Detection device, detection method, program, substrate processing device, and article manufacturing method

Abstract

To provide a detection device that can prevent a reduction in throughput.SOLUTION: A detection device detects the position of a mark formed on a substrate held on a stage, and has an imaging unit including an image pick-up device that picks up an image of the mark, and a processing unit that detects the position of the mark on the basis of the image picked up by the imaging unit. The processing unit determines an imaging condition for a second mark at a position corresponding to the first mark on a second substrate, on the basis of a first image that is a picked-up image of a first mark on a first substrate when the moving speed of the first substrate held on the stage is a first speed and a second image that is a picked-up image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed, and detects the position of the second mark on the basis of an image of the second mark picked up according to the imaging condition.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a detection apparatus, a detection method, a program, a substrate processing apparatus, and a method for manufacturing an article. [Background technology]

[0002] In the manufacturing process of semiconductor devices, liquid crystal display devices, etc., substrates are sometimes positioned based on the detection results of a detection device that detects the positions of marks formed on the substrate. When the detection device detects the positions of marks on multiple substrates, the detection device may not be able to correctly detect the positions of the marks due to differences in the conditions (light reflectance, shape, etc.) of each substrate.

[0003] Patent Document 1 describes that after the detection device has moved the substrate to a position where the position of the mark can be detected and the vibration of the stage holding the substrate falls within an allowable range, preliminary imaging is started to determine imaging conditions for detecting the position of the mark, and then the mark position is detected using the imaging conditions determined based on the detection results of the preliminary imaging. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-15994 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when detecting a substrate that requires a long time to detect, such as a substrate with low reflectivity, the method described in Patent Document 1 takes a long time to capture a preliminary image, which may reduce throughput.

[0006] Therefore, an object of the present invention is to provide a detection device that can suppress a decrease in throughput. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, one aspect of the present invention provides a detection device that detects the position of a mark formed on a substrate held on a stage, and includes an imaging unit including an imaging element that images the mark, and a processing unit that detects the position of the mark based on the image captured by the imaging unit, wherein the processing unit determines imaging conditions for a second mark located at a position corresponding to the first mark on a second substrate based on a first image captured of a first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed, and a second image captured of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed, and detects the position of the second mark based on the image captured of the second mark under the imaging conditions.

[0008] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a detection device that can suppress a decrease in throughput. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] 10 is a flowchart showing the steps from when a substrate is held on a stage to when it is exposed. [Figure 3] 10 is an example of an image of a mark. [Figure 4] 10 is a diagram showing the light intensity of an image of a mark captured by an imaging unit. FIG. [Figure 5] FIG. 10 is a diagram showing the settling time and light adjustment time of a conventional stage. [Figure 6]FIG. 4 is a diagram showing the settling time and light adjustment time of the stage in the first embodiment. [Figure 7] FIG. 4 is a flowchart showing how a detection unit detects the position of a mark in the first embodiment. [Figure 8] 4 is a schematic diagram showing the position of a mark when an imaging unit captures an image of the mark. FIG. [Figure 9] FIG. 10 is a flowchart showing a method for manufacturing an article according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and the embodiments may be combined in any manner. Furthermore, in the drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0012] In addition, in this specification and drawings, directions are basically shown using an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, with each axis being orthogonal to each other. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0013] Specific configurations of each embodiment will be described below.

[0014] First Embodiment 1 is a schematic diagram showing the configuration of a substrate processing apparatus 100 according to this embodiment. In this embodiment, the substrate processing apparatus 100 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system using a step-and-repeat method or a step-and-scan method.

[0015] The substrate processing apparatus 100 has an illumination optical system 3 that irradiates light, a projection optical system 4, a reticle stage (not shown) that holds the reticle 1, and a stage 6 that is movable in the X and Y directions while holding the substrate 2. The stage 6 holds the substrate 2 by vacuum suction, electrostatic suction, or the like.

[0016] The reticle 1 is, for example, an original plate in which a pattern to be transferred (e.g., a circuit pattern) is formed on the surface of quartz glass using chromium. The substrate 2 is, for example, single-crystal silicon, and when the substrate processing apparatus 100 is an exposure apparatus, the substrate 2 transported to the substrate processing apparatus 100 has a photosensitive material (resist) applied to its surface.

[0017] In the substrate processing apparatus 100, exposure light from a light source (not shown) passes through an illumination optical system 3 and illuminates a reticle 1 held on a reticle stage. The light that passes through the reticle 1 passes through a projection optical system 4 and is irradiated onto a substrate 2. At this time, light from a pattern formed on the reticle 1 forms an image on the surface of the substrate 2, and the substrate 2 (photosensitive material) is exposed to the pattern image. The substrate processing apparatus 100 exposes a shot area on the substrate 2 in this manner, and performs similar exposure on each of the multiple shot areas.

[0018] Furthermore, the substrate processing apparatus 100 has a main control unit 7 that controls each unit in the substrate processing apparatus 100, a stage control unit 8 that controls the driving of the stage 6, a detection unit (detection device) 11, a measurement unit 6a, and a reflector 6b. The detection unit 11 detects a mark 10 formed on the substrate 2 for aligning the substrate 2.

[0019] The position of the stage 6 is measured by the measurement unit 6a. The measurement unit 6a includes, for example, an interferometer, and irradiates light onto a reflector 6b provided on the stage 6, and determines the displacement of the stage 6 from a reference position based on the light reflected by the reflector 6b. This allows the measurement unit 6a to measure the position of the stage 6. The stage control unit 8 drives the stage 6 based on the position of the stage 6 measured by the measurement unit 6a and the position of the mark 10 detected by the detection unit 11, and controls the position of the stage 6.

[0020] The detection unit 11 includes a light source 12, an ND filter 13, a beam splitter 14, an imaging unit 15 including an image sensor, a detection unit control unit (processing unit, adjustment unit) 16, and a memory unit 17. The detection unit 11 includes, for example, an off-axis alignment scope. The light source 12 is, for example, a halogen lamp or an LED. The ND filter 13 includes multiple filters with different transmittances and is capable of adjusting the amount of light passing through. The beam splitter 14 may be, for example, a half mirror or a polarizing beam splitter. The imaging unit 15 is, for example, an image sensor such as a CCD sensor or a CMOS sensor. The detection unit control unit 16 controls each unit included in the detection unit 11. The detection unit control unit 16 is a processing unit that detects the position of the mark 10 based on the image captured by the imaging unit 15.

