Characteristic measurement apparatus for multilayer ceramic electronic component, and manufacturing method of multilayer ceramic electronic component

Abstract

To provide a characteristic measurement apparatus for multilayer ceramic electronic components that can stably hold a multilayer ceramic electronic component when a measurement probe is brought into contact with the multilayer ceramic electronic component for characteristic measurement, thereby enabling stable measurement.SOLUTION: A characteristic measurement apparatus for multilayer ceramic electronic components comprises at least one measurement system 600 including: a housing part 200 that houses a multilayer ceramic capacitor 1 in a substantially horizontal state; a measurement part 300 that includes a pair of measurement probes 400 that is disposed in an opposing manner so as to be advanceable and retractable with respect to each of a pair of metal terminals 60 of the multilayer ceramic capacitor 1 housed in the housing part 200, and comes into contact with the metal terminal 60 that the probe faces when advanced; and a pressing part 500 that is disposed in an opposing manner so as to be advanceable and retractable with respect to a second main surface 21b of a body part 10 arranged on the upper side of the multilayer ceramic capacitor 1 housed in the housing part 200, comes into contact with the second main surface 21b that the pressing part faces when advanced to press the multilayer ceramic capacitor 1 from the second main surface 21b.SELECTED DRAWING: Figure 3A

Description

[Technical Field]

[0001] The present invention relates to a device for measuring characteristics of a multilayer ceramic electronic component and a method for manufacturing a multilayer ceramic electronic component. [Background technology]

[0002] Conventionally, the characteristics of electronic components such as multilayer ceramic capacitors are examined to confirm whether they have desired characteristics. For example, the characteristics are measured by bringing measurement contacts into contact with a pair of terminals of the electronic component from both sides so as to sandwich the electronic component (see Patent Document 1, etc.). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-214215 Summary of the Invention [Problem to be solved by the invention]

[0004] When a measurement probe is brought into contact with an electronic component, the pressing force generated at that time can move the electronic component, making it impossible to measure properly, and there is room for improvement.

[0005] A primary object of the present invention is to provide an apparatus for measuring the characteristics of a multilayer ceramic electronic component, which can hold the multilayer ceramic electronic component in a stable state when a measurement probe is brought into contact with the multilayer ceramic electronic component to measure its characteristics, thereby enabling stable measurements to be performed. [Means for solving the problem]

[0006] The characteristic measuring device for a multilayer ceramic electronic component according to the present invention is a measuring device for measuring the characteristics of a multilayer ceramic electronic component that includes a substantially rectangular parallelepiped main body portion having a pair of main surfaces opposing each other in a height direction, a pair of side surfaces opposing each other in a width direction, and a pair of end surfaces opposing each other in a length direction, and a pair of metal terminals arranged on the outer sides of the pair of end surfaces, and includes at least one measurement system including: a housing portion that houses the multilayer ceramic electronic component with the pair of main surfaces arranged on the upper and lower sides, respectively, and with both the length direction and the width direction being substantially horizontal; a measuring portion including a pair of measurement probes that are arranged to be able to advance and retreat relative to each of the pair of metal terminals of the multilayer ceramic electronic component housed in the housing portion, and that come into contact with the metal terminals that they face when advanced; and a pressing portion that is arranged to be able to advance and retreat relative to the upper main surface of the multilayer ceramic electronic component housed in the housing portion, and that come into contact with the upper main surface that it faces when advanced, thereby pressing the multilayer ceramic electronic component from that main surface. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a device for measuring characteristics of a multilayer ceramic electronic component that can hold the multilayer ceramic electronic component in a stable state when a measurement probe is brought into contact with the multilayer ceramic electronic component to measure its characteristics, thereby enabling stable measurements to be performed. [Brief explanation of the drawings]

[0008] [Figure 1A] 1 is a side view of a first multilayer ceramic capacitor according to a preferred embodiment of the present invention. [Figure 1B] 1B is a view taken along the arrow IB in FIG. 1A and is a plan view of the first multilayer ceramic capacitor according to the embodiment. [Figure 2A] FIG. 4 is a side view of the second multilayer ceramic capacitor according to the embodiment. [Figure 2B] 2B is a view taken along the arrow IIB in FIG. 2A and is a plan view of the second multilayer ceramic capacitor according to the embodiment. [Figure 3A]1 is a front view showing a main part of a characteristics measuring device according to an embodiment, showing a measurement standby state; [Figure 3B] 1 is a front view showing a main part of a characteristic measuring device according to an embodiment, illustrating a measurement state. [Figure 4] FIG. 2 is a perspective view of the characteristic measuring device according to the embodiment, with the pressing portion removed. [Figure 5] FIG. 2 is a plan view of the characteristic measuring device according to the embodiment, with the pressing portion removed. [Figure 6] FIG. 6 is an enlarged plan view of a portion indicated by VI in FIG. 5, showing a state of measurement by a characteristics measurement device. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. The embodiment relates to a characteristic measuring device for a multilayer ceramic electronic component and a manufacturing method for a multilayer ceramic electronic component. First, a multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to the embodiment will be described with reference to Figures 1A to 2B. The multilayer ceramic capacitor 1 is manufactured while its predetermined characteristics are measured by a characteristic measuring device described below.

[0010] The multilayer ceramic capacitor 1 according to the embodiment includes a first multilayer ceramic capacitor 1A as a first multilayer ceramic electronic component shown in FIGS. 1A and 1B, and a second multilayer ceramic capacitor 1B as a second multilayer ceramic electronic component shown in FIGS. 2A and 2B. Both the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B include a pair of metal terminals 60 as external terminals. The pair of metal terminals 60 of the first multilayer ceramic capacitor 1A includes a pair of first metal terminals 60A. The pair of metal terminals 60 of the second multilayer ceramic capacitor 1B includes a pair of second metal terminals 60B. The pair of first metal terminals 60A of the first multilayer ceramic capacitor 1A are of an outwardly bent type. The pair of second metal terminals 60B of the second multilayer ceramic capacitor 1B are of an inwardly bent type. The first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are different in type in that the shapes of the metal terminals 60 constituting the external terminals are different, but the other configurations are the same except for the metal terminals 60.

[0011] A first multilayer ceramic capacitor 1A according to a preferred embodiment will be described. FIG. 1A is a side view of the first multilayer ceramic capacitor 1A. FIG. 1B is a view taken along arrow IB in FIG. 1A and is a plan view of the first multilayer ceramic capacitor 1A. The first multilayer ceramic capacitor 1A includes a body 10 having a substantially rectangular parallelepiped shape and the pair of first metal terminals 60A described above. The body 10 includes an outer casing 20 and a multilayer ceramic capacitor body 30 embedded in the outer casing 20.

[0012] The first multilayer ceramic capacitor 1A, the body 10, and the multilayer ceramic capacitor body 30 have common height, width, and length directions. These directions are based on the shape of the multilayer ceramic capacitor body 30, which is a substantially rectangular parallelepiped. In FIGS. 1A and 1B, the length direction of the first multilayer ceramic capacitor 1A, the body 10, and the multilayer ceramic capacitor body 30 is indicated by an arrow L. In FIG. 1A, the height direction of the first multilayer ceramic capacitor 1A, the body 10, and the multilayer ceramic capacitor body 30 is indicated by an arrow T. In FIG. 1B, the width direction of the first multilayer ceramic capacitor 1A, the body 10, and the multilayer ceramic capacitor body 30 is indicated by an arrow W.

[0013] 1A and 1B, the exterior packaging material 20 of the main body 10 includes a pair of main surfaces 21 that face each other in a height direction T, a pair of side surfaces 22 that face each other in a width direction W that is perpendicular to the height direction T, and a pair of end surfaces 23 that face each other in a length direction L that is perpendicular to the height direction T and the width direction W. These main surfaces 21, side surfaces 22, and end surfaces 23 constitute the main surfaces 21, side surfaces 22, and end surfaces 23 of the main body.

