Processing device and polished surface shaping method

Abstract

To provide a processing device which can reduce the thickness variation of a workpiece.SOLUTION: A processing device comprises: a chuck table which has a holding surface for holding a workpiece; a chuck table rotation drive source which rotates the chuck table; a polishing unit on which a polishing pad having a polishing surface for polishing the workpiece is attached; a polishing pad rotation drive source which rotates the polishing pad; a polishing movement mechanism which relatively moves the chuck table and the polishing pad along a first direction crossing the holding surface and the polishing surface; a shape measuring instrument which measures a shape of the holding surface; a shaping mechanism which shapes the holding surface by contacting with the polishing surface; a shaping movement mechanism which relatively moves the polishing pad and the shaping mechanism long a second direction crossing the first direction; and a controller which makes a shape of the polishing surface correspond to the shape of the holding surface by controlling the shaping of the polishing surface by the shaping mechanism according to the shape of the holding surface measured by the shape measuring instrument.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus and a polished surface shaping method for dressing the polishing surface of a polishing pad that polishes a workpiece. [Background technology]

[0002] The device chip manufacturing process uses a wafer in which devices are formed in multiple regions defined by multiple streets (planned division lines) arranged in a grid pattern. By dividing this wafer along the streets, device chips equipped with devices are obtained. The device chips are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] If the surface of a wafer used to manufacture device chips is not flat and fine irregularities (scratches, etc.) remain, this can cause a decrease in the die strength of the device chips, dimensional errors, etc., and can result in a decrease in the quality of the device chips. Therefore, before being divided, the wafer is sometimes polished using a polishing machine.

[0004] A polishing apparatus includes a chuck table for holding a workpiece such as a wafer, and a polishing unit for polishing the workpiece. The polishing unit has a built-in spindle, the tip of which is fitted with a disc-shaped polishing pad. The workpiece is held by the chuck table, and the chuck table and polishing pad are rotated while the polishing surface of the polishing pad is brought into contact with the workpiece's surface, thereby polishing the workpiece. This removes any fine irregularities remaining on the workpiece's surface, resulting in a flat polished surface.

[0005] If the thickness of a workpiece varies across its surface, the workpiece will not be polished uniformly by the polishing pad, and the thickness variation of the workpiece will be difficult to eliminate even after polishing. Therefore, a processing device has been proposed that measures the thickness distribution of the workpiece and shapes the polishing surface of the polishing pad based on the thickness distribution of the workpiece (see Patent Document 1). By using such a processing device, it becomes possible to press the polishing pad uniformly against a workpiece with thickness variation, thereby reducing the thickness variation of the workpiece after polishing. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-223636 Summary of the Invention [Problem to be solved by the invention]

[0007] When a workpiece is polished using a processing device, it is held on the holding surface of a chuck table. However, depending on the specifications of the processing device, the holding surface of the chuck table may not be flat. In this case, even if the workpiece has a uniform thickness, when the workpiece is held on the chuck table, it deforms to conform to the shape of the holding surface, resulting in an inconsistent height position of the polished surface of the workpiece. As a result, when a polishing pad is pressed against the workpiece's polished surface, the force (polishing pressure) acting on the workpiece becomes uneven, which can easily result in thickness variations in the workpiece after polishing.

[0008] The present invention has been made in view of the above problem, and has as its object to provide a processing apparatus and a polished surface shaping method that can reduce thickness variations in a workpiece. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a processing apparatus comprising: a chuck table having a holding surface for holding a workpiece; a chuck table rotation drive source for rotating the chuck table around a rotation axis intersecting the holding surface; a polishing unit on which a polishing pad having a polishing surface for polishing the workpiece is mounted; a polishing pad rotation drive source for rotating the polishing pad around a rotation axis intersecting the polishing surface; a polishing movement mechanism for relatively moving the chuck table and the polishing pad along the holding surface and a first direction intersecting the polishing surface; a shape measuring device for measuring the shape of the holding surface; a shaping mechanism for contacting the polishing surface and shaping the polishing surface; a shaping movement mechanism for relatively moving the polishing pad and the shaping mechanism along a second direction intersecting the first direction; and a controller for controlling the shaping of the polishing surface by the shaping mechanism in accordance with the shape of the holding surface measured by the shape measuring device, thereby causing the shape of the polishing surface to correspond to the shape of the holding surface.

[0010] Preferably, the diameter of the polishing pad is at least twice the diameter of the workpiece. Also preferably, the shaping mechanism has a shaping member that contacts the polishing surface to shape the polishing surface, and a displacement measuring device that measures the displacement of the shaping member in the first direction, and the controller identifies the shape of the polishing surface based on the displacement of the shaping member measured by the displacement measuring device when the shaping member is brought into contact with multiple positions on the polishing surface.

[0011] According to another aspect of the present invention, there is provided a polishing surface shaping method comprising: a holding surface measuring step for measuring the shape of the holding surface of a chuck table that holds a workpiece; and a shaping step for contacting a shaping member for shaping the polishing surface with the polishing surface of a polishing pad that polishes the workpiece, thereby shaping the polishing surface in accordance with the shape of the holding surface measured in the holding surface measuring step, thereby causing the shape of the polishing surface to correspond to the shape of the holding surface.

[0012] Preferably, the polishing surface shaping method further comprises a polishing surface shape specifying step of specifying the shape of the polishing surface based on the amount of displacement of the shaping member when the shaping member is brought into contact with multiple positions on the polishing surface shaped in the shaping step. Also preferably, the shape of the holding surface side of the chuck table is conical, and in the shaping step, the polishing surface is shaped so that an annular recess corresponding to the shape of the holding surface is formed on the polishing surface side of the polishing pad. [Effects of the Invention]

[0013] In a processing apparatus and a polishing surface shaping method according to one aspect of the present invention, the shape of the holding surface of the chuck table is measured, and the polishing surface of the polishing pad is shaped in accordance with the shape of the holding surface. This makes it possible to match the shape of the polishing surface of the polishing pad to the shape of the holding surface of the chuck table, thereby reducing thickness variations in the workpiece when it is held on the chuck table and polished with the polishing pad. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. [Figure 2] FIG. 2 is a cross-sectional view showing a chuck table. [Figure 3] FIG. 2 is a partial cross-sectional side view showing the grinding unit. [Figure 4] FIG. 2 is a partial cross-sectional side view showing the polishing unit. [Figure 5] 1 is a flowchart showing a polished surface shaping method. [Figure 6] FIG. 10 is a partial cross-sectional side view showing the processing device in a holding surface measuring step. [Figure 7] FIG. 2 is a plan view showing a chuck table and a shape measuring instrument. [Figure 8] FIG. 10 is a partial cross-sectional side view showing the processing device in a shaping step. [Figure 9] FIG. 10 is a partial cross-sectional side view showing the processing device in a polishing surface shape specifying step. [Figure 10] 1 is a partial cross-sectional side view showing a processing apparatus for polishing a workpiece. [Figure 11] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] (Embodiment 1) An embodiment according to one aspect of the present invention will be described below with reference to the accompanying drawings. First, a configuration example of a processing device according to this embodiment will be described. FIG. 1 is a perspective view showing a processing device (grinding / polishing device) 2 capable of performing grinding and polishing on a workpiece 11. In FIG. 1, the X-axis direction (first horizontal direction, left-right direction) and the Y-axis direction (second horizontal direction, front-rear direction) are perpendicular to each other. Furthermore, the Z-axis direction (up-down direction, height direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0016] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as single crystal silicon, and has a front surface (first surface) 11a and a back surface (second surface) 11b that are generally parallel to each other. The workpiece 11 is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) arranged in a grid pattern so as to intersect with each other. Furthermore, devices (not shown), such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices, are formed on the front surface 11a side of each of the regions divided by the streets.

[0017] By dividing the workpiece 11 along the streets, a plurality of device chips each including a device are manufactured. To divide the workpiece 11, a processing device such as a cutting device that cuts the workpiece 11 with an annular cutting blade or a laser processing device that processes the workpiece 11 by irradiating it with a laser beam is used. Then, for example, the processing device 2 performs grinding and polishing on the back surface 11b of the workpiece 11 before dividing the workpiece 11. This thins the workpiece 11 and flattens the back surface 11b of the workpiece 11.

[0018] However, there are no limitations on the type, material, size, shape, structure, etc. of the workpiece 11. For example, the workpiece 11 may be a substrate (wafer) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass, ceramics, resin, metal, etc. Furthermore, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of devices, and the workpiece 11 does not necessarily have to have any devices formed thereon.

[0019] In this embodiment, as an example, a case will be described in which the back surface 11b of the workpiece 11 is a surface to be processed (surface to be ground, surface to be polished) that is subjected to grinding and polishing by the processing device 2. When processing the back surface 11b side of the workpiece 11, a protective member may be fixed to the front surface 11a side of the workpiece 11. For example, a film-like protective sheet made of resin or the like is attached to the front surface 11a side of the workpiece 11 as the protective member. This protects the front surface 11a side of the workpiece 11.

[0020] The processing device 2 includes a base 4 that supports or houses each of the components of the processing device 2. An opening 4a is provided on the upper surface side of the front end of the base 4. Furthermore, a transport unit (transport mechanism) 6 that transports the workpiece 11 is provided inside the opening 4a. For example, the transport unit 6 is configured by a transport robot equipped with a robot hand (end effector) that can hold the workpiece 11.

[0021] Cassette support stands 8A and 8B are provided in front of the opening 4a. Box-shaped cassettes 10A and 10B are placed on the cassette support stands 8A and 8B, respectively. The cassettes 10A and 10B are containers that can accommodate a plurality of workpieces 11, which are objects to be processed by the processing device 2. When processing the workpieces 11 with the processing device 2, the cassettes 10A and 10B accommodating the plurality of workpieces 11 are set on the cassette support stands 8A and 8B.