[0021] The amount of light from the light source 12 is adjusted by an ND filter 13, and the light is guided to a beam splitter 14 by an optical system (not shown). The light reflected by the beam splitter 14 illuminates the mark 10 via a projection optical system (not shown), and is reflected by the mark 10 (substrate 2). The reflected light passes through the beam splitter 14 and is imaged by an imaging unit 15. A detection unit control unit 16 detects the position of the mark 10 based on the image obtained by the imaging unit 15 imaging the mark 10.

[0022] The detection unit 11 has an optical system (not shown) between the beam splitter 14 and the imaging unit 15, and this optical system can capture images of the mark 10 at a plurality of different magnifications (low and high magnifications). For example, when capturing an image of the mark 10 at a high magnification, a predetermined optical element is inserted into the optical path. When capturing an image of the mark 10 at a low magnification, the predetermined optical element is removed from the optical path.

[0023] Although only one mark 10 is shown in FIG. 1, multiple marks 10 are formed on the substrate 2. The marks 10 include pre-alignment marks for pre-alignment measurement that detect the amount of misalignment across the entire substrate 2, and fine alignment marks for global alignment measurement that determine the positions (arrangement information) of shot areas on the substrate 2 with high precision. The amount of misalignment across the entire substrate 2 in pre-alignment measurement includes, for example, shift, magnification, and rotation components. Global alignment measurement statistically processes the positions of the marks using the detection results obtained by detecting fine alignment marks formed in sample shot areas with the detection unit 11. Global alignment measurement is a measurement method that determines the positions (arrangement information) of multiple shot areas on the substrate 2 with high precision through this statistical processing. The detection unit 11 detects the mark 10 at low magnification during pre-alignment measurement, and measures the mark 10 at high magnification during global alignment measurement.

[0024] FIG. 2 is a flowchart showing the steps from when the substrate 2 is held on the stage 6 to when it is exposed. First, the substrate 2 is held on the stage 6 (S101). Next, the detection unit 11 detects pre-alignment marks at low magnification and performs pre-alignment measurement (S102). Next, the detection unit 11 performs global alignment measurement at high magnification based on the pre-alignment measurement results (S103). Specifically, in step S103, the target position of the stage 6 for performing global alignment measurement is corrected based on the amount of deviation of the substrate 2 detected in the pre-alignment measurement, and global alignment measurement is performed. Then, based on the positions (arrangement information) of the multiple shot areas on the substrate 2 determined by the global alignment measurement, the substrate 2 is aligned with each shot area, and exposure processing is performed (S104).

[0025] When the detection unit 11 detects the position of the mark 10 on multiple substrates 2, the detection unit 11 may not be able to correctly detect the position of the mark 10 due to differences in the state (light reflectivity, shape) of each substrate 2. The reflectivity varies depending on factors such as the processing in the previous process, the shape of the underlying layer, the material of the substrate 2 or photosensitive material, and the presence and material of an anti-reflection film. For example, if the substrate 2 has high reflectivity, the imaging unit 15 receives a large amount of light, which may exceed the limit of the amount of light (light intensity) at which the detection unit 11 can correctly detect the position of the mark 10, and the detection unit 11 may not be able to correctly detect the position of the mark 10. On the other hand, if the substrate 2 has low reflectivity, the imaging unit 15 receives a small amount of light, which is less than the amount of light (light intensity) necessary to detect the position of the mark 10, and the detection unit 11 may not be able to correctly detect the position of the mark 10. Alternatively, if the substrate 2 has low reflectivity, the imaging unit 15 needs to store charge for a longer time, which may result in a longer detection time for the mark 10.

[0026] Therefore, when the detection unit 11 performs pre-alignment measurement (S102) and global alignment measurement (S103), a dimming process is performed on the detection unit 11 before detecting the mark 10 (before the imaging unit 15 captures an image for detecting the mark 10). This dimming process adjusts the amount of light received by the imaging unit 15, which changes due to the state (light reflectance, shape) of the substrate 2, to an appropriate amount of light (light intensity). Note that, although the state of marks 10 on the same substrate 2 at each position on the substrate 2 is similar, the amount of light received by the imaging unit 15 may change due to individual differences between the marks 10 (type, shape, position, etc.). Therefore, when the detection unit 11 detects multiple marks 10 (when the imaging unit 15 captures an image of multiple marks 10), a dimming process is performed before detecting each mark 10.

[0027] The light adjustment process is performed by the detection unit control unit 16, which controls at least one of the adjustment of the intensity of light emitted from the light source 12, the adjustment of the transmittance of the ND filter 13, and the adjustment of the charge accumulation time of the imaging unit 15. This control adjusts the amount of light received by the imaging unit 15 when the imaging unit 15 images the mark 10. The adjustment of the intensity of light emitted from the light source 12 is performed, for example, by adjusting the power supplied to the light source 12.

[0028] When the amount of light received by the imaging unit 15 is to be reduced, adjustments are made such as weakening the intensity of light emitted from the light source 12, lowering the transmittance of the ND filter 13, and shortening the charge accumulation time of the imaging unit 15. When the amount of light received by the imaging unit 15 is to be increased, adjustments are made such as strengthening the intensity of light emitted from the light source 12, increasing the transmittance of the ND filter 13, and lengthening the charge accumulation time of the imaging unit 15.

[0029] Conventionally, the light adjustment process of the detection unit 11 has started after the substrate 2 has been moved to a position where the imaging unit 15 can image the mark 10 and when the vibration of the stage 6 has fallen within an allowable range. The light adjustment process includes pre-imaging to determine the imaging conditions for detecting the position of the mark 10, and light adjustment is performed based on the detection results of the pre-imaging. Then, after the light adjustment process is completed and the stage 6 has settled, imaging (main imaging) of the position of the mark 10 for pre-alignment measurement or global alignment measurement is performed. Conventionally, the pre-imaging of the mark 10 is performed when the stage 6 is not moving because the detection results of the detection unit 11 differ when the mark 10 is imaged while the stage 6 is moving and when the mark 10 is imaged when the stage 6 is not moving.

