Notch detection device, resin molding device, method for manufacturing resin molding, and notch detection method

Abstract

To correctly detect the position of a notch in a plate-like object.SOLUTION: A notch detection device includes a mounted surface where a plate-like object having a notch is arranged, a sensor, and a processing part. The sensor is configured to be relatively rotated around a predetermined rotation axis along the outer peripheral edge of the object arranged on the mounted surface, repeatedly measures a distance between the rotation axis and the outer peripheral edge while being relatively rotated along the outer peripheral edge, and thereby acquires a series of distance data in a circumferential direction. The outer peripheral edge of the object extends so as to form a predetermined repetitive pattern in the circumferential direction, except for the part of the notch. The processing part divides the series of distance data acquired by the sensor into a plurality of groups corresponding to the repetitive pattern in the circumferential direction, and compares the divided distance data between the groups, and thereby detects the position of the notch.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a notch detection device, a resin molding device, a method for manufacturing a resin molded product, and a notch detection method. [Background technology]

[0002] Patent Document 1 discloses a resin molding device for processing wafers. In Patent Document 1, a notch is provided on the outer periphery of the wafer, and the notch is used to position the wafer when it is set in a lower mold during resin molding. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-107700 A Summary of the Invention [Problem to be solved by the invention]

[0004] As in the example of Patent Document 1, a notch may be provided in a plate-like object such as a wafer. The notch can be used for various purposes, such as not only for positioning the wafer as described above but also for managing information about each chip by identifying each chip mounted on the wafer based on the position of the notch. In order to utilize the notch for such various purposes, it is necessary to accurately detect the position of the notch when processing the object such as a wafer.

[0005] An object of the present invention is to provide a notch detection device, a resin molding device, a method for manufacturing a resin molded product, and a notch detection method that can accurately detect the position of a notch in a plate-like object. [Means for solving the problem]

[0006] A notch detection device according to one aspect of the present invention includes a mounting surface on which a plate-shaped object having a notch is placed, a sensor, and a processing unit. The sensor is configured to rotate around a predetermined rotation axis relatively along the outer periphery of the object placed on the mounting surface, and while rotating relatively along the outer periphery, repeatedly measures the distance from the rotation axis to the outer periphery to obtain a series of distance data along the circumferential direction. The processing unit detects the position of the notch on the outer periphery of the object based on the series of distance data obtained by the sensor. The outer periphery of the object extends along the circumferential direction to form a predetermined repeating pattern, excluding the notch portion. The processing unit detects the position of the notch by dividing the series of distance data into multiple groups corresponding to the repeating pattern along the circumferential direction and comparing the divided distance data between the groups.

[0007] According to another aspect of the present invention, there is provided a resin molding apparatus including the above-described notch detection device and a molding die. An object is placed in the molding die so that the notch detected by the notch detection device is located at a predetermined position, and the object is molded with resin in the molding die.

[0008] A method for manufacturing a resin molded product according to yet another aspect of the present invention is a method for manufacturing a resin molded product using the resin molding apparatus described above. This method includes detecting the position of a notch with the notch detection device, placing an object in a molding die so that the notch detected by the notch detection device is located in a predetermined position, and molding the object with resin in the molding die to produce a resin molded product.

[0009] A notch detection method according to yet another aspect of the present invention includes rotating a sensor relatively along an outer peripheral edge of a plate-like object having a notch about a predetermined rotation axis, repeatedly measuring the distance from the rotation axis to the outer peripheral edge with the sensor while the sensor is rotating relatively along the outer peripheral edge to obtain a series of distance data along the circumferential direction, and detecting the position of the notch on the outer peripheral edge based on the series of distance data obtained by the sensor. The outer peripheral edge of the object extends along the circumferential direction to form a predetermined repeating pattern, excluding the notch portion. Detecting the position of the notch includes dividing the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and comparing the divided distance data between the groups to detect the position of the notch. [Effects of the Invention]

[0010] According to the present invention, the position of a notch in a plate-like object can be accurately detected. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a diagram schematically illustrating a plan view of a resin molding apparatus according to an embodiment; [Figure 2] FIG. 2 is a plan view of a substrate before resin molding according to an embodiment. [Figure 3] FIG. 2 is a diagram schematically illustrating a side view of a positioning mechanism according to an embodiment. [Figure 4] FIG. 2 is a side cross-sectional view schematically showing a part of a press module before clamping according to one embodiment. [Figure 5] FIG. 2 is a side cross-sectional view schematically showing a part of the press module after clamping according to one embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 4. [Figure 7] 1 is a flowchart illustrating a flow of a notch detection method according to an embodiment. [Figure 8A] 1 is an example of a graph of a series of distance data along a circumferential direction. [Figure 8B]This is an example of a graph in which graphs of multiple groups are superimposed. [Figure 8C] 10 is an example of a graph of average values for multiple groups. [Figure 8D] 10 is an example of a graph of the absolute value of deviation. [Figure 9] FIG. 10 is a plan view of a substrate according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that the same or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn schematically with objects appropriately omitted or exaggerated.

[0013] [1. Configuration of resin molding equipment] FIG. 1 is a schematic plan view of a resin molding apparatus 10 according to the present embodiment. The resin molding apparatus 10 is configured to resin-molde an object using a resin material R1. One example of the object is a substrate 60 on which a large number of electronic components 61, such as semiconductor chips, are mounted. For example, in the resin molding apparatus 10, the surface of the substrate 60 before resin molding on which the electronic components 61 are mounted is resin-sealed (resin-molded) to produce a resin-molded substrate 60. In the following description, the substrate (molding object) 60 before resin molding will be denoted by reference symbol 60A, and the substrate (resin-molded product) 60 after resin molding will be denoted by reference symbol 60B, and the two may be distinguished from each other.

