Exposure device, exposure method and article manufacturing method

Abstract

To provide an exposure device which is advantageous for improving productivity.SOLUTION: An exposure device for scanning and exposing a plurality of shot regions on a substrate has a stage for holding the substrate, and a control part for controlling drive of the stage on the basis of a first acceleration profile used in control of acceleration of the stage in a non-exposure section where the shot regions are not exposed, and a second acceleration profile used in control of acceleration of the stage in an exposure section where the shot region is exposed, wherein the second acceleration profile includes a waveform profile, and the control part controls the drive of the stage using the second acceleration profile in which at least one of angular velocity in the waveform profile and a phase of the waveform profile to which the first acceleration profile is connected is determined on the basis of information on the size of the shot region.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article. [Background technology]

[0002] In the lithography process for manufacturing devices such as semiconductor elements, an exposure apparatus is used to transfer the pattern of an original (reticle or mask) onto a substrate via a projection optical system. One such exposure apparatus is a scanning exposure apparatus that employs the so-called step-and-scan method, in which the original and substrate are scanned relative to each other to expose the substrate (scanning exposure), thereby transferring the pattern of the original onto the substrate.

[0003] In a scanning exposure apparatus, it is common to scan and expose a substrate while driving the substrate at a constant speed, but it has also been proposed to scan and expose a substrate while driving the substrate with acceleration and deceleration (acceleration or deceleration) (see Patent Document 1). Patent Document 1 discloses a technology for shortening the drive time of the stage (substrate) and improving productivity (throughput) by scan-exposing the substrate while accelerating and decelerating the stage that holds the substrate according to a drive (acceleration) profile made up of a sine wave. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5406861 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the conventional technology, the drive profile is not changed for each shot area regardless of the shot layout of the substrate (the arrangement of shot areas on the substrate).In the conventional technology, a drive profile that is optimal for scanning and exposing the shot area with the largest shot size is set as a drive profile common to multiple shot areas on the substrate.

[0006] The present invention has been made in view of the above problems of the conventional technology, and has an exemplary object to provide an exposure apparatus that is advantageous in improving productivity. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, an exposure apparatus as one aspect of the present invention is an exposure apparatus that scans and exposes a plurality of shot areas on a substrate, and includes: a stage that holds the substrate; and a control unit that controls driving of the stage based on a first acceleration profile used to control the acceleration of the stage in a non-exposure section where the shot areas are not exposed, and a second acceleration profile used to control the acceleration of the stage in an exposure section where the shot areas are exposed, wherein the second acceleration profile includes a waveform profile, and the control unit controls driving of the stage using the second acceleration profile, in which at least one of the angular velocity in the waveform profile and the phase of the waveform profile to which the first acceleration profile is connected is determined based on information related to the size of the shot areas.

[0008] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, for example, it is possible to provide an exposure apparatus that is advantageous in improving productivity. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram showing the configuration of an exposure apparatus according to one aspect of the present invention. [Figure 2] 10A and 10B are diagrams showing the movement locus of an exposure slit when scanning exposure is performed with a conventional drive profile. [Figure 3] 3 is a diagram showing an example of a drive profile of the substrate stage relative to the movement trajectory shown in FIG. 2. FIG. [Figure 4] FIG. 1 is a diagram showing an example of a shot layout of a substrate. [Figure 5] FIG. 10 is a diagram showing the movement locus of an exposure slit. [Figure 6] FIG. 4 is a diagram showing an example of a drive profile of the substrate stage. [Figure 7] FIG. 4 is a diagram showing an example of a drive profile of the substrate stage. [Figure 8] FIG. 10 is a diagram showing the movement locus of an exposure slit. [Figure 9] FIG. 4 is a diagram showing an example of a drive profile of the substrate stage. [Figure 10] 2 is a flowchart for explaining exposure processing in the exposure apparatus shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0012] 1 is a schematic diagram showing the configuration of an exposure apparatus 100 according to one aspect of the present invention. Exposure apparatus 100 is a lithography apparatus used in a lithography process, which is a manufacturing process for devices such as semiconductor elements, and forms a pattern on a substrate using an original (reticle or mask). Exposure apparatus 100 is a scanning exposure apparatus (scanner) that employs a step-and-scan method in which the original and substrate are scanned relative to each other to expose the substrate (scanning exposure), thereby transferring the pattern of the original onto the substrate.

[0013] In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system, with the Z axis being the direction along the optical axis of a projection optical system 14 (described later), and the X and Y axes being directions parallel to a plane perpendicular to the Z axis and perpendicular to each other. Furthermore, the directions parallel to the X, Y, and Z axes in the XYZ coordinate system are referred to as the X, Y, and Z directions, respectively. Hereinafter, the Z direction may be referred to as the height direction. In this embodiment, the direction in which the original and the substrate are scanned relatively (scanning direction) is referred to as the Y direction (+Y direction or −Y direction).

[0014] 1, exposure apparatus 100 has an illumination optical system 11, an original stage 13 that holds an original 12, a projection optical system 14, and a substrate stage 16 that holds a substrate 15. Exposure apparatus 100 also has a surface position measurement unit 17, a first measurement unit 18, a second measurement unit 19, a control unit 20, an original detection unit 21, and a substrate detection unit 22.

