Substrate holding device and substrate processing device

Abstract

To provide a substrate holding device and a substrate processing device with which it is possible to suppress a decrease in the accuracy of detecting the position of a contact holding unit.SOLUTION: A light emission unit 610 emits light having a plurality of mutually different peak wavelengths. A chuck member 220 is capable of moving between a first position P1 and a second position P2. The chuck member 220 holds a substrate W by moving from the first position P1 to a third position P3 between the first position P1 and the second position P2. A substrate holding unit 200 has a detection sensor 250 for detecting information related to the position of the chuck member 220. The light emission unit 610 emits light having a peak wavelength corresponding to the detection result of the detection sensor 250. A light reception unit 620 transmits, to a control unit 102, a signal corresponding to the wavelength of light received from the light emission unit 610. The control unit 102 determines the position of the chuck holding member 220 on the basis of the signal.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate holding device and a substrate processing apparatus. [Background technology]

[0002] Conventionally, substrate processing apparatuses have been known that include a substrate holding unit that holds and rotates a substrate and a rotation drive unit that rotates the substrate holding unit (see, for example, Patent Document 1). Patent Document 1 describes a substrate processing apparatus that includes a rotating chamber, multiple chucks that are disposed in the rotating chamber and hold substrates, an opening / closing mechanism that moves the multiple chucks between a holding position where the substrates are held and a transfer position where the substrates can be transferred, and a fixed chamber. In this substrate processing apparatus, the fixed chamber is provided with a light-projecting unit that irradiates light onto a moving member that moves in conjunction with the movement of the multiple chucks, and a light-receiving unit that receives light reflected from the moving member. The light-projecting unit irradiates light onto the moving member in the rotating chamber via a light-transmitting member of the fixed chamber and a light-transmitting member of the rotating chamber. The light-receiving unit receives light that is reflected by the moving member and enters the fixed chamber via the light-transmitting member of the rotating chamber and the light-transmitting member of the fixed chamber.

[0003] The height position of the movable member is then determined based on the amount of light received by the light receiving unit, and whether the chuck is located at the transfer position, the holding position, or the retracted position is determined based on the height position of the movable member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-25186 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in a substrate processing apparatus such as that disclosed in Patent Document 1, condensed water droplets or processing liquid used to process the substrate may adhere to the surface of the light-transmitting member of the fixed chamber and / or the surface of the light-transmitting member of the rotating chamber. In this case, the amount of light received by the light-receiving unit decreases. This reduces the accuracy of detecting the height position of the movable member, and therefore reduces the accuracy of detecting the position of the chuck.

[0006] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate holding device and a substrate processing apparatus that can prevent a decrease in the detection accuracy of the position of the contact holding part. [Means for solving the problem]

[0007] According to a first aspect of the present invention, a substrate holding device includes a substrate holding unit, a rotation drive unit, a holding drive unit, a light emitting unit, a light receiving unit, and a control unit. The substrate holding unit holds a substrate and rotates the substrate. The rotation drive unit rotates the substrate holding unit. At least a portion of the holding drive unit is disposed on the substrate holding unit. The light emitting unit emits light having a plurality of peak wavelengths different from one another. The light receiving unit receives the light from the light emitting unit. The substrate holding unit includes a spin base and an abutment holder. The spin base faces the substrate and has an internal space. The abutment holder is disposed on the spin base and holds the substrate by abutting against the substrate. The abutment holder is movable between a first position and a second position. The abutment holder holds the substrate by moving from the first position to a third position between the first position and the second position. The holding drive unit moves the contact holding unit between the first position and the second position. The substrate holding unit has a detection sensor that detects information regarding the position of the contact holding unit. The light emitting unit is disposed on the substrate holding unit. The light emitting unit emits light having a peak wavelength corresponding to the detection result of the detection sensor. The light receiving unit is disposed apart from the substrate holding unit and transmits a signal corresponding to the wavelength of the light received from the light emitting unit to the control unit. The control unit determines the position of the contact holding unit based on the signal.

[0008] In one embodiment, the substrate holding device 150 includes a power supply unit that supplies power to the substrate holding unit. The power supply unit includes a power receiving unit that is disposed on the substrate holding unit and supplies power to the light emitting unit and the detection sensor, and a power transmitting unit that is disposed apart from the substrate holding unit and supplies power to the power receiving unit in a contactless manner.

[0009] In one embodiment, the rotation driver stops the rotation of the substrate holder when the power receiver and the power transmitter face each other, and when the power receiver and the power transmitter face each other, the detection sensor detects information related to the position of the contact holder.

[0010] In one embodiment, when the light emitting unit and the light receiving unit are facing each other, the power receiving unit and the power transmitting unit are facing each other. The rotation drive unit stops rotation of the substrate holding unit when the light emitting unit and the light receiving unit are facing each other. When the light emitting unit and the light receiving unit are facing each other, the light emitting unit emits light to the light receiving unit.

[0011] In one embodiment, the substrate holder includes a power storage unit electrically connected to the light emitting unit and the detection sensor, and the power storage unit supplies power to the light emitting unit and the detection sensor when power is not being supplied from the power receiving unit to the light emitting unit and the detection sensor.

[0012] In one embodiment, the holding drive unit has an elevating member disposed in the internal space and moving up and down to rotate the contact holding unit. The elevating member moves up and down to rotate the contact holding unit, causing the contact holding unit to move between the first position and the second position. The detection sensor detects the vertical position of the elevating member.