[0014] In this embodiment, the substrate 60 is a thin plate-like member called a wafer, although it is not limited thereto. The substrate 60 is made of, for example, a semiconductor substrate such as a silicon wafer, a metal substrate, a resin substrate, a glass substrate, or a ceramic substrate. The substrate 60 may be made of, for example, a carrier used in FOWLP (Fan Out Wafer Level Packaging). The substrate 60 may or may not already have wiring provided thereon.

[0015] FIG. 2 is a plan view of the substrate 60A before resin molding. As shown in FIG. 2, the substrate 60A includes a thin, plate-like substrate body 62 and a large number of electronic components 61, such as semiconductor chips, integrated on the substrate body 62. The substrate 60A has a notch 63. In the example of FIG. 2, the notch 63 is formed in a V-shape. The notch 63 is a cutout provided in the outer peripheral edge P1 of the substrate 60A (i.e., of the substrate body 62) to indicate the position and orientation of each electronic component 61 on the substrate body 62. The individual electronic components 61 can be identified based on the position of the notch 63. In this embodiment, the notch 63 is used to position the substrate 60A when it is set in the molding die 305 during resin molding.

[0016] As shown in Fig. 1, the resin molding apparatus 10 includes a release film module 110, a resin module 120, a press module 130, a conveying module 140, and a control unit 150. Each module is configured to be detachable from adjacent modules. Note that although the resin molding apparatus 10 includes one press module 130 in the example of Fig. 1, it may include two or more press modules 130.

[0017] The control unit 150 is configured to control the entire resin molding apparatus 10. The control unit 150 controls, for example, each of the release film module 110, the resin module 120, the press module 130, and the conveying module 140. The control unit 150 includes a hardware processor such as a central processing unit (CPU), a random access memory (RAM), and a read-only memory (ROM), and is configured to execute information processing based on programs and various data. The control unit 150 may be realized by multiple computers. The control unit 150 is typically disposed adjacent to the modules 110, 120, 130, and 140 or disposed in the same casing as the modules 110, 120, 130, and 140, but at least a portion of the control unit 150 may be disposed remotely. The control unit 150 is an example of a processing unit. Input devices (not shown), such as buttons and a touch panel, and a display (not shown) are connected to the control unit 150.

[0018] In the release film module 110, a release film 11 having a desired shape is produced. In the resin module 120, a resin material R1 is supplied onto the release film 11. In this embodiment, the resin material R1 is a liquid resin, but is not limited thereto and may be, for example, a powdered or granular resin (granular resin). Furthermore, although not limited thereto, the resin material R1 is typically a thermosetting resin.

[0019] In the press module 130, compression molding is performed with the substrate 60A transported by the transport module 140 and the release film 11 supplied with the resin material R1 placed at predetermined positions in the molding die 305. This produces a substrate 60B, which is a resin molded product. The substrate 60B is transported by the transport module 140 and accommodated in a predetermined position (second accommodation section 146). Each module will be described in detail below.

[0020] The release film module 110 is configured to cut and separate a circular release film 11 from a long release film. The release film 11 is used to prevent the resin from adhering to the molding die 305 after compression molding in the press module 130 and to facilitate removal of the substrate 60B from the molding die 305. As a material for the release film, a resin material having properties such as heat resistance, releasability, flexibility, and extensibility is used, and examples of such materials include PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride.

[0021] The release film module 110 includes a moving mechanism 111, a film roll 112, and a film gripper 113. The moving mechanism 111 is located between the film roll 112 and the film gripper 113 in the direction of the arrow Y. The moving mechanism 111 is configured to move between the release film module 110 and the resin module 120. The moving mechanism 111 is movable, for example, in both the direction of the arrow X and the direction of the arrow Y.

[0022] A table 114 is arranged on the upper surface of the moving mechanism 111. The table 114 is a fixing base for fixing the release film 11. The release film pulled out from the film roll 112 is fixed on the table 114. The film gripper 113 is configured to pull out the release film from the film roll 112 and fix the leading end of the pulled release film. On the moving mechanism 111, the release film is cut by a cutter (not shown) to produce a circular release film 11. For example, the release film 11 may be fixed to the upper surface of the table 114 by suction using a suction mechanism (not shown) such as a vacuum pump through suction holes (not shown) formed on the upper surface of the table 114.

[0023] The resin module 120 is configured to supply the resin material R1 onto the release film 11 and to transport the release film 11 to which the resin material R1 has been supplied to a predetermined position in the molding die 305. The resin module 120 includes a supply mechanism 123, a resin loader 121, and a post-processing mechanism 122.

[0024] The supply mechanism 123 is configured to supply the resin material R1 toward the release film 11 placed on the table 114 of the movement mechanism 111 with the table 114 positioned downward. The supply mechanism 123 is movable, for example, in both the direction of arrow X and the direction of arrow Y. For example, the supply position of the resin material R1 on the release film 11 is adjusted by moving the supply mechanism 123 while the resin material R1 is being supplied. Alternatively, the supply position of the resin material R1 on the release film 11 may be adjusted by moving the table 114 of the movement mechanism 111 while the resin material R1 is being supplied. The supply mechanism 123 is preferably configured to move relative to the table 114 when supplying the resin material R1.

[0025] The resin loader 121 and the post-processing mechanism 122 are, for example, integrally configured. The resin loader 121 and the post-processing mechanism 122 are configured to move between the resin module 120, the press module 130, and the transfer module 140 via rails 142.