[0014] The pair of main surfaces 21 includes a first main surface 21a on the lower side in Fig. 1A and a second main surface 21b on the upper side in Fig. 1A. The pair of side surfaces 22 includes a first side surface 22a on the upper side in Fig. 1B and a second side surface 22b on the lower side in Fig. 1B. The pair of end surfaces 23 includes a first end surface 23a on the left side in Fig. 1A and a second end surface 23b on the right side in Fig. 1A.

[0015] Each of the first side surface 22a, the second side surface 22b, the first end surface 23a, and the second end surface 23b of the packaging material 20 has a parting line PL at approximately the center in the height direction T. The parting line PL is a line that corresponds to the parting surface of a mold used when molding the packaging material 20. A draft angle is provided on the surface of the packaging material 20, with the parting line PL as the boundary.

[0016] Each of the first side surface 22a and the second side surface 22b of the exterior packaging material 20 has a surface 22c1 on the first principal surface 21a side and a surface 22c2 on the second principal surface 21b side. Each of the first end surface 23a and the second end surface 23b of the exterior packaging material 20 has a surface 23c1 on the first principal surface 21a side and a surface 23c2 on the second principal surface 21b side. The surfaces 22c1, 23c1 on the first principal surface 21a side and the surfaces 22c2, 23c2 on the second principal surface 21b side are separated by a parting line PL.

[0017] Each of surfaces 22c1, 23c1 on the first main surface 21a side has a draft gradient such that the area of ​​the LW cross section along the length direction L and width direction W of packaging material 20 decreases as it approaches first main surface 21a from parting line PL. In other words, each of surfaces 22c1, 23c1 on the first main surface 21a side is a tapered surface that slopes toward the inside of packaging material 20 as it approaches first main surface 21a from parting line PL.

[0018] Each of surfaces 22c2, 23c2 on the second main surface 21b side has a draft gradient such that the area of ​​the LW cross section along the length direction L and width direction W of packaging material 20 decreases as it approaches second main surface 21b from parting line PL. In other words, each of surfaces 22c2, 23c2 on the second main surface 21b side is a tapered surface that slopes toward the inside of packaging material 20 as it approaches second main surface 21b from parting line PL.

[0019] 1A and 1B, the multilayer ceramic capacitor body 30 of the body portion 10 has a laminate 40 and external electrodes 50 provided on both ends of the laminate 40. The multilayer ceramic capacitor body 30 of the embodiment has the configuration of a commonly known multilayer ceramic capacitor.

[0020] The multilayer ceramic capacitor body 30 is arranged inside the exterior packaging material 20 with its height direction T, width direction W and length direction L respectively aligned with the height direction T, width direction W and length direction L of the exterior packaging material 20.

[0021] The laminate 40 of the multilayer ceramic capacitor body 30 includes a pair of main surfaces 41 facing each other in a height direction T, a pair of side surfaces 42 facing each other in a width direction W perpendicular to the height direction T, and a pair of end surfaces 43 facing each other in a length direction L perpendicular to the height direction T and the width direction W.

[0022] The pair of main surfaces 41 includes a first main surface 41a on the lower side in Fig. 1A and a second main surface 41b on the upper side in Fig. 1A. The pair of side surfaces 42 includes a first side surface 42a on the upper side in Fig. 1B and a second side surface 42b on the lower side in Fig. 1B. The pair of end surfaces 43 includes a first end surface 43a on the left side in Fig. 1A and a second end surface 43b on the right side in Fig. 1B.

[0023] The laminate 40 includes a plurality of dielectric layers and a plurality of internal electrode layers (both not shown) alternately stacked in the height direction T. The laminate 40 functions as a capacitor that generates electrostatic capacitance. The plurality of dielectric layers are made of a dielectric material such as a dielectric ceramic containing BaTiO3, CaTiO3, SrTiO3, or CaZrO3 as a main component. The dielectric material may be one in which a secondary component such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound is added to these main components.

[0024] It should be noted that the lengthwise dimension L of the laminate 40 is not necessarily longer than the widthwise dimension W. The corners and ridges of the laminate 40 are preferably rounded. A corner is a portion where three faces of the laminate 40 intersect, and a ridge is a portion where two faces of the laminate 40 intersect. It should be noted that unevenness may be formed on part or all of the surfaces constituting the laminate 40.

[0025] The dimensions of the laminate 40 are not particularly limited, but the length L dimension is preferably 0.2 mm or more and 10 mm or less. The height T dimension of the laminate 40 is preferably 0.1 mm or more and 10 mm or less. The width W dimension of the laminate 40 is preferably 0.1 mm or more and 10 mm or less.

[0026] The external electrode 50 has a first external electrode 50A arranged on the first end face 43a side of the laminate 40, and a second external electrode 50B arranged on the second end face 43b side of the laminate 40.

[0027] The first external electrode 50A is disposed so as to cover the entire first end face 43a of the laminate 40, and to cover portions of the first principal face 41a, the second principal face 41b, the first side face 42a, and the second side face 42b. The first external electrode 50A is connected to the multiple internal electrode layers of the laminate 40 on the first end face 43a. The portion of the first external electrode 50A disposed on the first principal face 41a is connected to a first outwardly bent terminal 61, which will be described later.

[0028] The second external electrode 50B is disposed so as to cover the entire second end face 43b of the laminate 40, and to cover portions of each of the first principal face 41a, the second principal face 41b, the first side face 42a, and the second side face 42b. The second external electrode 50B is connected on the second end face 43b to a plurality of internal electrode layers of the laminate 40 that are not connected to the first external electrode 50A. The portion of the second external electrode 50B disposed on the first principal face 41a is connected to a second outwardly bent terminal 62, which will be described later.

[0029] Capacitor characteristics are exhibited between the first external electrode 50A and the second external electrode 50B.

[0030] The external electrodes 50 (first external electrode 50A and second external electrode 50B) preferably have a configuration in which a plating layer is formed on the surface of a base electrode layer made of a baked layer connected to the internal electrode layer of the laminate 40, for example.

[0031] The components of the base electrode layer formed from the baked layer are not limited, but preferably include, for example, a metal component and either a glass component or a ceramic component, or both. The metal component includes, for example, at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The glass component includes, for example, at least one selected from B, Si, Ba, Mg, Al, Li, etc. The ceramic component may be the same type of ceramic material as that of the dielectric layer, or a different type of ceramic material. The ceramic component includes, for example, at least one selected from BaTiO3, CaTiO3, (Ba,Ca)TiO3, SrTiO3, CaZrO3, etc. The base electrode layer may be a multi-layer structure.

[0032] The base electrode layer is not limited to a baked layer, but may be a thin film layer on which metal particles are deposited, formed by a thin film formation method such as sputtering or vapor deposition. When the base electrode layer is a thin film layer, the metal preferably contains at least one selected from the group consisting of Mg, Al, Ti, W, Cr, Cu, Ni, Ag, Co, Mo, and V. This can increase the adhesive strength of the external electrode 50 to the laminate 40. The thin film layer may be a single layer or may be formed of multiple layers. For example, it may be formed of a two-layer structure consisting of a NiCr layer and a NiCu layer.

[0033] The plating layer may contain, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au, etc. The plating layer may be formed of multiple layers. The plating layer preferably has a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0034] The external electrode 50 of this embodiment may have a conductive resin layer containing, for example, conductive particles including Ag metal powder and a thermosetting resin such as epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin. When a conductive resin layer is provided as the base electrode layer, the conductive resin layer may be disposed so as to cover the baked layer, or may be disposed directly on the laminate 40 without a baked layer. When the conductive resin layer is disposed so as to cover the baked layer, the conductive resin layer is disposed between the baked layer and the plating layer. The conductive resin layer may completely cover the baked layer, or may cover only a portion of the baked layer.

[0035] The conductive resin layer containing a thermosetting resin is more flexible than a conductive layer made of, for example, a plating film or a fired conductive paste. Therefore, even if the first multilayer ceramic capacitor 1A is subjected to a physical shock or a shock due to a thermal cycle, the conductive resin layer functions as a buffer layer. Therefore, the conductive resin layer suppresses the occurrence of cracks in the multilayer ceramic capacitor 1.

