Inductor component

Abstract

To easily fill a gap between wires with a magnetic layer.SOLUTION: An inductor component 10 comprises an element assembly 11 having a first principal surface 11A and including a magnetic layer, an inductor wire 40, and a columnar wire 50. The inductor wire 40 includes a pair of pad parts 41 which are positioned in both ends of the inductor wire 40 and to which a first end of the columnar wire 50 is connected, and a linear wire body 42 which connects the pair of pad parts 41. The wire body 42 includes two or more parallel portions extending while keeping mutually equal intervals in a direction parallel to the first principal surface 11A. When an axis orthogonal to the first principal surface 11A is defined as a first axis X and an axis orthogonal to the first axis X and in a direction where parallel portions P are disposed side by side is defined as a second axis, in a perspective view in a direction along the first axis, a first interval H1 which is a shortest interval between the pad part 41 and the wire body 42 in a direction along a second axis Y is larger than a second interval H2 which is a shortest interval between the parallel portions P in the direction along the second axis Y.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an inductor component. [Background technology]

[0002] The inductor component disclosed in Patent Document 1 includes an element body having a main surface, an inductor wiring, and a columnar wiring. The element body has a magnetic layer. The inductor wiring extends parallel to the main surface within the magnetic layer. The columnar wiring extends in a direction intersecting the main surface. The columnar wiring extends from an end of the inductor wiring to the main surface of the element body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-38242 Summary of the Invention [Problem to be solved by the invention]

[0004] In an inductor component such as that described in Patent Document 1, a magnetic layer is present in the gaps between adjacent inductor wiring portions parallel to the main surface of the element body. If the height of this gap is excessively large compared to the width, it is difficult to fill the entire gap with the magnetic layer. As a result, spaces not filled with the magnetic layer may occur in the gaps between the inductor wiring portions. [Means for solving the problem]

[0005] In order to solve the above problem, the present invention provides an inductor component comprising: an element body having a main surface and including a magnetic layer; an inductor wiring extending within the element body parallel to the main surface; and a pillar-shaped wiring extending within the element body in a direction intersecting the main surface, wherein the inductor wiring has a pair of pad portions located at both ends of the inductor wiring and connected to first ends of the pillar-shaped wiring; and a linear wiring body connecting the pair of pad portions, wherein the wiring body has two or more parallel portions extending at equal intervals from each other in a direction parallel to the main surface, wherein an axis perpendicular to the main surface is defined as a first axis, and an axis perpendicular to the first axis and along a direction in which the parallel portions are arranged is defined as a second axis, and when viewed in a perspective view along the first axis, a first interval which is the shortest interval between the pad portion and the wiring body in a direction along the second axis is larger than a second interval which is the shortest interval between the parallel portions in a direction along the second axis.

[0006] Furthermore, in order to achieve the above object, the present invention provides an element body having a main surface and including a magnetic layer, a plurality of inductor wirings extending within the element body parallel to the main surface and aligned in a direction perpendicular to the main surface, and pillar-shaped wirings extending within the element body in a direction intersecting the main surface, each of the inductor wirings having a pair of pad portions located at both ends of the inductor wiring and connected to first ends of the pillar-shaped wirings, and a linear wiring body connecting the pair of pad portions, each of the wiring bodies having two or more parallel portions extending at equal intervals from each other in a direction parallel to the main surface, and the pad portion in the inductor wiring is defined as a specific pad portion, the pillar-shaped wiring extending from the specific pad portion toward the main surface is defined as a specific pillar-shaped wiring, an axis perpendicular to the main surface is defined as a first axis, and an axis perpendicular to the first axis and along the direction in which the parallel portions are arranged is defined as a second axis, the inductor component has two or more wiring overlapping regions where the parallel portions of the wiring bodies overlap when viewed in a direction along the first axis, and a third interval which is the shortest interval between the specific pad portion and the wiring overlapping region in a direction along the second axis when viewed in a direction along the first axis is larger than a fourth interval which is the shortest interval between the wiring overlapping regions in a direction along the second axis. [Effects of the Invention]

[0007] According to the above configuration, the gap between the pillar-shaped wiring and the wiring main body adjacent to the pillar-shaped wiring is sufficiently large, so that the magnetic layer can be easily filled between the pillar-shaped wiring and the wiring main body. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a see-through perspective view of an inductor component according to a first embodiment. [Figure 2] FIG. 2 is a transparent plan view of the inductor component of the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view of a specific cross section of the inductor component taken along line 3-3 in FIG. [Figure 4]FIG. 4 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 5] FIG. 5 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 6] FIG. 6 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 7] FIG. 7 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 8] FIG. 8 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 9] FIG. 9 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 10] FIG. 10 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 11] FIG. 11 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 12] FIG. 12 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 13] FIG. 13 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 14] FIG. 14 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 15] FIG. 15 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 16] FIG. 16 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 17] FIG. 17 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 18] FIG. 18 is an explanatory diagram of a method for manufacturing the inductor component of the first embodiment. [Figure 19] FIG. 19 is an exploded perspective view of the inductor component of the second embodiment. [Figure 20] FIG. 20 is a transparent plan view of the inductor component of the second embodiment. [Figure 21]FIG. 21 is a cross-sectional view of a specific cross section of the inductor component taken along line 21-21 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, first and second embodiments of the inductor component will be described with reference to the drawings. Note that the drawings may show components enlarged to facilitate understanding. The dimensional ratios of the components may differ from those in the actual drawings or from those in other drawings.

[0010] (Regarding the first embodiment) <Overall structure> 1, the inductor component 10 has a generally rectangular parallelepiped shape. The inductor component 10 includes an element body 11.

[0011] The element body 11 has six planar outer surfaces. One of these six outer surfaces is designated as the first main surface 11A. The surface located opposite the first main surface 11A and parallel to the first main surface 11A is designated as the second main surface 11B. The outer shapes of the first main surface 11A and the second main surface 11B are both rectangular. Note that "parallel" includes manufacturing errors and the like. In other words, "parallel" means that the difference from the average value of the spacing between the components is within a predetermined range. The predetermined range is, for example, 10% or less. In this embodiment, the first main surface 11A is the mounting surface that faces the substrate when the inductor component 10 is mounted on the substrate.

[0012] Here, an axis perpendicular to the first main surface 11A is defined as the first axis X. An axis perpendicular to the first axis X and parallel to a specific side of the first main surface 11A (in this embodiment, a long side of the first main surface 11A) is defined as the second axis Y. The second axis Y is an axis along the direction in which the parallel portions P, which will be described later, are arranged. An axis perpendicular to the first axis X and the second axis Y is defined as the third axis Z. A direction along the first axis X in which the first main surface 11A faces is defined as the first positive direction X1, and a direction opposite to the first positive direction X1 is defined as the first negative direction X2. In this embodiment, the first positive direction X1 coincides with the direction from the inductor wiring 40, which will be described later, toward the first main surface 11A. A specific direction along the second axis Y is defined as the second positive direction Y1, and a direction opposite to the second positive direction Y1 is defined as the second negative direction Y2. Furthermore, one specific direction along the third axis Z is defined as a third positive direction Z1, and the direction opposite to the third positive direction Z1 is defined as a third negative direction Z2.

[0013] As shown in FIG. 3, the element body 11 includes a first magnetic layer 21, a second magnetic layer 22, a third magnetic layer 23, and a fourth magnetic layer 24 as magnetic layers 20. The first magnetic layer 21 to the fourth magnetic layer 24 are arranged in this order in the first positive direction X1. The surface of the first magnetic layer 21 facing the first negative direction X2 is the second main surface 11B. The surface of the fourth magnetic layer 24 facing the first positive direction X1 is the first main surface 11A. Note that in FIG. 3, the boundaries between the magnetic layers 20 are shown as virtual two-dot chain lines, but it may not be possible to observe clear boundaries between the magnetic layers 20. The magnetic layer 20 is made of an organic resin containing magnetic powder. That is, the element body 11 contains a magnetic material. In this embodiment, the magnetic powder is magnetic powder made of an Fe-based alloy or an amorphous alloy. More specifically, the magnetic powder is FeSiCr-based metal powder containing iron. The magnetic powder is not limited to FeSiCr-based magnetic powder, but may be FeCo-based, FeSiAr-based, iron oxide-based, or a combination thereof. The organic resin may be epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, or a combination thereof. The organic resin may contain inorganic fillers in addition to the above materials.

[0014] It is preferable that the smallest particle size of the magnetic powder is 1 μm or more. This dimensional relationship is expected to improve the efficiency of obtaining inductance values. Furthermore, the median particle size (D50) in the particle size distribution of the magnetic powder is 10 μm or less. In this embodiment, the median particle size (D50) in the particle size distribution of the magnetic powder is approximately 8 μm.

[0015] The median particle size (D50) of the magnetic powder is calculated, for example, as follows. First, the magnetic powder is sampled using a scanning electron microscope (SEM) to obtain the particle size distribution. Next, in the particle size distribution, the frequency of each particle size is integrated from the smallest particle size to the largest particle size. The particle size at which this integrated value reaches 50% is defined as the median particle size (D50).

[0016] The inductor component 10 includes an inductor wiring 40. The inductor wiring 40 is made of a conductive material. The composition of the inductor wiring 40 is, for example, a copper ratio of 99 wt% or more and a sulfur ratio of 0.1 wt% to 1.0 wt%. Note that the material of the inductor wiring 40 is not limited to a conductor whose main component is copper, but may also be a conductor whose main component is Ag, Al, or Au.

[0017] The inductor wiring 40 is located within the element body 11. The inductor wiring 40 is located in the same position as the third magnetic layer 23 in the direction along the first axis X. The inductor wiring 40 includes a seed layer 40A. The seed layer 40A constitutes the surface of the inductor wiring 40 on the first negative direction X2 side. The seed layer 40A is made of copper. As will be described later, electrolytic copper plating is performed on the seed layer 40A, whereby copper grows on the seed layer 40A, forming the entire inductor wiring 40. Note that, in the process of promoting the growth of the copper plating, the surface of the inductor wiring 40 on the first positive direction X1 side may become a curved surface that is convex toward the first positive direction X1 side. Note that the seed layer 40A is not shown in FIGS. 1 and 2.

[0018] As shown in FIG. 2, the inductor wiring 40 extends parallel to the first main surface 11A within the element body 11. In this embodiment, the inductor wiring 40 extends in a meandering manner. That is, the inductor wiring 40 extends while alternately turning clockwise and counterclockwise. The inductor wiring 40 has a pair of pad portions 41 and a wiring main body 42. The pair of pad portions 41 are located at both ends of the inductor wiring 40. Hereinafter, one of the pair of pad portions 41 will be referred to as a first end pad portion 41A. The other of the pair of pad portions 41 will be referred to as a second end pad portion 41B.

[0019] The first end pad portion 41A has a substantially rectangular shape when viewed through the element body 11 in the first negative direction X2. Two sides of the first end pad portion 41A are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. The first end pad portion 41A is located on the second positive direction Y1 side and the third positive direction Z1 side with respect to the geometric center of the element body 11.

