Power supply device

Abstract

To provide a power supply device reducing load of designing or manufacturing the power supply device by being generally used as a power supply device of a supply object apparatus of power such as various electrical apparatuses or electronic apparatuses.SOLUTION: A power supply device 100 has a main board 101 and a sub-board 110 on a mother board 120 respectively. The main board 101 has a first main side switching element 103 and a second main side switching element 104 operation-controlled by a control unit 105. The sub-board 110 has a first sub- side switching element 113 and a second sub-side switching element 114 operation-controlled by the control unit 105. The control unit 105 controls each operation of the first main side switching element 103, the second main side switching element 104, the first sub-side switching element 113, and the second sub-side switching element 114, and makes the power supply device 100 act as a single-phase DC-AC inverter.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a power supply device that can be used in various electrical or electronic devices. [Background technology]

[0002] There have been power supply devices capable of supplying multiple types of power in the past. For example, Patent Document 1 below discloses a power supply device in which a primary block equipped with an inverter circuit controlled by a control unit can adjust the power supplied to a secondary block according to the magnitude of the output power of the secondary block. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-107973

[0004] However, the power supply device described in Patent Document 1 has a problem in that the entire power supply device must be designed according to the specifications of the various electrical or electronic devices to which power is supplied, and functions as a power supply device that outputs multiple types of power, such as a DC power supply, a DC-DC converter, a DC-AC inverter, or a motor driver, making the design or manufacturing of the power supply device complicated.

[0005] The present invention has been made to address the above-mentioned problems, and its purpose is to provide a power supply device that can be used universally as a power supply device for devices to which power is supplied, such as various electrical or electronic devices, thereby reducing the burden of designing or manufacturing the power supply device. Summary of the Invention

[0006] In order to achieve the above object, the present invention is characterized in that it has, on a main board, a control unit that controls the operation of the switching elements in accordance with a control program, main-side switching elements whose operation is controlled by the control unit, and a control program input unit for inputting the control program to the control unit.

[0007] According to this, the power supply device is provided with a program input section on the main board for inputting a control program to a control section that controls the operation of the main-side switching element, so that the power supply device can be easily configured by inputting a control program corresponding to the connected device to which power is to be supplied to the control section, thereby reducing the burden of designing or manufacturing the power supply device.

[0008] Another feature of the present invention is that the power supply device further includes at least one sub-board electrically connected to the main board, the sub-board including a sub-side switching element whose operation is controlled by the control unit and a sub-side switching element connection portion for electrically connecting to the sub-side switching element, and the main board including a control unit connection portion for electrically connecting the sub-side switching element connection portion to the control unit.

[0009] According to this, the power supply device is equipped with a sub-board equipped with a sub-side switching element whose operation is controlled by the control unit of the main board, thereby increasing the variation in the output power generated and further enhancing the versatility of the power supply device.

[0010] In order to achieve the above-mentioned object, the present invention is characterized in that it provides a power supply device comprising a main board and at least one sub-board connected to the main board, wherein the main board comprises a control unit that controls the operation of switching elements according to a control program, a main-side switching element whose operation is controlled by the control unit, and a control unit connection unit for electrically connecting to the control unit, and the sub-board comprises a sub-side switching element whose operation is controlled by the control unit, and a sub-side switching element connection unit for electrically connecting the control unit connection unit to the sub-side switching element.

[0011] According to this, the power supply device is equipped with a sub-board equipped with a sub-side switching element whose operation is controlled by the control unit of the main board, which increases the variation in output power generated, improves the versatility of the power supply device, and reduces the burden of designing or manufacturing the power supply device.

[0012] Another feature of the present invention is that the power supply device further includes a motherboard, and the motherboard includes a mainboard connection portion for electrically connecting the mainboard, a motherboard input portion electrically connected to the mainboard switching elements via the mainboard connection portion, a motherboard output portion electrically connected to the mainboard switching elements via the mainboard connection portion, and a subboard connection portion to which the subboard is electrically connected while being electrically connected to the mainboard connection portion.

[0013] According to this, the power supply device includes a motherboard to which the main board and the sub-board are electrically connected, and therefore the physically separate main board and sub-board can be handled as a single unit.

[0014] Another feature of the present invention is that the power supply device further includes a main board heat sink for dissipating heat from the main side switching elements, and the main board heat sink includes a main side switching element heat sink that dissipates heat by directly or indirectly contacting the main side switching elements, and a main board mounting portion that is attached to the main board.

