Resin composition

Abstract

To provide a resin composition or the like by which a cured product that has low dielectric loss tangent and dielectric constant, can suppress generation of a crack, and has excellent embedding properties can be obtained.SOLUTION: A resin composition contains (A) a hollow inorganic filler, (B) a solid inorganic filler, (C) one or more phenol resins selected from a biphenylaralkyl type phenol resin, a naphthol aralkyl type phenol resin and a propenyl group-containing phenol resin, and (D) a thermoplastic resin, where, when the content of component (A) when the total amount of component (A) and component (B) is 100 vol.% is a1, and the content of component (B) when the total amount of component (A) and component (B) is 100 vol.% is b1, a1 / b1 is 0.2 or more and 3 or less, a phenol equivalent of component (C) is 130 g / eq. or more and 1000 g / eq. or less, and the content of component (D) is 0.5 mass% or less when nonvolatile component of the resin composition is 100 mass%.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] A known manufacturing technique for printed wiring boards is a build-up method in which insulating layers and conductor layers are alternately stacked. In build-up manufacturing methods, the insulating layers are generally formed from a cured product obtained by curing a resin composition (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-23714 Summary of the Invention [Problem to be solved by the invention]

[0004] The cured product contained in the insulating layer is required to have low dielectric loss tangent and dielectric constant. A method of highly loading an inorganic filler into a resin composition is considered as a method for obtaining a cured product with low dielectric loss tangent and dielectric constant. However, when a resin composition highly loaded with an inorganic filler is used, cracks tend to easily occur in the cured product after desmearing, and the melt viscosity of the resin composition tends to increase, resulting in poor embeddability. Hereinafter, the dielectric loss tangent and dielectric constant may be collectively referred to as dielectric properties.

[0005] Another possible method for suppressing cracking is to include a large amount of thermoplastic resin, but although the inclusion of a large amount of thermoplastic resin can suppress cracking, the melt viscosity of the resin composition tends to increase, resulting in a decrease in embeddability.

[0006] The present invention has been made in view of the above-mentioned problems, and provides a resin composition which has a low dielectric loss tangent and relative dielectric constant, can suppress the occurrence of cracks, and can give a cured product with excellent embeddability; a resin sheet containing the resin composition; and a printed wiring board and a semiconductor device which have an insulating layer formed using the resin composition. [Means for solving the problem]

[0007] The present inventors have conducted extensive research to solve the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by a resin composition containing a specific phenolic resin, a predetermined amount of a thermoplastic resin, and a combination of a solid inorganic filler and a hollow inorganic filler in a predetermined ratio, thereby completing the present invention. That is, the present invention includes the following. [1] (A) Hollow inorganic filler, (B) solid inorganic filler; (C) one or more phenolic resins selected from biphenyl aralkyl phenolic resins, naphthol aralkyl phenolic resins, propenyl group-containing phenolic resins, and diphenylmethane phenolic resins; and (D) a thermoplastic resin, a1 / b1 is 0.2 or more and 3 or less, where a1 is the content of component (A) when the total amount of component (A) and component (B) is taken as 100 volume%, and b1 is the content of component (B) when the total amount of component (A) and component (B) is taken as 100 volume%, The phenol equivalent of component (C) is 130 g / eq. or more and 1000 g / eq. or less, A resin composition having a content of component (D) of 0.5% by mass or less when the nonvolatile components of the resin composition are taken as 100% by mass. [2] The resin composition according to [1], wherein the content of component (C) is from % by mass to % by mass, where the total non-volatile components of the resin composition is 100% by mass. [3] The resin composition according to [1] or [2], further comprising (E) an epoxy resin. [4] The resin composition according to any one of [1] to [3], further comprising (F) a radically polymerizable compound. [5] The resin composition according to [4], wherein the component (F) contains either a styrene-based radical polymerizable compound or a maleimide-based radical polymerizable compound. [6] The resin composition according to any one of [1] to [5], further comprising (G) a curing agent. [7] The resin composition according to [6], wherein the (G) curing agent includes an active ester curing agent. [8] The BET specific surface area of component (A) is 1m 2 / g or more 100m 2 The resin composition according to any one of [1] to [7], wherein the resin composition has a viscosity of 1000 MPa or less. [9] The resin composition according to any one of [1] to [8], wherein the content of component (A) is 1% by mass or more and 60% by mass or less, when the non-volatile components of the resin composition are taken as 100% by mass.

[10] The BET specific surface area of component (B) is 0.1 m 2 / g or more 100m 2 The resin composition according to any one of [1] to [9], wherein the resin composition has a viscosity of 1000 MPa or less.

[11] The resin composition according to any one of [1] to

[10] , wherein the content of component (B) is 10% by mass or more and 80% by mass or less, when the non-volatile components of the resin composition are 100% by mass.

[12] The resin composition according to any one of [1] to

[11] , which is used to form an insulating layer.

[13] A cured product of the resin composition according to any one of [1] to

[12] .

[14] A sheet-like laminate material containing the resin composition according to any one of [1] to

[12] .

[15] A resin sheet comprising a support and a resin composition layer formed on the support from the resin composition according to any one of [1] to

[12] .

[16] A printed wiring board having an insulating layer containing a cured product of the resin composition according to any one of [1] to

[12] .

[17] A semiconductor device comprising the printed wiring board according to

[16] . [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin composition which has a low dielectric loss tangent and relative dielectric constant, can suppress the occurrence of cracks, and can give a cured product which has excellent embeddability; a resin sheet containing the resin composition; and a printed wiring board and a semiconductor device which have an insulating layer formed using the resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and can be implemented with any modifications within the scope of the claims and their equivalents.

[0010] [Resin composition] The resin composition of the present invention comprises (A) a hollow inorganic filler, (B) a solid inorganic filler, (C) one or more phenolic resins selected from biphenylaralkyl phenolic resins, naphtholaralkyl phenolic resins, propenyl group-containing phenolic resins, and diphenylmethane phenolic resins, and (D) a thermoplastic resin, wherein the content of component (A) when the total amount of components (A) and (B) is taken as 100% by volume is defined as a1 and the content of component (B) when the total amount of components (A) and (B) is taken as 100% by volume is defined as b1, where a1 / b1 is 0.2 to 3, the phenol equivalent of component (C) is 130 to 1000 g / eq, and the content of component (D) is 0.5% by mass or less when the total nonvolatile components of the resin composition are taken as 100% by mass. This resin composition provides a cured product with low dielectric tangent and dielectric constant, suppresses cracking, and has excellent embeddability. In addition, it is usually possible to lower the minimum melt viscosity of the resin composition.

[0011] The resin composition may further contain optional components in addition to components (A) to (D). Examples of optional components include (E) epoxy resin, (F) radically polymerizable compound, (G) curing agent (excluding those corresponding to component (B)), (H) curing accelerator, (I) other additives, and (J) solvent. Each component contained in the resin composition of the present invention will be described in detail below. Hereinafter, components (A) and (B) may be collectively referred to as "inorganic filler," and (C) one or more phenolic resins selected from biphenyl aralkyl phenolic resins, naphthol aralkyl phenolic resins, propenyl group-containing phenolic resins, and diphenylmethane phenolic resins may be collectively referred to as "phenolic resin."

[0012] In the present invention, unless otherwise specified, the content of each component in the resin composition is a value when the nonvolatile components in the resin composition are 100 mass %, and the nonvolatile components refer to all nonvolatile components constituting the resin composition excluding the solvent (J) described below. Furthermore, the resin components of the resin composition refer to the nonvolatile components of the resin composition excluding the components (A) and (B).

[0013] <(A) Hollow inorganic filler> The resin composition contains a hollow inorganic filler (A) as component (A). By including component (A) in the resin composition, the dielectric constant can be reduced. The hollow inorganic filler (A) is usually contained in the resin composition in the form of particles. The hollow inorganic filler (A) may be used alone or in combination of two or more types.

[0014] As a result of intensive research, the present inventors have found that when a hollow inorganic filler is added to a resin composition, the dielectric constant can be reduced, but the melt viscosity increases and the embeddability decreases. In the present invention, by adding (A) a hollow inorganic filler and (B) a solid inorganic filler in a predetermined ratio, it is possible to obtain a cured product that has a low dielectric tangent and dielectric constant, is able to suppress the occurrence of cracks, and has excellent embeddability.

[0015] The (A) hollow inorganic filler may be a monohollow particle having only one void inside the particle, a multihollow particle having two or more voids inside the particle, or a combination of a monohollow particle and a multihollow particle.

[0016] Since the (A) hollow inorganic filler has pores, it usually has a porosity of more than 0% by volume. From the viewpoint of obtaining a cured product with a low dielectric constant, the porosity of the (A) hollow inorganic filler is preferably 10% by volume or more, more preferably 15% by volume or more, and particularly preferably 20% by volume or more. Furthermore, from the viewpoint of the mechanical strength of the cured product of the resin composition, the porosity of the (A) hollow inorganic filler is preferably 95% by volume or less, more preferably 90% by volume or less, and particularly preferably 85% by volume or less.

[0017] The porosity P (vol %) of a particle is defined as the volume ratio of the total volume of one or more pores present inside the particle to the total volume of the particle based on the outer surface of the particle (total volume of pores / volume of particle). This porosity P is calculated by multiplying the measured value of the actual density D of the particle by 1 / 2. M (g / cm 3 ), and the theoretical value of the material density of the material that forms the particle, D T (g / cm 3 ) can be calculated using the following formula (1).

number

[0018] (A) Hollow inorganic filler generally has voids formed within the particle and an outer shell formed of an inorganic material surrounding the voids. Usually, the voids are separated from the outside of the particle by the outer shell. In this case, it is desirable that the voids do not communicate with the outside of the particle. Therefore, it is desirable that the outer shell is a non-porous shell that does not have pores that communicate the voids with the outside of the particle. The fact that the outer shell is non-porous can be confirmed by observation with a transmission electron microscope (TEM).

[0019] (A) An inorganic compound is used as the material for the hollow inorganic filler, and examples of the material for the hollow inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate.

[0020] Furthermore, inorganic complex oxides may be used as the material for (A) hollow inorganic filler. The term "inorganic complex oxide" refers to an oxide containing two or more types of atoms selected from the group consisting of metal atoms and metalloid atoms. Such inorganic complex oxides are preferably oxides containing a combination of silicon and one or more types of atoms selected from the group consisting of metal atoms and metalloid atoms other than silicon. Metal atoms that can be combined with silicon include aluminum, lead, nickel, cobalt, copper, zinc, zirconium, iron, lithium, magnesium, barium, potassium, calcium, titanium, boron, and sodium, with aluminum being particularly preferred. Therefore, oxides containing silicon and aluminum are preferred as inorganic complex oxides, and aluminosilicates are particularly preferred.

[0021] Among these materials for the hollow inorganic filler (A), silica, alumina, and aluminosilicate are preferred, and silica is particularly preferred from the viewpoint of lowering the dielectric loss tangent. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Furthermore, spherical silica is preferred as the silica.

[0022] From the viewpoint of significantly obtaining the effects of the present invention, the average particle size of (A) the hollow inorganic filler is preferably 0.01 μm or more, more preferably 0.1 μm or more, particularly preferably 0.3 μm or more, and is preferably 5 μm or less, more preferably 4 μm or less, particularly preferably 3 μm or less.

[0023] The average particle size can be measured using a laser diffraction / scattering method based on Mie scattering theory. Specifically, a particle size distribution based on volume is created using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample of inorganic filler can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture ultrasonically for 10 minutes. The measurement sample is measured using a laser diffraction particle size distribution analyzer with blue and red light source wavelengths using a flow cell system to measure the volumetric particle size distribution of the inorganic filler, and the average particle size can be calculated as the median diameter from the particle size distribution obtained. Examples of laser diffraction particle size distribution analyzers include the LA-960 manufactured by Horiba, Ltd.

[0024] The BET specific surface area of the hollow inorganic filler (A) is preferably 1 m 2 / g or more, more preferably 2m 2 / g or more, particularly preferably 5m 2 / g or more, preferably 100m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 30m 2 The BET specific surface area of the particles can be measured in accordance with the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and calculating the specific surface area using the BET multipoint method.

[0025] The (A) hollow inorganic filler may be a commercially available product, such as "LHP-208" manufactured by Ube Exsymo Co., Ltd., or "MG-005," "MGH-005," "BA-1," or "CellSpheres" manufactured by Taiheiyo Cement Corporation.

[0026] The (A) hollow inorganic filler may also be produced by, for example, the method described in Japanese Patent No. 5940188 or a method equivalent thereto. Specifically, hollow silica particles, which are an example of the (A) hollow inorganic filler, can be produced by a method including the steps of: preparing an aqueous solution containing a substance capable of forming pores and a basic compound; mixing the aqueous solution with an alkoxysilane and stirring to precipitate silica particles; removing the substance capable of forming pores from the silica particles to obtain hollow silica precursors; and calcining the hollow silica precursors.