[0013] According to a second aspect of the present invention, a substrate processing apparatus includes the substrate holding device described above and a nozzle, the nozzle discharging a processing liquid onto the substrate held by the substrate holding unit. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide a substrate holding device and a substrate processing apparatus that can prevent a decrease in the detection accuracy of the position of the contact holding part. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a side cross-sectional view schematically showing the inside of a substrate processing apparatus including a substrate holding device of the present embodiment. [Figure 2] 2 is a side cross-sectional view schematically showing the structure around a substrate holding portion of the substrate holding device of the present embodiment. FIG. [Figure 3] FIG. 2 is an enlarged plan view showing the chuck member of the substrate holding portion and the substrate. [Figure 4] FIG. 2 is a perspective view schematically showing a holding drive unit and a chuck member. [Figure 5] FIG. 2 is an enlarged perspective view schematically illustrating a structure around a chuck member. [Figure 6] FIG. 2 is a block diagram of the substrate processing apparatus. [Figure 7] FIG. 10 is a side cross-sectional view that schematically shows the structure around a substrate holding portion of a substrate holding device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of a substrate holding device and a substrate processing apparatus according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, a Z-axis may be mentioned to facilitate understanding of the invention. Typically, the Z-axis is parallel to the vertical direction.

[0017] First, a substrate processing apparatus 100 including a substrate holding device 150 of the present embodiment will be described with reference to Fig. 1. Fig. 1 is a side cross-sectional view that schematically shows the inside of a substrate processing apparatus 100 including a substrate holding device 150 of the present embodiment.

[0018] 1, the substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0019] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W has a substantially circular disk shape. Here, the substrate processing apparatus 100 processes the substrates W one by one.

[0020] The substrate processing apparatus 100 includes a chamber 110, a substrate holding unit 200, a rotational drive unit 300, a holding drive unit 500, and a processing liquid supply unit 130. The chamber 110 accommodates the substrate holding unit 200, the rotational drive unit 300, the holding drive unit 500, and at least a portion of the processing liquid supply unit 130.

[0021] The chamber 110 has a generally box-like shape with an internal space. The chamber 110 accommodates the substrates W. Here, the substrate processing apparatus 100 is a single-wafer type that processes the substrates W one by one, and the chamber 110 accommodates the substrates W one by one.

[0022] The substrate holding unit 200 holds the substrate W. The substrate holding unit 200 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the lower surface (back surface) Wb of the substrate W faces vertically downward. The substrate holding unit 200 also rotates the substrate W while holding it. The upper surface Wa of the substrate W may be flattened. Alternatively, a device surface may be provided on the upper surface Wa of the substrate W, or a pillar-shaped laminate with a recess may be provided. The detailed structure of the substrate holding unit 200 will be described later.

[0023] The rotation drive unit 300 rotates the substrate holder 200. The rotation drive unit 300 includes a shaft 310, an electric motor 320, and a housing 330.

[0024] The shaft 310 is, for example, a hollow shaft. The shaft 310 extends vertically along a rotation axis AX1. The substrate holder 200 is coupled to the upper end of the shaft 310.

[0025] The electric motor 320 applies a rotational force to the shaft 310. The electric motor 320 rotates the shaft 310 in a rotational direction, thereby rotating the substrate W and the substrate holding unit 200 about the rotation axis AX1. The housing 330 surrounds the shaft 310 and the electric motor 320. Specifically, the housing 330 has an upper wall 331 facing the substrate holding unit 200 and a side wall 332 extending downward from the periphery of the upper wall 331. An opening through which the shaft 310 is inserted is formed in the center of the upper wall 331. The side wall 332 has a generally cylindrical shape that surrounds the sides of the shaft 310 and the electric motor 320.

[0026] The processing liquid supply unit 130 supplies the processing liquid to the substrate W. Specifically, the processing liquid supply unit 130 supplies the processing liquid to the upper surface Wa of the substrate W held by the substrate holder 200.

[0027] The processing liquid may be an etching liquid for etching the substrate W. Examples of the etching liquid include hydrofluoric nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). The type of etching liquid is not particularly limited, and may be, for example, acidic or alkaline.

[0028] Alternatively, the processing liquid may be a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water, and reduced water (hydrogen water).

[0029] Alternatively, the treatment liquid may be an organic solvent. Typically, the volatility of the organic solvent is higher than that of the rinse liquid. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol monoethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0030] At least a portion of the holding and driving part 500 is disposed in the substrate holding part 200. The holding and driving part 500 moves (rotates) a chuck member 220 (described later) of the substrate holding part 200. The detailed structure of the holding and driving part 500 will be described later.

[0031] The processing liquid supply unit 130 includes a pipe 132 and a nozzle 136. The processing liquid flows through the pipe 132 from a supply source. The nozzle 136 is connected to the downstream end of the pipe 132. The processing liquid supply unit 130 may include, for example, a valve that opens and closes a flow path in the pipe 132, and / or a pump (not shown) that sends out the processing liquid from the supply source. As the processing liquid flows through the nozzle 136, the nozzle 136 ejects the processing liquid onto the upper surface Wa of the substrate W. The processing liquid supply unit 130 may have multiple nozzles 136 that eject multiple types of processing liquid, respectively.

[0032] Furthermore, the nozzle 136 is configured to be movable relative to the substrate W. Specifically, the substrate processing apparatus 100 includes a movement mechanism (not shown) that moves the nozzle 136 horizontally and / or vertically relative to the substrate W. For example, the movement mechanism includes a ball screw mechanism and an electric motor that provides a driving force to the ball screw mechanism.

[0033] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid that has splashed from the substrate W. The cup 180 moves up and down. For example, the cup 180 moves up vertically to the side of the substrate W during the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. In this case, the cup 180 collects the processing liquid that has splashed from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W ends, the cup 180 moves down vertically from the side of the substrate W.

[0034] The substrate processing apparatus 100 includes a power supply unit 400. The power supply unit 400 supplies power to the substrate holding unit 200. Specifically, the power supply unit 400 includes a power transmitting unit 410 and a power receiving unit 420. The power transmitting unit 410 is disposed below the substrate holding unit 200. In this embodiment, the power transmitting unit 410 is disposed in the rotation driving unit 300. On the other hand, the power receiving unit 420 is disposed in the substrate holding unit 200. The power transmitting unit 410 and the power receiving unit 420 are disposed spaced apart from each other. The power transmitting unit 410 supplies power to the power receiving unit 420 in a contactless manner. The detailed structure of the power supply unit 400 will be described later.