[0020] The second end pad portion 41B has a substantially rectangular shape when viewed through the element body 11 in the first negative direction X2. Two sides of the second end pad portion 41B are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. The second end pad portion 41B is located on the second negative direction Y2 side and the third negative direction Z2 side with respect to the geometric center of the element body 11. That is, the pair of pad portions 41 are spaced apart from each other in a direction parallel to the first main surface 11A, specifically, in the direction along the second axis Y.

[0021] The wiring body 42 is linear and connects a pair of pad portions 41. The dimension of the wiring body 42 in the width direction perpendicular to the center line 40C is smaller than any of the sides of the pad portions 41 when viewed in the first negative direction X2.

[0022] The center line 40C of the wiring body 42 is determined as follows: When viewed in the first negative direction X2, the shortest line segment that can be drawn from any point on an edge of the wiring body 42 to the opposite edge is identified. The line connecting the points passing through the centers of these identified line segments is defined as the center line 40C of the wiring body 42 when viewed in the first negative direction X2.

[0023] The wiring body 42 has seven parallel portions P and six curved portions CV. The seven parallel portions P are the first parallel portion P1 to the seventh parallel portion P7. The six curved portions CV are the first curved portion CV1 to the sixth curved portion CV6. Each parallel portion P extends linearly along the third axis Z. As described above, each parallel portion P is aligned in the direction along the second axis Y.

[0024] The first parallel portion P1 is connected to the edge of the first end pad portion 41A on the third negative direction Z2 side. The first parallel portion P1 to the seventh parallel portion P7 are arranged in this order in the second negative direction Y2. The seventh parallel portion P7 is connected to the edge of the second end pad portion 41B on the third positive direction Z1 side. Adjacent parallel portions P extend at equal intervals in a direction parallel to the first main surface 11A. That is, adjacent parallel portions P extend parallel to each other. In addition, in the direction along the second axis Y, the interval between the first parallel portion P1 and the second parallel portion P2 is the same as the interval between the sixth parallel portion P6 and the seventh parallel portion P7. In addition, in the direction along the second axis Y, the interval between adjacent parallel portions P of the second parallel portion P2 to the sixth parallel portion P6 is the same.

[0025] The first curved portion CV1 connects the end of the first parallel portion P1 on the third negative direction Z2 side and the end of the second parallel portion P2 on the third negative direction Z2 side. The first curved portion CV1 is curved so as to convex toward the third negative direction Z2 side. The second curved portion CV2 connects the end of the second parallel portion P2 on the third positive direction Z1 side and the end of the third parallel portion P3 on the third positive direction Z1 side. The second curved portion CV2 is curved so as to convex toward the third positive direction Z1 side. The third curved portion CV3 connects the end of the third parallel portion P3 on the third negative direction Z2 side and the end of the fourth parallel portion P4 on the third negative direction Z2 side. The third curved portion CV3 is curved so as to convex toward the third negative direction Z2 side. The fourth curved portion CV4 connects the end of the fourth parallel portion P4 on the third positive direction Z1 side and the end of the fifth parallel portion P5 on the third positive direction Z1 side. The fourth curved portion CV4 is curved so as to convex toward the third positive direction Z1 side. The fifth curved portion CV5 connects the end of the fifth parallel portion P5 on the third negative direction Z2 side and the end of the sixth parallel portion P6 on the third negative direction Z2 side. The fifth curved portion CV5 is curved so as to convex toward the third negative direction Z2 side. The sixth curved portion CV6 connects the end of the sixth parallel portion P6 on the third positive direction Z1 side and the end of the seventh parallel portion P7 on the third positive direction Z1 side. The sixth curved portion CV6 is curved so as to convex toward the third positive direction Z1 side. In this way, when the element body 11 is seen through in the first negative direction X2, the wiring main body 42 extends in a meandering manner from the first end pad portion 41A toward the second end pad portion 41B.

[0026] The inductor component 10 includes two dummy wirings 40D. The material of the dummy wirings 40D is the same as that of the inductor wiring 40. The dummy wirings 40D are located in the same layer as the inductor wiring 40 within the element body 11. That is, the dummy wirings 40D are located in the same position as the third magnetic layer 23 in the direction along the first axis X.

[0027] One of the two dummy wirings 40D extends in the second positive direction Y1 from the edge of the first end pad portion 41A on the second positive direction Y1 side. The end of the dummy wiring 40D is exposed from the element body 11. The other of the two dummy wirings 40D extends in the second negative direction Y2 from the edge of the second end pad portion 41B on the second negative direction Y2 side. The end of the dummy wiring 40D is exposed from the element body 11.

[0028] As shown in Fig. 3, the inductor component 10 includes an insulating layer 30. The insulating layer 30 is located on the first negative direction X2 side with respect to the inductor wiring 40 and the two dummy wirings 40D. That is, the insulating layer 30 is located in the same position as the second magnetic layer 22 in the direction along the first axis X. As shown in Fig. 2, the insulating layer 30 extends along the inductor wiring 40 and the two dummy wirings 40D. When viewed in the first negative direction X2, the outer shape of the insulating layer 30 is slightly larger than the outer shape of the inductor wiring 40 and the outer shapes of each of the dummy wirings 40D.

[0029] As shown in FIG. 2, the inductor component 10 includes two columnar wirings 50 and two external electrodes 60. As shown in FIG. 3, each columnar wiring 50 extends in a direction intersecting the first main surface 11A. In this embodiment, each columnar wiring 50 extends in a direction perpendicular to the first main surface 11A. Each columnar wiring 50 is located on the first positive direction X1 side with respect to the inductor wiring 40. That is, each columnar wiring 50 is located at the same position as the fourth magnetic layer 24 in the direction along the first axis X. Each columnar wiring 50 is electrically connected to the inductor wiring 40. The material of each columnar wiring 50 is the same as the material of the inductor wiring 40.

[0030] The two pillar-shaped wirings 50 are a first pillar-shaped wiring 51 and a second pillar-shaped wiring 52. The first pillar-shaped wiring 51 is connected to the first end pad portion 41A. That is, a first end of the first pillar-shaped wiring 51 is connected to the first end pad portion 41A. The first pillar-shaped wiring 51 has a substantially quadrangular pillar shape. As shown in FIG. 2 , when viewed in the first negative direction X2, two sides of the first pillar-shaped wiring 51 are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. When viewed in the first negative direction X2, the outer shape of the first pillar-shaped wiring 51 is smaller than the outer shape of the first end pad portion 41A.

[0031] 3, the first columnar wire 51 extends from the first end pad portion 41A toward the first main surface 11A. That is, the first columnar wire 51 extends from the inductor wire 40 toward the first main surface 11A within the element body 11. A second end of the first columnar wire 51 is exposed from the first main surface 11A. In addition, the peripheral surface of the first columnar wire 51 is covered with the fourth magnetic layer 24 of the magnetic layer 20.

[0032] The second columnar wiring 52 is connected to the second end pad portion 41B. That is, a first end of the second columnar wiring 52 is connected to the second end pad portion 41B. The second columnar wiring 52 has a substantially quadrangular prism shape. As shown in FIG. 2, when viewed in the first negative direction X2, two sides of the second columnar wiring 52 are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. When viewed in the first negative direction X2, the outer shape of the second columnar wiring 52 is smaller than the outer shape of the second end pad portion 41B.

[0033] 3, the second columnar wire 52 extends from the second end pad portion 41B toward the first main surface 11A. That is, the second columnar wire 52 extends from the inductor wire 40 toward the first main surface 11A within the element body 11. A second end of the second columnar wire 52 is exposed from the first main surface 11A. In addition, the peripheral surface of the second columnar wire 52 is covered with the fourth magnetic layer 24 of the magnetic layer 20.

[0034] 1, each external electrode 60 is exposed from the element body 11. Specifically, each external electrode 60 is located on the first main surface 11A of the element body 11. That is, each external electrode 60 covers part of the outer surface of the element body 11. Although not shown in the figure, each external electrode 60 has a three-layer structure of Cu, Ni, and Au facing in the first positive direction X1.

[0035] 2, the two external electrodes 60 are a first external electrode 61 and a second external electrode 62. The first external electrode 61 is located on the first main surface 11A on the second positive direction Y1 side with respect to the geometric center of the first main surface 11A. The first external electrode 61 is connected to a second end of the first columnar wiring 51 that is exposed from the first main surface 11A.

[0036] The second external electrode 62 is located on the first main surface 11A on the second negative direction Y2 side with respect to the geometric center of the first main surface 11A. The second external electrode 62 is located symmetrically to the first external electrode 61 with respect to the center line of the first main surface 11A in the direction along the second axis Y. The second external electrode 62 is connected to the second end of the second columnar wiring 52 exposed from the first main surface 11A.

[0037] The inductor component 10 includes a solder resist 70. The solder resist 70 covers the surface of the element body 11 facing the first positive direction X1, excluding the two external electrodes 60. In other words, the first main surface 11A of the element body 11 is covered by the external electrodes 60 and the solder resist 70 and is not exposed. The solder resist 70 has higher insulating properties than the element body 11.

[0038] <About the dimensions of each wiring> As shown in FIG. 2, assume that the view is viewed in a direction along the first axis X. In this case, the shortest distance between the pad portion 41 and the wiring main body 42 in the direction along the second axis Y is defined as the first distance H1. In this embodiment, the first distance H1 is the shortest distance between the first end pad portion 41A and the parallel portion P in the direction along the second axis Y. Furthermore, when viewed in a direction along the first axis X, the shortest distance between the parallel portions P in the direction along the second axis Y is defined as the second distance H2. In this case, the first distance H1 is larger than the second distance H2. Note that in FIGS. 2 and 3, only some of the first distances H1 and second distances H2 are denoted by reference numerals.

[0039] As shown in FIG. 3, the inductor component 10 is viewed in a specific cross section that is perpendicular to the first main surface 11A and the center line 40C of each parallel portion P and includes one or more pad portions 41 and two or more parallel portions P. In this embodiment, the specific cross section is a cross section of the inductor component 10 taken along a plane that passes through the center of the first end pad portion 41A and is parallel to the first axis X and the second axis Y. The specific cross section in this embodiment includes the first end pad portion 41A and the second parallel portion P2 to the seventh parallel portion P7. That is, in this embodiment, the first interval H1 and the second interval H2 can be confirmed in the specific cross section. Therefore, the dimensional relationship between the wirings in the specific cross section will be described below.

[0040] When viewed in cross section at a specific cross section, the dimension of each parallel portion P in the direction along the second axis Y, i.e., the width dimension, is 64 μm. Also, when viewed in the same cross section, the dimension of each parallel portion P in the direction along the first axis X, i.e., the thickness dimension, is 40 μm.

