Underfloor material

Abstract

To provide an underfloor material capable of suitably exhibiting a buffer function.SOLUTION: An underfloor material 11 is placed between a base and a floor finishing material. The underfloor material 11 has an adhesive surface 11a that is bonded to the base. The underfloor material 11 includes: a needle-punched nonwoven fabric layer 21; a first covering layer 31 that covers an upper surface 21a of the needle-punched nonwoven fabric layer 21; and a second covering layer 41 that covers a lower surface 21b of the needle-punched nonwoven fabric layer 21. The second covering layer 41 is fixed to the needle-punched nonwoven fabric layer 21. The adhesive surface 11a that is bonded to the base is composed of a lower surface 41b of the second covering layer 41.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an underfloor material. [Background technology]

[0002] A soundproof flooring material in which a nonwoven fabric is laminated on the back side of a wooden floorboard is known, as described in Patent Document 1. This soundproof flooring material is fixed to the floor substrate using an adhesive. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 07-166617 Summary of the Invention [Problem to be solved by the invention]

[0004] In the underfloor material having the above-mentioned nonwoven fabric layer, a configuration that can better exhibit the shock-absorbing function is desired. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an underfloor material that can optimally exhibit its shock-absorbing function. [Means for solving the problem]

[0005] Various aspects of the underfloor material that solve the above problems will be described. The floor underlayment material of aspect 1 is a floor underlayment material that is placed between a base and a floor finishing material and has an adhesive surface that is adhered to the base, and comprises a needle-punched nonwoven fabric layer, a first covering layer that covers the upper surface of the needle-punched nonwoven fabric layer, and a second covering layer that covers the lower surface of the needle-punched nonwoven fabric layer, the second covering layer being fixed to the needle-punched nonwoven fabric layer, and the adhesive surface being formed by the lower surface of the second covering layer.

[0006] According to this configuration, the needle-punched nonwoven fabric layer has a structure in which the fibers are entangled, making it a buffer layer that is more likely to exhibit its buffering function and maintain its shape. Furthermore, when adhering the floor underlayment to the base, the second coating layer covering the underside of the needle-punched nonwoven fabric layer can prevent adhesive from penetrating into the needle-punched nonwoven fabric layer. This prevents the buffering performance of the needle-punched nonwoven fabric layer from being reduced by the adhesive. Furthermore, since the upper surface of the needle-punched nonwoven fabric layer is covered by the first coating layer, the load distributed by the first coating layer can be transmitted to the needle-punched nonwoven fabric layer. This reduces the concentration of load on the needle-punched nonwoven fabric layer, thereby improving the durability of the needle-punched nonwoven fabric layer, allowing it to continue to exhibit its buffering performance.

[0007] In the underfloor material of Aspect 2, the first coating layer may include a spunbond nonwoven fabric layer in Aspect 1. With this configuration, the spunbond nonwoven fabric layer has a heat-fused portion where the fibers are heat-fused, thereby improving the shape stability of the first coating layer. This allows the load applied from the first coating layer to the needle-punched nonwoven fabric layer to be more dispersed.

[0008] The underfloor material of aspect 3 may be the same as that of aspect 1 or aspect 2, further comprising an adhesive material layer that bonds the needle-punched nonwoven fabric layer and the first covering layer. This configuration makes it easier for loads and impacts from the first covering layer to be transmitted to the needle-punched nonwoven fabric layer via the adhesive material layer.

[0009] In the underfloor material of aspect 4, in aspect 3, the surface density of the adhesive material layer is 5 g / m 2 More than 350g / m 2 The range may be as follows: With this configuration, for example, it is possible to exhibit the load distribution performance of the adhesive material layer and to suppress warpage deformation of the underfloor material.

[0010] In the underfloor material of aspect 5, in aspect 3 or aspect 4, the adhesive material layer may be composed of a hot-melt adhesive. According to this configuration, the hot-melt adhesive can be solidified relatively quickly by cooling. Such a hot-melt adhesive tends to solidify near the upper surface of the needle-punched nonwoven fabric layer while remaining on the upper surface of the needle-punched nonwoven fabric layer. This prevents the adhesive forming the adhesive material layer from penetrating into the needle-punched nonwoven fabric layer.