[0022] An alignment mechanism (positioning mechanism) 12 is provided diagonally behind the opening 4a to align the workpiece 11. For example, the alignment mechanism 12 includes a temporary placement table on which the workpiece 11 is temporarily placed, and a plurality of pins that come into contact with the outer periphery of the workpiece 11 held by the temporary placement table and clamp the workpiece 11.

[0023] The workpieces 11 housed in the cassettes 10A and 10B are transported to the alignment mechanism 12 by the transport unit 6. The alignment mechanism 12 then holds the workpieces 11 on a temporary placement table and clamps them with multiple pins, thereby placing the workpieces 11 in a predetermined position.

[0024] A transport unit (transport mechanism, loading arm) 14 and a transport unit (transport mechanism, unloading arm) 16 are provided near the alignment mechanism 12, and each of these units rotates while holding the workpiece 11. For example, the transport units 14 and 16 are provided with one or more suction pads that suck the top surface of the workpiece 11, and transport the workpiece 11 while holding it by suction.

[0025] A moving mechanism 18 is provided behind the alignment mechanism 12 and the transport units 14 and 16. For example, the moving mechanism 18 is configured by a disk-shaped turntable. In this case, a rotational drive source (not shown), such as a motor, is connected to the turntable to rotate the turntable around a rotation axis that is approximately parallel to the Z-axis direction.

[0026] A plurality of chuck tables (holding tables) 20 that hold the workpieces 11 are connected to the moving mechanism 18. The upper surfaces of the chuck tables 20 form holding surfaces that hold the workpieces 11. For example, four chuck tables 20 are installed on the moving mechanism 18 at approximately equal intervals (90° intervals) along the circumferential direction of the moving mechanism 18. The moving mechanism 18 rotates counterclockwise (in the direction indicated by arrow α) in a plan view, and positions each chuck table 20 in the transfer region A, grinding region B (first grinding region, rough grinding region), grinding region C (second grinding region, finish grinding region), polishing region D, and transfer region A, in that order.

[0027] The transport unit 14 holds the workpiece 11, which has been aligned by the alignment mechanism 12, and moves it backward, thereby transporting the workpiece 11 from the alignment mechanism 12 to the chuck table 20 positioned in the transport area A. On the other hand, the transport unit 16 holds the workpiece 11 held by the chuck table 20 positioned in the transport area A and moves it forward, thereby transporting the workpiece 11 from the chuck table 20 to a cleaning unit 98, which will be described later.

[0028] 2 is a cross-sectional view showing the chuck table 20. The chuck table 20 includes a cylindrical frame (main body) 22 made of metal such as SUS (stainless steel), glass, ceramics, resin, etc. A cylindrical recess 22b is provided concentrically with the upper surface 22a at the center of the frame 22.

[0029] A disk-shaped holding member 24 made of a porous material such as porous ceramics is fitted into recess 22b. Holding member 24 includes a large number of pores that communicate from the top surface to the bottom surface of holding member 24. The top surface of holding member 24 forms a circular suction surface 24a that sucks workpiece 11 when chuck table 20 holds workpiece 11.

[0030] The upper surface 22a of the frame 22 and the suction surface 24a of the holding member 24 form the holding surface 20a of the chuck table 20. The holding surface 20a is connected to a suction source (not shown) such as an ejector via pores contained in the holding member 24, a flow path 22c provided inside the frame 22, a valve (not shown), etc. With the workpiece 11 placed on the holding surface 20a of the chuck table 20, the suction force (negative pressure) of the suction source is applied to the holding surface 20a, whereby the workpiece 11 is sucked and held by the chuck table 20.

[0031] The holding surface 20a side of the chuck table 20 is formed in a cone shape with the center of the holding surface 20a as the apex. Therefore, the holding surface 20a is slightly inclined with respect to the radial direction of the holding surface 20a. For convenience of explanation, the inclination of the holding surface 20a is exaggerated in FIG. 2 (the same applies to FIG. 3 and subsequent figures), but the actual inclination of the holding surface 20a is small. For example, when the diameter of the holding surface 20a is approximately 290 mm or more and 310 mm or less, the difference in height between the center and the outer periphery of the holding surface 20a (height of the cone) is set to approximately 20 μm or more and 40 μm or less.

[0032] A rotary drive source (chuck table rotary drive source) 26 that rotates the chuck table 20 is connected to the chuck table 20. The rotary drive source 26 is configured with a motor or the like, and rotates the chuck table 20 about a rotary axis (chuck table rotary axis) 28 that intersects with the holding surface 20a. For example, the rotary axis 28 of the chuck table 20 is set along a direction perpendicular to the radial direction of the holding surface 20a, and intersects with the holding surface 20a so as to pass through the center of the holding surface 20a.

[0033] In addition, a tilt adjustment mechanism (not shown) that adjusts the tilt of the chuck table 20 is connected to the chuck table 20. By operating the tilt adjustment mechanism to adjust the tilt of the chuck table 20, it is possible to switch between a state in which the rotation shaft 28 is arranged along the Z-axis direction and a state in which the rotation shaft 28 is tilted with respect to the Z-axis direction.

[0034] When grinding the workpiece 11, the angle of the chuck table 20 is adjusted so that the rotation axis 28 is slightly tilted with respect to the Z-axis direction (see FIG. 3). At this time, a grinding holding area 20b, which corresponds to a part of the holding surface 20a and extends from the center to the outer periphery of the holding surface 20a, is positioned approximately parallel to the horizontal plane (XY plane). The workpiece 11 is then held by the chuck table 20, and the area of ​​the workpiece 11 held in or near the grinding holding area 20b is ground by grinding units 42A and 42B, which will be described later.

[0035] On the other hand, when polishing the workpiece 11, the angle of the chuck table 20 is adjusted so that the rotation axis 28 is roughly parallel to the Z-axis direction (see FIG. 4). Then, the workpiece 11 is held by the chuck table 20, and the entire workpiece 11 is polished by the polishing unit 80, which will be described later.

[0036] 1, a pair of support structures 30A, 30B are provided at the rear end of the base 4 (behind the moving mechanism 18 and the chuck table 20). For example, the support structures 30A, 30B are formed in a rectangular parallelepiped shape and are arranged to protrude upward from the upper surface of the base 4. Furthermore, the surfaces (front surfaces) of the support structures 30A, 30B are arranged approximately parallel to the XZ plane.

[0037] A moving mechanism (grinding moving mechanism) 32A that moves a grinding unit 42A (described later) along the Z-axis direction is provided on the surface side of the support structure 30A. On the other hand, a moving mechanism (grinding moving mechanism) 32B that moves a grinding unit 42B (described later) along the Z-axis direction is provided on the surface side of the support structure 30B.

[0038] The movement mechanisms 32A and 32B each include a pair of guide rails 34 arranged along the Z-axis direction on the front surface side of the support structures 30A and 30B. A flat moving plate 36 is attached to the pair of guide rails 34 so as to be slidable along the guide rails 34.

[0039] A nut portion (not shown) is provided on the back surface (rear surface) of the moving plate 36. A ball screw 38, which is disposed along the Z-axis direction between a pair of guide rails 34, is threadedly engaged with this nut portion. A pulse motor 40 that rotates the ball screw 38 is connected to the end of the ball screw 38. When the ball screw 38 is rotated by the pulse motor 40, the moving plate 36 moves in the Z-axis direction along the guide rails 34.

[0040] A grinding unit 42A that performs rough grinding on the workpiece 11 is fixed to the surface side (front side) of the moving plate 36 of the moving mechanism 32A. On the other hand, a grinding unit 42B that performs finish grinding on the workpiece 11 is fixed to the surface side (front side) of the moving plate 36 of the moving mechanism 32B. Grinding unit 42A is positioned above grinding area B, and grinding unit 42B is positioned above grinding area C.

[0041] Each of the grinding units 42A, 42B includes a cylindrical housing 44. A columnar spindle 46 arranged along the Z-axis direction is rotatably housed in the housing 44. The tip (lower end) of the spindle 46 protrudes downward from the lower end of the housing 44. A disk-shaped mount 48 made of metal or the like is fixed to the tip of the spindle 46.

[0042] A grinding wheel 50A for rough grinding is attached to the lower surface of a mount 48 provided in the grinding unit 42A. Meanwhile, a grinding wheel 50B for finish grinding is attached to the lower surface of a mount 48 provided in the grinding unit 42B. For example, the grinding wheels 50A, 50B are detachably fixed to the mount 48 by fasteners such as bolts.

[0043] 3 is a partial cross-sectional side view showing the grinding unit 42A. The grinding wheel 50A includes an annular wheel base 52 made of a metal such as an aluminum alloy, and a plurality of grinding stones 54 fixed to the underside of the wheel base 52. The underside of the grinding stones 54 forms a grinding surface 54a that comes into contact with the workpiece 11 and grinds the workpiece 11.

[0044] The grinding wheels 54 are formed by fixing abrasive grains made of diamond, cBN (cubic boron nitride), etc. with a bonding material (bond material) such as a metal bond, a resin bond, a vitrified bond, etc. For example, a plurality of grinding wheels 54 formed in a rectangular parallelepiped shape are arranged in a ring shape at approximately equal intervals along the outer periphery of the wheel base 52.

[0045] A rotary drive source (grinding wheel rotary drive source) 56 that rotates the grinding wheel 50A is connected to the base end (upper end) of the spindle 46. The rotary drive source 56 is configured with a motor or the like, and rotates the spindle 46 about a rotation axis (grinding wheel rotation axis) 58 that intersects with the grinding surface 54a. For example, the rotation axis 58 is set to be generally parallel to the Z-axis direction. When the rotary drive source 56 is operated, the spindle 46, the mount 48, and the grinding wheel 50A rotate around the rotation axis 58, and the multiple grinding stones 54 revolve along a circular revolving path that is generally parallel to the horizontal plane (XY plane).

