Sensor device

Abstract

To suppress the effect of light reflected from the surface of a bonding wire on a semiconductor element.SOLUTION: A sensor device 100 includes a semiconductor element 20 having a light receiving surface 21, a wiring board 10 on which the semiconductor element 20 is mounted, a bonding wire 40 connecting the semiconductor element 20 and the wiring board 10, and a first wall body 31 having light-blocking properties and arranged between the bonding wire 40 and the light receiving surface 21 when viewed in the thickness direction of the wiring board 10.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a sensor device. [Background technology]

[0002] For example, an optical module is known that includes a fixed substrate, a sensor substrate fixed to the fixed substrate, and a light-emitting element fixed to the fixed substrate (see, for example, Patent Document 1). Electrode pads provided on the fixed substrate and electrode pads provided on the sensor substrate are connected via bonding wires. The bonding wires are sealed with resin.

[0003] For example, an optical module mounted with semiconductor elements such as light-emitting elements and light-receiving elements is known (see, for example, Patent Document 2). The semiconductor elements are disposed on a substrate, and electrodes of the semiconductor elements are connected to electrodes of the substrate via bonding wires. Parts of the semiconductor elements, the bonding wires, and the electrodes are sealed with resin. For example, a black epoxy resin containing a light-blocking filler is used as the resin. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-144037 [Patent Document 2] Japanese Patent Application Publication No. 2023-49169 Summary of the Invention [Problem to be solved by the invention]

[0005] There is a risk that light reflected from the surface of the bonding wire will affect the sensor characteristics of the semiconductor element.

[0006] An object of the present invention is to provide a sensor device that can suppress the influence of light reflected on the surface of a bonding wire on a semiconductor element. [Means for solving the problem]

[0007] The sensor device of the present disclosure comprises a semiconductor element having a light receiving surface, a wiring board on which the semiconductor element is mounted, a bonding wire connecting the semiconductor element and the wiring board, and a first wall body having light-blocking properties and arranged between the bonding wire and the light receiving surface when viewed in the thickness direction of the wiring board. [Effects of the Invention]

[0008] The present disclosure can provide a sensor device that can suppress the influence of light reflected on the surface of a bonding wire on a semiconductor element. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view of the sensor module according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the sensor module according to the first embodiment. [Figure 3] FIG. 2 is an enlarged cross-sectional view showing a portion of the sensor module. [Figure 4] FIG. 10 is a plan view of a sensor module according to a second embodiment. [Figure 5] FIG. 10 is a cross-sectional view of a sensor module according to a second embodiment. [Figure 6] FIG. 10 is a cross-sectional view of a sensor module according to a third embodiment. [Figure 7] 7A and 7B are cross-sectional views showing the vent hole and valve according to the first embodiment, where FIG. 7A shows the state of the valve in a normal state, and FIG. 7B shows the state of the valve during exhaust. [Figure 8] 8A and 8B are cross-sectional views showing a vent hole and a valve according to a second embodiment, where FIG. 8A shows the state of the valve in a normal state, and FIG. 8B shows the state of the valve during exhaust. DETAILED DESCRIPTION OF THE INVENTION

[0010] A sensor device according to an embodiment will be described below with reference to the accompanying drawings. In this specification and the drawings, substantially identical components may be designated by the same reference numerals to avoid redundant description. The terms "upper" and "lower" may be used in this specification. These refer to the "upper" and "lower" states shown in FIG. 2, where the side closer to the wiring board 10 in the Z-axis direction is the "lower" and the side closer to the top plate 33 of the cover 30 is the "upper." The actual arrangement of the sensor module 100 is not limited to this.

[0011] [Sensor module 100 according to the first embodiment] FIG. 1 is a plan view of a sensor module 100 according to the first embodiment. FIG. 2 is a cross-sectional view of the sensor module 100 according to the first embodiment. FIG. 3 is a cross-sectional view showing an enlarged portion of the sensor module 100. Note that in each drawing, an X-axis direction, a Y-axis direction, and a Z-axis direction, which are orthogonal to one another, are shown. The X-axis direction, the Y-axis direction, and the Z-axis direction do not have to be orthogonal to one another. The X-axis direction, the Y-axis direction, and the Z-axis direction may be any direction.

[0012] 1 to 3, the sensor module 100 includes a wiring substrate 10, a semiconductor element sensor 20, a cover 30, and bonding wires 40. The sensor module 100 is an example of a sensor device. The sensor module 100 is an optical sensor module or an infrared sensor module.