[0026] The resin loader 121 is configured to hold the release film 11 by sucking from above the peripheral edge of the release film 11 to which the resin material R1 has been supplied, and to move the release film 11 from the moving mechanism 111 to a predetermined position in the molding die 305. The post-processing mechanism 122 is configured to clean the molding die 305 and remove the release film 11 from the molding die 305 after compression molding by the molding die 305.

[0027] The transfer module 140 is configured to transfer the substrate 60A accommodated in the first accommodation section 145 to a predetermined position in the molding die 305, and to transfer the substrate 60B (resin molded product) manufactured in the press module 130 to the second accommodation section 146. The transfer module 140 includes a substrate loader 141, rails 142, a robot arm 143, the first accommodation section 145, the second accommodation section 146, and a positioning mechanism 147. In the transfer module 140, for example, the substrate 60 is transferred by the substrate loader 141 holding the substrate 60 moving on the rails 142. The rails 142 extend across the areas of the transfer module 140, the press module 130, and the resin module 120.

[0028] The first accommodating section 145 is configured to accommodate the substrate 60A before resin molding, and the second accommodating section 146 is configured to accommodate the substrate 60B after resin molding. The robot arm 143 takes out the substrate 60A from the first accommodating section 145 and hands it over to the positioning mechanism 147.

[0029] FIG. 3 is a schematic side view of the positioning mechanism 147. As shown in FIG. 3, the positioning mechanism 147 includes a rotating table 40, a shaft 41, a motor 42, and a sensor 43. The positioning mechanism 147 detects the position of the notch 63 on the outer peripheral edge P1 of the substrate 60A and positions the substrate 60A in the rotational direction (circumferential direction). That is, the positioning mechanism 147 adjusts the rotational orientation of the substrate 60A based on the position of the notch 63. The substrate 60A is then transported to the forming mold 305 by the robot arm 143 and the substrate loader 141 and set in the forming mold 305. At this time, the robot arm 143 and the substrate loader 141 transport the substrate 60A with the notch 63 fixed at a predetermined position relative to the robot arm 143 and the substrate loader 141. The substrate 60A is then set in the forming mold 305 so that the notch 63 is fixed at a predetermined position within the forming mold 305. As a result, the rotational direction of the substrate 60A is positioned within the molding die 305.

[0030] The robot arm 143 places the substrate 60A removed from the first accommodation section 145 on the top surface (an example of a mounting surface) of the turntable 40. At this time, the substrate 60A is placed on the turntable 40 with the mounting surface for the electronic components 61 facing upward. The robot arm 143 also places the substrate 60A on the turntable 40 so that the center C1 of the substrate 60A and the center C2 of the turntable 40 roughly overlap in a plan view. In this embodiment, the turntable 40 is disk-shaped. The substrate 60A is larger than the turntable 40 in a plan view, and the entire outer periphery of the substrate 60A extends outside the turntable 40.

[0031] A shaft 41 is fixed to the underside of the turntable 40 coaxially with the turntable 40. The shaft 41 is connected to a motor 42, and when the shaft 41 is rotated by the motor 42, the turntable 40 rotates around a predetermined rotation axis A1. The rotation of the shaft 41 and the turntable 40 is controlled by a control unit 150 connected to the motor 42. The rotation axis A1 passes through a center C2 of the turntable 40 in a plan view and extends in the vertical direction.

[0032] The sensor 43 includes a light source 431, a light receiver 432, and a frame 433. The frame 433 supports the light source 431 and the light receiver 432 so that they face each other with a gap between them. Light emitted by the light source 431 is detected by the light receiver 432 unless there is an obstruction between them. The frame 433 is disposed to the side of the turntable 40 so that the outer periphery of the substrate 60A placed on the turntable 40 is inserted between the light source 431 and the light receiver 432. For example, the light receiver 432 includes a plurality of light receiving elements forming an array, and the plurality of light receiving elements are arranged in the radial direction with respect to the rotation axis A1. Note that a plurality of light sources 431 may also be provided, and an array may be formed so as to face the arrangement of the light receiving elements.

[0033] The sensor 43 is configured to rotate about a rotation axis A1 relative to the outer peripheral edge P1 of the substrate 60A placed on the turntable 40. In this embodiment, the sensor 43 is fixed, and the turntable 40 rotates about the rotation axis A1. However, the above-described relative rotation may be achieved by rotating only the sensor 43, or by rotating both the sensor 43 and the turntable 40.

[0034] The control unit 150 rotates the turntable 40 on which the substrate 60A is placed. During this rotation (i.e., while the sensor 43 rotates relatively along the outer periphery P1 of the substrate 60A), the sensor 43 repeatedly measures the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A. More specifically, the control unit 150 causes the light source 431 to emit light and causes the light receiver 432 to detect the intensity of the light. The amount of light received by the light receiver 432 relative to the amount of light from the light source 431 decreases if there is an object between the light source 431 and the light receiver 432 that blocks the light. The greater the amount of light that is blocked, the less light is received by the light receiver 432. Here, as described above, the outer periphery of the substrate 60A is inserted between the light source 431 and the light receiver 432, which blocks the light from the light source 431 to the light receiver 432. Therefore, as the distance from the rotation axis A1 to the outer peripheral edge P1 of the substrate 60A increases, the amount of blocked light increases, and the intensity of light received by the light receiver 432 decreases. Conversely, as the distance from the rotation axis A1 to the outer peripheral edge P1 of the substrate 60A decreases, the amount of blocked light decreases, and the intensity of light received by the light receiver 432 increases. Therefore, the data on the intensity of light received by the light receiver 432 becomes distance data indicating the distance from the rotation axis A1 to the outer peripheral edge P1 of the substrate 60A. The sensor 43 repeatedly measures the intensity of light received by the light receiver 432 while the substrate 60A rotates around the rotation axis A1, thereby repeatedly acquiring distance data. As a result, the sensor 43 acquires a series of distance data along the circumferential direction based on the rotation axis A1. The control unit 150 detects the position of the notch 63 on the outer peripheral edge P1 of the substrate 60A based on the series of distance data acquired by the sensor 43. Then, the control unit 150 rotates the turntable 40 to rotate the substrate 60A so that the detected notch 63 is at a predetermined position, thereby positioning the substrate 60A in the rotational direction (circumferential direction).