[0030] FIG. 3 shows examples of images of the mark 10. FIG. 3(a) is an example of an image of the mark 10 captured while the stage 6 is moving, and FIG. 3(b) is an example of an image of the mark 10 captured while the stage 6 is not moving. In FIG. 3(a), the mark 10 is captured while the stage 6 is moving, so the mark 10 is stretched out compared to its original shape. On the other hand, in FIG. 3(b), the mark 10 is captured while the stage 6 is not moving, so the mark 10 is captured in its original shape.

[0031] FIG. 4 is a histogram of light intensity, with the horizontal axis representing light intensity, showing the light intensity of an image captured by the imaging unit 15 of the mark 10. This figure also shows the light intensity received by the imaging unit 15 when the imaging unit 15 captures the mark 10. FIG. 4(a) is an example of the light intensity when the imaging unit 15 captures the mark 10 while the stage 6 is moving, showing the light intensity of the image in FIG. 3(a). FIG. 4(b) is an example of the light intensity when the imaging unit 15 captures the mark 10 while the stage 6 is not moving, showing the light intensity of the image in FIG. 3(b). As shown in FIG. 4(a), when the imaging unit 15 captures the mark 10 while the stage 6 is moving, the maximum light intensity is 58. On the other hand, as shown in FIG. 4(b), when the imaging unit 15 captures the mark 10 while the stage 6 is not moving, the maximum light intensity is 112. In this way, the light intensity of the image captured by the imaging unit 15 (the intensity of light received by the imaging unit 15) differs between when the stage 6 is moving and when the stage 6 is not moving. This is because, when imaging is performed by the imaging unit 15 while the stage 6 is moving, a greater number of pixels among the multiple pixels included in the imaging element of the imaging unit 15 receive light than the number of pixels that receive light when the stage 6 has completed settling, resulting in the amount of light being dispersed.

[0032] The pre-imaging is performed to determine the imaging conditions for the actual imaging to detect the position of the mark 10, in other words, the amount of light to be adjusted. Therefore, the pre-imaging is preferably performed in a state where the influence of changes in the detection result (changes in light intensity) of the detection unit 11 due to the movement of the stage 6 is reduced. For example, the light intensity when the imaging unit 15 captures an image while the stage 6 is moving is weaker than the light intensity when the imaging unit 15 captures an image after settling is complete. Therefore, if light adjustment processing is performed based on an image of the mark 10 captured by the imaging unit 15 while the stage 6 is moving, the light intensity when the imaging unit 15 captures the image during the actual imaging will be higher. This causes the amount of light (light intensity) exceeding the limit value at which the detection unit 11 (detection unit control unit 16) can correctly detect the position of the mark 10 during the actual imaging. Therefore, the detection unit 11 (detection unit control unit 16) cannot correctly detect the position of the mark 10. For this reason, conventionally, the light adjustment processing, including the pre-imaging, was performed when the stage 6 was not moving, as was the case during the actual imaging.

[0033] However, with the conventional method, when detecting the mark 10 on the substrate 2 with low reflectivity, it is necessary to extend the accumulation time of the imaging unit 15, which means that it takes a long time to capture the image (detect the mark 10). This means that the pre-imaging takes a long time, which may reduce throughput.

[0034] 5 is a diagram showing the settling time and dimming time of a conventional stage. Conventionally, dimming processing including pre-imaging was started after the stage 6 had moved the substrate 2 and the vibration of the stage 6 had fallen within the allowable range, that is, while the stage 6 was settling. Then, after the dimming processing was completed and the stage 6 had settled, detection of the position of the mark 10 (main imaging) for pre-alignment measurement and global alignment measurement was performed.

[0035] FIG. 5(a) shows an example of a process in which the detection unit 11 detects a mark 10 (for example, a mark formed on a substrate 2 with high reflectivity) that requires a short time for pre-imaging (light control process). When detecting a mark 10 that requires a short time for pre-imaging, the light control process can be completed before the settling of the stage 6 is complete because the light control time including the pre-imaging is short. Then, once the settling of the stage 6 is complete, the position of the mark 10 can be detected immediately. Therefore, a situation does not occur in which the start of detection of the position of the mark 10 is delayed because the light control process is not completed, resulting in a decrease in throughput.

[0036] FIG. 5(b) shows an example of a process in which the detection unit 11 detects a mark 10 (e.g., a mark formed on a substrate 2 with low reflectivity) that requires a long time for pre-imaging (light control process). When detecting a mark 10 that requires a long time for pre-imaging, the light control process cannot be completed before the stage 6 is settling due to the long light control time, including pre-imaging. Therefore, even if the stage 6 has settling, detection of the position of the mark 10 cannot begin until the light control process is complete, resulting in reduced throughput. A case in which the pre-imaging (light control process) takes a long time like this occurs, for example, when the tolerance range for the preset light amount (light intensity) when the detection unit 11 detects the position of the mark 10 is narrow. Another case occurs when detecting the position of the mark 10 on a substrate with a lower reflectivity than a typical substrate, or when the reflectivity varies among multiple substrates.

[0037] Therefore, in this embodiment, the position of the mark 10 is detected (main imaging) under imaging conditions determined based on a first image of the mark 10 taken while the substrate 2 is moving due to the driving of the stage 6 and a second image of the mark 10 taken while the stage 6 is not being driven. That is, the detection unit control unit 16 (adjustment unit) starts a light control process (adjustment of imaging conditions) including pre-imaging while the stage 6 is being driven (moving). Then, the detection unit control unit 16 (adjustment unit) adjusts to the imaging conditions determined while the stage 6 is being driven.

[0038] Specifically, information is obtained regarding the change in light intensity of a second image obtained by capturing an image of the first mark on the first substrate while the stage 6 is not being driven, relative to the light intensity of a first image obtained by capturing an image of the first mark on the first substrate while the stage 6 is being driven. In this embodiment, an example is shown in which the information regarding the change is the rate of change in light intensity of the second image relative to the light intensity of the first image. Note that "driving the stage 6" means that control is being exercised to actively move the stage 6 using a motor or the like, and "not driving the stage 6" means that the motor is not being actively operated to move the stage 6.