[0046] The configurations and functions of the grinding unit 42B and the grinding wheel 50B (see FIG. 1) are similar to those of the grinding unit 42A and the grinding wheel 50A, respectively. However, the average particle size of the abrasive grains contained in the grinding stone 54 of the grinding wheel 50B is smaller than the average particle size of the abrasive grains contained in the grinding stone 54 of the grinding wheel 50A.

[0047] When grinding the workpiece 11, the workpiece 11 is transported to the chuck table 20 positioned in the transport area A (see FIG. 1) and held by the chuck table 20. Specifically, the workpiece 11 is placed on the chuck table 20 so that the back surface 11b (surface to be processed) is exposed upward and the front surface 11a faces the holding surface 20a. When a suction force is applied to the holding surface 20a in this state, the workpiece 11 is sucked and held by the chuck table 20. If a protective member is fixed to the front surface 11a side of the workpiece 11, the workpiece 11 is sucked and held by the chuck table 20 via the protective member.

[0048] As described above, the holding surface 20a side of the chuck table 20 is formed in a conical shape. When the workpiece 11 is suction-held by the chuck table 20, the workpiece 11 is held in a slightly deformed state along the holding surface 20a. The back surface 11b of the workpiece 11 in the grinding and holding region 20b or the region held in the vicinity thereof is positioned approximately parallel to the horizontal plane (XY plane).

[0049] Next, the moving mechanism 18 (see FIG. 1) is operated, and the chuck table 20 holding the workpiece 11 is placed in the grinding area B (see FIG. 1). As a result, the workpiece 11 is positioned below the grinding wheel 50A. At this time, the chuck table 20 is positioned so that the center of the workpiece 11 and the rotation path of the grinding wheel 54 overlap in the Z-axis direction.

[0050] Furthermore, the chuck table 20 is rotated around the rotation axis 28, and the grinding wheel 50A is rotated around the rotation axis 58. Then, the grinding wheel 50A is lowered by the moving mechanism 32A (see FIG. 1) so that the grinding surface 54a of the grinding wheel 54 comes into contact with the back surface 11b of the workpiece 11. As a result, the entire back surface 11b of the workpiece 11 is ground away by the grinding wheel 54, and the workpiece 11 is roughly ground. When the workpiece 11 is thinned to a predetermined thickness, the lowering of the grinding wheel 50A is stopped, and the rough grinding of the workpiece 11 is completed.

[0051] Next, the moving mechanism 18 (see FIG. 1) is operated, and the chuck table 20 holding the workpiece 11 is positioned in the grinding area C (see FIG. 1). As a result, the workpiece 11 is positioned below the grinding wheel 50B. The workpiece 11 is then ground by the grinding wheel 50B, and finish grinding is performed on the workpiece 11. The procedure for grinding the workpiece 11 with the grinding wheel 50B is the same as the procedure for grinding the workpiece 11 with the grinding wheel 50A.

[0052] Nozzles (not shown) for supplying grinding fluid such as pure water are provided inside or near the grinding units 42A, 42B, respectively. During grinding of the workpiece 11, the grinding fluid is continuously supplied to the workpiece 11 and the grinding wheel 54. This cools the workpiece 11 and the grinding wheel 54, and also washes away chips generated by grinding the workpiece 11.

[0053] As described above, the workpiece 11 is ground by the grinding wheels 50A and 50B, thereby performing rough grinding and finish grinding on the workpiece 11. When the back surface 11b of the workpiece 11 is ground by the grinding wheel 54, arc-shaped grinding marks (saw marks) formed along the revolution path of the grinding wheel 54 may remain on the back surface 11b of the workpiece 11.

[0054] 1, a support structure 60 is provided on the side of the polishing region D (on the side of the moving mechanism 18). For example, the support structure 60 is formed in a rectangular parallelepiped shape, and the surface of the support structure 60 (the surface on the moving mechanism 18 side) is disposed approximately parallel to the YZ plane. A moving mechanism (polishing moving mechanism) 62 is provided on the surface side of the support structure 60 to move a polishing unit 80 (described later) along the Y-axis and Z-axis directions.

[0055] The movement mechanism 62 includes a pair of Y-axis guide rails 64 arranged along the Y-axis direction on the front surface side of the support structure 60. A flat Y-axis movement plate 66 is attached to the pair of Y-axis guide rails 64 so as to be slidable along the Y-axis guide rails 64.

[0056] A nut portion (not shown) is provided on the back side of the Y-axis moving plate 66. A Y-axis ball screw 68, which is arranged along the Y-axis direction between a pair of Y-axis guide rails 64, is threadedly engaged with this nut portion. A Y-axis pulse motor 70, which rotates the Y-axis ball screw 68, is connected to the end of the Y-axis ball screw 68. When the Y-axis pulse motor 70 rotates the Y-axis ball screw 68, the Y-axis moving plate 66 moves in the Y-axis direction along the Y-axis guide rails 64.

[0057] A pair of Z-axis guide rails 72 arranged along the Z-axis direction are provided on the front surface side (movement mechanism 18 side) of Y-axis moving plate 66. A flat Z-axis moving plate 74 is attached to the pair of Z-axis guide rails 72 so as to be slidable along the Z-axis guide rails 72.

[0058] A nut portion (not shown) is provided on the back side of the Z-axis moving plate 74. A Z-axis ball screw 76, which is disposed along the Z-axis direction between a pair of Z-axis guide rails 72, is threadedly engaged with this nut portion. A Z-axis pulse motor 78, which rotates the Z-axis ball screw 76, is connected to the end of the Z-axis ball screw 76. When the Z-axis pulse motor 78 rotates the Z-axis ball screw 76, the Z-axis moving plate 74 moves in the Z-axis direction along the Z-axis guide rails 72.

[0059] A polishing unit 80 that polishes the workpiece 11 is fixed to the front surface side (moving mechanism 18 side) of the Z-axis moving plate 74. The polishing unit 80 is positioned above the polishing area D. The moving mechanism 62 controls the movement of the polishing unit 80 in the X-axis direction and the Z-axis direction. However, if the positional relationship between the chuck table 20 and the polishing unit 80 in the Y-axis direction can be adjusted by the moving mechanism 18, the mechanism that moves the polishing unit 80 along the Y-axis direction (Y-axis guide rail 64, Y-axis moving plate 66, Y-axis ball screw 68, Y-axis pulse motor 70) can be omitted from the moving mechanism 62.

[0060] The polishing unit 80 includes a cylindrical housing 82. A columnar spindle 84 is rotatably accommodated in the housing 82 and is arranged along the Z-axis direction. The tip (lower end) of the spindle 84 protrudes downward from the lower end of the housing 82. A disk-shaped mount 86 made of metal or the like is fixed to the tip of the spindle 84. A polishing pad 88 used for polishing the workpiece 11 is attached to the underside of the mount 86. For example, the polishing pad 88 is detachably fixed to the mount 86 by a fastener such as a bolt.

[0061] 4 is a partial cross-sectional side view showing the polishing unit 80. The polishing pad 88 includes a disk-shaped base 90 and a polishing layer 92 fixed to the base 90. The base 90 is made of a metal such as an aluminum alloy and is formed to have approximately the same diameter as the mount 86. Furthermore, for example, the polishing layer 92 is formed in a disk shape with approximately the same diameter as the base 90 and is fixed to the underside of the base 90 with an adhesive or the like.

[0062] The polishing layer 92 is made of a resin such as polyurethane or a nonwoven fabric such as felt, and contains abrasive grains (fixed abrasive grains). For example, silica particles or alumina particles with an average particle size of 0.2 μm to 0.5 μm are held inside the polishing layer 92. However, the material and size of the abrasive grains can be appropriately selected depending on the material of the workpiece 11, etc. The lower surface of the polishing layer 92 forms a polishing surface 88a that comes into contact with the workpiece 11 and polishes the workpiece 11.

[0063] A rotary drive source (polishing pad rotary drive source) 94 that rotates the polishing pad 88 is connected to the base end (upper end) of the spindle 84. The rotary drive source 94 is configured with a motor or the like, and rotates the spindle 84 about a rotation axis (polishing pad rotation axis) 96 that intersects with the polishing surface 88a. For example, the rotation axis 96 is set to be approximately parallel to the Z-axis direction. When the rotary drive source 94 is operated, the spindle 84, mount 86, and polishing pad 88 rotate around the rotation axis 96.

[0064] When the polishing unit 80 is moved along the Z-axis direction by the moving mechanism 62 (see FIG. 1), the chuck table 20 and the polishing pad 88 move relatively along a first direction (Z-axis direction) that intersects with the holding surface 20a and the polishing surface 88a. When the chuck table 20 is moved by the moving mechanism 18 (see FIG. 1) or the polishing unit 80 is moved along the Y-axis direction by the moving mechanism 62 (see FIG. 1), the chuck table 20 and the polishing pad 88 move relatively along a second direction (XY plane direction) that intersects with the first direction (Z-axis direction).

[0065] An elevator mechanism (not shown) that raises and lowers the chuck table 20 along the Z-axis direction may be connected to the chuck table 20. In this case, the elevator mechanism functions as a polishing movement mechanism that moves the chuck table 20 and the polishing pad 88 relatively along the first direction (Z-axis direction).

[0066] When the grinding process (see FIG. 3) of the workpiece 11 is completed, the moving mechanism 18 (see FIG. 1) is operated, and the chuck table 20 holding the workpiece 11 is positioned in the polishing region D (see FIG. 1). As a result, the workpiece 11 is positioned below the polishing pad 88. Then, the position of the polishing pad 88 in the Y-axis direction is adjusted by the moving mechanism 62 (see FIG. 1), and the polishing layer 92 of the polishing pad 88 is positioned so as to overlap the entire back surface 11b (the surface to be processed) of the workpiece 11.