[0015] The control unit 20 is configured, for example, by a computer (information processing device) including a processor such as a CPU, a memory, etc., and controls all parts of the exposure apparatus 100 in accordance with a program stored in the storage unit. In this embodiment, the control unit 20 controls the process of transferring the pattern of the original 12 to the substrate 15 while scanning the original 12 and the substrate 15 relatively, i.e., controls the scanning exposure of the substrate 15.

[0016] The illumination optical system 11 includes a light-blocking member such as a masking blade, and shapes light emitted from a light source (not shown) such as an excimer laser into, for example, a strip-shaped or arc-shaped light (slit light) having its longitudinal direction in the X direction, and illuminates a part of the original 12 with this light.

[0017] The original 12 and substrate 15 are held by an original stage 13 and a substrate stage 16, respectively, and are arranged at optically conjugate positions (the object plane and image plane of the projection optical system 14) via the projection optical system 14.

[0018] The projection optical system 14 has a predetermined projection magnification (for example, 1 / 2 or 1 / 4), and projects the pattern formed on the original 12 onto the substrate 15. The area of the substrate 15 onto which the pattern of the original 12 is projected (i.e., the area irradiated with the slit light) will be referred to below as the exposure slit.

[0019] The original stage 13 and the substrate stage 16 are configured to be drivable in a direction (e.g., the Y direction) perpendicular to the optical axis (optical axis of the slit light) of the projection optical system 14. The original stage 13 and the substrate stage 16 are driven (scanned) relatively in synchronization with each other at a speed ratio according to the projection magnification of the projection optical system 14. This allows the exposure slit to be scanned over the substrate, transferring the pattern of the original 12 onto (a shot area of) the substrate 15. By repeating this scanning exposure sequentially for each of the multiple shot areas on the substrate, the exposure process for one substrate 15 is completed.

[0020] The first measurement unit 18 includes, for example, a laser interferometer, and measures the position of the original stage 13. The laser interferometer included in the first measurement unit 18 measures the displacement of the original stage 13 from a reference position by, for example, irradiating a reflector 13a provided on the original stage 13 with laser light and detecting the laser light reflected by the reflector 13a. The first measurement unit 18 can obtain the current position of the original stage 13 based on the displacement of the original stage 13 from the reference position.

[0021] The second measurement unit 19 includes, for example, a laser interferometer, and measures the position of the substrate stage 16. The laser interferometer included in the second measurement unit 19 measures the displacement of the substrate stage 16 from a reference position by, for example, irradiating a reflector 16a provided on the substrate stage 16 with laser light and detecting the laser light reflected by the reflector 16a. The second measurement unit 19 can obtain the current position of the substrate stage 16 based on the displacement of the substrate stage 16 from the reference position.

[0022] The control unit 20 controls the driving of the original stage 13 and the substrate stage 16 in the X and Y directions based on the current position of the original stage 13 acquired by the first measurement unit 18 and the current position of the substrate stage 16 acquired by the second measurement unit 19. In this embodiment, the first measurement unit 18 and the second measurement unit 19 each use a laser interferometer to measure the position of the original stage 13 and the position of the substrate stage 16, but this is not limiting and an encoder, for example, may also be used.

[0023] The surface position measurement unit 17 includes, for example, a light projecting unit that projects light onto the surface of the substrate 15 and a light receiving unit that receives light reflected from the surface of the substrate 15, and measures the height (position in the Z direction) of the surface of the substrate 15.

[0024] The master detection unit 21 detects alignment marks provided on the master 12 and alignment marks provided on the master stage 13. The control unit 20 calculates the relative positions of the alignment marks detected by the master detection unit 21 to determine the positional deviation (amount of positional deviation) of the master 12 with respect to the master stage 13. By providing multiple alignment marks in the X direction on each of the master 12 and the master stage 13, it becomes possible to determine the positional deviation of the master 12 with respect to the master stage 13 in the X, Y, and θ directions.

[0025] Substrate detection unit 22 detects a plurality of alignment marks provided in a sample shot area among a plurality of shot areas on the substrate. Control unit 20 calculates and processes the detection results of substrate detection unit 22 to obtain arrangement information (shot layout) of the plurality of shot areas on the substrate.

[0026] In this embodiment, the original detection unit 21 and the substrate detection unit 22 are configured as off-axis systems that detect each mark without using the projection optical system 14, but this is not limiting. For example, the original detection unit 21 and the substrate detection unit 22 may be configured as TTL (Through The Lens) systems that detect each mark via the projection optical system 14.

[0027] 2 and 3, a description will be given of a drive profile of the substrate stage 16 for achieving scanning exposure of the substrate 15 while driving the substrate 15 with acceleration or deceleration (acceleration or deceleration). The drive profile is used by the control unit 20 to control the driving of the substrate stage 16. FIG. 2 is a diagram showing the movement trajectory of an exposure slit that moves relatively over the substrate 15 when the substrate stage 16 is driven based on a conventional drive profile. FIG. 3 is a diagram showing an example of a drive profile of the substrate stage 16 with respect to the movement trajectory of the exposure slit shown in FIG. 2. In FIG. 3, graph GP1 (upper graph) is an acceleration profile of the substrate stage 16 that shows the time-series change in the acceleration of the substrate stage 16 in the Y direction. Also, in FIG. 3, graph GP2 (lower graph) is a velocity profile of the substrate stage 16 that shows the time-series change in the velocity of the substrate stage 16 in the Y direction.

