Wiring circuit board

Abstract

To provide a wiring circuit board that can suppress occurrence of cracks in wiring near an end portion of a wiring portion.SOLUTION: A wiring circuit board 1 includes a plurality of wiring portions 3A, 3B, a first support portion 2A that supports one end portion of each of the wiring portions 3A, 3B, and a second support portion 2B that supports the other end portion of each of the wiring portions 3A, 3B. Each of the wiring portions 3A, 3B has wiring 133. The wiring 133 has a first portion 1331 connected to the first support portion 2A, a second portion 1332 connected to the second support portion 2B, and a main portion 1333 disposed between the first portion 1331 and the second portion 1332. The first portion 1331 and the second portion 1332 are thinner than the main portion 1333.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a wiring circuit board.

Background Art

[0002] Conventionally, a wiring circuit board including a plurality of wiring portions arranged at intervals and a connecting portion connecting the plurality of wiring portions is known (see, for example, Patent Document 1 below).

[0003] In this wiring circuit board, the thickness of the wiring portion is large (two or more times) compared to the width of the wiring portion. Therefore, the wiring portion can move more easily in the width direction than in the thickness direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a wiring circuit board as described in Patent Document 1, when the wiring portion moves, stress may concentrate in the vicinity of the end portion (the portion connected to the connecting portion) of the wiring portion. Therefore, cracks may occur in the wiring in the vicinity of the end portion of the wiring portion.

[0006] The present invention provides a wiring circuit board capable of suppressing the occurrence of cracks in the wiring in the vicinity of the end portion of the wiring portion.

Means for Solving the Problems

[0007] The present invention [1] includes a plurality of wiring portions extending in a first direction and arranged at intervals from each other, and a first support portion that supports one end portion of each of the plurality of wiring portions in the first direction. Each of the plurality of wiring portions has a wiring extending in the first direction, and the wiring has a main body portion arranged away from the first support portion in the first direction, and a first portion arranged between the first support portion and the main body portion in the first direction and connected to the first support portion. The first portion is thinner than the main body portion, and includes a wiring circuit board.

[0008] According to such a configuration, in the wiring arranged in the wiring portion, the first portion connected to the first support portion is thinner than the main body portion.

[0009] Therefore, when the wiring portion moves, it is possible to suppress the stress near one end portion of the wiring portion from concentrating on the wiring. In other words, it is possible to relieve the stress of the wiring arranged near one end portion of the wiring portion.

[0010] As a result, it is possible to suppress the occurrence of cracks in the wiring near one end portion of the wiring portion.

[0011] The present invention [2] includes the wiring circuit board of [1] above, in which each of the plurality of wiring portions has a plurality of the wirings, and in all of the wirings, the first portion is thinner than the main body portion.

[0012] According to such a configuration, in all of the wirings, it is possible to suppress the occurrence of cracks in the first portion.

[0013] The present invention [3] includes the wiring circuit board of [1] or [2] above, in which the wiring has a first conductor layer and a second conductor layer arranged on the first conductor layer, and the first conductor layer of the first portion is thinner than the first conductor layer of the main body portion.

[0014] According to such a configuration, it is possible to suppress the occurrence of cracks in the first conductor layer of the first portion.

[0015] The present invention [4] includes the wiring circuit board of [1] or [2], wherein the wiring has a first conductor layer and a second conductor layer disposed on the first conductor layer, and the second conductor layer of the first portion is thinner than the second conductor layer of the main body portion.

[0016] According to such a configuration, it is possible to suppress the occurrence of cracks in the second conductor layer of the first portion.

[0017] The present invention [5] includes the wiring circuit board of [1] or [2], wherein the wiring has a first conductor layer and a second conductor layer disposed on the first conductor layer, the first conductor layer of the first portion is thinner than the first conductor layer of the main body portion, and the second conductor layer of the first portion is thinner than the second conductor layer of the main body portion.

[0018] According to such a configuration, it is possible to suppress the occurrence of cracks in the first conductor layer of the first portion, and it is also possible to suppress the occurrence of cracks in the second conductor layer of the first portion.

[0019] The present invention [6] includes the wiring circuit board of any one of [1] to [5], wherein in the first direction, the length of the first portion is 0.1% to 25% of the total length of the wiring disposed in the wiring portion.

[0020] According to such a configuration, the stress of the wiring disposed near one end of the wiring portion can be more effectively relaxed.

[0021] As a result, it is possible to more effectively suppress the occurrence of cracks in the wiring near one end of the wiring portion.

[0022] The present invention [7] includes the wiring circuit board of any one of [1] to [6], wherein the width of the first portion is 50% or more and less than 100% of the width of the main body portion.

[0023] According to such a configuration, the stress of the wiring disposed near one end of the wiring portion can be more effectively relaxed.

[0024] As a result, it is possible to further suppress the occurrence of cracks in the wiring in the vicinity of one end of the wiring portion.

[0025] Invention [8] includes any one of the wiring circuit boards of [1] to [7] above, wherein the wiring circuit board has a metal support layer, an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer, and a conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring, and the metal support layer is disposed on the first support portion and the wiring portion.

[0026] Invention [9] includes any one of the wiring circuit boards of [1] to [7] above, wherein the wiring circuit board has a metal support layer, an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer, and a conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring, and the metal support layer is not disposed on the wiring portion but is disposed on the first support portion.