[0067] Furthermore, the inclination of the chuck table 20 is adjusted so that the rotation axis 28 is approximately parallel to the Z-axis direction. As a result, the rotation axis 28 of the chuck table 20 and the rotation axis 96 of the polishing pad 88 become approximately parallel. Furthermore, the chuck table 20 is rotated around the rotation axis 28, and the polishing pad 88 is rotated around the rotation axis 96. Then, the polishing pad 88 is lowered by the moving mechanism 62 (see FIG. 1), and the workpiece 11 and the polishing pad 88 are moved relatively and close to each other along the Z-axis direction (processing feed). As a result, the polishing surface 88a of the polishing pad 88 comes into contact with the back surface 11b of the workpiece 11, and the back surface 11b of the workpiece 11 is polished.

[0068] During polishing of the workpiece 11, a polishing liquid is supplied to the workpiece 11 and the polishing pad 88. For example, the polishing liquid corresponds to a liquid (chemical solution) that performs a chemical surface treatment on the workpiece 11. The material of the polishing liquid is appropriately selected depending on the material of the workpiece 11, the purpose of polishing, the processing conditions, etc. Examples of polishing liquids include an acidic solution in which permanganate is dissolved, and an alkaline solution in which sodium hydroxide or potassium hydroxide is dissolved. When the polishing layer 92 of the polishing pad 88 contains fixed abrasive grains, the polishing liquid does not contain abrasive grains.

[0069] When a polishing liquid is supplied to the contact area between the back surface 11b of the workpiece 11 and the polishing surface 88a of the polishing pad 88, the polishing liquid acts on the back surface 11b of the workpiece 11. As a result, CMP (Chemical Mechanical Polishing) is performed on the back surface 11b of the workpiece 11.

[0070] It should be noted that abrasive grains may not be contained in the polishing layer 92 of the polishing pad 88. In this case, abrasive grains (loose abrasive grains) are contained in the polishing liquid, and the loose abrasive grains are supplied to the contact area between the workpiece 11 and the polishing pad 88 together with the polishing liquid.

[0071] When the rear surface 11b of the workpiece 11 is polished as described above, minute irregularities remaining on the rear surface 11b of the workpiece 11 are removed, and the rear surface 11b is flattened. For example, if grinding marks remain on the rear surface 11b of the workpiece 11 after grinding, the grinding marks are removed by polishing. Then, after polishing continues until the workpiece 11 reaches a predetermined thickness, the processing feed is stopped and polishing of the workpiece 11 is completed.

[0072] 1, a cleaning unit 98 for cleaning the workpiece 11 is provided in front of the moving mechanism 18 and the chuck table 20. For example, the cleaning unit 98 includes a spinner table that holds and rotates the workpiece 11, and a nozzle that supplies a cleaning liquid such as pure water. The workpiece 11 is held by the spinner table, and cleaning liquid is supplied to the workpiece 11 from the nozzle while the spinner table is being rotated, thereby cleaning the workpiece 11 and washing away foreign matter such as processing chips adhering to the workpiece 11.

[0073] When polishing of the workpiece 11 is completed, the moving mechanism 18 rotates, and the chuck table 20 holding the workpiece 11 is again placed in the transfer area A. Then, the workpiece 11 is transferred from the chuck table 20 to the cleaning unit 98 by the transfer unit 16, and is cleaned by the cleaning unit 98. Thereafter, the workpiece 11 is stored in the cassette 10A or the cassette 10B by the transfer unit 6.

[0074] The processing apparatus 2 also includes a controller (control unit, control section, control device) 100 that controls the processing apparatus 2. The controller 100 is connected to each component of the processing apparatus 2 (transport unit 6, alignment mechanism 12, transport units 14 and 16, moving mechanism 18, chuck table 20, rotational drive source 26, moving mechanisms 32A and 32B, grinding units 42A and 42B, rotational drive source 56, moving mechanism 62, polishing unit 80, rotational drive source 94, cleaning unit 98, etc.). The controller 100 controls the operation of the processing apparatus 2 by outputting control signals to each component of the processing apparatus 2.

[0075] For example, the controller 100 is configured by a computer and includes a processing unit that performs processing such as calculations necessary for the operation of the processing device 2, and a storage unit that stores various information (data, programs, etc.) used for the operation of the processing device 2. The processing unit includes a processor such as a CPU (Central Processing Unit), and the storage unit includes memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0076] Here, when processing the workpiece 11 using the processing device 2, the holding surface 20a side of the chuck table 20 is formed in a conical shape for the convenience of grinding (see FIG. 3). In this case, when the workpiece 11 is held by the chuck table 20, the workpiece 11 is deformed to conform to the shape of the holding surface 20a.

[0077] When the workpiece 11 is held by the chuck table 20 as described above, the height position of the workpiece surface is not constant when the workpiece 11 is polished (see FIG. 4), and the workpiece surface of the workpiece 11 and the polishing surface 88a of the polishing pad 88 are not parallel to each other. When the polishing pad 88 is pressed against the workpiece 11 in this state, the polishing pad 88 is pressed strongly against the center of the workpiece 11, and the force (polishing pressure) acting on the workpiece 11 becomes non-uniform within the surface. As a result, the polishing rate (the amount of workpiece 11 polished per unit time) also becomes non-uniform within the surface of the workpiece 11, and thickness variations tend to occur in the workpiece 11 after polishing.

[0078] Therefore, the processing apparatus 2 according to this embodiment adjusts the shape of the polishing surface 88a to match the shape of the holding surface 20a by shaping the polishing surface 88a of the polishing pad 88 in accordance with the shape of the holding surface 20a of the chuck table 20. As a result, even if the holding surface 20a of the chuck table 20 is not formed flat, it is possible to apply a uniform polishing pressure to the workpiece 11 held by the chuck table 20, thereby reducing variations in thickness of the workpiece 11.

[0079] Specifically, as shown in FIG. 4, the processing apparatus 2 includes a shape measuring device 110 that measures the shape of the holding surface 20a of the chuck table 20, and a shaping mechanism (dressing mechanism) 120 that contacts the polishing surface 88a of the polishing pad 88 to shape (dress) the polishing surface 88a.

[0080] For example, the shape measuring instrument 110 is configured with a laser displacement meter that measures the height position (position in the Z-axis direction) of the holding surface 20a of the chuck table 20 in a non-contact manner. In this case, the shape measuring instrument 110 irradiates a laser beam toward the holding surface 20a and receives the laser beam reflected by the holding surface 20a. Then, the shape measuring instrument 110 identifies the height position of the holding surface 20a based on the displacement of the receiving spot of the laser beam, etc. However, there are no limitations on the type of shape measuring instrument 110 as long as it is possible to measure the height position of the holding surface 20a.

[0081] The shape measuring instrument 110 is connected to a movement mechanism that moves the shape measuring instrument 110 in the horizontal direction (XY plane direction). For example, as shown in FIG. 4, the shape measuring instrument 110 is attached to the underside of the outer periphery of the mount 86 provided in the polishing unit 80. In this case, the position of the shape measuring instrument 110 in the Y-axis direction and the Z-axis direction can be adjusted by the movement mechanism 62 (see FIG. 1). Furthermore, when the rotation drive source 94 is operated, the shape measuring instrument 110 revolves around the rotation axis 96 along a circular revolving path that is approximately parallel to the horizontal plane (XY plane). This allows the shape measuring instrument 110 to be positioned at any position on the revolving path.

[0082] However, there are no limitations on the installation method of the shape measuring device 110. For example, the shape measuring device 110 may be attached to the mount 48 (see FIG. 1) of the grinding units 42A, 42B. In this case, the position of the shape measuring device 110 in the Z-axis direction can be adjusted by the movement mechanisms 32A, 32B (see FIG. 1). Furthermore, by operating the rotation drive source 56 (see FIG. 3), the shape measuring device 110 revolves around the rotation axis 58 along a circular revolving path that is approximately parallel to the horizontal plane (XY plane). Furthermore, the shape measuring device 110 may be connected to a movement mechanism such as a revolving arm that is provided separately and independently from the grinding units 42A, 42B and the polishing unit 80.

[0083] When measuring the shape of the holding surface 20a of the chuck table 20, the shape measuring instrument 110 is positioned so as to overlap with the holding surface 20a in the Z-axis direction. Then, the chuck table 20 and the shape measuring instrument 110 are moved relatively in the horizontal direction, and the shape measuring instrument 110 continuously or intermittently measures the height position of the holding surface 20a. In this way, the shape of the holding surface 20a is measured. The positional relationship between the chuck table 20 and the shape measuring instrument 110 can also be adjusted by moving the chuck table 20 with the movement mechanism 18 (see FIG. 1). In this case, the shape measuring instrument 110 does not necessarily have to be connected to the mounts 48, 86 or a dedicated movement mechanism. The measurement of the shape of the holding surface 20a by the shape measuring instrument 110 will be described in detail below.

[0084] The shaping mechanism 120 includes a shaping member (dressing member) 122 that comes into contact with the polishing surface 88a of the polishing pad 88 to shape the polishing surface 88a. For example, the shaping member 122 is a plate-shaped or columnar grindstone that includes a metal substrate and abrasive grains made of diamond or the like that are electrodeposited on the substrate. The upper surface of the shaping member 122 forms a shaping surface 122a that comes into contact with the polishing surface 88a, and the abrasive grains contained in the shaping member 122 are moderately exposed from the shaping surface 122a.

[0085] The shaping mechanism 120 shapes the polishing surface 88a of the polishing pad 88 with the shaping surface 122a of the shaping member 122 by moving and rotating the shaping member 122. For example, the shaping mechanism 120 includes a support base 124 that supports each of the components that make up the shaping mechanism 120.

