Manufacturing method of film chip

Abstract

To provide a manufacturing method of a film chip which enables accurate image recognition of the film chip and can efficiently manufacture the film chip having excellent performance.SOLUTION: A manufacturing method of a film chip according to an embodiment of the invention successively includes the steps in which: a sheet 2 is disposed on a moving carrier sheet 1; the sheet 2 on the carrier sheet 1 is cut into a product portion 2a and a product outside portion 2b by a rotary cutter 31; and the product portion 2a on an image is recognized.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for producing a film chip. [Background technology]

[0002] Film chips with configurations suited to various applications are widely used in various industrial products. It has been considered to produce such film chips by pulling out and cutting raw sheets from a pre-prepared raw roll. For example, a method for preparing a raw roll has been proposed in which multiple adhesive sheets are temporarily attached to a strip-shaped release sheet at predetermined intervals and then rolled up to form a bundle (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-10963 Summary of the Invention [Problem to be solved by the invention]

[0004] However, as described in Patent Document 1, when a strip-shaped release sheet to which multiple adhesive sheets are attached is wound into a roll, unevenness or wrinkles due to the edges of the adhesive sheets may occur. When such a raw sheet is unwound and cut, film chips containing traces of the unevenness or wrinkles may be produced. Film chips containing such traces may have insufficient performance. It is also desirable to manufacture film chips with minimal variation in quality. Therefore, manufactured film chips may be transported to an image recognition device outside the film chip manufacturing line for inspection and determination of whether they are good or bad. In this case, transporting the film chips to an image recognition device outside the manufacturing line for inspection reduces the manufacturing efficiency of film chips. Therefore, it has been considered to install the image recognition device downstream of the cutting device in the film chip manufacturing line. However, if the image recognition device is installed downstream of the cutting device, there is a problem in that the film chips cannot be accurately image-recognized due to the influence of vibrations from the cutting device. A primary object of the present invention is to provide a method for manufacturing film chips that can accurately recognize the image of a film chip and can efficiently manufacture film chips with excellent performance. [Means for solving the problem]

[0005] [1] A method for manufacturing film chips according to an embodiment of the present invention includes, in this order: a step of placing a sheet on a moving carrier sheet; a step of cutting the sheet on the carrier sheet into a product portion and a non-product portion using a rotary cutter; and a step of image-recognizing the product portion. [2] The method for manufacturing film chips described in [1] above may further include a step of pulling the carrier sheet so that it passes through a buffer roller between the step of placing the individual sheets and the step of cutting the individual sheets. [3] In the method for manufacturing film chips described in [2] above, the buffer roller may be movable in a direction intersecting the direction in which the axis of the rotary cutter extends. The method for manufacturing film chips may detect the position of the buffer roller, and stop cutting of the individual sheets by the rotary cutter when the position of the buffer roller is closer to the rotary cutter than a predetermined position. [4] The method for manufacturing a film chip described in any of [1] to [3] above may further include a step of separating the non-product portion from the product portion between the step of cutting the individual sheet and the step of image-recognizing the product portion. [5] In the method for manufacturing film chips described in [4] above, in the step of arranging the individual sheets, a plurality of individual sheets may be arranged so as to be aligned in the direction of movement of the carrier sheet. The non-product portions of adjacent individual sheets among the plurality of individual sheets may be connected by a connecting material between the step of arranging the plurality of individual sheets and the step of separating the non-product portions. [6] In the method for producing film chips according to any one of [1] to [5] above, the thickness of the individual sheets may be 300 μm or more. [7] In the method for producing film chips according to any one of [1] to [6] above, the moving speed of the sheet in the step of cutting the sheet may be 5 m / min or less. [Effects of the Invention]

[0006] According to the embodiment of the present invention, film chips can be image-recognized with high accuracy, and film chips with excellent performance can be efficiently manufactured. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram of a film chip production line capable of carrying out a film chip production method according to one embodiment of the present invention. [Figure 2] FIG. 2 is a schematic plan view of the sheet placed on the carrier sheet shown in FIG. 1 and cut into a rectangular product portion and an outer portion of the product. [Figure 3] FIG. 3 is a schematic cross-sectional view of the sheet shown in FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view of the rotary cutter shown in FIG. [Figure 5]FIG. 5 is a schematic cross-sectional view of the cutting blade of the rotary cutter shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view of the blade-shaped sheet and cushion material shown in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view of the cushion material shown in FIG. 6 in a state where it is sandwiched and compressed between the blade-shaped sheet and the individual sheets. [Figure 8] Figure 8 is a schematic explanatory diagram for explaining an aspect in which, in the process of cutting the individual sheet shown in Figure 1 into a hexagonal product portion and a non-product portion, the upstream end of the product portion has a side that is approximately parallel to a direction perpendicular to the direction of movement of the carrier sheet. [Figure 9] FIG. 9 is a schematic explanatory view illustrating an embodiment in which the upstream end of the product portion is a corner portion in the step of cutting the sheet shown in FIG. 1 into a hexagonal product portion and an outer product portion. DETAILED DESCRIPTION OF THE INVENTION

[0008] Representative embodiments of the present invention will be described below, but the present invention is not limited to these embodiments. In addition, in order to clarify the explanation, the width, thickness, shape, etc. of each part may be shown schematically in the drawings compared to the embodiments, but these are merely examples and do not limit the interpretation of the present invention.

[0009] A. Overview of film chip manufacturing method Figure 1 is a schematic diagram of a film chip production line capable of carrying out a film chip manufacturing method according to one embodiment of the present invention; Figure 2 is a schematic plan view of a sheet placed on a carrier sheet shown in Figure 1, which has been cut into a rectangular product portion and a non-product portion. A method for manufacturing film chips according to one embodiment of the present invention includes, in this order, a placement step, a cutting step, and an image recognition step. The placement step, cutting step, and image recognition step are typically carried out on an integrated line. In the placement step, a single sheet 2 is placed on a moving carrier sheet 1. The carrier sheet 1 may move intermittently or continuously. The carrier sheet 1 preferably moves continuously. In the cutting step, the single sheet 2 on the carrier sheet 1 is cut into a product portion 2a and a non-product portion 2b by a rotary cutter 31. In the image recognition step, the product portion 2a is image-recognized. According to this method, the individual sheets placed on the carrier sheet are cut into a product portion and a non-product portion, so marks (e.g., rolling marks, dents) on the product portion can be reduced compared to when the individual sheets are stacked on the carrier sheet in advance and rolled up before being cut. Furthermore, since the individual sheets are cut by continuous processing using a rotary cutter, vibrations during cutting of the individual sheets can be reduced compared to when the individual sheets are cut by intermittent processing (e.g., press processing). Therefore, even if an image recognition process is performed after the cutting process, the film chips can be accurately image-recognized. As a result, the film chip can be image-recognized with high accuracy, and film chips with excellent performance can be efficiently manufactured.