[0028] When scanning exposure is performed on the shot area N to be exposed, the velocity of the substrate stage 16 is accelerated to a desired velocity in the non-exposure section 201. The non-exposure section 201 includes a constant acceleration section and a section in which the acceleration is changed to the desired acceleration using a linear or higher function, and is configured by a combination of two corresponding drive profiles. In the non-exposure section 201, the substrate stage 16 is accelerated at an acceleration higher than the start acceleration of the exposure section 202, which has the effect of shortening the time it takes for the substrate stage 16 to accelerate to the desired velocity.

[0029] In the exposure section 202, the shot area N is scanned and exposed while the substrate stage 16 is driven based on an acceleration profile of a portion of a sine wave, specifically, a half-cycle (phase 0 to π) of the sine wave. After that, the exposure section 202 is connected to the non-exposure section 203. Therefore, the phase at which the drive profile in the exposure section 202 and the drive profile in the non-exposure section 203 are connected is 0 or π. The angular velocity ωsin of the drive profile in the exposure section 202 (a drive profile formed from a portion of a sine wave) is calculated by dividing the phase π by the drive time Tsin of the substrate stage 16 in the exposure section 202. The drive time Tsin is calculated by dividing the average velocity Vave of the substrate stage 16 in the exposure section 202 by (the shot angle of view Yd of the shot area N + the slit size Ysilt of the exposure slit). Note that a settling time for the substrate stage 16 (a waiting time until the deviation of the substrate stage 16 converges) may be provided in the exposure section 202, and the shot area N may be scanned and exposed in a portion of the exposure section 202. Furthermore, by changing the start acceleration of the exposure section 202, the rate of change in speed of the substrate stage 16 during scanning exposure can be set arbitrarily.

[0030] The irradiation (accumulated) exposure amount of light (exposure light) irradiated onto the substrate 15 from a light source (not shown) must always be constant. Therefore, the shot area N is scanned and exposed while the exposure amount is changed in accordance with changes in the speed of the substrate stage 16. For example, the exposure amount is controlled so that when the speed of the substrate stage 16 is fast, the exposure amount is large, and when the speed of the substrate stage 16 is slow, the exposure amount is small.

[0031] In the non-exposure section 203, the substrate stage 16 is decelerated based on a drive profile that is the same as that in the non-exposure section 201 but with an inverted sign, while the substrate stage 16 is step-driven in the X direction to scan and expose the next exposure target shot area N+1. In the non-exposure section 204, the exposure section 205, and the non-exposure section 206, the substrate stage 16 is driven based on drive profiles that are the same as those in the non-exposure section 203, the exposure section 202, and the non-exposure section 201, respectively, but with an inverted sign. This allows the shot areas N and N+1 to be scanned and exposed consecutively, as shown in FIG. 2.

[0032] In conventional technology, regardless of the shot layout of the substrate 15, an optimal drive profile for scanning and exposing the shot area with the largest shot size (exposure area) is set as a drive profile common to multiple shot areas on the substrate. Here, the shot area with the largest shot size is typically a full-field shot area located inside the periphery of the substrate 15. However, the multiple shot areas on the substrate include not only full-field shot areas but also peripheral shot areas located on the periphery of the substrate 15. The peripheral shot areas are partial-field shot areas with a portion missing, and therefore have various shot sizes. Therefore, it is believed that productivity (throughput) can be further improved by determining (setting) an optimal drive profile for each shot area on the substrate.

[0033] Therefore, in this embodiment, as described in the first to third embodiments below, an optimal drive profile is determined for each shot area on the substrate, thereby further improving productivity when scanning and exposing the substrate 15 while accelerating and decelerating the substrate 15.

[0034] First Embodiment A method for determining an optimal drive profile for each shot area on a substrate in the first embodiment will be described with reference to FIGS. 4, 5(a), 5(b), and 6. The drive profile is a profile that defines the drive of the substrate stage 16 and includes, for example, various profiles that control the speed, acceleration, and position of the substrate stage 16. Here, an acceleration profile that controls the acceleration and deceleration of the substrate stage 16 will be described as the drive profile. The drive profile is configured by connecting a first drive profile in a non-exposure section that does not include an exposure section in which the shot area is exposed, and a second drive profile in an exposure section. The first drive profile is an acceleration profile (first acceleration profile) that controls the acceleration and deceleration of the substrate stage 16 in the non-exposure section. The second drive profile is an acceleration profile (second acceleration profile) that controls the acceleration and deceleration of the substrate stage 16 in the exposure section.

[0035] Fig. 4 is a diagram showing an example of a shot layout of substrate 15. As shown in Fig. 4, for example, 98 shot areas are arranged on substrate 15. The numbers written in the shot areas indicate shot numbers, and each shot area is scanned and exposed in the order of the shot numbers (dotted lines). In addition, the arrows written in the shot areas indicate the scanning direction.

[0036] In this embodiment, we focus on shot area S3 of shot number 3 and shot area S4 of shot number 4. Because shot areas S3 and S4 are partial-field shot areas (peripheral shot areas) with some areas outside the substrate, it is not necessary to perform scanning exposure on the entire area as in full-field shot areas. Therefore, as shown in FIGS. 5(a) and 5(b), for shot areas S3 and S4, there is room to shorten the drive distance of the substrate stage 16 in the exposure section by a drive distance Δd. Focusing on shot areas S3 and S4, FIG. 5(a) illustrates the movement trajectory of the exposure slit that moves relatively over the substrate 15 when the substrate stage 16 is driven based on a conventional drive profile (a drive profile common to all shot areas). FIG. 5(b) illustrates the movement trajectory of the exposure slit that moves relatively over the substrate 15 when the substrate stage 16 is driven based on a drive profile determined from (information relating to) the sizes of shot areas S3 and S4 in this embodiment. Fig. 6 is a diagram showing an example of a drive profile of the substrate stage 16 for the movement trajectory shown in Fig. 5(a) and Fig. 5(b). In Fig. 6, graph GP3 (upper graph) shows the drive profile (acceleration profile) for the movement trajectory shown in Fig. 5(a), and graph GP4 (lower graph) shows the drive profile (acceleration profile) for the movement trajectory shown in Fig. 5(b).

