Cooling unit, method of manufacturing the same and electronic apparatus

Abstract

To provide a cooling unit which can be made lightweight, of which the degree of freedom of shape is improved and which can be molded without being formed in an undercut shape in the case of injection molding, a method of manufacturing the same, and an electronic apparatus using the same.SOLUTION: A cooling unit 1 comprises: a metallic base section 2 which is formed in a tabular shape and in which an electronic component 41 can be disposed on one face; and a resin cooling section 3, which is provided on the other face of the base section 2, for cooling the electronic component 41 using a coolant. The cooling section 3 includes: a peripheral wall part 31 of which the proximal end side is joined to the base section 2 and which includes an opening on the side of a distal end; and a cover part 32 which is joined so as to close an opening 310 of the peripheral wall part 31. The cooling unit 1 comprises a flow passage 33 which is enclosed by the base section 2 and the cooling section 3 and in which the coolant can be circulated. The flow passage 33 includes a portion 201 corresponding to a portion 200, where the electronic component 41 is disposed, in the other face of the base section 2.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cooling unit, a manufacturing method thereof, and an electronic device. [Background technology]

[0002] BACKGROUND ART Conventionally, electronic devices have been known that include electronic components therein and a cooling unit that can cool the electronic components with a refrigerant. An example of a cooling unit used in this type of electronic device is described in Patent Document 1.

[0003] Specifically, the cooler (cooling unit) 20 in Patent Document 1 includes a case 90 made of a box-shaped member with an opening at the top, a heat sink 10 that closes the opening of the case 90, a coolant inlet 92, and a coolant outlet 94. The case 90 is made of a metal material such as aluminum. In this cooler 20, electronic components are attached to the upper surface of the heat sink 10, which is one of the outer surfaces of the cooler 20, and the lower surface of the heat sink 10 constitutes one of the inner surfaces of the cooler 20 and comes into contact with a refrigerant. Therefore, in the cooler 20, a refrigerant flows between the case 90 and the heat sink 10. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] WO2019 / 176620 A1 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the cooler 20 of Patent Document 1 is heavy because the case 90 is made of a metal material, and the degree of freedom in shape is limited, resulting in an unnecessarily large size for cooling the desired location. Furthermore, even if the case 90 were made of resin to reduce weight while keeping the shape of the cooler 20 of Patent Document 1, and an attempt was made to injection mold the case 90 onto the heat sink 10, molding would be impossible because the box-shaped case 90 would be under-shaped.

[0006] The present invention has been made in view of the above problems, and aims to provide a cooling unit that can be made lighter, has a high degree of freedom in shape, and can be molded without being under-shaped during injection molding, a method for manufacturing the same, and electronic equipment that uses the same. [Means for solving the problem]

[0007] The first invention is a metal base portion formed in a flat plate shape and capable of arranging electronic components on one surface thereof; a cooling unit provided on the other surface of the base portion and made of resin for cooling the electronic components using a refrigerant, The cooling unit is a peripheral wall portion having a base end joined to the other surface of the base portion and having an opening on a tip end side; a cover portion joined to the opening of the peripheral wall portion so as to close the opening, The cooling unit comprises: the cooling section is surrounded by the base section and the cooling section, and the cooling medium can flow through the cooling section, and the cooling section has a flow path including a portion of the other surface of the base section that corresponds to a portion where the electronic component is disposed. It is a cooling unit.

[0008] The second invention is the first invention, A partition wall portion for dividing the inside of the flow path is provided in the flow path. It is a cooling unit.

[0009] The third invention is the first invention or the second invention, a portion of the other surface of the base portion to which the peripheral wall portion is joined has fine irregularities formed thereon; It is a cooling unit.

[0010] The fourth invention is a metal base portion formed in a flat plate shape and capable of arranging electronic components on one surface thereof; a resin cooling portion provided on the other surface of the base portion and configured to cool the electronic component using a refrigerant, a peripheral wall forming step of injection-molding a peripheral wall having an opening on a tip side on the other surface of the base body and joining a base end side of the peripheral wall; a cooling portion forming step of joining a cover portion, which is preliminarily formed in a shape capable of closing the opening of the peripheral wall portion, to the opening, thereby forming the cooling portion having the peripheral wall portion and the cover portion, In the cooling portion forming step, a flow path that is surrounded by the base portion and the cooling portion and through which the coolant can flow, the flow path including a portion of the other surface of the base portion that corresponds to a portion on which the electronic component is disposed; This is a method for manufacturing a cooling unit.

[0011] The fifth invention is the fourth invention, In the peripheral wall portion forming step, a surface treatment is performed to form fine irregularities on a portion of the other surface of the base portion to which the base end side of the peripheral wall portion is to be joined; This is a method for manufacturing a cooling unit.

[0012] The sixth invention is the fifth invention, The surface treatment is performed by laser processing. This is a method for manufacturing a cooling unit.

