Adhesive tape for semiconductor, method for manufacturing semiconductor chip with adhesive layer, and method for manufacturing semiconductor device

Abstract

To provide an adhesive tape for a semiconductor that a specific liquid epoxy resin is used in an adhesive while being an adhesive tape integrated type, which suppresses increase of an amount of the liquid epoxy resin in the adhesive tape, suppresses thickening of the adhesive, and hardly causes viscosity rise with time.SOLUTION: An adhesive tape 10 includes a film-like adhesive 2, and an adhesive tape 5 stuck to the film-like adhesive, wherein the film-like adhesive contains an epoxy resin and a curing agent, the epoxy resin contains an epoxy resin which is liquid at 25°C, and a number average molecular weight of the epoxy resin which is liquid at 25°C is 350 or more.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an adhesive tape for semiconductors, a method for manufacturing a semiconductor chip with an adhesive layer, and a method for manufacturing a semiconductor device. [Background technology]

[0002] Conventionally, wire bonding, which uses thin metal wires such as gold wires, has been widely used to connect semiconductor chips to substrates. However, in order to meet the demands for higher performance, higher integration, and faster speeds in semiconductor devices, flip-chip connection (FC connection), which directly connects the semiconductor chip to the substrate by forming conductive protrusions called bumps on the semiconductor chip or substrate, is becoming more popular.

[0003] For example, the COB (Chip On Board) type connection method, which is widely used for BGA (Ball Grid Array), CSP (Chip Size Package), etc., in connection between semiconductor chips and substrates, also falls under the FC connection method. The FC connection method is also widely used in COC (Chip On Chip) type connection methods, which form connection parts (e.g., bumps and wiring) on ​​semiconductor chips to connect between semiconductor chips.

[0004] Recently, as one of the high-density mounting technologies, a method has been considered in which a wafer with a film-like adhesive attached (semiconductor wafer with an adhesive layer) is prepared, and semiconductor chips with an adhesive layer are obtained from this wafer.Among these, Patent Document 1 proposes an adhesive tape for semiconductors in which a backgrinding tape and an adhesive are bonded together, with the aim of simplifying the process. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-239138 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, there has been a strong demand for smaller, thinner, and more functional packages. Chip-stacked packages, POP (Package On Package), and TSV (Through-Silicon Via), which use the above-mentioned connection methods to stack and multi-layer chips, are becoming increasingly popular. These stacking and multi-layering technologies arrange semiconductor chips three-dimensionally, allowing for smaller packages compared to two-dimensional arrangements. Furthermore, stacking and multi-layering technologies are attracting attention as a next-generation semiconductor wiring technology because they are effective in improving semiconductor performance, reducing noise, reducing mounting area, and saving power.

[0007] When manufacturing the above-mentioned multi-layer stacked package, it is common to use the same stacking conditions for each layer of semiconductor chips in order to maximize production efficiency. Therefore, the adhesives used in manufacturing multi-layer stacked packages must have minimal variation in melting and curing properties so that the chips can be stacked under the same conditions. In particular, if the adhesives used for each layer have different viscosities, the distance between chips (gap height) will vary when the chips are stacked under the same conditions, resulting in reduced package quality. Therefore, it is desirable to minimize the viscosity variation between adhesives.

[0008] On the other hand, as a result of investigations by the present inventors, it has become clear that the viscosity of the film-like adhesive is likely to increase over time in adhesive tapes for semiconductors that are integrated with adhesive tapes such as backgrinding tape (hereinafter referred to as "adhesive tape-integrated adhesive tapes for semiconductors"). The storage period from manufacture to use of adhesive tapes used in the manufacture of packages is not necessarily the same, and adhesive tapes manufactured at different times may be used in the manufacture of a single package. Therefore, in order to use adhesive tape-integrated adhesive tapes for semiconductors in the manufacture of multi-layered packages, it is important to suppress the above-mentioned increase in viscosity over time.

[0009] Therefore, one aspect of the present invention has an object to provide an adhesive tape for semiconductors which is an all-in-one adhesive tape and in which the adhesive is less likely to increase in viscosity over time. [Means for solving the problem]

[0010] The present inventors have conducted extensive research to clarify the cause of the increase in adhesive viscosity in adhesive tape-integrated semiconductor adhesive tapes, and as a result, have confirmed in a component analysis of the adhesive tape that the adhesive tape contains a liquid epoxy resin, which is used in adhesives from the viewpoint of film-forming properties, etc., and have further confirmed that the amount of liquid epoxy resin in the adhesive tape changes before and after the increase in viscosity. Based on this finding, the present inventors have conducted further research and found that by using a specific liquid epoxy resin, the increase in the amount of liquid epoxy resin in the adhesive tape can be suppressed, and as a result, the increase in adhesive viscosity can also be suppressed, thereby completing the present invention.

[0011] The present invention provides the following [1] to

[13] .

[0012] [1] The adhesive tape includes a film adhesive and a pressure-sensitive adhesive tape attached to the film adhesive. The film adhesive contains an epoxy resin and a curing agent, the epoxy resin comprises an epoxy resin that is liquid at 25°C; An adhesive tape for semiconductors, wherein the epoxy resin that is liquid at 25°C has a number average molecular weight of 350 or more.

[0013] [2] The adhesive tape for a semiconductor according to [1], wherein the epoxy resin that is liquid at 25°C contains a compound represented by the following formula (I): [ka] [In formula (I), n represents an integer of 1 or more.]

[0014] [3] The adhesive tape for a semiconductor according to [1] or [2], wherein the content of compounds having a molecular weight of 350 or more contained in the epoxy resin that is liquid at 25°C is 50 mass% or more based on the total mass of the epoxy resin that is liquid at 25°C.

[0015] [4] The adhesive tape for a semiconductor according to any one of [1] to [3], wherein the content of the epoxy resin that is liquid at 25°C is 1 to 30 mass % based on the total mass of the film-like adhesive.

[0016] [5] The adhesive tape for a semiconductor according to any one of [1] to [4], wherein the epoxy resin comprises an epoxy resin that is solid at 25°C.

[0017] [6] The adhesive tape for a semiconductor according to any one of [1] to [5], wherein the curing agent comprises an imidazole-based curing agent.

[0018] [7] The adhesive tape for a semiconductor according to any one of [1] to [6], wherein the film-like adhesive further contains a fluxing agent.

[0019] [8] The adhesive tape for a semiconductor according to any one of [1] to [7], wherein the film-like adhesive further contains a polymer component having a weight-average molecular weight of 10,000 or more.

[0020] [9] The adhesive tape for a semiconductor according to any one of [1] to [8], wherein the film-like adhesive further contains a filler.

[0021]

[10] The adhesive tape for a semiconductor according to any one of [1] to [9], wherein the viscosity of the film-like adhesive at 80° C. is 3000 to 10000 Pa·s.

[0022]

[11] The adhesive tape for a semiconductor according to any one of [1] to

[10] , wherein the adhesive layer that forms the surface of the adhesive tape that comes into contact with the film-like adhesive contains a (meth)acrylic resin.

[0023]

[12] a laminating step of attaching the adhesive tape for a semiconductor according to any one of [1] to

[11] to a semiconductor wafer from the film-like adhesive side; a back grinding step of grinding a surface of the semiconductor wafer opposite to the adhesive tape to which the adhesive tape is attached; a dicing step of dividing the semiconductor wafer into individual pieces to obtain semiconductor chips with an adhesive layer after the back-grinding step.

[0024]

[13] A method for manufacturing a semiconductor device in which a plurality of semiconductor chips are stacked, comprising: a first lamination step of placing the semiconductor chip with the first adhesive layer obtained by the method described in

[12] on a substrate from the adhesive layer side and pressing the chip under heat;

[12] A method for manufacturing a semiconductor device, comprising: a second lamination step in which a semiconductor chip with a second adhesive layer obtained by the method described in

[12] is placed on the laminate obtained in the first lamination step from the adhesive layer side, and pressed while being heated. [Effects of the Invention]

[0025] According to one aspect of the present invention, it is possible to provide an adhesive tape for semiconductors which is an all-in-one adhesive tape and in which the adhesive is less likely to increase in viscosity over time. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a schematic cross-sectional view showing one embodiment of the adhesive tape for a semiconductor of the present invention. [Figure 2] 2A to 2C are cross-sectional views illustrating steps in one embodiment of the method for producing a semiconductor chip with an adhesive layer of the present invention. [Figure 3]3A to 3C are cross-sectional views illustrating steps in one embodiment of the method for producing a semiconductor chip with an adhesive layer of the present invention. [Figure 4] 4A to 4C are cross-sectional views illustrating steps in one embodiment of the method for producing a semiconductor chip with an adhesive layer of the present invention. [Figure 5] 5A to 5C are cross-sectional views schematically illustrating steps in one embodiment of the method for manufacturing a semiconductor device of the present invention. [Figure 6] 6A to 6C are cross-sectional views illustrating steps in one embodiment of the method for manufacturing a semiconductor device according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0027] In this specification, "(meth)acrylic" refers to at least one of acrylic and its corresponding methacrylic. The same applies to other similar expressions such as "(meth)acryloyl" and "(meth)acrylate." Furthermore, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. Furthermore, in the numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced with a value shown in the examples. Furthermore, the upper and lower limits individually described can be arbitrarily combined. Furthermore, unless otherwise specified, the materials exemplified below may be used alone or in combination of two or more. When multiple substances corresponding to each component are present in the composition, the content of each component in the composition refers to the total amount of the multiple substances present in the composition, unless otherwise specified.

[0028] Hereinafter, embodiments of the present invention will be described in detail, with reference to the drawings where necessary. In the drawings, identical or corresponding parts are designated by the same reference numerals, and duplicate explanations will be omitted. Furthermore, unless otherwise specified, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. Furthermore, the dimensional ratios of the drawings are not limited to those shown.

[0029] <Adhesive tape for semiconductors> 1 is a schematic cross-sectional view showing one embodiment of the adhesive tape for semiconductors of the present invention. In this specification, "for semiconductors" means that it is used in the manufacture of semiconductor devices, and means that it is used, for example, to bond a semiconductor chip to a member to be bonded (a substrate such as a wiring circuit board or another semiconductor chip) and to seal the gap between the semiconductor chip and the substrate.

[0030] 1 includes a supporting substrate 1, a film-like adhesive 2, and a pressure-sensitive adhesive tape 5. However, the supporting substrate 1 is not essential.

[0031] The adhesive tape 5 includes an adhesive layer 3 and a substrate 4, and is attached to the film-like adhesive 2 from the adhesive layer 3 side. That is, the adhesive layer 3 forms the contact surface of the adhesive tape 5 with the film-like adhesive 2. The adhesive tape 5 is, for example, a backgrinding tape, a dicing tape, or a protective tape (for example, a film that is peeled off after the film-like adhesive 2 is laminated to an adherend).

[0032] The film adhesive 2 contains an epoxy resin and a curing agent, and the epoxy resin includes an epoxy resin that is liquid at 25°C (hereinafter also referred to as "liquid epoxy resin"), and the number average molecular weight of the liquid epoxy resin is 350 or more.

