Laser processing system

Abstract

To reduce load on a drive component for driving a lifter vertically.SOLUTION: A laser processing system 1 includes: a storage shelf 3 provided on an upper part of a laser beam machine 13 performing laser processing of a work-piece and storing a pallet P on which the work-piece is mounted; a lifter 5 disposed on the side of the storage shelf 3 and the laser beam machine 13 and on which the pallet P can be mounted; and a lifter driving part 7 for supporting one of end parts of the lifter 5 and moving the lifter 5 vertically between the storage shelf 3 and the laser beam machine 13. A control part 9 causes the lifter support part operate so as to support the lifter when the lifter 5 is stopped within a prescribed range in the vertical direction with a floor surface where the laser beam machine 13 is installed as a reference.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laser processing system.

Background Art

[0002] A laser processing system in which a pallet storage unit and a laser processing machine are provided adjacent to each other vertically is disclosed in Patent Document 1. The laser processing system disclosed in Patent Document 1 includes a lifter that moves a pallet on which a workpiece is placed in the vertical direction, and the lifter moves the pallet from a pallet storage unit disposed above to a laser processing unit disposed below.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional laser processing system, when a large load acts on the lifter, the load on the drive components for driving the lifter vertically has been large.

Means for Solving the Problems

[0005] Aspects of one or more embodiments are provided above a laser processing machine that performs laser processing on a workpiece, and include a storage shelf for storing a pallet on which the workpiece is placed, a lifter disposed on the side of the storage shelf and the laser processing machine and capable of placing the pallet thereon, a lifter drive unit that supports one end of the lifter and moves the lifter in the vertical direction between the storage shelf and the laser processing machine, a lifter support unit disposed on the other end side of the lifter rather than one end of the lifter and capable of supporting the lifter, and a control unit that controls the lifter drive unit and the lifter support unit. The control unit is a laser processing system that operates the lifter support unit to support the lifter when the lifter is stopped within a predetermined range in the vertical direction with reference to the floor surface on which the laser processing machine is installed.

Advantages of the Invention

[0006] According to the laser processing system according to one or more embodiments, by operating the lifter support unit, the load on the drive components of the lifter can be reduced.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 7C

Figure 8A

Figure 8B

Figure 8C

Figure 8D

Figure 8E

Figure 8F

Figure 8G

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

MODE FOR CARRYING OUT THE INVENTION

[0008] (First Embodiment) Hereinafter, with reference to the drawings, the laser processing system 1 according to the present embodiment will be described. FIG. 1 is a side view showing the configuration of the laser processing system 1 according to the first embodiment. The laser processing system 1 according to the present embodiment includes a storage shelf 3, a lifter 5, a lifter drive unit 7, a control unit 9, a lifter support portion 11, and a laser processing machine 13.

[0009] The laser processing system 1 exchanges the pallet P on which the workpiece is placed between the laser processing machine 13 and the storage shelf 3. Specifically, the laser processing system 1 carries out the pallet P on which the workpiece to be processed is placed from the storage shelf 3 and carries it into the laser processing machine 13. When the processing by the laser processing machine 13 is completed, the laser processing system 1 carries out the pallet P from the laser processing machine 13 and stores the carried-out pallet P in the storage shelf 3. Then, the laser processing system 1 carries out a new pallet P from the storage shelf 3 and carries it into the laser processing machine 13.

[0010] The pallet P has a rectangular shape that is horizontally long along the left - right direction. A plurality of workpiece support members Ps for supporting the workpiece are provided on the pallet P. The plurality of workpiece support members Ps are arranged at intervals in the left - right direction. The workpiece support member Ps is a plate - shaped member extending in the front - rear direction (the direction perpendicular to the paper surface in FIG. 1) and is arranged in an upright state along the up - down direction.

[0011] The laser processing machine 13 performs laser processing on the workpiece on the pallet P. The laser processing machine 13 has a shape that is long in the left - right direction corresponding to the shape of the pallet P. The laser processing machine 13 can move the pallet P with the lifter 5, and can receive the pallet P supplied from the lifter 5 or carry out the pallet P to the lifter 5. The movement of the pallet P between the laser processing machine 13 and the lifter 5 is performed along the left - right direction which is the longitudinal direction of the pallet P.