[0041] When viewed in cross section at a specific cross section, the dimension of the first end pad portion 41A in the direction along the second axis Y is 200 μm. This dimension corresponds to the length of one side of the first end pad portion 41A when viewed in the first negative direction X2. Also, when viewed in the same cross section, the dimension of the first end pad portion 41A in the direction along the first axis X, i.e., the thickness dimension, is 40 μm. Note that the dimensions of the second end pad portion 41B are the same as the dimensions of the first end pad portion 41A.

[0042] When viewed in cross section at the specific cross section, the dimension of the first columnar wiring 51 in the direction along the second axis Y, i.e., the width dimension, is 150 μm. This dimension corresponds to the length of one side of the first columnar wiring 51 when viewed in the first negative direction X2. Also, when viewed in the same cross section, the dimension of the first columnar wiring 51 in the direction along the first axis X, i.e., the thickness dimension, is 65 μm. That is, when viewed in cross section at the specific cross section, the ratio of the maximum dimension of the first columnar wiring 51 in the direction perpendicular to the first main surface 11A to the maximum dimension of the first columnar wiring 51 in the direction parallel to the first main surface 11A is 2 or less. Specifically, this ratio is approximately 0.43.

[0043] 2, when viewed in a direction along the first axis X, the maximum dimension of the first columnar wiring 51 in a direction parallel to the first main surface 11A is the dimension of the diagonal of the first columnar wiring 51. This dimension is the diagonal dimension A. When viewed in a direction along the first axis X, the diagonal dimension A of the first columnar wiring 51 is 280 μm. When viewed in a direction along the first axis X, the ratio of the maximum dimension of the first columnar wiring 51 in the direction along the first axis X to the maximum dimension of the first columnar wiring 51 in a direction parallel to the first main surface 11A is 2 or less. Specifically, this ratio is approximately 0.23.

[0044] Here, as shown in FIG. 3, when viewed in a specific cross section, the first interval H1 is the shortest interval between the first end pad portion 41A and the wiring main body 42 in the direction along the second axis Y. That is, the first interval H1 is the interval between the first end pad portion 41A and the second parallel portion P2 in the specific cross section. The first interval H1 is 184 μm. When viewed in a specific cross section, the second interval H2 is the shortest interval between the parallel portions P in the direction along the second axis Y. That is, the second interval H2 is the interval between the adjacent second parallel portion P2 to sixth parallel portion P6 in the specific cross section. The second interval H2 is 103 μm. Thus, the first interval H1 is larger than the second interval H2.

[0045] As described above, the median particle size (D50) in the particle size distribution of the magnetic powder is 8 μm. Therefore, the median particle size (D50) in the particle size distribution of the magnetic powder is not more than one-fifth of the first interval H1. More specifically, the median particle size (D50) in the particle size distribution of the magnetic powder is not more than one-twentieth of the first interval H1.

[0046] Here, the distance from the surface of the first end pad portion 41A on the first negative direction X2 side to the second end of the first columnar wiring 51 on the first positive direction X1 side in the direction along the first axis X is defined as the post portion distance T1. The post portion distance T1 is 105 μm. In other words, the post portion distance T1 is at least twice the maximum dimension of the parallel portion P in the direction along the first axis X. Specifically, the post portion distance T1 is approximately 2.6 times the maximum dimension of the parallel portion P in the direction along the first axis X.

[0047] The average height is defined as the average value of the distance from the surface of the first end pad portion 41A on the first negative direction X2 side to the second end of the first columnar wiring 51 on the first positive direction X1 side in the direction along the first axis X and the maximum dimension of the parallel portion P in the direction along the first axis X. That is, the average height is the average value of the post portion distance T1 and the thickness dimension of the parallel portion P. In this embodiment, the average height is 72.5 μm. The ratio of the average height to the first interval H1 is defined as the first aspect ratio. The first aspect ratio is approximately 0.394.

[0048] The ratio of the maximum dimension of the parallel portion P in the direction along the first axis X to the second interval H2 is defined as the second aspect ratio. The second aspect ratio is approximately 0.388. In this embodiment, the ratio of the first aspect ratio to the second aspect ratio is approximately 1.015. That is, the ratio of the first aspect ratio to the second aspect ratio is 0.9 or more and 1.1 or less. Therefore, the first aspect ratio is approximately equal to the second aspect ratio, taking into account manufacturing errors and the like.

[0049] <Manufacturing methods for inductor components> Next, a description will be given of a method for manufacturing the inductor component 10. Note that in Figures 4 to 18, which explain the manufacturing method, the vicinity of the columnar wiring 50 is shown as a representative example.

[0050] As shown in FIG. 4, a base preparation step is first performed. Specifically, a plate-shaped base member BP is prepared. The material of the base member BP is ceramic. In the following description, it is assumed that the main surface of the base member BP is perpendicular to the first axis X. When viewed in the first negative direction X2, the base member BP has, for example, a rectangular shape. The dimensions of each side of the base member BP are such that multiple inductor components 10 can be accommodated. Next, a dummy insulating layer DIL is applied to the first positive direction X1 side of the base member BP, i.e., the entire upper surface. Note that in FIG. 4, the dummy insulating layer DIL is illustrated by a thick line.

[0051] Next, as shown in FIG. 5, a first insulating layer processing step is performed to form a base insulating layer BIL. The base insulating layer BIL is formed on the surface of the base member BP on the first positive direction X1 side. Specifically, the base insulating layer BIL is patterned. The patterning is performed in an area slightly larger than the area in which the inductor wiring 40 and the dummy wiring 40D are arranged. Specifically, the base insulating layer BIL is formed by photolithography.

[0052] Next, as shown in Fig. 6, a second insulating layer processing step is performed to form an insulating layer 30. The insulating layer 30 is formed on the surface of the base insulating layer BIL on the first positive direction X1 side. The shape of the insulating layer 30 is the same as that of the base insulating layer BIL. The insulating layer 30 is formed in the same manner as the above-mentioned base insulating layer BIL.

[0053] 7, a seed film formation step is performed to form a seed film MS. Specifically, a copper seed film MS is formed by sputtering over the entire surfaces of the base member BP and the insulating layer 30 on the first positive direction X1 side.

[0054] Next, as shown in FIG. 8, a first coating step is performed to form the first coating portion CP1. Specifically, first, a photosensitive dry film resist is applied to the entire surface of the seed film MS on the first positive direction X1 side. Next, the surface of the insulating layer 30 on the first positive direction X1 side is exposed to light and cured. This area is where the inductor wiring 40 and the dummy wirings 40D will not be formed. After that, the uncured portion of the applied dry film resist is peeled off and removed using a chemical solution. As a result, the cured portion of the applied dry film resist is formed as the first coating portion CP1. Note that the seed film MS is exposed in the portion of the applied dry film resist that has been removed by the chemical solution and is not covered by the first coating portion CP1.

[0055] Next, as shown in FIG. 9, an inductor wiring processing step is performed in which the inductor wiring 40 and each dummy wiring 40D are formed by electrolytic plating on the portion of the surface of the insulating layer 30 on the first positive direction X1 side that is not covered with the first covering portion CP1. Specifically, electrolytic copper plating is performed to grow copper from the exposed portion of the seed film MS. This forms the inductor wiring 40 and each dummy wiring 40D. Note that the dummy wiring 40D is not shown in FIG. 9.

[0056] Next, a first covering portion removing step is performed to remove the first covering portion CP1, as shown in Fig. 10. Specifically, the first covering portion CP1 is peeled off and removed using a chemical solution. 11, a second coating step is performed to form the second coating portion CP2. The area in which the second coating portion CP2 is formed is an area excluding a part of the inductor wiring 40. Specifically, the area is an area in which the columnar wirings 50 are not formed. The second coating portion CP2 is formed in this area by the same photolithography method as that used to form the first coating portion CP1.

[0057] 12, a columnar wiring processing step is performed to form the columnar wirings 50. Specifically, each columnar wiring 50 is formed on a portion of the surface of the inductor wiring 40 on the first positive direction X1 side that is not covered with the second covering portion CP2 by electrolytic copper plating, which is the same method as that used to form the inductor wiring 40. Thereafter, the end face of each columnar wiring 50 on the first positive direction X1 side is ground so that the dimension of each columnar wiring 50 in the direction along the first axis X becomes a desired dimension.

[0058] 13, a second coating removal step is performed to remove the second coating portion CP2. In the second coating removal step, the second coating portion CP2 and the portion of the seed film MS that was in contact with the second coating portion CP2 are removed by wet etching. As a result, only the portion of the inductor wiring 40 that will become the seed layer 40A that forms the surface on the first negative direction X2 side remains.

[0059] Next, as shown in FIG. 14, a first lamination step is performed to laminate the magnetic layers 20 other than the first magnetic layer 21. First, a resin containing magnetic powder, which is the material of the magnetic layer 20, is applied to the insulating layer 30 and the dummy insulating layer DIL on the first positive direction X1 side. Next, the resin containing magnetic powder is pressed to harden the resin containing magnetic powder, thereby forming the second magnetic layer 22, the third magnetic layer 23, and the fourth magnetic layer 24. At this time, the resin containing magnetic powder is pressed so that the surface of each columnar wiring 50 on the first positive direction X1 side is exposed and is flush with the surface of each columnar wiring 50 on the first positive direction X1 side. Note that in FIG. 14, the second magnetic layer 22 to the fourth magnetic layer 24 are indistinguishably illustrated as the magnetic layer 20.

[0060] 15, a main surface processing step is performed to form a solder resist 70. Specifically, an insulating material is patterned by photolithography on portions of the end surface of the fourth magnetic layer 24 on the first positive direction X1 side where the external electrodes 60 are not formed. As a result, the solder resist 70 is formed.

[0061] Next, as shown in Fig. 16, a base member removal step is performed. Specifically, first, a protective UV tape is attached to the surface of the solder resist 70 on the first positive direction X1 side. Then, the base member BP, the dummy insulating layer DIL, the base insulating layer BIL, and a portion of the magnetic layer 20 are all removed by scraping. Note that in the process of scraping the base insulating layer BIL, a portion of the insulating layer 30 on the first negative direction X2 side may be removed, but the inductor wiring 40 is not removed. Thereafter, the UV tape attached to the solder resist 70 is peeled off.

[0062] Next, as shown in FIG. 17 , a second lamination step is performed to laminate the first magnetic layer 21. Specifically, first, a resin containing magnetic powder, which is the material of the first magnetic layer 21, is applied to the surfaces of the second magnetic layer 22 and the insulating layer 30 facing the first negative direction X2. Then, the resin containing magnetic powder is hardened by pressing. Then, a UV tape is attached to the surface of the solder resist 70 facing the first positive direction X1 for protection. Then, the portion of the hardened resin facing the first negative direction X2 is scraped off. For example, the portion of the resin facing the first negative direction X2 is scraped off so that the dimension of the inductor component 10 in the direction along the first axis X of the inductor component 10 becomes a desired value. As a result, the first magnetic layer 21 is formed on the surfaces of the second magnetic layer 22 and the insulating layer 30 facing the first negative direction X2. Then, the UV tape attached to the solder resist 70 is peeled off. Note that in FIG. 17 , the first magnetic layer 21 to the fourth magnetic layer 24 are indistinguishably referred to as the magnetic layer 20.