[0011] In the floor underlayment of aspect 6, in accordance with aspect 5, the hot-melt adhesive may contain a polyethylene resin. This configuration increases the flexibility of the adhesive material layer. This allows the adhesive material layer to more easily follow deformations of, for example, the needle-punched nonwoven fabric layer and the first covering layer. This, for example, can prevent peeling between the needle-punched nonwoven fabric layer and the first covering layer.

[0012] In the underfloor material of aspect 7, in any one of aspects 1 to 6, the second coating layer may include a molten layer formed by melting fibers of the needle-punched nonwoven fabric along one of the two main surfaces of the needle-punched nonwoven fabric used to form the needle-punched nonwoven fabric layer. This configuration makes it possible to fix the second coating layer to the needle-punched nonwoven fabric layer without providing a separate fixing member for fixing the second coating layer to the needle-punched nonwoven fabric layer. [Effects of the Invention]

[0013] The present invention exhibits the effect of being able to suitably exhibit the buffering function. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is an exploded perspective view of a floor structure according to an embodiment. [Figure 2] FIG. 2 is an exploded cross-sectional view of the underfloor material. [Figure 3] FIG. 3 is a cross-sectional view showing the floor structure. [Figure 4]FIG. 4 is a schematic diagram illustrating a method for manufacturing an underfloor material. DETAILED DESCRIPTION OF THE INVENTION

[0015] An embodiment of the underfloor material will be described below with reference to the drawings. First, a floor structure in which the underfloor material is used will be described. <Floor structure> As shown in Figures 1 and 3, the underfloor material 11 is placed between a base 61 and a floor finishing material 62. The underfloor material 11 forms a floor structure together with the floor finishing material 62 on the base 61. The underfloor material 11 has an adhesive surface 11a that is adhered to the base 61.

[0016] The base 61 may be, for example, a floor slab made of concrete. The base 61 may have a floor slab and a floor material placed on the floor slab. That is, the underfloor material 11 may be used, for example, to improve the shock-absorbing performance of an existing floor material. The floor material may include a floor base material such as a wood board or a resin tile. The floor material may include a shock-absorbing material such as felt or a resin foam. The shock-absorbing material is placed between the floor base material and the floor slab. Floor materials with shock-absorbing material are commercially available under names such as soundproof flooring and sound-insulating flooring.

[0017] Examples of floor finishing materials 62 include flooring, cork boards, tiles, tatami mats, carpets, resin sheets, and rubber sheets. Examples of the outer shape of the floor finishing material 62 include tile shapes and long shapes. The thickness of the floor finishing material 62 is preferably, for example, 1.0 mm or more, more preferably 1.5 mm or more, and even more preferably 2.0 mm or more. The thickness of the floor finishing material 62 is, for example, preferably 20 mm or less, more preferably 15 mm or less, and even more preferably 10 mm or less.

[0018] <Underfloor material 11> As shown in Figures 2 and 3, the underfloor material 11 includes a needle-punched nonwoven fabric layer 21, a first covering layer 31 covering the upper surface 21a of the needle-punched nonwoven fabric layer 21, and a second covering layer 41 covering the lower surface 21b of the needle-punched nonwoven fabric layer 21. The underfloor material 11 of this embodiment further includes an adhesive material layer 51. Hereinafter, the upper surface and lower surface, such as the upper surface 21a and lower surface 21b of the needle-punched nonwoven fabric layer 21, refer to the surfaces that are in an up-down relationship when the underfloor material 11 is placed on the base 61. In addition, in the drawings, the thickness of some layers may be exaggerated to make each layer easier to understand.