[0012] The storage shelf 3 is arranged above the laser processing machine 13 and stores the pallet P. The storage shelf 3 is provided with a plurality of shelves arranged in the vertical direction and can store a plurality of pallets P. The storage shelf 3 also has a shape that is long in the left - right direction corresponding to the shape of the pallet P. The storage shelf 3 can move the pallet P with the lifter 5, and can receive the pallet P supplied from the lifter 5 or carry out the pallet P to the lifter 5. The movement of the pallet P between the storage shelf 3 and the lifter 5 is performed along the left - right direction which is the longitudinal direction of the pallet P.

[0013] The lifter 5 is arranged on the side, for example, the right side of the storage shelf 3 and the laser processing machine 13, and is configured such that the pallet P can be placed thereon. The lifter 5 moves in the vertical direction with the pallet P placed thereon and moves the pallet P between the storage shelf 3 and the laser processing machine 13. The lifter 5 corresponds to the shape of the pallet P and has a horizontally long shape with the size in the left - right direction larger than the size in the front - rear direction. The lifter 5 is connected to the lifter drive unit 7. The lifter 5 is driven by the lifter drive unit 7 to move in the vertical direction between the storage shelf 3 and the laser processing machine 13. The lifter drive unit 7 is connected to the left - hand end (one end) in the left - right direction (longitudinal direction) of the lifter 5, and the right - hand end (the other end) in the left - right direction of the lifter 5 is a free end.

[0014] FIG. 2 is a perspective view showing the structure of the lifter 5 of the laser processing system 1 according to the first embodiment. The lifter 5 includes support members 51A and 51B, connecting members 52A and 52B, and connection members 53A and 53B. The support members 51A and 51B are formed to have a length corresponding to the long side of the pallet P and support the pallet P. The connecting members 52A and 52B are formed to have a length corresponding to the short side of the pallet P and connect the support members 51A and 51B to each other. The connection members 53A and 53B connect the left ends of the support members 51A and 51B to the lifter driving unit 7.

[0015] The support members 51A and 51B have a long shape in the left-right direction and are only supported in a cantilever state. Therefore, when a large load acts on the lifter 5, a large load is applied to the connection members 53A and 53B. Thus, as will be described later, the lifter support portion 11 (see FIG. 4A) supports the lifter 5 with respect to the floor surface, thereby reducing the load applied to the connection members 53A and 53B.

[0016] FIG. 3 is a diagram for explaining the structure of the lifter driving unit 7 of the laser processing system 1 according to the first embodiment. The lifter driving unit 7 supports the left end of the lifter 5 and moves the lifter 5 in the vertical direction between the storage shelf 3 and the laser processing machine 13. The lifter driving unit 7 includes a rail 31 extending in the vertical direction. The connection members 53A and 53B of the lifter 5 include cam followers 54 which are driving components for driving the lifter up and down. The lifter 5 is supported by the lifter driving unit 7 by sandwiching the rail 31 from both sides with the cam followers 54. The lifter driving unit 7 has an endless chain 32 stretched along the rail 31, and the connection members 53A and 53B of the lifter 5 are connected to the chain 32. By rotating the chain 32 by a driving motor (not shown), the lifter 5 can be moved in the vertical direction.

[0017] As shown in FIG. 1, the control unit 9 controls the lifter drive unit 7 and the lifter support unit 11. In particular, when the control unit 9 stops the lifter 5 within a predetermined vertical range Ra with respect to the floor surface where the laser processing machine 13 is installed, the control unit 9 operates the lifter support unit 11 to support the lifter 5. Specific control for supporting the lifter 5 will be described later.

[0018] The control unit 9 is constituted by a computer having a memory, a processor such as a CPU (Central Processing Unit), and various interfaces. The memory and various interfaces are connected to the processor via a bus. By executing the program stored in the memory by the processor, the control unit 9 executes a process of exchanging the pallet P between the storage shelf 3 and the laser processing machine 13.