[0013] A seventh invention is any one of the fourth to sixth inventions, In the cooling portion forming step, The peripheral wall portion and the cover portion are joined by vibration welding. This is a method for manufacturing a cooling unit.

[0014] The eighth invention is the seventh invention, a protrusion is formed by protruding at least one of a surface of the peripheral wall portion to be joined with the cover portion and a surface of the cover portion to be joined with the peripheral wall portion; an inner convex portion is formed on at least one of the peripheral wall portion and the cover portion at a position closer to the flow path than the protrusion portion; By performing the vibration welding at the protruding portion, an inner space is formed between the protruding portion and the inner convex portion. This is a method for manufacturing a cooling unit.

[0015] The ninth invention is A cooling unit according to any one of the first to third inventions, the electronic component disposed on the one surface of the base portion of the cooling unit; a case body that houses the cooling unit therein, The refrigerant is supplied to the flow path in the cooling unit from outside the case body, and the refrigerant that has flowed through the flow path is configured to be able to be discharged to the outside of the case body. It is an electronic device.

[0016] The tenth invention is A cooling unit according to any one of the first to third inventions, the electronic component disposed on the one surface of the base portion of the cooling unit; a case body that houses the cooling unit; a supply pipe connected to an outer surface of the case body and configured to supply the refrigerant to the case body; a discharge pipe connected to an outer surface of the case body for discharging the refrigerant from the case body; a first connecting pipe provided in the case body and connecting the supply pipe to a first through hole formed in the base portion of the cooling unit and communicating with the flow path of the cooling unit; a second connecting pipe provided in the case body and connecting the second through hole formed in the base portion of the cooling unit and communicating with the flow path of the cooling unit to the exhaust pipe; having It is an electronic device. [Effects of the Invention]

[0017] The cooling unit of the first invention has a resin cooling section provided on the other surface of the metal base section, making it lighter than conventional cooling units with metal cooling sections. Furthermore, the cooling unit of the first invention has a resin cooling section, allowing for greater freedom in design compared to conventional cooling units with metal cooling sections. Therefore, the cooling unit of the first invention can form a flow path to include a desired portion of the other surface of the base section corresponding to the portion where the electronic components are located, making it possible to efficiently cool the heat generated by the electronic components. Furthermore, the cooling unit of the first invention has a structure in which the cover section is joined to the opening at the tip end of the peripheral wall section, making it easy to mold without being under-shaped during injection molding. Therefore, according to the cooling unit of the first aspect of the invention, it is possible to provide a cooling unit that can be made lighter, has a high degree of freedom in shape, and can be molded without being under-shaped during injection molding.

[0018] The cooling unit of the second invention has the same effects as the cooling unit of the first invention, but also has a partition wall portion within the flow path, which allows the outer shape of the peripheral wall portion to be made relatively simple, and has the effect of allowing the refrigerant to flow in the desired direction along the partition wall portion within the flow path, thereby providing efficient cooling.

[0019] The cooling unit of the third invention has the effect of the cooling unit of the first or second invention, and further has the effect that a part of the peripheral wall fits into the fine irregularities formed on the other surface of the base where the base end side of the peripheral wall is joined, firmly joining the base and the peripheral wall, making it easier to prevent the refrigerant from leaking out from between the base and the peripheral wall.

[0020] The manufacturing method of the cooling unit of the fourth invention includes the peripheral wall portion forming process and the cooling portion forming process described above, and therefore it is possible to manufacture a cooling unit that can be made lighter, has a high degree of freedom in shape, and can be molded without becoming under-shaped during injection molding.

[0021] In the manufacturing method for a cooling unit of the fifth invention, in the peripheral wall forming step, a surface treatment is performed to form fine irregularities on the other surface of the base where the base end side of the peripheral wall is to be joined. Therefore, in addition to the effects of the manufacturing method for a cooling unit of the fourth invention, the manufacturing method for a cooling unit of the fifth invention further has the effect that part of the material forming the peripheral wall penetrates into the fine irregularities formed on the other surface of the base where the base end side of the peripheral wall is to be joined, thereby firmly joining the base and the peripheral wall, thereby making it possible to obtain a cooling unit that is easy to prevent refrigerant from leaking out from between the base and the peripheral wall.

[0022] The sixth aspect of the present invention relates to a method for manufacturing a cooling unit according to the fifth aspect of the present invention, and further relates to a method for manufacturing a cooling unit according to the fifth aspect of the present invention, in which the surface treatment is performed by laser processing. Therefore, in addition to the effects of the fifth aspect of the present invention, the sixth aspect of the present invention has the further effect that the laser processing can form finer micro-irregularities in precise positions, thereby firmly joining the base and the peripheral wall.