[0027] From the viewpoint of improving moisture resistance and dispersibility, the (A) hollow inorganic filler is preferably treated with a surface treatment agent. Examples of the surface treatment agent include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate coupling agents. One type of surface treatment agent may be used alone, or two or more types may be used in any combination.

[0028] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0029] From the viewpoint of improving dispersibility, the degree of surface treatment with the surface treatment agent preferably falls within a specific range. Specifically, 100% by mass of the hollow inorganic filler is preferably surface-treated with 0.2% to 8% by mass of the surface treatment agent, more preferably with 0.2% to 5% by mass of the surface treatment agent, and even more preferably with 0.3% to 3% by mass of the surface treatment agent.

[0030] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the (A) hollow inorganic filler. From the viewpoint of improving the dispersibility of the (A) hollow inorganic filler, the amount of carbon per unit surface area of the (A) hollow inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition, it is more preferable that the content be 1.0 mg / m 2 Preferably less than 0.8 mg / m 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0031] The carbon amount per unit surface area of the (A) hollow inorganic filler can be measured after the surface-treated (A) hollow inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the (A) hollow inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the carbon amount per unit surface area of the (A) hollow inorganic filler can be measured using a carbon analyzer. The carbon analyzer that can be used is the "EMIA-320V" manufactured by Horiba, Ltd.

[0032] The content (vol %) of component (A) is preferably 1 vol % or more, more preferably 3 vol % or more, even more preferably 5 vol % or more, or 10 vol % or more, and is preferably 60 vol % or less, more preferably 60 vol % or less, even more preferably 50 vol % or less, 40 vol % or less, 35 vol % or less, or 30 vol % or less, assuming the non-volatile components of the resin composition to be 100 vol %.

[0033] The content (mass %) of component (A), when the non-volatile components of the resin composition are taken as 100 mass %, is preferably 1 mass % or more, more preferably 3 mass % or more, even more preferably 5 mass % or more, or 10 mass % or more, and is preferably 60 mass % or less, more preferably 55 mass % or less, even more preferably 50 mass % or less, 40 mass % or less, 30 mass % or less, or 20 mass % or less.

[0034] The content (vol %) of component (A), when the total amount of component (A) and component (B) is taken as 100% by volume, is preferably 20% by volume or more, more preferably 30% by volume or more, even more preferably 35% by volume or more, 40% by volume or more, and is preferably 70% by volume or less, more preferably 65% by volume or less, even more preferably 60% by volume or less, 55% by volume or less, 50% by volume or less.

[0035] The content (mass%) of component (A), when the total amount of component (A) and component (B) is taken as 100 mass%, is preferably 1 mass% or more, more preferably 5 mass% or more, even more preferably 10 mass% or more, 15 mass% or more, or 20 mass% or more, and is preferably 70 mass% or less, more preferably 65 mass% or less, even more preferably 60 mass% or less, 50 mass% or less, 40 mass% or less, or 30 mass% or less.

[0036] <(B) Solid inorganic filler> The resin composition contains a (B) solid inorganic filler as the (B) component. By including the (B) component in the resin composition, the dielectric properties can be reduced. The (B) solid inorganic filler does not include those corresponding to the above-mentioned (A) component. The (B) solid inorganic filler is usually included in the resin composition in the form of particles. The (B) solid inorganic filler may be used alone or in combination of two or more types.

[0037] (B) Solid inorganic filler refers to an inorganic filler that is substantially free of voids or holes, including cases where voids are inevitably mixed in during the production of the solid inorganic filler. The porosity of the (B) solid inorganic filler is less than 0.5% by volume, and is essentially 0% by volume. The porosity can be calculated using the above formula (1).

[0038] The material for component (B) is an inorganic compound, and is the same as the material for component (A).

[0039] Component (B) can be a commercially available product, such as "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C," "YA050C," "YA050C-MJE," "YA010C," "SC2500SQ," "SO-C4," "SO-C2," and "SO-C1" manufactured by Admatechs Co., Ltd.; "UFP-30," "DAW-03," and "FB-105FD" manufactured by Denka Company Limited; and "Silfil NSS-3N," "Silfil NSS-4N," and "Silfil NSS-5N" manufactured by Tokuyama Corporation.

[0040] The average particle size of component (B) is preferably 0.01 μm or more, more preferably 0.1 μm or more, and even more preferably 0.3 μm or more, and is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The average particle size of component (B) can be measured using the same method as that for measuring the average particle size of component (A).

[0041] The BET specific surface area of component (B) is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, preferably 100m 2 / g or less, more preferably 70m 2 / g or less, more preferably 40m 2 The specific surface area of component (B) can be measured by the same method as that for measuring the specific surface area of component (A).

[0042] From the viewpoint of improving moisture resistance and dispersibility, component (B) is preferably treated with a surface treatment agent. The surface treatment agent is the same as the surface treatment agent that may be used to treat component (A). The degree of surface treatment and the amount of carbon are also the same as those for component (A).

[0043] The content (vol %) of component (B) is preferably 5 vol % or more, more preferably 10 vol % or more, even more preferably 15 vol % or more, 20 vol % or more, or 25 vol % or more, and is preferably 60 vol % or less, more preferably 50 vol % or less, and even more preferably 40 vol % or less, assuming that the non-volatile components of the resin composition are 100 vol %.

[0044] The content (mass %) of component (B) is preferably 10 mass % or more, more preferably 20 mass % or more, even more preferably 30 mass % or more, 40 mass % or more, or 50 mass % or more, and is preferably 80 mass % or less, more preferably 75 mass % or less, even more preferably 70 mass % or less, or 60 mass % or less, assuming that the non-volatile components of the resin composition are 100 mass %.

[0045] The content (vol %) of component (B), when the total amount of components (A) and (B) is taken as 100% by volume, is preferably 30% by volume or more, more preferably 40% by volume or more, and even more preferably 50% by volume or more, and is preferably 80% by volume or less, more preferably 70% by volume or less, and even more preferably 65% by volume or less, and even more preferably 60% by volume or less.

[0046] The content (mass %) of component (B), when the total amount of components (A) and (B) is taken as 100 mass %, is preferably 30 mass % or more, more preferably 35 mass % or more, even more preferably 40 mass % or more, 50 mass % or more, 60 mass % or more, or 70 mass % or more, and is preferably 99 mass % or less, more preferably 95 mass % or less, and even more preferably 80 mass % or less.

[0047] When the total amount of components (A) and (B) is taken as 100% by volume, the content (volume %) of component (A) is defined as a1, and the total amount of components (A) and (B) is taken as 100% by volume, the content (volume %) of component (B) is defined as b1. The ratio a1 / b1 is 0.2 or more, preferably 0.3 or more, more preferably 0.4 or more, or 0.45 or more. The upper limit is 3 or less, preferably 2.95 or less, more preferably 2 or less, and even more preferably 1.5 or less, 1.2 or less, 1 or less, or 0.8 or less. By adjusting the volume ratio of components (A) and (B) so that a1 / b1 falls within this range, the dielectric properties can be reduced and the embeddability can be improved.

[0048] When the total amount of components (A) and (B) is taken as 100% by mass, the content (% by mass) of component (A) is defined as a2, and the total amount of components (A) and (B) is taken as 100% by mass, the content (% by mass) of component (B) is defined as b2. The ratio a2 / b2 is preferably 0.1 or more, more preferably 0.2 or more, and even more preferably 0.3 or more. The upper limit is preferably 3 or less, more preferably 2 or less, 1.5 or less, and even more preferably 1 or less, 0.5 or less. By adjusting the mass ratio of components (A) and (B) so that a2 / b2 falls within this range, it is possible to reduce the dielectric properties.

[0049] <(C) Phenolic resin> The resin composition contains, as component (C), one or more phenolic resins selected from (C) biphenylaralkyl phenolic resins, naphtholaralkyl phenolic resins, propenyl group-containing phenolic resins, and diphenylmethane phenolic resins, and these phenolic resins have a phenol equivalent of 130 g / eq. to 1000 g / eq. Component (C) reacts with epoxy resin (E) described below to cure the resin composition, while also suppressing cracking and reducing the dielectric loss tangent. Component (C) may be used alone or in combination of two or more.

[0050] The phenol equivalent of component (C) is 130 g / eq. or more, preferably 140 g / eq. or more, and more preferably 150 g / eq. or more. The upper limit is 1000 g / eq. or less, preferably 500 g / eq. or less, more preferably 400 g / eq. or less, and 300 g / eq. or less. The phenol equivalent is the phenolic hydroxyl group equivalent and represents the mass of resin per equivalent of hydroxyl group. Using component (C) with a phenol equivalent within this range prevents poor curing of the cured product, suppresses the occurrence of cracks, and enables a low dielectric tangent.

[0051] The component (C) is one or more phenolic resins selected from biphenylaralkyl type phenolic resins, naphtholaralkyl type phenolic resins, and propenyl group-containing phenolic resins, and is preferably a biphenylaralkyl type phenolic resin.

[0052] -Biphenyl aralkyl phenolic resin- The biphenylaralkyl type phenolic resin contains a biphenylaralkyl structure and a phenol structure in combination in the molecule, and one type of biphenylaralkyl type phenolic resin may be used alone, or two or more types may be used in combination.

[0053] The biphenyl aralkyl structure refers to a structure in which a portion of the carbon chain of an alkylene chain is substituted with a biphenyl skeleton. One or more substituents may be bonded to the biphenyl skeleton as long as the effects of the present invention are not significantly impaired. Examples of the substituents include hydrocarbon groups such as alkyl groups and aryl groups.

[0054] The phenol structure refers to a structure in which a hydroxyl group is bonded to a benzene ring. The benzene ring of the phenol structure may have one or more substituents bonded thereto, as long as the effects of the present invention are not significantly impaired. Examples of the substituents include hydrocarbon groups such as alkyl groups and aryl groups.

[0055] As the biphenylaralkyl type phenolic resin, for example, a compound represented by the following formula (C1-1) is preferable. [ka] In formula (C1-1), R 1 each independently represents an alkylene group; R 2 each independently represents a monovalent hydrocarbon group, and R 3 each independently represents a monovalent hydrocarbon group; n represents an integer of 1 to 20; each independently represents an integer of 0 to 4; and each independently represents an integer of 0 to 3.

[0056] In formula (C1-1), R1 each independently represents an alkylene group. The alkylene group may be linear or branched. The alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms, and particularly preferably 1 to 5 carbon atoms. Examples of the alkylene group include a methylene group, an ethylene group, and a propylene group.

[0057] In formula (C1-1), R 2 each independently represents a monovalent hydrocarbon group. The monovalent hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. Furthermore, the monovalent hydrocarbon group may be a linear or branched hydrocarbon group, or may be a hydrocarbon group containing a ring. The monovalent hydrocarbon group preferably has 1 to 20 carbon atoms, more preferably 1 to 10, and particularly preferably 1 to 6 carbon atoms. Examples of monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, and butyl; and aryl groups such as phenyl and naphthyl.

[0058] In formula (C1-1), R 3 R each independently represents a monovalent hydrocarbon group. 3 The range of R 2 It can be the same as:

[0059] In formula (C1-1), n represents an integer of 1 to 20. n is preferably 1 to 10, and more preferably 1 to 6.

[0060] In formula (C1-1), each g independently represents an integer of 0 to 4. g is preferably 0 or 1, and particularly preferably 0.

[0061] In formula (C1-1), each t independently represents an integer of 0 to 3. t is preferably 0 or 1, and particularly preferably 0.

[0062] The biphenylaralkyl phenol resin is preferably a compound represented by the following formula (C1-2). [ka] In formula (C1-2), R 4 each independently represents an alkyl group having 1 to 5 carbon atoms or a phenyl group; each m independently represents an integer of 1 to 5; n1 independently represents an integer of 1 to 20; and each t1 independently represents 0 or 1.

[0063] In formula (C1-2), R 4 each independently represents an alkyl group having 1 to 5 carbon atoms or a phenyl group. Examples of the alkyl group include a methyl group and an ethyl group.

[0064] In formula (C1-2), each m independently represents an integer of 1 to 5. m is preferably 1 to 4, more preferably 1 to 3, and particularly preferably 1.

[0065] In formula (C1-2), n1 each independently represents an integer of 1 to 20. n1 can be the same as n in formula (C1-1).

[0066] In formula (C1-2), each t1 independently represents 0 or 1. t1 is preferably 0.

[0067] Examples of biphenylaralkyl phenol resins include compounds represented by the following formula (C1-3): In formula (C1-3), n2 generally represents an integer of 1 to 20, and preferably an integer of 1 to 6. [ka]

[0068] Commercially available biphenylaralkyl phenolic resins may be used, such as "GPH-65," "GPH-78," and "GPH-103" manufactured by Nippon Kayaku Co., Ltd., and "MEH-7851," "MEH-7851-SS," and "MEH-7851-4H" manufactured by Meiwa Kasei Co., Ltd.

