Vibration device

Abstract

To provide a vibration device capable of suppressing deterioration of vibration characteristics of a vibration element.SOLUTION: A vibration device has a vibration element having a vibration board, and a support board for supporting the vibration element. The vibration board has a base section, and a drive vibration arm connected to the base section. The support board has: a first support section and a second support section disposed side by side in a first direction; and a first beam and a second beam that extend in the first direction and connects the first support section and the second support section. The base section and the first beam are joined via a first joining member and the base section and the second beam are joined via a second joining member.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a vibration device. [Background technology]

[0002] The vibration device described in Patent Document 1 has a base with a recess, an angular velocity detection element located in the recess and fixed to the base via a support substrate, and a lid that closes the opening of the recess.

[0003] The angular velocity detection element also has a base located in its center, a pair of detection vibration arms extending from the base in both directions in the Y-axis direction, a pair of connecting arms extending from the base in both directions in the X-axis direction, a pair of drive vibration arms extending from the tip of one connecting arm in both directions in the Y-axis direction, and a pair of drive vibration arms extending from the tip of the other connecting arm in both directions in the Y-axis direction.The angular velocity detection element is fixed to a support substrate at the base.In this angular velocity detection element, when an angular velocity around the detection axis is applied while the four drive vibration arms are driven to vibrate, detection vibrations are excited in the pair of detection vibration arms by Coriolis force.The angular velocity around the detection axis is then detected based on detection signals output from each detection vibration arm due to the detection vibrations.

[0004] On the other hand, the support substrate has a gimbal structure and includes a frame-shaped frame portion, a frame-shaped base fixing portion disposed outside the frame portion and joined to the base, an element mounting portion disposed inside the frame portion and joined to the angular velocity sensing element, a pair of first beams extending from the element mounting portion on both sides in the A-axis direction and connecting the element mounting portion and the frame portion, and a pair of second beams extending from the frame on both sides in the B-axis direction and connecting the frame portion and the base fixing portion. Such a support substrate absorbs and relieves stress caused by deformation of the base, making it difficult for the stress to be transmitted to the angular velocity sensing element. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-032841 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the support substrate described in Patent Document 1, the angular velocity sensing element is bonded to a single element mounting portion, making it difficult to mitigate deformation and distortion of the base caused by drive vibration, which may result in deterioration of the vibration characteristics of the angular velocity sensing element. [Means for solving the problem]

[0007] The vibration device of the present invention includes: a vibration element having a vibration substrate; a support substrate that supports the vibration element, The vibration substrate is A base and a drive vibration arm connected to the base, The support substrate is a first support portion and a second support portion arranged side by side in a first direction; a first beam and a second beam extending in the first direction and connecting the first support portion and the second support portion; the base portion and the first beam are joined via a first joining member, The base and the second beam are joined via a second joining member.

[0008] The method for manufacturing a vibration device of the present invention includes: a support substrate that supports the vibration element, The vibration substrate is A base and a drive vibration arm connected to the base, The support substrate is a first support portion and a second support portion arranged side by side in a first direction; a first beam and a second beam extending in the first direction and connecting the first support portion and the second support portion; the base portion and the first beam are joined via a first joining member, A method for manufacturing a vibration device in which the base and the second beam are joined via a second joining member, The method includes simultaneously forming the first support portion, the second support portion, the first beam, and the second beam. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view of an angular velocity sensor according to a first embodiment. [Figure 2] 2 is a cross-sectional view showing the angular velocity sensor shown in FIG. 1 in a state before the lid is sealed. [Figure 3] FIG. 2 is a top view showing the angular velocity detection element. [Figure 4] 3A and 3B are schematic diagrams showing drive vibration modes of an angular velocity detection element. [Figure 5] 3A and 3B are schematic diagrams illustrating detection vibration modes of an angular velocity detection element. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. 10 is a top view showing a modified example of the support substrate. [Figure 9] 10A and 10B are schematic diagrams showing deformation of the base portion in a drive vibration mode. [Figure 10] FIG. 2 is a top view showing wiring formed on a support substrate. [Figure 11] FIG. 10 is a top view of a support substrate included in the resonation device according to the second embodiment. [Figure 12] FIG. 12 is a partial enlarged view of the support substrate shown in FIG. [Figure 13] 10 is a top view of a support substrate included in the resonation device according to the third embodiment. FIG. [Figure 14] 14 is a top view showing a state in which an angular velocity detection element is bonded to the support substrate shown in FIG. 13. FIG. [Figure 15] FIG. 10 is a top view of a support substrate included in the resonation device according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The resonation device of the present invention will be described in detail below based on the embodiments shown in the accompanying drawings. For ease of explanation, each figure illustrates three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis. The direction along the X-axis is also referred to as the "X-axis direction," the direction along the Y-axis is also referred to as the "Y-axis direction," and the direction along the Z-axis is also referred to as the "Z-axis direction." The Z-axis is aligned vertically, and the arrow side is also referred to as "up" and the opposite side as "down." In the following, a planar view of the support substrate 4, i.e., a planar view from the Z-axis direction, will also be simply referred to as a "planar view."

[0011] First Embodiment FIG. 1 is a cross-sectional view of an angular velocity sensor according to a first embodiment. FIG. 2 is a cross-sectional view showing the angular velocity sensor shown in FIG. 1 in a state before the lid is sealed. FIG. 3 is a top view showing an angular velocity detection element. FIG. 4 is a schematic diagram showing a drive vibration mode of the angular velocity detection element. FIG. 5 is a schematic diagram showing a detection vibration mode of the angular velocity detection element. FIGS. 6 and 7 are each a top view of a support substrate. FIG. 8 is a top view showing a modified example of the support substrate. FIG. 9 is a schematic diagram showing deformation of the base in the drive vibration mode. FIG. 10 is a top view showing wiring formed on the support substrate.

