Grinding wheel attachment and detachment jig

Abstract

To provide a grinding wheel attachment and detachment jig capable of attaching and detaching a grinding wheel to and from a wheel mount with preferable workability.SOLUTION: A grinding wheel 26 is configured by arranging a grinding stone 26B in a ring shape in an annular base 26A formed of a non-magnetic material. The grinding wheel 26 is detachably attached to a wheel mount 25 formed of a magnetic material by a plurality of bolts 28. A grinding wheel attachment and detachment jig 60 used in attaching and detaching the grinding wheel 26 to and from the wheel mount 25. The grinding wheel attachment and detachment jig 60 includes: a support plate 61 including in an outer peripheral part thereof a placement surface 61a on which the annular base 26A is placed; and a magnet 62 arranged in a ring shape in a radially inside of the placement surface 61a of the support plate 61. A positioning pin 63 is perpendicularly erected in the center of the support plate 61. The positioning pin 63 fits to a positioning hole 25d formed in the center of the wheel mount 25.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a grinding wheel mounting / dismounting jig used when mounting / dismounting a grinding wheel of a grinding device to / from a wheel mount. [Background technology]

[0002] For example, in the manufacturing process of semiconductor devices such as ICs and LSIs used in various electronic devices, the backside of a wafer is ground by a grinding machine to thin the wafer to a predetermined thickness in order to reduce the size and weight of the semiconductor device. Here, in the grinding machine, for example, a grinding wheel having multiple grinding stones arranged in a ring is detachably attached by multiple bolts to a wheel mount attached to the tip of a spindle rotated by a motor. Then, the spindle, the wheel mount, and the grinding wheel attached to the wheel mount are rotated, and the wafer held on the chuck table is ground by the rotating grinding stones.

[0003] In such a grinding device, for example, when a grinding wheel becomes worn, the grinding wheel having the worn grinding wheel is replaced with a new grinding wheel by removing the grinding wheel having the worn grinding wheel from the wheel mount and attaching a new grinding wheel having an unworn grinding wheel to the wheel mount.

[0004] However, when replacing a grinding wheel, that is, when removing a grinding wheel with a worn grinding stone from a wheel mount and attaching a new grinding wheel to the wheel mount, problems may occur, such as accidentally damaging the grinding stone or dropping the grinding stone and damaging the chuck table. To prevent such problems from occurring, grinding wheel attachment / detachment jigs have been proposed for supporting the grinding wheel when attaching or detaching it (see, for example, Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-121128 [Patent Document 2] Japanese Patent Application Publication No. 2018-069344 [Patent Document 3] Japanese Patent Application Publication No. 2019-177444 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the grinding wheel mounting / dismounting jigs proposed in Patent Documents 1 to 3 have the problem of poor workability because the worker must support the grinding wheel mounting / dismounting jig with one hand when mounting or dismounting the grinding wheel.

[0007] The present invention has been made in view of the above problems, and its object is to provide a grinding wheel mounting / dismounting jig that enables the grinding wheel to be mounted / dismounted to / from the wheel mount with good workability. [Means for solving the problem]

[0008] The invention described in claim 1 is a grinding wheel attachment / detachment jig used to attach and detach a grinding wheel, which is constructed by arranging grinding wheels in a ring shape on an annular base made of a non-magnetic material and is removably attached to a wheel mount made of a magnetic material with a plurality of bolts, to the wheel mount, and is characterized by comprising: a support plate having a mounting surface on its outer periphery on which the annular base is placed, and a magnet arranged radially inside the mounting surface of the support plate.

[0009] The invention described in claim 2 is characterized in that, in the invention described in claim 1, a positioning pin is vertically erected on the support plate to fit into a positioning recess or positioning hole formed in the wheel mount.

[0010] The invention as set forth in claim 3 is characterized in that, in the invention as set forth in claim 2, it further comprises a biasing means for biasing the positioning pin upward. [Effects of the Invention]

[0011] According to the invention described in claim 1, the grinding wheel is attached to and detached from the wheel mount while the grinding wheel attachment / detachment jig is supported on the wheel mount by the magnetic force of a magnet.At this time, the worker does not need to support the grinding wheel attachment / detachment jig by hand, so the grinding wheel can be attached to and detached from the wheel mount easily and efficiently.

[0012] According to the invention described in claim 2, when attaching or detaching a grinding wheel to or from a wheel mount, the positioning pin on the grinding wheel attachment / detachment jig can be fitted into the positioning recess or positioning hole on the wheel mount, thereby aligning the centers of the grinding wheel attachment / detachment jig and the wheel mount and accurately positioning (centering) the grinding wheel attachment / detachment jig relative to the wheel mount.