[0036] The length direction L dimension of the multilayer ceramic capacitor body 30 including the laminate 40 and the external electrodes 50 is preferably 0.2 mm or more and 10 mm or less. The height direction T dimension of the multilayer ceramic capacitor body 30 is preferably 0.1 mm or more and 10 mm or less. The width direction W dimension of the multilayer ceramic capacitor body 30 is preferably 0.1 mm or more and 10 mm or less.

[0037] As shown in FIGS. 1A and 1B, the pair of first metal terminals 60A includes a first outwardly bent terminal 61 and a second outwardly bent terminal 62. As shown in FIG.

[0038] The first outer bent terminal 61 and the second outer bent terminal 62 are metal terminals mounted on the mounting surface of a mounting substrate on which the multilayer ceramic capacitor 1 is to be mounted. The first outer bent terminal 61 and the second outer bent terminal 62 are, for example, plate-shaped lead frames. The first main surface 41a of the laminate 40 of this embodiment is the surface opposite to the mounting surface of the mounting substrate on which the first multilayer ceramic capacitor 1A is to be mounted.

[0039] 1A , the first outwardly bent terminal 61 is bent in the height direction T of the multilayer ceramic capacitor body 30 and extends in a direction away from the multilayer ceramic capacitor body 30 to the outside in the length direction L. The first outwardly bent terminal 61 has: a first joint portion 71A facing and connected to a portion of the first external electrode 50A arranged on the first main surface 41a side; a first rising portion 72A connected to the first joint portion 71A and extending away from the opposing first end face 43a and away from the mounting surface of the mounting board; a first extension portion 73A connected to the first rising portion 72A and extending in the length direction L away from the multilayer ceramic capacitor body 30; a first falling portion 74A connected to the first extension portion 73A and extending toward the mounting surface of the mounting board; and a first mounting portion 75A connected to the first falling portion 74A and extending in a direction along the mounting surface of the mounting board.

[0040] The second outwardly bent terminal 62 is bent in the height direction T of the multilayer ceramic capacitor body 30 and extends in a direction away from the multilayer ceramic capacitor body 30 to the outside in the length direction L. The first outwardly bent terminal 61 has: a second joint portion 71B facing and connected to a portion of the second external electrode 50B arranged on the first main surface 41a side, a second rising portion 72B connected to the second joint portion 71B and extending away from the opposing first end face 43a and away from the mounting surface of the mounting board, a second extension portion 73B connected to the second rising portion 72B and extending in the length direction L away from the multilayer ceramic capacitor body 30, a second falling portion 74B connected to the second extension portion 73B and extending toward the mounting surface of the mounting board, and a second mounting portion 75B connected to the second falling portion 74B and extending in a direction along the mounting surface of the mounting board.

[0041] The first joint portion 71A of the first outwardly bent terminal 61 and the second joint portion 71B of the second outwardly bent terminal 62 are joined by a joint material (not shown). The joint material is not limited, but is preferably solder. For example, Pb-free solder may be used. As Pb-free solder, lead-free solder such as Sn-Sb, Sn-Ag-Cu, Sn-Cu, and Sn-Bi is preferred. For example, Sn-10Sb to Sn-15Sb solder can be preferably used.

[0042] The external electrode 50 described above has a plating layer, and if the plating layer is a Ni plating layer, this is preferable because it prevents the underlying electrode layer from being eroded by the solder that joins the multilayer ceramic capacitor body 30 and the first metal terminal 60A. In addition, a Sn plating layer is preferable because it improves the wettability of the solder that joins the multilayer ceramic capacitor body 30 and the first metal terminal 60A, facilitating joining the multilayer ceramic capacitor body 30 and the first metal terminal 60A.

[0043] By employing the first metal terminals 60A, i.e., the first outwardly bent terminals 61 and the second outwardly bent terminals 62 as the metal terminals 60, it is possible to increase the distance between the mounting substrate and the multilayer ceramic capacitor body 30, thereby achieving the effect of alleviating stress from the mounting substrate. In addition, it is possible to increase the thickness of the exterior material 20 provided on the mounting substrate side, thereby ensuring insulation.

[0044] The exterior material 20 covers the multilayer ceramic capacitor body 30 and parts of the pair of first metal terminals 60A.

[0045] The exterior covering material 20 is arranged, for example, to cover the entire first joint portion 71A, the entire first rising portion 72A, and at least a part of the first extending portion 73A of the first outwardly bent terminal 61. The exterior covering material 20 is also arranged, for example, to cover the entire second joint portion 71B, the entire second rising portion 72B, and at least a part of the second extending portion 73B of the second outwardly bent terminal 62.

[0046] In the present embodiment, the first extension portion 73A of the first outwardly bent terminal 61 is partially exposed and protrudes from the first end surface 23a of the outer casing 20. The second extension portion 73B of the second outwardly bent terminal 62 is partially exposed and protrudes from the second end surface 23b of the outer casing 20. More specifically, the first extension portion 73A of the first outwardly bent terminal 61 is partially exposed and protrudes from the parting line PL of the first end surface 23a of the outer casing 20. The second extension portion 73B of the second outwardly bent terminal 62 is partially exposed and protrudes from the parting line PL of the second end surface 23b of the outer casing 20.

[0047] The first main surface 21a of the packaging material 20 is preferably flat and has a predetermined degree of flatness. This can prevent poor suction by a mounter of a mounting machine used to mount the multilayer ceramic capacitor 1 on a mounting board. This allows the first multilayer ceramic capacitor 1A to be reliably mounted on the mounting board. As a result, the occurrence of mounting defects can be prevented.

[0048] The minimum distance from the second main surface 21b of the packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 100 μm or more and 4000 μm or less. The minimum distance from the first main surface 21a of the packaging material 20 to the first joint portion 71A of the first outwardly bent terminal 61 is preferably 100 μm or more and 4000 μm or less. The minimum distance from the first side surface 22a of the packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 100 μm or more and 4000 μm or less. The minimum distance from the second side surface 22b of the packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 100 μm or more and 4000 μm or less.

[0049] The minimum distance from the first end face 23a of the packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 300 μm or more and 5000 μm or less. The minimum distance from the second end face 23b of the packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 300 μm or more and 5000 μm or less. The average distance in the length direction L from the surface 23c1 of the first end face 23a of the packaging material 20 on the first main surface 21a side to the first rising portion 72A of the first outwardly bent terminal 61 is preferably 200 μm or more and 4900 μm or less. The average distance in the length direction L from the surface 23c1 of the second end face 23b of the packaging material 20 on the first main surface 21a side to the second rising portion 72B of the second outwardly bent terminal 62 is preferably 200 μm or more and 4900 μm or less.

[0050] The exterior material 20 is preferably made of resin. For example, the exterior material 20 may be formed by molding engineering plastic using a transfer molding method, an injection molding method, or the like. In particular, the material of the exterior material 20 is preferably made of a thermosetting epoxy resin. This ensures adhesion between the exterior material 20 and the multilayer ceramic capacitor body 30 and the first metal terminal 60A, and improves the withstand voltage and moisture resistance. The exterior material 20 may be formed by painting, for example, a liquid or powdered silicone-based or epoxy-based resin.

[0051] In this way, the exterior packaging material 20 covers a wide range of the conductive metal parts, such as the external electrode 50 and the first metal terminal 60A, thereby ensuring a creepage distance (insulating surface distance) between the conductors. Furthermore, the wide range of the conductive metal parts covered by the exterior packaging material 20 can avoid the risk of surface discharge.

[0052] The shape of the exterior packaging material 20 is not particularly limited. For example, it may be a truncated cone such as a truncated pyramid. The shape of the corners of the exterior packaging material 20 is not particularly limited and may be rounded.

[0053] The above is the configuration of the first multilayer ceramic capacitor 1A according to the embodiment. Next, a second multilayer ceramic capacitor 1B shown in FIGS. 2A and 2B will be described. As described above, the second multilayer ceramic capacitor 1B differs only in that the shape of the pair of metal terminals 60 is an inwardly bent type, as opposed to the outwardly bent type of the first multilayer ceramic capacitor 1A. The other components of the exterior packaging material 20 and the multilayer ceramic capacitor body 30 are common to the first multilayer ceramic capacitor 1A. Therefore, in FIGS. 2A and 2B, the same reference numerals are used to designate the components common to the first multilayer ceramic capacitor 1A shown in FIGS. 1A and 1B (the exterior packaging material 20 and the multilayer ceramic capacitor body 30), and their description will be omitted. Instead, a description will be given of the second metal terminals 60B as the pair of metal terminals 60 provided in the second multilayer ceramic capacitor 1B.

