Alignment device

Abstract

To provide an alignment device that can align a first member and a second member with high precision.SOLUTION: A substrate bonding apparatus 1 (alignment device) includes a first substrate holder 10, a second substrate holder 20, a second movement actuator 200, an imaging unit 50, and a control unit 91. The second movement actuator 200 moves one of the first substrate holder 10 and the second substrate holder 20 in the horizontal direction. The imaging unit 50 captures an image of the second mark M2 on the second substrate holder 20 through a first formation region R1 of the first substrate holder 10. The control unit 91 controls the second movement actuator 200 on the basis of the imaging result of the imaging unit 50 such that a first mark M1 and the second mark M2 are in a predetermined positional relationship. At least one of the first formation region R1 and the second formation region R2 is wider than the field of view of the imaging unit 50.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an alignment device. [Background technology]

[0002] Conventionally, there has been known an apparatus that includes a first member for holding a first substrate, a second member disposed opposite the first member for holding a second substrate, an actuator for moving the second member, and an imaging unit for capturing images of a first alignment mark provided on the first member and a second alignment mark provided on the second member, and that aligns the first and second members and then bonds the first and second substrates together. Patent Document 1, for example, describes an example of such an apparatus that includes a first holding unit for holding a first plate-like body on which a first alignment mark is formed, a second holding unit for holding a second optically transparent plate-like body on which a second alignment mark is formed, and an imaging unit disposed on the opposite side of the second plate-like body from the first plate-like body and imaging the first and second plate-like bodies. In this apparatus, the imaging unit captures images of the first alignment mark and the second alignment mark in the same field of view. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-165331 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, in a substrate bonding apparatus that bonds two substrates together, the two substrates must be electrically connected to each other, so they must be aligned with high precision. To align the two substrates with high precision, the magnification of the imaging unit must be increased. This narrows the field of view of the imaging unit.

[0005] However, if the field of view of the imaging unit becomes narrow, it may become impossible to fit both the first alignment mark and the second alignment mark within the same field of view, making it difficult to align the two substrates with high precision.

[0006] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an alignment device that can accurately align a first member and a second member. [Means for solving the problem]

[0007] According to one aspect of the present invention, an alignment device includes a first member, a second member, a moving actuator, a mark imaging unit, and a control unit. A first mark is formed on the first member. The second member is disposed opposite the first member. A second mark is formed on the second member. The moving actuator moves one of the first member and the second member in a direction intersecting a direction in which the first member and the second member face each other. The mark imaging unit images the first mark and the second mark. The control unit controls the moving actuator. The first member has a first formation area in which one or more of the first marks are formed. The second member has a second formation area in which one or more of the second marks are formed. The mark imaging unit images the second mark of the second member via the first formation area of the first member. The control unit controls the moving actuator based on the imaging result of the mark imaging unit so that the first mark and the second mark are in a predetermined positional relationship. At least one of the first formation area and the second formation area is wider than the field of view of the mark imaging unit, and the mark in at least one of the first formation area and the second formation area includes coordinate information.

[0008] In one embodiment, the at least one mark has a main mark arranged in the center and a plurality of sub-marks arranged around the main mark.

[0009] In one embodiment, the primary mark and the secondary mark differ in at least one of shape, size, and spacing.

[0010] In one embodiment, the sub-marks are formed so that at least one of the spacing between adjacent sub-marks and the size of the sub-marks increases with increasing distance from the center.

[0011] In one embodiment, the secondary marks have different shapes depending on the distance from the central portion.

[0012] In one embodiment, the mark imaging unit is fixed to the first member, the movement actuator moves the second member, the second formation area is larger than a field of view of the mark imaging unit, and the second mark includes the coordinate information.

[0013] In one embodiment, the substrate processing apparatus further includes a first imaging unit and a second imaging unit. The first member has a first chuck that holds a first substrate on which a first substrate mark is formed. The second member has a second chuck that holds a second substrate on which a second substrate mark is formed. The first imaging unit images the first mark and the first substrate mark. The second imaging unit images the second mark and the second substrate mark. The control unit calculates a first positional relationship between the first mark and the first substrate mark based on the imaging result of the first imaging unit. The control unit calculates a second positional relationship between the second mark and the second substrate mark based on the imaging result of the second imaging unit. The control unit calculates the predetermined positional relationship based on the first positional relationship and the second positional relationship. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide an alignment device that can accurately align a first member and a second member. [Brief explanation of the drawings]

[0015] [Figure 1]1 is a plan view showing a schematic configuration of a substrate bonding apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a block diagram showing the configuration of a substrate bonding apparatus. [Figure 3] 5 is a flowchart showing a method for bonding a first substrate and a second substrate using the substrate bonding apparatus of the present embodiment. [Figure 4] FIG. 2 is a perspective view schematically illustrating the structure of a joint unit. [Figure 5] 10 is a schematic view showing the structure around the second chuck of the joining unit as viewed from the X direction. FIG. [Figure 6] 10 is a schematic view showing the structure around the second chuck of the joining unit as viewed from the Y direction. FIG. [Figure 7] FIG. 10 is a schematic view showing the structure around the support base from below. [Figure 8] FIG. 2 is a perspective view schematically illustrating the structure of the joint unit from below. [Figure 9] 10 is a diagram showing the structure of the periphery of the first mark of the first reference mask as viewed from the first substrate detection sensor side (bottom side) in a state where one surface of the first stage faces downward. FIG. [Figure 10] 10 is a diagram showing the structure of the periphery of the second mark of the second reference mask as viewed from the second substrate detection sensor side (upper side). FIG. [Figure 11] 10 is a flowchart showing a substrate bonding method of the bonding unit. [Figure 12] FIG. 2 is a diagram schematically illustrating the structure of the first chuck as viewed from below with one surface of the first stage facing downward. [Figure 13] FIG. 2 is a diagram schematically illustrating the structure of a second chuck as viewed from above. [Figure 14] FIG. 2 is a diagram schematically illustrating the structure of the first chuck as viewed from below with one surface of the first stage facing downward. [Figure 15] FIG. 2 is a diagram schematically illustrating the structure of a second chuck as viewed from above. [Figure 16] FIG. 10 is a plan view showing the positional relationship between the first substrate and the second substrate in a state where the second chuck is placed at a reference position. [Figure 17]FIG. 10 is a plan view showing the positional relationship between the first mark and the second mark in a state where the second chuck is placed at a reference position. [Figure 18] FIG. 2 is a plan view showing a state in which the first substrate and the second substrate are aligned. [Figure 19] FIG. 10 is a diagram showing another example of the second marks of the second reference mask, viewed from the second substrate detection sensor side (upper side). DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, an embodiment of an alignment device according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. In this embodiment, the X- and Y-axes are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0017] A substrate bonding apparatus 1 according to one embodiment of the present invention will be described with reference to Figures 1 to 18. In this embodiment, the substrate bonding apparatus 1 will be described as an example of an alignment apparatus of the present invention. First, the overall configuration of the substrate bonding apparatus 1 will be described with reference to Figure 1. Figure 1 is a plan view showing a schematic configuration of the substrate bonding apparatus 1 according to one embodiment of the present invention.