[0013] According to the invention described in claim 3, when positioning (centering) the grinding wheel mounting / dismounting jig relative to the wheel mount, if the tip of the positioning pin is not inserted smoothly into the positioning recess or positioning hole of the wheel mount and collides with the opening edge of the positioning recess or positioning hole, the positioning pin can descend against the biasing force of the biasing means, and the impact of the positioning pin is absorbed and mitigated by the biasing means. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. [Figure 2] 1 is a perspective view of a grinding wheel mounting / dismounting jig according to the present invention. [Figure 3] FIG. 2 is a partial cross-sectional side view showing the structure for attaching the grinding wheel to the wheel mount. [Figure 4]3 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to the first embodiment of the present invention. FIG. [Figure 5] 3 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to the first embodiment of the present invention. FIG. [Figure 6] 3 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to the first embodiment of the present invention. FIG. [Figure 7] 10 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to a second embodiment of the present invention. FIG. [Figure 8] 10 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to a second embodiment of the present invention. FIG. [Figure 9] 10 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to a second embodiment of the present invention. FIG. [Figure 10] 10 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to a third embodiment of the present invention. FIG. [Figure 11] 10 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to a third embodiment of the present invention. FIG. [Figure 12] 10 is a side cross-sectional view showing a process of attaching and detaching a grinding wheel to and from a wheel mount using a grinding wheel attaching and detaching jig according to a third embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0016] [Grinding equipment configuration] First, the configuration of a grinding device equipped with a grinding wheel that is attached to and detached from a wheel mount using a grinding hole attaching and detaching jig according to the present invention will be described below with reference to Fig. 1. In the following description, the directions of the arrows shown in Fig. 1 will be referred to as the X-axis (left-right direction), the Y-axis (front-rear direction), and the Z-axis (up-down direction), respectively.

[0017] The grinding apparatus 1 shown in FIG. 1 grinds a disk-shaped wafer W, which is a workpiece, and is mainly equipped with the following components:

[0018] That is, the grinding device 1 has as its main components a chuck table 10 that holds the wafer W, which is the workpiece, and rotates around the vertical axis of the wafer W, a grinding unit 20 that grinds the wafer W held by suction on the chuck table 10, a thickness gauge 30 that measures the thickness of the wafer W during grinding, a grinding feed mechanism 40 that raises and lowers the grinding unit 20 in a direction vertical to the holding surface of the chuck table 10 (Z-axis direction), and a horizontal movement mechanism 50 that moves the chuck table 10 horizontally to the holding surface (Y-axis direction).

[0019] 1, a plurality of devices (not shown) are formed on the surface facing downward, and these devices are protected by a protective tape T attached to the surface of the wafer W. The front surface (the bottom surface in FIG. 1) of the wafer W is suction-held to the holding surface of a chuck table 10 via the protective tape T, and the back surface (the top surface in FIG. 1) is ground by a grinding unit 20. Note that, in addition to silicon (Si), the wafer W may be made of silicon carbide (SiC), glass, ceramics, sapphire (Al2O3), or potassium arsenide (GaAs).

[0020] Next, the configurations of the chuck table 10, grinding unit 20, thickness measuring device 30, grinding feed mechanism 40, and horizontal movement mechanism 50, which are the main components of the grinding device 1, will be described.

[0021] (Chuck table) The chuck table 10 is a disk-shaped member, and a porous member 11 is incorporated in the center thereof. Here, the porous member 11 is made of porous ceramic or the like, and its upper surface forms a holding surface that suction-holds the disk-shaped wafer W.

[0022] The chuck table 10 is rotated around a vertical axis by a rotation mechanism (not shown). Although not shown, the porous member 11 of the chuck table 10 is selectively connected to a suction source (not shown), such as an ejector or a vacuum pump.

[0023] The grinding device 1 according to this embodiment has a rectangular box-shaped base 100 that is long in the Y-axis direction (front-rear direction), and the chuck table 10 faces a rectangular opening 100a that is long in the Y-axis direction and opens into the base 100. The periphery of the chuck table 10 at the opening 100a is covered with a rectangular plate-shaped cover 101, and the front and rear (-Y direction and +Y direction) parts of the cover 101 at the opening 100a are covered by bellows-shaped expandable covers 102 and 103, which move and expand together with the cover 101.

[0024] (Grinding unit) The grinding unit 20 includes a spindle housing 22 fixed to a holder 21, a spindle motor 23 housed in the spindle housing 22, a vertical spindle 24 rotated by the spindle motor 23, a disk-shaped wheel mount 25 attached to the lower end of the spindle 24, and a grinding wheel 26 serving as a processing tool detachably attached to the underside of the wheel mount 25. The grinding wheel 26 is composed of an annular base 26A and a plurality of grinding wheels 26B attached in an annular shape to the underside of the annular base 26A. The grinding wheels 26B are rectangular block-shaped processing members for grinding the wafer W, and their undersides form a grinding surface that comes into contact with the upper surface (surface to be ground) of the wafer W.

