Electronic module and manufacturing method for electronic module

Abstract

To provide an electronic module that can increase the heat release property compared to the conventional electronic module and suppress the adhesion of resin to a heat release surface of a substrate.SOLUTION: An electronic module 1 includes a first substrate 10, a first heat generation component 12, and mold resin, and further includes a second substrate 20 and support members 18 and 28. A first heat release surface 11 of the first substrate 10 and a second heat release surface 21 of the second substrate 20 are exposed outside the electronic module 1. Since heat release is possible from both surfaces in the electronic module 1, the heat release property can be higher than that of the conventional electronic module. In the manufacture, the pressing force is applied to a side opposite to the place where the first substrate 10 and the second substrate 20 and the support members 18 and 28 are in contact to make the first heat release surface 11 and the second heat release surface 21 in close contact with a mold die, so that the adhesion of the resin to the heat release surface can be suppressed.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an electronic module and a method for manufacturing an electronic module. [Background technology]

[0002] Conventionally, there has been known an electronic module that includes a substrate, a heat-generating component (e.g., a semiconductor chip such as a MOSFET) arranged on the substrate, a surface of the substrate on which the heat-generating component is arranged, and a molded resin that seals the heat-generating component, and in which the surface of the substrate opposite to the side on which the heat-generating component is arranged is exposed to the outside of the electronic module (see, for example, Patent Document 1).

[0003] In conventional electronic modules, the side of the substrate opposite to the side on which the heat-generating components are located is exposed to the outside of the electronic module, making it easier to dissipate heat generated by the heat-generating components to the outside of the electronic module via the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2020 / 208741 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, electronic elements are the typical heat-generating components in electronic modules, and research into electronic elements has progressed rapidly in recent years. For example, next-generation electronic elements using semiconductor materials such as SiC and GaN are beginning to be put into practical use. While such electronic elements can be made smaller (and thus more dense), greater attention must be paid to their heat dissipation. For this reason, in the technical field of electronic modules, there is a demand for improved heat dissipation in electronic modules.

[0006] One possible configuration for improving the heat dissipation of an electronic module is to add an additional substrate (second substrate) that is disposed at a distance from a conventional substrate (first substrate). In an electronic module with such a configuration, it is possible to use a member that transfers heat generated by heat-generating components disposed on the first substrate to the second substrate, or to distribute the heat-generating components between the first substrate and the second substrate. Therefore, an electronic module with the above configuration can dissipate heat from both sides, thereby improving heat dissipation compared to conventional electronic modules.

[0007] In order to manufacture the electronic module described above, it is necessary to form a mold resin to protect the internal structure of the electronic module. The mold resin is formed using a mold die. Conventional methods for manufacturing electronic modules have employed a method in which support pins are provided on the mold die and used to press components (e.g., pin terminals) that contact the substrate and protrude toward the side where the heat-generating components are located. This method allows the surface of the substrate opposite the side where the heat-generating components are located (the heat dissipation surface) to be tightly attached to the mold die, thereby preventing the resin from adhering to the heat dissipation surface.

[0008] However, when manufacturing an electronic module that has two substrates and dissipates heat from both sides, since there are substrates on both sides of the electronic module, it is not possible to directly press the components that protrude from the substrates as in conventional manufacturing methods.

[0009] The present invention has been made in view of the above-mentioned problems, and aims to provide an electronic module that can improve heat dissipation compared to conventional electronic modules and can suppress adhesion of resin to the heat dissipation surface of the substrate, as well as a method for manufacturing such an electronic module. [Means for solving the problem]

[0010] The electronic module of the present invention is an electronic module comprising a first substrate, a first heat-generating component arranged on the first substrate, a surface of the first substrate on which the first heat-generating component is arranged, and a molded resin that seals the first heat-generating component, wherein the electronic module further comprises a second substrate arranged on the side of the first substrate on which the first heat-generating component is arranged and spaced apart from the first substrate and the first heat-generating component, and a support member arranged between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, and wherein a first heat dissipation surface, which is the surface of the first substrate opposite the side on which the first heat-generating component is arranged, and a second heat dissipation surface, which is the surface of the second substrate opposite the first substrate side, are exposed to the outside of the electronic module.