[0019] FIG. 4A is a diagram showing the structure of the lifter support unit 11 of the laser processing system 1 according to the first embodiment. FIG. 4B is an enlarged view of part A of FIG. 4A for showing the structure of the lifter support unit 11 of the laser processing system 1 according to the first embodiment. FIG. 5 is a perspective view showing the structure of the support table 62 of the laser processing system 1 according to the first embodiment. As shown in FIG. 4A, a support table 62 is disposed on the floor surface below the lifter 5. As shown in FIG. 5, the support table 62 is provided with a plurality of rod-shaped pins 66 on the upper surface 65 supported by the support columns 64. Each pin 66 penetrates vertically through the gap between the respective work support members Ps of the pallet P and can project upward from the upper surface of the pallet P. Each pin 66 of the support table 62 can temporarily support the work when the work is carried into the pallet P placed on the lifter 5.

[0020] As shown in FIG. 4A, the lifter support unit 11 is disposed at the end of the lifter 5 opposite to the connection members 53A and 53B, that is, at the right end of the lifter 5. The lifter support unit 11 can support the lifter 5 with respect to the floor surface where the laser processing machine 13 is installed. The lifter support unit 11 includes a brake rail 61 and a gripping device 63.

[0021] The brake rail 61 is provided on the lifter 5 and extends in the vertical direction. As shown in FIGS. 2 and 4A, the brake rail 61 is provided on the connecting member 52B of the lifter 5. Therefore, the brake rail 61 is provided at the right end of the lifter 5. As shown in FIG. 4B, the brake rail 61 is formed of a plate-like member and is provided in an upright state such that the plane of the plate-like member is perpendicular. The brake rail 61 is provided on the left side of the connecting member 52B, that is, at a position facing the support table 62.

[0022] As shown in FIG. 4A, the gripping device 63 is provided on the support table 62 and is supported on the floor surface via the support table 62. The gripping device 63 grips the brake rail 61. As shown in FIG. 5, the gripping device 63 is provided on the right side of the support table 62, that is, at a position facing the brake rail 61.

[0023] FIG. 6 is a diagram for explaining the structure of the gripping device 63 of the laser processing system 1 according to the first embodiment. The gripping device 63 includes clamp portions 71A, 71B formed of a link mechanism, and a cylinder 72 that switches the open / closed state of the clamp portions 71A, 71B. The left and right clamp portions 71A, 71B are connected to the cylinder 72. By pulling the cylinder 72, the clamp portions 71A, 71B are in an open state. On the other hand, by pushing out the cylinder 72, the clamp portions 71A, 71B are in a closed state. The gripping device 63 is arranged such that the brake rail 61 is positioned between the clamp portions 71A, 71B.

[0024] As shown in FIG. 4A, when the lifter 5 stops within a predetermined range Ra in the vertical direction, the gripping device 63 grips the brake rail 61. This predetermined range Ra is a range preset as a lifter holding area and is a range in which the gripping device 63 can grip the brake rail 61. The lifter holding area is, for example, a range in which the height of the pallet P is from 700 mm to 980 mm from the floor surface.

[0025] Figures 7A to 7C are diagrams showing the relationship between the gripping device 63 and the brake rail 61 in the laser processing system 1 according to the first embodiment. The lifter holding area will be described with reference to Figures 7A to 7C.

[0026] As shown in Figure 7A, when the height of the pallet P is 700 mm from the floor surface, it is an example of the work supply height, that is, the height for supplying the work to the pallet P. When the height of the pallet P is 700 mm from the floor surface, the pin 66 of the support table 62 protrudes above the upper surface of the pallet P. Even if the work is carried onto the pallet P by a crane or a forklift, the work can be supported by the pin 66 of the support table 62, so no large load is applied to the lifter 5. When the height of the pallet P is 700 mm from the floor surface, the lifter 5 has descended to the lowest position with respect to the floor surface. The gripping device 63 grips the upper end of the brake rail 61.

[0027] As shown in Figure 7B, when the height of the pallet P is 940 mm from the floor surface, it is an example of the pass line height, that is, the height for carrying the pallet P from the lifter 5 to the laser processing machine 13. When the lifter 5 is raised and the pallet P is moved from a height of 700 mm from the floor surface to a height of 940 mm, the upper surface of the pallet P rises above the pin 66 of the support table 62, and the work is transferred from the support table 62 to the pallet P. Then, when the pallet P reaches a height of 940 mm from the floor surface, the pallet P can be carried into the laser processing machine 13. When the height of the pallet P is 940 mm from the floor surface, since the lifter 5 has risen compared to the case where the height of the pallet P is 700 mm from the floor surface, the gripping device 63 grips below the brake rail 61.