[0086] An elevating mechanism 126 is installed on the support base 124, which moves (lifts) the shaping member 122 along a first direction (Z-axis direction) that intersects with the holding surface 20a and the polishing surface 88a. For example, the elevating mechanism 126 is configured by an air cylinder, and includes a cylindrical cylinder 128 and a rod 130 housed in the cylinder 128. The tip (upper end) of the rod 130 protrudes upward from the upper end of the cylinder 128, and a support member 132 is fixed to the tip of the rod 130.

[0087] A piston (not shown) that divides the interior of the cylinder 128 into a first chamber and a second chamber is built into the cylinder 128, and the rod 130 is fixed to the piston. The pressure of the air supplied to the first chamber and the second chamber can be controlled by a pressure regulator or the like, so that the rod 130 can be moved upward (in the direction of being ejected from the cylinder 128) and downward (in the direction of being accommodated in the cylinder 128). This causes the rod 130 and the support member 132 to move up and down along the Z-axis direction.

[0088] A rotation mechanism 134 that rotates the shaping member 122 is installed on the support member 132. For example, the rotation mechanism 134 includes a cylindrical spindle 136 and a rotation drive source 138 such as a motor connected to the base end (lower end) of the spindle 136. A base 140 that supports the shaping member 122 is fixed to the tip end (upper end) of the spindle 136. The shaping member 122 is fixed to the base 140 so that the shaping surface 122a is exposed upward. When the rotation drive source 148 is operated, the shaping member 122, the spindle 136, and the base 140 rotate around a rotation axis that is approximately parallel to the Z-axis direction.

[0089] The shaping mechanism 120 also includes a displacement measuring device 142 that measures the amount of displacement of the shaping member 122. The displacement measuring device 142 directly or indirectly measures the amount of displacement (amount of change in position) of the shaping member 122 in a first direction (Z-axis direction) that intersects with the holding surface 20a and the polishing surface 88a.

[0090] For example, the displacement measuring device 142 is configured by a laser displacement meter and is installed on the support base 124. The shaping mechanism 120 also includes a reference member 144 that functions as a reference for the displacement of the shaping member 122. The reference member 144 is configured from a material that is reflective to the light (laser beam) irradiated from the displacement measuring device 142. The reference member 144 is fixed to any component of the shaping mechanism 120 that moves up and down together with the shaping member 122 so that it overlaps with the displacement measuring device 142 in the Z-axis direction. FIG. 4 illustrates an example in which the reference member 144 is fixed to the support member 132.

[0091] When the shaping member 122 moves up and down along the Z-axis direction by the lifting mechanism 126 or by application of an external force, the reference member 144 also moves up and down in conjunction with the shaping member 122. That is, the amount of displacement of the shaping member 122 is equal to the amount of displacement of the reference member 144. The displacement measuring device 142 receives light reflected by the lower surface of the reference member 144 and measures the amount of displacement of the reference member 144 in the Z-axis direction. This indirectly measures the displacement of the shaping member 122.

[0092] In addition, a moving mechanism (shaping moving mechanism) 146 that moves the shaping mechanism 120 along a second direction (horizontal direction, XY plane direction) that intersects with the first direction (Z-axis direction) is connected to the shaping mechanism 120. For example, the moving mechanism 146 is a ball screw type moving mechanism that includes a ball screw arranged along the X-axis direction or the Y-axis direction and a pulse motor that rotates the ball screw. The specific configuration of the ball screw type moving mechanism is similar to that of the moving mechanisms 32A, 32B and the moving mechanism 62 (see FIG. 1). The moving mechanism 146 is connected to the support base 124 of the shaping mechanism 120.

[0093] When the moving mechanism 146 is operated, the support base 124 and the components supported by the support base 124 move in the horizontal direction, thereby controlling the relative positional relationship between the polishing pad 88 and the shaping member 122 in the horizontal direction.

[0094] The configurations of the shaping mechanism 120 and the moving mechanism 146 can be changed as appropriate within a range that allows movement and rotation of the shaping member 122. For example, the shaping mechanism 120 may further include an inclination adjustment mechanism that adjusts the inclination angle of the shaping member 122.

[0095] Next, a specific example of a polishing surface shaping method for shaping the polishing surface 88a of the polishing pad 88 using the processing device 2 will be described. Fig. 5 is a flowchart showing the polishing surface shaping method according to this embodiment. The polishing surface shaping method according to this embodiment includes a holding surface measuring step S1 for measuring the shape of the holding surface 20a of the chuck table 20, and a shaping step S2 for shaping the polishing surface 88a of the polishing pad 88 in accordance with the shape of the holding surface 20a, thereby making the shape of the polishing surface 88a correspond to the shape of the holding surface 20a. The polishing surface shaping method according to this embodiment also optionally includes a polishing surface shape specifying step S3 for specifying the shape of the polishing surface 88a after shaping based on the amount of displacement of the shaping member 122.

[0096] Fig. 6 is a partial cross-sectional side view showing the processing apparatus 2 in the holding surface measuring step S1. Fig. 6 shows a block diagram showing the functional configuration of the controller 100 in addition to the chuck table 20, the polishing unit 80, the polishing pad 88, the rotation drive source 94, and the shape measuring instrument 110. The controller 100 includes a processing unit 150 that executes processes required for shaping the polishing surface 88a of the polishing pad 88, and a storage unit (memory) 160 that stores various information (data, programs, etc.) used for shaping the polishing surface 88a of the polishing pad 88.

[0097] The processing unit 150 includes a holding surface shape specifying unit 152, a shaping condition setting unit 154, and a polishing surface shape specifying unit 156. The holding surface shape specifying unit 152 specifies the shape of the holding surface 20a of the chuck table 20 and stores information about the shape of the holding surface 20a (holding surface shape information) in a holding surface shape memory unit 162 included in the memory unit 160. The shaping condition setting unit 154 sets shaping conditions for shaping the polishing surface 88a of the polishing pad 88 into a predetermined shape and stores information about the shaping conditions (shaping condition information) in a shaping condition memory unit 164 included in the memory unit 160. The polishing surface shape specifying unit 156 specifies the shape of the polishing surface 88a after shaping and stores information about the shape of the polishing surface 88a after shaping (polishing surface shape information) in a polishing surface shape memory unit 166 included in the memory unit 160.

[0098] The processing unit 150 also includes a shaping control unit 158 ​​that controls the shaping of the polishing surface 88a of the polishing pad 88. The shaping control unit 158 ​​is connected to the components of the processing device 2 that are used to shape the polishing surface 88a. The shaping control unit 158 ​​outputs control signals to each component to control the operation of each component, causing the processing device 2 to shape the polishing surface 88a of the polishing pad 88.

[0099] In the holding surface measuring step S1, first, with no workpiece 11 placed on the holding surface 20a of the chuck table 20, the angle of the chuck table 20 is adjusted so that the rotation axis 28 of the chuck table 20 is approximately parallel to the Z-axis direction. Also, the positional relationship between the chuck table 20 and the shape measuring device 110 is adjusted. For example, a control signal is output from the shaping control unit 158 ​​to the movement mechanism 18 and / or the movement mechanism 62 (see FIG. 1), and the chuck table 20 and the polishing unit 80 are positioned so that the center (rotation axis 28) of the holding surface 20a of the chuck table 20 and the turning path of the shape measuring device 110 overlap in the Z-axis direction.

[0100] Next, a control signal is output from the shaping control unit 158 ​​to the rotary drive source 94 and the shape measuring device 110. This activates the shape measuring device 110 and starts measuring the height position of the holding surface 20a. Also, the rotary drive source 94 is activated to rotate the spindle 84, and the shape measuring device 110 turns while measuring the height position of the holding surface 20a.

[0101] 7 is a plan view showing the chuck table 20 and the shape measuring instrument 110. For example, the shape measuring instrument 110 rotates along an arc-shaped path 110a so as to pass directly above the center O of the holding surface 20a of the chuck table 20. Then, by rotating the shape measuring instrument 110 while operating it, the height position of the holding surface 20a is measured at multiple points that overlap with the path 110a.

[0102] If the holding surface 20a side of the chuck table 20 is conical, the height position of the holding surface 20a can be measured at two or more points that are different distances from the center O of the holding surface 20a, thereby calculating the inclination of the holding surface 20a and identifying the shape of the holding surface 20a. Therefore, for example, in the holding surface measurement step S1, the path 110a of the shape measuring instrument 110 is set so as to overlap with the center O of the holding surface 20a and measurement points P1 and P2 that are located between the center O and the outer periphery of the holding surface 20a. Then, the height position of the holding surface 20a is measured at three points: the center O and the measurement points P1 and P2.

[0103] However, the measurement conditions for the holding surface 20a by the shape measuring instrument 110 can be set appropriately depending on the specifications of the chuck table 20, etc. For example, the shape measuring instrument 110 may continuously measure the height position of the holding surface 20a along the path 110a. Also, the position of the measurement point can be adjusted by rotating the chuck table 20 with a rotary drive source 26 (see FIG. 6).

[0104] 6, information on the height position of the holding surface 20a measured by the shape measuring instrument 110 is input to a holding surface shape specifying unit 152 of the processing unit 150. Then, the holding surface shape specifying unit 152 specifies the shape of the holding surface 20a based on the measurement result by the shape measuring instrument 110, and generates information on the shape of the holding surface 20a (holding surface shape information). The holding surface shape information acquired by the holding surface shape specifying unit 152 is stored in a holding surface shape storage unit 162.