[0023] In the method for manufacturing a cooling unit of the seventh invention, the peripheral wall and the cover are joined by vibration welding in the cooling section forming step. Therefore, in addition to the effects of the method for manufacturing a cooling unit of any one of the fourth to sixth inventions, the method for manufacturing a cooling unit of the seventh invention has the further effect of being able to firmly join the peripheral wall and the cover even when the cooling section to be formed has a complex or large shape.

[0024] The cooling unit manufacturing method of the eighth invention is the cooling unit manufacturing method of the seventh invention, in which an inner space is formed between the protrusion and the inner convex portion by joining the protrusion by vibration welding. Therefore, according to the cooling unit manufacturing method of the eighth invention, in addition to the effect of the cooling unit manufacturing method of the seventh invention, even if burrs are generated by vibration welding of the protrusion, the burrs are contained in the inner space formed between the protrusion and the inner convex portion, and therefore, the burrs can be prevented from falling into the flow path of the cooling unit.

[0025] The electronic device of the ninth invention has a cooling unit described in any one of the first to third inventions, and therefore can be used to supply refrigerant from outside the case body to the flow path in the cooling unit and discharge the refrigerant that has circulated through the flow path to the outside of the case body, thereby efficiently cooling the heat generated by the electronic components.

[0026] The electronic device of the tenth invention has the above configuration, so that the refrigerant can be supplied from outside the case body through the supply pipe and the first connecting pipe into the flow path of the cooling unit, and the refrigerant that has circulated through the flow path can be discharged from the case body through the second connecting pipe and the discharge pipe. Therefore, the electronic device of the tenth invention can be used to supply the refrigerant from outside the case body to the flow path in the cooling unit and discharge the refrigerant that has circulated through the flow path to the outside of the case body, and can efficiently cool the heat generated by the electronic components. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a perspective view of a cooling unit according to one embodiment. [Figure 2] FIG. 2 is a perspective view of a base part used in a cooling unit and a manufacturing method thereof according to one embodiment, as viewed from the other surface side opposite to the surface on which electronic components are arranged. [Figure 3] FIG. 3 is an exploded perspective view of a cooling unit according to one embodiment, and is also a perspective view showing how a pre-formed cover portion is joined to an opening at the tip end of a peripheral wall portion joined to the other surface of a base portion in a manufacturing method of a cooling unit according to one embodiment. [Figure 4] FIG. 4 is a perspective view of a cooling unit according to one embodiment, and also shows a state after a pre-formed cover portion is joined to an opening at the tip end of a peripheral wall portion joined to the other surface of a base portion in a manufacturing method of a cooling unit according to one embodiment. [Figure 5] FIG. 5 is a view showing the other surface of the base part used in the cooling unit and the manufacturing method thereof according to one embodiment. [Figure 6] FIG. 6 is a diagram showing a modified example of the other surface of the base part in the cooling unit and the manufacturing method thereof according to one embodiment. [Figure 7] 7 is a cross-sectional view of the cooling unit according to the embodiment shown in FIG. 4 taken along line VII-VII. [Figure 8] FIG. 8 is a partially enlarged view showing the circled portion in FIG. [Figure 9] FIG. 9 is a cross-sectional view showing a modified example of the shape of the cover portion used in the cooling unit and the manufacturing method thereof according to one embodiment, in correspondence with FIG. [Figure 10] FIG. 10 is a perspective view of an electronic device in one embodiment, in which a portion of the side of the case body (specifically, the side face on the front side) is cut away to allow the inside of the case body to be seen. DETAILED DESCRIPTION OF THE INVENTION

[0028] A cooling unit according to an embodiment, a manufacturing method thereof, and an electronic device according to an embodiment will be described with reference to FIGS.

[0029] (cooling unit) 1 to 9, the cooling unit 1 of this embodiment has a base portion 2 and a cooling portion 3. The base portion 2 is formed in a flat plate shape, and an electronic component 41 (see FIG. 10 described later) can be arranged (mounted) on one surface 20a. Details of the electronic component 41 will be described in the section on electronic device 4 (described later).

[0030] The base 2 is made of metal and can be formed into a flat plate shape from various metal materials (the above-mentioned metals include alloys). Examples of metal materials that can be used to form the base 2 include aluminum, aluminum alloys, iron, iron alloys, and stainless steel. In the cooling unit 1 of this embodiment, the metal material that can be used to form the base 2 can be aluminum or an aluminum alloy, from the viewpoints of weight reduction, thermal conductivity, noise suppression, and the like.

[0031] The outer shape of the base part 2 can be, for example, a rectangular shape, but is not particularly limited and can be appropriately selected depending on the shape of an electronic device 4 (described later) to which the cooling unit 1 is applied. Furthermore, the thickness of the base part 2 can be, for example, 0.5 mm or more and 3 mm or less from the viewpoint of weight reduction, strength, etc.