[0011] The manufacturing method of the electronic module of the present invention is a manufacturing method of an electronic module for manufacturing the electronic module of the present invention, and is characterized by including a preparation step of preparing an unsealed electronic module comprising the first substrate, the first heat-generating component, the second substrate, and the support member; an arrangement step of placing the unsealed electronic module in a molding die and applying a pressing force to a portion of the first heat dissipation surface corresponding to the back side of the portion where the first substrate and the support member are in contact and to a portion of the second heat dissipation surface corresponding to the back side of the portion where the second substrate and the support member are in contact, thereby adhering the first heat dissipation surface and the second heat dissipation surface to the molding die; and a molding step of injecting resin into the molding die to form the molding resin. [Effects of the Invention]

[0012] The electronic module of the present invention includes a second substrate disposed on the side of the first substrate where the first heat-generating component is disposed, while being spaced apart from the first substrate and the first heat-generating component. Furthermore, a first heat dissipation surface, which is the surface of the first substrate opposite the side where the first heat-generating component is disposed, and a second heat dissipation surface, which is the surface of the second substrate opposite the first substrate, are exposed to the outside of the electronic module. Therefore, the electronic module of the present invention can dissipate heat from both sides, resulting in an electronic module with improved heat dissipation performance compared to conventional electronic modules.

[0013] The electronic module of the present invention also includes a support member disposed between the first substrate and the second substrate and in contact with both the first substrate and the second substrate. During manufacturing of the electronic module of the present invention, a pressing force can be applied to the side opposite the contact point between the first substrate and the support member and the side opposite the contact point between the second substrate and the support member, thereby tightly adhering the first heat dissipation surface and the second heat dissipation surface to the molding die. Therefore, the electronic module of the present invention can prevent resin from adhering to the heat dissipation surfaces of the substrates.

[0014] Therefore, the electronic module of the present invention is an electronic module that can improve heat dissipation performance compared to conventional electronic modules and can suppress adhesion of resin to the heat dissipation surface of the substrate.

[0015] A method for manufacturing an electronic module of the present invention includes a preparation step of preparing an unsealed electronic module including a first substrate, a first heat-generating component, a second substrate, and a support member. The method for manufacturing an electronic module of the present invention also includes a placement step of placing the unsealed electronic module in a molding die and applying pressure to a portion of the first heat dissipation surface corresponding to the backside of the portion where the first substrate and the support member contact each other and a portion of the second heat dissipation surface corresponding to the backside of the portion where the second substrate and the support member contact each other, thereby closely adhering the first heat dissipation surface and the second heat dissipation surface to the molding die. Therefore, the method for manufacturing an electronic module of the present invention is capable of manufacturing an electronic module of the present invention that has higher heat dissipation properties than conventional electronic modules and can suppress adhesion of resin to the heat dissipation surfaces of the substrates. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view of an electronic module 1 according to an embodiment. [Figure 2] 2A and 2B are external views of an electronic module 1 according to an embodiment. Fig. 2A is a plan view of the electronic module 1. Fig. 2B is a left side view of the electronic module 1. Fig. 2C is a bottom view of the electronic module 1. [Figure 3] 3 is a perspective view of the internal structure of the electronic module 1 according to the embodiment, and in FIG. 3, the molding resin 40, which is one of the components of the electronic module 1, is not shown. [Figure 4] 4(a) to 4(c) are plan views illustrating the internal structure of the electronic module 1 according to the embodiment. In FIG. 4(a), the second substrate 20, the second heat-generating component 22, the second spacer 25, and the molded resin 40 are not shown among the components of the electronic module 1. In FIG. 4(b), in addition to the components not shown in FIG. 4(a), the first heat transfer member 14, the first spacer 15, the first internal connection terminal 16, and the external connection terminals 30 and 35 are also not shown. In FIG. 4(c), in addition to the components not shown in FIG. 4(b), the second heat transfer member 24, the second internal connection terminal 26, and the external connection terminals 32a, 32b, 34, 36, and 37 are also not shown. In FIG. 4(c), the rectangular shape B that is the outer edge of the central region is indicated by a dashed line, and the center of gravity G of the first substrate 10, which is common to the center of gravity of the central region, is indicated by a dot. The area surrounded by rectangular shape B is the central area, and the area outside rectangular shape B is the peripheral area. Note that although part of rectangular shape B overlaps with the outer shape of first heat-generating component 12 and is difficult to see, the vertices of rectangular shape B overlap with "point F on first heat-generating component 12 that is farthest from center of gravity G of first substrate 10." [Figure 5]5(a) and 5(d) are side views illustrating the internal structure of an electronic module 1 according to an embodiment. FIG. 5(a) is a left side view of the internal structure of the electronic module 1. FIG. 5(b) is an enlarged view of the vicinity of the support member 18 in FIG. 5(a). FIG. 5(c) is a right side view of the internal structure of the electronic module 1. FIG. 5(d) is an enlarged view of the vicinity of the support member 28 in FIG. 5(c). In FIGS. 5(a) to 5(d), the mold resin 40, one of the components of the electronic module 1, is not shown. [Figure 6] 6(a) to 6(d) are side views illustrating the internal structure of an electronic module 1 according to an embodiment. FIG. 6(a) is a left side view of the internal structure of the electronic module 1. FIG. 6(b) is an enlarged view of the first heat transfer member 14 and its vicinity in FIG. 6(a). FIG. 6(c) is a right side view of the internal structure of the electronic module 1. FIG. 6(d) is an enlarged view of the second heat transfer member 24 and its vicinity in FIG. 6(c). Of the components of the electronic module 1, the support members 18 and 28, the external connection terminals 34 and 37, and the molded resin 40 are not shown in FIGS. 6(b) and 6(d). Arrows H1 to H4, indicated by dashed lines in FIGS. 6(b) and 6(d), indicate the state of heat transfer (heat dissipation) during operation. [Figure 7] 7(a) and 7(b) are bottom views illustrating the internal structure of the electronic module 1 according to the embodiment. In FIG. 7(a), the first substrate 10, the first heat-generating component 12, the first spacer 15, and the molded resin 40, which are components of the electronic module 1, are not shown. In FIG. 7(b), in addition to the components not shown in FIG. 7(a), the second heat transfer member 24, the second spacer 25, the second internal connection terminal 26, and the external connection terminals 32a, 32b, and 36 are also not shown. [Figure 8] 8(a) and 8(b) are side views illustrating a manufacturing method of an electronic module according to an embodiment. Fig. 8(a) is a left side view illustrating a preparation step S10. Fig. 8(b) is a left side view illustrating a placement step S20. Fig. 8(c) is a left side view illustrating a molding step S30. In Fig. 8(b), the arrow indicated by the symbol P indicates the location where pressing force is applied in the placement step S20. DETAILED DESCRIPTION OF THE INVENTION

