Semiconductor device

Abstract

To provide a semiconductor device having the high heat dissipation performance.SOLUTION: A semiconductor device comprises: a semiconductor element 2 in which a semiconductor chip is sealed with resin and which has a heat dissipation surface 20; a heat dissipation member 3 having a fixing surface 30 disposed so as to face the heat dissipation surface 20, and dissipating heat from the heat dissipation surface 20 to a surrounding environment; and a fitting coupling part including grooves 31a, 31b serving as recesses and projections 21a, 21b inserted into the grooves 31a, 31b, and fixing the semiconductor element 2 to the heat dissipation member 3 such that the heat dissipation surface 20 and the fixing surface 30 are in contact with each other. Furthermore, contact surfaces that abut each other and lock the projections 21a, 21b into the grooves 31a, 31b are formed on the projections 21a, 21b and in the grooves 31a, 31b, respectively.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device. [Background technology]

[0002] A semiconductor element in which a semiconductor chip is resin-encapsulated is often fixed to a heat dissipation member made of metal (such as aluminum or copper) on which heat dissipation fins are formed, in order to effectively dissipate heat generated by the semiconductor chip. An example of such a semiconductor device is the semiconductor device described in Patent Document 1.

[0003] In the semiconductor device described in Patent Document 1, a heat generating element having a semiconductor chip is fixed to a first heat dissipation section, and the first heat dissipation section is fixed to a second heat dissipation section having heat dissipation fins. The heat generating element is joined to the first heat dissipation section by thermal welding, resin material, screws, etc. Heat generated in the semiconductor chip is transferred to the second heat dissipation section via the first heat dissipation section, and is then dissipated from the heat dissipation fins of the second heat dissipation section into the atmosphere or a liquid such as cooling water. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-91088 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the semiconductor device described in Patent Document 1, heat from the heat generating element is dissipated to the surrounding environment (air, cooling water, etc.) via two heat dissipation members (first and second heat dissipation members), which tends to increase the thermal resistance from the heat generating element to the surrounding environment, resulting in a problem of reduced cooling performance for the heat generating element. [Means for solving the problem]

[0006] A semiconductor device according to one aspect of the present invention comprises a semiconductor element having a heat dissipation surface in which a semiconductor chip is sealed with resin, a heat dissipation member having a fixing surface arranged opposite the heat dissipation surface and dissipating heat from the heat dissipation surface to the surrounding environment, and a fitting coupling portion having a recess and a protrusion inserted into the recess and fixing the semiconductor element to the heat dissipation member so that the heat dissipation surface and the fixing surface are in contact, and the protrusion and the recess each have a contact surface formed thereon that abut against each other and engage the protrusion in the recess. [Effects of the Invention]

[0007] According to the present invention, the heat dissipation performance can be further improved. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a semiconductor device according to the first embodiment. [Figure 2] FIG. 2 is a diagram showing a semiconductor device in which a semiconductor element is fixed to a heat dissipation member. [Figure 3] FIG. 3 is a perspective view showing the details of the protrusion. [Figure 4] FIG. 4 is a perspective view showing the groove in detail. [Figure 5] FIG. 5 is a view taken along the arrow A in FIG. [Figure 6] FIG. 6 is a diagram illustrating the fitting joint portion. [Figure 7] FIG. 7 is a diagram showing a first modification. [Figure 8] FIG. 8 is a diagram showing a second modification. [Figure 9] FIG. 9 is a diagram illustrating the second embodiment. [Figure 10] FIG. 10 is a diagram showing a schematic configuration of a semiconductor device according to the third embodiment. [Figure 11] FIG. 11 is an enlarged view of a fitting joint portion in the third embodiment. [Figure 12] FIG. 12 is a cross-sectional view of the fitting joint taken along a plane perpendicular to the x-axis. [Figure 13]FIG. 13 is a diagram illustrating the insertion operation of the convex portion into the concave portion. DETAILED DESCRIPTION OF THE INVENTION