[0010] In the arrangement step, typically, a plurality of individual sheets 2 are arranged on a carrier sheet 1 so as to be aligned in the moving direction of the carrier sheet 1. The plurality of individual sheets 2 are arranged at intervals from one another on the carrier sheet 1. All of the intervals between adjacent individual sheets 2 among the plurality of individual sheets 2 are preferably substantially the same.

[0011] In the cutting step, typically, a rotary cutter 31 cuts the individual sheets 2 that move together with the carrier sheet 1 . The moving speed of the sheet 2 in the cutting step is, for example, 10 m / min or less, preferably 5 m / min or less. On the other hand, the moving speed of the sheet 2 in the cutting step is, for example, 1 m / min or more. If the rotary cutter cuts the sheet moving at such a moving speed in the cutting step, the arrangement step and the cutting step can be fully coordinated, and can be carried out continuously and smoothly.

[0012] In the cutting process, the rotary cutter 31 typically rotates so as to send the sheet 2 to be cut downstream in the direction of movement of the carrier sheet 1. In the illustrated example, the rotary cutter 31 rotates counterclockwise as viewed from the front side of the paper. The peripheral speed of the rotary cutter 31 in the cutting step is, for example, ±1.0 m / min of the moving speed of the sheet 2, and preferably ±0.5 m / min of the moving speed of the sheet 2. The peripheral speed of the rotary cutter 31 is, for example, 1 m / min to 10 m / min, and preferably 1 m / min to 5 m / min. If the peripheral speed of the rotary cutter in the cutting step is within this range, the moving sheet can be cut with high precision.

[0013] In the image recognition process, typically, the product portion 2a is image-recognized to acquire information about the product portion 2a. The acquired information about the product portion 2a includes, for example, the outer shape of the product portion, detection of defect markings, and confirmation of the position of product markings.

[0014] In one embodiment, the film chip manufacturing method further includes a takt time difference absorbing step, in which the carrier sheet 1 is routed so as to pass through a buffer roller 73 between the placement step and the cutting step. This makes it possible to absorb the takt time difference between the placement step and the cutting step, and to supply the individual sheets to the rotary cutter at the appropriate timing.

[0015] In one embodiment, the buffer roller 73 is movable in a direction intersecting the direction in which the axis of the rotary cutter 31 extends. When the rotary cutter 31 cuts the individual sheet 2 as described above in the cutting process, the individual sheet 2 and the carrier sheet 1 may be pulled by the rotation of the rotary cutter 31. In this case, the buffer roller 73 receives force from the carrier sheet 1 that is pulled around it and moves in a direction approaching the rotary cutter 31. In the takt time difference absorbing process, the position of the buffer roller 73 may be detected. In the takt time difference absorbing process, if the position of the buffer roller 73 is closer to the rotary cutter 31 than a predetermined position, the individual sheet 2 and the carrier sheet 1 may be pulled beyond an allowable range by the rotation of the rotary cutter 31. Therefore, cutting of the individual sheet 2 by the rotary cutter 31 is stopped. This can prevent the occurrence of defective product portions and improve the yield of film chips.

[0016] In one embodiment, the method for producing a film chip further includes a separation step in which the non-product portion 2b is separated from the product portion 2a between the cutting step and the image recognition step, thereby enabling more accurate image recognition of the product portion in the image recognition step.

[0017] Furthermore, when a plurality of individual sheets 2 are arranged on the carrier sheet 1 in the arrangement step, the film chip manufacturing method may further include a connection step. In the connection step, between the arrangement step and the separation step, the non-product portions 2b of adjacent individual sheets 2 among the plurality of individual sheets 2 are connected by a connecting material 63. In the illustrated example, the connection step is performed between the arrangement step and the tact difference absorption step. According to this method, the plurality of out-of-product portions are connected by the connecting material, so that the plurality of out-of-product portions can be continuously separated from the product portion in the separation step.

[0018] The connecting material 63 is typically a long connecting tape 63a. The connecting tape 63a may have any appropriate configuration. The connecting tape 63a is affixed to the non-product portions 2b of adjacent sheet sheets 2 together so as not to overlap the product portions 2a of the sheet sheets 2. In one embodiment, the connecting tape 63a is affixed to the widthwise ends (direction perpendicular to the moving direction of the carrier sheet 1) of multiple individual sheets 2 lined up in the moving direction of the carrier sheet 1. This allows the non-product portions of three or more individual sheets to be connected by one connecting tape. In the illustrated example, both widthwise ends of the individual sheets 2 are connected by the connecting tape 63a.

[0019] B. Details of the sheet Next, with reference to FIG. 3, the individual sheets used in the film chip manufacturing method will be described in detail. The individual sheet 2 is a mother sheet from which at least one product portion 2a can be punched. The shape and size of the individual sheet 2 are not particularly limited as long as the product portion 2a can be punched out. In other words, one or more product portions 2a can be cut out from one individual sheet 2 in the cutting process. The number of product portions 2a that can be cut out from one individual sheet 2 is, for example, 1 to 6, or 15 to 30.

[0020] The thickness of the individual sheets 2 is, for example, 250 μm or more, preferably 300 μm or more. Meanwhile, the thickness of the individual sheets 2 is, for example, 700 μm or less, preferably 500 μm or less. According to the film chip manufacturing method of this embodiment, even if the thickness of the individual sheets is within this range, it is possible to prevent the inclusion of marks such as rolling marks and dents in the product portion. Therefore, film chips with excellent performance can be stably manufactured.

[0021] Furthermore, the individual sheets 2 may have any suitable configuration. The individual sheets 2 may have a single-layer structure or a laminated structure. In one embodiment, the individual sheets 2 have a laminated structure. The number of layers of the individual sheets 2, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers, is, for example, 4 or more, preferably 5 or more, more preferably 6 or more, and even more preferably 8 or more. On the other hand, the number of layers of the individual sheets 2, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers, is typically 10 or less. In the illustrated example, the individual sheet 2 includes a laminated film 22 and a plurality of light release layers 21 .