[0017] The electronic module and the manufacturing method of the electronic module of the present invention will be described below based on the embodiments shown in the drawings. The embodiments described below do not limit the invention according to the claims. Furthermore, not all of the elements and combinations thereof described in the embodiments are necessarily essential to the solution of the present invention.

[0018] [Embodiment] 1. Electronic module 1 according to an embodiment 1 to 8, the electronic module 1 according to the embodiment includes a first substrate 10, a first heat-generating component 12, a first heat transfer member 14, a first spacer 15, a first internal connection terminal 16, support members 18 and 28, a second substrate 20, a second heat-generating component 22, a second heat transfer member 24, a second spacer 25, a second internal connection terminal 26, external connection terminals 30, 32a, 32b, 34, 35, 36, and 37, and a molded resin 40. Note that the electronic module 1 may include other components in addition to those described above. Each component will be described below.

[0019] The first substrate 10 is a substrate on which the first heat-generating component 12 is disposed. The first substrate 10 has a structure in which copper plates are disposed on both sides of a ceramic plate (for example, a DCB substrate). A first heat dissipation surface 11, which is the surface of the first substrate 10 opposite to the side on which the first heat-generating component 12 is disposed, is exposed to the outside of the electronic module 1 (outside the molded resin 40) (see FIG. 2(c)). The first substrate 10 is electrically connected to a first drain electrode (first second electrode, described later) of the first heat-generating component 12.

[0020] In this specification, "electrically connected" refers not only to cases where the conductive parts of the components are in direct contact with each other, but also to cases where the components are in contact with each other via another conductive component (for example, solder or a spacer).

[0021] The first heat-generating component 12 is disposed on the first substrate 10. In this specification, the term "heat-generating component" refers to an electronic component that generates heat when in use (when power is applied). Examples of heat-generating components include, but are not limited to, electronic elements (typically semiconductor chips), resistors, coils, and capacitors.

[0022] The first heat-generating component 12 is a vertical electronic component having a first electrode and a first second electrode. In this specification, a "vertical electronic component" refers to an electronic component having at least two types of electrodes (first electrode and second electrode) on its surface, with the surface on which the first electrode is located being the opposite surface to the surface on which the second electrode is located. A "vertical electronic component" can also be said to be an "electronic component having electrodes on both sides."

[0023] Specifically, the first heat-generating component 12 is a vertical MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) having a first source electrode (first first electrode) 12a arranged on the second substrate 20 side, a first drain electrode (first second electrode, not shown) arranged on the first substrate 10 side, and a first gate electrode 12b arranged on the same side as the first source electrode 12a (see FIG. 4(b)). The first heat-generating component 12 has three first source electrodes 12a.