[0009] First Embodiment A semiconductor device according to a first embodiment of the present invention will be described with reference to Figs. 1 to 6. Fig. 1 is a diagram illustrating the schematic configuration of semiconductor device 1. Semiconductor device 1 includes a semiconductor element 2 in which a semiconductor chip 4 is sealed with a sealing material such as resin, and a heat dissipation member 3 to which semiconductor element 2 is fixed. Heat dissipation member 3 is provided with fins 35 for efficiently dissipating heat generated by semiconductor element 2. Heat dissipation member 3 is made of a metal material containing copper, aluminum, or the like, which has good thermal conductivity. Fig. 1 is an exploded perspective view showing a state in which semiconductor element 2 has been removed from heat dissipation member 3.

[0010] A pair of recessed grooves 31a and 31b extending in the x-axis direction are formed on the fixing surface 30 of the heat dissipation member 3. Stoppers 34 are provided at the ends of the grooves 31a and 31b in the negative x-axis direction, and are formed to rise from the fixing surface. A pair of protrusions 21a and 21b extending in the x-axis direction are formed on the surface of the semiconductor element 2 on the side where the heat dissipation surface 20 is provided. The semiconductor element 2 is provided with a plurality of terminals 22 extending so as to be exposed from the sealing material.

[0011] The protrusions 21a, 21b of the semiconductor element 2 are formed so as to be insertable into the grooves 31a, 31b of the heat dissipation member 3. By inserting each of the protrusions 21a, 21b into the corresponding grooves 31a, 31b and sliding the semiconductor element 2 in the negative x-axis direction, the semiconductor element 2 is fixed to the heat dissipation member 3 so that the heat dissipation surface 20 contacts the fixing surface 30. In other words, the protrusions 21a, 21b and the grooves 31a, 31b form a fitting joint that fixes the semiconductor element 2 to the heat dissipation member 3. Each of the protrusions 21a, 21b is provided with locking elements 211, 212 and protrusions 213 for locking the protrusions 21a, 21b in the grooves 31a, 31b.

[0012] FIG. 2 is a view of the semiconductor device 1 with the semiconductor element 2 fixed to the heat dissipation member 3, viewed from the positive direction of the y-axis. As indicated by the dashed arrow in FIG. 1, the protrusions 21a and 21b of the semiconductor element 2 are inserted into the grooves 31a and 31b of the heat dissipation member 3 through the insertion openings 314 at the ends of the grooves 31a and 31b in the extension direction. The semiconductor element 2 is then slid up to the stopper 34, thereby fixing the heat dissipation surface 20 to the fixing surface 30. Note that thermally conductive grease may be used to improve adhesion between the heat dissipation surface 20 and the fixing surface 30. The protrusion 21b, which has the locking elements 211 and 212 and the protrusion 213, is inserted into the groove 31b.

[0013] FIG. 3 is a perspective view showing in detail the portion of the protrusion 21b where the locking elements 211 and 212 and the protrusion 213 are provided. Meanwhile, FIG. 4 is an enlarged perspective view of the corresponding region of the groove 31b, i.e., the region where the portion of the protrusion 21b shown in FIG. 3 is inserted. An insertion opening (groove cross-sectional opening) 314 for inserting the protrusion 21b is formed in the end of the groove 31b in the extension direction, i.e., the surface at the end of the heat dissipation member 3 in the x-axis direction. The locking element 211 of the protrusion 21b is inserted into the region sandwiched between the surfaces 311a and 311b of the groove 31b. The locking element 212 of the protrusion 21b is inserted into the region sandwiched between the surfaces 312a and 312b of the groove 31b. The protrusion 213 of the protrusion 21b fits into a recess 313 formed in the surface 311a of the groove 31b. The recess 313 has a surface 313a that is perpendicular to the x-axis.

