Memory device including tiled arrangement of memory transistors capable of operating independently and concurrently

Abstract

To provide a memory device including a tiled arrangement of memory transistors capable of operating independently and concurrently, and a memory system including a multi-channel configuration for high-bandwidth access.SOLUTION: In a memory device, each tile of a plurality of tiles of a memory circuit is electrically connected to a module control circuit and includes a physically separated memory array operated by the module control circuit. The memory array includes a three-dimensional array of storage transistors configured by a plurality of memory pages in a storage transistor, and each storage transistor is accessed by a word line and a bit line. Each tile is individually addressed by the associated module control circuit and operates independently of each other to perform memory operations on memory pages of storage transistors in the memory array in response to memory access commands specified for the tile.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to memory systems having large capacity and high bandwidth, and more particularly to memory devices including tiled arrays of memory transistors that can operate independently and simultaneously, and to memory systems having multi-channel configurations for high-bandwidth access. [Background technology]

[0002] High-density memory arrays, such as a three-dimensional array of NOR memory strings ("3D NOR memory array"), are disclosed, for example, in U.S. Pat. No. 10,121,553, entitled "Capacitively Coupled Nonvolatile Thin Film Transistor NOR Strings in a Three-Dimensional Array," filed August 26, 2016, and issued November 6, 2018. The entire disclosure of U.S. Pat. No. 10,121,553 is incorporated herein by reference for all purposes. The storage transistors or memory transistors of U.S. Pat. No. 10,121,553 are configured as a three-dimensional array of NOR memory strings formed on a plane of a semiconductor substrate. In addition to providing high memory density and capacity, such three-dimensional NOR memory arrays can provide highly desirable speeds of memory circuits that are comparable to conventional memory circuits, such as dynamic random access memories ("DRAMs"), which have much lower circuit density and consume significantly more power.

[0003] Furthermore, the memory circuit of Patent Document 1 is also referred to as "quasi-volatile memory" or "QV memory." Each memory cell of QV memory stores a data bit as an electrical charge in a charge storage material (e.g., ONO), similar to memory cells in nonvolatile memory (NVM). Due to the nature of the charge storage layer, typical QV memory cells have a much longer data retention time than DRAM cells and therefore a lower refresh rate. For example, a typical DRAM system is designed to refresh every 64 milliseconds, while a QV memory with equivalent effective access performance may refresh every 10 minutes. This reduced refresh rate offers significant advantages to QV memory: reduced power requirements, reduced heat dissipation, and improved memory availability for better host performance. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] U.S. Patent No. 10,121,553 [Patent Document 2] U.S. Patent Application Serial No. 17 / 812,375 [Patent Document 3] U.S. Patent Application Serial No. 17 / 936,320 [Patent Document 4] U.S. Patent Application Serial No. 17 / 525,712 Summary of the Invention [Means for solving the problem]

[0005] In accordance with the present disclosure, a memory device is provided that includes an arrangement of tiles of memory transistors operable independently and simultaneously from one another. Also in accordance with the present disclosure, a memory system is provided that has a multi-channel configuration for high-bandwidth access. The present disclosure is substantially as shown and / or described below, for example, with reference to at least one drawing, and as more fully set forth in the claims.

[0006] In one embodiment, a memory device of the present disclosure comprises a plurality of tiles of a memory circuit, each tile including a physically separated array of storage transistors ("memory array") electrically connected to and operated by a module control circuit, the memory array having a three-dimensional array of storage transistors arranged into a plurality of memory pages of storage transistors, each storage transistor being accessed by a word line and a bit line, the module control circuit communicating with the memory array to perform memory operations on one or more memory pages of the storage transistors, each tile being individually addressed by an associated module control circuit and configurable to operate independently of one another to perform memory operations on units of memory pages of storage transistors in the memory array in response to memory access commands specified for the tile, and two or more randomly addressed tiles of the memory circuit being configurable to simultaneously perform overlapping memory operations.

[0007] In another embodiment, a memory module of the present disclosure comprises: a plurality of semiconductor memory dies, each semiconductor memory die including a three-dimensional array of storage transistors divided into a plurality of partitions, corresponding partitions across the plurality of semiconductor memory dies forming a memory channel, the plurality of partitions across the plurality of semiconductor memory dies forming a first number of memory channels independently accessible from one another; and a memory controller die including memory control circuitry for accessing and operating the plurality of semiconductor memory dies, the plurality of semiconductor memory dies connected to the memory controller die via a first set of interconnect structures, the memory control circuitry including a first number of channel controllers, each channel controller connected to operate one of the memory channels to perform memory operations on storage transistors associated with each memory channel independently of and in parallel with memory operations performed on the storage transistors of the other memory channels.

[0008] In some embodiments, another memory module of the present disclosure comprises a plurality of semiconductor memory dies, each semiconductor memory die including a plurality of memory arrays, each memory array including a three-dimensional array of storage transistors, the plurality of semiconductor memory dies including a first number of semiconductor memory dies providing a specified memory capacity of the memory module and at least one spare semiconductor memory die providing redundant memory capacity; and a memory controller die including memory control circuitry that accesses and operates the plurality of semiconductor memory dies to perform memory operations, the plurality of semiconductor memory dies being connected to the memory controller die via a first set of interconnect structures, wherein the memory controller receives input requests for memory operations from a host processor addressed to a first memory address space spanning the first number of semiconductor memory dies and excluding the memory space of the at least one spare semiconductor memory die.

[0009] These and other advantages, aspects and novel features of the present invention, as well as details of illustrated embodiments thereof, will be more fully understood by reference to the following description and accompanying drawings. [Brief explanation of the drawings]

[0010] Various embodiments of the present invention are disclosed in the following detailed description and the accompanying drawings, which depict various embodiments of the present invention, but which are not intended to be limiting. It should be understood that like reference numerals indicate like structural elements in the drawings, and that the depictions in the figures are not necessarily drawn to scale.

[0011] [Figure 1A] FIG. 1A illustrates a memory module according to an embodiment of the present disclosure. [Figure 1B] FIG. 1B illustrates a memory module structure formed as stacked memory dies according to an embodiment of the present disclosure. [Figure 2A] FIG. 2A illustrates a memory module with multiple memory channels that can be accessed independently of one another, according to an embodiment of the present disclosure. [Figure 2B] FIG. 2B illustrates a memory module having a stacked memory die configuration, according to some embodiments. [Figure 3] FIG. 3 is a top view of a semiconductor memory die illustrating the configuration of a storage transistor according to an embodiment of the present disclosure. [Figure 4A] FIG. 4A illustrates a memory structure including a three-dimensional array of NOR-type memory strings, according to some embodiments. [Figure 4B] FIG. 4B illustrates a memory structure including a three-dimensional array of NOR memory strings, according to some embodiments. [Figure 5] FIG. 5 is a circuit diagram illustrating a memory array of NOR memory strings according to an embodiment of the present disclosure. [Figure 6] FIG. 6 is a circuit diagram illustrating exemplary support circuitry connected to bit lines of a NOR memory string according to an embodiment of the present disclosure. [Figure 7] FIG. 7 is a schematic diagram of a memory controller according to an embodiment of the present disclosure. [Figure 8] FIG. 8 is a schematic diagram of a channel controller implemented in the memory controller of FIG. 7 according to an embodiment of the present disclosure. [Figure 9] FIG. 9 is a cross-sectional view in the YZ plane of a tile in a memory device according to an embodiment of the present invention. [Figure 10] FIG. 10 shows a two-dimensional array of tiles forming part of a memory device according to an embodiment of the present invention. [Figure 11] FIG. 11 is a block diagram illustrating modular control circuitry that may be incorporated into each tile of a memory device to provide intelligent, semi-autonomous memory operation control in accordance with some embodiments of the present invention. [Figure 12]FIG. 12 is a block diagram illustrating a modular control circuit that may be incorporated into each tile of a memory device according to another embodiment of the present invention. [Figure 13] FIG. 13 is a block diagram illustrating bit line selection and sense amplifier configurations in a module control circuit according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] In an embodiment of the present invention, a memory module includes a plurality of semiconductor memory dies connected to a memory controller, the semiconductor memory dies being divided into a plurality of independently accessible memory channels, each memory channel being formed across the plurality of semiconductor memory dies. That is, a memory channel is formed from each memory partition of the plurality of semiconductor memory dies. The memory controller includes a channel controller corresponding to each memory partition to control memory operations in each memory partition independently from memory operations in other partitions. With this configuration, the memory module realizes a large capacity memory with high-bandwidth access enabled by the multiple independently accessible memory channels.

[0013] In another embodiment of the present invention, a memory system includes a memory device of storage transistors (or memory transistors) arranged into multiple memory arrays or "tiles," and the memory device interacts with a controller device to perform read and write operations. In one embodiment, each tile is a unit of operation for memory access and is also referred to herein as a "memory bank." In some embodiments, the controller device is configured to issue write commands and write termination commands to the memory device that specify a memory bank. The write command instructs the memory device to initiate a write operation to a specified memory bank within the memory device, and the write termination command instructs the memory device to terminate a memory operation in the memory bank. In some embodiments, the controller device issues a write suspend (abort) command as a write termination command to terminate an ongoing write operation in a memory bank of the memory device in order to issue a read command to the memory device to read data from the same memory bank. In some examples, the read command is directed to a memory page in a different memory bank than the memory page in which the write operation was in progress. The terminated write operation can be resumed after the read operation is completed.

[0014] As used herein, the terms “semiconductor memory die,” “memory die,” “semiconductor memory device,” or “memory device” are used interchangeably to refer to a memory circuit of memory transistors or storage transistors formed on a semiconductor substrate. In embodiments of the present disclosure, the semiconductor memory device includes a three-dimensional array of storage transistors. In some embodiments, the semiconductor memory device is configured using a three-dimensional array of NOR memory strings formed on a semiconductor substrate, as described in U.S. Patent No. 6,449,495. In embodiments of the present disclosure, the semiconductor memory device includes a memory array of quasi-volatile storage transistors, also referred to as “quasi-volatile memory” or “QV memory.” Because quasi-volatile storage transistors have a much longer retention time than typical DRAM memory cells, quasi-volatile memory devices are refreshed much less frequently than typical DRAM memory devices. For example, a DRAM memory device requires refreshing its DRAM memory cells every 64 milliseconds, while a quasi-volatile memory device only needs to refresh its quasi-volatile storage transistors every 10 minutes or more. As used herein, a NOR memory string includes storage transistors formed on a plane of a semiconductor substrate that share a common source region and a common drain region, and each storage transistor can be individually addressed and accessed. In some examples, NOR memory strings can be provided in multiple planes (e.g., 8 or 16 planes) on a semiconductor substrate, with the NOR memory strings on each plane arranged in columns to form a three-dimensional array. As used herein, the term "memory device" can refer to a single memory die or a set of multiple memory dies connected to a memory controller.

[0015] As used herein, the term “storage transistor” is used interchangeably with “memory transistor” to refer to data storage structures formed on the memory dies described herein. In some examples, semiconductor memory devices of the present disclosure, including NOR-type memory strings of randomly accessible storage transistors (or memory transistors), can find application in computer systems, e.g., as main memory, where data storage locations are directly accessible by the computer system's processor, in the role previously played in the art by conventional random access memories (RAMs) such as dynamic RAMs (DRAMs) and static RAMs (SRAMs). For example, memory structures of the present disclosure can be applied to computer systems to function as random access memory to support the operation of microprocessors, graphical processors, and artificial intelligence processors. In other examples, memory structures of the present disclosure can be applied to provide long-term data storage in computer systems, to form storage systems such as solid-state drives, or to replace hard drives.

[0016] In some embodiments, semiconductor memory devices are formed using thin-film storage transistors that implement charge trapping as a data storage mechanism, with data being stored in a charge storage film of each storage transistor. For example, the charge storage film may include a tunnel dielectric layer, a charge trapping layer, and a blocking layer, which may be implemented as a multilayer structure of silicon oxide, silicon nitride, and silicon oxide, in that order, also referred to as an ONO layer. An electric field applied to the charge storage film changes the threshold voltage of the storage transistor by adding or removing charge from the charge trapping layer of the charge storage film, thereby encoding a given logic state into the storage transistor.

[0017] In another embodiment, a semiconductor memory device is formed using a ferroelectric field effect transistor as a storage transistor. More specifically, a ferroelectric field effect transistor (also referred to herein as a ferroelectric transistor or FeFET) is formed by using a ferroelectric material as a gate dielectric layer between the gate conductor and the channel of the field effect transistor. The ferroelectric transistor achieves memory functionality by storing data as polarization states in a ferroelectric gate dielectric layer (also referred to as a ferroelectric insulating layer). Specifically, a voltage applied to the gate conductor induces an electric polarization in the ferroelectric insulating layer, which can be reversed by applying a voltage of the opposite polarity. The induced polarization state in the ferroelectric gate dielectric layer changes the threshold voltage of the ferroelectric storage transistor. The change or shift in the threshold voltage of the ferroelectric storage transistor due to different polarization states can be used to represent different logical states of data. For example, two logical states (e.g., "0" and "1") can be represented by high and low threshold voltages of the ferroelectric transistor as a result of two induced electric polarization states in the ferroelectric insulating layer. A three-dimensional array of NOR-type memory strings of thin-film ferroelectric transistors is disclosed, for example, in U.S. patent application Ser. No. 17 / 812,375 (Patent Document 2), entitled "Three-Dimensional Memory String Array of Thin-Film Ferroelectric Transistors," filed on July 13, 2022 (the entire disclosure of Patent Document 2 is incorporated herein by reference).

[0018] In some implementations, the ferroelectric insulating layer is a doped hafnium oxide layer. In some examples, the doped hafnium oxide layer includes one or more of zirconium-doped hafnium oxide (HZO), silicon-doped hafnium oxide (HSO), aluminum-zirconium-doped hafnium oxide (HfZrAlO), aluminum-doped hafnium oxide (HfO2:Al), lanthanum-doped hafnium oxide (HfO2:La), hafnium zirconium oxynitride (HfZrON), hafnium zirconium aluminum oxide (HfZrAlO), and any hafnium oxide containing zirconium impurities.

[0019] In yet another embodiment, a three-dimensional array of NOR-type memory strings is formed using junctionless ferroelectric storage transistors. That is, the ferroelectric storage transistors do not include p / n junctions as drain or source regions within the channel. Instead, the drain and source regions are formed by conductive layers, such as metal layers, and the semiconductor channel region is formed by an amorphous oxide semiconductor material, such as indium gallium zinc oxide (IGZO). In some examples, the source / drain conductive layers can be formed from a metal layer or a low-resistivity metal conductive material, such as molybdenum (Mo), tungsten (W), tungsten nitride (WN), ruthenium, or titanium tungsten alloy (TiW). In some examples, the semiconductor channel region can be formed from other oxide semiconductor materials, such as indium zinc oxide (IZO), indium tungsten oxide (IWO), or indium tin oxide (ITO). A three-dimensional array of NOR-type memory strings of junctionless thin-film ferroelectric transistors is disclosed, for example, in U.S. patent application Ser. No. 17 / 936,320 (Patent Document 3), entitled "Memory Structure Including Three-Dimensional NOR-Type Memory Strings of Junctionless Ferroelectric Memory Transistors and Method for Manufacturing the Same," filed on September 28, 2022 (the entire disclosure of Patent Document 3 is incorporated herein by reference).

[0020] FIG. 1A illustrates a memory module according to an embodiment of the present disclosure. Referring to FIG. 1A, the memory module 10 is constructed as a multi-die structure including one or more semiconductor memory dies 12 having memory arrays formed thereon and a memory controller die 14 (memory controller) having control circuitry formed thereon. In the example illustrated in FIG. 1A, the memory module 10 includes two semiconductor memory dies 12, namely, memory die A (memory device A) and memory die B (memory device B), connected to each other by interconnect structures 13, such as through-silicon vias (TSVs). The memory dies 12 communicate with the memory controller 14 (chiplet) through a memory array interface 15. In some embodiments, the memory array interface 15 is a high-bandwidth data interface implemented on interconnect structures (e.g., TSVs or hybrid bonds) connecting the memory dies 12 to the controller die 14 (memory controller). The memory controller 14 also includes one or more external interfaces, such as a memory interface for host access or other system functions. For example, the memory controller 14 includes a host interface 16 for communicating with a host processor. The host interface 16 communicates with the host processor, for example, to receive requests from the host to read data from or write data to the memory module 10, and to send responses to the host, such as write completion responses and read data.