[0024] The first heat-generating component 12 generates heat at a different timing than the second heat-generating component 22. In this specification, the condition "heat generation at different timings" is satisfied if the timings at which the heat generation of the first heat-generating component and the second heat-generating component increase or decrease during actual use do not match. Note that the above "heat generation timing" is preferably "the timing at which heat generation reaches its maximum." In this case, the above feature can also be expressed as "when the electronic module 1 is in use, the first heat-generating component 12 and the second heat-generating component 22 are controlled so that the timings at which they each generate their maximum heat are different." The electronic module 1 according to the embodiment is intended to configure a half-bridge circuit, with the first heat-generating component 12 used as the high side and the second heat-generating component 22 used as the low side.

[0025] The first heat transfer member 14 is a member that transfers heat generated by the first heat-generating component 12 to the second substrate 20 (see FIGS. 6(a) and 6(b)). The first heat transfer member 14 is a generally columnar member that is connected to the first heat-generating component 12 and the second substrate 20 so as to be able to exchange heat therewith, and whose main portion is formed as an integral unit. With respect to the first heat transfer member, "connected so as to be able to exchange heat" includes not only cases in which the first heat transfer member is in direct contact with the target component, but also cases in which the first heat transfer member is in contact with the target component via another component (e.g., solder or a spacer). The above-mentioned "another component" is preferably made of a material with good thermal conductivity (e.g., a metal material). The above points also apply to the second heat transfer member.

[0026] 6(b), the state of heat transfer (heat dissipation) regarding the first heat-generating component 12 in the electronic module 1 will be described. The first heat-generating component 12 is disposed on the first substrate 10. Therefore, the heat generated by the first heat-generating component 12 is dissipated to the outside of the electronic module 1 via the first substrate 10 (see arrow H1).

[0027] The electronic module 1 also includes a first heat transfer member 14 that transfers heat generated in the first heat-generating component 12 to the second substrate 20. Therefore, the heat generated in the first heat-generating component 12 is dissipated to the outside of the electronic module 1 via a path that passes through the first heat transfer member 14 and the second substrate 20, in addition to the path that passes through the first substrate 10 described above (see arrow H2).

[0028] The first heat transfer member 14 is made of a conductive material and is electrically connected to the electrodes of the first heat-generating component 12. In other words, the first heat transfer member 14 can also function as an internal connection terminal, which is a member present inside the electronic module 1 and used for electrical communication. The first heat transfer member 14 is electrically connected to the first source electrode (first first electrode) 12a. The electronic module 1 includes three first heat transfer members 14 corresponding to the three first source electrodes 12a of the first heat-generating component 12. The end of each first heat transfer member 14 opposite to the first heat-generating component 12 side is electrically connected to the wiring pattern of the second substrate 20.

[0029] The first spacer 15 is made of a conductive material and is a saucer-shaped member interposed between the first source electrode 12a of the first heat-generating component 12 and the first heat transfer member 14. Although not shown, the first source electrode 12a and the first spacer 15 are joined by a conductive bonding material (e.g., solder). The first spacer 15 and the first heat transfer member 14 are also joined by a conductive bonding material.

[0030] The first internal connection terminal 16 is a member that exists inside the electronic module 1 and is used for electrical communication. The first internal connection terminal 16 is electrically connected to the first gate electrode 12b of the first heat-generating component 12 and the external connection terminal 35.

[0031] The support members 18 and 28 are members disposed between the first substrate 10 and the second substrate 20 and are in contact with both the first substrate 10 and the second substrate 20 (see FIG. 5, particularly FIGS. 5(b) and 5(d)). The electronic module 1 includes two or more support members 18 and 28. In this embodiment, the electronic module 1 includes three support members 18 and three support members 28.

[0032] Here, when the electronic module 1 is viewed in plan with reference to the surface of the first substrate 10 on which the first heat-generating component 12 is arranged, the central region is defined as a region whose outer edge has a rectangular shape B, whose center of gravity is common with the center of gravity G of the first substrate 10, and whose outer edge contacts a point F on the first heat-generating component 12 that is farthest from the center of gravity G of the first substrate 10 (a corner of the first heat-generating component 12 in the electronic module 1). The region outside the central region is defined as a peripheral region. In the electronic module 1, at least two of the support members 18, 28 (all six support members 18, 28 in the electronic module 1) have their ends on the first substrate 10 side contact the peripheral region (see FIG. 4(c)).