[0018] As shown in FIG. 1, the substrate bonding apparatus 1 stacks and bonds a first substrate W1 and a second substrate W2. In this embodiment, the substrate bonding apparatus 1 performs, for example, an activation process, a cleaning process, and a bonding process on the first substrate W1 and the second substrate W2. Note that in this embodiment, the first substrate W1 and the second substrate W2 are bonded together by bonding the first substrate W1 and the second substrate W2. For this reason, in the following description, bonding the first substrate W1 and the second substrate W2 may be referred to as bonding the first substrate W1 and the second substrate W2 together.

[0019] The first substrate W1 and the second substrate W2 are, for example, semiconductor substrates, glass substrates, etc. In this embodiment, the first substrate W1 and the second substrate W2 are substantially disk-shaped semiconductor wafers.

[0020] Hereinafter, the first substrate W1 and the second substrate W2 may be referred to as substrate W unless otherwise required.

[0021] In this embodiment, the substrate W has a front surface Wa (see FIG. 4) and a back surface located opposite the front surface Wa. The front surface Wa is a device-forming surface on which elements are formed. The back surface is a non-device-forming surface on which elements are not formed.

[0022] Each substrate W has a plurality of (for example, several tens to several hundreds) semiconductor chips (not shown). The semiconductor chips constitute integrated circuits such as CPUs and / or DRAMs. The semiconductor chips have, for example, a semiconductor element layer (not shown) in which a plurality of semiconductor elements such as transistors are formed, and a plurality of electrodes (not shown). The electrodes are made of a metal material such as copper, gold, or aluminum. In this embodiment, the electrodes are made of, for example, copper. The semiconductor element layer and the electrodes are formed on the surface Wa of the substrate W.

[0023] The electrodes of the first substrate W1 and the electrodes of the second substrate W2 are bonded and electrically connected, and the electrodes of the second substrate W2 are disposed at positions corresponding to the electrodes of the first substrate W1.

[0024] The electrodes of the substrate W are formed as, for example, bumps and / or electrode pads. In this embodiment, the electrodes of the substrate W are formed as bumps. In addition, in this embodiment, an insulating film is formed on the surface of the substrate W so as to fill the periphery of the electrodes. The electrodes are exposed from the insulating film, and the electrodes and the insulating film are formed to be approximately flush with each other.

[0025] The substrate bonding apparatus 1 includes a transport path CP, a first load port LP1, a second load port LP2, a third load port LP3, an activation unit AU, a cleaning unit CU, a pre-alignment unit PU, a transport unit TU, a bonding unit JU, a center robot CR, a transport robot TR, and a control device 90.

[0026] The center robot CR, the first load port LP1, the second load port LP2, the third load port LP3, the activation unit AU, the cleaning unit CU, the pre-alignment unit PU, the transport unit TU, and the joining unit JU are arranged to face the transport path CP.

[0027] The center robot CR holds and transports the substrate W. The center robot CR moves within the transport path CP.

[0028] The first load port LP1 accommodates a plurality of (e.g., 25) first substrates W1. Specifically, the first load port LP1 is provided with a FOUP (also called a carriage) (not shown) that can accommodate a plurality of first substrates W1 in a stacked state.

[0029] The second load port LP2 accommodates a plurality of (e.g., 25) second substrates W2. Specifically, a FOUP (not shown) capable of accommodating a plurality of second substrates W2 in a stacked state is disposed on the second load port LP2.

[0030] The third load port LP3 accommodates a plurality of (e.g., 25) laminated substrates WL. Specifically, a FOUP (not shown) capable of accommodating a plurality of laminated substrates WL in a stacked state is disposed on the third load port LP3. The laminated substrate WL is a substrate in which a first substrate W1 and a second substrate W2 are stacked and bonded together.

[0031] The activation unit AU activates the surface Wa of the substrate W. The activation unit AU activates at least the surface of the electrode of the substrate W. Specifically, the activation unit AU performs plasma processing on the substrate W. The type of gas used in the plasma processing is not particularly limited, but is, for example, oxygen or nitrogen.

[0032] The activation unit AU includes, for example, a high-frequency power supply and a pair of electrodes to which a high-frequency voltage is applied. By applying a high-frequency voltage between the pair of electrodes, the processing gas is converted into plasma. For example, when oxygen gas is used as the processing gas, the oxygen gas is converted into plasma and becomes oxygen ions. When the surface Wa of the substrate W is irradiated with the oxygen ions, dangling bonds (unbonded hands) are generated on the surface of the electrodes.

[0033] The cleaning unit CU cleans the substrate W. In this embodiment, the cleaning unit CU cleans the substrate W activated by the activation unit AU. The cleaning unit CU has a cleaning nozzle (not shown) that discharges a cleaning liquid. Examples of the cleaning liquid include deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0034] The cleaning unit CU cleans the substrate W, thereby cleaning the electrodes of the substrate W. At this time, hydroxyl groups are formed on the surfaces of the electrodes.

[0035] The transfer unit TU is disposed so as to face the transfer path CP, the pre-alignment unit PU, and the joining unit JU. The transfer unit TU accommodates a transfer robot TR.

[0036] The transport robot TR holds and transports the substrate W. The transport robot TR delivers the substrate W between the center robot CR, the pre-alignment unit PU, and the bonding unit JU.

[0037] The pre-alignment unit PU aligns the substrates W one by one before alignment in the bonding unit JU. Hereinafter, alignment by the pre-alignment unit PU may be referred to as pre-alignment.

[0038] The bonding unit JU bonds together, under atmospheric pressure, two substrates W (a first substrate W1 and a second substrate W2) that have been aligned by the pre-alignment unit PU. The detailed structure of the bonding unit JU will be described later.

[0039] Fig. 2 is a block diagram showing the configuration of the substrate bonding apparatus 1. As shown in Fig. 2, a control device 90 controls various operations of the substrate bonding apparatus 1. The control device 90 includes a control unit 91 and a storage unit 93. The control unit 91 has a processor. The control unit 91 has, for example, a central processing unit (CPU). Alternatively, the control unit 91 may have a general-purpose computer.

[0040] The storage unit 93 stores data and computer programs. The data defines, for example, the processing content and processing procedure for joining.

[0041] The storage unit 93 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 93 may include removable media. The control unit 91 executes a computer program stored in the storage unit 93 to perform the joining operation.

