Process liquid supply system, process liquid supply method, and storage medium

Abstract

To increase a fed liquid flow rate of a process liquid returned from a circulation path to a processing tank.SOLUTION: A process liquid supply system according to one aspect of the present disclosure comprises: a process liquid supply unit for supplying a process liquid to a processing tank where a substrate is processed by being immersed; a circulation path for flowing the process liquid out of the processing tank and returning it to the processing tank; a pump and a flowmeter disposed in the circulation path; and a control unit for controlling each unit. The control unit executes a storing process for supplying the process liquid from the process liquid supply unit and storing the process liquid in the processing tank, a filling process for actuating the pump to circulate the process liquid in the circulation path and filling the circulation path with the process liquid; a first circulating process for actuating the pump after the filling process so that the process liquid circulating in the circulation path reaches a prescribed initial set flow rate and circulating the process liquid in the circulation path, and a second circulating process for actuating the pump after a time when the measured value of a flowmeter equals the initial set flow rate so that a prescribed processing set flow rate for processing a substrate is reached.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The disclosed embodiments relate to a processing liquid supply system, a processing liquid supply method, and a storage medium. [Background technology]

[0002] BACKGROUND ART Conventionally, a substrate processing apparatus has been disclosed in which a processing liquid is circulated in a processing bath for processing a substrate, and various processes are performed on the substrate immersed in the processing bath (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-022707 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can increase the flow rate of the treatment liquid returned from the circulation path to the treatment tank. [Means for solving the problem]

[0005] A processing liquid supply system according to one aspect of the present disclosure includes a processing liquid supply unit, a circulation path, a pump, a flow meter, and a control unit. The processing liquid supply unit supplies processing liquid to a processing tank in which a substrate is immersed for processing. The circulation path flows the processing liquid from the processing tank and returns it to the processing tank. The pump and the flow meter are provided in the circulation path. The control unit controls each unit. The control unit also performs a storage process, a filling process, a first circulation process, and a second circulation process. The storage process supplies the processing liquid from the processing liquid supply unit and stores the processing liquid in the processing tank. The filling process operates the pump to flow the processing liquid through the circulation path and fill the circulation path with the processing liquid. The first circulation process operates the pump after the filling process so that the processing liquid flowing through the circulation path has a given initial setting flow rate, thereby circulating the processing liquid through the circulation path. In the second circulation process, after the measurement value of the flow meter reaches the initial setting flow rate, the pump is operated so as to achieve a given processing setting flow rate when processing the substrate. [Effects of the Invention]

[0006] According to the present disclosure, the flow rate of the treatment liquid returned from the circulation path to the treatment tank can be increased. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a block diagram showing an example of the configuration of a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating an example of the configuration of a liquid processing unit according to an embodiment. [Figure 3] FIG. 3 is a diagram illustrating an example of the configuration of a processing liquid supply system according to an embodiment. [Figure 4] FIG. 4 is a timing chart showing an example of the procedure of the start-up process executed by the substrate processing apparatus according to the embodiment. [Figure 5] FIG. 5 is a timing chart showing an example of the procedure of the circulation process and the temperature adjustment process performed by the processing liquid supply system according to the embodiment. [Figure 6]FIG. 6 is a timing chart showing an example of the procedure of the circulation process and the temperature adjustment process performed by the processing liquid supply system according to the embodiment. [Figure 7] FIG. 7 is a diagram illustrating an example of the configuration of a processing liquid supply system according to the first modification of the embodiment. [Figure 8] FIG. 8 is a diagram illustrating an example of the configuration of a processing liquid supply system according to the second modification of the embodiment. [Figure 9] FIG. 9 is a flowchart showing an example of the procedure of the control process executed by the processing liquid supply system according to the embodiment. [Figure 10] FIG. 10 is a flowchart showing another example of the procedure of the control process executed by the processing liquid supply system according to the embodiment. [Figure 11] FIG. 11 is a flowchart showing another example of the procedure of the control process executed by the processing liquid supply system according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, with reference to the accompanying drawings, embodiments of a processing liquid supply system, a processing liquid supply method, and a storage medium disclosed herein will be described in detail. Note that the present disclosure is not limited to the embodiments described below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of elements may differ from reality. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0009] In the past, there has been disclosed a substrate processing apparatus in which a processing liquid is circulated in a processing tank for processing the substrates, and various processes are performed on the substrates immersed in the processing tank. However, in the above-mentioned conventional technology, if the output of the pump alone is increased in order to increase the flow rate of the processing liquid returned from the circulation path to the processing tank, there is a risk of malfunction of the pump.

[0010] Therefore, it is desired to realize a technology that can overcome the above-mentioned problems and increase the flow rate of the processing liquid returned from the circulation path to the processing tank without causing any problems in the operation of the pump.

[0011] <Configuration of the substrate processing apparatus> First, the configuration of a substrate processing apparatus 1 including a processing liquid supply system 3 of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a block diagram showing an example of the configuration of a substrate processing apparatus 1 according to an embodiment.

[0012] As shown in FIG. 1, a substrate processing apparatus 1 according to the embodiment includes a liquid processing unit 2, a processing liquid supply system 3, and a control device 4.

[0013] The liquid processing unit 2 processes a substrate such as a semiconductor wafer (hereinafter also referred to as a "wafer") using a processing liquid L (see FIG. 2).

[0014] The treatment liquid L according to the embodiment includes, for example, an aqueous solution of phosphoric acid (H3PO4). In this disclosure, the aqueous solution of phosphoric acid is also simply referred to as "phosphoric acid." The treatment liquid L according to the embodiment may also include a silicate compound. This silicate compound can be added to the aqueous solution of phosphoric acid, for example, by using a solution in which colloidal silicon is dispersed.

[0015] In the present disclosure, the processing liquid L is not limited to one containing phosphoric acid, and various processing liquids for liquid processing of the wafer W can be used.

[0016] The processing liquid supply system 3 supplies the processing liquid L to the liquid processing units 2. An example of the configuration of the processing liquid supply system 3 will be described later.

[0017] Control device 4 controls liquid processing units 2 and processing liquid supply system 3. Control device 4 is, for example, a computer, and includes a control unit 5 and a storage unit 6. Storage unit 6 stores programs for controlling various processes executed in substrate processing apparatus 1. Control unit 5 controls the operations of liquid processing units 2 and processing liquid supply system 3 by reading and executing the programs stored in storage unit 6.

[0018] Such a program may be recorded on a computer-readable storage medium and installed from that storage medium into the storage unit 6 of the control device 4. Examples of computer-readable storage media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0019] The substrate processing apparatus 1 may include a plurality of liquid processing units 2. In this case, the substrate processing apparatus 1 may include a plurality of processing liquid supply systems 3 corresponding to the plurality of liquid processing units 2, or may include one processing liquid supply system 3 corresponding to the plurality of liquid processing units 2.

[0020] <Configuration of liquid processing unit> Next, a configuration example of the liquid processing unit 2 will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the configuration of the liquid processing unit 2 according to this embodiment.

[0021] 2 is a batch-type processing unit that processes a plurality of wafers W (only one wafer is shown in FIG. 2) at once. As shown in FIG. 2, liquid processing unit 2 includes a processing tank 21, a holder 22, and a plurality of (four in this example) discharge units 23. The number of discharge units 23 included in liquid processing unit 2 is not limited to four.

[0022] The processing tank 21 includes an inner tank 21a and an outer tank 21b. The inner tank 21a is a box-shaped tank that is open at the top and stores a processing liquid L therein. A lot formed by a plurality of wafers W is immersed in the inner tank 21a. The outer tank 21b is disposed around the inner tank 21a. The outer tank 21b is also open at the top. The processing liquid L that overflows from the inner tank 21a flows into the outer tank 21b.

[0023] The holding unit 22 holds a plurality of wafers W forming a lot in a vertical position. The holding unit 22 has an elevation mechanism (not shown) that raises and lowers the held lot, and lowers the lot from above the inner bath 21a in the processing bath 21 to immerse it in the inner bath 21a, or raises the lot immersed in the inner bath 21a to remove it from the processing bath 21.

[0024] The plurality of discharge units 23 are disposed inside the inner tank 21 a, specifically near the bottom of the inner tank 21 a. The plurality of discharge units 23 are connected to the processing liquid supply system 3, and discharge the processing liquid L supplied from the processing liquid supply system 3 into the inner tank 21 a.

[0025] Liquid processing unit 2 holds a lot using holder 22 and immerses the held lot in processing liquid L stored in inner bath 21a. In this way, a plurality of wafers W are processed by processing liquid L.

[0026] For example, in the embodiment, of the silicon nitride film and the silicon oxide film formed on the wafer W, the silicon nitride film is selectively etched by the phosphoric acid aqueous solution that is the processing liquid L.

[0027] <Configuration of processing liquid supply system> Next, a configuration example of the processing liquid supply system 3 will be described with reference to Fig. 3. Fig. 3 is a diagram showing an example of the configuration of the processing liquid supply system 3 according to the embodiment.

[0028] 3, the processing liquid supply system 3 includes a processing liquid supply unit 31 and a circulation path 32. The processing liquid supply unit 31 supplies the processing liquid L to the processing tank 21. The processing liquid supply unit 31 supplies unused processing liquid L to the inner tank 21a of the processing tank 21, for example.

