paste is applied to both ends of the sintered laminate (element) and baked to form external electrodes that are electrically connected to the internal electrodes. Thereby, a laminated electronic component is obtained. Also, other laminated electronic components such as laminated multilayer substrates can be manufactured through a process of laminating green sheets.

[0103] <Electronic component> The resin composition or the resin composition paste of the present disclosure can be used for electronic components. Such electronic components include, for example, electronic components including an insulating layer containing the resin composition of the present disclosure and a conductive layer. Examples of the electronic components include inductor components, capacitor components, LC filter components, etc.

[0104] Electronic components include electronic components by a lamination method manufactured by laminating a plurality of insulating layers printed with conductor patterns and connecting the layers with vias, electronic components by a film formation method manufactured by printing a conductor pattern on an insulating layer by sputtering, evaporation, etc., and electronic components by a photolithography method manufactured by repeating the formation of an insulating layer and a conductive layer through processes such as photolithography.

[0105] Hereinafter, a method for manufacturing an inductor component according to an embodiment will be described.

[0106] (Method for manufacturing an inductor component) The step of repeatedly applying an insulating paste containing quartz as a filler and containing the resin composition of the present disclosure by screen printing to form an insulating layer. This insulating layer is an outer layer insulating layer located on one outer side in the axial direction of the coil.

[0107] A photosensitive conductive paste layer is applied and formed, and a coil conductor layer and an external electrode conductor layer are formed by a photolithography process. Specifically, a photosensitive conductive paste having Ag as a main metal component is applied by screen printing to form a photosensitive conductive paste layer. Further, the photosensitive conductive paste layer is irradiated with ultraviolet rays or the like through a photomask and developed with an alkaline solution or the like. Thereby, the coil conductor layer and the external electrode conductor layer are formed on the insulating layer. At this time, a desired coil pattern can be drawn on the photomask.

[0108] An insulating layer provided with openings and via holes is formed by a photolithography process. Specifically, a photosensitive insulating paste is applied by screen printing to form it on the insulating layer. Further, the photosensitive insulating layer is irradiated with ultraviolet rays or the like through a photomask and developed with an alkaline solution or the like.

[0109] A coil conductor layer and an external electrode conductor layer are formed by a photolithography process. Specifically, a photosensitive conductive paste having Ag as a main metal component is applied by screen printing to form a photosensitive conductive paste layer. Further, the photosensitive conductive paste layer is irradiated with ultraviolet rays or the like through a photomask and developed with an alkaline solution or the like. Thereby, a conductor layer connecting between the external electrode conductor layers is formed in the opening, a via hole conductor is formed in the via hole, and the coil conductor layer is formed on the insulating layer and in the opening.

[0110] By repeating the above steps, a coil conductor layer and an external electrode conductor layer are formed on and inside the insulating layer.

[0111] The insulating paste is repeatedly applied by screen printing to form an insulating layer. This insulating layer is an outer layer insulating layer located outside the other side in the axial direction of the coil.

[0112] Through the above steps, a mother laminate is obtained.

[0113] The mother laminate is cut into a plurality of unfired laminates by dicing or the like. In the cutting process of the mother laminate, the external electrodes are exposed from the laminate on the cut surface formed by cutting. to be exposed.

[0114] The unfired laminate is fired under predetermined conditions to obtain a laminate. The laminate is subjected to barrel processing. Ni plating having a thickness of 2 μm or more and 10 μm or less and Sn plating having a thickness of 2 μm or more and 10 μm or less are applied to the portion where the external electrode is exposed from the laminate. Through the above steps, an inductor component of 0.4 mm × 0.2 mm × 0.2 mm is completed.

[0115] Note that the method for forming the conductor pattern is not limited to the above. For example, a printing and laminating method of a conductor paste using a screen plate having an opening in the conductor pattern shape may be used, or a method of forming a conductor pattern by etching a conductor film formed by sputtering, vapor deposition, foil crimping, etc. may be used, or a method of forming a negative pattern like the semi-additive method to form a conductor pattern with a plating film and then removing unnecessary parts may be used. Furthermore, by forming the conductor pattern in multiple stages to have a high aspect ratio, the loss due to resistance at high frequencies can be reduced. More specifically, it may be a process of repeating the formation of the above conductor pattern, or a process of repeatedly stacking the wirings formed by the semi-additive process, or a process of forming a part of the stack by the semi-additive process and forming the other parts by etching a plated growth film, or a process of combining a process of growing the wirings formed by the semi-additive process by plating to increase the aspect ratio.