[0015] According to this, the power supply device is provided with a main board heat sink having a main switching element heat sink for dissipating heat from the main switching elements, thereby making it possible to suppress malfunctions caused by heat from the main switching elements.

[0016] Another feature of the present invention is that the power supply device further comprises a sub-board heat sink for dissipating heat from the sub-side switching elements, the sub-board heat sink comprising a sub-side switching element heat sink portion that dissipates heat by directly or indirectly contacting the sub-side switching elements, and a sub-board mounting portion that is mounted to the sub-board, and the main board heat sink and the sub-board heat sink are configured to be detachable from each other.

[0017] According to this, the power supply device is equipped with a sub-board heat sink having a sub-side switching element heat sink for dissipating heat from the sub-side switching elements, thereby suppressing malfunctions caused by heat from the sub-side switching elements, and since the main board heat sink and the sub-board heat sink are configured to be detachable from each other, the main board heat sink and the sub-board heat sink can be integrated to make handling easier. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a perspective view showing the outline of the external configuration of a power supply device according to an embodiment of the present invention; [Figure 2] 2 is a block diagram showing a circuit configuration of the power supply device shown in FIG. 1. FIG. [Figure 3] FIG. 2 is a perspective view showing the outline of the external configuration of the main board shown in FIG. [Figure 4] 2 is a perspective view showing the outline of the external configuration of the sub-board shown in FIG. 1. FIG. [Figure 5] 2 is an exploded perspective view showing a state in which the main board and sub-board, to which the board heat sink is attached, in the power supply device shown in FIG. 1 are separated from the mother board. FIG. [Figure 6] FIG. 2 is an exploded perspective view of a board heat sink, a main board, and a sub-board. [Figure 7] 7 is a perspective view showing the outline of the external configuration of a main board heat sink and a sub-board heat sink that constitute the board heat sink shown in FIG. 6. FIG. [Figure 8] 7 is a perspective view showing the outline of the external configuration of a holder that constitutes the substrate heat dissipator shown in FIG. 6. FIG. [Figure 9]FIG. 10 is a block diagram showing a circuit configuration of a power supply device (variable DC-DC converter) according to a modified example of the present invention. [Figure 10] FIG. 10 is a block diagram showing a circuit configuration of a power supply device (diode bridgeless PFC) according to another modified example of the present invention. [Figure 11] FIG. 10 is a block diagram showing a circuit configuration of a power supply device (three-phase motor driver) according to another modified example of the present invention. [Figure 12] FIG. 10 is a block diagram showing a circuit configuration of a power supply device (three-phase DC-AC inverter) according to another modified example of the present invention. [Figure 13] FIG. 10 is a perspective view showing the outline of the external configuration of a power supply device according to another modified example of the present invention, the power supply device including a plurality of sub-boards. DETAILED DESCRIPTION OF THE INVENTION

[0019] An embodiment of a power supply device according to the present invention will now be described with reference to the drawings. Fig. 1 is a perspective view showing the outline of the external configuration of a power supply device 100 according to the present invention. Fig. 2 is a block diagram showing the circuit configuration of the power supply device 100 shown in Fig. 1.

[0020] (Configuration of power supply device 100) This power supply device 100 is a device that supplies DC or AC power to drive various electrical or electronic devices (hereinafter referred to as "target devices") and can output multiple types of power according to the specifications of the target devices to function as a DC power supply, a DC-DC converter, a DC-AC inverter, a motor driver, etc. In this embodiment, power supply device 100 is configured as a single-phase DC-AC inverter that converts DC input power of 200V to 400V into AC power in the range of 100V to 240V and outputs it. This power supply device 100 is mainly configured with a main board 101, a sub-board 110, a motherboard 120, and a board heat sink 200.

[0021] 3, the main board 101 is a device that can supply multiple types of power to a target device either alone or in cooperation with a sub-board 110. Specifically, the main board 101 is configured by providing a first main-side switching element 103, a second main-side switching element 104, a control unit 105, an isolator 106, and a control unit connection unit 107 on a printed circuit board 102 that is rectangular in plan view.

[0022] The first main side switching element 103 and the second main side switching element 104 are elements for generating power according to the equipment to be supplied with power, and are configured with switching elements such as unipolar transistors such as MOSFETs, bipolar transistors such as IGBTs, or diodes. In this case, the first main side switching element 103 and the second main side switching element 104 may be configured with wide-gap semiconductors such as SiC, GaN, diamond, AlN, AlGaN, or ZnO. In this embodiment, the first main side switching element 103 and the second main side switching element 104 are configured with GaN.