[0019] (Needle-punched nonwoven fabric layer 21) The needle-punched nonwoven fabric layer 21 functions as a buffer layer for the underfloor material 11. Examples of fibers for the needle-punched nonwoven fabric layer 21 include polyester fibers, polyolefin fibers, polyamide fibers, polyvinyl alcohol fibers, and acrylic fibers. The basis weight of the needle-punched nonwoven fabric layer 21 is, for example, 60 g / m 2 More than 600g / m 2 The thickness of the needle-punched nonwoven fabric layer 21 is preferably within the range of, for example, 1 mm or more and 10 mm or less. The basis weight and thickness of the needle-punched nonwoven fabric layer 21 can be changed depending on the configuration of the base 61, for example.

[0020] When the base 61 on which the floor underlayment 11 is to be installed is a floor slab, the basis weight of the needle-punched nonwoven fabric layer 21 is, for example, 200 g / m 2 More than 600g / m 2 It is preferable that the thickness is within the following range: When the base 61 on which the underfloor material 11 is installed is a floor slab, the thickness of the needle-punched nonwoven fabric layer 21 is preferably within the range of 3 mm or more and 10 mm or less.

[0021] When the base 61 on which the floor underlayment 11 is installed includes a floor slab and a floor material placed on the floor slab, the basis weight of the needle-punched nonwoven fabric layer 21 is, for example, 60 g / m 2 More than 300g / m 2It is preferable that the thickness is within the following range: When the base 61 on which the underfloor material 11 is installed includes a floor slab and a floor material placed on the floor slab, the thickness of the needle-punched nonwoven fabric layer 21 is preferably within the range of 1 mm or more and 5 mm or less.

[0022] (First coating layer 31) The first covering layer 31 is disposed between the needle-punched nonwoven fabric layer 21 and the floor finishing material 62, thereby covering the upper surface 21a of the needle-punched nonwoven fabric layer 21. Examples of the first covering layer 31 include nonwoven fabric layers such as spunbonded nonwoven fabric layers, chemical-bonded nonwoven fabric layers, and spunlace nonwoven fabric layers, as well as glass cloth layers, paper layers, and resin film layers. Examples of fibers used in the nonwoven fabric layers include polyester fibers, polyolefin fibers, polyamide fibers, polyvinyl alcohol fibers, and acrylic fibers. The first covering layer 31 may have a single-layer structure or a multi-layer structure. The first covering layer 31 may have a multi-layer structure including layers made of the same material, or a multi-layer structure including layers made of different materials.

[0023] The first covering layer 31 preferably includes a spunbonded nonwoven fabric layer. The spunbonded nonwoven fabric has heat-sealed portions where fibers are heat-sealed. The thickness of the first coating layer 31 is, for example, preferably 0.01 mm or more, more preferably 0.03 mm or more, and even more preferably 0.05 mm or more. The thickness of the first coating layer 31 is, for example, preferably 1 mm or less, more preferably 0.8 mm or less, and even more preferably 0.5 mm or less. The basis weight of the first coating layer 31 is, for example, 20 g / m 2 More than 100g / m 2 It is preferable that the content is within the following range.

[0024] (Second coating layer 41) As shown in FIG. 2 , the upper surface 41a of the second covering layer 41 is fixed to the needle-punched nonwoven fabric layer 21. The lower surface 41b of the second covering layer 41 forms an adhesive surface 11a that adheres the underfloor material 11 to the base 61. Examples of the second covering layer 41 include nonwoven fabric layers such as spunbonded nonwoven fabric layers and chemically bonded nonwoven fabric layers, glass cloth layers, and paper layers. Examples of fibers used in the nonwoven fabric layers include polyester fibers, polyolefin fibers, polyamide fibers, polyvinyl alcohol fibers, and acrylic fibers. The second covering layer 41 may have a single-layer structure or a multilayer structure. The second covering layer 41 may have a multilayer structure including layers made of the same material or layers made of different materials. The second covering layer 41 has a structure with lower liquid permeability than the needle-punched nonwoven fabric layer 21.