[0069] -Naphthol aralkyl phenolic resin- The naphthol aralkyl phenolic resin contains a combination of a naphthol aralkyl structure and a phenol structure in the molecule, and one type of naphthol aralkyl phenolic resin may be used alone, or two or more types may be used in combination.

[0070] The naphthol aralkyl structure refers to a structure having a naphthol group and an aralkylene group. The naphthol group may be bonded to the alkylene portion of the aralkylene group, or to the arylene portion of the aralkylene group, or may be bonded via a divalent group such as a methylene group. Examples of the aralkylene group include a benzylene group. The naphthol group is a divalent group derived from hydroxynaphthalene, and hydroxynaphthalene is a concept that includes naphthol and dihydroxynaphthalene. The naphthol group and the aralkylene group may be bonded to one or more substituents as long as the effects of the present invention are not significantly impaired. Examples of the substituent include hydrocarbon groups such as alkyl groups and aryl groups.

[0071] The phenol structure refers to a structure in which a hydroxyl group is bonded to a benzene ring. The benzene ring of the phenol structure may have one or more substituents bonded thereto, as long as the effects of the present invention are not significantly impaired. Examples of the substituents include hydrocarbon groups such as alkyl groups and aryl groups.

[0072] As the naphthol aralkyl type phenolic resin, for example, a compound represented by the following formula (C2-1) is preferred. [ka] In formula (C2-1), R 11 each independently represents an alkylene group; R 12 each independently represents a divalent aromatic hydrocarbon group, R 13 each independently represents a monovalent hydrocarbon group; a represents an integer of 1 to 20; each u1 independently represents an integer of 1 to 6; and each u independently represents an integer of 0 to 6.

[0073] In formula (C2-1), R11 R each independently represents an alkylene group. 11 The range of R in formula (C1-1) 1 It can be the same as:

[0074] In formula (C2-1), R 12 each independently represents a divalent aromatic hydrocarbon group. Examples of the divalent aromatic hydrocarbon group include an arylene group, an aralkylene group, and an arylenealkylenearylene group.

[0075] The arylene group is preferably an arylene group having 6 to 30 carbon atoms, more preferably an arylene group having 6 to 20 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. Examples of such an arylene group include a phenylene group, a naphthylene group, an anthracenylene group, and a biphenylene group, and among these, a phenylene group and a biphenylene group are preferred.

[0076] The aralkylene group is preferably an aralkylene group having 7 to 30 carbon atoms, more preferably an aralkylene group having 7 to 20 carbon atoms, and even more preferably an aralkylene group having 7 to 15 carbon atoms. Examples of such aralkylene groups include a benzylene group and a group having a biphenylene-methylene structure.

[0077] The arylene alkylene arylene group preferably has a carbon atom number of 13 to 30. Examples of such an arylene alkylene arylene group include groups having a phenylene-methylene-phenylene structure.

[0078] In formula (C2-1), R 13 R each independently represents a monovalent hydrocarbon group. 13 The range of R in formula (C1-1) 2 It can be the same as:

[0079] In formula (C2-1), a represents an integer of 1 to 20. a is preferably 1 to 10, and more preferably 1 to 6.

[0080] In formula (C2-1), each u1 independently represents an integer of 1 to 6. u1 is preferably 1 to 3, and particularly preferably 1 or 2.

[0081] In formula (C2-1), each u independently represents an integer of 0 to 6. u is preferably 0 or 1, and particularly preferably 0.

[0082] The naphthol aralkyl phenol resin is preferably a compound represented by the following formula (C2-2). [ka] In formula (C2-2), R 14 each independently represents an alkyl group having 1 to 5 carbon atoms or a phenyl group; each m1 independently represents an integer of 1 to 5; each a1 independently represents an integer of 1 to 20; each u2 independently represents 0 or 1; and each u3 independently represents an integer of 1 to 6.

[0083] In formula (C2-2), R 14 each independently represents an alkyl group having 1 to 5 carbon atoms or a phenyl group. Examples of the alkyl group include a methyl group and an ethyl group.

[0084] In formula (C2-2), m1 each independently represents an integer of 1 to 5. m1 is preferably 1 to 4, more preferably 1 to 3, and particularly preferably 1.

[0085] In formula (C2-2), each a1 independently represents an integer of 1 to 20. a1 can be the same as a in formula (C2-1).

[0086] In formula (C2-2), each u2 independently represents 0 or 1. u2 is preferably 0.

[0087] In formula (C2-2), each u3 independently represents an integer of 1 to 6. u3 is preferably 1 to 3, and particularly preferably 1 or 2.

[0088] Examples of naphthol aralkyl phenolic resins include compounds represented by the following formula (C2-3): In the formula, a2 generally represents an integer of 1 to 20, preferably an integer of 1 to 6, and each u4 is independently generally an integer of 1 to 6, preferably an integer of 1 to 3, and particularly preferably 1 or 2. [ka]

[0089] The naphthol aralkyl phenol resin may be a commercially available product, such as "SN-485" manufactured by Nippon Kagaku Co., Ltd.

[0090] -Propenyl group-containing phenolic resin- The propenyl group-containing phenolic resin contains a phenol structure having a propenyl group. One type of propenyl group-containing phenolic resin may be used alone, or two or more types may be used in combination.

[0091] The phenol structure having a propenyl group refers to a structure in which a hydroxyl group and a propenyl group are bonded to a benzene ring. The benzene ring of the propenylphenol structure may have one or more propenyl groups. The benzene ring of the phenol structure may have one or more substituents bonded thereto, as long as the effects of the present invention are not significantly impaired. Examples of the substituents include hydrocarbon groups such as alkyl groups and aryl groups.

[0092] Examples of the propenyl group include a 1-propenyl group and a 2-propenyl group (allyl group), with the allyl group being preferred.

[0093] The propenyl group-containing phenolic resin is preferably, for example, either a compound represented by the following formula (C3-1-1) or a compound represented by the following formula (C3-1-2). [ka] In formula (C3-1-1), R22 each independently represents a propenyl group; R 21 each independently represents an alkylene group; R 23 each independently represents a monovalent hydrocarbon group; b represents an integer of 1 to 20; q represents an integer of 1 to 3; and r represents an integer of 0 to 3. In formula (C3-1-2), R 22 each independently represents a propenyl group; R 21 each independently represents an alkylene group; R 23 each independently represents a monovalent hydrocarbon group, and R 24 each independently represents a single bond or a divalent aromatic hydrocarbon group; R 25 each independently represents a single bond or an alkylene group; s represents an integer of 1 to 4; each q independently represents an integer of 1 to 3; and each r independently represents an integer of 0 to 3.

[0094] In formula (C3-1-1) and formula (C3-1-2), R 21 each independently represents an alkylene group. The alkylene group may be linear or branched. The alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms, and particularly preferably 1 to 5 carbon atoms. Examples of the alkylene group include a methylene group, an ethylene group, and a propylene group.

[0095] In formula (C3-1-1) and formula (C3-1-2), R 23 R each independently represents a monovalent hydrocarbon group. 23 The range of R in formula (C1-1) 2 It can be the same as:

[0096] In formula (C3-1-1), R 24 each independently represents a single bond or a divalent aromatic hydrocarbon group. Examples of the divalent aromatic hydrocarbon group include an arylene group, an aralkylene group, and an arylenealkylenearylene group.

[0097] The arylene group is preferably an arylene group having 6 to 30 carbon atoms, more preferably an arylene group having 6 to 20 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. Examples of such an arylene group include a phenylene group, a naphthylene group, an anthracenylene group, and a biphenylene group, and among these, a phenylene group and a biphenylene group are preferred.

[0098] The aralkylene group is preferably an aralkylene group having 7 to 30 carbon atoms, more preferably an aralkylene group having 7 to 20 carbon atoms, and even more preferably an aralkylene group having 7 to 15 carbon atoms. Examples of such aralkylene groups include a benzylene group and a group having a biphenylene-methylene structure.

[0099] The arylene alkylene arylene group preferably has a carbon atom number of 13 to 30. Examples of such an arylene alkylene arylene group include groups having a phenylene-methylene-phenylene structure.

[0100] In formula (C3-1-2), R 25 R each independently represents a single bond or an alkylene group. 25 The scope of the alkylene group represented by R 21 It can be the same as:

[0101] In formula (C3-1-1) and formula (C3-1-2), q each independently represents an integer of 1 to 3. q is preferably 1 or 2, and more preferably 1.

[0102] In formula (C3-1-1) and formula (C3-1-2), each r independently represents an integer of 0 to 3. r is preferably 0 or 1, and particularly preferably 0.

[0103] In formula (C3-1-1), b represents an integer of 1 to 20. b is preferably 1 to 10, and more preferably 1 to 6.

[0104] In formula (C3-1-2), s represents an integer of 1 to 4. s is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1.

[0105] The propenyl group-containing phenolic resin is preferably, for example, any one of a compound represented by the following formula (C3-2-1), a compound represented by formula (C3-2-2), and a compound represented by formula (C3-2-3). [ka] In formula (C3-2-1), R 26 each independently represents a propenyl group; each m2 independently represents an integer of 1 to 5; and b1 independently represents an integer of 1 to 20. In formula (C3-2-2), R 26 each independently represents a propenyl group; each m2 independently represents an integer of 1 to 5; and s1 independently represents an integer of 1 to 4. In formula (C3-2-3), R 26 each independently represents a propenyl group; R 27 each independently represents an alkyl group having 1 to 5 carbon atoms or a phenyl group; each m2 independently represents an integer of 1 to 5; s1 independently represents an integer of 1 to 4; and each r1 independently represents 0 or 1.

[0106] In formula (C3-2-1), formula (C3-2-2), and formula (C3-2-3), R 26 each independently represents an alkyl group having 1 to 5 carbon atoms or a phenyl group. Examples of the alkyl group include a methyl group and an ethyl group.

[0107] In formula (C3-2-1), formula (C3-2-2), and formula (C3-2-3), m2 each independently represents an integer of 1 to 5. m2 is preferably 1 to 4, more preferably 1 to 3, and particularly preferably 1.

[0108] In formula (C3-2-1), formula (C3-2-2), and formula (C3-2-3), r1 each independently represents 0 or 1. r1 is preferably 0. In formula (C3-2-1), b1 represents an integer of 1 to 20. b1 can be the same as b in formula (C3-1-1).

[0109] In formula (C3-2-2) and formula (C3-2-3), s1 represents an integer of 1 to 4. s1 may be the same as s in formula (C3-1-2).

[0110] Examples of propenyl group-containing phenolic resins include compounds represented by the following formulas (C3-3-1), (C3-3-2), and (C3-3-3): 28 represents a propenyl group, b2 generally represents an integer of 1 to 20, preferably an integer of 1 to 6, and s2 generally represents an integer of 1 to 4, preferably an integer of 1 to 3, more preferably 1 or 2, and even more preferably 1. R 29 is R in formula (C-3-3) 27 and r2 is the same as r1 in formula (C3-2-3). [ka]

[0111] The propenyl group-containing phenolic resin may be a commercially available product, such as "SBA01A," "SBA02A," "BPN01S," "APG-LG," or "LVA-01" manufactured by Gun-ei Chemical Industry Co., Ltd., or "MEH-8000" manufactured by Meiwa Chemical Industry Co., Ltd.

[0112] -Diphenylmethane type phenolic resin- The diphenylmethane type phenolic resin contains a combination of a diphenylmethane structure and a phenol structure in the molecule, and one type of diphenylmethane type phenolic resin may be used alone, or two or more types may be used in combination.

[0113] The diphenylmethane structure refers to a structure in which hydrogen atoms in methane are replaced by one phenylene group and one hydroxyphenylene group or one hydroxyphenyl group.

[0114] As the diphenylmethane type phenolic resin, for example, a compound represented by the following formula (C4-1) is preferred. [ka] In formula (C4-1), R 41 each independently represents a monovalent hydrocarbon group, and c1 represents an integer of 1 to 20.

[0115] In formula (C4-1), R 41 R each independently represents a monovalent hydrocarbon group. 41 The monovalent hydrocarbon group represented by R in formula (C1-1) 2 is the same as the monovalent hydrocarbon group represented by

[0116] In formula (C4-1), c1 represents an integer of 1 to 20. nc4 is preferably 1 to 10, and more preferably 1 to 6.

[0117] The diphenylmethane type phenolic resin is preferably a compound represented by the following formula (C4-2). [ka] In formula (C4-2), c2 represents an integer of 1 to 20.

[0118] In formula (C4-2), c2 represents an integer of 1 to 20. c2 can be the same as c1 in formula (C4-1).

[0119] Commercially available diphenylmethane type phenolic resins may be used, such as "MEH-7800-4S," "MEH-7800-SS," "MEH-7800-S," "MEH-7800-M," and "MEH-7800-H" manufactured by Meiwa Chemical Industry Co., Ltd.