[0035] The substrate processing apparatus 100 includes a light emitting unit 610 and a light receiving unit 620. The light emitting unit 610 emits light having a plurality of peak wavelengths different from one another. The light emitting unit 610 is disposed in the substrate holding unit 200. In this embodiment, the light emitting unit 610 is disposed in an internal space S of the substrate holding unit 200, which will be described later. The light receiving unit 620 is disposed apart from the substrate holding unit 200. The light receiving unit 620 is disposed outside a spin base 210 of the substrate holding unit 200, which will be described later. In this embodiment, the light receiving unit 620 is disposed inside the rotation drive unit 300.

[0036] The light emitting unit 610 has a plurality of light emitting elements that emit light having different peak wavelengths. The light emitting elements are, for example, light emitting diodes (LEDs). The number of light emitting elements may be two or more. In this embodiment, the number of light emitting elements is three. For example, the light emitting unit 610 has a red light emitting element that emits red light, a green light emitting element that emits green light, and a blue light emitting element that emits blue light.

[0037] The light receiving unit 620 receives light from the light emitting unit 610. The light receiving unit 620 transmits a signal corresponding to the wavelength of the received light to the control device 101, which will be described later. Specifically, the light receiving unit 620 has a plurality of light receiving elements that detect light having different wavelengths. The light receiving elements have, for example, photodiodes. The photodiodes have, for example, color filters. The number of light receiving elements may be, for example, two or more. In this embodiment, the number of light receiving elements is three. For example, the light receiving unit 620 has a red light receiving element that detects red light, a green light receiving element that detects green light, and a blue light receiving element that detects blue light.

[0038] The substrate processing apparatus 100 includes a control device 101. The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a memory unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computer. The control unit 102 is an example of the "control unit" of the present invention.

[0039] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may include removable media. The control unit 102 executes computer programs stored in the storage unit 104 to perform substrate processing operations.

[0040] The storage unit 104 stores data. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W.

[0041] In this embodiment, the substrate holding device 150 is made up of the substrate holding unit 200, the rotation drive unit 300, the power supply unit 400, the holding drive unit 500, the light emitting unit 610, the light receiving unit 620 and the control device 101.

[0042] Next, the substrate holding part 200 will be further described with reference to Figures 2 and 3. Figure 2 is a side cross-sectional view that schematically shows the structure around the substrate holding part 200 of the substrate holding device 150 of this embodiment.

[0043] As shown in FIG. 2 , the substrate holding unit 200 includes a spin base 210 and a chuck member 220. The chuck member 220 is an example of the "contact holding unit" of the present invention. The spin base 210 has, for example, a hollow, approximately disk-like shape, a hollow, approximately cylindrical shape, or a hollow donut-like shape. The spin base 210 faces the substrate W. The spin base 210 has a diameter slightly larger than that of the substrate W. Specifically, the spin base 210 has an upper wall 211, an inner wall 212, an outer wall 213, and a bottom wall 214.

[0044] The upper wall 211 has a substantially circular plate facing the lower surface Wb of the substrate W. A circular opening is formed in the center of the upper wall 211. The inner wall 212 has a substantially cylindrical shape and extends downward from the inner peripheral edge of the upper wall 211. The outer wall 213 has a substantially cylindrical shape and extends downward from the outer peripheral edge of the upper wall 211. In this embodiment, for example, the upper wall 211, the inner wall 212, and the outer wall 213 are formed from a single member. The bottom wall 214 has a substantially circular plate that covers the lower part of the upper wall 211. A circular opening is formed in the center of the bottom wall 214. The bottom wall 214 connects the inner wall 212 and the outer wall 213. An internal space S is formed by the upper wall 211, the inner wall 212, the outer wall 213, and the bottom wall 214. In this embodiment, the internal space S is an enclosed space. For example, a sealing member (not shown) is disposed between the bottom wall 214 and the inner wall 212, and a sealing member (not shown) is disposed between the bottom wall 214 and the outer wall 213.

[0045] The chuck members 220 are provided on the spin base 210. Typically, the spin base 210 is provided with a plurality of chuck members 220 (six in this example). The lower portions of the chuck members 220 are housed in the internal space S, while the upper portions of the chuck members 220 protrude outside the internal space S. The chuck members 220 are arranged around the substrate W and hold the substrate W horizontally by abutting against the outer periphery of the substrate W.

[0046] Specifically, the chuck member 220 has a rotating shaft 221 extending in the vertical direction and a chuck portion 222 fixed to the upper end of the rotating shaft 221. The chuck member 220 rotates about a rotation axis AX2 extending in the vertical direction. The rotation axis AX2 is the central axis of the rotating shaft 221. The chuck portion 222 extends in the radial direction of the rotating shaft 221. The chuck portion 222 has a support portion 222a that supports the lower surface Wb of the substrate W, and a pressing portion 222b that presses the upper surface Wa of the substrate W. The support portion 222a and the pressing portion 222b are formed so that the distance between them increases toward the radial outside of the rotating shaft 221.

[0047] 3 is an enlarged plan view showing the chuck member 220 of the substrate holding unit 200 and the substrate W. As shown in FIG. 3, the chuck member 220 is movable (rotatable) between a first position P1 and a second position P2. The chuck member 220 moves from the first position P1 to a third position P3, thereby coming into contact with the substrate W and holding (gripping) the substrate W. The third position P3 is a position between the first position P1 and the second position P2. To simplify the drawing, the chuck member 220 moved to the first position P1 and the second position P2 is depicted by a two-dot chain line in FIG. 3.

[0048] Specifically, the first position P1 is a position where the chuck member 220 does not hold (grasp) the substrate W. In this embodiment, the first position P1 is, for example, a position where a transport mechanism (not shown) and the chuck member 220 transfer the substrate W. Note that the first position P1 may be, for example, a position where the chuck member 220 is separated from the substrate W. At the first position P1, the chuck member 220 may support the substrate W.