[0021] As used herein, a "memory module" refers to one or more semiconductor memory dies connected to an associated memory controller die to form a high-density, high-capacity memory system. Each semiconductor memory die (also referred to as a memory die or memory device) includes multiple three-dimensional arrays of storage transistors (also referred to as memory transistors or memory cells) for storing memory data. A memory controller die, also referred to as a "memory controller," "controller die," "controller device," or "chiplet" herein, includes control circuitry for accessing and operating the memory devices and performing other memory control functions such as data routing and error correction. The control circuitry may also include one or more external interfaces, such as a memory interface for host access. In this embodiment, the memory module is constructed as a multi-die structure with memory devices formed on one semiconductor die and a memory controller formed on another semiconductor die. The memory dies and memory controller die can be integrated using various integration technologies, such as TSVs, hybrid bonds, exposed contacts, interposers, printed circuit boards, and other suitable interconnect technologies, particularly those for high-density interconnects.

[0022] With this configuration, the memory module 10 of the present disclosure can integrate one or more semiconductor memory dies with a single memory controller die, thereby achieving a high-capacity memory system with faster memory controller operation and faster memory performance. Additionally, the memory dies and controller dies can be manufactured separately using dedicated manufacturing processes to optimize the performance of each integrated circuit. More specifically, the memory module 10 can be manufactured using a manufacturing process optimized for the memory circuits and a manufacturing process optimized for the memory controller. For example, the memory controller can be manufactured using a manufacturing process optimized for forming low-voltage, high-speed logic circuits. In this manner, the performance of the memory circuits and the performance of the memory controller can be individually optimized, resulting in a memory module 10 with high capacity, high bandwidth, and high-speed memory operation.

[0023] In one embodiment, the memory controller is formed as a separate semiconductor die or integrated circuit, e.g., an application-specific integrated circuit, customized for use as a memory controller. In another embodiment of the present invention, the memory controller is implemented by a general-purpose integrated circuit (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a communications chip, or a field-programmable gate array). The functional blocks forming the memory controller are embedded in the general-purpose integrated circuit, and the memory controller's memory array interface is electrically and physically connected to the memory device using one of the techniques described above. With such a configuration, the embedded memory controller does not include host interface circuitry but can communicate directly with logic circuitry via interconnect lines formed within or on the general-purpose integrated circuit. Such a configuration is also referred to as "in-memory computing." In-memory computing is particularly desirable in data-intensive artificial intelligence and machine learning applications that require large amounts of memory in close proximity to the CPU or GPU core processor embedded in the memory controller functional block.

[0024] FIG. 1B illustrates a memory module structure formed as stacked memory dies according to embodiments of the present disclosure. For example, memory module 10 of FIG. 1A is formed by stacking two or more memory dies on top of each other and integrating the stacked memory dies with a memory controller die, as shown in FIG. 1B. Referring to FIG. 1B, memory module 20 includes multiple memory devices 22 stacked on top of each other. For example, memory module 20 includes memory device 22-1 and memory device 22-2 stacked on top of each other. The stacked memory devices 22 (or "memory stack") are then integrated with a controller die 24. In some embodiments, memory devices 22 (memory stack) are interconnected to controller die 24 via through-silicon vias 23 (TSVs) formed through memory devices 22 and connected to contact pads on controller die 24. In other embodiments, other methods of interconnecting stacked memory devices 22 to controller die 24 can be used, such as hybrid bonds, copper studs, interposers, or other suitable interconnection methods. By integrating multiple memory devices (memory dies), memory module 20 can achieve large memory circuitry in a small footprint, with resulting advantages being particularly evident when multiple memory devices (memory dies) are stacked to provide high memory capacity while sharing a memory controller among multiple memory devices (memory dies) to reduce cost per unit.

[0025] Memory Channel Configuration

[0026] FIG. 2A illustrates a memory module including multiple independently accessible memory channels according to an embodiment of the present disclosure. Similar elements in FIGS. 1A and 2A are labeled with similar reference numerals for ease of description. Referring to FIG. 2A, a memory module 30 includes multiple semiconductor memory dies 12 (memory devices) connected to each other via interconnect structures 13, such as through-silicon vias (TSVs). In this example, the memory module 30 includes four memory dies 12, labeled memory die 0 through memory die 3. The memory dies 12 communicate with a memory controller 14 via a memory array interface 32. The memory controller 14 includes one or more external interfaces, such as a memory interface 16 for communicating with a host or host processor.

[0027] In an embodiment of the present disclosure, each memory die 12 is divided into N partitions, and corresponding partitions in all memory dies 12 are grouped to form N memory channels that can be accessed independently (N is an integer greater than or equal to 2). In this embodiment, four memory channels Ch0 to Ch3 are illustrated. In other embodiments, the memory module may be divided into any suitable number of memory channels based on factors such as bandwidth and / or reliability and quality of service requirements. With this configuration, each memory channel operates independently to provide memory functionality using storage transistors within the channel partition. The memory controller 14 operates each memory channel independently and in parallel with the other channels to perform memory operations, such as read or write operations. The memory array interface 32 provides a separate memory channel interface for each memory channel. That is, the memory channels Ch0 to Ch3 can be accessed independently of each other through their respective memory channel interfaces 32-0 to 32-3. In an embodiment of the present invention, the memory controller 14 includes channel controllers 0-3, designated 17-0-17-3, for accessing each memory channel Chn through a respective memory array interface 32-n. The memory controller 14 includes a control logic circuit 18, which includes control circuitry for controlling the channel controllers 17-n, a host interface circuit for communicating with a host via the memory interface 16, and other circuits for controlling memory operations. The memory controller 14 routes read or write requests received from the host to each of the channel controllers 17-n to store or retrieve memory data from the corresponding memory channel. By dividing and operating the memory die 12 as individually accessible memory channels, the memory module 30 can provide high-bandwidth data transfers to the host.

[0028] A notable feature of the memory channel configuration in the memory module 30 is that each memory channel is formed across multiple semiconductor memory dies 12 and is individually controlled by a respective channel controller of the memory controller 14. That is, memory channel Ch0 is formed from each section of memory die 0 to memory die 3. Similarly, memory channels Ch1 to Ch3 are formed from each section of memory die 0 to memory die 3, respectively. The memory channel configuration of the present invention is particularly advantageous when applied to a memory module having a stacked memory die configuration. FIG. 2B illustrates a memory module 30 having a stacked memory die configuration according to some embodiments. The stacked memory die configuration is formed by stacking memory dies 0 to 3 on top of each other and stacking them on the memory controller 14. The stacked memory dies 0 to 3 are connected to the memory controller 14 by interconnect structures. In embodiments of the present invention, each memory die 12 is divided into N memory partitions. Corresponding memory partitions in the multiple stacked memory dies 12 form a memory channel. In other words, each memory channel Ch-n includes memory partitions of memory die 0 to memory die 3. In the diagram shown in Figure 2B, memory channel Ch-n is formed longitudinally across multiple memory dies stacked on top of each other. N memory channels are formed parallel to each other across multiple memory dies stacked on top of each other. Each memory channel has its own channel controller, so that each memory channel can be individually controlled and accessed in parallel to receive input memory data and provide memory output data.

[0029] The memory channel configuration of the present invention implemented by the memory module 30 has several advantages. First, the memory channel configuration can be adapted to any number of memory dies 12 used to form a memory module. For N memory channels, the memory controller 14 can be easily modified to address any number of memory dies included in a memory stack simply by configuring the memory address bits designated to select a memory die from a memory channel. Thus, the memory channel configuration of the present invention enables a scalable design of the memory module. Second, the memory channel configuration of the present invention allows the memory controller to exploit parallelism in memory accesses, resulting in more efficient utilization of the storage transistors on each memory die. During operation, the memory controller 14 minimizes access contention by distributing memory accesses among the N memory channels, thereby increasing utilization of the large number of storage transistors formed on each memory die 12. The memory channel configuration of the present invention allows multiple storage transistors to be accessed simultaneously and in parallel across the N channels, thereby achieving high-bandwidth memory accesses.

[0030] FIG. 3 is a top view of a semiconductor memory die illustrating the configuration of storage transistors according to an embodiment of the present disclosure. Referring to FIG. 3, a semiconductor memory die 40 (memory device) includes multiple three-dimensional arrays (memory arrays) of thin-film storage transistors. The memory array is configured as a two-dimensional array of tiles 42 (i.e., the tiles are arranged in rows and columns) formed on or within a semiconductor substrate. Each tile 42 (also referred to as a "memory tile") includes a three-dimensional array of thin-film storage transistors formed on a plane of the semiconductor substrate. As used herein, the tiles 42 of the memory die 40 refer to physically isolated arrays of memory cells with localized modular control circuitry that allows the tiles to operate simultaneously with other tiles and performs memory operations based on memory data access units, e.g., pages of memory data. Thus, the tiles 42 of the memory die 40 refer to a regular array of regularly arranged memory cells in an addressable modular structure. In some embodiments, each tile 42 includes a memory array of semi-volatile storage transistors organized as a three-dimensional array of NOR-type memory strings. The memory array in memory die 40 is also referred to herein as a semi-volatile memory circuit.

[0031] In the memory die 40, each tile 42 can be configured to be individually and independently addressable. In an embodiment of the present invention, each tile 42 is used as an operational unit for memory access and is also referred to as a "memory bank" or "bank." Accordingly, a memory bank is composed of one tile as an operational unit for memory access, and each tile or memory bank operates on one access unit of memory data (e.g., a page or "memory page") per memory operation. That is, each memory access from the host is based on an access unit of memory data. An access unit is also referred to as a page or memory page of memory data. In the memory die 40, each memory bank includes one tile, and one tile alone provides an entire access unit of memory data or an entire memory page of memory data. For example, each memory page includes 512 bits of memory data. This is in contrast to conventional memory devices in which a memory die includes multiple memory banks, each of which provides only a portion of an access unit of memory data, and the entire access unit of memory data must be obtained by combining memory data from multiple memory banks.

[0032] More specifically, in some embodiments, each tile is composed of multiple memory pages of storage transistors, each memory page including a subset of the storage transistors in the tile. For example, a memory page may include 512 storage transistors, and a tile may include more than 120K memory pages of storage transistors. With this configuration, the storage transistors in the memory device are accessed in units of memory pages having a predetermined byte size. That is, each read or write operation to the memory device is performed in units of memory pages. In one example, the memory device is accessed with a memory page size of 64 bytes or 512 bits.

[0033] In the embodiments described herein, a memory bank is described as being comprised of a single tile. In other embodiments, one or more tiles may be configured to form a memory access operation unit or memory bank. For example, a row of tiles or a two-dimensional block of tiles may be configured to be addressed together as a memory bank. In other words, in another embodiment, a memory bank may include a single tile 42 or a block of tiles, such as a row or section of tiles. This configuration allows the tile 42 to be a building block that allows flexibility in configuring a memory module to fit application requirements.

[0034] As used herein, a "tile" refers to a physically isolated memory array of memory cells with local modular control circuitry, and a "memory bank" refers to an operational or logical unit of memory access. As used herein, a memory bank comprises one tile, and the terms "memory bank" or "bank" are used interchangeably with the term "tile" to refer to a memory access operational unit consisting of a single tile or a single physically isolated memory array. Note that, in general, a "tile" refers to a physical memory array, and a "memory bank" refers to a logical unit of memory access operation.

[0035] On the memory die 40, support circuitry for operating the thin-film storage transistors of each tile is locally formed on or in the semiconductor substrate beneath the memory array. In some embodiments, the support circuitry for each tile is locally formed and modularized in a portion of the semiconductor substrate beneath each memory array. The tile-based support circuitry, also referred to as modular control circuitry or "under-array circuitry" ("CuA"), may include various voltage sources for power supply, ground, programming, erase, or read voltages, sense amplifiers, various data latches or registers, various logic circuits, various analog circuits, and other circuits used in memory operations. Examples of logic circuits include timing control circuits, address decoder circuits, redundancy logic circuits, and control circuits. Examples of analog circuits include data drivers, word line and bit line driver and select transistors, and bias control transistors. Additionally, in embodiments of the present disclosure, each CuA includes a state machine or sequencer for executing instructions (commands) executed by the associated tile. Each CuA incorporates a sequencer that acts as the CuA's local processor, allowing the CuA to form intelligent control circuits that allow each tile to operate independently and self-contained, and that allow multiple tiles to operate simultaneously and independently.

[0036] During operation, the sequencer in each CuA associated with each tile receives commands targeted to the associated tile from the controller circuit and decodes the commands to perform memory operations in the associated tile. For example, the sequencer performs read and write operations in the associated tile in response to commands received from the controller device. The sequencer also issues instructions (commands) to perform an entire sequence of read or write operations on memory pages in the tile specified by memory addresses associated with the memory operations. Importantly, in memory die 40, the complete circuitry of the local module control circuit (CuA) is replicated for each tile so that each tile operates independently to perform memory operations in response to commands from the controller device addressed to that particular tile.

[0037] In an embodiment of the present invention, a first manufacturing process forms tile-based support circuits on a semiconductor substrate, and then the semiconductor substrate with the tile-based support circuits formed thereon is subjected to a second manufacturing process to form thin-film storage transistors.

[0038] With this configuration, each tile 42 within the memory die 40 operates as a semi-autonomous mini-array of memory cells within the memory die 40. Support circuitry in the intelligent CuA allows each tile 42 to operate semi-autonomously, independently of other tiles within the memory die 40. Each tile 42 has its own associated CuA, which allows simultaneous memory access to multiple storage transistors within the memory die 40, resulting in increased memory throughput and reduced latency. In some embodiments, two adjacent tiles can share certain support circuitry within the CuA. For example, a tile can include a set of sense amplifiers shared with its adjacent tile. When selected for access, each tile uses its own set of sense amplifiers and the set of sense amplifiers of its adjacent tile. In this case, the tile whose set of sense amplifiers is borrowed is marked as inaccessible until the operation of the borrowed sense amplifiers is completed.

[0039] In the embodiment shown in Figure 3, memory die 40 is illustrated as including tiles arranged in 8 rows and 8 columns. The embodiment shown in Figure 3 is for illustrative purposes only and is not intended to be limiting. In one example, a memory die may include 1024 tiles arranged in 32 rows and 32 columns, or 2048 tiles arranged in 64 rows and 32 columns. The number of tiles and the arrangement of the tiles within memory die 40 may be selected based on various design factors, such as the size and dimensions of the memory die or the placement of interconnect structures.

[0040] In an embodiment of the present disclosure, the memory die 40 is divided into multiple partitions to form individual memory channels by dividing a two-dimensional array of tiles. In this embodiment, the memory die 40 is divided into four partitions by tile columns to form four memory channels, Ch0-Ch3. In this example, each memory channel (Ch0-Ch3) includes two columns of eight tiles, for a total of 16 tiles per memory channel. In another example, in a memory die with 1024 tiles, the memory die can be divided into eight partitions by tile columns to form eight memory channels, each including four columns of 32 tiles, for a total of 128 tiles per memory channel.

[0041] In an embodiment of the present disclosure, the memory die 40 includes a data interface region 43 for forming interconnect structures 45 for connection to a memory controller. In this embodiment, the data interface region is located in the center of the memory die 40, midway between two tile columns. Furthermore, to support memory channel configurations, the interconnect structures 45 are divided according to the channel configuration, with interconnect structures 45-0 through 45-3 provided for memory channels Ch0 through Ch3. For example, the interconnect structures 45 are through-silicon vias (TSVs), and each memory channel includes a dedicated set of interconnect structures or TSVs for transferring data for that memory channel to and from a memory controller, and more specifically, to and from an associated channel controller within the memory controller. As shown in FIG. 3 , the memory die 40 may include an additional set of interconnect structures 44 for providing power and ground connections to the memory array formed in the tile 42. In some embodiments, as shown in FIG. 2B , multiple memory dies 40 are used to form a memory stack, and the formed memory stack is stacked on a memory controller to form a memory module. Within the memory stack, memory channels are formed by tiles within the same channel partition across all memory dies in the memory stack.

[0042] FIG. 4A illustrates a memory structure 50 including a three-dimensional array of NOR memory strings according to some embodiments. In embodiments of the present disclosure, the memory structure 50 of FIG. 4A is used to form a three-dimensional array of storage transistors in tiles of the memory die 40 of FIG. 3. Various methods for forming three-dimensional NOR memory strings are described in the aforementioned U.S. Patent Application Publication No. 2010 / 0249907. Referring to FIG. 4A, the memory structure 50 includes thin-film storage transistors 60 formed as NOR memory strings along a horizontal direction (Y direction) in multiple planes, with each plane being formed by a set of active layers 56. Specifically, the memory structure 50 includes multiple active layers 56 formed on a plane of a semiconductor substrate 52. A buffer oxide layer 54 is provided between the semiconductor substrate 52 and the active layers 56. The active layers 56 are stacked one on top of the other along the Z direction (i.e., perpendicular to the plane of the semiconductor substrate 52) and are separated from each other by insulating dielectric layers 55, such as silicon carbide (SiOC) layers. The active layer 56 is divided into narrow strips ("active strips") 57 in the X direction. The active strips 57 are stacked together to form a stack of active strips ("active stack") extending in the Y direction.