[0028] As shown in FIG. 7C, when the height of the pallet P is 980 mm from the floor surface, it is an example of the upper limit height, that is, the upper limit of the range in which the gripping device 63 can grip the brake rail 61. In this case, the gripping device 63 is gripping the lower end portion of the brake rail 61. Thus, the gripping device 63 is set to be able to grip the brake rail 61 within the lifter holding area where the height of the pallet P ranges from 700 mm to 980 mm from the floor surface.

[0029] FIGS. 8A to 8G are diagrams for explaining the operation of the lifter support portion 11 in the laser processing system 1 according to the first embodiment. Hereinafter, the operation of the lifter support portion 11 will be described.

[0030] As shown in FIG. 8A, when loading the workpiece onto the pallet P1, the lifter 5 on which the pallet P1 is placed is moved to the workpiece supply height where the height of the pallet P1 is 700 mm from the floor surface. At this time, with the gripping device 63 gripping the brake rail 61, the workpiece is loaded onto the pallet P1. When the workpiece is loaded, the gripping device 63 releases the brake rail 61 once, and the lifter 5 rises to the pass line height where the height of the pallet P1 is 940 mm from the floor surface.

[0031] As shown in FIG. 8B, when the lifter 5 is raised and the pallet P1 is moved from a height of 700 mm to a height of 940 mm from the floor surface, the upper surface of the pallet P rises above the pin 66 of the support table 62, and the workpiece is transferred from the support table 62 to the pallet P. When the lifter 5 rises to the pass line height of 940 mm from the floor surface, the gripping device 63 grips the brake rail 61. In this state, the pallet P1 is loaded into the laser processing machine 13, and laser processing is performed on the workpiece on the pallet P1. When the processing is completed, as shown in FIG. 8C, the pallet P1 is unloaded from the laser processing machine 13 to the lifter 5. Next, the gripping device 63 releases the brake rail 61. As shown in FIG. 8D, when the lifter 5 rises to the storage shelf 3, then the pallet P1 is stored in the storage shelf 3.

[0032] As shown in FIG. 8E, in order to process the new pallet P2, when the pallet P2 is carried out from the storage shelf 3 to the lifter 5, the lifter 5 descends to a pass line height of 940 mm from the floor surface. When the lifter 5 descends to the pass line height, as shown in FIG. 8F, the gripping device 63 grips the brake rail 61. As shown in FIG. 8G, the pallet P2 is carried into the laser processing machine 13, and laser processing is performed on the workpiece on the pallet P2. Thus, in the laser processing system 1 according to the present embodiment, when the lifter 5 is moved up and down and stops within the lifter holding area, the gripping device 63 grips the brake rail 61.

[0033] FIG. 9 is a flowchart showing the procedure of the control process of the gripping device 63 by the laser processing system 1 according to the first embodiment. The control process of the gripping device 63 by the control unit 9 will be described.

[0034] In step S101, the control unit 9 determines whether an operation command for moving the lifter 5 has been received. If received, it proceeds to step S103. If not received, it determines again whether an operation command has been received.

[0035] In step S103, the control unit 9 outputs a brake-off command for opening the gripping device 63, and controls the gripping device 63 to release the brake rail 61.

[0036] In step S105, the control unit 9 determines whether the gripping device 63 has been opened by the brake-off command in step S103. The determination of whether it is in the open state can be made by an auto-switch provided in the cylinder 72 of the gripping device 63. If the gripping device 63 is in the open state, it proceeds to step S107. If it is not in the open state, that is, if it remains in the closed state, it proceeds to step S121.

[0037] In step S107, after the lifter 5 moves according to the operation command in step S101, the control unit 9 determines whether the stopped position is within the lifter holding area. As described with reference to FIG. 7, the lifter holding area is set such that the height of the pallet P from the floor surface ranges from 700 mm to 980 mm from the floor surface. Therefore, the control unit 9 determines whether the lifter 5 has stopped within the lifter holding area. If it has stopped within the lifter holding area, the process proceeds to step S111. If it has stopped outside the lifter holding area, the process proceeds to step S109.