[0042] The control unit 91 controls the center robot CR, activation unit AU, cleaning unit CU, transport robot TR, pre-alignment unit PU, and joining unit JU by sending control signals to the center robot CR, activation unit AU, cleaning unit CU, transport robot TR, pre-alignment unit PU, and joining unit JU.

[0043] Next, a substrate bonding method using the substrate bonding apparatus 1 of this embodiment will be described with reference to Fig. 3. Fig. 3 is a flowchart showing a method for bonding a first substrate W1 and a second substrate W2 using the substrate bonding apparatus 1 of this embodiment. In this embodiment, the method for bonding the first substrate W1 and the second substrate W2 includes steps SA to SD. Steps SA to SD are executed by the control unit 91.

[0044] 3, in step SA, the control unit 91 executes the activation process. Specifically, the control unit 91 controls the center robot CR to load the first substrate W1 from the first load port LP1 into the activation unit AU. Then, the control unit 91 controls the activation unit AU to perform plasma processing on the first substrate W1. Similarly, the control unit 91 controls the center robot CR to load the second substrate W2 from the second load port LP2 into the activation unit AU. Then, the control unit 91 controls the activation unit AU to perform plasma processing on the second substrate W2.

[0045] Next, in step SB, the control unit 91 executes the cleaning process. Specifically, the control unit 91 controls the center robot CR to load the first substrate W1 from the activation unit AU into the cleaning unit CU. Then, the control unit 91 controls the cleaning unit CU to perform the cleaning process on the first substrate W1. Similarly, the control unit 91 controls the center robot CR to load the second substrate W2 from the activation unit AU into the cleaning unit CU. Then, the control unit 91 controls the cleaning unit CU to perform the cleaning process on the second substrate W2.

[0046] Next, in step SC, the control unit 91 executes a pre-alignment process. Specifically, the control unit 91 controls the center robot CR and the transport robot TR to unload the first substrate W1 from the cleaning unit CU and load it into the pre-alignment unit PU. Then, the control unit 91 controls the pre-alignment unit PU to perform the pre-alignment process on the first substrate W1.

[0047] Similarly, the control unit 91 controls the center robot CR and the transport robot TR to unload the second substrate W2 from the cleaning unit CU and load it into the pre-alignment unit PU, and then controls the pre-alignment unit PU to perform pre-alignment processing on the second substrate W2.

[0048] Next, in step SD, the control unit 91 executes a bonding process. Specifically, the control unit 91 controls the transport robot TR to carry the first substrate W1 from the pre-alignment unit PU to the bonding unit JU. Similarly, the control unit 91 controls the transport robot TR to carry the second substrate W2 from the pre-alignment unit PU to the bonding unit JU. Then, the control unit 91 controls the bonding unit JU to align the first substrate W1 and the second substrate W2, and then performs a bonding process to bond them together.

[0049] In this manner, the substrate bonding process by the substrate bonding apparatus 1 of this embodiment is completed.

[0050] In this embodiment, step SA is described as processing the first substrate W1 and the second substrate W2 in parallel, but the activation process for the first substrate W1 and the activation process for the second substrate W2 may be performed in sequence. Similarly, in each of steps SB to SC, it is described as processing the first substrate W1 and the second substrate W2 in parallel, but the process for the first substrate W1 and the process for the second substrate W2 may be performed in sequence. Furthermore, the process of steps SA to SC for the first substrate W1 and the process of steps SA to SC for the second substrate W2 may be performed in parallel.

[0051] Next, the joining unit JU of this embodiment will be described with reference to Figs. 4 to 8. Fig. 4 is a perspective view that schematically shows the structure of the joining unit JU. As shown in Fig. 4, the joining unit JU comprises a base 2, a first substrate holder 10, a second substrate holder 20, a first movement actuator 100, and a second movement actuator 200. The first substrate holder 10 is an example of a "first member" in the present invention. The second substrate holder 20 is an example of a "second member" in the present invention. The second movement actuator 200 is an example of a "movement actuator" in the present invention.

[0052] The base 2 supports the first substrate holder 10, the second substrate holder 20, the first movement actuator 100, and the second movement actuator 200. The base 2 is made of, for example, stone.

[0053] In this embodiment, the first substrate holder 10 holds the back surface of the first substrate W1 (the surface opposite to the surface to be bonded to the second substrate W2).

[0054] The first substrate holder 10 has a first stage 11 and a first chuck 12 fixed to the first stage 11. The first stage 11 has one surface 11a to which the first chuck 12 is attached. The first stage 11 is, for example, a plate having a rectangular parallelepiped shape. The first stage 11 is made of, for example, ceramic, metal, or the like.

[0055] The first chuck 12 holds the back surface of the first substrate W1. The holding method by the first chuck 12 is not particularly limited, but may be, for example, a vacuum type. The first chuck 12 is, for example, a cylindrical or disc-shaped plate. The first chuck 12 is made of, for example, ceramic or metal. The first chuck 12 is also configured to be rotatable around its center.

[0056] In this embodiment, the second substrate holder 20 holds the back surface of the second substrate W2 (the surface opposite to the surface to be bonded to the first substrate W1).

[0057] The second substrate holder 20 has a second stage 21 and a second chuck 22 fixed to the second stage 21. The second stage 21 holds the second chuck 22. The second stage 21 is, for example, a plate having a rectangular parallelepiped shape. The second stage 21 is made of, for example, ceramic or metal.

[0058] The second chuck 22 holds the back surface of the second substrate W2. The holding method by the second chuck 22 is not particularly limited, but may be, for example, a vacuum type. The second chuck 22 is, for example, a cylindrical or disc-shaped plate. The second chuck 22 is made of, for example, ceramic or metal. The second chuck 22 is also configured to be rotatable around its center.

[0059] The first movement actuator 100 has an inversion actuator 110, an elevation actuator 120, and a first gantry 130. In Fig. 4, the first gantry 130 is depicted by a two-dot chain line.

[0060] The inversion actuator 110 turns the first substrate holder 10 upside down. The inversion actuator 110 has a rotating shaft 111 fixed to the first substrate holder 10 and a rotation drive unit (not shown) that rotates the rotating shaft 111. The rotation drive unit has, for example, a stepping motor. The rotation drive unit rotates the rotating shaft 111 by 180 degrees, thereby turning the first substrate holder 10 upside down.

[0061] The first movement actuator 100 also has a first rotation drive unit 140. The first rotation drive unit 140 is attached to the first substrate holder 10. The first rotation drive unit 140 rotates the first chuck 12 in the circumferential direction. The first rotation drive unit 140 includes, for example, a direct drive motor.