[0037] Consider the case where shot areas S3 and S4 are scanned and exposed while driving the substrate stage 16 based on the conventional drive profile (graph GP3). In this case, the drive profile in exposure sections 202 and 205 is the same as the drive profile used when scanning and exposing the shot area with the largest shot size (full-field shot area). However, when scanning and exposing shot areas S3 and S4, it is not necessary to drive the substrate stage 16 to scan and expose the section indicated by the drive distance Δd, so the drive distance Δd of the substrate stage 16 can be shortened.

[0038] Therefore, in this embodiment, the drive distance Δd is shortened by connecting the second drive profile in the exposure section 202, which is configured as a half cycle (phase 0 to π) of a sine wave, with the first drive profile in the non-exposure section 203, at the timing when the exposure slit leaves the substrate. In other words, the drive profile is determined by changing the phase that connects the first drive profile and the second drive profile in accordance with (information related to) the size of the shot area so that the drive time of the substrate stage 16 in the exposure section is shortened. Here, the information related to the size of the shot area includes at least information indicating the length of the shot area in the scanning direction. Furthermore, in this embodiment, an example is described in which the second drive profile in the exposure section is configured as a part of a sine wave, but this is not limiting. For example, the second drive profile in the exposure section may be configured as a curve including a function of second degree or higher.

[0039] By changing the phase connecting the second drive profile in the exposure section 202 and the first drive profile in the non-exposure section 203, the drive profile shown in graph GP4 is obtained, and the drive distance Δd can be shortened. Referring to graph GP4, in the scanning exposure of shot area S3, the second drive profile in the exposure section 502 is connected to the first drive profile in the non-exposure section 503 at a phase (<π) that is equal to or less than half the cycle of the sine wave.

[0040] Furthermore, in the scanning exposure of shot area S4, as shown in graph GP3, the driving distance Δd is shortened by connecting the first driving profile in non-exposure section 204 and the second driving profile in exposure section 205 with a phase > 0 rather than connecting them with a phase of zero. In the scanning exposure of shot area S4, the driving profile shown in graph GP4 is obtained by connecting the first driving profile in non-exposure section 504 and the second driving profile in exposure section 505 with a phase > 0.

[0041] In this embodiment, the drive profile (phase connecting the first drive profile and the second drive profile) for shot area N to be exposed is determined by the time scanning exposure of shot area N-2 is completed in control unit 20. Furthermore, before scanning exposure of substrate 15 begins, the drive profile (phase connecting the first drive profile and the second drive profile) for each shot area may be determined in advance.

[0042] In this manner, in this embodiment, by determining an optimal drive profile for each shot area on the substrate, the drive distance (drive time) of the substrate stage 16 required for scanning exposure is shortened, thereby further improving productivity. Note that the method of changing the phase connecting the first drive profile in the non-exposure section and the second drive profile in the exposure section for each shot area on the substrate has the advantage that the same location in each shot area can be scanned and exposed with the same acceleration. For example, setting the acceleration when scanning and exposing the center of each shot area to zero is advantageous when performing various corrections.

[0043] In addition, in this embodiment, it can be said that the driving distance in the scanning direction of the substrate stage 16 when exposing a partial field shot area is shorter than the driving distance in the scanning direction of the substrate stage 16 when exposing a full field shot area. Therefore, one aspect of the present invention also includes a configuration in which a driving profile that realizes such driving of the substrate stage 16 is obtained from an external device, and the substrate 15 is exposed while driving the substrate stage 16 based on this driving profile. Here, a partial field shot area can be considered to be a shot area whose length in the scanning direction is shorter than a predetermined reference length. Furthermore, the reference length may be set to, for example, the length in the scanning direction of the full field shot area.

[0044] Furthermore, connecting the first drive profile in the non-exposure section and the second drive profile in the exposure section at a phase other than zero or π may cause discontinuity in the differential value of the acceleration profile, potentially reducing the control accuracy (deviation) of the substrate stage 16. In such cases, the phase connecting the first drive profile in the non-exposure section and the second drive profile in the exposure section may be determined taking into account the settling time of the substrate stage 16. Note that the first drive profile in the non-exposure section may be changed so that the discontinuity in the differential value of the acceleration profile becomes smaller (smoother).

[0045] Second Embodiment A method for determining an optimal drive profile for each shot area on a substrate in the second embodiment will be described with reference to Figures 5(a), 5(b), and 7. Figure 7 is a diagram showing an example of a drive profile of the substrate stage 16 for the movement trajectory shown in Figures 5(a) and 5(b). In Figure 7, graph GP5 (upper graph) shows the drive profile (acceleration profile) for the movement trajectory shown in Figure 5(a), and graph GP6 (lower graph) shows the drive profile (acceleration profile) for the movement trajectory shown in Figure 5(b).