[0012] The resonator device 1 shown in FIG. 1 is an angular velocity sensor that detects an angular velocity ωz around the Z axis. The resonator device 1 includes an angular velocity detection element 3 as a resonator element that detects the angular velocity ωz, a support substrate 4 that supports the angular velocity detection element 3, a circuit element 5 that controls the driving of the angular velocity detection element 3, and a package 2 that houses these. By arranging the angular velocity detection element 3, the support substrate 4, and the circuit element 5 in the package 2, the angular velocity detection element 3, the support substrate 4, and the circuit element 5 can be protected. Within the package 2, the angular velocity detection element 3, the support substrate 4, and the circuit element 5 are arranged overlapping in the Z axis direction. With this configuration, the expansion of the resonator device 1 in the X axis direction and the Y axis direction, i.e., the footprint, is reduced, allowing the resonator device 1 to be made smaller.

[0013] [Package 2] First, the package 2 will be described. As shown in FIG. 1, the package 2 has a cavity-shaped base 21 having a recess 211 opening to its upper surface, and a plate-shaped lid 22 joined to the upper surface of the base 21 via a seam ring 24 and closing the opening of the recess 211. The package 2 has an internal space S, in which the angular velocity sensing element 3, the support substrate 4, and the circuit element 5 are housed, stacked in the Z-axis direction. This configuration allows the package 2 to protect the angular velocity sensing element 3 and the circuit element 5. The internal space S is also hermetically sealed and in a reduced pressure state, preferably closer to a vacuum. This reduces viscous resistance and improves the vibration characteristics of the angular velocity sensing element 3. However, the atmosphere in the internal space S is not particularly limited.

[0014] 2, a groove 221 is formed on the back surface of the lid 22 before the lid 22 is hermetically sealed, and the inside and outside of the internal space S are in communication with each other via the groove 221. After the internal space S is evacuated via the groove 221, an energy beam EL such as a laser beam is irradiated near the groove 221 of the lid 22 to melt a portion of the lid 22, thereby closing the groove 221. In this way, the internal space S is hermetically sealed. However, the method for hermetically sealing the internal space S is not particularly limited.

[0015] The constituent material of the base 21 is not particularly limited, but various ceramics such as aluminum oxide can be used. The constituent material of the lid 22 is also not particularly limited, but it is preferable that the constituent material has a linear expansion coefficient similar to that of the constituent material of the base 21. For example, if the constituent material of the base 21 is ceramic, it is preferable that the lid 22 be made of an alloy such as Kovar.

[0016] The lid 22 is connected to the ground (reference potential) when the resonation device 1 is in use. Therefore, the lid 22 functions as a shield that blocks external disturbances, and can effectively suppress deterioration of the characteristics of the resonation device 1. However, the present invention is not limited to this, and the lid 22 does not have to be connected to the ground.

[0017] 1, the recess 211 has a first recess 211a that opens to the top surface of the base 21, a second recess 211b that opens to the bottom surface of the first recess 211a and has a smaller opening area than the first recess 211a, and a third recess 211c that opens to the bottom surface of the second recess 211b and has a smaller opening area than the second recess 211b. The circuit element 5 is fixed to the bottom surface of the third recess 211c, and the support substrate 4 is fixed to the bottom surface of the first recess 211a, and the angular velocity detection element 3 is fixed to the support substrate 4.

[0018] Furthermore, a plurality of internal terminals 231 are arranged on the bottom surface of the first recess 211a, a plurality of internal terminals 232 are arranged on the bottom surface of the second recess 211b, and a plurality of external terminals 233 are arranged on the bottom surface of the base 21. The plurality of internal terminals 232 include those electrically connected to the internal terminals 231 via internal wiring (not shown) formed in the base 21 and those electrically connected to the external terminals 233 via the internal wiring. Each internal terminal 231 is electrically connected to the support substrate 4 via a conductive fourth bonding member B4, and each internal terminal 232 is electrically connected to the circuit element 5 via a bonding wire BW. The number and arrangement of the internal terminals 231, 232 and the external terminals 233 are not particularly limited and may be set appropriately depending on, for example, the number of terminals of the angular velocity sensing element 3 and the circuit element 5.

[0019] [Angular velocity sensor 3] Next, we will explain the angular velocity detection element 3. The angular velocity detection element 3 is a quartz crystal vibration element, and as shown in Fig. 3, has a vibration substrate 300 made of quartz crystal and electrodes formed on the surface of the vibration substrate 300. The vibration substrate 300 can be formed by patterning a quartz crystal substrate by dry etching, wet etching, or the like.

[0020] The vibration substrate 300 also has a base 30 located in the center, a pair of detection vibration arms 31 and 32 extending from the base 30 in both directions in the Y-axis direction, a pair of support arms 33 and 34 extending from the base 30 in both directions in the X-axis direction, a pair of drive vibration arms 35 and 36 extending from the tip of one support arm 33 in both directions in the Y-axis direction, and a pair of drive vibration arms 37 and 38 extending from the tip of the other support arm 34 in both directions in the Y-axis direction. The angular velocity detection element 3 is supported by the support substrate 4 at the base 30.

[0021] The angular velocity detection element 3 also has, as electrodes formed on the surface of the vibration substrate 300, a first detection signal electrode E1 arranged on both main surfaces of the detection vibration arm 31, a first detection ground electrode E2 arranged on both side surfaces of the detection vibration arm 31, a second detection signal electrode E3 arranged on both main surfaces of the detection vibration arm 32, a second detection ground electrode E4 arranged on both side surfaces of the detection vibration arm 32, a drive signal electrode E5 arranged on both main surfaces of the drive vibration arms 35, 36 and both side surfaces of the drive vibration arms 37, 38, and a drive ground electrode E6 arranged on both side surfaces of the drive vibration arms 35, 36 and both main surfaces of the drive vibration arms 37, 38.