[0025] The second covering layer 41 can be fixed to the needle-punched nonwoven fabric layer 21 by at least one of chemical and physical means. Examples of chemical means include adhesion using an adhesive, welding that utilizes melting of the second covering layer 41, and fixing using adhesive tape. Examples of physical means include fixing using a stapler or the like. When using an adhesive, it is preferable to use a hot-melt adhesive from the viewpoint of preventing penetration of the adhesive into the needle-punched nonwoven fabric layer 21.

[0026] From the viewpoint of simplifying the structure for fixing second coating layer 41 to needle-punched nonwoven fabric layer 21, it is preferable that second coating layer 41 include a melt layer formed using the needle-punched nonwoven fabric used to form needle-punched nonwoven fabric layer 21. The melt layer can be formed by melting the fibers of the needle-punched nonwoven fabric along one of the two main surfaces of the needle-punched nonwoven fabric used to form needle-punched nonwoven fabric layer 21. The melt layer has a heat-fused portion where the fibers of the needle-punched nonwoven fabric are heat-fused. Such a melt layer has a structure with lower liquid permeability than needle-punched nonwoven fabric layer 21.

[0027] The thickness of the second coating layer 41 is, for example, preferably 0.005 mm or more, more preferably 0.01 mm or more, and even more preferably 0.03 mm or more. The thickness of the second coating layer 41 is, for example, preferably 1 mm or less, more preferably 0.8 mm or less, and even more preferably 0.5 mm or less. The surface density (basis weight) of the second coating layer 41 is, for example, 10 g / m 2 More than 100g / m 2 It is preferable that the content is within the following range.

[0028] (Adhesive material layer 51) The adhesive material layer 51 bonds the needle-punched nonwoven fabric layer 21 and the first covering layer 31. The adhesive material layer 51 can be made of, for example, a hot-melt adhesive, a room-temperature curing adhesive, or an adhesive tape. The adhesive material layer 51 is preferably made of a hot-melt adhesive. A hot-melt adhesive is an adhesive that contains a thermoplastic resin as its main component and is solid at room temperature. A hot-melt adhesive is applied in a melted state by heating, and then solidifies relatively quickly by cooling.

[0029] Examples of thermoplastic resins contained in hot melt adhesives include polyolefin resins, polyester resins, polyamide resins, etc. Examples of polyolefin resins include polyethylene resins, polypropylene resins, etc.

[0030] The hot melt adhesive may contain one type of thermoplastic resin or two or more types of thermoplastic resins. From the viewpoint of further increasing the flexibility of the adhesive material layer 51, the hot melt adhesive preferably contains a polyethylene-based resin, and more preferably contains a low-density polyethylene-based resin.

[0031] The surface density of the adhesive material layer 51 is 5 g / m 2 More than 350g / m 2 The surface density of the adhesive material layer 51 is preferably within the range of 5 g / m 2In the above cases, for example, increasing the strength of the adhesive material layer 51 makes it possible to further improve the load distribution performance of the adhesive material layer 51. Here, when forming the adhesive material layer 51 by hardening the adhesive between the needle-punched nonwoven fabric layer 21 and the first covering layer 31, the adhesive may shrink. The degree of adhesive shrinkage tends to increase as the areal density of the adhesive, i.e., the areal density of the adhesive material layer 51, increases. Excessive shrinkage of the adhesive causes warpage in the laminate in which the needle-punched nonwoven fabric layer 21 and the first covering layer 31 are bonded by the adhesive material layer 51, i.e., warpage of the underfloor material 11. Such warpage of the underfloor material 11 occurs when the areal density of the adhesive material layer 51 is increased to 350 g / m or less. 2 This can be reduced by doing the following:

[0032] <Method of manufacturing the underfloor material 11> An example of a method for manufacturing the underfloor material 11 will be described with reference to FIG. To manufacture the underfloor material 11, first, a first laminated sheet S1 is prepared, which is a laminate of a first covering layer sheet S1a and an adhesive base layer S1b that will become the first covering layer 31. The adhesive base layer S1b can be formed by applying a hot melt adhesive onto the first covering layer sheet S1a using an extrusion lamination method.