[0029] The processing liquid supply unit 31 includes a supply source 31a, a supply path 31b, and a flow rate regulator 31c. The supply source 31a is, for example, a tank that stores the processing liquid L. The supply path 31b connects the supply source 31a and the inner bath 21a and supplies the processing liquid L from the supply source 31a to the inner bath 21a. The supply path 31b may also be connected to the outer bath 21b.

[0030] The flow rate regulator 31c is provided in the supply path 31b and regulates the amount of the processing liquid L supplied to the processing tank 21. The flow rate regulator 31c is composed of, for example, an on-off valve, a flow control valve, a flow meter, and the like.

[0031] The circulation path 32 is connected to the liquid processing unit 2 and supplies the processing liquid L to the liquid processing unit 2. The circulation path 32 is a circulation line that causes the processing liquid L to flow out from the processing tank 21 and return to the processing tank 21.

[0032] Specifically, one end of the circulation path 32 is connected to a plurality of locations (two locations in FIG. 3) on the bottom of the outer bath 21b, and the other end of the circulation path 32 is connected to a plurality of discharge parts 23 located inside the inner bath 21a. In the processing liquid supply system 3, the processing liquid L sent from the outer bath 21b to the circulation path 32 passes through the circulation path 32 and is supplied from the discharge parts 23 into the inner bath 21a.

[0033] Furthermore, the processing liquid L supplied from the discharge portion 23 to the inner bath 21a overflows from the inner bath 21a and flows into the outer bath 21b. In this way, the circulation path 32 circulates the processing liquid L between the inner bath 21a and the outer bath 21b.

[0034] The circulation path 32 is provided with a pump 33, a pressure gauge 34, a check valve 35, a heater 36, a filter 37, a branching portion 38, and a flow meter 39 in this order from the upstream side with respect to the treatment tank 21.

[0035] The pump 33 forms a circulating flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32, and returns to the treatment tank 21. The pump 33 is, for example, a magnetic levitation pump that pumps the treatment liquid L by rotating a rotating part while being magnetically levitated in the treatment liquid L. Note that the pump 33 of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0036] On the other hand, by using a magnetic levitation pump for the pump 33, which has a higher liquid transfer capacity than other types, the liquid transfer flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 can be increased.

[0037] The pressure gauge 34 measures the pressure of the processing liquid L flowing through the circulation path 32. The pressure measurement value of the processing liquid L measured by the pressure gauge 34 is output to the control unit 5 (see FIG. 1). The check valve 35 prevents backflow of the processing liquid L flowing through the circulation path 32. The check valve 35 is, for example, an air-operated valve.

[0038] The heater 36 heats the processing liquid L flowing through the circulation path 32. In the embodiment, by heating the processing liquid L with the heater 36, the processing liquid L stored in the processing bath 21 can be heated to a processing set temperature A S (See FIG. 5) (for example, about 160°C to 170°C).

[0039] The filter 37 removes contaminants such as particles contained in the processing liquid L flowing through the circulation path 32. The filter 37 may include a plurality of filter modules arranged in parallel.

[0040] The number of filter modules belonging to one filter 37 can be determined taking into consideration the filtering capacity required of the filter 37 and the allowable pressure drop in the filter 37. In the present disclosure, as shown in FIG. 3, the filter 37 is composed of two filter modules arranged in parallel.

[0041] A branch path 41 that is connected to the outer bath 21b of the treatment bath 21 branches off from the branching part 38. The flow meter 39 measures the flow rate of the treatment liquid L flowing through the circulation path 32. The measured value of the flow rate of the treatment liquid L measured by the flow meter 39 is output to the control part 5.

[0042] The branch path 41 is a flow path for sampling the concentration of the treatment liquid L flowing through the circulation path 32. This branch path 41 is provided with a flow meter 42, a concentration meter 43, and a valve 44, in this order from the upstream side with respect to the branch point 38.

[0043] The flow meter 42 measures the flow rate of the treatment liquid L flowing through the branch path 41. The measured value of the flow rate of the treatment liquid L measured by the flow meter 42 is output to the control unit 5.

[0044] The concentration meter 43 measures the concentration of the treatment liquid L flowing through the circulation path 32 by measuring the concentration of the treatment liquid L flowing through the branch path 41. The concentration meter 43 measures, for example, the phosphoric acid concentration of the treatment liquid L flowing through the branch path 41. The measured value of the concentration of the treatment liquid L measured by the concentration meter 43 is output to the control unit 5. The valve 44 controls whether or not the treatment liquid L is supplied from the branch part 38 to the outer bath 21b.

[0045] The processing liquid supply system 3 also includes a thermometer 45. The thermometer 45 measures the temperature of the processing liquid L stored in the processing tank 21, thereby measuring the temperature of the processing liquid L flowing through the circulation path 32. The thermometer 45 measures the temperature of the processing liquid L stored in, for example, the inner tank 21a. The measured value of the temperature of the processing liquid L measured by the thermometer 45 is output to the control unit 5.

[0046] The thermometer 45 of the present disclosure is not limited to measuring the temperature of the processing liquid L stored in the inner tank 21a, but may also measure the temperature of the processing liquid L stored in the outer tank 21b, or the temperature of the processing liquid L flowing through the circulation path 32.

[0047] <Details of launch process> Next, details of the start-up process of the substrate processing apparatus 1 according to the embodiment will be described with reference to Figures 4 to 6. Figure 4 is a timing chart showing an example of the procedure of the start-up process executed by the substrate processing apparatus 1 according to the embodiment.

[0048] First, from time T01, the control unit 5 (see Figure 1) performs a drainage process to drain all of the used processing liquid L (see Figure 3) from the inner tank 21a (see Figure 3) and the outer tank 21b (see Figure 3) of the processing tank 21 (see Figure 3).

[0049] Next, from time T02 when the drainage process is completed, the control unit 5 performs a storage process to store unused processing liquid L in the inner tank 21a and outer tank 21b of the processing tank 21. Specifically, the control unit 5 first supplies the processing liquid L from the processing liquid supply unit 31 (see FIG. 3) to the inner tank 21a, filling the inner tank 21a with the processing liquid L.

[0050] Next, the control unit 5 supplies the processing liquid L that has overflowed from the inner tank 21a to the outer tank 21b by further supplying the processing liquid L from the processing liquid supply unit 31 to the inner tank 21a. Then, at time T04 when the liquid level of the processing liquid L supplied to the outer tank 21b reaches a given second height, the control unit 5 ends the storage process.

[0051] The control unit 5 starts a circulation process of circulating the processing liquid L through the circulation path 32 (see FIG. 3) from time T03 when the liquid level of the processing liquid L supplied to the outer bath 21b reaches a given first height that is lower than the second height. During this circulation process, from time T05 when the processing liquid L meets the conditions described below, the control unit 5 starts a circulation process of circulating the processing liquid L through the circulation path 32 (see FIG. 3) from time T06 when the processing liquid L meets the conditions described below. S (See FIG. 5)

[0052] The circulation process and the temperature control process will be described in detail with reference to Fig. 5 and Fig. 6. Fig. 5 and Fig. 6 are timing charts showing an example of the procedure of the circulation process and the temperature control process performed by the processing liquid supply system 3 according to the embodiment.

[0053] As shown in FIG. 5, from the above-mentioned time T03, the control unit 5 (see FIG. 1) operates the pump 33 (see FIG. 3) to pass the processing liquid L (see FIG. 3) through the circulation path 32 (see FIG. 3) as the first process in the circulation process, thereby performing a filling process to fill the circulation path 32 with the processing liquid L.

[0054] When a magnetic levitation pump is used as the pump 33, there are two types of operation modes for the pump 33: flow rate feedback control (referred to as "flow rate FB control" in the drawings of this disclosure) and rotation speed control.

[0055] In flow rate feedback control, the rotation speed of the rotating part in the pump 33 is automatically controlled so that the flow rate of the processing liquid L measured by the flow meter 39 (see FIG. 3) becomes a designated flow rate.

[0056] For example, in the flow rate feedback control, if the measured flow rate of the processing liquid L is lower than the designated flow rate, the pump 33 increases the rotation speed of the rotating part. On the other hand, in the flow rate feedback control, if the measured flow rate of the processing liquid L is higher than the designated flow rate, the pump 33 decreases the rotation speed of the rotating part.

[0057] In the rotation speed control, the rotation speed of the rotating part in the pump 33 is controlled to be a designated rotation speed.

[0058] In the filling process according to the embodiment, the control unit 5 controls the rotation speed of the pump 33, as shown in Fig. 5. Furthermore, in the filling process, the control unit 5 controls the rotation speed of the pump 33, as shown in Fig. 5. s Specify it to operate.

[0059] In this way, by operating the pump 33 by controlling the rotation speed during the filling process, the pump 33 can be operated stably even when the circulation path 32 is not filled with the treatment liquid L, causing the measured value of the flow meter 39 to be unstable and making flow rate feedback control difficult. Therefore, according to the embodiment, the circulation path 32 can be stably filled with the treatment liquid L.