[0046] In this embodiment, the drive profile shown in graph GP6 is obtained by changing the angular velocity ωsin of the drive profile (drive profile consisting of a portion of a sine wave) in the exposure sections 202 and 205 for the drive profile shown in graph GP5. In the drive profile shown in graph GP, the angular velocity ωa (>ωsin) of the drive profile in the exposure sections 502 and 505 is changed according to (information relating to) the sizes of the shot areas S3 and S4. The angular velocity ωa of the drive profile (drive profile consisting of a portion of a sine wave) in the exposure sections 502 and 505 is calculated by the phase π / the drive time Ta of the substrate stage 16 in the exposure sections 502 and 505. The drive time Ta is calculated by (the shot angle of view Yd of the shot areas S3 and S4 + the slit size Ysilt of the exposure slit - the drive distance Δd) / the average velocity Vave of the substrate stage 16 in the exposure sections 502 and 505. Furthermore, when determining the angular velocity ωa, a frequency lower than the natural frequency of the substrate stage 16 is set.

[0047] In this embodiment, the second drive profile (the angular velocities of the sine waves constituting it) for shot area N to be exposed is determined by the control unit 20 before scanning exposure of shot area N-2 is completed. Furthermore, the second drive profile (the angular velocities of the sine waves constituting it) for each shot area may be determined in advance before scanning exposure of substrate 15 is started.

[0048] The method of changing the angular velocity of the sine wave that constitutes the second drive profile in accordance with the size of the shot area to be exposed has the advantage that the first drive profile and the second drive profile can be connected with a phase of zero or π, which prevents discontinuities in the differential value of the acceleration profile and enables stable stage control.

[0049] In this way, in this embodiment, by determining the optimal drive profile for each shot area on the substrate, the drive distance (drive time) of the substrate stage 16 required for scanning exposure is shortened, thereby making it possible to further improve productivity.

[0050] Third Embodiment A method for determining an optimum drive profile for each shot area on a substrate in the third embodiment will be described with reference to FIGS. 4, 8(a), 8(b), and 9. FIG.

[0051] 4, in this embodiment, attention is focused on shot area S84 of shot number 84 and shot area S85 of shot number 85. Shot areas S84 and S85 have a positional relationship that includes a line feed section as a non-exposure section when scanning and exposing each of them. Here, the line feed section is a section in which, after exposing the shot area (S84) arranged in the first row among the multiple shot areas on the substrate, the substrate stage 16 is driven to expose a shot area (S85) arranged in a second row different from the first row. Furthermore, because shot area S85 is a partial field shot area (peripheral shot area) part of which is outside the substrate, there is room for shortening the driving distance (time) of the substrate stage 16.

[0052] 8(a) is a diagram showing the movement trajectory of the exposure slit when the shot areas S84 and S85 are scanned and exposed while the substrate stage 16 is driven based on a conventional drive profile. FIG. 8(b) is a diagram showing the movement trajectory of the exposure slit when the shot areas S84 and S85 are scanned and exposed while the substrate stage 16 is driven based on a drive profile determined from the sizes of the shot areas S84 and S85 in this embodiment. FIG. 9 is a diagram showing an example of the drive profile of the substrate stage 16 for the movement trajectory shown in FIGS. 8(a) and 8(b). In FIG. 9, graph GP7 (upper graph) shows the drive profile (acceleration profile) for the movement trajectory shown in FIG. 8(a), and graph GP8 (lower graph) shows the drive profile (acceleration profile) for the movement trajectory shown in FIG. 8(b).

[0053] 9 (graphs GP7 and GP8), the substrate stage 16 is driven based on a conventional drive profile in a non-exposure section 801 and an exposure section 802. The non-exposure section 803 includes a line feed section made up of a sine wave with one cycle (phase 0 to 2π), a section in which the acceleration is changed to a desired acceleration using a function of one degree or higher, and a constant acceleration section, and is made up of a combination of three corresponding drive profiles, respectively.

[0054] The next exposure target shot area S85 (the area outside the substrate) does not need to be scanned and exposed across its entire area as in a full-field shot area, so the drive distance of the substrate stage 16 can be reduced by drive distance Δd. Accordingly, the drive distance of the substrate stage 16 in the line feed section can also be reduced by drive distance Δd.

[0055] In the non-exposure section 813 including the line feed section, the angular velocity ωb of the drive profile in the non-exposure section 803 is changed to angular velocity ωc (ωb<ωc), thereby shortening the drive distance of the substrate stage 16 in the line feed section. In addition, when determining the angular velocity ωc, it is set to a frequency lower than the natural frequency of the substrate stage 16.

[0056] The first drive profile (the angular velocity of the sine wave constituting it) in the line feed section for shot area N to be exposed is determined by the time scanning exposure of shot area N-2 is completed in control unit 20. Furthermore, the first drive profile (the angular velocity of the sine wave constituting it) in the line feed section for each shot area may be determined in advance before scanning exposure of substrate 15 is started.

[0057] In this embodiment, the angular velocity of the sine wave that constitutes the first drive profile in the line break section is changed, but it is also possible to change the phase that connects the first drive profile and the second drive profile without changing the angular velocity, as in embodiment 1. Furthermore, the first drive profile in the line break section may be configured not with a sine wave but with a function of first or higher order and a constant acceleration section, and the profile in the function of first or higher order and the constant acceleration section may be determined depending on the drive distance in the line break section.