[0039] The detection unit control unit 16 preferably obtains a first image and a second image for each of the multiple marks 10 formed on the substrate 2 by imaging the imaging unit 15. That is, the imaging unit 15 preferably images each of the multiple marks 10 formed on the substrate 2 (first substrate) at two or more different speeds (for example, when the stage 6 is moving and when it is settling). Furthermore, it is preferable to obtain information regarding the change (rate of change) for each mark 10 on the substrate 2. This is because the amount of light received (light intensity) by the imaging unit 15 varies due to individual differences in the marks 10 (such as type, shape, and position). Furthermore, the driving trajectory of the stage 6 when the imaging unit 15 moves the substrate 2 to a position where the mark 10 can be imaged differs for each mark 10, and the acceleration and speed conditions of the stage 6 when moving each mark 10 to a position where the mark 10 can be imaged differ from one another. Therefore, it is preferable to obtain a first image and a second image for each of the multiple marks 10, and it is preferable to obtain information regarding the change for each mark 10.

[0040] Based on the information (rate of change) related to the obtained change and a third image of the second mark on the second substrate, captured by the imaging unit 15 while the stage 6 is being driven (moved), the imaging conditions for performing the actual imaging of the second mark are determined. In this embodiment, the corresponding positions are defined as the first mark and the second mark corresponding to each other when the position of the first mark on the first substrate is the same as the position of the second mark on the second substrate. The imaging conditions include, for example, the intensity of light emitted from the light source 12, the transmittance of the ND filter 13, and the charge accumulation time of the imaging unit 15, and include at least one of these. In other words, the imaging conditions are the amount of light to be adjusted.

[0041] 6 is a diagram showing the settling time and dimming time of the stage 6 in this embodiment. As shown in FIG. 6, in this embodiment, the dimming process including pre-imaging is started when the stage 6 is being driven. This allows the dimming process to be completed by the time the stage 6 has settled, even when detecting a mark 10 that requires a long time for pre-imaging (dimming process) (a mark that requires a long accumulation time for the imaging unit 15), and thus reduces a decrease in throughput.

[0042] FIG. 7 is a flowchart showing how the detection unit 11 detects the position of the mark 10 in this embodiment. This flowchart is applicable to both pre-alignment measurement and global alignment measurement. It is preferable to apply the method of this embodiment to at least one of pre-alignment measurement (low-magnification detection) and global alignment measurement (high-magnification detection). First, the stage control unit 8 starts moving the stage 6 holding the substrate 2 to a position (target position) where the imaging unit 15 can image the position of the mark 10 (S201). This target position is the position of the stage 6 when the actual imaging (detection of the position of the mark 10) for pre-alignment measurement or global alignment measurement is performed on the mark 10. The target position is, for example, the position of the stage 6 when the mark 10 is located near the center of the imaging area of the imaging unit 15.

[0043] Next, the detection unit control unit 16 determines whether the memory unit 17 stores information about changes (rate of change) corresponding to the substrate 2 on which the mark 10 is to be detected or corresponding to the mark 10 to be detected (S202, determination step). Here, the information about changes corresponding to the substrate 2 on which the mark 10 is to be detected is information about changes previously obtained for a substrate in the same or similar state (light reflectance, shape, etc.) as the substrate 2. A substrate in the same or similar state as the substrate 2 is, for example, a substrate from the same lot as the substrate 2, a substrate made of the same or similar material as the substrate 2, a substrate that has undergone the same or similar pre-processing step as the substrate 2, or a substrate having an underlayer that is the same or similar to the substrate 2. Alternatively, it may be a substrate having an anti-reflection film that is the same or similar to the substrate 2. If information about changes has been calculated and stored in the past for the mark 10 on a substrate that is the same or similar to the substrate 2, the information about changes can be used to detect the mark 10 on the substrate 2.

[0044] If the detection unit control unit 16 determines in step S202 that the memory unit 17 does not store information regarding the change, the process proceeds to step S203. When the stage 6 is moving (moving) to the target position and the stage 6 reaches a predetermined position, the detection unit control unit 16 controls the imaging unit 15 to perform a preliminary image capture (first detection step) (S203). The image captured in the first detection step is the first image. Here, whether or not the predetermined position has been reached can be determined based on the measurement result of the measurement unit 6a. The predetermined position is, for example, a position that is a predetermined distance away from the target position set by the user and where the mark 10 is within the imaging area of the imaging unit 15.

[0045] 8 is a schematic diagram showing the position of the mark 10 when the imaging unit 15 captures an image of the mark 10. The first detection step is performed when the mark 10 is at a position 51 that is a predetermined distance 53 away from a target position 52 and within an imaging area 50 of the imaging unit 15.

[0046] Next, the detection unit control unit 16 controls the stage 6 to capture an image of the mark 10 (second detection step) when the stage 6 has settled at the target position (target position 52 in FIG. 8) (S204). The image captured in the second detection step is the second image. Whether the stage 6 is at the target position and whether the stage 6 has settled can be determined based on the measurement results of the measurement unit 6a. Here, "the stage 6 has settled" means that the stage 6 is vibrating within a set allowable range or is not vibrating.

[0047] Next, the detection unit control unit 16 determines whether the light intensity detected in the second detection step (light intensity of the second image) is within a preset intensity tolerance range (S205). The preset intensity tolerance range is, for example, a range of light intensity values preset by the user, which is a range of light intensity values within which the detection unit 11 can correctly detect the position of the mark 10. The light intensity value used for this determination is, for example, the top 1% of the detected light intensities. The highest value may be an abnormal value (outlier), and using this abnormal value may result in an incorrect determination. Therefore, it is preferable to use the top 1% value. Alternatively, the light intensity value used for the determination may be the average value from the highest value to the top 1% of the detected light intensities, or the highest value among the detected light intensities excluding abnormal values. Although the present embodiment has been described using the top 1% as a reference, the present invention is not limited to this example.