[0060] In the embodiment, during the filling process, the measurement value of the flow meter 39 is set to a given minimum circulation flow rate F L At the same time, the rotation speed R is set to a value at which cavitation does not occur inside the pump 33. s It is preferable to operate the pump 33 at this rate. This allows the circulation path 32 to be filled with the processing liquid L stably.

[0061] 5, the filling process according to the embodiment may be performed from time T03 for a period P1 that has been confirmed in advance as being sufficient to fill the circulation path 32 with the processing liquid L. This makes it possible to more reliably fill the circulation path 32 with the processing liquid L.

[0062] In the embodiment, as shown in FIG. 5, before and after the start of the filling process, the concentration measurement value of the processing liquid L measured by the concentration meter 43 (see FIG. 3) is stable at the initial concentration C0 supplied from the processing liquid supply unit 31 (see FIG. 3).

[0063] Similarly, before and after the start of the filling process, the temperature of the treatment liquid L measured by the thermometer 45 (see FIG. 3) is stable at the initial temperature A0 of the treatment liquid L supplied from the treatment liquid supply unit 31.

[0064] Following the filling process described above, in the circulation process according to this embodiment, the control unit 5 performs a stop process from time T11 by stopping the pump 33 (i.e., setting the rotation speed of the rotating unit to zero) to stop the circulation of the processing liquid L through the circulation path 32. Note that time T11 is the time when a given period P1 has elapsed since time T03. As a result, the measurement value of the flow meter 39 becomes zero, as shown in FIG.

[0065] Next, in the circulation process according to the embodiment, the control unit 5 performs a first circulation process, as shown in Fig. 6, in which the processing liquid L (see Fig. 3) flowing through the circulation path 32 (see Fig. 3) is circulated at a predetermined initial setting flow rate F1 from time T12. Note that time T12 is the time when a predetermined period has elapsed since time T11 (see Fig. 5). The initial setting flow rate F1 is the minimum circulation flow rate F L is a value greater than

[0066] When performing this first circulation process, the control unit 5 (see FIG. 1) switches the operation mode of the pump 33 (see FIG. 3) from rotation speed control to flow rate feedback control.

[0067] Then, in the first circulation process, the control unit 5 sets the set flow rate of the treatment liquid L in the circulation path 32 to the initial set flow rate F1 and operates the pump 33. As a result, the measurement value of the flow meter 39 gradually increases from zero, as shown in FIG.

[0068] Furthermore, in this embodiment, from time T05 after the start of the first circulation process, the control unit 5 operates the heater 36 (see FIG. 3) to perform a temperature control process for the processing liquid L. Note that at this time T05, the measurement value of the flow meter 39 reaches the minimum circulation flow rate F L This is the time when a given period P2 has elapsed since the time T13 at which the

[0069] In this way, the minimum circulation flow rate F L By providing a margin for the period P2 before operating the heater 36, rather than operating the heater 36 immediately after the temperature reaches , the heater 36 can be operated after a sufficient circulation flow rate in the circulation path 32 is secured.

[0070] Therefore, according to the embodiment, it is possible to suppress problems caused by operating the heater 36 when the flow rate in the circulation path 32 is insufficient.

[0071] In the embodiment, from time T05 when the temperature adjustment process starts, the measurement value of the thermometer 45 gradually rises from temperature A0. Also, in the embodiment, the processing liquid L overflows from the inner tank 21a to the outer tank 21b, and the temperature of the processing liquid L rises, causing the water in the processing liquid L to evaporate from the processing tank 21, and therefore the measurement value of the concentration meter 43 gradually rises from concentration C0.

[0072] In the embodiment, after the measurement value of the flow meter 39 reaches the initial set flow rate F1 (time T14 in the example of FIG. 6), the control unit 5 performs a second circulation process in which the pump 33 is operated so that the circulation path 32 reaches a given process set flow rate F2 when processing the wafer W. This process set flow rate F2 is a value greater than the initial set flow rate F1.

[0073] That is, in the circulation process according to the embodiment, the flow rate in the circulation path 32 is once stabilized at the initial setting flow rate F1, and then the pump 33 is operated so that the circulation path 32 reaches the set processing flow rate F2.

[0074] This makes it possible to suppress the occurrence of cavitation inside the pump 33 even if the flow rate of the processing liquid L is increased, compared to when the pump 33 is operated so that the flow rate in the circulation path 32 increases from zero to the processing set flow rate F2 in one go.

[0075] Therefore, according to the embodiment, the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 can be increased.

[0076] In addition, in the embodiment, the control unit 5 may start the second circulation process when the measurement value of the flow meter 39 reaches the initial set flow rate F1 and the measurement value of the concentration meter 43 falls within a given concentration range.

[0077] For example, in the embodiment, the measurement value of the concentration meter 43 is set to the process set concentration C S lower than the given lower limit concentration C TL and the treatment set concentration C S higher than a given upper concentration C TH If the time falls between the time when the first cycle and the time when the second cycle are started, the second circulation process may be started.

[0078] This allows the viscosity of the processing liquid L to approach the viscosity during wafer W processing, and then the pump 33 can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be further suppressed.

[0079] Therefore, according to the embodiment, the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 can be increased stably.

[0080] In addition, in the embodiment, the control unit 5 may start the second circulation process when the measurement value of the flow meter 39 reaches the initial set flow rate F1 and the measurement value of the thermometer 45 falls within a given temperature range.

[0081] For example, in the embodiment, the measurement value of the thermometer 45 is set to the process temperature A S A given lower limit temperature A TL and processing temperature setting A S A given upper limit temperature A TH If the time falls between the time when the first cycle and the time when the second cycle are started, the second circulation process may be started.

[0082] This allows the viscosity of the processing liquid L to approach the viscosity during wafer W processing, and then the pump 33 can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be further suppressed.

[0083] Therefore, according to the embodiment, the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 can be increased stably.

[0084] In addition, in an embodiment, the control unit 5 may start the second circulation process from time T15 when the measurement value of the flow meter 39 becomes the initial setting flow rate F1, the measurement value of the concentration meter 43 becomes a given concentration range, and the measurement value of the thermometer 45 becomes a given temperature range.

[0085] This allows the viscosity of the processing liquid L to be brought closer to the viscosity during wafer W processing, and then the pump 33 can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be further suppressed.

[0086] Therefore, according to the embodiment, the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 can be increased stably.

[0087] 6, the control unit 5 starts the second circulation process from the above-mentioned time T15, and gradually increases the set flow rate of the pump 33 from this time T15 to time T16. Note that this time T16 is the time when a given period P3 has elapsed since time T15.

[0088] Then, at time T16, the control unit 5 sets the set flow rate of the pump 33 to the set process flow rate F2 for processing the wafer W. Then, the measurement value of the flow meter 39 becomes the set process flow rate F2 for processing the wafer W, and the measurement value of the concentration meter 43 becomes the set process concentration C S The measurement value of the thermometer 45 is the processing temperature A S This completes the start-up process.

[0089] In the embodiment, the set flow rate of the pump 33 is gradually increased between time T15 and time T16, thereby suppressing a sudden change in the flow rate in the circulation path 32. Therefore, according to the embodiment, it is possible to suppress the occurrence of cavitation inside the pump 33.

[0090] <Variation 1> Next, a processing liquid supply system 3 according to Modification 1 of the embodiment and a start-up process using the processing liquid supply system 3 will be described with reference to Fig. 7 in addition to Fig. 5 and Fig. 6. Fig. 7 is a diagram showing an example of the configuration of the processing liquid supply system 3 according to Modification 1 of the embodiment.

[0091] 7 differs from the above-described embodiment in the configuration of the circulation path 32. Specifically, in this modification 1, a plurality of circulation paths 32 (two in the example of FIG. 7) are provided for one treatment tank 21. This makes it possible to increase the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 compared to when one circulation path 32 is provided for one treatment tank 21.

[0092] Circulation path 32 according to Modification 1 includes circulation paths 32A and 32B. Circulation paths 32A and 32B are each connected to liquid processing units 2 and supply processing liquid L to liquid processing units 2. Circulation paths 32A and 32B are each a circulation line that causes processing liquid L to flow out from processing tank 21 and return the processing liquid L to processing tank 21.

[0093] Specifically, one end of each of the circulation paths 32A and 32B is connected to the bottom of the outer tank 21b, and the other end of each of the circulation paths 32A and 32B is connected to a plurality of discharge ports 23 located inside the inner tank 21a.

[0094] In the processing liquid supply system 3, the processing liquid L sent from the outer bath 21b to the circulation paths 32A and 32B passes through the circulation paths 32A and 32B and is supplied from the discharge part 23 into the inner bath 21a.

[0095] Furthermore, the processing liquid L supplied from the discharge portion 23 to the inner tank 21a overflows from the inner tank 21a and flows into the outer tank 21b. In this manner, the circulation paths 32A and 32B circulate the processing liquid L between the inner tank 21a and the outer tank 21b.

[0096] In circulation path 32A, with treatment tank 21 as the reference, a pump 33A, a pressure gauge 34A, a check valve 35A, a heater 36A, a filter 37A, and a flow meter 39A are provided in this order from the upstream side.