[0022] Six terminals T1, T2, T3, T4, T5, and T6 are arranged on the underside of the base 30. Although not shown, the terminal T1 is electrically connected to the first detection signal electrode E1, the terminal T2 is electrically connected to the first detection ground electrode E2, the terminal T3 is electrically connected to the second detection signal electrode E3, the terminal T4 is electrically connected to the second detection ground electrode E4, the terminal T5 is electrically connected to the drive signal electrode E5, and the terminal T6 is electrically connected to the drive ground electrode E6.

[0023] The angular velocity detecting element 3 described above detects the angular velocity ωz in the following manner. When a drive signal is applied to the drive signal electrode E5, the drive vibration arms 35, 36 and the drive vibration arms 37, 38 flexurally vibrate in opposite phases in the X-axis direction, as shown in FIG. 4 (hereinafter, this state is also referred to as the "drive vibration mode"). In this state, the vibrations of the drive vibration arms 35, 36 and the drive vibration arms 37, 38 are canceled, or offset, and the detection vibration arms 31, 32 do not substantially vibrate. When an angular velocity ωz is applied to the angular velocity detecting element 3 while it is driven in the drive vibration mode, as shown in FIG. 5, the Coriolis force acts on the drive vibration arms 35, 36, 37, 38, exciting flexural vibration in the Y-axis direction, and the detection vibration arms 31, 32 flexurally vibrate in the X-axis direction in response to this flexural vibration (hereinafter, this state is also referred to as the "detection vibration mode").

[0024] The charge generated in the detection vibration arm 31 by such a detection vibration mode is extracted as a first detection signal from the first detection signal electrode E1, and the charge generated in the detection vibration arm 32 is extracted as a second detection signal from the second detection signal electrode E3, and the circuit element 5 determines the angular velocity ωz based on these first and second detection signals.

[0025] The angular velocity detection element 3 has been described above. However, the configuration of the angular velocity detection element 3 is not particularly limited as long as it includes at least one drive vibration arm having a drive signal electrode and at least one detection vibration arm having a detection signal electrode. For example, the angular velocity detection element 3 may include a base, a pair of drive vibration arms extending from the base toward the positive side of the Y axis direction and aligned in the X axis direction, and a pair of detection vibration arms extending from the base toward the negative side of the Y axis direction and aligned in the X axis direction, and may be configured to detect angular velocity around the Y axis. In this configuration, when an angular velocity around the Y axis is applied while the pair of drive vibration arms are flexurally vibrating in opposite phases in the Z axis direction, the Coriolis force is generated, causing the pair of detection vibration arms to vibrate in opposite phases in the Z axis direction. Then, the charge generated in one detection vibration arm is extracted as a first detection signal, and the charge generated in the other detection vibration arm is extracted as a second detection signal. The circuit element 5 calculates the angular velocity around the Y axis based on these first and second detection signals.

[0026] Furthermore, in this embodiment, a vibration element is applied to the angular velocity detection element 3, but the configuration of the vibration element is not particularly limited. For example, it may be an acceleration detection element that detects acceleration, or it may be a vibration element for an application other than detecting a physical quantity, such as an oscillator that oscillates a predetermined frequency signal. Furthermore, the constituent material of the vibration substrate 300 is not limited to quartz, and may be, for example, a piezoelectric material other than quartz, or a material other than a piezoelectric material, such as silicon. In other words, it may be a MEMS vibration element.

[0027] [Support substrate 4] Next, the support substrate 4 will be described. As shown in Fig. 1, the support substrate 4 is interposed between the angular velocity sensing element 3 and the base 21, and has the function of absorbing and mitigating stress caused by deformation of the base 21, making it difficult for the stress to be transmitted to the angular velocity sensing element 3. The support substrate 4 is located directly below the angular velocity sensing element 3, and supports the angular velocity sensing element 3 from below.

[0028] 6, the support substrate 4 has a frame portion 40 that is rectangular in shape in a plan view, and three beams, a first beam 41, a second beam 42, and a third beam 43, that are arranged within an opening 40a of the frame portion 40. In such a support substrate 4, the lower surfaces of the first support portion 401 and the second support portion 402 are joined to the bottom surface of the first recess 211a via a fourth bonding member B4, and the base 30 of the angular velocity detecting element 3 is joined to the upper surfaces of the first beam 41, the second beam 42, and the third beam 43 via a first bonding member B1, a second bonding member B2, and a third bonding member B3, respectively.

[0029] As shown in FIG. 7 , the frame 40 includes a first support portion 401 and a second support portion 402 arranged side by side in the X-axis direction, which is a first direction. The first support portion 401 is located on the positive side of the X-axis direction and extends in the Y-axis direction. The second support portion 402 is located on the negative side of the X-axis direction and extends in the Y-axis direction. The frame 40 is configured by connecting both ends of the first support portion 401 and the second support portion 402 in the Y-axis direction. In this way, by integrally forming the first support portion 401 and the second support portion 402 as the frame 40, the mechanical strength of the support substrate 4 can be increased. However, this is not limited thereto. For example, as shown in FIG. 8 , the first support portion 401 and the second support portion 402 may be formed separately.

[0030] As shown in FIG. 7 , the first beam 41, the second beam 42, and the third beam 43 each extend straight in the X-axis direction and are arranged side by side at equal intervals in the Y-axis direction. The first beam 41, the second beam 42, and the third beam 43 are connected to the first support portion 401 at their ends on the positive side in the X-axis direction and to the second support portion 402 at their ends on the negative side in the X-axis direction. Of these three beams, the central third beam 43 passes through the center O of the support substrate 4 in a plan view. The first beam 41 and the second beam 42, located on both sides of the third beam 43 in the Y-axis direction, are arranged symmetrically with respect to the third beam 43. This configuration allows the first beam 41, the second beam 42, and the third beam 43 to be arranged in a balanced manner within the opening 40a. Therefore, the angular velocity sensor 3 can be supported by the support substrate 4 in a more stable position. However, the arrangement of the first beam 41, the second beam 42, and the third beam 43 is not particularly limited.