[0043] Each active layer 56 includes a first doped semiconductor layer 62 and a second doped semiconductor layer 64 (e.g., n+ polysilicon or heavily doped n-type polysilicon) separated from each other by a dielectric layer 63 (e.g., silicon oxide). The first doped semiconductor layer 62 and the second doped semiconductor layer 64 form the drain and source regions of the storage transistor 60. Each active layer 56 includes one or more conductive layers 61, 65 (e.g., tungsten (W) lined with titanium nitride (TiN)). Each conductive layer 61, 65 is formed adjacent to one of the doped semiconductor layers 62, 64 to reduce the resistivity of the doped semiconductor layer it contacts. During intermediate processing steps, the active layer includes a sacrificial layer (e.g., silicon nitride or carbon) that is later replaced with a conductive layer. Subsequent processing steps form a channel region 66 (e.g., p-polysilicon or lightly doped p-type polysilicon), a charge storage film 67, and a gate conductor or gate electrode 68 (e.g., TiN-lined W) in the narrow trench between the isolated active stacks. The gate electrode 68 and the charge storage film 67 are formed as columnar structures extending in the Z direction. In this embodiment, the charge storage film 67 surrounds the gate electrode 68, forming a columnar structure. In this specification, the gate electrode 68 is also referred to as a "local word line," and the gate electrode 68 and the surrounding charge storage film 67 are collectively referred to as the local word line (LWL) structure 58.

[0044] In the embodiment shown in FIG. 4A, the storage transistors in the three-dimensional memory array are charge-trapping storage transistors, and the charge storage film 67 includes a tunnel dielectric layer, a charge-trapping layer, and a blocking layer. The tunnel dielectric layer can be any silicon oxide (SiOx), silicon nitride (SixNy), silicon oxide nitride (SiON), any aluminum oxide (AlOx), any hafnium oxide (HfOx), zirconium oxide (ZrOx), any hafnium silicon oxide (HfSixOy), any hafnium zirconium oxide (HfZrO), or any combination thereof. The charge-trapping layer can be multilayered and can include any silicon nitride (SixNy), hafnium oxide (HfO2), or hafnium silicon nitride (HfSiON). The blocking layer can be any silicon oxide (SiOx), aluminum oxide, or both. In one example, the charge storage film 67, also referred to as an ONOA file, includes a silicon oxide layer (SiOx), a silicon nitride layer (SiN), a silicon oxide layer (SiOx), and an aluminum oxide layer (Al2O3), which are stacked in this order from the channel layer side toward the gate conductor layer.

[0045] The first and second doped semiconductor layers of each active strip form a source region 64 ("common source line") and a drain region 62 ("common bit line") of a storage transistor formed along one or both sides of the active strip 57. Specifically, the storage transistor 60 is formed at the junction of the active strip 57 with the channel region 66 and the LWL structure 58. In the example of FIG. 4A, the LWL structures 58 are formed in a staggered pattern in trenches adjacent to the active strip 57 such that the storage transistors formed on either side of the active strip 57 are offset from each other in the Y direction along the memory string. If the storage transistor is a ferroelectric storage transistor, as will be described in more detail below, the first and second doped semiconductor layers are omitted and the conductive layers 61, 65 function as the source and drain terminals.

[0046] With this configuration, each storage transistor 60 is composed of a first doped semiconductor layer 62 forming a drain region (common bit line), a second doped semiconductor layer 64 forming a source region (common source line), a channel region 66 in contact with both the drain region 62 and the source region 64, a gate electrode 68, and a charge storage film 67 located between the gate electrode 68 and the channel region 66. Each storage transistor 60 is insulated from adjacent storage transistors along the active stack (in the Z direction) by an insulating dielectric layer 55. With this configuration, the storage transistors sharing a common source line and a common bit line along each active strip (in the Y direction) form a NOR memory string (also referred to herein as a "horizontal NOR memory string" or "HNOR memory string").

[0047] In another embodiment, the storage transistors in the three-dimensional memory array are junctionless ferroelectric storage transistors. In some implementations, the ferroelectric storage transistors are configured in a manner similar to charge-trapping storage transistors by replacing the charge storage film with a ferroelectric gate dielectric layer incorporating a ferroelectric material. FIG. 4B illustrates a memory structure including a three-dimensional array of NOR-type memory strings according to some embodiments. More specifically, FIG. 4B illustrates an exemplary three-dimensional memory array of junctionless ferroelectric storage transistors. Similar elements in FIGS. 4A and 4B are labeled with similar reference numerals and will not be described again. Referring to FIG. 4B, a memory structure 50B includes junctionless thin-film ferroelectric storage transistors 60B formed as NOR-type memory strings along the horizontal direction (Y direction) in multiple planes, each plane being formed by a set of active layers 56. Each active layer 56 includes a first conductive layer 61 and a second conductive layer 65 (e.g., tungsten (W) lined with titanium nitride (TiN)) separated from each other by a dielectric layer 63 (e.g., silicon oxide). The first conductive layer 61 and the second conductive layer 65 function as the drain and source terminals of the ferroelectric storage transistor. Subsequent processing steps form a channel region 66B (e.g., an oxide semiconductor material such as IGZO), a ferroelectric insulating layer 67B, and a gate conductor or gate electrode 68 (e.g., W lined with TiN) in the narrow trench between the isolated active stacks. The gate electrode 68 and the ferroelectric insulating layer 67B are formed as columnar structures extending in the Z direction. In this specification, the gate electrode 68 is also referred to as a "local word line," and the gate electrode 68 and the surrounding ferroelectric insulating layer 67B are collectively referred to as the local word line structure 58.

[0048] In the embodiment shown in FIG. 4B, the storage transistors in the three-dimensional memory array are junctionless ferroelectric storage transistors. In some implementations, the ferroelectric gate dielectric layer 67B is a doped hafnium oxide (HfO) layer. In one example, the hafnium oxide is doped with zirconium oxide (ZrO) to form a hafnium zirconium oxide layer (HZO). In another example, the hafnium oxide is doped with silicon (Si), iridium (Ir), and lanthanum (La). In some embodiments, the gate dielectric layer may further include an interfacial layer, such as a material having a high dielectric constant, between the channel region and the gate dielectric layer.

[0049] The first and second conductive layers of each active strip form the source line ("common source line") and drain line ("common bit line") of a storage transistor formed along one or both sides of the active strip 57. In the example shown in FIG. 4B, the storage transistor is formed only on one side of the active strip 57, while the other side of the active strip is adjacent to an auxiliary trench 59. The auxiliary trench 59 does not contain any active transistor elements. A ferroelectric storage transistor 60B is formed at the junction of the active strip 57 with the channel region 66B and the LWL structure 58. With this configuration, along each active strip (in the Y direction), the storage transistors sharing a common source line and a common bit line form a NOR memory string or an HNOR memory string. In some examples, a three-dimensional array of NOR memory strings of junctionless thin-film ferroelectric transistors is disclosed in U.S. Patent No. 6,239,999 (the disclosure of which is incorporated herein by reference in its entirety). The memory structure 50B of FIG. 4B can be configured based on the memory structure described in U.S. Patent No. 6,239,999 (the disclosure of which is incorporated herein by reference in its entirety).

[0050] 4A and 4B, various types of support circuitry supporting operation of the NOR memory strings are formed within or on the semiconductor substrate 52 to complete the memory circuit. As discussed above, the support circuitry for the storage transistors within a tile is formed locally beneath each tile and is referred to as the "circuit under array," or CuA. The circuitry within the CuA may include power supplies, sense amplifiers, data latches, logic circuits, and analog circuits, as discussed above. In embodiments of the present disclosure, the CuA includes a state machine or sequencer for controlling and executing memory operations on the storage transistors within each tile. By incorporating a state machine into each CuA, multiple tiles within a memory die can be accessed for simultaneous memory operations.

[0051] In one exemplary embodiment, each tile in the memory die includes eight active layers, i.e., eight storage transistor layers, each active layer including 2k bit lines (or 2k active stacks) with storage transistors formed on either side of the bit line, and each tile including 4k word lines (gate electrodes), for a total of 8M bits per layer, or 64M storage transistors in one tile.

[0052] In some embodiments, memory operations on a memory die are performed in units of memory pages of memory data, also referred to as access units of memory data. Each memory access, in this embodiment, is performed to one memory page within a memory bank (or tile). More specifically, bit lines of storage transistors within a memory page are selected simultaneously, and the storage transistors are simultaneously identified to provide read data or are driven in the same write operation to store write data. In one example, a memory page of memory data is 512 bits. Thus, each time a read or write operation is performed, 512 storage transistors are accessed within a tile. In one embodiment, each memory access activates one word line (WL) associated with the 32 memory pages, and one of the 32 memory pages is selected for the memory operation by selecting the bit line associated with the storage transistor within the selected memory page.

[0053] In embodiments of the present disclosure, the support circuitry (CuA) of each tile includes a number of sense amplifiers equal to the number of data bits in a memory page. Therefore, during each read operation, all sense amplifiers are used to read the stored data from the selected bit line, so no additional address bits are required to select a subset of the sense amplifiers. Similarly, during a write operation, all sense amplifiers are used to drive write data to the selected bit line, so no additional address bits are required to select the sense amplifiers. This contrasts with conventional memory devices, which require one or more column address bits to select a subset of the sense amplifiers to provide read data. By providing the same number of sense amplifiers in the CuA as the number of data bits in a memory page, the size of the CuA can be kept small, which allows the CuA to be formed under each tile. Additionally, eliminating the address bits required to select a subset of the sense amplifiers simplifies memory operations. In some embodiments, the support circuitry may include additional sense amplifiers to identify or drive additional bit lines associated with other data stored in the memory array, such as refresh pointer data, metadata, or memory health indicator bits.

[0054] In one embodiment, the interconnect structures 45 (FIG. 3) for each memory channel include connection structures for at least as many data bits as there are data bits in a memory page. In one example, each set of interconnect structures 45 includes 300 through-silicon vias (TSVs) for each memory channel to output 512 data bits in a memory page over two clock cycles (256 bits each clock cycle), plus additional data bits for error correction and control signals.

[0055] In this description, memory structure 50 of FIG. 4A includes storage transistors that implement charge trapping as the data storage mechanism, and memory structure 50B of FIG. 4B includes storage transistors that implement ferroelectricity as the data storage mechanism. The exact nature of the data storage mechanism implemented in the memory structures of the present invention is not important to the practice of the present invention. As will be appreciated by those skilled in the art, the bias conditions applied to the storage transistors for read and write operations are a function of the data storage mechanism implemented. For purposes of illustration, bias conditions for ferroelectric storage transistors will be used in the following description.

[0056] FIG. 5 is a circuit diagram illustrating a memory array of NOR-type memory strings according to an embodiment of the present disclosure. FIG. 5 illustrates a memory circuit of NOR-type memory strings that can be formed using the memory structure of FIG. 4A or 4B. Referring to FIG. 5, a memory array 70 of storage transistors 72 is illustrated, representing a portion of the storage transistors in the three-dimensional memory array of FIG. 4A or 4B. The memory array 70 includes multiple memory strings 75 formed on each active layer, each including a series of storage transistors 72 connected in parallel between a common bit line 74 and a common source line 76. Because the storage transistors are connected in parallel in a NOR configuration, the memory strings 75 are also referred to as NOR-type memory strings. The NOR-type memory strings 75 of storage transistors form the basic building blocks from which two-dimensional or three-dimensional arrays of storage transistors can be formed. That is, multiple strings of storage transistors can be used to form a two-dimensional array of storage transistors, or a plane of storage transistors. Additionally, a three-dimensional array of storage transistors can be formed by stacking multiple planes of two-dimensional arrays of storage transistors. In this description, the semiconductor memory device is implemented by an array or arrays of strings of storage transistors, and the exact configuration or arrangement of the strings of storage transistors is not important to the practice of the invention.

[0057] The storage transistors 72 are thin-film storage transistors having drain terminals connected to bit lines 74, source terminals connected to source lines 76, gate or control terminals connected to word lines 78, and data storage layers that store data for the storage transistors. For example, the data storage layers may be a set of charge storage layers or ferroelectric insulating layers. More specifically, the gate terminals of the storage transistors 72 are driven by word lines (WLx) 78, and each word line WLx activates one storage transistor 72 in a given NOR memory string 75 while simultaneously activating other storage transistors in other NOR memory strings. With this configuration, when a word line WL is selected, all storage transistors 72 connected to that word line (e.g., WLn) are activated. In operation, a selected word line activates P memory pages. Each memory page includes Q storage transistors associated with Q NOR memory strings. A bit line belonging to the selected memory page is selected for a memory operation. Thus, the selected word line and the selected bit line select a memory page, thereby providing access to the Q storage transistors in the selected memory page.

[0058] For example, the bit lines of each memory string are connected to sense amplifier circuits to sense the stored data during a memory read operation. The sense amplifier circuits and other circuit elements, as well as control signals for facilitating operation of the sense amplifiers and memory array, are not shown in FIG. 5 . For example, the bit lines may include discharge transistors for discharging the bit lines after a read or write operation. In another example, the sense amplifier circuits may include transistors and devices for implementing a reset function for the sense amplifiers. Additionally, the sense amplifier circuits may include latch circuits for latching the outputs of the sense amplifiers. Details of an exemplary sense amplifier circuit are described below with reference to FIG. 6.

[0059] In embodiments of the present disclosure, a memory device includes storage transistors (or "memory cells") that can be read, programmed, or erased. Program and erase operations are collectively referred to as write operations. A memory device performs memory operations including a read operation to read data from a storage transistor and a write operation to write data to a storage transistor. A memory device may also perform other operations, such as a refresh operation, which are not discussed in this description. In this description, a write operation includes two operations or phases: an erase operation or erase phase and a program operation or program phase. In this embodiment, an erase operation is associated with writing a first logic state (e.g., logic "1") to a memory cell, and a program operation is associated with writing a second logic state (e.g., logic "0") to a memory cell. Note that the particular logic states assigned to an erase or program operation are arbitrary and not important to the practice of the present invention. In other embodiments, the erase step is associated with writing a logic "0" to a memory cell, and the program step is associated with writing a logic "1" to a memory cell. In this embodiment, the erase operation is also referred to as a set 1 operation, and the program operation is also referred to as a set 0 operation.

[0060] In the memory array 70, each storage transistor of a NOR memory string is read, programmed, or erased by appropriately biasing its associated word line 78 (WLx) and a common bit line 74 (BLy) shared with other storage transistors in the NOR memory string 75. The storage transistor's associated word line is shared with storage transistors of NOR memory strings on other planes that are aligned with the storage transistor along a direction perpendicular to the plane of the semiconductor substrate (the "orthogonal direction"). Each word line is also shared between two storage transistors of adjacent NOR memory strings on the same plane (see FIGS. 4A and 4B). In some embodiments, the common source line is typically electrically floating; that is, the common source line is not connected to any potential. During read, program, or erase operations, the common source line of the NOR memory string is typically supplied with a relatively constant voltage maintained by a voltage source or charge in an associated capacitor ("virtual ground"), such as the parasitic capacitance of the common source line. For example, the common source line of a NOR memory string can be biased to a given voltage by a precharge operation in which a desired voltage is provided on the common bit line and the common source line is charged to the voltage on the bit line through one or more precharge transistors. To program or erase the storage transistors, for example, a significant voltage difference (e.g., 8 V for charge storage transistors and 3 V for ferroelectric storage transistors) is imposed between the common bit line and the word line. To mitigate disturbance to unselected storage transistors, undesired erasure or programming of unselected storage transistors can be suppressed by imposing a predetermined voltage difference between the associated word line of the unselected storage transistors and its common bit line that is significantly lower than the voltage required for programming or erasing.

[0061] FIG. 6 is a circuit diagram illustrating exemplary support circuits connected to bit lines of a NOR memory string according to an embodiment of the present disclosure. Specifically, FIG. 6 illustrates sense amplifier circuits and related circuit elements for performing read and write memory operations. For simplicity, additional circuit elements and control signals have been omitted. Referring to FIG. 6, each bit line 74 is connected to a sense amplifier 80 via a bit line selector (not shown). In practice, each bit line selector is connected to P bit lines and selects one of the P bit lines for sensing by an associated sense amplifier. In other words, each bit line selector is connected to the bit line of the same data bit across P memory pages. If an access unit includes 512 bits of memory data, 512 bit line selectors are provided to select the bit lines of the memory page selected for access. With this configuration, a selected word line activates P memory pages (e.g., 32 memory pages), and a set of bit line selectors in each sense amplifier selects the bit lines associated with the memory page selected for access. FIG. 6 illustrates a selected bit line 74 connected to a sense amplifier 80. In FIG. 6, for simplicity, the bit line selectors and other bit lines that share the same sense amplifiers are omitted.