[0033] Next, a needle-punched nonwoven fabric NW is prepared to form the needle-punched nonwoven fabric layer 21. Subsequently, the needle-punched nonwoven fabric NW is adhered to the first covering layer sheet S1a of the first laminate sheet S1 to obtain a second laminate sheet S2. The second laminate sheet S2 is obtained by heat-treating the adhesive base material layer S1b of the first laminate sheet S1 while the needle-punched nonwoven fabric NW and the first laminate sheet S1 are superimposed on each other.

[0034] To heat the adhesive base material layer S1b, for example, a first roll R1, which is a heating roll, can be used. More specifically, the first covering layer sheet S1a, adhesive base material layer S1b, and needle-punched nonwoven fabric NW are arranged in this order from the outer circumferential surface of the first roll R1. At this time, the adhesive base material layer S1b is melted by being heated by the first roll R1 from the side of the first covering layer sheet S1a. The melted adhesive base material layer S1b is cooled after passing through the first roll R1. This results in a second laminate sheet S2 having an adhesive material layer 51 in which the adhesive base material layer S1b is solidified. The second laminate sheet S2 has a structure in which the first covering layer 31 and the needle-punched nonwoven fabric NW are bonded by the adhesive material layer 51.

[0035] The first roll R1 is configured to be rotatable in the direction indicated by the arrow in Fig. 4. A hot melt adhesive may be further applied to the adhesive base material layer S1b of the first laminate sheet S1 before it is supplied to the first roll R1. Also, a hot melt adhesive may be applied to the main surface of the needle-punched nonwoven fabric NW that will be bonded to the first laminate sheet S1 before it is supplied to the first roll R1.

[0036] Next, the fibers of the needle-punched nonwoven fabric NW in the second laminate sheet S2 are melted along the main surface opposite the first coating layer 31, thereby forming a molten layer, i.e., the second coating layer 41. The molten layer can be formed by passing the second laminate sheet S2 between the second roll R2 and the third roll R3. The second roll R2 is a heating roll for heating the needle-punched nonwoven fabric NW of the second laminate sheet S2. The second laminate sheet S2 is placed so that the main surface of the needle-punched nonwoven fabric NW is in contact with the second roll R2.

[0037] At this time, by sandwiching the second laminate sheet S2 between the second roll R2 and the third roll R3 arranged opposite the second roll R2, it is possible to easily maintain contact between the main surface of the needle-punched nonwoven fabric NW and the outer peripheral surface of the second roll R2. The distance between the second roll R2 and the third roll R3 is preferably, for example, in the range of 1 mm to 8 mm. The second roll R2 and the third roll R3 are configured to be rotatable in the directions indicated by the arrows in FIG. 4.

[0038] Next, the needle-punched nonwoven fabric NW will be described. The needle-punched nonwoven fabric NW contains thermoplastic fibers. The needle-punched nonwoven fabric NW preferably contains, for example, first fibers having a first melting point and second fibers having a second melting point lower than the first melting point. For example, polyester-based fibers having the first melting point can be used as the first fibers. For example, polyester-based fibers having the second melting point can be used as the second fibers.

[0039] By heating this needle-punched nonwoven fabric NW to a temperature equal to or higher than the second melting point of the second fibers, the second fibers can be thermally fused together, or the melted second fibers can bond the first fibers together. The heating temperature of the needle-punched nonwoven fabric NW, i.e., the surface temperature of the second roll R2, is equal to or higher than the second melting point of the second fibers, and is preferably equal to or higher than T2 + 5 [°C], where T2 is the second melting point of the second fibers [°C].

[0040] The heating temperature of the needle-punched nonwoven fabric NW, i.e., the surface temperature of the second roll R2, is preferably below the first melting point of the first fibers. If the first melting point of the first fibers is T1 [°C], then the heating temperature is preferably T1-5 [°C] or less. In this case, for example, it is possible to suppress shrinkage of the needle-punched nonwoven fabric NW when the needle-punched nonwoven fabric NW is heated. The difference between the first melting point T1 [°C] and the second melting point T2 [°C], T1-T2 [°C], is preferably 10 [°C] or more. In this case, the second coating layer 41 can be easily formed by melting the second fibers.