[0027] Invention

[10] includes any one of the wiring circuit boards of [1] to [9] above, wherein the wiring circuit board further includes a second support portion that supports the other ends of the plurality of wiring portions in the first direction, the wiring is disposed between the second support portion and the main body portion in the first direction, and the wiring further has a second portion connected to the second support portion, and the second portion is thinner than the main body portion.

[0028] According to such a configuration, for the wiring disposed in the wiring portion, the second portion connected to the second support portion is thinner than the main body portion.

[0029] Therefore, when the wiring portion moves, it is possible to suppress the concentration of stress in the vicinity of the other end of the wiring portion on the wiring. In other words, it is possible to relieve the stress of the wiring disposed in the vicinity of the other end of the wiring portion.

[0030] As a result, it is possible to suppress the occurrence of cracks in the wiring in the vicinity of the other end of the wiring portion.

[0031] The present invention

[11] includes the wiring circuit board of

[10] above, wherein each of the plurality of the wiring portions has a plurality of the wirings, and in all of the wirings, the second portion is thinner than the main body portion.

[0032] According to such a configuration, it is possible to suppress the occurrence of cracks in the second portion in all the wirings.

[0033] The present invention

[12] includes the wiring circuit board of

[10] or

[11] above, wherein the wiring has a first conductor layer and a second conductor layer disposed on the first conductor layer, and the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion.

[0034] According to such a configuration, it is possible to suppress the occurrence of cracks in the first conductor layer of the second portion.

[0035] The present invention

[13] includes the wiring circuit board of

[10] or

[11] above, wherein the wiring has a first conductor layer and a second conductor layer disposed on the first conductor layer, and the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

[0036] According to such a configuration, it is possible to suppress the occurrence of cracks in the second conductor layer of the second portion.

[0037] The present invention

[14] includes the wiring circuit board of

[10] or

[11] above, wherein the wiring has a first conductor layer and a second conductor layer disposed on the first conductor layer, the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion, and the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

[0038] According to such a configuration, it is possible to suppress the occurrence of cracks in the first conductor layer of the second portion and also suppress the occurrence of cracks in the second conductor layer of the second portion.

[0039] The present invention

[15] includes any one of the wiring circuit boards

[10] to

[14] in which, in the first direction, the length of the second portion is 0.1% to 25% of the total length of the wiring arranged in the wiring portion.

[0040] According to such a configuration, the stress of the wiring arranged near the other end portion of the wiring portion can be more relaxed.

[0041] As a result, the occurrence of cracks in the wiring near the other end portion of the wiring portion can be more suppressed.

[0042] The present invention

[16] includes any one of the wiring circuit boards

[10] to

[15] in which the width of the second portion is 50% or more and less than 100% of the width of the main body portion.

[0043] According to such a configuration, the stress of the wiring arranged near the other end portion of the wiring portion can be more relaxed.

[0044] As a result, the occurrence of cracks in the wiring near the other end portion of the wiring portion can be more suppressed.

[0045] The present invention

[17] includes any one of the wiring circuit boards

[10] to

[16] , wherein the wiring circuit board has a metal support layer, an insulating layer arranged on one side of the metal support layer in the thickness direction of the metal support layer, and a conductor pattern arranged on one side of the insulating layer in the thickness direction and having the wiring, and the metal support layer is arranged in the first support portion, the second support portion, and the wiring portion.

[0046] The present invention

[18] includes any one of the wiring circuit boards

[10] to

[16] , wherein the wiring circuit board has a metal support layer, an insulating layer arranged on one side of the metal support layer in the thickness direction of the metal support layer, and a conductor pattern arranged on one side of the insulating layer in the thickness direction and having the wiring, and the metal support layer is not arranged in the wiring portion but is arranged in the first support portion and the second support portion.

Advantages of the Invention

[0047] According to the wiring circuit board of the present invention, it is possible to suppress the occurrence of cracks in the wiring in the vicinity of the end of the wiring portion.

Brief Description of the Drawings

[0048]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Mode for Carrying Out the Invention

[0049] 1. Wiring Circuit Board As shown in FIG. 1, the wiring circuit board 1 includes a plurality of support portions 2 (first support portion 2A and second support portion 2B) and a plurality of wiring portions 3A, 3B.

[0050] The first support portion 2A and the second support portion 2B are arranged at intervals in the first direction. The first direction is the direction in which the wiring 133A described later extends. The first direction is orthogonal to the thickness direction of the wiring circuit board 1. Each of the first support portion 2A and the second support portion 2B extends in the second direction. The second direction is orthogonal to both the first direction and the thickness direction. The first support portion 2A supports one end portion of each of the wiring portions 3A, 3B in the first direction. Terminals 131A, 131B of the conductor pattern 13 described later are arranged on the first support portion 2A. The second support portion 2B supports the other end portion of each of the wiring portions 3A, 3B in the first direction. Terminals 132A, 132B of the conductor pattern 13 described later are arranged on the second support portion 2B.