[0032] 1 to 2, 5 to 6, etc., the base portion 2 can be formed with a first through hole 21 and a second through hole 22 that penetrate the base portion 2. The first through hole 21 and the second through hole 22 both communicate with a flow path 33 (described later) of the cooling unit 1. In this embodiment, the first through hole 21 is formed to communicate with the flow path 33 at one end of the flow path 33, and the second through hole 22 is formed to communicate with the flow path 33 at the other end of the flow path 33.

[0033] 2, 5 and 6, if necessary, a heat dissipation member such as a cooling fin 23 can be provided on the other surface 20b of the base part 2 in a portion 201 corresponding to a portion 200 (see FIG. 10) where the electronic component 41 is arranged, in order to more efficiently dissipate heat from the electronic component 41. Examples of materials for the cooling fin 23 include aluminum, aluminum alloy, copper, copper alloy, iron, iron alloy, and ceramics.

[0034] The cooling unit 3 is provided on the other surface 20b of the base unit 2, as exemplified in Figures 1 and 4. The cooling unit 3 is for cooling the electronic components 41 using a refrigerant (not shown). The refrigerant may be liquid or gas. Preferably, the refrigerant is liquid from the viewpoints of chemical stability and large specific heat. Examples of liquid refrigerants (liquid refrigerants) include water and LLC (Long Life Coolant). Examples of gaseous refrigerants (gas refrigerants) include fluorocarbons.

[0035] The cooling section 3 is made of resin and can be formed into a desired shape from various resin materials. Examples of resin materials that can be used to form the cooling section 3 include various thermoplastic resins such as polyamide (PA) such as polyamide 66, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyether ether ketone (PEEK), and polypropylene (PP). In the cooling unit 1 of this embodiment, the resin material that forms the cooling section 3 can be specifically polyamide such as polyamide 66 from the viewpoints of injection moldability, vibration weldability, and the like.

[0036] The cooling section 3 has a peripheral wall 31, a cover 32, and a flow path 33. The base end side of the peripheral wall 31 is joined to the other surface 20b of the base section 2, and constitutes the outer peripheral side wall of the cooling section 3. The peripheral wall 31 can be formed in an endless shape (seamless, cylindrical) with no joints in the circumferential direction. The peripheral wall 31 has an opening 310 on the tip side, which is opposite the base end side of the base section 2.

[0037] The cover portion 32 is joined to the opening 310 of the peripheral wall portion 31 so as to close the opening 310. In the cooling unit 1 of this embodiment, the peripheral wall portion 31 and the cover portion 32 are preferably formed from the same material (polyamide in this example) from the viewpoints of bonding properties, vibration welding properties, and the like. The size and shape of the cover portion 32 are not particularly limited as long as it can close the opening 310 of the peripheral wall portion 31. Furthermore, as illustrated in FIGS. 3 and 4, the cover portion 32 may be formed with a bulge portion 321 that bulges outward from the cover portion 32 along the flow path 33 from the viewpoint of improving refrigerant flow. Furthermore, if a partition wall portion 331 (described later) is provided within the flow path 33, the cover portion 32 may be formed with a recess 322 that serves as a portion to be joined to the tip surface of the partition wall portion 331. The recess 322 is a groove formed corresponding to the partition wall portion 331 when viewed from the outer surface side of the cover portion 32. 9, the outer peripheral edge of the cover portion 32 may be protruded toward the peripheral wall portion 31, and the cover portion 32 may be joinable to the peripheral wall portion 31 at this protruding portion.

[0038] As illustrated in FIGS. 3 to 4 and 7, the flow path 33 is a portion surrounded by the base 2 and the cooling unit 3, through which the refrigerant can flow. Specifically, the flow path 33 is formed by a space surrounded by the base 2, the peripheral wall 31 of the cooling unit 3, and the cover 32 of the cooling unit 3. However, as illustrated in FIGS. 2, 5 and 6, the flow path 33 is formed to include a portion 201 of the other surface 20b of the base 2, which corresponds to the portion 200 where the electronic component 41 is disposed. Note that the cooling fins 23 provided in the portion 201 of the other surface 20b of the base 2, which corresponds to the portion 200 where the electronic component 41 is disposed, come into contact with the refrigerant within the flow path 33.

[0039] As illustrated in FIG. 3 and other figures, the cooling unit 1 of this embodiment can have a partition wall 331 in the flow path 33 to separate the flow path 33. Similar to the peripheral wall 31, the partition wall 331 has a base end joined to the other surface 20b of the base 2. Here, an example is shown in which the partition wall 331 is formed to protrude from the base 2, but the partition wall 331 may also be formed to protrude from the cover 32. One or more partition walls 331 can be provided.