[0014] 1, the protrusions 21a and 21b and the grooves 31a and 31b have shapes that are symmetrical with respect to the y-axis direction. Although the protrusions 21b and grooves 31b are shown in Figures 3 and 4, the protrusions 21a and grooves 31a have similar shapes.

[0015] In the fixed state shown in Fig. 2, the protrusion 213 of the convex portion 21b shown in Fig. 3 is fitted into the depression 313 of the groove 31b. The surface 211a of the locking element 211 of the convex portion 21b faces the surface 311a of the groove 31b, and the surface 211b faces the surface 311a of the groove 31b. The surface 212a of the locking element 212 faces the surface 312a of the groove 31b, and the surface 212b faces the surface 312b of the groove 31b. The surface 213a of the protrusion 213 faces the surface 313a of the depression 313 formed in the groove 31b.

[0016] 5 is a view of the protrusions 21a and 21b of the semiconductor element 2 and the grooves 31a and 31b of the heat dissipation member 3, i.e., the fitting coupling portion 5, as viewed from the direction indicated by arrow A in FIG. 2. Note that in FIG. 5, the semiconductor element 2 and the heat dissipation member 3 are shown separated into upper and lower halves to make it easier to understand the relationship between the surfaces. When the protrusions 21a and 21b are inserted into the corresponding grooves 31a and 31b, respectively, in the y-axis direction, the surfaces 211a and 211b of the locking element 211 abut against the opposing surfaces 311a and 311b of the grooves 31a and 31b, respectively. Furthermore, in the z-axis direction, the surfaces 212a and 212b of the locking element 212 abut against the opposing surfaces 312a and 312b of the grooves 31a and 31b, respectively.

[0017] Although the configuration is such that the surfaces 212b and 312b abut against each other here, a clearance may be provided between the surfaces 212b and 312b so that they do not abut against each other. When the semiconductor element 2 is attached to the heat dissipation member 3, the heat dissipation surface 20 abuts against the fixing surface 30, and therefore the abutment between the surfaces 212b and 312b and the abutment between the heat dissipation surface 20 and the fixing surface 30 locks the semiconductor element 2 in the z-axis direction.

[0018] FIG. 6 is a diagram illustrating the fitting coupling portion 5, which is composed of the protrusions 21a, 21b and the grooves 31a, 31b. In FIG. 6, the B1-B1 cross section of FIG. 5, which is a cross section of the protrusions 21a, 21b, is shown at the bottom, and the B2-B2 cross section of FIG. 5, which is a cross section of the grooves 31a, 31b, is shown at the top. When the semiconductor element 2 is moved in the negative x-axis direction as indicated by the dashed arrow, the protrusions 21a, 21b are inserted into the grooves 31a, 31b and slide within the grooves 31a, 31b. Note that when the protrusions 21a, 21b are pressed into the grooves 31a, 31b, the protrusions 213 protruding from the surfaces 211a of the protrusions 21a, 21b elastically deform and enter the grooves 31a, 31b. The surface of protrusion 213 opposite surface 311a is inclined downward in the negative x-axis direction so that protrusion 213 can be easily inserted into grooves 31a and 31b. When semiconductor element 2 is moved to stopper 34 (see FIG. 2), protrusion 213, which has been elastically deformed, returns to its original shape and fits into recess 313.

[0019] When the protrusion 213 fits into the recess 313, the surface 213a of the protrusion 213 abuts against the surface 313a of the recess 313. The surfaces 213a, 313a are surfaces perpendicular to the x-axis, and the abutment between the surfaces 213a and 313a prevents the movement of the convex portions 21a, 21b in the grooves 31a, 31b in the positive direction of the x-axis. Note that the movement in the negative direction of the x-axis is prevented by the semiconductor element 2 abutting against the stopper 34.