[0023] The input / output electrodes (source electrodes and drain electrodes) of the first main side switching element 103 and the second main side switching element 104 are electrically connected to the first main side switching element input / output section 103a and the second main side switching element input / output section 104a, respectively, which consist of metal terminals that protrude from the ends of the printed circuit board 102.

[0024] The control unit 105 is a device for controlling the operation of the first main side switching element 103 and the second main side switching element 104 to generate desired power, and is configured by a microcomputer or a digital signal processor (DSP). In this embodiment, the control unit 105 is configured by a DSP. In this case, the control unit 105 controls the operation of the first main side switching element 103 and the second main side switching element 104 using a PWM signal via the isolator 106.

[0025] This control unit 105 is electrically connected to a control unit input / output unit 105a, which is made up of a plurality of metal terminals that protrude from the end of the printed circuit board 102 and are used for inputting driving power, inputting / outputting digital signals, and communicating with external devices. In this case, some of the terminals of the control unit 105 for inputting / outputting digital signals are electrically connected to the control unit connection unit 107.

[0026] The isolator 106 is an insulating circuit for preventing the voltage applied to the first main switching element 103 and the second main switching element 104 from being applied to the control unit 105.

[0027] The control unit connection portion 107 is a connector for electrically connecting the control unit 105 to the first sub-side switching element 113 and the second sub-side switching element 114 provided on the sub-board 110, and is provided in a state where it protrudes from the surface of the printed circuit board 102.

[0028] 4, the sub-board 110 is a device for supplying multiple types of power to a target device in cooperation with the main board 101. Specifically, the sub-board 110 is configured by including an isolator 112, a first sub-side switching element 113, a second sub-side switching element 114, and a sub-side switching element connection part 115 on a printed circuit board 111.

[0029] The isolator 112 is an insulating circuit that prevents the voltage applied to the first sub-side switching element 113 and the second sub-side switching element 114 from being applied to the control unit 105, similar to the isolator 106.

[0030] The first sub-side switching element 113 and the second sub-side switching element 114 are elements for generating power according to the equipment to be supplied with power, and are configured with transistors or diodes similar to the first main-side switching element 103 and the second main-side switching element 104. In this embodiment, the first sub-side switching element 113 and the second sub-side switching element 114 are configured with GaN, similar to the first main-side switching element 103 and the second main-side switching element 104.

[0031] The input / output electrodes (source electrodes and drain electrodes) of the first sub-side switching element 113 and the second sub-side switching element 114 are electrically connected to a first sub-side switching element input / output unit 113a and a second sub-side switching element input / output unit 114a, respectively, which are made of metal terminals that protrude from the end of the printed circuit board 111. In addition, the control electrodes (gate electrodes) of the first sub-side switching element 113 and the second sub-side switching element 114 are electrically connected to a sub-side switching element connection unit 115 via an isolator 122.

[0032] The sub-side switching element connection part 115 is a connector for electrically connecting to the control part connection part 107 on the main board 101, and is provided in a state where it protrudes from the surface of the printed circuit board 111. The control part connection part 107 and the sub-side switching element connection part 115 can be connected directly or via a connection cord (not shown).

[0033] 5, motherboard 120 is a component that electrically connects main board 101 and sub-board 110 and holds them together as a unit. Specifically, motherboard 120 mainly includes, on printed circuit board 121, motherboard input section 122, input capacitor 123, control power input section 124, main board holder 125, sub-board holder 126, motherboard control section connection section 127, output choke coil 128a, output capacitor 128b, and motherboard output section 129.

[0034] The mother-side input unit 122 is a connector-type terminal for receiving, from an external power source, power to be supplied to the first main-side switching element 103, the second main-side switching element 104, the first sub-side switching element 113, and the second sub-side switching element 114 on the main board 101 and the sub-board 110. The input-side capacitor 123 is a polarized capacitor for stably supplying power received from the external power source to the main board 101 and the sub-board 110. The control power input unit 124 is a metal terminal for receiving drive power to be supplied to the control unit 105 on the main board 101.

[0035] The main board holding portion 125 is a portion that holds the main board 101 while electrically connecting it, and has holes into which the first main side switching element input / output portion 103a, the second main side switching element input / output portion 104a, and the control unit input / output portion 105a are inserted and electrically connected, and is configured such that flat portions are formed around these holes to support the main board heat sink 201, which will be described later.