[0051] The wiring portions 3A and 3B are arranged between the first support portion 2A and the second support portion 2B in the first direction. In the present embodiment, each of the wiring portions 3A and 3B extends in the first direction. One end of each of the wiring portions 3A and 3B in the first direction is connected to the first support portion 2A. The other end of each of the wiring portions 3A and 3B in the first direction is connected to the second support portion 2B. Note that the shape of each of the wiring portions 3A and 3B is not limited. Each of the wiring portions 3A and 3B may be linear or curved. The wiring portions 3A and 3B are arranged side by side in the second direction. In other words, the wiring portions 3A and 3B are arranged side by side in a direction orthogonal to the direction in which the wiring portion 3A extends. The wiring portions 3A and 3B are arranged at intervals from each other in the second direction. In other words, the wiring portions 3A and 3B are arranged at intervals from each other in a direction orthogonal to the direction in which the wiring portion 3A extends. At least a part of the wiring 133A of the conductor pattern 13 described later is arranged in the wiring portion 3A. At least a part of the wiring 133B of the conductor pattern 13 described later is arranged in the wiring portion 3B.

[0052] The width W0 of the wiring portion 3A is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0053] Note that the "width" is the length in a direction orthogonal to both the direction in which the wiring portion extends and the thickness direction. For example, the "width" of the wiring portion 3A is the length in a direction orthogonal to both the direction in which the wiring portion 3A extends and the thickness direction. In the present embodiment, the "width" is the length in the second direction.

[0054] The interval D1 between the wiring portion 3A and the wiring portion 3B is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0055] As shown in FIG. 2, the wiring circuit board has a metal support layer 11, a first insulating layer 12, a conductor pattern 13, and a second insulating layer 14.

[0056] (1) Metal support layer The metal support layer 11 is disposed on the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A, 3B. That is, the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A, 3B have the metal support layer 11. The metal support layer 11 supports the first insulating layer 12, the conductor pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. Examples of the material of the metal support layer 11 include copper, nickel, cobalt, iron, and alloys thereof. Examples of the alloy include copper alloy. Preferably, the material of the metal support layer 11 is copper alloy.

[0057] The thickness T1 of the metal support layer 11 is, for example, 10 μm to 300 μm, preferably 50 μm to 250 μm.

[0058] As shown in FIG. 3, the width W1 of the metal support layer 11 of the wiring portion 3A is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm.

[0059] The width W1 of the metal support layer 11 of the wiring portion 3A may be the same as or different from the width W0 (see FIG. 1) of the wiring portion 3A. Specifically, the width W1 of the metal support layer 11 of the wiring portion 3A may be the same as or different from the width of the first insulating layer of the wiring portion 3A.

[0060] For example, when the width W1 of the metal support layer 11 of the wiring portion 3A is wider than the width of the first insulating layer of the wiring portion 3A and is the widest among the layers constituting the wiring portion 3A, the width W1 of the metal support layer 11 of the wiring portion 3A becomes the width W0 of the wiring portion 3A. That is, in this case, the width W1 of the metal support layer 11 of the wiring portion 3A is the same as the width W0 of the wiring portion 3A.

[0061] Also, for example, when the width of the first insulating layer of the wiring portion 3A is wider than the width W1 of the metal support layer 11 of the wiring portion 3A and is the widest among the layers constituting the wiring portion 3A, the width of the first insulating layer 12 of the wiring portion 3A becomes the width W0 of the wiring portion 3A. In this case, the width W1 of the metal support layer 11 of the wiring portion 3A is narrower than the width W0 of the wiring portion 3A.

[0062] The ratio (T1 / W1) of the thickness T1 to the width W1 of the metal support layer 11 of the wiring portion 3A is 2 or more, preferably 3 or more. Hereinafter, the ratio (T1 / W1) is defined as the aspect ratio of the metal support layer 11 of the wiring portion 3A.

[0063] When the aspect ratio (T1 / W1) of the metal support layer 11 of the wiring portion 3A is equal to or greater than the above lower limit value, the rigidity of the wiring portion 3A in the thickness direction can be ensured.

[0064] The aspect ratio (T1 / W1) of the metal support layer 11 of the wiring portion 3A is, for example, 30 or less, preferably 10 or less.

[0065] The aspect ratio (T1 / W1) of the metal support layer 11 of the wiring portion 3A may be 2 to 30, or 3 to 10.

[0066] The distance D2 between the metal support layer 11 of the wiring portion 3A and the metal support layer 11 of the wiring portion 3B is, for example, 5 μm to 300 μm, preferably 10 μm to 250 μm. The distance D2 may be the same as or different from the distance D1.

[0067] (2) First insulating layer As shown in FIG. 2, the first insulating layer 12 is disposed on the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A and 3B. That is, the support portion 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A and 3B have the first insulating layer 12. The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction of the metal support layer 11. The first insulating layer 12 is disposed on one surface of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed between the metal support layer 11 and the conductor pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the conductor pattern 13. The first insulating layer 12 is made of resin. Examples of the resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0068] (3) Conductor pattern The conductor pattern 13 is disposed on one side of the first insulating layer 12 in the thickness direction. The conductor pattern 13 is disposed on one surface of the first insulating layer 12 in the thickness direction. That is, the wirings 133A and 133B are disposed on the first insulating layer 12. The conductor pattern 13 is disposed on the opposite side of the metal support layer 11 with respect to the first insulating layer 12 in the thickness direction. The shape of the conductor pattern 13 is not limited.

[0069] As shown in FIG. 1, the conductor pattern 13 includes a plurality of terminals 131A and 131B, a plurality of terminals 132A and 132B, and a plurality of wirings 133A and 133B.

[0070] The terminals 131A and 131B are disposed on the first support portion 2A. Each of the terminals 131A and 131B has a square land shape. The terminals 131A and 131B are arranged in the second direction. The terminals 131A and 131B are spaced apart from each other in the second direction.