[0040] Furthermore, in the cooling unit 1 of this embodiment, a partition wall 331 is provided in the flow path 33, so that the refrigerant flows from one end to the other end of the flow path 33, as indicated by the symbol Y in Fig. 5. The partition wall 331 is not necessarily required in the flow path 33. For example, as illustrated in Fig. 6, without forming the partition wall 331, a portion 24 to which the peripheral wall 31 is joined may be formed on the other surface 20b of the base 2, corresponding to a portion 200 where the electronic component 41 is disposed, so that the refrigerant flows to that portion, and the peripheral wall 31 is formed in that portion. Note that Figs. 5 and 6 do not illustrate the peripheral wall 31 and the partition wall 331, but instead illustrate the portion 24 to which the peripheral wall 31 is joined (a portion 240 to which the base end of the peripheral wall 31 is to be joined) and the portion 25 to which the partition wall 331 is to be joined (a portion 250 to which the base end of the partition wall 331 is to be joined).

[0041] 5 and 6, in the cooling unit 1 of this embodiment, fine irregularities (not shown) are formed on a portion 24 of the other surface 20b of the base portion 2 to which the peripheral wall portion 31 is joined (i.e., before the peripheral wall portion 31 is joined, this is a portion 240 to which the base end side of the peripheral wall portion 31 is to be joined). When the partition wall portion 331 is formed, fine irregularities may also be formed on a portion 25 of the other surface 20b of the base portion 2 to which the partition wall portion 331 is joined (i.e., before the partition wall portion 331 is joined, this is a portion 250 to which the base end side of the partition wall portion 331 is to be joined), as shown in FIG.

[0042] The cooling unit 1 of this embodiment has a resin cooling section 3 provided on the other surface 20b of the metal base 2, making it lighter than conventional cooling units in which the cooling section 3 is made of metal. Furthermore, the cooling unit 1 of this embodiment has a resin cooling section 3, allowing for greater freedom in design compared to conventional cooling units in which the cooling section 3 is made of metal. Therefore, the cooling unit 1 of this embodiment can form the flow path 33 to include a desired portion 201 on the other surface 20b of the base 2 that corresponds to the portion 200 where the electronic component 41 is located, thereby enabling efficient cooling of heat generated by the electronic component 41. Furthermore, the cooling unit 1 of this embodiment has a structure in which the cover 32 is joined to the opening 310 on the tip side of the peripheral wall 31 to form the cooling section 3, allowing for easy molding without undercutting during injection molding.

[0043] Therefore, according to the cooling unit 1 of this embodiment, it is possible to provide a cooling unit 1 that can be made lighter, has a high degree of freedom in shape, and can be molded without being under-shaped during injection molding.

[0044] (Manufacturing method of cooling unit) The method for manufacturing a cooling unit of this embodiment is a method for manufacturing a cooling unit that is formed in a flat plate shape and has a metal base portion on one surface of which electronic components can be placed, and a resin cooling portion that is provided on the other surface of the base portion and uses a refrigerant to cool the electronic components. Here, the manufacturing of the cooling unit 1 of this embodiment described above will be used as an example and will be described with appropriate reference to Figures 1 to 9.

[0045] The method for manufacturing a cooling unit of this embodiment includes a peripheral wall forming step and a cooling portion forming step.

[0046] In the manufacturing method of the cooling unit of this embodiment, the peripheral wall forming step is a step of injection-molding a peripheral wall 31 having an opening 310 on the distal end side onto the other surface 20b of the base 2 and joining the base end side of the peripheral wall 31, as exemplified in Figures 2 and 3 . Specifically, outsert molding can be used as the injection molding method. Because the peripheral wall 31 having the opening 310 on the distal end side does not have an under-shaped configuration, the peripheral wall 31 can be easily formed and joined to the base 2 by an injection molding method such as outsert molding.

[0047] 5 and 6, in the peripheral wall forming step, it is preferable to perform a surface treatment to form fine irregularities on the portion 240 of the other surface 20b of the base 2 where the base end side of the peripheral wall 31 is to be joined. This is because, when the peripheral wall 31 is injection molded, part of the material forming the peripheral wall enters the fine irregularities, enabling the base 2 and the peripheral wall 31 to be firmly joined together.

[0048] The surface treatment for forming the fine irregularities is preferably performed by laser processing. This is because finer irregularities can be formed in precise positions by applying a laser to the portion 240 where the base end side of the peripheral wall portion 31 is to be joined. The surface treatment for forming the fine irregularities may be, other than laser processing, surface treatment such as blasting, etching, plasma discharge processing, or anodizing.

[0049] In the manufacturing method of the cooling unit of this embodiment, the cooling portion forming process is a process of forming a cooling portion 3 having a peripheral wall portion 31 and a cover portion 32 by joining a cover portion 32, which is pre-formed in a shape that can cover the opening 310 of the peripheral wall portion 31, to the opening 310, as illustrated in Figures 3 and 4, etc.