[0097] The pump 33A forms a circulating flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32A, and returns to the treatment tank 21. The pump 33A is, for example, a magnetic levitation pump. Note that the pump 33A of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0098] The pressure gauge 34A measures the pressure of the processing liquid L flowing through the circulation path 32A. The pressure measurement value of the processing liquid L measured by the pressure gauge 34A is output to the control unit 5 (see FIG. 1). The check valve 35A prevents backflow of the processing liquid L flowing through the circulation path 32A. The check valve 35A is, for example, an air-operated valve.

[0099] The heater 36A heats the processing liquid L flowing through the circulation path 32A. In the first modification, the processing liquid L stored in the processing bath 21 is heated to a processing set temperature A S (See Figure 5)

[0100] The filter 37A removes contaminants such as particles contained in the processing liquid L flowing through the circulation path 32A. The filter 37A may include a plurality of filter modules arranged in parallel.

[0101] The flow meter 39A measures the flow rate of the processing liquid L flowing through the circulation path 32A. The measured value of the flow rate of the processing liquid L measured by the flow meter 39A is output to the control unit 5.

[0102] In circulation path 32B, with treatment tank 21 as the reference, a pump 33B, a pressure gauge 34B, a check valve 35B, a heater 36B, a filter 37B, a branching portion 38, and a flow meter 39B are provided in this order from the upstream side.

[0103] The pump 33B forms a circulating flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32B, and returns to the treatment tank 21. The pump 33B is, for example, a magnetic levitation pump that delivers the treatment liquid L by rotating a rotating part while magnetically levitating in the treatment liquid L. Note that the pump 33B of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0104] The pressure gauge 34B measures the pressure of the processing liquid L flowing through the circulation path 32B. The pressure measurement value of the processing liquid L measured by the pressure gauge 34B is output to the control unit 5. The check valve 35B prevents backflow of the processing liquid L flowing through the circulation path 32B. The check valve 35B is, for example, an air-operated valve.

[0105] The heater 36B heats the processing liquid L flowing through the circulation path 32B. In the first modification, the processing liquid L stored in the processing bath 21 is heated to a processing set temperature A S It is heated until

[0106] The filter 37B removes contaminants such as particles contained in the processing liquid L flowing through the circulation path 32B. The filter 37B may include a plurality of filter modules arranged in parallel.

[0107] A branch path 41 that is connected to the outer bath 21b of the treatment bath 21 branches off from the branching portion 38. The flow meter 39B measures the flow rate of the treatment liquid L flowing through the circulation path 32B. The measured value of the flow rate of the treatment liquid L measured by the flow meter 39B is output to the control unit 5.

[0108] The branch path 41 is a flow path for sampling the concentration of the treatment liquid L flowing through the circulation path 32B. A flow meter 42, a concentration meter 43, and a valve 44 are provided in this branch path 41, in this order from the upstream side with respect to the branch point 38.

[0109] The flow meter 42 measures the flow rate of the treatment liquid L flowing through the branch path 41. The measured value of the flow rate of the treatment liquid L measured by the flow meter 42 is output to the control unit 5.

[0110] The concentration meter 43 measures the concentration of the treatment liquid L flowing through the circulation path 32 by measuring the concentration of the treatment liquid L flowing through the branch path 41. The concentration meter 43 measures, for example, the phosphoric acid concentration of the treatment liquid L flowing through the branch path 41. The measured value of the concentration of the treatment liquid L measured by the concentration meter 43 is output to the control unit 5. The valve 44 controls whether or not the treatment liquid L is supplied from the branch part 38 to the outer bath 21b.

[0111] Next, details of the start-up process of the substrate processing apparatus 1 using the processing liquid supply system 3 according to the first modification will be described with reference to FIGS.

[0112] As shown in Fig. 5, the control unit 5 (see Fig. 1) operates the pumps 33A and 33B (see Fig. 7) as a circulation process from time T03, which is the same as in the embodiment. As a result, the control unit 5 causes the processing liquid L (see Fig. 7) to flow through the circulation paths 32A and 32B (see Fig. 7), thereby performing a filling process to fill the circulation paths 32A and 32B with the processing liquid L.

[0113] In the filling process according to the first modification, the control unit 5 controls the rotation speed of the pumps 33A and 33B, which are magnetic levitation pumps, as shown in Fig. 5. Furthermore, in the filling process, the control unit 5 controls the rotation speed of the pumps 33A and 33B. s Make it work.

[0114] In this way, by operating the pumps 33A and 33B by controlling the rotation speed during the filling process, the pumps 33A and 33B can be stably operated even when flow rate feedback control is difficult because the circulation paths 32A and 32B are not filled with the processing liquid L. Therefore, according to the first modification, the circulation paths 32A and 32B can be stably filled with the processing liquid L.

[0115] In addition, in the first modification, during the filling process, the measured values ​​of the flow meters 39A and 39B (see FIG. 7) are both equal to or less than the minimum circulation flow rate F L At the same time, the rotation speed R is set to a value at which cavitation does not occur inside the pumps 33A and 33B. s It is preferable to operate the pumps 33A and 33B at this rate, so that the circulation paths 32A and 32B can be filled with the processing liquid L stably.

[0116] 5, the filling process according to the first modification is preferably performed from time T03 for a period P1 that has been confirmed in advance as being sufficient to fill both of the circulation paths 32A and 32B with the processing liquid L. This makes it possible to more reliably fill the circulation paths 32A and 32B with the processing liquid L.

[0117] Following the filling process described above, in the circulation process according to Modification 1, the control unit 5 stops the pumps 33A and 33B from time T11, similar to the embodiment, to perform a stop process of stopping the circulation of the treatment liquid L through the circulation paths 32A and 32B. As a result, the measured values ​​of the treatment liquid L measured by the flow meters 39A and 39B become zero, as shown in FIG.

[0118] In this way, in the circulation process according to the first modification, by performing a stopping process to stop the circulation of the processing liquid L after the filling process, it is possible to make all of the circulation paths 32A, 32B uniform in a state of zero circulation flow rate. Therefore, according to the first modification, it is possible to start up circulation flows in a state in which all of the circulation paths 32A, 32B have the same flow rate.

[0119] Next, in the circulation process according to the first variant, the control unit 5 performs a first circulation process, as shown in FIG. 6, in which the control unit 5 circulates the processing liquid L (see FIG. 7) flowing through the circulation paths 32A and 32B (see FIG. 7) from time T12, which is the same as in the embodiment, so that the processing liquid L (see FIG. 7) flowing through the circulation paths 32A and 32B is both at an initial set flow rate F1.

[0120] When performing this first circulation process, the control unit 5 (see FIG. 1) switches the operation mode of the pumps 33A and 33B (see FIG. 7) from rotation speed control to flow rate feedback control.

[0121] In the first circulation process, the control unit 5 sets the set flow rates of the treatment liquid L in the circulation paths 32A and 32B to the initial set flow rate F1, and operates the pumps 33A and 33B. As a result, the measured values ​​of the flow meters 39A and 39B (see FIG. 7) gradually increase from zero, as shown in FIG.

[0122] Furthermore, in the first modification, the control unit 5 operates the heaters 36A and 36B (see FIG. 7) to adjust the temperature of the treatment liquid L from time T05 after the start of the first circulation process.

[0123] In this way, in the first modification, the minimum circulation flow rate F LThe heaters 36A and 36B are not operated immediately after the temperature reaches 100° C., but are operated after a margin of a period P2.

[0124] This allows the heaters 36A, 36B to be operated after ensuring a sufficient circulation flow rate in the circulation paths 32A, 32B, thereby suppressing problems caused by operating the heaters 36A, 36B when the flow rate in the circulation paths 32A, 32B is insufficient.

[0125] In Modification 1, from time T05 when the temperature adjustment process starts, the measurement value of thermometer 45 gradually rises from temperature A0. Also, in Modification 1, as the processing liquid L overflows from inner bath 21a to outer bath 21b and the temperature of processing liquid L rises, the water in processing liquid L evaporates from processing bath 21, and the measurement value of concentration meter 43 gradually rises from concentration C0.

[0126] In the first variant, after the measured values ​​of the flow meters 39A and 39B both reach the initial set flow rate F1, the control unit 5 performs a second circulation process in which the pumps 33A and 33B are operated so that the circulation paths 32A and 32B reach the processing set flow rate F2.

[0127] That is, in the circulation process according to the first modification, the flow rates in the circulation paths 32A and 32B are first stabilized at the initial setting flow rate F1, and then the pumps 33A and 33B are operated so that the circulation paths 32A and 32B reach the processing setting flow rate F2.

[0128] This allows the control unit 5 to stably perform feedback control of both the circulation paths 32A and 32B at the desired set processing flow rate F2. Therefore, according to the first modification, the flow rates of the processing liquid L discharged from the plurality of discharge units 23 via the circulation paths 32A and 32B can be made uniform, thereby reducing variations in the temperature of the processing liquid L in the inner bath 21a.

[0129] Furthermore, compared to operating pumps 33A and 33B so that the flow rate in circulation paths 32A and 32B increases from zero to the processing set flow rate F2 in one go, even if the flow rate of processing liquid L is increased, the occurrence of cavitation inside pumps 33A and 33B can be suppressed.

[0130] Therefore, according to the first modification, the flow rate of the processing liquid L returned to the processing tank 21 from the circulation paths 32A and 32B can be increased.