[0054] 2A is a side view of the second multilayer ceramic capacitor 1B. FIG. 2B is a plan view of the second multilayer ceramic capacitor 1B, taken along the line IIB in FIG. 2A. As shown in FIGS. 2A and 2B, the pair of second metal terminals 60B includes a first inner bent terminal 65 and a second inner bent terminal 66. The first inner bent terminal 65 and the second inner bent terminal 66 are metal terminals mounted on the mounting surface of a mounting board on which the multilayer ceramic capacitor 1 is to be mounted. The first outer bent terminal 65 and the second inner bent terminal 66 are, for example, plate-shaped lead frames.

[0055] As shown in FIG. 2A, the first inwardly bent terminal 65 is bent in the height direction L of the multilayer ceramic capacitor body 30, and the tip portion thereof is bent inward in the length direction L around the first main surface 21a side of the exterior packaging material 20. The first inwardly bent terminal 65 has a first joint portion 81A facing and connected to a portion of the first external electrode 50A located on the first main surface 41a side, a first rising portion 82A connected to the first joint portion 81A and extending away from the mounting surface of the mounting board while moving away from the opposing first end face 43a, a first extension portion 83A connected to the first rising portion 82A and extending in the length direction L away from the multilayer ceramic capacitor body 30, a first falling portion 84A connected to the first extension portion 83A and extending toward the mounting surface of the mounting board, and a first mounting portion 85A connected to the first falling portion 84A, bent to face the first main surface 21a of the outer casing 20, and extending in a direction along the mounting surface of the mounting board. The first falling portion 84A extends toward the mounting surface in a direction approximately perpendicular to the mounting surface. The first mounting portion 85A extends toward the center in the length direction L of the multilayer ceramic capacitor body 30, that is, toward the inside, along the mounting surface.

[0056] The second inwardly bent terminal 66 is bent in the height direction T of the multilayer ceramic capacitor body 30, and its tip portion is bent inward in the length direction L around the first main surface 21a of the exterior material 20. The second inwardly bent terminal 66 has a second joint portion 81B facing and connected to a portion of the second external electrode 50B arranged on the first main surface 41a side, a second rising portion 82B connected to the second joint portion 81B and extending away from the mounting surface of the mounting board while moving away from the opposing second end face 43b, a second extension portion 83B connected to the second rising portion 82B and extending in the length direction L away from the multilayer ceramic capacitor body 30, a second falling portion 84B connected to the second extension portion 83B and extending toward the mounting surface of the mounting board, and a second mounting portion 85B connected to the second falling portion 84B, bent to face the first main surface 21a of the outer casing 20, and extending in a direction along the mounting surface of the mounting board. The second falling portion 84B extends toward the mounting surface in a direction approximately perpendicular to the mounting surface. The second mounting portion 85B extends toward the center in the length direction L of the multilayer ceramic capacitor body 30, that is, toward the inside, along the mounting surface.

[0057] According to the second multilayer ceramic capacitor 1B having a pair of inwardly bent second metal terminals 60B, the overall length direction L dimension is shortened, so that the mounting area required when mounting the second multilayer ceramic capacitor 1B on a mounting board can be reduced, thereby achieving space savings.

[0058] The first mounting portion 85A and the second mounting portion 85B may extend parallel to the mounting surface, or may extend at an angle away from the mounting surface toward the center in the longitudinal direction L of the multilayer ceramic capacitor body 30. In this case, when the second multilayer ceramic capacitor 1B is mounted on the mounting substrate, a bonding material such as solder can be introduced into this portion, thereby increasing the mounting strength. Furthermore, the second multilayer ceramic capacitor 1B can be stably disposed on the mounting surface of the mounting substrate.

[0059] The above is the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B as the multilayer ceramic capacitor 1 according to the embodiment. In both the first multilayer ceramic capacitor 1A and the multilayer ceramic capacitor 1B according to the embodiment, one multilayer ceramic capacitor body 30 is housed inside the packaging material 20 to form the body portion 10, but the body portion 10 is not limited to this. For example, the body portion 10 may be formed by housing a plurality of multilayer ceramic capacitor bodies 30 inside the packaging material 20. For example, a plurality of multilayer ceramic capacitor bodies 30 may be housed inside the packaging material 20 in a state where they are arranged in parallel. Alternatively, a plurality of multilayer ceramic capacitor bodies 30 may be housed inside the packaging material 20 in a state where they are stacked in two or more layers.

[0060] 3A to 6, a characteristic measuring device 100 according to an embodiment for measuring the characteristics of the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B according to the above-described embodiment will be described. In the following description, unless there is a need to separately describe the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B, they will be collectively referred to as the multilayer ceramic capacitor 1, and the first metal terminals 60A and the second metal terminals 60B will be collectively referred to as the metal terminals 60.

[0061] 3A and 3B are front views showing the main parts of characteristic measurement apparatus 100 according to an embodiment, with FIG. 3A showing a measurement standby state and FIG. 3B showing a measurement state. FIG. 4 shows a perspective view of characteristic measurement apparatus 100 excluding a pressing unit 500 (described later), and FIG. 5 is a plan view thereof. FIG. 6 is an enlarged plan view of the portion indicated by VI in FIG. 5, showing the measurement state. In FIGS. 3A to 6, the length direction of characteristic measurement apparatus 100 is indicated by arrow X, the width direction perpendicular to length direction X is indicated by arrow Y, and the height direction (up-down direction) perpendicular to length direction X and width direction Y is indicated by arrow Z. As shown in FIG. 5, characteristic measurement apparatus 100 has a bilaterally symmetrical structure with respect to a center line CL in width direction Y as a line of symmetry. In the following, width direction W may also be referred to as the left-right direction.

[0062] As shown in Figures 3A and 3B, the characteristic measuring device 100 includes a base 110, a housing section 200 that houses the multilayer ceramic capacitor 1, a measuring section 300 that includes a pair of measurement probes 400 arranged on both sides of the housing section 200 in the width direction Y, and a pressing section 500 that presses down the multilayer ceramic capacitor 1 housed in the housing section from above.

[0063] The base 110 includes a base board 120 that is installed substantially horizontally, a central base 130 that is installed in the center of the base board 120 in the width direction Y, and a pair of left and right slider bases, a first slider base 141 and a second slider base 142, that are arranged on both sides of the base board 120 in the width direction Y. A storage block 150 that has a convex shape when viewed from the front is arranged on the central base 130.

[0064] 4 and 5, a plurality of the storage sections 200 are provided on the storage block 150. The plurality of storage sections 200 are arranged in parallel and adjacent to each other in the length direction X.

[0065] The accommodating section 200 accommodates one multilayer ceramic capacitor 1. The multilayer ceramic capacitor 1 is accommodated in the accommodating section 200 with its length direction L aligned with the width direction Y of the characteristic measuring device 100, its width direction W aligned with the length direction X of the characteristic measuring device 100, and its height direction T aligned with the height direction Z of the characteristic measuring device 100. The accommodating section 200 is open upward, and the multilayer ceramic capacitor 1 is dropped into the accommodating section 200 through the opening. Note that both the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are accommodated in the accommodating section 200 with their first main surfaces 21a facing downward.

[0066] 4 and 5, the accommodation section 200 has a rectangular frame-shaped partition wall 210 standing upright on the upper surface of the accommodation block 150. Inside the partition wall 210, a rectangular accommodation space for accommodating one multilayer ceramic capacitor 1 is formed.