[0033] Furthermore, the electronic module 1 is configured such that, when the electronic module 1 is viewed in plan with the first substrate 10 as a reference, all of the support members 18, 28 are not aligned in a straight line. When evaluating the above configuration, evaluation is performed not on only the support member 18 or only the support member 28, but on the entire support members 18, 28.

[0034] The support members 18 and 28 are made of a conductive material and are electrically connected to other components of the electronic module 1. The support member 18 is electrically connected to the first substrate 10 and the external connection terminal 34. The support member 28 is electrically connected to the second substrate 20 and the external connection terminal 37.

[0035] Second substrate 20 is a substrate that is disposed on the side of first substrate 10 where first heat-generating component 12 is disposed, in a state separated from first substrate 10 and first heat-generating component 12. Regarding the second substrate, "separated from the first substrate and the first heat-generating component" refers to a state in which the second substrate is not in direct contact with the first substrate and the first heat-generating component. Therefore, if the second substrate is not in direct contact with the first substrate and the first heat-generating component, it can be said that the second substrate is "separated from the first substrate and the first heat-generating component" even if a component in contact with the second substrate is also in contact with the first substrate or the first heat-generating component.

[0036] The second substrate 20 has a structure in which copper plates are arranged on both sides of a ceramic plate (for example, a DCB substrate). A second heat dissipation surface 21, which is the surface of the second substrate 20 opposite to the first substrate 10 side, is exposed to the outside of the electronic module 1 (see FIGS. 1 and 2(a)). The second substrate 20 is electrically connected to a second drain electrode (second second electrode, described later) of the second heat-generating component 22.

[0037] The second heat-generating component 22 is disposed on the surface of the second substrate 20 facing the first substrate 10. The second heat-generating component 22 is a vertical electronic component having a second first electrode and a second second electrode. Specifically, the second heat-generating component 22 is a vertical MOSFET having a second source electrode (second first electrode) 22a disposed on the first substrate 10 side, a second drain electrode (second second electrode, not shown) disposed on the second substrate 20 side, and a second gate electrode 22b disposed on the same side as the second source electrode 22a (see FIG. 7(b)). The second heat-generating component 22 has three second source electrodes 22a.

[0038] The second heat transfer member 24 is a member that transfers heat generated by the second heat-generating component 22 to the first substrate 10 (see FIGS. 6(c) and 6(d)). The second heat transfer member 24 is a substantially columnar member whose main portion is integrally formed and is connected to the second heat-generating component 22 and the first substrate 10 so as to be able to exchange heat with them.

[0039] 6(d), the state of heat transfer (heat dissipation) regarding the second heat-generating component 22 in the electronic module 1 will be described. The second heat-generating component 22 is disposed on the second substrate 20. Therefore, the heat generated by the second heat-generating component 22 is dissipated to the outside of the electronic module 1 via the second substrate 20 (see arrow H3).

[0040] The electronic module 1 also includes a second heat transfer member 24 that transfers heat generated by the second heat-generating component 22 to the first substrate 10. Therefore, the heat generated by the second heat-generating component 22 is dissipated to the outside of the electronic module 1 via a path that passes through the second heat transfer member 24 and the first substrate 10, in addition to the path that passes through the second substrate 20 described above (see arrow H4).

[0041] The second heat transfer member 24 is made of a conductive material and is electrically connected to the electrode of the second heat-generating component 22. In other words, the second heat transfer member 24 can also function as an internal connection terminal, which is a member present inside the electronic module 1 and used for electrical communication. The second heat transfer member 24 is electrically connected to the second source electrode (second first electrode) 22a. The electronic module 1 includes three second heat transfer members 24, corresponding to the three second source electrodes 22a of the second heat-generating component 22. The end of each second heat transfer member 24 opposite to the second heat-generating component 22 side is connected to the wiring pattern on the first substrate 10.

[0042] The second spacer 25 is made of a conductive material and is a saucer-shaped member interposed between the second source electrode 22a of the second heat-generating component 22 and the second heat transfer member 24. Although not shown, the second source electrode 22a and the second spacer 25 are joined by a conductive bonding material (e.g., solder). The second spacer 25 and the second heat transfer member 24 are also joined by a conductive bonding material.

[0043] The second internal connection terminal 26 is a member that exists inside the electronic module 1 and is used for electrical communication. The second internal connection terminal 26 is electrically connected to the second gate electrode 22b of the second heat-generating component 22 and the external connection terminal 36.