[0033] Here, "liquid at 25°C" means that the viscosity at 25°C measured with an E-type viscometer is 400 Pa·s or less. The number average molecular weight is the value measured using GPC (gel permeation chromatography) and converted into standard polystyrene. The unit of molecular weight is g / mol.

[0034] The adhesive tape 10 is an all-in-one adhesive tape, yet has the characteristic that the film-like adhesive 2 is less likely to increase in viscosity over time. The reason for this is not clear, but it is presumed that the cause of the viscosity increase is that the liquid epoxy resin contained in the adhesive migrates (penetrates) into the adhesive layer of the adhesive tape over time, causing a change in the composition of the adhesive. In the adhesive tape 10, the number-average molecular weight of the liquid epoxy resin contained in the film-like adhesive 2 is 350 or more, so migration (penetration) of the liquid epoxy resin into the adhesive layer is less likely to occur, and as a result, it is presumed that the adhesive is less likely to increase in viscosity.

[0035] The film adhesive 2 and the pressure-sensitive adhesive tape 5 will be described in detail below.

[0036] (film adhesive) The film-like adhesive 2 is an adhesive composition containing an epoxy resin (hereinafter sometimes referred to as "component (a)") and a curing agent (hereinafter sometimes referred to as "component (b)"). If necessary, the adhesive composition may contain a fluxing agent (hereinafter sometimes referred to as "component (c)"), a polymer component with a weight-average molecular weight of 10,000 or more (hereinafter sometimes referred to as "component (d)"), and a filler (hereinafter sometimes referred to as "component (e)").

[0037] (a) Component: Epoxy resin Epoxy resins are compounds containing two or more epoxy groups in their molecules. Component (a) contains a liquid epoxy resin with a number-average molecular weight of at least 350. Examples of liquid epoxy resins include glycidyl ethers of bisphenol A, glycidyl ethers of bisphenol AD, glycidyl ethers of bisphenol S, glycidyl ethers of bisphenol F, glycidyl ethers of hydrated bisphenol A, glycidyl ethers of ethylene oxide adducts of bisphenol A, glycidyl ethers of propylene oxide adducts of bisphenol A, glycidyl ethers of naphthalene resins, and trifunctional or tetrafunctional glycidyl amines. The liquid epoxy resin may contain one of these compounds alone or a mixture of two or more.

[0038] The liquid epoxy resin may contain a compound having a molecular weight of less than 350, but from the viewpoint of further suppressing an increase in viscosity, the smaller the content of the compound having a molecular weight of less than 350, the better. The content of the compound having a molecular weight of 350 or more contained in the liquid epoxy resin may be 50% by mass or more, 70% by mass or more, 90% by mass or more, 95% by mass or more, 99% by mass or more, or 100% by mass based on the total mass of the liquid epoxy resin.

[0039] In one embodiment, the liquid epoxy resin preferably contains a compound represented by the following formula (I), from the viewpoint of further suppressing an increase in viscosity of the adhesive over time by suppressing the movement (molecular movement) of the resin. [ka] [In formula (I), n represents an integer of 1 or more.]

[0040] From the viewpoint of suppressing molecular motion of the resin, the liquid epoxy resin more preferably contains a compound in which n in formula (I) is 1, and even more preferably contains both a compound in formula (I) in which n is 1 and a compound in formula (I) in which n is 2 or more.

[0041] The content of the compound in which n is 1 in formula (I) may be 30 to 100% by mass, 40% by mass or more, or 50% by mass or more, or 75% by mass or less, 65% by mass or less, or 55% by mass or less, based on the total mass of the liquid epoxy resin.

[0042] In one embodiment, the liquid epoxy resin may contain a compound represented by the following formula (II): In this case, steric hindrance tends to suppress molecular motion of the liquid epoxy resin, and as a result, the increase in viscosity of the adhesive over time tends to be further suppressed. [ka] [In formula (II), R 1 and R 2 each independently represents a hydrogen atom or a glycidyl group, and l and m represent an integer of 0 or greater.

[0043] In formula (II), l and m may be, for example, an integer of 0 to 10. The sum of l and m may be, for example, an integer of 0 to 20. R 1 and R 2 When is a hydrogen atom, at least one of l and m may be 1 or more.

[0044] The liquid epoxy resin may contain one or more types of compounds represented by formula (II).

[0045] The compound represented by formula (II) may be a compound represented by the following formula (IIa), from the viewpoints of suppressing molecular motion of the liquid epoxy resin and heat resistance after film curing. [ka]

[0046] The content of the compound represented by formula (IIa) may be 70 mass % or more, 80 mass % or more, or 90 mass % or more, based on the total mass of the liquid epoxy resin. The liquid epoxy resin may consist solely of the compound represented by formula (IIa).

[0047] The compound represented by formula (II) may be a compound represented by the following formula (IIb): [ka] [In formula (IIb), p and q represent integers of 0 or more, and the sum of p and q is 1 or more.]

[0048] From the viewpoint of suppressing molecular motion of the resin, the liquid epoxy resin more preferably contains a compound in which the sum of p and q in formula (IIb) is 1 or 2, and even more preferably contains both of these. It is even more preferable that the liquid epoxy resin contains, in addition to the compound in formula (IIb) in which the sum of p and q is 1 or 2, a compound in formula (IIb) in which the sum of p and q is 3 or more.

[0049] The content of the compound in which the sum of p and q in formula (IIb) is 1 may be 10 to 30 mass %, or may be 15 mass % or more, or 20 mass % or more, or may be 25 mass % or less, or 20 mass % or less, based on the total mass of the liquid epoxy resin.

[0050] The content of the compound in which the sum of p and q in formula (IIb) is 2 may be 10 to 90 mass %, or may be 30 mass % or more, or 50 mass % or more, or may be 70 mass % or less, or 50 mass % or less, based on the total mass of the liquid epoxy resin.

[0051] The content of the compound in which the sum of p and q in formula (IIb) is 3 or more may be 0 to 90 mass %, 30 mass % or more, or 50 mass % or more, or 70 mass % or less, or 50 mass % or less, based on the total mass of the liquid epoxy resin.

[0052] From the viewpoint of achieving both the effect of suppressing viscosity increase and the desired effects of the liquid epoxy resin (improved film formability, low viscosity, improved lamination properties, etc.) at a high level, the number average molecular weight of the liquid epoxy resin is preferably 350 to 800. The number average molecular weight of the liquid epoxy resin may be 400 or more or 500 or more, or may be 700 or less or 600 or less.

[0053] The epoxy equivalent of the liquid epoxy resin may be 50 to 500 g / eq, 100 to 400 g / eq, or 120 to 370 g / eq.

[0054] From the viewpoint of achieving a high level of both the effect of suppressing viscosity increase and the desired effects of the liquid epoxy resin (improved film-forming properties, low viscosity, improved lamination properties, etc.), the content of the liquid epoxy resin may be 1 to 30 mass % based on the total mass of the adhesive composition (film-like adhesive), or may be 3 mass % or more, or 5 mass % or more, or may be 20 mass % or less, or 10 mass % or less.

[0055] From the viewpoint of heat resistance after the film is cured, component (a) may contain an epoxy resin that is solid (non-liquid) at 25°C (hereinafter also referred to as "solid epoxy resin"). Here, "solid at 25°C" means that the viscosity at 25°C measured with an E-type viscometer exceeds 400 Pa s.

[0056] Examples of solid epoxy resins that can be used include bisphenol A epoxy resins, bisphenol F epoxy resins, naphthalene epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, phenol aralkyl epoxy resins, biphenyl epoxy resins, triphenylmethane epoxy resins, triphenolmethane epoxy resins, dicyclopentadiene epoxy resins, and various polyfunctional epoxy resins. These can be used alone or in combination of two or more.

[0057] The content of the solid epoxy resin may be 0 to 50% by mass, or may be 0 to 30% by mass, based on the total mass of component (a), from the viewpoint of achieving both the effect of suppressing viscosity increase and the desired effects of the liquid epoxy resin (improved film formability, low viscosity, improved lamination properties, etc.) at a high level.

[0058] (b) Component: Hardener Examples of component (b) include phenolic resin-based curing agents, acid anhydride-based curing agents, amine-based curing agents, imidazole-based curing agents, and phosphine-based curing agents. Among these, phenolic resin-based curing agents, acid anhydride-based curing agents, amine-based curing agents, and imidazole-based curing agents exhibit flux activity that suppresses the formation of an oxide film at the connection, so using these curing agents can improve connection reliability. Each curing agent is described below.

[0059] (i) Phenolic resin curing agent The phenolic resin curing agent is not particularly limited as long as it has two or more phenolic hydroxyl groups in the molecule, and examples thereof include phenol novolac resin, cresol novolac resin, phenol aralkyl resin, cresol naphthol formaldehyde polycondensate, triphenylmethane-type polyfunctional phenolic resin, and various polyfunctional phenolic resins. These can be used alone or in combination of two or more.

[0060] (ii) Acid anhydride curing agent Examples of acid anhydride curing agents that can be used include methylcyclohexanetetracarboxylic dianhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, and ethylene glycol bisanhydrotrimellitate. These can be used alone or in combination of two or more.

[0061] (iii) Amine-based curing agents As the amine-based curing agent, for example, dicyandiamide can be used.

[0062] (iv) Imidazole-based curing agents Examples of imidazole curing agents include 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, and 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine. -[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and adducts of epoxy resins and imidazoles. Among these, from the viewpoints of excellent curing properties, storage stability, and connection reliability, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole are preferred. These may be used alone or in combination of two or more. They may also be microencapsulated to form latent curing agents.

[0063] (v) Phosphine-based curing agents Examples of phosphine curing agents include triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra(4-methylphenyl)borate, and tetraphenylphosphonium(4-fluorophenyl)borate.

[0064] The phenolic resin curing agent, acid anhydride curing agent, and amine curing agent can each be used alone or in combination with two or more of them. The imidazole curing agent and phosphine curing agent can each be used alone or in combination with the phenolic resin curing agent, acid anhydride curing agent, or amine curing agent.

[0065] From the viewpoint of further improving storage stability and making decomposition or deterioration due to moisture absorption less likely to occur, it is preferable to use a curing agent selected from the group consisting of phenolic resin-based curing agents, amine-based curing agents, imidazole-based curing agents, and phosphine-based curing agents. From the viewpoint of ease of adjusting the curing rate and realizing short-time connection for the purpose of improving productivity due to fast curing properties, it is more preferable to use a curing agent selected from the group consisting of phenolic resin-based curing agents, amine-based curing agents, and imidazole-based curing agents, and among these, it is preferable to use an imidazole-based curing agent.

[0066] The content of the curing agent (particularly the content of the imidazole-based curing agent) is preferably 0.1 to 20 parts by mass, and more preferably 0.1 to 10 parts by mass, per 100 parts by mass of component (a). When the content of the curing agent is 0.1 part by mass or more, curability tends to be improved, while when the content is 20 parts by mass or less, the adhesive composition does not cure before a metal bond is formed, and connection defects tend to be less likely to occur.