[0049] The second position P2 is a position opposite the first position P1 with respect to the third position P3. The second position P2 is a position where the chuck member 220 cannot hold (grasp) the substrate W or transfer the substrate W. When the substrate W is located at the transfer position (the position shown in FIG. 3), the chuck member 220 cannot move to the second position P2.

[0050] The third position P3 is a position where the chuck member 220 abuts against the outer periphery of the substrate W to hold (grasp) the substrate W.

[0051] Next, the holding drive unit 500 will be further described with reference to Figures 4 and 5. Figure 4 is a perspective view that schematically shows the holding drive unit 500 and the chuck member 220. Figure 5 is an enlarged perspective view that schematically shows the structure around the chuck member 220. Note that in Figure 4, a cam plate 551 and a protrusion 223, which will be described later, are omitted for simplicity.

[0052] As shown in FIGS. 2 and 4, the holding and driving unit 500 has a first lifting plate 510, a second lifting plate 520, a biasing member 530, and a lifting device 540. The first lifting plate 510 is an example of the "lifting member" of the present invention. The first lifting plate 510 and the biasing member 530 are disposed in the internal space S of the spin base 210. The first lifting plate 510 is disposed so as to be movable up and down by a guide mechanism (not shown). A ring-shaped driven magnet 511 is provided on the underside of the first lifting plate 510.

[0053] A plurality of biasing members 530 are arranged between the upper wall 211 and the first lifting plate 510. The biasing members 530 bias the first lifting plate 510 downward.

[0054] The second lifting plate 520 and the lifting device 540 are disposed within the housing 330 of the rotation drive unit 300. The second lifting plate 520 is disposed directly below the first lifting plate 510. The second lifting plate 520 is disposed in a state in which it can be raised and lowered by a guide mechanism (not shown).

[0055] Additionally, a ring-shaped driving magnet 521 is provided on the upper surface of the second lifting plate 520. The driving magnet 521 is arranged so as to repel the driven magnet 511. Specifically, the driving magnet 521 and the driven magnet 511 are arranged so that the surfaces facing each other have the same polarity.

[0056] The lifting device 540 moves the second lifting plate 520 up and down. The lifting device 540 has, for example, an air cylinder or a motor. In this embodiment, the second lifting plate 520 is connected to, for example, a cylinder rod of an air cylinder.

[0057] When the lifting device 540 is driven to lift the second lifting plate 520, the first lifting plate 510 also lifts due to the action of the mutually repelling drive magnet 521 and driven magnet 511. On the other hand, when the lifting device 540 is driven to lower the second lifting plate 520, the first lifting plate 510 also lowers due to the weight of the first lifting plate 510 and the action of the biasing member 530.

[0058] It should be noted that the driven magnet 511 and the driving magnet 521 do not have to be ring-shaped. As long as the lifting and lowering operation of the first lift plate 510 can be performed, for example, each of the first lift plate 510 and the second lift plate 520 may be provided with a plurality of magnets.

[0059] 5, the holding and driving unit 500 (see FIG. 1) has a cam 550. A plurality of cams 550 (six in this example) are provided to correspond to the chuck members 220. The cams 550 are disposed in the internal space S of the spin base 210. The cams 550 are provided on the first lifting plate 510 so as to protrude radially outward from the outer circumferential edge of the first lifting plate 510.

[0060] The cam 550 includes a plate-shaped cam plate 551 and a connecting portion 552. The connecting portion 552 connects the cam plate 551 to the first lifting plate 510. The cam plate 551 includes a guide hole 551a extending obliquely downward. The chuck member 220 includes a protrusion 223 protruding radially outward from the rotating shaft 221. The protrusion 223 is, for example, a cylindrical or polygonal prism-shaped shaft. The tip of the protrusion 223 of the chuck member 220 engages with the guide hole 551a. Therefore, when the first lifting plate 510 moves up or down, the protrusion 223 moves along the guide hole 551a extending obliquely downward, causing the chuck member 220 to rotate about the rotation axis AX2. Therefore, the rotational angular position of the chuck member 220 is determined by the height position of the first lifting plate 510.

[0061] Specifically, when the first lift plate 510 is located at the uppermost position in its vertically movable range, the protrusion 223 is located at the lowermost part of the guide hole 551a of the cam plate 551. At this time, the chuck member 220 is located at the first position P1 (see FIG. 3). In this state, the substrate W can be transferred between a transport mechanism (not shown) such as a transport arm and the chuck member 220. Hereinafter, the height position of the substrate W when the transport mechanism and the chuck member 220 transfer the substrate W may be referred to as the transfer height.

[0062] When the transport mechanism (not shown) is positioned at the substrate W delivery height and the first lift plate 510 descends from the uppermost position in its movable range, the protrusion 223 moves obliquely upward from the lowermost portion of the guide hole 551a of the cam plate 551, causing the chuck member 220 to move (rotate) clockwise in a plan view. The chuck member 220 then abuts against the outer periphery of the substrate W to hold (grasp) the substrate W. At this time, the chuck member 220 is located at the third position P3 (see FIG. 3). At this time, the movement (rotation) of the chuck member 220 stops, and the protrusion 223 stops at a position midway through the guide hole 551a (the position in FIG. 5), causing the descent of the first lift plate 510 to stop.

[0063] Furthermore, when the transport mechanism (not shown) is not positioned at the substrate W delivery height, and the first lifting plate 510 descends from the uppermost position in its movable range, the protrusion 223 moves obliquely upward from the lowermost portion of the guide hole 551a of the cam plate 551, causing the chuck member 220 to move (rotate) clockwise in a plan view. At this time, the chuck member 220 does not abut against the outer periphery of the substrate W, and therefore the protrusion 223 reaches the uppermost portion of the guide hole 551a of the cam plate 551. At this time, the chuck member 220 reaches the second position P2 (see FIG. 3). At this time, the movement (rotation) of the chuck member 220 stops, and the descent of the first lifting plate 510 also stops.