[0048] If it is determined in step S205 that the intensity of light detected in the second detection process is not within a preset tolerance range of intensity, the imaging conditions for detecting the position of the mark 10 are adjusted (S206, adjustment process). Specifically, at least one of the intensity of light emitted from the light source 12, the transmittance of the ND filter 13, and the charge accumulation time of the imaging unit 15 is adjusted.

[0049] After performing step S206, the detection unit control unit 16 converts the light intensity value obtained from the first image to a value that would be obtained if detected under the adjusted imaging conditions, and corrects the light intensity value of the first image, which is the detection result of the first detection process (S207). This correction may be performed based on, for example, a table or graph showing the relationship between imaging conditions such as the intensity of light emitted from the light source 12, the transmittance of the ND filter 13, and the charge accumulation time of the imaging unit 15 and the light intensity, or the correction value may be calculated using an equation. Then, the second detection process of step S204 is performed again under the adjusted imaging conditions.

[0050] If it is determined in step S205 that the light intensity detected in the second detection process is within a preset tolerance range of intensity, the process proceeds to step S208. The detection unit control unit 16 obtains information related to the change from the light intensity of the first image captured in the first detection process and the light intensity of the second image captured in the second detection process (S208, calculation process). The light intensity of the first image used in the calculation process is the corrected value if corrected in step S207, and the light intensity of the second image is the image when the second detection process was last performed. If the information related to the change is a rate of change, the information can be obtained using, for example, equation (1), where IR is the rate of change, X1 is the light intensity of the first image, and X2 is the light intensity of the second image. IR=X2 / X1 Equation (1)

[0051] The light intensity value used to obtain information about the change is, for example, the top 1% of the detected light intensities. Alternatively, the light intensity value used to obtain information about the change may be the average value of the detected light intensities ranging from the highest to the top 1%, or the highest value among the detected light intensities excluding abnormal values. In this embodiment, an example is given in which the top 1% is used as the reference, but the present invention is not limited to this example. This information about the change indicates the change (difference) in light intensity between when the imaging unit 15 captures an image while the stage 6 is moving and when the imaging unit 15 captures an image while the stage 6 has settled.

[0052] Next, the storage unit 17 stores the information about the obtained change and the adjusted imaging conditions (determined imaging conditions) in association with the information about the mark 10 (S209). In this manner, the information about the change is stored for each mark 10. Here, in the present embodiment, an example has been shown in which the imaging conditions and the information about the change are stored in association with each other. However, the first image and the second image may be stored in association with the imaging conditions. Alternatively, the light intensity of the first image and the light intensity of the second image may be stored in association with the imaging conditions. Note that the information about the mark 10 may include, for example, the position of the mark 10 on the substrate 2, the identification number of the mark 10, the type of the mark 10, etc. The imaging conditions may include, for example, at least one of the intensity of light emitted from the light source 12, the transmittance of the ND filter 13, and the charge accumulation time of the imaging unit 15.

[0053] Next, the detection unit control unit 16 detects (determines) the position of the mark 10 based on the image (second image) captured the last time the second detection step (S204) was performed (S210). In other words, the image captured the last time step S204 was performed is the main image captured when no information about the change has been stored. As described above, when the storage unit 17 does not store information about the change, information about the change is obtained based on the first image captured by capturing an image while the stage 6 was moving (first detection step) and the second image captured by main image capturing after the stage 6 has settled (second detection step).

[0054] If the detection unit control unit 16 determines in step S202 that the memory unit 17 stores information about the change, the process proceeds to step S211. When the stage 6 is moving (moving) to the target position and reaches a predetermined position, the detection unit control unit 16 controls the detection unit 11 to perform a preliminary image capture (third detection step) (S211). The image captured in the third detection step is a third image. The predetermined position is, for example, a position that is a predetermined distance away from the target position set by the user, where the mark 10 is within the imageable area 50 of the image capture unit 15, which is position 51 in FIG. 8.

[0055] Next, the detection unit control unit 16 estimates the light intensity from the light intensity of the third image captured in the third detection step, the information about the change that is associated with the information about the mark 10 and stored in the storage unit 17, and the imaging conditions (S212, estimation step). Specifically, this estimation step estimates the light intensity when the imaging unit 15 captures an image under the imaging conditions stored when the stage 6 has completed settling. In other words, it estimates the light intensity of a fourth image, which will be described later. In the estimation step, for example, the light intensity when the stage 6 has completed settling is estimated by multiplying the light intensity detected (captured) in the third detection step by information about the change (rate of change). Here, "when the stage 6 has completed settling" means when the stage 6 is vibrating within a set allowable range or when it is not vibrating.

[0056] Next, the detection unit control unit 16 determines whether the light intensity estimated in the estimation process falls within a preset intensity tolerance range (S213). The preset intensity tolerance range is, for example, a range of light intensity values preset by a user, which is a range of light intensity values within which the detection unit 11 can correctly detect the position of the mark 10. The light intensity value used for this determination is, for example, the highest value or the top 1% of the estimated light intensity values. Alternatively, the light intensity value used for the determination may be the average value from the highest value to the top 1% of the estimated light intensity values, or the highest value among the estimated light intensity values (intensity) excluding abnormal values. In this embodiment, an example is given in which the top 1% is used as the reference, but this is not limiting. If it is determined in step S213 that the light intensity estimated in the estimation process falls within the preset intensity tolerance range, the detection unit control unit 16 determines the imaging conditions used in the estimation process as the imaging conditions to be used for detecting the position of the mark 10, and proceeds to step S216.

[0057] Next, the imaging unit 15 images the mark 10 under the determined imaging conditions (fourth detection step) (S216). The image captured in the fourth detection step is the fourth image. The imaging in step S216 is performed when the stage 6 has completed settling at the target position (target position 52 in FIG. 8). The imaging performed in step S216 is the actual imaging when information regarding the change has been stored.