[0067] (c) Ingredient: Fluxing agent Component (c) is a compound having fluxing activity, such as a compound having a carboxy group (mono- or polycarboxylic acid). As mentioned above, imidazole-based curing agents can also have fluxing activity, but compounds that fall under the category of imidazole-based curing agents are not considered to fall under component (c). Specific examples of component (c) include dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, and dodecanedioic acid, as well as compounds in which an electron-donating group is substituted at the 2-position of these dicarboxylic acids (e.g., 2-methylglutaric acid).

[0068] The content of component (c) is preferably 0.5 to 10 mass %, and more preferably 0.5 to 5 mass %, based on the total amount of the adhesive composition.

[0069] (d) Component: A polymer component having a weight-average molecular weight of 10,000 or more Component (d) contributes to improving heat resistance and film formability. Component (d) is, for example, a thermoplastic resin. Examples of component (d) include phenoxy resin, polyimide resin, polyamide resin, polycarbodiimide resin, cyanate ester resin, acrylic resin, polyester resin, polyethylene resin, polyethersulfone resin, polyetherimide resin, polyvinyl acetal resin, urethane resin, and acrylic rubber. Among these, from the viewpoint of easily obtaining excellent heat resistance and film formability, phenoxy resin, polyimide resin, acrylic rubber, cyanate ester resin, and polycarbodiimide resin are preferred, and phenoxy resin, polyimide resin, and acrylic rubber are more preferred. These thermoplastic resins can be used alone or as a mixture or copolymer of two or more types. Note that component (d) does not include the epoxy resin, which is component (a).

[0070] The weight-average molecular weight of component (d) is 10,000 or more, preferably 20,000 or more, and more preferably 30,000 or more. Such component (d) can further improve the heat resistance and film-forming properties of the adhesive composition. The weight-average molecular weight of component (d) is preferably 1,000,000 or less, and more preferably 500,000 or less. Such component (d) can achieve the effect of high heat resistance. In this specification, the weight-average molecular weight refers to a value measured using GPC (gel permeation chromatography) in terms of standard polystyrene. An example of measurement conditions for the GPC method is shown below. Apparatus: HCL-8320GPC, UV-8320 (product name, manufactured by Tosoh Corporation), or HPLC-8020 (product name, manufactured by Tosoh Corporation) Column: TSKgel superMultiporeHZ-M x 2, or 2 pieces of GMHXL + 1 piece of G-2000XL Detector: RI or UV detector Column temperature: 25 to 40°C Eluent: Select a solvent that dissolves the polymer components. Examples include tetrahydrofuran (THF), N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMA), N-methylpyrrolidone (NMP), and toluene. When using a polar solvent, the phosphoric acid concentration may be adjusted to 0.05 to 0.1 mol / L (usually 0.06 mol / L) and the LiBr concentration to 0.5 to 1.0 mol / L (usually 0.63 mol / L). Flow rate: 0.30~1.5mL / min Standard material: polystyrene

[0071] When the adhesive composition contains component (d), the content C of component (d) d Content of component (a) relative to C a Ratio of C a / C d The mass ratio is preferably 0.01 to 5, more preferably 0.05 to 3, and even more preferably 0.1 to 2. a / Cd By making the ratio C 0.01 or more, better curing properties and adhesive strength can be obtained, and a / C d By setting the value to 5 or less, better film formability can be obtained.

[0072] (e) Ingredients: Filler Component (e) is effective in controlling the viscosity of the adhesive composition and the physical properties of the cured product of the adhesive composition. Component (e) may be an insulating inorganic filler, an inorganic filler such as whiskers, or an organic filler such as a resin filler. Component (e) may be used alone or in combination of two or more. Since inorganic fillers and organic fillers each have advantageous effects, either one may be used depending on the application, or they may be mixed together to exhibit the functions of both.

[0073] Examples of insulating inorganic fillers include glass, silica, alumina, titanium oxide, carbon black, mica, and boron nitride. Among these, silica, alumina, titanium oxide, and boron nitride are preferred, and silica, alumina, and boron nitride are more preferred.

[0074] Whiskers include, for example, aluminum borate, aluminum titanate, zinc oxide, calcium silicate, magnesium sulfate, and boron nitride.

[0075] Examples of resin fillers include fillers made of resins such as polyurethane and polyimide. Resin fillers have a smaller thermal expansion coefficient than organic components (epoxy resins, curing agents, etc.), which contributes to improving connection reliability. Resin fillers also make it easy to adjust the viscosity of the adhesive composition. Resin fillers have a superior stress-relieving function compared to inorganic fillers, so resin fillers can further suppress peeling during reflow tests, etc.

[0076] Among the above, insulating inorganic fillers are preferably used from the viewpoint of insulation reliability (particularly HAST resistance).

[0077] There are no particular limitations on the shape, particle size, or content of component (e). Component (e) may have its physical properties appropriately adjusted by surface treatment.

[0078] The content of component (e) is preferably 10 to 80 mass %, and more preferably 15 to 60 mass %, based on the total amount of the adhesive composition.

[0079] The above describes the main components that may be contained in the film-like adhesive 2, but the film-like adhesive 2 may also contain components other than those described above (other components). For example, the film-like adhesive 2 may further contain a thermosetting resin other than epoxy resin, such as a phenolic resin (except when contained as a curing agent) or an acrylic resin. However, it is preferable that the film-like adhesive 2 primarily contains an epoxy resin as the thermosetting resin. The content of the epoxy resin is preferably 80% by mass or more, and more preferably 90% by mass or more, based on the total amount of the thermosetting resin. The content of the epoxy resin may also be 100% by mass, based on the total amount of the thermosetting resin.

[0080] The film adhesive 2 may further contain additives such as antioxidants, silane coupling agents, titanium coupling agents, leveling agents, and ion trapping agents. These may be used alone or in combination of two or more. The content of these additives may be adjusted appropriately so that the effects of each additive are exerted.

[0081] The film-like adhesive 2 can be formed by dissolving or dispersing the adhesive composition containing the above-mentioned components in a solvent to form a varnish, applying this varnish to the supporting substrate 1, and removing the solvent by heating. This method results in a film-like adhesive with a supporting substrate, which comprises the supporting substrate 1 and the film-like adhesive 2.

[0082] The supporting substrate 1 may be, for example, a polymer film having heat resistance and solvent resistance, such as polyethylene terephthalate. Commercially available examples include polyethylene terephthalate films such as "A-31" manufactured by Teijin DuPont Films Co., Ltd. The thickness of the supporting substrate 1 is preferably 10 to 100 μm, more preferably 30 to 75 μm, and particularly preferably 35 to 50 μm. If the thickness is less than 10 μm, the supporting substrate 1 tends to be easily torn during coating, and if it exceeds 100 μm, it tends to be less cost-effective.

[0083] Examples of methods for applying the varnish onto the supporting substrate 1 include commonly known methods such as knife coating, roll coating, spray coating, gravure coating, bar coating, and curtain coating.

[0084] The temperature condition when removing the solvent by heating is preferably about 70 to 150°C.

[0085] The solvent to be used is not particularly limited, but is preferably determined based on the boiling point and volatility during adhesive layer formation. Specifically, solvents with relatively low boiling points, such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene, are preferred because they do not promote curing of the adhesive layer during adhesive layer formation. To improve coatability, solvents with relatively high boiling points, such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone, may also be used. These solvents may be used alone or in combination of two or more.

[0086] The thickness of the film-like adhesive 2 may be 2 to 50 μm, or may be 5 to 20 μm. From the viewpoint of suppressing resin overflow after mounting, the thickness of the film-like adhesive 2 is preferably 5 to 16 μm. The thickness of the film-like adhesive 2 may be 0.6 to 1.5 times, 0.7 to 1.3 times, or 0.8 to 1.2 times the height of the electrodes before connection of the semiconductor wafer. The thickness of the film-like adhesive 2 may be less than the height of the electrodes before connection of the semiconductor wafer. When the thickness of the film-like adhesive 2 is 0.6 times or more the height of the electrodes, the occurrence of voids due to unfilled adhesive can be sufficiently suppressed, further improving connection reliability. When the thickness of the film-like adhesive 2 is 1.5 times or less, the amount of adhesive extruded from the chip connection region during connection can be sufficiently suppressed, thereby suppressing the occurrence of fillets and sufficiently preventing adhesive from adhering to unnecessary areas.

[0087] The viscosity of the film-like adhesive 2 at 80°C is preferably 3000 to 10,000 Pa·s, and more preferably 4000 to 9,000 Pa·s. A viscosity within this range facilitates resin melting during compression bonding and allows the resin to flow sufficiently, reducing the likelihood of voids forming around the electrodes and grooves. Furthermore, it ensures more reliable contact between opposing electrodes, a preliminary step toward achieving a good connection. The viscosity of the film-like adhesive 2 is measured using the following procedure. First, multiple pieces of film-like adhesive are bonded together at a temperature of 60 to 80°C to prepare a measurement sample with a thickness of 400 to 600 μm. The viscosity of this measurement sample is measured using an ARES (product name, manufactured by TA INSTRUMENTS) under the following conditions: a measurement jig diameter of 8 mm, a measurement frequency of 10 Hz, a measurement temperature range of 25°C to 260°C, and a heating rate of 10°C / min, and the viscosity at the specified temperature is determined.

[0088] The viscosity of the film adhesive 2 can be adjusted by, for example, selecting a high molecular weight component, selecting a filler, and adjusting the amounts of these components added.

[0089] (adhesive tape) The pressure-sensitive adhesive tape 5 includes a pressure-sensitive adhesive layer 3 and a substrate 4. In the following, the pressure-sensitive adhesive layer 3 will be first described, and then the substrate 4 will be described.

[0090] The pressure-sensitive adhesive layer 3 has adhesive strength at room temperature and has the necessary adhesive strength to the adherend. The pressure-sensitive adhesive layer 3 preferably has the property of being cured (i.e., its adhesive strength is reduced) by high-energy rays such as radiation or heat, but more preferably is easily peelable from the adhesive layer without the application of high-energy rays such as radiation or heat. The pressure-sensitive adhesive layer 3 may be a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer 3 can be formed using, for example, an acrylic resin, various synthetic rubbers, natural rubber, or a polyimide resin. Among these, when the pressure-sensitive adhesive layer 3 contains an acrylic resin and / or a methacrylic resin (hereinafter collectively referred to as "(meth)acrylic resin"), an effect of suppressing an increase in the viscosity of the adhesive over time is expected.

[0091] When the pressure-sensitive adhesive layer 3 has the property of being cured (i.e., its adhesive strength is reduced) by high-energy rays such as radiation, the pressure-sensitive adhesive layer 3 may contain, for example, an acrylic copolymer as the main component, a crosslinking agent, and a photopolymerization initiator. These components are explained below. In this specification, the term "main component" refers to a component whose content exceeds 50 parts by mass per 100 parts by mass of the composition constituting the target layer.