[0041] The first melting point T1 of the first fibers is preferably 200°C or higher, for example, from the viewpoint of shape retention. In this case, for example, the heat resistance of the needle-punched nonwoven fabric layer 21 can be easily ensured in the production of the underfloor material 11. The first melting point T1 is preferably 300°C or lower, for example. The second melting point T2 of the second fibers is preferably 100°C or higher, for example, from the viewpoint of heat resistance.

[0042] The underfloor material 11 obtained as described above can be stored or transported, for example, in a rolled state. The long underfloor material 11 can be used by cutting it to the size appropriate for the installation location. The method for manufacturing the underfloor material 11 is not limited to a continuous method for manufacturing a long product, but may also be a discontinuous method for manufacturing individual underfloor materials 11 of predetermined sizes.

[0043] <Floor structure formation method> Next, a method for forming a floor structure using the above-mentioned underfloor material 11 will be described. 1 and 3, to form a floor structure, first, an adhesive 63 for underfloor material is applied to a base 61, and then the underfloor material 11 is placed so that the adhesive surface 11a of the underfloor material 11 overlaps the adhesive 63 for underfloor material. As the adhesive 63 for underfloor material, for example, a resin-based adhesive such as a urethane-based resin, an acrylic-based resin, or a modified silicone resin, or a rubber-based adhesive can be used.

[0044] At this time, the second covering layer 41 is fixed to the underside 21b of the needle-punched nonwoven fabric layer 21 in the underfloor material 11. In the underfloor material 11, the adhesive surface 11a that is adhered to the base 61 is formed by the underside 41b of the second covering layer 41. Therefore, the second covering layer 41 can prevent the underfloor material adhesive 63 from penetrating into the needle-punched nonwoven fabric layer 21.

[0045] Next, a floor finishing adhesive 64 is applied to the upper surface of the first covering layer 31, and then the floor finishing material 62 is placed on the floor finishing adhesive 64. As the floor finishing adhesive 64, for example, a resin adhesive such as a urethane resin, an epoxy resin, or an acrylic resin can be used. As the floor finishing adhesive 64, a peel-up bond that has adhesiveness and allows the floor finishing material 62 to be easily peeled off can also be used.

[0046] Next, a pressure roller is used to press the upper surface of the floor finishing material 62, thereby obtaining a floor structure having a laminated structure of the underfloor material 11 and the floor finishing material 62 on the base 61. In the floor structure obtained in this manner, the underfloor material 11 is adhered to the base 61, so that, for example, displacement of the underfloor material 11 can be suppressed.

[0047] In the case where an impact is applied to the floor structure due to walking on the floor finishing material 62, the needle-punched nonwoven fabric layer 21 of the underfloor material 11 acts as a buffer layer, thereby suppressing the transmission of sound and vibration to the surrounding area of the floor structure.

[0048] <Actions and Effects of This Embodiment> Next, the operation and effects of this embodiment will be described. (1) The underfloor material 11 is disposed between a base 61 and a floor finishing material 62. The underfloor material 11 has an adhesive surface 11a that is adhered to the base 61. The underfloor material 11 includes a needle-punched nonwoven fabric layer 21, a first covering layer 31, and a second covering layer 41. The first covering layer 31 covers the upper surface 21a of the needle-punched nonwoven fabric layer 21. The second covering layer 41 covers the lower surface 21b of the needle-punched nonwoven fabric layer 21. The second covering layer 41 is fixed to the needle-punched nonwoven fabric layer 21. The adhesive surface 11a that is adhered to the base 61 is formed by the lower surface 41b of the second covering layer 41.