[0020] As described above, in this embodiment, the semiconductor element 2 and the heat dissipation member 3 are fixed to each other by a fitting joint 5, rather than by a conventional screw fastening structure. The fitting joint 5, which fixes the semiconductor element 2 to the heat dissipation member 3, is composed of protrusions 21a and 21b formed on the semiconductor element 2 and grooves 31a and 31b formed on the heat dissipation member 3. By directly fixing the semiconductor element 2 to the heat dissipation member 3 by the fitting joint 5, the thermal resistance from the semiconductor element 2 to the heat dissipation member 3 can be reduced compared to the semiconductor device described in Patent Document 1, which includes multiple heat dissipation members, and heat dissipation performance can be improved. Furthermore, the provision of the protrusions 21a and 21b and the grooves 31a and 31b also has the effect of increasing the contact area between the semiconductor element 2 and the heat dissipation member 3.

[0021] Also, by reducing the number of parts, costs can be reduced. In addition, by eliminating the screw fastening structure, it is possible to eliminate the effect of stress on the semiconductor chip 4 due to the screw fastening torque and the limitations on the layout within the resin seal caused by providing through holes for screw fastening.

[0022] In the above-described embodiment, the protrusions 21a, 21b and the grooves 31a, 31b are configured to extend in the x-axis direction, but they may also be configured to extend in the y-axis direction. The number of pairs of protrusions and grooves is not limited to two, and may be one pair, or three or more pairs. Furthermore, the protrusions 21a, 21b may be configured to be separated into multiple pieces in the groove extension direction. Furthermore, while the protrusions 213 are provided on the surfaces 211a of the protrusions 21a, 21b, they may be provided on any of the surfaces of the protrusions 21a, 21b. Furthermore, they may also be provided on the heat dissipation surface 20 or the fixing surface 30. In either case, the recesses 313 are disposed on the surfaces facing the protrusions 213. Furthermore, to prevent misalignment in the sliding direction, instead of providing the protrusions 213 and the recesses 313, the protrusions 21a, 21b and the grooves 31a, 31b may be bonded with an adhesive.

[0023] (Variation 1) FIG. 7 is a diagram illustrating a first modification of the above-described embodiment. The semiconductor device 1A includes a semiconductor element 2A and a heat dissipation member 3A. The semiconductor element 2A has a heat dissipation surface 20A whose shape is different from that of the heat dissipation surface 20 of the semiconductor element 2 of the first embodiment. The heat dissipation member 3A also has a fixing surface 30A whose shape is different from that of the fixing surface 30 of the heat dissipation member 3 of the first embodiment. The heat dissipation surface 20A of the semiconductor element 2A is inclined so that the thickness of the resin-encapsulated portion of the semiconductor element 2A decreases as the position in the x-axis direction becomes more positive. Meanwhile, the fixing surface 30A of the heat dissipation member 3A is inclined so that the height of the surface increases as the position in the x-axis direction becomes more positive. The inclination angle of the heat dissipation surface 20A and the inclination angle of the fixing surface 30A are set equal. The other configurations of the semiconductor element 2A and the heat dissipation member 3A, excluding the heat dissipation surface 20A and the fixing surface 30A, are similar to those of the semiconductor element 2 and the heat dissipation member 3 of the first embodiment, and therefore will not be described below.

[0024] In addition to the same effects as those of the semiconductor device 1 described above, the semiconductor device 1A of the first modification provides the following effects. In the semiconductor device 1A, the heat dissipation surface 20A and the fixing surface 30A are inclined so that the height of the surface increases as the position in the x-axis direction becomes more positive. Therefore, as the semiconductor element 2A moves toward the positive side in the x-axis direction, the distance between the heat dissipation surface 20A and the fixing surface 30A decreases. This can further improve the tight contact between the heat dissipation surface 20A and the fixing surface 30A in the fixed state shown in FIG. 7. As a result, the thermal resistance between the heat dissipation surface 20A and the fixing surface 30A can be further reduced, thereby improving heat dissipation performance.