[0067] 5, the partition wall 210 has a pair of end wall portions 220 facing each other in the width direction Y and a pair of side wall portions 230 facing each other in the length direction X. An end notch 221 that penetrates through the pair of end wall portions 220 in the width direction Y and opens upward is formed in the center of each of the pair of end wall portions 220. A side notch 231 that penetrates through the pair of side wall portions 230 in the length direction X and opens upward is formed in the center of each of the pair of side wall portions 230.

[0068] The accommodation portion 200 includes a bottom surface 240 formed by the upper surface of the accommodation block 150. The bottom surface 240 is a substantially horizontal surface that faces the first main surface 21a disposed below the multilayer ceramic capacitor 1 and supports the multilayer ceramic capacitor 1 in a substantially horizontal state. The bottom surface 240 has a groove-like slit 241 as a recess extending in the longitudinal direction X. The slit 241 has a dimension that extends over the entire length of the multilayer ceramic capacitor 1 in the width direction W accommodated in the accommodation portion 200. The slits 241 of the accommodation portion 200 of the embodiment are continuous in the direction in which the multiple accommodation portions 200 are arranged side by side. That is, one slit 242 extending along the longitudinal direction X is formed on the upper surface of the accommodation block 150, and the single slit 242 constitutes the slit 241 for each accommodation portion 200.

[0069] 4 and 5, the storage sections 200 adjacent to each other in the longitudinal direction X share one side wall section 230. That is, one side wall section 230 constitutes both side wall sections 230. Therefore, the internal spaces of the adjacent storage sections 200 communicate with each other via the side cutout 231.

[0070] Partition walls 250 extending along the width direction Y are formed on the outer sides of the side wall portions 230 shared by adjacent storage portions 200 in the width direction Y, i.e., on the side away from the storage portion 200. These partition walls 250 stand upright on the upper surface of the storage block 150 in a manner that continues on an extension of the side wall portions 230 toward the outside in the width direction Y. The partition walls 250 include a first partition wall 251 on the left side in the width direction Y in Figures 4 and 5 and on the side of a first slider 351, which will be described later, and a second partition wall 252 on the right side in the width direction Y in Figures 4 and 5 and on the side of a second slider 352, which will be described later.

[0071] The metal terminals 60 of the multilayer ceramic capacitor 1 accommodated in the accommodating portion 200, which are exposed from the exterior of the exterior packaging material 20, are partially exposed outward in the width direction W from the end notch 221. This allows a measuring probe 400, which will be described later, to come into contact with the metal terminals 60. The partition wall 250 is exposed in this manner and is disposed between a pair of metal terminals 60 adjacent to each other in the longitudinal direction X. In other words, the partition wall 250 isolates the metal terminals 60 of the multilayer ceramic capacitors 1 accommodated in accommodating portions 200 adjacent to each other in the longitudinal direction X in the parallel arrangement direction of the adjacent accommodating portions 200.

[0072] When a first multilayer ceramic capacitor 1A is accommodated in each of a pair of accommodating portions 200 adjacent to each other in the longitudinal direction X, the first outwardly bent terminals 61 adjacent to each other in the longitudinal direction X are isolated from each other in the parallel direction by the first partition walls 251, and the second outwardly bent terminals 62 adjacent to each other in the longitudinal direction X are isolated from each other in the parallel direction by the second partition walls 252.

[0073] When the second multilayer ceramic capacitor 1B is accommodated in each of a pair of accommodating portions 200 adjacent to each other in the longitudinal direction X, the first inwardly bent terminals 65 adjacent to each other in the longitudinal direction X are isolated from each other in the parallel direction by the first partition walls 251, and the second inwardly bent terminals 66 adjacent to each other in the longitudinal direction X are isolated from each other in the parallel direction by the second partition walls 252.

[0074] When the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are accommodated in a pair of accommodation portions 200 adjacent to each other in the longitudinal direction X, the first outer bent terminal 61 and the first inner bent terminal 65 adjacent to each other in the longitudinal direction X are isolated from each other in the parallel direction by the first partition wall 251, and the second outer bent terminal 62 and the second inner bent terminal 66 adjacent to each other in the longitudinal direction X are isolated from each other in the parallel direction by the second partition wall 252.

[0075] The measuring section 300 includes a pair of measuring probes 400 that respectively contact a pair of metal terminals 60 of the multilayer ceramic capacitor 1 housed in the housing section 200, and a pair of sliders 350 that move each of these measuring probes 400 toward and away from the metal terminals 60.

[0076] The slider 350 includes a first slider 351 disposed on the first slider base 141 and a second slider 352 disposed on the second slider base 142. The pair of measurement probes 400 includes a first measurement probe 410 provided on the first slider 351 and a second measurement probe 420 provided on the second slider 352.

[0077] The first slider 351 is supported on the first slider base 141 via a slider block 351a fixed integrally to the underside thereof so as to be slidable in the width direction Y. This allows the first slider 351 to advance and retreat relative to the accommodation block 150 which includes the plurality of accommodation sections 200. The first slider 351 has built-in first measurement probes 410 which extend substantially along the width direction Y in correspondence with the plurality of accommodation sections 200.

[0078] The first measuring probe 410 has a first tip contact portion 411 as a tip contact portion and a first rear end wiring portion 412 as a rear end wiring portion. The first tip contact portion 411 of the first measuring probe 410 protrudes from the tip of the first slider 351 in the advancing direction toward the containing block 150. The multiple first measuring probes 410 advance and retreat together with the first slider 351 relative to the corresponding containing section 200. When advancing, the first measuring probes 410 face the metal terminals 60 of the multilayer ceramic capacitor 1 contained in the containing section 200, and the first tip contact portion 411 comes into contact with the facing metal terminals 60, thereby enabling measurement.

[0079] The advance stroke of the first measuring probe 410 by the first slider 351 is set so that the first tip contact portion 411 reliably contacts the metal terminal 60 of the multilayer ceramic capacitor 1. The first measuring probe 410 is supported by a spring (not shown) so that even if the distance between the metal terminal 60 and the first tip contact portion 411 varies depending on the shape of the metal terminal 60 or the like, the distance is absorbed and the first tip contact portion 411 resiliently contacts the metal terminal 60. As shown in FIGS. 5 and 6 , first groove-shaped recesses 351c are formed on the surface of the first slider 351 facing each first partition wall 251, into which the first partition walls 251 enter to allow the first slider 351 to advance when the first slider 351 advances toward the accommodation section 200 for measurement.

[0080] A plurality of first grooves 355 are provided at the end of the first slider 351 in the retraction direction away from the housing block 150, corresponding to the plurality of first measurement probes 410. A first rear end connection 412 of the first measurement probe 410 is disposed in the first groove 355. The first groove 355 opens in the retraction direction of the first slider 351 and upward. The plurality of first grooves 355 are partitioned in the parallel arrangement direction of the plurality of first measurement probes 410 by a plurality of first rear wall portions 355A integral with the first slider 351. The first rear end connection 412 of the first measurement probe 410 is connected to wiring (not shown). The wiring is, for example, a power supply wiring and a measurement signal wiring. The first rear end connection 412 is disposed within the first groove 355. Of the multiple first rear wall portions 355A, the first rear wall portion 355A that separates adjacent first groove portions 355 constitutes a first shielding wall 355B that serves as a shielding wall that isolates a pair of adjacent first rear end wiring portions 412 from each other in the parallel direction.

[0081] The second slider 352 is supported on the second slider base 142 via a slider block 352a fixed integrally to the underside thereof so as to be slidable in the width direction Y. This allows the second slider 352 to advance and retreat relative to the accommodation block 150 which includes the plurality of accommodation sections 200. The second slider 352 has built-in second measurement probes 420 which extend substantially along the width direction Y in correspondence with the plurality of accommodation sections 200.

[0082] The second measuring probe 420 has a second front end contact portion 421 as a front end contact portion and a second rear end wiring portion 422 as a rear end wiring portion. The second front end contact portion 421 of the second measuring probe 420 protrudes from the front end of the second slider 352 in the advancing direction toward the containing block 150. The second measuring probes 420 advance and retreat together with the second slider 352 relative to the corresponding containing section 200. When advancing, the second measuring probes 420 face the metal terminals 60 of the multilayer ceramic capacitor 1 contained in the containing section 200, and the second front end contact portion 421 comes into contact with the facing metal terminals 60, thereby enabling measurement.