[0064] Continuing to refer to Figure 2, the substrate holding part 200 will be further described. As shown in Figure 2, the substrate holding part 200 has a detection sensor 250. The detection sensor 250 is disposed in the internal space S. The detection sensor 250 is a sensor for detecting the position of the chuck member 220. The detection sensor 250 detects information relating to the position of the chuck member 220. In this embodiment, the information relating to the position of the chuck member 220 includes, for example, the height position (up-down position) of the first lifting plate 510.

[0065] Specifically, the detection sensor 250 is disposed directly below the first lifting plate 510. The detection sensor 250 is a distance measuring sensor that measures the distance to the first lifting plate 510. The detection sensor 250 includes, for example, a light-emitting element that emits light and a light-receiving element that receives reflected light. The detection sensor 250 may also be a distance measuring sensor disposed directly above the first lifting plate 510. The detection sensor 250 transmits the detection result to the control device 240, which will be described later. By measuring the distance to the first lifting plate 510, the height position of the first lifting plate 510 can be calculated. This allows the rotational angle position of the chuck member 220 to be calculated, and therefore it can be determined whether the chuck member 220 is located at the first position P1, the second position P2, or the third position P3.

[0066] The light emitting portion 610 is disposed, for example, above the bottom wall 214 of the substrate holding portion 200. A window 214a is formed in a portion of the bottom wall 214 below the light emitting portion 610. The window 214a is translucent to the light emitted from the light emitting portion 610.

[0067] Light receiving unit 620 is disposed, for example, below upper wall 331 of rotation drive unit 300. A window 331a is formed in a portion of upper wall 331 above light receiving unit 620. Window 331a is translucent to light emitted from light emitting unit 610.

[0068] The substrate holding unit 200 further includes a control device 240 that controls each component of the substrate holding unit 200. In this embodiment, the control device 240 is accommodated within the internal space S of the spin base 210. In this embodiment, the power receiving unit 420 is configured to be smaller than the radius of the spin base 210 in a plan view. This makes it easy to ensure space for arranging the control device 240 within the internal space S of the spin base 210. According to the configuration of this embodiment, even in a configuration without wiring connecting the outside and inside of the spin base 210, the control device 240 can easily control and drive each component of the substrate holding unit 200. The control device 240 controls each component of the substrate holding unit 200. In this embodiment, the control device 240 controls the light emitting unit 610. The control device 240 is configured using, for example, a microcomputer. Details of the control device 240 will be described later.

[0069] Next, the power supply unit 400 will be further described with reference to Fig. 2. As shown in Fig. 2, the power transmission unit 410 is disposed in the rotary drive unit 300. The power transmission unit 410 has a power transmission coil wound around a predetermined central axis (not shown).

[0070] Specifically, the power transmitter 410 is disposed within the rotary drive unit 300. In this embodiment, the power transmitter 410 is disposed below an upper wall 331 of the rotary drive unit 300. The power transmitter 410 is disposed substantially horizontally and substantially parallel to the upper wall 331. At least a portion of the upper wall 331 above the power transmitter 410 is formed of, for example, resin.

[0071] The center of the power transmitting unit 410 is disposed at a predetermined position at a predetermined distance from the rotation axis AX1 of the substrate holding unit 200. One power transmitting unit 410 is provided around the rotation axis AX1.

[0072] The power receiving unit 420 is electrically connected to the light emitting unit 610, the control device 240, and the detection sensor 250, and supplies power to the light emitting unit 610, the control device 240, and the detection sensor 250. The power receiving unit 420 is disposed on the substrate holding unit 200. The power receiving unit 420 has a power receiving coil wound around a predetermined central axis (not shown).

[0073] Specifically, the power receiving unit 420 is disposed in the internal space S of the spin base 210. In this embodiment, the power receiving unit 420 is disposed above the bottom wall 214 of the substrate holding unit 200. The power receiving unit 420 is disposed substantially horizontally and substantially parallel to the bottom wall 214. At least a portion of the bottom wall 214 below the power receiving unit 420 is formed of, for example, resin.

[0074] Furthermore, the center of the power receiving unit 420 is disposed at a predetermined position a predetermined distance from the rotation axis AX1 of the substrate holding unit 200. One power receiving unit 420 is provided around the rotation axis AX1. The distance from the center of the power receiving unit 420 to the rotation axis AX1 is equal to the distance from the center of the power transmitting unit 410 to the rotation axis AX1. Therefore, when the substrate holding unit 200 rotates, the power receiving unit 420 and the power transmitting unit 410 sometimes face each other in the vertical direction and sometimes do not.

[0075] When the substrate holding unit 200 is positioned at a reference angle position in the rotational direction, the power receiving unit 420 and the power transmitting unit 410 face each other in the vertical direction, and the central axis (not shown) of the power receiving unit 420 and the central axis (not shown) of the power transmitting unit 410 are substantially aligned. Furthermore, when the substrate holding unit 200 is positioned at a reference angle position in the rotational direction, the light emitting unit 610 and the light receiving unit 620 face each other in the vertical direction. In this embodiment, when the light emitting unit 610 and the light receiving unit 620 face each other in the vertical direction, the power receiving unit 420 and the power transmitting unit 410 face each other in the vertical direction.

[0076] Next, the substrate processing apparatus 100 will be further described with reference to Fig. 6. Fig. 6 is a block diagram of the substrate processing apparatus 100.

[0077] 6, the control unit 102 controls the rotation drive unit 300, the processing liquid supply unit 130, the cup 180, the power supply unit 400, and the holding drive unit 500. Specifically, the control unit 102 controls the rotation drive unit 300, the processing liquid supply unit 130, the cup 180, the power supply unit 400, and the holding drive unit 500 by sending control signals to the rotation drive unit 300, the processing liquid supply unit 130, the cup 180, the power supply unit 400, and the holding drive unit 500.