[0058] If it is determined in step S213 that the light intensity estimated in the estimation step is not within a preset tolerance range of intensity, the process proceeds to step S214. At least one of the intensity of light emitted from the light source 12, the transmittance of the ND filter 13, and the charge accumulation time of the imaging unit 15 is adjusted (S214, adjustment step). That is, the imaging conditions for detecting the position of the mark 10 are adjusted. In this adjustment step, the imaging conditions to be used in the actual imaging are determined, and adjustments are made to the determined imaging conditions. Here, if step S214 is performed, step S214 is a determination step for determining the imaging conditions, and if step S214 is not performed, that is, if the process proceeds from step S213 to step S216, step S213 is a determination step for determining the imaging conditions.

[0059] After step S214 is performed, the storage unit 17 updates the stored imaging conditions to the adjusted imaging conditions (S215). Note that the estimation process of step S212 and the determination of step S213 may be performed again after step S215. Next, the imaging unit 15 controls to capture an image of the mark 10 (fourth detection process) when the stage 6 has completed settling at the target position under the determined (adjusted) imaging conditions (S216).

[0060] After step S216, the detection unit control unit 16 detects (determines) the position of the mark 10 (S210) based on the fourth image captured in the fourth detection step (S216). Here, steps S202 to S216 are an information processing method performed by the detection unit control unit 16 in accordance with a program stored inside.

[0061] Thus, in this embodiment, if the storage unit 17 has stored information about the corresponding change in advance, the light control process including the preliminary image capture is started while the stage 6 is being driven (moving), and the image capture conditions are determined using the information about the change. This reduces the delay in starting detection of the position of the mark 10 due to the increased time required for the preliminary image capture. In other words, there is a high possibility that the light control process in steps S211 to S215 can be completed before the settling of the stage 6 is complete (the time when actual image capture of the mark 10 to detect the position of the mark 10 in step S216 can begin), thereby suppressing a decrease in throughput.

[0062] The detection methods for detecting mark 10 by detector 11 include bright-field observation, which detects reflected light incident perpendicularly to mark 10, and dark-field observation, which detects reflected light incident obliquely to mark 10. Bright-field observation detects reflected light from areas of substrate 2 other than mark 10 in addition to mark 10, so the amount of light detected by detector 11 is relatively large. On the other hand, dark-field observation detects reflected light from the edge of mark 10, so the amount of light detected by detector 11 is relatively small. When bright-field observation and dark-field observation are performed using a single detector 11, memory 17 may store information regarding changes for bright-field observation and information regarding changes for dark-field observation for each mark 10. Alternatively, memory 17 may store either information regarding changes for bright-field observation or information regarding changes for dark-field observation for each mark 10.

[0063] As described above, when imaging is performed by the imaging unit 15 while the stage 6 is moving, a greater number of pixels included in the imaging unit 15 receive light than the pixels that receive light when the stage 6 has settled, resulting in a dispersion of the light intensity. Therefore, in dark-field observation, which detects reflected light from the edge, the difference between the result (light intensity) detected by the detection unit 11 when the stage 6 is being driven and the result (light intensity) detected by the detection unit 11 when the stage 6 is not being driven is greater than in bright-field observation. Specifically, in dark-field observation, the result (light intensity) detected by the detection unit 11 when the stage 6 is being driven is significantly weaker because the amount of light at the edge is further dispersed. In this embodiment, the light intensity detected by the detection unit 11 after settling is completed is estimated using information about the change, allowing appropriate dimming even in dark-field observation, in which the amount of light detected by the detection unit 11 is relatively small.

[0064] In this embodiment, the imaging conditions are determined based on a first image captured while the stage 6 is being driven and a second image captured while the stage 6 is not being driven, and the position of the mark 10 is detected. However, the second image may be detected while the stage 6 is being driven (moving). In other words, the second speed, which is the speed at which the second image is captured, may or may not be 0 (m / sec). In other words, the first image captured when the moving speed of the substrate 2 held by the stage 6 is a first speed and the second image captured when the moving speed of the substrate 2 held by the stage 6 is a second speed slower than the first speed may be used.

[0065] In addition, although the present embodiment has shown an example in which the substrate from which the first image is obtained and the substrate from which the second image is obtained are the same, the substrates from which the first image and the second image are obtained may be different. Furthermore, in the present embodiment, the example in which the information regarding the change is the rate of change of the light intensity of the second image relative to the light intensity of the first image has been shown, the information regarding the change may also be, for example, the difference. Alternatively, the information regarding the change may also be the rate of change of the light intensity of the first image relative to the light intensity of the second image.

[0066] In the present embodiment, an example has been shown in which the detection unit control unit 16 calculates information about the change and controls the detection unit 11, but the detection unit control unit 16 and the main control unit 7 may be integrated, and the main control unit 7 may perform the control performed by the detection unit control unit 16. In the present embodiment, an example has been shown in which the detection unit control unit 16 calculates information about the change and determines (adjusts) imaging conditions. However, an external information processing device may obtain information about the change and imaging conditions, and transmit the obtained information about the change and imaging conditions to the detection unit control unit 16.

[0067] The main control unit 7, stage control unit 8, and detection unit control unit 16 each include a processing unit, a bus, a ROM, a RAM, and a storage device, and each component functions according to a program. The processing unit is a processing device that performs control calculations according to the program and controls each component connected to the bus. This processing unit can be configured using a CPU, a PLD such as an FPGA, an ASIC, a computer with a built-in program, or a combination of all or part of these. The ROM is a memory for reading data only and stores programs and data. The RAM is a memory for reading and writing data and is used to store programs and data. The RAM is used for temporary storage of data such as the results of CPU calculations. The storage device is also used to store programs and data. The storage device is also used as a temporary storage area for the operating system (OS) programs and data of the main control unit 7, stage control unit 8, and detection unit control unit 16. The storage device has slower data input / output speed than RAM, but is capable of storing large amounts of data. The storage device is preferably a non-volatile storage device that can store data as permanent data so that it can be referenced for a long period of time. The storage device is mainly composed of a magnetic storage device (HDD), but may also be a device that reads and writes data by loading external media such as CDs, DVDs, and memory cards.