[0120] When the number of epoxy groups in the (E) epoxy resin is taken as 1, the number of phenolic hydroxyl groups in the (C) component is preferably 0.01 or more, more preferably 0.02 or more, even more preferably 0.05 or more, and preferably 1.5 or less, more preferably 1.0 or less, more preferably 0.9 or less, and particularly preferably 0.8 or less. The "number of phenolic hydroxyl groups in the (C) component" refers to the sum of all values obtained by dividing the mass of the non-volatile components of the (C) component present in the resin composition by the phenolic hydroxyl group equivalent. Furthermore, the "number of epoxy groups in the (E) epoxy resin" refers to the sum of all values obtained by dividing the mass of the non-volatile components of the (E) epoxy resin present in the resin composition by the epoxy equivalent.

[0121] The content of component (C), when the non-volatile components of the resin composition are taken as 100% by mass, is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more, from the viewpoint of suppressing the occurrence of cracks, and is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less.

[0122] When the resin component of the resin composition is taken as 100% by mass, the content of component (C) is preferably 1% by mass or more, more preferably 3% by mass or more, and particularly preferably 5% by mass or more, from the viewpoint of suppressing the occurrence of cracks, and is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.

[0123] <(D) Thermoplastic resin> The resin composition contains a thermoplastic resin (D) as component (D). This thermoplastic resin (D) as component (D) does not include those corresponding to the above-mentioned components (A) to (C). By incorporating a predetermined amount of the thermoplastic resin (D) into the resin composition, it is possible to obtain a cured product that has a low dielectric loss tangent and relative dielectric constant, can suppress the occurrence of cracks, and has excellent embeddability. The component (D) may be used alone or in combination of two or more.

[0124] From the viewpoint of improving embeddability, the content of component (D) is 0.5% by mass or less, preferably 0.45% by mass or less, more preferably 0.4% by mass or less, and even more preferably 0.3% by mass or less, based on 100% by mass of the nonvolatile components of the resin composition. Also, from the viewpoint of suppressing cracking, the content of component (D) is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more, based on 100% by mass of the nonvolatile components of the resin composition.

[0125] From the viewpoint of improving embeddability, the content of component (D) is preferably 5% by mass or less, more preferably 3% by mass or less, and particularly preferably 2% by mass or less, when the resin component of the resin composition is taken as 100% by mass, and is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and particularly preferably 0.4% by mass or more.

[0126] Examples of the (D) thermoplastic resin include phenoxy resin, polyimide resin, polystyrene resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, polyester resin, etc. The (D) thermoplastic resin may be used alone or in combination of two or more.

[0127] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenolacetophenone, novolac, biphenyl, fluorene, dicyclopentadiene, norbornene, naphthalene, anthracene, adamantane, terpene, and trimethylcyclohexane. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton); "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YL7500BH30," "YX6954BH30," "YX7553," "YX7553BH30," "YL7769BH30," "YL6794," "YL7213," "YL7290," "YL7482," and "YL7891BH30" manufactured by Mitsubishi Chemical Corporation; and the like.

[0128] The polyimide resin may be a resin having an imide structure (preferably a cyclic imide structure), such as an imidized product of an acid anhydride and a diamine compound or a diisocyanate compound. Specific examples of polyimide resins include "PIAD200" manufactured by Arakawa Chemical Industry Co., Ltd., "SLK-6100" manufactured by Shin-Etsu Chemical Co., Ltd., and "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd. Specific examples of polyimide resins include linear polyimides obtained by reacting bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride (polyimides described in JP 2006-37083 A), and modified polyimides such as polysiloxane skeleton-containing polyimides (polyimides described in JP 2002-12667 A and JP 2000-319386 A).

[0129] Examples of polystyrene resins include homopolymers of styrene, copolymers of styrene and diene compounds (butadiene, isoprene, etc.), and hydrogenated products thereof. Specific examples of polystyrene resins include hydrogenated styrene-based thermoplastic resins "H1041," "Tuftec H1043," "Tuftec P2000," and "Tuftec MP10" (manufactured by Asahi Kasei Corporation); epoxidized styrene-butadiene thermoplastic resins "Epofriend AT501" and "CT310" (manufactured by Daicel Corporation); modified polystyrene resin having hydroxyl groups "Septon HG252" (manufactured by Kuraray Co., Ltd.); modified polystyrene resin having carboxyl groups "Tuftec N503M," modified polystyrene resin having amino groups "Tuftec N501," modified polystyrene resin having acid anhydride groups "Tuftec M1913" (manufactured by Asahi Kasei Corporation); unmodified polystyrene resin "Septon S8104" (manufactured by Kuraray Co., Ltd.); styrene-ethylene / butylene-styrene block copolymer "FG1924" (manufactured by Kraton) and "EF-40" (manufactured by Cray Valley).

[0130] Examples of polyvinyl acetal resins include polyvinyl formal resins and polyvinyl butyral resins, with polyvinyl butyral resins being preferred. Specific examples of polyvinyl acetal resins include S-LEC BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, and BM series manufactured by Sekisui Chemical Co., Ltd.

[0131] Examples of polyolefin resins include ethylene copolymer resins such as low-density polyethylene, very low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin polymers such as polypropylene and ethylene-propylene block copolymer.

[0132] Examples of polybutadiene resins include hydrogenated polybutadiene skeleton-containing resins, hydroxy group-containing polybutadiene resins, phenolic hydroxy group-containing polybutadiene resins, carboxy group-containing polybutadiene resins, acid anhydride group-containing polybutadiene resins, epoxy group-containing polybutadiene resins, isocyanate group-containing polybutadiene resins, urethane group-containing polybutadiene resins, and polyphenylene ether-polybutadiene resins.

[0133] Specific examples of polyamide-imide resins include "Vylomax HR11NN" and "Vylomax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of polyamide-imide resins also include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imides) manufactured by Resonac Corporation.

[0134] A specific example of the polyethersulfone resin is "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0135] Specific examples of polysulfone resins include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0136] A specific example of the polyphenylene ether resin is "NORYL SA90" manufactured by SABIC Corp. A specific example of the polyetherimide resin is "Ultem" manufactured by GE Corp.

[0137] Examples of polycarbonate resins include hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, and urethane group-containing carbonate resins. Specific examples of polycarbonate resins include "FPC0220" manufactured by Mitsubishi Gas Chemical Company, Inc., "T6002" and "T6001" (polycarbonate diols) manufactured by Asahi Kasei Corporation, and "C-1090," "C-2090," and "C-3090" (polycarbonate diols) manufactured by Kuraray Co., Ltd. Specific examples of polyether ether ketone resins include "Sumiploy K" manufactured by Sumitomo Chemical Co., Ltd.

[0138] Examples of polyester resins include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, and polycyclohexane dimethyl terephthalate resin.

[0139] The weight average molecular weight (Mw) of the (D) thermoplastic resin is preferably greater than 5,000, more preferably 8,000 or more, even more preferably 10,000 or more, and particularly preferably 20,000 or more, and is preferably 100,000 or less, more preferably 70,000 or less, even more preferably 60,000 or less, and particularly preferably 50,000 or less.

[0140] When the content of component (C) when the nonvolatile components of the resin composition are taken as 100% by mass is defined as c1, and the content of component (D) when the nonvolatile components of the resin composition are taken as 100% by mass is defined as d1, from the viewpoint of significantly obtaining the effects of the present invention, c1 / d1 is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 30 or less, more preferably 25 or less, and even more preferably 20 or less, 15 or less, or 10 or less.

[0141] <(E) Epoxy resin> The resin composition may contain an (E) epoxy resin as component (E). The (E) epoxy resin may be a curable resin having an epoxy group. By including the (E) epoxy resin, a cured product exhibiting good mechanical strength and insulation reliability can be obtained. The (E) epoxy resin does not include those corresponding to the above-mentioned components (A) to (D). The (E) epoxy resin may be used alone or in combination of two or more.

[0142] Examples of (E) epoxy resins include bixylenol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, bisphenol AF-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, phenol aralkyl-type epoxy resins, biphenyl-type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane-type epoxy resins, cyclohexane dimethanol-type epoxy resins, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, and phenolphthalimidine-type epoxy resins. The (E) epoxy resin may be used alone or in combination of two or more.

[0143] From the viewpoint of obtaining a cured product having excellent heat resistance, the (E) epoxy resin preferably contains an epoxy resin containing an aromatic structure. The aromatic structure is a chemical structure generally defined as aromatic, and also includes polycyclic aromatic rings and aromatic heterocycles. Examples of epoxy resins containing an aromatic structure include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, bisxyleneol type epoxy resins, glycidylamine type epoxy resins having an aromatic structure, glycidyl ester type epoxy resins having an aromatic structure, cresol novolac type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins having an aromatic structure, epoxy resins having a butadiene structure having an aromatic structure, alicyclic epoxy resins having an aromatic structure, heterocyclic epoxy resins, spiro ring-containing epoxy resins having an aromatic structure, cyclohexanedimethanol type epoxy resins having an aromatic structure, naphthylene ether type epoxy resins, trimethylol type epoxy resins having an aromatic structure, and tetraphenylethane type epoxy resins having an aromatic structure.

[0144] The resin composition preferably contains, as the (E) epoxy resin, an epoxy resin having two or more epoxy groups per molecule. The proportion of the epoxy resin having two or more epoxy groups per molecule relative to 100% by mass of the non-volatile components of the (E) epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0145] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition may contain only a liquid epoxy resin as the epoxy resin, or may contain only a solid epoxy resin, or may contain a combination of a liquid epoxy resin and a solid epoxy resin.

[0146] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0147] Preferred liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins having an ester skeleton, cyclohexane type epoxy resins, cyclohexanedimethanol type epoxy resins, and epoxy resins having a butadiene structure, with naphthalene type epoxy resins being more preferred.

[0148] Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycyrol type epoxy resin) manufactured by ADEKA Corporation; and "EP-3950L" and "EP-3980S" ( Examples of epoxy resins include glycidylamine epoxy resins, ADEKA's "EP-4088S" (dicyclopentadiene epoxy resin), Nippon Steel Chemical & Material's "ZX1059" (a mixture of bisphenol A and bisphenol F epoxy resins), Nagase ChemteX's "EX-721" (glycidyl ester epoxy resin), Daicel's "Celloxide 2021P" (alicyclic epoxy resin with an ester structure), Daicel's "PB-3600," Nippon Soda's "JP-100" and "JP-200" (epoxy resins with a butadiene structure), and Nippon Steel Chemical & Material's "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane epoxy resin). These may be used alone or in combination.

[0149] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0150] Preferred solid epoxy resins include bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol novolac-type epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenol aralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, and phenolphthalimidine-type epoxy resins, and more preferred are biphenyl-type epoxy resins.

[0151] Specific examples of solid epoxy resins include DIC Corporation's "HP4032H" (naphthalene-type epoxy resin); DIC Corporation's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC Corporation's "N-690" (cresol novolac-type epoxy resin); DIC Corporation's "N-695" (cresol novolac-type epoxy resin); DIC Corporation's "HP-7200," "HP-7200HH," "HP-7200H," and "HP-7200L" (dicyclopentadiene-type epoxy resins); and DIC Corporation's "EXA-7311." "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V", "ESN4" manufactured by Nippon Steel Chemical & Material Co., Ltd. 100V" (naphthalene-type epoxy resin); "ESN485" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bixylenol-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "Y" manufactured by Mitsubishi Chemical Corporation Examples include "X7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0152] The epoxy equivalent of the (E) epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 3,000 g / eq., even more preferably 80 g / eq. to 2,000 g / eq., and particularly preferably 110 g / eq. to 1,000 g / eq. The epoxy equivalent represents the mass of the resin per equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0153] The weight average molecular weight (Mw) of the (E) epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0154] The content of the (E) epoxy resin is preferably 1% by mass or more, more preferably 5% by mass or more, and even more preferably 8% by mass or more, and is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

[0155] The content of the (E) epoxy resin, when the resin component in the resin composition is taken as 100% by mass, is preferably 20% by mass or more, more preferably 25% by mass or more, and even more preferably 30% by mass or more, and is preferably 40% by mass or less, more preferably 35% by mass or less, and even more preferably 30% by mass or less.

[0156] <(F) Radical Polymerizable Compound> The resin composition may contain a radically polymerizable compound (F) as component (F). This radically polymerizable compound (F) as component (F) excludes those corresponding to components (A) to (E). The component (F) may be used alone or in combination of two or more.

[0157] The (F) radical polymerizable compound may contain an ethylenically unsaturated bond. Therefore, the (F) radical polymerizable compound may have a radical polymerizable group containing an ethylenically unsaturated bond. Examples of the radical polymerizable group include unsaturated hydrocarbon groups such as vinyl, allyl, 1-propenyl, 3-cyclohexenyl, 3-cyclopentenyl, 2-vinylphenyl, 3-vinylphenyl, and 4-vinylphenyl; and α,β-unsaturated carbonyl groups such as acryloyl, methacryloyl, and maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl). The (F) radical polymerizable compound preferably has two or more radical polymerizable groups.