[0022] B-1.Laminated film The laminate film 22 may have any appropriate laminate structure. The number of layers in the laminate film 22 is, for example, 2 or more, preferably 4 or more, and more preferably 5 or more, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers. On the other hand, the number of layers in the laminate film 22 is typically 8 or less, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers.

[0023] In the illustrated example, the laminated film 22 includes a polarizing plate 221 , a retardation film 226 , and an optical function film 222 . The polarizing plate 221 typically includes a polarizer 221a. Any appropriate polarizer can be adopted as the polarizer 221a. The polarizer may be made of, for example, a single-layer resin film, or may be obtained by using a laminate of two or more layers.

[0024] Specific examples of polarizers made of a single-layer resin film include hydrophilic polymer films such as polyvinyl alcohol (PVA) resin films, partially formalized PVA resin films, and partially saponified ethylene-vinyl acetate copolymer films that have been dyed with iodine or a dichroic substance such as a dichroic dye and stretched, and polyene-based oriented films such as dehydrated PVA films and dehydrochlorinated polyvinyl chloride films. Polarizers obtained by dyeing a PVA resin film with iodine and uniaxially stretching it are preferred because of their excellent optical properties.

[0025] Specific examples of polarizers obtained using laminates include a laminate of a resin substrate and a PVA-based resin layer (PVA-based resin film) laminated on the resin substrate, or a polarizer obtained using a laminate of a resin substrate and a PVA-based resin layer coated on the resin substrate. A polarizer obtained using a laminate of a resin substrate and a PVA-based resin layer coated on the resin substrate can be produced, for example, by applying a PVA-based resin solution to the resin substrate and drying the resin substrate to form a PVA-based resin layer on the resin substrate, thereby obtaining a laminate of the resin substrate and the PVA-based resin layer, and then stretching and dyeing the laminate to convert the PVA-based resin layer into a polarizer. In one embodiment, a polyvinyl alcohol-based resin layer containing a halide and a polyvinyl alcohol-based resin is formed on one side of the resin substrate. Stretching typically involves immersing the laminate in an aqueous boric acid solution and stretching it. Furthermore, the stretching may optionally further include in-air stretching the laminate at an elevated temperature (e.g., 95°C or higher) before stretching in the aqueous boric acid solution. Additionally, in one embodiment of the present invention, the laminate is preferably subjected to a drying shrinkage treatment in which the laminate is heated while being transported in the longitudinal direction, thereby shrinking the laminate by 2% or more in the width direction. Typically, the manufacturing method of this embodiment includes subjecting the laminate to an in-air auxiliary stretching treatment, a dyeing treatment, an underwater stretching treatment, and a drying shrinkage treatment, in this order. By introducing auxiliary stretching, it is possible to increase the crystallinity of PVA, even when PVA is coated on a thermoplastic resin, thereby achieving high optical properties. Furthermore, by simultaneously increasing the orientation of PVA in advance, problems such as a decrease in orientation or dissolution of PVA when immersed in water in the subsequent dyeing or stretching steps can be prevented, thereby achieving high optical properties. Furthermore, when the PVA-based resin layer is immersed in a liquid, the disordering of the orientation of polyvinyl alcohol molecules and the decrease in orientation can be suppressed compared to when the PVA-based resin layer does not contain a halide. This can improve the optical properties of a polarizer obtained through treatment steps in which the laminate is immersed in a liquid, such as a dyeing treatment and an underwater stretching treatment. Furthermore, the optical properties can be improved by shrinking the laminate in the width direction through drying shrinkage treatment.The obtained resin substrate / polarizer laminate may be used as is (i.e., the resin substrate may be used as a protective layer for the polarizer), or the resin substrate may be peeled off from the resin substrate / polarizer laminate and any appropriate protective layer depending on the purpose may be laminated on the peeled surface. Details of such a polarizer manufacturing method are described in, for example, JP 2012-73580 A and Japanese Patent No. 6470455 A. The entire disclosures of these publications are incorporated herein by reference.

[0026] The dyeing with iodine is carried out, for example, by immersing the PVA-based resin film in an aqueous iodine solution. The stretching ratio in the uniaxial stretching is preferably 3 to 7 times. The stretching may be carried out after the dyeing treatment or while dyeing. Alternatively, the stretching may be carried out before dyeing. If necessary, the PVA-based resin film may be subjected to a swelling treatment, a crosslinking treatment, a washing treatment, a drying treatment, or the like. For example, by immersing the PVA-based resin film in water and washing it before dyeing, it is possible to wash away dirt and antiblocking agents on the surface of the PVA-based resin film, and also to swell the PVA-based resin film, thereby suppressing uneven dyeing.

[0027] The thickness of the polarizer 221a is, for example, 1 μm to 80 μm, preferably 1 μm to 15 μm, more preferably 1 μm to 12 μm, and even more preferably 3 μm to 12 μm.

[0028] The polarizer 221a typically exhibits absorptive dichroism at any wavelength between 380 nm and 780 nm. The single transmittance of the polarizer 221a is, for example, 41.5% to 46.0%, preferably 43.0% to 46.0%, and more preferably 44.5% to 46.0%. The degree of polarization of the polarizer 221a is preferably 97.0% or more, more preferably 99.0% or more, and even more preferably 99.9% or more.

[0029] The polarizing plate 221 may include a protective layer 221b in addition to the polarizer 221a. The protective layer 221b is provided on at least one surface of the polarizer 221a. That is, the protective layer 221b may be provided on only one surface of the polarizer 221a, or may be provided on both surfaces of the polarizer 221a. In the illustrated example, the protective layer 221b is provided on both surfaces of the polarizer 221a. The protective layer 221b is typically attached to the polarizer 221a via any appropriate adhesive layer (not shown).

[0030] The protective layer is formed of any suitable film that can be used as a protective layer for a polarizer. Typical examples of the main component of the film include transparent resins, such as cycloolefin (COP) resins (e.g., polynorbornene-based), polyester resins (e.g., polyethylene terephthalate (PET)-based), cellulose resins (e.g., triacetyl cellulose (TAC)), polycarbonate (PC) resins, (meth)acrylic resins, polyvinyl alcohol resins, polyamide resins, polyimide resins, polyethersulfone resins, polysulfone resins, polystyrene resins, polyolefin resins, and acetate resins. Other examples include thermosetting or ultraviolet-curable resins such as (meth)acrylic, urethane, (meth)acrylic urethane, epoxy, and silicone resins. In this specification, "(meth)acrylic" includes both acrylic and methacrylic. Other examples include glassy polymers such as siloxane-based polymers. The polymer film described in JP 2001-343529 A (WO 01 / 37007) can also be used. Examples of materials for this film include resin compositions containing a thermoplastic resin having substituted or unsubstituted imide groups in its side chains and a thermoplastic resin having substituted or unsubstituted phenyl and nitrile groups in its side chains. Examples include a resin composition containing an alternating copolymer of isobutene and N-methylmaleimide and an acrylonitrile-styrene copolymer. The polymer film can be, for example, an extrusion molded product of the above resin composition. The resin film materials can be used alone or in combination.