[0062] In this embodiment, the joining unit JU includes an angle detection sensor 150. The angle detection sensor 150 includes, for example, three or more distance measurement sensors 151. The distance measurement sensors 151 are attached, for example, to one surface 11a of the first substrate holder 10, and measure the distance to the second substrate holder 20. By rotating the rotation shaft 111 based on the detection results of the distance measurement sensors 151, the first substrate holder 10 can be positioned parallel to the second substrate holder 20.

[0063] The lifting actuator 120 moves the first substrate holder 10 up and down. The lifting actuator 120 has a pair of support members 121 and a pair of lifting mechanisms 122. The support members 121 support the reversing actuator 110. The support members 121 rotatably support the rotation shaft 111 of the reversing actuator 110.

[0064] The lifting mechanism 122 has a plurality of movers 122a and a plurality of rails (not shown). The movers 122a are fixed to a support member 121. Two movers 122a are fixed to one support member 121. The movers 122a move along the rails. The movers 122a have, for example, a coil. The movers 122a also have an encoder that detects the distance moved along the rails (not shown).

[0065] A rail (not shown) is fixed to the first gantry 130 so as to extend in the vertical direction. The rail has a plurality of magnets. The magnets are arranged so that their north and south poles are alternately aligned in the vertical direction. When a current is passed through the coil of the mover 122a, the mover 122a moves along the rail. When the mover 122a moves up and down along the rail, the first substrate holder 10 moves up and down.

[0066] The second movement actuator 200 has a parallel movement unit 210 and a second rotation drive unit 230 (see FIG. 5). The parallel movement unit 210 translates the second substrate holder 20 in the horizontal direction along the upper surface of the base 2. The parallel movement unit 210 has a movement unit 211 that moves the second substrate holder 20 in the X direction, a movement unit 212 that moves the second substrate holder 20 in the Y direction, and a support base 213 that is arranged between the movement unit 211 and the movement unit 212.

[0067] 5 is a schematic diagram showing the structure around the second substrate holder 20 of the joining unit JU from the X direction. As shown in FIGS. 4 and 5, the moving part 211 is disposed on a support base 213. The moving part 211 has a linear motor 2111 and a linear guide 2112. In this embodiment, the moving part 211 has a pair of linear motors 2111 and a pair of linear guides 2112.

[0068] The pair of linear motors 2111 are arranged on the outer sides in the Y direction of the second stage 21 of the second substrate holder 20. The pair of linear motors 2111 are arranged at a predetermined distance from each other in the Y direction.

[0069] Each linear motor 2111 has a mover 2111a and a rail 2111b. The mover 2111a is fixed to a side surface of the second stage 21. The mover 2111a moves along the rail 2111b. The rail 2111b is fixed to the support base 213 so as to extend in the X direction. The mover 2111a moves along the rail 2111b, causing the second substrate holder 20 to move in the X direction.

[0070] The pair of linear guides 2112 are disposed between the second stage 21 of the second substrate holder 20 and the support base 213. The pair of linear guides 2112 are disposed at a predetermined distance in the Y direction.

[0071] Each linear guide 2112 has a mover 2112a and a rail 2112b extending in the X direction. The mover 2112a is fixed to the lower surface (the surface facing the support base 213) of the second stage 21. The mover 2112a moves along the rail 2112b.

[0072] 6 is a schematic diagram showing the structure around the second substrate holder 20 of the joining unit JU from the Y direction. As shown in FIGS. 4 and 6, the moving part 212 is disposed on the base 2. The moving part 212 has a linear motor 2121 and a linear guide 2122. In this embodiment, the moving part 212 has a pair of linear motors 2121 and a pair of linear guides 2122.

[0073] The pair of linear motors 2121 are disposed between the support stand 213 and the base 2. The pair of linear motors 2121 are disposed at a predetermined distance from each other in the X direction.

[0074] Each linear motor 2121 has a mover 2121a and a rail 2121b. The mover 2121a is fixed to the lower surface of the support stand 213 (the surface facing the base 2). The mover 2121a moves along the rail 2121b. The rail 2121b is fixed to the base 2 so as to extend in the Y direction. As the mover 2121a moves along the rail 2121b, the support stand 213 and the second substrate holder 20 move in the Y direction.

[0075] The pair of linear guides 2122 are disposed between the support base 213 and the base 2. The pair of linear guides 2122 are disposed at a predetermined distance in the X direction.

[0076] Each linear guide 2122 has a mover 2122a and a rail 2122b. The mover 2122a is fixed to the lower surface (the surface facing the base 2) of the support stand 213. The mover 2122a moves along the rail 2122b.

[0077] The second rotation drive unit 230 is attached to a lower portion of the second chuck 22 of the second substrate holder 20. The second rotation drive unit 230 rotates the second chuck 22 in the circumferential direction. The second rotation drive unit 230 includes, for example, a direct drive motor.

[0078] 7 is a schematic diagram showing the structure around the support base 213 from below. As shown in FIGS. 5 and 7, the joining unit JU is equipped with a detection mechanism 300. The detection mechanism 300 detects movement of one of the first substrate holder 10 and the second substrate holder 20 within the XY plane. In this embodiment, the detection mechanism 300 detects movement of the second substrate holder 20 within the XY plane.

[0079] Specifically, the detection mechanism 300 has, for example, a two-dimensional scale 301 (hereinafter referred to as 2D scale 301) and a detection sensor 302. The 2D scale 301 is attached to the lower surface of the second stage 21 of the second substrate holder 20. The 2D scale 301 has a rectangular shape extending in the X and Y directions. The 2D scale 301 is, for example, a reflective diffraction grating scale.

[0080] An opening 213a is provided in the support base 213. The opening 213a is located below the 2D scale 301.

[0081] The detection sensor 302 is attached to the upper surface of the base 2. The detection sensor 302 protrudes upward from the opening 213a of the support base 213. The detection sensor 302 emits laser light toward the 2D scale 301 and receives the light reflected by the 2D scale 301. As the second substrate holder 20 moves, the light reception signal of the detection sensor 302 changes. This allows the amount of movement of the second substrate holder 20 in the X and Y directions to be detected.

[0082] Returning to Fig. 4, the joining unit JU will be further described. As shown in Fig. 4, the joining unit JU includes a first substrate detection sensor 310, and the first substrate holder 10 has a first reference mask 410. The first substrate detection sensor 310 is an example of the "first imaging section" in the present invention.

[0083] The first substrate detection sensor 310 is fixed to the second stage 21. The first substrate detection sensor 310 has a camera 311. The first substrate detection sensor 310 transmits image data captured by the camera 311 to the control device 90.

[0084] The first reference mask 410 has a plurality of first marks, which are alignment marks. The first marks of the first reference mask 410 will be described later.

[0085] The first reference mask 410 is fixed to the first stage 11. The first reference mask 410 has a mark member 411 on which a first mark is formed, and a pair of supports 412 that support the mark member 411. The mark member 411 is formed, for example, from a light-transmitting member, and is formed, for example, from glass that transmits visible light.