[0035] Thereafter, the robot arm 143 retrieves the substrate 60A, which has been positioned in the rotational direction (circumferential direction) by the positioning mechanism 147, from the turntable 40 and hands it over to the substrate loader 141. More specifically, the robot arm 143 turns the substrate 60A over and places it on the upper surface of the substrate loader 141. As a result, the substrate 60A is held by the substrate loader 141 with the mounting surface for the electronic components 61 facing downward. The substrate loader 141 transports the substrate 60A from a predetermined position near the robot arm 143 to a predetermined position in the forming mold 305, and hands the substrate 60A over to the forming mold 305 with the mounting surface for the electronic components 61 facing downward.

[0036] Furthermore, the substrate loader 141 retrieves the resin-molded substrate 60B from the molding die 305 with the mounting surface of the electronic components 61 facing downward, and transfers it to the robot arm 143 either indirectly via another device or directly. Upon receiving the substrate 60B, the robot arm 143 turns the substrate 60B upside down and stores the substrate 60B in the second storage section 146. As a result, the substrate 60B is stored in the second storage section 146 with the resin-molded surface facing upward.

[0037] 4 and 5 are side cross-sectional views schematically illustrating a portion of the press module 130. FIG. 4 illustrates the state before mold clamping, and FIG. 5 illustrates the state after mold clamping. As shown in FIGS. 4 and 5, the press module 130 includes an outer frame member 301, a fixed platen 310, a movable platen 330, and a molding die 305. An example of the molding die 305 is a metal mold. In this embodiment, the press module 130 is configured to manufacture a resin molded product (substrate 60B) by using a so-called compression molding method. However, the resin molding method is not limited to this. By replacing the press module 130 with a different molding module, the substrate 60B may be manufactured by a different method, for example, a transfer molding method.

[0038] The outer frame member 301 is composed of tie bars (columns) or hold frames (plate members). When the outer frame member 301 is composed of tie bars, for example, the outer frame member 301 is composed of four tie bars arranged at the four corners. Each of the four tie bars extends in the vertical direction. When the outer frame member 301 is composed of hold frames, for example, the outer frame member 301 is composed of two hold frames arranged on the left and right. The wide surfaces of the two hold frames face each other in the horizontal direction.

[0039] The stationary platen 310 is a plate-like member that is rectangular in plan view. The stationary platen 310 is fixed to the upper part of the outer frame member 301. The movable platen 330 is disposed inside the outer frame member 301 and below the stationary platen 310. The movable platen 330 is configured to move in the vertical direction. The movement of the movable platen 330 is achieved by, for example, a mold clamping mechanism (not shown). The mold clamping mechanism is achieved by, for example, a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a link mechanism.

[0040] The forming mold 305 includes an upper mold 320 and a lower mold 340. The forming mold 305 is disposed inside the outer frame member 301, between a stationary platen 310 and a movable platen 330. More specifically, the upper mold 320 is fixed to the lower surface of the stationary platen 310, and the lower mold 340 is fixed to the upper surface of the movable platen 330. As the movable platen 330 moves up and down, the lower mold 340 also moves up and down together with the movable platen 330. As the movable platen 330 rises, the forming mold 305 is clamped.

[0041] The lower mold 340 includes a base plate 344, a bottom member 341, springs 343, and side members 342. The base plate 344 is a plate-like member that is rectangular in plan view. The base plate 344 is fixed to the upper surface of the movable platen 330. The bottom member 341 is a block-like member that is rectangular in plan view. The bottom member 341 is fixed to the upper surface of the base plate 344, and is located approximately in the center of the base plate 344. The side members 342 are frame-like members that surround the periphery of the bottom member 341. The side members 342 are fixed to the bottom member 341 via multiple springs 343.

[0042] The upper surface of the side member 342 is located higher than the upper surface of the bottom member 341, and a recess (cavity) is formed in the upper surface of the lower mold 340. A release film 11 carrying a resin material R1 is transported and placed in this recess by the resin loader 121. A substrate 60A delivered from the substrate loader 141 is placed on the lower surface of the upper mold 320. At this time, the substrate 60A is held on the lower surface of the upper mold 320 by a method such as suction, with the mounting surface for the electronic components 61 facing downward. At this time, the control unit 150 also controls the lower surface of the upper mold 320 so that a notch 63 is positioned at a predetermined position. In other words, the control unit 150 controls the rotational direction (circumferential direction) of the substrate 60A held on the lower surface of the upper mold 320 to be oriented in a predetermined direction, based on the position of the notch 63 detected by the positioning mechanism 147. This positions the rotational direction of the substrate 60A within the molding mold 305. Then, the substrate 60A is placed on the lower surface of the upper mold 320, and the mold release film 11 and the resin material R1 are placed in the recess of the lower mold 340, and the molding die 305 is then clamped. As a result, the mounting surface of the substrate 60A on which the electronic component 61 is mounted is resin-sealed. During resin sealing, the resin material R1 is appropriately heated by a heating mechanism (not shown).