[0036] The sub-substrate holding portion 126 is a portion that holds the sub-substrate 110 while electrically connecting it, and has holes into which the first sub-side switching element input / output portion 113a and the second sub-side switching element input / output portion 114a are inserted and electrically connected, and is configured such that flat portions are formed around these holes to support the sub-substrate heat sink 210, which will be described later.

[0037] The mother side control unit connection unit 127 is a connector-type connection terminal for inputting a control program to control the operation of the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114 to the control unit 105 of the main board 101, or for the control unit 105 to communicate with other devices.

[0038] The output side choke coil 128a and the output side capacitor 128b are electrical components for smoothing the output voltages from the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114 and removing noise.

[0039] The mother side output unit 129 is a metal terminal for outputting the output power from the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114 to the outside.

[0040] As shown in Figure 6, the board heat sink 200 is a component for ensuring the heat dissipation properties of the main board 101 and the sub-board 110, and is mainly composed of a main board heat sink 201, a sub-board heat sink 210, and a holder 220.

[0041] 7, main board heat sink 201 is a component for ensuring the heat dissipation properties of main board 101, and is made of a material with good thermal conductivity (for example, a metal material such as aluminum). Specifically, main board heat sink 201 is made of a plate-like body that is rectangular in front view and extends along main board 101. In this case, main board heat sink 201 is formed to be longer than the length of main board 101 in the longitudinal direction, and to have a width that is approximately the same as the width of main board 101. Main board heat sink 201 is mainly formed to include main-side switching element heat sink 202, escape portion 203, board holding portions 204a and 204b, and connection portions 205a and 205b.

[0042] The main-side switching element heat dissipation portion 202 is a portion that promotes heat dissipation of the first main-side switching element 103 and the second main-side switching element 104 provided on the main board 101, and is formed to protrude in a convex shape so as to contact the back side of the plate surface on which the first main-side switching element 103 and the second main-side switching element 104 are respectively attached in the printed board 102. In this case, the main-side switching element heat dissipation portion 202 is in close contact with the printed board 102, with an area substantially the same as the area of the first main-side switching element 103 and the second main-side switching element 104 facing the printed board 102.

[0043] The recess 203 is formed at a position separated from the surface of the printed circuit board 102 to form a space between it and the surface of the printed circuit board 102, and is formed recessed relative to the main-side switching element heat dissipation portion 202. In this embodiment, the recess 203 is formed on both sides of the main-side switching element heat dissipation portion 202.

[0044] Board holding portions 204a and 204b are portions against which the edges of both longitudinal ends of printed circuit board 102 abut and which hold the printed circuit board 102 together with holder 220, and are formed in a planar shape extending along the edges of both longitudinal ends of printed circuit board 102. In this case, board holding portions 204a and 204b are formed to protrude toward printed circuit board 102 beyond recess 203.

[0045] Connection portions 205a and 205b are portions into which main-side connection portion 222 of holder 220 fits, and are recessed relative to board holders 204a and 204b. In this embodiment, connection portions 205a and 205b are formed in the shape of a groove extending along board holders 204a and 204b. Through holes for passing screws 223a and 223b are formed in the center of connection portions 205a and 205b in the direction of the groove. As a result, main board heat sink 201 has a generally U-shaped cross section.

[0046] 7, sub-substrate heat sink 210 is a component for ensuring the heat dissipation properties of sub-substrate 110, and is made of a material with good thermal conductivity (for example, a metal material such as aluminum). Specifically, sub-substrate heat sink 210 is formed in a shape symmetrical to main-substrate heat sink 201 with holder 220 interposed therebetween. In other words, sub-substrate heat sink 210 is made of a plate-like body that is rectangular in front view and extends along sub-substrate 110.

[0047] The sub-substrate heat sink 210 is configured to include a sub-side switching element heat sink 211, a recess 212, substrate holding portions 213a, 213b, and connecting portions 214a, 214b, which are formed in the same manner as the main-side switching element heat sink 202, the recess 203, the substrate holding portions 204a, 204b, and the connecting portions 205a, 205b in the main substrate heat sink 201.

[0048] 8, holder 220 is a component for attaching main board 101 to main board heat sink 201 and for attaching sub-board 110 to sub-board heat sink 210, and is formed in a rod shape with a roughly U-shaped cross section. Holder 220 is configured to include main board holding portion 221, main-side connection portion 222, sub-board holding portion 224, and sub-side connection portion 225.

[0049] Main board holding portion 221 is a portion against which the edges of printed circuit board 102 abut to hold it together with main board heat sink 201, and is formed in a flat shape extending along the edges of both longitudinal ends of printed circuit board 102. In other words, main board holding portion 221 is formed in a flat surface parallel to board holding portions 204a and 204b.