[0031] The base 30 of the angular velocity detecting element 3 is joined to the central portions of the first beam 41, the second beam 42, and the third beam 43 via first, second, and third joining members B1, B2, and B3. Specifically, the base 30 is joined to the central portion of the first beam 41 via two first joining members B1 (B11, B12), the base 30 is joined to the central portion of the second beam 42 via two second joining members B2 (B21, B22), and the base 30 is joined to the central portion of the third beam 43 via two third joining members B3 (B31, B32).

[0032] According to this configuration, the vibration and deformation (strain) occurring in the base 30 during the drive vibration mode can be effectively attenuated by the first beam 41, the second beam 42, and the third beam 43 each independently elastically deforming (flexibly deforming). Therefore, deterioration of the vibration characteristics of the angular velocity detection element 3 can be effectively suppressed, and the angular velocity ωz can be detected more accurately. Specifically, for example, depending on the formation accuracy of the vibration substrate 300, the vibration of the drive vibration arms 35 and 36 and the vibration of the drive vibration arms 37 and 38 may not be completely canceled out during the drive vibration mode, causing the base 30 to vibrate in the X-axis direction or the Y-axis direction. Furthermore, as shown in FIG. 9 , the base 30 deforms so as to repeatedly expand and contract in the X-axis direction in response to the out-of-phase vibration of the drive vibration arms 35 and 36 and the drive vibration arms 37 and 38. Such vibration and deformation of the base 30 can be effectively attenuated by the first beam 41, the second beam 42, and the third beam 43 each independently elastically deforming.

[0033] The support substrate 4 described above is made of quartz crystal. The support substrate 4 is obtained by patterning a quartz crystal substrate using dry etching, wet etching, or the like to integrally form the frame portion 40, the first beam 41, the second beam 42, and the third beam 43. In other words, the method for manufacturing the resonator device 1 includes a step of simultaneously forming the frame portion 40, the first beam 41, the second beam 42, and the third beam 43. This method allows the support substrate 4 to be easily formed with excellent dimensional accuracy. Furthermore, by integrally forming the frame portion 40, the first beam 41, the second beam 42, and the third beam 43 from a quartz crystal substrate, they are made of the same material. Therefore, the linear expansion coefficients of the frame portion 40 and the first, second, and third beams 41, 42, and 43 are equal, and thermal stress due to the difference in linear expansion coefficients between them is less likely to occur in the support substrate 4. This reduces thermal stress on the angular velocity sensing element 3, stabilizing its characteristics.

[0034] As described above, in the vibration device 1 of this embodiment, the support substrate 4 and the vibration substrate 300 of the angular velocity detection element 3 are both made of quartz crystal. In other words, they are made of the same material. By making the support substrate 4 and the vibration substrate 300 of the same material, the linear expansion coefficients of the support substrate 4 and the vibration substrate 300 become equal, and thermal stress due to the difference in linear expansion coefficients between them is less likely to occur. Therefore, thermal stress is less likely to be applied to the angular velocity detection element 3, and the characteristics of the angular velocity detection element 3 are stabilized.

[0035] Furthermore, the support substrate 4 is formed from a quartz crystal substrate with the same cut angle as the vibration substrate 300. In this embodiment, the support substrate 4 and the vibration substrate 300 are formed from Z-cut quartz crystal substrates. Furthermore, the orientation of the crystal axis of the support substrate 4 matches the orientation of the crystal axis of the vibration substrate 300. In other words, the electrical axis, mechanical axis, and optical axis of the support substrate 4 and the vibration substrate 300 are aligned. Since quartz has different linear expansion coefficients in the directions along the electrical axis, mechanical axis, and optical axis, forming the support substrate 4 and the vibration substrate 300 from quartz crystal substrates with the same cut angle and aligning the orientations of their crystal axes further reduces the thermal stress caused by the difference in linear expansion coefficients between the two. This further reduces the thermal stress applied to the angular velocity sensing element 3, further stabilizing the characteristics of the angular velocity sensing element 3.

[0036] However, the configuration of the support substrate 4 is not particularly limited, and may be made of, for example, quartz crystal having a different cut angle from the vibrating substrate 300, or may be made of a material other than quartz crystal, i.e., a material different from the vibrating substrate 300. In this case, examples of the material for the support substrate 4 include silicon and glass. In particular, when a MEMS vibrating element made of silicon is used as the vibrating element, it is preferable that the support substrate 4 is also made of silicon.

[0037] The support substrate 4 described above also functions as a relay substrate for electrically connecting the angular velocity sensing element 3 and the circuit element 5. As shown in Fig. 10, in a plan view, the first beam 41 overlaps with the terminals T1 and T4, and of the two first joint members B1 joining the first beam 41 and the angular velocity sensing element 3, the first joint member B11 contacts the terminal T1 and the first joint member B12 contacts the terminal T4. In addition, the second beam 42 overlaps with the terminals T3 and T6 in a plan view, and of the two second joint members B2 joining the second beam 42 and the angular velocity sensing element 3, the second joint member B21 contacts the terminal T3 and the second joint member B22 contacts the terminal T6. In addition, the third beam 43 overlaps with terminals T2 and T5 in a planar view, and of the two third joining members B3 that join the third beam 43 and the angular velocity detection element 3, the third joining member B31 is in contact with terminal T2, and the third joining member B32 is in contact with terminal T5.