[0078] The control unit 102 controls the rotation driver 300 to start rotation of the substrate holding unit 200, change the rotation speed, and stop rotation of the substrate holding unit 200. For example, the control unit 102 controls the electric motor 320 of the rotation driver 300 to stop the substrate holding unit 200 at a reference angle position. That is, the rotation driver 300 stops the rotation of the substrate holding unit 200 when the light emitting unit 610 and the light receiving unit 620 face each other. Note that the method for stopping the substrate holding unit 200 at the reference angle position is not particularly limited. For example, a sensor may be provided to detect whether the substrate holding unit 200 is positioned at the reference angle position, and the control unit 102 may stop the substrate holding unit 200 at the reference angle position based on the detection result of this sensor. Alternatively, for example, the control unit 102 may stop the substrate holding unit 200 at the reference angle position based on the output of the power supply unit 400.

[0079] The control unit 102 controls the processing liquid supply unit 130 to cause the nozzle 136 to discharge the processing liquid onto the substrate W or to stop discharging the processing liquid.

[0080] The control unit 102 controls the cup 180 to move the cup 180 relative to the substrate W. Specifically, the control unit 102 raises the cup 180 vertically upward to the side of the substrate W during the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. Furthermore, when the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 180 vertically downward from the side of the substrate W.

[0081] The control unit 102 controls the holding and driving unit 500 to raise and lower the second lift plate 520, thereby rotating the chuck member 220. Specifically, the control unit 102 controls the lifting device 540 to lower the second lift plate 520, thereby holding (gripping) the substrate W by the chuck member 220. The control unit 102 also controls the lifting device 540 to raise the second lift plate 520, thereby releasing the hold (gripping) of the substrate W by the chuck member 220.

[0082] The control unit 102 controls the power supply unit 400 to supply power to the substrate holding unit 200. Specifically, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420 in a contactless manner.

[0083] In this embodiment, the control unit 102 controls the power supply unit 400 to supply power from the power transmitter 410 to the power receiver 420 while the substrate holding unit 200 is stopped from rotating. Specifically, the control unit 102 controls the power supply unit 400 to supply power from the power transmitter 410 to the power receiver 420 while the substrate holding unit 200 is stopped at the reference angle position. Therefore, when the power transmitter 410 and the power receiver 420 face each other and power is being supplied from the power transmitter 410 to the power receiver 420, the detection sensor 250 can detect information regarding the position of the chuck member 220. Note that in this embodiment, power is not supplied from the power transmitter 410 to the power receiver 420 while the substrate holding unit 200 is rotating.

[0084] The control device 240 of the substrate holder 200 includes a control unit 242 and a memory unit 244. The control unit 242 has a processor. The control unit 242 has, for example, a central processing unit (CPU). Alternatively, the control unit 242 may have a general-purpose computer.

[0085] The storage unit 244 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 244 may include removable media. The control unit 242 executes a computer program stored in the storage unit 244 to control the light emission unit 610.

[0086] When power is supplied from the power receiving unit 420 to the control unit 242, the detection sensor 250, and the light emitting unit 610, the control unit 242 controls the detection sensor 250 to detect the height position of the first lifting plate 510. The control unit 242 receives the detection result of the detection sensor 250. Then, the control unit 242 controls the light emitting unit 610 to emit light having a peak wavelength according to the detection result of the detection sensor 250.

[0087] Specifically, the control unit 242 calculates the height position of the first lifting plate 510 based on the detection result of the detection sensor 250. Then, the control unit 242 determines the position of the chuck member 220 based on the height position of the first lifting plate 510. In other words, the control unit 242 determines which of the first position P1, second position P2, and third position P3 the chuck member 220 is located at.

[0088] Thereafter, with the light emitting unit 610 and the light receiving unit 620 facing each other, the control unit 242 controls the light emitting unit 610 to emit light toward the light receiving unit 620. The control unit 242 also controls the light emitting unit 610 to emit light having a peak wavelength corresponding to the position of the chuck member 220. In this embodiment, for example, the first position P1 corresponds to red light, the second position P2 corresponds to green light, and the third position P3 corresponds to blue light. Therefore, when the control unit 242 determines that the chuck member 220 is located at the first position P1, it controls the light emitting unit 610 to emit red light. When the control unit 242 determines that the chuck member 220 is located at the second position P2, it controls the light emitting unit 610 to emit green light. When the control unit 242 determines that the chuck member 220 is located at the third position P3, it controls the light emitting unit 610 to emit blue light.

[0089] The control unit 102 determines the position of the chuck member 220 based on a signal from the light receiving unit 620. Specifically, when the light emitting unit 610 emits light, the light receiving unit 620 receives the light from the light emitting unit 610 and transmits a signal corresponding to the wavelength of the received light to the control unit 102. The control unit 102 then receives the signal from the light receiving unit 620 and determines whether the chuck member 220 is at the first position P1, the second position P2, or the third position P3 based on the received signal.

[0090] In the present embodiment, as described above, the light emitting unit 610 emits light having a peak wavelength corresponding to the detection result of the detection sensor 250, and the light receiving unit 620 transmits a signal corresponding to the wavelength of the light received from the light emitting unit 610 to the control unit 102. The control unit 102 then determines the position of the chuck member 220 based on the signal from the light receiving unit 620. Therefore, even if condensed water droplets and / or processing liquid adhere to the surface of the window 214a and / or the surface of the window 331a and the amount of light received by the light receiving unit 620 decreases, the light receiving unit 620 transmits a signal corresponding to the wavelength of the received light to the control unit 102, and therefore, it is possible to prevent a decrease in the accuracy with which the control unit 102 detects the position of the chuck member 220.

[0091] As described above, the power supply unit 400 has a power receiving unit 420 disposed on the substrate holding unit 200, and a power transmitting unit 410 disposed apart from the substrate holding unit 200 and supplying power to the power receiving unit 420 in a contactless manner. This allows power to be easily supplied to the substrate holding unit 200. Furthermore, because power is supplied to the power receiving unit 420 in a contactless manner, it is possible to suppress the generation of dust due to wear of the contact-type member, unlike when a contact-type member such as a slip ring is used.