[0086] With one surface 11a of the first stage 11 facing downward, the first substrate detection sensor 310 is moved horizontally, whereby the first substrate detection sensor 310 detects the alignment mark of the first substrate W1 and the first mark of the first reference mask 410. At this time, after the first substrate detection sensor 310 detects the alignment mark of the first substrate W1, the detection mechanism 300 detects the direction and distance that the first substrate detection sensor 310 and the second substrate holder 20 have moved until the first mark of the first reference mask 410 is detected. This makes it possible to detect the relative position of the alignment mark of the first substrate W1 with respect to the first mark of the first reference mask 410.

[0087] The joining unit JU includes a second substrate detection sensor 320, and the second substrate holder 20 has a second reference mask 420. The second substrate detection sensor 320 is an example of the "second imaging section" in the present invention.

[0088] The joining unit JU includes a second gantry 350, and the second substrate detection sensor 320 is fixed to the second gantry 350. In FIG. 4, a part of the second gantry 350 is depicted by a two-dot chain line. The second substrate detection sensor 320 includes a camera 321. The second substrate detection sensor 320 transmits image data captured by the camera 321 to the control device 90.

[0089] The second reference mask 420 has a plurality of second marks, which are alignment marks. The second marks of the second reference mask 420 will be described later.

[0090] The second reference mask 420 is fixed to the second stage 21. The second reference mask 420 has a mark member 421 on which a second mark is formed, and a support 422 that supports the mark member 421.

[0091] Here, by moving the second substrate holder 20 and the second substrate W2 in the horizontal direction, the second substrate detection sensor 320 detects the alignment mark of the second substrate W2 and the second mark of the second reference mask 420. At this time, after the second substrate detection sensor 320 detects the alignment mark of the second substrate W2, the detection mechanism 300 detects the direction and distance moved by the second substrate holder 20 and the second substrate W2 until the second mark of the second reference mask 420 is detected. This makes it possible to detect the relative position of the alignment mark of the second substrate W2 with respect to the second mark of the second reference mask 420.

[0092] Fig. 8 is a perspective view showing a schematic structure of the joining unit JU from below. As shown in Fig. 8, the joining unit JU is provided with an imaging unit 50. The imaging unit 50 transmits captured imaging data to the control device 90. The imaging unit 50 is an example of the "mark imaging unit" of the present invention.

[0093] The imaging unit 50 is attached to the first stage 11 so as to penetrate the first stage 11 in the thickness direction.

[0094] When the first substrate W1 held by the first substrate holder 10 and the second substrate W2 held by the second substrate holder 20 are bonded together, the first reference mask 410 and the second reference mask 420 are arranged facing each other in the vertical direction. At this time, the first marks of the first reference mask 410 and the second marks of the second reference mask 420 are both positioned within the imaging field of the imaging unit 50, so that the imaging unit 50 can simultaneously image the first marks of the first reference mask 410 and the second marks of the second reference mask 420.

[0095] The control unit 91 (see FIG. 1) controls the first movement actuator 100 and the second movement actuator 200.

[0096] The control unit 91 controls the first movement actuator 100 to turn upside down the first substrate W1 held by the first substrate holder 10. The control unit 91 controls the first movement actuator 100 to move the turned-up first substrate W1 downward, and bonds the first substrate W1 and the second substrate W2 together.

[0097] The control unit 91 can calculate the relative positional relationship between the alignment marks of the first substrate W1 and the alignment marks of the second substrate W2 based on the detection results of the detection mechanism 300, the first substrate detection sensor 310, the second substrate detection sensor 320, and the imaging unit 50.

[0098] Next, the first mark M1 of the first reference mask 410 will be described with reference to Fig. 9. Fig. 9 is a diagram showing the structure of the periphery of the first mark M1 of the first reference mask 410 as viewed from the first substrate detection sensor 310 side (bottom side) in a state in which one surface 11a of the first stage 11 faces downward.

[0099] 9, a plurality of (four in this example) first marks M1 are formed on the mark member 411 of the first reference mask 410. The four first marks M1 are arranged at predetermined positions. The first marks M1 have, for example, a square shape and are formed to be the same size as each other. The first marks M1 are formed on the surface of the mark member 411 by etching or the like.

[0100] The first reference mask 410 also has a first formation region R1 in which a plurality of first marks M1 are formed. The first formation region R1 is a region that surrounds all of the first marks M1. In FIG. 9, the first formation region R1 is indicated by a dashed line. The first formation region R1 is located at one end of the first reference mask 410 in the X direction (X1 direction). The first formation region R1 is narrower than the field of view R50 of the imaging unit 50. In FIG. 9, the field of view R50 is indicated by a two-dot chain line. In FIG. 9, the field of view R50 is indicated by a rectangular shape, but the field of view R50 may also be, for example, circular.

[0101] Next, the second mark M2 of the second reference mask 420 will be described with reference to Fig. 10. Fig. 10 is a diagram showing the structure of the periphery of the second mark M2 of the second reference mask 420 as viewed from the second substrate detection sensor 320 side (top side).

[0102] 10, a plurality of (here, several tens or more) second marks M2 are formed on the mark member 421 of the second reference mask 420. The plurality of second marks M2 are arranged radially. The second marks M2 have, for example, a square shape and are formed to be the same size as each other. The second marks M2 are formed on the surface of the mark member 421 by etching or the like.

[0103] The second reference mask 420 also has a second formation region R2 in which multiple second marks M2 are formed. The second formation region R2 is an area that surrounds all of the second marks M2. In FIG. 10, the second formation region R2 is indicated by a dashed line. The second formation region R2 is located at one end of the second reference mask 420 in the X direction (X1 direction). When the imaging unit 50 is focused on the second marks M2, the second formation region R2 is wider than the field of view R50 (see FIG. 9) of the imaging unit 50. However, the field of view R50 is large enough to include one or more second marks M2 (four or more in this embodiment).

[0104] In this embodiment, the second mark M2 includes coordinate information. Specifically, the second mark M2 has a plurality of (here, five) main marks M21 arranged in the center of the second formation region R2, and a plurality of (here, several tens or more) sub-marks M22 arranged around the main marks M21. In this embodiment, the sub-marks M22 are formed three times around the main mark M21.

[0105] The main mark M21 and the sub-mark M22 have the same shape. However, the main mark M21 and the sub-mark M22 have different sizes (areas). In this embodiment, the size of the sub-mark M22 is smaller than the size of the main mark M21.

[0106] Furthermore, the main marks M21 and the sub-marks M22 are spaced apart from each other. In other words, the distance between adjacent main marks M21 and the distance between adjacent sub-marks M22 are different from each other. In this embodiment, the distance between adjacent sub-marks M22 is smaller than the distance between adjacent main marks M21.