[0044] The external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 are electrically connected to the components of the electronic module 1 between the first substrate 10 and the second substrate 20, and at least one end of the external connection terminals 30 protrudes outside the molded resin 40. The external connection terminal 30 is a detection terminal for the first source electrode 12a of the first heat-generating component 12. The external connection terminal 32a is a power terminal capable of handling large currents. The external connection terminal 32b is a detection terminal for the second source electrode 22a of the second heat-generating component 22. The external connection terminals 32a and 32b are integral members.

[0045] The external connection terminal 34 is a power terminal electrically connected to the support member 18. The external connection terminal 35 is a control terminal electrically connected to the first internal connection terminal 16. The external connection terminal 36 is a control terminal electrically connected to the second internal connection terminal 26. The external connection terminal 37 is a power terminal electrically connected to the support member 28.

[0046] The molded resin 40 seals the surface of the first substrate 10 on which the first heat-generating component 12 is arranged and the first heat-generating component 12 (see FIGS. 1 and 2). The molded resin 40 also seals the surface of the second substrate 20 on which the second heat-generating component 22 is arranged and the second heat-generating component 22.

[0047] 2. Manufacturing method of electronic module according to embodiment A method for manufacturing an electronic module according to an embodiment will be described below. The method for manufacturing an electronic module according to an embodiment is a method for manufacturing an electronic module 1 according to an embodiment, and includes a preparation step S10, an arrangement step S20, and a molding step S30. Note that the method for manufacturing an electronic module according to an embodiment may further include steps other than those described above. Each step will be described below.

[0048] The preparation step S10 is a step of preparing an unsealed electronic module 1a including a first substrate 10, a first heat-generating component 12, a second substrate 20, and support members 18 and 28 (see FIG. 8(a)). Note that the above-mentioned components are the minimum, and the unsealed electronic module 1a in the embodiment includes all of the components of the electronic module 1 except for the mold resin 40.

[0049] The unsealed electronic module 1a prepared in the preparation step S10 may include components that are different in shape or state from the components included in the electronic module 1. For example, all or part of the external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 in the preparation step S10 may be integrated with a frame-shaped member (not shown). In this case, the external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 must be separated from the frame-shaped member in a step subsequent to the molding step S30.

[0050] The placement step S20 is a step of placing the unsealed electronic module 1a in a molding die (not shown). In the placement step S20, a pressing force is applied to a portion of the first heat dissipation surface 11 corresponding to the backside of the portion where the first substrate 10 and the support members 18, 28 are in contact with each other and to a portion of the second heat dissipation surface 21 corresponding to the backside of the portion where the second substrate 20 and the support members 18, 28 are in contact with each other (hereinafter referred to as "pressing portions"), so that the first heat dissipation surface 11 and the second heat dissipation surface 21 are tightly attached to the molding die (see FIG. 8(b)).

[0051] It should be noted that the above pressing points are points where a high pressing force should be applied (points that can withstand a high pressing force), and the above description does not exclude the application of pressing force or the inevitable application of pressing force to points other than the pressing points on the first heat dissipation surface 11 and the second heat dissipation surface 21. For this reason, when performing the arrangement step S20, pressing force may be applied to each individual pressing point as shown in Fig. 8(b), or pressing force may be applied to a linear or planar area including multiple pressing points, or a combination of these may be used.

[0052] The molding step S30 is a step of injecting resin into a molding die to form molding resin 40 (FIG. 8(c)). By carrying out the molding step S30, the electronic module 1 can be manufactured.

[0053] 3. Effects of the Electronic Module 1 and the Manufacturing Method of the Electronic Module According to the Embodiment The effects of the electronic module 1 and the method for manufacturing the electronic module according to the embodiment will be described below.

[0054] The electronic module 1 according to the embodiment includes a second substrate 20 that is disposed on the side of the first substrate 10 where the first heat-generating component 12 is disposed, while being spaced apart from the first substrate 10 and the first heat-generating component 12. Furthermore, a first heat dissipation surface 11, which is the surface of the first substrate 10 opposite the side where the first heat-generating component 12 is disposed, and a second heat dissipation surface 21, which is the surface of the second substrate 20 opposite the first substrate 10, are exposed to the outside of the electronic module 1. Therefore, the electronic module 1 according to the embodiment can dissipate heat from both sides, and is therefore an electronic module that can achieve higher heat dissipation performance compared to conventional electronic modules.