[0013] [Wiring board 10] The wiring board 10 may be a wiring board having wiring formed on its upper surface 10a. The thickness direction of the wiring board 10 is along the Z-axis direction. Wire bonding pads are formed on the upper surface 10a.

[0014] [Semiconductor element sensor 20] The semiconductor element sensor 20 is a semiconductor element having a light receiving surface 21. The semiconductor element sensor 20 is, for example, a light receiving element. The semiconductor element sensor 20 may include a MEMS (Micro Electro Mechanical Systems) sensor chip and a glass substrate.

[0015] The semiconductor element sensor 20 is mounted on the upper surface 10a of the wiring substrate 10. The semiconductor element sensor 20 is adhered to the upper surface 10a of the wiring substrate 10 using an adhesive resin (adhesive). The adhesive resin may be, for example, a die bond resin such as a silicone resin.

[0016] The semiconductor element sensor 20 has a top surface 22 and a bottom surface 23 that face each other in the Z-axis direction. The bottom surface 23 includes a surface that contacts the upper surface 10a of the wiring substrate 10. The top surface 22 is the surface opposite the wiring substrate 10. The light receiving surface 21 is formed on the top surface 22. A wire bonding pad to which a bonding wire 40 is bonded is formed on the top surface 22.

[0017] The semiconductor element sensor 20 is wire-bonded to the wiring board 10. The semiconductor element sensor 20 is connected to a wire bonding pad formed on the wiring board 10 via a bonding wire 40.

[0018] [Cover 30] The cover 30 has a first wall 31, a second wall 32, and a top plate 33. The first wall 31, the second wall 32, and the top plate 33 are integrally formed. The first wall 31, the second wall 32, and the top plate 33 have light-blocking properties. The first wall 31, the second wall 32, and the top plate 33 are formed from, for example, resin.

[0019] [First wall 31] The first wall 31 is disposed between the bonding wire 40 and the light receiving surface 21 when viewed in the Z-axis direction. The first wall 31 is disposed so as to surround the light receiving surface 21 when viewed in the Z-axis direction. The first wall 31 forms, for example, a rectangular frame when viewed in the Z-axis direction. The thickness direction of the first wall 31 is along a direction intersecting the Z-axis direction. The light receiving surface 21 is disposed within an opening 35 surrounded by the first wall 31. The first wall 31 is disposed outside the light receiving surface 21. The first wall 31 is formed to a position higher than the bonding wire 40. The first wall 31 may be joined to the top surface 22 of the semiconductor element sensor 20. The first wall 31 may be adhesively attached to the top surface 22 of the semiconductor element sensor 20. In the X-axis and Y-axis directions, the side closer to the light receiving surface 21 is defined as the inner side, and the side farther from the light receiving surface 21 is defined as the outer side. In the cover 30, the second wall 32 may be adhered to the upper surface 10a of the wiring board 10, and the first wall 31 may be in contact with the top surface 22 of the semiconductor element sensor 20. The first wall 31 does not have to be joined to the top surface 22 of the semiconductor element sensor 20.

[0020] [Second wall 32] The second wall 32 is disposed farther from the light receiving surface 21 than the bonding wire 40 when viewed in the Z-axis direction. When viewed in the Z-axis direction, the second wall 32 is disposed so as to surround the semiconductor element sensor 20 and the bonding wire 40. When viewed in the Z-axis direction, an accommodation space 45 is formed between the first wall 31 and the second wall 32. When viewed in the Z-axis direction, the second wall 32 forms, for example, a rectangular frame. The thickness direction of the second wall 32 is along a direction intersecting the Z-axis direction.

[0021] A plurality of bonding wires 40 are arranged in an accommodation space 45 between the first wall 31 and the second wall 32. The accommodation space 45 is formed to surround the semiconductor element sensor 20. The second wall 32 is arranged outside the plurality of bonding wires 40. The second wall 32 may be joined to the upper surface 10a of the wiring board 10. The second wall 32 may be adhered to the upper surface 10a of the wiring board 10. The second wall 32 is formed to a position higher than the bonding wires 40. In the cover 30, the first wall 31 may be adhered to the top surface 22 of the semiconductor element sensor 20, and the second wall 32 may be in contact with the upper surface 10a of the wiring board 10. The second wall 32 does not have to be joined to the upper surface 10a of the wiring board 10.