[0050] In this cooling section forming step, a flow path 33 through which a refrigerant can flow is formed, surrounded by the base section 2 and the cooling section 3. However, the flow path 33 is formed so as to include a portion 201 of the other surface 20b of the base section 2 that corresponds to a portion 200 where the electronic component 41 is arranged.

[0051] The peripheral wall portion 31 and the cover portion 32 are preferably joined by vibration welding. This is because the peripheral wall portion 31 and the cover portion 32 can be firmly joined together even when the cooling portion 3 to be formed has a complex or large shape. The method of joining the peripheral wall portion 31 and the cover portion 32 may be other than vibration welding, such as heat welding, ultrasonic welding, or bonding with an adhesive.

[0052] Specifically, when joining the peripheral wall portion 31 and the cover portion 32 by vibration welding, it is preferable to carry out the process as follows. That is, as illustrated in Figures 7 and 8, at least one of the surface of the peripheral wall portion 31 to be joined with the cover portion 32 and the surface of the cover portion 32 to be joined with the peripheral wall portion 31 is protruded to form a protrusion 34. Figures 7 and 8 illustrate a case in which the protrusion 34 has both a peripheral wall portion-side protrusion 341 formed by protruding the surface of the peripheral wall portion 31 to be joined with the cover portion 32, and a cover portion-side protrusion 342 formed by protruding the surface of the cover portion 32 to be joined with the peripheral wall portion 31.

[0053] In addition, an inner-side convex portion 35 is formed on at least one of the peripheral wall portion 31 and the cover portion 32 at an inward position closer to the flow path 33 than the protrusion 34. In Figures 7 and 8, the inner-side convex portion 35 includes both a peripheral-wall-side inner convex portion 351 formed on the peripheral wall portion 31 and a cover-side inner convex portion 352 formed on the cover portion 32 at an inward position closer to the flow path 33 than the protrusion 34.

[0054] 7 and 8, an outer-side convex portion 36 may be formed on at least one of the peripheral wall portion 31 and the cover portion 32 at a position outward from the protrusion 34. In FIGS. 7 and 8, the outer-side convex portion 36 is exemplified by a peripheral-wall-side outer convex portion 361 formed on the peripheral wall portion 31 at a position outward from the protrusion 34. Although not shown, the outer-side convex portion 36 may also be formed by a cover-side outer convex portion formed on the cover portion 32 at a position outward from the protrusion 34.

[0055] As illustrated in FIGS. 7 and 8 , vibration welding is performed at the protrusion 34, whereby the peripheral wall protrusion 341 and the cover protrusion 342 are joined (vibration welded) to form a joint margin (which can also be referred to as a welding margin) 39. An inner space 37 is formed between the protrusion 34 and the inner convex portion 35. An outer space 38 is also formed between the protrusion 34 and the outer convex portion 36. Even if burrs (not shown) are generated when the peripheral wall 31 and the cover 32 are vibration welded, the generated burrs are contained in the inner space 37 and the outer space 38. Therefore, when the inner space 37 is provided, it is possible to prevent the burrs from falling off into the cooling section 3, specifically, into the flow path 33. When the outer space 38 is provided, it is possible to prevent the burrs from falling off outside the cooling section 3.

[0056] The inner-side protrusion 35 and the outer-side protrusion 36 are preferably formed to have such lengths that they do not come into contact with the surfaces facing the tip surfaces of the inner-side protrusion 35 and the outer-side protrusion 36 after vibration welding at the protrusion 34. This is to join the peripheral wall-side protrusion 341 and the cover-side protrusion 342 and ensure reliable vibration welding at the protrusion 34. As illustrated in FIGS. 7 and 8, after vibration welding at the protrusion 34, the tip surfaces of the peripheral wall-side inner protrusion 351 and the cover-side inner protrusion 352 do not come into contact with each other, leaving a slight gap between the respective tip surfaces. Similarly, the tip surface of the peripheral wall-side outer protrusion 361 does not come into contact with the opposing surface 362 of the cover 32 that faces the tip surface of the peripheral wall-side outer protrusion 361, leaving a slight gap between the respective surfaces.

[0057] The manufacturing method for the cooling unit of this embodiment includes the peripheral wall portion forming process and the cooling portion forming process described above, and therefore it is possible to manufacture the cooling unit 1 of this embodiment, which can be made lightweight, has a high degree of freedom in shape, and can be molded without becoming under-shaped during injection molding.

[0058] (electronic equipment)

[0059] As shown in FIG. 10, the electronic device 4 of this embodiment includes the cooling unit 1 of this embodiment, an electronic component 41, and a case body .

[0060] The electronic component 41 is disposed on one surface 20a of the base portion 2 of the cooling unit 1. While FIG. 10 shows an example in which a plurality of electronic components 41 (specifically, two) are mounted inside the case body 42, the number of electronic components 41 is not particularly limited. It can be selected appropriately depending on the type, specifications, etc. of the electronic device 4. Furthermore, in FIG. 10, the electronic component 41 is shown in a simplified form to make it easier to illustrate the configuration other than the electronic component 41, and the size and shape of the electronic component 41 depicted in FIG. 10 differ from those of the actual product.