[0025] (Variation 2) FIG. 8 is a diagram illustrating a second modification of the embodiment described above. FIG. 8 is a diagram illustrating a fitting joint portion 5 in the second modification. As in the case illustrated in FIG. 5, the upper side of FIG. 8 illustrates the shapes of the protrusions 21a, 21b and heat dissipation surface 20B of the semiconductor element 2B, and the lower side illustrates the shapes of the grooves 31a, 31b and fixing surface 30B of the heat dissipation member 3B. In the second modification, the shapes of the heat dissipation surface 20B of the semiconductor element 2B and the fixing surface 30B of the heat dissipation member 3B are different from the shapes of the heat dissipation surface 20 and fixing surface 30 of the embodiment described above. Note that the other configurations of the semiconductor element 2B and the heat dissipation member 3B, excluding the heat dissipation surface 20B and fixing surface 30B, are the same as the configurations of the semiconductor element 2 and the heat dissipation member 3 of the first embodiment, and therefore will not be described below.

[0026] In range C in the y-axis direction shown in FIG. 8 , the heat dissipation surface 20B and the fixing surface 30B have the same V-shaped cross section perpendicular to the x-axis. The heat dissipation surface 20B forms a convex V-shaped surface, and the fixing surface 30B forms a concave V-shaped surface. When the semiconductor element 2B is fixed to the heat dissipation member 3B by the fitting joint 5 formed by the convex portions 21a, 21b and the grooves 31a, 31b, the heat dissipation surface 20B and the fixing surface 30B, including the V-shaped surface, are joined together. In this way, forming the V-shaped surfaces on the heat dissipation surface 20B and the fixing surface 30B increases the contact area, improving heat transfer performance from the semiconductor element 2B to the heat dissipation member 3B and further improving heat dissipation performance.

[0027] <Second embodiment> FIG. 9 is a diagram illustrating a second embodiment of the present invention. In the second embodiment, the structure of the fitting joint 5 differs from that of the first embodiment. The protrusions 22a and 22b of the semiconductor element 2C and the grooves 32a and 32b of the heat dissipation member 3C form a dovetail joint structure. FIG. 9 illustrates the fitting joint 5 in the second embodiment, and, similar to FIG. 5, is a view of the fitting joint 5 as seen from the direction indicated by arrow A in FIG. 2. Surfaces 221a and 221b are formed on the respective protrusions 22a and 22b. A protrusion 213 similar to that in the first embodiment is formed on the surface 221a. Surfaces 321a, 321b, and 322 are formed on the respective grooves 32a and 32b. A recess 313 similar to that in the first embodiment is formed on the surface 321a.

[0028] When the protrusions 22a and 22b are inserted into the corresponding grooves 32a and 32b, surfaces 221a and 221b of the protrusions 22a and 22b abut against opposing surfaces 321a and 321b of the grooves 32a and 32b, respectively, in the y-axis direction. Surfaces 221b and 222 of the protrusions 22a and 22b abut against opposing surfaces 321b and 322 of the grooves 32a and 32b, respectively, in the z-axis direction. The protrusion 213 fits into the depression 313 of the groove 32a and 32b, as in the case of FIG. 6 of the first embodiment, and surfaces 213a of the protrusion 213 perpendicular to the x-axis abut against surfaces 313a of the depression 313.

[0029] In this example, the surface 222 and the surface 322 are configured to abut against each other, but a clearance may be provided between the surfaces 222 and 322 to prevent abutment between them. When the semiconductor element 2C is attached to the heat dissipation member 3C, the heat dissipation surface 20 and the fixing surface 30 abut against each other, and therefore the abutment between the surfaces 222 and 322 and the abutment between the heat dissipation surface 20 and the fixing surface 30 locks the semiconductor element 2C in the z-axis direction.

[0030] In the second embodiment, the semiconductor element 2 is also directly fixed to the heat dissipation member 3 by the fitting joint 5, so the thermal resistance from the semiconductor element 2 to the heat dissipation member 3 can be reduced, and heat dissipation performance can be improved. In addition, costs can be reduced by reducing the number of parts, and by eliminating the screw fastening structure, the effect of stress on the semiconductor chip 4 due to screw tightening torque and restrictions on the layout within the resin seal due to the provision of through holes for screw fastening can be eliminated.