[0038] The support substrate 4 also has formed thereon a wiring L1 electrically connecting the terminal T1 to the corresponding internal terminal 231 via the first bonding member B11 and the fourth bonding member B4, a wiring L4 electrically connecting the terminal T4 to the corresponding internal terminal 231 via the first bonding member B12 and the fourth bonding member B4, a wiring L3 electrically connecting the terminal T3 to the corresponding internal terminal 231 via the second bonding member B21 and the fourth bonding member B4, a wiring L6 electrically connecting the terminal T6 to the corresponding internal terminal 231 via the second bonding member B22 and the fourth bonding member B4, a wiring L2 electrically connecting the terminal T2 to the corresponding internal terminal 231 via the third bonding member B31 and the fourth bonding member B4, and a wiring L5 electrically connecting the terminal T5 to the corresponding internal terminal 231 via the third bonding member B32 and the fourth bonding member B4. In this way, by using the support substrate 4 as a relay substrate for electrically connecting the angular velocity sensing element 3 and the circuit element 5, it becomes easy to electrically connect the angular velocity sensing element 3 and the circuit element 5. For convenience of explanation, the wirings L1 to L6 are shown only in Fig. 10 and are omitted in the other figures.

[0039] The first, second, third, and fourth bonding members B1, B2, B3, and B4 are not particularly limited as long as they have both conductivity and bonding properties, and examples thereof include various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps, and conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide, epoxy, silicone, and acrylic adhesives. Using metal bumps as the first, second, third, and fourth bonding members B1, B2, B3, and B4 can suppress gas generation from the first, second, third, and fourth bonding members B1, B2, B3, and B4, and can effectively suppress environmental changes in the internal space S, particularly pressure increases. On the other hand, if a conductive adhesive is used for the first, second, third and fourth bonding members B1, B2, B3 and B4, the first, second, third and fourth bonding members B1, B2, B3 and B4 become relatively soft, and the first, second, third and fourth bonding members B1, B2, B3 and B4 can also absorb and relieve stress.

[0040] [Circuit element 5] Next, the circuit element 5 will be described. As shown in FIG. 1, the circuit element 5 is fixed to the bottom surface of the third recess 211c via a fixing member such as metal paste or adhesive. The circuit element 5 is also electrically connected to the angular velocity sensing element 3 via the support substrate 4. The circuit element 5 includes a drive circuit 51 that applies a drive signal to drive the angular velocity sensing element 3, and a detection circuit 52 that performs detection processing of the angular velocity ωz based on the first and second detection signals from the angular velocity sensing element 3.

[0041] The above describes the vibration device 1. As described above, the vibration device 1 includes the angular velocity detection element 3, which is a vibration element including the vibration substrate 300, and the support substrate 4 that supports the angular velocity detection element 3. The vibration substrate 300 also includes a base 30 and drive vibration arms 35, 36, 37, and 37 connected to the base 30. The support substrate 4 also includes a first support portion 401 and a second support portion 402 that are arranged side by side in the X-axis direction, which is a first direction, and a first beam 41 and a second beam 42 that extend in the X-axis direction and connect the first support portion 401 and the second support portion 402. The base 30 and the first beam 41 are joined via a first joining member B1, and the base 30 and the second beam 42 are joined via a second joining member B2. With this configuration, the first beam 41 and the second beam 42 independently elastically deform, thereby effectively attenuating vibrations and deformations that occur in the base 30 in the drive vibration mode described above. Therefore, deterioration of the vibration characteristics of the angular velocity detecting element 3 can be effectively suppressed.

[0042] As described above, the support substrate 4 has a frame-shaped frame portion 40 including the first support portion 401 and the second support portion 402, and the first beam 41 and the second beam 42 are disposed inside the frame portion 40. In this way, by integrally forming the first support portion 401 and the second support portion 402 as the frame portion 40, the mechanical strength of the support substrate 4 can be increased.

[0043] As described above, the support substrate 4 has the third beam 43 located between the first beam 41 and the second beam 42. The third beam 43 extends in the X-axis direction and connects the first support portion 401 and the second support portion 402, and the base portion 30 and the third beam 43 are joined via the third joining member B3. With this configuration, the first beam 41, the second beam 42, and the third beam 43 each elastically deform independently, thereby effectively damping the vibration and deformation occurring in the base portion 30 in the drive vibration mode described above. This effectively suppresses deterioration of the vibration characteristics of the angular velocity sensor 3.

[0044] As described above, in the resonator device 1, the resonator substrate 300 and the support substrate 4 are made of the same material. With this configuration, the linear expansion coefficients of the support substrate 4 and the resonator substrate 300 are equal, making it difficult for thermal stress to occur due to the difference in linear expansion coefficients between them. As a result, thermal stress is less likely to be applied to the angular velocity sensing element 3, stabilizing the characteristics of the angular velocity sensing element 3.

[0045] As described above, the resonation device 1 also includes the circuit element 5 electrically connected to the angular velocity sensing element 3 via the support substrate 4. This configuration facilitates electrical connection between the angular velocity sensing element 3 and the circuit element 5.

[0046] As described above, the vibration device 1 has the package 2 that houses the angular velocity detection element 3 and the support substrate 4. This makes it possible to protect the angular velocity detection element 3 and the support substrate 4.

[0047] As described above, the manufacturing method of the vibration device 1 includes the angular velocity sensing element 3, which is a vibration element including the vibration substrate 300, and the support substrate 4 supporting the angular velocity sensing element 3. The vibration substrate 300 includes the base 30 and the drive vibration arms 35, 36, 37, and 38 connected to the base 30. The support substrate 4 includes the first support portion 401 and the second support portion 402 arranged side by side in the X-axis direction, which is a first direction, and the first beam 41 and the second beam 42 extending in the X-axis direction and connecting the first support portion 401 and the second beam 42. The base 30 and the first beam 41 are joined via the first bonding member B1, and the base 30 and the second beam 42 are joined via the second bonding member B2. The manufacturing method of the vibration device 1 includes the steps of simultaneously forming the first support portion 401, the second support portion 402, the first beam 41, and the second beam 42. This method allows the support substrate 4 to be easily formed.