[0055] Furthermore, the electronic module 1 according to the embodiment includes support members 18, 28 that are disposed between the first substrate 10 and the second substrate 20 and are in contact with both the first substrate 10 and the second substrate 20. During manufacturing of the electronic module 1 according to the embodiment, pressing force can be applied to the side opposite the contact point between the first substrate 10 and the support members 18, 28 and the side opposite the contact point between the second substrate 20 and the support members 18, 28, thereby tightly adhering the first heat dissipation surface 11 and the second heat dissipation surface 21 to the molding die. Therefore, the electronic module 1 according to the embodiment can prevent resin from adhering to the heat dissipation surfaces of the substrates.

[0056] Therefore, the electronic module 1 according to the embodiment is an electronic module that can improve heat dissipation performance compared to conventional electronic modules and can suppress adhesion of resin to the heat dissipation surface of the substrate.

[0057] Furthermore, the electronic module 1 according to the embodiment includes a first heat transfer member 14 that transfers heat generated in the first heat-generating component 12 to the second substrate 20. Therefore, according to the electronic module 1 according to the embodiment, the heat generated from the first heat-generating component 12 can be dissipated not only via the first substrate 10, but also via the second substrate 20 via the first heat transfer member 14.

[0058] Furthermore, the electronic module 1 according to the embodiment includes two or more support members 18, 28, and at least two of the support members 18, 28 have ends on the first substrate 10 side that contact the outer periphery. Therefore, according to the electronic module 1 according to the embodiment, by arranging the support members 18, 28 on the outside of the first substrate 10, it is possible to stably support the first substrate 10 and the second substrate 20 during manufacturing.

[0059] Furthermore, in the electronic module 1 according to the embodiment, the support members 18, 28 are made of a conductive material and are electrically connected to other components of the electronic module 1. Therefore, according to the electronic module 1 according to the embodiment, the support members 18, 28 can be used for electrical communication inside the electronic module 1, and functions can be consolidated to reduce the size of the electronic module 1.

[0060] Moreover, the electronic module 1 according to the embodiment includes a second heat-generating component 22 arranged on the surface of the second substrate 20 facing the first substrate 10. Therefore, according to the electronic module 1 according to the embodiment, it is possible to increase the mounting density by also arranging the second heat-generating component 22 on the second substrate 20. Furthermore, according to the electronic module 1 according to the embodiment, it is possible to further improve heat dissipation by distributing the arrangement of the first heat-generating component 12 and the second heat-generating component 22 between the first substrate 10 and the second substrate 20.

[0061] Furthermore, the electronic module 1 according to the embodiment includes a second heat transfer member 24 that transfers heat generated in the second heat-generating component 22 to the first substrate 10. Therefore, according to the electronic module 1 according to the embodiment, the heat generated from the second heat-generating component 22 can be dissipated not only via the second substrate 20, but also via the first substrate 10 via the second heat transfer member 24.

[0062] Furthermore, in the electronic module 1 according to the embodiment, the first substrate 10 and the second substrate 20 have a structure in which copper plates are disposed on both sides of a ceramic plate. Therefore, according to the electronic module 1 according to the embodiment, it is possible to further improve heat dissipation by using substrates with high thermal conductivity.

[0063] The method for manufacturing an electronic module according to the embodiment includes a preparation step S10 of preparing an unsealed electronic module 1a including a first substrate 10, a first heat-generating component 12, a second substrate 20, and support members 18 and 28. The method for manufacturing an electronic module according to the embodiment also includes an arrangement step S20 of placing the unsealed electronic module 1a in a molding die and applying pressure to a portion of the first heat dissipation surface 11 corresponding to the backside of the portion where the first substrate 10 and the support members 18 and 28 are in contact and a portion of the second heat dissipation surface 21 corresponding to the backside of the portion where the second substrate 20 and the support members 18 and 28 are in contact, thereby closely adhering the first heat dissipation surface 11 and the second heat dissipation surface 21 to the molding die. Therefore, the method for manufacturing an electronic module according to the embodiment is a method for manufacturing an electronic module 1 that can improve heat dissipation compared to conventional electronic modules and can suppress adhesion of resin to the heat dissipation surfaces of the substrates.

[0064] Although the present invention has been described above based on the above embodiment, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the present invention, and for example, the following modifications are also possible.

[0065] (1) The shape, number, size, position, etc. of the components of the present invention are not limited to those described above or shown in the drawings, and may be modified as appropriate as long as the characteristics of the present invention are not impaired.

[0066] For example, in the above embodiment, the number of first heat-generating components 12 is one, but the present invention is not limited to this. The number of first heat-generating components may be multiple. The same applies to the second heat-generating components.