[0071] The terminals 132A and 132B are disposed on the second support portion 2B. Each of the terminals 132A and 132B has a square land shape. The terminals 132A and 132B are arranged in the second direction. The terminals 132A and 132B are spaced apart from each other in the second direction.

[0072] The wiring 133A electrically connects the terminal 131A and the terminal 132A. One end portion of the wiring 133A is connected to the terminal 131A. The other end portion of the wiring 133A is connected to the terminal 132A. At least a part of the wiring 133A is disposed in the wiring portion 3A. That is, the wiring portion 3A has the wiring 133A. The wiring 133A extends in the first direction.

[0073] The wiring 133B electrically connects the terminal 131B and the terminal 132B. One end of the wiring 133B is connected to the terminal 131B. The other end of the wiring 133B is connected to the terminal 132B. At least a part of the wiring 133B is disposed in the wiring portion 3B. That is, the wiring portion 3B has the wiring 133B. The wiring 133B extends in the first direction. The wirings 133A and 133B are arranged side by side in the second direction. The wirings 133A and 133B are spaced apart from each other in the second direction.

[0074] (4) Second insulating layer As shown in FIG. 2, the second insulating layer 14 covers all of the wirings 133A and 133B. The second insulating layer 14 is disposed on the first insulating layer 12 in the thickness direction. Note that the second insulating layer 14 does not cover the terminals 131A, 131B, 132A, and 132B. The second insulating layer 14 is made of resin. Examples of the resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0075] 2. Details of the wiring Next, with reference to FIG. 1, details of the wiring 133A will be described. Note that the wiring 133B has the same structure as the wiring 133A. The description of the wiring 133B will be omitted.

[0076] As shown in FIG. 1, the wiring 133A has a first portion 1331, a second portion 1332, a body portion 1333 (third portion), a fourth portion 1334, and a fifth portion 1335. The wiring 133A may not have the fourth portion 1334 and the fifth portion 1335.

[0077] The first portion 1331, the second portion 1332, and the body portion 1333 are disposed in the wiring portion 3A. The first portion 1331, the second portion 1332, and the body portion 1333 are disposed between the first support portion 2A and the second support portion 2B in the first direction.

[0078] The first part 1331 is arranged at one end of the wiring part 3A and in its vicinity in the first direction. The first part 1331 is arranged between the first support part 2A and the main body part 1333 in the first direction. The first part 1331 is connected to the first support part 2A. Specifically, one end of the first part 1331 in the first direction is connected to the fourth part 1334 of the wiring 133A. When the wiring 133A does not have the fourth part 1334, one end of the first part 1331 in the first direction may be connected to the terminal 131A. The first part 1331 is thinner than the main body part 1333.

[0079] In the first direction, the length L1 of the first part 1331 is, for example, 0.1% to 25% of the total length L0 of the wiring 133A arranged in the wiring part 3A, preferably 5% to 25%, more preferably 10% to 25%, and even more preferably 10% to 21%.

[0080] When the length L1 of the first part 1331 is within the above range, while suppressing an increase in the impedance of the wiring 133A, the stress of the first part 1331 can be more relaxed.

[0081] The width W11 of the first part 1331 is, for example, 50% or more and less than 100% of the width W13 of the main body part 1333, preferably 60% to 80%.

[0082] When the width W11 of the first part 1331 is within the above range, the stress of the first part 1331 can be more relaxed.

[0083] The ratio (W11 / W1) of the width W11 of the first part 1331 to the width W1 of the metal support layer 11 of the wiring part 3A is, for example, 200% or less, preferably 120% or less. The ratio (W11 / W1) is, for example, 50% or more.

[0084] When the ratio (W11 / W1) is within the above range, the stress of the first part 1331 can be more relaxed.

[0085] With respect to the width W0 of the wiring portion 3A, the ratio (W11 / W0) of the width W11 of the first portion 1331 is, for example, less than 100%, preferably 70% or less. The ratio (W11 / W0) is, for example, 50% or more.

[0086] When the ratio (W11 / W0) is within the above range, the stress of the first portion 1331 can be more effectively relieved.

[0087] The second portion 1332 is disposed in the first direction at the other end of the wiring portion 3A and in its vicinity. The second portion 1332 is disposed between the second support portion 2B and the main body portion 1333 in the first direction. The second portion 1332 is connected to the second support portion 2B. Specifically, one end of the second portion 1332 in the first direction is connected to the fifth portion 1335 of the wiring 133A. When the wiring 133A does not have the fifth portion 1335, one end of the first portion 1331 in the first direction may be connected to the terminal 132A. The second portion 1332 is thinner than the main body portion 1333. The width of the second portion 1332 may be the same as the width of the first portion 1331.

[0088] In the first direction, the length L2 of the second portion 1332 is, for example, 0.1% to 25%, preferably 5% to 25%, more preferably 10% to 25%, and even more preferably 10% to 21% of the total length L0 of the wiring 133A disposed in the wiring portion 3A.

[0089] When the length L2 of the second portion 1332 is within the above range, the stress of the second portion 1332 can be more effectively relieved.

[0090] The width W12 of the second portion 1332 is, for example, 50% or more and less than 100%, preferably 60% to 80% of the width W13 of the main body portion 1333.

[0091] When the width W12 of the second portion 1332 is within the above range, the stress of the second portion 1332 can be more effectively relieved.