[0063] Next, as shown in FIG. 18 , an electrode processing step is performed to form the external electrodes 60. The external electrodes 60 are formed in the areas of the surface of the fourth magnetic layer 24 on the first positive direction X1 side and the surfaces of each columnar wiring 50 on the first positive direction X1 side that are not covered with the solder resist 70. Copper, nickel, and gold are electrolessly plated in these areas. As a result, a first external electrode 61 and a second external electrode 62 are formed. Note that in FIG. 18 , the copper, nickel, and gold layers are not distinguished from one another. Although not shown, a portion of the external electrode 60 may cover a portion of the surface of the solder resist 70 on the first positive direction X1 side. After the electrode processing step, the inductor component 10 is diced into individual pieces to obtain the desired size.

[0064] <Effects of the First Embodiment> (1-1) In the above embodiment, the first interval H1 is larger than the second interval H2. That is, the interval between the pillar-shaped wiring 50 and the wiring main body 42 adjacent to the pillar-shaped wiring 50 is sufficiently large. With this configuration, even around a pillar-shaped wiring 50 whose dimension in the direction along the first axis X is relatively large, the magnetic layer 20 is likely to fill between the pillar-shaped wiring 50 and the wiring main body 42 adjacent to the pillar-shaped wiring 50. In this way, since the magnetic layer 20 is likely to fill between the pillar-shaped wiring 50 and the wiring main body 42 adjacent to the pillar-shaped wiring 50, it is possible to prevent the occurrence of a space between the pillar-shaped wiring 50 and the wiring main body 42 where the magnetic layer 20 is not filled.

[0065] Furthermore, one way to prevent the occurrence of a space between the columnar wiring 50 and the wiring body 42 is to increase the pressure when filling the magnetic layer 20 in the first lamination step or the like in the manufacturing process of the inductor component 10. With the above configuration, there is no need to excessively increase the pressure when filling the magnetic layer 20. Therefore, it is possible to prevent cracks from occurring in the magnetic layer 20 due to the load of the pressure when filling.

[0066] (1-2) In the above embodiment, the ratio of the first aspect ratio to the second aspect ratio is 0.9 or more and 1.1 or less. In this way, if the first aspect ratio and the second aspect ratio are approximately the same, it can be said that the ease of filling the magnetic layer 20 is approximately the same for each location. If the ease of filling the magnetic layer 20 is uniform, it is possible to prevent the occurrence of locations throughout the inductor component 10 where the magnetic layer 20 is not filled.

[0067] (1-3) The larger the ratio of the maximum dimension of the columnar wiring 50 in the direction along the first axis X to the maximum dimension of the columnar wiring 50 in the direction along the second axis Y when viewed in the first negative direction X2, the more difficult it is for the magnetic layer 20 to fill around the columnar wiring 50. In the above embodiment, this ratio is 2 or less. With this configuration, the magnetic layer 20 is more likely to fill the gap between the columnar wiring 50 and the parallel portion P.

[0068] (1-4) In the above embodiment, the post portion distance T1 is at least twice the maximum dimension of the parallel portion P in the direction along the first axis X. Thus, even in a configuration in which there is a difference between the post portion distance T1 and the height dimension of the parallel portion P, the magnetic layer 20 can be easily filled because the gap between the pillar-shaped wiring 50 and the parallel portion P is sufficiently large.

[0069] (1-5) The smaller the particle size of the magnetic powder, the more evenly it is distributed within the magnetic layer 20. In the above embodiment, the median particle size (D50) in the particle size distribution of the magnetic powder is 10 μm or less. With a median particle size (D50) of such dimensions, the magnetic powder is more likely to be distributed evenly within the magnetic layer 20.

[0070] (1-6) In the above embodiment, in the particle size distribution of the magnetic powder, the median particle size (D50) is equal to or less than one-fifth of the first interval H1. According to this dimensional relationship of the median particle size (D50), the magnetic powder is evenly distributed in the gap between the columnar wiring 50 and the parallel portion P.

[0071] (Regarding the second embodiment) Hereinafter, a second embodiment of the inductor component will be described, and explanations of the same configuration as the first embodiment will be omitted or simplified.

[0072] 19, the inductor component 100 has a generally rectangular parallelepiped shape. The inductor component 100 includes an element body 11. The element body 11 has six planar outer surfaces. Of these six outer surfaces, one specific surface is designated as a first main surface 11A. Furthermore, a surface located opposite the first main surface 11A and parallel to the first main surface 11A is designated as a second main surface 11B. The outer shapes of the first main surface 11A and the second main surface 11B are both rectangular. In this embodiment, the first main surface 11A is a mounting surface that faces a substrate when the inductor component 100 is mounted on the substrate.

[0073] Here, a first axis X, a second axis Y, and a third axis Z are defined as in the first embodiment. Also, as in the first embodiment, a first positive direction X1, a first negative direction X2, a second positive direction Y1, a second negative direction Y2, a third positive direction Z1, and a third negative direction Z2 are defined. Note that the first positive direction X1 coincides with the direction from each inductor wiring 110L (described later) toward the first main surface 11A. Also, the second axis Y is along the direction in which the parallel portion Q of the first inductor wiring 120 and the parallel portion R of the second inductor wiring 130 are aligned.

[0074] As shown in FIG. 21, the element body 11 includes seven magnetic layers 20. The seven magnetic layers 20 are a first magnetic layer 21 to a seventh magnetic layer 27. The first magnetic layer 21 to the seventh magnetic layer 27 are arranged in this order in the first positive direction X1. The surface of the first magnetic layer 21 facing the first negative direction X2 is the second main surface 11B. The surface of the seventh magnetic layer 27 facing the first positive direction X1 is the first main surface 11A. Note that in FIG. 21, the boundaries between the magnetic layers 20 are shown as virtual two-dot chain lines, but it may not be possible to observe clear boundaries between these magnetic layers 20. The material of the magnetic layers 20 is the same as that of the first embodiment. That is, the magnetic layers 20 contain magnetic powder.

[0075] <Inductor wiring> As shown in Fig. 19, the inductor element 100 includes a first inductor wiring 120 and a second inductor wiring 130 as the inductor wiring 110L. These two inductor wirings 110L are aligned in a direction perpendicular to the first main surface 11A. The material of each inductor wiring 110L is the same as that of the first embodiment. Note that in Fig. 19, the seed layer of the inductor wiring 110L is not shown.

[0076] The first inductor wiring 120 is located at the same location as the third magnetic layer 23 in the direction along the first axis X. The first inductor wiring 120 extends parallel to the first main surface 11A within the element body 11. In this embodiment, the first inductor wiring 120 extends in a meandering shape. The first inductor wiring 120 has a pair of first pad portions 121 and a first wiring main body 122. The pair of first pad portions 121 are located at both ends of the first inductor wiring 120. One of the pair of first pad portions 121 is referred to as a first end pad portion 121A. The other of the pair of first pad portions 121 is referred to as a second end pad portion 121B.

[0077] As shown in Fig. 20, the first end pad portion 121A of the first pad portion 121 has a substantially rectangular shape when the element body 11 is viewed in the first negative direction X2. In Fig. 20, the area corresponding to the first end pad portion 121A is indicated by a two-dot chain line. Two sides of the first end pad portion 121A are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. When the element body 11 is viewed in the first negative direction X2, the first end pad portion 121A is located on the second positive direction Y1 side and the third positive direction Z1 side with respect to the geometric center of the element body 11.

[0078] The second end pad portion 121B of the first pad portion 121 has a substantially rectangular shape when viewed through the element body 11 in the first negative direction X2. In Figure 20, the area corresponding to the second end pad portion 121B is shown by a two-dot chain line. Two sides of the second end pad portion 121B are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. When viewed through the element body 11 in the first negative direction X2, the second end pad portion 121B is located on the second negative direction Y2 side and the third positive direction Z1 side with respect to the geometric center of the element body 11.

[0079] 19, the first wiring main body 122 is linear. The first wiring main body 122 connects a pair of first pad portions 121. The dimension of the first wiring main body 122 in the width direction perpendicular to the center line thereof is smaller than either side of the first pad portion 121 when viewed in the first negative direction X2. The center line of the first wiring main body 122 is determined in the same manner as the center line 40C of the wiring main body 42 of the first embodiment.

[0080] As shown in FIG. 20 , the first wiring main body 122 has four parallel portions Q and three connection portions CW. The four parallel portions Q are a first parallel portion Q1, a second parallel portion Q2, a third parallel portion Q3, and a fourth parallel portion Q4. The parallel portions Q are aligned in a direction along the second axis Y. The parallel portions Q extend linearly along the third axis Z. As described above, the parallel portions Q extend equidistantly from one another in a direction parallel to the first main surface 11A. The three connection portions CW are a first connection portion CW1, a second connection portion CW2, and a third connection portion CW3. The connection portions CW extend linearly along the second axis Y.

[0081] The first parallel portion Q1 is connected to the edge of the first end pad portion 121A on the third negative direction Z2 side. The first parallel portion Q1 to the fourth parallel portion Q4 are arranged in this order in the second negative direction Y2. The fourth parallel portion Q4 is connected to the edge of the second end pad portion 121B on the third negative direction Z2 side. In addition, in the direction along the second axis Y, the distance between the first parallel portion Q1 and the second parallel portion Q2 is the same as the distance between the third parallel portion Q3 and the fourth parallel portion Q4. In addition, in the direction along the second axis Y, the distance between the second parallel portion Q2 and the third parallel portion Q3 is smaller than the distance between the first parallel portion Q1 and the second parallel portion Q2.

[0082] The first connection portion CW1 connects the end of the first parallel portion Q1 on the third negative direction Z2 side to the end of the second parallel portion Q2 on the third negative direction Z2 side. The second connection portion CW2 connects the end of the second parallel portion Q2 on the third positive direction Z1 side to the end of the third parallel portion Q3 on the third positive direction Z1 side. The third connection portion CW3 connects the end of the third parallel portion Q3 on the third negative direction Z2 side to the end of the fourth parallel portion Q4 on the third negative direction Z2 side.

[0083] As shown in FIG. 19, the second inductor wiring 130 is located at the same position as the fifth magnetic layer 25 in the direction along the first axis X. As shown in FIG. 19 , the second inductor wiring 130 extends parallel to the first main surface 11A within the element body 11. In this embodiment, the second inductor wiring 130 extends in a meandering shape. The second inductor wiring 130 has a pair of second pad portions 131 and a second wiring main body 132. The pair of second pad portions 131 are located at both ends of the second inductor wiring 130. One of the pair of second pad portions 131 is referred to as a first end pad portion 131A. The other of the pair of second pad portions 131 is referred to as a second end pad portion 131B.

[0084] As shown in Fig. 20, the first end pad portion 131A of the second pad portion 131 has a substantially rectangular shape when the element body 11 is viewed in the first negative direction X2. In Fig. 20, the area corresponding to the first end pad portion 131A is indicated by a two-dot chain line. Two sides of the first end pad portion 131A are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. When the element body 11 is viewed in the first negative direction X2, the first end pad portion 131A is located on the second positive direction Y1 side and the third negative direction Z2 side with respect to the geometric center of the element body 11.