[0038] In step S109, the control unit 9 determines whether the gripping device 63 is in the open state. If it is in the open state, the process returns to step S101. If it is not in the open state, that is, if it is in the closed state, the process proceeds to step S121.

[0039] In step S111, the control unit 9 outputs a brake-on command to close the gripping device 63, causing the gripping device 63 to grip the brake rail 61. That is, when the lifter is stopped in the lifter holding area, the control unit 9 operates the lifter support portion 11 to support the lifter 5.

[0040] In step S113, the control unit 9 determines whether the gripping device 63 has been closed by the brake-on command in step S111. If the gripping device 63 has been closed, the control unit 9 determines that the lifter 5 has stopped normally within the lifter holding area and ends the control process of the gripping device 63 according to the present embodiment. On the other hand, if the gripping device 63 has not been closed, the control unit 9 determines that the gripping device 63 has not gripped normally and proceeds to step S115.

[0041] In step S115, the control unit 9 determines whether the brake-on command output because the gripping device 63 could not grip normally is the third time. If it is the third time, the process proceeds to step S121. If it is less than the third time, the process proceeds to step S117.

[0042] In step S117, since the gripping device 63 cannot grip properly, the control unit 9 outputs a brake-off command to open the gripping device 63 once and releases the brake rail 61 from the gripping device 63.

[0043] In step S119, the control unit 9 determines whether the gripping device 63 is in the open state according to the brake-off command in step S117. If the gripping device 63 is in the open state, it returns to step S111. On the other hand, if the gripping device 63 is not in the open state, it proceeds to step S121.

[0044] In step S121, the control unit 9 determines that the gripping device 63 cannot grip properly, outputs an alarm, stops the laser processing system 1, and ends the control process of the gripping device 63 according to the present embodiment.

[0045] (Modification 1) FIG. 10 is a diagram for explaining the structure of the laser processing system 1 according to Modification 1. In the above-described embodiment, the laser processing system 1 includes one brake rail 61 and one gripping device 63 each. In Modification 1, as shown in FIG. 10, a plurality of brake rails 61A, 61B and a plurality of gripping devices 63A, 63B corresponding thereto are provided.

[0046] The brake rails 61A, 61B are respectively provided on the lifter 5 and extend in the vertical direction (the vertical direction of the paper surface in FIG. 10). The brake rails 61A, 61B are provided at both ends in the front-rear direction of the connecting member 52B of the lifter 5.

[0047] The gripping devices 63A, 63B are provided on the support table 62 and grip the brake rails 61A, 61B respectively. The gripping devices 63A, 63B are provided on the side surfaces of the support table 62 facing the brake rails 61A, 61B, and are provided at both ends in the front-rear direction of this side surface. The structures and operations of the gripping devices 63A, 63B are the same as those of the above-described embodiment.

[0048] (Modification 2) In the above-described embodiment, the workpiece is carried into the pallet P in a state where the gripping device 63 grips the brake rail 61 (closed state). Since the lifter 5 is supported on the floor surface, the lifter 5 remains horizontal even when the workpiece is carried in. However, if the gripping device 63 suddenly releases the brake rail 61, the right side of the lifter 5 will suddenly tilt downward due to the weight of the workpiece. Further, if the lifter 5 suddenly tilts, the lifter 5 may warp upward due to the reaction, and the lifter 5 may vibrate up and down.

[0049] On the other hand, when the workpiece is carried into the pallet P in a state where the gripping device 63 does not grip the brake rail 61 (open state), the right side of the lifter 5 will tilt downward due to the weight of the workpiece. In this state, the gripping device 63 grips the brake rail 61. Next, when the gripping device 63 suddenly releases the brake rail 61 after carrying out the workpiece W from the pallet P, the right side of the lifter 5 will bounce upward vigorously. Further, due to the reaction, the right side of the lifter 5 may warp downward, and the lifter 5 may vibrate up and down.

[0050] Therefore, in the second modification, when the control unit 9 outputs a brake-off command, instead of opening the gripping device 63 with a single brake-off command, the brake-off command and the brake-on command are alternately output in a short period of time. That is, when the gripping device 63 that grips the brake rail 61 releases the brake rail 61, the control unit 9 causes the gripping device 63 to repeatedly execute opening and gripping a plurality of times.