[0062] During a read operation, the sense amplifier 80 senses a voltage signal indicative of the bit line current on the selected bit line to determine the logic state of the selected storage transistor and generates a sense amplifier output SAOUT (node 82) in response to the sensing. In this embodiment, the sense amplifier output SAOUT (node 82) is connected to a pair of data latches 84, 86. In this embodiment, a first data latch 84 (DL1) can be used to store data locally in the memory tile, such as read data for a refresh operation. A second data latch 86 (DL2) can be used to store data to be exchanged with the memory controller, such as read data read from the selected storage transistor or write data received from the memory controller. Note that the sense amplifier circuit configuration including two data latches 84, 86 is illustrative only and not intended to be limiting. Other sense amplifier circuit configurations are also possible. In one embodiment, the sense amplifier 80 itself may be configured to incorporate data latch functionality so that it functions as a data latch to store read data. In this case, the support circuitry of each tile includes three data latches: a first data latch DL1, a second data latch DL2, and a third data latch DL3 as a sense amplifier. In this case, the third data latch DL3 (sense amplifier) is used to store read data read from a selected storage transistor, and the second data latch DL2 is used to store write data received from the memory controller.

[0063] During a read operation, the sense amplifier 80 senses a voltage signal on the selected bit line 74, which indicates the bit line current associated with the erased or programmed state of the selected storage transistor. The sense amplifier 80 generates a sense amplifier output signal SAOUT having a logic state indicative of the sensed bit line voltage signal. In one embodiment, during a read operation, read data is stored in the data latch DL2. The read data is sent to a data bus 90 by a data driver 88 and provided to the memory controller. In practice, the data driver 88 is controlled by a clock signal and can send the read data to the data bus 90 synchronously with the clock signal.

[0064] In a write operation, write data from the memory controller is sent to a data bus 90, and a write driver 92 sends the write data to data latches DL2. The write driver 92 is also controlled by a clock signal and can send the write data to data latches DL2 in response to the clock signal. To perform an erase or program operation, a bit line (BL) bias control circuit 94, under the control of a state machine in CuA, applies a program voltage or an erase voltage to bit lines 74 depending on the logic state of the write data to be written to the storage transistors.

[0065] Memory Controller Architecture

[0066] FIG. 7 is a schematic diagram of a memory controller according to an embodiment of the present disclosure. In some examples, the memory controller 100 of FIG. 7 can be used to implement the memory controller 14 of the memory module 30 of FIG. 2A. Specifically, the memory controller 100 is configured to operate a memory device configured with multiple memory channels that are accessed independently of one another. Referring to FIG. 7, the memory controller 100 includes a host interface circuit 106 for interfacing with a host, a memory control circuit 110 for interfacing with the memory device 101, and a processor 108 for controlling the operation of the host interface circuit 106 and the memory control circuit 110. The memory controller 100 operates based on one or more clock signals. For example, the host interface circuit 106 may use a clock signal having a first clock frequency, and the memory control circuit 110 and the processor 108 may use a clock signal having a second clock frequency that is different from the first clock frequency. While the clock signals for operating the memory controller are not shown in FIG. 7 for simplicity of explanation, it should be understood that the memory controller 100 operates based on one or more clock signals.

[0067] The host interface circuit 106 is connected to a host interface bus 102 for communicating with a host, such as a host processor. The memory controller 100 receives requests from the host processor and transmits responses to the host processor via the host interface circuit 106. For example, the memory controller 100 receives read requests and write requests with write data from the host via the host interface bus 102. The memory controller 100 provides read data and write completion responses to the host via the host interface bus 102. In an exemplary embodiment, the host interface circuit 106 communicates with the host via a PCIe 5.0 serial bus using the Compute Express Link™ (CXL) protocol. In the CXL protocol, the host processor issues a request with no data (REQ) as a read request and a request with data (RwD) as a write request with write data. In the CXL protocol, the memory controller 100 also issues a response with data (DRS) as read data and a response with no data (NDR) as a write completion response.

[0068] The memory control circuitry 110 is configured to operate on the memory channels of the memory device 101 and communicate with the memory device via the memory array interface 103. In an embodiment of the present disclosure, the memory device 101 is a memory stack including multiple memory dies stacked on top of each other. In this example, the memory stack 101 includes four memory dies, namely, die 0, die 1, die 2, and die 3. The memory dies in the memory stack 101 are divided into N memory channels that can be accessed independently of each other according to the memory channel configuration scheme described above. In this example, the four memory dies, namely, die 0, die 1, die 2, and die 3, are divided into four memory channels, namely, Ch0, Ch1, Ch2, and Ch3. In other examples, the memory dies may be divided into four channels or 16 channels. Under the memory channel configuration scheme in the exemplary embodiment of the present disclosure, each memory channel Chn is formed across all semiconductor dies in the memory stack 101. That is, each memory channel Ch0-Ch3 includes memory partitions from memory dies Die 0-Die 3. The memory control circuit 110 communicates with the memory stack 101 via a memory array interface 103 that includes individual memory channel interfaces 104-0 to 104-3 for each memory channel Ch0 to Ch3. Specifically, each memory channel interface 104-n includes a data interface and a command interface for each memory channel.

[0069] The configuration of memory device 101 in FIG. 7 is illustrative only and not intended to be limiting. Memory control circuitry 110 is configured to operate memory devices of any configuration, such as a single semiconductor memory die or multiple semiconductor dies. Memory control circuitry 110 is configured to operate on memory channels of a memory device, where the memory channels can be configured in various ways. The exact channel configuration of the memory device is not important to the practice of the present invention. In FIG. 7, the memory device is a memory stack, and the channel configuration spans the memory dies in the stack. In another example, the memory device includes multiple memory dies (e.g., k memory dies) arranged in a planar fashion adjacent to a memory controller, with each memory die including multiple memory channels (e.g., n memory channels). Memory control circuitry 110 of memory controller 100 can be configured to operate k×n memory channels across the k memory dies.

[0070] The memory control circuit 110 includes a channel controller 116 that is instantiated N times to provide one channel controller 116 for each memory channel. In this embodiment, four instances of the four channel controllers 116, including channel controller 0 through channel controller 3, are provided for the four memory channels of the memory stack 101. Each channel controller 116 communicates with the memory channel via a respective memory channel interface 104-n. In this manner, each memory channel Ch0 through Ch3 of the memory stack 101 can be accessed independently of one another, and high-bandwidth memory access can be achieved by accessing the memory channels Ch0 through Ch3 in parallel.

[0071] The memory control circuit 110 further includes an address translation circuit 114 and a channel arbiter 112, both of which communicate with all of the channel controllers 116. The host interface 106 receives input requests from the host, such as a read request (REQ) or a write request (RwD), which are provided to the address translation circuit 114 of the memory control circuit 110. The address translation circuit 114 decodes the logical address in each request to determine which memory channel the request should be sent to and sends the request to the channel controller 116 of the specified memory channel. Upon completion of the memory operation, each channel controller 116 provides a response, such as read data or a write completion response, to the channel arbiter 112. The channel arbiter 112, under the control of channel arbitration logic, selects which response to send to the host interface 106. For example, the channel arbitration logic returns the responses in the same order as the corresponding requests received. In another example, the channel arbitration logic implements a credit management scheme that determines which responses from which memory channels are returned to the host processor. In some examples, the channel arbitration logic is implemented within the processor 108.

[0072] FIG. 8 is a schematic diagram of a channel controller implemented in the memory controller of FIG. 7 according to an embodiment of the present disclosure. As described above with reference to FIG. 7, the memory controller 100 receives input requests over the host interface bus 102, and the received requests are provided to the address translation circuit 114 of the memory control circuit 110. The address translation circuit 114 decodes the logical address in the request to generate a physical address of the memory device 101 corresponding to the logical address. The physical address is also referred to herein as a memory address. Based on the channel address indicated in the decoded physical address, the request is provided to each channel control unit 116. In some embodiments, the address bits for selecting a memory channel are the lower address bits of the physical address. In this manner, input requests are distributed to different memory channels, reducing channel contention and resulting in improved memory utilization. As a result of the address translation, each channel controller 116 receives an input request for a read or write operation designated for that memory channel.

[0073] It should be noted that the operation of the channel controller 116 is based on one or more clock signals. Typically, the channel controller 116 operates based on a controller clock signal at a given clock frequency. Signals sent to and from the channel controller may cross over different clock domains (i.e., different clock frequencies). In such cases, a buffer or clock crossing FIFO circuit may be used for signals crossing over at two different clock frequencies. For simplicity of explanation, clock signals and associated clock crossing circuitry are not shown in FIG. 8 . It should be understood that the operation of the channel controller is synchronous with the controller clock signal. For example, the channel controller 116 sends a command to the memory device 101 on each clock cycle of the controller clock signal. In one example, the controller clock signal has a frequency of 500 MHz, and the channel controller sends a command to a memory device for which a command is available every clock cycle or every two clock cycles, i.e., every 2 ns or every 4 ns.

[0074] In some embodiments, the address translation circuit 114 decodes the logical address in the request into a physical address including a memory channel address, a memory bank address, a memory die address, a word line address, and a memory page address. Thus, the decoded physical address selects a memory channel from among the N memory channels and a memory die from among the K memory dies within the selected memory channel. The physical address then selects a memory bank (or memory tile) within the selected memory die of the selected memory channel. Within the selected memory bank, the physical address selects a word line, thereby activating P memory pages within the memory tile. The physical address ultimately selects one memory page from the P memory pages associated with the selected word line. As described above, each memory page includes Q data bits, e.g., 512 bits.

[0075] 8, channel controller 116 receives incoming read or write requests from address translation circuit 114 and stores the requests in respective ingress buffers. Specifically, incoming read requests are stored in ingress read buffer 120, and incoming write requests are stored in ingress write buffer 122. Incoming write requests are then provided to and stored in write staging buffer 128 as pending write requests. Ingress channel arbiter 124 regulates the flow of pending read and write requests to read queue 130 and write queue 132 based on one or more predetermined priority rules provided by read / write arbitration logic circuit 125. Specifically, ingress channel arbiter 124 arbitrates between pending read requests from read ingress buffer 120 and pending write requests evicted from write staging buffer 128 based on the predetermined priority rules to select requests to send to read queue 130 and write queue 132. For example, the ingress channel arbiter 124 may prioritize read requests unless the write staging buffers for one or more memory banks are nearly full. The ingress channel arbiter 124 may further consider attributes such as the age of the request or the state of the memory bank in determining the priority. In another example, the ingress channel arbiter 124 may forward read requests to a read queue or write requests to a write queue in a manner that avoids excessive bank contention.

[0076] Read queue 130 and write queue 132 store read and write requests and generate commands for memory device 101 based on the stored requests. Read queue 130 and write queue 132 generate commands to bid for access to memory device 101 via command selector 135, also referred to as a global arbitration circuit or global scheduler. Command selector 135 selects a command to be sent to an associated memory channel of memory device 101 to perform a memory operation at a destination memory address associated with each request. The command selected by command selector 135 is also referred to as a "winning command."

[0077] In an embodiment of the present disclosure, the channel controller 116 of FIG. 8 is adapted for a memory device in which the write latency is much longer than the read latency. A distinctive feature of the channel controller of the present invention is that the channel controller is configured to mask potentially long write latencies from the host. In some embodiments, the channel controller 116 stores incoming write requests and write data in a write staging buffer 128 and returns a write completion response to the host before the write operation is actually executed in the memory device, i.e., before the write data is stored in the memory device. At the same time, the channel controller 116 manages the write request and performs the write operation to the memory device in the background of the host operation, thereby hiding the extended write latency at the memory device from the host system, allowing the host system to operate as if it only experienced the nominal write latency at the memory device.

[0078] In some embodiments, in the channel controller 116, each write request stored in the ingress write buffer 122 is first evicted to the write staging buffer 128, and then the pending write request entries in the write staging buffer 128 are provided to the ingress channel arbiter 124 for arbitration with read requests from the ingress read buffer 120. In one example, the write staging buffer 128 can be used to prevent too many write requests to the same memory bank of a memory channel from being sent to the write queue 132, filling the write queue and causing backpressure on the ingress write buffer 122. In some embodiments, the write staging buffer 128 is sized to store a large enough number of write requests to handle the write latency of memory devices that are masked from the host. In this embodiment, the eviction of a write request from the ingress write buffer 122 to the write staging buffer 128 notifies the host of a write completion response. That is, each time a write request is evicted from ingress write buffer 122 and transferred to write staging buffer 128, a write completion response for that write request is sent to the host. From the host's perspective, that particular write request completes while channel controller 116 maintains and processes write requests to be completed in memory device 101. In this embodiment, the write completion responses (e.g., NDRs under the CXL protocol) for each memory channel n are provided to channel arbiter 112b, which receives the write completion responses from all memory channels (e.g., Chn, x through z). Channel arbiter 112b selects a write completion response from the memory channels to be provided to the host via the host interface based on predetermined arbitration rules.

[0079] As described above, the ingress channel arbiter 124 arbitrates between read requests from the ingress read buffer 120 and write requests from the write staging buffer 128 based on predetermined priority rules and selects requests to send to the read and write queues. In another example, the ingress channel arbiter 124 forwards read requests to the read queue or write requests to the write queue to avoid excessive bank contention. For example, if there is a pending write request for a given memory bank of a given memory die in the write queue, the ingress channel arbiter 124 does not forward additional write requests for the same memory bank of the same memory die to the write queue, but instead forwards write requests destined for other memory banks to the write queue. In this way, the ingress channel arbiter 124 prevents an excessive number of write requests for the same memory bank of the same memory die from being sent to the write queue 132, which would cause the write queue to fill up if the memory device has long write latency.

[0080] In an embodiment of the present disclosure, the ingress channel arbiter 124 further evaluates the incoming read request to determine whether the read request is for the same memory address as a write request pending in the write staging buffer 128. In an embodiment of the present disclosure, the ingress read buffer 120 transfers the memory address of the pending read request (the “read address”) to the write staging buffer 128. The write staging buffer 128 determines whether the read request is for the same memory address as a pending write request in the write staging buffer 128. If the write staging buffer 128 determines that the read request has a memory address that matches the destination memory address of a pending write request in the write staging buffer, the channel controller 116 implements various techniques to provide the write data of the matching pending write request as the read data for the read request. In one example, the read request is satisfied with the write data from the write staging buffer 128. In another example, the channel controller 116 forwards matching pending write requests to the write queue 132, and the read requests are satisfied with write data from the write queue 132 (more specifically, the write data storage 134 associated with the write queue).

[0081] In this embodiment, the read queue 130 is a data structure that stores pending read requests for an associated memory channel. The read queue 130 stores pending read requests along with the destination memory address, such as a memory bank address or a memory page address, for the read request. The read queue 130 also stores other attributes associated with each read request, such as the status of the memory bank indicated by the destination memory address and the command being processed by the memory bank. The status of the memory bank ("bank status") is used to indicate whether the read request is eligible to be sent to the memory device. In this embodiment, each entry in the read queue 130 can request the transmission of an activate command, a read command, or an abort command. The activate command instructs the memory device to start sensing data stored in a specified memory page of a specified memory bank using a sense amplifier circuit and store the sensed data in a data latch (e.g., data latch DL2 in FIG. 6) connected to the sense amplifier circuit. The read command outputs the sensed data stored in the data latch to the channel controller 116. For example, data read from the memory device 100 is stored in the read data storage 142. The details of the interrupt command will be described later.

[0082] In this embodiment, write queue 132 is a data structure that stores active write requests for the associated memory channel. Write queue 132 stores active write requests along with the destination memory address (e.g., memory bank address, memory page address) of each write request. In this embodiment, write data for each write request is stored in write data storage 134, which communicates with write queue 132. For each write request, write queue 132 further stores other attributes associated with each write request, such as the state of the memory bank indicated by the destination memory address and the command being processed by the memory bank. The memory bank state (“bank state”) is used to indicate whether the write request is eligible to be sent to the memory device. In this embodiment, each entry in write queue 131 can request the sending of a write command. The write command, along with associated write data stored in write data storage 134, is sent to the memory device and instructs the memory device to write data to a specified memory page in a specified memory bank. In some embodiments, the write data is first stored in a data latch (eg, data latch DL2 of FIG. 6), and the bit line bias control circuitry sends the write data to the storage transistor.