[0158] Examples of the (F) radical polymerizable compound include a (meth)acrylic radical polymerizable compound, a styrene radical polymerizable compound, an allyl radical polymerizable compound, a maleimide radical polymerizable compound, etc. The (F) component preferably contains either a styrene radical polymerizable compound or a maleimide radical polymerizable compound.

[0159] The (meth)acrylic radical polymerizable compound is, for example, a compound having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of the (meth)acrylic radical polymerizable compound include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and the like. Low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds such as dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate; low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and ethoxylated isocyanuric acid tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Examples of commercially available (meth)acrylic radically polymerizable compounds include "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA9000" and "SA9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC.

[0160] The styrene-based radical polymerizable compound is, for example, a compound having one or more, preferably two or more, vinyl groups directly bonded to an aromatic carbon atom. Examples of the styrene-based radical polymerizable compound include low-molecular-weight (molecular-weight less than 1000) styrene-based compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high-molecular-weight (molecular-weight 1000 or more) styrene-based compounds such as styrene-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Commercially available styrene-based radical polymerizable compounds include, for example, "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St 1200" and "OPE-2St 2200" (styrene-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Company, Inc. Further, examples of the styrene-based radical polymerizable compound include Copolymer A described in WO 2017 / 115813.

[0161] The allyl radical polymerizable compound is, for example, a compound having one or more, preferably two or more, allyl groups. Examples of allyl radical polymerizable compounds include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; epoxy-containing aromatic allyl compounds such as 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; and allyl silane compounds such as diallyldiphenylsilane. Commercially available allyl radical polymerizable compounds include "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Industry Co., Ltd., "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "TRIAM-705" (triallyl trimellitate) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., "DAND" (2,3-naphthalene carboxylic acid diallyl) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "ALP-d" (bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane) manufactured by Shikoku Chemical Industry Co., Ltd., "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane) manufactured by Nippon Kayaku Co., Ltd., and "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) manufactured by Shikoku Chemical Industry Co., Ltd.

[0162] The maleimide radical polymerizable compound is, for example, a compound having one or more, preferably two or more, maleimide groups. The maleimide radical polymerizable compound may be an aliphatic maleimide compound containing an aliphatic amine skeleton, or an aromatic maleimide compound containing an aromatic amine skeleton. Commercially available maleimide radical polymerizable compounds include, for example, "SLK-2600" manufactured by Shin-Etsu Chemical Co., Ltd., "BMI-1500," "BMI-1700," "BMI-3000J," "BMI-689," and "BMI-2500" (dimer diamine structure-containing maleimide compounds) manufactured by DesiCner Molecules, Inc., "BMI-6100" (aromatic maleimide compound) manufactured by DesiCner Molecules, Inc., "MIR-5000-60T" and "MIR-3000-70MT" (biphenylaralkyl maleimide compounds) manufactured by Nippon Kayaku Co., Ltd., "BMI-70" and "BMI-80" manufactured by K.I. Chemical Industry Co., Ltd., and "BMI-2300" and "BMI-TMH" manufactured by Daiwa Kasei Kogyo Co., Ltd. Furthermore, as the maleimide-based radical polymerizable compound, a maleimide resin (maleimide compound containing an indane ring skeleton) disclosed in Technical Disclosure No. 2020-500211 of the Japan Institute of Invention and Innovation may be used.

[0163] The ethylenically unsaturated bond equivalent of the radically polymerizable compound (F) is preferably 20 g / eq. to 3,000 g / eq., more preferably 50 g / eq. to 2,500 g / eq., even more preferably 70 g / eq. to 2,000 g / eq., and particularly preferably 90 g / eq. to 1,500 g / eq. The ethylenically unsaturated bond equivalent represents the mass of the radically polymerizable compound per equivalent of the ethylenically unsaturated bond.

[0164] The weight-average molecular weight (Mw) of the radically polymerizable compound (F) is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited, but may be, for example, 150 or more. The weight-average molecular weight can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0165] The content of component (F) is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more, and is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

[0166] The content of component (F) is preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more, and is preferably 15% by mass or less, more preferably 10% by mass or less, and even more preferably 8% by mass or less, when the resin component in the resin composition is taken as 100% by mass.

[0167] <(G) Hardener> The resin composition may contain a (G) curing agent as component (G). This (G) curing agent as component (G) excludes those corresponding to components (A) to (F). Component (G) generally has the function of curing the resin composition by reacting with component (E). Component (G) may be used alone or in combination of two or more types in any ratio.

[0168] The component (G) can be a compound capable of reacting with the component (E) to cure the resin composition, and examples thereof include active ester curing agents, phenolic curing agents (excluding those corresponding to the component (C)), benzoxazine curing agents, carbodiimide curing agents, acid anhydride curing agents, amine curing agents, cyanate ester curing agents, etc. Among these, from the viewpoint of significantly achieving the effects of the present invention, the component (G) preferably contains any one of an active ester curing agent, a phenolic curing agent, and a carbodiimide curing agent, and more preferably contains an active ester curing agent.

[0169] Examples of active ester curing agents include curing agents having one or more active ester groups per molecule. Among these, preferred active ester curing agents are compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, active ester curing agents obtained from a carboxylic acid compound and a hydroxy compound are preferred, and active ester curing agents obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound are more preferred.

[0170] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0171] Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalene, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolak. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one dicyclopentadiene molecule with two phenol molecules.

[0172] Preferred specific examples of the active ester curing agent include an active ester curing agent containing a dicyclopentadiene-type diphenol structure, an active ester curing agent containing a naphthalene structure, an active ester curing agent containing an acetylated product of phenol novolac, and an active ester curing agent containing a benzoylated product of phenol novolac. Among these, an active ester curing agent containing a naphthalene structure and an active ester curing agent containing a dicyclopentadiene-type diphenol structure are more preferred. The "dicyclopentadiene-type diphenol structure" refers to a divalent structure consisting of phenylene-dicyclopentylene-phenylene.

[0173] Commercially available active ester curing agents include "EXB9451," "EXB9460," "EXB9460S," "HPC-8000L-65TM," "HPC-8000-65T," "EXB-8000H," and "EXB-8000L-65TM" (manufactured by DIC Corporation) as active ester curing agents containing a dicyclopentadiene-type diphenol structure; and "EXB-9416-70BK," "EXB-8100L-65T," "HPC-8150-62T," "EXB-8150L-65T," "EXB-8100L-65T," and "EXB-8" (manufactured by DIC Corporation) as active ester curing agents containing a naphthalene structure. Examples of active ester curing agents include "EXB9401" (manufactured by DIC Corporation), a phosphorus-containing active ester curing agent, "DC808" (manufactured by Mitsubishi Chemical Corporation) containing an acetylated phenol novolac, "YLH1026," "YLH1030," and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) and "EXB-8500-65T" (manufactured by DIC Corporation) as active ester curing agents containing a benzoylated phenol novolac, and "PC1300-02-65T" and "PC1300-02-65MA" (manufactured by Air Water Inc.) as active ester curing agents containing a styryl group and a naphthalene structure.

[0174] Examples of phenolic curing agents include curing agents having one or more, preferably two or more, hydroxyl groups bonded to an aromatic ring (such as a benzene ring or a naphthalene ring) per molecule. Among these, compounds having a hydroxyl group bonded to a benzene ring are preferred. Furthermore, from the viewpoint of heat resistance and water resistance, phenolic curing agents having a novolac structure are preferred. Furthermore, from the viewpoint of adhesion, nitrogen-containing phenolic curing agents are preferred, and triazine skeleton-containing phenolic curing agents are more preferred. In particular, from the viewpoint of achieving high levels of heat resistance, water resistance, and adhesion, triazine skeleton-containing phenolic novolac curing agents are preferred.

[0175] Specific examples of phenol-based curing agents and naphthol-based curing agents include "MEH-7700," "MEH-7810," and "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd.; "NHN," "CBN," and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN-170," "SN-180," "SN-190," "SN-475," "SN-495," "SN-495V," "SN-375," and "SN-395" manufactured by Nippon Steel Chemical & Material Co., Ltd.; Examples include "TD-2090," "TD-2090-60M," "LA-7052," "LA-7054," "LA-1356," "LA-3018," "LA-3018-50P," "EXB-9500," "HPC-9500," "KA-1160," "KA-1163," and "KA-1165" manufactured by DIC Corporation; and "GDP-6115L," "GDP-6115H," and "ELPC75" manufactured by Gun-ei Chemical Co., Ltd.

[0176] Specific examples of carbodiimide curing agents include "V-03", "V-05", and "V-07" manufactured by Nisshinbo Chemical Inc.; and Stavaxol (registered trademark) P manufactured by Lanxess AG.

[0177] Specific examples of benzoxazine curing agents include "ODA-BOZ" manufactured by JFE Chemical Corporation, "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemicals Corporation.

[0178] Examples of acid anhydride curing agents include curing agents having one or more acid anhydride groups in one molecule. Specific examples of acid anhydride curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenone. Examples of suitable curing agents include tetracarboxylic dianhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resins (copolymers of styrene and maleic acid). Commercially available acid anhydride curing agents are also available, such as "MH-700" manufactured by New Japan Chemical Co., Ltd.

[0179] Examples of the amine curing agent include curing agents having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Among these, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine curing agent is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxybenzoyl). Examples of suitable amine curing agents include 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, and bis(4-(3-aminophenoxy)phenyl)sulfone. Commercially available amine curing agents may be used, such as "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

[0180] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; polyfunctional cyanate resins derived from phenol novolac, cresol novolac, etc.; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester curing agents include "PT30" and "PT60" manufactured by Lonza (both of which are phenol novolac-type multifunctional cyanate ester resins); "ULL-950S" (multifunctional cyanate ester resin); "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been triazine-converted to form a trimer); and the like.

[0181] When the number of epoxy groups in component (E) is taken as 1, the number of active groups in the (G) curing agent is preferably 0.01 or more, more preferably 0.05 or more, even more preferably 0.1 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. Here, "the number of epoxy groups in component (E)" refers to the total value obtained by dividing the mass of the non-volatile components of component (E) present in the resin composition by the epoxy equivalent. Furthermore, "the number of active groups in (G) curing agent" refers to the total value obtained by dividing the mass of the non-volatile components of the (G) curing agent present in the resin composition by the active group equivalent.

[0182] The content of the (G) curing agent is preferably 1% by mass or more, more preferably 5% by mass or more, and even more preferably 10% by mass or more, and is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 18% by mass or less, based on 100% by mass of the non-volatile components in the resin composition.

[0183] The content of the (G) curing agent, when the resin component in the resin composition is taken as 100% by mass, is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, and is preferably 70% by mass or less, more preferably 65% by mass or less, even more preferably 60% by mass or less.

[0184] <(H) Curing accelerator> The resin composition may contain a (H) curing accelerator as component (H). This (H) curing accelerator as component (H) does not include those corresponding to the above-mentioned components (A) to (G). The (H) curing accelerator functions as a curing catalyst that accelerates the curing of the (E) epoxy resin. The (H) component may be used alone or in combination of two or more.

[0185] Examples of the (H) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. Among these, imidazole-based curing accelerators are preferred. One type of (H) curing accelerator may be used alone, or two or more types may be used in combination.

[0186] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butyldimethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium tetra-p-tolylborate. aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine aromatic phosphines such as benzene, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether;

[0187] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. aromatic dimethylureas such as toluene bis(dimethylurea), 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluene bisdimethylurea].

[0188] Examples of guanidine curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide.

[0189] Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, and 1-benzyl-2-methylimidazole. Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl -(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct Examples of imidazole compounds include 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins. Commercially available imidazole curing accelerators include "1B2PZ," "2E4MZ," "2MZA-PW," "2MZ-OK," "2MA-OK," "2MA-OK-PW," "2PHZ," "2PHZ-PW," "Cl1Z," "Cl1Z-CN," "Cl1Z-CNS," and "C11Z-A" manufactured by Shikoku Chemicals Corporation; and "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0190] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organic copper complexes such as copper(II) acetylacetonate, organic zinc complexes such as zinc(II) acetylacetonate, organic iron complexes such as iron(III) acetylacetonate, organic nickel complexes such as nickel(II) acetylacetonate, and organic manganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0191] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc. Commercially available amine curing accelerators may be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno Co., Inc.

[0192] The content of (H) curing accelerator, when the non-volatile components of the resin composition are taken as 100% by mass, is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and particularly preferably 0.1% by mass or more, and is preferably 3% by mass or less, more preferably 1.5% by mass or less, and particularly preferably 1% by mass or less.

[0193] The content of the (H) curing accelerator, when the resin component of the resin composition is taken as 100% by mass, is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and particularly preferably 0.1% by mass or more, and is preferably 3% by mass or less, more preferably 1.5% by mass or less, and particularly preferably 1% by mass or less.