[0043] Figure 6 is a cross-sectional view taken along line VI-VI in Figure 4. As shown in Figures 4 to 6, positioning pins 321 are provided on the underside of upper mold 320. Substrate 60A is held on the underside of upper mold 320 with pins 321 aligned with notches 63. More specifically, substrate loader 141 delivers substrate 60A to upper mold 320 so that pins 321 fit into notches 63. This more reliably prevents movement, including rotation, of substrate 60A within molding mold 305 during resin molding, resulting in more stable resin molding.

[0044] Note that, to more reliably prevent movement, including rotation, of substrate 60A, it is not necessary to insert pin 321 into notch 63. For example, one or more holes may be formed in substrate 60A, preferably near the outer periphery, and one or more pilot pins provided on upper mold 320 may be inserted into the one or more holes. In this case, control unit 150 can position substrate 60A in the rotational direction on the lower surface of upper mold 320 using the position of notch 63 as a reference, thereby positioning the pilot pin with respect to the hole. Alternatively, as long as substrate 60A is held relatively firmly on the lower surface of upper mold 320 by a method such as suction, the positioning pins (including pin 321 and pilot pin described above) may be omitted.

[0045] Furthermore, substrate 60A can be placed in the recess of lower die 340 with the mounting surface for electronic component 61 facing upward, and resin material R1 can be supplied onto substrate 60A, before molding die 305 is closed. In this case, a positioning pin similar to pin 321 or the pilot pin described above can be provided on lower die 340.

[0046] [2. Details of the board shape] The shape of substrate 60A according to this embodiment will be described in detail below with reference to Fig. 2. However, the shape of the object to which the present invention is applied is not limited to the shape of substrate 60A described here.

[0047] The substrate body 62 included in the substrate 60A has a notch 63. The outer peripheral edge P1 of the substrate 60A (i.e., of the substrate body 62) extends, excluding the portion of the notch 63, in a plan view along the circumferential direction based on the center C1 so as to form a predetermined repeating pattern. In the example of FIG. 2, four identical patterns PT1 to PT4 are repeated in this order along the circumferential direction. However, because the pattern PT1 includes the notch 63, the pattern PT1 has a different shape from the other patterns PT2 to PT4 only in the portion of the notch 63.

[0048] Substrate 60A has a rotationally symmetric shape in plan view, excluding notch 63. In the example of Fig. 2, outer peripheral edge P1 includes four patterns PT1 to PT4, which overlap with themselves every time they are rotated 90 degrees, resulting in a four-fold symmetric shape. In other words, the number of rotational symmetries is four.

[0049] The patterns PT1 to PT4 each include arc segments B1 to B4 and straight line segments L1 to L4. Each of the arc segments B1 to B4 is an arc with a center C1 as its base. Each of the straight line segments L1 to L4 extends linearly so as to connect the endpoints of two adjacent arc segments among the arc segments B1 to B4. However, the straight line segment L1 is cut out at the location of the notch 63. The substrate 60A is non-circular even excluding the location of the notch 63.

[0050] The shortest distance from the center C1 of the substrate 60A to the outer peripheral edge P1 is the distance between the center C1 and the straight line segments L1-L4. Therefore, in this embodiment, the shortest distance from the center C1 to the outer peripheral edge P1 is different from the distance from the center C1 to the notch 63 (the innermost end of the outline of the notch 63 along the radial direction).

[0051] Using the sensor 43 described above, a series of distance data indicating the distance from the rotation axis A1 to the outer peripheral edge P1 of the substrate 60A can be obtained along the circumferential direction based on the rotation axis A1. Therefore, if the substrate 60A were circular except for the portion of the notch 63, the circumferential position corresponding to the data indicating the shortest distance among the series of distance data could be determined to be the position of the notch 63 by aligning the rotation axis A1 with the center C1 of the substrate 60A. However, because the substrate 60A in this case is non-circular, the position of the notch 63 cannot be detected using the above algorithm. However, the method described below allows the position of the notch 63 to be correctly detected even for a non-circular substrate 60A.

[0052] [3. Manufacturing method for resin molded products] Next, a method for manufacturing a resin molded product (substrate 60B) using the resin molding apparatus 10 will be described. In the process of manufacturing the substrate 60B, the position of the notch 63 in the substrate 60A is detected by the above-mentioned positioning mechanism 147 and control unit 150 (an example of a notch detection device), and the substrate 60A is positioned in the rotational direction. Figure 7 is a flowchart showing the flow of the method for detecting the notch 63. Below, the method for manufacturing the substrate 60B will be described, focusing on the process shown in Figure 7.

[0053] First, when a command to start manufacturing a resin molded product is given to the resin molding apparatus 10 via the input device, the control unit 150 drives the robot arm 143. The robot arm 143 removes the substrate 60A from the first accommodation unit 145 and places the removed substrate 60A on the top surface of the turntable 40 of the positioning mechanism 147. At this time, the robot arm 143 aligns the center C1 of the substrate 60A so that it roughly overlaps with the center C2 of the turntable 40. In this state, the process shown in FIG. 7 starts.

[0054] In step S1, the control unit 150 drives the positioning mechanism 147 to acquire a series of distance data. More specifically, while rotating the turntable 40 around the rotation axis A1 (while rotating the sensor 43 relative to the turntable 40), the sensor 43 repeatedly measures the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A. In this embodiment, the turntable 40 rotates at least once, during which the light source 431 emits light and the light receiver 432 measures the intensity of the light emitted from the light source 431 at short time intervals. This acquires a series of light intensity data, in other words, a series of distance data indicating the distance from the rotation axis A1 to the outer periphery P1. The series of distance data includes multiple data sets that associate data indicating angles around the rotation axis A1 with data indicating the distance from the rotation axis A1 to the outer periphery P1 at those angles. Information about the angles around the rotation axis A1 is acquired based on the number of rotations of the motor 42. These multiple data sets are acquired at small angle intervals between 0° and 360°. Therefore, the series of distance data acquired here is a series of data group along the circumferential direction based on the rotation axis A1. Note that the series of distance data acquired by the sensor 43 may be data for one or more rotations of the turntable 40, but the following calculations use distance data for one rotation.