[0107] In this embodiment, the sub-marks M22 are formed such that the distance between adjacent sub-marks M22 increases with increasing distance from the center of the second formation region R2. Specifically, the distance L12 between the sub-mark M221 on the first lap from the inside and the sub-mark M222 on the second lap from the inside is smaller than the distance L23 between the sub-mark M222 on the second lap from the inside and the sub-mark M223 on the third lap from the inside. This allows the coordinates of each second mark M2 to be detected even when the imaging unit 50 images only a portion of the second formation region R2 (when the field of view R50 is narrower than the second formation region R2). In other words, the direction and distance of each second mark M2 relative to the center Pr2 of the second formation region R2 can be detected even when the imaging unit 50 images only a portion of the second formation region R2.

[0108] As described above with reference to FIGS. 1 to 10, in this embodiment, the second formation region R2 is larger than the field of view R50 of the imaging unit 50. This prevents the second marks M2 from falling outside the field of view R50 of the imaging unit 50. Furthermore, the second marks M2 contain coordinate information. Therefore, even when the imaging unit 50 captures an image of only a portion of the second formation region R2, the coordinates of each second mark M2 can be detected. This allows the first substrate holder 10 and the second substrate holder 20 to be aligned with high precision, thereby allowing the first substrate W1 and the second substrate W2 to be aligned with high precision.

[0109] As described above, the second mark M2 has a main mark M21 disposed at the center and a plurality of sub-marks M22 disposed around the main mark M21. Therefore, the second formation region R2 can be easily made wider than the field of view range R50 of the imaging unit 50.

[0110] As described above, the main mark M21 and the sub-mark M22 are different in size and spacing, so that the main mark M21 and the sub-mark M22 can be easily distinguished from each other.

[0111] As described above, the sub-marks M22 are formed so that the distance between adjacent sub-marks M22 increases as the distance from the center increases, so that the coordinates of each sub-mark M22 can be easily detected.

[0112] Furthermore, as described above, in a configuration in which the imaging unit 50 is fixed to the first substrate holder 10 and the second moving actuator 200 moves the second substrate holder 20, the second formation region R2 is wider than the field of view of the imaging unit 50, and the second marks M2 include coordinate information. Therefore, even in a configuration in which the second marks M2 move horizontally relative to the imaging unit 50, it is possible to easily prevent the second marks M2 from falling outside the field of view range R50 of the imaging unit 50. Furthermore, even when the imaging unit 50 captures an image of only a portion of the second formation region R2, the coordinates of each second mark M2 can be easily detected.

[0113] Next, a substrate joining method of the joining unit JU of this embodiment will be described with reference to Figures 11 to 18. Figure 11 is a flowchart showing the substrate joining method of the joining unit JU. In this embodiment, the substrate joining method of the joining unit JU includes steps S101 to S114.

[0114] 12 to 18 are diagrams illustrating the substrate bonding method of the bonding unit JU. Also, FIGS. 12 and 14 are diagrams schematically illustrating the structure of the first substrate holder 10 as viewed from below with one surface 11a of the first stage 11 facing downward. FIGS. 13 and 15 are diagrams schematically illustrating the structure of the second substrate holder 20 as viewed from above. FIG. 16 is a plan view showing the positional relationship between the first substrate W1 and the second substrate W2 when the second substrate holder 20 is placed at the reference position. FIG. 17 is a plan view showing the positional relationship between the first mark M1 and the second mark M2 when the second substrate holder 20 is placed at the reference position. FIG. 18 is a plan view showing the first substrate W1 and the second substrate W2 aligned. 16 to 18, for ease of understanding, the second substrate holder 20 and the second substrate W2 are indicated by solid lines, and the first substrate holder 10 and the first substrate W1 are indicated by two-dot chain lines.

[0115] 11, in step S101, the control unit 91 carries the first substrate W1, which has been handed over from the pre-alignment unit PU to the transport robot TR, into the joining unit JU. The first substrate W1 is held by the first substrate holder 10 with the bonding surface (front surface Wa) facing upward (see FIG. 12).

[0116] Next, in step S102, the control unit 91 carries the second substrate W2, which has been handed over from the pre-alignment unit PU to the transport robot TR, into the joining unit JU. The second substrate W2 is held by the second substrate holder 20 with the bonding surface (front surface Wa) facing upward (see FIG. 13).

[0117] Next, in step S103, the control unit 91 controls the first moving actuator 100 to turn the first substrate holder 10 upside down, so that the bonding surface of the first substrate W1 faces downward.

[0118] Next, in step S104, the control unit 91 controls the second movement actuator 200 and the first substrate detection sensor 310 to capture images of the alignment mark Mw1 (see FIG. 12) on the first substrate W1 and the multiple first marks M1 (see FIG. 9) on the first reference mask 410. The alignment mark Mw1 has, for example, a square shape and is formed on the surface Wa of the first substrate W1. The alignment mark Mw1 is an example of a "first substrate mark" in the present invention. The first substrate W1 has multiple (here, four) alignment marks Mw1.

[0119] The control unit 91 also controls the second movement actuator 200 and the second substrate detection sensor 320 to capture images of the alignment mark Mw2 (see FIG. 13) on the second substrate W2 and the multiple second marks M2 (see FIG. 10) on the second reference mask 420. The alignment mark Mw2 has, for example, a cross shape (or a plus shape) and is formed on the surface Wa of the second substrate W2. The alignment mark Mw2 is an example of a "second substrate mark" in the present invention. The second substrate W2 has multiple (here, four) alignment marks Mw2.

[0120] The control unit 91 acquires image data captured by the first substrate detection sensor 310 and the second substrate detection sensor 320.

[0121] Next, in step S105, the control unit 91 calculates the angular position of the first substrate W1 based on the imaging data acquired from the first substrate detection sensor 310. At this time, the control unit 91 calculates the angular position of the first substrate W1 based on image data of the alignment mark Mw1 of the first substrate W1. The control unit 91 may calculate the angular position of the first substrate W1 based on the image data of the alignment mark Mw1 of the first substrate W1 and the imaging data of the first mark M1 of the first reference mask 410. Note that in this embodiment, the angular position of the substrate W means the rotational angular position of the substrate W in the rotational direction about a central axis perpendicular to the surface Wa of the substrate W. In the following description, the angular position of the substrate W may be referred to as the rotational angular position of the substrate W.

[0122] Similarly, the control unit 91 calculates the angular position of the second substrate W2 based on the imaging data acquired from the second substrate detection sensor 320. At this time, the control unit 91 calculates the angular position of the second substrate W2 based on image data of the alignment marks Mw2 of the second substrate W2. The control unit 91 may calculate the angular position of the second substrate W2 based on the image data of the alignment marks Mw2 of the second substrate W2 and the imaging data of the second marks M2 of the second reference mask 420.