[0031] <Third embodiment> 10 to 13 are diagrams illustrating a third embodiment of the present invention. FIG. 10 is an exploded perspective view of a semiconductor device 1D. The semiconductor device 1D includes a semiconductor element 2D and a heat dissipation member 3D to which the semiconductor element 2D is fixed. The shape of the protrusions 23a and 23b formed on the heat dissipation surface 20 of the semiconductor element 2D is different from the shape of the protrusions 21a and 21b of the first embodiment. Note that in FIG. 10, the protrusion 23a is hidden behind the back surface of the resin-sealed portion of the semiconductor element 2D and is not visible. The other configuration of the semiconductor element 2D, except for the protrusions 23a and 23b, is the same as that of the semiconductor element 2 shown in FIG. 1 and elsewhere. Furthermore, the fixing surface 30 of the heat dissipation member 3D is formed with recesses 33a and 33b into which the protrusions 23a and 23b are inserted, instead of the grooves 31a and 31b of the heat dissipation member 3 of the first embodiment. The heat dissipation member 3D does not have a stopper 34 as shown in FIG. 1. The other configuration of the heat dissipation member 3D is similar to that of the heat dissipation member 3 shown in FIG.

[0032] 11 is an enlarged view of the protrusion 23b and recess 33b in FIG. 10, i.e., the fitting coupling portion 5 in the third embodiment. By pressing the protrusion 23b toward the negative side of the z-axis direction relative to the recess 33b, the protrusion 23b is inserted into the recess 33b. Similarly, the protrusion 23a is inserted by pressing it into the recess 33a. In this way, in the third embodiment, by pressing the protrusions 23a and 23b into the corresponding recesses 33a and 33b, the heat dissipation surface 20 of the semiconductor element 2D is fixed to the fixing surface 30 of the heat dissipation member 3D.

[0033] 12 is a cross-sectional view of the protrusions 23a, 23b and recesses 33a, 33b shown in FIG. 10, cut along a plane perpendicular to the x-axis. Engagement claws 231 are formed in the tip regions of the protrusions 23a, 23b. Engagement claws 231 are formed on surfaces 231a whose normals face the positive direction of the z-axis. The protrusions 23a, 23b have surfaces 232, 233 perpendicular to the y-axis, respectively. Meanwhile, the recesses 33a, 33b have surfaces 332, 333 facing the surfaces 232, 233 of the inserted protrusions 23a, 23b. Furthermore, the recesses 33a, 33b have surfaces 331 facing the surfaces 231a of the inserted engagement claws 231. Furthermore, as shown in FIG. 11, the recesses 33a and 33b have surfaces 334a and 334b that face the surfaces 234a and 234b of the inserted protrusions 23a and 23b that are perpendicular to the x-axis.

[0034] 13 is a diagram illustrating the insertion operation of protrusion 23b into recess 33b. In step 1 shown in the upper part, the tip portion of protrusion 23b is inserted into recess 33b, and inclined surface 231b of engagement claw 231 abuts against the edge of recess 33b. When protrusion 23b is further pressed into recess 33b, a reaction force from the edge of recess 33b causes protrusion 23b to elastically deform to the left in the figure, and the tip portion including engagement claw 231 enters recess 33b.

[0035] In step 2 shown in the middle of FIG. 13 , a portion of the protrusion 23b is inserted into the recess 33b. In this state, the elastically deformed engagement claw 231 of the protrusion 23b is pressed against the surface 332 of the recess 33b by elastic force. When the semiconductor element 2D is further pressed down so that the heat dissipation surface 20 abuts against the fixing surface 30 of the heat dissipation member 3D as shown in step 3, the engagement claw 231 abutting against the surface 332 disengages from the surface 332 and slides into the space below the surface 331. As a result, the elastically deformed protrusion 23b returns to its original shape, and the protrusion 23b and the recess 33b are fitted and coupled together as shown in step 3. Although not shown or described, the protrusion 23a and the recess 33a are similar to the above-described protrusion 23b and recess 33b.