[0025] Wheel mount 25 is made of a magnetic material such as iron or stainless steel (e.g., SUS400), and has a disk-shaped protrusion 25A integrally formed in the center of its underside as shown in Fig. 3. A plurality of (eight in this embodiment) bolt insertion holes 25a are formed vertically at equal angular intervals (45° intervals) around the periphery of wheel mount 25.

[0026] 3, a circular hole-shaped flow passage 25b is formed in the axial center of wheel mount 25, which is in communication with a circular hole-shaped flow passage 24a formed perpendicular to the axial center of spindle 24, and a plurality of flow passages 25c are formed inside wheel mount 25, extending radially outward from flow passage 25b. Note that flow passage 24a formed in spindle 24 is connected to a grinding water supply source (not shown).

[0027] Furthermore, a circular positioning hole 25d having the same diameter as flow path 25b is formed in the axial center of wheel mount 25, and a disk-shaped lid member 27 is fitted onto the upper end of this positioning hole 25d. Note that wheel mount 25 may be formed with a positioning recess instead of positioning hole 25d.

[0028] On the other hand, the annular base 26A of the grinding wheel 26 is made of a non-magnetic material such as a non-magnetic metal, such as an aluminum alloy or stainless steel (e.g., SUS300 series), or a non-magnetic material, such as resin, and a plurality of block-shaped grinding stones 26B are arranged in an annular shape and fixed to the outer periphery of the lower surface of the base 26A. Here, each grinding stone 26B is made by solidifying diamond abrasive grains with a binder such as a metal bond or a resin bond.

[0029] Then, on the outer periphery of the upper surface of the annular base 26A, female screw holes 26a are formed vertically at equal angular pitches (45° pitches) in the circumferential direction, the same number as the bolt insertion holes 25a formed in the wheel mount 25 (eight in this embodiment). Furthermore, circular hole-shaped nozzles 26b are formed vertically in the annular base 26A, and communicate with a plurality of flow paths 25c formed vertically in the wheel mount 25, and each nozzle 26b is open to the atmosphere.

[0030] As shown in Figure 3, the grinding wheel 26 is removably attached to the wheel mount 25 by fitting the inner surface of the annular base 26A onto the outer periphery of the protrusion 25A of the wheel mount 25 to incorporate the wheel mount 25, and then threading multiple (eight) bolts 28, which are inserted from above into multiple (eight) bolt insertion holes 25a formed in the wheel mount 25, into multiple (eight) female threaded holes 26a formed in the annular base 26A of the grinding wheel 26.

[0031] (Thickness measuring instrument) The thickness measuring device 30 is a height gauge that measures the thickness of the wafer W held on the chuck table 10 during grinding, and is equipped with a first contactor 31 that comes into contact with the top surface of the wafer W and a second contactor 32 that comes into contact with the top surface of the chuck table 10. Here, the first contactor 31 measures the height of the top surface of the wafer W during grinding, and the thickness of the wafer W is determined from the difference between the height of the top surface of the wafer W measured by the first contactor 31 and the height of the top surface of the chuck table 10 measured by the second contactor 32.

[0032] (Grinding feed mechanism) The grinding feed mechanism 40 raises and lowers the grinding unit 20 in a direction (Z-axis direction) perpendicular to the holding surface of the chuck table 10, and is disposed on the −Y-axis direction end face (front face) of a rectangular box-shaped column 41 that is erected vertically on the +Y-axis direction end face (rear end face) of the upper surface of the base 100. The grinding feed mechanism 40 raises and lowers a rectangular plate-shaped lifting plate 42 attached to the back face of the holder 21, together with the holder 21 and the spindle 24 and grinding wheel 26 held by the holder 21, in the Z-axis direction along a pair of left and right guide rails 43. The pair of left and right guide rails 43 are disposed perpendicular to the front face of the column 41 and parallel to each other.

[0033] A rotatable ball screw 44 is provided vertically along the Z-axis direction (up-down direction) between the pair of left and right guide rails 43, and the upper end of the ball screw 44 is connected to a servo motor 45, which serves as a drive source and can rotate forward and backward. The servo motor 45 is attached in a vertical position to the column 41 via a rectangular plate-shaped bracket 46 attached to the upper surface of the column 41. The lower end of the ball screw 44 is rotatably supported by the column 41, and a nut member (not shown) that protrudes horizontally from the back surface of the lifting plate 42 toward the rear (+Y-axis direction) is threadedly engaged with the ball screw 44.