[0048] Second Embodiment Fig. 11 is a top view of a support substrate included in the resonation device according to the second embodiment, and Fig. 12 is a partially enlarged view of the support substrate shown in Fig. 11.

[0049] The resonator device 1 of this embodiment is similar to the resonator device 1 of the first embodiment described above, except that the support substrate 4 has a different configuration. In the following description, the differences between this embodiment and the first embodiment will be mainly described, and similar points will not be described again. In addition, in each drawing of this embodiment, the same components as those in the first embodiment will be denoted by the same reference numerals.

[0050] 11 and 12, in the support substrate 4 of this embodiment, a first widened portion 410 that is widened in the Y-axis direction is formed in the center of the first beam 41. A width W11 of the first widened portion 410 of the first beam 41 is larger than a width W12 of portions located on both sides of the first widened portion 410. The first beam 41 and the base portion 30 of the angular velocity detecting element 3 are joined at the first widened portion 410 via a first joining member B1.

[0051] Similarly, a second widened portion 420 that is widened in the Y-axis direction is formed in the center of the second beam 42. The width W21 of the second widened portion 420 of the second beam 42 is larger than the width W22 of portions located on both sides of the second widened portion 420. At the second widened portion 420, the second beam 42 and the base portion 30 of the angular velocity detecting element 3 are joined via a second joining member B2.

[0052] Similarly, a third widened portion 430 that is widened in the Y-axis direction is formed in the central portion of the third beam 43. The width W31 of the third widened portion 430 of the third beam 43 is larger than the width W32 of portions located on both sides of the third widened portion 430. The third beam 43 and the base 30 of the angular velocity detecting element 3 are joined at the third widened portion 430 via a third joining member B3.

[0053] According to this configuration, compared to the first embodiment described above, the first bonding member B1, the second bonding member B2, and the third bonding member B3 are allowed to be misaligned in the Y-axis direction, which effectively prevents the first bonding member B1, the second bonding member B2, and the third bonding member B3 from protruding from the beams. Therefore, the first beam 41, the second beam 42, and the third beam 43 can be bonded to the angular velocity sensor 3 more reliably and with the desired strength.

[0054] As described above, in the resonation device 1 of this embodiment, the first beam 41 has a first widened portion 410 that is wider on both sides in the X-axis direction, and the base 30 is joined to the first widened portion 410 via the first joint member B1. The second beam 42 has a second widened portion 420 that is wider on both sides in the X-axis direction, and the base 30 is joined to the second widened portion 420 via the second joint member B2. This configuration allows for misalignment of the first joint member B1 and the second joint member B2 in the Y-axis direction, effectively preventing the first joint member B1 and the second joint member B2 from protruding from the beam. Therefore, the first beam 41 and the second beam 42 can be joined to the angular velocity sensor 3 more reliably and with the desired strength.

[0055] The second embodiment can also achieve the same effects as the first embodiment described above.

[0056] Third Embodiment Fig. 13 is a top view of a support substrate included in the vibration device according to the third embodiment, Fig. 14 is a top view showing a state in which an angular velocity detection element is bonded to the support substrate shown in Fig. 13.

[0057] The resonator device 1 of this embodiment is similar to the resonator device 1 of the first embodiment described above, except that the support substrate 4 has a different configuration. In the following description, the differences between this embodiment and the first embodiment will be mainly described, and similar points will not be described again. In addition, in each drawing of this embodiment, the same components as those in the first embodiment will be denoted by the same reference numerals.

[0058] 13 , in the support substrate 4 of this embodiment, the first beam 41 has a pair of first spring portions 411 and 412 that elastically deform in the X-axis direction, the second beam 42 has a pair of second spring portions 421 and 422 that elastically deform in the X-axis direction, and the third beam 43 has a pair of third spring portions 431 and 432 that elastically deform in the X-axis direction. With this configuration, for example, compared to the first embodiment described above, the first beam 41, the second beam 42, and the third beam 43 have an increased degree of deformation freedom, and vibrations and deformations occurring in the base 30 in the drive vibration mode can be more effectively damped.

[0059] The first spring portion 411 is annular and is disposed at the end of the first beam 41 on the positive side in the X-axis direction. The second spring portion 421 is annular and is disposed at the end of the second beam 42 on the positive side in the X-axis direction. The third spring portion 431 is annular and is disposed at the end of the third beam 43 on the positive side in the X-axis direction. The first spring portion 411, the second spring portion 421, and the third spring portion 431 are integrally formed by a single combined spring portion 441.

[0060] Similarly, the first spring portion 412 is annular and is disposed at the end of the first beam 41 on the negative side in the X-axis direction. The second spring portion 422 is annular and is disposed at the end of the second beam 42 on the negative side in the X-axis direction. The third spring portion 432 is annular and is disposed at the end of the third beam 43 on the negative side in the X-axis direction. The first spring portion 412, the second spring portion 422, and the third spring portion 432 are integrally formed by a single combined spring portion 442.

[0061] The combined spring portions 441 and 442 are disposed so as to straddle the first beam 41, the second beam 42, and the third beam 43, respectively, and cross these. Furthermore, the combined spring portions 441 and 442 each have a ring shape that is long in the Y-axis direction and is shaped to be easily elastically deformed in the X-axis direction. By integrally forming the first, second, and third spring portions 411, 421, and 431 as the combined spring portion 441 and the first, second, and third spring portions 412, 422, and 432 as the combined spring portion 442, the support substrate 4 has a simpler shape and is easier to form than a configuration in which the first, second, and third spring portions 411, 421, and 431 are formed separately and the first, second, and third spring portions 412, 422, and 432 are formed separately. Furthermore, since large combined spring portions 441 and 442 can be formed, the first beam 41, the second beam 42, and the third beam 43 can be deformed more flexibly in the X-axis direction, respectively. Therefore, vibrations and deformations occurring in the base 30 in the drive vibration mode can be damped more effectively.