[0116] Also, the conductor material is not limited to the Ag paste as described above, and any good conductor such as Ag, Cu, Au formed by sputtering, vapor deposition, foil crimping, plating, etc. may be used.

[0117] In addition, the method for forming the insulating layer, the opening, and the via hole is not limited to the above, and a method of opening by laser or drilling after pressure bonding, spin coating, or spray coating of an insulating material sheet may also be used.

[0118] In addition, the insulating material is not limited to the glass and ceramic materials as described above, and may be an organic material such as an epoxy resin, a fluororesin, or a polymer resin, or a composite material such as a glass epoxy resin. However, those with low dielectric constant and dielectric loss are desirable.

[0119] In addition, the size of the inductor component is not limited to the above.

[0120] Regarding the method for forming the external electrode, it is not limited to the method of plating the external conductor exposed by cutting. Instead, the external electrode may be formed by dipping the conductor paste or sputtering method after cutting, and then plating may be performed thereon.

[0121] (Surface roughness) In the electronic component of the present disclosure, the insulating layer using the resin composition of the present disclosure is difficult to be over-sintered when sintered together with the conductive layer. For example, since the interface between the insulating layer and the conductive layer is difficult to be over-sintered, bubbles and the like are less likely to occur. Therefore, the unevenness of the surface of the insulating layer and / or the conductive layer at the interface is likely to be small, and the surface roughness is likely to be small. When the surface roughness of the insulating layer and / or the conductive layer at the interface is small, it becomes easier to maintain the characteristics and reliability as an electronic component. For example, in an inductor component, the resistance loss at high frequencies is reduced, and the Q value is likely to be improved.

[0122] In one embodiment, at the interface between the insulating layer and the conductive layer, the surface roughness Rq of the conductive layer may be 1.0 μm or less, 0.8 μm or less, 0.6 μm or less, or 0.4 μm or less.

[0123] The surface roughness Rq of the conductive layer at the interface between the insulating layer and the conductive layer (specifically, refer to JIS B0601:2013) can be measured as follows. (1) Obtain an internal electrode cross-sectional image (shown in Fig. 4 as a representative diagram) from the DPA cross-section of the electronic component. Suitable images can be obtained using a laser microscope, a confocal microscope, a SEM, etc. (2) Using image processing software, binarize the obtained image so that the internal electrode part is white and the insulator part is black (shown in Fig. 5 as a representative diagram). Examples of image processing software include WinRoof (manufactured by Mitani Corporation) and imageJ (manufactured by Wayne Rasband), but it is not limited to these as long as binarization can be performed. (3) From the binarized image, calculate Rq according to the following formula for the interface between the internal electrode and the insulator part. Rq represents the root mean square of the square of Z(x) at the reference length l.

Equation

[0124] The resin composition of the present disclosure has been described above, but it is merely an exemplification of typical examples. Therefore, those skilled in the art will easily understand that the resin composition of the present disclosure is not limited to these and various embodiments are conceivable.

Examples

[0125] The examples of the present disclosure will be specifically described below, but the examples do not limit the present disclosure.

[0126] <Examples and Comparative Examples> As glass compositions, Examples 1 to 5 and Comparative Example 1 having compositions of SiO2, B2O3, and K2O as shown in Table 5 were prepared. The compositions shown in Table 5 were confirmed by XRF.

[0127] Examples 1 (Ag addition) to 5 (Ag addition) and Comparative Example 1 (Ag addition) in which 7% by weight of silver was added were prepared for Examples 1 to 5 and Comparative Example 1.

[0128] <Test Method> The test procedure is as follows.