[0050] Main-side connecting portion 222 is a portion that fits into connecting portions 205a and 205b of main board heat sink 201, and is formed in a convex shape that fits into connecting portions 205a and 205b. In this case, main-side connecting portion 222 is formed with female threads into which screws 223a and 223b are screwed.

[0051] Similar to the main board holding portion 221, the sub-board holding portion 224 is a portion against which the edge of the printed circuit board 111 rests and which holds it together with the sub-board heat sink 210, and is formed in a planar shape extending along the edges of both longitudinal ends of the printed circuit board 111.

[0052] Similar to main-side connection portion 222, sub-side connection portion 225 is a portion that fits into connection portions 205a and 205b of sub-board heat sink 210, and is formed in a convex shape that fits into connection portions 214a and 214b. In this case, sub-side connection portion 225 is formed with female threads into which screws 226a and 226b are screwed.

[0053] That is, board heat sink 200 is integrally formed by connecting main board heat sink 201 and sub-board heat sink 210 to each other via holder 220. In this case, board heat sink 200 is formed in a cylindrical shape with openings in directions perpendicular to the longitudinal direction of printed circuit boards 102 and 111.

[0054] (Operation of power supply device 100) Next, we will explain the operation of the power supply device 100 configured as described above. First, an operator prepares the main board 101 and the sub-board 110, and also prepares the board heat sink 200, and attaches the board heat sink 200 to the main board 101 and the sub-board 110.

[0055] Specifically, the worker positions the back side of the printed circuit board 102 of the main board 101 opposite to the side on which the first main side switching element 103 and the second main side switching element 104 are arranged, to the main side switching element heat dissipation portion 202 of the main board heat sink 201, and positions both longitudinal ends of the printed circuit board 102 to the board holding portions 204a and 204b, respectively.

[0056] Next, the worker places main board holding portion 221 of holder 220 on both ends of printed circuit board 102 that are respectively placed on board holding portions 204a, 204b, and fits main-side connecting portion 222 of holder 220 into connecting portions 205a, 205b of main board heat dissipator 201. Then, the worker passes screws 226a, 226b through connecting portions 205a, 205b and screws into the screw holes in main-side connecting portion 222. This allows the worker to attach main board heat dissipator 201 to main board 101.

[0057] Next, the worker attaches sub-substrate heat sink 210 to sub-substrate 110 in the same procedure as for main substrate 101. In this case, the worker electrically connects control unit connection portion 107 on main substrate 101 and sub-side switching element connection portion 115 on sub-substrate 110 via a wiring cord (not shown).

[0058] This allows an operator to attach the board heat sink 200 to the main board 101 and the sub-board 110, and handle them as a single unit. In this case, the control unit 105 on the main board 101 is electrically connected to the first sub-side switching elements 113 and the second sub-side switching elements 114 on the sub-board 110 via the control unit connection part 107 and the sub-side switching element connection part 115, respectively. The main board 101 and the sub-board 110 are held inside the board heat sink 200 with the first main-side switching elements 103 and the second main-side switching elements 104 and the first sub-side switching elements 113 and the second sub-side switching elements 114 facing each other.

[0059] Next, the worker prepares the motherboard 120 and attaches the main board 101 and the sub-board 110 to this motherboard 120. Specifically, the worker inserts the first main-side switching element input / output unit 103a, the second main-side switching element input / output unit 104a, and the control unit input / output unit 105a of the main board 101 into the main board holding unit 125 of the motherboard 120 and solders them. The worker also inserts the first sub-side switching element input / output unit 113a and the second sub-side switching element input / output unit 114a of the sub-board 110 into the sub-board holding unit 126 of the motherboard 120 and solders them.

[0060] This allows the worker to attach main board 101 and sub-board 110 to mother board 120. In this case, main board 101 and sub-board 110 are attached in an upright state on mother board 120. Furthermore, board heat sink 200 is placed on mother board 120.

[0061] Next, the worker inputs a control program that controls the operation of each of the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114 into the control unit 105 on the main board 101. Specifically, the worker supplies power to the control unit 105 via the control power input unit 124 on the mother board 120 to start up the control unit 105, and then inputs the control program into the control unit 105 via the mother side control unit connection unit 127.