[0031] The thickness of the protective layer 221b is typically 5 mm or less, preferably 1 mm or less, more preferably 1 μm to 500 μm, and even more preferably 5 μm to 150 μm.

[0032] Furthermore, a surface treatment layer 221c may be provided on the surface of the protective layer 221b as needed. In the illustrated example, the surface treatment layer 221c is provided on the surface of the protective layer 221b on the optical function film 222 side. Examples of the surface treatment layer 221c include a hard coat layer, an anti-reflection layer, an anti-sticking layer, and an anti-glare treatment layer, and a hard coat layer is preferred. The thickness of the surface treatment layer 221c can be set arbitrarily and appropriately, and is, for example, 1 μm to 10 μm.

[0033] The retardation film 226 is typically attached to the polarizing plate 221 via a first adhesive layer 223. In the illustrated example, the retardation film 226 is attached to the surface treatment layer 221c via the first adhesive layer 223.

[0034] Any appropriate material may be adopted as the material of the retardation film 226. In one embodiment, the retardation film 226 is made of a stretched polymer film.

[0035] Any appropriate resin may be used as the resin for forming the polymer film. Specific examples include resins that form positive birefringence films, such as norbornene-based resins, polycarbonate-based resins, cellulose-based resins, polyvinyl alcohol-based resins, and polysulfone-based resins. Among these materials for the retardation film 226, polycarbonate-based resins are preferred.

[0036] The optical function film 222 can impart any appropriate performance to the film chip 10. In one embodiment, the optical function film 222 is disposed on the opposite side of the retardation film 226 from the polarizing plate 221. In the illustrated example, the optical function film 222 is attached to the retardation film 226 via a second adhesive layer 224.

[0037] The optical function film 222 includes a substrate 222a and a function layer 222b. The substrate 222a is a resin film that supports the functional layer 222b. The substrate 222a may be made of any appropriate material. Examples of materials for the substrate 222a include the transparent resins described above. The thickness of the base material 222a is, for example, 20 μm or more, preferably 30 μm or more, whereas the thickness of the base material 222a is, for example, 80 μm or less, preferably 50 μm or less.

[0038] The functional layer 222b is typically provided on the surface of the base material 222a opposite to the polarizing plate 221. Examples of the functional layer 222b include a hard coat layer, an anti-reflection layer, an anti-sticking layer, and an anti-glare layer. The functional layer 222b may have a laminated structure of two or more layers. Of the functional layers 222b, an anti-reflection layer is preferred. The thickness of the functional layer 222b can be set arbitrarily and appropriately, and is, for example, 0.05 μm to 15 μm, or 1 μm to 8 μm.

[0039] In the illustrated example, the laminate film 22 further includes a third adhesive layer 225. The third adhesive layer 225 is located on the opposite side of the polarizing plate 221 from the retardation film 226. In the illustrated example, the third adhesive layer 225 is laminated on the protective layer 221b of the polarizing plate 221.

[0040] Each of the first adhesive layer 223, the second adhesive layer 224, and the third adhesive layer 225 may be composed of any appropriate adhesive. Examples of adhesives include (meth)acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives, and polyether adhesives. By adjusting the type, number, combination, and compounding ratio of the monomers that form the base resin of the adhesive, as well as the amount of crosslinking agent, reaction temperature, reaction time, etc., an adhesive having desired properties depending on the purpose can be prepared. The base resin of the adhesive may be used alone or in combination of two or more types. Of the adhesives, a (meth)acrylic adhesive is preferable.

[0041] The shear storage modulus of each of the first pressure-sensitive adhesive layer 223, the second pressure-sensitive adhesive layer 224, and the third pressure-sensitive adhesive layer 225 is, for example, 10 kPa to 300 kPa, and preferably 50 kPa to 300 kPa at 25°C. If the storage modulus of each pressure-sensitive adhesive layer is below the above lower limit, peeling failure tends to occur. The shear storage modulus is measured, for example, using a dynamic viscoelasticity device (product name: manufactured by ARES Rheometric Scientific) at a temperature rise rate of 5°C / min, a frequency of 1 Hz, and a measurement temperature range of -40°C to 100°C. The thickness of each of the first adhesive layer 223, the second adhesive layer 224, and the third adhesive layer 225 is, for example, 3 μm to 30 μm, or, for example, 5 μm to 20 μm.

[0042] As described above, the laminated film 22 in the illustrated example includes, in this order, the optical function film 222, the second pressure-sensitive adhesive layer 224, the retardation film 226, the first pressure-sensitive adhesive layer 223, the protective layer 221b, the polarizer 221a, the protective layer 221b, and the third pressure-sensitive adhesive layer 225. In other words, the laminated film 22 in the illustrated example has a five-layer laminated structure excluding the adhesive layers (adhesive layer and pressure-sensitive adhesive layer).

[0043] Although not shown, the laminated film 22 may further include another retardation film, if necessary. The other retardation film is typically disposed between the retardation film 226 and the optically functional film 222. The other retardation film may have any appropriate retardation depending on the application of the film chip 10.

[0044] B-2. Light peeling layer The plurality of light release layers 21 are attached to the laminated film 22. In the illustrated example, the plurality of light release layers 21 are laminated on an optically functional film 222.

[0045] Although not shown, each of the plurality of light release layers 21 includes a base film and an adhesive layer. The base film may be made of any suitable material. Examples of materials for the base film include polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resins; (meth)acrylic resins such as polymethyl methacrylate; and cycloolefin-based resins such as polynorbornene. These may be used alone or in combination. The thickness of the base film is, for example, 20 μm to 70 μm, and preferably 30 μm to 60 μm. The adhesive layer provided in the light release layer 21 can be explained in the same manner as the first adhesive layer 223 described above. The thickness of the light release layer 21 is, for example, 30 μm to 80 μm, and preferably 40 μm to 70 μm.