[0055] In the following step S2, the control unit 150 corrects the series of distance data acquired in step S1. The series of distance data acquired in step S1 is a data group arranged in the circumferential direction with respect to the rotation axis A1, i.e., with respect to the center C2 of the turntable 40. In step S2, this is converted into a data group arranged in the circumferential direction with respect to the center C1 of the substrate 60A. Note that, when the substrate 60A is placed on the turntable 40, if the center C1 of the substrate 60A and the center C2 of the turntable 40 coincide in a plan view, or if they do not coincide but the difference is negligible, step S2 can be omitted.

[0056] Plotting the points indicated by each data set (pairs of data indicating angles and distances relative to the center C2) included in the series of distance data before conversion onto a polar coordinate plane depicts the shape of the outer periphery P1 of the substrate 60A. The coordinates of the center C1 of the substrate 60A are calculated by determining the center coordinates of the drawn outer periphery P1. The calculation of the center coordinates of the outer periphery P1 can be performed, for example, by geometric calculation or by image pattern matching. Then, by replotting each point indicated by the series of distance data before conversion onto a polar coordinate plane with the calculated center C1 as the origin (i.e., calculating the angle around the center C1 and the distance from the center C1 for each point), the series of distance data before conversion can be converted into a series of data groups along the circumferential direction relative to the center C1. Note that the method of converting the origin of the polar coordinate system from the center C2 to the center C1 is not limited to the procedure described here, and various methods apparent to those skilled in the art can be used.

[0057] In subsequent steps S3 to S5, the position of notch 63 on outer periphery P1 of substrate 60A is detected based on the series of distance data corrected in step S2. Note that, in steps S3 to S5, if step S2 is omitted, similar processing is performed on the series of distance data acquired in step S1. FIG. 8A is an example of a graph of the series of distance data corrected in step S2. The horizontal axis indicates the data number in chronological order, and the vertical axis indicates the distance from center C1 to outer periphery P1. In other words, the horizontal axis indicates the angle around center C1, i.e., the circumferential direction. Controller 150 divides the series of distance data corrected in step S2 into multiple groups along the circumferential direction, and compares the divided distance data between the groups to detect the position of notch 63.

[0058] In step S3, the control unit 150 divides the series of distance data corrected in step S2 into N groups along the circumferential direction. N is an integer equal to or greater than 2. In the example of FIG. 8A, the series of distance data is divided into four groups G1 to G4. These groups G1 to G4 correspond to the repeating patterns PT1 to PT4 shown in FIG. 2, respectively. In this example, N=4 because the shape of the substrate 60A has four-fold symmetry. However, N does not need to match the number of rotational symmetries of the shape of the substrate 60A. For example, N can be an integer equal to or greater than 2 that is a divisor of the rotational symmetry number.

[0059] Each group G1 to G4 has M elements, numbered 1 to M. M is an integer equal to or greater than 2. M can be calculated by dividing the number of data points (points) included in the series of distance data by the number of groups, N. In this case, if the number of data points is not divisible by N, the remaining data can be thinned out appropriately. The thinned data can be, for example, data at the end of the series of distance data or data near the boundary between groups. Note that even if measurement parameters such as the rotation speed of the turntable 40 and the light-receiving interval of the photoreceiver 432 are set in advance so that the number of data points (for one rotation of the turntable 40) included in the series of distance data is an integer multiple of N, some data may remain. This is because the control unit 150 may not necessarily issue various measurement commands at strictly equal intervals.

[0060] In the next step S4, control unit 150 calculates the average value of the distances indicated by the N elements belonging to each of the N groups, for each of the first to Mth orders. That is, the average value of the N first elements (distances) included in each of the N groups is calculated, the average value of the N second elements (distances), ..., the average value of the N Mth elements (distances). That is, in step S4, the graphs of the N groups divided in step S3 are superimposed (see FIG. 8B), and the average value of the N points in each group that are in the same order along the horizontal axis is calculated (see FIG. 8C).

[0061] In the next step S5, control unit 150 identifies the element that has the largest deviation from the average value calculated in step S4 among the N×M elements (distances) belonging to the N groups. FIG. 8D is a graph of the absolute values of deviation of the N×M elements (distances). Here, the average value compared to each of the N×M elements is the average value calculated for the first to Mth elements in the same order as the element in question, among the average values calculated in step S4. That is, a value (difference) is calculated by subtracting the average value of the first element calculated in step S4 from each distance indicated by the N first elements included in each of the N groups. Thereafter, similarly, a difference is calculated by subtracting the average value of the second elements from each distance indicated by the N second elements, and so on, and a difference is calculated by subtracting the average value of the Mth element from each distance indicated by the N Mth elements. That is, in step S5, the graph of the average value calculated in step S4 is subtracted from each graph of the N groups divided in step S3 to identify the element with the largest deviation. The element with the largest deviation can be the element with the largest absolute value of deviation. In this case, the element with the largest absolute value of deviation is identified from among the N×M elements (distances). Then, the control unit 150 detects the circumferential position of the element with the largest deviation thus identified as the position of the notch 63. The position of the notch 63 is identified, for example, by the angle and distance indicated by the distance data corresponding to the element with the largest deviation among the series of distance data corrected in step S2. This completes the processing of FIG. 7.