[0085] The second end pad portion 131B of the second pad portion 131 has a substantially rectangular shape when viewed through the element body 11 in the first negative direction X2. In Fig. 20, the area corresponding to the second end pad portion 131B is shown by a two-dot chain line. Two sides of the second end pad portion 131B are parallel to the second axis Y, and the remaining two sides are parallel to the third axis Z. When viewed through the element body 11 in the first negative direction X2, the second end pad portion 131B is located on the second negative direction Y2 side and the third negative direction Z2 side with respect to the geometric center of the element body 11.

[0086] 19, the second wiring main body 132 is linear. The second wiring main body 132 connects a pair of second pad portions 131. The dimension of the second wiring main body 132 in the width direction perpendicular to the center line thereof is smaller than either side of the second pad portion 131 when viewed in the first negative direction X2. The center line of the second wiring main body 132 is determined in the same manner as the first wiring main body 122.

[0087] As shown in FIG. 20, the second wiring main body 132 has four parallel portions R and three connection portions CZ. The four parallel portions R are a first parallel portion R1, a second parallel portion R2, a third parallel portion R3, and a fourth parallel portion R4. Each parallel portion R extends linearly along the third axis Z. The parallel portions R extend at equal intervals in a direction parallel to the first main surface 11A. The three connection portions CZ are a first connection portion CZ1, a second connection portion CZ2, and a third connection portion CZ3. Each connection portion CZ extends linearly along the second axis Y.

[0088] The first parallel portion R1 is connected to the edge of the first end pad portion 131A on the third positive direction Z1 side. The first parallel portion R1 to the fourth parallel portion R4 are arranged in this order in the second negative direction Y2. The fourth parallel portion R4 is connected to the edge of the second end pad portion 131B on the third positive direction Z1 side. In addition, in the direction along the second axis Y, the distance between the first parallel portion R1 and the second parallel portion R2 is the same as the distance between the third parallel portion R3 and the fourth parallel portion R4. In addition, in the direction along the second axis Y, the distance between the second parallel portion R2 and the third parallel portion R3 is smaller than the distance between the first parallel portion R1 and the second parallel portion R2.

[0089] The first connection portion CZ1 connects the end of the first parallel portion R1 on the third positive direction Z1 side to the end of the second parallel portion R2 on the third positive direction Z1 side. The second connection portion CZ2 connects the end of the second parallel portion R2 on the third negative direction Z2 side to the end of the third parallel portion R3 on the third negative direction Z2 side. The third connection portion CZ3 connects the end of the third parallel portion R3 on the third positive direction Z1 side to the end of the fourth parallel portion R4 on the third positive direction Z1 side.

[0090] When viewed in the first negative direction X2, the first parallel portion R1 of the second wiring main body 132 overlaps with the first parallel portion Q1 of the first wiring main body 122. When viewed in the first negative direction X2, the second parallel portion R2 of the second wiring main body 132 overlaps with the second parallel portion Q2 of the first wiring main body 122. When viewed in the first negative direction X2, the third parallel portion R3 of the second wiring main body 132 overlaps with the third parallel portion Q3 of the first wiring main body 122. When viewed in the first negative direction X2, the fourth parallel portion R4 of the second wiring main body 132 overlaps with the fourth parallel portion Q4 of the first wiring main body 122.

[0091] <About pillar wiring> 19, the inductor element 100 includes four pillar-shaped wirings 140. Each pillar-shaped wiring 140 is electrically connected to the inductor wiring 110L. The material of each pillar-shaped wiring 140 is the same as the material of the inductor wiring 110L.

[0092] The four pillar-shaped wirings 140 are a first pillar-shaped wiring 141, a second pillar-shaped wiring 142, a third pillar-shaped wiring 143, and a fourth pillar-shaped wiring 144. Each pillar-shaped wiring 140 extends in a direction intersecting with the first main surface 11A. In the present embodiment, each pillar-shaped wiring 140 extends in a direction perpendicular to the first main surface 11A.

[0093] A first end of the first columnar wiring 141 is connected to the first end pad portion 121A of the first inductor wiring 120. The first columnar wiring 141 extends from the first end pad portion 121A toward the first main surface 11A. A second end of the first columnar wiring 141 is exposed from the first main surface 11A.

[0094] The first columnar wiring 141 includes a first via 141A, a first lead portion 141B, a second via 141C, and a second lead portion 141D. The first via 141A of the first columnar wiring 141 is located at the same position as the fourth magnetic layer 24 in the direction along the first axis X. The first via 141A has a quadrangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first via 141A overlaps a part of the first end pad portion 121A of the first pad portion 121. The dimension of the first via 141A in the direction along the second axis Y is smaller than the dimension of the first end pad portion 121A of the first pad portion 121 in the direction along the second axis Y. 21, a first end of the first via 141A on the first negative direction X2 side is connected to the first end pad portion 121A of the first pad portion 121. As shown in FIG. 21, a first end of the first via 141A on the first negative direction X2 side is connected to the first end pad portion 121A of the first pad portion 121.

[0095] As shown in FIG. 19, the first lead portion 141B of the first columnar wiring 141 is located at the same position as the fifth magnetic layer 25 in the direction along the first axis X. The first lead portion 141B has a quadrangular prism shape. As shown in FIG. 20, when viewed in the first negative direction X2, the first lead portion 141B overlaps with a part of the first end pad portion 121A of the first pad portion 121 and the first via 141A. The dimension of the first lead portion 141B in the direction along the second axis Y is smaller than the dimension of the first end pad portion 121A of the first pad portion 121 in the direction along the second axis Y. Furthermore, the dimension of the first lead portion 141B in the direction along the third axis Z is approximately the same as the dimension of the first end pad portion 121A of the first pad portion 121 in the direction along the third axis Z. When viewed in the first negative direction X2, the entire first lead portion 141B overlaps the first end pad portion 121A. As shown in Fig. 21, a first end of the first lead portion 141B on the first negative direction X2 side is connected to the first via 141A.

[0096] As shown in FIG. 19, the second via 141C of the first columnar wiring 141 is located at the same position as the sixth magnetic layer 26 in the direction along the first axis X. The second via 141C has a quadrangular prism shape. As shown in FIG. 20, when viewed in the first negative direction X2, the second via 141C overlaps with a part of the first lead portion 141B of the first columnar wiring 141 and a part of the first end pad portion 121A of the first pad portion 121. The second via 141C is located on the third positive direction Z1 side with respect to the first via 141A. The dimension of the second via 141C in the direction along the second axis Y is smaller than the dimension of the first end pad portion 121A of the first pad portion 121 in the direction along the second axis Y. 21, a first end of the second via 141C on the first negative direction X2 side is connected to the first lead-out portion 141B of the first columnar wiring 141. As shown in FIG. 21, a first end of the second via 141C on the first negative direction X2 side is connected to the first lead-out portion 141B of the first columnar wiring 141. The second via 141C has a dimension along the third axis Z that is smaller than the dimension along the second axis Y of the first end pad portion 121A of the first pad portion 121. When viewed in the first negative direction X2, the second via 141C entirely overlaps the first end pad portion 121A and the first lead-out portion 141B. As shown in FIG. 21, a first end of the second via 141C on the first negative direction X2 side is connected to the first lead-out portion 141B of the first columnar wiring 141.

[0097] 19, the second lead portion 141D of the first columnar wire 141 is located at the same position as the seventh magnetic layer 27 in the direction along the first axis X. The second lead portion 141D has a quadrangular prism shape. As shown in FIG. 20, when viewed in the first negative direction X2, the second lead portion 141D of the first columnar wire 141 overlaps with a part of the first end pad portion 121A of the first pad portion 121, a part of the first via 141A of the first columnar wire 141, a part of the first lead portion 141B, and the second via 141C. The dimension of the second lead portion 141D in the direction along the second axis Y is smaller than the dimension of the first end pad portion 121A of the first pad portion 121 in the direction along the second axis Y. The dimension of the second lead portion 141D in the direction along the third axis Z is smaller than the dimension of the first end pad portion 121A of the first pad portion 121 in the direction along the third axis Z. That is, when viewed in the first negative direction X2, the entire second lead portion 141D overlaps the first end pad portion 121A. As shown in FIG. 21 , a first end of the second lead portion 141D on the first negative direction X2 side is connected to the second via 141C. In addition, a surface of the second lead portion 141D on the first positive direction X1 side is exposed from the first main surface 11A.

[0098] 19, a first end of the second columnar wiring 142 is connected to the second end pad portion 121B of the first inductor wiring 120. The second columnar wiring 142 extends from the second end pad portion 121B toward the first main surface 11A. In addition, a second end of the second columnar wiring 142 is exposed from the first main surface 11A.

[0099] The second columnar wiring 142 includes a first via 142A, a first lead portion 142B, a second via 142C, and a second lead portion 142D. The first via 142A of the second columnar wiring 142 is located at the same position as the fourth magnetic layer 24 in the direction along the first axis X. The first via 142A has a rectangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first via 142A overlaps a portion of the second end pad portion 121B of the first pad portion 121. The dimension of the first via 142A in the direction along the second axis Y is smaller than the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the second axis Y. Furthermore, the dimension of the first via 142A in the direction along the third axis Z is smaller than the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the third axis Z. When viewed in the first negative direction X2, the entire first via 142A overlaps the second end pad portion 121B. As shown in FIG. 21, a first end of the first via 142A on the first negative direction X2 side is connected to the second end pad portion 121B of the first pad portion 121.

[0100] As shown in FIG. 19 , the first lead portion 142B of the second columnar wiring 142 is located at the same position as the fifth magnetic layer 25 in the direction along the first axis X. The first lead portion 142B has a rectangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first lead portion 142B overlaps with a part of the second end pad portion 121B of the first pad portion 121 and the first via 142A. The dimension of the first lead portion 142B in the direction along the second axis Y is smaller than the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the second axis Y. Furthermore, the dimension of the first lead portion 142B in the direction along the third axis Z is substantially the same as the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the third axis Z. When viewed in the first negative direction X2, the entire first lead portion 142B overlaps the second end pad portion 121B. As shown in Fig. 21, a first end of the first lead portion 142B on the first negative direction X2 side is connected to the first via 142A.