[0194] <(I) Optional Additives> The resin composition may contain (I) optional additives as component (I). Examples of (I) optional additives include thermosetting resins other than epoxy resins; organic fillers such as rubber particles; elastomers (excluding those corresponding to component (D)); organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; antifoaming agents such as silicone-based antifoaming agents, acrylic-based antifoaming agents, fluorine-based antifoaming agents, and vinyl resin-based antifoaming agents; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion improvers such as urea silanes; and triazole-based adhesion enhancers. Examples of the optional additives include adhesion promoters such as tetrazole-based adhesion promoters and triazine-based adhesion promoters; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (I) The optional additives may be used alone or in combination of two or more.

[0195] <(J) Solvent> The resin composition may further contain a (J) solvent as an optional volatile component in addition to the nonvolatile components (A) to (I) described above. Typically, an organic solvent is used as the (J) solvent. Examples of the organic solvent include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of suitable solvents include ether ester solvents such as ethyl acetate; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (J) Solvents may be used singly or in combination of two or more.

[0196] The amount of (J) solvent is not particularly limited, but may be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, or even 0% by mass, relative to 100% by mass of all components of the resin composition.

[0197] The resin composition can be produced, for example, by mixing the above-mentioned components. Some or all of the above-mentioned components may be mixed simultaneously, or they may be mixed sequentially. In the process of mixing each component, the temperature may be appropriately set, and thus heating and / or cooling may be performed temporarily or throughout. Furthermore, stirring or shaking may be performed in the process of mixing each component.

[0198] <Physical properties of resin composition> A cured product obtained by thermally curing the resin composition at 190°C for 90 minutes exhibits the characteristic of a low dielectric loss tangent. This results in an insulating layer with a low dielectric loss tangent. The dielectric loss tangent of the cured product is preferably 0.0040 or less, more preferably 0.0035 or less, even more preferably 0.0033 or less, and particularly preferably 0.0030 or less. There is no particular lower limit, and it can be, for example, 0.0010 or more. The dielectric loss tangent can be measured by the method described in the Examples below.

[0199] The cured product obtained by thermally curing the resin composition at 190°C for 90 minutes exhibits the characteristic of a low dielectric constant. This results in an insulating layer with a low dielectric constant. The dielectric constant of the cured product is preferably 3 or less, more preferably 2.9 or less, even more preferably 2.95 or less, and particularly preferably 2.8 or less. There is no particular lower limit, and it can be, for example, 0.1 or more. The dielectric constant can be measured by the method described in the Examples below.

[0200] The resin composition exhibits the characteristic of low melt viscosity. Therefore, for example, the dynamic viscoelastic modulus is measured using a dynamic viscoelasticity measuring device under measurement conditions of a temperature rise rate of 5°C / min, a measurement temperature interval of 2.5°C, and a vibration frequency of 1 Hz when measured in a temperature range of 60°C to 180°C. The melt viscosity when measured in a temperature range of 60°C to 180°C is preferably 4000 poise or less, 3000 poise or less, more preferably 2800 poise or less, 2500 poise or less. There is no particular lower limit, but it can be 10 poise or more. The melt viscosity can be measured by the method described in the examples below.

[0201] Because the resin composition has a low melt viscosity, the cured product obtained by curing the resin composition at 130°C for 30 minutes and then at 170°C for 30 minutes exhibits excellent embeddability. Therefore, an insulating layer with excellent embeddability is obtained. For example, a resin composition layer of a resin sheet is laminated on a copper-clad laminate on which a 1mm square lattice wiring pattern has been formed. After lamination, the resin composition layer is thermally cured at 130°C for 30 minutes and then at 170°C for 30 minutes to obtain an insulating layer. The support of the resin sheet is peeled off, and the embeddability of the resin composition layer in the 1mm square lattice wiring pattern is observed using a FIB-SEM composite device. Preferably, no voids due to poor embedding are generated, but depressions are generated on the wiring pattern. More preferably, the wiring patterns of all inner layer circuit boards are embedded with the insulating layer. The embeddability can be evaluated using the method described in the Examples below.

[0202] The resin composition is cured at 130°C for 30 minutes, followed by 30 minutes at 170°C, and the resulting cured product exhibits the property of being able to suppress the occurrence of cracks after desmearing (roughening treatment). This results in an insulating layer with excellent crack resistance. Specifically, after producing a circuit board and performing desmearing, when 100 copper pads on the circuit board are observed, the number of cracks is preferably 10 or less (10% or less), more preferably 3 or less. The crack resistance can be evaluated by the method described in the Examples below.

[0203] The resin composition can be used as a resin composition for insulating purposes, and can be particularly suitably used as a resin composition for forming an insulating layer (resin composition for forming an insulating layer). For example, the resin composition according to the present embodiment can be used as a resin composition for forming an insulating layer of a printed wiring board, and can be suitably used as a resin composition for forming an interlayer insulating layer (resin composition for interlayer insulation purposes).

[0204] The resin composition may also be used as a resin composition for forming a rewiring formation layer (resin composition for forming a rewiring formation layer). The rewiring formation layer refers to an insulating layer for forming a rewiring layer. The rewiring layer refers to a conductor layer formed on the rewiring formation layer as an insulating layer. For example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition according to this embodiment may be used as a resin composition for forming a rewiring formation layer. When a semiconductor chip package is manufactured through the following steps (1) to (6), a rewiring layer may further be formed on the sealing layer. (1) a step of laminating a temporary fixing film on a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0205] Furthermore, the resin composition can be used in a wide range of applications in which resin compositions are used, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor encapsulating materials, hole filling resins, and component embedding resins.

[0206] [Sheet-type laminated material] The resin composition according to this embodiment may be used by applying it in the form of a varnish, but from an industrial perspective, it is preferable to use it in the form of a sheet-like laminate material containing the resin composition.

[0207] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0208] In one embodiment, the resin sheet includes a support and a resin composition layer provided on the support. The resin composition layer is formed from the resin composition according to the present embodiment. Therefore, the resin composition layer usually includes a resin composition, and preferably includes only a resin composition.

[0209] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, from the viewpoint of reducing the thickness of the printed wiring board and providing a cured product of the resin composition with excellent insulating properties even when the cured product is thin. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be 5 μm or more, 10 μm or more, etc.

[0210] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0211] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0212] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0213] The surface of the support that is to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0214] The support may be a support with a release layer, which has a release layer on the surface that bonds with the resin composition layer. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available products may be used as the support with a release layer, including, for example, "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Uni-Peel" manufactured by Unitika Limited, which are PET films having a release layer primarily composed of an alkyd resin-based release agent.

[0215] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0216] In one embodiment, the resin sheet may further include an optional layer as needed. Examples of such optional layers include a protective film conforming to the support and provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to prevent dust from adhering to the surface of the resin composition layer and scratches.

[0217] The resin sheet can be produced, for example, by preparing a liquid (varnish) resin composition as is or by dissolving the resin composition in a solvent to prepare a liquid (varnish) resin composition, applying this to a support using a die coater or the like, and then drying it to form a resin composition layer.

[0218] The solvent may be the same as the solvent explained as a component of the resin composition. One type of solvent may be used alone, or two or more types may be used in combination.

[0219] Drying may be carried out by heating, blowing hot air, or the like. Drying conditions are not particularly limited, but drying is usually carried out so that the solvent content in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the solvent in the resin composition, for example, when a resin composition containing 30% by mass to 60% by mass of solvent is used, a resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0220] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can usually be used by peeling off the protective film.

[0221] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition according to this embodiment.

[0222] The sheet-like fiber substrate used for the prepreg can be, for example, a commonly used prepreg substrate such as glass cloth, aramid nonwoven fabric, or liquid crystal polymer nonwoven fabric. From the viewpoint of thinning the printed wiring board, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber substrate is not particularly limited, and is usually 10 μm or more.

[0223] The prepreg can be produced by a method such as a hot melt method or a solvent method.

[0224] The thickness of the prepreg can be in the same range as that of the resin composition layer in the resin sheet described above.

[0225] The sheet-like laminate material can be suitably used to form an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be more suitably used to form an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board).

[0226] [Printed wiring board] A printed wiring board according to one embodiment of the present invention includes an insulating layer containing a cured product of the resin composition according to this embodiment. This printed wiring board can be produced, for example, by using the resin sheet described above by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing the resin composition layer to form an insulating layer.

[0227] The "inner layer substrate" used in step (I) is a member that will become the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate is sometimes called an "inner layer circuit board." Furthermore, intermediate products on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board are also included in the aforementioned "inner layer substrate." When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0228] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS plate) or a metal roll (such as a SUS roll). Note that rather than pressing the thermocompression bonding member directly onto the resin sheet, it is preferable to press it via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0229] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination is preferably carried out under reduced pressure conditions of 26.7hPa or less.

[0230] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0231] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0232] The support may be removed between step (I) and step (II), or may be removed after step (II).

[0233] In step (II), the resin composition layer is cured to form an insulating layer made of a cured product of the resin composition. The resin composition layer is usually cured by thermal curing. Specific curing conditions for the resin composition layer may be those typically used when forming an insulating layer for a printed wiring board.

[0234] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0235] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 150°C, preferably 60°C to 140°C, more preferably 70°C to 130°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0236] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) to (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0237] In another embodiment, a printed wiring board can be manufactured using the above-mentioned prepreg. The manufacturing method can be basically the same as when a resin sheet is used.

[0238] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0239] Step (IV) is a step of roughening the insulating layer. Typically, smear removal is also performed in this step (IV). The roughening treatment procedure and conditions are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0240] Examples of swelling liquids used in the roughening treatment include alkaline solutions and surfactant solutions, with alkaline solutions being preferred. Examples of the alkaline solution include sodium hydroxide solution and potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. Swelling treatment using a swelling liquid can be performed by immersing the insulating layer in the swelling liquid at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in the swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0241] Examples of oxidizing agents used in the roughening treatment include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigance P" manufactured by Atotech Japan.

[0242] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product such as "Reduction Solution Securigant P" manufactured by Atotech Japan can be cited. Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From the standpoint of workability, a preferred method is to immerse the object that has been roughened with an oxidizing agent in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0243] In one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit and it can be, for example, 1 nm or more, 2 nm or more, etc. Furthermore, the root mean square roughness (Rq) of the insulating layer surface after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit and it can be, for example, 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0244] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0245] The conductor layer may have a single layer structure, or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0246] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0247] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer using a conventionally known technique such as a semi-additive method or a full-additive method. From the viewpoint of ease of production, the semi-additive method is preferred. An example of forming a conductor layer using a semi-additive method will be described below.

[0248] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0249] In another embodiment, the conductor layer may be formed using a metal foil. When a metal foil is used to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The resin composition layer and the metal foil may be laminated by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed using the metal foil on the insulating layer by a conventionally known technique such as a subtractive method or a modified semi-additive method.

[0250] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Smelting Co., Ltd., and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0251] [Semiconductor Devices] A semiconductor device according to one embodiment of the present invention includes the printed wiring board. The semiconductor device can be manufactured using the printed wiring board.

[0252] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). [Example]

[0253] The present invention will be specifically described below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. The porosity of the hollow inorganic filler and the solid inorganic filler is a value calculated by the above formula (1).

[0254] <Synthesis Example 1: Synthesis of Copolymer A> According to Example 1 of WO 2017 / 115813, 3.0 moles (390.6 g) of divinylbenzene, 1.8 moles (229.4 g) of ethylvinylbenzene, 10.2 moles (1066.3 g) of styrene, and 15.0 moles (1532.0 g) of n-propyl acetate were charged into a 5.0 L reactor, and 600 mmol of boron trifluoride diethyl ether complex was added at 70 ° C. The reaction was allowed to proceed for 4 hours. After the polymerization solution was terminated with aqueous sodium bicarbonate solution, the oil layer was washed three times with pure water, and the mixture was devolatilized under reduced pressure at 60 ° C. to recover the polymer. The resulting product was weighed, and it was confirmed that 896.7 g of copolymer A was obtained. The Mw of copolymer A was 41,300.

[0255] <Example 1: Preparation of resin composition 1> Six parts of a biphenyl-type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent: approximately 271 g / eq.) and 14 parts of a naphthalene-type epoxy resin ("HP4032SS" manufactured by DIC Corporation, epoxy equivalent: approximately 144 g / eq.) were heated and dissolved in 20 parts of toluene and 20 parts of MEK while stirring. The resulting solution was cooled to room temperature and then mixed with 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%), 6 parts of a triazine skeleton-containing phenolic curing agent (DIC Corporation's "LA-3018-50P", hydroxyl group equivalent approximately 151 g / eq., 2-methoxypropanol solution with a solid content of 50%), 5 parts of a biphenylaralkyl phenolic resin (Nippon Kayaku Co., Ltd.'s "GPH-65", phenol equivalent approximately 198 g / eq.), 1 part of a carbodiimide curing agent (Nisshinbo Chemical Inc.'s "V-03", unsaturated bond equivalent 428 g / eq., toluene solution with a solid content of 50%), and 1 part of a phenoxy resin (Mitsubishi Chemical Corporation's "YX7553"). Resin composition 1 was obtained by mixing 1 part of "BH30" (a 30% solids MEK-cyclohexanone mixed solution), 5 parts of a curing accelerator (a 10% solids MEK solution of "1B2PZ" manufactured by Shikoku Chemical Industry Co., Ltd.), 100 parts of a solid inorganic filler (spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.), and 35 parts of a hollow inorganic filler (hollow silica ("LHP-208" manufactured by Ube Exsymo Co., Ltd., average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.), and uniformly dispersing the mixture in a high-speed rotating mixer.