[0062] After the position of notch 63 has been detected, control unit 150 again drives positioning mechanism 147 and adjusts the rotational (circumferential) orientation of substrate 60A based on the detected position of notch 63. More specifically, turntable 40 is rotated so that notch 63 is at a predetermined position along the circumferential direction. Thereafter, robot arm 143 retrieves substrate 60A, whose position of notch 63 has been adjusted, from turntable 40 and transfers it to molding die 305 via substrate loader 141. Control unit 150 controls robot arm 143 and substrate loader 141 to place substrate 60A in molding die 305 so that notch 63 is located at a predetermined position within molding die 305.

[0063] After substrate 60A is set in molding die 305, control unit 150 clamps molding die 305. Then, substrate 60A is molded with resin in molding die 305 to produce a resin molded product (substrate 60B). Control unit 150 controls substrate loader 141 and robot arm 143 to retrieve substrate 60B from molding die 305 and store it in second storage unit 146. This completes the production of the resin molded product.

[0064] [4. Features] According to the above-described resin molding apparatus 10, it is possible to correctly detect the position of the notch 63. As a result, it is possible to correctly position the object (substrate 60A) having the notch 63.

[0065] [5. Modifications] The above-described embodiment is merely an example of the present invention in all respects, and the present invention is not limited to the above-described embodiment. Various improvements and modifications to the above-described embodiment are possible within the scope of the present invention. For example, the following modifications are possible. The various technical features described in this specification can be combined as appropriate within the spirit and scope of the present invention.

[0066] <5-1> The shape of the object (substrate 60) excluding the notch 63 does not have to be rotationally symmetric. If a repeating pattern exists along the circumferential direction on the outer peripheral edge P1 excluding the notch 63, the notch 63 can be correctly detected using a method similar to that described above. For example, the shape of the object excluding the notch 63 may be line-symmetric as shown in FIG. 9. In this case, in step S3, the series of distance data is divided equally into two groups, and in step S4, the graphs of the two groups are superimposed by inverting the graph of one group, and the average value is calculated. The rest of the process is the same as in FIG. 7.

[0067] As another example, the shape of the object excluding the portion of notch 63 may be circular. In this case, too, it can be said that a repeating pattern exists along the circumferential direction on outer peripheral edge P1 excluding the portion of notch 63, and notch 63 can be correctly detected using a method similar to that described above.

[0068] <5-2> In the above embodiment, the position of the notch 63 in the substrate 60A before resin molding is detected, but the position of the notch 63 in the substrate 60B after resin molding may be detected by a similar method.

[0069] <5-3> The information about the position of the notch 63 detected in the above embodiment was used to position the substrate 60A to be set in the forming mold 305. However, the information about the position of the notch 63 can also be used for other purposes.

[0070] For example, the position of notch 63 can be detected and the information can be utilized not only when substrate 60A is set in mold 305, but also in any other situation where an object needs to be positioned. The "any other situation" here includes processes performed in resin molding apparatus 10, as well as processes before substrate 60A is loaded into resin molding apparatus 10 and processes after substrate 60B is unloaded from resin molding apparatus 10. For example, the position of notch 30 may be detected when resin-molded substrate 60B is cut with a blade to separate the resin-molded substrate 60B into multiple packages. In this case, fixing the position of notch 30 in resin-molded substrate 60B prevents electronic components 61 from being accidentally cut.

[0071] Furthermore, each electronic component 61 mounted on the substrate 60 can be identified based on the position of the notch 63. Therefore, information on the position of the notch 63 can also be used when managing information related to each electronic component 61 on the substrate 60. In this case, in any situation where it is necessary to identify each electronic component 61, the position of the notch 63 can be detected by the above-described method and the information can be used.

[0072] [6. Notes] <Technology 1> (composition) a placement surface on which a plate-shaped object having a notch is placed; a sensor configured to rotate around a predetermined rotation axis relatively along an outer periphery of the object placed on the mounting surface, the sensor repeatedly measuring the distance from the rotation axis to the outer periphery while rotating relatively along the outer periphery, thereby acquiring a series of distance data along the circumferential direction; a processing unit that detects the position of the notch on the outer periphery based on the series of distance data acquired by the sensor; Equipped with the outer peripheral edge extends in a circumferential direction, excluding the notch, to form a predetermined repeating pattern; the processing unit divides the series of distance data into a plurality of groups along a circumferential direction corresponding to the repeating pattern, and compares the divided distance data between the groups to detect the position of the notch. Notch detection device.

[0073] (Effects, etc.) According to this notch detection device, the series of distance data is divided into multiple groups along the circumferential direction corresponding to the repeating pattern, and the divided distance data is compared between the groups, thereby making it possible to accurately detect the position of the notch in the plate-like object.

[0074] <Technology 2> (composition) The object has a rotationally symmetric shape except for the notch. The notch detection device described in technique 1.

[0075] (Effects, etc.) This notch detection device can accurately detect the position of a notch in an object that has a rotationally symmetric shape except for the notch.

[0076] <Technology 3> (composition) The object is non-circular except for the notch. 3. The notch detection device according to claim 1 or 2.

[0077] (Effects, etc.) This notch detection device can accurately detect the position of a notch in a non-circular object excluding the notch portion.

[0078] <Technology 4> (composition) the shortest distance from the center of the object to the outer periphery is different from the distance from the center to the notch; A notch detection device according to any one of techniques 1 to 3.

[0079] (Effects, etc.) This notch detection device can accurately detect the position of a notch in an object in which the shortest distance from the center to the outer periphery is different from the distance from the center to the notch.