[0062] In this case, an operator can connect a microcomputer (not shown) or a personal computer (not shown) capable of creating a control program to the control unit 105 via the mother-side control unit connection unit 127 and input the control program. In this case, the control program input to the control unit 105 is configured to control the operation of the first main-side switching element 103, the second main-side switching element 104, the first sub-side switching element 113, and the second sub-side switching element 114 so as to generate the power required by the target device to which the power supply device 100 is connected. In this embodiment, the control program is configured to cause the power supply device 100 to function as a single-phase DC-AC inverter.

[0063] Next, the worker uses power supply device 100 as a power supply device. Specifically, the worker connects an external DC power supply (not shown) to mother-side input unit 122 on motherboard 120, and connects the power supply target device to mother-side output unit 129. This allows the worker to make power supply device 100 function as a power supply device (in this embodiment, a single-phase DC-AC inverter) for the power supply target device.

[0064] Specifically, in the power supply device 100, the control unit 105 controls the operation of the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114, thereby converting the DC power input to the mother side input unit 122 into AC power and outputting it from the mother side output unit 129.

[0065] Next, the worker can stop the operation of the power supply device 100. Specifically, the worker can stop the operation of the power supply device 100 by stopping the supply of input power to the motherboard 120 or the supply of power to the control unit 105.

[0066] Next, the worker can change the specifications of the input voltage or output power (current and voltage) of the power supply device 100. Specifically, the worker can change the specifications of the input voltage or output power (current and voltage) of the power supply device 100 by rewriting the control program stored in the control unit 105 using a procedure similar to the input work of the control program described above.

[0067] As can be understood from the above operation description, according to the above embodiment, the power supply device 100 is provided with a motherboard control unit connection unit 127 on the motherboard 120 for inputting a control program to the control unit 105 that controls the operation of each of the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114.Therefore, by inputting a control program corresponding to the connected device to which power is to be supplied into the control unit 105, the power supply device can be easily configured, thereby reducing the burden of designing or manufacturing the power supply device.

[0068] Furthermore, the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. In the description of each modification, the same parts as those in the above-described embodiment are designated by the same reference numerals, and redundant description will be omitted.

[0069] For example, in the above embodiment, the power supply device 100 is configured to include the motherboard 120. However, the power supply device 100 can be configured without the motherboard 120. In this case, the power supply device 100 may have the motherboard input unit 122, input capacitor 123, control power input unit 124, sub-board holder 126, motherboard control unit connection unit 127, output choke coil 128a, output capacitor 128b, and motherboard output unit 129, which are included in the motherboard 120, provided on the main board 101. In this case, the main board 101 may be configured to be connected to the sub-board 110 via a wiring cord instead of the sub-board holder 126. Furthermore, the motherboard control unit connection unit 127 can function as the control unit input / output unit 105a on the main board 101.

[0070] Furthermore, in the above embodiment, the power supply device 100 is configured to include the sub-board 110. However, the sub-board 110 is required depending on the specifications of the power supply device 100, and if the specifications of the power supply device 100 can be satisfied with only the main board 101, the sub-board 110 is not necessary.

[0071] For example, Fig. 9 is a block diagram showing an example of a power supply device 100 configured as a variable DC-DC converter that converts 400V DC input power into DC power in the range of 0V to 380V and outputs it. In this power supply device 100, the second main switching element 104 of the main board 101 is connected to the motherboard output unit 129 compared to the motherboard 120 in the above embodiment, and because the output power is DC, the output choke coil 128a is reduced to one and an additional polarized output capacitor 128c is installed. In addition, a control program for causing the first main switching element 103 and the second main switching element 104 to function as a variable DC-DC converter is input to the control unit 105. This allows the power supply device 100 to function as a variable DC-DC converter.

[0072] In this way, power supply device 100 according to the present invention can make main board 101 function as a core board for various power supply devices by changing the control program stored in control unit 105 and the wiring of mother board 120.

[0073] For example, FIG. 10 is a block diagram showing an example of a power supply device 100 configured with a diode bridgeless PFC (power factor correction circuit). This power supply device 100 converts an AC input voltage of 85V to 260V into DC power of 400V and outputs it. In this power supply device 100, the mother-side output unit 129 of the motherboard 120 in the above embodiment serves as the mother-side input unit 130, and the mother-side input unit 122 in the above embodiment serves as the mother-side output unit 131. In this case, the output-side capacitor 128b in the above embodiment functions as the input-side capacitor 132. Furthermore, the output-side choke coil 128a in the above embodiment is provided as independent input-side choke coils 133a and 133b for each of the two terminals of the mother-side input unit 130, downstream of the input-side capacitor 132. Furthermore, the input-side capacitor 123 in the above embodiment functions as the output-side capacitor 134.