[0036] 11, in the x-axis direction, the surfaces 234a of the protrusions 23a and 23b abut against the surfaces 334a of the recesses 33a and 33b, and the surfaces 234b of the protrusions 23a and 23b abut against the surfaces 334b of the recesses 33a and 33b. In the y-axis direction, the surfaces 232 of the protrusions 23a and 23b abut against the surfaces 332 of the recesses 33a and 33b, and the surfaces 233 of the protrusions 23a and 23b abut against the surfaces 333 of the recesses 33a and 33b. In the z-axis direction, the surfaces 231a of the engagement claws 231 of the protrusions 23a and 23b abut against the surfaces 331 of the recesses 33a and 33b, and the heat dissipation surface 20 of the semiconductor element 2D abuts against the fixing surface 30 of the heat dissipation member 3D. As a result, the semiconductor element 2D and the heat dissipation member 3D are fixed so that the heat dissipation surface 20 and the fixing surface 30 are in contact with each other.

[0037] According to the above-described embodiment and modified examples, the following advantageous effects are achieved.

[0038] (1) As shown in Figures 10 to 12, a semiconductor device 1D includes a semiconductor element 2D in which a semiconductor chip 4 is sealed with resin and which has a heat dissipation surface 20, a heat dissipation member 3 which has a fixing surface 30 arranged opposite the heat dissipation surface 20 and which dissipates heat from the heat dissipation surface 20 to the surrounding environment, and a fitting coupling portion 5 which has recesses 33a, 33b and protrusions 23a, 23b which are inserted into the recesses 33a, 33b and which fixes the semiconductor element 2D to the heat dissipation member 3D so that the heat dissipation surface 20 and the fixing surface 30 are in contact with each other, and surfaces 231a, 232, 233, 234a, 234b, 331, 332, 333, 334a, 334b are formed on the protrusions 23a, 23b and the recesses 33a, 33b, respectively, which are abutment surfaces that abut against each other and engage the protrusions 23a, 23b with the recesses 33a, 33b.

[0039] As described above, the semiconductor element 2 is directly fixed to the heat dissipation member 3 by the protrusions 23a, 23b formed on the semiconductor element 2 and the recesses 33a, 33b formed on the heat dissipation member 3, which reduces thermal resistance compared to conventional configurations that include multiple heat dissipation members, thereby improving heat dissipation performance. Furthermore, reducing the number of parts also reduces costs.

[0040] 1 to 6, the recesses are grooves 31a, 31b extending in a first direction (x-axis direction) perpendicular to the opposing direction (z-axis direction) between the heat dissipation surface 20 and the fixing surface 30, and the contact surfaces include first contact surfaces (surfaces 212a, 212b, 312a, 312b) that engage with each other in the opposing direction and second contact surfaces (surfaces 211a, 211b, 311a, 311b) that engage with each other in a second direction (y-axis direction) perpendicular to both the opposing direction and the first direction. Engagement between the first and second contact surfaces securely fixes the semiconductor element 2 to the heat dissipation member 3D, and the heat dissipation surface 20 and the fixing surface 30 are tightly attached to each other.

[0041] (3) In the above (2), as shown in Figures 1 to 6, the convex portions 21a, 21b are slidably inserted into the grooves 31a, 31b from the insertion openings 314 at the ends of the grooves 31a, 31b in the extension direction along the grooves 31a, 31b, and the convex portions 21a, 21b have protrusions 213 on their outer surfaces that engage with recesses 313 formed on the inner surfaces of the grooves 31a, 31b. The engagement of the protrusions 213 with the recesses 313 prevents the convex portions 21a, 21b from moving in the extension direction of the grooves 31a, 31b (x-axis direction).