[0092] Furthermore, the power receiving unit 420 is accommodated in the internal space S of the spin base 210. Therefore, unlike when the power receiving unit 420 is disposed outside the spin base 210, for example, there is no need to provide a through-hole in the spin base 210 for passing wiring that supplies power from the power receiving unit 420 to the detection sensor 250 and the light emitting unit 610. This prevents the atmosphere outside the spin base 210 from entering the spin base 210. As a result, it is possible to prevent the atmosphere outside the spin base 210 from adversely affecting components disposed inside the spin base 210, such as the detection sensor 250, the light emitting unit 610, and / or the power receiving unit 420. This is particularly effective in a substrate processing apparatus 100 that uses a processing liquid such as an etching liquid, as in this embodiment.

[0093] Furthermore, as described above, the rotation driver 300 stops the rotation of the substrate holder 200 at a position where the power receiver 420 and the power transmitter 410 face each other. Then, with the power receiver 420 and the power transmitter 410 facing each other, the detection sensor 250 detects information related to the position of the chuck member 220. Therefore, when the detection sensor 250 detects information related to the position of the chuck member 220, power can be easily supplied to the detection sensor 250 from the power transmitter 410 via the power receiver 420.

[0094] As described above, the rotation driver 300 stops the rotation of the substrate holder 200 at a position where the power receiver 420 and the power transmitter 410 face each other. Then, with the light emitter 610 and the light receiver 620 facing each other, the light emitter 610 emits light to the light receiver 620. Therefore, when the light emitter 610 emits light to the light receiver 620, power can be easily supplied from the power transmitter 410 to the light receiver 620 via the power receiver 420.

[0095] As described above, the holding and driving unit 500 is disposed in the internal space S and has the first lifting plate 510 which moves up and down to rotate the chuck member 220, and the detection sensor 250 detects the vertical position of the first lifting plate 510. Therefore, by detecting the vertical position of the first lifting plate 510 with the detection sensor 250, the position of the chuck member 220 can be easily determined.

[0096] (Variation) Next, a substrate holding device 150 according to a modified example of the present invention will be described with reference to Fig. 7. Fig. 7 is a side cross-sectional view that schematically shows the structure around a substrate holding unit 200 of a substrate holding device 150 according to a modified example. In this modified example, unlike the above embodiment, an example will be described in which the substrate holding unit 200 has a power storage unit 700.

[0097] As shown in Fig. 7, the substrate holder 200 has a power storage unit 700 that stores electricity. The power storage unit 700 is a battery. The type of the power storage unit 700 is not particularly limited, but is, for example, a lithium ion battery. The power storage unit 700 may also be a primary battery.

[0098] The power storage unit 700 is housed in the internal space S of the substrate holding unit 200. The power storage unit 700 is connected to the detection sensor 250 and the light output unit 610 by wiring 710. In other words, the power storage unit 700 is electrically connected to the detection sensor 250 and the light output unit 610. Note that, in FIG. 7, the wiring 710 connecting the power storage unit 700 and the detection sensor 250 is omitted for simplicity of the drawing.

[0099] In this modification, the power storage unit 700 is connected to the control unit 242 via wiring (not shown).

[0100] Furthermore, in this modification, when power is not being supplied from the power receiving unit 420 to the detection sensor 250 and the light emitting unit 610, the power storage unit 700 supplies power to the detection sensor 250 and the light emitting unit 610. Specifically, when power is no longer being supplied from the power receiving unit 420 to the detection sensor 250 and the light emitting unit 610 due to, for example, a power outage or the like, the control unit 242 controls the power storage unit 700 to supply power from the power storage unit 700 to the detection sensor 250 and the light emitting unit 610. Therefore, for example, even if a power outage or the like occurs while the first lifting plate 510 is being raised or lowered, the position of the chuck member 220 can be easily detected.

[0101] The method by which the control unit 242 determines whether the loss of power supply to the detection sensor 250 and the light emitter 610 is due to a power outage or the rotation of the substrate holding unit 200 is not particularly limited. For example, a power supply unit 400 capable of transmitting and receiving signals between the power transmitter 410 and the power receiver 420 may be used. For example, when rotating the substrate holding unit 200, the power transmitter 410 may transmit a rotation signal indicating that the substrate holding unit 200 is to be rotated to the power receiver 420, and the control unit 242 may determine whether the substrate holding unit 200 is stopped based on the rotation signal. Alternatively, an acceleration sensor may be provided in the substrate holding unit 200, and the control unit 242 may determine whether the substrate holding unit 200 is stopped based on the detection result of the acceleration sensor. Alternatively, a detection sensor may be provided to detect the rotation angle position of the substrate holding unit 200, and the control unit 242 may determine whether the substrate holding unit 200 is stopped based on the detection result of the detection sensor.

[0102] In this modification, the power storage unit 700 is connected to the power receiving unit 420 via a wiring 710. The control unit 242 controls the power receiving unit 420 to supply surplus power from the power receiving unit 420 to the power storage unit 700. This makes it possible to prevent the remaining amount (level) of the power storage unit 700 from becoming zero.

[0103] Other configurations and other effects of the modified example are similar to those of the above embodiment.

[0104] The above describes the embodiments and modifications of the present invention with reference to the drawings. However, the present invention is not limited to the above embodiments and modifications, and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments and modifications. For example, some components may be omitted from all components shown in the embodiments and modifications. Furthermore, components from different embodiments and modifications may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual components due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments and modifications are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0105] For example, in the above embodiment, as an example in which the light emitting unit 610 emits light having a plurality of different peak wavelengths according to the position of the chuck member 220, an example in which the light emitting unit 610 corresponds to a first position P1, a second position P2, and a third position P3 of the chuck member 220 with red light emitting elements, green light emitting elements, and blue light emitting elements, respectively, has been described. However, the present invention is not limited to this. That is, an example in which the light emitting unit 610 has the same number of light emitting elements as the number of positions of the chuck member 220 (here, three) has been described. However, the present invention is not limited to this. For example, the number of light emitting elements of the light emitting unit 610 may be less than the number of positions of the chuck member 220. Specifically, for example, the light emitting unit 610 may have red light emitting elements and green light emitting elements, and a first state in which only red light is emitted, a second state in which only green light is emitted, and a third state in which both red light and green light are emitted may be respectively associated with the three positions of the chuck member 220.