[0022] [Tabletop 33] The top plate 33 is formed to cover the bonding wires 40 and the accommodation space 45. The thickness direction of the top plate 33 is along the Z-axis direction. The top plate 33 is connected to the upper part of the first wall body 31 and the upper part of the second wall body 32. The top plate 33 connects the first wall body 31 and the second wall body 32. In other words, the first wall body 31 and the second wall body 32 protrude downward from the top plate 33. The top plate 33 is formed to surround the opening 35 when viewed in the Z-axis direction.

[0023] The cover 30 forms a housing space 45 between itself and the upper surface of the wiring board 10. The cover 30 is disposed so as to cover the bonding wires 40 from the side opposite to the wiring board 10 in the Z-axis direction.

[0024] [Ventilation 50] A ventilation hole 50 is formed in the cover 30. The ventilation hole 50 is formed in the top plate 33. The ventilation hole 50 penetrates the top plate 33 in the Z-axis direction. The ventilation hole 50 communicates with the storage space 45. A valve 60 is provided in the ventilation hole 50. When the valve 60 is opened, air in the storage space 45 can be discharged to the outside of the cover 30. When the valve 60 is closed, the storage space 45 can be sealed.

[0025] The valve 60 includes a valve element having, for example, a disk shape. The valve 60 may be formed from, for example, a flexible material. The valve 60 may be deformable in response to the pressure difference between the pressure inside the accommodation space 45 and the pressure outside the cover 30. The valve 60 may be opened in response to the pressure difference. The valve 60 may be raised in response to the pressure difference. The valve 60 may be formed from, for example, a gel material. By including the valve 60, the sensor module 100 can achieve both sealing at room temperature and releasing internal pressure during reflow.

[0026] The ventilation port 50 includes a ventilation hole 51 and a valve accommodating portion 52. The ventilation hole 51 is an example of a first hole, and the valve accommodating portion 52 is an example of a second hole. The ventilation hole 51 is formed closer to the accommodation space 45 in the Z-axis direction than the valve accommodating portion 52. The valve accommodating portion 52 communicates with the ventilation hole 51 and has a larger inner diameter than the ventilation hole 51. The valve accommodating portion 52 is formed farther from the accommodation space 45 in the Z-axis direction than the ventilation hole 51.

[0027] A stepped surface 52a is formed in the vent port 50. The stepped surface 52a is a stepped surface between the vent hole 51 and the valve accommodating portion 52. The valve 60 is disposed on the stepped surface 52a and closes the vent hole 51. When the pressure inside the accommodation space 45 increases, the valve 60 floats up, and the air inside the accommodation space 45 passes through the vent hole 51, flows into the valve accommodating portion 52, and is released to the outside of the cover 30. When the pressure inside the accommodation space 45 decreases, the valve 60 comes into contact with the stepped surface 52a, and the vent hole 51 is closed.

[0028] When viewed in the Z-axis direction, the ventilation holes 51 are arranged at positions that do not overlap with the bonding wires 40. When viewed in the Z-axis direction, the ventilation holes 51 are arranged between a plurality of bonding wires 40.

[0029] [Operation and effect of the sensor module 100 according to the first embodiment] The sensor module 100 of the first embodiment comprises a semiconductor element sensor 20 having a light receiving surface 21, a wiring board 10 on which the semiconductor element sensor 20 is mounted, a bonding wire 40 connecting the semiconductor element sensor 20 and the wiring board 10, and a first wall body 31 having light-blocking properties and arranged between the bonding wire 40 and the light receiving surface 21 when viewed in the Z-axis direction (the thickness direction of the wiring board 10).

[0030] In such a sensor module 100, a first wall 31 having light-blocking properties is disposed between the bonding wire 40 and the light-receiving surface 21, thereby suppressing the effect of light reflected on the surface of the bonding wire 40 on the semiconductor element sensor 20. In the sensor module 100, transmission of light from the accommodation space 45 into the opening 35 is suppressed. Similarly, in the sensor module 100, transmission of light from the opening 35 into the accommodation space 45 is suppressed. Since light that travels from the opening 35 into the sensor module 100 does not travel into the accommodation space 45, light reflected on the bonding wire 40 can be suppressed. By suppressing light reflected on the surface of the bonding wire 40, the measurement accuracy of the sensor module 100 can be improved.

[0031] In addition, the sensor module 100 has a second wall 32 that is positioned farther from the light receiving surface 21 than the bonding wire 40 when viewed in the Z-axis direction, and in the Z-axis direction, the first wall 31 and the second wall 32 are formed to a position higher than the bonding wire 40.