[0092] With respect to the width W1 of the metal support layer 11 of the wiring portion 3A, the ratio (W12 / W1) of the width W12 of the second portion 1332 is, for example, 200% or less, preferably 120% or less. The ratio (W12 / W1) is, for example, 50% or more.

[0093] When the ratio (W12 / W1) is within the above range, the stress of the second portion 1332 can be more effectively relaxed.

[0094] With respect to the width W0 of the wiring portion 3A, the ratio (W12 / W0) of the width W12 of the second portion 1332 is, for example, less than 100%, preferably 70% or less. The ratio (W12 / W0) is, for example, 50% or more.

[0095] When the ratio (W12 / W0) is within the above range, the stress of the second portion 1332 can be more effectively relaxed.

[0096] The body portion 1333 is disposed between the first portion 1331 and the second portion 1332 in the first direction. The body portion 1333 is disposed away from the first portion 1331 and the second portion 1332 in the first direction. The body portion 1333 is disposed between the first portion 1331 and the second portion 1332 in the first direction. One end portion of the body portion 1333 in the first direction is connected to the first portion 1331. The other end portion of the body portion 1333 in the first direction is connected to the second portion 1332.

[0097] The fourth portion 1334 is disposed on the first support portion 2A. One end portion of the fourth portion 1334 in the first direction is connected to the terminal 131A. The other end portion of the fourth portion 1334 in the first direction is connected to the first portion 1331. The width of the fourth portion 1334 may be the same as the width of the body portion 1333.

[0098] The fifth portion 1335 is disposed on the second support portion 2B. One end portion of the fifth portion 1335 in the first direction is connected to the second portion 1332. The other end portion of the fifth portion 1335 in the first direction is connected to the terminal 132A. The width of the fifth portion 1335 may be the same as the width of the body portion 1333.

[0099] 2. Effects (1) According to the wiring circuit board 1, as shown in FIG. 1, the wiring 133A disposed in the wiring portion 3A is thinner than the main body portion 1333 disposed between the first portion 1331 connected to the first support portion 2A and the second portion 1332 connected to the second support portion 2B.

[0100] Therefore, when the wiring portion 3A moves, it is possible to suppress the stress from concentrating on the first portion 1331 and the second portion 1332 in the vicinity of the end of the wiring portion 3A. In other words, the stress of the wiring 133A disposed in the vicinity of the end of the wiring portion 3A can be relaxed.

[0101] As a result, it is possible to suppress the occurrence of cracks in the wiring 133A in the vicinity of the end of the wiring portion 3A.

[0102] (2) According to the wiring circuit board 1, as shown in FIG. 1, the length L1 of the first portion 1331 and the length L2 of the second portion 1332 are 0.1% to 25% of the total length L0 of the wiring 133A disposed in the wiring portion 3A.

[0103] Therefore, the stress of the first portion 1331 and the second portion 1332 can be more relaxed.

[0104] As a result, it is possible to more suppress the occurrence of cracks in the wiring 133A in the vicinity of the end of the wiring portion 3A.

[0105] (3) According to the wiring circuit board 1, as shown in FIG. 1, the width W12 of the first portion 1331 and the width W12 of the second portion 1332 are 50% or more and less than 100% of the width W13 of the main body portion 1333.

[0106] Therefore, the stress of the first portion 1331 and the second portion 1332 can be more relaxed.

[0107] As a result, it is possible to more suppress the occurrence of cracks in the wiring 133A in the vicinity of the end of the wiring portion 3A.

[0108] 3. Modification Example Next, a modification example will be described. In the modification example, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0109] (1) As shown in FIG. 4, each of the wiring portions 3A and 3B may have a plurality of wirings 201. Specifically, the wiring circuit board 1 has a conductor pattern 20 instead of the conductor pattern 13. The conductor pattern 20 has a plurality of terminals 201A, 201B, 201C, 201D, a plurality of terminals 202A, 202B, 202C, 202D, and a plurality of wirings 203A, 203B, 203C, 203D.

[0110] The terminals 201A, 201B, 201C, and 201D are arranged on the first support portion 2A. The terminals 201A, 201B, 201C, and 201D are arranged in the second direction. The terminals 201A, 201B, 201C, and 201D are arranged at intervals from each other in the second direction.

[0111] The terminals 202A, 202B, 202C, and 202D are arranged on the second support portion 2B. The terminals 202A, 202B, 202C, and 202D are arranged in the second direction. The terminals 202A, 202B, 202C, and 202D are arranged at intervals from each other in the second direction.

[0112] The wiring 203A electrically connects the terminal 201A and the terminal 202A. The wiring 203B electrically connects the terminal 201B and the terminal 202B. The wirings 203A and 203B are arranged in the second direction. The wirings 203A and 203B are arranged at intervals from each other in the second direction. The wiring 203A and the wiring 203B are arranged in the wiring portion 3A.

[0113] The wiring 203C electrically connects the terminal 201C and the terminal 202C. The wiring 203D electrically connects the terminal 201D and the terminal 202D. The wirings 203C and 203D are arranged in the second direction. The wirings 203C and 203D are arranged at intervals from each other in the second direction. The wiring 203C and the wiring 203D are arranged in the wiring portion 3B.

[0114] In all of the wirings 203A, 203B, 203C, and 203D, the first portion 2031 and the second portion 2032 are thinner than the body portion 2033.