[0051] FIG. 11 is a diagram for explaining the control process of the gripping device 63 by the laser processing system 1 according to the second modification. When the workpiece W is carried into the pallet P with the gripping device 63 gripping the brake rail 61, the lifter 5 is supported on the floor surface, so it is maintained in a horizontal state without tilting. Here, if the gripping device 63 is opened for an extremely short time of less than 1 second, the lifter 5 descends by L1 and then the gripping device 63 grips the brake rail 61 again. Further, if the gripping device 63 is released for an extremely short time of less than 1 second, the lifter 5 only descends from L1 to L2 and then the gripping device 63 grips the brake rail 61 again.

[0052] As described above, in the second modification, the gripping device 63 repeatedly performs opening and gripping at predetermined intervals, thereby gradually lowering the lifter 5. Also, when the lifter 5 bounces up, the lifter 5 is gradually raised. Therefore, in the second modification, when the gripping device 63 releases the brake rail 61, it is possible to prevent the lifter 5 from tilting vigorously and vibrating up and down. Note that the intervals and number of repetitions of opening and gripping are set to appropriate values through experiments and simulations.

[0053] As described in detail above, the laser processing system 1 according to the present embodiment is provided above a laser processing machine 13 that performs laser processing on a workpiece, and includes a storage shelf 3 that stores a pallet P on which the workpiece is placed, a lifter 5 that is disposed on the side of the storage shelf 3 and the laser processing machine 13 and on which the pallet P can be placed, a lifter drive unit 7 that supports one end of the lifter 5 and moves the lifter 5 in the vertical direction between the storage shelf 3 and the laser processing machine 13, a lifter support unit 11 that is disposed on the other end side of the lifter 5 rather than one end of the lifter 5 and can support the lifter 5, and a control unit 9 that controls the lifter drive unit 7 and the lifter support unit 11. When the lifter 5 is stopped in the lifter holding area, the control unit 9 operates the lifter support unit 11 to support the lifter 5. According to this configuration, since the lifter 5 is supported by the floor surface by the lifter support unit 11, even if a large load acts on the lifter 5, the load on the drive components for driving the lifter 5 up and down can be reduced.

[0054] Further, in the laser processing system 1 according to the present embodiment, the lifter support portion 11 is provided on the lifter 5 and includes a brake rail 61 extending in the vertical direction and a gripping device 63 that is supported with respect to the floor surface and grips the brake rail 61. Then, when the lifter 5 is stopped in the lifter holding area, the control unit 9 causes the gripping device 63 to grip the brake rail 61. Thereby, since the lifter 5 can be supported with respect to the floor surface, even if a large load acts on the lifter 5, the load applied to the drive components of the lifter 5 can be reduced.

[0055] As shown in FIG. 7A, when placing a workpiece on the pallet P, it is necessary to lower the lifter 5 to the workpiece supply height. This is because when the lifter 5 is lowered to the workpiece supply height, the pin 66 of the support table 62 protrudes from the upper surface of the pallet P, so that the workpiece can be supported by the pin 66. In this case, even if the workpiece is placed on the pallet P, the load associated with the placement of the workpiece can be received by the pin 66, so that it is possible to suppress a large load from being applied to the drive components of the lifter 5.

[0056] However, as shown in FIG. 7B, in order to shorten the working time, the workpiece may be placed on the pallet P with the pallet P remaining at the pass line height without lowering the pallet P to the workpiece supply height. In this case, since the workpiece cannot be supported by the pin 66 of the support table 62, a large load acts on the lifter 5 via the pallet P. At this time, a large load is applied to the drive components of the lifter 5.

[0057] Therefore, in the present embodiment, when the lifter 5 stops within a predetermined range Ra (lifter holding area) including the pass line height, the braking rail 61 is gripped by the gripping device 63. By gripping the braking rail 61 with the gripping device 63, the lifter 5 can be supported with respect to the floor surface via the support table 62. Even when a large load acts on the lifter 5 by placing the workpiece on the pallet P, since the lifter 5 is in a state of being supported with respect to the floor surface, the load applied to the drive components of the lifter 5 can be reduced.