[0083] In this embodiment, the channel controller 116 includes an issued write queue 133. The write queue 132 allocates an active write request entry to the issued write queue 133 when the command selector 135 determines that the active write request is a winning command. Specifically, the write queue 132 transmits a write command along with write data to the memory device 101 in response to the active write request selected by the command selector 135. For example, the write data is sent to the memory device 101 and stored in a data latch (e.g., data latch DL2) of the specified memory page. The write queue 132 then forwards the write request to the issued write queue 133. The issued write queue 133 processes the remaining write operation flow. For example, each entry in the issued write queue 133 can transmit a commit command to instruct the memory device 101 to initiate a bias voltage sequence for writing previously transmitted write data to storage transistors of a destination memory address. For example, a commit command is sent to activate a program, erase, or refresh operation flow in the support circuitry (CuA) of a specified memory tile, which applies appropriate voltages to the bit lines of the storage transistors associated with the selected memory page. The issued write queue 133 deallocates the write request when the write flow ends, i.e., when the erase and program operations on the storage transistors are complete. Furthermore, in this embodiment, each entry in the issued write queue 133 can also send a write resume command, as will be described in more detail below.

[0084] In some embodiments, issued write queue 133 stores issued write requests until they are completed. Note that the use of issued write queue 133 is optional and may be omitted in other embodiments. In other embodiments, issued write requests may be stored in write queue 132 itself until the write requests are completed.

[0085] In this embodiment, an active read or write request in a respective read / write queue is eligible for bidding access if its destination memory bank does not have a memory operation currently in progress. For example, a read or write request is eligible if its destination memory bank is not currently being read from or written to. Eligible read or write requests bid for access to memory device 101 via command selector 135. Command selector 135 arbitrates commands received from eligible read or write requests and determines, every clock cycle (or every x clock cycles), a command (the “winning command”) to send to memory device 101.

[0086] In an embodiment of the present disclosure, command selector 135 selects commands to send to memory device 101 based on predetermined priority rules. In this embodiment, command selector 135 sends commands to each memory channel of the memory device via two command buses: (1) memory command bus 144 for commands that do not include data, such as activate commands, suspend commands, commit commands, and write resume commands, and (2) data command bus 146 for commands that include data, such as read commands and write commands. In some embodiments, command selector 135 includes memory command selector 136 and data command selector 138 for selecting from eligible commands provided by read queue 130 and write queue 132. Memory command selector 136 selects commands to send to the memory device on memory command bus 144, and data command selector 138 selects commands to send to the memory device on data command bus 146. In this embodiment, commands provided to memory command selector 136 include, for example, an activate command to set up a read operation. Commands sent on memory command bus 144 are not associated with read or write data. Meanwhile, commands provided to data command selector 138 include, for example, read commands and write commands. A write command is provided on data command bus 146, and associated write data is provided from write data storage 134 on data bus 148. In response to a read command, memory device 101 provides read data on data bus 148 and stores the read data in read data storage 142. The read data is provided as a read data response to the memory channel.

[0087] In this embodiment, a read data response (e.g., DRS) for each memory channel n is provided to a channel arbiter 112a, which receives read data responses from all memory channels (e.g., Chn, x-z). The channel arbiter 112a selects a read data response from a memory channel to provide to the host via the host interface based on predetermined arbitration rules.

[0088] In embodiments of the present disclosure, the channel controller 116 is configured to operate to maximize the performance of the memory device. For example, in one embodiment, the channel controller is configured to operate in a greedy mode, which always attempts to send commands to the memory device for execution as long as there are pending requests. Thus, the read queue 130 and the write queue 132 always send eligible commands to the command selector 135 to bid for access to the memory device. Meanwhile, the command selector 135 operates based on predetermined priority rules and selects a winning command to send to the memory device every x clock cycles (x is 1 or greater). In one example, the command selector 135 is configured in a read-first mode, in which commands for write operations are sent in empty clock cycles between commands for read operations. In another example, the command selector 135 is configured in a write-first mode, in which commands for read operations are sent in empty clock cycles between commands for write operations. In some embodiments, the predetermined priority rules include fixed priority rules or dynamic priority rules.

[0089] During operation, read queue 130 and write queue 132 store active read and write requests for the memory device, with each read / write request associated with a destination memory page within a destination memory bank of a destination memory die of the memory channel. Read queue 130 and write queue 132 determine which of their stored pending requests are eligible to be executed by the memory device. Read queue 130 and write queue 132 always attempt to send all eligible commands to command selector 135. Command selector 135 arbitrates the commands using predetermined priority rules and selects a winning command every clock cycle (or x clock cycles). The winning command is then sent to memory device 101 (along with write data on data bus 148) via the respective memory command bus 144 or data command bus 146. To track memory operations being executed on the memory device, the winning command is provided to command tracker 140, which operates to track the progress of each command sent to the memory device. The winning command is also provided to bank tracker 145, which tracks the state of each memory bank in the memory channel. Read queue 130 and write queue 132, as well as issued write queue 133, use the information in bank tracker 145 and command tracker 140 to determine the status of each memory bank that has a request pending, and based on the determined bank state, determine the commands that are eligible to bid for access in command selector 135.

[0090] In some embodiments, bank tracker 145 is a data structure that stores bank status data for each memory bank in a memory channel, where the bank status indicates whether a given memory bank is inactive (i.e., eligible to receive commands) or busy (i.e., not eligible to receive commands). Bank tracker may further store data indicating memory operations being performed on busy memory banks. Read queue 130 and write queue 132 obtain the status of each memory bank associated with their respective pending requests from bank tracker 145.

[0091] In some embodiments, command tracker 140 tracks each command being sent and executed in each memory bank of the memory device based on clock timing. In one embodiment, each command executed in memory device 101 is assigned a predetermined command execution time. Command tracker 140 tracks commands issued for execution in the memory device and indicates a given command as complete upon expiration of the predetermined command execution time assigned to that command. In some examples, the progress of each command being executed is tracked using clock cycles. In one example, commands sent to memory device 101 share the same time base; for example, commands are sent every 4 ns. In some embodiments, command tracker 140 is implemented as a shift register. In one example, the winning command is assigned to the top of the shift register and is shifted every clock cycle to track the progress of commands being executed in the memory device. In some embodiments, configurable tap points are provided in the shift register to indicate associated timing constraints. Commands progressing through the shift register are compared to each tap point. A match at a tap point indicates that time or clock cycles have elapsed since the command was issued to the given tap point. In this way, the command tracker tracks the progress of each command issued to the memory device. A command that has progressed beyond the tap point associated with its allotted command execution time is marked as a completed command and the associated memory bank is marked as free.

[0092] In this manner, the read queue 130 and the write queue 132 determine the bank status and ongoing memory operations for each memory bank for which a request is pending. The bank status and memory operation progress information allows the read queue and the write queue to determine whether a pending request is associated with a busy memory bank or an inactive or empty memory bank. For pending requests associated with an inactive memory bank, the read queue and the write queue issue commands that are eligible to be bid for access. The memory command selector 136 and the data command selector 138 of the command selector 135 select a winning command from among the eligible commands every clock cycle and send it to the memory device 101. The command tracker 140 and the bank tracker 145 update their respective statuses every clock cycle in response to the winning command. In this manner, the winning command is identified for the read queue 130 and the write queue 132, and the bank status associated with the winning command's memory bank is updated to busy. This makes pending requests to the same memory bank ineligible for bidding.

[0093] The structure and operation of the channel controller have been described herein to illustrate the process flow from receiving a request to generating a command for a memory device. It should be understood that the channel controller may include other circuit elements not shown or described to support memory operations. For example, the channel controller may perform error detection and correction. The channel controller may also include an ECC encoder for performing error correction coding and an ECC decoder for detecting and correcting bit errors, thereby preventing data loss. The ECC circuitry and other support circuitry included in the channel controller have been omitted from FIG. 8 for simplicity of illustration.

[0094] In the above-described embodiments, the memory device is formed by a memory stack of K memory dies with memory channel partitions across the memory dies in the stack. In another embodiment of the present invention, the K memory dies of the memory device are arranged side-by-side on an interconnect structure, such as an interposer, and are arranged adjacent to a memory controller die formed on the same interconnect structure. Such a packaging structure is also referred to as 2.5-dimensional packaging. In some examples, when formed on an interposer, the interposer provides high-density die-to-die connections between the K memory dies and the memory controller die. In some embodiments, each memory die is divided into S memory channels, forming S×K memory channels with the K memory dies. This configuration allows the memory device to provide a large number of memory channels, which has the beneficial effect of reducing access contention and increasing the availability of memory banks in the K memory dies.

[0095] In the above-described embodiments, the memory device includes a memory stack of K memory dies stacked together to provide the intended or designated memory capacity of the memory module. In embodiments of the present invention, the memory stack includes at least one additional spare memory die that is used to provide redundant memory capacity within the memory module. In some embodiments, the spare memory die is formed as part of the memory stack and is connected to the K memory dies via the same interconnect structures, such as TSVs, that connect the K memory dies.

[0096] Thus, in some embodiments, a memory module includes a memory device integrated with a memory controller, the memory device being formed by a memory stack including K+1 memory dies. With such a configuration, preferably, K memory dies provide the intended or designated memory capacity of the memory module, and one additional memory die (the “spare memory die”) provides additional memory capacity for redundancy. With such a configuration, the memory address space of the spare memory die is unknown to the host processor and known only to the memory controller. That is, the host processor is unaware of the physical existence of the spare memory die or the memory address space associated with the spare memory die. The host processor is aware only of the memory address space of the K memory dies (the “host address space”). That is, requests sent from the host processor to the memory module are directed only to the memory address space spanning the K memory dies known to the host processor. Meanwhile, the memory controller controls the physical memory address space spanning the K+1 memory dies and manages the mapping of logical memory addresses in the host address space to physical memory addresses, including mapping to the spare memory die when a redundancy replacement is applied. In other words, the memory controller communicates with the host processor over a memory address space spanning the K memory dies and manages memory operations in a memory address space spanning the K+1 memory dies. In some embodiments, the memory controller controls and directs accesses to spare memory dies via address translation circuitry, for example, when the memory capacity of a spare memory die is applied to replace a non-functioning or failed memory tile within the known address space of the K memory dies.

[0097] In another embodiment, a memory module includes a memory device integrated with a memory controller, the memory device being formed by K+1 memory dies arranged side-by-side on an interconnect structure with the memory controller in a packaging structure also referred to as 2.5D packaging. In some examples, the interconnect structure is an interposer. In other examples, the K+1 memory dies are arranged side-by-side to surround the memory controller on the interconnect structure. Importantly, the K+1 memory dies of the memory device of the present invention have a variety of packaging structures, either stacked (3D) or 2.5D packaging. The particular packaging structure of the K+1 memory dies and therefore the memory controller die is not important to the practice of the present invention.

[0098] In some embodiments, the memory controller is configured to monitor the operational or health status of memory arrays (or tiles) within each memory die. For example, the memory controller may obtain health information of storage transistors while performing refresh operations. The memory controller may also perform error correction on memory data read during read operations and determine the health or operational status of memory arrays and / or storage transistors within the memory arrays. The memory controller may determine that one or more memory arrays are malfunctioning, have lost functionality, have failed, or are degraded. As used herein, a memory array (tile) is considered malfunctioning or failed when one or more storage transistors within the memory array are malfunctioning or have failed, or when other transistors or circuit elements within the memory array are malfunctioning or have failed. For example, a failed or degraded storage transistor refers to a storage transistor that is still functional but has degraded electrical characteristics, such as a smaller-than-expected memory window, a smaller-than-expected transistor "on" current (Ion), or a significant deviation from the storage transistor's performance specifications. In another example, a memory controller may detect that one or more memory arrays are malfunctioning or failing by detecting a significant deviation from a memory device's performance specifications.

[0099] In some embodiments, the memory controller is configured to determine whether to replace one or more malfunctioning or failed memory arrays (tiles). If the memory controller determines that redundancy replacements should be applied to tiles in the K memory dies, the memory controller replaces the failed memory tiles with redundant memory tiles in the spare memory die. The memory controller manages address mapping information so that future requests received from the host processor that address the replaced memory tiles in the host address space are directed to the replacement memory tiles in the spare memory die.

[0100] For example, if during the operational life of the memory module, a tile of one of the K memory dies is detected to be failed or failing, the memory controller replaces the suspect tile with a functioning tile from the spare memory die. In some embodiments, the redundancy replacement can be performed on individual tiles or groups of tiles. In some embodiments, the address translation circuitry of the memory controller manages the mapping of logical memory addresses in the host address space to physical memory addresses, such that requests input from the host processor to replacement memory banks of the K memory dies are redirected to the replacement memory banks in the spare memory die. The tile replacement operation using the physical memory addresses of the spare memory die is completely transparent to the host processor and is managed internally within the memory module by the memory controller. The host processor can continue to operate using the logical memory addresses in the host address space. Meanwhile, the memory controller controls the physical memory address space of the K+1 memory dies and manages the mapping of logical memory addresses to physical memory addresses, including mapping to the spare memory die when a redundancy replacement is applied. In this way, the memory module continues to support its full specified memory capacity even if some tiles within the K memory dies or some storage transistors within a tile malfunction or fail. Furthermore, the memory controller predicts the impending failure or degradation of one or more tiles and initiates redundancy replacement, thereby improving the operational reliability of the memory module.

[0101] In some embodiments, an address translation circuit of a memory controller (e.g., address translation circuit 114 of FIG. 8 ) is configured to process incoming requests from a host processor and be received by a memory module, each request including a logical memory address within a host address space of the K semiconductor memory dies. Meanwhile, the address translation circuit of the memory controller converts the logical memory addresses of the incoming requests into physical memory addresses that identify storage transistors within the K+1 semiconductor memory dies. Specifically, the address translation circuit of the memory controller manages the mapping of logical memory addresses within the host address space that are targeted to malfunctioning or failed memory arrays and replaced with physical memory addresses within the memory address space of the spare memory die. The host processor continues to send requests to the memory module using the logical memory addresses of the host address space of the K memory dies, while the memory controller, via the address translation circuit, manages the mapping of the logical memory addresses to the physical memory addresses of the K+1 memory dies, including mapping the logical memory addresses to physical memory addresses on the spare memory die when a redundancy replacement is applied.

[0102] Memory Device Architecture

[0103] In embodiments of the present invention, the memory devices described herein implement a tile-based architecture including an arrangement of arrays or tiles of memory transistors that can operate independently and simultaneously, with each tile including memory transistors arranged in a three-dimensional array and local modular control circuitry that operates the memory transistors within the tile. The tile-based architecture of the present invention allows for simultaneous memory access to multiple tiles within the memory device, thereby enabling independent and simultaneous memory operations to be performed across multiple tiles. Tile-based simultaneous access to the memory device has the advantage of increasing memory bandwidth and reducing tail latency of the memory device by ensuring high availability of storage transistors.

[0104] As used herein, memory access concurrency refers to the simultaneous execution of multiple memory operations across multiple randomly addressed tiles of a memory device, with each tile performing memory operations on an access unit or memory page of memory data. In some examples, the memory operations include read, write, and refresh operations. In other words, the memory device operates with overlapping memory operations performed across multiple tiles, where the memory device continues to receive incoming commands from the controller device while executing previously received commands, with each command being executed by or directed to a different tile within the memory device. When a memory device is divided into multiple memory channels, memory access concurrency refers to the simultaneous execution of multiple memory operations across multiple tiles in each channel of the memory device. Also, in this description, the multiple memory operations are executed asynchronously with each other. That is, the multiple memory operations are not initiated on the same clock cycle, but rather on different clock cycles when the memory device (or memory channel) receives a command.

[0105] Memory access concurrency is particularly beneficial in memory devices with asymmetric read / write latencies. In an exemplary embodiment of the present invention, a memory device may have a write latency that is much longer than its read latency. For example, the write latency may be 300 ns to 1 μs, while the read latency may be 70 to 90 ns. In this case, overlapping read and write operations may occur simultaneously in different tiles, improving memory performance by continuing to provide high memory bandwidth and high memory availability despite the memory device's long write latency. Conventional memory devices (e.g., DRAMs) that do not have asymmetric read and write latencies or have short read and write latencies do not need to implement memory access concurrency because they typically operate by completing each memory operation before the next operation. In memory devices that have asymmetric read / write latencies, or write latencies that are longer than read latencies, such as the memory devices in the embodiments of the present disclosure, memory access concurrency can be implemented to perform overlapping memory operations to mask what would otherwise be long write latencies, so that the memory device behaves as if it has short read and write latencies.

[0106] In embodiments of the present disclosure, a memory structure for forming a memory device of the present invention includes a memory array portion configured as described above with reference to FIGS. 4A and 4B to form a three-dimensional array of randomly accessible NOR memory strings of storage transistors. To complete the memory device, the memory structure includes a staircase portion at the end (Y direction) of the memory strings, as shown in FIG. 9. The thin-film storage transistors of the NOR memory strings are formed in the memory array portion, and the staircase portion on the opposite side of the array portion includes a staircase structure that provides connection to a common bit line and optionally a common source line for the NOR memory strings through conductive vias. In some embodiments, the common source line is precharged to function as a virtual voltage reference source during programming, read, and erase operations, thereby eliminating the need for continuous electrical connection to support circuitry during such operations. The common source line is described herein as electrically floating to indicate the absence of continuous electrical connection to the common source line. Various processing steps can be used in embodiments of the present disclosure to form the staircase structure within the memory structure. The processing steps for forming the staircase structure may occur before, after, or between the processing steps for forming the memory array portion.