[0092] The acrylic copolymer has at least a radiation-curable carbon-carbon double bond-containing group and a hydroxyl group in the main chain.

[0093] The (meth)acrylic resin as the acrylic copolymer may contain unsaturated bonds in the side chains and have adhesive properties. Examples of such resins include those having a glass transition temperature of −40° C. or lower, a hydroxyl value of 20 to 150 mg KOH / g, a chain-polymerizable functional group content of 0.3 to 1.5 mmol / g, a substantially undetectable acid value, and a weight-average molecular weight of 300,000 or higher.

[0094] A (meth)acrylic resin having these characteristics can be obtained by synthesis using known methods, such as solution polymerization, suspension polymerization, emulsion polymerization, bulk polymerization, precipitation polymerization, gas-phase polymerization, plasma polymerization, and supercritical polymerization. Polymerization reactions include radical polymerization, cationic polymerization, anionic polymerization, living radical polymerization, living cationic polymerization, living anionic polymerization, coordination polymerization, and immortal polymerization, as well as techniques such as ATRP and RAFT. Among these, radical polymerization synthesis using a solution polymerization method is preferred because of its economical efficiency, high reactivity, ease of polymerization control, and ease of formulation, such as the ability to directly use the resin solution obtained by polymerization for formulation.

[0095] Here, a method for obtaining a (meth)acrylic resin by radical polymerization using a solution polymerization method will be described in detail as an example.

[0096] The monomer used in synthesizing the (meth)acrylic resin is not particularly limited as long as it has one (meth)acrylic group in one molecule, but specific examples include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, butoxyethyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, heptyl (meth)acrylate, octylheptyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, and the like. aliphatic (meth)acrylates such as methyl acrylate, stearyl (meth)acrylate, behenyl (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolypropylene glycol (meth)acrylate, and mono(2-(meth)acryloyloxyethyl)succinate; alicyclic (meth)acrylates such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, mono(2-(meth)acryloyloxyethyl)tetrahydrophthalate, and mono(2-(meth)acryloyloxyethyl)hexahydrophthalate;Benzyl (meth)acrylate, phenyl (meth)acrylate, o-biphenyl (meth)acrylate, 1-naphthyl (meth)acrylate, 2-naphthyl (meth)acrylate, phenoxyethyl (meth)acrylate, p-cumylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl (meth)acrylate, 1-naphthoxyethyl (meth)acrylate, 2-naphthoxyethyl (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate, nonylphenoxy Aromatic (meth)acrylates such as phenoxy polyethylene glycol (meth)acrylate, phenoxy polypropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl (meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl (meth)acrylate, and 2-hydroxy-3-(2-naphthoxy)propyl (meth)acrylate; 2-tetrahydrofurfuryl (meth)acrylate Heterocyclic (meth)acrylates such as acrylate, N-(meth)acryloyloxyethylhexahydrophthalimide, and 2-(meth)acryloyloxyethyl-N-carbazole; caprolactone-modified products thereof; ω-carboxy-polycaprolactone mono(meth)acrylate; glycidyl (meth)acrylate, α-ethylglycidyl (meth)acrylate, α-propylglycidyl (meth)acrylate, α-butylglycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2- compounds having an ethylenically unsaturated group and an epoxy group, such as ethyl glycidyl (meth)acrylate, 2-propyl glycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7-epoxyheptyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether;Compounds having an ethylenically unsaturated group and an oxetanyl group, such as (2-ethyl-2-oxetanyl)methyl (meth)acrylate, (2-methyl-2-oxetanyl)methyl (meth)acrylate, 2-(2-ethyl-2-oxetanyl)ethyl (meth)acrylate, 2-(2-methyl-2-oxetanyl)ethyl (meth)acrylate, 3-(2-ethyl-2-oxetanyl)propyl (meth)acrylate, and 3-(2-methyl-2-oxetanyl)propyl (meth)acrylate; ) Compounds having an ethylenically unsaturated group and an isocyanate group, such as acryloyloxyethyl isocyanate; and compounds having an ethylenically unsaturated group and a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate, and the desired composition can be obtained by appropriately combining these;

[0097] Furthermore, if necessary, styrene copolymerizable with the above-mentioned monomers, N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-isopropylmaleimide, N-butylmaleimide, N-isobutylmaleimide, N-2-methyl-2-propylmaleimide, N-pentylmaleimide, N-2-pentylmaleimide, N-3-pentylmaleimide, N-2-methyl-1-butylmaleimide, N-2-methyl-2-butylmaleimide, N-3-methyl-1-butylmaleimide, N-3-methyl-2-butylmaleimide, N-hexylmaleimide, N-isopropyl ... N-methyl-2-pentylmaleimide, N-methyl-3-pentylmaleimide, N-3-methyl-1-pentylmaleimide, N-3-methyl-2-pentylmaleimide, N-3-methyl-3-pentylmaleimide, N-4-methyl-1-pentylmaleimide, N-4-methyl-2-pentylmaleimide, N-2,2-dimethyl-1-butylmaleimide, N-3,3-dimethyl-1-butylmaleimide, N-3,3-dimethyl- 2-Butylmaleimide, N-2,3-dimethyl-1-butylmaleimide, N-2,3-dimethyl-2-butylmaleimide, N-hydroxymethylmaleimide, N-1-hydroxyethylmaleimide, N-2-hydroxyethylmaleimide, N-1-hydroxy-1-propylmaleimide, N-2-hydroxy-1-propylmaleimide, N-3-hydroxy-1-propylmaleimide, N-1-hydroxy-2-propylmaleimide, N-2-hydroxy-2-propylmaleimide, N-1-hydroxy-1-butylmaleimide, N-2-hydroxy N-hydroxy-1-butylmaleimide, N-3-hydroxy-1-butylmaleimide, N-4-hydroxy-1-butylmaleimide, N-1-hydroxy-2-butylmaleimide, N-2-hydroxy-2-butylmaleimide, N-3-hydroxy-2-butylmaleimide, N-4-hydroxy-2-butylmaleimide, N-2-methyl-3-hydroxy-1-propylmaleimide, N-2-methyl-3-hydroxy-2-propylmaleimide, N-2-methyl-2-hydroxy-1-propylmaleimide, N-1-hydroxy-1-pentylmaleimide,N-2-hydroxy-1-pentylmaleimide, N-3-hydroxy-1-pentylmaleimide, N-4-hydroxy-1-pentylmaleimide, N-5-hydroxy-1-pentylmaleimide, N-1-hydroxy-2-pentylmaleimide, N-2-hydroxy-2-pentylmaleimide, N-3-hydroxy-2-pentylmaleimide, N-4-hydroxy-2-pentylmaleimide, N-5-hydroxy-2-pentylmaleimide, N-1-hydroxy-3-pentylmaleimide, N-2-hydroxy-3-pentylmaleimide, N-3-hydroxy N-hydroxy-3-pentylmaleimide, N-1-hydroxy-2-methyl-1-butylmaleimide, N-1-hydroxy-2-methyl-2-butylmaleimide, N-1-hydroxy-2-methyl-3-butylmaleimide, N-1-hydroxy-2-methyl-4-butylmaleimide, N-2-hydroxy-2-methyl-1-butylmaleimide, N-2-hydroxy-2-methyl-3-butylmaleimide, N-2-hydroxy-2-methyl-4-butylmaleimide, N-2-hydroxy-3-methyl-1-butylmaleimide, N-2-hydroxy-3-methyl-2 -butylmaleimide, N-2-hydroxy-3-methyl-3-butylmaleimide, N-2-hydroxy-3-methyl-4-butylmaleimide, N-4-hydroxy-2-methyl-1-butylmaleimide, N-4-hydroxy-2-methyl-2-butylmaleimide, N-1-hydroxy-3-methyl-2-butylmaleimide, N-1-hydroxy-3-methyl-1-butylmaleimide, N-1-hydroxy-2,2-dimethyl-1-propylmaleimide, N-3-hydroxy-2,2-dimethyl-1-propylmaleimide, N-1-hydroxy-1-hexylmaleimide N-hydroxy-2-hexylmaleimide, N-1-hydroxy-3-hexylmaleimide, N-1-hydroxy-4-hexylmaleimide, N-1-hydroxy-5-hexylmaleimide, N-1-hydroxy-6-hexylmaleimide, N-2-hydroxy-1-hexylmaleimide, N-2-hydroxy-2-hexylmaleimide, N-2-hydroxy-3-hexylmaleimide, N-2-hydroxy-4-hexylmaleimide, N-2-hydroxy-5-hexylmaleimide, N-2-hydroxy-6-hexylmaleimide,N-3-hydroxy-1-hexylmaleimide, N-3-hydroxy-2-hexylmaleimide, N-3-hydroxy-3-hexylmaleimide, N-3-hydroxy-4-hexylmaleimide, N-3-hydroxy-5-hexylmaleimide, N-3-hydroxy-6-hexylmaleimide, N-1-hydroxy-2-methyl-1-pentylmaleimide, N-1-hydroxy-2-methyl-2-pentylmaleimide, N-1-hydroxy-2-methyl-3-pentylmaleimide, N-1-hydroxy-2-methyl-4-pentylmaleimide, N-1 -Hydroxy-2-methyl-5-pentylmaleimide, N-2-hydroxy-2-methyl-1-pentylmaleimide, N-2-hydroxy-2-methyl-2-pentylmaleimide, N-2-hydroxy-2-methyl-3-pentylmaleimide, N-2-hydroxy-2-methyl-4-pentylmaleimide, N-2-hydroxy-2-methyl-5-pentylmaleimide, N-2-hydroxy-3-methyl-1-pentylmaleimide, N-2-hydroxy-3-methyl-2-pentylmaleimide, N-2-hydroxy-3-methyl-3-pentylmaleimide N-hydroxy-3-methyl-4-pentylmaleimide, N-2-hydroxy-3-methyl-5-pentylmaleimide, N-2-hydroxy-4-methyl-1-pentylmaleimide, N-2-hydroxy-4-methyl-2-pentylmaleimide, N-2-hydroxy-4-methyl-3-pentylmaleimide, N-2-hydroxy-4-methyl-4-pentylmaleimide, N-2-hydroxy-4-methyl-5-pentylmaleimide, N-3-hydroxy-2-methyl-1-pentylmaleimide, N-3-hydroxy-2-methyl-2-pentyl N-hydroxy-2-methyl-3-pentylmaleimide, N-3-hydroxy-2-methyl-4-pentylmaleimide, N-3-hydroxy-2-methyl-5-pentylmaleimide, N-1-hydroxy-4-methyl-1-pentylmaleimide, N-1-hydroxy-4-methyl-2-pentylmaleimide, N-1-hydroxy-4-methyl-3-pentylmaleimide, N-1-hydroxy-4-methyl, N-1-hydroxy-3-methyl-1-pentylmaleimide, N-1-hydroxy-3-methyl-2-pentylmaleimide,N-1-hydroxy-3-methyl-3-pentylmaleimide, N-1-hydroxy-3-methyl-4-pentylmaleimide, N-1-hydroxy-3-methyl-5-pentylmaleimide, N-3-hydroxy-3-methyl-1-pentylmaleimide, N-3-hydroxy-3-methyl-2-pentylmaleimide, N-1-hydroxy-3-ethyl-4-butylmaleimide, N-2-hydroxy-3-ethyl-4-butylmaleimide, N-2-hydroxy-2-ethyl-1-butylmaleimide, N-4-hydroxy-3-ethyl-1-butylmaleimide, N-4-hydroxy-3-ethyl-2-butylmaleimide, N-4-hydroxy-3-ethyl-3-butylmaleimide, N-4-hydroxy-3-ethyl-4-butylmaleimide, N-1-hydroxy-2,3-dimethyl-1-butylmaleimide, N-1-hydroxy-2,3-dimethyl-2-butylmaleimide, N-1-hydroxy-2,3-dimethyl-3-butylmaleimide, N-1-hydroxy-2,3-dimethyl-4-butylmaleimide, N-2-hydroxy-2,3-dimethyl-1-butylmaleimide, N-2-hydroxy-2,3-dimethyl -3-butylmaleimide, N-2-hydroxy-2,3-dimethyl-4-butylmaleimide, N-1-hydroxy-2,2-dimethyl-1-butylmaleimide, N-1-hydroxy-2,2-dimethyl-3-butylmaleimide, N-1-hydroxy-2,2-dimethyl-4-butylmaleimide, N-2-hydroxy-3,3-dimethyl-1-butylmaleimide, N-2-hydroxy-3,3-dimethyl-2-butylmaleimide, N-2-hydroxy-3,3-dimethyl-4-butylmaleimide, N-1-hydroxy-3,3-dimethyl-1-butylmaleimide alkylmaleimides such as N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide, N-2-methylcyclohexylmaleimide, N-2-ethylcyclohexylmaleimide, and N-2-chlorocyclohexylmaleimide; N-phenylmaleimide,Aryl maleimides such as N-2-methylphenylmaleimide, N-2-ethylphenylmaleimide, and N-2-chlorophenylmaleimide can be used as appropriate.