[0105] There are no limitations on the format or type of the holding surface shape information. For example, the holding surface shape specifying unit 152 calculates an approximation surface that approximates the shape of the holding surface 20a from the height position of the holding surface 20a measured by the shape measuring instrument 110, and stores the approximation surface in the holding surface shape storage unit 162 as holding surface shape information. Specifically, assuming that the holding surface 20a side of the chuck table 20 is conical, when the height positions of three points (center O and measurement points P1 and P2) on the holding surface 20a are measured as shown in FIG. 7, the holding surface shape specifying unit 152 calculates a cone whose apex is the center O and whose side faces include measurement points P1 and P2. The side faces of the cone calculated in this way correspond to the approximation surface that approximates the holding surface 20a, and are used as holding surface shape information.

[0106] However, the holding surface shape specifying unit 152 may store the height positions of the holding surface 20a measured by the shape measuring instrument 110 as holding surface shape information in the holding surface shape storage unit 162. For example, when height positions are continuously measured along a path from the center of the holding surface 20a to the outer periphery, the height positions of the holding surface 20a measured by the shape measuring instrument 110 correspond directly to the shape of the holding surface 20a. In this case, a collection of height positions of the holding surface 20a measured by the shape measuring instrument 110 can also be used as holding surface shape information.

[0107] Next, the polishing surface 88a of the polishing pad 88 is shaped in accordance with the shape of the holding surface 20a of the chuck table 20 measured in the holding surface measuring step S1 (shaping step S2). Figure 8 is a partial cross-sectional side view showing the processing device 2 in the shaping step S2.

[0108] In the shaping step S2, the polishing surface 88a of the polishing pad 88 is shaped by the shaping mechanism 120. Specifically, first, a control signal is output from the shaping control unit 158 ​​to the moving mechanism 62 (see FIG. 1) and / or the moving mechanism 146, and the positional relationship between the polishing pad 88 and the shaping mechanism 120 is adjusted so that the shaping mechanism 120 is positioned below the polishing pad 88.

[0109] Furthermore, the shaping condition setting unit 154 sets shaping conditions (processing conditions) when the shaping mechanism 120 shapes the polishing surface 88a of the polishing pad 88. Specifically, the shaping condition setting unit 154 selects shaping conditions for shaping the polishing surface 88a of the polishing pad 88 into a shape corresponding to the holding surface 20a of the chuck table 20, based on the holding surface shape information stored in the holding surface shape storage unit 162.

[0110] More specifically, the shaping condition setting unit 154 selects shaping conditions so that recesses (grooves) 88b corresponding to the holding surface 20a of the chuck table 20 are formed on the polishing surface 88a side of the polishing pad 88. Examples of polishing conditions selected by the shaping condition setting unit 154 include the movement speed, movement amount, and rotation speed of the polishing pad 88, and the movement speed, movement amount, and rotation speed of the shaping member 122. The shaping conditions set by the shaping condition setting unit 154 are then stored in the shaping condition storage unit 164.

[0111] Next, the shaping control unit 158 ​​reads out the shaping conditions stored in the shaping condition storage unit 164 and controls each component of the processing device 2 so that the polishing surface 88a of the polishing pad 88 is shaped in accordance with the shaping conditions. Specifically, first, the shaping control unit 158 ​​outputs a control signal to the lifting mechanism 126 of the shaping mechanism 120 to fix the shaping member 122 in an elevated position. For example, if the shaping member 122 is configured by an air cylinder, high-pressure air is supplied to the cylinder 128, and the rod 130 is maintained in a state projected from the cylinder 128.

[0112] Then, the shaping control unit 158 ​​outputs a control signal to at least one of the moving mechanism 62 (see FIG. 1), the rotary drive source 94, the rotary drive source 138, and the moving mechanism 146, causing the shaping mechanism 120 to shape the polishing surface 88a of the polishing pad 88 under the shaping conditions set by the shaping condition setting unit 154. As a result, with the polishing pad 88 and the shaping member 122 rotating, the polishing surface 88a of the polishing pad 88 comes into contact with the shaping surface 122a of the shaping member 122. As a result, a recess 88b corresponding to the holding surface 20a of the chuck table 20 is formed on the polishing surface 88a side of the polishing pad 88.

[0113] For example, by controlling the moving mechanism 62 (see FIG. 1) and / or the moving mechanism 146, the relative moving speed and moving distance in the horizontal direction (XY plane direction) of the polishing pad 88 and the shaping member 122 can be adjusted. This allows the shaping surface 122a to contact a desired position on the polishing surface 88a, and recesses 88b to be formed at any position and in any range on the polishing pad 88.

[0114] Furthermore, by controlling the moving mechanism 62 (see FIG. 1), the relative moving speed and moving distance in the Z-axis direction of the polishing pad 88 and the shaping member 122 are adjusted. Furthermore, by controlling the rotary drive source 94 and the rotary drive source 138, the rotation speed of the polishing pad 88 and the rotation speed of the shaping member 122 are respectively adjusted. This makes it possible to adjust the depth of the recesses 88b in the contact area where the polishing surface 88a and the shaping surface 122a come into contact, and to form recesses 88b of any desired depth in the polishing pad 88. Note that, during shaping of the polishing surface 88a, the angle of the shaping member 122 may be adjusted as appropriate depending on the shape of the recesses 88b.

[0115] When shaping the polishing surface 88a of the polishing pad 88, for example, the relative movement speed in the Z-axis direction between the polishing pad 88 and the shaping member 122 is adjusted so that the pressure (pressing force) applied from the shaping member 122 to the polishing surface 88a is 100 N or more and 200 N. However, the pressing force can be set appropriately depending on the material of the polishing pad 88, etc.

[0116] As described above, the polishing surface 88a of the polishing pad 88 is shaped by the shaping mechanism 120 under predetermined shaping conditions, and a recess 88b of a desired shape is formed on the polishing surface 88a side of the polishing pad 88. For example, the diameter of the polishing pad 88 (the diameter of the polishing layer 92) is set to be at least twice the diameter of the workpiece 11. Then, while rotating the polishing pad 88 and the shaping member 122, the polishing surface 88a and the shaping member 122 are moved relative to each other while the polishing surface 88a and the shaping surface 122a are brought into contact with each other. The rotation speed, moving distance, moving speed, etc. of the polishing pad 88 and the shaping member 122 at this time are set based on the shaping conditions selected by the shaping condition setting unit 154. As a result, an annular recess 88b corresponding to the holding surface 20a of the chuck table 20 is formed on the polishing surface 88a side of the polishing pad 88.

[0117] The annular recess 88b is formed concentrically with the polishing surface 88a along the circumferential direction of the polishing surface 88a. The recess 88b is also formed in a triangular shape in cross section to correspond to the holding surface 20a of the chuck table 20. Therefore, the thickness of the region between the center and outer periphery of the polishing pad 88 is thinner than the thickness at the center and outer periphery of the polishing pad 88. The shaping conditions are set so that the inclination of the side surface (inner wall) of the recess 88b is equal to the inclination of the holding surface 20a of the chuck table 20. This causes the cross-sectional shape of the holding surface 20a to match the cross-sectional shape of the recess 88b.

[0118] However, the cross-sectional shape of the holding surface 20a of the chuck table 20 and the cross-sectional shape of the polishing surface 88a of the polishing pad 88 after shaping (the cross-sectional shape of the recess 88b) do not necessarily have to be completely identical. For example, the bottom of the recess 88b corresponding to the apex of the holding surface 20a may be formed in a rounded shape (R-shape). Furthermore, the side surface (inner wall) of the recess 88b corresponding to the inclined surface of the holding surface 20a may be formed in a slightly curved shape. In this case, the side surface of the recess 88b may be curved in an upward convex shape or a downward convex shape.

[0119] As described above, by carrying out the shaping step S2, the polishing surface 88a of the polishing pad 88 is shaped under shaping conditions that correspond to the shape of the holding surface 20a of the chuck table 20. As a result, a recess 88b that corresponds to the shape of the holding surface 20a of the chuck table 20 is formed on the polishing surface 88a side of the polishing pad 88. This recess 88b corresponds to a groove into which the holding surface 20a side of the chuck table 20 can be fitted.

[0120] After the shaping step S2 is performed, a polishing surface shape specifying step S3 may be performed to specify the shape of the polishing surface 88a of the shaped polishing pad 88. Figure 9 is a partial cross-sectional side view showing the processing apparatus 2 in the polishing surface shape specifying step S3.

[0121] In the polishing surface shape specifying step S3, first, a control signal is output from the shaping control unit 158 ​​to the lifting mechanism 126, and the shaping member 122 is brought into a state in which it can be raised and lowered by the application of an external force. Specifically, the air supplied to the cylinder 128 is reduced in pressure to the extent that the rod 130 remains projected from the cylinder 128. As a result, when a downward external force is applied to the rod 130, it descends in the direction of being accommodated in the cylinder 128, and when the application of the external force is released, it ascends in the direction of being projected from the cylinder 128. In other words, the rod 130 is brought into a state in which it operates like a spring that expands and contracts when an external force is applied and released.

[0122] Furthermore, a control signal is output from the shaping control unit 158 ​​to the displacement measuring instrument 142, which then operates. This causes the displacement measuring instrument 142 to start monitoring the amount of displacement in the Z-axis direction of the shaping member 122. The displacement measuring instrument 142 then continuously measures the amount of displacement of the reference member 144, which moves up and down in conjunction with the shaping member 122, thereby indirectly monitoring the amount of displacement of the shaping member 122.

[0123] Furthermore, with the rotation of the polishing pad 88 and the shaping member 122 maintained, a control signal is output from the shaping control unit 158 ​​to the moving mechanism 62 (see FIG. 1) and the moving mechanism 146, and the positional relationship between the polishing pad 88 and the shaping mechanism 120 is adjusted so that the shaping surface 122a of the shaping member 122 comes into contact with the shaped polishing surface 88a. Then, with the polishing surface 88a and the shaping surface 122a in contact with each other, the polishing pad 88 and the shaping member 122 move relatively in the horizontal direction.