[0067] As another example, in the above embodiment, the number of support members 18 and the number of support members 28 are three, but the present invention is not limited to this. Although it is preferable that the total number of support members is two or more, the present invention can also be implemented with just one. Furthermore, the arrangement and shape of support members 18 and 28 in the above embodiment are also examples, and can be set appropriately depending on the structure of the electronic module, etc.

[0068] (2) The electronic module of the present invention may further include a heat-generating component other than the first heat-generating component (a heat-generating component for which no corresponding first heat-transfer member exists) or other structure, etc. on the first substrate. The electronic module of the present invention may further include a heat-generating component other than the second heat-generating component (a heat-generating component for which no corresponding second heat-transfer member exists) or other structure, etc. on the second substrate.

[0069] (3) The electronic module of the present invention does not have to include the second heat-generating component.

[0070] (4) The electronic module of the present invention may not include the first heat transfer member. Furthermore, even if the electronic module of the present invention includes the second heat-generating component, it may not include the second heat transfer member.

[0071] (5) The electronic module of the present invention may not include the first spacer and the second spacer.

[0072] (6) The functions of the external connection terminals 30, 32a, 32b, 34, 35, 36, and 37 described in the above embodiment are merely examples, and the present invention is not limited to these. The functions of the external connection terminals can be appropriately set depending on the structure of the electronic module, etc.

[0073] (7) The first heat-generating component in the electronic module of the present invention may be a heat-generating component other than a vertical MOSFET. Examples of heat-generating components other than a vertical MOSFET include electronic elements other than a vertical MOSFET (diodes, transistors, thyristors, etc.), resistors, coils, and capacitors. The same applies to the second heat-generating component. [Explanation of symbols]

[0074] 1...electronic module, 1a...unsealed electronic module, 10...first substrate, 11...first heat dissipation surface, 12...first heat-generating component, 14...first heat transfer member, 18, 28...support member, 20...second substrate, 21...second heat dissipation surface, 22...second heat-generating component, 24...second heat transfer member, 40...molded resin

Claims

1. a first substrate; a first heat generating component disposed on the first substrate; an electronic module including a surface of the first substrate on which the first heat generating component is disposed and a molding resin that seals the first heat generating component, the electronic module further includes: a second substrate disposed on the side of the first substrate where the first heat-generating component is disposed, while being spaced apart from the first substrate and the first heat-generating component; and a support member disposed between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, An electronic module characterized in that a first heat dissipation surface, which is the surface of the first substrate opposite to the side on which the first heat-generating component is arranged, and a second heat dissipation surface, which is the surface of the second substrate opposite to the first substrate side, are exposed to the outside of the electronic module.

2. The electronic module according to claim 1 , further comprising a first heat transfer member for transferring heat generated by the first heat generating component to the second substrate.

3. the electronic module includes two or more of the support members; When the electronic module is viewed in plan with reference to the surface of the first substrate on which the first heat-generating component is disposed, an outer edge has a rectangular shape, has a center of gravity that is common with the center of gravity of the first substrate, and a region of the first heat-generating component where the outer edge is in contact with a point on the first substrate that is farthest from the center of gravity of the first substrate is defined as a central region, and a region outside the central region is defined as a peripheral region, The electronic module according to claim 1 , wherein at least two of the support members have ends on the first substrate side in contact with the outer peripheral region.

4. 2. The electronic module of claim 1, wherein the support member is made of a conductive material and is electrically connected to other components in the electronic module.

5. The electronic module according to claim 1 , further comprising a second heat generating component disposed on a surface of the second substrate facing the first substrate.

6. The electronic module according to claim 5 , further comprising a second heat transfer member for transferring heat generated by the second heat generating component to the first substrate.

7. 2. The electronic module according to claim 1, wherein the first substrate and the second substrate each have a structure in which copper plates are disposed on both sides of a ceramic plate.

8. 2. A method for manufacturing the electronic module according to claim 1, comprising: a preparation step of preparing an unsealed electronic module including the first substrate, the first heat-generating component, the second substrate, and the support member; an arrangement step of placing the unsealed electronic module in a molding die, and applying a pressing force to a portion of the first heat dissipation surface corresponding to the backside of the portion where the first substrate and the support member are in contact with each other and a portion of the second heat dissipation surface corresponding to the backside of the portion where the second substrate and the support member are in contact with each other, thereby bringing the first heat dissipation surface and the second heat dissipation surface into close contact with the molding die; and a molding step of injecting a resin into the molding die to form the molding resin.

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