[0107] The memory structure described above with reference to FIGS. 4A and 4B illustrates the organization of a memory array including a three-dimensional array of NOR-type memory strings. This memory structure can be used as a building block for forming large-capacity, high-density memory devices. In embodiments of the present disclosure, the memory structure described above can be used as a building block for forming tiles including a memory array as a modular memory unit and local modular control circuitry formed below the memory array. The memory devices of the present disclosure are formed using an array of tiles. In one exemplary embodiment, the memory device is configured as a two-dimensional array of tiles arranged along the X and Y directions, with each tile including a three-dimensional array of storage transistors with support and control circuitry for each tile formed below the respective tile. More specifically, the memory device includes multiple memory arrays of thin-film storage transistors organized as a two-dimensional array of "tiles" (i.e., the tiles are arranged in rows and columns) formed on a plane of a semiconductor substrate. Each tile is configured to be individually addressed. This configuration allows the tiles to be modular units that allow flexibility in configuring memory modules to meet application requirements.

[0108] 9 is a cross-sectional view in the YZ plane of a tile in a memory device according to an embodiment of the present invention. Referring to FIG. 9, a tile 201 is formed on a semiconductor substrate 200. The memory structure of the tile 201 is formed in an insulating film 211, and a protective film 212 (passivation film) is formed on the insulating film 211. In some implementations, the insulating film 211 is made of silicon oxide (SiO x), and the protective film 212 is formed from polyimide. In this embodiment, the memory structure includes a three-dimensional array of storage transistors ("memory array") configured as described above with reference to the memory structure of FIG. 4A or 4B. More specifically, the memory structure may be a three-dimensional array of charge trapping storage transistors (FIG. 4A) or a three-dimensional array of junctionless ferroelectric storage transistors (FIG. 4B).

[0109] A P-type or N-type diffusion region 221 is formed on the top surface of the semiconductor substrate 200. Other structures (not shown in FIG. 9 ), such as isolation structures or shallow trench isolation (STI) structures, may also be formed in the semiconductor substrate 200. A gate electrode 222 is formed on the semiconductor substrate 200 and is insulated from the semiconductor substrate by a gate dielectric layer. For example, the gate dielectric layer may be a thin silicon oxide layer. The gate electrode 222, together with the P-type and N-type diffusion regions 221, form a transistor in the semiconductor substrate 200. This transistor can be used to form circuit elements. For example, this transistor can be used to form support circuitry for operating storage transistors in a 3D NOR memory array formed in the tile 201. The circuit elements are interconnected by interconnects 224 formed in the insulating film 211 of the lower interconnect portion 232 and contacts 223 that connect to one or more layers of vias 225 to form the support circuitry. In some embodiments, support circuitry for the storage transistor is provided in the circuit element portion 231 and the lower interconnect portion 232. For example, support circuitry forming modular control circuitry for an array of storage transistors is formed in circuit element portion 231 and lower interconnect portion 232 .

[0110] In the tile 201, a 3D NOR memory array 210 is formed in a memory array portion 233. An upper interconnect portion 234 is formed above the memory array portion 233. An insulating film 211 in the upper interconnect portion 234 is provided with interconnects 226 and vias 227 for forming further electrical connections. In some embodiments, the upper interconnect portion 234 is provided with conductive pads 228 for connecting to circuit elements external to the semiconductor memory device. For example, a protective film 212 is formed on the upper interconnect portion 234, seals the upper interconnect portion 234, and has openings that expose at least a portion of the conductive pads 228.

[0111] In memory array portion 233, thin-film storage transistors are configured as a three-dimensional array of NOR memory strings within memory array section 202. Memory array portion 202 is disposed between staircase portions 203a and 203b. Staircase portions 203a and 203b are formed on opposite sides of tile 201. Connections to a common bit line and optionally a common source line for the NOR memory strings are provided in staircase portions 203a and 203b through conductive vias. In some embodiments, the common source line is precharged and then maintained at a relatively constant voltage to serve as a virtual voltage reference during programming, erasing, and read operations, thereby eliminating the need for continuous electrical connection to support circuitry during such operations. In FIG. 9, array portion 202, staircase portions 203a, and staircase portions 203b are not drawn to scale. For example, array portion 202 may be much larger in area than either staircase portions 203a or 203b.

[0112] In the memory array portion 202, thin-film storage transistors are formed at the intersections of common drain and source lines (collectively designated 204) and local word lines 205. A gate dielectric layer 206 is formed between the conductive local word lines and a channel layer (not shown in FIG. 9 ). The common drain and source lines are arranged in multiple planes extending in the Y direction, and the local word lines 205 are arranged in the Y direction as columnar structures extending in the Z direction, thereby forming storage transistors in multiple planes in the Z direction and in a three-dimensional array of rows in the X direction along each memory string in the Y direction. In FIG. 9 , global word line conductors 208 provide electrical connection between circuitry 222 below the memory array 210 and the local word lines 205 associated with the three-dimensional memory stack.

[0113] In the above embodiment, the support circuits are described as being formed below the memory array portion 233. This configuration is merely exemplary and is not intended to be limiting. For example, in other embodiments, both the memory array portion and the support circuits may be formed directly on the semiconductor substrate 200. In this case, for example, the support circuits may be arranged around the memory array portion. In other embodiments, the support circuits may be formed on a separate semiconductor substrate. In this case, for example, the semiconductor substrate on which the memory array portion is formed and the semiconductor substrate on which the support circuits are formed are bonded to each other after the respective memory elements and circuit elements are formed.

[0114] FIG. 9 shows one exemplary embodiment of a tile of storage transistors, or a physically separated memory array. The depiction of tile 201 in FIG. 9 is for illustration only and is not intended to be limiting. FIG. 9 is provided to illustrate the incorporation of the memory structure of FIG. 4B or FIG. 4A to form a tile containing modular memory units (memory arrays) and modular control circuitry. This tile can then be used as a building block to form a memory device including multiple arrays of three-dimensional storage transistors, such as junctionless ferroelectric storage transistors, to provide desired memory capacity at high density levels.

[0115] In an embodiment of the present invention, tile 201 implements a horizontal NOR (HNOR) memory architecture in which bit lines are stacked in multiple planes and word lines are formed as columnar structures. The bit lines are connected to bit line driver circuits (including bit line select transistors) to select and drive memory pages on the bit lines for memory operations. The word lines are connected to word line driver circuits (including word line select transistors) to select one of the word lines in tile 201 for memory operations. This configuration allows for the formation of support circuits formed below the memory array, with the bit line driver circuits located below staircase portions 203a and 203b and the word line driver circuits located below memory array portion 202. This configuration allows for the formation of compact (small-sized) under-array circuits because the bit line driver / select transistors are typically smaller in size than the word line driver / select transistors. In memory devices using thin-film storage transistors, such as charge trapping storage transistors or ferroelectric storage transistors, the word line driver / select transistors are typically configured to have a larger on / off voltage difference than the bit line driver / select transistors. Therefore, the word line driver circuits are typically much larger than the bit line driver circuits.

[0116] The HNOR memory architecture of the present disclosure allows for compact under-array circuitry because the bit line drive / select transistors require a smaller footprint and can be pulled under the staircase portion, while the larger word line drive / select transistors are located under the memory array portion, which has more space to accommodate the larger transistors. Therefore, the tile 201 in this embodiment is scalable because its size is not limited by the size of the staircase structure or the driver circuit. This is in contrast to conventional memory architectures (e.g., NAND flash memory) in which word lines are stacked and bit lines are formed in columnar structures. In these conventional memory architectures, the larger word line drive / select transistors must be located under the staircase portion, so the large size of the word line drive / select transistors determines the size of the tile or limits the size of the memory tile to a minimum size. Conventional memory architectures with stacked word lines cannot support memory devices with a large number of tiles because each tile must have a large tile size to accommodate the word line drive / select transistors that must be located under the staircase portion. The HNOR memory architecture implemented in the memory device of the present invention allows for compact tile sizes to be formed, so that the memory device can be formed to include a large number of tiles. A memory device with a large number of tiles allows for concurrency of memory operations, increasing memory bandwidth and memory availability of the memory device.

[0117] FIG. 10 illustrates a two-dimensional array of tiles forming part of a memory device, according to an embodiment of the present disclosure. Referring to FIG. 10, in an embodiment of the present disclosure, a memory device 280 includes a two-dimensional array of tiles 201, each including a memory array 210, which is a three-dimensional array of storage transistors, and a module control circuit 250. The tiles 201 may be configured as described above with reference to FIGS. 3, 4A, 4B, and 9. The memory array 210 of the tile 201 is formed on a semiconductor substrate portion 240. An insulating layer 253 is provided between the semiconductor substrate portion 240 and the memory array 210 formed thereon. A module control circuit (CuA) 250, which implements support circuitry for operating the storage transistors in each tile, is formed on the semiconductor substrate portion 240. Specifically, each tile 201 includes its own module control circuit (CuA) 250 formed below each memory array 210. As used herein, semiconductor substrate portion 240 refers to semiconductor substrate 241 and interconnect structures 242 formed on semiconductor substrate 241. Furthermore, in embodiments of the present invention, each module control circuit 250 has approximately the same planar dimensions (in the XY plane) as memory array 210.

[0118] In memory device 280, each tile is controlled by a respective module control circuit 250 to perform memory operations on the storage transistors in the memory array. The memory device also includes additional peripheral control circuitry in the areas between tiles or on the periphery of the memory device. In some examples, the peripheral control circuitry includes input / output circuitry for communicating with a memory controller, protection circuitry (e.g., against electrostatic discharge), data path circuitry, interface circuitry, and other control logic circuitry. The peripheral control circuitry may also include analog circuitry (e.g., regulators, voltage reference circuits, temperature sensors) and non-volatile memory (e.g., electronic fuse memory, one-time programmable memory) for storing trimming data. The circuitry of the peripheral control circuitry supports the operation of each module control circuit 250 but does not directly control memory operations on the storage transistors, such as reading from or writing to the storage transistors.

[0119] With this configuration, a memory device 280 implementing the tile-based architecture of the present invention includes multiple tiles, each formed as a modular memory unit by a physically separated memory cell array, and each modular memory unit operated by a local modular control circuit (CuA). In other words, the memory array includes multiple tiles, each operated independently of the other by the modular control circuit formed in each tile. Each modular memory unit is a physically separated memory cell array, each including its own three-dimensional array of memory cells and its own staircase structure for connecting the memory cells to the modular control circuit. Each modular memory unit is an individual and independently operable memory array, and multiple modular memory units are multiple instances of the same modular memory unit structure, each individual modular memory unit being physically separated from the other modular memory units. Each modular memory unit is operated by its own local modular control circuit and performs semi-autonomous memory operations (e.g., read operations, write operations).

[0120] In embodiments of the present invention, a memory device interacts with a memory controller, such as those described above with reference to FIGS. 1A, 1B, 2A, 2B, 7, and 8, to receive input commands having addresses for performing memory operations specified by the commands on respective memory tiles designated by the addresses. Each tile having a module control circuit is described herein as operating semi-autonomously in that the module control circuit receives commands having addresses that designate its associated memory array and operates independently to perform memory operations specified by the commands on its associated memory array. The module control circuit may receive regulated voltage levels or clock signals from the peripheral control circuitry, but does not receive control signals related to memory operations from the peripheral control circuitry. Rather, the module control circuitry is itself the processing unit for its associated module memory unit and generates all control signals for controlling its associated module memory unit (or memory array) to perform memory operations.

[0121] A distinctive feature of the memory device of the present invention is that each tile is used as an operational unit of memory access, i.e., each tile operates on an access unit of memory data, such as a page or memory page of memory data. Thus, each command from the memory controller is addressed to a single tile, and each tile operates on the command to read or write to a memory page of memory data, independent of commands addressed to other tiles. As mentioned above, as used herein, an access unit or memory page of memory data refers to the number of data bits of memory data in each memory access request from a host device to the memory controller. In some examples, the access unit is 512 bits of memory data. It is helpful to note that this description only discusses memory data within an access unit, with the understanding that each memory access may include additional data bits, such as metadata bits, error flags, or other data bits used by the host but that are not strictly memory data.

[0122] When connected and operated by a memory controller, the memory device 280 provides memory access concurrency, where multiple memory operations are performed simultaneously in multiple tiles, each memory operation being performed independently of the others, and overlapping memory operations being performed in different memory tiles. The memory controller receives memory access requests from a host device and issues commands (with memory addresses) to the memory device in response to the received memory access requests. For example, the memory controller issues commands to each tile of the memory device every 4 ns or 5 ns. In embodiments of the present disclosure, the memory controller implements a tile or bank conflict avoidance scheme to avoid sending a new command to a tile that is currently processing an existing command. Tile conflict avoidance is particularly beneficial when the memory device has asymmetric latency, such as a very long write latency relative to the read latency. For example, if the write latency (e.g., 1 μs) is much longer than the read latency (e.g., 90 ns), the memory controller can perform a write operation in one tile and overlap the read and write operations performed in other tiles to enable concurrent execution. In this way, long write latencies do not hold up read operations while waiting for write operations to complete. Examples of tile or bank conflict avoidance schemes were described above with reference to FIG.

[0123] With this configuration, the memory device receives commands from the memory controller, each command addressed to a tile, and no command is issued to a tile currently executing another command. Thus, the memory device receives commands to activate other tiles that are not currently executing commands. Furthermore, each command is issued for an entire access unit of memory data, and each tile operates independently of the others to perform memory operations on an entire access unit or memory page of memory data. In this manner, tiles within the memory device can be individually addressed and operated on individually and simultaneously, such that each tile operates on an entire memory page of memory data for each memory access request. The memory device operated by the memory controller ensures high availability of tiles, thereby increasing memory bandwidth and reducing tail latency of memory access requests. Importantly, by dividing the memory address space of the memory device into multiple tiles, the probability of memory access conflicts in which incoming memory accesses are addressed to the same tile is significantly reduced, thereby contributing to reduced tail latency and improved quality of service levels for the memory device. In particular, the tail latency of the memory devices of the present disclosure is improved by having a large number of tiles available for host memory access, thereby avoiding situations where host memory accesses must be stalled in order to activate all or most of the memory banks.

[0124] In an embodiment of the present invention, each tile of the memory device is operated by a local module control circuit (CuA). With continued reference to FIG. 10, each module control circuit 250 is a complete control circuit replicated for each tile so that memory operations within each tile are self-contained. The module control circuit 250 includes a sequencer that functions as an intelligent processing unit that executes commands received from the memory controller and addressed to each tile, and triggers memory operations in the associated tile in response to the received commands. Exemplary embodiments of the module control circuit are described below with reference to FIGS. 11 and 12. The structure and configuration of the module control circuit described herein are exemplary only and are not intended to be limiting. In other embodiments, other configurations and design schemes may be used.

[0125] FIG. 11 is a block diagram illustrating a module control circuit that can be incorporated into each tile of a memory device to provide intelligent, semi-autonomous memory operation control, according to some embodiments of the present invention. In some examples, the module control circuit 300 of FIG. 11 can be used to implement the module control circuit 250 of FIG. 10 or the support circuitry or CuA described in the above embodiments. Referring to FIG. 11, the module control circuit (CuA) 300 implements support circuitry for the module memory unit and is formed locally beneath each memory array. The module control circuit 300 includes a circuit portion formed beneath the staircase portion of the tile and a circuit portion formed beneath the memory cell array portion of the tile. Generally, the module control circuit 300 includes bit line (BL) and word line (WL) selection circuitry for selecting memory pages of storage transistors from the memory array in response to received addresses, bias control circuitry for controlling voltage biases applied to selected bit lines and word lines to perform memory operations triggered by received commands, and control circuitry.

[0126] To facilitate the description of the present invention, the following exemplary memory device configuration will be used. In some examples, each memory array within a memory device or within a memory channel of a memory device includes M word lines. During each memory operation, one of the M word lines is activated to select P memory pages. Each memory page includes Q data bits. Thus, each memory array includes P×Q bit lines formed on multiple planes of the memory array, each bit line associated with a NOR memory string including M storage transistors. Activating a word line selects P memory pages, and selecting Q bit lines selects a memory page of storage transistors. Note that the staircase portions of the tiles are also referred to herein as upper and lower staircase portions. The terms "upper" and "lower" are used for ease of reference in the figures and are not intended to indicate a particular orientation or arrangement of circuit elements.