[0034] Therefore, when the servo motor 45 is started to rotate the ball screw 44 forward and backward, the lifting plate 42, to which a nut member (not shown) that screws onto the ball screw 44 is attached, moves up and down along a pair of guide rails 43 together with the grinding unit 20, so that the grinding unit 20 moves up and down and the grinding amount (grinding allowance) of the grinding wheel 26B on the wafer W is set.

[0035] (Horizontal movement mechanism) The horizontal movement mechanism 50 is a mechanism for moving the chuck table 10 in the horizontal direction (Y-axis direction) relative to the holding surface, and is disposed on a rectangular block-shaped internal base 51 housed inside the base 100. The horizontal movement mechanism 50 is equipped with a block-shaped slider 52, and the slider 52 is slidable in the Y-axis direction along a pair of left and right guide rails 53 disposed parallel to each other along the Y-axis direction (front-rear direction). Therefore, the chuck table 10 supported by the slider 52 and a rotation mechanism (not shown) are slidable along the Y-axis direction together with the slider 52.

[0036] A rotatable ball screw 54 extending in the Y-axis direction (front-rear direction) is disposed between a pair of left and right guide rails 53 on the internal base 51, and one end of the ball screw 54 in the Y-axis direction (the left end in FIG. 1) is connected to a servo motor 55, which serves as a drive source and can rotate forward and backward. The other end of the ball screw 54 in the Y-axis direction (the right end in FIG. 1) is rotatably supported on the internal base 51 by a bearing 56 that is erected on the internal base 51. A nut member (not shown) that protrudes downward from the slider 52 is screwed onto the ball screw 54.

[0037] Therefore, when the servo motor 55 is started to rotate the ball screw 54 forward or backward, a nut member (not shown) that is threaded onto the ball screw 54 slides in the Y-axis direction (front-back direction) along the ball screw 54 together with the slider 52, and the chuck table 10 also moves integrally along the Y-axis direction together with the slider 52. As a result, the wafer W that is suction-held on the holding surface of the chuck table 10 also moves along the Y-axis direction.

[0038] [Function of grinding equipment] Next, grinding of the wafer W by the grinding apparatus 1 configured as above will be described.

[0039] When grinding the wafer W, the wafer W is placed on the holding surface of the chuck table 10 with the protective tape T facing down. The porous member 11 of the chuck table 10 is then connected to a suction source (not shown), such as an ejector or a vacuum pump, and the porous member 11 is evacuated. This generates a negative pressure in the porous member 11, and the wafer W is attracted by this negative pressure and held on the holding surface of the chuck table 10.

[0040] On the other hand, the horizontal movement mechanism 50 is driven to move the chuck table 10 in the +Y-axis direction (rearward), and the wafer W suction-held on the chuck table 10 is positioned below the grinding wheel 26 of the grinding unit 20. Then, the chuck table 10 is rotated by a rotation mechanism (not shown), and the wafer W held on the holding surface of the chuck table 10 is rotated at a predetermined rotational speed, and the spindle motor 23 is driven to rotate the grinding wheel 26 at a predetermined speed.

[0041] The lower surface of the grinding wheel 26B is then brought into contact with the back surface (top surface) of the wafer W held on the holding surface of the chuck table 10, and the grinding feed mechanism 40 lowers the grinding wheel 26B in the −Z axis direction (the direction toward the holding surface) until the thickness of the wafer W (measured by the thickness gauge 30) reaches a predetermined thickness. This grinds the back surface (top surface) of the wafer W to a predetermined finished thickness. During the grinding process of the wafer W, grinding water is sprayed from a grinding water supply source (not shown) through a flow path 24a formed at the axial center of the spindle 24 and flow paths 25b and 25c formed in the wheel mount 25, as shown in FIG. 3, and then from multiple nozzles 26b formed in the annular base 26A of the grinding wheel 26 toward the contact area (processing area) between the wafer W and the grinding wheel 26B. Therefore, the contact portion (processing portion) between the wafer W and the grinding wheel 26B is cooled by the grinding water, and the grinding water washes away and removes grinding dust generated by grinding the wafer W. Here, pure water is preferably used as the grinding water.

[0042] Incidentally, when the grinding stone 26B of the grinding wheel 26 wears out due to grinding the wafer W, the grinding wheel 26 is replaced with a new one. To replace the grinding wheel 26, that is, to remove the old grinding wheel 26 from the wheel mount 25 and attach the new grinding wheel 26 to the wheel mount 25, an attachment / detachment operation is performed. This attachment / detachment operation of the grinding wheel 26 is performed using a grinding wheel attachment / detachment jig 60 shown in FIG. 2.