[0049] With this configuration, needle-punched nonwoven fabric layer 21 has a structure in which fibers are entangled, making it a buffer layer that is more likely to exhibit its buffering function and maintain its shape. Furthermore, when underfloor material 11 is bonded to base 61, second coating layer 41 covering undersurface 21b of needle-punched nonwoven fabric layer 21 prevents underfloor material adhesive 63 from penetrating into needle-punched nonwoven fabric layer 21. This prevents the buffering performance of needle-punched nonwoven fabric layer 21 from being reduced by underfloor material adhesive 63. Furthermore, since upper surface 21a of needle-punched nonwoven fabric layer 21 is covered by first coating layer 31, the load distributed by first coating layer 31 can be transmitted to needle-punched nonwoven fabric layer 21. This reduces the concentration of load on needle-punched nonwoven fabric layer 21, thereby improving the durability of needle-punched nonwoven fabric layer 21 and allowing it to continue to exhibit its buffering performance. Therefore, the buffering function can be optimally exhibited.

[0050] (2) The first covering layer 31 of the underfloor material 11 preferably includes a spunbond nonwoven fabric layer. In this case, the spunbond nonwoven fabric layer has heat-fused portions where the fibers are heat-fused, thereby improving the shape stability of the first covering layer 31. This allows the load applied from the first covering layer 31 to the needle-punched nonwoven fabric layer 21 to be more dispersed. This makes it possible to improve, for example, cushioning performance and shape retention function.

[0051] (3) The underfloor material 11 further includes an adhesive material layer 51 that bonds the needle-punched nonwoven fabric layer 21 and the first covering layer 31. In this case, loads and impacts from the first covering layer 31 are more easily transmitted to the needle-punched nonwoven fabric layer 21 via the adhesive material layer 51. This allows the needle-punched nonwoven fabric layer 21 to more easily exhibit its cushioning properties.

[0052] (4) The surface density of the adhesive material layer 51 of the underfloor material 11 is 5 g / m 2 More than 350g / m 2 It is preferable that the thickness is within the following range: In this case, for example, it is possible to exhibit the load distribution performance of the adhesive material layer 51 and to suppress warpage deformation of the underfloor material 11.

[0053] (5) The adhesive material layer 51 is preferably made of a hot-melt adhesive. In this case, the hot-melt adhesive can be solidified relatively quickly by cooling. Such a hot-melt adhesive tends to solidify near the upper surface 21a of the needle-punched nonwoven fabric layer 21 while remaining on the upper surface 21a of the needle-punched nonwoven fabric layer 21. This prevents the adhesive forming the adhesive material layer 51 from penetrating into the needle-punched nonwoven fabric layer 21. This allows the buffering function based on the structure of the needle-punched nonwoven fabric layer 21 to be fully exhibited.

[0054] (6) The hot-melt adhesive constituting the adhesive material layer 51 preferably contains a polyethylene resin. In this case, the flexibility of the adhesive material layer 51 can be increased. This allows the adhesive material layer 51 to easily follow the deformation of, for example, the needle-punched nonwoven fabric layer 21 and the first covering layer 31. This makes it possible to suppress, for example, peeling between the needle-punched nonwoven fabric layer 21 and the first covering layer 31. This therefore makes it possible, for example, to increase durability so that the cushioning performance can be continuously exerted.

[0055] (7) The second covering layer 41 preferably includes a molten layer formed by melting the fibers of the needle-punched nonwoven fabric NW along one of the two main surfaces of the needle-punched nonwoven fabric NW used to form the needle-punched nonwoven fabric layer 21. In this case, the second covering layer 41 can be fixed to the needle-punched nonwoven fabric layer 21 without the need for a separate fixing member for fixing the second covering layer 41 to the needle-punched nonwoven fabric layer 21. This allows the structure for fixing the second covering layer 41 to the needle-punched nonwoven fabric layer 21 to be simple.

[0056] <Example of change> The above embodiment may be modified as follows: The above embodiment and the following modifications may be combined with each other within the scope of technical compatibility.

[0057] The adhesive material layer 51 may be omitted. That is, the first cover layer 31 does not have to be fixed to the needle-punched nonwoven fabric layer 21. The means for fixing the first covering layer 31 to the needle-punched nonwoven fabric layer 21 is not limited to the chemical means using the adhesive material layer 51 as in the above embodiment, but may be a physical means such as a stapler. Such physical means and chemical means may also be combined.