[0080] <Technology 5> the processing unit corrects the series of distance data acquired by the sensor into a second series of distance data indicating a plurality of distances from the center of the object to the outer periphery; dividing the corrected second set of distance data into N groups along a circumferential direction, each group having a first element through an Mth element, where N and M are integers greater than or equal to 2; For each of the first to Mth orders, calculate the average value of the N elements belonging to each of the N groups; Among the N×M elements belonging to the N groups, an element having the largest deviation from the average value for the same order from 1 to M is identified; Detecting the circumferential position of the identified element as the position of the notch. 5. A notch detection device according to any one of techniques 1 to 4.

[0081] <Technology 6> (composition) A notch detection device according to any one of techniques 1 to 5; Mold and Equipped with the object is placed in the molding die so that the notch detected by the notch detection device is located at a predetermined position, and is molded with resin in the molding die. Resin molding equipment.

[0082] (Effects, etc.) According to this resin molding device, the notch can be correctly positioned within the mold during resin molding.

[0083] <Technology 7> (composition) A method for manufacturing a resin molded product using the resin molding device described in technique 6, the notch detection device detecting the position of the notch; placing the object in the mold so that the notch detected by the notch detection device is located at the predetermined position; molding the object with resin in the molding die to produce the resin molded product; Including, A method for manufacturing resin molded products.

[0084] (Effects, etc.) According to this method for manufacturing a resin molded product, the position of the notch in the plate-like object can be accurately detected, and the notch can be accurately positioned in the molding die using the position of the notch as a reference.

[0085] <Technology 8> (composition) Rotating the sensor relatively around a predetermined rotation axis along the outer periphery of the plate-shaped object having the notch; repeatedly measuring the distance from the rotation axis to the outer circumferential edge with the sensor while the sensor rotates relatively along the outer circumferential edge, thereby obtaining a series of distance data along the circumferential direction; detecting a position of the notch on the outer periphery based on the series of distance data acquired by the sensor; Including, the outer peripheral edge extends in a circumferential direction, excluding the notch, to form a predetermined repeating pattern; detecting the position of the notch includes dividing the series of distance data into a plurality of groups along a circumferential direction corresponding to the repeating pattern, and comparing the divided distance data between the groups to detect the position of the notch. Notch detection method.

[0086] (Effects, etc.) According to this notch detection method, the series of distance data is divided into multiple groups along the circumferential direction corresponding to the repeating pattern, and the divided distance data are compared between the groups, thereby making it possible to accurately detect the position of the notch in the plate-like object. [Explanation of symbols]

[0087] 10 Resin molding equipment 147 Positioning mechanism 150 control unit (processing unit) 305 Molding mold 320 upper mold 321 pins 340 Lower mold 40 Rotating Platform 41 Shaft 42 Motor 43 Sensors 431 Light source 432 Photoreceiver 433 frames 60, 60A, 60B Substrate (object) 61 Electronic Components 62 Board body 63 Notch P1 outer edge PT1~PT4 repeat pattern A1 rotation axis C1 Center of the board C2 Center of the turntable B1~B4 Arc section L1~L4 Straight line part G1~G4 Group R1 Resin material

Claims

1. a placement surface on which a plate-shaped object having a notch is placed; a sensor configured to rotate around a predetermined rotation axis relatively along an outer periphery of the object placed on the mounting surface, the sensor repeatedly measuring the distance from the rotation axis to the outer periphery while rotating relatively along the outer periphery, thereby acquiring a series of distance data along the circumferential direction; a processing unit that detects the position of the notch on the outer periphery based on the series of distance data acquired by the sensor; Equipped with the outer peripheral edge extends in a circumferential direction, excluding the notch, to form a predetermined repeating pattern; the processing unit divides the series of distance data into a plurality of groups along a circumferential direction corresponding to the repeating pattern, and compares the divided distance data between the groups to detect the position of the notch. Notch detection device.

2. The object has a rotationally symmetric shape except for the notch. The notch detection device according to claim 1 .

3. The object is non-circular except for the notch.

3. The notch detection device according to claim 1 or 2.

4. the shortest distance from the center of the object to the outer periphery is different from the distance from the center to the notch; 4. The notch detection device according to claim 1.

5. the processing unit corrects the series of distance data acquired by the sensor into a second series of distance data indicating a plurality of distances from the center of the object to the outer periphery; dividing the corrected second set of distance data into N groups along a circumferential direction, each group having a first element through an Mth element, where N and M are integers greater than or equal to two; For each of the first to Mth orders, calculate the average value of the N elements belonging to each of the N groups; Among the N×M elements belonging to the N groups, an element having the largest deviation from the average value for the same order from 1 to M is identified; Detecting the circumferential position of the identified element as the position of the notch.

5. The notch detection device according to claim 1.

6. A notch detection device according to any one of claims 1 to 5; Mold and Equipped with the object is placed in the molding die so that the notch detected by the notch detection device is located at a predetermined position, and is molded with resin in the molding die. Resin molding equipment.

7. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 6, the notch detection device detecting the position of the notch; placing the object in the mold so that the notch detected by the notch detection device is located at the predetermined position; molding the object with resin in the molding die to produce the resin molded product; Including, A method for manufacturing resin molded products.

8. Rotating the sensor relatively around a predetermined rotation axis along the outer periphery of the plate-shaped object having the notch; repeatedly measuring the distance from the rotation axis to the outer circumferential edge with the sensor while the sensor rotates relatively along the outer circumferential edge, thereby obtaining a series of distance data along the circumferential direction; detecting a position of the notch on the outer periphery based on the series of distance data acquired by the sensor; Including, the outer peripheral edge extends in a circumferential direction, excluding the notch, to form a predetermined repeating pattern; detecting the position of the notch includes dividing the series of distance data into a plurality of groups along a circumferential direction corresponding to the repeating pattern, and comparing the divided distance data between the groups to detect the position of the notch. Notch detection method.

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