[0106] In the above embodiment, the light emitting unit 610 emits three light beams (red light, green light, and blue light) having different peak wavelengths, but the present invention is not limited to this. For example, the light emitting unit 610 may emit two light beams or four or more light beams having different peak wavelengths.

[0107] In the above embodiment, an example has been described in which the detection sensor 250 is a distance measuring sensor that measures the distance to the first lift plate 510, but the present invention is not limited to this. For example, the detection sensor 250 may be a magnetic sensor, or a light blocking sensor that has a light emitting element and a light receiving element and detects light blocking.

[0108] Furthermore, in the above embodiment, an example has been described in which the information regarding the position of the chuck member 220 includes the height position of the first lifting plate 510. That is, an example has been described in which the detection sensor 250 detects the height position of the first lifting plate 510. However, the present invention is not limited to this. For example, the information regarding the position of the chuck member 220 may include the rotation angle of the chuck member 220. That is, the detection sensor 250 may be a sensor that detects the rotation angle of the chuck member 220. Furthermore, the information regarding the position of the chuck member 220 may be other information.

[0109] In the above embodiment, for example, the chuck member 220 moves between the first and second positions by rotating, but the present invention is not limited to this. For example, the chuck member may move linearly between the first and second positions by providing a mechanism that converts rotational motion into linear motion. Also, for example, the holding drive unit may have a linear motor, and the chuck member may move linearly between the first and second positions.

[0110] Furthermore, for example, in the above embodiment, an example has been described in which the centers of the power transmitting unit 410 and the power receiving unit 420 are disposed at a predetermined distance from the rotation axis AX1 of the substrate holding unit 200, but the present invention is not limited to this. For example, the centers of the power transmitting unit 410 and the power receiving unit 420 may substantially coincide with the rotation axis AX1 of the substrate holding unit 200. That is, the power transmitting unit 410 may have a power transmitting coil wound around the rotation axis AX1, and the power receiving unit 420 may have a power receiving coil wound around the rotation axis AX1. With this configuration, the power transmitting unit 410 and the power receiving unit 420 always face each other regardless of whether the substrate holding unit 200 is rotating. Therefore, power can be supplied from the power transmitting unit 410 to the power receiving unit 420 even while the substrate holding unit 200 is rotating.

[0111] Furthermore, for example, in the above embodiment, the detection sensor 250 is disposed in the internal space S of the spin base 210 , but the detection sensor 250 may be disposed outside the spin base 210 . [Industrial Applicability]

[0112] The present invention is suitably used in a substrate holding device and a substrate processing device. [Explanation of symbols]

[0113] 100: Substrate processing apparatus 102: Control unit 136: Nozzle 150:Substrate holding device 200: Board holding part 210: Spin Base 220: Chuck member (contact holding part) 250: Detection sensor 300: Rotation drive unit 400: Power supply section 410: Power transmission unit 420: Power receiving unit 500: Holding drive unit 510: First lifting plate (lifting member) 610: Light emitting part 620: Light receiving section 700: Power storage unit P1: 1st position P2: 2nd position P3: 3rd position S:Internal space W: Substrate

Claims

1. a substrate holder that holds a substrate and rotates the substrate; a rotation drive unit that rotates the substrate holder; a holding and driving unit at least a portion of which is disposed on the substrate holding unit; a light emitting section that emits light having a plurality of peak wavelengths different from one another; a light receiving unit that receives light from the light emitting unit; Control unit and Equipped with The substrate holder includes: a spin base facing the substrate and having an internal space; a contact holding part that is disposed on the spin base and that holds the substrate by contacting the substrate; and The contact holding portion is movable between a first position and a second position; holding the substrate by moving from the first position to a third position between the first position and the second position; the holding drive unit moves the contact holding unit between the first position and the second position, the substrate holding part has a detection sensor that detects information regarding the position of the contact holding part, the light emitting unit is disposed on the substrate holding unit and emits light having a peak wavelength corresponding to the detection result of the detection sensor; the light receiving unit is disposed apart from the substrate holding unit, and transmits a signal corresponding to the wavelength of the light received from the light emitting unit to the control unit; The control unit determines the position of the contact holding unit based on the signal.

2. a power supply unit that supplies power to the substrate holder; The power supply unit a power receiving unit disposed on the substrate holding unit and supplying power to the light emitting unit and the detection sensor; a power transmitting unit that is disposed apart from the substrate holding unit and that supplies power to the power receiving unit in a non-contact manner; The substrate holding device of claim 1 , comprising:

3. the rotation driver stops the rotation of the substrate holder at a position where the power receiver and the power transmitter face each other; The substrate holding device according to claim 2 , wherein the detection sensor detects information relating to the position of the contact holding part while the power receiving part and the power transmitting part are opposed to each other.

4. When the light emitting unit and the light receiving unit are opposed to each other, the power receiving unit and the power transmitting unit are opposed to each other; the rotation driver stops the rotation of the substrate holder in a state where the light emitting unit and the light receiving unit face each other; 4. The substrate holding device according to claim 2, wherein the light emitting portion and the light receiving portion are opposed to each other, and the light emitting portion emits light to the light receiving portion.

5. the substrate holding unit has a power storage unit electrically connected to the light emitting unit and the detection sensor, 4. The substrate holding device according to claim 2, wherein the power storage unit supplies power to the light emitting unit and the detection sensor when power is not supplied from the power receiving unit to the light emitting unit and the detection sensor.

6. the holding drive unit is disposed in the internal space and has a lifting member that moves up and down to rotate the contact holding unit, The lifting member moves up and down to rotate the contact holding portion, thereby moving the contact holding portion between the first position and the second position, The substrate holding device according to claim 1 , wherein the detection sensor detects the vertical position of the lifting member.

7. The substrate holding device according to claim 1 ; a nozzle that ejects a processing liquid onto the substrate held by the substrate holder; A substrate processing apparatus comprising:

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