[0043] The grinding wheel attachment / detachment jig 60 shown in Figure 2 is composed of a disk-shaped support plate 61, multiple (six in the illustrated example) cylindrical magnets (permanent magnets) 62 arranged on the upper surface of the support plate 61, a cylindrical positioning pin 63 standing vertically upward from the center of the upper surface of the support plate 61, and a cylindrical handle 64 extending vertically downward from the center of the lower surface of the support plate 61.

[0044] The outer diameter of the support plate 61 is set slightly smaller than the diameter of the inscribed circle of the grinding wheel 26B, and the diameter of the circumscribed circle of the multiple (six) magnets 62 arranged on the upper surface of the support plate 61 is set slightly smaller than the inner diameter of the annular base 26A of the grinding wheel 26. The outer periphery of the upper surface of the support plate 61, specifically, the ring-shaped portion 61a (hatched portion in FIG. 2 ) radially outward of the circumscribed circle of the multiple magnets 62, forms a mounting surface on which the annular base 26A of the grinding wheel 26 is placed when the grinding wheel 26 is mounted or removed using the grinding wheel mounting / removal jig 60 (described later). In this embodiment, six magnets (permanent magnets) 62 are arranged on the same circumference at equal angular intervals (60° intervals) on the upper surface of the support plate 61. However, the number of magnets 62 is optional and may be three or more, less than six, or seven or more. Alternatively, a single ring-shaped magnet 62 may be used.

[0045] The outer diameter of the positioning pin 63 is set to a value slightly smaller than the inner diameter of the positioning hole 25d formed in the center of the wheel mount 25, and a tapered surface 63a that decreases in diameter toward the top is formed at the upper end of the positioning pin 63. Furthermore, the outer diameter of the handle 64 is set to a size that allows an operator to easily grip the handle 64 with their hand.

[0046] [How to attach and remove the grinding wheel] Next, an embodiment of a method for attaching and detaching the grinding wheel 26, which is carried out using the grinding wheel attaching and detaching jig 60 configured as described above, will be described.

[0047] First Embodiment When removing the grinding wheel 26 from the wheel mount 25 to replace it, the worker grasps the handle 64 of the grinding wheel mounting / detaching jig 60 with one hand and lifts the grinding wheel mounting / detaching jig 60 in the direction of the solid arrow from the chain line position shown in Fig. 4, and positions the grinding wheel mounting / detaching jig 60 below the grinding wheel 26 as shown by the solid line in Fig. 4. Specifically, the positioning pin 63 erected at the center of the upper surface of the support plate 61 of the grinding wheel mounting / detaching jig 60 is inserted and fitted into the positioning hole 25d formed in the center of the wheel mount 25. This causes the center of the grinding wheel mounting / detaching jig 60 to coincide with the center of the wheel mount 25, and the grinding wheel mounting / detaching jig 60 is accurately positioned (centered) with respect to the wheel mount 25. At this time, since the tapered surface 63a is formed at the tip of the positioning pin 63, the positioning pin 63 is guided by this tapered surface 63a and smoothly fits into the positioning hole 25d of the wheel mount 25.

[0048] As described above, when the grinding wheel mounting / detaching jig 60 is raised to the solid line position in Figure 4, the multiple magnets (six pieces) 62 arranged on the upper surface of the support plate 61 of the grinding wheel mounting / detaching jig 60 pass inside the annular base 26A of the grinding wheel 26 and abut against the underside of the wheel mount 25 made of a magnetic material. At this time, the multiple magnets 62 are magnetically attached to the underside of the protrusion 25A of the wheel mount 25, so the grinding wheel mounting / detaching jig 60 is supported by the wheel mount 25. At this time, the outer peripheral surfaces of the multiple magnets (six pieces) 62 are fitted into the inner peripheral surface of the annular base 26A of the grinding wheel 26. Therefore, because the grinding wheel mounting / detaching jig 60 is supported by the wheel mount 25 by the magnetic force of the multiple magnets 62, the grinding wheel mounting / detaching jig 60 will not fall even if the operator releases the handle 64 of the grinding wheel mounting / detaching jig 60. The magnetic force of the multiple (six) magnets 62 is set to a value greater than the weight of the grinding wheel mounting / dismounting jig 60 itself and the weight of the grinding wheel 26. In other words, the grinding wheel 26 supported on the wheel mount 25 via the grinding wheel attachment / detachment jig 60 is freely rotatable with the underside of the annular base 26A supported on the mounting surface 61a and the inner surface of the annular base 26A supported on the outer surface of each magnet 62.