[0068] In the present embodiment, the substrate processing apparatus 1 is described as a projection exposure apparatus. However, the substrate processing apparatus 1 is not limited to this. For example, the substrate processing apparatus 1 may be a lithography apparatus that performs lithography on a substrate using an electron beam, ion beam, or the like to form a pattern on the substrate. The substrate processing apparatus 1 may also be another lithography apparatus (substrate exposure apparatus), such as an imprinting apparatus that forms a pattern on the substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus that processes substrates such as semiconductor wafers or glass plates, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 1 may also be a planarization apparatus that uses a flat plate to planarize a composition on the substrate. For example, if the substrate processing apparatus 1 is a projection exposure apparatus, the projection optical system is the substrate processing unit, and the part that processes the substrate 2 is the substrate processing unit.

[0069] Second Embodiment This embodiment relates to a method for manufacturing an article, characterized in that the article is manufactured using the above-described detection method.

[0070] FIG. 9 is a flowchart of a method for manufacturing an article according to this embodiment. First, a holding step (S301) is performed in which a second substrate is held on the stage 6. Next, a detection step (S302) is performed in which a second mark on the second substrate, which is located at a position corresponding to the first mark, is detected under the determined imaging conditions. The imaging conditions used in the detection step are determined based on the first image and the second image. The first image is an image of the first mark on the first substrate captured by the imaging unit 15 when the moving speed of the first substrate held on the stage 6 is a first speed. The second image is an image of the first mark on the first substrate captured by the imaging unit 15 when the moving speed of the first substrate held on the stage 6 is a second speed that is slower than the first speed.

[0071] Then, an alignment step (S303) is performed to align the second substrate based on the detection result of the second mark detected in the detection step. Next, a formation step (S304) is performed to form a pattern on the second substrate aligned in the alignment step, and a processing step (S305) is performed to process the second substrate on which the pattern is formed in the formation step.

[0072] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like.

[0073] In the forming step, for example, a substrate (silicon wafer, glass plate, etc.) coated with a photosensitive material is exposed by an exposure apparatus (lithography apparatus) to form a pattern on the substrate.

[0074] The processing steps include, for example, developing the substrate (photosensitive material) on which the pattern is formed, etching the developed substrate, removing the resist, dicing, bonding, and packaging. According to this manufacturing method, it is possible to manufacture articles with a higher throughput than conventional methods.

[0075] The disclosure of the present specification includes the following detection apparatus, detection method, program, substrate processing apparatus, and method for manufacturing an article.

[0076] [Item 1] A detection device for detecting the position of a mark formed on a substrate held on a stage, an imaging unit including an imaging element that images the mark; a processing unit that detects the position of the mark based on the image captured by the imaging unit, the processing unit determines imaging conditions for a second mark located at a position corresponding to the first mark on the second substrate based on a first image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed and a second image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed, and detects the position of the second mark based on an image of the second mark captured under the imaging conditions.

[0077] [Item 2] 2. The detection device according to item 1, wherein the second image is an image captured when the stage is not being driven.

[0078] [Item 3] 3. The detection device according to item 1 or 2, characterized in that the imaging unit images the second mark under imaging conditions determined based on information regarding a change in the light intensity of the second image relative to the light intensity of the first image.

[0079] [Item 4] The detection device described in any one of items 1 to 3, characterized in that the imaging unit images the second mark under imaging conditions determined based on a third image obtained by the imaging unit capturing the second mark while the second substrate held on the stage is moving.

[0080] [Item 5] 5. The detection device according to any one of items 1 to 4, wherein the imaging section images each of the plurality of marks formed on the first substrate at two or more different speeds.

[0081] [Item 6] 6. The detection device according to any one of items 1 to 5, further comprising a storage unit that stores information relating to a change in the light intensity of the second image relative to the light intensity of the first image in association with the imaging conditions.

[0082] [Item 7] 6. The detection device according to any one of items 1 to 5, further comprising a storage unit that stores the light intensity of the first image, the light intensity of the second image, and the imaging conditions in association with each other.

[0083] [Item 8] 3. The detection device according to item 2, wherein the second image is captured when vibration of the stage is within a preset tolerance range.

[0084] [Item 9] 9. The detection device according to any one of items 1 to 8, wherein the second substrate has the same or similar light reflectance as the first substrate.

[0085] [Item 10] 10. The detection device according to any one of items 1 to 9, wherein the imaging conditions include at least one of the intensity of light emitted from a light source included in the detection device, the transmittance of an ND filter included in the detection device, and an accumulation time of charge in an imaging element included in the detection device.

[0086] [Item 11] 11. The detection device according to any one of items 1 to 10, further comprising an adjustment unit that can adjust at least one of the intensity of light emitted from a light source included in the detection device, the transmittance of an ND filter included in the detection device, and the charge accumulation time of an image sensor included in the detection device.

[0087] [Item 12] A detection device for detecting the position of a mark formed on a substrate held on a stage, an imaging unit including an imaging element that images the mark; a processing unit that determines an imaging condition for the mark when the stage is not being driven, based on an image of the mark captured by the imaging unit while the stage is being driven; an adjustment unit that adjusts an imaging condition when the imaging unit images the mark, The detection device, wherein the adjustment unit starts adjusting the imaging conditions while the stage is being driven so as to achieve the imaging conditions determined by the processing unit.

[0088] [Item 13] Item 13. The detection device according to item 12, wherein the imaging unit images each of the plurality of marks formed on the substrate at two or more different speeds.

[0089] [Item 14] a determining step of determining imaging conditions based on a first image obtained by capturing an image of a first mark on a first substrate when the moving speed of the first substrate held on a stage is a first speed, and a second image obtained by capturing an image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed; a detection step of detecting a second mark located at a position corresponding to the first mark on a second substrate under the imaging conditions determined in the determination step; A detection method comprising:

[0090] [Item 15] Item 15. The detection device according to item 14, further comprising a calculation step of calculating information relating to a change in the light intensity of the second image relative to the light intensity of the first image.

[0091] [Item 16] Item 16. The detection method according to item 15, further comprising a determining step of determining whether or not information relating to the change corresponding to the second mark is stored.

[0092] [Item 17] 17. The detection method according to item 15 or 16, further comprising an estimation step of estimating a light intensity when the second mark is imaged when the second substrate is not moving, based on a third image obtained by imaging the second mark on the second substrate while the second substrate is moving and information related to the change.