[0058] The first covering layer 31 may have a laminated structure in which a spunbond nonwoven fabric layer and a nonwoven fabric layer other than the spunbond nonwoven fabric layer are laminated together. The multiple layers constituting the first covering layer 31 may or may not be bonded to each other.

[0059] The second coating layer 41 may be formed from a laminated structure of a molten layer formed by melting the fibers of the needle-punched nonwoven fabric NW and a layer other than the molten layer. The multiple layers constituting the second coating layer 41 are bonded to each other to form an integrated second coating layer 41 fixed to the needle-punched nonwoven fabric layer 21.

[0060] In the manufacturing method of the above-described underfloor material 11, the first covering layer sheet S1a of the first laminate sheet S1 and the needle-punched nonwoven fabric NW are bonded together, and then a melting layer (second covering layer 41) is formed on the needle-punched nonwoven fabric NW. However, this method is not limited to this, and it is also possible to form a melting layer (second covering layer 41) on the needle-punched nonwoven fabric NW, and then bond the needle-punched nonwoven fabric with the melting layer to the first covering layer sheet S1a of the first laminate sheet S1.

[0061] <Additional Notes> The technical concepts that can be understood from the above-described embodiments and modifications will be described below. A method for manufacturing an underfloor material that is positioned between a base and a floor finishing material and has an adhesive surface that is adhered to the base, the underfloor material comprising a needle-punched nonwoven fabric layer, a first coating layer that covers the upper surface of the needle-punched nonwoven fabric layer, and a second coating layer that covers the lower surface of the needle-punched nonwoven fabric layer, the second coating layer being fixed to the needle-punched nonwoven fabric layer, and the adhesive surface being formed by the lower surface of the second coating layer, the manufacturing method comprising the steps of: preparing a needle-punched nonwoven fabric for forming the needle-punched nonwoven fabric layer; and forming a molten layer by melting fibers of the needle-punched nonwoven fabric along one of both main surfaces of the needle-punched nonwoven fabric, the second coating layer including the molten layer. [Explanation of symbols]

[0062] 11...Floor underlayment 11a...Adhesive surface 21...Needle-punched nonwoven fabric layer 21a, 41a...Top surface 21b, 41b…bottom surface 31...First coating layer 41…Second coating layer 51…Adhesive material layer 61...Foundation 62…Floor finishing material 63...Adhesive for floor underlayment 64...Floor finishing adhesive S1: First laminated sheet S1a...Sheet for first covering layer S1b…adhesive base material layer NW: Needle-punched nonwoven fabric S2: Second laminated sheet R1...1st roll R2...2nd roll R3...3rd roll

Claims

1. A floor underlayment material that is disposed between a base and a floor finishing material and has an adhesive surface that is adhered to the base, a needle-punched nonwoven fabric layer; a first covering layer covering the upper surface of the needle-punched nonwoven fabric layer; a second covering layer covering the lower surface of the needle-punched nonwoven fabric layer, the second covering layer is fixed to the needle-punched nonwoven fabric layer; The adhesive surface is formed by the underside of the second coating layer.

2. The floor underlayment according to claim 1 , wherein the first covering layer comprises a spunbond nonwoven fabric layer.

3. The floor underlayment according to claim 1 , further comprising an adhesive material layer that bonds the needle-punched nonwoven fabric layer and the first covering layer.

4. The surface density of the adhesive material layer is 5 g / m ２ Above, 350g / m ２ The floor underlayment material according to claim 3, wherein the thickness is within the following range.

5. The floor underlayment according to claim 3 , wherein the adhesive material layer is made of a hot melt adhesive.

6. The floor underlayment material according to claim 5 , wherein the hot melt adhesive contains a polyethylene resin.

7. The floor underlayment material described in claim 1, wherein the second coating layer includes a molten layer formed by melting the fibers of the needle-punched nonwoven fabric along one of the two main surfaces of the needle-punched nonwoven fabric used to form the needle-punched nonwoven fabric layer.

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