[0083] The advance stroke of the second measurement probe 420 by the second slider 352 is set so that the second tip contact portion 421 reliably contacts the metal terminal 60 of the multilayer ceramic capacitor 1. The second measurement probe 420 is supported by a spring (not shown) so that even if the distance between the metal terminal 60 and the second tip contact portion 421 varies depending on the shape of the metal terminal 60 or the like, the distance is absorbed and the second tip contact portion 421 resiliently contacts the metal terminal 60. As shown in FIGS. 5 and 6 , the surface of the second slider 352 facing each second partition wall 252 is provided with second groove-shaped recesses 352c into which the second partition walls 252 enter to allow the second slider 352 to advance when the second slider 352 advances toward the accommodation section 200 for measurement.

[0084] A plurality of second grooves 357 are provided at the end of the second slider 352 on the retraction direction side away from the containing block 150, corresponding to the plurality of second measurement probes 420. The second grooves 357 are arranged with second rear end wiring connections 422 of the second measurement probes 420. The second grooves 357 are open in the retraction direction of the second slider 352 and upward. The plurality of second grooves 357 are partitioned in the parallel arrangement direction of the plurality of second measurement probes 420 by a plurality of second rear wall portions 357A integral with the second slider 352. The second rear end wiring connections 422 of the second measurement probes 420 are connected to wiring (not shown). The wiring is, for example, a power supply wiring and a measurement signal wiring. The second rear end wiring connections 422 are arranged within the second grooves 357. Of the multiple second rear wall portions 357A, the second rear wall portions 357A that separate adjacent second groove portions 357 constitute second shielding walls 357B that serve as shielding walls that isolate a pair of adjacent second rear end wiring portions 422 from each other in the parallel direction.

[0085] 3A and 3B, the pressing part 500 is arranged above the accommodating part 200 so as to be movable up and down. That is, the pressing part 500 is arranged to face the second main surface 21b arranged on the upper side of the multilayer ceramic capacitor 1 accommodated in the accommodating part 200 so as to be movable toward and away from the second main surface 21b.

[0086] The pressing unit 500 includes a pressing pin 510 that presses down the multilayer ceramic capacitor 1 accommodated in the accommodation unit 200 from above. A pressing pin 510 is provided for each of the accommodation units 200. The pressing pins 510 are provided on the lower end surface of a vertically movable head 520. The vertically movable head 520 is driven up and down by a driving unit 530 configured with an air cylinder or the like. Therefore, the pressing pins 510 are moved up and down collectively by the driving unit 530 via the vertically movable head 520. When the vertically movable head 520 descends, the pressing pin 510 comes into contact with the second main surface 21b of the upward-facing external packaging material 20 of the multilayer ceramic capacitor 1 accommodated in the accommodation unit 200, and presses the external packaging material 20 downward from the second main surface 21b. The pressing pin 510 may press the external packaging material 20 downward with a certain amount of pressure.

[0087] The characteristic measuring device 100 of the embodiment has a plurality of accommodation sections 200 arranged in parallel in the longitudinal direction X, and each of the plurality of accommodation sections 200 is provided with a pair of measurement probes 400 (a first measurement probe 410 and a second measurement probe 420) of the measurement section 300 and a presser pin 510 of the presser section 500. In the embodiment, one measurement system 600 is configured by one accommodation section 200, the first measurement probe 410 and the second measurement probe 420 arranged for this one accommodation section 200, and one presser pin 510. Therefore, the characteristic measuring device 100 of the embodiment has a plurality of measurement systems 600 arranged in parallel in the longitudinal direction X.

[0088] The above is the configuration of the characteristic measuring device 100 according to the embodiment. This characteristic measuring device 100 measures the characteristics of the multilayer ceramic capacitor 1 as follows. The characteristics to be measured include, but are not limited to, the dielectric loss tangent and the withstand voltage, which are measured by applying a voltage.

[0089] First, as shown in Fig. 3A, the first slider 351 and the second slider 352 are retracted outward in the width direction W from the storage block 150, and the measurement unit 300 is placed in a standby state in which the first measurement probe 410 and the second measurement probe 420 are separated from the storage unit 200. Also, as shown in Fig. 3A, the up-and-down moving head 520 is moved upward from the storage block 150, and the pressing unit 500 is placed in a standby state in which the pressing pin 510 is separated upward from the storage unit 200.

[0090] In the standby state, the multilayer ceramic capacitors 1 are accommodated in the multiple accommodation sections 200. The multilayer ceramic capacitor 1 is placed on the bottom surface 240 of the accommodation section 200 with the first main surface 21a of the exterior material 20 facing downward, and is supported by the bottom surface 240. A portion of the metal terminal 60 is exposed to the outside in the width direction W from the end notch 221 of the end wall section 220.

[0091] Next, the vertically movable head 520 is lowered to advance the pressing pin 510 toward the accommodation portion 200 and bring it into contact with the multilayer ceramic capacitor 1. The pressing pin 510 comes into contact with the second main surface 21b of the outer casing 20 facing upward, thereby restricting the outer casing 20 from moving upward or horizontally. In this way, the multilayer ceramic capacitor 1 is held in the accommodation portion 200.

[0092] Next, the first slider 351 and the second slider 352 are moved toward the containing block 150 to the measurement position, and the first measuring probe 410 and the second measuring probe 420 are brought into contact with a pair of metal terminals 60 of the multilayer ceramic capacitor 1 to enter a measurement state. FIGS. 3B and 6 show this measurement state. At this time, as shown in FIG. 6, the first partition wall 251 enters the first groove-shaped recess 351c of the first slider 351, and the first partition wall 252 enters the second groove-shaped recess 352c of the second slider 352.

[0093] When the multilayer ceramic capacitor 1 accommodated in the accommodation portion 200 is the first multilayer ceramic capacitor 1A, the first measurement probe 410 has a first tip contact portion 411 that contacts the outer surface of the first outwardly bent terminal 61 of the first metal terminal 60A, and the second measurement probe 420 has a second tip contact portion 421 that contacts the outer surface of the second outwardly bent terminal 62 of the first metal terminal 60A. For example, the first tip contact portion 411 contacts the first falling portion 74A of the first outwardly bent terminal 61, and the second tip contact portion 421 contacts the second falling portion 74B of the second outwardly bent terminal 62.

[0094] When the multilayer ceramic capacitor 1 accommodated in the accommodation portion 200 is the second multilayer ceramic capacitor 1B, the first measuring probe 410 has a first tip contact portion 411 that contacts the outer surface of the first inner-bent terminal 65 of the second metal terminal 60B, and the second measuring probe 420 has a second tip contact portion 421 that contacts the outer surface of the second inner-bent terminal 66 of the second metal terminal 60B. For example, the first tip contact portion 411 contacts the first falling portion 84A of the first inner-bent terminal 65, and the second tip contact portion 421 contacts the second falling portion 84B of the second outer-bent terminal 66.

[0095] A predetermined measurement voltage is applied to the multilayer ceramic capacitor 1 from the first measurement probe 410 and the second measurement probe 420 by a predetermined measurement tool, and measurement is performed. The measurement signal is fed back to the measurement tool via the first measurement probe 410 and the second measurement probe 420. When the measurement is completed, the first slider 351 and the second slider 352 are retracted from the containing block 150 to return the measurement unit 300 to the standby state, and the first measurement probe 410 and the second measurement probe 420 are separated from the multilayer ceramic capacitor 1.

[0096] Next, the vertically movable head 520 is raised and returned to the standby state, and the pressing pin 510 is moved upward away from the accommodating section 200 .

[0097] This completes the measurement. If there is a new multilayer ceramic capacitor 1 to be measured, the new multilayer ceramic capacitor 1 is accommodated in the accommodation portion 200, and the above-described measurement steps are carried out in the same manner.

[0098] According to the characteristic measuring device 100 of the embodiment, since it is equipped with a plurality of measurement systems 600 including the accommodation portions 200, it is possible to perform measurements successively or simultaneously on a plurality of types of multilayer ceramic capacitors 1, i.e., the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B of the embodiment, to manufacture these multilayer ceramic capacitors 1A, 1B.