[0032] According to the sensor module 100 having this configuration, the bonding wire 40 can be placed in the accommodation space 45 between the first wall 31 and the second wall 32. Since the first wall 31 and the second wall 32 are formed to a position higher than the bonding wire 40, the first wall 31 and the second wall 32 can protect the bonding wire 40. For example, during the manufacturing of the sensor module 100, other objects outside the sensor module 100 are prevented from coming into contact with the bonding wire 40. This reduces the risk of damage to the bonding wire 40. Furthermore, the sensor module 100 can be easily handled during the manufacturing of the sensor module 100. According to the sensor module 100, the handleability of the sensor module 100 can be improved.

[0033] The sensor module 100 also includes a cover 30 that includes a first wall 31 and covers the bonding wire 40 from the side opposite to the wiring board 10. According to such a sensor module 100, the bonding wire 40 can be protected by covering it with the cover 30. The bonding wire 40 can be placed in an accommodation space 45 between the wiring board 10 and the cover 30. Protecting the bonding wire 40 improves the handleability of the sensor module 100. Furthermore, covering the bonding wire 40 with the cover 30 can suppress light reflection on the surface of the bonding wire 40, thereby suppressing its influence on the semiconductor element sensor 20.

[0034] Furthermore, in the sensor module 100, the cover 30 includes a second wall 32 that is disposed farther from the light-receiving surface 21 than the bonding wire 40 when viewed in the Z-axis direction. In the sensor module 100, the cover 30 may include a first wall 31, a second wall 32, and a top plate 33. The cover 30 has light-blocking properties and a predetermined strength. The first wall 31, the second wall 32, and the top plate 33 cover the bonding wire 40, thereby protecting the bonding wire 40. In the sensor module 100, the influence of light reflected on the surface of the bonding wire 40 on the semiconductor element sensor 20 can be suppressed.

[0035] Furthermore, in the sensor module 100, the cover 30 is formed with a vent hole 50 that communicates with the accommodation space 45 that accommodates the bonding wire 40. According to such a sensor module 100, the inside and outside of the accommodation space 45 can be communicated with each other via the vent hole 50. This makes it possible to suppress fluctuations in the pressure inside the accommodation space 45, and to suppress damage to the cover 30 due to an increase in pressure inside the accommodation space 45.

[0036] Furthermore, in the sensor module 100, a valve 60 is provided at the vent 50. According to the sensor module 100 having this configuration, the vent 50 can be opened and closed by the valve 60. By opening and closing the valve 60, the pressure inside the accommodation space 45 can be adjusted as needed.

[0037] In addition, in the sensor module 100, the ventilation port 50 includes a ventilation hole (first hole) 51 formed closer to the storage space 45 in the Z-axis direction, and a valve accommodating section (second hole) 52 that communicates with the ventilation hole 51 and has an inner diameter larger than that of the ventilation hole 51, and a valve 60 is arranged on a step surface 52a formed between the ventilation hole 51 and the valve accommodating section 52.

[0038] In the sensor module 100 having this configuration, the vent hole 51 can be closed by placing the valve 60 on the stepped surface 52a. When the pressure inside the accommodation space 45 increases, the valve 60 rises from the stepped surface 52a, allowing ventilation through the vent hole 51. When the pressure inside the accommodation space 45 decreases, the valve 60 descends and is placed on the stepped surface 52a, thereby closing the vent hole 51. The valve 60 is movable in the Z-axis direction inside the valve accommodation portion 52. In the sensor module 100, the pressure inside the accommodation space 45 can be adjusted using the valve 60 with a simple configuration. In the sensor module 100, damage to the sensor module 100 can be suppressed by suppressing an increase in pressure inside the accommodation space 45. The sensor module 100 may or may not include the valve 60.

[0039] [Sensor module 100B according to the second embodiment] Fig. 4 is a plan view of a sensor module 100B according to the second embodiment. Fig. 5 is a cross-sectional view of the sensor module 100B according to the second embodiment. The sensor module 100B according to the second embodiment shown in Figs. 4 and 5 differs from the sensor module 100 according to the first embodiment in that the sensor module 100B according to the second embodiment does not have a top plate 33 and that the bonding wires 40 are covered with resin 70. Note that in the description of the sensor module 100B according to the second embodiment, descriptions that are the same as those for the sensor module 100 according to the first embodiment may be omitted.