[0115] According to this modification example, in all of the wirings 203A, 203B, 203C, and 203D, it is possible to suppress the occurrence of cracks.

[0116] (2) The wiring portion 3A may have a plurality of conductor layers (for example, the first conductor layer 30A and the second conductor layer 30B).

[0117] For example, as shown in FIG. 5, the conductor pattern 30 may have the first conductor layer 30A and the second conductor layer 30B. In other words, the wiring 303A has the first conductor layer 30A and the second conductor layer 30B. The first conductor layer 30A is disposed on the first insulating layer 12. The second conductor layer 30B is disposed on the first conductor layer 30A.

[0118] The first conductor layer 30A of the first portion 3031 and the second portion 3032 may be thinner than the first conductor layer 30A of the body portion 3033. If the first conductor layer 30A of the first portion 3031 and the second portion 3032 is thinner than the first conductor layer 30A of the body portion 3033, it is possible to suppress the occurrence of cracks in the first conductor layer 30A of the first portion 3031 and the second portion 3032.

[0119] Also, as shown in FIG. 6, the second conductor layer 30B of the first portion 3031 and the second portion 3032 may be thinner than the second conductor layer 30B of the body portion 3033. If the second conductor layer 30B of the first portion 3031 and the second portion 3032 is thinner than the second conductor layer 30B of the body portion 3033, it is possible to suppress the occurrence of cracks in the second conductor layer 30B of the first portion 3031 and the second portion 3032.

[0120] Also, as shown in FIG. 7, the first conductor layer 30A of the first portion 3031 and the second portion 3032 may be thinner than the first conductor layer 30A of the main body portion 3033, and the second conductor layer 30B of the first portion 3031 and the second portion 3032 may be thinner than the second conductor layer 30B of the main body portion 3033. In this case, in the first portion 3031 and the second portion 3032, it is possible to suppress the occurrence of cracks in the first conductor layer 30A and also suppress the occurrence of cracks in the second conductor layer 30B.

[0121] (3) As shown in FIG. 8, the wiring portion 3A may have an intermediate insulating layer 41 between the first conductor layer 30A and the second conductor layer 30B. The intermediate insulating layer 41 is disposed on the first insulating layer 12. The intermediate insulating layer 41 covers the first conductor layer 30A. The second insulating layer 14 is disposed on the intermediate insulating layer 41. The second insulating layer 14 covers the second conductor layer 30B. The first conductor layer 30A is, for example, a signal wiring, and the second conductor layer 30B is, for example, a shield conductor layer.

[0122] Also in this modification, as in the above-described modification (2), the first conductor layer 30A of the first portion 3031 and the second portion 3032 may be made thinner than the first conductor layer 30A of the main body portion 3033. Further, the second conductor layer 30B of the first portion 3031 and the second portion 3032 may be made thinner than the second conductor layer 30B of the main body portion 3033.

[0123] Also in this modification, the same operational effects as those of the above-described modification (2) can be obtained.

[0124] (4) The wiring circuit board 1 may have three or more support portions 2. For example, as shown in FIG. 9, in addition to the above-described first support portion 2A, second support portion 2B, and a plurality of wiring portions 3A, 3B, the wiring circuit board 1 may have a third support portion 2C and a plurality of wiring portions 50A, 50B.

[0125] In this case, the terminals 132A and 132B are not arranged on the second support portion 2B but on the third support portion 2C. Each of the wirings 133A and 133B extends from the first support portion 2A, passes through the second support portion 2B, and reaches the third support portion 2C. Intermediate portions (sixth portions 1336) of each of the wirings 133A and 133B are arranged on the second support portion 2B.

[0126] The third support portion 2C is arranged on the opposite side of the first support portion 2A with respect to the second support portion 2B in the first direction. In other words, the second support portion 2B is arranged between the first support portion 2A and the third support portion 2C in the first direction. The third support portion 2C extends in the second direction. The third support portion 2C supports the other end portions of the wiring portions 50A and 50B in the first direction. Note that one end portion of each of the wiring portions 50A and 50B in the first direction is supported by the second support portion 2B.

[0127] The wiring portion 50A has the same structure as the wiring portion 3A. Specifically, the wiring 133A arranged in the wiring portion 50A has a first portion 1331, a second portion 1332, and a body portion 1333, similar to the wiring 133A arranged in the wiring portion 3A. Also in the wiring portion 50A, the first portion 1331 and the second portion 1332 are thinner than the body portion 1333.

[0128] In the wiring portion 50A, the first portion 1331 is arranged at one end portion of the wiring portion 50A in the first direction. The first portion 1331 in the wiring portion 50A is arranged between the second support portion 2B and the body portion 1333 in the first direction and is connected to the second support portion 2B. Specifically, the first portion 1331 in the wiring portion 50A is connected to the sixth portion 1336.

[0129] In the wiring portion 50A, the second portion 1332 is arranged at the other end portion of the wiring portion 50A in the first direction. The second portion 1332 in the wiring portion 50A is arranged between the body portion 1333 and the third support portion 2C in the first direction and is connected to the third support portion 2C. Specifically, the second portion 1332 in the wiring portion 50A is connected to the fifth portion 1335.

[0130] Even in this modification, the same operational effects as those of the above-described embodiment can be obtained.

[0131] Also, in this modification, the middle portion (the sixth portion 1336) of the wirings 133A and 133B can be supported by the second support portion 2B.