[0131] In addition, in the first modification, the control unit 5 determines whether the measured values ​​of the flow meters 39A and 39B are both the initial set flow rate F1 and whether the measured value of the concentration meter 43 is within a given concentration range (lower limit concentration C TL and upper concentration C TH When the second circulation process is started, the second circulation process may be started.

[0132] This allows the viscosity of the processing liquid L to approach the viscosity during wafer W processing, and then the pumps 33A and 33B can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pumps 33A and 33B can be further suppressed.

[0133] Therefore, according to the first modification, the flow rate of the treatment liquid L returned to the treatment tank 21 from the circulation paths 32A and 32B can be increased stably.

[0134] In addition, in the first modification, the control unit 5 determines whether the measured values ​​of the flow meters 39A and 39B are both the initial set flow rate F1 and whether the measured value of the thermometer 45 is within a given temperature range (lower limit temperature A TL and upper limit temperature A TH When the second circulation process is started, the second circulation process may be started.

[0135] This allows the viscosity of the processing liquid L to approach the viscosity during wafer W processing, and then the pumps 33A and 33B can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pumps 33A and 33B can be further suppressed.

[0136] Therefore, according to the first modification, the flow rate of the treatment liquid L returned to the treatment tank 21 from the circulation paths 32A and 32B can be increased stably.

[0137] In addition, in variant example 1, the control unit 5 may start the second circulation process from time T15 when the measurement values ​​of the flow meters 39A and 39B both reach the initial setting flow rate F1, the measurement value of the concentration meter 43 falls within a given concentration range, and the measurement value of the thermometer 45 falls within a given temperature range.

[0138] This allows the viscosity of the processing liquid L to be brought closer to the viscosity during wafer W processing, and then the pumps 33A and 33B can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pumps 33A and 33B can be further suppressed.

[0139] Therefore, according to the first modification, the flow rate of the treatment liquid L returned to the treatment tank 21 from the circulation paths 32A and 32B can be increased stably.

[0140] The control unit 5 starts the second circulation process from time T15, and gradually increases the set flow rates of the pumps 33A and 33B from time T15 to time T16. Then, at time T16, the control unit 5 sets the set flow rates of the pumps 33A and 33B to the process set flow rate F2 for processing the wafer W.

[0141] Then, the measured values ​​of the flow meters 39A and 39B become the set process flow rate F2 when processing the wafer W, and the measured value of the concentration meter 43 becomes the set process concentration C S The measurement value of the thermometer 45 is the processing temperature A S This completes the series of startup processes according to the first modification.

[0142] In the first modification, the set flow rates of the pumps 33A and 33B are gradually increased between time T15 and time T16, thereby suppressing abrupt changes in the flow rates in the circulation paths 32A and 32B. Therefore, according to the first modification, it is possible to suppress the occurrence of cavitation inside the pumps 33A and 33B.

[0143] In the example of Figure 7 described so far, an example has been shown in which the circulation path 32 includes two circulation paths 32A and 32B, but the present disclosure is not limited to such an example, and the circulation path 32 may be configured to include three or more circulation paths.

[0144] <Variation 2> Next, a processing liquid supply system 3 according to Modification 2 of the embodiment and a start-up process using the processing liquid supply system 3 will be described with reference to Fig. 8 in addition to Fig. 5 and Fig. 6. Fig. 8 is a diagram showing an example of the configuration of the processing liquid supply system 3 according to Modification 2 of the embodiment.

[0145] 8 differs from the above-described embodiment and Modification 1 in the configuration of the circulation path 32. Specifically, in Modification 2, one circulation path 32 branches at a branch point 50 midway to form multiple (two in the figure) branch circulation paths 32a, 32b.

[0146] This allows the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 to be increased compared to when one circulation path 32 is provided from the most upstream to the most downstream for one treatment tank 21.

[0147] The circulation path 32 is provided with, in this order from the upstream side with respect to the treatment tank 21, a pump 33, a pressure gauge 34, a check valve 35, and a branching section 50. The circulation path 32 branches into branch circulation paths 32a and 32b at the branching section 50.

[0148] The pump 33 forms a circulation flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32 and the branch circulation paths 32a and 32b, and returns to the treatment tank 21. The pump 33 is, for example, a magnetic levitation pump. Note that the pump 33 of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0149] The pressure gauge 34 measures the pressure of the processing liquid L flowing through the circulation path 32. The pressure measurement value of the processing liquid L measured by the pressure gauge 34 is output to the control unit 5 (see FIG. 1). The check valve 35 prevents backflow of the processing liquid L flowing through the circulation path 32. The check valve 35 is, for example, an air-operated valve.

[0150] In this way, by arranging the pump 33 upstream of the branching portion 50, the processing liquid L can be sent to the plurality of branch circulation paths 32a, 32b without increasing the number of pumps 33. Therefore, according to the second modification, the manufacturing cost of the processing liquid supply system 3 can be reduced.

[0151] In the branch circulation path 32a, a heater 36A, a filter 37A, and a flow meter 39A are provided in this order from the upstream side with respect to the branch portion 50.

[0152] The heater 36A heats the processing liquid L flowing through the branch circulation path 32a. In the second modification, the processing liquid L stored in the processing bath 21 is heated to a processing set temperature A S (See Figure 5)

[0153] The filter 37A removes contaminants such as particles contained in the processing liquid L flowing through the branch circulation path 32a. The filter 37A may include a plurality of filter modules arranged in parallel.

[0154] The flow meter 39A measures the flow rate of the treatment liquid L flowing through the branch circulation path 32a. The measured value of the flow rate of the treatment liquid L measured by the flow meter 39A is output to the control unit 5.

[0155] In the branch circulation path 32b, a heater 36B, a filter 37B, a branch portion 38, and a flow meter 39B are provided in this order from the upstream side with respect to the branch portion 50.

[0156] The heater 36B heats the processing liquid L flowing through the branch circulation path 32b. In the second modification, the processing liquid L stored in the processing bath 21 is heated to a processing set temperature A S It is heated until

[0157] The filter 37B removes contaminants such as particles contained in the processing liquid L flowing through the branch circulation path 32b. The filter 37B may include a plurality of filter modules arranged in parallel.

[0158] A branch path 41 that is connected to the outer tank 21b of the processing tank 21 branches off from the branch part 38. The flow meter 39B measures the flow rate of the processing liquid L flowing through the branch circulation path 32b. The measured value of the flow rate of the processing liquid L measured by the flow meter 39B is output to the control unit 5.

[0159] The branch path 41 is a flow path for sampling the concentration of the treatment liquid L flowing through the branch circulation path 32b. A flow meter 42, a concentration meter 43, and a valve 44 are provided in this branch path 41, in this order from the upstream side with respect to the branch point 38.

[0160] The flow meter 42 measures the flow rate of the treatment liquid L flowing through the branch path 41. The measured value of the flow rate of the treatment liquid L measured by the flow meter 42 is output to the control unit 5.

[0161] The concentration meter 43 measures the concentration of the treatment liquid L flowing through the circulation path 32 by measuring the concentration of the treatment liquid L flowing through the branch path 41. The concentration meter 43 measures, for example, the phosphoric acid concentration of the treatment liquid L flowing through the branch path 41. The measured value of the concentration of the treatment liquid L measured by the concentration meter 43 is output to the control unit 5. The valve 44 controls whether or not the treatment liquid L is supplied from the branch part 38 to the outer bath 21b.

[0162] Next, details of the start-up process of the substrate processing apparatus 1 using the processing liquid supply system 3 according to the second modification will be described with reference to FIGS.

[0163] As shown in Fig. 5, the control unit 5 (see Fig. 1) operates the pump 33 (see Fig. 8) as a circulation process from time T03, similar to the embodiment. As a result, the control unit 5 causes the processing liquid L (see Fig. 8) to flow through the circulation path 32 (see Fig. 8) and the branch circulation paths 32a and 32b (see Fig. 8), thereby performing a filling process in which the circulation path 32 and the branch circulation paths 32a and 32b are filled with the processing liquid L.

[0164] In the filling process according to the second modification, the control unit 5 controls the rotation speed of the pump 33, which is a magnetic levitation pump, as shown in Fig. 5. Furthermore, in the filling process, the control unit 5 controls the rotation speed of the pump 33 at a given rotation speed R s Make it work.

[0165] In this way, by operating the pump 33 by controlling the rotation speed during the filling process, the pump 33 can be operated stably even when flow rate feedback control is difficult because the circulation path 32 and the branch circulation paths 32a, 32b are not filled with the processing liquid L. Therefore, according to the second modification, the circulation path 32 and the branch circulation paths 32a, 32b can be filled with the processing liquid L stably.

[0166] In the second modification, during the filling process, the measured values ​​of the flow meters 39A and 39B (see FIG. 8) are both equal to or less than the minimum circulation flow rate F L At the same time, the rotation speed R is set to a value at which cavitation does not occur inside the pump 33. s It is preferable to operate the pump 33 at this rate, so that the circulation path 32 and the branch circulation paths 32a and 32b can be filled with the processing liquid L stably.