[0049] 4, when the grinding wheel mounting / detaching jig 60 is supported by the magnetic force of the magnet 62 against the underside of the protrusion 25A protruding from the underside of the wheel mount 25, a minute gap δ is formed between the underside of the annular base 26A of the grinding wheel 26 and the upper surface of the support plate 61 of the grinding wheel mounting / detaching jig 60. That is, the height H between the upper surface of the annular base 26A and the upper surface of the support plate 61 of the grinding wheel mounting / detaching jig 60 is set higher than the thickness t of the annular base 26A by the minute gap δ. Therefore, the relationship Ht=δ holds among the height H, the thickness t, and the minute gap δ.

[0050] Next, in a state in which the grinding wheel attaching / detaching jig 60 is supported on the wheel mount 25 by the magnetic force of the magnet 62 as described above, when the multiple (eight in this embodiment) bolts 28 are loosened and pulled upward (in the direction of the solid arrow) from the bolt insertion holes 25a of the wheel mount 25 as shown in Fig. 5, the grinding wheel 26 is released from being fastened to the wheel mount 25 by the bolts 28, and the grinding wheel 26 falls under its own weight and is placed on the placement surface 61a on the outer periphery of the upper surface of the support plate 61 of the grinding wheel attaching / detaching jig 60. At this time, a minute gap δ is formed between the lower surface of the wheel mount 25 and the upper surface of the annular base 26A of the grinding wheel 26.

[0051] As described above, the grinding wheel 26 is removed while the grinding wheel attachment / detachment jig 60 is supported on the wheel mount 25 by the magnetic force of the magnet 62. At this time, the worker does not need to support the grinding wheel attachment / detachment jig 60 by hand, so the grinding wheel 26 can be removed easily and efficiently.

[0052] Then, from the state in which the grinding wheel 26 has been removed from the wheel mount 25 and placed on the support plate 61 of the grinding wheel attachment / detachment jig 60, as shown in Figure 6, the grinding wheel attachment / detachment jig 60 with the removed grinding wheel 26 placed on the support plate 61 is lowered in the direction of the solid arrow, the grinding wheel 26 placed on the support plate 61 is removed from the support plate 61, a new grinding wheel 26 is placed on the support plate 61, and a new grinding wheel 26 can be attached to the wheel mount 25 by performing the above steps in reverse.

[0053] That is, as shown in Fig. 6, the grinding wheel attachment / detachment jig 60 with a new grinding wheel 26 placed on it is pushed upward (in the direction of the dashed arrow) so that the magnetic forces of the multiple (six) magnets 62 are brought into close contact with the underside of the protrusion 25A of the wheel mount 25, as shown in Fig. 5. The grinding wheel attachment / detachment jig 60 is then supported by the wheel mount 25 by the magnetic forces of the multiple magnets 62. In this state, the multiple (eight) female screw holes 26a formed in the annular base 26A of the grinding wheel 26 are aligned circumferentially with the multiple (eight) bolt insertion holes 25a formed in the wheel mount 25. However, in the state shown in Fig. 5, a minute gap δ is formed between the underside of the wheel mount 25 and the upper surface of the annular base 26A of the grinding wheel 26, as shown in the figure, so the grinding wheel 26 can freely rotate circumferentially on the mounting surface 61a of the support plate 61 of the grinding wheel attachment / detachment jig 60. Therefore, the multiple (eight) female screw holes 26a formed in the annular base 26A of the grinding wheel 26 can be aligned with the positions of the bolt insertion holes 25a formed in the wheel mount 25. Note that, because the annular base 26A of the grinding wheel 26 is made of a non-magnetic material, the annular base 26A is not affected by the magnetic force of the magnet 62, and the annular base 26A can rotate freely on the mounting surface 61a of the grinding wheel attaching / detaching jig 60.

[0054] Once the multiple (eight) female threaded holes 26a formed in the annular base 26A of the grinding wheel 26 are accurately aligned with the bolt insertion holes 25a formed in the wheel mount 25 as described above, each bolt 28 is passed through each bolt insertion hole 25a of the wheel mount 25 from above and screwed into the female threaded holes 26a of the annular base 26A, and the new grinding wheel 26 is attached to the wheel mount 25 with the multiple (eight) bolts 28, as shown in Figure 4.

[0055] As described above, when a new grinding wheel 26 is attached to the wheel mount 25 with multiple (eight) bolts 28, the magnetic force of multiple (six) magnets 62 pulls the grinding wheel attachment / detachment jig 60 attached to the wheel mount 25 away from the wheel mount 25 and moves it downward (in the direction of the dashed arrow in Figure 4) as shown by the chain line in Figure 4.

[0056] As described above, the grinding wheel 26 is attached to the wheel mount 25 with the grinding wheel attachment / detachment jig 60 supported on the wheel mount 25 by the magnetic force of the magnet 62. At this time, the worker does not need to support the grinding wheel attachment / detachment jig 60 by hand, so the grinding wheel 26 can be attached easily and efficiently.