[0046] The plurality of light release layers 21 include a first light release layer 21a and a second light release layer 21b. First light release layer 21a is disposed on the outermost layer of sheet 2. Second light release layer 21b is located between first light release layer 21a and laminated film 22. First light release layer 21a is typically attached to second light release layer 21b.

[0047] The peel strength of first release layer 21a to second release layer 21b is, for example, 0.15 N / 50 mm or less, and preferably 0.10 N / 50 mm or less. On the other hand, the peel strength of first release layer 21a to second release layer 21b is typically 0.05 N / 50 mm or more. The peel strength is measured, for example, by a peel strength test using an autograph.

[0048] In the illustrated example, the plurality of light release layers 21 further includes a third light release layer 21c. The third light release layer 21c is located between the second light release layer 21b and the laminate film 22. The second light release layer 21b is typically attached to the third light release layer 21c. The peel force of second light release layer 21b to third light release layer 21c is, for example, 0.11 N / 50 mm or more, preferably 0.15 N / 50 mm or more. On the other hand, the peel force of second light release layer 21b to third light release layer 21c is typically 0.2 N / 50 mm or less.

[0049] In the illustrated example, the third light release layer 21c is attached to the optical function film 222. The range of the release force of the third light release layer 21c with respect to the optical function film 222 is, for example, the same as the range of the release force of the first light release layer 21a described above.

[0050] B-3.Release liner The individual sheet 2 may further include a release liner 23. In one embodiment, the release liner 23 is temporarily attached to the surface of the third pressure-sensitive adhesive layer 225 opposite the polarizing plate 221. In the illustrated example, the release liner 23 is located as the outermost layer of the individual sheet 2, opposite the first light release layer 21a. Release liner 23 may be made of any suitable plastic film. Specific examples of plastic films include polyethylene terephthalate (PET) film, polyethylene film, and polypropylene film. Although not shown, the surface of release liner 23 on the side of third pressure-sensitive adhesive layer 225 may be treated with any suitable release agent (e.g., a silicone-based release agent) as needed. The thickness of the release liner 14 is, for example, 20 μm to 100 μm, or, for example, 30 μm to 50 μm.

[0051] As described above, the illustrated example of the individual sheet 2 includes, in this order, the first light release layer 21a, the second light release layer 21b, the third light release layer 21c, the optical function film 222, the second pressure-sensitive adhesive layer 224, the retardation film 226, the first pressure-sensitive adhesive layer 223, the protective layer 221b, the polarizer 221a, the protective layer 221b, the third pressure-sensitive adhesive layer 225, and the release liner 23. In other words, the illustrated example of the individual sheet 2 has a laminated structure of nine layers, excluding the adhesive layers (adhesive layer and pressure-sensitive adhesive layer).

[0052] C. Film chip production line Next, with reference to FIG. 1, a film chip production line 100 capable of carrying out the above-described film chip production method will be described. Film chip production line 100 is an integrated line capable of producing film chips 10. In one embodiment, film chip production line 100 includes a carrier sheet conveying unit 7, a sheet supply unit 5, a tape application unit 6, a cutting device 3, a separation unit 8, an image recognition unit 4, and a chip recovery unit 9.

[0053] C-1. Carrier sheet transport section In the illustrated example, the carrier sheet conveying section 7 includes a carrier sheet payout roller 71 (hereinafter referred to as the CS payout roller 71), a carrier sheet take-up roller 72 (hereinafter referred to as the CS take-up roller 72), the above-mentioned buffer roller 73, and a plurality of guide rollers 74. A long carrier sheet 1 is wound in a roll shape around the CS payout roller 71. The CS winding roller 72 is rotatable by receiving an external driving force, and can wind up the carrier sheet 1 pulled out from the CS payout roller 71. This allows the carrier sheet 1 to move from the CS payout roller 71 toward the CS winding roller 72. The buffer roller 73 is located between the CS payout roller 71 and the CS take-up roller 72. The buffer roller 73 is a dancer roll. In the illustrated example, the carrier sheet 1 is bent and routed around the buffer roller 73 between the tape application unit 6 and the cutting device 3. The plurality of guide rollers 74 are arbitrarily and appropriately arranged to guide the movement of the carrier sheet 1. In the illustrated example, the plurality of guide rollers 74 include two first guide rollers 74a located between the tape application unit 6 and the cutting device 3. The two first guide rollers 74a guide the carrier sheet 1 so that the carrier sheet 1 passes around the buffer roller 73. The two first guide rollers 74a are positioned horizontally at a distance from each other and are positioned above the buffer roller 73.

[0054] C-2. Sheet supply unit The sheet supply unit 5 can supply the above-mentioned individual sheets 2 onto the carrier sheet 1 by the carrier sheet transport unit 7. In the illustrated example, the sheet supply unit 5 includes a sheet tray 51, a stage 52, a conveyor 53, two first pinch rollers 55, and a pickup device 54.

[0055] The sheet tray 51 can accommodate a plurality of individual sheets 2. The plurality of individual sheets 2 are typically accommodated in the sheet tray 51 in a state where they are stacked in the thickness direction. The stage 52 has a generally flat plate shape that extends horizontally. The conveyor 53 is capable of transporting the individual sheets 2 placed thereon in a horizontal direction. The conveyor 53 may operate intermittently or continuously. The conveyor 53 preferably operates continuously. The conveyor 53 may have any appropriate configuration. A typical example of the conveyor 53 is a roller conveyor. The two first pinch rollers 55 are disposed downstream of the conveyor 53 in the conveying direction of the conveyor 53. The two first pinch rollers 55 typically face each other in the vertical direction. The carrier sheet 1 passes between the two first pinch rollers 55. The pickup device 54 is capable of picking up the individual sheets 2 stored in the sheet tray 51 one by one, and is capable of moving while holding the individual sheets 2. The pickup device 54 may have any appropriate configuration. A representative example of the pickup device 54 is a vacuum suction type pickup device.

[0056] C-3. Tape attachment part The tape application unit 6 is capable of applying the above-mentioned connecting tape 63a to the plurality of individual sheets 2 arranged on the carrier sheet 1. In the illustrated example, the tape application unit 6 includes a tape feed roller 61 and two second pinch rollers 62.

[0057] A long connected tape 63a is wound in a roll around the tape feed roller 61. The connected tape 63a is pulled out from the tape feed roller 61 and fed toward a gap between the two second pinch rollers 62. The two second pinch rollers 62 are located downstream of the first pinch roller 55 in the moving direction of the carrier sheet 1, and in the illustrated example, are located between the first pinch roller 55 and the buffer roller 73. The two second pinch rollers 62 typically face each other in the vertical direction. The carrier sheet 1 passes between the two second pinch rollers 62.