[0040] The sensor module 100B includes a first wall 31 and a second wall 32. An accommodation space 45 is formed between the first wall 31 and the second wall 32. The upper part of the accommodation space 45 may be open to the outside. The bonding wire 40 is sealed with a light-blocking resin 70. The bonding pad to which the bonding wire 40 is joined is also sealed with the resin 70. Note that the resin 70 is not shown in FIG. 4. The resin 70 may be, for example, a black epoxy resin containing a light-blocking filler.

[0041] In the sensor module 100B according to the second embodiment, a first wall 31 having light-blocking properties is disposed between the bonding wire 40 and the light-receiving surface 21. This reduces the effect of light reflected on the surface of the bonding wire 40 on the semiconductor element sensor 20. In the sensor module 100B, light transmission from the accommodation space 45 to the inside of the opening 35 is reduced. Similarly, in the sensor module 100B, light transmission from the opening 35 to the accommodation space 45 is reduced. Since light traveling from the opening 35 into the sensor module 100 does not travel into the accommodation space 45, light reflection on the bonding wire 40 can be reduced. By reducing the light reflected on the surface of the bonding wire 40, the measurement accuracy of the sensor module 100 can be improved.

[0042] In the sensor module 100B of the second embodiment, the first wall 31 and the second wall 32 are formed to a position higher than the bonding wire 40, so that the bonding wire 40 can be protected by the first wall 31 and the second wall 32.

[0043] Furthermore, in the sensor module 100B, the bonding wires 40 are covered with a light-shielding resin 70. In the sensor module 100B having this configuration, the bonding wires 40 are covered with the resin 70, so that reflection of light on the surfaces of the bonding wires 40 can be suppressed.

[0044] Furthermore, in the sensor module 100B, the first wall 31 and the second wall 32 are formed to a position higher than the bonding wire 40 and the resin 70. This allows the first wall 31 and the second wall 32 to protect the bonding wire 40 and the resin 70.

[0045] [Sensor module 100C according to the third embodiment] FIG. 6 is a cross-sectional view of a sensor module according to a third embodiment. The sensor module 100C according to the third embodiment shown in FIG. 6 differs from the sensor module 100 according to the first embodiment in that the sensor module 100C according to the third embodiment includes a cover 30C having a first wall 31 and a top plate 33 instead of the cover 30, and that the sensor module 100C includes a second wall 32C that is separate from the cover 30C. Note that in the description of the sensor module 100C according to the third embodiment, descriptions similar to those of the sensor module 100 according to the first embodiment may be omitted. The sensor module 100C may include an air vent 50 and a valve 60 as shown in FIG. 3. The air vent 50 and the valve 60 are not shown in FIG. 6.

[0046] The sensor module 100C includes a cover 30C and a second wall 32C. The cover 30C has a first wall 31 and a top plate 33. The second wall 32C has the same configuration as the second wall 32, but is formed as a separate body from the cover 30C. The second wall 32C and the cover 30C are joined together. The second wall 32C may be, for example, a cavity substrate that forms a space (accommodation space 45) in the center. For example, the wiring board 10 and the second wall 32C may be formed integrally.

[0047] The sensor module 100C according to the third embodiment also achieves the same effects as the sensor module 100 according to the first embodiment. The second wall 32C may be formed as a separate body from the cover 30C. Note that the sensor module 100 according to the modified example may include a cover 30 having the second wall 32 and the top plate 33, and a first wall 31 that is separate from the cover 30.

[0048] [Vent 50 and valve 60 according to the first embodiment] 7(a) is a cross-sectional view showing the vent port 50 and valve 60 according to the first example, and FIG. 7(b) is a view showing the state of the valve 60 during normal operation, and FIG. 7(b) is a view showing the state of the valve 60 during exhaust. In describing the vent port 50 and valve 60 according to the first example, descriptions similar to those in the first embodiment above may be omitted.

[0049] The valve 60 is made of a gel material and is deformable in response to the pressure inside the storage space 45. As shown in FIG. 7(a), the valve 60 normally closes the vent hole 51. As shown in FIG. 7(b), during exhaust, the valve 60 deforms and an opening communicating with the vent hole 51 is formed. The valve 60 deforms to form a ring shape in a plan view. The inner diameter of the opening formed in the valve 60 varies in the Z-axis direction.