[0062] 14, in plan view, the combined spring portion 441 is arranged to overlap the drive vibration arms 35 and 36, and the combined spring portion 442 is arranged to overlap the drive vibration arms 37 and 38. With this configuration, it is possible to ensure a sufficiently large gap between the combined spring portions 441 and 442. That is, it is possible to ensure a sufficient length of the portion between the combined spring portions 441 and 442 of the first, second, and third beams 41, 42, and 43, and it is possible to effectively suppress a decrease in elasticity in the Y-axis direction and the Z-axis direction.

[0063] However, without being limited to this, the combined spring part 441 may be located inside (negative side in the X-axis direction) relative to the drive vibration arms 35 and 36, or may be located outside (positive side in the X-axis direction) relative to the drive vibration arms 35 and 36. Similarly, the combined spring part 442 may be located inside (positive side in the X-axis direction) relative to the drive vibration arms 37 and 38, or may be located outside (negative side in the X-axis direction) relative to the drive vibration arms 37 and 38.

[0064] As described above, in the vibration device 1 of this embodiment, the first beam 41 has first spring portions 411 and 412 that elastically deform in the X-axis direction. Moreover, the second beam 42 has second spring portions 421 and 422 that elastically deform in the X-axis direction. With this configuration, the degree of freedom of deformation of the first beam 41 and the second beam 42 increases, and vibrations and deformations that occur in the base 30 in the drive vibration mode can be more effectively attenuated.

[0065] As described above, the first spring portion 411 and the second spring portion 421 are integrally formed by the annular combined spring portion 441 that straddles the first beam 41 and the second beam 42, and the first spring portion 412 and the second spring portion 422 are integrally formed by the annular combined spring portion 442 that straddles the first beam 41 and the second beam 42. With this configuration, the first and second spring portions 411 and 421 can be formed as one large combined spring portion 441, and similarly, the first and second spring portions 412 and 422 can be formed as one large combined spring portion 442, which allows the first beam 41 and the second beam 42 to deform more flexibly in the X-axis direction. This allows for more effective damping of vibrations and deformations that occur in the base portion 30 in the drive vibration mode.

[0066] As described above, the third beam 43 has the third spring portions 431, 432 that elastically deform in the X-axis direction. With this configuration, the degree of freedom of deformation of the third beam 43 increases, and vibrations and deformations occurring in the base portion 30 in the drive vibration mode can be more effectively attenuated.

[0067] The third embodiment can also achieve the same effects as the first embodiment described above.

[0068] <Fourth embodiment> FIG. 15 is a top view of a support substrate included in the resonation device according to the fourth embodiment.

[0069] The resonation device 1 of this embodiment is similar to the resonation device 1 of the third embodiment described above, except that the first spring portions 411, 412, the second spring portions 421, 422, and the third spring portions 431, 432 of the support substrate 4 are different in configuration. Note that the following description of this embodiment will focus on the differences from the third embodiment described above, and a description of similar points will be omitted. Furthermore, in the drawings of this embodiment, the same reference numerals are used to designate the same components as those of the third embodiment described above.

[0070] In the support substrate 4 of the third embodiment described above, the first spring portion 411, the second spring portion 421, and the third spring portion 431 are integrally formed as the combined spring portion 441, but in the support substrate 4 of this embodiment, the first spring portion 411, the second spring portion 421, and the third spring portion 431 are each formed separately. Similarly, the first spring portion 412, the second spring portion 422, and the third spring portion 432 are each formed separately.

[0071] If the first, second, and third spring portions 411, 421, and 431 were integrally formed as the combined spring portion 441, as in the third embodiment, the displacement of any one of the first beam 41, the second beam 42, and the third beam 43 would be transmitted to the other two beams via the combined spring portion 441, potentially affecting the displacement of these two beams. In contrast, in this embodiment, the first, second, and third spring portions 411, 421, and 431 are formed separately, so this problem does not occur. The same applies to the first, second, and third spring portions 412, 422, and 432. Therefore, compared to the third embodiment, the vibration and deformation occurring in the base portion 30 in the drive vibration mode can be more effectively damped.

[0072] Here, the third spring portions 431 and 432 of the third beam 43 located in the center each have an annular portion. With this configuration, the annular portions elastically deform in the X-axis direction, causing the third beam 43 to elastically deform in the X-axis direction. With this configuration, the third spring portions 431 and 432 can be formed on the third beam 43 with a simple shape.

[0073] In contrast, the first spring portions 411 and 412 of the first beam 41 each have a crank-shaped bent portion that is closer to the center O than the third spring portions 431 and 432 and that follows the outer periphery of the third spring portions 431 and 432. That is, the first spring portions 411 and 412 each have a portion that is bent in the Y-axis direction, which is a direction different from the X-axis direction, midway along the first beam 41. With this configuration, the crank-shaped bent portion elastically deforms in the X-axis direction, causing the first beam 41 to elastically deform in the X-axis direction. With this configuration, the first spring portions 411 and 412 can be formed on the first beam 41 with a simple shape.

[0074] Similarly, the second spring portions 421, 422 of the second beam 42 are bent in a crank shape along the outer periphery of the third spring portions 431, 432, closer to the center O than the third spring portions 431, 432. That is, the second spring portions 421, 422 each have a portion midway along the second beam 42 that is bent in the Y-axis direction, which is a direction different from the X-axis direction. With this configuration, the crank-shaped bent portion elastically deforms in the X-axis direction, thereby elastically deforming the second beam 42 in the X-axis direction. With this configuration, the second spring portions 421, 422 can be formed in the second beam 42 with a simple shape.