[0099] That is, as shown in Fig. 6, at least one of the multiple measurement systems 600 is set as a first measurement system 610, and at least one of the other measurement systems 600 is set as a second measurement system 620. Specifically, two first measurement systems 610 and one second measurement system 620 are set in Fig. 6. Then, a first multilayer ceramic capacitor 1A is accommodated in the accommodation portion 200 of the first measurement system 610, and a second multilayer ceramic capacitor 1B is accommodated in the accommodation portion 200 of the second measurement system 620. Next, the first measurement system 610 measures the first multilayer ceramic capacitor 1A, and the second measurement system 620 measures the second multilayer ceramic capacitor 1B, using the above-mentioned measurement process.

[0100] Here, the measurement step of bringing the pair of measurement probes 400 into contact with the pair of first metal terminals 60A of the first multilayer ceramic capacitor 1A in the first measurement system 610 is called the first measurement step, and the measurement step of bringing the pair of measurement probes 400 into contact with the pair of second metal terminals 60B of the second multilayer ceramic capacitor 1B in the second measurement system 620 is called the second measurement step. The first and second measurement steps can be performed consecutively or simultaneously. This makes it possible to measure different types of multilayer ceramic capacitors 1A, 1B and manufacture these multilayer ceramic capacitors 1A, 1B without changing the setup to match the type of multilayer ceramic capacitor 1.

[0101] According to the embodiment described above, the following effects are achieved.

[0102] (1) A characteristic measuring device 100 according to an embodiment is a measuring device for measuring the characteristics of a multilayer ceramic capacitor 1 as a multilayer ceramic electronic component, which includes a substantially rectangular parallelepiped main body 10 having a pair of main surfaces 21 opposing each other in a height direction T, a pair of side surfaces 22 opposing each other in a width direction W, and a pair of end surfaces 23 opposing each other in a length direction L, and a pair of metal terminals 60 disposed on the outer sides of the pair of end surfaces 23, and includes a housing 20 that houses the multilayer ceramic capacitor 1 with the pair of main surfaces 21 disposed on the upper and lower sides, respectively, and with both the length direction L and the width direction W being substantially horizontal. 0, a measuring unit 300 including a pair of measuring probes 400 arranged to be able to advance and retreat opposite each of the pair of metal terminals 60 of the multilayer ceramic capacitor 1 accommodated in the accommodating portion 200, and which contact the opposing metal terminals 60 when advanced, and a pressing unit 500 arranged to be able to advance and retreat opposite the second main surface 21b arranged on the upper side of the multilayer ceramic capacitor 1 accommodated in the accommodating portion 200, and which contacts the opposing upper second main surface 21b when advanced, thereby pressing the multilayer ceramic capacitor 1 from the second main surface 21b.

[0103] According to the characteristic measuring device 100 of the embodiment, when the pair of measurement probes 400 are brought into contact with the metal terminals 60 of the multilayer ceramic capacitor 1 to measure the characteristics, the multilayer ceramic capacitor 1 is pressed down by the press pins 510 of the press unit 500, thereby holding the multilayer ceramic capacitor 1 in the accommodating portion 200. This allows the multilayer ceramic capacitor 1 to be stably held in the accommodating portion 200. If the multilayer ceramic capacitor 1 were not pressed down by the press pins 510 of the press unit 500, when the pair of measurement probes 400 contacted the metal terminals 60 in that state, the pressing force from the measurement probes 400 could cause the multilayer ceramic capacitor 1 to move, for example by being flipped upward, and the measurement probes 400 could not properly contact the metal terminals 60. However, according to the characteristic measuring device 100 of the embodiment, when the measurement probes 400 contact the metal terminals 60 of the multilayer ceramic capacitor 1, the press pins 510 press down and restrict movement, so there is no risk of the multilayer ceramic capacitor 1 moving and causing poor contact of the measurement probes 400. Therefore, the measurement can be performed stably.

[0104] (2) In the characteristic measuring device 100 according to the embodiment, the accommodating portion 200 preferably includes a bottom surface 240 that supports the multilayer ceramic capacitor 1 opposite the first main surface 21a located below, and the bottom surface 240 preferably has a slit 241 as a recess extending over at least the entire length of the multilayer ceramic capacitor 1 accommodated in the accommodating portion 200 in the width direction W.

[0105] This allows the multilayer ceramic capacitor 1 to increase the effective creepage distance between the pair of metal terminals 60 when housed in the housing portion 200, thereby suppressing discharge between the pair of metal terminals 60.

[0106] (3) The characteristic measuring device 100 according to the embodiment includes a plurality of measurement systems 600, and the plurality of measurement systems 600 preferably have accommodating sections 200 arranged adjacent to each other so that the multilayer ceramic capacitors 1 accommodated in the accommodating sections 200 are parallel to each other in the width direction W, and have partition walls 250 that isolate the metal terminals 60 of the multilayer ceramic capacitors 1 accommodated in adjacent accommodating sections 200 from each other in the parallel direction of the adjacent accommodating sections 200.

[0107] This makes it possible to suppress discharge between the metal terminals 60 of adjacent multilayer ceramic capacitors 1.

[0108] (4) In the characteristic measuring device 100 according to the embodiment, the first measuring probe 410 as the measuring probe 400 includes a first tip contact portion 411 that contacts the metal terminal 60 and a first rear end wiring portion 412, and the second measuring probe 420 as the measuring probe 400 includes a second tip contact portion 421 that contacts the metal terminal 60 and a second rear end wiring portion 422, and preferably has a first shielding wall 355B that isolates a pair of adjacent first rear end wiring portions 412 from each other in the parallel direction, and a second shielding wall 357B that isolates a pair of adjacent second rear end wiring portions 422 from each other in the parallel direction.

[0109] This makes it possible to suppress discharge between the first rear end wire connections 412 and the second rear end wire connections 422 of adjacent multilayer ceramic capacitors 1.

[0110] (5) A method for manufacturing a multilayer ceramic capacitor according to an embodiment includes preparing a first multilayer ceramic capacitor 1A having a pair of metal terminals 60 each of which is a first metal terminal 60A, and a second multilayer ceramic capacitor 1B having a pair of metal terminals 60 each of which is a second metal terminal 60B, and measuring the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B using a characteristic measuring device 100 according to an embodiment, wherein at least one of a plurality of measurement systems 600 of the characteristic measuring device 100 is set as a first measurement system 610, and the first measurement system 610 At least one of the measurement systems 600 other than the first measurement system 610 is set as a second measurement system 620, and the measurement method includes a first measurement step of accommodating a first multilayer ceramic capacitor 1A in the accommodating section 200 of the first measurement system 610 and bringing a pair of measurement probes 400 of the first measurement system 610 into contact with each of a pair of first metal terminals 60A, and a second measurement step of accommodating a second multilayer ceramic capacitor 1B in the accommodating section 200 of the second measurement system 620 and bringing a pair of measurement probes 400 of the second measurement system 620 into contact with each of a pair of second metal terminals 60B, and the first measurement step and the second measurement step are performed consecutively or simultaneously.

[0111] This makes it possible to measure the different types of multilayer ceramic capacitors 1A, 1B and manufacture the multilayer ceramic capacitors 1A, 1B without changing the setup to suit the different types of multilayer ceramic capacitors 1A, 1B.

[0112] 6 , during measurement, the first partition 251 fits into the first groove-shaped recess 351c of the first slider 351, and the second partition 252 fits into the second groove-shaped recess 352c of the second slider 352. As a result, a pair of first measurement probes 410 adjacent to each other in the longitudinal direction X are separated by the first partition 251 and the first slider 351, thereby suppressing discharge between the first measurement probes 410. Furthermore, a pair of second measurement probes 410 adjacent to each other in the longitudinal direction X are separated by the second partition 252 and the second slider 352, thereby suppressing discharge between the second measurement probes 420.

[0113] Although the embodiments have been described above, the present disclosure is not limited to these embodiments, and can be implemented in various forms without departing from the gist of the present disclosure.