[0101] As shown in FIG. 19, the second via 142C of the second columnar wiring 142 is located at the same position as the sixth magnetic layer 26 in the direction along the first axis X. The second via 142C has a quadrangular prism shape. As shown in FIG. 20, when viewed in the first negative direction X2, the second via 142C overlaps with a part of the first lead portion 142B of the second columnar wiring 142 and a part of the second end pad portion 121B of the first pad portion 121. The second via 142C is located on the third positive direction Z1 side with respect to the first via 142A. The dimension of the second via 142C in the direction along the second axis Y is smaller than the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the second axis Y. 21, a first end of the second via 142C on the first negative direction X2 side is connected to the first lead-out portion 142B of the second columnar wiring 142. As shown in FIG. 21, a first end of the second via 142C on the first negative direction X2 side is connected to the first lead-out portion 142B of the second columnar wiring 142. The second via 142C has a dimension along the third axis Z that is smaller than the dimension along the second axis Y of the second end pad portion 121B of the first pad portion 121. When viewed in the first negative direction X2, the second via 142C entirely overlaps the second end pad portion 121B and the first lead-out portion 142B. As shown in FIG. 21, a first end of the second via 142C on the first negative direction X2 side is connected to the first lead-out portion 142B of the second columnar wiring 142.

[0102] 19, the second lead portion 142D of the second columnar wiring 142 is located at the same position as the seventh magnetic layer 27 in the direction along the first axis X. The second lead portion 142D has a quadrangular prism shape. As shown in FIG. 20, when viewed in the first negative direction X2, the second lead portion 142D overlaps with a part of the second end pad portion 121B of the first pad portion 121, a part of the first via 142A of the second columnar wiring 142, a part of the first lead portion 142B, and the second via 142C. The dimension of the second lead portion 142D in the direction along the second axis Y is smaller than the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the second axis Y. The dimension of the second lead portion 142D in the direction along the third axis Z is smaller than the dimension of the second end pad portion 121B of the first pad portion 121 in the direction along the third axis Z. That is, when viewed in the first negative direction X2, the entire second lead portion 142D overlaps the second end pad portion 121B. As shown in FIG. 21 , a first end of the second lead portion 142D on the first negative direction X2 side is connected to the second via 142C. In addition, a surface of the second lead portion 142D on the first positive direction X1 side is exposed from the first main surface 11A.

[0103] 19, a first end of the third columnar wiring 143 is connected to the first end pad portion 131A of the second inductor wiring 130. The third columnar wiring 143 extends from the first end pad portion 131A toward the first main surface 11A. A second end of the third columnar wiring 143 is exposed from the first main surface 11A.

[0104] The third columnar wiring 143 includes a first via 143A and a first lead portion 143B. The first via 143A of the third columnar wiring 143 is located at the same position as the sixth magnetic layer 26 in the direction along the first axis X. The first via 143A has a quadrangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first via 143A overlaps a part of the first end pad portion 131A of the second pad portion 131. The dimension of the first via 143A in the direction along the second axis Y is smaller than the dimension of the first end pad portion 131A of the second pad portion 131 in the direction along the second axis Y. Furthermore, the dimension of the first via 143A in the direction along the third axis Z is smaller than the dimension of the first end pad portion 131A of the second pad portion 131 in the direction along the third axis Z. 19, the first via 143A has a first end on the first negative direction X2 side connected to the first end pad 131A of the second pad 131.

[0105] The first lead portion 143B of the third columnar wiring 143 is located at the same position as the seventh magnetic layer 27 in the direction along the first axis X. The first lead portion 143B has a quadrangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first lead portion 143B overlaps with a part of the first end pad portion 131A of the second pad portion 131, the first via 143A, and a part of the insulating layer 150 (described later). The dimension of the first lead portion 143B in the direction along the second axis Y is smaller than the dimension of the first end pad portion 131A of the second pad portion 131 in the direction along the second axis Y. Furthermore, the dimension of the first lead portion 143B in the direction along the third axis Z is larger than the dimension of the first end pad portion 131A of the second pad portion 131 in the direction along the third axis Z. That is, when viewed in the first negative direction X2, the first lead portion 143B protrudes from the first end pad portion 131A. A part of the protruding portion overlaps the insulating layer 150. As shown in FIG. 19, a first end of the first lead portion 143B on the first negative direction X2 side is connected to the first via 143A. A surface of the first lead portion 143B on the first positive direction X1 side is exposed from the first main surface 11A.

[0106] The fourth columnar wiring 144 is connected to the second end pad portion 131B of the second inductor wiring 130. The fourth columnar wiring 144 extends from the second end pad portion 131B toward the first main surface 11A. A second end of the fourth columnar wiring 144 is exposed from the first main surface 11A.

[0107] The fourth columnar wiring 144 includes a first via 144A and a first lead portion 144B. The first via 144A of the fourth columnar wiring 144 is located at the same position as the sixth magnetic layer 26 in the direction along the first axis X. The first via 144A has a quadrangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first via 144A overlaps a portion of the second end pad portion 131B of the second pad portion 131. The dimension of the first via 144A in the direction along the second axis Y is smaller than the dimension of the second end pad portion 131B of the second pad portion 131 in the direction along the second axis Y. Furthermore, the dimension of the first via 144A in the direction along the third axis Z is smaller than the dimension of the second end pad portion 131B of the second pad portion 131 in the direction along the third axis Z. 19, the first via 144A has a first end on the first negative direction X2 side connected to the second end pad 131B of the second pad 131.

[0108] The first lead portion 144B of the fourth columnar wiring 144 is located at the same position as the seventh magnetic layer 27 in the direction along the first axis X. The first lead portion 144B has a quadrangular prism shape. As shown in FIG. 20 , when viewed in the first negative direction X2, the first lead portion 144B of the fourth columnar wiring 144 overlaps with a part of the second end pad portion 131B of the second pad portion 131, the first via 144A, and a part of the insulating layer 150 (described later). The dimension of the first lead portion 144B in the direction along the second axis Y is smaller than the dimension of the second end pad portion 131B of the second pad portion 131 in the direction along the second axis Y. Furthermore, the dimension of the first lead portion 144B in the direction along the third axis Z is larger than the dimension of the second end pad portion 131B of the second pad portion 131 in the direction along the third axis Z. That is, when viewed in the first negative direction X2, the first lead portion 144B protrudes from the second end pad portion 131B. A part of the protruding portion overlaps the insulating layer 150. As shown in FIG. 19, a first end of the first lead portion 144B on the first negative direction X2 side is connected to the first via 144A. A surface of the first lead portion 144B on the first positive direction X1 side is exposed from the first main surface 11A.

[0109] <Insulating layer and external electrodes> 19, the inductor component 100 includes five insulating layers 150. The insulating layers 150 are located inside the element body 11. The five insulating layers 150 are a first insulating layer 151 to a fifth insulating layer 155. The first insulating layer 151 to the fifth insulating layer 155 are arranged in this order in the first positive direction X1.

[0110] The second insulating layer 152 is located in the same location as the third magnetic layer 23 and the first inductor wiring 120 in the direction along the first axis X. When viewed in the first negative direction X2, the outer shape of the second insulating layer 152 is a substantially rectangular shape that is slightly smaller than the outer shape of the third magnetic layer 23. The outer shape of the second insulating layer 152 is slightly larger than the area surrounded by straight lines around the outermost edge of the first inductor wiring 120. In other words, when viewed in the first negative direction X2, the first inductor wiring 120 is located inside the second insulating layer 152. However, the second insulating layer 152 is not located in any of the three areas defined by the inductor wiring 110L. 19 and 20 , when viewed in the first negative direction X2, the second insulating layer 152 is not located in a rectangular area that is slightly smaller than the area defined by the first parallel portion Q1, the second parallel portion Q2, the first connecting portion CW1, and the first connecting portion CZ1. Furthermore, when viewed in the first negative direction X2, the second insulating layer 152 is not located in a rectangular area that is slightly smaller than the area defined by the second parallel portion Q2, the third parallel portion Q3, the second connecting portion CW2, and the second connecting portion CZ2. Furthermore, when viewed in the first negative direction X2, the second insulating layer 152 is not located in a rectangular area that is slightly smaller than the area defined by the third parallel portion Q3, the fourth parallel portion Q4, the third connecting portion CW3, and the third connecting portion CZ3.

[0111] 19, the first insulating layer 151 is located in the same location as the second magnetic layer 22 in the direction along the first axis X. When viewed in the first negative direction X2, the outline of the first insulating layer 151 is the same as the outline of the second insulating layer 152. Similarly to the second insulating layer 152, the first insulating layer 151 is not located in any of the three regions defined by the inductor wiring 110L.

[0112] The third insulating layer 153 is located in the same position as the fourth magnetic layer 24 in the direction along the first axis X. When viewed in the first negative direction X2, the outer shape of the third insulating layer 153 is the same as the outer shape of the second insulating layer 152. Similarly to the second insulating layer 152, the third insulating layer 153 is not located in the three regions defined by the inductor wiring 110L described above, nor in the region where the first via 141A of the first columnar wiring 141 and the first via 142A of the second columnar wiring 142 are located.

[0113] The fourth insulating layer 154 is located in the same location as the fifth magnetic layer 25 in the direction along the first axis X. When viewed see-through in the first negative direction X2, the outer shape of the fourth insulating layer 154 is the same as the outer shape of the second insulating layer 152. Similarly to the second insulating layer 152, the fourth insulating layer 154 is not located in the three regions defined by the inductor wiring 110L described above, nor in the region where the first drawn-out portion 141B of the first columnar wiring 141, the first drawn-out portion 142B of the second columnar wiring 142, and the second inductor wiring 130 are located.

[0114] The fifth insulating layer 155 is located in the same location as the sixth magnetic layer 26 in the direction along the first axis X. When viewed see-through in the first negative direction X2, the outer shape of the fifth insulating layer 155 is the same as the outer shape of the second insulating layer 152. Similarly to the second insulating layer 152, the fifth insulating layer 155 is not located in the three regions defined by the inductor wiring 110L described above, nor in the region where the second via 141C of the first columnar wiring 141, the second via 142C of the second columnar wiring 142, the first via 143A of the third columnar wiring 143, and the first via 144A of the fourth columnar wiring 144 are located.

[0115] 19, the inductor component 100 includes four external electrodes 160. Each external electrode 160 is located on the first main surface 11A. The layered structure of each external electrode 160 is the same as that of the first embodiment.

[0116] The four external electrodes 160 are a first external electrode 161, a second external electrode 162, a third external electrode 163, and a fourth external electrode 164. The first external electrode 161 is located on the first main surface 11A on the second positive direction Y1 side and in the third positive direction Z1 with respect to the geometric center of the first main surface 11A. The first external electrode 161 is connected to an end surface of the first columnar wiring 141 that is exposed from the first main surface 11A. That is, the first columnar wiring 141 electrically connects the first external electrode 161 to the first end pad portion 121A of the first pad portion 121 of the first inductor wiring 120.

[0117] The second external electrode 162 is located on the first main surface 11A on the second negative direction Y2 side and in the third positive direction Z1 with respect to the geometric center of the first main surface 11A. The second external electrode 162 is connected to an end surface of the second columnar wiring 142 that is exposed from the first main surface 11A. That is, the second columnar wiring 142 electrically connects the second external electrode 162 to the second end pad portion 121B of the first pad portion 121 of the first inductor wiring 120.