[0058] In the scanning exposure of shot area S85, as in the first embodiment, the first drive profile in the non-exposure section 804 and the second drive profile in the exposure section 805 are connected with a phase > 0 rather than with a phase of zero, thereby shortening the drive distance Δd. By connecting the first drive profile in the non-exposure section 804 and the second drive profile in the exposure section 805 with a phase > 0, the drive profile shown in graph GP8 is obtained. Referring to graph GP8, in the scanning exposure of shot area S85, the second drive profile in the exposure section 815 is connected with the first drive profile in the non-exposure section 814 with a phase > 0.

[0059] In this embodiment, a case has been described in which the phase to be connected to the drive profile (second drive profile configured as part of a sine wave) in the exposure section 815 is changed, but the present invention is not limited to this. For example, as in the second embodiment, the angular velocity of the sine wave that configures the drive profile in the exposure section 815 may be changed.

[0060] In this manner, in this embodiment, a first drive profile for the non-exposure section and a second drive profile for the exposure section are determined for each shot area on the substrate, which reduces the drive distance (drive time) of the substrate stage 16 required for scanning exposure, thereby further improving productivity.

[0061] <Fourth embodiment> The operation of exposure apparatus 100, that is, the exposure process (exposure method), will be described with reference to Figure 10. As described above, the exposure process is performed by control unit 20 comprehensively controlling each part of exposure apparatus 100.

[0062] In S102, the substrate 15 is carried into the exposure apparatus 100. Specifically, the substrate 15 is carried by a carrying hand (not shown), and the substrate 15 is held by the substrate stage 16.

[0063] In S104, pre-alignment (pre-measurement and correction) for global alignment is performed. Specifically, a low-magnification field alignment optical system (not shown) is used to measure and correct deviations such as rotation errors of the substrate 15 so that the alignment mark on the substrate falls within the measurement range of a high-magnification field alignment optical system (not shown) used in global alignment.

[0064] In S106, global tilt is performed. Specifically, the surface heights (surface positions) of a plurality of measurement points on the substrate are measured using the surface position measurement unit 17. Then, based on the surface positions measured by the surface position measurement unit 17, the overall tilt of the substrate 15 is calculated and corrected.

[0065] In S108, a pre-adjustment is performed to measure the surface position of the substrate 15 in real time by scanning exposure. The pre-adjustment includes, for example, adjusting the light intensity of the light source of the surface position measurement unit 17 and storing the pattern step (pattern offset) in the shot area on the substrate.

[0066] In S110, the projection optical system 14 is adjusted. Specifically, the tilt, field curvature, and the like of the projection optical system 14 are determined using a light intensity sensor and a reference mark (not shown) arranged on the substrate stage 16 and a reference plate (not shown) arranged on the original stage 13. For example, the change in the amount of exposure light when the substrate stage 16 is driven in the X, Y, and Z directions is measured by a light intensity sensor arranged on the substrate stage 16. Then, the amount of deviation of the reference mark from the reference plate is determined based on the change in the amount of exposure light, and the projection optical system 14 is adjusted.

[0067] In S112, global alignment is performed. Specifically, a high-magnification field alignment optical system is used to detect alignment marks on the substrate, and the overall amount of misalignment of the substrate 15 and the amount of misalignment common to each shot area are determined. To detect the alignment marks with high accuracy, the alignment marks must be positioned at a position where the contrast of the alignment marks is best (best contrast position). The best contrast position can be measured using the surface position measurement unit 17 and the alignment optical system. For example, the substrate stage 16 is driven to a predetermined height (position in the Z direction), the contrast is measured using the alignment optical system, and the surface position of the substrate 15 is measured using the surface position measurement unit 17. The contrast measurement results for each position of the substrate stage 16 in the Z direction and the measurement results of the surface position of the substrate 15 are associated and saved. Then, based on the multiple contrast measurement results, the position of the substrate stage 16 in the Z direction where the contrast is highest is determined and designated as the best contrast position.

[0068] In S114, a drive profile for the substrate stage 16 when scanning and exposing each shot area on the substrate is determined (first step). As described above, the drive profile is constructed by connecting a first drive profile in a non-exposure section that does not include an exposure section in which the shot area is exposed, and a second drive profile in an exposure section. Specifically, as described in the first to third embodiments, a drive profile (first drive profile and second drive profile) is determined for each of the multiple shot areas on the substrate 15 based on information about the size of the shot area.

[0069] In S116, the shot area to be exposed on the substrate 15 is scanned and exposed (second step). Specifically, the shot area on the substrate 15 is scanned and exposed while driving (accelerating and decelerating) the substrate stage 16 based on the drive profile determined in S114. At this time, exposure on the best focus surface can be achieved by driving the substrate stage 16 for focus leveling while measuring the surface position of the shot area on the substrate 15 in real time with the surface position measurement unit 17.

[0070] In S118, it is determined whether scanning exposure has been completed for all shot areas on substrate 15. If scanning exposure has not been completed for all shot areas on substrate 15, the process proceeds to S114, and S114 and S116 are repeated. On the other hand, if scanning exposure has been completed for all shot areas on substrate 15, the process proceeds to S120.

[0071] In S120, substrate 15 is carried out from exposure apparatus 100. Specifically, substrate 15, all of whose shot areas have been exposed, is received from substrate stage 16 by a transport hand (not shown) and transported to the outside of exposure apparatus 100.