[0124] For example, the shaping member 122 is moved by the moving mechanism 146 along a linear path connecting the center and outer periphery of the polishing surface 88a. At this time, the rod 130 moves up and down (extends and contracts) according to the depth of the recess 88b so that the shaping member 122 and the polishing surface 88a are maintained in contact with each other. As a result, the shaping member 122 moves up and down so as to trace the polishing surface 88a, and successively comes into contact with multiple positions on the polishing surface 88a.

[0125] The pressure (pressing force) applied by the shaping member 122 to the polishing surface 88a is set to, for example, 1 / 5 or less, preferably 1 / 10 or less, and more preferably 1 / 20 or less of the pressing force applied when shaping the polishing surface 88a (shaping step S2). Typically, the pressure of the air supplied to the cylinder 128 is adjusted so that the shaping member 122 applies a pressing force of about 10 N to the polishing surface 88a. However, the pressing force can be set appropriately depending on the material of the polishing pad 88, etc. Furthermore, the rotation of the polishing pad 88 and the shaping member 122 may be slowed down or stopped within a range that allows the shaping member 122 to move smoothly while remaining in contact with the polishing surface 88a.

[0126] Then, while the shaping member 122 moves along the polishing surface 88a, the displacement amount of the shaping member 122 (reference member 144) in the Z-axis direction is measured by the displacement measuring device 142. The displacement amount of the shaping member 122 at this time corresponds to the shape of the shaped polishing surface 88a. The displacement amount of the shaping member 122 measured by the displacement measuring device 142 is input to the polishing surface shape specifying unit 156 of the controller 100.

[0127] The polishing surface shape specifying unit 156 specifies the shape of the polishing surface 88a based on the amount of displacement of the shaping member 122 measured by the displacement measuring device 142, and generates information on the shape of the polishing surface 88a (polishing surface shape information). The polishing surface shape information acquired by the polishing surface shape specifying unit 156 is then stored in the polishing surface shape storage unit 166. Note that the holding surface shape specifying unit 152 may use the amount of displacement of the shaping member 122 measured by the displacement measuring device 142 as the polishing surface shape information as is, or may use information obtained by performing predetermined data processing on the amount of displacement of the shaping member 122 as the polishing surface shape information.

[0128] In the above description, the displacement of the reference member 144 is measured by the displacement measuring device 142. However, depending on the material of the polishing pad 88, the height position of the polishing surface 88a may be directly measured by the displacement measuring device 142. In this case, the height position of the polishing surface 88a may be directly measured by the displacement measuring device 142, and the height position of the polishing surface 88a may be input to the polishing surface shape specifying unit 156.

[0129] As described above, by performing the polishing surface shape specifying step S3 to specify the shape of the polishing surface 88a after shaping, it is possible to confirm afterward whether the polishing surface 88a has been shaped into the desired shape in the shaping step S2. Furthermore, after performing the polishing surface shape specifying step S3, by reading and referencing the holding surface shape information, shaping condition information, and polishing surface shape information stored in the holding surface shape memory unit 162, the shaping condition memory unit 164, and the polishing surface shape memory unit 166, respectively, it is possible to verify afterward the degree of agreement between the shape of the holding surface 20a and the shape of the polishing surface 88a after shaping, the relationship between the shape of the holding surface 20a and the shaping conditions, and the relationship between the shaping conditions and the shape of the polishing surface 88a after shaping, etc. This makes it possible to evaluate the shaping of the polishing surface 88a, review the shaping conditions, etc., and improve the shaping accuracy.

[0130] There is no limitation on the timing at which the above-described holding surface measuring step S1 through polishing surface shape specifying step S3 are performed. For example, while the processing device 2 is in operation, the holding surface measuring step S1 through polishing surface shape specifying step S3 are performed at a timing when the workpiece 11 is not being ground or polished (during setup, while the workpiece 11 is being transported, while the workpiece 11 is being cleaned, etc.). Furthermore, the holding surface measuring step S1 through polishing surface shape specifying step S3 may be performed immediately after the chuck table 20 is replaced or during maintenance of the processing device 2.

[0131] After the shaping of the polishing surface 88a of the polishing pad 88 is completed, the workpiece 11 is polished as described above. Specifically, the workpiece 11 is held by the chuck table 20, and after rough grinding and finish grinding are performed on the workpiece 11, the chuck table 20 is positioned in the polishing region D (see FIG. 1). Then, the workpiece 11 is polished by the shaped polishing pad 88.

[0132] 10 is a partial cross-sectional side view showing the processing device 2 that polishes the workpiece 11. When polishing the workpiece 11, the positional relationship between the chuck table 20 and the polishing pad 88 is adjusted so that the back surface 11b (the surface to be processed) of the workpiece 11 overlaps with the recessed portion 88b formed in the polishing pad 88 in the Z-axis direction.

[0133] Then, while the chuck table 20 is rotated around the rotation axis 28 and the polishing pad 88 is rotated around the rotation axis 96, the polishing pad 88 is lowered and the workpiece 11 and the polishing pad 88 are moved relatively so as to approach each other (processing feed). As a result, the polishing surface 88a of the polishing pad 88 comes into contact with the back surface 11b of the workpiece 11, and the back surface 11b side of the workpiece 11 is polished.

[0134] As described above, the polishing surface 88a of the polishing pad 88 is shaped to correspond to the holding surface 20a of the chuck table 20. Therefore, the shape of the back surface 11b of the workpiece 11 held by the holding surface 20a of the chuck table 20 also corresponds to the shape of the polishing surface 88a. When the polishing pad 88 is pressed against the workpiece 11, the back surface 11b of the workpiece 11 enters the recess 88b, and the entire back surface 11b comes into contact with the side surface (inner wall) of the recess 88b. This allows the polishing pad 88 to be pressed uniformly against the back surface 11b of the workpiece 11. As a result, localized polishing of the workpiece 11 is less likely to occur, and thickness variations of the workpiece 11 after polishing are reduced.

[0135] When the polishing pad 88 is pressed against the rear surface 11b of the workpiece 11, the flexible polishing layer 92 deforms to conform to the rear surface 11b of the workpiece 11. Therefore, even if the cross-sectional shape of the rear surface 11b of the workpiece 11 does not completely match the cross-sectional shape of the recess 88b, the polishing surface 88a can be brought into contact with the entire rear surface 11b of the workpiece 11 due to the deformation of the polishing layer 92.

[0136] As described above, in the processing apparatus 2 and polished surface shaping method according to this embodiment, the shape of the holding surface 20a of the chuck table 20 is measured, and the polishing surface 88a of the polishing pad 88 is shaped in accordance with the shape of the holding surface 20a. This makes it possible to make the shape of the polishing surface 88a of the polishing pad 88 correspond to the shape of the holding surface 20a of the chuck table 20, reducing in-plane variations in the polishing rate (amount of workpiece 11 polished per unit time) when the workpiece 11 is held by the chuck table 20 and polished with the polishing pad 88, and also reducing variations in the thickness of the workpiece 11 after polishing.

[0137] The polished surface shaping method according to this embodiment is realized by the controller 100 (see FIG. 6, etc.) executing a program. Specifically, the storage unit 160 of the controller 100 stores a program for causing the processing device 2 to execute the holding surface measuring step S1 to the polished surface shape specifying step S3. This program includes instructions for causing the controller 100 to generate control signals to be output to each component of the processing device 2 in order to realize the holding surface measuring step S1 to the polished surface shape specifying step S3.

[0138] When shaping the polishing surface 88a of the polishing pad 88, the controller 100 reads out and executes the above program from the storage unit 160. As a result, a series of processes corresponding to the holding surface measuring step S1 to the polishing surface shape specifying step S3 are executed by the controller 100, and control signals are sequentially output to each component of the processing device 2. As a result, the polishing surface shaping method according to this embodiment is automatically carried out.

[0139] The structure, method, etc. according to this embodiment can be modified as appropriate without departing from the scope of the object of the present invention.

[0140] (Embodiment 2) In the above-described first embodiment, a processing device 2 (see FIG. 1) capable of performing grinding and polishing on a workpiece 11 has been described. However, the processing device according to the present invention may also be a processing device (polishing device) dedicated to performing polishing on a workpiece 11. Below, an example of the configuration of a polishing device to which the present invention can be applied will be described.

[0141] Fig. 11 is a perspective view showing a processing device (polishing device) 200 that polishes a workpiece 11. In Fig. 11, the X-axis direction (first horizontal direction, left-right direction) and the Y-axis direction (second horizontal direction, front-rear direction) are perpendicular to each other. Also, the Z-axis direction (up-down direction, height direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0142] The processing apparatus 200 includes a base 202 that supports or houses each of the components that make up the processing apparatus 200. A rectangular opening 202a is provided on the upper surface of the base 202, with its longitudinal direction aligned with the X-axis direction. Furthermore, a columnar support structure 204 is provided on the upper surface of the rear end of the base 202, aligned with the Z-axis direction.

[0143] A chuck table (holding table) 206 is provided inside the opening 202a to hold the workpiece 11. The upper surface of the chuck table 206 is disposed approximately parallel to the horizontal plane (XY plane) and forms a holding surface 206a that holds the workpiece 11. The holding surface 206a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), and the like provided inside the chuck table 206.

[0144] Further, a movement mechanism 208 is provided inside the opening 202a. The movement mechanism 208 is connected to the chuck table 206 and moves the chuck table 206 along the Y-axis direction. For example, the movement mechanism 208 is a ball screw type movement mechanism.

[0145] Specifically, the moving mechanism 208 includes a support base 210 that supports the components of the moving mechanism 208. A pair of guide rails 212 arranged along the Y-axis direction are provided on the support base 210. A moving table 214 is mounted on the pair of guide rails 212 so as to be slidable along the guide rails 212.