[0058] Furthermore, when the gripping device 63 that has gripped the braking rail 61 releases the braking rail 61, the control unit 9 of the laser processing system 1 according to the present embodiment causes the gripping device 63 to repeatedly execute opening and gripping a plurality of times at a predetermined interval. As a result, since the free end side of the lifter 5 can be gradually moved up and down, it is possible to prevent the lifter 5 from vibrating up and down.

[0059] In the above-described embodiment, the lifter support portion 11 is disposed at the right end portion of the lifter 5. However, as long as the load applied to the drive components of the lifter 5 can be reduced by the supporting force of the lifter support portion 11, it may be disposed at a position closer to the left side than the right end portion of the lifter 5.

[0060] (Second Embodiment) The laser processing system 1 according to the second embodiment will be described. In the first embodiment, the gripping device 63 was provided on the support table 62, but in the present embodiment, the difference is that the gripping device 63 is provided on the lifter 5.

[0061] FIG. 12 is a perspective view showing the structure of the laser processing system 1 according to the second embodiment. The lifter support portion 11 includes a brake rail 61 and a gripping device 63. The brake rail 61 is supported on the floor surface and extends upward. Specifically, the brake rail 61 may be installed on the floor surface and extend upward, or may be installed on a fence installed around the lifter 5. However, since it is necessary to allow an operator to access the lifter 5, when the operator accesses from the front side surface of the lifter 5, the brake rail 61 needs to be provided close to the right side or the rear side surface of the lifter 5. Further, the brake rail 61 is formed of a plate-like member so that the gripping device 63 can grip it, and is arranged to be located between the clamp portions 71A and 71B of the gripping device 63.

[0062] The gripping device 63 is provided on the lifter 5 and grips the brake rail 61. The gripping device 63 is provided on the right side surface of the lifter 5, that is, the side surface opposite to the end connected to the lifter driving portion 7. Further, the gripping device 63 is provided at the rear end of the right side surface so that an operator can access the lifter 5. However, the gripping device 63 may be provided on the rear side surface of the lifter 5 when the operator accesses from the front side surface of the lifter 5.

[0063] When the control unit 9 stops the lifter 5 within a predetermined range in the vertical direction, the control unit 9 causes the gripping device 63 to grip the brake rail 61. The control unit 9 controls the gripping device 63 in the same manner as in the first embodiment, thereby controlling the lifter support portion 11 to support the lifter 5 with respect to the floor surface.

[0064] In the laser processing system 1 according to the second embodiment, the lifter support portion 11 includes a brake rail 61 that is supported on the floor surface and extends upward, and a gripping device 63 that is provided on the lifter 5 and grips the brake rail 61. Then, when the lifter 5 stops within a predetermined range in the vertical direction, the control unit 9 causes the gripping device 63 to grip the brake rail 61. As a result, since the lifter 5 can be supported on the floor surface by the gripping device 63 gripping the brake rail 61, the load applied to the drive components of the lifter 5 when loading the workpiece onto the lifter 5 can be reduced.

[0065] (Third Embodiment) The laser processing system 1 according to the third embodiment will be described. In the first and second embodiments, the configuration was such that the gripping device 63 gripped the brake rail 61, but in this embodiment, the difference is that a lift that moves up and down in conjunction with the lifter 5 is provided.

[0066] FIG. 13 is a perspective view showing the structure of the laser processing system 1 according to the third embodiment. The lifter support portion 11 includes a lift 81 and a stopper 83. The lift 81 is disposed on the floor surface below the lifter 5 and moves up and down in the vertical direction to support the lifter 5. The lift 81 is a pantograph-type lift table, and a table 85 is provided at the upper portion. The table 85 is moved up and down by columns 87 configured in an X shape, and the lifter 5 is supported on the upper surface of the table 85.

[0067] When the lifter 5 is within the lifter holding area, the length of the support column 87 is set such that the upper surface of the table 85 contacts the lower part of the lifter 5. When the lifter 5 descends from the position of the storage shelf 3 and the pallet P reaches the upper limit height, the lower part of the connecting member 52B at the tip of the lifter 5 contacts the upper surface of the table 85, whereby the elevator 81 supports the lifter 5. And while the lifter 5 is moving up and down between the work supply height and the upper limit height, under the control of the control unit 9, the elevator 81 moves the table 85 up and down following the movement of the lifter 5. Thereby, the elevator 81 can continuously support the lifter 5. Finally, when the lifter 5 rises beyond a height of 980 mm from the floor surface, the lifter 5 separates from the upper surface of the table 85.