[0058] C-4.Cutting device The cutting device 3 is capable of cutting the individual sheets 2 placed on the carrier sheet 1. The cutting device 3 is located downstream of the buffer roller 73 in the moving direction of the carrier sheet 1. In the illustrated example, the cutting device 3 includes the rotary cutter 31 and the opposing roller 32. The rotary cutter 31 and the opposing roller 32 typically face each other in the vertical direction. The carrier sheet 1 passes between the rotary cutter 31 and the opposing roller 32.

[0059] As shown in Fig. 4, the rotary cutter 31 includes a cylindrical roll 311 and a blade sheet 312. Although Fig. 4 and Fig. 5 are cross-sectional views, hatching has been omitted for the sake of convenience. The cylindrical roll 311 is configured to rotate by receiving a driving force from the outside. The blade-shaped sheet 312 includes a sheet body 315 and a cutting blade 313. The sheet body 315 is flexible. The cutting blade 313 has any appropriate pattern shape that corresponds to the outer shape of the product portion 2a. The cutting blade 313 protrudes from the sheet body 315 in the thickness direction. The blade sheet 312 is wound and fixed on the circumferential surface of the roll 311. With the blade sheet 312 fixed on the circumferential surface of the roll 311, the cutting blades 313 protrude radially outward from the roll 311. The length of the cutting blade 313 in the radial direction of the rotary cutter 31 (hereinafter referred to as the height of the cutting blade 313) is, for example, 0.5 mm to 3.0 mm, or, for example, 0.6 mm to 1.5 mm, or, for example, 0.6 mm to 0.8 mm.

[0060] As shown in FIG. 5, the cross section of the cutting blade 313 has a substantially wedge shape. The cutting edge angle of the cutting blade 313 is, for example, 20° to 80°, and preferably 20° to 40°. When the cutting edge angle of the cutting blade is in this range, it is possible to stably prevent cracks from occurring in the product portion of the sheet during the cutting process. Furthermore, when the cutting edge angle of the cutting blade is in this range, even if the sheet has multiple light release layers, it is possible to prevent the light release layers from lifting (peeling off) when the sheet is cut.

[0061] The cutting edge angle of the cutting blade 313 is divided into a first angle θ1 on the outside-of-product portion 2b side and a second angle θ2 on the product portion 2a side by a reference line L that passes through the tip of the cutting blade 313 along the radial direction of the roll 311. The first angle θ1 on the side of the outer product portion 2b is preferably 1.0 times or more, more preferably 1.5 times or more, and even more preferably 2.0 times or more, the second angle θ2 on the side of the product portion 2a. When the first angle θ1 is set to the second angle θ2 at such a ratio, cracks in the product can be more reliably prevented. Also, even if the sheet has multiple light release layers, lifting (peeling) of the light release layers when the sheet is cut can be more reliably prevented. The first angle θ1 on the side of the outer product portion 2b is, for example, 10° to 30°, and preferably 15° to 30°. The second angle θ2 on the product portion 2a side is, for example, 0° to 30°, and preferably 0° to 15°.

[0062] As shown in FIG. 4, in one embodiment, the rotary cutter 31 further includes a flexible cushion material 314 in addition to the roll 311 and the blade sheet 312 . The cushion material 314 is typically located on the opposite side of the blade-shaped sheet 312 from the roll 311. In the illustrated example, the cushion material 314 is fixed to the sheet body 315. The cushion material 314 is in contact with the cutting blade 313.

[0063] 6, cushion material 314 has slit 314a in a portion corresponding to cutting blade 313. Slit 314a penetrates cushion material 314 in the radial direction of roll 311. Cutting blade 313 is disposed within slit 314a and is in contact with the inner surface of slit 314a. 6 and 7, for convenience, the blade-shaped sheet 312 and the cushion material 314 are shown extending linearly in the left-right direction of the paper, but in reality, the blade-shaped sheet 312 and the cushion material 314 extend in an arc shape along the outer peripheral surface of the roll 311.

[0064] As shown in Figure 7, during the cutting process, the cushion material 314 is sandwiched and compressed between the sheet body 315 of the blade-shaped sheet 312 and the individual sheets 2, and comes into contact with the product portion 2a and the non-product portion 2b. This allows the cushion material to prevent the product portion and the non-product portion from moving unintentionally during the cutting process. This prevents friction between the cutting blade and the product portion and / or between the product portion and the non-product portion. As a result, cracks in the product portion can be more reliably prevented. The cushion material 314 may be provided partially on the rotary cutter 31 so that it comes into contact with the product portion 2a but does not come into contact with the outside-product portion 2b during the cutting process.

[0065] The hardness of the cushion material 314 is preferably 10° to 80°, and more preferably 30° to 60°. The hardness of the cushion material is measured, for example, by a durometer. If the hardness of the cushioning material is within this range, the cushioning material can appropriately press the product portion and the outer portion during the cutting process, thereby reliably suppressing movement of the product portion and the outer portion during the cutting process and reliably suppressing dents from occurring in the product portion.

[0066] Before the cutting step, the thickness of cushion material 314 (i.e., the thickness of cushion material 314 in an uncompressed state) is, for example, 1 to 5 times, and preferably 0.8 to 2 times, the height of cutting blade 313. Before the cutting step, the thickness of cushion material 314 is, for example, 0.4 mm to 8.0 mm, and preferably 1.0 mm to 6.0 mm. In the cutting process, the cushion material 314 is compressed as described above. The compression rate of the cushion material in the cutting process is, for example, 70% or less, preferably 60% or less, and more preferably 50% or less. On the other hand, the compression rate of the cushion material in the cutting process is, for example, 20% or more, and preferably 35% or more. The compression rate of the cushion material is calculated, for example, by the following formula. Compression ratio = (thickness of cushion material in compressed state / thickness of cushion material before compression) x 100 If the compression rate of the cushioning material is within this range, the pressing force of the cushioning material on the product portion and the outer portion of the product can be appropriately adjusted, which makes it possible to more stably suppress the movement of the product portion and the outer portion of the product and to more stably suppress the occurrence of dents on the product portion.

[0067] C-5.Separation part As shown in FIG. 1, the separator 8 is configured to separate the outer product portion 2b and the product portion 2a cut by the cutting device 3. The separator 8 is located on the opposite side of the buffer roller 73 with respect to the cutting device 3. In the illustrated example, the separator 8 includes a conveyor 83, a separation roller 81, and a winding roller 82. Note that the separator 8 may also be a more acute-angled one, such as a separation bar.