[0098] Among these, it is preferable to use at least one selected from (meth)acrylic esters, which are C8 to C23 aliphatic esters. (Meth)acrylic resins obtained by copolymerizing such monomer components not only have a low glass transition temperature and exhibit excellent adhesive properties, but also have strong hydrophobic interactions, which results in excellent peelability at the interface between the pressure-sensitive adhesive layer 3 and the film-like adhesive 2 after irradiation with ultraviolet light or electron beams, making them preferable.

[0099] The polymerization initiator necessary to obtain such a (meth)acrylic resin is not particularly limited as long as it is a compound that generates radicals when heated to 30°C or higher. Examples of suitable initiators include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis(t-butylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-2-methylcyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, and 1,1-bis(t-hexylperoxy)cyclohexane; (iii) Peroxyketals such as cyclohexane and 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; dialkyl peroxides such as α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, t-butylcumyl peroxide, and di-t-butyl peroxide; diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, and benzoyl peroxide; bis(4-t-butylcyclohexane) peroxycarbonates such as di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, and di-3-methoxybutyl peroxycarbonate; t-butyl peroxypivalate, t-hexyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, and t-butylperoxy-2-ethyl peroxyesters such as t-butyl peroxyisobutyrate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butyl peroxylaurate, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane, and t-butyl peroxyacetate;Examples include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile).

[0100] The reaction solvent used in the solution polymerization is not particularly limited as long as it can dissolve the (meth)acrylic resin, and examples thereof include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; alcohols such as methanol, ethanol, isopropanol, butanol, ethylene glycol, and propylene glycol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; carbonates such as ethylene carbonate and propylene carbonate; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether. Examples of suitable organic solvents include polyhydric alcohol alkyl ethers such as ethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether; polyhydric alcohol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, and diethylene glycol monoethyl ether acetate; and amides such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone. These organic solvents can be used alone or in combination of two or more. Supercritical carbon dioxide or the like can also be used as a solvent for polymerization.

[0101] Photosensitivity can be imparted to a (meth)acrylic resin by chemically bonding a functional group that can react upon irradiation with ultraviolet light, an electron beam, or visible light. Specific examples of the functional group that can react upon irradiation with ultraviolet light, an electron beam, or visible light include a (meth)acrylic group, a vinyl group, an allyl group, a glycidyl group, an alicyclic epoxy group, and an oxetane group.

[0102] There are no particular limitations on the method for imparting photosensitivity to a (meth)acrylic resin. For example, when synthesizing the above-mentioned (meth)acrylic resin, a monomer having a functional group capable of undergoing an addition reaction, such as a hydroxyl group, a carboxyl group, a maleyl anhydride group, a glycidyl group, or an amino group, may be copolymerized in advance to introduce an addition-reactive functional group into the (meth)acrylic resin, and then an ethylenically unsaturated group may be introduced into the side chain by addition-reacting the functional group with a compound having at least one ethylenically unsaturated group and at least one functional group selected from an epoxy group, an oxetanyl group, an isocyanate group, a hydroxyl group, a carboxyl group, or the like. This allows the (meth)acrylic resin to be imparted with photosensitivity.

[0103] Such compounds are not particularly limited, and examples thereof include compounds having an ethylenically unsaturated group and an epoxy group, such as glycidyl (meth)acrylate, α-ethyl glycidyl (meth)acrylate, α-propyl glycidyl (meth)acrylate, α-butyl glycidyl (meth)acrylate, 2-methyl glycidyl (meth)acrylate, 2-ethyl glycidyl (meth)acrylate, 2-propyl glycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7-epoxyheptyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether; (2-ethyl-2-oxetanyl)methyl (meth)acrylate, (2-methyl-2-oxetanyl)methyl (meth)acrylate, and the like. Compounds having an ethylenically unsaturated group and an oxetanyl group, such as 2-(2-ethyl-2-oxetanyl)ethyl (meth)acrylate, 2-(2-methyl-2-oxetanyl)ethyl (meth)acrylate, 3-(2-ethyl-2-oxetanyl)propyl (meth)acrylate, and 3-(2-methyl-2-oxetanyl)propyl (meth)acrylate; compounds having an ethylenically unsaturated group and an isocyanate group, such as methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, and m-isopropenyl-α,α-dimethylbenzyl isocyanate; compounds having an ethylenically unsaturated group and a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate;Examples of the compound include compounds having an ethylenically unsaturated group and a carboxyl group, such as (meth)acrylic acid, crotonic acid, cinnamic acid, succinic acid (2-(meth)acryloyloxyethyl), 2-phthaloylethyl (meth)acrylate, 2-tetrahydrophthaloylethyl (meth)acrylate, 2-hexahydrophthaloylethyl (meth)acrylate, ω-carboxy-polycaprolactone mono(meth)acrylate, 3-vinylbenzoic acid, and 4-vinylbenzoic acid;

[0104] Among these, from the viewpoints of cost and reactivity, it is preferable to use 2-(meth)acryloyloxyethyl isocyanate, glycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, ethyl isocyanate (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, (meth)acrylic acid, crotonic acid, 2-hexahydrophthaloylethyl (meth)acrylate, etc., and react them with the (meth)acrylic resin to impart photosensitivity. These compounds can be used alone or in combination of two or more. If necessary, a catalyst that promotes the addition reaction can be added, or a polymerization inhibitor can be added to prevent cleavage of double bonds during the reaction. Even more preferable is a reaction product of an OH group-containing (meth)acrylic resin with at least one selected from 2-methacryloyloxyethyl isocyanate and 2-acryloyloxyethyl isocyanate.

[0105] The crosslinking agent is a compound having at least one selected from the group consisting of a hydroxyl group, a glycidyl group, and an amino group introduced into the (meth)acrylic resin, and two or more functional groups per molecule that are reactive with these functional groups, and there are no limitations on its structure. Examples of bonds formed by such crosslinking agents include ester bonds, ether bonds, amide bonds, imide bonds, urethane bonds, and urea bonds. Among these, crosslinking agents containing an aromatic group-containing isocyanate group are preferred, since this prevents the peel strength between the pressure-sensitive adhesive layer 3 and the film-like adhesive 2 from increasing even with increased UV irradiation.

[0106] The amount of crosslinking agent contained in the pressure-sensitive adhesive layer 3 is preferably 10 to 13 parts by mass per 100 parts by mass of the acrylic copolymer. If the amount of crosslinking agent is less than 10 parts by mass, the elongation at break of the pressure-sensitive adhesive layer 3 before UV irradiation will be high, and machinability during the dicing process will likely be insufficient. In addition, the peel strength between the pressure-sensitive adhesive layer 3 and the film-like adhesive 2 after UV irradiation will not be sufficiently reduced, and it will likely be necessary to set a relatively large push-up amount during the pick-up process. On the other hand, if the amount of crosslinking agent exceeds 13 parts by mass, the adhesive strength to the pressure-sensitive adhesive layer 3 before UV irradiation will likely be insufficient.

[0107] The crosslinking agent preferably has two or more isocyanate groups per molecule. Such a compound easily reacts with the hydroxyl group, glycidyl group, amino group, etc. introduced into the (meth)acrylic resin to form a strong crosslinked structure, thereby suppressing adhesion of the adhesive layer 3 to the semiconductor chip after the die bonding process.

[0108] Specific examples of crosslinking agents having two or more isocyanate groups in one molecule include isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate.

[0109] Furthermore, it is also possible to use an isocyanate group-containing oligomer obtained by reacting the above-mentioned isocyanate compound with a polyhydric alcohol having two or more OH groups per molecule. When obtaining such an oligomer, examples of polyhydric alcohols having two or more OH groups per molecule include ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, pentaerythritol, dipentaerythritol, 1,4-cyclohexanediol, and 1,3-cyclohexanediol.

[0110] Among these, it is more desirable that the crosslinking agent be a reaction product of a polyfunctional isocyanate having two or more isocyanate groups per molecule and a polyhydric alcohol having three or more OH groups per molecule. By using such an isocyanate group-containing oligomer, the pressure-sensitive adhesive layer 3 can form a dense crosslinked structure.

[0111] The photopolymerization initiator is not particularly limited as long as it generates an active species that can cause chain polymerization of the acrylic copolymer when irradiated with one or more types of light selected from ultraviolet light, electron beams, and visible light, and may be, for example, a photoradical polymerization initiator or a photocationic polymerization initiator. The chain-polymerizable active species is not particularly limited as long as it reacts with the functional group of the acrylic copolymer to initiate a polymerization reaction.