[0146] A nut portion (not shown) is provided on the lower surface (back surface) side of the moving table 214. A ball screw 216 disposed along the Y-axis direction between a pair of guide rails 212 is threadedly engaged with this nut portion. A pulse motor 218 that rotates the ball screw 216 is connected to an end of the ball screw 216. When the ball screw 216 is rotated by the pulse motor 218, the moving table 214 moves in the Y-axis direction along the pair of guide rails 212.

[0147] The chuck table 206 is placed on the moving table 214. A flat table cover 220 is provided around the periphery of the chuck table 206 so as to surround the chuck table 206. Furthermore, accordion-shaped dust-proof and drip-proof covers 222 that are extendable and contractible along the Y-axis direction are provided in front and behind the table cover 220. The table cover 220 and the dust-proof and drip-proof cover 222 close the opening 202a so as to cover the components of the moving mechanism 208.

[0148] When the moving mechanism 208 is operated, the chuck table 206 moves along the Y-axis direction together with the table cover 220 and is positioned at the front end (transport position) or the rear end (polishing position) of the opening 202a. In addition, the chuck table 206 is connected to a rotation drive source (not shown) such as a motor that rotates the chuck table 206 around a rotation axis that is approximately parallel to the Z-axis direction.

[0149] The surface (front surface) of the support structure 204 is disposed along the XZ plane. A moving mechanism 224 that moves a polishing unit 236 (described later) along the Z-axis direction is provided on the surface side of the support structure 204. For example, the moving mechanism 224 is a ball screw type moving mechanism.

[0150] Specifically, the movement mechanism 224 includes a pair of guide rails 226 arranged along the Z-axis direction on the front surface side of the support structure 204. A flat moving plate 228 is attached to the pair of guide rails 226 so as to be slidable along the pair of guide rails 226.

[0151] A nut portion (not shown) is provided on the back surface side (rear surface side) of the moving plate 228. A ball screw 230 is disposed along the Z-axis direction between a pair of guide rails 226 and is threadedly engaged with this nut portion. A pulse motor 232 that rotates the ball screw 230 is connected to an end of the ball screw 230. When the ball screw 230 is rotated by the pulse motor 232, the moving plate 228 moves (moves up and down) along the guide rails 226 in the Z-axis direction.

[0152] A support member 234 is fixed to the surface (front surface) side of the moving plate 228. The support member 234 supports a polishing unit 236 that polishes the workpiece 11. The configuration and function of the polishing unit 236 are similar to those of the polishing unit 80 of the processing apparatus 2 (see FIG. 1, etc.). Specifically, the polishing unit 236 includes a housing 238, a spindle 240, and a mount 242. The polishing pad 88 described above is detachably attached to the underside of the mount 242.

[0153] The processing apparatus 200 also includes a controller (control unit, control section, control device) 244 that controls the processing apparatus 200. The controller 244 is connected to each component of the processing apparatus 200 (such as the chuck table 206, the moving mechanism 208, the moving mechanism 224, and the polishing unit 236). The configuration and functions of the controller 244 are similar to those of the controller 100 of the processing apparatus 2 (see FIG. 1, etc.).

[0154] In the processing apparatus 200, the holding surface 206a of the chuck table 206 may not be flat. For example, depending on the type of workpiece 11 and the specifications of the chuck table 206, the holding surface 206a may be inclined, curved, uneven, etc. Furthermore, manufacturing errors of the chuck table 206 may cause the holding surface 206a to have low flatness.

[0155] Therefore, like the processing apparatus 2, the processing apparatus 200 is also equipped with a shape measuring device 110 and a shaping mechanism 120 (see FIG. 4). The controller 244 controls the moving mechanism 208, the moving mechanism 224, a rotary drive source (not shown) that rotates the chuck table 206, a rotary drive source (not shown) that rotates the polishing pad 88, the shape measuring device 110, the shaping mechanism 120, and the like, thereby measuring the holding surface 206a of the chuck table 206 with the shape measuring device 110 and shaping the polishing surface 88a of the polishing pad 88 with the shaping mechanism 120. This allows the shape of the polishing surface 88a to correspond to the shape of the holding surface 206a of the chuck table 206. The specific method and procedure for shaping the polishing surface 88a of the polishing pad 88 are the same as those in the processing apparatus 2 (see FIGS. 5 to 9).

[0156] The structure, method, etc. according to this embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention. Furthermore, for matters omitted in this embodiment, the description of embodiment 1 can be appropriately cited. [Explanation of symbols]

[0157] 11 Workpiece 11a Surface (first side) 11b Back side (2nd side) 2 Processing equipment (grinding and polishing equipment) 4 Foundation 4a aperture 6. Transport unit (transport mechanism) 8A, 8B Cassette support stand 10A, 10B cassette 12 Alignment mechanism (positioning mechanism) 14 Transport unit (transport mechanism, loading arm) 16 Transport unit (transport mechanism, unloading arm) 18 Moving mechanism 20 Chuck table (holding table) 20a Holding surface 20b Grinding holding area 22 Frame (main body) 22a Top side 22b Recess 22c Channel 24 Retaining member 24a Suction surface 26 Rotation drive source (chuck table rotation drive source) 28 Rotation axis (chuck table rotation axis) 30A,30B Support structure 32A, 32B Movement mechanism (grinding movement mechanism) 34 Guide rail 36 Moving Plate 38 Ball screw 40 Pulse motor 42A, 42B Grinding Unit 44 Housing 46 Spindle 48 Mount 50A, 50B grinding wheels 52 Wheel base 54 Grinding Wheel 54a Grinding surface 56 Rotation drive source (grinding wheel rotation drive source) 58 Rotating shaft (grinding wheel rotating shaft) 60 Support structure 62 Movement mechanism (polishing movement mechanism) 64 Y-axis guide rail 66 Y-axis moving plate 68 Y-axis ball screw 70 Y-axis pulse motor 72 Z-axis guide rail 74 Z-axis moving plate 76 Z-axis ball screw 78 Z-axis pulse motor 80 Polishing Unit 82 Housing 84 Spindle 86 Mount 88 Polishing Pad 88a Polished surface 88b Recess (groove) 90 foundations 92 Polishing layer 94 Rotation drive source (polishing pad rotation drive source) 96 Rotation shaft (polishing pad rotation shaft) 98 Cleaning Unit 100 Controller (control unit, control section, control device) 110 Shape measuring instrument Route 110a 120 Shaping mechanism (dressing mechanism) 122 Shaping components (dressing components) 124 Support stand 126 Lifting mechanism 128 cylinders 130 rods 132 Support member 134 Rotation mechanism 136 Spindle 138 Rotational drive source 140 Foundation 142 Displacement measuring instrument 144 Reference Member 146 Movement mechanism (shaping movement mechanism) 150 Processing section 152 Holding surface shape identification part 154 Formatting Condition Setting Section 156 Polished surface shape identification part 158 Shaping Control Unit 160 Memory 162 Holding surface shape memory part 164 Shaping condition storage section 166 Polished surface shape memory part 200 Processing equipment (polishing equipment) 202 Foundation 202a aperture 204 Support structure 206 Chuck table (holding table) 206a Holding surface 208 Moving mechanism 210 Support stand 212 Guide Rail 214 Mobile Table 216 Ball screw 218 Pulse motor 220 Table Cover 222 Dustproof and drip-proof cover 224 Moving mechanism 226 Guide Rail 228 Moving Plate 230 Ball screw 232 Pulse motor 234 Support member 236 Polishing Unit 238 Housing 240 spindle 242 Mount 244 Controller (control unit, control section, control device)

Claims

1. a chuck table having a holding surface for holding a workpiece; a chuck table rotation drive source that rotates the chuck table about a rotation axis that intersects with the holding surface; a polishing unit to which a polishing pad having a polishing surface for polishing the workpiece is attached; a polishing pad rotation drive source that rotates the polishing pad about a rotation axis that intersects with the polishing surface; a polishing movement mechanism that moves the chuck table and the polishing pad relatively along a first direction that intersects with the holding surface and the polishing surface; a shape measuring device for measuring the shape of the holding surface; a shaping mechanism that contacts the polishing surface to shape the polishing surface; a shaping movement mechanism that relatively moves the polishing pad and the shaping mechanism along a second direction that intersects with the first direction; a controller that controls the shaping of the polishing surface by the shaping mechanism in accordance with the shape of the holding surface measured by the shape measuring device, thereby causing the shape of the polishing surface to correspond to the shape of the holding surface.

2. 2. The processing apparatus according to claim 1, wherein the diameter of the polishing pad is at least twice the diameter of the workpiece.

3. the shaping mechanism includes a shaping member that contacts the polishing surface to shape the polishing surface, and a displacement measuring device that measures a displacement amount of the shaping member in the first direction; 3. The processing apparatus according to claim 1, wherein the controller determines the shape of the polishing surface based on the amount of displacement of the shaping member measured by the displacement measuring device when the shaping member is brought into contact with a plurality of positions on the polishing surface.

4. a holding surface measuring step of measuring the shape of the holding surface of the chuck table that holds the workpiece; a shaping step of bringing a shaping member that shapes the polishing surface into contact with the polishing surface of a polishing pad that polishes the workpiece, thereby shaping the polishing surface in accordance with the shape of the holding surface measured in the holding surface measurement step, thereby making the shape of the polishing surface correspond to the shape of the holding surface.

5. The polished surface shaping method according to claim 4, further comprising a polished surface shape specifying step of specifying the shape of the polished surface based on the amount of displacement of the shaping member when the shaping member is brought into contact with multiple positions on the polished surface shaped in the shaping step.

6. The shape of the holding surface side of the chuck table is conical, 6. The method for shaping a polished surface according to claim 4, wherein the shaping step includes shaping the polishing surface so that an annular recess corresponding to the shape of the holding surface is formed on the polishing surface side of the polishing pad.

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