[0050] When the pressure inside the storage space 45 increases, an opening is formed in the center of the valve 60. The central portion of the valve 60 is pushed radially outward, and the radially outer portions of the valve 60 are pushed upward. The gas inside the storage space 45 is exhausted to the outside of the cover 30 through the central opening of the valve 60, thereby reducing the pressure inside the storage space 45. As the pressure inside the storage space 45 decreases, the central opening of the valve 60 becomes smaller, and eventually the opening of the valve 60 disappears. As shown in FIG. 7(a), the valve 60 closes the air vent 51.

[0051] [Ventilation port 50B and valve 60B according to the second embodiment] 8A and 8B are cross-sectional views showing the vent port 50B and valve 60B according to the second embodiment, with Fig. 8A showing the state of the valve 60B in a normal state and Fig. 8B showing the state of the valve 60B during exhaust. Descriptions of the vent port 50B and valve 60B according to the second embodiment that are the same as those in the first embodiment may be omitted.

[0052] The ventilation opening 50B is a through-hole that penetrates the top plate 33 in the Z-axis direction. The shape of the ventilation opening 50B may be, for example, conical. The cross-sectional shape of the ventilation opening 50B along the Z-axis may be inclined with respect to the Z-axis. The inner diameter of the ventilation opening 50B on the side farther from the accommodation space 45 is larger than the inner diameter of the ventilation opening 50B on the side closer to the accommodation space 45. The inner peripheral surface of the ventilation opening 50B may or may not be inclined with respect to the Z-axis. A stepped surface may or may not be formed on the inner peripheral surface of the ventilation opening 50B.

[0053] The valve 60B may have, for example, a truncated cone shape. The shape of the valve 60B may be cylindrical, disc-shaped, conical, or another shape. The valve 60B is formed from a gel material and is deformable in response to the pressure inside the storage space 45. As shown in FIG. 8(a), the valve 60B normally closes the vent port 50B. As shown in FIG. 8(b), during exhaust, the valve 60B deforms and an opening communicating with the storage space 45 is formed. The valve 60B deforms to form a ring shape in a plan view. The inner diameter of the opening formed in the valve 60B varies in the Z-axis direction.

[0054] As described above, the valve 60B is deformed to form an opening in response to the pressure inside the accommodation space 45, and the gas inside the accommodation space 45 can be exhausted to the outside of the cover 30.

[0055] It should be noted that the present invention is not limited to the configurations shown here, and other embodiments may be possible in which other components are combined with the configurations described in the above embodiments. In this regard, the present invention can be modified within the scope of the present invention, and can be appropriately determined depending on the application form. [Explanation of symbols]

[0056] 100, 100B, 100C: sensor module, 10: wiring board, 20: semiconductor element sensor (semiconductor element), 21: light receiving surface, 30: cover, 31: first wall, 32, 32C: second wall, 33: top plate, 40: bonding wire, 50: ventilation hole, 51: ventilation hole (first hole), 52: valve accommodating section (second hole), 52a: step surface, 60: valve, 70: resin, X: X-axis direction, Y: Y-axis direction, Z: Z-axis direction (plate thickness direction).

Claims

1. a semiconductor element having a light receiving surface; a wiring board on which the semiconductor element is mounted; a bonding wire connecting the semiconductor element and the wiring board; a first wall body having light-blocking properties and disposed between the bonding wire and the light-receiving surface when viewed in the thickness direction of the wiring board;

2. a second wall body disposed farther from the light receiving surface than the bonding wire when viewed in the plate thickness direction; The sensor device according to claim 1 , wherein the first wall and the second wall are formed to a position higher than the bonding wire in the thickness direction.

3. The sensor device according to claim 1 , further comprising a cover that includes the first wall and covers the bonding wires from a side opposite to the wiring board.

4. The cover is The sensor device according to claim 3 , further comprising a second wall body disposed farther from the light receiving surface than the bonding wire when viewed in the thickness direction.

5. The cover includes:

4. The sensor device according to claim 3, further comprising a vent opening communicating with the housing space for housing the bonding wire.

6. The sensor device according to claim 5 , wherein the vent hole is provided with a valve.

7. The vent is a first hole formed closer to the accommodation space in the plate thickness direction; a second hole communicating with the first hole and having an inner diameter larger than that of the first hole; The sensor device according to claim 6 , wherein the valve is disposed on a step surface formed between the first hole and the second hole.

8. 3. The sensor device according to claim 2, wherein the bonding wires are covered with a resin having a light-shielding property.

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