[0256] <Example 2: Preparation of resin composition 2> In Example 1, 1) The amount of biphenyl aralkyl phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight approximately 198 g / eq.) was changed from 5 parts to 7 parts. 2) The amount of active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was changed from 43 parts to 25 parts. 3) 6 parts of a triazine skeleton-containing phenolic curing agent (DIC Corporation "LA-3018-50P", hydroxyl group equivalent weight approximately 151 g / eq., 2-methoxypropanol solution with a solid content of 50%) was replaced with 20 parts of a dicyclopentadiene-type diphenol structure-containing active ester curing agent (DIC Corporation "HPC-8000L-65MT", active group equivalent weight 220 g / eq., MEK / toluene mixed solution with a solid content of 65%). 4) The amount of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK / cyclohexanone mixed solution) was changed from 2 parts to 1 part. Resin composition 2 was obtained in the same manner as in Example 1 except for the above points.

[0257] <Example 3: Preparation of resin composition 3> In Example 1, 1) 5 parts of biphenylaralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of biphenylaralkyl type phenolic resin ("GPH-103" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 231 g / eq.), 2) 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was replaced with 40 parts of a dicyclopentadiene-type diphenol structure-containing active ester curing agent (DIC Corporation's "HPC-8000L-65MT," active group equivalent 220 g / eq., MEK / toluene mixed solution with a solid content of 65%). 3) The amount of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK / cyclohexanone mixed solution) was changed from 2 parts to 1 part. Resin composition 3 was obtained in the same manner as in Example 1 except for the above points.

[0258] <Example 4: Preparation of resin composition 4> In Example 1, 1) 5 parts of biphenyl aralkyl type phenolic resin (Nippon Kayaku Co., Ltd. "GPH-65", phenol equivalent: approximately 198 g / eq.) was replaced with 5 parts of naphthol aralkyl type phenolic resin (Nippon Kayaku Co., Ltd. "SN-485", phenol equivalent: approximately 215 g / eq.), 2) 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was replaced with 45 parts of a radical polymerizable compound (DIC Corporation's "NE-V-1100-70T," unsaturated bond equivalent 428 g / eq., toluene solution with a solid content of 70%). 3) The amount of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK / cyclohexanone mixed solution) was changed from 2 parts to 1 part. Resin composition 4 was obtained in the same manner as in Example 1 except for the above points.

[0259] <Example 5: Preparation of resin composition 5> In Example 1, 1) 5 parts of biphenylaralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of biphenylaralkyl type phenolic resin ("MEH-7851-SS" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent weight: approximately 203 g / eq.), 2) Two parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK-cyclohexanone mixed solution) were replaced with two parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7891BH30", a 30% solids MEK-cyclohexanone mixed solution), 3) The amount of solid inorganic filler (spherical silica (Admatechs Co., Ltd. "SO-C2", average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573") was changed from 100 parts to 108 parts. 4) The amount of hollow inorganic filler (hollow silica (Ube Exsymo Co., Ltd. "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573") was changed from 35 parts to 27 parts. Resin composition 5 was obtained in the same manner as in Example 1 except for the above points.

[0260] <Example 6: Preparation of resin composition 6> In Example 1, 1) 5 parts of biphenylaralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of biphenylaralkyl type phenolic resin ("MEH-7851-4H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent weight: approximately 240 g / eq.), 2) Two parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK-cyclohexanone mixed solution) were replaced with one part of phenoxy resin (Mitsubishi Chemical Corporation's "YX7899BH30", a 30% solids MEK-cyclohexanone mixed solution), 3) The amount of solid inorganic filler (spherical silica (Admatechs Co., Ltd. "SO-C2", average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573") was changed from 100 parts to 55 parts. 4) The amount of hollow inorganic filler (hollow silica (Ube Exsymo "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573") was changed from 35 parts to 80 parts. Resin composition 6 was obtained in the same manner as in Example 1 except for the above points.

[0261] <Example 7: Preparation of resin composition 7> In Example 1, 1) 5 parts of biphenylaralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of diphenylmethane type phenolic resin ("MEH-7800-4S" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent weight: approximately 173 g / eq.), 2) Two parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK-cyclohexanone mixed solution) were replaced with two parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX6954BH30", a 30% solids MEK-cyclohexanone mixed solution), 3) 6 parts of Copolymer A (toluene solution with a solid content of 50%) described in Synthesis Example 1 was used. Resin composition 7 was obtained in the same manner as in Example 1 except for the above points.

[0262] <Example 8: Preparation of resin composition 8> In Example 1, 1) 5 parts of biphenylaralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of diphenylmethane type phenolic resin ("MEH-7800-H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent weight: approximately 178 g / eq.), 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 1 part. 3) Five parts of the curing accelerator (10% solids MEK solution of "1B2PZ" manufactured by Shikoku Chemical Industry Co., Ltd.) was changed to one part of the curing accelerator (4-dimethylaminopyridine (DMAP), 10% solids MEK solution). Resin composition 8 was obtained in the same manner as in Example 1 except for the above points.

[0263] <Example 9: Preparation of resin composition 9> In Example 1, 1) 5 parts of biphenyl aralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of allyl group-containing biphenyl type phenolic resin ("SBA01A" manufactured by Gunei Chemical Industry Co., Ltd., phenol equivalent weight: approximately 260 g / eq.), 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 3 parts. 3) Three parts of a maleimide compound ("BMI-689" manufactured by Designer Molecules, maleimide equivalent: 345 g / eq.) were used. Resin composition 9 was obtained in the same manner as in Example 1 except for the above points.

[0264] Example 10: Preparation of resin composition 10 In Example 1, 1) 5 parts of biphenyl aralkyl phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of allyl group-containing biphenyl phenolic resin ("SBA02A" manufactured by Gunei Chemical Industry Co., Ltd., phenol equivalent weight: approximately 222 g / eq.), 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 1 part. 3) Three parts of a maleimide compound ("BMI-1500" manufactured by Designer Molecules, maleimide equivalent: 752 g / eq.) were used. Resin composition 10 was obtained in the same manner as in Example 1 except for the above points.

[0265] <Example 11: Preparation of resin composition 11> In Example 1, 1) 5 parts of biphenyl aralkyl type phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 5 parts of propenylated biphenyl type phenolic resin ("BPN01S" manufactured by Gunei Chemical Industry Co., Ltd., phenol equivalent weight: approximately 245 g / eq.), 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK / cyclohexanone mixed solution) was changed from 2 parts to 1 part. Resin composition 11 was obtained in the same manner as in Example 1 except for the above points.

[0266] <Example 12: Preparation of resin composition 12> In Example 1, 1) Five parts of biphenylaralkyl phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) were replaced with four parts of allylphenolic resin ("APG-LG" manufactured by Gunei Chemical Industry Co., Ltd., phenol equivalent weight: approximately 157 g / eq.). Resin composition 12 was obtained in the same manner as in Example 1 except for the above points.

[0267] <Example 13: Preparation of resin composition 13> In Example 1, 1) 5 parts of biphenyl aralkyl phenol resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with 4 parts of allyl phenol resin ("LVA-01" manufactured by Gunei Chemical Industry Co., Ltd., phenol equivalent weight: approximately 154 g / eq.), 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 1 part. 3) The amount of solid inorganic filler (spherical silica (Admatechs Co., Ltd. "SO-C2", average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573")) was changed from 100 parts to 120 parts. 4) 35 parts of hollow inorganic filler (hollow silica (Ube Exximo Co., Ltd. "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573")) was replaced with 15 parts of hollow inorganic filler (hollow silica (Taiheiyo Cement Corporation "MGH-005", average particle size 1.6 μm, porosity 80% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573")). Resin composition 13 was obtained in the same manner as in Example 1 except for the above points.

[0268] <Example 14: Preparation of resin composition 14> Resin composition 14 was obtained in the same manner as in Example 1, except that 2 parts of the phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a mixed solution of MEK and cyclohexanone with a solid content of 30%) was replaced with 3 parts of a polyimide resin ("PIAD200" manufactured by Arakawa Chemical Industries, Ltd., a mixed solution of cyclohexanone, dimethyl glycol, and methylcyclohexane with a solid content of 20%).

[0269] <Example 15: Preparation of resin composition 15> Resin composition 15 was obtained in the same manner as in Example 1, except that 2 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, MEK-cyclohexanone mixed solution with 30% solids) was changed to 1.5 parts of styrene-butadiene resin ("Tuftec P2000" manufactured by Asahi Kasei Corporation, toluene solution with 33.3% solids).

[0270] <Example 16: Preparation of resin composition 16> In Example 1, 1) The amount of hollow inorganic filler (hollow silica (Ube Exsymo's "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd.'s "KBM573")) was changed from 35 parts to 50 parts, 2) The amount of solid inorganic filler (spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.)) was changed from 100 parts to 85 parts. Resin composition 16 was obtained in the same manner as in Example 1 except for the above points.

[0271] <Example 17: Preparation of resin composition 17> In Example 1, 1 part of a carbodiimide curing agent ("V-03" manufactured by Nisshinbo Chemical Inc., unsaturated bond equivalent 428 g / eq., toluene solution with a solid content of 50%) was not used. Resin composition 17 was obtained in the same manner as in Example 1 except for the above points.

[0272] <Example 18: Preparation of resin composition 18> In Example 1, 1) 35 parts of hollow inorganic filler (hollow silica (Ube Exsymo's "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical's "KBM573")) was replaced with 35 parts of hollow inorganic filler (hollow silica (Taiheiyo Cement's "MGH-005", average particle size 1.6 μm, porosity 80% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical's "KBM573"). Resin composition 18 was obtained in the same manner as in Example 1, except for the above.

[0273] <Comparative Example 1: Preparation of Resin Composition 19> In Example 1, 1) 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was replaced with 40 parts of a dicyclopentadiene-type diphenol structure-containing active ester curing agent (DIC Corporation's "HPC-8000L-65MT," active group equivalent 220 g / eq., MEK / toluene mixed solution with a solid content of 65%). 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 1 part. 3) The amount of solid inorganic filler (spherical silica (Admatechs Co., Ltd. "SO-C2", average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573")) was changed from 100 parts to 135 parts. 4) No hollow inorganic filler (hollow silica (Ube Exsymo's "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical's "KBM573")) was used. Resin composition 19 was obtained in the same manner as in Example 1 except for the above points.

[0274] <Comparative Example 2: Preparation of Resin Composition 20> In Example 1, 1) 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was replaced with 40 parts of a dicyclopentadiene-type diphenol structure-containing active ester curing agent (DIC Corporation's "HPC-8000L-65MT," active group equivalent 220 g / eq., MEK / toluene mixed solution with a solid content of 65%). 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 1 part. 3) The amount of triazine skeleton-containing phenolic curing agent (DIC Corporation "LA-3018-50P", hydroxyl group equivalent weight approximately 151 g / eq., 2-methoxypropanol solution with 50% solids) was changed from 6 parts to 10 parts. 4) A biphenyl aralkyl phenolic curing agent ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent: approximately 198 g / eq.) was not used. Resin composition 20 was obtained in the same manner as in Example 1 except for the above points.

[0275] <Comparative Example 3: Preparation of Resin Composition 21> In Example 1, 1) 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was replaced with 40 parts of a dicyclopentadiene-type diphenol structure-containing active ester curing agent (DIC Corporation's "HPC-8000L-65MT," active group equivalent 220 g / eq., MEK / toluene mixed solution with a solid content of 65%). 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 30% solids MEK / cyclohexanone mixed solution) was changed from 2 parts to 5 parts. Resin composition 21 was obtained in the same manner as in Example 1 except for the above points.