[0072] According to the exposure process of this embodiment, the driving distance (driving time) of the substrate stage 16 required for scanning exposure of each shot area of the substrate 15 can be shortened, thereby improving productivity.

[0073] Fifth Embodiment The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays, liquid crystal display elements, semiconductor elements, and MEMS. This manufacturing method includes the steps of exposing a substrate coated with a photosensitive agent using the exposure apparatus 100 (exposure process) described above and developing the exposed photosensitive agent. The developed photosensitive agent pattern is then used as a mask to perform etching and ion implantation processes on the substrate, forming a circuit pattern on the substrate. These exposure, development, etching, and other processes are repeated to form a circuit pattern consisting of multiple layers on the substrate. In subsequent processes, the substrate on which the circuit pattern has been formed is diced (processed), followed by chip mounting, bonding, and inspection. This manufacturing method may also include other well-known processes (e.g., oxidation, film formation, vapor deposition, doping, planarization, resist stripping, etc.). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0074] The disclosure of the present specification includes the following exposure apparatus, exposure method, and method for manufacturing an article.

[0075] (Item 1) 1. An exposure apparatus that exposes a plurality of shot areas of a substrate while scanning an original and the substrate, a stage that holds and drives the substrate; a control unit that controls driving of the stage based on a driving profile that defines driving of the stage, the drive profile is configured by connecting a first acceleration profile that controls acceleration / deceleration of the stage in a non-exposure section that does not include an exposure section in which the shot area is exposed, and a second acceleration profile that controls acceleration / deceleration of the stage in the exposure section, the second acceleration profile is comprised of a curve; 10. An exposure apparatus, wherein the control unit determines the first acceleration profile and the second acceleration profile for each of the plurality of shot areas based on information about the size of the shot area.

[0076] (Item 2) 2. The exposure apparatus according to item 1, wherein the second acceleration profile is configured from a portion of a sine wave.

[0077] (Item 3) 3. The exposure apparatus described in item 1 or 2, characterized in that the control unit determines the first acceleration profile and the second acceleration profile for each of the plurality of shot areas so that the driving distance of the stage in the exposure section is a distance according to the size.

[0078] (Item 4) 4. The exposure apparatus according to any one of items 1 to 3, wherein the control unit determines the first acceleration profile and the second acceleration profile so as to shorten the drive time of the stage in the exposure section.

[0079] (Item 5) 5. The exposure apparatus according to any one of items 2 to 4, wherein the control unit determines the first acceleration profile and the second acceleration profile by changing the phase of the sine wave connecting the first acceleration profile and the second acceleration profile in accordance with the information.

[0080] (Item 6) 6. The exposure apparatus according to item 5, wherein the phase of the sine wave connecting the first acceleration profile and the second acceleration profile is a phase other than zero or π.

[0081] (Item 7) 5. The exposure apparatus according to any one of items 2 to 4, wherein the control unit determines the first acceleration profile and the second acceleration profile by changing the angular velocity of the sine wave in accordance with the information.

[0082] (Item 8) 8. The exposure apparatus according to item 7, wherein the control unit changes the angular velocity of the sine wave so that the angular velocity of the sine wave has a frequency lower than the natural frequency of the stage.

[0083] (Item 9) 5. The exposure apparatus described in any one of items 2 to 4, characterized in that the control unit determines the first acceleration profile and the second acceleration profile by changing the phase of the sine wave connecting the first acceleration profile and the second acceleration profile and the angular velocity of the sine wave according to the information.

[0084] (Item 10) the first acceleration profile is comprised of a portion of a sine wave; 10. The exposure apparatus described in any one of items 2 to 9, characterized in that the control unit determines the first acceleration profile and the second acceleration profile by changing the angular velocity of the sine wave in the first acceleration profile according to the information.

[0085] (Item 11) Item 11. The exposure apparatus according to item 10, wherein the non-exposure section is a line feed section in which the stage is driven to expose shot areas arranged in a first row among the plurality of shot areas, and then to expose shot areas arranged in a second row different from the first row.

[0086] (Item 12) 12. The exposure apparatus according to any one of items 1 to 11, wherein the information includes information indicating the length of the shot area in the scanning direction.

[0087] (Item 13) 1. An exposure apparatus that exposes a plurality of shot areas of a substrate while scanning an original and the substrate, a stage that holds and drives the substrate; a control unit that controls driving of the stage based on a driving profile that defines driving of the stage, the drive profile is configured by connecting a first acceleration profile that controls acceleration / deceleration of the stage in a non-exposure section that does not include an exposure section in which the shot area is exposed, and a second acceleration profile that controls acceleration / deceleration of the stage in the exposure section, the second acceleration profile is comprised of a curve; an exposure apparatus, characterized in that the first acceleration profile and the second acceleration profile are set so that a driving distance of the stage in the scanning direction when exposing a shot area among the plurality of shot areas, the shot area having a length in the scanning direction that is shorter than a predetermined reference length, is shorter than a driving distance of the stage in the scanning direction when exposing a shot area in which the length in the scanning direction of the shot area is the reference length.