[0112] Examples of the photoradical polymerization initiator include benzoin ketals such as 2,2-dimethoxy-1,2-diphenylethan-1-one; α-hydroxyketones such as 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one; 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and 1,2-methyl-1-[4-(methylthio)phenyl]- α-Aminoketones such as 2-morpholinopropan-1-one; oxime esters such as 1-[4-(phenylthio)phenyl]-1,2-octadione-2-(benzoyl)oxime; phosphine oxides such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, ... 2,4,5-triarylimidazole dimers such as 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer; benzophenone, N,N,N',N'-tetramethyl-4,4'-diaminobenzophenone, N,N,N',N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxyphenyl benzophenone compounds such as 4'-dimethylaminobenzophenone; quinone compounds such as 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, and 2,3-dimethylanthraquinone;Benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin phenyl ether; benzoin compounds such as benzoin, methylbenzoin, and ethylbenzoin; benzyl compounds such as benzyl dimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis(9,9'-acridinylheptane); N-phenylglycine, coumarin, and the like.

[0113] In the above-mentioned 2,4,5-triarylimidazole dimer, the substituents on the aryl groups of the two triarylimidazole moieties may be the same to give a symmetrical compound, or different to give an asymmetrical compound. A thioxanthone compound may be combined with a tertiary amine, such as the combination of diethylthioxanthone and dimethylaminobenzoic acid.

[0114] Examples of the photocationic polymerization initiator include aryl diazonium salts such as p-methoxybenzenediazonium hexafluorophosphate, diaryliodonium salts such as diphenyliodonium hexafluorophosphate and diphenyliodonium hexafluoroantimonate, triarylsulfonium salts such as triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium hexafluorophosphate, diphenyl-4-thiophenoxyphenylsulfonium hexafluoroantimonate and diphenyl-4-thiophenoxyphenylsulfonium pentafluorohydroxyantimonate, triphenylselenonium hexafluorophosphate ... Examples of suitable cationic polymerization initiators include triarylselenonium salts such as ammonium tetrafluoroborate and triphenylselenonium hexafluoroantimonate; dialkylphenacylsulfonium salts such as dimethylphenacylsulfonium hexafluoroantimonate and diethylphenacylsulfonium hexafluoroantimonate; dialkyl-4-hydroxy salts such as 4-hydroxyphenyldimethylsulfonium hexafluoroantimonate and 4-hydroxyphenylbenzylmethylsulfonium hexafluoroantimonate; and sulfonate esters such as α-hydroxymethylbenzoin sulfonate, N-hydroxyimide sulfonate, α-sulfonyloxyketone, and β-sulfonyloxyketone. These cationic polymerization initiators can be used alone or in combination of two or more. Furthermore, they can also be used in combination with an appropriate sensitizer.

[0115] Among them, when strict insulation properties and insulation reliability are required for the pressure-sensitive adhesive layer 3, it is preferable to use a photoradical initiator, and among them, benzoin ketals such as 2,2-dimethoxy-1,2-diphenylethan-1-one; α-hydroxybenzoates such as 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, etc. hydroxyketone, benzophenone, 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2, quinone compounds such as 3-dimethylanthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin phenyl ether; benzoin compounds such as benzoin, methylbenzoin, and ethylbenzoin; benzyl compounds such as benzyl dimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis(9,9'-acridinylheptane); N-phenylglycine, coumarin, and the like are preferred because they have excellent storage stability, and 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, and benzophenone are even more preferred because they can be handled under ordinary ultraviolet-shielding fluorescent lamps and do not require equipment such as a yellow room.

[0116] The optimum amount of photopolymerization initiator to be added varies depending on the desired thickness of the pressure-sensitive adhesive layer 3 and the light source used, but is preferably 0.5 to 1.5 parts by mass per 100 parts by mass of the acrylic copolymer. When the amount of photopolymerization initiator is 0.5 parts by mass or more, the peel strength from the film-like adhesive 2 after UV irradiation can be sufficiently reduced. When the amount of photopolymerization initiator is 1.5 parts by mass or less, decomposition of the pressure-sensitive adhesive layer 3 when irradiated with UV light can be suppressed.

[0117] The thickness of the pressure-sensitive adhesive layer 3 may be three or more times the thickness of the film-like adhesive 2. However, if the thickness of the pressure-sensitive adhesive layer 3 is increased too much, the thickness variation will increase and the cost of raw materials will increase, so the thickness of the pressure-sensitive adhesive layer 3 is more preferably three to five times the thickness of the film-like adhesive 2.

[0118] The thickness of the pressure-sensitive adhesive layer 3 is preferably 25 to 295 μm, more preferably 50 to 150 μm, and even more preferably 50 to 100 μm. A thickness of 25 μm or more makes it easier to prevent voids from occurring during lamination of the film-like adhesive 2, and tends to make it easier to prevent voids from forming, especially when there is a large difference between the height of the electrode and the thickness of the film-like adhesive 2. On the other hand, a thickness of 295 μm or less makes it possible to prevent the amount of residual solvent in the pressure-sensitive adhesive layer 3 from increasing, and tends to prevent variations in adhesive strength caused by the influence of residual solvent.

[0119] The adhesive layer 3 can be formed by dissolving or dispersing an adhesive composition containing the above-mentioned components in a solvent to form a varnish, applying this varnish to the substrate 4, and removing the solvent by heating.

[0120] Methods for applying the varnish onto the substrate 4 include commonly known methods such as knife coating, roll coating, spray coating, gravure coating, bar coating, curtain coating, comma coating, and die coating.

[0121] The temperature condition when removing the solvent by heating is preferably about 70 to 150°C.

[0122] Examples of the solvent to be used include the same solvents as those used when forming the film adhesive 2.

[0123] Examples of the substrate 4 include plastic films such as polyester film, polytetrafluoroethylene film, polyethylene film, polypropylene film, and polymethylpentene film. Among these, polyester film is preferred, and polyethylene terephthalate film is more preferred. The substrate 4 may be a mixture of two or more materials selected from the above materials, or may be a multilayer of the above films.

[0124] The thickness of the substrate 4 is preferably 5 to 50 μm, and more preferably 12 to 38 μm. When the thickness is 5 μm or more, the substrate 4 tends to be more likely to be prevented from being deformed due to thermal shrinkage during the drying process of the pressure-sensitive adhesive layer 3, and the occurrence of variations in the thickness of the pressure-sensitive adhesive layer 3 tends to be more likely to be prevented. Furthermore, when the pressure-sensitive adhesive tape 5 is a back-grinding tape, when the thickness of the substrate 4 is 50 μm or less, warping of the wafer after back-grinding tends to be more likely to be more sufficiently prevented.

[0125] The thickness of the pressure-sensitive adhesive tape 5 may be, for example, 75 to 300 μm, preferably 75 to 175 μm, and more preferably 85 to 125 μm. A thickness of 75 μm or more tends to easily prevent insufficient filling of the areas around the bumps and the scribe lines, while a thickness of 300 μm or less tends to easily prevent the pressure-sensitive adhesive layer 3 from seeping out and also tends to easily prevent the film-like adhesive 2 from peeling off from the wafer when the pressure-sensitive adhesive tape is peeled off.

[0126] The adhesive tape 10 described above can be obtained, for example, by a method including a step of laminating the film-like adhesive 2 in the film-like adhesive with a supporting substrate prepared by the method described above to the pressure-sensitive adhesive layer 3 in the pressure-sensitive adhesive tape 5. It is also possible to prepare the adhesive tape 10 by applying a coating liquid of the film-like adhesive 2 onto the pressure-sensitive adhesive layer 3 of the pressure-sensitive adhesive tape 5 to form the film-like adhesive 2, but applying and drying the coating liquid on the pressure-sensitive adhesive layer 3 can cause problems such as destruction of the pressure-sensitive adhesive layer 3 and component migration between the pressure-sensitive adhesive and the adhesive, so it is preferable to obtain the adhesive tape 10 by laminating a film-like adhesive with a supporting substrate and the pressure-sensitive adhesive tape.

[0127] The above-mentioned method for producing the adhesive tape 10 can inhibit the liquid epoxy resin in the film-like adhesive 2 from migrating (penetrating) into the pressure-sensitive adhesive layer 3. The effect of inhibiting the migration of the liquid epoxy resin into the pressure-sensitive adhesive layer can be indirectly confirmed by the rate of increase in the liquid epoxy resin in the pressure-sensitive adhesive layer. For example, when a storage test is conducted in which the adhesive tape 10 is stored at 40°C for 48 hours immediately after production, the rate of increase in the liquid epoxy resin in the pressure-sensitive adhesive tape 5 immediately after the test is completed from immediately before the start of the test can be 30% by mass or less (e.g., 5 to 30% by mass). As mentioned above, the amount of migration of the liquid epoxy resin can vary depending on the type of liquid epoxy resin, etc., and by appropriately changing these factors, the rate of increase in the liquid epoxy resin can be set to 25% by mass or less, 20% by mass or less, 15% by mass or less, or 10% by mass or less. The increase rate of the liquid epoxy resin can be obtained by measuring the amount of liquid epoxy resin in the pressure-sensitive adhesive tape 5 immediately after lamination (initial amount) and the amount of liquid epoxy resin in the pressure-sensitive adhesive tape 5 in the adhesive tape 10 after a storage test (amount after storage) using reverse phase liquid chromatography (RPLC), and calculating the increase rate of the amount of liquid epoxy resin ([amount after storage - initial amount] / [initial amount] x 100). Specific measurement conditions are shown in the examples.

[0128] <Method of manufacturing semiconductor chip with adhesive layer and semiconductor device> Next, a method for manufacturing a semiconductor chip with an adhesive layer and a semiconductor device using the adhesive tape 10 of the above embodiment will be described.

[0129] 2 to 4 are schematic cross-sectional views illustrating a method for manufacturing a semiconductor chip 30 with an adhesive layer according to one embodiment.

[0130] The method for manufacturing the semiconductor chip 30 with an adhesive layer includes a laminating step (FIG. 2) of attaching the adhesive tape 10 to the semiconductor wafer 20 from the film-like adhesive 2 side, a back-grinding step (FIG. 3) of grinding the surface of the semiconductor wafer 20 opposite to the adhesive tape 10 to which the adhesive tape 10 has been attached, and a dicing step (FIG. 4) of dicing the semiconductor wafer 20 after the back-grinding step to obtain the semiconductor chip 30 with an adhesive layer. Note that in this embodiment, the adhesive tape 5 of the adhesive tape 10 is a back-grinding tape, so the back-grinding step is included, but is not essential. If the back-grinding step is not performed, the adhesive tape 5 may be, for example, a dicing tape, a protective tape, or the like.

[0131] The semiconductor wafer 20 used in this embodiment has, on one main surface, protruding electrodes (solder bumps) 26 (FIG. 2(a)). The protruding electrodes 26 are made up of bumps 22 and solder balls 24 provided on the bumps 22.

[0132] Examples of the semiconductor wafer 20 include a 6-inch wafer, an 8-inch wafer, a 12-inch wafer, etc., whose surface has been treated with an oxide film. Examples of the bumps 22 include, but are not limited to, those made of copper, silver, gold, etc. Examples of the solder balls 24 include those made of conventionally known solder materials such as lead-containing solder or lead-free solder.