[0057] Therefore, by using the grinding wheel attachment / detachment jig 60 of this embodiment, when replacing the grinding wheel 26, the grinding wheel 26 can be attached and detached (mounted and removed) to and from the wheel mount 25 easily and efficiently, and problems such as damaging the grinding wheel 26B of the grinding wheel 26 or the grinding wheel 26 falling onto the chuck table 10 (see Figure 1) and damaging the chuck table 10 do not occur.

[0058] Second Embodiment Next, the configuration of a grinding wheel mounting / dismounting jig 60' according to a second embodiment and the operation of mounting / dismounting the grinding wheel 26 to / from the wheel mount 25 using the grinding wheel mounting / dismounting jig 60' will be described with reference to FIGS.

[0059] 7, in the grinding wheel mounting / dismounting jig 60' according to this embodiment, the handle 64 is formed in a cylindrical shape with a bottom, and the lower half of the positioning pin 63 is inserted into the handle 64. Here, the positioning pin 63 is movable up and down relative to the handle 64, and is constantly biased upward by a coil spring 65, which is a biasing means mounted in the handle 64 in a compressed state.

[0060] Therefore, since the other configurations of the grinding wheel mounting / dismounting jig 60' in this embodiment are the same as the configuration of the grinding wheel mounting / dismounting jig 60 in the first embodiment, in Figures 7 to 9, the same elements as those shown in Figures 4 to 6 are given the same symbols, and further explanation of them will be omitted below.

[0061] Furthermore, the attachment and detachment of the grinding wheel 26 to and from the wheel mount 25 using the grinding wheel attachment / detachment jig 60' of this embodiment is performed in the same manner as the attachment and detachment work performed using the grinding wheel attachment / detachment jig 60 of the first embodiment. However, in the attachment and detachment work performed using the grinding wheel attachment / detachment jig 60' of this embodiment, as shown in Figure 7, when the grinding wheel 26 is pushed upward and the grinding wheel attachment / detachment jig 60' is supported on the wheel mount 25 by the magnetic force of multiple magnets 62, if the tip of the positioning pin 63 does not insert smoothly into the positioning hole 25d of the wheel mount 25 when positioning (centering) the grinding wheel attachment / detachment jig 60' with respect to the wheel mount 25 and the tip of the positioning pin 63 collides with the open edge of the positioning hole 25d, the positioning pin 63 can move down against the biasing force of the coil spring 65, and the impact of the positioning pin 63 is absorbed and mitigated by the coil spring 65.

[0062] 4, the positioning pin 63 is guided by the tapered surface 63a at its tip and inserted into the positioning hole 25d of the wheel mount 25. The biasing force of the coil spring 65 causes the positioning pin 63 to be inserted into the positioning hole 25d of the wheel mount 25, with its tip maintained in contact with the cover member 27. Furthermore, with the grinding wheel attaching / detaching jig 60' supported on the wheel mount 25, as shown in FIG. 8, when the grinding wheel 26 is removed from the wheel mount 25 or when a new grinding wheel 26 is attached to the wheel mount 25, the positioning pin 63 is inserted into the positioning hole 25d of the wheel mount 25 by the biasing force of the coil spring 65, with its tip maintained in contact with the cover member 27.

[0063] Furthermore, as shown in Figure 9, when the grinding wheel 26 removed from the wheel mount 25 is pushed downward on the grinding wheel attachment / detachment jig 60' placed on the support plate 61 to separate it from the wheel mount 25, or when a new grinding wheel 26 is pushed downward on the grinding wheel attachment / detachment jig 60' placed on the support plate 61 to bring it closer to the wheel mount 25, the positioning pin 63 is in a fully extended state by the coil spring 65, and while engaged with the positioning hole 25d of the wheel mount 25, the positioning pin 63 extends a long distance above the support plate 61 to guide the up and down movement of the grinding wheel attachment / detachment jig 60', so that the grinding wheel attachment / detachment jig 60' can be pushed up and down stably.

[0064] Therefore, by using the grinding wheel attachment / detachment jig 60' of this embodiment, when replacing the grinding wheel 26, the grinding wheel 26 can be attached and detached (mounted and removed) to and from the wheel mount 25 with good workability, and the same effect as in the first embodiment can be obtained, in that problems such as damaging the grinding stone 26B of the grinding wheel 26 or the grinding wheel 26 falling onto the chuck table 10 (see Figure 1) and damaging the chuck table 10 do not occur.

[0065] Third Embodiment Next, the configuration of a grinding wheel mounting / dismounting jig 60'' according to a third embodiment and the operation of mounting / dismounting the grinding wheel 26 to / from the wheel mount 25 using the grinding wheel mounting / dismounting jig 60'' will be described with reference to FIGS.