[0129] [High-temperature rheology measurement] In order to measure the complex viscosities of the examples, comparative examples, examples with Ag addition, and comparative examples with Ag addition using a high-temperature rheometer, press compacts were prepared from the glass frit shown in the examples and comparative examples under the conditions of Table 3 below. [Table 3]

[0130] The prepared press compacts were set in a high-temperature rheometer, and the complex viscosity was measured under the conditions of Table 4 below. The measurement results of the complex viscosity are shown in Table 5. [Table 4]

[0131] [Reduction rate of complex viscosity due to addition of 7 wt% Ag] The reduction rate of the complex viscosity due to the addition of 7 wt% Ag was calculated from the following formula. "Reduction rate of the complex viscosity of the glass frit when Ag is added = 100 - Complex viscosity of the glass frit when Ag is added / Complex viscosity of the glass frit alone × 100"

[0132] The examples and comparative examples were determined as follows based on the reduction rate of the complex viscosity due to the addition of 7 wt% Ag. Among the reduction rates at 901 °C and 926 °C, the one with the higher reduction rate is: Less than 30%; ◎ (best) 30% or more and less than 40%; 〇 (good) 40% or more and less than 80%; △ (acceptable) (no practical problems) 80% or more; × (unacceptable) (practical problems)

[0133] [Softening point] The softening points of the examples, comparative examples, examples with Ag addition, and comparative examples with Ag addition were measured by DTA according to the following conditions. The measurement results of the softening point are shown in Table 5. 30 mg of glass frit having a median diameter (D50) of 0.1 μm or more and 5.0 μm or less was used, and a platinum pan was used as the container for the glass frit. Α-alumina was used as a reference, and the inflection point (the fourth inflection point) of the second endothermic peak was defined as the glass softening point when viewed from the low-temperature side of the DTA chart obtained by heating from room temperature to 950 °C at 10 °C / min in an air atmosphere.

[0134] [SEM Observation] The glass frit having the composition described in Example 1 and Comparative Example 2 was sintered together with an Ag-containing electrode to produce an Ag-GL co-sintered body (see Fig. 5). The Ag-GL interface of the cross section obtained by embedding such a co-sintered body in resin and polishing was observed by SEM. Shown in Figs. 6 and 7.

[0135]

Table 5

[0136] From Table 5, it was found that the complex viscosity reduction rate due to the addition of 7 wt% Ag in Examples 1 to 5 was smaller than that in Comparative Example 1.

[0137] Aspects of the resin composition and its manufacturing method of the present disclosure are as follows. <Item 1> Comprising a glass frit, an inorganic filler, an alkali-soluble resin, a photosensitive monomer, and a photopolymerization initiator, A resin composition in which the reduction rate of the complex viscosity of the glass frit when 7 wt% or less of Ag is added to the glass frit is less than 40% at 900 °C and less than 60% at 926 °C compared to the case where no Ag is added. <Item 2> The resin composition according to Item 1, wherein the reduction rate of the complex viscosity when 7 wt% or less of Ag is added is less than 30% at 900 °C and less than 30% at 926 °C compared to the case where no Ag is added. <Item 3> The resin composition according to Item 1 or 2, wherein the average particle size of the glass frit is 0.1 μm or more and 5.0 μm or less. <Item 4> The glass frit-containing resin composition according to any one of items 1 to 3, which contains SiO2, X2O3 (X is Al or B), and R2O (R is an alkali metal element). <Item 5> The resin composition according to item 4, wherein the ratio of the amount of X2O3 to the total amount of SiO2 and X2O3 is X2O3 / (SiO2 + X2O3) < 0.200. <Item 6> The resin composition according to item 4, wherein the ratio of the amount of R2O to the total amount of SiO2 and X2O3 is 0.008 < R2O / (SiO2 + X2O3) < 0.042. <Item 7> The inorganic filler is at least one selected from the group consisting of Mg2SiO4, CaSiO3, ZrO2, Al2O3, CeO, TiO2, Fe2O3, SiO2, CoAl2O4, and the perovskite-type oxide represented by the general formula: ABO3 [wherein, the constituent element of the A site contains at least one selected from the group consisting of Ag, K, La, Sr, Ca, and Ba, and the constituent element of the B site contains at least one selected from the group consisting of Nb, Ca, Co, Ti, Zr, and Fe.] The resin composition according to any one of items 1 to 6, which contains at least one or more selected from the group consisting of the above-mentioned inorganic fillers. <Item 8> A resin composition paste containing the resin composition according to any one of items 1 to 7, a solvent, and a dispersant and / or a plasticizer. <Item 9> The resin composition paste according to item 8, wherein the dispersant is an anionic dispersant. <Item 10> A green sheet obtained by molding the resin composition according to any one of items 1 to 7 into a sheet shape. <Item 11> An electronic component including an insulating layer containing the resin composition according to any one of items 1 to 7 and a conductive layer containing Ag. <Item 12> The electronic component according to item 11, wherein the surface roughness Rq of the conductive layer is 1.0 μm or less at the interface between the insulating layer and the conductive layer. <Item 13> Forming a laminate by laminating an insulating layer containing the resin composition according to any one of Items 1 to 7 and a conductive layer containing Ag. A method for manufacturing an electronic component, comprising heat-treating the laminate. <Item 14> The manufacturing method according to Item 13, wherein the conductive layer is laminated on the insulating layer by photolithography.