[0132] (5) As shown in FIG. 10, the first portion 1331 may have a tapered shape in which the width W11 becomes narrower as it approaches the first support portion 2A from the main body portion 1333. The second portion 1332 may have a tapered shape in which the width W12 becomes narrower as it approaches the second support portion 2B from the main body portion 1333.

[0133] Even in this modification, the same operational effects as those of the above-described embodiment can be obtained.

[0134] (6) As shown in FIG. 11, the metal support layer 11 may not be disposed in the wiring portion 3A, but may be disposed in the first support portion 2A and the second support portion 2B. In this case, as shown in FIG. 12, the wiring portion 3A does not have the metal support layer 11, but has the first insulating layer 12, the wiring 133A, and the second insulating layer 14.

[0135] Even in this modification, the same operational effects as those of the above-described embodiment can be obtained.

[0136] (7) As shown in FIG. 13, the wiring circuit board 1 may not include the metal support layer 11. In other words, the support portions 2 (the first support portion 2A and the second support portion 2B) and the wiring portions 3A and 3B may not have the metal support layer 11.

[0137] Even in this modification, the same operational effects as those of the above-described embodiment can be obtained.

[0138] (8) As shown in FIG. 14, even when the conductor pattern 30 has a plurality of conductor layers (for example, the first conductor layer 30A and the second conductor layer 30B) and the intermediate insulating layer 41 disposed between the first conductor layer 30A and the second conductor layer 30B, the wiring portion 3A may not have the metal support layer 11.

[0139] (9) As shown in FIG. 15, the wiring circuit board 1 may include a second conductor pattern 61 and a third insulating layer 62.

[0140] The second conductor pattern 61 is disposed on the other side of the first insulating layer 12 in the thickness direction. The second conductor pattern 61 is disposed on the other surface of the first insulating layer 12 in the thickness direction. The second conductor pattern 61 is disposed on the side opposite to the conductor pattern 30 with respect to the first insulating layer 12 in the thickness direction.

[0141] The third insulating layer 62 covers the second conductor pattern 61. The third insulating layer 62 is disposed on the other side of the first insulating layer 12 in the thickness direction. The third insulating layer 62 is disposed on the other surface of the first insulating layer 12 in the thickness direction.

[0142] Even in this modification, the same operational effects as those of the above-described embodiment can be obtained. Also, in this modification, the wiring portion 3A may not include the metal support layer 11.

[0143] (10) As shown in FIGS. 16A and 16B, when the wiring circuit board 1 includes the second conductor pattern 61, the wiring circuit board 1 may have a terminal 131C electrically connected to the second conductor pattern 61.

[0144] Specifically, as shown in FIG. 16A, the wiring circuit board 1 may include a terminal 131C and a wiring 133C.

[0145] The terminal 131C is disposed on the first support portion 2A. The terminal 131C is disposed on the first insulating layer 12. The terminal 131C is disposed on one surface of the first insulating layer 12 in the thickness direction.

[0146] The wiring 133C is arranged on the first support portion 2A. The wiring 133C is arranged away from the wiring 133A. The wiring 133C is arranged on the first insulating layer 12. The wiring 133C is arranged on one surface of the first insulating layer 12 in the thickness direction. One end portion of the wiring 133C is connected to the terminal 131C. The other end portion of the wiring 133C is connected to the second conductor pattern 61 through the through hole 120 (via hole) of the first insulating layer 12. Thereby, the terminal 131C is electrically connected to the second conductor pattern 61 through the wiring 133C.

[0147] Note that, as shown in FIG. 16B, the terminal 131C may be directly connected to the second conductor pattern 61 through the through hole 120 (via hole) of the first insulating layer 12. In this case, the wiring circuit board 1 does not include the wiring 133C.

[0148] (11) As shown in FIG. 17, the second insulating layer 14 may be adhered to one surface of the first insulating layer 12 in the thickness direction and the conductor pattern 13 by the adhesive 63.

[0149] Further, when the wiring circuit board 1 includes the second conductor pattern 61 and the third insulating layer 62, the third insulating layer 62 may be adhered to the other surface of the first insulating layer 12 in the thickness direction and the second conductor pattern 61 by the adhesive 63.

[0150] Further, when the wiring circuit board 1 includes the second conductor pattern 61 and the third insulating layer 62, the wiring circuit board 1 may have a metal support layer 11. The metal support layer 11 may not be arranged in the wiring portion 3A, and may be arranged in the first support portion 2A and the second support portion 2B. The metal support layer 11 may be adhered to the third insulating layer 62 by the adhesive 64. The adhesive 64 is a conductive adhesive, and may be in contact with the second conductor pattern 61 through the through hole 62A of the third insulating layer 62. The second conductor pattern 61 may be electrically connected to the metal support layer 11 through the adhesive 64 (conductive adhesive).

[0151] Even in this modification example, the same operational effects as those of the above-described embodiment can be obtained.

Example

[0152] Next, the present invention will be described based on examples and comparative examples. The present invention is not limited by the following examples. Also, specific numerical values such as physical property values and parameters used in the following description can be replaced with the upper limit values (numerical values defined as "hereinafter" and "less than") or lower limit values (numerical values defined as "above" and "greater than") of the corresponding physical property values, parameters, etc. described in the above "Mode for Carrying Out the Invention".

[0153] The maximum stress of the simulation models of the wiring parts in the following examples and comparative examples was calculated by Ansys Mechanical (finite element method analysis software, manufactured by Ansys, Inc.).