[0167] 5, the filling process according to the second modification may be performed from time T03 for a period P1 that is confirmed in advance as being sufficient to fill the circulation path 32 and the branch circulation paths 32a and 32b with the processing liquid L. This makes it possible to more reliably fill the circulation path 32 and the branch circulation paths 32a and 32b with the processing liquid L.

[0168] Following the filling process described above, in the circulation process according to Modification 2, the control unit 5 stops the pump 33 from time T11, similar to the embodiment, to stop the circulation of the processing liquid L through the circulation path 32 and the branch circulation paths 32a and 32b. As a result, the measured values ​​of the flow meters 39A and 39B become zero, as shown in FIG.

[0169] In this way, in the circulation process according to Modification 2, by performing a stopping process to stop the circulation of the processing liquid L after the filling process, it is possible to make all of the branch circulation paths 32a, 32b uniform in a state of zero circulation flow rate. Therefore, according to Modification 2, it is possible to start up circulation flows in a state in which all of the branch circulation paths 32a, 32b have the same flow rate.

[0170] Next, in the circulation process according to the second variant, the control unit 5 performs a first circulation process, as shown in FIG. 6, in which the control unit 5 circulates the processing liquid L (see FIG. 8) flowing through the branch circulation paths 32a, 32b (see FIG. 8) from time T12, which is the same as in the embodiment, so that the processing liquid L (see FIG. 8) flowing through both paths is at an initial setting flow rate F1.

[0171] When performing this first circulation process, the control unit 5 (see FIG. 1) switches the operation mode of the pump 33 (see FIG. 8) from rotation speed control to flow rate feedback control.

[0172] Then, in the first circulation process, the control unit 5 sets the set flow rate of the processing liquid L in the branch circulation paths 32a and 32b to the initial set flow rate F1, and operates the pump 33. As a result, as shown in FIG. 6, the measured values ​​of the flow meters 39A and 39B (see FIG. 8) gradually increase from zero.

[0173] Furthermore, in the second modification, the control unit 5 operates the heaters 36A and 36B (see FIG. 8) to adjust the temperature of the treatment liquid L from time T05 after the start of the first circulation process.

[0174] In this way, in the second modification, the minimum circulation flow rate F L The heaters 36A and 36B are not operated immediately after the temperature reaches 100° C., but are operated after a margin of a period P2.

[0175] This allows the heaters 36A, 36B to be operated after ensuring a sufficient circulation flow rate in the branch circulation paths 32a, 32b, thereby preventing problems caused by operating the heaters 36A, 36B when the flow rate in the branch circulation paths 32a, 32b is insufficient.

[0176] In Modification 2, from time T05 when the temperature adjustment process starts, the measurement value of the thermometer 45 gradually rises from temperature A0. Also, in Modification 2, as the processing liquid L overflows from the inner bath 21a to the outer bath 21b and the temperature of the processing liquid L rises, the water in the processing liquid L evaporates from the processing bath 21, and the measurement value of the concentration meter 43 gradually rises from concentration C0.

[0177] In the second variant, after the measured values ​​of the flow meters 39A and 39B both reach the initial set flow rate F1, the control unit 5 performs a second circulation process in which the pump 33 is operated so that the branch circulation paths 32a and 32b reach the processing set flow rate F2.

[0178] That is, in the circulation process according to the second modification, the flow rates in the branch circulation paths 32a and 32b are first stabilized at the initial setting flow rate F1, and then the pump 33 is operated so that the branch circulation paths 32a and 32b reach the processing setting flow rate F2.

[0179] This allows the control unit 5 to stably perform feedback control of both the branch circulation paths 32a and 32b at the desired set processing flow rate F2. Therefore, according to the second modification, the flow rates of the processing liquid L discharged from the plurality of discharge units 23 via the branch circulation paths 32a and 32b can be made uniform, thereby reducing variations in the temperature of the processing liquid L in the inner bath 21a.

[0180] Furthermore, compared to operating the pump 33 so that the flow rate in the branch circulation paths 32a and 32b increases from zero to the processing set flow rate F2 in one go, even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be suppressed.

[0181] Therefore, according to the second modification, the flow rate of the processing liquid L returned to the processing tank 21 from the circulation path 32 and the branch circulation paths 32a and 32b can be increased.

[0182] In the second modification, the control unit 5 determines whether the measured values ​​of the flow meters 39A and 39B are both the initial set flow rate F1 and whether the measured value of the concentration meter 43 is within a given concentration range (lower limit concentration C TL and upper concentration C TH When the second circulation process is started, the second circulation process may be started.

[0183] This allows the viscosity of the processing liquid L to be brought closer to the viscosity during wafer W processing, and then the pump 33 can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be further suppressed.

[0184] Therefore, according to the second modification, the flow rate of the treatment liquid L returned to the treatment tank 21 from the circulation path 32 and the branch circulation paths 32a and 32b can be increased stably.

[0185] In the second modification, the control unit 5 determines whether the measured values ​​of the flow meters 39A and 39B are both the initial set flow rate F1 and whether the measured value of the thermometer 45 is within a given temperature range (lower limit temperature A TL and upper limit temperature A THWhen the second circulation process is started, the second circulation process may be started.

[0186] This allows the viscosity of the processing liquid L to be brought closer to the viscosity during wafer W processing, and then the pump 33 can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be further suppressed.

[0187] Therefore, according to the second modification, the flow rate of the treatment liquid L returned to the treatment tank 21 from the circulation path 32 and the branch circulation paths 32a and 32b can be increased stably.

[0188] In addition, in variant example 2, the control unit 5 may start the second circulation process from time T15 when the measurement values ​​of the flow meters 39A and 39B both reach the initial setting flow rate F1, the measurement value of the concentration meter 43 falls within a given concentration range, and the measurement value of the thermometer 45 falls within a given temperature range.

[0189] This allows the viscosity of the processing liquid L to be brought closer to the viscosity during wafer W processing, and then the pump 33 can be operated to achieve the processing set flow rate F2, so that even if the flow rate of the processing liquid L is increased, the occurrence of cavitation inside the pump 33 can be further suppressed.

[0190] Therefore, according to the second modification, the flow rate of the treatment liquid L returned to the treatment tank 21 from the circulation path 32 and the branch circulation paths 32a and 32b can be increased stably.

[0191] The control unit 5 starts the second circulation process from time T15, and gradually increases the set flow rate of the pump 33 from time T15 to time T16. Then, the control unit 5 sets the set flow rate of the pump 33 to the set processing flow rate F2 for processing the wafer W at time T16.

[0192] Then, the measured values ​​of the flow meters 39A and 39B become the set process flow rate F2 when processing the wafer W, and the measured value of the concentration meter 43 becomes the set process concentration C SThe measurement value of the thermometer 45 is the processing temperature A S This completes the series of startup processes according to the second modification.

[0193] In the second modification, the set flow rate of the pump 33 is gradually increased between time T15 and time T16, thereby suppressing abrupt changes in the flow rates in the circulation path 32 and the branch circulation paths 32a and 32b. Therefore, according to the second modification, the occurrence of cavitation inside the pump 33 can be suppressed.

[0194] In the example of Figure 8 described so far, an example has been shown in which the circulation path 32 branches into two branch circulation paths 32a and 32b along the way, but the present disclosure is not limited to such an example, and the circulation path 32 may branch into three or more branch circulation paths along the way.

[0195] The processing liquid supply system 3 according to the embodiment includes a processing liquid supply unit 31, a circulation path 32 (32A, 32B), pumps 33 (33A, 33B), flow meters 39 (39A, 39B), and a control unit 5. The processing liquid supply unit 31 supplies the processing liquid L to a processing tank 21 in which a substrate (wafer W) is immersed for processing. The circulation path 32 (32A, 32B) causes the processing liquid L to flow out of the processing tank 21 and return it to the processing tank 21. The pumps 33 (33A, 33B) and the flow meters 39 (39A, 39B) are provided in the circulation path 32 (32A, 32B). The control unit 5 controls each component. The control unit 5 also performs a storage process, a filling process, a first circulation process, and a second circulation process. In the storage process, the processing liquid L is supplied from the processing liquid supply unit 31 and stored in the processing tank 21. In the filling process, the pumps 33 (33A, 33B) are operated to pass the processing liquid L through the circulation path 32 (32A, 32B) and fill the circulation path 32 (32A, 32B) with the processing liquid L. In the first circulation process, after the filling process, the pumps 33 (33A, 33B) are operated so that the processing liquid L flowing through the circulation path 32 (32A, 32B) reaches a predetermined initial setting flow rate F1, thereby circulating the processing liquid L through the circulation path 32 (32A, 32B). In the second circulation process, after the measurement value of the flow meter 39 (39A, 39B) reaches the initial setting flow rate F1, the pumps 33 (33A, 33B) are operated so that the processing liquid L reaches a predetermined processing setting flow rate F2 for processing the substrate (wafer W). This increases the flow rate of the processing liquid L returned from the circulation path 32 to the processing bath 21.

[0196] The processing liquid supply system 3 according to the embodiment further includes a heater 36 (36A, 36B) provided in the circulation path 32 (32A, 32B) and a thermometer 45 that measures the temperature of the processing liquid L flowing through the circulation path 32 (32A, 32B). The control unit 5 operates the heater 36 (36A, 36B) to heat the processing liquid L in the first circulation process, and starts the second circulation process when the measurement values ​​of the flowmeter 39 (39A, 39B) reach the initial set flow rate F1 and the measurement value of the thermometer 45 falls within a given temperature range. This makes it possible to stably increase the flow rate of the processing liquid L returned from the circulation path 32 (32A, 32B) to the processing tank 21.