[0123] Next, in step S106, the control unit 91 controls the first rotation drive unit 140 based on the calculated rotation angle position of the first substrate W1 to rotate the first substrate W1 by a predetermined angle. At this time, the control unit 91 rotates the first substrate W1, for example, so that a line (not shown) that passes through the center of the first substrate W1 and connects the two alignment marks Mw1 is parallel to the X direction or the Y direction. As a result, the first substrate W1 becomes in the state shown in FIG.

[0124] Similarly, the control unit 91 controls the second rotation drive unit 230 based on the calculated rotation angle position of the second substrate W2 to rotate the second substrate W2 by a predetermined angle. At this time, the control unit 91 rotates the second substrate W2, for example, so that a line (not shown) that passes through the center of the second substrate W2 and connects the two alignment marks Mw2 is parallel to the X direction or the Y direction. As a result, the second substrate W2 becomes in the state shown in FIG.

[0125] Next, in step S107, the control unit 91 controls the second movement actuator 200 and the first substrate detection sensor 310 to capture an image of the alignment mark Mw1 on the first substrate W1. The control unit 91 also controls the second movement actuator 200 and the second substrate detection sensor 320 to capture an image of the alignment mark Mw2 on the second substrate W2. The control unit 91 acquires image data captured by the first substrate detection sensor 310 and the second substrate detection sensor 320. Note that the first substrate detection sensor 310 and the second substrate detection sensor 320 may not capture an image of the first mark M1 on the first reference mask 410 and the second mark M2 on the second reference mask 420 in step S104, but may instead capture an image of the first mark M1 on the first reference mask 410 and the second mark M2 on the second reference mask 420 in step S107.

[0126] Next, in step S108, the control unit 91 controls the second movement actuator 200 to move the second substrate holder 20 to a reference position. The reference position is, for example, the position of the second substrate holder 20 when the center of the second chuck 22 of the second substrate holder 20 is located directly below the center of the first chuck 12 of the first substrate holder 10. At this time, in this embodiment, as shown in FIGS. 16 and 17, the center Pr1 of the first formation region R1 of the first reference mask 410 and the center Pr2 of the second formation region R2 of the second reference mask 420 coincide in a planar view. However, the alignment mark Mw1 of the first substrate W1 and the alignment mark Mw2 of the second substrate W2 are misaligned due to the positional misalignment of the first substrate W1 relative to the first chuck 12 and the positional misalignment of the second substrate W2 relative to the second chuck 22. In this state, the distance between the first substrate W1 and the second substrate W2 is, for example, several millimeters to several tens of millimeters or more.

[0127] Next, in step S109, the control unit 91 calculates the positional relationship between each mark based on the imaging data of the alignment marks Mw1 and Mw2 captured by the first substrate detection sensor 310 and the second substrate detection sensor 320 in step S107, and the imaging data of the first mark M1 and the second mark M2 captured in step S104 or step S107.

[0128] Specifically, the control unit 91 calculates a first positional relationship between the first mark M1 and the alignment mark Mw1 based on the imaging result of the first substrate detection sensor 310, and calculates a second positional relationship between the second mark M2 and the alignment mark Mw2 based on the imaging result of the second substrate detection sensor 320. The control unit 91 then calculates a predetermined positional relationship based on the first positional relationship and the second positional relationship. Note that the predetermined positional relationship is, for example, the positional relationship between the first mark M1 and the second mark M2 when the center of the alignment mark Mw1 on the first substrate W1 and the center of the alignment mark Mw2 on the second substrate W2 are aligned.

[0129] Next, in step S110, the control unit 91 controls the second movement actuator 200 to move the second substrate holder 20 in the horizontal direction based on the predetermined positional relationship calculated in step S109 so that the center of the alignment mark Mw2 on the second substrate W2 substantially coincides with the center of the alignment mark Mw1 on the first substrate W1 in the horizontal direction. As a result, the center Pr1 of the first formation region R1 and the center Pr2 of the second formation region R2 are shifted in the horizontal direction by approximately the same amount as the amount by which the alignment mark Mw1 on the first substrate W1 and the alignment mark Mw2 on the second substrate W2 were shifted in step S108 (see FIG. 18).

[0130] Next, in step S111, the control unit 91 controls the lifting actuator 120 to lower the first substrate holder 10 by a predetermined amount, so that the distance between the first substrate W1 and the second substrate W2 becomes, for example, several μm or more and 10 μm or less.

[0131] Next, in step S112, the imaging unit 50 images the first mark M1 of the first reference mask 410 and the second mark M2 of the second reference mask 420. Specifically, the imaging unit 50 images the second mark M2 through (transmits) the first formation region R1. The control unit 91 acquires image data captured by the imaging unit 50.

[0132] Here, the magnification of the imaging unit 50 is relatively large, and the field of view R50 of the imaging unit 50 is relatively narrow. For this reason, if the first substrate W1 is misaligned with respect to the first chuck 12, or if the second substrate W2 is misaligned with respect to the second chuck 22, the center of the second mark M2 will not be located within the field of view R50 of the imaging unit 50.

[0133] However, in this embodiment, as described above, the second mark M2 has the main mark M21 and the sub-mark M22 arranged around the main mark M21, and therefore the sub-mark M22 of the second mark M2 can be positioned within the field of view R50 of the imaging unit 50. In other words, even if the first substrate W1 and the second substrate W2 are misaligned, the imaging unit 50 can capture images of the first mark M1 and the second mark M2.

[0134] In this embodiment, since the imaging unit 50 is attached to the first substrate holder 10 on which the first marks M1 are formed, all of the first marks M1 (or the first formation areas R1) are located within the field of view range R50 of the imaging unit 50.

[0135] Next, in step S113, the control unit 91 drives the second movement actuator 200 based on the image data acquired in step S112 so that the positional relationship between the first mark M1 and the second mark M2 becomes the predetermined positional relationship calculated in step S109. This allows the first substrate W1 and the second substrate W2 to be aligned with high precision.

[0136] Next, in step S114, the control unit 91 controls the first moving actuator 100 to move the first substrate holder 10 and the first substrate W1 downward, thereby bonding the first substrate W1 and the second substrate W2 together.

[0137] In this manner, the joining of the first substrate W1 and the second substrate W2 by the joining unit JU is completed.

[0138] As described with reference to FIGS. 11 to 18, in this embodiment, the control unit 91 calculates a first positional relationship between the first mark M1 and the alignment mark Mw1 based on the imaging results of the first substrate detection sensor 310. The control unit 91 also calculates a second positional relationship between the second mark M2 and the alignment mark Mw2 based on the imaging results of the second substrate detection sensor 320. The control unit 91 then calculates a predetermined positional relationship based on the first positional relationship and the second positional relationship. Therefore, by capturing images of the first mark M1 and the second mark M2 using the imaging unit 50, the first substrate W1 and the second substrate W2 can be aligned with high precision.