[0042] (4) In the above (3), as shown in Fig. 7, the heat dissipation surface 20A and the fixing surface 30A of the semiconductor device 1A are configured as inclined surfaces that are inclined upward in the first direction (x-axis direction) from the side where the insertion opening 314 is provided. Therefore, when the protrusions 21a, 21b are slid from the insertion openings 314 of the grooves 31a, 31b along the first direction (x-axis direction), the distance between the heat dissipation surface 20A and the fixing surface 30A decreases. As a result, when the semiconductor element 2A is fixed to the heat dissipation member 3A, the state of contact between the heat dissipation surface 20A and the fixing surface 30A can be further improved, and heat dissipation performance can be improved.

[0043] (5) In the above (1), the heat dissipation surface 20B of the semiconductor element 2B and the fixing surface 30B of the heat dissipation member 3B include uneven contact surfaces, as shown in Fig. 8. In this way, the heat dissipation surface 20B and the fixing surface 30B include uneven contact surfaces, which increases the area of the contact surfaces and improves the heat transfer performance from the semiconductor element 2B to the heat dissipation member 3B, thereby further improving the heat dissipation performance.

[0044] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate some of the application examples of the present invention, and the technical scope of the present invention is not intended to be limited to the specific configurations of the above embodiments. Furthermore, it is possible to combine the configurations described in the above embodiments and modifications. [Explanation of symbols]

[0045] 1, 1A, 1D... semiconductor device, 2, 2A, 2B, 2C, 2D... semiconductor element, 3, 3A, 3B, 3C, 3D... heat dissipation member, 4... semiconductor chip, 5... fitting joint portion, 20, 20A, 20B... heat dissipation surface, 21a, 21b, 22a, 22b, 23a, 23b... convex portion, 22... terminal, 30, 30A, 30B... fixing surface, 31a, 31b, 32a, 32b... groove, 33a, 33b... concave portion, 34... stopper, 35... fin, 211,212...Locking element, 213...Protrusion, 211a,211b,212a,212b,213a,221a,221b,222,231a,232,233,234a,234b,311a,3 11b, 312a, 312b, 313a, 321a, 321b, 322, 331, 332, 333, 334a, 334b...surface, 231...engaging claw, 231b...slope, 313...dent, 314...insertion opening

Claims

1. a semiconductor element in which a semiconductor chip is sealed with resin and has a heat dissipation surface; a heat dissipation member having a fixing surface disposed opposite to the heat dissipation surface and configured to dissipate heat from the heat dissipation surface into an ambient environment; a fitting coupling portion having a recess and a protrusion inserted into the recess, the fitting coupling portion fixing the semiconductor element to the heat dissipation member so that the heat dissipation surface and the fixing surface are in contact with each other; The semiconductor device is such that the protrusion and the recess are respectively formed with abutment surfaces that come into contact with each other to lock the protrusion into the recess.

2. 2. The semiconductor device according to claim 1, The recess is a groove extending in a first direction perpendicular to a direction in which the heat dissipation surface and the fixing surface oppose each other, The abutment surface includes a first abutment surface that engages in the opposing direction and a second abutment surface that engages in a second direction that is perpendicular to both the opposing direction and the first direction.

3. 3. The semiconductor device according to claim 2, the protrusion is slidably inserted into the groove from an insertion opening at an end of the groove in an extension direction along the groove, the convex portion has a protrusion on its outer surface that engages with a depression formed on the inner circumferential surface of the groove, The projection engages with the recess, thereby preventing the convex portion from moving in the extension direction of the groove.

4. 4. The semiconductor device according to claim 3, The semiconductor device, wherein the heat dissipation surface and the fixing surface are configured as inclined surfaces that are inclined upward along the first direction from the side where the insertion opening is provided.

5. 2. The semiconductor device according to claim 1, The semiconductor device includes a contact surface having an uneven shape, the heat dissipation surface and the fixing surface.

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