[0088] (Item 14) 1. An exposure method for exposing a plurality of shot areas of a substrate while scanning an original and a substrate, comprising: a first step of determining a drive profile that defines the drive of a stage that holds the substrate when exposing the plurality of shot areas; a second step of exposing the plurality of shot areas while driving the stage based on the drive profile, the drive profile is configured by connecting a first acceleration profile that controls acceleration / deceleration of the stage in a non-exposure section that does not include an exposure section in which the shot area is exposed, and a second acceleration profile that controls acceleration / deceleration of the stage in the exposure section, the second acceleration profile is comprised of a curve; an exposure method, wherein in the first step, the first acceleration profile and the second acceleration profile are determined for each of the plurality of shot areas based on information about the size of the shot area;

[0089] (Item 15) Item 15. Exposing a substrate using the exposure method according to Item 14; developing the exposed substrate; manufacturing an article from the developed substrate; A method for manufacturing an article, comprising:

[0090] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0091] 100: exposure device 12: original 15: substrate 16: substrate stage 20: control unit

Claims

1. An exposure apparatus that scans and exposes a plurality of shot areas on a substrate, a stage for holding the substrate; a control unit that controls driving of the stage based on a first acceleration profile used to control acceleration of the stage in a non-exposure section in which the shot area is not exposed, and a second acceleration profile used to control acceleration of the stage in an exposure section in which the shot area is exposed, the second acceleration profile includes a waveform profile; an exposure apparatus characterized in that the control unit controls the driving of the stage using the second acceleration profile, in which at least one of the angular velocity in the waveform profile and the phase of the waveform profile to which the first acceleration profile is connected is determined based on information regarding the size of the shot area.

2. 2. The exposure apparatus according to claim 1, wherein the control unit controls the driving of the stage using the first acceleration profile and the second acceleration profile, which are determined for each of the plurality of shot areas so that the driving distance of the stage in the exposure section is a distance corresponding to the size of the shot area.

3. 3. The exposure apparatus according to claim 2, wherein the control unit controls driving of the stage using the first acceleration profile and the second acceleration profile that are determined so as to shorten the driving time of the stage in the exposure section.

4. 2. The exposure apparatus according to claim 1, wherein the phase of the waveform profile connecting the first acceleration profile and the second acceleration profile is a phase other than zero or π.

5. the plurality of shot areas include a first shot area and a second shot area smaller than the first shot area, 2. The exposure apparatus according to claim 1, wherein the second acceleration profile of the first shot area is longer than the second acceleration profile of the second shot area.

6. the first shot area is located inside the substrate, and the second shot area is located on the periphery of the substrate; 6. The exposure apparatus according to claim 5, wherein a portion of the second shot area is located outside the substrate.

7. 2. The exposure apparatus according to claim 1, wherein the angular velocity of the waveform profile has a frequency lower than a natural frequency of the stage.

8. 2. The exposure apparatus according to claim 1, wherein the information relating to the size of the shot area includes information indicating the length of the shot area in the scanning direction.

9. 2. The exposure apparatus according to claim 1, wherein the control unit controls the exposure amount to change in accordance with the speed of the stage.

10. 2. The exposure apparatus according to claim 1, wherein a predetermined position in each of the plurality of shot areas is exposed at the same acceleration.

11. An exposure apparatus that scans and exposes a plurality of shot areas on a substrate, a stage that holds and drives the substrate; a control unit that controls driving of the stage using a first acceleration profile that controls acceleration of the stage in a non-exposure section where the shot area is not exposed, and a second acceleration profile that controls acceleration of the stage in an exposure section where the shot area is exposed, the second acceleration profile includes a waveform profile; the plurality of shot areas include a first shot area whose length in the scanning direction is equal to or greater than a reference length, and a second shot area whose length in the scanning direction is shorter than the reference length, an exposure apparatus, characterized in that the second acceleration profile is determined so that a driving distance of the stage in the scanning direction when exposing the second shot area is shorter than a driving distance of the stage in the scanning direction when exposing the first shot area.

12. 12. The exposure apparatus according to claim 11, wherein the reference length is a length in the scanning direction of a shot area where the entire area of the shot area is located within the substrate.

13. An exposure apparatus that scans and exposes a plurality of shot areas on a substrate, a stage for holding the substrate; a control unit that controls the driving of the stage using a driving profile, the drive profile includes a first acceleration profile that controls acceleration of the stage in a non-exposure section in which the shot area is not exposed, and a second acceleration profile that controls acceleration of the stage in an exposure section in which the shot area is exposed, the first acceleration profile corresponding to a line feed section in which the stage is driven to expose shot areas arranged in a first row among the plurality of shot areas and then expose shot areas arranged in a second row different from the first row includes a first waveform profile; an exposure apparatus characterized in that the control unit controls the driving of the stage using the drive profile in which at least one of the angular velocity in the first waveform profile and the phase of the second waveform profile included in the second acceleration profile to which the first acceleration profile is connected is determined so as to shorten the driving distance in the scanning direction of the stage.

14. An exposure method for scanning and exposing a plurality of shot areas on a substrate, comprising: a first step of determining a drive profile used to control the drive of a stage that holds the substrate when exposing the plurality of shot areas; a second step of exposing the plurality of shot areas while driving the stage based on the drive profile, the drive profile includes a first acceleration profile that controls acceleration of the stage in a non-exposure section in which the shot area is not exposed, and a second acceleration profile that controls acceleration of the stage in an exposure section in which the shot area is exposed, the second acceleration profile includes a waveform profile; An exposure method characterized in that in the first step, at least one of the angular velocity in the waveform profile and the phase of the waveform profile to which the first acceleration profile is connected is determined based on information regarding the size of the shot area.

15. exposing a substrate using the exposure method according to claim 14; developing the exposed substrate; manufacturing an article from the developed substrate; A method for manufacturing an article, comprising:

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