[0154] (1) Example As shown in FIG. 1, a simulation model was created in which the widths of both ends (the first part and the second part) of the wiring arranged in the wiring part were set to be narrower than the width of the part (the main body part) between the first part and the second part (the width W0 of the wiring part: 100 μm, the width W1 of the metal support layer: 40 μm, the width W11 of the first part: 40 μm, the width W12 of the second part: 40 μm, the width W13 of the main body part: 55 μm), the length L0 of the wiring part: 500 μm, the length L1 of the first part: 100 μm, the length L2 of the second part: 100 μm, and the length L3 of the main body part: 300 μm). The maximum stress of the first part and the second part of the wiring was 75 MPa. The material of the wiring was copper, and the elastic modulus of the wiring was 100 GPa.

[0155] (2) Comparative Example A simulation model of the wiring in which the first part, the second part, and the main body part had the same width (the width W0 of the wiring part: 100 μm, the width W1 of the metal support layer: 40 μm, the width of the wiring: 55 μm) was created in the same manner as in the example except that the widths of the first part and the second part were changed. The maximum stress of the first part and the second part of the wiring was 100 MPa.

Explanation of Reference Numerals

[0156] 1 Wiring circuit board 2A First support part 2B Second support part 3A Wiring part 3B Wiring part 133A Wiring 133B Wiring 1331 First part 1332 Second part 1333 Body part

Claims

1. A plurality of wiring portions extending in a first direction and arranged at intervals from each other, and a first support portion that supports one end portion of each of the plurality of wiring portions in the first direction. Each of the plurality of wiring portions has a wiring extending in the first direction, and the wiring has a body portion arranged away from the first support portion in the first direction, and a first portion arranged between the first support portion and the body portion in the first direction and connected to the first support portion. The first portion is a wiring circuit board that is thinner than the body portion.

2. Each of the plurality of wiring portions has a plurality of the wirings, and in all of the wirings, the first portion is thinner than the body portion. The wiring circuit board according to claim 1.

3. The wiring has a first conductor layer, and a second conductor layer disposed on the first conductor layer. The first conductor layer of the first portion is thinner than the first conductor layer of the body portion. The wiring circuit board according to claim 1.

4. The wiring has a first conductor layer, and a second conductor layer disposed on the first conductor layer. The second conductor layer of the first portion is thinner than the second conductor layer of the body portion. The wiring circuit board according to claim 1.

5. The wiring has a first conductor layer, and a second conductor layer disposed on the first conductor layer. The first conductor layer of the first portion is thinner than the first conductor layer of the body portion, and the second conductor layer of the first portion is thinner than the second conductor layer of the body portion. The wiring circuit board according to claim 1.

6. In the first direction, the length of the first portion is 0.1% to 25% of the total length of the wiring disposed in the wiring portion. The wiring circuit board according to claim 1.

7. The width of the first portion is 50% or more and less than 100% of the width of the body portion. The wiring circuit board according to claim 1.

8. The wiring circuit board has a metal support layer, an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer, and a conductor pattern having the wiring disposed on one side of the insulating layer in the thickness direction. The metal support layer is disposed on the first support portion and the wiring portion. The wiring circuit board according to claim 1. ​ ​ ​ ​ ​ ​ ​ ​ ​ A conductor pattern having the wiring and disposed on one side of the insulating layer in the thickness direction having The wiring circuit board according to claim 1, wherein the metal support layer is not disposed in the wiring portion but is disposed in the first support portion.

10. The wiring circuit board further includes a second support portion that supports the other ends of the plurality of wiring portions in the first direction, The wiring is further provided with a second portion disposed between the second support portion and the main body portion in the first direction and connected to the second support portion, The wiring circuit board according to claim 1, wherein the second portion is thinner than the main body portion.

11. Each of the plurality of wiring portions has a plurality of the wirings, The wiring circuit board according to claim 10, wherein in all of the wirings, the second portion is thinner than the main body portion.

12. The wiring a first conductor layer, a second conductor layer disposed on the first conductor layer having The wiring circuit board according to claim 10, wherein the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion.

13. The wiring a first conductor layer, a second conductor layer disposed on the first conductor layer having The wiring circuit board according to claim 10, wherein the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

14. The wiring a first conductor layer, a second conductor layer disposed on the first conductor layer having the first conductor layer of the second portion is thinner than the first conductor layer of the main body portion, and The wiring circuit board according to claim 10, wherein the second conductor layer of the second portion is thinner than the second conductor layer of the main body portion.

15. In the first direction, the length of the second portion is 0.1% to 25% of the total length of the wiring disposed in the wiring portion. The wiring circuit board according to claim 10.

16. The width of the second portion is 50% or more and less than 100% of the width of the main body portion. The wiring circuit board according to claim 10.

17. The wiring circuit board a metal support layer, an insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer, a conductor pattern having the wiring and disposed on one side of the insulating layer in the thickness direction having The wiring circuit board according to claim 10, wherein the metal support layer is disposed in the first support portion, the second support portion, and the wiring portion.

18. The wiring circuit board a metal support layer, An insulating layer disposed on one side of the metal support layer in the thickness direction of the metal support layer; A conductor pattern disposed on one side of the insulating layer in the thickness direction and having the wiring; and having; The metal support layer is not disposed in the wiring portion but is disposed in the first support portion and the second support portion. The wiring circuit board according to claim 10.

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