[0127] In an embodiment of the present invention, module control circuit 300 includes a circuit portion 252 formed in a central portion of the module control circuit. Circuit portion 252 includes control circuitry, also referred to as tile logic. In some embodiments, tile logic circuit 252 includes a sequencer or processor unit that executes a sequence of memory operations on the memory array. Specifically, the sequencer receives input commands from a memory controller addressed to an associated tile, along with associated memory addresses and write data (if applicable). The sequencer decodes each received command, such as by decoding microcode within the command, and executes instructions according to the command to perform memory operations on the memory array, each memory operation including a sequence of operations or steps that operate on storage transistors of the memory array. For example, a command may be a read command to read data from a particular memory page in the memory array. In another example, the command may be a write command with write data to store data in a particular memory page in the memory array. In yet another example, the command may be a refresh command to refresh stored data in a particular page in the memory array. Specifically, the sequencer generates control signals to execute the sequence of operations on the memory array and the timing of each memory operation. For example, the sequencer generates control signals that dictate timing sequences for performing various operational sequences, such as selecting word lines and bit lines, applying bias voltages, and sensing, programming, and erasing selected storage transistors. Importantly, the sequencers in each module control circuit operate independently of one another without requiring control from circuit elements external to the module control circuit. In this manner, the sequencers in the tile logic circuit 252 add intelligence to the module control circuits, enabling the module control circuits 300 to perform semi-autonomous memory operations.

[0128] In an embodiment of the present invention, module control circuit 300 includes circuit portions 254A and 254B that implement row circuitry for selecting and activating word lines in the memory array. In this embodiment, the row circuitry is divided into two circuit portions 254A, 254B formed adjacent to tile logic circuit portion 252 in the center of the module control circuitry. In other embodiments, the row circuitry may be formed in a single circuit portion 254, located to one side of tile logic circuit portion 252. The row circuitry includes row decoder circuitry 255, row bias control circuitry 256, and word line selection circuitry 257, also referred to as word line (WL) driver circuitry. In this embodiment, circuit portions 254A and 254B may each be configured to control half of the word lines in the memory array. For example, circuit portion 254A may be configured to control the upper half of the word lines in the memory array, and circuit portion 254B may be configured to control the lower half of the word lines in the memory array.

[0129] The row decoder circuit 255 is configured to decode memory addresses accompanying commands received by the tile logic circuit 252 to determine which word lines to activate for a memory operation. The row bias control circuit 256 generates and controls word line voltage values for biasing selected word lines as a function of the memory operation being performed. The row bias control circuit 256 also generates and controls word line voltage values for unselected word lines, for example, to minimize disturbance of unselected memory cells. In one example, the selected word lines are applied with a first voltage value for read operations and a second voltage value different from the first voltage value for write operations. In another example, the unselected word lines are applied with an inhibit voltage value to minimize disturbance of data stored in unselected memory cells. Finally, the word line driver circuit 257 includes word line drive / select transistors connected to the M word lines in the memory array. In response to a decoded address from row decoder 255 specifying a word line for selection, word line driver circuit 257 selects the specified word line and applies to the selected word line the appropriate bias voltage value associated with the memory operation to be performed. Word line driver circuit 257 also applies an inhibit voltage to the other M-1 unselected word lines. The row circuit (circuit portions 254A, 254B) operates in this manner to select and drive one word line from the M word lines for a memory operation.

[0130] Module control circuit 300 includes circuit portions 258A and 258B that implement column circuitry for selecting and activating bit lines in the memory array. In this embodiment, the column circuitry is divided into two circuit portions 258A, 258B formed adjacent to row circuit portions 254A, 254B. In other embodiments, the column circuitry may be formed in a single circuit portion 258, located on one side of tile logic circuit portion 252. The column circuitry includes column decoder circuitry and column bias control circuitry. In this embodiment, circuit portions 258A and 258B may each be configured to control half of the bit lines in the memory array. For example, circuit portion 258A may be configured to control the upper half of the bit lines in the memory array, and circuit portion 258B may be configured to control the lower half of the bit lines in the memory array.

[0131] The column decoder circuitry in the column circuitry 258A or 258B is configured to decode a memory address associated with a command received by the tile logic circuitry 252 to determine the memory page of the bit lines to activate for the memory operation. The column bias control circuitry in the column circuitry 258A or 258B generates and controls bit line voltage values for driving selected bit lines as a function of the memory operation being performed. The column bias control circuitry also generates and controls bit line voltage values for unselected bit lines to minimize disturbance of unselected memory cells. In one example, the selected bit lines are applied a third voltage value for read operations and a fourth voltage value different from the third voltage value for write operations. In another example, the unselected bit lines are applied an inhibit voltage value to minimize disturbance of data stored in unselected memory cells.

[0132] The module control circuit 300 includes circuit portions 260A and 260B that implement sense circuits and latch circuits. In this embodiment, the sense circuits and latch circuits are divided into two circuit portions 260A and 260B formed adjacent to column circuit portions 258A and 258B, respectively. The placement and division of the sense circuits and latch circuits depend on the configuration of the staircase structure of the tile that provides bit lines of the NOR-type memory strings of the memory array for connection to the module control circuit. When the staircase structure includes two portions formed at both ends of the tile, it is beneficial to place the corresponding sense circuits and latch circuits near the respective bit line staircase portions for better sensing and driving performance.

[0133] In circuit portions 260A and 260B, the sense amplifier circuit includes Q sense amplifiers corresponding to the number of data bits in a memory page. The Q sense amplifiers are connected to Q selected bit lines. Therefore, each memory operation is performed on a memory page of data bits, and no sense amplifier selection is required. By providing the same number of sense amplifiers in module control circuit 300 as the number of data bits in a memory page, the size of the module control circuit can be kept compact and the module control circuit can be formed below each memory array. In this embodiment, Q selected bit lines are provided through upper and lower staircase portions. Therefore, half of the sense amplifiers are provided in circuit portion 260A and connected to the Q / 2 selected bit lines in the upper staircase portion, and the other half of the sense amplifiers are provided in circuit portion 260B and connected to the Q / 2 selected bit lines in the lower staircase portion.

[0134] The data latch circuitry may include two or more data latches or registers for storing output read data or input write data. The sense amplifier control circuitry directs the operation of the sense amplifiers and data latches to sense read data from selected bit lines or provide write data to selected bit lines. In some examples, the sense amplifiers, data latches, and bias control circuitry may be configured as described above with reference to FIG. 6.

[0135] In an embodiment of the present invention, module control circuit 300 includes circuit portions 262A and 262B that implement bit line (BL) driver circuits for selecting and driving bit lines (e.g., Q bit lines) of a selected memory page in the memory array. The bit line driver circuits include a set of bit line select transistors that select and drive the selected bit lines. In this embodiment, the bit line select circuit is divided into two circuit portions 262A, 262B formed on either end of the module control circuit. Additionally, the two circuit portions of the bit line select circuit are formed below respective staircase portions on either end of the tile.

[0136] More specifically, the bit line selection circuit includes a first set of bit line select transistors formed below the upper staircase portion and a second set of bit line select transistors formed below the lower staircase portion. As described above, in this embodiment, P×Q bit lines are provided through the upper and lower staircase portions. That is, half of the bit lines of the memory array are connected to a stair structure formed at a first end (e.g., the top end) of the tile and connected to bit line select transistors formed below the stair structure. The other half of the bit lines of the memory array are connected to a stair structure formed at a second end (e.g., the bottom end) opposite the first end of the tile and connected to bit line select transistors formed below the stair structure. With this configuration, the first set of bit line select transistors (circuit portion 262A) are connected to (P×Q) / 2 bit lines and are formed below the upper staircase portion to select and drive Q / 2 bit lines for memory operations. A second set of bit line select transistors (circuit portion 262B) is connected to the (P×Q) / 2 bit lines and is formed below the lower staircase portion to select and drive the Q / 2 bit lines for memory operations. Thus, the bit line select circuitry selects Q bit lines from the P×Q bit lines in the memory array to perform memory operations.

[0137] In this configuration, the first and second sets of bitline select transistors are connected to the bitlines of the NOR memory strings at the upper and lower staircases to select the bitlines and apply appropriate voltage levels to the selected bitlines for read and write operations. Specifically, the bitline select transistors select a memory page for Q bitlines from all P×Q bitlines in response to a column decoder that decodes a memory address associated with a command received by the tile logic circuit 252. The bitline select transistors apply bias voltages generated by the column bias control circuitry to the selected bitlines via the sense amplifier circuitry to perform the specified memory operation. Unselected bitlines are left electrically floating or are not actively biased to a particular voltage potential.

[0138] During operation, in module control circuit 300, tile logic circuit 252 receives an input command and a memory address. Row decoder 255 decodes the memory address and determines which word line to select. Row bias control circuit 256 generates bias voltage levels for selected and unselected word lines. Word line driver circuit 257 selects a designated word line from M word lines for a memory operation. Meanwhile, column decoders (circuit portions 258A, 258B) decode the memory address and determine which memory page to select. Column bias control circuit generates bias voltage levels for selected bit lines. Bit line driver circuits (circuit portions 262A, 262B) select Q bit lines of the selected memory page, which are connected to the sense amplifiers. A sequencer within tile logic circuit 252 controls the sequence and timing of the various steps to perform a memory operation. For example, for a read operation, the sense amplifier first precharges the selected bit line and then senses the current or voltage value on the selected bit line as a result of the storage transistor in the selected memory page being activated by the selected word line. The sensed data value of the Q data bit is stored in the data latch (circuit portions 260A and 260B) for reading by the memory controller on the I / O bus of the memory device. For a write operation, the sense amplifier precharges the selected bit line and applies a bit line bias voltage to the selected bit line according to the write data value (stored in the data latch), which is stored in the storage transistor in the selected memory page activated by the selected word line. In some embodiments, unselected bit lines are biased to an inhibit voltage value due to virtual capacitive coupling by the unselected word lines. The sequencer performs read and write operations, each of which includes various stages with different bias voltage values and timing. The sequencer manages the sequence of stages in each memory operation and the timing of each other stage.

[0139] In this embodiment, module control circuitry 300 is configured with tile logic circuitry 252 in the center, flanked by decoder circuitry, bias control circuitry, selection circuitry, sense circuitry, and latch circuitry. In this configuration, control signals from tile logic circuitry 252 to other circuits can be routed across the tile area, such as using conductive interconnects and vias in interconnect portion 232 (FIG. 9).

[0140] The configuration of module control circuit 300 in FIG. 11 is illustrative only and not intended to be limiting. Circuitry within module control circuit 300 may be arranged in other configurations depending on other design considerations, such as transistor or circuit element size and signal routing needs. FIG. 12 is a block diagram illustrating a module control circuit that may be incorporated into each tile of a memory device according to another embodiment of the present invention. Referring to FIG. 12, module control circuit 350 includes circuit elements identical to those of module control circuit 300 in FIG. 11, and identical elements are numbered identically for ease of description. Module control circuit 350 is comprised of tile logic circuit 252 located on the tile region side. Row circuitry, including row decoder 255, row bias control circuit 256, and word line driver circuit 257, is located in the center adjacent to tile logic circuit 252. Column decoder and bias control circuits 258A and 258B are similarly located on either side of the row circuitry, adjacent to tile logic circuit 252. In some examples, the circuit layout of the module control circuit 350 accommodates sense amplifier or column decoder circuitry that occupies a larger area, allowing for more efficient use of the tile area by placing the tile logic to the side. In the configuration of the module control circuit 350, the routing of control signals from the tile logic 252 to other circuit elements can include routing in two different directions.

[0141] In the module control circuit 300 of Figure 11, control signals from the tile logic circuit 252 to other circuits can be routed in only one direction on the tile area, for example, from top to bottom, or vice versa, as shown by the arrows in Figure 11. In this case, command and address signals can be routed to the module control circuit 350 in each tile using the routing area between tiles in the memory device, or using several areas on the tile. In the module control circuit 350 of Figure 12, control signals from the tile logic circuit 252 to other circuits can be routed both horizontally and vertically, as shown by the arrows in Figure 12. In this case, command and address signals to the module control circuit 350 in each tile are generally routed using the routing area between tiles in the memory device.

[0142] FIG. 13 is a block diagram illustrating a bit line selection and sense amplifier configuration in a module control circuit according to an embodiment of the present invention. The circuit elements in the block diagram of FIG. 13 are illustrative of the circuit elements in the module control circuit of FIG. 11 or FIG. 12. Furthermore, for ease of explanation, assume that the memory array has 16,384 bit lines, each word line selecting one of 32 memory pages, and the memory page size is 512 bits. Additional data bits for metadata, error correction, or health indication may be provided but are not included in this diagram for simplicity. Referring to FIG. 13, the 16k bit lines of the memory array are split into two sections and connected to the module control unit via a two-tier structure. In this embodiment, the upper tier section is connected to 8,192 bit lines, and the lower tier section is connected to another 8,192 bit lines. In each tier section, the bit lines are connected to respective bit line driver circuits, each circuit selecting half of the memory page, i.e., 256 bit lines. For example, in the upper staircase section, the bit line driver circuit includes 256 selector circuits, each selecting one of the 32 bit lines. Similarly, in the lower staircase section, the bit line driver circuit includes 256 selector circuits, each selecting one of the 32 bit lines. The selector circuits receive a page address and determine which bit line to select. The outputs of the 256×2 selector circuits corresponding to the 256×2 selected bit lines are connected to respective sense amplifier circuits. A set of 256 sense amplifiers is provided in the upper section, and a set of 256 sense amplifiers is provided in the lower section. The 256×2 sense amplifiers are then connected to respective data latches. For example, a set of data latches 261A is connected to sense amplifier 260A, and a set of data latches 261B is connected to sense amplifier 260B.

[0143] FIG. 13 illustrates the data flow for a read operation. The sensed data from the 256×2 sense amplifiers is stored in data latches 261A and 261B for output to the memory controller. Thus, each set of data latches provides 256 bits or 32 bytes of output data. The memory controller receives and combines data from the two sets of data latches 261A and 261B to obtain a memory page of 512 bits or 64 bytes of memory data. The configuration of FIG. 13 also applies to a write operation, in which 512 bits of write data are received by the module control circuitry and stored in the two sets of data latches 261A and 261B. The bit line driver circuitry selects the 512 bit lines of the memory page to be written, and the sense amplifiers provide the write data on the selected bit lines.

[0144] With this configuration, the module control circuit includes a number of sense amplifiers for sensing or driving bit lines equal to the number of data bits in a memory page. No select signals are used to select the sense amplifiers. Rather, bit line selection is used to connect only the memory page size of bit lines to the sense amplifiers. This configuration allows for a compact module control circuit, simplifies circuit design and control, and enables high-bandwidth operation.

[0145] In the above-described embodiment, the memory device includes an array of tiles, each tile providing an access unit of memory data, such as a memory page (e.g., 512 bits) of memory data. Note that the above description is in terms of memory operations in which each memory access from the host responds to a host request based on an access unit of memory data. In actual implementations, each tile may perform additional auxiliary memory operations that are not part of the host memory request, such as refresh or wear leveling. In some cases, each memory operation performed on a target memory page within a tile may include additional auxiliary memory operations on another related memory page within the same tile. A module control circuit (CuA) cooperates with the memory controller to control the auxiliary memory operations.

[0146] In an embodiment of the present disclosure, a write operation is performed in conjunction with a partial refresh operation, and each time a memory page is written, another memory page associated with the same word line is selected and simultaneously refreshed. As described above, a destination memory address activates a selected word line, activating P memory pages. While one of the P memory pages is selected for the write operation, a partial refresh operation selects other memory pages belonging to the activated word line for refresh. The partial refresh operation can be advantageously applied to reduce disturbance experienced by unselected storage transistors associated with the activated word line. The partial refresh operation is disclosed in U.S. Patent Application No. 17 / 525,712, entitled "Methods For Reducing Disturb Errors By Refreshing Data Alongside Programming Or Erase Operations," filed November 12, 2021 (the entire disclosure of which is incorporated herein by reference). When a partial refresh operation is performed, each write operation within a tile is performed on a specified memory page and a memory page to be refreshed, i.e., each write operation is performed on two memory pages. However, the memory access unit remains a single memory page, and only one memory page is written with input write data, while the other memory page only has its contents refreshed. This description of memory operations performed within a tile based on an access unit of memory data does not exclude additional, auxiliary memory operations being performed on other memory pages within the same tile.