[0068] The stopper 83 is provided on the elevator 81 and stops the elevation of the elevator 81. The stopper 83 is provided between the table 85 and the floor surface and stops the movement of the table 85 under the control of the control unit 9. Also, the stopper 83 may be provided between the support columns 87 and stop the movement of the table 85 by stopping the movement of the support columns 87 under the control of the control unit 9.

[0069] When the control unit 9 stops the lifter 5 within a predetermined range in the vertical direction, it stops the elevation of the elevator 81 with the stopper 83. Specifically, while the lifter 5 is moving within the lifter holding area, the control unit 9 moves the elevator 81 up and down following the lifter 5, and when the lifter 5 stops, it stops the elevation of the table 85 with the stopper 83.

[0070] In the laser processing system 1 according to the third embodiment, the lifter support portion 11 is disposed on the floor surface below the lifter 5 and includes a lifter 81 that moves up and down in the vertical direction to support the lifter 5, and a stopper 83 provided on the lifter 81 to stop the lifting and lowering of the lifter 81. Then, when the lifter 5 stops within a predetermined range in the vertical direction and the lifter 81 supports the lifter 5 with respect to the floor surface, the control unit 9 stops the lifting and lowering of the lifter 81 with the stopper 83. Thereby, since the lifter 81 can support the lifter 5 with respect to the floor surface, the load applied to the drive components of the lifter 5 can be reduced when loading the workpiece onto the lifter 5.

[0071] As described above, although the embodiments of the present invention have been described, it should not be understood that the discussions and drawings forming a part of this disclosure limit the present invention. Various alternative embodiments, examples, and operation techniques will be apparent to those skilled in the art from this disclosure.

Explanation of Signs

[0072] 1 Laser processing system 3 Storage shelf 5 Lifter 7 Lifter drive unit 9 Control unit 11 Lifter support portion 13 Laser processing machine 31 Rail 32 Chain 51A, 51B Support members 52A, 52B Connecting members 53A, 53B Connection members 54 Cam follower 61, 61A, 61B Brake rails 62 Support table 63, 63A, 63B Gripping devices 64, 87 Struts 65 Upper surface 66 Pin 71A, 71B Clamp portions 72 Cylinder 81 Lifter 83 Stopper 85 Table Pallets P, P1, P2 Workpiece W

Claims

1. A storage shelf provided above a laser processing machine that performs laser processing on a workpiece, for storing a pallet on which the workpiece is placed, A lifter arranged on the side of the storage shelf and the laser processing machine, on which the pallet can be placed, A lifter drive unit that supports one end of the lifter and moves the lifter in the vertical direction between the storage shelf and the laser processing machine, A lifter support unit arranged on the other end side of the lifter relative to the one end of the lifter, capable of supporting the lifter, A control unit for controlling the lifter drive unit and the lifter support unit, When the control unit stops the lifter within a predetermined range in the vertical direction with reference to the floor surface on which the laser processing machine is installed, the control unit operates the lifter support unit to support the lifter Laser processing system.

2. The lifter support unit, A brake rail provided on the lifter and extending in the vertical direction, A gripping device supported by the floor surface for gripping the brake rail, When the control unit stops the lifter within the predetermined range in the vertical direction, the control unit causes the gripping device to grip the brake rail The laser processing system according to claim 1.

3. The lifter support unit, A brake rail supported by the floor surface and extending in the vertical direction, A gripping device provided on the lifter for gripping the brake rail, When the control unit stops the lifter within the predetermined range in the vertical direction, the control unit causes the gripping device to grip the brake rail The laser processing system according to claim 1.

4. When the gripping device that grips the brake rail releases the brake rail, the control unit causes the gripping device to repeatedly execute opening and gripping a plurality of times. The laser processing system according to claim 2 or 3.

5. The lifter support unit, A lift arranged below the lifter on the floor surface, moving up and down in the vertical direction to support the lifter, A stopper provided on the lift for stopping the lift, When the control unit stops the lifter within the predetermined range in the vertical direction, the control unit stops the lift with the stopper The laser processing system according to claim 1.

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