[0133] Grooves 28 serving as scribe lines that serve as marks during dicing are formed on the main surface on which the protruding electrodes 26 of the semiconductor wafer 20 are provided. The grooves 28 are recesses with a depth of about 5 to 15 μm.

[0134] The thickness of the semiconductor wafer 20 before thinning can be in the range of 250 to 800 μm. Typically, the sliced ​​semiconductor wafer has a thickness of 625 to 775 μm when it is 6 to 12 inches in size.

[0135] From the viewpoint of miniaturization of semiconductors, the height of the bumps 22 is preferably 5 to 50 μm, and the height of the solder balls 24 is preferably 2 to 30 μm.

[0136] In the lamination process, the support substrate 1 is peeled from the adhesive tape 10, and the film-like adhesive (adhesive layer) 2, pressure-sensitive adhesive layer 3, and substrate 4 are placed in this order on the surface of the semiconductor wafer 20 on which the protruding electrodes (solder bumps) 26 are formed (hereinafter referred to as the "functional surface"). Pressure is then applied to the semiconductor wafer 20 and substrate 4 so that the tips of the solder balls 24 penetrate the film-like adhesive 2 (see FIG. 2(b)). While it is most desirable for the tips of the solder balls to penetrate the adhesive layer, there is no problem even if a few microns of the adhesive layer remains at the tips of the solder balls, as long as it does not affect the electrical connection between the substrate and the semiconductor chip via the solder balls, as described below. In this embodiment, the film-like adhesive 2 is attached to the functional surface of the semiconductor wafer 20 by vacuum lamination, making it easy to expose the bumps.

[0137] Vacuum lamination can be performed using a diaphragm, a roll, or a press, but the diaphragm method is preferred from the viewpoint of embeddability.

[0138] The lamination conditions are preferably a lamination temperature of 50° C. to 100° C., a line pressure of 0.5 to 3.0 kgf / cm, and a feed rate of 0.2 to 2.0 m / min.

[0139] When using a diaphragm method for vacuum lamination, the following conditions are preferred: stage temperature: 20°C to 60°C, diaphragm temperature: 50°C to 100°C, degassing time: 10 to 100 seconds, pressurization time: 10 to 100 seconds, and pressurization: 0.1 to 1.0 MPa. In the case of the diaphragm method, the lamination temperature refers to the diaphragm temperature.

[0140] If lamination is performed at a temperature higher than 80°C, the wafer tends to warp significantly after backgrinding. On the other hand, if the lamination temperature is too low, it tends to be difficult to fill the areas around the bumps. Therefore, lamination is preferably performed at a temperature between 50 and 80°C.

[0141] In the back grinding process, the side of the semiconductor wafer 20 opposite to the adhesive tape 10 to which the adhesive tape 10 is attached, i.e., the side of the semiconductor wafer 20 opposite to the side on which the protruding electrodes (solder bumps) 26 are formed, is ground to thin the semiconductor wafer 20 (FIG. 3). The grinding can be performed using a back grinder.

[0142] In the back grinding process, it is preferable to thin the semiconductor wafer 20 to a thickness of 10 to 150 μm. If the thickness of the thinned semiconductor wafer 20 is less than 10 μm, the semiconductor wafer is likely to be damaged, while if it exceeds 150 μm, it becomes difficult to meet the demand for miniaturization of semiconductor devices.

[0143] In the dicing process, first, the polished surface side of the thinned semiconductor wafer 20 is attached to a dicing tape 6 (FIG. 4(a)). Next, a dicing device is used to cut the semiconductor wafer 20 and the film-like adhesive 2 along the grooves 28, thereby dividing the semiconductor wafer 20 into individual pieces (FIG. 4(b)). This results in semiconductor chips 30 with an adhesive layer, each consisting of a semiconductor chip 29 and an adhesive layer 9. The adhesive tape 5, consisting of the substrate 4 and the adhesive layer 3, may be peeled off from the film-like adhesive 2 before dicing.

[0144] After the dicing process is completed, the semiconductor chips with adhesive attached are picked up using a pick-up device and used in the manufacture of semiconductor devices.

[0145] Although not shown, from the viewpoint of obtaining a semiconductor chip with an adhesive layer applicable to stacking and multi-layering techniques, the manufacturing method of this embodiment may include a step of forming an electrode on the main surface of the semiconductor wafer 20 or the semiconductor chip 29 opposite to the main surface on which the protruding electrodes 26 are formed, or may include a step of forming a through electrode in the semiconductor wafer 20 or the semiconductor chip 29. The method of manufacturing the electrode is not particularly limited, and a known method may be adopted.

[0146] 5 and 6 are schematic cross-sectional views illustrating a method for manufacturing the semiconductor device 100 according to this embodiment.

[0147] The manufacturing method of the semiconductor device 100 includes a first lamination step (FIG. 5) in which a semiconductor chip 30a with a first adhesive layer is placed on a base 7 from the adhesive layer 9a side and pressure-bonded while heated, and a second lamination step (FIG. 6) in which a semiconductor chip 30b with a second adhesive layer is placed on a laminate 40 obtained in the first lamination step from the adhesive layer 9b side and pressure-bonded while heated. The first semiconductor chip 30a with an adhesive layer and the second semiconductor chip 30b with an adhesive layer are semiconductor chips with adhesive layers obtained by the method of the above embodiment. The first semiconductor chip 30a with an adhesive layer and the second semiconductor chip 30b with an adhesive layer have electrodes (31a, 31b) on the surface opposite to the surface on which the protruding electrodes (26a, 26b) are provided, and through electrodes (32a, 32b) are formed between the electrodes (31a, 31b) and the protruding electrodes (26a, 26b). The base 7 is another semiconductor chip having electrodes 8 or a support member (such as a wiring circuit board) for mounting a semiconductor chip having electrodes.

[0148] In the first lamination process, the semiconductor chip 30a with the first adhesive layer is heated and pressurized in a direction in which the protruding electrodes 26a and the electrodes 8 face each other, thereby melting the solder on the protruding electrodes 26a and joining the protruding electrodes 26a of the semiconductor chip 30a with the first adhesive layer to the electrodes 8 of the base 7 (Figures 5(a) and (b)).

[0149] The first laminate process may include a first thermocompression bonding process in which the adhesive layer-attached semiconductor chip 30a and the base 7 are pressed together in the direction in which the protruding electrodes 26a and the electrodes 8 face each other at a temperature lower than the melting point of the solder on the protruding electrodes 26a, and a second thermocompression bonding process in which the solder on the protruding electrodes 26a is melted by heating to join the protruding electrodes 26a and the electrodes 8.

[0150] If the adhesive layer 9a further contains a flux component, the pressure in the first thermocompression bonding step may be applied at a temperature higher than the melting point or softening point of the flux component and lower than the melting point of the solder in the protruding electrodes, thereby achieving a stronger connection.

[0151] The thermocompression bonding conditions in the first thermocompression bonding step are preferably 100°C to 200°C, pressure: 0.1 MPa to 1.5 MPa, and time: 1 second to 15 seconds, and more preferably 100°C to 180°C, pressure: 0.1 MPa to 1.0 MPa, and time: 1 second to 10 seconds. The thermocompression bonding conditions in the second thermocompression bonding step are preferably 230°C to 350°C, pressure: 0.1 MPa to 1.5 MPa, and time: 1 second to 15 seconds, and more preferably 230°C to 300°C, pressure: 0.1 MPa to 1.0 MPa, and time: 1 second to 15 seconds. The above temperature and pressure conditions refer to the temperature and pressure applied to the adhesive layer.

[0152] In this way, the electrodes 8 of the base 7 and the bumps 22a of the semiconductor chip 29a are electrically connected via the solder balls 24a, and the space between the base 7 and the semiconductor chip 29a is sealed by the sealing portion 35a, which is the cured adhesive, to obtain a laminate 40 (Figure 5 (b)).

[0153] In the second lamination process, the semiconductor chip 30b with the second adhesive layer is heated and pressurized in a direction in which the protruding electrodes (solder bumps) 26b and the electrodes 31a face each other, thereby melting the solder in the protruding electrodes 26b and joining the protruding electrodes 26b of the semiconductor chip 30b with the second adhesive layer to the electrodes 31a of the laminate 40 (Figures 6(a) and (b)).

[0154] The second lamination step can be carried out in the same manner as the first lamination step. The details of the heating and pressure bonding conditions in the second lamination step are the same as the details of the heating and pressure bonding conditions in the first lamination step.

[0155] In this way, the electrodes 31a of the laminate 40 and the bumps 22b of the semiconductor chip 29b are electrically connected via the solder balls 24b, and the laminate 40 and the semiconductor chip 29b are sealed with the sealing portion 35b, which is a hardened adhesive, to obtain the semiconductor device 100 (Figure 6 (b)).

[0156] In this embodiment, a plurality of semiconductor chips with adhesive layers may be stacked in multiple stages by repeating a step similar to the second stacking step. That is, the manufacturing method of this embodiment may include a plurality of steps of stacking semiconductor chips with adhesive layers on the semiconductor device 100.

[0157] The film-like adhesive of the adhesive tape used in the manufacturing method of this embodiment is less likely to increase in viscosity over time, and therefore, according to the manufacturing method of this embodiment, even if the semiconductor chip with the first adhesive layer and the semiconductor chip with the second adhesive layer are produced using adhesive tapes manufactured at different times, there is less chance of variation in the distance (gap height) between the chips when the chips are stacked under the same conditions.

[0158] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. [Example]

[0159] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0160] Details of the materials used in the examples are as follows: The number average molecular weight was measured using GPC (gel permeation chromatography) under the following conditions. [conditions] Column: Hitachi High-Tech, GL-A130-S + GL-A120-S + GL-A110-S Column temperature: 35℃ Eluent:THF Flow rate: 1.0ml / min Sample concentration: 3g / l (THF soluble content) Injection volume: 70μl Detector: Differential refractometer (RI) Molecular weight calibration standard: Standard polystyrene Data processing: Agilent Technologies, OpenLAB CDS (EZChrom Edition)

[0161] (a) Epoxy resin [Liquid epoxy resin] YL983U (liquid epoxy resin listed in Table 1, manufactured by Mitsubishi Chemical Corporation, trade name) RE-305S (a mixture containing the liquid epoxy resin listed in Table 1, manufactured by Nippon Kayaku Co., Ltd., trade name) BATG (liquid epoxy resin listed in Table 1, manufactured by Resonac Co., Ltd., product name) CDMDG (liquid epoxy resin listed in Table 1, manufactured by Resonac Co., Ltd., product name) EP-4000L (liquid epoxy resin listed in Table 1, manufactured by DIC Corporation, product name) EP-4010L (liquid epoxy resin listed in Table 1, manufactured by DIC Corporation, product name) EXA-4850-150 (liquid epoxy resin listed in Table 1, manufactured by DIC Corporation, trade name) HP-820 (liquid epoxy resin listed in Table 1, manufactured by DIC Corporation, trade name)

[0162] [Table 1] The molecular weights in the table are the molecular weights (number average molecular weights) of the liquid epoxy resins.