[0093] [Item 18] 18. A program for causing a computer to execute the detection method according to any one of items 14 to 17.

[0094] [Item 19] a stage for holding the substrate; an imaging unit including an imaging element that images the mark formed on the substrate; a processing unit that detects the position of the mark based on the image captured by the imaging unit; a control unit that controls a position of the substrate based on the position of the mark detected by the processing unit; a substrate processing unit for processing the substrate, the processing unit determines imaging conditions for a second mark located at a position corresponding to the first mark on the second substrate based on a first image obtained by imaging the first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed and a second image obtained by imaging the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed, and detects the position of the second mark based on the image obtained by imaging the second mark under the imaging conditions; the control unit aligns the second substrate based on the position of the second mark detected by the processing unit; the substrate processing unit performs processing on the aligned second substrate, A substrate processing apparatus characterized by:

[0095] [Item 20] a holding step of holding the second substrate on the stage; a detection step of detecting a second mark located at a position corresponding to the first mark on the second substrate under imaging conditions determined based on a first image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed, and a second image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed; an alignment step of aligning the second substrate based on the detection result of the second mark detected in the detection step; a forming step of forming a pattern on the second substrate aligned in the alignment step; a processing step of processing the second substrate on which the pattern has been formed in the forming step; A method for manufacturing an article, comprising:

[0096] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. A detection device for detecting the position of a mark formed on a substrate held on a stage, an imaging unit including an imaging element that images the mark; a processing unit that detects the position of the mark based on the image captured by the imaging unit, The processing unit determines imaging conditions for a second mark located at a position corresponding to the first mark on the second substrate based on a first image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed, and a second image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed, and detects the position of the second mark based on an image of the second mark captured under the imaging conditions.

2. 2. The detection device according to claim 1, wherein the second image is an image captured when the stage is not driven.

3. 2. The detection device according to claim 1, wherein the imaging unit images the second mark under imaging conditions determined based on information regarding a change in light intensity of the second image relative to the light intensity of the first image.

4. 2. The detection device according to claim 1, wherein the imaging unit images the second mark under imaging conditions determined based on a third image of the second mark captured by the imaging unit while the second substrate held on the stage is moving.

5. 2. The detection device according to claim 1, wherein the imaging section images each of the plurality of marks formed on the first substrate at two or more different speeds.

6. 2. The detection device according to claim 1, further comprising a storage unit that stores information relating to a change in the light intensity of the second image relative to the light intensity of the first image in association with the imaging conditions.

7. 2. The detection device according to claim 1, further comprising a storage unit that stores the light intensity of the first image, the light intensity of the second image, and the imaging conditions in association with each other.

8. 3. The detection device according to claim 2, wherein the second image is captured when vibration of the stage is within a preset tolerance range.

9. 2. The detection device according to claim 1, wherein the second substrate has a light reflectance that is the same as or similar to that of the first substrate.

10. 2. The detection device according to claim 1, wherein the imaging conditions include at least one of an intensity of light emitted from a light source included in the detection device, a transmittance of an ND filter included in the detection device, and an accumulation time of charge of an imaging element included in the detection device.

11. 2. The detection device according to claim 1, further comprising an adjustment unit that can adjust at least one of the intensity of light emitted from a light source included in the detection device, the transmittance of an ND filter included in the detection device, and the charge accumulation time of an image sensor included in the detection device.

12. A detection device for detecting the position of a mark formed on a substrate held on a stage, an imaging unit including an imaging element that images the mark; a processing unit that determines an imaging condition for the mark when the stage is not being driven, based on an image of the mark captured by the imaging unit while the stage is being driven; an adjustment unit that adjusts an imaging condition when the imaging unit images the mark, The detection device, wherein the adjustment unit starts adjusting the imaging conditions while the stage is being driven so as to achieve the imaging conditions determined by the processing unit.

13. 13. The detection device according to claim 12, wherein the imaging section images each of the plurality of marks formed on the substrate at two or more different speeds.

14. a determining step of determining imaging conditions based on a first image obtained by capturing an image of a first mark on a first substrate when the moving speed of the first substrate held on a stage is a first speed, and a second image obtained by capturing an image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed; a detection step of detecting a second mark on a second substrate at a position corresponding to the first mark under the imaging conditions determined in the determination step; A detection method comprising:

15. 15. The detection device according to claim 14, further comprising a calculation step of calculating information relating to a change in the intensity of light of the second image relative to the intensity of light of the first image.

16. 16. The detection method according to claim 15, further comprising a determining step of determining whether or not information relating to the change corresponding to the second mark is stored.

17. The detection method according to claim 15, further comprising an estimation step of estimating the light intensity when the second mark is imaged when the second substrate is not moving, based on a third image of the second mark on the second substrate imaged when the second substrate is moving and information regarding the change.

18. A program for causing a computer to execute the detection method according to any one of claims 14 to 17.

19. a stage for holding the substrate; an imaging unit including an imaging element that images the mark formed on the substrate; a processing unit that detects the position of the mark based on the image captured by the imaging unit; a control unit that controls a position of the substrate based on the position of the mark detected by the processing unit; a substrate processing unit for processing the substrate, the processing unit determines imaging conditions for a second mark located at a position corresponding to the first mark on the second substrate based on a first image obtained by imaging the first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed and a second image obtained by imaging the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed, and detects the position of the second mark based on the image obtained by imaging the second mark under the imaging conditions; the control unit aligns the second substrate based on the position of the second mark detected by the processing unit; the substrate processing unit performs processing on the aligned second substrate. A substrate processing apparatus characterized by:

20. a holding step of holding the second substrate on the stage; a detection step of detecting a second mark located at a position corresponding to the first mark on the second substrate under imaging conditions determined based on a first image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a first speed, and a second image of the first mark on the first substrate when the moving speed of the first substrate held on the stage is a second speed slower than the first speed; an alignment step of aligning the second substrate based on a detection result of the second mark detected in the detection step; a forming step of forming a pattern on the second substrate aligned in the alignment step; a processing step of processing the second substrate on which the pattern has been formed in the forming step; A method for manufacturing an article, comprising:

Images