[0068] The conveyor 83 is capable of horizontally transporting the individual sheets 2 received from the carrier sheet 1. The conveyor 83 may operate intermittently or continuously. The conveyor 83 preferably operates continuously. The conveyor 83 may have any appropriate configuration. A representative example of the conveyor 83 is a belt conveyor. Among the multiple guide rollers 74, the guide roller 74 located between the cutting device 3 and the separation unit 8 may function as a peeling roller 74b. The peeling roller 74b peels the cut individual sheets 2 from the carrier sheet 1. As a result, the cut individual sheets 2 are transferred from the carrier sheet 1 to the conveyor 83. The separation roller 81 is disposed above the conveyor 83 with a small gap therebetween. The separation roller 81 can separate the non-product portion 2b from the product portion 2a when the individual sheets 2 transported by the conveyor 83 pass between the separation roller 81 and the conveyor 83. The winding roller 82 is capable of winding up the non-product portion 2b separated by the separation roller 81.

[0069] C-6. Image Recognition Unit The image recognition unit 4 is capable of image-recognizing the product portion 2a. More specifically, by performing image recognition on the product portion 2a, the image recognition unit 4 can perform, for example, defect marking detection, center of gravity detection, IJP printing position detection, printing defect detection, outer diameter dimension measurement, print detection, defect detection, etc. Examples of the image recognition unit 4 include a camera, a light source, a monitor, and an image processing unit.

[0070] In the illustrated example, the image recognition unit 4 performs image recognition on the product portion 2a separated from the non-product portion 2b. The image recognition unit 4 is located downstream of the separation roller 81 in the conveying direction of the conveyor 83. The image recognition unit 4 is disposed above the conveyor 83 at a distance. The image recognition unit 4 performs image recognition on the product portion 2a that has reached below the image recognition unit 4. During image recognition by the image recognition unit 4, the conveyor 83 may be stopped or may maintain its conveying state. When the conveyor 83 maintains its conveying state, the image recognition unit 4 performs image recognition on the product portion 2a as it passes below the image recognition unit 4. This enables efficient image recognition of the product portion 2a. However, vibrations caused by the driving of the conveyor 83 may affect the image recognition unit 4.

[0071] C-7. Chip collection section The chip recovery unit 9 is typically capable of recovering the product portion 2a after image recognition by the image recognition unit 4. In the illustrated example, the chip recovery unit 9 includes a pickup device 91, a non-defective product tray 92, and a defective product tray 93.

[0072] The pickup device 91 is capable of picking up the product portions 2a on the conveyor 83 one by one, and is capable of moving while holding the product portions 2a. The pickup device 91 may have any appropriate configuration. A representative example of the pickup device 91 is a vacuum suction type pickup device. The non-defective tray 92 can accommodate, as film chips 10, product portions 2a that have been determined to be non-defective based on information about the product portions 2a image-recognized by the image recognition unit 4. The film chips 10 are typically accommodated in the non-defective tray 92 in a state where they are stacked in the thickness direction. The defective product tray 93 can accommodate product parts 2 a that have been determined to be defective based on the information of the product parts 2 a that have been image-recognized by the image recognition unit 4 .

[0073] D. Details of the film chip manufacturing process Next, a method for manufacturing the film chip 10 will be described in detail with reference to FIG. In the illustrated example, the above-mentioned arrangement step, connection step, tact difference absorption step, cutting step, separation step, and image recognition step are carried out consecutively.

[0074] D-1. Placement process In the placement step, as described above, the individual sheet 2 is placed on the carrier sheet 1. At this time, the first light release layer 21a is typically positioned on the opposite side of the carrier sheet 1. When the individual sheet 2 includes the laminated film 22, the plurality of light release layers 21, and the release liner 23, the release liner 23 comes into contact with the carrier sheet 1. In the illustrated example, the individual sheets 2 stored in the sheet tray 51 are first removed onto the stage 52 by the pickup device 54. Then, at a predetermined timing, the individual sheets 2 are transported from the stage 52 to the conveyor 53 by the pickup device 54. In one embodiment, the individual sheets 2 are intermittently placed on the continuously operating conveyor 53. The individual sheets 2 are then transported by the conveyor 53 toward a gap between two first pinch rollers 55. When the individual sheets 2 pass between the two first pinch rollers 55, they are placed on the carrier sheet 1 and are appropriately pressed by the first pinch rollers 55. As a result, the individual sheets 2 are transferred from the conveyor 53 to the carrier sheet 1 and placed on the carrier sheet 1. Furthermore, by repeating this placement process, a plurality of individual sheets 2 are placed on the carrier sheet 1 so as to be aligned in the direction in which the carrier sheet 1 moves.

[0075] D-2.Connection process In the connecting step, adjacent sheets 2 among the plurality of sheets 2 are connected by the long connecting tape 63a, as described above. In the illustrated example, the connecting tape 63a is continuously supplied from the tape feed roller 61 to between the two second pinch rollers 62. Then, when the individual sheet 2 passes between the two second pinch rollers 62 as the carrier sheet 1 moves, the connecting tape 63a is attached to the widthwise end of the individual sheet 2. Thereafter, when the next individual sheet 2 passes between the two second pinch rollers 62, the connecting tape 63a is attached to the widthwise end of the individual sheet 2. As a result, the connecting tape 63a is continuously attached to the width direction ends of the individual sheets 2 passing between the two second pinch rollers 62 in sequence, and the multiple individual sheets 2 are connected together by the connecting tape 63a.

[0076] D-3. Takt difference absorption process In the tact time difference absorbing process, the carrier sheet 1 supporting the single sheet 2 is guided by two guide rollers 74 so as to pass around the buffer roller 73. Note that in the tact time difference absorbing process, the position of the buffer roller 73 may be detected as described above, and the operation of the rotary cutter 31 may be controlled based on the detected position of the buffer roller 73.

[0077] D-4.Cutting process In the cutting step, as described above, the individual sheets 2 on the carrier sheet 1 are cut into the product portion 2a and the non-product portion 2b by the rotary cutter 31 (see FIG. 2). In the illustrated example, when the individual sheet 2 passes between the rotary cutter 31 and the opposing roller 32 as the carrier sheet 1 moves, the individual sheet 2 is cut into a product portion 2a and a non-product portion 2b by the rotary cutter 31. More specifically, the portion of the individual sheet 2 to which the connecting tape 63a is not attached (in the illustrated example, the portion of the individual sheet 2 between the two connecting tapes 63a) is cut by the rotary cutter 31.