[0075] As described above, in the vibration device 1 of this embodiment, the first spring portions 411 and 412 have portions bent in the Y-axis direction, which is different from the first X-axis direction, midway along the first beam 41. Furthermore, the second spring portions 421 and 422 have portions bent in the Y-axis direction, which is different from the X-axis direction, midway along the second beam 42. With this configuration, the first spring portions 411 and 412 can be formed in the first beam 41 with a simple shape. Similarly, the second spring portions 421 and 422 can be formed in the second beam 42 with a simple shape.

[0076] As described above, the third spring portions 431 and 432 have annular portions disposed midway along the third beam 43. According to this configuration, the third spring portions 431 and 432 can be formed on the third beam 43 with a simple shape.

[0077] The fourth embodiment can also achieve the same effects as the first embodiment described above.

[0078] Although the vibration device of the present invention has been described above based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part can be replaced with any configuration having a similar function. In addition, any other configuration may be added to the present invention. In addition, each embodiment may be combined as appropriate.

[0079] For example, in the above-described embodiment, the angular velocity detection element 3 is located above the support substrate 4, but this is not limiting, and the angular velocity detection element 3 may be located below the support substrate 4 and supported by being suspended from the support substrate 4. Furthermore, in the above-described embodiment, the support substrate 4 is fixed to the base 21, but this is not limiting, and the support substrate 4 may be fixed to the circuit element 5, for example. [Explanation of symbols]

[0080] 1...vibration device, 2...package, 21...base, 211...recess, 211a...first recess, 211b...second recess, 211c...third recess, 22...lid, 221...groove, 231...internal terminal, 232...internal terminal, 233...external terminal, 24...seam ring, 3...angular velocity detection element, 30...base, 300...vibration substrate, 31...detection vibration arm, 32...detection vibration arm, 33...support arm, 34...support arm, 35...drive vibration arm, 36... Driving vibration arm, 37...driving vibration arm, 38...driving vibration arm, 4...support substrate, 40...frame portion, 40a...opening, 401...first support portion, 402...second support portion, 41...first beam, 410...first widened portion, 411...first spring portion, 412...first spring portion, 42...second beam, 420...second widened portion, 421...second spring portion, 422...second spring portion, 43...third beam, 430...third widened portion, 431...third spring portion, 432...third spring portion, 441...combined Spring portion, 442...combined spring portion, 5...circuit element, 51...drive circuit, 52...detection circuit, B1...first joining member, B11...first joining member, B12...first joining member, B2...second joining member, B21...second joining member, B22...second joining member, B3...third joining member, B31...third joining member, B32...third joining member, B4...fourth joining member, BW...bonding wire, E1...first detection signal electrode, E2...first detection ground electrode , E3...second detection signal electrode, E4...second detection ground electrode, E5...drive signal electrode, E6...drive ground electrode, EL...energy line, L1...wiring, L2...wiring, L3...wiring, L4...wiring, L5...wiring, L6...wiring, O...center, S...internal space, T1...terminal, T2...terminal, T3...terminal, T4...terminal, T5...terminal, T6...terminal, W11...width, W12...width, W21...width, W22...width, W31...width, W32...width, ωz...angular velocity

Claims

1. a vibration element including a vibration substrate; a support substrate that supports the vibration element, The vibration substrate is A base and a drive vibration arm connected to the base, The support substrate is a first support portion and a second support portion arranged side by side in a first direction; a first beam and a second beam extending in the first direction and connecting the first support portion and the second support portion, the base portion and the first beam are joined via a first joining member, A vibration device, characterized in that the base and the second beam are joined via a second joining member.

2. the support substrate has a frame-shaped frame portion including the first support portion and the second support portion, The vibration device according to claim 1 , wherein the first beam and the second beam are disposed inside the frame portion.

3. the first beam has a first widened portion that is widened on both sides in the first direction, and the base portion is joined to the first widened portion via the first joining member; The vibration device described in claim 1, wherein the second beam has a second widening portion that is widened on both sides in the first direction, and the base is joined to the second widening portion via the second joining member.

4. the first beam has a first spring portion that elastically deforms in the first direction, The vibration device according to claim 1 , wherein the second beam has a second spring portion that elastically deforms in the first direction.

5. the first spring portion has a portion bent in a direction different from the first direction midway along the first beam, The vibration device according to claim 4 , wherein the second spring portion has a portion midway along the second beam that is bent in a direction different from the first direction.

6. The vibration device according to claim 4 , wherein the first spring portion and the second spring portion are integrally formed by an annular combined spring portion that is arranged across the first beam and the second beam.

7. the support substrate has a third beam located between the first beam and the second beam; the third beam extends in the first direction and connects the first support portion and the second support portion; The vibration device according to claim 1 , wherein the base and the third beam are joined via a third joining member.

8. The vibration device according to claim 7 , wherein the third beam has a third spring portion that elastically deforms in the first direction.

9. The vibration device according to claim 8 , wherein the third spring portion has an annular portion disposed midway along the third beam.

10. The vibrating device according to claim 1 , wherein the vibrating substrate and the supporting substrate are made of the same material.

11. The vibration device according to claim 1 , further comprising a circuit element electrically connected to the vibration element via the support substrate.

12. The vibration device according to claim 1 , further comprising a package that houses the vibration element and the support substrate.

13. a vibration element including a vibration substrate; a support substrate that supports the vibration element, The vibration substrate is A base and a drive vibration arm connected to the base, The support substrate is a first support portion and a second support portion arranged side by side in a first direction; a first beam and a second beam extending in the first direction and connecting the first support portion and the second support portion, the base portion and the first beam are joined via a first joining member, A method for manufacturing a vibration device in which the base and the second beam are joined via a second joining member, A method for manufacturing a vibration device, comprising the steps of simultaneously forming the first support portion, the second support portion, the first beam, and the second beam.

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