Description of Reference Numerals

[0138] 1 Glass body 2 Electrode containing Ag 3 Ag-GL co-sintered body 4 Resin 5 Void

Claims

1. A resin composition comprising a glass frit, an inorganic filler, an alkali-soluble resin, a photosensitive monomer, and a photoinitiator, wherein the reduction rate of the complex viscosity of the glass frit when 7% by weight or less of Ag is added to the glass frit is less than 40% at 900 ° C and less than 60% at 926 ° C compared to the case where no Ag is added.

2. The resin composition according to claim 1, wherein the reduction rate of the complex viscosity when 7% by weight or less of Ag is added is less than 30% at 900 ° C and less than 30% at 926 ° C compared to the case where no Ag is added.

3. The resin composition according to claim 1, wherein the average particle size of the glass frit is 0.1 μm or more and 5.0 μm or less.

4. The glass frit contains SiO ２ and X ２ O ３ (where X is Al or B), and R ２ O (where R is an alkali metal element), the resin composition according to claim 1.

5. SiO ２ and X ２ O ３ The ratio of the amount of X ２ O ３ to the total amount of SiO ２ O ３ / (SiO ２ + X ２ O ３ ) < 0.200, the resin composition according to claim 4.

6. SiO ２ and X ２ O ３ The ratio of the amount of R ２ O to the total amount of SiO ２ O / (SiO ２ + X ２ O ３ ) is 0.008 < R ２ O / (SiO ２ + X ２ O ３ ) < 0.

042. The resin composition according to claim 4

7. The inorganic filler is Mg ２ SiO ４ , CaSiO ３ , ZrO ２ , Al ２ O ３ , CeO, TiO ２ , Fe ２ O ３ , SiO ２ , CoAl ２ O ４ , and general formula: ABO ３ [In the formula, at least one selected from the group consisting of Ag, K, La, Sr, Ca, and Ba is included in the constituent elements of the A site, and at least one selected from the group consisting of Nb, Ca, Co, Ti, Zr, and Fe is included in the constituent elements of the B site.] The resin composition according to claim 1, comprising at least one or more selected from the group consisting of perovskite-type oxides represented by the formula.

8. A resin composition paste comprising the resin composition according to claim 1, a solvent, and a dispersant and / or a plasticizer.

9. The resin composition paste according to claim 8, wherein the dispersant is an anionic dispersant.

10. A green sheet obtained by molding the resin composition according to claim 1 into a sheet shape.

11. An electronic component comprising an insulating layer containing the resin composition according to claim 1 and a conductive layer containing Ag.

12. The electronic component according to claim 11, wherein the surface roughness Rq of the conductive layer is 1.0 μm or less at the interface between the insulating layer and the conductive layer.

13. Forming a laminate by laminating an insulating layer containing the resin composition according to claim 1 and a conductive layer containing Ag, Heat-treating the laminate, a method for manufacturing an electronic component.

14. The manufacturing method according to claim 13, wherein the conductive layer is laminated on the insulating layer by photolithography.

Images