[0147] Additionally, in the above-described embodiments, the tile-based support circuitry or module control circuitry (CuA) for each tile is described as being formed within or on the semiconductor substrate on which the array of storage transistors is formed. In alternative embodiments, the module control circuitry (CuA) may be formed on a separate semiconductor substrate different from the semiconductor substrate on which the storage transistors are formed. In such a configuration, the memory array of storage transistors is formed on a first semiconductor die, and the module control circuitry for each array of storage transistors is formed on a second semiconductor die. A memory device is formed by electrically and mechanically connecting the first semiconductor die to the second semiconductor die, with each memory array and associated module control circuitry forming a tile within the memory device, and the memory device includes an array of tiles formed by bonding the first semiconductor die and the second semiconductor die. Tiles, including the module control circuitry and associated memory arrays, can be individually addressed by an external memory controller.

[0148] 9 may be formed by two semiconductor dies, with the memory array portion 210 formed on a first semiconductor die and the module control circuitry formed on a second semiconductor die. The second semiconductor die may be joined to the first semiconductor die via an interconnect structure formed on the underside (or bottom) or top side of the memory array portion 210. For example, the interconnect structure may be a hybrid bond. Forming the memory array portion and the module control circuitry on separate semiconductor dies has the beneficial effect of allowing the manufacturing process to be optimized separately for the memory circuitry and the control circuitry.

[0149] In some embodiments, the circuitry of each modular control circuit may be divided into a portion of the control circuit formed below or above the memory array of storage transistors in a first semiconductor die and the remaining control circuitry formed in a second semiconductor die. For example, the bit line selector circuit / driver circuit for each tile may be formed in or above the semiconductor substrate of the first semiconductor die below each memory array. Alternatively, in another example, the bit line selector circuit / driver circuit for each tile may be formed as vertical thin film transistors above (on the opposite side of the semiconductor substrate from) the respective memory array. In this embodiment, the first semiconductor die need only provide global bit line connections to the second semiconductor die. With this configuration, memory devices of the present invention can be configured in various ways to provide an array of tiles of storage transistors with modular control circuitry. Memory devices may be formed on a monolithic semiconductor die or in a multi-die configuration to enable optimization of the manufacturing process between the memory circuitry and the support circuitry. Whether formed monolithically or in a multi-die configuration, memory tiles, including modular control circuits and associated memory arrays, can be individually addressed by an external memory controller.

[0150] In this detailed description, process steps described in one embodiment can be used in another embodiment even if not explicitly described in another embodiment. When a method including two or more defined steps is referred to herein, the defined steps can be performed in any order or simultaneously, unless the context dictates or specific instructions are provided otherwise herein. Furthermore, unless the context dictates or specific instructions are provided otherwise, the method can also include one or more other steps performed before any defined step, between two defined steps, or after all defined steps.

[0151] In this detailed description, various embodiments or examples of the present invention can be embodied in various forms, such as processes, devices, systems, and compositions of matter. A detailed description of one or more embodiments of the present invention is provided above, along with accompanying figures that illustrate the principles of the present invention. While the present invention has been described in connection with such embodiments, the present invention is not limited to any particular embodiment. Various modifications and variations are possible within the scope of the present invention. The scope of the present invention is limited only by the appended claims, and the present invention encompasses various alternatives, modifications, and equivalents. Numerous specific details are described herein to provide a thorough understanding of the present invention. These details are provided for illustrative purposes, and the present invention may be practiced according to the claims without some or all of these specific details. For the purposes of clarity, technical matters known in the art related to the present invention have not been described in detail so as not to unnecessarily obscure the present invention. The present invention is defined by the appended claims.

Claims

1. 1. A memory device, comprising: a plurality of tiles of memory circuitry, each tile including a memory array, which is a physically separated array of storage transistors, electrically connected to and operated by a module control circuit, the memory array having a three dimensional array of storage transistors organized into a plurality of memory pages of the storage transistors, each of the storage transistors being accessed by a word line and a bit line, the module control circuitry communicating with the memory array to perform memory operations on one or more memory pages of the storage transistors; each said tile is individually addressable by an associated said module control circuit and configurable to operate independently of one another to perform memory operations on memory pages of said storage transistors in said memory array in response to memory access commands specified for said tile; A memory device, wherein two or more of the randomly addressed tiles of the memory circuit are configurable to simultaneously perform overlapping memory operations.

2. 2. The memory device of claim 1, the plurality of tiles of the memory circuit are formed on a semiconductor substrate; a memory device, wherein each tile includes an array of physically isolated storage transistors formed above a plane of the semiconductor substrate, and the modular control circuitry formed below the memory array on or within the semiconductor substrate.

3. 2. The memory device of claim 1, the plurality of tiles of the memory circuit include a plurality of arrays of the physically isolated storage transistors formed on a first semiconductor die and corresponding modular control circuitry for the arrays of storage transistors formed on a second semiconductor die; The memory device, wherein the first semiconductor die is electrically and mechanically connected to the second semiconductor die, whereby each of the memory arrays and associated modular control circuitry forms a tile of the memory device.

4. 2. The memory device of claim 1, the plurality of tiles of the memory circuit including a plurality of the physically isolated arrays of storage transistors, at least a portion of the module control circuitry formed on a first semiconductor die, and remaining corresponding module control circuitry for the arrays of storage transistors formed on a second semiconductor die; The first semiconductor die is electrically and mechanically connected to the second semiconductor die, whereby each memory array having a portion of the module control circuitry and associated module control circuitry forms a tile of the memory device.

5. 2. The memory device of claim 1, Each of the memory access commands is based on an access unit of memory data; the access unit is a memory page, The memory device, wherein the modular control circuitry of the tile performs a memory operation on the memory page of the storage transistor in response to each memory access command specified for the tile.

6. 6. The memory device of claim 5, the memory data access unit includes 512 bits; The memory page of storage transistors includes 512 storage transistors.

7. 2. The memory device of claim 1, 10. The memory device of claim 9, wherein each of the physically separated memory arrays in each of the tiles includes storage transistors arranged in the three-dimensional array and one or more staircase structures connecting the storage transistors to the modular control circuitry.

8. 8. The memory device of claim 7, each said physically separate memory array within each said tile includes a three-dimensional array of randomly accessible NOR memory strings of storage transistors; The one or more staircase structures connect bit lines of the NOR memory strings to the module control circuitry.

9. 9. The memory device of claim 8, In each of the memory arrays, each word line activates a first number of memory pages; The module control circuit selects bit lines associated with a first memory page of the storage transistors to perform a memory operation in response to the memory access command.

10. 2. The memory device of claim 1, A memory device, wherein each of the plurality of tiles of the memory circuit includes a semi-volatile memory circuit.

11. 11. The memory device of claim 10, The memory device, wherein the storage transistors of the semi-volatile memory circuits in each of the memory arrays are refreshed at intervals of 10 minutes or more.

12. 11. The memory device of claim 10, The memory device, wherein the storage transistors in each of the memory arrays each include a storage material that is programmable by a direct tunneling technique.

13. 11. The memory device of claim 10, The memory device, wherein the storage transistors in each memory array each include a ferroelectric storage transistor.

14. 9. The memory device of claim 8, the three-dimensional array of NOR memory strings is arranged in parallel in a first direction and stacked in multiple layers in a second direction; Each of the NOR memory strings includes a plurality of storage transistors that share a common source line and a common drain line; Each layer of the NOR memory string extends along a third direction, The array of NOR memory strings includes: (i) a plurality of local word line structures formed between adjacent stacks of the NOR memory strings; (ii) a plurality of word lines formed over the three-dimensional array and extending in the first direction, each word line connected to a respective subset of the local word line structures; each said storage transistor is formed at a junction between each said NOR memory string and each said local word line structure; each said storage transistor including: (i) a channel region formed between a common source layer and a common drain layer; (ii) a gate dielectric layer; and (iii) said local word line structure as a gate conductor.

15. 15. The memory device of claim 14, The memory device, wherein each of the module control circuits has the same dimensions in the first direction and the third direction as its associated memory array.

16. 2. The memory device of claim 1, the module control circuits of the plurality of tiles interact with a memory controller integrated circuit formed on another semiconductor substrate; each module control circuit within the tile receives the memory access command designated for the tile along with a memory address associated with the command; The memory address specifies a memory page within the memory array for performing a memory operation specified by the memory access command.

17. 17. The memory device of claim 16, each said memory access command specifies a memory operation, including a read, write, and refresh operation; The memory access command provides write data along with a write operation command.

18. 17. The memory device of claim 16, each said physically separate memory array within each said tile includes a three-dimensional array of randomly accessible NOR memory strings of storage transistors; the one or more staircase structures connecting the bit lines of the NOR memory strings to the module control circuitry, and each module control circuit in the plurality of tiles is a complete control circuit replicated for each of the tiles.

19. 8. The memory device of claim 7, Each of the module control circuits a bit line driver circuit connected to the bit lines of the memory array via the staircase structure, for selecting a bit line of a memory page designated by a memory address and a driving bias voltage in response to a memory operation designated by the memory access command; a word line driver circuit connected to select a word line of the memory array to activate the first number of memory pages of storage transistors; the bit line driver circuit is located in a portion of the module control circuit below the staircase structure of the memory array; The memory device, wherein the word line driver circuit is disposed in a central portion of the module control circuit.

20. 20. The memory device of claim 19, the module control circuitry of the designated tile responds to a memory address associated with the memory access command by selecting one of the word lines in the memory array via the word line driver circuitry to activate the first number of memory pages; The module control circuitry further selects bit lines of one memory page from the first number of activated memory pages to perform a memory operation indicated by the associated memory access command.

21. 20. The memory device of claim 19, each module control circuit within the tile further comprises tile logic circuitry including a processor unit that decodes the memory access command and executes a sequence of memory operations on the memory array of the tile to perform the memory operation specified by the command; The tile logic circuitry executes a memory operation sequence for each of the memory access commands and generates control signals for controlling a timing sequence for executing the memory operation sequence.

22. 20. The memory device of claim 19, each module control circuit in the tile further comprises a sense amplifier circuit for the selected bit line of the bit line driver circuit for sensing or driving the selected bit line in response to the memory access command; the sense amplifier circuit includes a second number of sense amplifiers; the second number is equal to the number of data bits in an access unit of memory data associated with the memory access command; The memory device, wherein the access unit is equal to a memory page.

23. 23. The memory device of claim 22, a plurality of data latches configured to store read data retrieved from the memory array in response to a read operation and to store write data to be stored in the memory array in response to a write operation.

24. 1. A memory module, comprising: a plurality of semiconductor memory dies, each semiconductor memory die including a three dimensional array of storage transistors divided into a plurality of partitions, corresponding partitions across the plurality of semiconductor memory dies forming a memory channel, the plurality of partitions across the plurality of semiconductor memory dies forming a first number of memory channels that are independently accessible from one another; a memory controller die including memory control circuitry for accessing and operating the plurality of semiconductor memory dies, the plurality of semiconductor memory dies being connected to the memory controller die via a first set of interconnect structures, the memory control circuitry including a first number of channel controllers, each channel controller connected to operate one of the memory channels to perform memory operations on storage transistors associated with the respective memory channel independently of and in parallel with memory operations performed on the storage transistors of the other memory channels.

25. 25. The memory module of claim 24, the plurality of semiconductor memory dies are stacked one on top of the other; the stacked semiconductor memory die is formed stacked on the memory controller die; The memory module, wherein the first set of interconnect structures electrically connects the plurality of stacked semiconductor memory dies to the memory controller die.

26. 26. The memory module of claim 25, The stacked semiconductor memory dies are connected to one another via a second set of interconnect structures.

27. 27. The memory module of claim 26, the first set of interconnect structures includes one of a through silicon via (TSV), a hybrid bond, a copper stud, and an interposer; The memory module, wherein the second set of interconnect structures includes through-silicon vias (TSVs).

28. 28. The memory module of claim 27, the first set of interconnect structures includes a first number of sets of through silicon vias (TSVs); a memory module, wherein each set of the through silicon vias (TSVs) connects the respective partitions across the plurality of semiconductor memory dies to the respective channel controllers on the memory controller die;

29. 25. The memory module of claim 24, each said semiconductor memory die includes a memory array of semi-volatile storage transistors formed on a semiconductor substrate; the memory array is configured as a two-dimensional array of tiles formed on the semiconductor substrate; The memory module, wherein the storage transistors in each tile are arranged in a three-dimensional array of NOR memory strings.

30. 30. The memory module of claim 29, A memory module, wherein each of the sections of the three-dimensional array of storage transistors forms a portion of a tile of the memory array.

31. 25. The memory module of claim 24, each said channel controller communicating with a respective memory channel via a memory interface; The memory module, wherein the memory interface includes at least one command bus and at least one data bus.

32. 25. The memory module of claim 24, each said channel controller sending commands to a respective memory channel to perform memory operations; The commands include at least a read command and a write command.

33. 25. The memory module of claim 24, the memory controller further includes an address translation circuit configured to process input requests received by the memory module; each said input request includes a logical memory address; the address translation circuitry of the memory controller translates the logical memory addresses into physical memory addresses that identify the storage transistors within the semiconductor memory die; The memory module, wherein the physical memory address includes one or more address bits for selecting a respective memory channel from the plurality of memory channels.

34. 34. The memory module of claim 33, The one or more address bits of the physical memory address for selecting a memory channel include lower order address bits of the physical memory address.

35. 34. The memory module of claim 33, The physical memory address is address bits for selecting a memory channel from the plurality of memory channels; address bits for selecting a memory die from the plurality of semiconductor memory dies; address bits for selecting a memory bank from the tile within each partition; address bits for selecting a row of the storage transistors within the memory bank; and address bits for selecting a subset of the storage transistors from the row of storage transistors to form a memory page.

36. 25. The memory module of claim 24, the plurality of semiconductor memory dies includes K+1 semiconductor memory dies, K of the semiconductor memory dies providing a designated memory capacity of the memory module, one of the semiconductor memory die providing redundant memory capacity; an input request to the memory module is addressed to a memory address space that spans the K semiconductor memory dies and excludes the semiconductor memory die that provides the redundant memory capacity;

37. 37. The memory module of claim 36, the memory controller further includes an address translation circuit configured to process input requests received by the memory module; each of the input requests includes a logical memory address that targets the memory address space of the K semiconductor memory dies; The memory module, wherein the address translation circuitry of the memory controller translates the logical memory addresses into physical memory addresses that identify corresponding storage transistors within the K+1 semiconductor memory dies.

38. 38. The memory module of claim 37, the address translation circuitry translates a first logical memory address targeted to the memory address space of the K semiconductor memory dies to the physical memory address within the memory address space spanning the K+1 semiconductor memory dies.

39. 1. A memory module, comprising: a plurality of semiconductor memory dies, each semiconductor memory die including a plurality of memory arrays, each memory array including a three-dimensional array of storage transistors, the plurality of semiconductor memory dies including a first number of semiconductor memory dies providing a designated memory capacity of the memory module and at least one spare semiconductor memory die providing redundant memory capacity; a memory controller die including memory control circuitry that accesses and operates the plurality of semiconductor memory dies to perform memory operations, the plurality of semiconductor memory dies being connected to the memory controller die via a first set of interconnect structures; the memory controller die receives input requests from a host processor for memory operations addressed to a first memory address space spanning the first number of semiconductor memory dies and excluding the memory space of the at least one spare semiconductor memory die.

40. 40. The memory module of claim 39, the memory controller die is configured to initiate replacement of the memory arrays in the first number of semiconductor memory dies with redundant memory arrays in the at least one spare semiconductor memory die in response to detecting a predetermined condition in the memory arrays.

41. 41. The memory module of claim 40, The memory module, wherein the memory controller die performs memory operations on the memory array within a second memory address space that spans both the first number of semiconductor memory dies and the at least one spare semiconductor memory die.

42. 40. The memory module of claim 39, the first number of semiconductor memory dies includes K semiconductor memory dies, which together with the spare semiconductor memory die form a group of K+1 semiconductor memory dies; the first number of semiconductor memory dies define the first memory address space; The group of K+1 semiconductor memory dies defines a second memory address space.

43. 43. The memory module of claim 42, the memory controller die further includes an address translation circuit configured to process input requests received by the memory module; each said input request includes a logical memory address directed to said first memory address space; The memory module, wherein address translation circuitry of the memory controller die translates the logical memory addresses into physical memory addresses that identify corresponding storage transistors within the K+1 semiconductor memory die.

44. 44. The memory module of claim 43, The address translation circuitry translates first logical memory addresses directed to the first memory address space to physical memory addresses within the second memory address space.

45. 40. The memory module of claim 39, The plurality of semiconductor memory dies are stacked together to form a memory module and connected to each other via a second set of interconnect structures.

46. 46. The memory module of claim 45, the first set of interconnect structures includes one of a through silicon via (TSV), a hybrid bond, a copper stud, and an interposer; The memory module, wherein the second set of interconnect structures includes through-silicon vias (TSVs).

47. 43. The memory module of claim 42, The memory controller die communicates with the host processor via the first memory address space and manages memory operations via the second memory address space.

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