[0163] [Solid epoxy resin] YX7110B80 (flexible solid epoxy resin, manufactured by Mitsubishi Chemical Corporation, product name) EP1032H60 (a multifunctional solid epoxy resin with a triphenolmethane skeleton, manufactured by Mitsubishi Chemical Corporation, product name)

[0164] (b) Hardener 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole, product name, manufactured by Shikoku Chemicals Corporation)

[0165] (c) Fluxing agent Glutaric acid (Tokyo Chemical Industry Co., Ltd., melting point: approximately 98°C)

[0166] (d) a polymer component having a weight-average molecular weight of 10,000 or more FX-293 (phenoxy resin, manufactured by Nippon Steel Chemical & Material Co., Ltd., trade name, Tg: approx. 160°C, weight average molecular weight: 40,000-50,000)

[0167] (e) Filler EXL2655 (acrylic rubber organic filler, manufactured by DOW, product name) KE180G-HLA (silica filler, manufactured by Admatechs Co., Ltd., product name)

[0168] <Examples 1 to 6 and Comparative Examples 1 and 2> (Preparation of coating liquid) Coating liquids for forming film-like adhesives in Examples 1 to 6 and Comparative Examples 1 and 2 were prepared. Specifically, the components shown in Table 2 were added to an organic solvent (cyclohexanone) so that the NV value ([mass of coating material after drying] / [mass of coating material before drying] × 100) was 60%, to obtain a mixed liquid. The amount of each component added was the amount shown in Table 2 (unit: parts by mass). Then, beads with a diameter of 1.0 mm and beads with a diameter of 2.0 mm were added to the mixed liquid, and the mixture was stirred for 30 minutes using a bead mill (Fritsch Japan Co., Ltd., planetary fine grinder P-7). The amount of beads added was the same mass as the non-volatile content of the mixed liquid (total amount of components other than the organic solvent). After stirring, the beads were removed by filtration to obtain a coating liquid for forming a film-like adhesive.

[0169] [Table 2]

[0170] (Preparation of film adhesive with supporting substrate) The coating liquid prepared above was applied to a release film (trade name "Purex A55" manufactured by Teijin DuPont Films Co., Ltd.) serving as a supporting substrate using a small precision coating device (Kanei Seiki Co., Ltd.) so that the film thickness after drying would be 12 μm. The coating film was then dried (100°C / 10 min) in a clean oven (manufactured by ESPEC) to form a film adhesive, yielding a film adhesive with a supporting substrate.

[0171] (Preparation of adhesive tape) An acrylic copolymer was obtained by solution polymerization using 2-ethylhexyl acrylate and methyl methacrylate as the main monomers and hydroxyethyl acrylate and acrylic acid as the functional group monomers. The weight-average molecular weight of this synthesized acrylic copolymer was 400,000 and the glass transition temperature was -38°C. A varnish for adhesives was prepared by blending 100 parts by mass of this acrylic copolymer with 10 parts by mass of a multifunctional isocyanate crosslinker (manufactured by Nippon Polyurethane Industry Co., Ltd., product name "Coronate HL").

[0172] The adhesive varnish was applied to a 38 μm thick polyethylene terephthalate (PET) substrate (manufactured by Unitika Ltd., product name "EMBLED S25") using an applicator while adjusting the gap so that the adhesive layer would be 60 μm thick after drying, and then dried for 5 minutes at 80° C. This yielded an adhesive tape with a pressure-sensitive adhesive layer formed on the substrate.

[0173] (Preparation of adhesive tape) The film-like adhesive with a supporting substrate and pressure-sensitive adhesive tape of each of the Examples and Comparative Examples prepared above were used to prepare adhesive tapes of Examples 1 to 6 and Comparative Examples 1 and 2. Specifically, the pressure-sensitive adhesive tape was laminated with the film-like adhesive with a supporting substrate using a roll laminator (lamination temperature: 30±10°C) to obtain an adhesive tape having a laminated structure of PET substrate / pressure-sensitive adhesive layer / adhesive layer / support substrate.

[0174] <Evaluation> (Migration of liquid epoxy resin) The migration of the liquid epoxy resin in the adhesive tapes of Examples 1 to 4 and Comparative Examples 1 and 2 was confirmed by the following method. Specifically, first, the adhesive tape was peeled from the adhesive tape immediately after production, and the adhesive tape was immersed in acetonitrile to extract the liquid epoxy resin from the adhesive tape. The content of the liquid epoxy resin in the extracted components (peak area of ​​the peak derived from the liquid epoxy resin, initial content) was determined using reverse phase liquid chromatography (RPLC). Next, a storage test was performed in which the adhesive tape was stored at 40°C for 48 hours immediately after production. After the storage test, the adhesive tape was peeled from the adhesive tape. The liquid epoxy resin was extracted from the peeled adhesive tape using the same method as above, and the content of the liquid epoxy resin in the extracted components (peak area of ​​the peak derived from the liquid epoxy resin, content after storage) was determined. Next, the increase rate r ([content rate after storage - initial content rate] / [initial content rate] x 100) before and after the storage test was calculated from the liquid epoxy resin content calculated above, and the migration of the liquid epoxy resin in each adhesive tape was confirmed from this increase rate r. The increase rate r is shown in Table 5. The RPLC measurement conditions were as follows: [conditions] Equipment: Waters ACQUITY UPLC H-Class / eλPDA Detection wavelength: 210~800nm Column: ACQUITY UPLC BEH C18 (2.1 mmφ x 100 mm) Column temperature: 60°C in Examples 3 and 4, 40°C in others Eluent: A. Acetonitrile B. H2O Gradient conditions: Examples 3 and 4 were as shown in Table 3, and the other examples were as shown in Table 4.

[0175] [Table 3]

[0176] [Table 4]

[0177] (viscosity stability) The viscosity stability of the film-like adhesive in the adhesive tapes of Examples 1 to 6 and Comparative Examples 1 and 2 was evaluated by the following method. Specifically, first, the support substrate and adhesive tape were peeled off from the adhesive tape immediately after production to obtain a film-like adhesive. This film-like adhesive was laminated multiple times using a desktop laminator (product name: Hotdog GK-13DX, manufactured by Lamy Corporation) to obtain a 400 μm laminated film. The obtained laminated film was punched out using a 10 mm square punch to prepare a viscosity measurement sample. The viscosity at 80°C of the obtained viscosity measurement sample was measured under the following conditions using a rotational rheometer (manufactured by TA Instruments, product name: ARES-G2), and this was defined as the 80°C viscosity (initial) of the film-like adhesive in the adhesive tape. The results are shown in Table 5. [Measurement conditions] Measuring tool size: 9mmφ Heating rate: 10℃ / min Frequency: 10Hz Temperature range: 30~180℃

[0178] Next, to confirm the viscosity increase of the adhesive tape over time, a storage test (accelerated test) was conducted in which the adhesive tape was stored at 40°C for 48 hours immediately after production. This storage test corresponds to a storage test in which the adhesive tape was stored at room temperature (25°C) for 4 weeks. After the test, the 80°C viscosity (after accelerated test) of the film-like adhesive in the adhesive tape was measured in the same manner as above. In addition, the amount of change in 80°C viscosity from the initial 80°C viscosity and the 80°C viscosity after the accelerated test ([80°C viscosity after accelerated test] - [initial 80°C viscosity]) was calculated, and viscosity stability was evaluated based on this amount of change. The results are shown in Table 5.

[0179] [Table 5] [Explanation of symbols]

[0180] 1... supporting substrate, 2... film-like adhesive, 3... pressure-sensitive adhesive layer, 4... substrate, 5... adhesive tape, 6... dicing tape, 7... base, 8... electrode, 9... adhesive layer (film-like adhesive), 10... adhesive tape, 20... semiconductor wafer, 22, 22a, 22b... bumps, 24, 24a, 24b... solder balls, 26, 26a, 26b... protruding electrodes (solder bumps), 28... grooves, 29, 29a, 29b... semiconductor chips, 30, 30a, 30b... semiconductor chips with adhesive layer, 31a, 31b... electrodes, 32a, 32b... through electrodes, 100... semiconductor device.

Claims

1. The adhesive tape includes a film adhesive and a pressure-sensitive adhesive tape attached to the film adhesive. The film adhesive contains an epoxy resin and a curing agent, The epoxy resin includes an epoxy resin that is liquid at 25°C, The adhesive tape for semiconductors, wherein the epoxy resin that is liquid at 25°C has a number average molecular weight of 350 or more.

2. 2. The adhesive tape for a semiconductor according to claim 1, wherein the epoxy resin that is liquid at 25°C contains a compound represented by the following formula (I): 【Chemical 1】 [In formula (I), n represents an integer of 1 or more.]

3. 2. The adhesive tape for a semiconductor according to claim 1, wherein the content of compounds having a molecular weight of 350 or more contained in the epoxy resin that is liquid at 25°C is 50 mass% or more based on the total mass of the epoxy resin that is liquid at 25°C.

4. 2. The adhesive tape for a semiconductor according to claim 1, wherein the content of the epoxy resin that is liquid at 25° C. is 1 to 30 mass % based on the total mass of the film-like adhesive.

5. 2. The adhesive tape for semiconductor use according to claim 1, wherein the epoxy resin comprises an epoxy resin that is solid at 25°C.

6. 2. The adhesive tape for a semiconductor according to claim 1, wherein the curing agent comprises an imidazole-based curing agent.

7. 2. The adhesive tape for a semiconductor according to claim 1, wherein the film adhesive further contains a fluxing agent.

8. 2. The adhesive tape for a semiconductor according to claim 1, wherein the film-like adhesive further contains a polymer component having a weight-average molecular weight of 10,000 or more.

9. 2. The adhesive tape for a semiconductor according to claim 1, wherein the film adhesive further contains a filler.

10. 2. The adhesive tape for a semiconductor according to claim 1, wherein the viscosity of the film-like adhesive at 80° C. is 3,000 to 10,000 Pa·s.

11. 2. The adhesive tape for a semiconductor according to claim 1, wherein the adhesive layer that forms the surface of the adhesive tape that comes into contact with the film-like adhesive contains a (meth)acrylic resin.

12. a laminating step of attaching the adhesive tape for a semiconductor according to any one of claims 1 to 11 to a semiconductor wafer from the film-like adhesive side; a back grinding step of grinding a surface of the semiconductor wafer opposite to the adhesive tape to which the adhesive tape is attached; a dicing step of dividing the semiconductor wafer into individual pieces to obtain semiconductor chips with an adhesive layer after the back-grinding step.

13. A method for manufacturing a semiconductor device in which a plurality of semiconductor chips are stacked, comprising the steps of: a first lamination step of placing the semiconductor chip with the first adhesive layer obtained by the method according to claim 12 on a substrate from the adhesive layer side and pressing the chip under heat; A method for manufacturing a semiconductor device, comprising: a second lamination step in which a semiconductor chip with a second adhesive layer obtained by the method described in claim 12 is placed on the laminate obtained in the first lamination step from the adhesive layer side, and pressed while being heated.

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