[0061] Examples of the electronic component 41 include a reactor, a coil, an inverter, and a semiconductor. These components can be used alone or in combination of two or more. Among the electronic components 41, a reactor, a coil, an inverter, a semiconductor, and the like generate heat and reach high temperatures, and are therefore suitable as the electronic component 41 to be disposed on one surface 20 a of the base portion 2.

[0062] The case body 42 accommodates the cooling unit 1 inside. Specifically, the case body 42 has a case bottom 421, case side surfaces 422 erected on the outer periphery of the case bottom 421, and a case top 423 that closes an upper opening of the case formed by the case side surfaces 422. The case side surfaces 422 are formed in a rectangular cylindrical shape as a whole. Note that the front portion of the case side surfaces 422 is omitted in FIG. 10. Such a case body 42 can be formed, for example, by integrally molding the case bottom surface 421 and the case side surfaces 422 using aluminum die casting or the like, and then covering the case top surface 423.

[0063] In the electronic device 4 illustrated in FIG. 10, the inside of the case body 42 is partitioned by the base part 2 of the cooling unit 1, and the electronic component 41 is arranged in an upper space 425 inside the case surrounded by the inner wall surface 424 of the case body 42 and one surface 20a of the base part 2, and the cooling part 3 is arranged in a lower space 426 inside the case surrounded by the inner wall surface 424 of the case body 42 and the other surface 20b of the base part 2.

[0064] The electronic device 4 is configured to supply a refrigerant from outside the case body 42 to the flow path 33 in the cooling unit 1, and to be able to discharge the refrigerant that has circulated through the flow path 33 to the outside of the case body 42. In the electronic device 4 of this embodiment, as illustrated in FIG. 10 , the electronic device 4 further includes a supply pipe 43, a discharge pipe 44, a first connecting pipe 45, and a second connecting pipe 46.

[0065] The supply pipe 43 is connected to the outer surface of the case body 42 and is used to supply a refrigerant to the case body 42. The discharge pipe 44 is connected to the outer surface of the case body 42 and is used to discharge a refrigerant from the case body 42. In the electronic device 4 of this embodiment, as illustrated in FIG. 10 , the supply pipe 43 is connected to a supply pipe through hole 430 formed in the case side surface 422 by fitting it from the outside of the case side surface 422. The discharge pipe 44 is connected to a discharge pipe through hole 440 formed in the case side surface 422 by fitting it from the outside of the case side surface 422. In the electronic device 4 of this embodiment, the supply pipe 43 and the discharge pipe 44 are connected to one of the multiple (specifically, four) case side surfaces 422, and it is possible to supply and discharge a refrigerant on the side of this one case side surface 422.

[0066] The first connecting pipe 45 is provided inside the case body 42, specifically in the upper case space 425. The first connecting pipe 45 connects the supply pipe 43 to a first through hole 21 that is formed in the base portion 2 of the cooling unit 1 and communicates with the flow path 33 of the cooling unit 1. The first connecting pipe 45 and the supply pipe 43, and the first connecting pipe 45 and the first through hole 21 are connected by being fitted together.

[0067] Similarly, the second connecting pipe 46 is provided inside the case body 42, specifically in the upper case space 425. The second connecting pipe 46 connects the second through hole 22, which is formed in the base portion 2 of the cooling unit 1 and communicates with the flow path 33 of the cooling unit 1, to the discharge pipe 44. The second connecting pipe 46 and the discharge pipe 44, and the second connecting pipe 46 and the second through hole 22 are connected by being fitted together.

[0068] In the electronic device 4 of this embodiment, the refrigerant supplied to the supply pipe 43 from a refrigerant supply source (not shown) flows through the first connecting pipe 45 and enters the flow path 33 in the cooling section 3 of the cooling unit 1 through the first through-hole 21. The refrigerant that has entered the flow path 33 flows inside the flow path 33, enters the second connecting pipe 46 through the second through-hole 22, flows inside the second connecting pipe 46, and is discharged from the discharge pipe 44.

[0069] As described above, the electronic device 4 of this embodiment can supply the refrigerant from the outside of the case body 42 into the flow path 33 of the cooling unit 1 through the supply pipe 43 and the first connecting pipe 45, and can also discharge the refrigerant that has circulated through the flow path 33 from the case body 42 through the second connecting pipe 46 and the discharge pipe 44. Therefore, the electronic device 4 of this embodiment can efficiently cool the heat generated by the electronic component 41.

[0070] Examples of the electronic device 4 include a power control unit (PCU) and an electronic control unit (ECU) in an automobile, etc. In this case, the electronic device 4 can be installed in the engine compartment or the interior of the automobile.