[0197] The processing liquid supply system 3 according to the embodiment further includes a concentration meter 43 that measures the concentration of the processing liquid L flowing through the circulation path 32 (32A, 32B). The control unit 5 operates the heater 36 (36A, 36B) to heat the processing liquid L during the first circulation process. The control unit 5 then starts the second circulation process when the measurement value of the flow meter 39 (39A, 39B) reaches the initial setting flow rate F1, the measurement value of the thermometer 45 falls within a given temperature range, and the measurement value of the concentration meter 43 falls within a given concentration range. This allows the flow rate of the processing liquid L returned from the circulation path 32 (32A, 32B) to the processing tank 21 to be increased stably.

[0198] The processing liquid supply system 3 according to the embodiment further includes a heater 36 (36A, 36B) provided in the circulation path 32 (32A, 32B) and a concentration meter 43 that measures the concentration of the processing liquid L flowing through the circulation path 32 (32A, 32B). The control unit 5 operates the heater 36 (36A, 36B) to heat the processing liquid L in the first circulation process. The control unit 5 then starts the second circulation process when the measurement value of the flow meter 39 (39A, 39B) reaches the initial setting flow rate F1 and the measurement value of the concentration meter 43 falls within a given concentration range. This allows the flow rate of the processing liquid L returned from the circulation path 32 (32A, 32B) to the processing tank 21 to be stably increased.

[0199] Furthermore, in the processing liquid supply system 3 according to the embodiment, a plurality of circulation paths 32A, 32B are provided. Pumps 33A, 33B and flow meters 39A, 39B are provided in each of the circulation paths 32A, 32B. During the filling process, the control unit 5 operates the pumps 33A, 33B provided in each of the circulation paths 32A, 32B to fill all of the circulation paths 32A, 32B with the processing liquid L. Between the filling process and the first circulation process, the control unit 5 executes a stop process to stop the operation of all of the pumps 33A, 33B and stop the circulation in all of the circulation paths 32A, 32B. This allows the circulation flow to be started with the same flow rate in all of the circulation paths 32A, 32B.

[0200] In the processing liquid supply system 3 according to this embodiment, the control unit 5 starts the second circulation process when the measured values ​​of all the flow meters 39A, 39B reach the initial set flow rate F1 in the first circulation process, thereby reducing the temperature variation of the processing liquid L in the inner bath 21a.

[0201] In the processing liquid supply system 3 according to the embodiment, the circulation path 32 branches downstream of the pump 33 to form a plurality of branch circulation paths 32a, 32b. Flow meters 39A, 39B are provided for each of the branch circulation paths 32a, 32b. In the filling process, the control unit 5 operates the pump 33 to fill all of the branch circulation paths 32a, 32b with the processing liquid L. Between the filling process and the first circulation process, the control unit 5 stops the operation of the pump 33 to stop circulation in all of the branch circulation paths 32a, 32b. This allows the circulation flow to be started with the same flow rate in all of the branch circulation paths 32a, 32b.

[0202] Furthermore, in the processing liquid supply system 3 according to the embodiment, the pump 33 (33A, 33B) is a magnetic levitation pump that feeds the processing liquid L by rotating while magnetically levitating a rotating part in the processing liquid L. The control unit 5 feeds the processing liquid L while controlling the rotation speed of the rotating part based on the measurement value of the flow meter 39 (39A, 39B). This makes it possible to increase the flow rate of the processing liquid L returned from the circulation path 32 to the processing tank 21.

[0203] In the processing liquid supply system 3 according to the embodiment, the control unit 5 operates the pump 33 (33A, 33B) while fixing the rotation speed of the rotating unit at a given rotation speed during the filling process. This allows the circulation path 32 to be stably filled with the processing liquid L.

[0204] <Control processing procedure> Next, the procedure of the control process according to the embodiment will be described with reference to Figures 9 to 11. Figure 9 is a flowchart showing an example of the procedure of the control process executed by the processing liquid supply system 3 according to the embodiment.

[0205] In the control process according to the embodiment, first, the control unit 5 operates the pump 33 to pass the treatment liquid L through the circulation path 32, thereby performing a filling process to fill the circulation path 32 with the treatment liquid L (step S101).

[0206] Next, the control unit 5 determines whether the circulation path 32 is filled with the treatment liquid L (step S102). For example, the control unit 5 can determine that the circulation path 32 is filled with the treatment liquid L when the filling process (step S101) is performed for a given period P1 or more.

[0207] If it is determined that the circulation path 32 is filled with the processing liquid L (step S102, Yes), the control unit 5 stops the pump 33 to perform a stop process to stop the circulation of the processing liquid L through the circulation path 32 (step S103). On the other hand, if it is determined that the circulation path 32 is not filled with the processing liquid L (step S102, No), the process returns to step S101.

[0208] Following the stop process (step S103), the control unit 5 determines whether or not the circulation of the treatment liquid L has stopped in the circulation path 32 (step S104). For example, the control unit 5 can determine that the circulation of the treatment liquid L has stopped in the circulation path 32 when the stop process (step S103) has been performed for a given period of time or longer.

[0209] If it is determined that the circulation of the treatment liquid L has stopped in the circulation path 32 (step S104, Yes), the control unit 5 performs a first circulation process of circulating the treatment liquid L so that the treatment liquid L flowing through the circulation path 32 has a given initial setting flow rate F1 (step S105). On the other hand, if it is determined that the circulation of the treatment liquid L has not stopped in the circulation path 32 (step S104, No), the process returns to step S103.

[0210] Following the first circulation process (step S105), the control unit 5 determines whether the flow rate of the processing liquid L in the circulation path 32 has reached the initial setting flow rate F1 (step S106). If it is determined that the flow rate of the processing liquid L in the circulation path 32 has reached the initial setting flow rate F1 (step S106, Yes), the control unit 5 determines whether the temperature of the processing liquid L is within a given temperature range (lower limit temperature A TL and upper limit temperature A TH It is determined whether the value is within the range of (between 0 and 1) (step S107).

[0211] If it is determined that the temperature of the treatment liquid L is within the given temperature range (step S107, Yes), the control unit 5 determines whether the concentration of the treatment liquid L is within the given concentration range (lower limit concentration C TL and upper concentration C TH It is determined whether the value is within the range (between 0 and 1) (step S108).

[0212] If it is determined that the concentration of the processing liquid L is within the given concentration range (Yes in step S108), the control unit 5 performs a second circulation process (step S109) by operating the pump 33 so that the circulation path 32 has a given set processing flow rate F2 when processing the wafer W. Then, the series of start-up processes is completed.

[0213] In the process of step S106, if it is determined that the flow rate of the processing liquid L in the circulation path 32 has not reached the initial setting flow rate F1 (step S106, No), the process returns to step S105.

[0214] Furthermore, in the process of step S107, if it is determined that the temperature of the processing liquid L is not within the given temperature range (step S107, No), the process returns to the process of step S105.

[0215] Furthermore, in the process of step S108, if it is determined that the concentration of the treatment liquid L is not within the given concentration range (step S108, No), the process returns to the process of step S105.

[0216] FIG. 10 is a flowchart showing another example of the procedure of the control process executed by the processing liquid supply system 3 according to the embodiment.

[0217] In the control process shown in FIG. 10, first, the control unit 5 operates the pump 33 to pass the processing liquid L through the circulation path 32, thereby performing a filling process to fill the circulation path 32 with the processing liquid L (step S201).

[0218] Next, the control unit 5 determines whether the circulation path 32 is filled with the processing liquid L (step S202). If it is determined that the circulation path 32 is filled with the processing liquid L (step S202, Yes), the control unit 5 stops the pump 33 and performs a stop process to stop the circulation of the processing liquid L through the circulation path 32 (step S203).

[0219] On the other hand, if it is determined that the circulation path 32 is not filled with the treatment liquid L (step S202, No), the process returns to step S201.

[0220] Following the stop process (step S203), the control unit 5 determines whether or not the circulation of the processing liquid L has stopped in the circulation path 32 (step S204). If it is determined that the circulation of the processing liquid L has stopped in the circulation path 32 (step S204, Yes), the control unit 5 performs a first circulation process to circulate the processing liquid L so that the processing liquid L flowing through the circulation path 32 has a given initial setting flow rate F1 (step S205).

[0221] On the other hand, if it is determined that the circulation of the treatment liquid L in the circulation path 32 has not stopped (No in step S204), the process returns to step S203.

[0222] Following the first circulation process (step S205), the control unit 5 determines whether the flow rate of the processing liquid L in the circulation path 32 has reached the initial setting flow rate F1 (step S206). If it is determined that the flow rate of the processing liquid L in the circulation path 32 has reached the initial setting flow rate F1 (step S206, Yes), the control unit 5 determines whether the temperature of the processing liquid L is within a given temperature range (step S207).