[0118] The third external electrode 163 is located on the first main surface 11A on the second positive direction Y1 side and the third negative direction Z2 side with respect to the geometric center of the first main surface 11A. The third external electrode 163 is connected to an end surface of the third columnar wiring 143 that is exposed from the first main surface 11A. That is, the third columnar wiring 143 electrically connects the first end pad portion 131A of the second pad portion 131 of the second inductor wiring 130 to the third external electrode 163.

[0119] The fourth external electrode 164 is located on the first main surface 11A on the second negative direction Y2 side and in the third negative direction Z2 with respect to the geometric center of the first main surface 11A. The fourth external electrode 164 is connected to an end surface of the fourth columnar wiring 144 that is exposed from the first main surface 11A. That is, the fourth columnar wiring 144 electrically connects the second end pad portion 131B of the second pad portion 131 of the second inductor wiring 130 to the fourth external electrode 164.

[0120] The inductor component 10 includes a solder resist 70. The solder resist 70 covers the first main surface 11A except for the four external electrodes 160. In other words, the first main surface 11A of the element body 11 is covered by the external electrodes 160 and the solder resist 70 and is not exposed. The solder resist 70 has higher insulating properties than the element body 11.

[0121] <About the wiring layer> 19, the inductor component 100 includes five wiring layers 110 extending parallel to the first main surface 11A within the element body 11. In this case, in a direction perpendicular to the first main surface 11A, the five wiring layers 110 are referred to as a first wiring layer 111, a second wiring layer 112, a third wiring layer 113, a fourth wiring layer 114, and a fifth wiring layer 115, in order from the side farthest from the first main surface 11A.

[0122] 19 , the first wiring layer 111 is composed of a first inductor wiring 120. The second wiring layer 112 is composed of a first via 141A of a first columnar wiring 141 and a first via 142A of a second columnar wiring 142. The third wiring layer 113 is composed of a second inductor wiring 130, a first lead-out portion 141B of the first columnar wiring 141, and a first lead-out portion 142B of the second columnar wiring 142. The fourth wiring layer 114 is composed of a second via 141C of the first columnar wiring 141, a second via 142C of the second columnar wiring 142, a first via 143A of a third columnar wiring 143, and a first via 144A of a fourth columnar wiring 144. The fifth wiring layer 115 is composed of a second extraction portion 141D of the first columnar wiring 141, a second extraction portion 142D of the second columnar wiring 142, a first extraction portion 143B of the third columnar wiring 143, and a first extraction portion 144B of the fourth columnar wiring 144.

[0123] <About the dimensions of each wiring> 20 and 21 , here, of the two inductor wirings 110L, a pad portion in the inductor wiring 110L that is farthest from the first main surface 11A in a direction perpendicular to the first main surface 11A is referred to as a specific pad portion SP. Also, a pillar wiring 140 connected to the specific pad portion SP is referred to as a specific pillar wiring SC. In the second embodiment, the specific pad portion SP is the first pad portion 121. Also, the specific pillar wiring SC is the first pillar wiring 141 and the second pillar wiring 142. In the following description, a first end pad portion 121A of the first pad portion 121 will be representatively referred to as the specific pad portion SP, and the first pillar wiring 141 will be representatively referred to as the specific pillar wiring SC.

[0124] As shown in FIG. 20 , the inductor component 100 has wire overlapping regions where the parallel portions of the wire main bodies overlap when viewed in a direction along the first axis X. In the second embodiment, the inductor component 100 has four wire overlapping regions. The four wire overlapping regions are the first wire overlapping region W1 to the fourth wire overlapping region W4. The first wire overlapping region W1 is the smallest region that includes the first parallel portion Q1 of the first wire main body 122 and the first parallel portion R1 of the second wire main body 132. The second wire overlapping region W2 is the smallest region that includes the second parallel portion Q2 of the first wire main body 122 and the second parallel portion R2 of the second wire main body 132. The third wire overlapping region W3 is the smallest region that includes the third parallel portion Q3 of the first wire main body 122 and the third parallel portion R3 of the second wire main body 132. The fourth wiring overlap region W4 is the smallest region that includes the fourth parallel portion Q4 of the first wiring main body 122 and the fourth parallel portion R4 of the second wiring main body 132. In Fig. 21, the second wiring overlap region W2 and the third wiring overlap region W3 are each illustrated by a two-dot chain line.

[0125] 20, when viewed in a direction along the first axis X, the shortest distance between the specific pad portion SP and the wiring overlapping region in the direction along the second axis Y is defined as the third distance H3. That is, the third distance H3 is the distance between the first end pad portion 121A and the second wiring overlapping region W2 in the direction along the second axis Y. In this embodiment, the third distance H3 is 170 μm. Note that in this embodiment, the distance between the first end pad portion 121A and the second wiring overlapping region W2 in the direction along the second axis Y is the same as the distance between the second end pad portion 121B and the third wiring overlapping region W3 in the direction along the second axis Y.

[0126] Furthermore, when viewed in a direction along the first axis X, the shortest distance between the wiring overlapping regions in the direction along the second axis Y is defined as the fourth distance H4. In other words, the fourth distance H4 is the distance between the second wiring overlapping region W2 and the third wiring overlapping region W3 in the direction along the second axis Y. The fourth distance H4 is 140 μm. In this way, the third distance H3 is larger than the fourth distance H4.

[0127] Here, the cross section is assumed to be perpendicular to the first main surface 11A and the center line of each parallel portion, and includes one or more specific pad portions SP and two or more wiring overlapping regions. The specific cross section in this embodiment includes the specific pad portions SP, the second wiring overlapping region W2, and the third wiring overlapping region W3.

[0128] Here, the distance from the surface of the specific pad portion SP on the first negative direction X2 side to the second end of the specific columnar wiring SC on the first positive direction X1 side in the direction along the first axis X is defined as the fifth-layer distance T3. In this embodiment, the distance from the first end pad portion 121A of the first pad portion 121 to the second lead portion 141D of the first columnar wiring 141 is the same as the distance from the second end pad portion 121B of the first pad portion 121 to the second lead portion 142D of the second columnar wiring 142. Therefore, in the following description, the distance from the surface of the first end pad portion 121A of the first pad portion 121 on the first negative direction X2 side to the surface of the second lead portion 141D of the first columnar wiring 141 on the first positive direction X1 side is defined as the fifth-layer distance T3. The fifth-layer distance T3 is 450 μm.

[0129] Furthermore, the maximum dimension T2 of the wiring overlapping region in the direction along the first axis X is 300 μm. The average value of the five-layer distance T3 and the maximum dimension T2 of the wiring overlapping region in the direction along the first axis X is defined as the average distance. The average distance is 375 μm.

[0130] Here, the ratio of the average distance to the third interval H3 is defined as the third aspect ratio. The third aspect ratio is approximately 2.21. The ratio of the maximum dimension T2 of the wiring overlapping region in the direction along the first axis X to the fourth interval H4 is defined as the fourth aspect ratio. The fourth aspect ratio is approximately 2.14. In this embodiment, the ratio of the third aspect ratio to the fourth aspect ratio is approximately 1.03. That is, the ratio of the third aspect ratio to the fourth aspect ratio is equal to or greater than 0.9 and equal to or less than 1.1.

[0131] <Effects of the second embodiment> (2-1) In the above embodiment, the third distance H3 is larger than the fourth distance H4. That is, the distance between the specific pad portion SP and the second wiring overlap region W2 in the direction along the second axis Y is sufficiently large. In other words, the distance between the specific pad portion SP connected to the first columnar wiring 141, which has a larger dimension in the direction along the first axis X among the columnar wirings 140, and the parallel portions of the inductor wirings 110L adjacent to the specific pad portion SP is sufficiently large. With this configuration, the magnetic layer 20 is easily filled between the specific pad portion SP and the wiring overlap region. In this way, since the magnetic layer 20 is easily filled between the specific pad portion SP and the wiring overlap region, it is possible to prevent the occurrence of a space between the specific pad portion SP and the wiring overlap region where the magnetic layer 20 is not filled.

[0132] Furthermore, one way to prevent the occurrence of a space between the specific pad portion SP and the wiring overlapping region is to increase the pressure when filling the magnetic layer 20 in the manufacturing process of the inductor component 100. With the above configuration, there is no need to excessively increase the pressure when filling the magnetic layer 20. Therefore, it is possible to prevent cracks from occurring in the magnetic layer 20 due to the load of the pressure when filling.

[0133] (2-2) In the above embodiment, the ratio of the third aspect ratio to the fourth aspect ratio is 0.9 or more and 1.1 or less. In this way, if the third aspect ratio and the fourth aspect ratio are approximately the same, it can be said that the ease of filling the magnetic layer 20 is approximately the same for each location. If the ease of filling the magnetic layer 20 is uniform, it is possible to prevent the occurrence of locations throughout the inductor component 100 where the magnetic layer 20 is not filled.

[0134] <Example of change> The above-described embodiments can be modified as follows: The first embodiment, the second embodiment, and the following modifications can be combined and implemented within the scope of technical compatibility.

[0135] In the first embodiment, the element body 11 of the inductor component 10 does not have to contain magnetic powder. For example, the material of the element body 11 may be a photosensitive resin material such as polyimide, ceramic, or glass. This also applies to the element body 11 of the inductor component 100 of the second embodiment.

[0136] In the first embodiment, the columnar wirings 50 do not necessarily extend in a direction perpendicular to the first main surface 11A, but may extend in a direction intersecting the first main surface 11A. This also applies to the columnar wirings 140 of the second embodiment.

[0137] In the first embodiment, the shape of each of the columnar wirings 50 when viewed in a direction perpendicular to the first main surface 11A is not limited to the example of the above embodiment. For example, each of the columnar wirings 50 may have a cylindrical shape. This also applies to the columnar wirings 140 of the second embodiment.

[0138] In the first embodiment, the shape of the inductor wiring 40 is not limited to a meandering shape. The wiring body 42 of the inductor wiring 40 may have two or more parallel portions P extending parallel to each other between a pair of pad portions 41 in a direction parallel to the first main surface 11A. For example, the inductor wiring 40 may be a spiral wiring having a spiral shape extending parallel to the first main surface 11A. This also applies to the wiring body of each inductor wiring 110L in the second embodiment.

[0139] In the first embodiment, the inductor component 10 does not necessarily have to have the external electrode 60. In that case, the portion of the columnar wiring 50 exposed on the first main surface 11A may be used as an electrode. This also applies to the inductor component 100 of the second embodiment.

[0140] In the first embodiment, each external electrode 60 does not have to be configured with multiple layers stacked together. For example, in the above embodiment, each external electrode 60 may be configured with a single metal layer. Furthermore, each external electrode 60 may further include layers made of different materials. This also applies to the external electrode 160 of the second embodiment.

[0141] In the first embodiment, the first interval H1 is not limited to the shortest interval between the first end pad portion 41A and the parallel portion P in the direction along the second axis Y. In other words, the wiring main body 42 adjacent to the first end pad portion 41A in the direction along the second axis Y does not have to be the parallel portion P. In other words, the first interval H1 only needs to be the shortest interval between the first end pad portion 41A and the wiring main body 42 in the direction along the second axis Y when viewed in a see-through manner in the direction along the first axis X.