[0139] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual thickness, length, number, spacing, etc. of each component shown in the above embodiments due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0140] For example, in the above embodiment, an example has been described in which the first substrate holder 10 is moved in the vertical direction and the second substrate holder 20 is moved in the horizontal direction, but the present invention is not limited to this. For example, the second substrate holder 20 may be moved in the vertical direction and the first substrate holder 10 may be moved in the horizontal direction. Also, one of the first substrate holder 10 and the second substrate holder 20 may be moved in both the vertical and horizontal directions.

[0141] In the above embodiment, the present invention is applied to the substrate bonding apparatus 1 that bonds the first substrate W1 and the second substrate W2, but the present invention is not limited to this. For example, the present invention may be applied to an exposure apparatus that aligns a mask (first member) and a substrate (second member).

[0142] In the above embodiment, an example has been described in which the second formation region R2 in which the second mark M2 is formed is wider than the field of view of the imaging unit 50, but the present invention is not limited to this. For example, the first formation region R1 in which the first mark M1 is formed may be wider than the field of view of the imaging unit 50. Furthermore, both the first formation region R1 and the second formation region R2 may be wider than the field of view of the imaging unit 50.

[0143] Furthermore, in the above embodiment, an example has been described in which the imaging unit 50 is attached to the first substrate holder 10, but the present invention is not limited to this. For example, the imaging unit 50 may be attached to the second substrate holder 20. Furthermore, the imaging unit 50 may be attached to a member other than the first substrate holder 10 and the second substrate holder 20, such as the first gantry 130. For example, when the imaging unit 50 is attached to a member other than the first substrate holder 10 and the second substrate holder 20, such as the first gantry 130, it is preferable that both the first forming region R1 and the second forming region R2 are wider than the field of view of the imaging unit 50.

[0144] In the above embodiment, the main mark M21 and the sub-mark M22 have different sizes and the same shape, but the present invention is not limited to this. The main mark M21 and the sub-mark M22 may have different shapes. The main mark M21 and the sub-mark M22 may also have the same size.

[0145] In the above embodiment, an example has been described in which all the sub-marks M22 have the same shape and the same size, but the present invention is not limited to this. For example, all the sub-marks M22 may have different shapes or sizes. With this configuration, the coordinates of the imaged sub-mark M22 can be detected by imaging one sub-mark M22 with the imaging unit 50. Also, for example, the sub-marks M22 may have different shapes or sizes for each circumference.

[0146] In the above embodiment, an example has been described in which the distance between adjacent sub-marks M22 increases with increasing distance from the center, but the present invention is not limited to this. The size of the sub-marks M22 may increase with increasing distance from the center. Furthermore, the distance between adjacent sub-marks M22 and / or the size of the sub-marks M22 may decrease with increasing distance from the center. Alternatively, as shown in FIG. 19, the sub-marks M22 may have different shapes depending on the distance from the center. In this case, for example, the shape of the sub-marks M22 may be different for each rotation from the innermost one.

[0147] In addition, in the above embodiment, for ease of understanding, an example has been described in which the second substrate holder 20 is moved to the reference position in step S108, but the present invention is not limited to this. In other words, step S108 may be omitted.

[0148] In the above embodiment, an example has been described in which the substrate bonding process is completed by bonding the first substrate W1 and the second substrate W2 together, but the present invention is not limited to this. For example, after bonding the first substrate W1 and the second substrate W2 together, the bonding accuracy between the first substrate W1 and the second substrate W2 may be confirmed. In this case, for example, the bonding accuracy between the first substrate W1 and the second substrate W2 may be confirmed by capturing images of the first mark M1 and the second mark M2 using the imaging unit 50. [Industrial Applicability]

[0149] The present invention is suitably used in an alignment device. [Explanation of symbols]

[0150] 1: Substrate bonding device (alignment device) 10: First substrate holder (first member) 12: First chuck 20: Second substrate holder (second member) 22: Second chuck 50: Imaging unit (mark imaging unit) 91: Control unit 200: Second moving actuator (moving actuator) 310: First board detection sensor (first imaging unit) 320: Second board detection sensor (second imaging unit) L12, L23: Interval M1: First mark M2: Second mark M21: Main Mark M22, M221, M222, M223: Secondary marks Mw1: Alignment mark (first board mark) Mw2: Alignment mark (second board mark) R1: 1st formation area R2: Second formation area W1: First board W2: Second board

Claims

1. a first member having a first mark formed thereon; a second member disposed opposite the first member and having a second mark formed thereon; a movement actuator that moves one of the first member and the second member in a direction intersecting a direction in which the first member and the second member face each other; a mark imaging unit that images the first mark and the second mark; a control unit that controls the movement actuator; Equipped with the first member has a first formation region in which one or more of the first marks are formed, the second member has a second formation region in which one or more second marks are formed, the mark imaging unit images the second mark of the second member through the first formation region of the first member; the control unit controls the movement actuator based on an imaging result of the mark imaging unit so that the first mark and the second mark have a predetermined positional relationship; At least one of the first formation area and the second formation area is wider than the field of view of the mark imaging unit, An alignment device, wherein the mark in at least one of the first forming region and the second forming region includes coordinate information.

2. The alignment device of claim 1 , wherein the at least one mark has a main mark disposed at a central portion and a plurality of sub-marks disposed around the main mark.

3. The alignment device of claim 2 , wherein the primary mark and the secondary mark differ in at least one of shape, size, and spacing.

4. 4. The alignment device according to claim 2, wherein the sub-marks are formed so that at least one of the spacing between adjacent sub-marks and the size of the sub-marks increases with increasing distance from the center.

5. The alignment device according to claim 2 or 3, wherein the secondary marks have different shapes depending on the distance from the central portion.

6. the mark imaging unit is fixed to the first member, the movement actuator moves the second member; the second formation area is wider than the field of view of the mark imaging unit, The alignment device according to claim 1 , wherein the second mark includes the coordinate information.

7. The imaging device further includes a first imaging unit and a second imaging unit, the first member has a first chuck that holds a first substrate on which a first substrate mark is formed, the second member has a second chuck that holds a second substrate on which a second substrate mark is formed, the first imaging unit images the first mark and the first board mark; the second imaging unit images the second mark and the second board mark; The control unit calculating a first positional relationship between the first mark and the first substrate mark based on an imaging result of the first imaging unit; calculating a second positional relationship between the second mark and the second substrate mark based on an imaging result of the second imaging unit; The alignment device according to claim 1 , wherein the predetermined positional relationship is calculated based on the first positional relationship and the second positional relationship.

Images