[0071] The present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit and scope of the present invention. For example, in the above-described embodiments, the first through hole 21 and the second through hole 22 are formed in the base portion 2 of the cooling unit 1. However, the first through hole 21 and the second through hole 22 may be formed in the peripheral wall portion 31 to supply and discharge the refrigerant. In addition, in the above-described embodiments, the first connecting pipe 45 and the second connecting pipe 46 are provided in the upper case space 425. However, the first connecting pipe 45 and the second connecting pipe 46 may also be provided in the lower case space 426. Furthermore, the configurations described in the above-described embodiments can be combined with each other in any desired manner. Furthermore, the claims as originally filed can be combined with each other in any desired manner. [Explanation of symbols]

[0072] 1 Cooling unit 2 Base 20a One side 20b The other side 200 Part where electronic components are placed 201 Part corresponding to the part where electronic components are placed 21 First through hole 22 Second through hole 3 Cooling section 31 Peripheral wall section 310 Aperture 32 Cover 33 Flow path 4 Electronic equipment 41 Electronic Components 42 Case body 43 Supply pipe 44 Discharge pipe 45 1st connecting pipe 46 2nd connecting pipe

Claims

1. It is formed in a flat plate shape, and has a metal base portion on one side on which electronic components can be placed, A cooling unit having a resin cooling section provided on the other side of the base portion for cooling the electronic components using a refrigerant, The cooling unit is A peripheral wall portion is joined to the other surface of the base portion at its base end and has an opening at its tip end, It has a covering portion joined to the opening so as to close the opening in the peripheral wall portion, The cooling unit is The cooling portion and the base portion surround the cooling portion, allowing the refrigerant to flow through it, and the other surface of the base portion includes a flow path that corresponds to the portion where the electronic components are arranged. Cooling unit.

2. The flow path has a partition wall portion for dividing the flow path. The cooling unit according to claim 1.

3. On the other surface of the base portion, the portion to which the peripheral wall portion is joined has fine irregularities formed. The cooling unit according to claim 1.

4. It is formed in a flat plate shape, and has a metal base portion on one side on which electronic components can be placed, A method for manufacturing a cooling unit having a resin cooling section provided on the other side of the base portion for cooling the electronic components using a refrigerant, A peripheral wall forming step is performed by injection molding a peripheral wall portion having an opening at the tip end onto the other surface of the base portion and joining the base end of the peripheral wall portion. The process includes a cooling section forming step, in which a covering portion, which is formed in advance in a shape capable of closing the opening in the peripheral wall portion, is joined to the opening to form the cooling section having the peripheral wall portion and the covering portion, In the cooling section formation step, The base portion and the cooling portion surround the coolant, allowing the coolant to flow through them, and the other surface of the base portion includes a portion corresponding to the portion where the electronic components are arranged, forming a flow path. A method for manufacturing a cooling unit.

5. In the peripheral wall formation step, On the other surface of the base portion, the portion where the base end of the peripheral wall portion is to be joined is subjected to a surface treatment that creates fine irregularities. A method for manufacturing a cooling unit according to claim 4.

6. The surface treatment is applied by laser processing. A method for manufacturing a cooling unit according to claim 5.

7. In the cooling section formation step, The peripheral wall portion and the covering portion are joined by vibration welding. A method for manufacturing a cooling unit according to any one of claims 4 to 6.

8. A protruding portion is formed by making at least one of the surfaces on the peripheral wall portion that are intended to be joined with the covering portion, and the surfaces on the covering portion that are intended to be joined with the peripheral wall portion, At a position closer to the flow path than the aforementioned protrusion, an inward protrusion is formed on at least one of the peripheral wall portion and the covering portion. By performing the vibration welding at the protruding portion, an inner space is formed between the protruding portion and the inwardly protruding portion. A method for manufacturing a cooling unit according to claim 7.

9. A cooling unit according to any one of claims 1 to 3, The electronic component arranged on one side of the base portion of the cooling unit, It has a case body that houses the cooling unit inside, The cooling unit is configured to supply the refrigerant to the flow path from outside the case body, and to discharge the refrigerant that has flowed through the flow path to the outside of the case body. electronic equipment.

10. A cooling unit according to any one of claims 1 to 3, The electronic component arranged on one side of the base portion of the cooling unit, A case body that houses the aforementioned cooling unit inside, A supply pipe connected to the outer surface of the case body for supplying the refrigerant to the case body, A discharge pipe connected to the outer surface of the case body for discharging the refrigerant from the case body, A first connecting pipe is provided inside the case body and connects the supply pipe to a first through-hole formed in the base portion of the cooling unit and communicating with the flow path of the cooling unit, A second connecting pipe is provided inside the case body and connects the second through-hole, which is formed in the base portion of the cooling unit and communicates with the flow path of the cooling unit, to the discharge pipe, Having, electronic equipment.

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