[0078] The product portion 2a may have any appropriate shape when viewed in the thickness direction of the individual sheet 2. Examples of the shape of the product portion 2a include a polygonal shape, a circular shape, and an elliptical shape. 2, in one embodiment, the product portion 2a has a rectangular shape when viewed in the thickness direction of the sheet 2. In the illustrated example, a plurality of rectangular product portions 2a are cut out from one sheet 2. In this embodiment, the dimension of the long side of the product portion 2a is, for example, 20 mm or more and 450 mm or less, and the dimension of the short side of the product portion 2a is, for example, 20 mm or more and 250 mm or less.

[0079] 8 and 9, in another embodiment, the product portion 2a has a polygonal shape with pentagons or more sides when viewed in the thickness direction of the sheet 2. In the illustrated example, a plurality of hexagonal product portions 2a are cut out from one sheet 2. In this embodiment, the upstream end of the product portion 2a in the moving direction of the carrier sheet 1 is a side (see FIG. 8) or a corner (see FIG. 9) that is approximately parallel to the width direction perpendicular to the moving direction when viewed from the thickness direction of the product portion 2a. Note that the expression "approximately parallel" also includes the case where the angle between the side located at the upstream end of the product portion 2a and the width direction perpendicular to the moving direction of the carrier sheet 1 is 0°±3°. When the upstream end of the product portion 2a is a corner, the angle of the corner is, for example, 120° or more, preferably 150° or more, whereas the angle of the corner of the upstream end of the product portion 2a is, for example, less than 180°. When the individual sheets are cut in this manner in the cutting process, even if a rotary cutter is used to cut out a product portion having a polygonal shape with pentagons or more, cracks in the product portion can be suppressed. Furthermore, even if the individual sheets have multiple light release layers, lifting (peeling) of the light release layers can be stably suppressed.

[0080] Furthermore, when the product portion 2a has a polygonal shape with pentagons or more sides, the downstream end of the product portion 2a in the moving direction of the carrier sheet 1 is, when viewed from the thickness direction of the product portion 2a, a side that is approximately parallel to the width direction perpendicular to the moving direction (see Figure 8) or a corner (see Figure 9), preferably a corner. The angle of the corners at the downstream end of the product portion 2a is, for example, 45° or more, preferably 60° or more. On the other hand, the angle of the corners at the downstream end of the product portion 2a is, for example, 120° or less. If the angle of the corners at the downstream end of the product portion is in this range, even if the individual sheet has multiple light release layers, lifting (peeling) of the light release layers can be stably suppressed.

[0081] D-5. Separation process As shown in FIG. 1, in the separation step, the outer product portion 2b is separated from the product portion 2a as described above. In the illustrated example, the individual sheet 2 that has passed through the cutting device 3 is peeled from the carrier sheet 1 by the peeling roller 74b and transferred from the carrier sheet 1 to the conveyor 83. In other words, between the cutting process and the separation process, the carrier sheet 1 is peeled from the individual sheet 2. The individual sheet 2 is then transported by the conveyor 83 and passes between the separation roller 81 and the conveyor 83. At this time, the non-product portion 2b is separated from the product portion 2a by the separation roller 81. Thereafter, the multiple non-product portions 2b connected by the connecting tape 63a are continuously wound up by the winding roller 82. Meanwhile, the product portion 2a is maintained on the conveyor 83.

[0082] D-6. Image recognition process In the image recognition step, the product portion 2a is image-recognized by the image recognition unit 4 as described above. In the illustrated example, the image recognition unit 4 performs image recognition with high accuracy on the product portions 2a positioned on the conveyor 83. Thereafter, the pickup device 91 transports the product portions 2a whose information, image-recognized by the image recognition unit 4, is within the allowable range to a non-defective tray 92 as film chips 10. On the other hand, the pickup device 91 transports the product portions 2a whose information, image-recognized by the image recognition unit 4, is outside the allowable range to a defective tray 93 as defective products.

[0083] In this way, film chips 10 having desired properties are continuously manufactured. In one embodiment, the film chip 10 includes a plurality of light release layers 21, a laminated film 22, and a release liner 23 (see FIG. 3). Such a film chip 10 can be used in a variety of applications, and is particularly suitable for optical applications. More specifically, after release liner 23 is peeled off from third adhesive layer 225, film chip 10 can be attached to an optical component via third adhesive layer 225, and used in optical applications. Examples of optical components include liquid crystal display panels and organic EL display panels. [Industrial Applicability]

[0084] The method for manufacturing film chips according to the embodiment of the present invention can be suitably used for manufacturing film chips that are applied to various industrial products. [Explanation of symbols]

[0085] 1 Carrier Sheet 2 individual sheets 2a Product part 2b External part of the product 4 Image Recognition Unit 31 Rotary Cutter 63 Connecting material 73 Buffer roller

Claims

1. placing a single sheet onto a moving carrier sheet; cutting the individual sheets on the carrier sheet into a product portion and a non-product portion using a rotary cutter; and a step of image-recognizing the product portion, in this order.

2. The method for manufacturing film chips according to claim 1 , further comprising the step of routing the carrier sheet so as to pass through a buffer roller between the step of placing the individual sheets and the step of cutting the individual sheets.

3. the buffer roller is movable in a direction intersecting with a direction in which an axis of the rotary cutter extends, 3. The method for manufacturing film chips according to claim 2, further comprising detecting the position of the buffer roller and stopping the cutting of the individual sheets by the rotary cutter when the position of the buffer roller is closer to the rotary cutter than a predetermined position.

4. The method for manufacturing film chips according to claim 1 or 2, further comprising a step of separating the non-product portion from the product portion between the step of cutting the individual sheets and the step of image-recognizing the product portion.

5. In the step of arranging the individual sheets, the individual sheets are arranged so as to be aligned in a moving direction of the carrier sheet; The method for manufacturing film chips described in claim 4, wherein the non-product portions of adjacent sheets among the plurality of sheets are connected by a connecting material between the process of arranging the plurality of sheets and the process of separating the non-product portions.

6. 3. The method for producing film chips according to claim 1, wherein the thickness of the individual sheets is 300 μm or more.

7. 3. The method for producing film chips according to claim 1, wherein the moving speed of the sheet in the step of cutting the sheet is 5 m / min or less.

Images