[0223] If it is determined that the temperature of the processing liquid L is within the given temperature range (Yes in step S207), the control unit 5 performs a second circulation process (step S208) by operating the pump 33 so that the circulation path 32 has a processing set flow rate F2 for processing the wafer W. Then, the series of start-up processes is completed.

[0224] In the process of step S206, if it is determined that the flow rate of the processing liquid L in the circulation path 32 has not reached the initial setting flow rate F1 (step S206, No), the process returns to the process of step S205.

[0225] Furthermore, in the process of step S207, if it is determined that the temperature of the treatment liquid L is not within the given temperature range (step S207, No), the process returns to the process of step S205.

[0226] FIG. 11 is a flowchart showing another example of the procedure of the control process executed by the processing liquid supply system 3 according to the embodiment.

[0227] In the control process shown in FIG. 11, first, the control unit 5 operates the pump 33 to pass the processing liquid L through the circulation path 32, thereby performing a filling process to fill the circulation path 32 with the processing liquid L (step S301).

[0228] Next, the control unit 5 determines whether the circulation path 32 is filled with the processing liquid L (step S302). If it is determined that the circulation path 32 is filled with the processing liquid L (step S302, Yes), the control unit 5 stops the pump 33 and performs a stop process to stop the circulation of the processing liquid L through the circulation path 32 (step S303).

[0229] On the other hand, if it is determined that the circulation path 32 is not filled with the treatment liquid L (No at step S302), the process returns to step S301.

[0230] Following the stop process (step S303), the control unit 5 determines whether or not the circulation of the processing liquid L has stopped in the circulation path 32 (step S304). If it is determined that the circulation of the processing liquid L has stopped in the circulation path 32 (step S304, Yes), the control unit 5 performs a first circulation process to circulate the processing liquid L so that the processing liquid L flowing through the circulation path 32 has a given initial setting flow rate F1 (step S305).

[0231] On the other hand, if it is determined that the circulation of the treatment liquid L in the circulation path 32 has not stopped (No in step S304), the process returns to step S303.

[0232] Following the first circulation process (step S305), the control unit 5 determines whether the flow rate of the processing liquid L in the circulation path 32 has reached the initial setting flow rate F1 (step S306). If it is determined that the flow rate of the processing liquid L in the circulation path 32 has reached the initial setting flow rate F1 (step S306, Yes), the control unit 5 determines whether the concentration of the processing liquid L is within a given concentration range (step S307).

[0233] If it is determined that the concentration of the processing liquid L is within the given concentration range (Yes in step S307), the control unit 5 performs a second circulation process (step S308) by operating the pump 33 so that the circulation path 32 has a set processing flow rate F2 for processing the wafer W. Then, the series of start-up processes is completed.

[0234] In the process of step S306, if it is determined that the flow rate of the processing liquid L in the circulation path 32 has not reached the initial set flow rate F1 (step S306, No), the process returns to the process of step S305.

[0235] Furthermore, in the process of step S307, if it is determined that the concentration of the treatment liquid L is not within the given concentration range (step S307, No), the process returns to the process of step S305.

[0236] The processing liquid supply method according to the embodiment includes a storing step, a filling step (steps S101, S201, S301), a first circulation step (steps S105, S205, S305), and a second circulation step (steps S109, S208, S308). In the storing step, the processing liquid L is supplied to the processing tank 21 in which the substrate (wafer W) is immersed for processing, and the processing liquid L is stored in the processing tank 21. In the filling step, the pumps 33 (33A, 33B) provided in the circulation path 32 (32A, 32B) are operated to cause the processing liquid L to flow through the circulation path 32 (32A, 32B), thereby filling the circulation path 32 (32A, 32B) with the processing liquid L. The circulation path 32 (32A, 32B) flows the processing liquid L out of the processing tank 21 and returns it to the processing tank 21. In the first circulation step, after the filling step, the pumps 33 (33A, 33B) are operated so that the processing liquid L flowing through the circulation path 32 (32A, 32B) reaches a given initial setting flow rate F1, thereby circulating the processing liquid L through the circulation path 32 (32A, 32B). In the second circulation step, after the processing liquid L flowing through the circulation path 32 (32A, 32B) reaches the initial setting flow rate F1, the pumps 33 (33A, 33B) are operated so that the processing liquid L reaches a given processing setting flow rate F2 for processing the substrate (wafer W). This increases the flow rate of the processing liquid L returned from the circulation path 32 to the processing tank 21.

[0237] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present disclosure.

[0238] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0239] 3 Processing liquid supply system 5. Control section 21 Treatment tank 21a Inner tank 21b Outer tank 31 Processing liquid supply unit 32, 32A, 32B circulation path 32a, 32b Branch circulation route 33, 33A, 33B pumps 36, 36A, 36B heaters 39, 39A, 39B flowmeter 43 Densitometer 45 Thermometer F1 initial setting flow rate F2 treatment set flow rate L processing liquid W wafer (an example of a substrate)

Claims

1. a processing liquid supply unit that supplies a processing liquid to a processing tank in which the substrate is immersed for processing; a circulation path through which the treatment solution flows out of the treatment tank and returns to the treatment tank; a pump and a flow meter provided in the circulation path; a control unit that controls each unit; Equipped with The control unit a storage process of supplying the processing liquid from the processing liquid supply unit and storing the processing liquid in the processing tank; a filling process of operating the pump to pass the treatment liquid through the circulation path and filling the circulation path with the treatment liquid; a first circulation process in which, after the filling process, the pump is operated so that the treatment liquid flowing through the circulation path has a predetermined initial set flow rate, thereby circulating the treatment liquid through the circulation path; and performing a second circulation process of operating the pump so that the flow rate reaches a predetermined process set flow rate when processing the substrate after the measurement value of the flow meter reaches the initial set flow rate. Processing liquid supply system.

2. a heater provided in the circulation path and a thermometer for measuring the temperature of the treatment liquid flowing through the circulation path, The control unit operates the heater to heat the treatment liquid in the first circulation process, and starts the second circulation process when the measurement value of the flow meter reaches the initial set flow rate and the measurement value of the thermometer falls within a given temperature range. The processing liquid supply system according to claim 1 .

3. a concentration meter for measuring the concentration of the treatment liquid flowing through the circulation path, The control unit operates the heater to heat the treatment liquid in the first circulation process, and starts the second circulation process when the measurement value of the flow meter reaches the initial set flow rate, the measurement value of the thermometer falls within a given temperature range, and the measurement value of the concentration meter falls within a given concentration range. The processing liquid supply system according to claim 2 .

4. a heater provided in the circulation path; and a concentration meter for measuring the concentration of the treatment liquid flowing through the circulation path, The control unit In the first circulation process, the heater is operated to heat the treatment liquid, and when the measurement value of the flow meter reaches the initial set flow rate and the measurement value of the concentration meter falls within a given concentration range, the second circulation process is started. The processing liquid supply system according to claim 1 .

5. The circulation path is provided in plurality, the pump and the flow meter are provided in each of the circulation paths, The control unit In the filling process, the pumps provided in the circulation paths are operated to fill all of the circulation paths with the treatment liquid; Between the filling process and the first circulation process, a stop process is performed to stop the operation of all the pumps and stop the circulation of all the circulation paths. The processing liquid supply system according to claim 1 .

6. The control unit starts the second circulation process when the measured values ​​of all the flow meters reach the initial set flow rate in the first circulation process. The processing liquid supply system according to claim 5 .

7. the circulation path branches into a plurality of branch circulation paths downstream of the pump, the flow meter is provided in each of the branch circulation paths, The control unit In the filling process, the pump is operated to fill all of the branch circulation paths with the processing liquid; Between the filling process and the first circulation process, a stop process is performed to stop the operation of the pump and stop circulation in all of the branch circulation paths. The processing liquid supply system according to claim 1 .

8. The control unit starts the second circulation process when the measured values ​​of all the flow meters reach the initial set flow rate in the first circulation process. The processing liquid supply system according to claim 7 .

9. the pump is a magnetic levitation pump that pumps the treatment liquid by rotating a rotating part while being magnetically levitated in the treatment liquid, The control unit controls the rotation speed of the rotating unit based on the measurement value of the flow meter to feed the treatment liquid.

9. The processing liquid supply system according to claim 1.

10. The control unit operates the pump while fixing the rotation speed of the rotating unit to a given rotation speed during the filling process. The processing liquid supply system according to claim 9 .

11. a storing step of supplying a processing liquid to a processing tank in which a substrate is immersed for processing, and storing the processing liquid in the processing tank; a filling step of operating a pump provided in a circulation path that discharges the treatment liquid from the treatment tank and returns the treatment liquid to the treatment tank, thereby causing the treatment liquid to flow through the circulation path and filling the circulation path with the treatment liquid; a first circulation step of circulating the treatment liquid through the circulation path by operating the pump so that the treatment liquid flowing through the circulation path has a predetermined initial set flow rate after the filling step; a second circulation step of operating the pump so that the processing liquid flowing through the circulation path reaches a predetermined processing set flow rate when processing the substrate after the initial set flow rate has been reached; A processing liquid supply method comprising:

12. A computer-readable storage medium storing a program that runs on a computer and controls a processing liquid supply system, The program, when executed, causes a computer to control the processing liquid supply system so as to perform the processing liquid supply method according to claim 11. storage medium.

Images