[0276] <Comparative Example 4: Preparation of Resin Composition 22> In Example 1, 1) 43 parts of an active ester curing agent (HP-B-8151-62T, active group equivalent 238 g / eq., toluene solution with a solid content of 62%) was replaced with 40 parts of a dicyclopentadiene-type diphenol structure-containing active ester curing agent (DIC Corporation's "HPC-8000L-65MT," active group equivalent 220 g / eq., MEK / toluene mixed solution with a solid content of 65%). 2) The amount of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", MEK-cyclohexanone mixed solution with 30% solids) was changed from 2 parts to 1 part. 3) Five parts of a biphenylaralkyl phenolic resin ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenol equivalent weight: approximately 198 g / eq.) was replaced with four parts of a polyfunctional phenolic curing agent having the following structure ("MEH-7600-4H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent weight: approximately 100 g / eq., where n represents 1 to 3): Resin composition 22 was obtained in the same manner as in Example 1 except for the above points. [ka]

[0277] <Comparative Example 5: Preparation of Resin Composition 23> In Comparative Example 4, the mixture was changed to 4 parts of a polyfunctional phenol-based curing agent ("MEH-7600-4H" manufactured by Meiwa Chemical Industry Co., Ltd., phenol equivalent of approximately 100 g / eq.) and 10 parts of an alicyclic skeleton-containing phenol-based curing agent ("FATC809" manufactured by Gun-ei Chemical Industry Co., Ltd., containing an allyl group, phenol equivalent of approximately 1250 g / eq.). Resin composition 23 was obtained in the same manner as in Example 1 except for the above points.

[0278] <Comparative Example 6: Preparation of Resin Composition 24> In Example 1, 1) The amount of hollow inorganic filler (hollow silica (Ube Exsymo's "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd.'s "KBM573")) was changed from 35 parts to 7 parts, 2) The amount of solid inorganic filler (spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.)) was changed from 100 parts to 128 parts. Resin composition 24 was obtained in the same manner as in Example 1 except for the above points.

[0279] <Comparative Example 7: Preparation of Resin Composition 25> In Example 1, 1) The amount of hollow inorganic filler (hollow silica (Ube Exsymo's "LHP-208", average particle size 0.5 μm, porosity 50% by volume) surface-treated with an amine-based silane coupling agent (Shin-Etsu Chemical Co., Ltd.'s "KBM573")) was changed from 35 parts to 83 parts, 2) The amount of solid inorganic filler (spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, porosity 0% by volume) surface-treated with an amine-based silane coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.)) was changed from 100 parts to 52 parts. Resin composition 25 was obtained in the same manner as in Example 1 except for the above points.

[0280] <Comparative Example 8: Preparation of Resin Composition 26> In Example 1, 1 part of the phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a MEK / cyclohexanone mixed solution with a solid content of 30%) was not used. Resin composition 26 was obtained in the same manner as in Example 1, except for the above points.

[0281] <Test Example 1: Measurement of dielectric loss tangent and relative permittivity> (1) Preparation of cured product for evaluation A glass cloth-based epoxy resin double-sided copper-clad laminate (Panasonic "R5715ES", thickness 0.7 mm, 255 mm square) was placed on the release agent-untreated side of a release agent-treated PET film (Lintec "501010", thickness 50 μm, 240 mm square), and the four sides were fixed with polyimide adhesive tape (width 10 mm) (hereinafter sometimes referred to as "fixed PET film").

[0282] Resin compositions 1 to 26 obtained in the examples and comparative examples were applied to the release-treated surface of the above-mentioned "fixed PET film" using an applicator so that the thickness of the resin composition layer after drying would be 40 μm, and then dried at 70°C to 100°C (average 100°C) for 3 minutes to obtain resin sheet A.

[0283] The resin composition layer was then placed in a 190°C oven and thermally cured for 90 minutes. After thermal curing, the polyimide adhesive tape was peeled off, and the cured product was removed from the glass cloth-based epoxy resin double-sided copper-clad laminate. The PET film ("501010" manufactured by Lintec Corporation) was also peeled off, yielding a sheet-like cured product. The resulting cured product is referred to as the "cured product for evaluation."

[0284] (2) Measurement of relative permittivity and dielectric loss tangent The cured product for evaluation was cut to obtain a test piece measuring 2 m in width and 80 mm in length. The dielectric constant and dielectric loss tangent of the test piece were measured by the cavity resonance perturbation method using an "HP8362B" manufactured by Agilent Technologies at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on two test pieces, and the average values were calculated.

[0285] <Test Example 2: Measurement of Melt Viscosity> Twenty-five resin composition layers of resin sheet A were stacked together to a thickness of 1 mm, and a 20 mm diameter punch was used to prepare a measurement sample. The melt viscosity of the prepared measurement sample was measured using a dynamic viscoelasticity measuring device (UBM's "Rheogel-G3000"). The dynamic viscoelasticity was measured under the following measurement conditions: starting temperature 60°C to 200°C, heating rate 5°C / min, measurement temperature interval 2.5°C, and oscillation frequency 1 Hz, and the minimum melt viscosity (poise) was determined. A cone plate was used as the measurement jig.

[0286] <Test Example 3: Evaluation of embeddability> (1) Preparation of resin sheet B A polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) with a release layer was prepared as a support. The resin varnishes obtained in the Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 25 μm, and dried at 70°C to 80°C (average 75°C) for 2.5 minutes to obtain a resin sheet B including a support and a resin composition layer.

[0287] (2) Lamination of resin sheet B A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness: 12 μm, substrate thickness: 0.15 mm, Mitsubishi Gas Chemical Company, Inc. "HL832NSF LCA", 255 × 340 mm size) was prepared as a copper-clad laminate. The copper surface of the copper-clad laminate was roughened on both sides using a MEC "CZ8201" (copper etching depth: 0.5 μm). Resin sheet B was then laminated onto both sides of the copper-clad laminate using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700") so that the resin composition layer was in contact with the copper-clad laminate. Lamination was performed by reducing the pressure to 13 hPa or less for 30 seconds, followed by pressure bonding at 120 °C and a pressure of 0.74 MPa for 30 seconds. Next, the laminate was heat-pressed at 100°C under a pressure of 0.5 MPa for 60 seconds.

[0288] (3) Thermal curing of the resin composition layer The inner layer substrate laminated with resin sheet B was then placed in an oven at 130°C and heated for 30 minutes, and then transferred to an oven at 170°C and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. The support was then peeled off to obtain a cured substrate A having an insulating layer, a copper-clad laminate, and an insulating layer in this order.

[0289] (4) Evaluation of the embedding ability of the insulating layer Using a FIB-SEM hybrid instrument (SMI3050SE manufactured by SII Nanotechnology Inc.), the embedding ability of the resin composition layer in the 1 mm square lattice wiring pattern of the cured substrate A was observed and evaluated according to the following criteria. ○: All wiring patterns are buried in insulating layers. △: No voids due to poor filling occurred, but depressions occurred on the wiring pattern. ×: Voids are generated due to poor filling.

[0290] <Test Example 4: Evaluation of crack resistance> (1) Evaluation of crack resistance after desmearing A 25 μm thick resin sheet B was laminated to both sides of a core material (Resonac Corporation "E705GR", 400 μm thick) consisting of 350 μm diameter circular copper pads (35 μm copper thickness) arranged in a grid pattern at 400 μm intervals to achieve a residual copper ratio of 60%. Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd. two-stage build-up laminator "CVP700"), the resin composition layer was bonded to both sides of the core material. This lamination was carried out by reducing the pressure to 13 hPa or less for 30 seconds, followed by pressure bonding at 100 °C and 0.74 MPa for 30 seconds. This was placed in a 130 °C oven and heated for 30 minutes, then transferred to a 170 °C oven and heated for 30 minutes. The support was then peeled off, and the resulting circuit board was immersed in a swelling solution, Swelling Dip Securigant P (manufactured by Atotech Japan), at 60°C for 10 minutes. Next, the circuit board was immersed in a roughening solution, Concentrate Compact P (aqueous solution of 60 g / L KMnO4 and 40 g / L NaOH) (manufactured by Atotech Japan), at 80°C for 30 minutes. Finally, the circuit board was immersed in a neutralizing solution, Reduction Solution Securigant P (manufactured by Atotech Japan), at 40°C for 5 minutes. One hundred copper pads on the roughening-treated circuit board were observed to check for the presence or absence of cracks in the resin composition layer, and the results were evaluated according to the following criteria. ◎: 3 or fewer cracks 〇: More than 3 but less than 10 cracks ×: More than 10 cracks

[0291] [Table 1] [Table 2] [Table 3] In the table, *1: Indicates the content when the non-volatile components in the resin composition are taken as 100% by mass. *2: Indicates the content when the non-volatile components in the resin composition are 100% by volume. *3: Indicates the content when the total amount of components (A) and (B) is 100% by volume.

[0292] (1) The components (A) and (B) are mixed together to obtain a predetermined volume ratio, (2) Contains component (C) whose phenol equivalent is within a specified range, and (3) Examples 1 to 18, which contain a predetermined amount of component (D), show that cured products with low dielectric tangent and relative dielectric constant, which can suppress the occurrence of cracks, and which have excellent embeddability can be obtained.

[0293] On the other hand, Comparative Examples 1, 6, and 7, which satisfy the above requirements (2) and (3) but do not satisfy the requirement (1), are shown to be inferior to Examples 1-18 in either the relative dielectric constant or the embeddability.

[0294] It is shown that Comparative Example 2, which satisfies the above requirements (1) and (3) but does not satisfy requirement (2), does not suppress the occurrence of cracks as compared with Examples 1 to 15.

[0295] Comparative Example 3, which satisfies the above requirements (1) and (2) but does not satisfy requirement (3) (does not contain the specified amount of component (D)), has a higher melt viscosity than Examples 1 to 18, and is therefore shown to have inferior embeddability.

[0296] Although the above requirements (1) and (3) are satisfied, the comparative example 4 does not satisfy the requirement (2), i.e., the phenol equivalent is outside the range of 130 g / eq. or more and 1000 g / eq. or less, and is shown to have an inferior dielectric tangent compared to the examples 1 to 18.

[0297] Although the above requirements (1) and (3) are satisfied, the requirement (2) is not satisfied. In other words, Comparative Example 5, which uses a phenolic resin with a phenol equivalent of approximately 1250 g / eq., outside the range of 130 g / eq. to 1000 g / eq., has an inferior dielectric tangent compared to Examples 1 to 18. Furthermore, since Comparative Example 5 uses a phenolic resin with a phenol group equivalent of approximately 1250 g / eq., the resin composition is not cured sufficiently, and the embeddability is inferior.

[0298] Furthermore, Comparative Example 8, which satisfies the above requirements (1) and (2) but does not satisfy requirement (3) (does not contain component (D)), shows that cracking is not suppressed as compared with Examples 1 to 18.

Claims

1. (A) hollow inorganic filler, (B) a solid inorganic filler; (C) one or more phenolic resins selected from biphenyl aralkyl phenolic resins, naphthol aralkyl phenolic resins, propenyl group-containing phenolic resins, and diphenylmethane phenolic resins; and (D) a thermoplastic resin, a1 / b1 is 0.2 or more and 3 or less, where a1 is the content of the component (A) when the total amount of the component (A) and the component (B) is taken as 100 volume%, and b1 is the content of the component (B) when the total amount of the component (A) and the component (B) is taken as 100 volume%, and The phenol equivalent of component (C) is 130 g / eq. or more and 1000 g / eq. or less, A resin composition, wherein the content of component (D) is 0.5% by mass or less when the total nonvolatile components of the resin composition is 100% by mass.

2. The resin composition according to claim 1, wherein the content of the component (C) is 0.5% by mass or more and 10% by mass or less, when the total nonvolatile components of the resin composition is 100% by mass.

3. The resin composition according to claim 1 , further comprising (E) an epoxy resin.

4. The resin composition according to claim 1 , further comprising (F) a radically polymerizable compound.

5. The resin composition according to claim 4 , wherein the component (F) comprises either a styrene-based radical polymerizable compound or a maleimide-based radical polymerizable compound.

6. The resin composition according to claim 1 , further comprising (G) a curing agent.

7. The resin composition according to claim 6 , wherein the (G) curing agent comprises an active ester curing agent.

8. The BET specific surface area of component (A) is 1 m ２ / g or more 100m ２ The resin composition according to claim 1, wherein the viscosity is 1000 kJ / g or less.

9. The resin composition according to claim 1, wherein the content of the component (A) is 1% by mass or more and 60% by mass or less, when the total nonvolatile components of the resin composition is 100% by mass.

10. The BET specific surface area of component (B) is 0.1 m ２ / g or more 100m ２ The resin composition according to claim 1, wherein the viscosity is 1000 kJ / g or less.

11. The resin composition according to claim 1, wherein the content of the component (B) is 10% by mass or more and 80% by mass or less, when the total nonvolatile components of the resin composition is 100% by mass.

12. The resin composition according to claim 1, which is used to form an insulating layer.

13. A cured product of the resin composition according to any one of claims 1 to 12.

14. A sheet-like laminate material comprising the resin composition according to any one of claims 1 to 12.

15. A resin sheet comprising a support and a resin composition layer formed on the support from the resin composition according to any one of claims 1 to 12.

16. A printed wiring board comprising an insulating layer containing a cured product of the resin composition according to any one of claims 1 to 12.

17. A semiconductor device comprising the printed wiring board according to claim 16.

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