[0114] In the above embodiment, a multilayer ceramic capacitor using a dielectric ceramic is exemplified as a multilayer ceramic electronic component, but the multilayer ceramic electronic component of the present disclosure is not limited to this and can be applied to various other multilayer ceramic electronic components such as piezoelectric components using piezoelectric ceramic, thermistors using semiconductor ceramic, inductors using magnetic ceramic, etc. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, examples of semiconductor ceramics include spinel ceramics, and examples of magnetic ceramics include ferrite.

[0115] The present disclosure includes the following combinations:

[0116] [1] A measuring device for measuring characteristics of a multilayer ceramic electronic component, comprising: a body portion having a substantially rectangular parallelepiped shape, each body portion having a pair of main surfaces opposing each other in a height direction, a pair of side surfaces opposing each other in a width direction, and a pair of end surfaces opposing each other in a length direction; and a pair of metal terminals disposed on the outer sides of the pair of end surfaces, a housing portion that houses the multilayer ceramic electronic component with the pair of main surfaces disposed on the upper and lower sides, respectively, and with both the length direction and the width direction substantially horizontal; a measuring unit including a pair of measuring probes arranged to be movable forward and backward relative to the pair of metal terminals of the multilayer ceramic electronic component accommodated in the accommodation unit, the measuring unit contacting the opposing metal terminal when the measuring probe is advanced; a pressing portion that is disposed opposite to the upper principal surface of the multilayer ceramic electronic component accommodated in the accommodation portion so as to be movable forward and backward, and that, when advanced, comes into contact with the upper principal surface that it faces and presses the multilayer ceramic electronic component against the principal surface; An apparatus for measuring characteristics of a multilayer ceramic electronic component, comprising at least one measurement system including:

[0117] [2] The housing portion includes a bottom surface that faces the main surface disposed on the lower side and supports the multilayer ceramic electronic component, The apparatus for measuring characteristics of a multilayer ceramic electronic component according to [1], wherein the bottom surface has a recess extending over at least the entire width of the multilayer ceramic electronic component accommodated in the accommodation portion.

[0118] [3] A plurality of the measurement systems is provided, the plurality of measurement systems are arranged adjacent to each other in the housing portions so that the multilayer ceramic electronic components housed in the housing portions are aligned in the width direction, The device for measuring characteristics of a multilayer ceramic electronic component according to [1] or [2], further comprising a partition wall that isolates the metal terminals of the multilayer ceramic electronic components housed in adjacent housing sections from each other in the parallel direction of the adjacent housing sections.

[0119] [4] The measurement probe includes a tip contact portion that contacts the metal terminal and a rear connection portion that is connected to a wiring, The apparatus for measuring characteristics of a multilayer ceramic electronic component according to [3], further comprising a shielding wall that separates a pair of the rear-end connection portions adjacent in the parallel direction from each other in the parallel direction.

[0120] [5] The multilayer ceramic electronic component includes: a first multilayer ceramic electronic component in which each of the pair of metal terminals is a first metal terminal; a second multilayer ceramic electronic component in which each of the pair of metal terminals is a second metal terminal; A manufacturing method for measuring the first multilayer ceramic electronic component and the second multilayer ceramic electronic component using the characteristic measuring device for multilayer ceramic electronic components according to [3] or [4], At least one of the plurality of measurement systems is set as a first measurement system, and at least one of the measurement systems other than the first measurement system is set as a second measurement system; a first measurement step of accommodating the first monolithic ceramic electronic component in the accommodation portion of the first measurement system and bringing the pair of measurement probes of the first measurement system into contact with the pair of first metal terminals, respectively; a second measurement step of accommodating the second monolithic ceramic electronic component in the accommodation portion of the second measurement system and bringing the pair of measurement probes of the second measurement system into contact with the pair of second metal terminals, respectively; The method for manufacturing a multilayer ceramic electronic component comprises carrying out the first measuring step and the second measuring step consecutively or simultaneously. [Explanation of symbols]

[0121] 1...Multilayer ceramic capacitor (multilayer ceramic electronic component) 1A...First multilayer ceramic electronic component 1B...Second multilayer ceramic electronic component 10...Main body 21...Main surface of main body 22...Side of main body 23...End face of main body 60…Metal terminal 60A...First metal terminal 60B...Second metal terminal 100...Characteristics measuring device 200…Storage section 240...Bottom 241...Slit (recess) 250…Bulkhead 300…Measurement part 355B...First barrier (barrier) 357B...Second barrier (barrier) 400...Measuring probe 411...First tip contact portion (tip contact portion) 412...First rear end connection part (rear end connection part) 421...Second tip contact portion (tip contact portion) 422...Second rear end wiring portion (rear end wiring portion) 500...Pressing part 600...Measurement system 610...First measurement system 620...Second measurement system

Claims

1. A measuring device for measuring characteristics of a multilayer ceramic electronic component, the measuring device comprising: a substantially rectangular parallelepiped main body having a pair of main surfaces opposing each other in a height direction, a pair of side surfaces opposing each other in a width direction, and a pair of end surfaces opposing each other in a length direction; and a pair of metal terminals disposed on the outer sides of the pair of end surfaces, a housing portion that houses the multilayer ceramic electronic component with the pair of main surfaces disposed on the upper and lower sides, respectively, and with both the length direction and the width direction being substantially horizontal; a measuring unit including a pair of measuring probes arranged to be movable forward and backward relative to the pair of metal terminals of the multilayer ceramic electronic component accommodated in the accommodation unit, the measuring unit contacting the opposing metal terminal when the measuring probe is advanced; a pressing portion that is disposed opposite to the upper principal surface of the multilayer ceramic electronic component accommodated in the accommodation portion so as to be movable forward and backward, and that, when advanced, comes into contact with the upper principal surface that it faces and presses the multilayer ceramic electronic component against the principal surface; An apparatus for measuring characteristics of a multilayer ceramic electronic component, comprising at least one measurement system including:

2. the accommodation portion includes a bottom surface that faces the main surface disposed on the lower side and supports the multilayer ceramic electronic component, 2. The apparatus for measuring characteristics of a multilayer ceramic electronic component according to claim 1, wherein the bottom surface has a recess extending over at least the entire width of the multilayer ceramic electronic component accommodated in the accommodation portion.

3. A plurality of the measurement systems is provided, the plurality of measurement systems are arranged adjacent to each other in the housing portions so that the multilayer ceramic electronic components housed in the housing portions are aligned in the width direction, 3. The device for measuring characteristics of a multilayer ceramic electronic component according to claim 1, further comprising a partition wall that isolates the metal terminals of the multilayer ceramic electronic components housed in adjacent housing sections from each other in the direction in which the adjacent housing sections are arranged side by side.

4. the measurement probe includes a tip contact portion that contacts the metal terminal and a rear connection portion that is connected to a wiring, 4. The apparatus for measuring characteristics of a multilayer ceramic electronic component according to claim 3, further comprising a shield wall that separates a pair of said rear end connection portions adjacent in said juxtaposition direction from each other in said juxtaposition direction.

5. The multilayer ceramic electronic component includes: a first multilayer ceramic electronic component in which each of the pair of metal terminals is a first metal terminal; a second multilayer ceramic electronic component in which each of the pair of metal terminals is a second metal terminal; A manufacturing method for measuring the first multilayer ceramic electronic component and the second multilayer ceramic electronic component using the characteristic measuring apparatus for multilayer ceramic electronic components according to claim 3, comprising: At least one of the plurality of measurement systems is set as a first measurement system, and at least one of the measurement systems other than the first measurement system is set as a second measurement system; a first measurement step of accommodating the first monolithic ceramic electronic component in the accommodation portion of the first measurement system and bringing the pair of measurement probes of the first measurement system into contact with the pair of first metal terminals, respectively; a second measurement step of accommodating the second monolithic ceramic electronic component in the accommodation portion of the second measurement system and bringing the pair of measurement probes of the second measurement system into contact with the pair of second metal terminals, respectively; The method for manufacturing a multilayer ceramic electronic component includes carrying out the first measuring step and the second measuring step consecutively or simultaneously.

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