[0142] In the first embodiment, the ratio of the first aspect ratio to the second aspect ratio may be less than 0.9, or may be greater than 1.1.

[0143] In the first embodiment, the ratio of the maximum dimension of the columnar wiring 50 in the direction along the first axis X to the maximum dimension of the columnar wiring 50 in the direction parallel to the first main surface 11A when facing the first negative direction X2 may be greater than 2.

[0144] In the first embodiment, the post portion distance T1 may be less than twice the maximum dimension of the parallel portion P in the direction perpendicular to the first main surface 11A. In the first embodiment, the median particle size (D50) in the particle size distribution of the magnetic powder may be greater than 10 μm. Also, the median particle size (D50) in the particle size distribution of the magnetic powder may be greater than one-fifth of the first interval H1.

[0145] In the first embodiment, the smallest particle size of the magnetic powder is not limited to 1 μm or more. In the second embodiment, a part of the inductor wiring 110L may not be covered with the insulating layer 150 and may be in contact with the magnetic layer 20.

[0146] In the second embodiment, the ratio of the third aspect ratio to the fourth aspect ratio may be less than 0.9, or may be greater than 1.1.

[0147] In the second embodiment, the number of wiring overlapping regions is not limited to four. The inductor component 100 may have two or more wiring overlapping regions. In the second embodiment, the inductor element 100 may further include a different inductor wiring in addition to the first inductor wiring 120 and the second inductor wiring 130. In this case, the multiple inductor wirings may be arranged in the direction along the first axis X.

[0148] <Additional Notes> The technical ideas that can be understood from the above-described embodiment and modified examples will be described. [1] An inductor component comprising: an element body having a main surface and including a magnetic layer; inductor wiring extending within the element body parallel to the main surface; and pillar-shaped wiring extending within the element body in a direction intersecting the main surface, wherein the inductor wiring has a pair of pads located at both ends of the inductor wiring and connected to first ends of the pillar-shaped wiring; and a linear wiring body connecting the pair of pads, wherein the wiring body has two or more parallel portions extending at equal intervals from each other in a direction parallel to the main surface, wherein an axis perpendicular to the main surface is defined as a first axis, and an axis perpendicular to the first axis and along a direction in which the parallel portions are arranged is defined as a second axis, and when viewed in a perspective view along the first axis, a first interval which is the shortest interval between the pad portion and the wiring body in a direction along the second axis is larger than a second interval which is the shortest interval between the parallel portions in a direction along the second axis.

[0149] [2] The columnar wiring extends from the inductor wiring toward the main surface, and among the directions along the first axis, the direction from the inductor wiring toward the main surface is defined as a positive direction, and the opposite direction is defined as a negative direction. The average value of the distance from the surface of the pad portion on the negative side in the direction along the first axis to a second end of the columnar wiring on the positive side and the maximum dimension of the parallel portions in a direction perpendicular to the main surface is defined as an average height dimension, a first aspect ratio is defined as a ratio of the average height dimension to the first spacing, and a second aspect ratio is defined as a ratio of the maximum dimension of the parallel portions in the direction along the first axis to the second spacing, wherein the ratio of the first aspect ratio to the second aspect ratio is 0.9 or more and 1.1 or less.

[0150] [3] An inductor component according to [1] or [2], wherein the ratio of the maximum dimension of the columnar wiring in a direction parallel to the main surface when viewed in a direction along the first axis to the maximum dimension of the columnar wiring in a direction parallel to the first axis is 2 or less.

[0151] [4] An inductor component according to any one of [1] to [3], wherein, when the direction from the inductor wiring toward the main surface is defined as a positive direction and the opposite direction as a negative direction in the direction along the first axis, the distance from the negative side surface of the pad portion in the direction along the first axis to the second end of the columnar wiring on the positive side is at least twice the maximum dimension of the parallel portion in the direction along the first axis.

[0152] [5] The inductor component according to any one of [1] to [4], wherein the magnetic layer contains magnetic powder, and the median particle size (D50) in the particle size distribution of the magnetic powder is 10 μm or less. [6] The inductor component according to any one of [1] to [5], wherein the magnetic layer contains magnetic powder, and the median particle size (D50) in the particle size distribution of the magnetic powder is one-fifth or less of the first interval.

[0153] [7] An element body having a main surface and including a magnetic layer, a plurality of inductor wirings extending within the element body parallel to the main surface and aligned in a direction perpendicular to the main surface, and pillar-shaped wirings extending within the element body in a direction intersecting the main surface, each of the inductor wirings having a pair of pad portions located at both ends of the inductor wiring and connected to first ends of the pillar-shaped wirings, and a linear wiring body connecting the pair of pad portions, each of the wiring bodies having two or more parallel portions extending at equal intervals from each other in a direction parallel to the main surface, and the inductor wiring furthest from the main surface in a direction perpendicular to the main surface among the plurality of inductor wirings an inductor component having two or more wiring overlapping regions where the parallel portions of each wiring body overlap when viewed in a direction along the first axis, where the pad portion in the line is defined as a specific pad portion, the columnar wiring extending from the specific pad portion toward the main surface is defined as a specific columnar wiring, an axis perpendicular to the main surface is defined as a first axis, and an axis perpendicular to the first axis and along the direction in which the parallel portions are arranged is defined as a second axis, and wherein when viewed in a direction along the first axis, a third interval which is the shortest interval between the specific pad portion and the wiring overlapping region in the direction along the second axis is larger than a fourth interval which is the shortest interval between the wiring overlapping regions in the direction along the second axis.

[0154] [8] Inductor component according to [7], when the direction along the first axis from each inductor wiring toward the main surface is defined as a positive direction and the opposite direction is defined as a negative direction, the average value of the distance from the surface of the specific pad on the negative side in the direction along the first axis to the second end of the specific columnar wiring on the positive side and the maximum dimension of the wiring overlapping region in the direction along the first axis is defined as an average distance, the ratio of the average distance to the third spacing is defined as a third aspect ratio, and the ratio of the maximum dimension of the wiring overlapping region in the direction along the first axis to the fourth spacing is defined as a fourth aspect ratio, the ratio of the third aspect ratio to the fourth aspect ratio is 0.9 or more and 1.1 or less. [Explanation of symbols]

[0155] H1…1st interval H2…Second interval P...parallel part 10...Inductor components 11...Base body 11A…1st main surface 11B…Second main surface 20...Magnetic layer 41...Pad section 42...Wiring body 40C…center line 40D...Dummy wiring 50…Column wiring

Claims

1. an element body having a main surface and including a magnetic layer; an inductor wiring extending parallel to the main surface within the element body; pillar-shaped wirings extending in a direction intersecting the main surface within the element body; Equipped with the inductor wiring has a pair of pad portions located at both ends of the inductor wiring and connected to first ends of the pillar-shaped wirings, and a line-shaped wiring main body connecting the pair of pad portions, the wiring body has two or more parallel portions extending at equal intervals in a direction parallel to the main surface, an axis perpendicular to the main surface is defined as a first axis, and an axis perpendicular to the first axis and along the direction in which the parallel portions are arranged is defined as a second axis; When viewed in a direction along the first axis, a first interval that is the shortest interval between the pad portion and the wiring main body in a direction along the second axis is larger than a second interval that is the shortest interval between the parallel portions in a direction along the second axis. Inductor components.

2. the pillar-shaped wiring extends from the inductor wiring toward the main surface, Among the directions along the first axis, a direction from the inductor wiring toward the main surface is defined as a positive direction, and an opposite direction is defined as a negative direction; an average value of a distance from a surface of the pad portion on the negative side in a direction along the first axis to a second end of the pillar-shaped wiring on the positive side and a maximum dimension of the parallel portion in a direction perpendicular to the main surface is defined as an average height dimension; a ratio of the average height dimension to the first interval is a first aspect ratio; When a ratio of a maximum dimension of the parallel portions in a direction along the first axis to the second interval is defined as a second aspect ratio, The ratio of the first aspect ratio to the second aspect ratio is 0.9 or more and 1.1 or less. The inductor component according to claim 1 .

3. a ratio of a maximum dimension of the pillar wiring in a direction along the first axis to a maximum dimension of the pillar wiring in a direction parallel to the main surface when viewed in a direction along the first axis is 2 or less; The inductor component according to claim 1 .

4. When the direction along the first axis from the inductor wiring toward the main surface is defined as a positive direction and the opposite direction is defined as a negative direction, The distance from the negative side surface of the pad portion to the positive side second end of the pillar-shaped wiring in the direction along the first axis is equal to or greater than twice the maximum dimension of the parallel portion in the direction along the first axis. The inductor component according to claim 1 .

5. the magnetic layer contains magnetic powder, The median particle size (D50) in the particle size distribution of the magnetic powder is 10 μm or less. The inductor component according to claim 1 .

6. the magnetic layer contains magnetic powder, The median particle size (D50) in the particle size distribution of the magnetic powder is equal to or less than one-fifth of the first interval. The inductor component according to claim 1 .

7. an element body having a main surface and including a magnetic layer; a plurality of inductor wirings extending parallel to the main surface within the element body and aligned in a direction perpendicular to the main surface; pillar-shaped wirings extending in a direction intersecting the main surface within the element body; Equipped with each of the inductor wirings has a pair of pad portions located at both ends of the inductor wiring and connected to first ends of the pillar-shaped wirings, and a line-shaped wiring main body connecting the pair of pad portions; each of the wiring bodies has two or more parallel portions extending at equal intervals in a direction parallel to the main surface; Among the plurality of inductor wirings, the pad portion of the inductor wiring farthest from the main surface in a direction perpendicular to the main surface is defined as a specific pad portion, and the pillar wiring extending from the specific pad portion toward the main surface is defined as a specific pillar wiring, When an axis perpendicular to the main surface is defined as a first axis, and an axis perpendicular to the first axis and along the direction in which the parallel portions are arranged is defined as a second axis, The wiring wiring includes two or more wiring overlapping regions, which are regions where the parallel portions of the wiring bodies overlap when viewed in a direction along the first axis, When viewed in a direction along the first axis, a third interval, which is the shortest interval between the specific pad portion and the wiring overlapping region in a direction along the second axis, is larger than a fourth interval, which is the shortest interval between the wiring overlapping regions in the direction along the second axis. Inductor components.

8. Among the directions along the first axis, a direction from each of the inductor wirings toward the main surface is defined as a positive direction, and an opposite direction is defined as a negative direction; an average value of a distance from the surface of the specific pad portion on the negative side in the direction along the first axis to a second end of the specific pillar wiring on the positive side and a maximum dimension of the wiring overlapping region in the direction along the first axis is defined as an average distance; a ratio of the average distance to the third interval is a third aspect ratio; When the ratio of the maximum dimension of the wiring overlapping region in the direction along the first axis to the fourth interval is defined as a fourth aspect ratio, The ratio of the third aspect ratio to the fourth aspect ratio is 0.9 or more and 1.1 or less. The inductor component according to claim 7 .

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