[0074] Furthermore, a control program for causing the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, and the second sub side switching element 114 to function as a diode bridgeless PFC is input to the control unit 105. This allows the power supply device 100 to function as a diode bridgeless PFC.

[0075] 11 is a block diagram showing an example of a power supply device 100 configured with a three-phase motor driver. In this power supply device 100, an isolator 140, a third sub-side switching element 141, and a fourth sub-side switching element 142 similar to the isolator 112, the first sub-side switching element 113, and the second sub-side switching element 114 in the above embodiment are provided in parallel with the isolator 112, the first sub-side switching element 113, and the second sub-side switching element 114. That is, the sub-substrate 110 is provided with four elements, namely, the first sub-side switching element 113, the second sub-side switching element 114, the third sub-side switching element 141, and the fourth sub-side switching element 142, whose operation is controlled by the control unit 105.

[0076] In this case, the third sub-side switching element 141 and the fourth sub-side switching element 142 are electrically connected to the third sub-side switching element input / output unit 141a and the fourth sub-side switching element input / output unit 142a, respectively, which are similar to the first sub-side switching element input / output unit 113a and the second sub-side switching element input / output unit 114a.

[0077] Meanwhile, holes are formed in the sub-substrate holding portion 126 of the motherboard 120 to which the third sub-side switching element input / output portion 141a and the fourth sub-side switching element input / output portion 142a are electrically connected. Also, the mother-side output portion 129 of the power supply device 100 extends from the output terminal of the third sub-side switching element 141 and serves as a three-phase AC output terminal. In this case, the power supply device 100 does not include the output-side choke coil 128a and the output-side capacitor 128b of the above embodiment.

[0078] Furthermore, a control program for causing the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, the second sub side switching element 114, the third sub side switching element 141, and the fourth sub side switching element 142 to function as a three-phase motor driver is input to the control unit 105. This allows the power supply device 100 to function as a three-phase motor driver.

[0079] 12 is a block diagram showing an example in which the power supply device 100 is configured as a three-phase DC-AC inverter. In this power supply device 100, an output choke coil 128a and an output capacitor 128b are provided at each output of the first main switching element 103, the first sub-side switching element 113, and the third sub-side switching element 141 in the three-phase motor driver circuit shown in FIG.

[0080] Furthermore, a control program for causing the first main side switching element 103, the second main side switching element 104, the first sub side switching element 113, the second sub side switching element 114, the third sub side switching element 141, and the fourth sub side switching element 142 to function as a three-phase DC-AC inverter is input to the control unit 105. This allows the power supply device 100 to function as a three-phase DC-AC inverter.

[0081] The power supply device 100 according to the present invention can be used as a power supply for target devices other than these modifications, such as a battery charger, a pump driver, a lighting device, a laser oscillator, or a piezoelectric element.

[0082] Furthermore, in the above embodiment, power supply device 100 is configured to include board heat sink 200. However, if the need for heat dissipation from main board 101 or sub-board 110 is not high (for example, if input / output power is low), power supply device 100 can be configured without board heat sink 200. In this case, power supply device 100 can also be configured to include only one of main board heat sink 201 and sub-board heat sink 210.

[0083] 13, when the power supply device 100 includes multiple sub-substrates 110 (FIG. 13 shows three sub-substrates 110), a sub-substrate heat sink 210 may be provided for each sub-substrate 110. In this case, the power supply device 100 may be configured to include multiple sub-substrate holders 126 on a single mother substrate 120 so that a sub-substrate heat sink 210 can be placed for each sub-substrate holder 126. In these cases, the substrate heat sink 200 can be configured so that the second and subsequent sub-substrate heat sinks 210 can be attached directly to the main substrate heat sink 201, or so that the second and subsequent sub-substrate heat sinks 210 can be attached to the sub-substrate heat sink 210 attached to the main substrate heat sink 201.

[0084] Furthermore, in the above embodiment, board heat dissipator 200 is configured such that main board heat dissipator 201 and sub-board heat dissipator 210 are detachable from each other. However, board heat dissipator 200 can also be configured such that main board heat dissipator 201 and sub-board heat dissipator 210 cannot be attached to each other and are independent of each other.

[0085] Furthermore, in the above embodiment, power supply device 100 is configured to include main board 101, sub-board 110, motherboard 120, and board heat sink 200. However, power supply device 100 can also be configured to include at least main board 101. If power supply device 100 is configured without motherboard 120, motherboard control unit connection unit 127 for inputting a control program to control unit 105 can be made to function as control unit input / output unit 105a on main board 101. Furthermore, motherboard input unit 122, input capacitor 123, control power input unit 124, output choke coil 128a, output capacitor 128b, and motherboard output unit 129, which are provided on motherboard 120, may be provided on main board 101.