[0066] In the grinding wheel mounting / dismounting jig 60" according to this embodiment, as shown in FIG. 10, the inner peripheral surface of the annular base 26A of the grinding wheel 26 is formed as a tapered surface 26c that expands in diameter downward, and the outer peripheral surfaces of the multiple magnets 62 are formed as tapered surfaces 62a that fit into the tapered surface 26c of the annular base 26A. The other configuration is the same as that of the grinding wheel mounting / dismounting jig 60 according to embodiment 1, and therefore in FIGS. 10 to 12, the same elements as those shown in FIGS. 4 to 6 are designated by the same reference numerals, and further description thereof will be omitted below.

[0067] Furthermore, the attachment and detachment of the grinding wheel 26 to and from the wheel mount 25 using the grinding wheel attachment and detachment jig 60" according to this embodiment is carried out in the same manner as the attachment and detachment work carried out using the grinding wheel attachment and detachment jig 60 according to the first embodiment. That is, the grinding wheel 26 is removed from the wheel mount 25 in the order shown in Figures 10 → 11 → 12, and a new grinding wheel 26 is attached to the wheel mount 25 in the reverse order of the removal procedure, in the order shown in Figures 12 → 11 → 10.

[0068] Therefore, by using the grinding wheel attaching / detaching jig 60" according to this embodiment, when replacing the grinding wheel 26, the worker can attach / detach (mount and remove) the grinding wheel 26 to / from the wheel mount 25 while the grinding wheel attaching / detaching jig 60" is still attached to the wheel mount 25 without having to support the grinding wheel attaching / detaching jig 60" by hand, allowing the worker to attach / detach the grinding wheel 26 to / from the wheel mount 25 easily and efficiently. As a result, the same effect as in embodiment 1 can be obtained, in that problems such as damaging the grinding stone 26B of the grinding wheel 26 or the grinding wheel 26 falling onto the chuck table 10 (see Figure 1) and damaging the chuck table 10 do not occur.

[0069] When removing the grinding wheel 26 from the wheel mount 25, it is advisable to remove the magnetically attached grinding wheel attachment / detachment jig 60 from the wheel mount 25 by pressing the head of the bolt 28 inserted into the bolt insertion hole 25a. Here, the positioning hole 25d and the positioning pin 63 do not have to be located in the center. Alternatively, multiple positioning holes 25d and pins 63 may be located.

[0070] It should be noted that the present invention is not limited to the application of the above-described embodiments, and various modifications are possible within the scope of the claims and the technical ideas described in the specification and drawings. [Explanation of symbols]

[0071] 1: grinding device, 10: chuck table, 11: porous member, 20: grinding unit, 21: holder, 22: spindle housing, 23: spindle motor, 24: spindle, 25: wheel mount, 25A: protrusion, 25a: bolt insertion hole, 25b, 25c: flow path, 25d: positioning hole, 26: grinding wheel, 26A: annular base, 26B: grinding wheel, 26a: female screw hole, 26b: nozzle, 26c: tapered surface, 27: Cover member, 28: Bolt, 30: Thickness measuring device, 31: First contactor, 32: second contactor, 40: grinding feed mechanism, 41: column, 42: lifting plate, 43: Guide rail, 44: Ball screw, 45: Servo motor, 46: Bracket, 50: horizontal movement mechanism, 51: internal base, 52: slider, 53: guide rail, 54: Ball screw, 55: Servo motor, 56: Bearing, 60, 60', 60": Grinding wheel attachment / detachment jig, 61: Support plate, 61a: mounting surface of support plate, 62: magnet, 62a: tapered surface of magnet, 63: Positioning pin, 63a: Tapered surface of the positioning pin, 64: Handle, 65: coil spring (urging means), 100: base, 100a: opening of base, 101: Cover, 102, 103: Elastic cover, T: Protective tape, W: Wafer

Claims

1. A grinding wheel mounting / removal jig used to mount / remove a grinding wheel, the grinding wheel comprising a non-magnetic annular base and a plurality of grinding wheels arranged in a circular shape, the grinding wheel being detachably mounted to a magnetic wheel mount with a plurality of bolts, the grinding wheel comprising: a support plate having a mounting surface on an outer periphery thereof on which the annular base is mounted; a magnet disposed radially inside the mounting surface of the support plate; A grinding wheel attachment / detachment jig comprising:

2. 2. The grinding wheel mounting / dismounting jig according to claim 1, wherein said support plate has a positioning pin extending vertically therefrom, said positioning pin fitting into a positioning recess or a positioning hole formed in said wheel mount.

3. 3. A grinding wheel mounting / dismounting jig according to claim 2, further comprising a biasing means for biasing said positioning pin upward.

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