[0086] Furthermore, in the above embodiment, power supply device 100 is configured to include mother-side control unit connection unit 127 so that a control program can be input or rewritten to control unit 105. In other words, mother-side control unit connection unit 127 corresponds to the control program input unit of the present invention. However, power supply device 100 can also be configured so that the control program input unit is omitted and the control program cannot be input or rewritten to control unit 105. In this case, control unit 105 is mounted on main board 101 with a control program input in advance. [Explanation of symbols]

[0087] 100...power supply device, 101...main board, 102...printed board, 103...first main side switching element, 103a...first main side switching element input / output section, 104...second main side switching element, 104a...second main side switching element input / output section, 105...control section, 105a...control section input / output section, 106...isolator, 107...control section connection section, 110...sub-board, 111...printed circuit board, 112...isolator, 113...first sub-side switching element, 113a...first sub-side switching element input / output section, 114...second sub-side switching element, 114a...second sub-side switching element input / output section, 115...sub-side switching element connection section, 120... motherboard, 121... printed circuit board, 122... motherboard side input section, 123... input side capacitor, 124... control power input section, 125... main board holding section, 126... sub-board holding section, 127... motherboard side control section connection section, 128a... output side choke coil, 128b, 128c... output side capacitor, 129... motherboard side output section, 130... mother side input section, 131... mother side output section, 132... input side capacitor, 133a, 133b... input side choke coil, 134... output side capacitor, 140... isolator, 141... third sub-side switching element, 141a... third sub-side switching element input / output section, 142... fourth sub-side switching element, 142a... fourth sub-side switching element input / output section, 200...board heat sink, 201...main board heat sink, 202...main side switching element heat sink, 203...relief portion, 204a, 204b...board holding portion, 205a, 205b...connection portion, 210... Sub-substrate heat sink, 211... Sub-side switching element heat sink, 212... Relief portion, 213a, 213b... Substrate holding portion, 214a, 214b... Connection portion, 220...holding body, 221...main board holding portion, 222...main side connection portion, 223a, 223b...screws, 224...sub-board holding portion, 225...sub-side connection portion, 226a, 226b...screws.

Claims

1. On the main board a control unit that controls the operation of the switching element in accordance with a control program; a main-side switching element whose operation is controlled by the control unit; A power supply device comprising: a control program input section for inputting the control program to the control section.

2. The power supply device according to claim 1, further comprising: At least one sub-board electrically connected to the main board, The sub-substrate is a sub-side switching element whose operation is controlled by the control unit; a sub-side switching element connection portion for electrically connecting to the sub-side switching element, The main board is A power supply device comprising: a control unit connection portion for electrically connecting the sub-side switching element connection portion to the control unit.

3. A power supply device comprising a main board and at least one sub-board connected to the main board, The main board is a control unit that controls the operation of the switching element in accordance with a control program; a main-side switching element whose operation is controlled by the control unit; a control unit connection portion for electrically connecting to the control unit, The sub-substrate is a sub-side switching element whose operation is controlled by the control unit; a sub-side switching element connection portion for electrically connecting the control unit connection portion to the sub-side switching element.

4. The power supply device according to claim 2 or 3, further comprising: Equipped with a motherboard, The motherboard comprises: a main board connection portion for electrically connecting the main board; a mother-side input section electrically connected to the main-side switching element via the main board connection section; a mother-side output section electrically connected to the main-side switching element via the main board connection section; a sub-board connection portion to which the sub-board is electrically connected while being electrically connected to the main board connection portion.

5. The power supply device according to claim 2 or 3, further comprising: a main board heat sink for dissipating heat from the main-side switching element; The main board heat sink is a main-side switching element heat dissipation portion that dissipates heat by being in direct or indirect contact with the main-side switching element; A power supply device comprising a main board mounting portion that is attached to the main board.

6. The power supply device according to claim 5, further comprising: a sub-substrate heat sink for dissipating heat from the sub-side switching element; The sub-substrate heat sink is a sub-side switching element heat dissipation portion that dissipates heat by directly or indirectly contacting the sub-side switching element; a sub-board mounting portion that is attached to the sub-board; The power supply device is characterized in that the main board heat sink and the sub-board heat sink are configured to be detachable from each other.

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